© 2011 ANSYS, Inc. December 9, 2013 1

High speed interface simulation using the new 3D layout HFSS interface

S. Muff

ANSYS Germany GmbH

© 2011 ANSYS, Inc. December 9, 2013 2

ANSYS Electronic Solutions

SI and RF Physical Design

EMI/EMC Antennas Package/PCB

Electromechanical Physical Design

Motors/Actuators Power Electronics

Circuit & System Design

© 2011 ANSYS, Inc. December 9, 2013 4

SIwave & ALinks GUI

SIwave HFSS Sentinel-PSI

DesignerSI Q3D Extractor

Icepak Workbench

New SIwave Platform Solution

Thermal

Sentinel-TI

Analog/IP

Totem

RTL

PowerArtist

SoC

RedHawk

Apache IC

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Designer Desktop

HPC Partners

CAD Partners

• Pro/E Wildfire

• UG NX

• CATIA V5 • SolidWorks

• SpaceClaim

ANSYS Multiphysics Platform

EDA Partners

• Zuken

• ODB++

• Cadence

• Synopsys

• Mentor

Apache IC Modeling

Co-Simulation

Temperature Deformation RF Power

SIwave Simulation

• HFSS

• SIwave/PSI

• Q3D/NPE

• Mechanical

• IcePak

CPM from RedHawk

Integrated HFSS Solver

Layout

Stackup

3D View

ANSYS Electronics Platform

© 2011 ANSYS, Inc. December 9, 2013 6

Two HFSS Design Interfaces

Both Require the Accuracy of 3D and HFSS

Mechanical CAD (MCAD)

Electrical Layout (ECAD)

© 2011 ANSYS, Inc. December 9, 2013 8

Fast meshing technology for ECAD geometry

• EBU Classic mesher – 3D conformal mesh, expensive for ECAD

– Can be used with adaptive refinement

• Traditional ECAD meshers – 2D or Prismatic mesh, fast for ECAD

– Difficult to adapt locally

– Geometry restrictions

• Phi mesher – Fast 3D conformal mesh for ECAD

– Full adaptation control

R15: HFSS for ECAD Phi Mesher

0

10

20

30

40

50

60

70

1.E+02 1.E+03 1.E+04 1.E+05 1.E+06 1.E+07

Phi is 10x to 30x faster than Classic

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• Import Capabilities Direct Import of Cadence .mcm,.brd files and Mentor/Altium ODB++

Importing Capabilities

File > Import >

Layout Generated in ECAD System

EM Layout

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• Modify Stackup/Layers

Select the menu item Layout > Layers

Add, Remove signal or dielectric layers

• Parameterization Parametric Design Environment

• Fully parameterized geometry and stackups

• New stackup dialog with laminate mode

• Visibility-by-type

• XML read/write

Layer Stackup Editor

Layers Stackup

© 2011 ANSYS, Inc. December 9, 2013 13

Stackup Editor - Manufacturing Tolerances

Image courtesy of AMKOR • Overetching and Underetching

© 2011 ANSYS, Inc. December 9, 2013 14

Layer Stackup Editor - Parameterization

Via Radius Trace Widths

• Fully parameterized padstack geometry Vias

Pads

• Layer based or per each net/polygon Trace widths

© 2011 ANSYS, Inc. December 9, 2013 15

Embedded Dielectric Layer

Embedded Dielectric Layer Dielectric Layer

For embedded dielectric layer(s): 1) Define it as signal layer(s) 2) Turn on ‘Solve Inside’ option for HFSS

© 2011 ANSYS, Inc. December 9, 2013 16

• Ports Creation During Import process

• Ports created on nets of interest

• Maintain Trace Characteristics and Nets from Layout

Intelligent Automatic Ports Creation

Netname(s) to be imported

Option to setup ports for netname(s) imported

File > Import >

© 2011 ANSYS, Inc. December 9, 2013 17

• Create Gap Coax Port

As simple as Draw > Port > Create or

Select Edges Port > Create Edge Port

• Vertical or Coaxial

Intelligent Automatic Ports Creation

© 2011 ANSYS, Inc. December 9, 2013 18

• Automatic Ports Setup Right click > Select Edges > “Click on Ports Edges”

Wave or Lumped ports depending on routing type

Wave or Lumped Ports

Gap (Lumped) Port

Wave Port

Convert Lumped to Wave Port

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Embedded Components • S-parameters or RLC components

– No requirement to mesh a boundary condition or to add ports for connecting terminals of a device

– Includes ability to represent these component models via S-parameters

© 2011 ANSYS, Inc. December 9, 2013 20

• Solve DC point with Q3D Extractor engine Bringing together two best-in-class 3D solvers for hyper-accurate

extraction of broadband models for packages and PCBs

• Enforced Passivity and Causality

Integrated DC solver

Automatic application of source and sinks for Q3D

Calculated non-complex DC point

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Results Comparison

Solid – HFSS 3D Dashed – HFSS in 3D Layout

• HFSS 3D compared to HFSS 3D Electrtical Layout

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DesignerSI

•Circuit Simulator- Nexxim Engine (transient, fast convolution, statistical and IBIS-AMI circuit simulation) •Integrated Schematic capture and layout tool •Design management front-end linking EM simulation products (HFSS, Q3D, SIwave, ..) •2D quasi-static field solver •HFSS Solver on Demand

© 2011 ANSYS, Inc. December 9, 2013 24

DDR3 in DesignerSI Virtual Compliance

JEDEC DDR3 Memory Specification 226 Pages

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• HFSS in 3D Layout provides: Direct Import of Cadence .mcm, .brd, .sip files and ODB++

Layout intelligent Automatic Port Setup

• Support circuit ports of SIwave

Industry Leading Meshing capacity

• Advanced Phi mesher reduces 30 – 40x

Parameterized Stackup Geometry

Solve at DC with integrated DC solver

Passive and Causal frequency sweeps

• Workshops Package setup & simulation

• mcm import, cut put and parameterize, automated setup

PCB setup and simulation

• Circuit ports support, RLC component transfer (ext. S-par. w/i HFSS)

Summary

© 2011 ANSYS, Inc. December 9, 2013 26

Thank You