58
High Speed Digital
High Speed Digital
Agenda
• Market Overview
• Product Requirements
• Mid Loss Product Overview (Theta)
• Low Loss Product Overview (FX-2)
• Ultra Low Loss Overview (R&D)
MARKET OVERVIEW
Macro Trends – Video on Demand
Netflix – Video On Demand
• 26.5 million subscribers (6’ 2012)
• 1 Billion hours of streaming video
in one month (June ‘12)
• Accounts for >20% Broadband
Usage in US
• Uses ~ 41 MB/min
Skype – Video Conferencing
• 31 million subscribers (3’2012)
• 560 million people that have ever
used Skype
• 77% of the global VoIP bandwidth
• Uses ~ 3.4 MB/min
Next Gen switches consume less power, and enable communications from one server to
another server with minimal delays
Macro Trends – Cloud Computing
10/40 GbE Architecture
Enables music
streaming/video streaming
Legacy Architecture
Slower access time
IP
Infrastructure Computing
Test &
Measurement High Reliability
Market Segmentation
Mobile Infrastructure
upgrades, data center build-
outs, and mobile apps
driving demand in Network
Infrastructure expansion
Demand for Intel
Architecture based servers
driving market, growth in
Unix and Mainframe servers
down
PRODUCT REQUIREMENTS
Product Requirements
• Electrical Performance – Mid-Loss (df < 0.012)
– Low-Loss (df < 0.007)
– Ultra-Low (df < 0.003)
• Lead-Free Assembly (LFA) – Moisture Level Sensitivity (MSL-1)
(JEDEC STD) Precondition
– 260°C x 10 passes reflow
• CAF Reliability – Wall-to-Wall Space 0.40 - 0.53mm
– Test Conditions: 100V, 65°C/85%RH, 1000hr, 260°C Precondition
Example: .8mm CAF Test Board
Segment Technology Roadmap
Backplanes Line Cards
2009 2012 2015 2009 2012 2015
FR-4
Mid-to-Low
FR-4 to Mid
Mid-Planes Blade Cards
2009 2012 2015 2009 2012 2015
Two leading market segments require mid-loss to ultra-low
loss electrical performance over the next 5 years
Mid-
Loss
Low-
Loss
Ultra
Low
Mid- to
Low
FR4 to
Mid Low-
Loss
Ultra
Low
Mid-
Loss
Low-
Loss
Mid-
Loss Low-
Loss
FR-4
IP Infrastructure
Computing
Electrical Segmentation
0.004
Comp # 4
Electrical Performance (tan δ) 0.010 0.008 0.006 0.001
Rela
tive P
ricin
g
Comp # 3
Comp #2
MCL-FX-2
Comp #6
0.002
RD2
Comp #3 w/
Low DK Glass
Mid Loss Segment Low Loss Segment Ultra Low Loss
Needs: Product Reliability (CAF,
LFA) – HDI Designs
Needs: Same as Mid-Loss +
Electrical Performance of Megtron
6, Broad Product line-up, cost
competitive
Needs: Electrical
Property similar to
PTFE, Broad Product
line-up, suitable for use
in Backplanes and line
cards
Theta™
(MCL-HE-679G)
Comp #4
Rela
tive P
rice
Comp #3
Legacy
Modified
Epoxy
0.78 mm
Wall-to Wall Space
≤ 0.48 mm
Wall-to-Wall Space
Comp #2
Comp #3 w/
Low Dk Glass
Eutectic 220°C Mixed Mode 245°C 260°C Lead-Free
Mid-Loss Lead-Free Assembly
Theta™
(MCL-HE-679G)
Comp #4
Rela
tive P
rice
Comp #3
Legacy
Modified
Epoxy
0.78 mm
Wall-to Wall Space
≤ 0.48 mm
Wall-to-Wall Space
Comp #2 Theta™
(MCL-HE-679G)
Comp #3 w/
Low Dk Glass
Generation 1 Generation 2 Generation 3
0.94 mm
Wall-to Wall Space
Mid-Loss CAF Resistance
Product Line Properties
Properties Units Theta™
(MCL-HE-679G) (MCL-FX-2) Under Development
Material Type Halogen-Free Mid-Loss Low Loss Ultra Low
Loss Lam
Ultra Low
Loss Bond Ply
Dk @ 1GHz 3.90 – 4.10 3.30 - 3.40 3.02 2.94
Df @ 1GHz 0.008 – 0.010 0.002 - 0.003 0.0016 0.003
Tg (TMA) °C 180 – 190 175 – 185 - 170
Tg (DMA) °C 210 – 220 210 - 220
CTEZ (< Tg) ppm/°C 35 - 45 48 - 55 58 50
CTEZ (> Tg) ppm/°C 190 – 220 80 – 130
UL Flammability UL-94 V-0 V-0 V-0 -
IPC4101C Slash Sheet /127, /128/, /130 /102
Mid Loss Low Loss Ultra-Low Loss
Perform
Metric Description
Theta™
(MCL-HE-679G) MCL-FX-2 Under Development
Halogen-Free Mid-
Loss Low Loss
Ultra Low Loss
Laminate
Bond-ply
Low loss
Lead-Free
Assembly
J-STD-020D
(6x260°C)
10x +
0.48mm1
10x +
Min - 0.48mm1 - -
CAF
(Server)
Precon:6x260°C
15V, 600hr
65°C/85%RH
600hr +
Min - 0.48mm1
600hr +
Min - 0.48mm1 - -
CAF
(Network
Infrastructure)
Precon:6x260°C
100V, 1000hr
65°C/85%RH
In Process
Min - 0.40mm1
In Process
Min - 0.40mm1
In Process
Min - 0.40mm1
In Process
Min - 0.40mm1
Interconnect
Stress Test (IST)2
3.2mm, 18L
Precon:6x260°C
1000 Cycles
(20°C – 150°C)
Interconnect
Stress Test
(IST)3
HDI (1+n+1), 18L,
2.l6mm
Precon: 6x260°C
1000 Cycles +
(20°C – 150°C)
100 Cycles
(20°C -190°C)
Highly
Accelerated
Thermal Shock
(HATS)
HDI (3+n+3)
12L, 1.65mm
Precon: 6x260°C
>500 Cycles
(-40°C to +150°C) TBD
Performance by Product Line Mid Loss Low Loss Ultra-Low Loss
Product Line Properties
Property Units Theta™
(MCL-HE-679G) MCL-FX-2 Under Development
Material Type Halogen-Free Mid-Loss Low Loss Ultra Low Loss
Laminate
Ultra Low
Loss BP
Available Cu
Type STD, VLP
STD, VLP,
Profile Free
Rolled Annealed
Electrodeposited,
Resistive Foils
-
Available Cu
Thickness microns 12, 18, 35, 70,105,140 12,18,35,70,105 18, 35 -
Glass Types 1037,1078,1080,3313,
2116, 1501,7629
1037, 1078,1080,
3313,2116 3313, 2116 unreinforced
Spread Glass
Types
1037, 1078, 3313 1037, 1078, 3313 - -
Mid Loss Low Loss Ultra-Low Loss
Glass Glass Type Fabric Count
(warp x fill)/inch
Yarn Diameter
(um)
Thickness
(mm) Products
1037 Spread 70 x 73 4.57 0.028 Theta™, FX-2
106 Non-Spread 56 x 56 5.33 0.033 RO4450F™
1080 Non-Spread 60 x 47 5.33 0.053 RO4450B™,
RO4350B™
1078 Spread 54 x 54 5.33 0.043 Theta™, FX-2
106 (non-spread)
Reduce Fiber Weave Effect
Spread Glass vs. Non-Spread
1080 (non-spread) 1037 (spread) 1078 (spread)
17
CAF Failure Mode
Dendritic failures in the bond-ply
layers, particularly in the 106
bondply
“Triple Point” failures occur in the
interstitial space between the
individual filaments, likely caused
by a capillary void during
impregnation process
106 glass tightly bound and
difficult to “wet” with resin and
susceptible to capillary voids
Capillary voids trap moisture and
ionic contaminants leading to CAF
formation
Orthogonal View of Glass
bundles
106 Glass Bundles
Glass Filament
Capillary Void
18
Spread vs Non-Spread
1037 Glass 106 Glass
106 Glass (40X) 1037 Glass (50X)
Glass weaves such as 1037, 1067, 1078 offer advantages over traditional weaves
such as 106 during prepreg impregnation by minimizing the occurrence of capillary
voids
CAF Test Results (Two Glass Suppliers)
Hollow Fiber in Glass Capillary Void
Glass Supplier “A” Glass Supplier “B”
No Failures!
Rogers Confidential
A-Type Glass Failure Analysis
Orthogonal Hollow-Fiber
(MCL-HE-679G)
Theta™
PRODUCT OVERVIEW
Product Overview
Features Benefits
Halogen Free • Meets Future Environmental
Concerns
Broad Range of Thicknesses • Design Flexibility
Low Insertion Loss • Signal Integrity
CAF Resistant • Long Term MLB Reliability
Low Z-Axis CTE • Superior Thermal / Mechanical
Reliability
High Tg / Lead Free Process Compatible • High Temperature Processing
Capability
• Ease of Fabrication
• Meets Environmental Concerns
Product Line Properties
Properties Units Theta™
(MCL-HE-679G) (MCL-FX-2) Under Development
Material Type Halogen-Free Mid-Loss Low Loss Ultra Low
Loss Lam
Ultra Low
Loss Bond Ply
Dk @ 1GHz 3.90 – 4.10 3.30 - 3.40 3.02 2.94
Df @ 1GHz 0.008 – 0.010 0.002 - 0.003 0.0016 0.003
Tg (TMA) °C 180 – 190 175 – 185 - 170
Tg (DMA) °C 210 – 220 210 - 220
CTEZ (< Tg) ppm/°C 35 - 45 48 - 55 58 50
CTEZ (> Tg) ppm/°C 190 – 220 80 – 130
UL Flammability UL-94 V-0 V-0 V-0 -
IPC4101C Slash Sheet /127, /128/, /130 /102
Mid Loss Low Loss Ultra-Low Loss
Transmission Line Characterization
3-Layer Stripline Structure
0.008” Core/0.008” PP
½ oz STD “Shiny” Cu
50 Ω Strip-line
Theta electrical performance comparable to best-in-class mid loss products
#4 Phenolic #3 #2
-50
-30
-10
0 2 4 6 8 10周波数(GHz)
伝送損失(dB/m) HE-679G+HVLP foil
HE-679 G+RT foil
HE-679G+LP foil
D-4+Ｓｔｄ foil
HE-679 G+Std foil
・Loss of HE-679G using VLP or RT is the same as that of D-4 material using Std.
・The reduction of transmission loss is possible by using HVLP.
Transmission Line Characterization vs. Cu Foils
Laminate Electrical Properties
Prepreg/Bondply Electrical Properties
APPLICATIONS
Tested Applications
• 26-Layer, Server CAF/Pb-Free Reflow Test Vehicle
– 260C, 10x Reflow, CAF Test Vehicle (0.8, 1.0 mm pitch)
• 18-Layer, 3+N+3 IST Coupon (Advanced Technology Product
Designs)
– 260C x 9, 100% pass 1000 cycles @ 150C
• 28-Layer Carrier Class Router OEM Test Vehicle
– Internal 2 oz plane layers, 1mm pitch BGA, 10x 260C Reflow, 2 week
35C/85%RH precondition
• 12-Layer 3+N+3 stacked microvia Design
– Stacked microvias, 4x lamination, blind/buried vias
• 18-Layer 1+N+1 Blind-Buried Microvia Test Vehicle
– 10x 260C reflow, 10x no bake solder floats, 6x260C precon + IST 1000
Cycle @150C + IST 100 Cycle @190C
26-Layer PCB TV
26-Layer Test Vehicle • 26 Layer PCB
• 0.130” Thick
• 0.010” (0.30mm) Smallest Hole
• 0.8, 1.0 mm Pitch
• 0.019” Web Thickness
• 13:1 Aspect Ratio
Horizontal Section 10x Reflow JEDEC 260C Reflow Profile
26-Layer Server Class Line Card TV
CAF Coupon
Theta passed all 4 conditions shown above thru 600 hours (for Servers and Storage)
testing at Endicott Interconnect Labs following IBM test requirements
0.48mm
0.53mm
0.68mm
0.74mm
Wall to Wall Spacing
18-Layer, 3+N+3 IST OEM Coupon (Advanced
Technology Product Designs)
Thermal Analysis Unit Results
TG (TMA) °C 175.4
9x260C IST @ 150C CTF 1000
Carrier Class Router
• 28L, 0.145” Thick
• 2 oz plane layers
• Passed Test parameters – 260̊C, 10x Reflow CSAM
– 35̊C /85%RH 2 week precon
– CAF (1000hr,1.0mm BGA)
– HATS Thermal Analysis Unit Results
TG (TMA) °C 185. 4
CTEZ (TMA), pre-Tg ppm/°C 55.02
CTEZ (TMA), post-Tg ppm/°C 260.4
CTEZ (TMA), 50 – 260C % 2.63%
T260 min >30 min
Eye Brow Crack Test Vehicle
Theta passes 6x solder floats 288C (no preconditioning) without any
evidence of eyebrow cracks, competitive materials fail even with prebakes
Thermal Analysis Unit Results
TG (TMA) °C 175.31
CTEZ (TMA), pre-Tg ppm/°C 57.47
CTEZ (TMA), post-Tg ppm/°C 294.8
CTEZ (TMA), 50 – 260C % 3.18%
T260 min 45.9 min
3+N+3 Liquid-Liquid Thermal Shock (B)
Thermal Analysis Unit Results
TG (TMA) °C 171.70
CTEZ (TMA), pre-Tg ppm/°C 55.8
CTEZ (TMA), post-Tg ppm/°C 278.6
CTEZ (TMA), 50 – 260C % 3.096%
T260 min 16.33
1+N+1 Blind-Buried Stacked Microvia TV
Thermal Analysis Unit Results
TG (TMA) °C 174.42
IST @ 150C +
IST @190C CTF 1000+/100+
Lead-Free Assembly
JEDEC STD # of Pass 10X+
Solder Floats (no bake) # of Pass 10X
18-Layer, 0.085” (2.16mm) thickness
• 18 Layers
• Thickness: 0.085” (2.16mm)
• 2 lamination cycles
• Stacked via over Buried Via
• Passed Test Parameters:
– IST coupons (150C + 190C)
– 10x 260C̊ JEDEC LFA Reflow
FABRICATION
Processing
• Prepreg Shelf-Life/Storage
• Lamination
• Drilling
• Desmear
Precautions in handling
• The shelf life of prepreg is 3 months after the date of
shipping with controlled condition in the moisture barrier
packing (aluminum laminated bag).
• Storage Recommendations: 20+/-5oC(68+/-9oF), <60%RH
Prepreg Shelf-Life/Storage
Lamination Process of HE-679G
• The press cycle should be adjusted in order to attain a Tg of
175oC(347oF) or more (by TMA)
• The product temperature should reach 190oC(374oF). The
minimum requirement should be that the product
temperature exceeds 180oC(356oF) for more than 80
minutes. (Must ; ref. Fig.)
• Product Heating Rate; 2.5-5.0oC /min at 60-130oC
• Apply Full Pressure (2.5-4.0 MPa) before product reaches
110oC
Lamination Cycle
0
50
100
150
200
0 30 60 90 120 150 180 210 240
Time (min.)
Pro
du
cts
Te
mp
era
ture
(oC
)
0
1
2
3
4
5
6
7
8
9
10
11
12
Pre
ss
ure
(M
Pa
)
Keep more than 180oC(356
oF),
more than 80min. in products
Product pressure: 3MPa(427psi)
Vaccuum Condition: under 4.0mmHg
heating rate: 3-4oC/min.(6-7
oF)
(80oC~130
oC(176-266
oF))
Fig. Recommended press condition
0.4-0.7MP(50-85psi) for 27min.
Press timing: 110-130oC(230-266oF)
190℃
Lamination Process of HE-679G
Apply Full Pressure below 110C̊
Lamination Cycle
Desmearing process
Theta desmear rate is faster than FR-4 in permanganate process
Process Chemicals Temp.
(oC) Duration (Min.)
Swelling Swelling dip Securiganth P 70 2.5 – 5
Etching Concentrate Compact CP 70 5 – 7
Neutralization Securiganth P-500 40 5
Material Sample:
50mm X 50mm (without
copper), N=5
Chemistry:
Rohm and Haas
Desmear
Desmear: Plasma vs. Permanganate
Plasma penetration into
glass bundles
Permanganate results in
virtually no wicking
FX-2
PRODUCT OVERVIEW
Product Overview
Features Benefits
High Tg (175 – 185C)/ Lead Free Process
Compatible
High Temperature Processing
Capability
Ease of Fabrication
Meets Environmental Concerns
Low Insertion Loss (50% lower than FR-4)
Dk – 3.4; Df – 0.0026 (1 GHz)
Suitable for applications > 10 Gbps
CAF Resistant Long Term MLB Reliability
Low Z-Axis CTE – 45 ppm/C (<Tg) Superior Thermal / Mechanical
Reliability
Product Line-Up of MCL-FX-2
*This line-up plan is as of Apr.’11. The line-up may be changed for some reasons.
Code nameActual
thicknessEstimated Dk Estimated Df
- (inch) (mm) (inch) 1 GHz 3 GHz 5 GHz 10 GHz 1 GHz 3 GHz 5 GHz 10 GHz
0.05 0.002 1037 x 1 71(69- 73) 0.050 0.0020 3.24 3.24 3.23 3.22 0.0023 0.0028 0.0036 0.0044
Y0.05 0.002 1067 x 1 63(61- 65) 0.050 0.0020 3.43 3.42 3.41 3.39 0.0024 0.0034 0.0042 0.0053
M0.06 0.002 1078 x 1 54(52- 56) 0.057 0.0022 3.44 3.43 3.42 3.41 0.0026 0.0036 0.0045 0.0055
0.06 0.002 1080 x 1 54(52- 56) 0.058 0.0023 3.44 3.43 3.42 3.41 0.0026 0.0036 0.0045 0.0055
M0.08 0.003 1078 x 1 64(62- 66) 0.076 0.0030 3.43 3.42 3.41 3.39 0.0024 0.0034 0.0042 0.0053
0.08 0.003 1080 x 1 64(62- 66) 0.078 0.0031 3.43 3.42 3.41 3.39 0.0024 0.0034 0.0042 0.0053
0.1 0.004 3313 x 1 54(52- 56) 0.100 0.0039 3.44 3.43 3.42 3.41 0.0026 0.0036 0.0045 0.0055
0.11 0.004 1037 x 2 71(69- 73) 0.100 0.0039 3.24 3.24 3.23 3.22 0.0023 0.0028 0.0036 0.0044
Y0.11 0.004 1067 x 2 63(61- 65) 0.100 0.0039 3.43 3.42 3.41 3.39 0.0024 0.0034 0.0042 0.0053
0.13 0.005 2116 x 1 54(52- 56) 0.125 0.0049 3.44 3.43 3.42 3.41 0.0026 0.0036 0.0045 0.0055
0.2 0.008 3313 x 2 54(52- 56) 0.200 0.0079 3.44 3.43 3.42 3.41 0.0026 0.0036 0.0045 0.0055
0.26 0.010 2116 x 2 54(52- 56) 0.250 0.0098 3.44 3.43 3.42 3.41 0.0026 0.0036 0.0045 0.0055
0.4 0.016 1501 x 2 54(52- 56) 0.397 0.0156 3.44 3.43 3.42 3.41 0.0026 0.0036 0.0045 0.0055
0.5 0.020 1501 x 2 + x 1 54(52- 56) 0.497 0.0196 3.44 3.43 3.42 3.41 0.0026 0.0036 0.0045 0.0055
0.6 0.024 1501 x 3 54(52- 56) 0.596 0.0235 3.44 3.43 3.42 3.41 0.0026 0.0036 0.0045 0.0055
0.8 0.032 1501 x 4 54(52- 56) 0.794 0.0313 3.44 3.43 3.42 3.41 0.0026 0.0036 0.0045 0.0055
1.0 0.040 1501 x 5 54(52- 56) 0.993 0.0391 3.44 3.43 3.42 3.41 0.0026 0.0036 0.0045 0.0055
1.2 0.047 1501 x 6 54(52- 56) 1.191 0.0469 3.44 3.43 3.42 3.41 0.0026 0.0036 0.0045 0.0055
1.4 0.055 1501 x 7 54(52- 56) 1.390 0.0547 3.44 3.43 3.42 3.41 0.0026 0.0036 0.0045 0.0055
1.6 0.063 1501 x 8 54(52- 56) 1.588 0.0625 3.44 3.43 3.42 3.41 0.0026 0.0036 0.0045 0.0055
VLP
12 (3/8oz.)
18 (0.5oz.)
35 (1oz.)
profile free
12 (3/8oz.)
18 (0.5oz.)
35 (1oz.)
Copper foil
(um)Construction
RC
(wt%)
Standard
12 (3/8oz.)
18 (0.5oz.)
35 (1oz.)
70 (2oz.)
Laminate Electrical Properties
Product Line-Up of GFA-2 (Prepreg)
**The dielectric thickness after lamination is defined as the thickness of one sheet of prepreg when the
resin flow is within 0%. This value changes according to the press condition and inner-layer pattern.
***This line-up plan is as of Apr.’11. The line-up may be changed for some reasons.
After lam. Thickness Estimated Dk Estimated Df
(mm) (inch) 1 GHz 3 GHz 5 GHz 10 GHz 1 GHz 3 GHz 5 GHz 10 GHz
0.04 #1037 KZNC 69 - 73 0.050 0.0020 3.24 3.24 3.23 3.22 0.0023 0.0027 0.0036 0.0044
#1067 KYMC 61 - 65 0.050 0.0020 3.43 3.42 3.41 3.39 0.0024 0.0034 0.0042 0.0053
#1067 KYUC 71 - 75 0.072 0.0028 3.24 3.24 3.23 3.22 0.0023 0.0027 0.0036 0.0044
0.06 #1080 KUQC 62 - 66 0.078 0.0031 3.43 3.42 3.41 3.39 0.0024 0.0034 0.0042 0.0053
#1080 KUMC 66 - 70 0.089 0.0035 3.35 3.34 3.33 3.31 0.0024 0.0028 0.0041 0.0052
#1080 KUPC 70 - 74 0.104 0.0041 3.24 3.24 3.23 3.22 0.0023 0.0027 0.0036 0.0044
#1078 KRQC 62 - 66 0.076 0.0030 3.43 3.42 3.41 3.39 0.0024 0.0034 0.0042 0.0053
#1078 KRMC 66 - 70 0.087 0.0034 3.35 3.34 3.33 3.31 0.0024 0.0028 0.0041 0.0052
0.08 #3313 KGHB 54 - 58 0.106 0.0042 3.44 3.43 3.42 3.41 0.0026 0.0036 0.0045 0.0055
#3313 KGKB 56 - 60 0.112 0.0044 3.43 3.43 3.42 3.41 0.0025 0.0032 0.0043 0.0054
0.1 #2116 KAGB 52 - 56 0.125 0.0049 3.44 3.43 3.42 3.41 0.0026 0.0036 0.0045 0.0055
0.15 #1501 KQGB 50 - 54 0.188 0.0074 3.48 3.47 3.46 3.45 0.0029 0.0040 0.0050 0.0061
RC
(wt%)Glass Style
Nominal
thickness
(mm)
Prepreg
Type name
Prepreg Electrical Properties
-60
-40
-20
0
0 5 10 15 20
Frequency (GHz)
Tra
nsm
isson L
oss (
dB
/m
)
FX-2+HVLP foil
FX-2+Std foil
FX-2+RT foil
FX-2+LP foil
D-6+HVLP foil
FX-2 Transmission Loss (Various copper)
・Loss of FX-2 using VLP or RT is the same as that of D-6 material using HVLP.
・The reduction of transmission loss is possible by using HVLP.
Transmission Line Characterization vs. Cu Foils
SPP method
Evaluation Board
Construction
High RC (S3)
1
2
3
4
5
6
7
8
Core 1x1078, 72% resin
1/2oz Cu (PF)
Fill 1x1078, 72% resin
Core 1x2116 54% resin
Fill 1x2116 54% resin
1/2oz Cu (PF)
1/2oz Cu (VLP)
1/2oz Cu (VLP)
1/2oz Cu (VLP)
1/2oz Cu (VLP)
Fill 1x2116 54% resin
1/2oz Cu (STD)
Fill
1/2oz Cu (STD)
1x2116 54% resin
Core 1x2116 54% resin
1
2
3
4
5
6
7
8
Core 1x1078, 72% resin
1/2oz Cu (PF)
Fill 1x1078, 72% resin
Core 1x2116 54% resin
Fill 1x2116 54% resin
1/2oz Cu (PF)
1/2oz Cu (VLP)
1/2oz Cu (VLP)
1/2oz Cu (VLP)
1/2oz Cu (VLP)
Fill 1x2116 54% resin
1/2oz Cu (STD)
Fill
1/2oz Cu (STD)
1x2116 54% resin
Core 1x2116 54% resin
Low RC (S6)
SMASPP2z Test Vehicle
3cm
9.8cm
Evaluation Line: Single end strip line
Pulse wave analysis Equipment
Short Pulse Propagation (SPP) Method, Dk/Df
SPP Extracted Dk/Df
Short Pulse Propagation (SPP) Method, Dk/Df FX-2
Block Frequency Dk Df
1GHz 3.118 0.0050
3GHz 3.106 0.0053
10GHz 3.095 0.0053
20GHz 3.087 0.0064
1GHz 3.482 0.0054
3GHz 3.469 0.0058
10GHz 3.454 0.0062
20GHz 3.444 0.0074
HE-679GBlock Frequency Dk Df
1GHz 3.675 0.0148
3GHz 3.634 0.0161
10GHz 3.588 0.0165
20GHz 3.562 0.0169
1GHz 3.950 0.0115
3GHz 3.917 0.0124
10GHz 3.880 0.0125
20GHz 3.858 0.0134
S3
(Resin rich)
S6
(Resin poor)
S3
(Resin rich)
S6
(Resin poor)
Layer counts : 26 layer board
Total thickness : 4.1mm
Precondition:
E-0.5/110 C-24/85/85%RH
Reflow
260degC X 10 times
No blister & No delamination
observed
Dia.0.25mm Dia.0.30mm
Heat resistance of high layer count board
After reflow 260degC 10sec x 6 times
26-Layer Lead-Free TV
CAF Coupon
FX-2 passed all 4 conditions shown above thru 600 hours (for Servers and Storage)
testing following IBM test requirements
0.48mm
0.53mm
0.68mm
0.74mm
Wall to Wall Spacing
Thermal Analysis
Test Description Unit Method Results
FX-2 Cycle 1 Cycle 2
TG (TMA) °C IPC TM 650 2.4.41 191.15 193.7
CTEZ (TMA), pre-Tg ppm/°C IPC TM 650 2.4.41 73.26 72.21
CTEZ (TMA), post-Tg ppm/°C IPC TM 650 2.4.41 130.6 127.8
CTEZ (TMA), 50 – 260C % IPC TM 650 2.4.41 2.177 2.126
T260 (with external copper) min IPC TM 650 2.4.24.1 Pass Pass
T288 (with external copper) min IPC TM 650 2.4.24.1 12.39 10.64
Ultra-Low Loss High Speed Digital
Material System
12/5/2012 Rogers Proprietary 57
Emerging Market Needs • We are seeing an emerging market opportunity for
interconnects at speeds of 25 Gb/s and higher with
interconnect lengths up to 30” – High Speed Computing
– SANS
– IP Routers / Switches
– ATE
– Optical Networks
– Backplanes and large system cards
12/5/2012 Rogers Proprietary 58
Emerging Market Needs
• No existing material system available today meets all needs - Electrical modeling indicates a need for
- Dk<3.5
- Df<.002
- Low surface roughness copper (=/< .5 um Rq)
- Very few Choices meet above criteria
- In Addition; Designs typified by need for
- High layer counts
- Dimensional stability
- Low Z-axis CTE for reliability on high aspect ratio holes
- Ability to withstand lead-free solder reflow (high Td)
