CONFIDENTIALCONFIDENTIAL“WemakeDigitalPrintedElectronicsandSmart3DPrintingeasierworldwide”
HighresolutionfunctionalmaterialsdepositionsystemscombiningAerosolJetwithInkJetprintheads capabilitieswithin-linePhotonicPost
Drying/CuringforcompleteintegratedprocessingCPES2017– TorontoCanada– 05/25/2017
2
Shareevolution:5€to38€
35%Growthoverthepast5years
GlobalPresencein75Countries
Growthbyacquisitionwith
Köra-Packmat &Ceradrop
KM40%Shareholdersince
April1st2016
Foundedin1982
IntroducedonParisstockExchangein2006(ALMDG)
250$MillionMarketCapitalization
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NewMGICorporateHQ
MGI4,ruedela Méridienne94260 Fresnes - France• 10000sqm Land• 6000sqm Factory• 2000sqm Offices
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TheMGIGroup– InnovationinMotion
170 Employeesworldwide
70 R&DEngineers
20 Phd Doctors
Worldwidemanufacturerpioneerin
digitalprinting&finishingsolutions
FirstDigitalPressin1991
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TheInkjetTechnology
8th generationofinkjet
printingpresses
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WhatareourmainBusinessUnits?
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MGIGroup– Kora-Packmat
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Ceradropfocus
CERADROP, a MGI Group company, develops andsales innovative materials deposition digitalprinters dedicated to Printed Electronics andSmart 3D Printing.
Printed electronics
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DigitalPrintedElectronicsandSmart3DPrinting
Key differentiators:
§ More flexibility (possibility to make newcomponents),
§ No waste, mask free method, cheaper,full additive, without COV
§ Time saving for R&D (quick prototyping),
§ Productivity improvements (faster thanscreen printing, multiple heads),
§ Contactless method (no risk to damageprevious layers),
§ Capability to make 3D components inone single step without re-alignment,
§ Multimaterial possibility (one processdoes it all).
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FluidDynamicComparisonPiezo Ink Jet AerosolJetPrint
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ProcessFlowComparison
SpinCoat
SoftBake
Expose
PEB
Develop
PrintPattern
Thermal,UV,orPhotonicCure
Photolithography InkJetandAerosolJetPrint
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TypicalInkjetProcessDesign
CourseAdjustment?
DesignPatterns
Set/TestDrop
Spacing
AdjustPlatenTemp
Finish
Sizeandshapeoff?
Sizeor shapeoff?
Thicknessoffonly
AdjustPlatenTempor
ReformulateStart
Y
N
YY
N N
Source: Micro Chem Corp.
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Desktopsystemssinglefluid,multipletargetsManyrelatedpublishedtechnicalpapers
SU 8 inkjet photoresist
• DMP2800printer16nozzleprinthead withmax1.6mmcoverageperpassat100dpi.
• LargerPatternsRequiremultiplepasses
• Discontinuitybetweenpassescausesunequalpullonthefluidpattern
• Shapesprintedclosetoborderscanbedistorted
• Striationcan be controlledusing morenozzles forbetter areacoverage perpass
Photo courtesy of Micro Chem Corp.
ANP Ag Nano inkjet Ink
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DigitalPE&Smart3DPrintingiswonderfulbutit’saspecificanddifficulttopic
Different components
to print coming from
different software
Dynamic accuracy and repeatability
New ink / printhead
interactions
Complexink /
substrate interaction
Innovative drying and
curing technologies
High level of reliability
Inkjet printed electronics by adaptation of graphical state of art is a dream
Innovative Software
Process knowledge
New printer hardware
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Asingleplatformisbetterthanseparatetechnologies:CeraPrinterF-Serie
Plug-and-PlayPrintheads holder
CeraPrinterF-Serie:oneplatformandonesoftwarefortwotechnologiesHybridmaterialsdepositiontechnology(Inkjet,AerosolJet,…)In-linemulti-curingtechnologiesintegrated(NIR,UV,Photonics)In-linecharacterizationdevices(Laserreflectometer,4PointProbe)Suitablewithawiderangeofinksandpastes
Post-processcuring
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All-in-oneState-of-of-the-artDigitalMaterialsDepositionPlatform
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Advantages
• 1cpsto1000cpsviscosityfunctionalmaterialscapable
• Ideal forsmall features,highresolution linewidth downto5Micronspossible
• Highaspectratio3Dgeometryjetting
• Idealforrapidprototyping
• Maskless Lithography
• Rapidprototyping
• Reducedmaterialwaste
• Abilitytocoatunusualsubstrates
• Reachnewapplications
• Rolltoroll
• Largesingle-formatsheet
Aerosol Jet Ink-Jet
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MGIGroupknow-howdedicatedtoPrintedElectronicsandSmart3DPrinting
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CeraPrintersrangeandroadmap:fromlabtofabthankstoMGIgroup
CapabilitiesEmbeddedfunctions
TabletopinkjetprintersAerosol Jet 200 BenchTop Series
AJ 300 stand alone Serie
Industrial upscale from inkjet and aerosol jet technologies
AJ 5X Serie
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Automaticcharacterizationtools:DropAnalyser andFabAnalyser
Print head mapping
Nozzles clogging detection
Automated ink characterization
Automated report generation
Automated experiment plan
Printing job analysis
Shape and thickness measurement
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CeraSlice:aninfinite panelofsolutionsforaninfinite panelofdesigns
CAM:freelydefined
processsequencesbyuser-friendly
macro-programming
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Oursolution:effectivetoolsforaworkflowdedicatedtodigitalmanufacturing
CADfileanalysisInks/Heads/substratesparameters
Printingstrategy
Substrate/inkinteractioncharacterization
Printhead /inkinteractioncharacterization
Automaticprinterconfigurationfollowingtheneededprintingstrategy
NativeCADfilesfromdesigner
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Video:CeraSlice SoftwareFlow
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InkjetPrintedelectronicscomponentsrealizedwithCeraPrinterequipmentandCeraSlicesoftware
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Ceramicprintedelectronics:sol-gelpatterning
Sol-gelmesoporous SiO2basedinkforSmartendoscopicdevices
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Ceramicprintedelectronics:Silvermetallizationonaluminasubstrate
HomemadeAgwaterbasednanoinkwithadhesionpromoter
forceramicThickFilmapplication
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Ceramicprintedelectronics:Piezoelectricdevicewithhighaspectratio
PZT micropillars array
OnematerialprintedCeradropPZTink25mmx25mmsheets40µmpillarwidthand66µmspacing,upto800µmofthicknessWithoutrealignmentWithoutinsitudryingpost-process
1250°Csinteringcycle(Leadatmospherecontrol)VerygoodrepeatabilityNosignificantbendingGoodmechanicalstrengthFinegrainmicrostructureHighlydense(>95%)andcrack-lesspillars
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Ceramicprintedelectronics:3Dminiaturizedmultimaterial components
HomemadeBaTiO3,SiO2,magneticandAgwaterbasednanoinks
for3Dpassivecomponents
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Flexibleprintedelectronics:SilverUHFRFIDantenna[865– 960MHz]
SilvernanoinkSubstrate:Paper
Adaptation
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Organicprintedelectronics:CoppermetallizationonPETsubstrate
OnematerialprintedCopperinkdownto30µmlinewidthPETsubstrateA4format256components
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Organicprintedelectronics:OPVmodules
Multimaterialcomponentsmadeinonestep3DcomponentsthankstolayersstackingPossibilitytoproducespecificshapes,sizesandcolorsaccordingtothecustomer’sneeds
AdvantagesofIJPforOPVapplication:
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Hybrid(inkjet+aerosoljet)PrintedelectronicscomponentsrealizedwithHybridCERADROPequipment
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IndustrialSemicon Application:Humanactivitysensorsforsmartbuildings
P(VDF-TrFE)thinfilmSubstrate:200mmsiliconCMOSwafer
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Verygoodthicknessuniformity(6.9to7.1µm)
across1cm2squareandwafer Electricandpyroelectriccharacteristicsofinkjet
P(VDF-TrFE)FerroCapacitors arethesamethanspincoatingthinfilms.
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Firstsample:Smart3Dceramiccomponentswithdirect3Dmetallization
3D objects printed by inkjet+
3D metallization printed by Aerosol Jet
HomemadeAgandaluminawaterbasednano-inks
forinterconnected ceramic
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What’sthefutureintoMGIGroup?
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Alphajet:ModularPlatform
Digital Printing Printed Electronics
n Substrates: paper, plastic, cardboard and corrugate
n Substrates: organic, glass, metal and ceramic
CombinesMGIandCeradrop’s corecapabilitiesinDigitalPrintingandPrintedElectronics
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Thankyouverymuchforyourattention
32 rue de SoyouzParc d'ESTER
87068 Limoges - FRANCETél: +33 555 382 696 Fax: +33 555 381 751
http://www.youtube.com/user/CeradropTV
http://www.linkedin.com/company/ceradrop
http://www.ceradrop.fr/
Headquarters and manufacturing
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