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Home > Documents > HI(PCA Journal No. 16 Figure 3. Comparison of process operating window for HASL with different...

HI(PCA Journal No. 16 Figure 3. Comparison of process operating window for HASL with different...

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Page 1: HI(PCA Journal No. 16 Figure 3. Comparison of process operating window for HASL with different alloys With tin-lead solder, the copper concentration must be maintained below 0.3%,

Page 2: HI(PCA Journal No. 16 Figure 3. Comparison of process operating window for HASL with different alloys With tin-lead solder, the copper concentration must be maintained below 0.3%,

Page 3: HI(PCA Journal No. 16 Figure 3. Comparison of process operating window for HASL with different alloys With tin-lead solder, the copper concentration must be maintained below 0.3%,

Page 4: HI(PCA Journal No. 16 Figure 3. Comparison of process operating window for HASL with different alloys With tin-lead solder, the copper concentration must be maintained below 0.3%,

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