DELIVERING QUALITY SINCE 1952.

High-TechPrinted Circuit Boards Overview

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America's Oldest,A History of Innovation

Privately held company, established in 1952.

Estimated 2013: Sales: US$40 Million

100+ Employees Worldwide (70 – North America, 30 – Asia, 3 – Europe)

Design and manufacture customized, built-to-print, performance-critical products for all sectors of the electronics industry.

Leading provider of printed circuit boards, membrane switches, graphic overlays, silicone rubber products, electronic heaters, fans, motors and custom battery packs.

Integrated supply chain management solutions to handle the complexity of today’s global marketplace while making sure that every order is being manufactured at the “right” factory.

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Global Operations

Significant Investment in People and Facilities across the globe.

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Our Customers - The Top GlobalOEM’s In Growth Industries

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Industry Breakdown

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Technology Road Map

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Focus on the Right Market

Key Markets to go after:– Industrial

• Avionics• Aerospace• Automation

– Telecommunications– Information Technologies– Military

• Communications• Antenna• Satellite• Ordinance• Aerospace

– Medical– Transportation

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Quickturn PCB Capabilities

Up to 18 Layers Laminate – FR-4 (All Tg & Td Ranges), CEM-1, Teflon, Ceramic, Polyimide Finished Thickness Up to .300” Minimum Dielectric Spacing = .003” Green, Blue, Red, Black, Clear and White Solder Masks and Legend Inks Immersion Gold, Gold Fingers, Full Body Gold, Bondable Gold Immersion Silver, Immersion Tin, Lead Free HAL, OSP, ENEPIG Minimum Lines & Spaces =.003” Blind & Buried Vias Maximum Panel Size = 24” x 36” Minimum Finished Hole Size = .005” +/- .003” Maximum Hole Aspect Ratio = 15:1 Maximum Copper Weight = 6 oz. (UL Approved) Laser Direct Imaging and Laser Drilling Controlled Impedance +/- 10% Carbon Ink

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Clear Focus in Manufacturing

Focusing on Technology:– 2.7 Mil Signals– 26:1 Via Aspect Ratio– Impedance down to 5%– Micro via Laser & Stacked Drill and

rout– Thermal Solutions & Cavities– Oversize Boards and Backplanes

Backplanes & Back panels– Up to 24 x 34 panels– Up to .400” thickness– Hi Performance dielectrics– 24 Hour Quickturn are available– All surface finishes are available

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To Be SuccessfulYou Need the Right Tools

Laser Direct Imaging:– Orbotech LDI System– 60 Scans per hour w/ 1 Mil signal

resolution– 5 Colight Exposure Units– 3 Collimated Exposure Units

Develop Etch & Strip:– HMS Hollmuller DES– Steady State processing– Accelerated Cycles– Increased thru-put– Enhanced yields

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Continued Investment

Autoclave Vacuum Lamination:– Vacuum Press International– Allows for oversized

panels/backplanes– Improves adhesion– Improves tolerance– Reduces Cycle Time

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Capital Investment

Excellon Dual Laser– Microvias– 3k holes/minute– Stacked Vias– Laser Trim– Laser Route

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Capital Investment

Drill Optimize & Register:– Multiline System– Real Time x-Ray– Sub lam registration– Optimize scale factors– Enhanced yields

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PCB Services

Delivery

STANDARD LEAD TIME - 20 Working DaysTechnology 1 Day 2 Day 3 Day 5 Day 7 Day 10 Day

1 - 4 Layers x x x x x x

6 - 10 Layers x x x x x

> 10 Layers x x x x

Both Prototype and Production Quantities

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HDI – High Density Interconnect PCB

HDI is a PCB with a higher wiring density per area, finer lines and space, smaller vias and pads than conventional PCB’s.

HDI Boards contain blind and/or buried vias and often contain microvias of .006 or less in diameter.

To produce HDI boards, laser direct imaging and laser drilling equipment is a must along with investment in other high tech equipment to ensure high quality production.

HDI Production Capabilities

Laser Microvias Blind and Buried Via’s Sequential Lamination Via-In-Pad Technology 2/2 lines and spacing Copper filled stacked microvia’s Up to 18 Layers Down to 2 mil dielectrics Tight Impedance Control

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Value Added Capabilities

Castellated Edges Counter Sinks/Counter Bores

– Plated/Non-Plated Standoff’s, Spacers & Pem Nuts Installed Connectors (Soldered/Press Fit) Aluminum Clad Boards Silver Thru Hole Volume Production

FR-4 Custom Board Spacers Ultra Clean Ionic Cleanliness Eyelets Peelable Solder Mask Edge Plating MIL-55110 & 31032 Back Planes

Hole Tolerance +/- .002”

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Material Used in Fabrication

Arlon ISOLA ITEQ ROGERS TACNOIC NANYA NELCO

522 AD 370HR IT-140 3003 TMM6

RF-35 NP140 N4000-13

527 CLTE

FR406 IT-156 4003 ULTRALAM

TLT N4000-13EP

870 CUCLAD

FR408 IT-180A 4350 TLX N4000-13SI

933 DICLAD

FR408HR

5870 TLY N4000-6

25FR GX

GETEK 5880 TSM30

25N GY IS410 6002

35N LX IS415 6010

85N TMM10

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PCB Design and Layout

Our Capabilities Encompass The Full Design Flow From Start To Finish Including:

Micro BGA / Micro Via / Blind and Buried Vias Rules Driven Designs Schematic Capture Library Development Database Construction and Verification Signal Integrity/Design Verification EMI Checking Full Document Package Creation Electrical Engineering Expertise

We are fully licensed and utilize industry leading tools, including Cadence Allegro, Mentor Expedition, Mentor's PADS, Altium, Valor for DFM Analysis.

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World Class Quality Assurance & Engineering

US Based QA Capabilities Include:– Full Cross Section/Microsection Reporting and Ionic

Testing Equipment– X-Ray Fisherscope for all Metal Thickness & Purity

Measurement on every lot.– Scienscope DMP-1000 stereo zoom microscope with

digital picture capability up to 100x– Vision Engineering Mantis Elite for 10X full range

visual inspection.– World Class Electronics Test Lab

Epec’s superior on-time delivery rates are the result of our significant, dedicated engineering resources and processes.

– Perform all DRC, DFM, Graphic Art and Engineering reviews at our Engineering Center outside of Boston, MA

– Documentation of all manufacturing and detailed planning processes, for all special requirements,

– Consistent documentation and tooling at all manufacturing locations to ensure seamless prototype through production manufacturing.

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The Epec Value Added Operation

The Broker

Customer Delivery in

as little as 1 day.

98% On-Time

99.5% Quality

Product arrives at

Epec, is re-inspected, final QA is completed

before shipping to customer.

On-site QA Inspection at factory by Epec

employees.

Epec US & Asian

Operations groups

manages order status,

on-site; daily WIP analysis

through ERP System

Continual process and

on-site technical

improvement program, to

optimize delivery and

quality performance

Manufacturing Begins

Complete Epec Eng Analysis, work with customer to resolve

all technical and build issues.

Production Planning matches

order with our optimal domestic or

Asian facility

Receive Customer

Order

The Epec Operation

Customer Delivery in

5-8 weeks

80% On-Time80% Quality

Send order to the factory broker

works with

Receive Customer

Order

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Our Products

Battery Packs Flex & Rigid-Flex PCB’s User Interfaces

Fans & Motors Cable Assemblies Printed Circuit Boards

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Inventory Management

Customer requirements are always unique and customized, therefore our inventory management system must accommodate for this type of environment.

We Offer:– Kanban– Consignment– JIT Programs– Blanket Orders– Customer Fulfillment– Bonded Warehousing– Kitting– Safety Stock– Other flexible solutions

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The Difference is Quality and Delivery

1. Quicker Delivery - Epec's technology infrastructure and people, including the Asian and US based operations and engineering teams, enable jobs to get started the same day the order data is electronically received by our factory.

2. Accurate Information - Epec's on-site personnel provide accurate daily Work In Process reports so customers can receive immediate order status information, along with in person verification of all daily reports by Epec staff.

3. Better Quality - Epec ensures higher levels of quality through three key additional processes. On-site QA inspectors at each facility provide an additional audit before it leaves Asia, Epec maintains dual UL approval at each facility with quarterly audits, and perform QA audits at our headquarters in Boston, MA.

4. Flexibility - Each of our manufacturing facilities have been selected for theirbest-in-class niche product and delivery solutions, ensuring our optimal facility is building every order.

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If you require additional information please contact us with any questions or requests.

North American Headquarters174 Duchaine Blvd.New Bedford, MA 02745Tel: (508) 995-5171Fax: (508) 998-8694

Contact Us By Email:Sales sales@epectec.comQuotes quoting@epectec.comEngineering engineering@epectec.com

Visit Our Website For More Informationwww.epectec.com

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