Honeywell AES Workmanship, Supplemental Standardquality.saricamfg.com/Work Instructions/Sarica...

Sarica Manufacturing Company

Process Manual 10.01.00 Rev M

Written in conjunction with IPC/EIA J-STD-001, IPC-A-610, IPC/WHMA-A-

620, ANSI/ESD-S20.20,IPC-7711 REWORK

Sarica Manufacturing, Inc. G r o u p C o d e 10

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Do cu m e n t I d e nti f i e r 00

W OR K M AN S H I P S T ANDAR D

TABLE OF CONTENTS

1. Introduction

2. General

2.1 SOP Harness/Cable2.2 SOP CCA2.3 Assembly Instructions2.4 Training 610/620/001-ESD2.5 Visual Acuity2.6 Quality Records2.7 Lighting Illumination/Magnification2.8 Calibration2.9 Multiple Terminals2.10 Equipment2.11 Materials2.12 Procedures and Requirements2.13 Printed Wiring Board Damage2.14 Storage, Handling, Cleaning2.15 Lead Forming2.16 Cleanliness2.17 Safety2.18 Assembly Criteria2.19 Acceptance Criteria, Cable/Wire Harness2.20 Packaging Cable and Harness2.21 Ionograph2.22 MSD2.23 Nonconformance2.24 Maintenance2.25 First Piece Inspection/IPI

3. Hand Soldering

3.0 General3.1 Cleanliness of Soldering Work Areas3.2 Lead Trimming3.3 Pre-Tinning/Tinning3.4 Soldering Iron Tip Cleaning3.5 Hand Soldering3.6 Insulation Stripping3.7 Mechanical Assembly

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3.8 Inspection3.9 Fasteners3.10 Procedure to Solder Flared Terminal to Circuit Foil (Pad)3.11 Eyelets3.12 Wire Attachment3.13 Turret Terminals3.14 Bifurcated Terminals3.15 Hook, Eyelet, Perforated or Pierced Terminals3.16 Stress Relief/Routing3.17 Splicing3.18 Solder Wicking3.19 Solder in the Lead’s Bend Radius3.20 Anti-Wicking Tools3.21 Cordwood Assembly3.22 Clearance3.23 Printed Wiring Board Contacts3.24 Procedure for Resistance Soldering3.25 Conductive Soldering of Lampholders3.26 Lamp Contacts3.27 Safety3.28 Special Provisions3.29 Visual Inspection Criteria for Resistance Soldering3.30 Visual Inspection Criteria for Conductive Soldering of Lampholders3.31 Visual Inspection Criteria for Lamp Contact Assemblies3.32 Quality Records3.33 Termination Requirements3.34 Jumper Wires

4. ESD

4.0 Forms4.1 Conflict4.2 Equipment/Supplies4.3 Packaging and Storage Equipment4.4 Specifications of ESD Sensitive Components4.5 Engineering Drawings of ESD Sensitive Components4.6 Packaging of Components4.7 Procedures for Areas Where Unpackaged and Unprotected ESDS Components are Handled

Routinely4.8 Procedures for Areas Where Unpackaged and Unprotected ESDS Components are Handled

Occasionally



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4.9 Processing and Handling of ESDS Components4.10 Other Procedures4.11 Safety4.12 Packaging4.13 Labeling4.14 Quality Assurance4.15 Manufacturing Audits4.16 Quality Records

5. Terminal Crimping

5.0 Forms5.1 Training Requirements5.2 Material/Solution/Equipment5.3 Control, Maintenance and Storage of Crimping Equipment5.4 Repair Disposition5.5 Accuracy of Standards Used for Verification5.6 Mechanical Wire Strippers 5.7.1 Requirements for Crimped Terminations and Connections5.8 Damage of Wire Insulation5.9 Insulation Crimp5.10 Insulation Crimp Adjustment Test Instruction (Open or Closed Barrel Terminals)5.11 Crimp Terminals5.12 Connector Assemblies5.13 Barrel Terminal Splice Crimping5.14 Safety5.15 Insulation Displacement Connection (IDC)5.16 Quality Assurance5.A Crimp Pull Test Procedure

6. Lacing, Tying Wrapping

6.1 Materials6.2 Requirements for Adhesive6.3 Requirements6.4 Termination Points6.5 Boot Areas6.6 Conductor Flexible Tubing6.7 Connectors Without Strain Relief Clamps6.8 Application of Bundle Ties6.9 Tying Methods for Plastic Tie Straps6.10 Tying Methods for Tape6.11 Protecting Wire at Multiconductor Splices



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6.12 Exception Areas6.13 Spacing Between Stitches6.14 Safety6.15 Cleanliness or Work Station6.16 Wire/Harness Installation6.17 Cable and Wire Harness, Bend Radius6.18 Braided Shield6.19 Braid-Pre-Woven6.20 Routing of Wiring, Cable and Harnesses

7. Wire Prep & Marking/Labeling

7.1 Twisting of Wires7.2 Wire Stripping7.3 Marking/Labeling7.4 Connection Requirements

8. Rework, Modification

8.1 Repair8.2 Rework Wave Solder and Reflow Soldering8.3 Rework Hand Soldering

9. Installation of Bolts, Nuts, Screws

9.1 Effects of Surface Coatings9.2 Selection of Fastener9.3 Safety Wiring9.4 Fastener Flatness/Tilt9.5 Workmanship Criteria9.6 Torque and Stripping Requirements9.7 Flat Head Screws9.8 Flat Washers and Lock Washers9.9 General Requirements9.10 Allowable Gap Dimensions9.11 Quality Assurance9.12 Acceptance Criteria9.13 Quality Assurance9.14 Assembly Criteria

10. Adhesives, Compounds, Sleeving & Boots

10.1 DefinitionsDate Rev. Page9/24/2015 M 5 of 217


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10.2 Applications and Curing10.3 Sleeves and Boots10.4 Solder Sleeve Devices10.5 Bonding

11. Through Hole Soldering

11.1 Wave Flow Soldering 11.2 Flux11.3 Flux Thinner11.4 Solder11.5 Solder Purity Maintenance11.6 Process11.7 Resoldering11.8 Inspection Criteria11.9 Dross Removal11.10 Preventative Maintenance11.11 Select Soldering

12. SMT

12.1 Materials12.2 Application of Solder Paste or Epoxy12.3 Placement of Surface-Mounted Components12.4 Soldering12.5 Further Processing12.6 Rework and Repair12.7 Solder Joints12.8 Solder Paste12.9 Reflow12.10 AOI

13. Conformal Coat

13.1 Materials/Solution/Equipment13.2 Cleaning and Drying13.3 Masking13.4 Preparation of Coating13.5 Application of Coating Material13.6 General Requirements13.7 Rework procedure for finished assemblies due to functional failure 13.8 Safety 13.9 Storage



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13.10 Inspection Criteria13.11 Rework for defects in the conformal coating material13.12 Quality Assurance

14. Testing

14.1 Electrical Test14.2 Mechanical Test

15. FOD

15.1 Document Information15.2 Purpose15.3 Scope15.4 Definitions15.5 FOD Area: Do Not Enter With15.6 Training15.7 Training Subjects to Include15.8 Work Instruction 15.9 Preventative Practice15.10 FOD Sensitive Areas15.11 Audits15.12 Compliance Control

16. Final Inspection

16.1 Soldering Anomalies-Excess Solder/Solder Balls/Solder Fines

17. X-ray



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Revision Record

Issue Date Who InitiatedChange

Record of Change

rev. A 8/22/2011 P. Mullen Add to: 9.1.3 Potting material used must be verified in accordance with print router or job specifications.

rev. B 12/9/2012 P. Mullen Add updates to comply to NADCAP requirements.

rev.B1 5/7/2012 P. Mullen Add updates to comply to NADCAP requirements

rev. C 6/15/2012 T. Miller Added updates to NADCAP requirements.

rev. D 11/1/2012 K.Vandeman, T.Miller

Changed Ionic contamination level from 20 to 10 micrograms per square inch. Corrected procedure # in 1.3.1 from “3.1” to “1.1”. Corrected multiple typo and spacing errors.

rev. E 3/15/2013 T. Miller,K. Vandeman

Multiple updates

rev. F 6/25/2013 K. Vandeman Added Updated to HPS1009 & HPS1007 requirements.

rev. G 11/1/2013 K. Vandeman Updates made for the following sections: 2.10.5, 2.11, 2.11.3, 2.14.1, 2.15, 2.16.3.2, 2.19.3.4, 2.23, 3.33, 4.9, 4.17, 7.2, 7.3.2, 8, 8.3, 9.2.1, 9.9.1, 11.6, 12.8.3, 12.8.8, 12.9.3, 14.1, 16.

rev. H 11/26/2013 K. Vandeman Correction to Soldering Iron Calibration 2.10.5.1

rev. J 4/30/14 T. Miller Updates made to the following sections: 2.3.3.11, 2.7, 2.7.1, 6, 6.10.1.1, 7.3.1, 14.1, 15.9

rev. K 6/26/14 T. Miller, K. Vandeman

Updated section 5.A for new pull test equipment,Updated sections 11.1, and 2.16 for new equipment.

rev. L 8/12/15 K. Vandeman Updated the following sections: 2.5, 2.11, 2.11.1, 2.11.3, 2.20, 2.24, 2.25, 9.2.1, 12.9.3, 12.10, and 17. Added section: 10.5.0 – 10.5.6, and 11.11.

rev. M 9/30/15 T. Miller,K. Vandeman

Updated the following sections: 2.1, 2.25, 3.6.1, 5.3.2.4, 5.12.4, 10.4



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Issue Date Who InitiatedChange

Record of Change



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SECTION 1: INTRODUCTION

Process criteria for Sarica Manufacturing Company, assemblies are contained in the following documents.

• Hand soldering, requirements and workmanship/inspection criterion is contained in the Class 3 requirements of IPC/EIA J-STD-001, IPC-A-610 and HPS1008

• A rework workmanship inspection criterion is contained in the IPC-7711.• Terminal Crimping requirements and workmanship/inspection criteria is contained in IPC/WHMA-A-620• Tie Wrap/Lacing and Solderless Wire Wrap requirements and workmanship/inspection criteria are contained in

IPC/WHMA-A-620 and IPC-A-610 and HPS1008• Wire Preparation in IPC/WHMA-A-620 AND HPS1008• Cleanliness requirements for PCB/CCA are contained in IPC/EIA J-STD-001 and IPC-A-610. And Cable and

Wire Harness IPC-A-620

ESD criterion is contained in ANSI/ESD-S20.20

• Terms and definitions are found in the IPC-T-50.• The Installation of Bolts, Nuts, Screws and Torque Requirements, workmanship and inspection criteria are

contained within this document.• Adhesives and Compounds requirements are contained within this document.

The purpose of this Process Manual is to address criteria not covered by the above documents which are unique to our processes. This manual is to be treated as a supplement to the above documents. The order of precedence for this Process Manual accept/reject criteria is as follows:

• Customer approved print• Sarica Manufacturing approved print• Process Standard Text and Illustrations• IPC/EIA J-STD-001, and IPC-A-610 class 3, ANSI/ESD-S20.20, IPC-7711, IPC/WHMA-A-620 Text• Sarica Manufacturing/Customer (Manufacturing Work Instructions)• Testing requirements IPC/WHMA-A-620• Honeywell Documents 09-03-030, HPS1006, HPS1007, HPS1008, HPS1009

All proposed changes to this Process Manual are to be processed through the Quality and Manufacturing Assurance.

This Process Manual shall be controlled in accordance with Sarica Policies and Procedures.



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SECTION 2: GENERAL

2.1 SOP Harness/Cable



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2.2 SOP CCA



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2.3 Assembly Instructions

2.3.1 Objective:

This procedure (7.5.1-06) defines the method of assembling product to the assembly work cell. Sarica builds per this manual cable, wire harness assemblies, and circuit card assemblies meeting engineering drawing, assembly manuals, aids or customer supplied build information and the requirements of Class 3 of IPC/WHMA-A-620 and CCA to IPC-A-610.

2.3.2 Responsibilities:

2.3.2.1 The Operations/Quality Manager is responsible for ensuring the person performing this work instruction is properly trained or the requirements herein.

2.3.2.2 The Operations/Quality Manager is responsible for all the customer/custom product assemblies. When major Elements are changed validation of the acceptability of the changes are performed and documented.

2.3.3 Procedure:

2.3.3.1 A specific job number shall be issued to the floor with each job. Work Tickets issued must match assembly travelers.

2.3.3.2 The job will have the appropriate build and test instructions which may include engineering drawings, assembly manuals/aids or customer supplied build information. Sarica process router will focus on key processes for individual product review for Process indicators and implement action if required.

2.3.3.3 The operators are responsible for the work ticket to have the latest customer revision and will build and test to above requirements using customer supplied specifications from drawing and/or purchase order using the correct tools, jigs, fixtures and test revision. Sarica only uses full cycle tools for all crimping requirements.

2.3.3.4 Age sensitive material will be identified indicating the end use date, date of acceptance, and initials. Periodic audits be conducted to assure age-sensitive material is not used beyond identified dates.

2.3.3.5 When containers are used in the building and storage of cable/wire harnesses they must be free of all extraneous material and clean. Containers are sometimes used in the kitting of material or the moving of material in the building of the assemblies. In case of CCA's black totes must be used for material movement. Customers sometimes supply packaging material for their products to be stored, processed and shipped in and Sarica complies.

2.3.3.6 Sarica does not allow any damaged, nicked, or scrapped wires or rejected pins/lugs to be used.2.3.3.7 Rework salvage parts if necessary. Retest required for all rework operations.2.3.3.8 Upon completion of the first piece operator will have Quality Control or Manufacture Engineering

validate first piece. Upon approval of first piece the operator will continue to build the full work order and initial or stamp the job order packets indicating the job meets the requirements of the specifications.

2.3.3.9 These records shall be maintained as specified in the Level II Procedure 4.0 Control of Documents section of the Quality System.



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2.3.3.10 Any non-conforming parts found shall be brought to the attention of the Operation Manager for disposition and a reject tag shall be attached. Quality control does the final inspection of material and stamps the work ticket for Compliance requirements.

2.3.3.11 All products shall be tested electrically/mechanically, inspected for proper operation, and results recorded prior to shipment. This shall be a verification of proper wiring unless other specified on the build instruction. Customers supply test equipment/fixtures.

2.3.3.12 All products cleaned with inline Aquastorm cleaning machine must bake out for 12 hours prior to shipping prior to testing or shipment.

2.4 Training IPC-610/IPC-620/J-STD-001/ESD

Sarica works in conjunction with an outside source for inspector, tech, and operator training. Employees are trained to IPC/WHMA-A-620, IPC-A-610, J-STD-001, and ESD by a certified IPC trainer. Training consist of demonstration of wire preparation, cable assembly, crimping, soldering, solder sleeves, tensile test, contact retention, pull test, ESD protection etc. with written exam. Employees must have a minimum of 80% on the written exam. The required modules are included in the certificate records. Documented evidence of certification and training are maintained to show compliance to requirements. Training interval for inspectors and operators does not exceed 12 months. Additional training is done if documented training requirements are not met. If an update in the IPC/WHMA-A-620, IPC-A-610, J-STD-001, or ESD is deemed necessary for retraining, additional training for other internal processes (such as testing), shall be done by the Engineering department or other qualified personnel.

2.5 Visual Acuity

All inspectors and operators have a visual test by an outside firm that specializes in this test every 12 months and the results are kept in the employee records. Visual Acuity test for assembly and inspection personnel include color distinction Ishihara, and nearsighted acuity Jagen Type 1. All operators and inspectors must pass both visual acuity test before performing work on any product.

2.6 Quality Records

• Initialed Work Order• Reject Tag if necessary

2.7 Lighting Illumination/Magnification

Lighting Illumination at the surface of the workstation for soldering, assembly, rework and inspection shall be sufficient enough to allow ease of seeing task to be done (93 foot candles min.). This meets the requirements of the IPC-620 in Table section 1.17.1.1. Plant maintenance will inspect and test the lighting at the workstations annually.

2.7.1 Magnification Aids



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General inspection of cables & harnesses, surface mount technology (SMT), and mixed technology PBAs shall be performed at 10X magnification. Magnification up to 40X shall be used when suspect conditions require higher magnification levels for detection.

2.8 Calibration

When applicable, equipment and tools shall be checked for calibration to the national / international standards.Calibration logs are F-760 Calibrated tool, F-761 Calibrated active crimp tools. Tool name, number, date of Calibration and the date of the due calibration shall be listed on tools and in the logs. Limitations of tooling and equipment are evaluated at the time of purchase. If a tool is found out of calibration it shall be immediately tagged with a reject tag and recalibrated or sent out for calibration. Torque tools conform to ASME B1017.14. Tools and Equipment are verified in the process router when applicable and records are maintained by engineering and plant maintenance.

2.9 Multiple Terminals

When crimping multiple terminals with different size wires using the same crimping tool, will be acceptable to show acceptance that pull tests have been accomplished on all wire/terminal combinations.

2.10 Equipment

2.10.1 Lead Forming Tools

Automatic lead forming devices are preferred. Lead bending tools shall be of the type especially designed for this purpose and shall be selected and maintained such that no detrimental damage results from the use of these tools.

When forming of component leads and wires is required, wire-bending tools shall be used to form the component leads and wires. Round-nosed (Reference Figure 47) or protected long-nose pliers or equivalent may be used as a bending tool as long as the bend-radius requirements are satisfied.

2.10.2 Wire and Lead Cutting Tools

Diagonal, side, or end-cutting tools may be used to cut wire or component leads (Reference Figure 48). The combination of a cutting and swaging tool may be used provided the leads are not fractured after they are cut. Choose tools designed to cut the size of wire or lead being used. Do not assume that all wires/leads, regardless of A.W.G., can be cut using a small pair of side cuts. Use the appropriate size. Not doing so may severely damage the tool’s blades/cutting edges, thus leading to the tool being scrapped.

Tools used to cut leads shall not impart harmful mechanical shock to the component. Shear-type cutters or holding fixtures to absorb shock may be used.

2.10.3 Component-Lead Cleaning Tools



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Component leads shall be cleaned using a cleaning process that is controlled to prevent damage or expose component lead basis metal. Knives, emery cloth, sandpaper, steel wool, and other abrasives shall not be used unless Engineering approved.

2.10.4 Heat Sinks

If specified on the applicable engineering drawing, heat sinks or thermal shunts shall be used to protect heat-sensitive components such as semiconductors, ceramic capacitors, crystal devices, meter movements, insulating materials, etc. from damage due to heat while soldering. Heat sinks shall be of such material, size, shape, and design as to permit rapid application and removal with minimum interference to the soldering procedure and to provide rapid heat removal from the area being soldered. Heat sinks shall be held in place by a suitable means, such as friction or spring tension, to prevent damage to the surface, to the insulation of the wire, and to the component being soldered (Reference Figure 6).

2.10.5 Soldering Tools and Equipment

The soldering tools and equipment shall be capable of heating the joint area rapidly and of maintaining proper soldering temperature at the joint throughout the soldering operation without causing electrical, thermal, or mechanical damage to adjacent areas or connections. Tools shall be clean prior to use (free of dirt, grease, flux, oil and any other foreign matter) and shall be kept clean during use. Sponges shall be kept in a clean, moist condition. Tools and equipment shall be selected, used and maintained such that no damage or degradation that would be detrimental to designed function of parts or assemblies would result from their use. Soldering irons, equipment, and systems shall be chosen and employed to provide temperature control and isolation from electrical overstress or ESD. A tool used to cut leads shall not impart shock that damages a component lead seal or internal connection.

All equipment shall be operated in accordance with the manufacturer’s recommendations and be maintained.

• When equipment is located in non-ESD-controlled areas, maintenance shall be as described in the ESD section of this document.

2.10.5.1 Soldering Irons:

The wattage of the soldering iron and the size and shape of its tip shall permit soldering with maximum ease and control without causing damage to adjacent areas or connections.

Operators preform a daily visual inspection to insure soldering Irons are operating correctly. For calibration of soldering irons refer to section 4.14.1.2 of this document. Calibration stickers shall be present on each acceptable unit.

NOTE: Soldering Irons used for “Hard Solder” on non-ESD assemblies will only be calibrated for tip temperature.



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NOTE: Irons shall be turned off prior to removing tip or disconnecting hand piece. Not doing so could result in damage to the unit. The only exception to this is if the solder iron unit is specially designed to allow this event without damage. Follow manufacturer instructions.

The soldering iron tip shall always be fully inserted into the heating element and securely attached to the iron. Oxidation shall not be allowed to accumulate between the heating element and the tip. A bright, thin, continuous tinned surface shall be maintained on the tip's working surface by using a tip tinning product or simply putting solder on the tip to ensure proper heat transfer and to minimize the transfer of impurities to the solder connection. Uncontrolled transformer-type, uncontrolled temperature pencil-type soldering tools, or ungrounded soldering irons shall not be used on PCB’s.

2.10.5.2 Portable Solder Pots:

After 30 uses the material is discharged and new added. The solder pot shall also be tested to make sure it is capable of maintaining the pre-selected temperature ±9° F. Results recorded in the Soldering Pot Log # F763

1. Solder Pot identification number.2. Date the usages

Portable Solder Pots used for tinning non-gold component leads and/or wires, gold component leads or used to clean-off enamel/varnish insulation from magnet wires or for any other use shall, for contamination control, be emptied after 30 usages.

Solder pots shall be grounded and meet the ESD requirements of this document.

2.10.5.2.1 Identifying Soldering Irons and Portable Solder Pots: Soldering irons and portable solder pots shall be identified on the equipment

2.10.6 Holding Devices

Holding devices, materials or techniques used to retain parts and components shall not contaminate damage or degrade printed boards or components.

2.11 Materials

Materials used in the soldering processes described in this specification shall be as specified here in.

All materials with expiration dates are checked monthly and removed from stock when expired, expired material will be recorded on expiration log Form# F802 and disposed of properly. Operators are responsible for verifying materials used in manufacturing process are still with in shelf life, any expired material will be given to plant maintenance for proper disposal.



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Materials for use shall be called out on process router Form# F776B. Materials for use including solder type, flux type, and cleaning chemistries shall only be present on work station when product is being assembled. ROHS jobs requiring ROHS solder shall be segregated by ROHS workstations. ROHS works stations will have green ESD table mats and only ROHS materials and tools shall be allowed on the work station.

2.11.1 Solder

Solder tin/lead composition Sn63 (soft solders) solder form optional, which provide the required electrical and mechanical requirements, conforming to J-STD-006 shall be used unless specified differently. High temperature (Hard Solder) tin/lead solder conforming to J-STD-006 may be used when specified on the approved engineering assembly drawing. Solder shall be checked by receiving inspection for required shelf life.

2.11.2 Flux Type

Flux must meet the requirements of IPC J-STD-004. Flux will be chosen with consideration of its composition, activity and halide content to prevent corrosion and contamination. Flux form is optional and dependent upon solder form. Type H or M fluxes shall not be used for tinning of stranded wires. Flux shall be checked by the receiving inspection for required shelf life.

Flux type to be called out on Router. Alpha Flux 373 shall be used for CCA cleaning processes and Alpha Flux 800 (Type ROL0) shall be used for no-cleaning process.

2.11.3 Adhesives

All electrically nonconductive adhesive materials used for attachment of components not specified by customer, must meet the requirements of IPC-SM-817. The adhesives shall not be detrimental to the component or assembly they are used on. The material shall be cured.

All adhesives and bonding material shall be stored to manufacturer’s recommendation.

2.11.4 Mishandled Material

Any Material that has been mishandled shall have a reject tag written and giving to manufacture engineer to disposition.

2.12 Procedures and Requirements

Soldering, conformal coating, surface mounting, cleaning, and repair shall be in accordance with the procedures described in the applicable section of this document.Wires shall not be birdcaged or separated; there shall be no icicles, solder lumps, bumps, protrusions, etc. There shall be no pinholes allowed. Wire leads not discernible in the solder will be rejected. A wrap around joint less than 180 deg., regardless of solder coverage will be rejected. These approved pads also improve



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circuit card assembly cleaning of flux residue after the part is soldered.

2.12.1 Gold Edge Contacts: Gold Removal

Boards with gold edge contacts shall have the conformal coating extend up on the edge of the contact, covering the line of demarcation. (Reference Figure 4) Gold shall be removed from the surface to be soldered when the thickness of Gold exceeds (.0001in.) A double tinning process or dynamic solder wave may be used for gold removal. These requirements may be eliminated if there is documented evidence available for review that there are no gold related solder embrittlement problems associated with the soldering process being used. Use the manufacturer process specifications.

2.12.2 Gold on Through-hole Component leads

Gold shall be removed from at least 95% of the surfaces to be soldered of the through-hole component leads with 2.5 µm [0.0984 mil] or more of gold thickness. On those contacts where the deposited gold is found to be greater than 2.5 µm [0.0984 mil] on areas that are to be soldered the gold shall be removed by tinning the area that will be involved in the soldered area and removing the gold/solder mixture to eliminate the risk of gold embrittlement. This may be accomplished by using a solder pot to dip the area to be tinned or by hand soldering the area and removing the solder by using solder braid, de-soldering vacuum device, solder pump or equivalent.

2.12.3 Gold on All Surfaces to be Soldered

Gold shall be removed from 95% of all surfaces to be soldered of surface mount components regardless of gold thickness. This may be accomplished by using a solder pot to dip the area to be tinned or by hand soldering the area and removing the solder by using solder braid, de-soldering vacuum device, solder pump or equivalent.

2.12.4 Gold on Surface of Solder Terminals

Gold shall be removed from the surfaces to be soldered of solder terminals plated with 2.5 µm [0.0984 mil] or more of gold thickness. On those areas where the deposited gold is found to be greater than 2.5 µm [0.0984 mil] on areas that are to be soldered the gold shall be removed by tinning the area that will be involved in the soldered area and removing the gold/solder mixture to eliminate the risk of gold embrittlement. This may be accomplished by using a solder pot to dip the area to be tinned or by hand soldering the area and removing the solder by using solder braid, de-soldering vacuum device, solder pump or equivalent.

2.12.5 Printed Wiring Board Oxidation

The black line (oxidation) at the side and/or top edge of the trace is acceptable if following conditions are met:

• It does not result in reduction of the trace’s width by more than 20% of the minimum conductor width Date Rev. Page9/24/2015 M 20 of 217


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specified on the master drawing.• The black lines (oxidation) are covered with solder mask or conformal coating. (This requirement is not

applicable at Receiving Inspection.)

The black lines (oxidation) between the traces and gold are acceptable if:• They do not exceed 0.050 inch in length. This measurement shall be taken from the center point of

the gold finger to the center point of the trace.• The black lines (oxidation) are covered by solder mask or conformal coating. (This requirement is

not applicable at Receiving Inspection.)

2.13 Printed Wiring Board Damage

2.13.1 Printed Wiring Board

The base material of the Printed Wiring Board (PWB) shall not be cracked or crushed by component or board assembly fastening devices.

The base material of the PWB must be smooth and exhibit no evidence of chipping or delamination.

2.13.2 Delamination/Blistering

There shall be no evidence of blistering or separation between any of the layers of base material and/or between the base material and the metal circuitry.

2.14 Storage, Handling and Cleaning

2.14.1 Printed Wiring Boards Handling

Prior to assembly, printed wiring boards shall be stored, delivered, and kept in a container to preserve their level of cleanliness.

All unpopulated PWB made of fiberglass shall be stored in “Hot Box” on arrival to bake out moisture. PWB shall be keep there until use, all unused boards will be returned back into “Hot Box”.

If boards are received from kitting wrapped in paper bags or paper wrapping material, they shall not be re- wrapped in this material during assembly. Static shielding bags shall be used on all PWB's. Prior to installing components on PWB’s, clean the board, as needed, to remove any surface contamination from prior handling. See area supervisor for instructions. During the assembly process, printed wiring boards shall be, whenever possible, handled by their edges to avoid contamination of solderable connections. Never stack boards one on top of the other without protection in between to prevent damage. Preferred method is to have a vertical or horizontal rack to slide boards in and out of. Racks shall be made of static dissipative material for ESD protection as well.

Parts shall be handled in a manner to preclude damage to terminations and to avoid the need for subsequent Date Rev. Page9/24/2015 M 21 of 217


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lead straightening operations. Once parts are mounted on printed boards, the unsoldered assembly shall be handled, transported and processed in a manner to preclude movement that would detrimentally affect formation of acceptable solder connections. When parts are mounted in solder paste, the unsoldered assembly should be processed so that the part does not move within the solder paste such that the final soldered connection results in a part misalignment. After soldering operations have been performed, the assembly shall be sufficiently cooled so that solder is solidified prior to further handling.

2.14.2 Microsections and Quality Coupons

All microsections and quality coupons are to be stored in document storage area. Microsections and quality coupons are to be retained for five (5) years.

2.14.3 Dropped CCA and PBA Procedure

In the event a circuit card assembly is dropped, a reject tag shall be written and given to the manufacturer engineer to write a disposition.

If a CCA is dropped more than 4 feet the following shall be checked that all edges of the CCA are not damaged, no damage to components, no dents or dings, and no mechanical damage.

2.15 Lead Forming

When forming bends, exercise extreme care to prevent damage to the component's leads and body. Exposed base material on component leads shall be pre-tinned when applicable. While forming, welded leads should be firmly held by a suitable means. While forming by hand or by machine the component markings should be visible and legible. Best practice is having the markings visible but if the markings are not it does not affect the function of the part.

All lead forming to be performed to J-STD-001, Part and component leads should be preformed to the final configuration excluding the final clinch or retention bend before assembly or installation. The lead forming process shall not damage leads seals, welds, or connections internal to components.

Leads shall extend at least one lead diameter or thickness but not less than 0.031 inches from the body before the start of the bend radius.

Once a components leads are formed it shall be checked and verified that the bend is correct, and no damage of the component has occurred.

The lead bend radius shall be in accordance with the table below.



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2.15.1 Welded Leads

The end of the welded lead is considered the end of the component body (Reference Figure 8). Hermetically sealed components must be handled with caution to prevent damage to the seal. To prevent damage, the leads shall not be bent less than .060 inches from the seal (Reference Figure 36).

While forming, welded leads should be held firmly by a suitable tool.

2.15.2 Meniscus

The end of the meniscus on a dual lead component (i.e. disk capacitor) is considered the end of the component body. (Reference Figure 9) Components with coated leads shall not have coating (meniscus) removed or damaged:

In such a way that the component substrate active electrical area is exposed Beyond where the lead enters the component body

Structural integrity shall not be compromised (Reference Figure 37).

2.16 Cleanliness

Cleanliness requirements and workmanship/inspection for PCB/CCA/Cable and Wire Harness and all soldered connections are contained in IPC/EIA J-STD-001/CLASS 3, IPC-HDBK-001 and IPC-A-610 Class 3 and IPC-A-620 Class 3



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The purpose of this section is to establish the processes and requirements for cleaning soldered joints, printed circuit boards (PCBs) or printed wiring boards (PWBs) and Cable and Wire Harness. This process spec also defines the approved processes for cleaning circuit card assemblies (CCAs) that require further soldering at the assembly level.

2.16.1 Solutions

The following solutions shall be used as needed.

Solution Sarica StandardIsopropyl Alcohol 9516105g

Deionized Water No Part number

NOTE: To clean OA or WSF flux with Deionized water, at the workstation, the water shall need to be heated 140 to 160 degrees Fahrenheit. Check Manufacturers Data Information for each P/N.

Other cleaning solutions specifically designed for cleaning circuit card assemblies are acceptable to use, provided that the substitute cleaning solutions are:

• Proven to be compatible with the cleaning equipment in which they are to be used• Non-destructive to components and the circuit card substrate• Capable of cleaning to an ionic contamination level better than 10 micrograms per square inch.

Substitutions are to be approved by the Engineer for the department. Special cleaning processes that deviate from this spec should be placed on routers for the part numbers to which they apply or on departmental process instructions.

2.16.1.1 Ultrasonic Cleaning: Ultrasonic cleaning on electronic assemblies with electrical components shall not be performed unless approved in writing by customer.

2.16.2 Equipment

The following equipment, or equivalent based on engineering approval, may be used for cleaning CCAs and/or any component to be used on CCAs. For Cable and Harness the router will describe the proper sequence of machine processing for each part. Proper cleaning of CCAs set up and operation are described in section 2.16.3

2.16.2.1 Aquastorm Cleaning Systems:

• Inline Aqueous cleaner



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2.16.2.2 Cleanliness Testing Equipment

SCS Ionograph Model 500MLP

2.16.2.3 Other Equipment

Baskets may be used to contain circuit cards that may otherwise be damaged by the cleaning equipment or are too small to be contained by the cleaning equipment’s conveyor system. Baskets must be constructed of open mesh and may not impede the force of the machines’ spray on the circuit cards being cleaned. Circuit cards must be placed flat in the basket and may not be stacked on top of each other.

2.16.3 Cleaning Procedures

Flux must be removed from printed wiring boards as soon as possible after each soldering process within 1 hour of soldering. All items to be cleaned shall be cleaned in a manner that will prevent thermal shock and or detrimental intrusion of cleaning media into components that are not totally sealed.

Cleaning may be accomplished by one of the following methods:• Hand Cleaning• Aquastorm Inline Machine Cleaning

2.16.3.1 Hand Cleaning:

When printed wiring boards are hand-soldered, they may be cleaned by hand if machine cleaning cannot be performed within 1 hour of soldering or if they contain components on the board that cannot be machine cleaned. Any of the cleaning agents listed in this section or any other cleaning agent designed specifically for cleaning printed circuits and meeting all requirements of this section may be used. When hand cleaning printed wiring boards both sides of the board are to be cleaned, so all flux residue is removed.

Hand Soldered connections other than PCB/CCA shall be cleaned using the appropriate solvent or recommended by the vendor of the flux and approved by Engineering and following the instructions for use.

Only natural bristle brushes may be used for applying cleaning agent to the printed wiring board and scrubbing. The brush must be soaked in the cleaning solution before scrubbing the printed wiring board.

All Cable and Wire Harnesses are cleaned according to procedures by hand with a soft brush and or a wet rag as needed. Assemblies shall be free of dirt, lint, solder splash, wire clippings etc. This method of cleaning prevents contamination and damage of the assemblies and readiness for the next process step. If components are incompatible with this cleaning method they will be protected during cleaning.



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When needed/required, cleaning for crimped connections shall be done per the hand cleaning process. If nonpermanent markings are on the assemblies they should also be removed.

2.16.3.2 Setting up the Machine-Controlled Cleaning Processes:

Aquastorm cleaning processes are machine-controlled processes requiring minimal operator intervention when correctly set up. These processes should be set up in accordance with the manufacturer’s instruction manual. Pre-set parameters are set by manufacturer engineer which are proven to produce cleaning quality under 10 micrograms per square inch meeting J-STD-001 requirements.

Settings: Settings are pre-programed by manufacturer engineers to get optimal cleaning. Settings changes are restricted to manufacture engineers and require engineering username, and password to change.

Operation:Place CCA’s into baskets, boards shall not overhang each other.Load baskets on conveyor machine will turn on automatically to preset program.Remove CCA’s from basket move to bake out oven.

2.16.3.3 Aquastorm Machine Cleaning:

The water quality in the in-line aqueous cleaning processes is critical to the success of the operation. The Operator shall be trained in proper operation of the Aquastorm cleaning process.

2.16.3.4 Maintenance

All maintenance will be done to manufactures recommendations and recorded on preventative maintenance log.

IMPORTANT: No production parts shall be processed before the equipment operating parameters are checked by operator. Each output variable shall be verified to be within the proper operating range.

2.17 Safety

Comply with the applicable safety standards.

2.18 Assembly Criteria

If an Ionograph or equivalent equipment is used to check contamination levels after cleaning a CCA or PCB prior to conformal coating, the following instructions shall apply.



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This specific instruction describes the daily routine required to make the Ionograph ready for production. The following steps are to be followed by all operators prior to use of this equipment. This instruction and testing procedure are valid for the Aquastorm machine.

2.19 Acceptance Criteria Cable/Wire Harness

Assemblies produced in accordance with IPC-A-620 shall be free of all extraneous matter (wire clippings, insulation slugs, strands of shielding braid) or any other item not required to be present.

2.19.1 Acceptance Criteria CCA

Inspection personnel shall verify the acceptability for each of the printed circuit boards processed by inspecting to the established inspection plan for the part or process. The inspector ensures the product satisfies the cleanliness levels. If the Ionograph method is used, the Ionograph report will be supplied to the inspector if requested.

2.19.2 Metrology

Engineering and plant maintenance personnel shall be responsible for calibration and maintenance, for all equipment requiring calibration and maintenance in the cleaning process.

2.19.3 Acceptance Criteria

2.19.3.1 Acceptance Testing for Parts – Hand or Machine Cleaned

A sample of one circuit card assembly shall be tested for cleanliness after the final cleaning prior to conformal coating. Tested circuit card assemblies (and their associated production orders) will be accepted only if they pass the 10 Microgram per square inch limit set on the test equipment. Frequency of cleanliness test shall occur once per production shift.• If the tested assembly passes, it shall be re-cleaned, and the entire production order

may be accepted for further processing.• If the tested assembly fails, the entire production order shall be run through the cleaning

process again, and a second (different) sample shall be tested for cleanliness.

NOTE: If an assembly is too large to fit into the Ionograph, or if for any reason the Ionograph test is detrimental to the assembly (such as for painted assemblies in which the 75% alcohol solution damages the finish), the Ionograph test may be omitted. Ionograph readings of other assemblies run through the same machine cleaning process that day, and a physical inspection of the units bypassing the Ionograph test shall serve as proof of cleanliness.

NOTE: Printouts from the Ionograph are stapled to the work ticket or stored online under company network and shall be retained for a minimum of two years in the part file as proof of process. At



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the end of the second year retention period, the Engineer for the department may destroy.

2.19.3.2 Acceptance Testing for Parts that are Hand Cleaned with No Ionograph

Parts that are hand cleaned will not have any special acceptance criteria detailed on the router. Since hand cleaning done at the assembly level it has no contamination test, verification of cleanliness may be done visually by the operator beforehand coating.

2.19.3.3 Acceptable Contamination

It is preferred to have the assemblies free of flux residue, dust, dirt, lint, oil, grease, corrosion or corrosive products, fingerprints, or other materials unrelated to the assembly design; however, slight traces of these items may still be present. These traces are not cause for rejection as long as the contaminants do not exceed acceptable limits as defined in this process specification. In the event that contamination still exists which exceeds acceptable limits, the assembly shall be subject to a complete re-clean procedure.

2.19.3.4 Dryness

All boards cleaned shall be baked in recirculating air oven at 120 degrees Fahrenheit (+/- 10 degrees Fahrenheit) for a period of 12 hours before testing or shipment of product.

2.20 Packaging

Sarica packages per customer’s drawings and/or requirements. When not called out, orders are to be packaged the best possible way (bubble bag, plastic bag or in boxes, etc.). All orders will be labeled with part number on packaging or placed in a box with purchase order.

2.21 Ionograph

Ionograph testing shall be done once a shift at a minimum, each CCA assembly shall have an assigned profile with the surface area of the assembly and fail point set to 10 Microgram per square inch. For proper operation of the Ionograph refer to the manufactures instruction manual.

2.21.1 Operation of Ionograph:

The Ionograph shall be operated only by individuals that have been properly trained and are fully confident operation of the equipment. Failure to abide by the manufacturer’s instruction manual may result in extensive damage to the equipment.



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Each CCA will have its own profile with the dimensions of the CCA stored on the hard drive of the computer attached to the Ionograph.

To operate the Ionograph the operator must first check the percent of IPA solution in the tank of the Ionograph from the on screen instructions using a hydrometer. The operator will then perform a chemical calibration on the unit to ensure it is in full operation using 2 ml of standardizing solution #3 dispensed from a pipette this must be performed daily to ensure proper operation of the unit. Once the above items have been performed the operator is to load the appropriate file. The program name will be the same as the board number. Once the program has been loaded the operator must follow onscreen instructions and wait for the baseline to stabilize and the temperature of the solution to be at the appropriate levels. Once the baseline and temperature are in range it is acceptable to begin the test. Operator will then load the CCA into the solution with a clean wire to the bottom of the tank and then click the ok button the start the test.

2.22 Moisture Sensitive Components:

Receiving of MSD Components:

All moisture sensitive components received in shall not be opened until ready for use. All moisture sensitive level components shall be stored in drying cabinet in SMT area.

Any moisture sensitive devices once opened or shelf life in sealed bag exceeded must be stored inside the dry cabinet for applicable time stated in IPC J-STD-033C table 4-1 before use. All moisture sensitive devices are to be stored in original packing and sealed until use is needed.



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Opening and Mounting Moisture Sensitive Devices:

All MSD shall remain sealed inside MBB bag until use. Once a MBB has been opened it shall have the date and time recorded of opening on the reel or packaging. All components must be mounted within hours stated on MSID label or stored in dry cabinet after used. Once components have exceeded time of to be mounted within on MSID label card they all must be re-baked in drying cabinet for time stated in IPC J-STD-033C table 4-1 before use. After re-bake of parts time and date must be recorded on the reel and packaging before use.

Note: If any parts received in that are moisture sensitive and do not have a MSID they shall be brought to manufacturer engineer and the data sheet for parts shall be pulled to identify correct level of moisture sensitivity. The moisture sensitive level will be recorded on the bag or label with initials of manufacturer engineer and appropriate bake out times will occur.

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Any item found to have nonconformance shall have a reject tag written and dispositioned by engineering.

2.24 Maintenance

The importance of general maintenance and calibration cannot be over emphasized, as this can easily and efficiently be performed during or after each use or when deemed necessary, ensuring satisfactory performance and continuous production. Semi-Automatic and Fully Automatic equipment shall be on a Preventative Maintenance schedule controlled by the Maintenance Department.

All in process equipment including tooling, fixtures, soldering equipment and tools, stencils, spray nozzles, automated flux dispensers/nozzles, and ESD workstations shall be cleaned after use.

2.25 First Piece Inspection/ Initial Product Inspection

First piece inspection or initial product inspection will be completed by quality control inspectors or manufacture engineers. First piece inspection shall be inspected for solderability, solder defects, FOD, part presents, part polarity.

Sarica uses the following length tolerances unless otherwise directed by customer drawing or documentation:

Strip length +/- 0.030”0” to 2” +/- 0.125”2” to 12” +/- 0.250”12” to 36” +/- 0.500”36” to 48” +/- 1.000”48” and above +/- 2%



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SECTION 3: HAND SOLDERING

Hand soldering requirements and workmanship/ inspection criterion is contained in the Class 3 requirements of IPC/EIA J-STD-001/CLASS 3, IPC-HDBK-001 with AMENDMENT 1/CLASS 3, IPC-A-610/CLASS 3 and IPC-A-620

FORMS

Form Name Form # Form DescriptionSolder Equipment Test Log F-777 &

F-778Record temperature of the solder pot. Retain for two (2) years then dispose.

Portable Solder Pot Usage Log

F-777 &F-778

This process form is to track the amount of use the solder pot has and limits the use to a maximum of30 usages. Retain for two (2) years then dispose.

3.0 General:

Through-Hole TerminationsAxial leaded components, when mounted horizontal to board surface, should be approximately centered between the mounting holes. The entire length of the component body should be in contact with the board surface. The maximum space between the component body and board shall not exceed 0.028 inches, unless specified by customer drawing. Components that are required to be mounted off the board shall be elevated at least 0.059 inches, unless specified by customer drawing. Components mounted in unsupported holes and required to be elevated shall be provided with lead forms at the board surface, or other mechanical support.

Axial leaded components mounted vertically in unsupported holes shall be mounted with lead forms or other mechanical support.

Axial lead components mounted vertically in supported holes shall have component height and clearance (from the board to body or weld bead) requirements in accordance with the user determined dimension and shall not impact form, fit or function.

3.1 Cleanliness of Soldering Work Areas

Prior to use, work areas, tools, work benches and equipment shall be visually inspected by the operators to ensure that they are in good working condition and free from dirt, grease, oil, solder spatter, wire insulation cuttings, or other foreign material on the working surfaces. Tools needing repair or replacement shall be reported to the area supervisor.

To facilitate frequent and thorough cleaning, the work area, furniture, and fixtures should be arranged such that the floors, corners, aisles, and workbenches are accessible and uncluttered.



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Eating, drinking, grooming and smoking at the workstation shall not be permitted, and precautions shall be taken to preclude contamination of products at the workstation. Use only hand lotions approved by Engineering.

3.2 Lead Trimming:

Pre-established Lead Length:Components (i.e. Dips, Sips, Relays, Sockets, Connectors, etc.) having a pre-established lead length, that may be damaged internally by lead cutting, do not require lead trimming per IPC-A-610 unless otherwise specified on the approved engineering drawing.

NOTE: All tempered leads shall not be trimmed unless specified on the approved engineering drawing.

Lead Trimming after soldering:When lead cutting is performed after soldering, the solder terminations shall either be reflowed or visually inspected at 10X to ensure that the original solder connection has not been damaged (e.g., fractured) or deformed. Lead trimming after soldering that cuts into solder fillets shall be reflowed. If solder connections is reflowed this is considered part of the soldering process and not rework. This requirement does not apply to components that are designed such that a portion of the lead is intended to be removed after soldering (e.g., break-away tie bars).

3.3 Pre-tinning/Tinning

Tinning is the application of molten solder to a base metal in order to increase its solderability and assure that the wire/lead be soldered has a uniform and readily solderable surface. At the time of soldering, component leads not meeting the solderability requirements shall be reworked by tinning or other suitable methods prior to soldering. All portions of stranded wires that contact the area to be in the solder connection shall be tinned. (Reference Figure 49) Wires that are tinned will not be crimped unless otherwise specified .Wires are tinned when they will be formed into splices. Tinned wires should be visually inspected and cleaned by appropriate cleaning methods if necessary before moving on to the next procedure. Stranded wires shall be tinned when wires will be formed for attachment to solder terminals.

The assembler shall not allow the solder to flow into areas of the wire that must remain flexible. The solder shall penetrate to the inner strands of the wire and shall exhibit acceptable wetting over the entire tinned portion of the wire. To permit inspection for nicks or cuts at the point of insulation termination, solder and wicking shall not conceal the individual outer wire strands, although individual inner strands may be obscured. Due to various types of solder used the type required will be listed on part router. Flux must meet the requirements of IPC J-STD-004. Flux will be chosen with consideration of its composition, activity and halide content to prevent corrosion and contamination. Flux form is optional and dependent upon solder form. Type H or M fluxes shall not be used for tinning of stranded wires. Flux shall be checked by the receiving inspection for required shelf life. Solder pots used for tinning, the temperature of the solder will be recorded by the operator on the solder pot log # F-777 or F-778 once in an 8 hour shift using the Fluke #561 infrared thermometer or equivalent.



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3.4 Soldering Iron Tip Cleaning

3.4.1 Surface-Treated Tips

Clean with emery cloth or aluminum oxide cloth while the tip is cold, until the surface is bright. Files shall not be used. Re-tin with rosin core solder by holding solder on the surface, and, as it begins to melt, rubbing it back and forth. Always maintain solder on the tip of a heated solder iron sitting idle.

3.4.2 Copper Tips

Clean copper tips when they are cold by filing them to a smooth surface. Remove as little copper as possible.Do not file beyond 1/2 the original length. Tin by holding solder on the surface as the tip is heated. When the solder will just melt, rub the surface to be tinned with rosin core solder until the solder adheres. Wipe off the excess solder on the wiping pad.

3.4.2.1 Avoiding Contamination while Processing and Cleaning: Solder alloy is job pacific and solder rolls are clearly labeled and the alloy is specified on drawings to prevent any contamination. Any filing or abrading of tips shall be done far enough away from work area to prevent contamination of any parts or equipment.

3.5 Hand Soldering

3.5.1 Applying Solder

The solder shall be applied to the joint, not to the soldering iron. To improve heat transfer, a very small quantity of solder shall be applied where the iron’s tip touches the joint (Reference Figure 50). After heat transfer is made, move solder to the side opposite the tip, apply the correct amount of solder, then remove the tip and solder simultaneously. Solder shall only be applied to one side of the PTH except for intrusive soldering. Heat may be simultaneously applied to both sides of the PTH.

3.5.2 Applying Heat

Prior to soldering the connection, wipe the tip on a clean, wet, cellulose or equivalent sponge. The areas to be joined shall be heated to the pre-selected temperature, for a period not to exceed approximately 5 seconds. Excessive time (slow heating) and excessive temperature shall be avoided to prevent unreliable solder joints and damaged parts. The time limit begins when the solder flows. Place the tip against the pad and lead with maximum contact to achieve rapid transfer of heat.

3.5.3 Cooling

Liquid, of any kind, shall not be used to cool a soldered connection. Heat sinks may be used to expedite cooling. The connection shall not be subjected to movement or stress at any time during the cooling and solidification of the solder.



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3.5.4 Post Soldering Cleaning

Flux residue shall be removed as soon as possible, but no later than one hours after soldering. Some fluxes may require more immediate action to facilitate adequate removal. The cleaning solvents, solutions, and methods used shall have no harmful effect on the parts, connections, and materials being cleaned. If fluxes are not cleaned per above instructions, the flux will polymerize and may not be detected during the Ionograph Cleaning Test.

3.5.5 Re-soldering

Specific areas of soldered boards found to be unacceptable and approved for rework may be reworked manually to conform to the requirements of this specification. The assembly should be cooled to room temperature prior to any re-solder operation.

Care should be taken to avoid the need for re-soldering. When re-soldering is required, quality standards for the re-soldered connections shall be the same as for the original connection. Slight discoloration due to rework is acceptable. To prevent inter-metallic growth when rework or repair is necessary and required, the largest portion of solder on a connection should be removed by a de-soldering method and then re-soldered using new solder.

3.5.6 Thermal Protection

Any component identified as heat sensitive, protective measures shall be deployed to minimize component heating and prevent thermal shock. Protection may include an additional heating process. All components classified as heat sensitive will be called out on process router.

Note: If it is not possible to implement an effective heat sink, the component shall be preheated. Multilayer ceramic chip capacitors (MLCCs) and “stacked” capacitors containing these parts shall be handled as thermal stock sensitive. Heat up and cool down rates shall be controlled within the manufacturer’s recommendation.

3.6 Insulation Stripping

Insulation shall be cleanly removed from conductors by one of the following methods (care shall be taken to avoid wire or insulation damage). Slight discoloration due to thermal or chemical stripping and/or minor depressions up to but not exceeding 20% of the insulation’s thickness with no bare wire (conductor) exposed caused by mechanical strippers shall not be cause for rejection .When wire insulation clearance for soldered termination is greater than 2 wire diameters or 1.5 mm, which is greater but does not permit shorting to adjacent conductors, the assembly is rejected.

• Mechanical: May be of the hand-operated or automatic high-volume machine type. Hand-operated strippers shall be of the fixed die configuration (Reference Figure 28). Automatic high-volume machine strippers shall be of a type using either fixed dies, dies adjustable to calibrated stops, or roller cutters



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adjustable to calibrated stops.• Chemical: Chemical solution, pastes, and creams used to strip hookup and magnet wires are

suitable for removing insulation (enamel, varnish, polyvinyl, etc.) and shall be limited to those that meet both of the following criteria:

• Cause no degradation of the base metal of the wire• Allow wires or conductors to be neutralized and cleaned of both ionic and non-ionic

contaminants

They shall be used in accordance with the recommendation of the stripping agent’s manufacturer.

• Solder: Polyurethane or similar heat strippable coating may be removed by dipping the insulated wire to the required depth into a pot containing the appropriate solder alloy at the temperature recommended by the manufacturer. (Care must be taken to control dip-time and temperature to prevent damage to the insulation.) The dipping action shall have the dual effect of removing the insulation coating and tinning the wire. The pot’s concentration of impurities shall be controlled by monthly testing according to Wave Solder section of this document. (Reference Figure 30)

3.6.1 Solid Wire and Stranded Wire Condition

Care shall be taken to avoid damaging wires or insulation. Broken, scraped, stretched, severed, or damaged strands in a single termination shall not be acceptable, nor shall the strands be birdcaged. Smooth indentations (e.g. tooling marks) are acceptable up to 10 percent. Nicks, cuts, scrapes, stretching, or other observable damage that exceeds 10 percent of the original cross-sectional area of solid wires or leads shall be unacceptable.

Exposed base material along the length of any stranded or solid wire or lead is unacceptable and shall be corrected if:

• Stranded wire: if correction is acceptable • Solid wire: if exposed base material does not exceed 10% of the wire’s original diameter

To correct the exposed base material, dip the wire into a solder pot.

Partial or incomplete cuts of strand groups shall not be present in contact crimp or solder connection areas.

When stripping wire, a slug of insulation should be left on the end of the wire (Ref. Figure 32). Grasp the slug of insulation with your fingers on the right hand, and with a simultaneous rotary twisting away from your body and a linear pull, extract the insulation slug from the conductor (Ref. Figures 31 and 33).

3.7 Mechanical Assembly

The following sections shall be used if the drawing does not specify the hardware stack-up.



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3.8 Inspection

Visual inspection should be performed to verify the following conditions:

• Correct parts and hardware• Part Presence • Correct sequence of assembly• Correct security and tightness of parts and hardware• Freedom from damage• Correct orientation and polarity of parts and hardware

3.9 Fasteners

3.9.1 Secured by Clips, Clamps, or Brackets

The following basic requirements shall be adhered to when component parts are mechanically secure by clips, clamps, or brackets: (Reference Figure 11)

• All clips, clamps, or brackets shall be secured to prevent rotation; appropriate devices include two fasteners, one fastener and a non-turn device, etc. Holders designed for single-hole mounting shall withstand a 14 inch-ounce torque without rotating.

• Clamps and brackets that require removal to replace the component shall be secured with a threaded fastener or other non-permanent fastener, unless the subassembly in which the component is mounted is considered disposable and non-repairable.

• Spring-type clips that do not require removal to replace the component may be secured with permanent type fasteners such as rivets or eyelets.

• Spring type clips shall require a positive displacement to remove the component.• The use of twist-type lugs, tabs, ears, and cable lacing shall be avoided.

3.10 Procedure to Solder Flared Terminal to Circuit Foil (Pad)

Step 1: Select a conical soldering tip, and allow the soldering iron to reach maximum temperature.

Step 2: Ensure that the terminal is mechanically tight in the hole and the barrel is flared (not rolled) on the circuit pad side.

Step 3: Place the soldering tip in the barrel (flared end) of the terminal, and allow the terminal and pad to become hot enough to readily melt rosin core solder (5 seconds max. to complete).

Step 4: Apply solder at the junction of the flared flange and printed circuit pad.

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the pad, forming a smooth fillet at the junction of the pad and terminal barrel.

Additional heat may be necessary on larger printed circuit pads. When necessary, apply additional heat with a quick wiping motion of the soldering tip so that the terminal is not disturbed or pad lifted from the base material.

Step 5: Allow solder to solidify before handling or soldering other connections.

Step 6: Remove all contaminates with approved solvent (i.e. alcohol or deionized water) and a natural bristled brush. Thoroughly dry the connection.

Step 7: Inspect per J-Std-001/Class 3.

NOTE: Due to the nature of the product and where it is located on an aircraft, qualification of product with flared terminals was completed with the flared terminals soldered. All flared terminals attached to circuitry shall be soldered on either the solder source side or the component side to guarantee that the flared terminal will be a continuous electrical connection. Flared terminals shall only be used when attached to circuitry unless otherwise directed by print.

3.11 Eyelets

3.11.1 Rolled Eyelet

The eyelet form should be a smooth rollover touching the surface. Splits are permissible providing they do not enter into the barrel or body. Strain or stress marks caused by the rollover should be kept to a minimum. A maximum of 3 splits is permissible.

NOTE: Due to the nature of the product and where it is located on an aircraft, qualification of product with rolled terminals on circuitry was completed with the rolled terminals soldered. All rolled terminals attached to circuitry shall be soldered on either the solder source side or the component side to guarantee that the rolled terminal will be a continuous electrical connection. When a rolled terminal is placed in a board location with no circuitry the roll shall be secure enough not to allow the terminal to turn.



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3.11.2 Funnel Flange: Funnel Set Eyelet

• Form should be upset in a uniform spread and be concentric to the hole.• Splits are permissible providing they do not enter into the barrel or body diameter. A maximum of 3 splits

is permissible (Reference Figures 14 and 15).

3.11.3 Funnel Flange: Elliptical Eyelet

• The elliptical funnel should be flared smoothly with the funnel concentric to the barrel.• The eyelet should be seated snugly with no vertical movement.• The flared funnel, measured across its widest diameter, measures 25% larger than the hole size (Reference

Figures 16, 17 and 18).

3.11.4 Acceptance Criteria of Soldered Connections

The acceptable solder connection indicates evidence of wetting and adherence when the solder blends to the soldered surface, forming a contact angle of 90deg. or less, except when the quantity of solder results in a contour which is limited by the edge of the attached surfaces. Solder inspection may require magnification to inspect solder. Solder wicking is allowed if the wire to remains flexible in required areas.

3.12 Wire Attachment

No terminal shall have more leads or wires attached to it than the number that can be placed adjacent to the surface of the terminal without overlap or that exceeds the height or shoulder of the terminal. Each terminal listed in this document has a maximum wire fill dependent on A.W.G. No terminal shall be over filled.

Before soldering is performed, component leads and wires shall be sufficiently mechanically secured to their terminals to prevent motion between the parts of a joint during the soldering operation. The wire shall be close to the terminal surface and/or post for the full curvature of the wrap. (Reference Figure 19)

The solder must not obscure the contour of the wire strands. When soldering the second section on double- ended terminals, care should be taken to ensure that the joint on the first section is not compromised.

Fillets between the wire and the terminal shall be concave and smooth for the entire wrapped length of wire. (Reference Figure 19)

Fillets shall feather to a thin edge on the wire and terminal to indicate proper wetting and flowing action. (Reference Figure 19) Wires shall not be birdcaged or separated, there shall be no icicles, solder lumps, bumps, protrusions, etc. There shall be no pinholes allowed.

Solder wicking along a stranded wire is permissible provided:



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• The general contour of the conductor within the solder is not obscured• The outer diameter of the insulation is not enlarged or damaged• The wicking does not restrict the flexing or movement of the wire • The degree of wicking does not extend beyond the beginning of the insulation by more than ¼ inch

(Reference Figure 20)

The solder joint area must be free from flux residue. No evidence that flux has wicked up the wire under the insulation shall be present.

Solder joint and adjacent area shall be free of:

• Evidence of charring, burning, or other heat damage• Splattering of flux or solder on adjacent connections or parts• Loose parts resulting from excessive heat

3.13 Turret Terminals

When a number of different types of components are mounted on a turret terminal, the most heat sensitive component should be placed on the top. The sequence of installation from the top to the bottom should be as follows:

1. Semiconductors and diodes2. Resistors3. Relays4. Capacitors (Reference Figure 23-B)5. Coils6. Hookup wires7. Jumpers

3.13.1 Lead and Wire Placement on Double-ended Terminals

The component lead should be attached to the terminal on one side of the board, and the bus and jumper wire should be placed on the same side. Hookup wires should only be connected to the terminal opposite the component's side of the board (Reference Figure 23-A).

3.14 Bifurcated Terminals

Side-route wires entering bifurcated terminals shall be

• Dressed through the slot• In positive contact with two corners of the post as a minimum (four corners if a maximum full wrap)



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• Terminated within a 90° bend of a full wrap as a minimum and with no overlap as a maximum(Reference Figure 21)

3.15 Hook, Eyelet, Perforated or Pierced Terminals

The bend of wires and leads attached to hook, eyelet, perforated, or pierced terminals shall be between 180° and a full wrap with no overlap (maximum) (Reference Figure 21). No more than 3 wires shall be attached to any of the aforementioned terminals. Perforated terminals to which wire sizes 16 A.W.G. and larger will be attached may be connected in a straight-through manner. Additional mechanical retention may be required to prevent movement during soldering.

3.15.1 Solder Cup Terminals

Solder cups terminals have the wires inserted straight in to them and must contact the back wall or other inserted wires for the full depth of the cup. Build to the IPC-620 (4.8.6)

3.16 Stress Relief/Routing

Conductors or component leads terminated at any terminal style solder connection shall have sufficient slack, in the form of a slight loop or gradual bend, to withstand the stresses they will encounter. When multiple conductors are routed from a common trunk cable to uniformly spaced terminals, these bends should be uniform in length to prevent stresses on any one conductor.

The bend in the wire shall serve to minimize tensile or shear forces at the soldered connection. The wire or lead shall wrap around the terminal in the same direction as the stress-relief bend (so that pulling the wire or lead would tend to wrap more, rather than unwrap, the terminal) (Reference Figure 24).

When conductors are routed from a harness cable or from a cable to a terminal, they shall have sufficient slack in the form of a slight bend for one service loop (Reference Figure 25).

3.17 Splicing

The splicing of wires shall not be allowed except for magnetic wires where applicable. Follow ApprovedEngineering drawing or customer requirements for wrap, tape method, solder or crimp per this document. Splices are not placed in bends, or where they may be exposed to tension, flexure, or other stresses. Only authorized splices shall be used in assemblies and only trained assemblers shall be permitted to splice assemblies. Splice records will be kept in part quality file.

3.17.1 Solder Splices

Stranded wires shall be tinned when being formed into splices except mesh splices and optional when heat shrink solder devices are used. Sleeving shall conform to the splice contour and have a snug fit over the wire splice area and wire insulation. Sleeving shall cover wire insulation on both ends of the spliced area by a minimum of one (1) diameter of the wire group. Tack solder is attaching all breakouts with sufficient solder



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flow. Shield overlap is from 1 to 3 times the diameter of the largest wire bundle. A solder fillet is present around the entire shield overlap area and the shield overlap is still flexible. For mesh splices wire strands shall be mashed together so that the strands interlace evenly and are equal length. Lap splices will have a minimum of three wire diameters of overlap and the solder shall wet all elements of the termination forming a visible solder joint.

3.17.2 Crimped Splices

When attaching multiple wires to a single terminal, each wire shall meet the same acceptability criteria as a single termination. When attaching single or multiple wires to a terminal, the combined circular mil area of the wires shall comply with the circular mil area range for the terminal. Sleeving, if required, is centered on the barrel splice and over laps wire insulation on both sides of the spliced area at not less than 1 wire bundle diameter.

3.17.3 Tie/Tape Splicing

Tape width overlap must be 50% or greater. Initial shield on legs must be secured. Shield mesh tape conforms to the bundle. Shield tape is secured on each leg. Tape ends must be secured.

3.18 Solder Wicking

Solder wicking during soldering of stranded wire is permissible, provided

• The general contour of the conductor within the solder is not obscured• The outer diameter of the insulation is not enlarged or damaged• The wicking does not restrict the flexing or movement of the wire• The wicking does not extend beyond the beginning of the insulation by more than 1/4 inch

Wicking should not hide the contour of the conductor, although individual inner strands may be obscured. (Reference Figure 20) Tensiling of the wire must not be mistakenly thought to be wicking of the wire. The difference must be addressed by removing the insulation to visually identify solder in the strands to be wicking. If there is no evidence of solder in the strands it is tensiling. Tensiling must be addressed by the Engineer for acceptability based on the necessary flexibility of the wire.

3.19 Solder in the Lead’s Bend Radius

As a result of normal wetting, solder may be present in components’ formed leads. This presence is permissible provided that: (Reference Figure 35)

• The topside bend radius is discernible• Solder climb (wetting) on the lead does not extend to within 1-lead diameter of the component’s body



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3.20 Anti-Wicking Tools

Anti-wicking tools shall be of a type marked with conductor gauge sizes and shall be used to prevent the conductor from heating to a temperature at which it would attract solder under the insulation (Reference Figure 6).

3.21 Cordwood Assembly

3.21.1 Printed Wiring Board

• There shall be no evidence of cracks or other defects in the printed wiring.• There shall be no evidence of charring or other heat damage to the printed wiring board. There shall be no

blisters or other surface defects.• There shall be no evidence of delamination or lifted circuitry.• After soldering, the printed wiring board shall not exhibit any warp in excess of 0.020 inch (Reference

Figure 39).

3.21.2 Module Assembly

When sleeving is used, it should be properly positioned to perform its intended task. (Reference Figure 40)

3.22 Clearance

Clearance between the end of the insulation and the solder of the connection shall be as follows:

• Minimum clearance: The insulation shall not be embedded in the solder joint. The contour of the conductor shall not be obscured at the termination end of the insulation. Clearance shall be visible.

• Maximum clearance: Clearance shall be less than twice the wire’s diameter (including insulation) or 0.060 inch, whichever is larger, but shall not permit shorting between adjacent conductors.

The ceramic coating on the component’s leads shall not extend into the component’s mounting hole. (Reference Figure 41)

Components shall be: (Reference Figure 42)• Approximately centered between the printed wiring boards• Have a minimum of 0.060 inch between the inside surface of the printed wiring board and the

component body• Be vertically aligned (± .032 inches)

The component leads shall extend a minimum of 0.030 inch beyond the opposite surface of the printed Date Rev. Page9/24/2015 M 43 of 217


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circuit board (Reference Figures 43 and 44).

3.23 Printed Wiring Board Contacts

Unless otherwise specified on the applicable engineering drawing, all electrolytically deposited gold shall be in accordance with Specification SAE AMS2422 or ASTM B488, Type II, Class I. The minimum thickness shall be 0.000050 inch (0.0013 mm) and a maximum 0.0984mil on areas that are to be soldered. On those contacts where the deposited gold is found to be greater than 0.0984mil on areas that are to be soldered the gold shall be removed by tinning the area that will be involved in the soldered area and removing the gold/solder mixture to eliminate the risk of gold embrittlement. This may be accomplished by using a solder pot to dip the area to be tinned or by hand soldering the area and removing the solder by using solder braid, desoldering vacuum device, solder pump or equivalent.

Surface defects that expose copper or nickel in the specified contact area, shall be cause for rejection.

3.24 Procedure for Resistance Soldering

NOTE: High temperature solder (commonly called hard solder) shall be used only when specified on the applicable engineering drawing.

Step 1: Check all external wires and plugs to make sure they are in good working condition.

Step 2: Plug the unit into a 110 VAC outlet.

Step 3: Check to make sure the carbon tip is inserted into the handle assembly with approximately ¾–1" remaining out.

Step 4: Check the heat selector switch for proper setting. Use the lowest temperature setting that allows the solder to flow and have good wetting without damaging parts.

Step 5: Clip the ground clamp onto the fixture or part.

Step 6: Turn the unit’s off/on switch to the on position.

Step 7: Hold the carbon tip to the area to be soldered.

Step 8: Apply solder to area to be soldered.

Step 9: After the solder has melted and wetted to the parts being soldered, remove the carbon tip from the soldered area.

Step 10: Turn the off/on switch to the off position.

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Step 12: Clean the soldered area and remove flux residue by using Isopropyl Alcohol.

3.24.1 Solder Ferrule Pins

View solder fillet through the inspection hole. Shield weave patter must be intact. A film of solder on the outside of the terminal that does not interfere with assembly is acceptable. The inspection hole is flush with the surface is acceptable. Pin tip must not show signs of melting. Use standard manufacture instructions to solder the pins.

3.24.2 Press Fit Coaxial Connectors

The completed press fit connector shall comply with the IPC-620 (13.7.2) and the manufacturer instructions. 3.24.3 Swage-Type Connectors

Swage ferrule must be compressed into the connector body. The gap between the ferrule shoulder and nut face must not exceed .02 in. and must comply with the IPC-620 (13.11)

3.25 Conductive Soldering of Lampholders (Reference Figure 10)

NOTE: The terms Sweat Soldering, plumbing soldering, lap soldering are describing the same process and assemblers can achieve such a solder joint by following steps 1 thru 13 in this paragraph.

Step 1: Choose the appropriate soldering fixture per the print or router.

Step 2: Before assembly, clean the lampholder and ferrule with alcohol (if using Scotchbrite, do not remove plating).

Step 3: Prior to setting up the heat transfer; add a minimal amount of the appropriate flux (SD-191).

Step 4: Choose the appropriate solder size and alloy.

Step 5: Choose the appropriate wattage of iron and appropriate size of tip for connection.

CAUTION: Keep the tip secure.

Step 6: Plug the solder iron into a 110 outlet and allow it to heat to the proper temperature (20–30 minutes).

Step 7: Clean the tip off using a clean moist cellulose sponge.



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CAUTION: Cleaning the tip with a dry cotton towel is a fire hazard and may cause personal injury.

Step 8: Apply the soldering iron’s tip to the parts being joined to form heat transfer.

Step 9: A small amount of solder added at the point where the parts being joined contact the tip will enhance the heat transfer.

Step 10: Add solder to the connection being formed. The solder shall flow evenly, having no peaks or sharp edges.

When in constant contact with the tip, some assemblies may require rotation to successfully achieve heat transfer and an acceptable solder connection. No filing or cutting off of peaks or icicles with Exacto knives or cutters.

Step 11: After the solder has flowed and wetted the parts, remove the soldering iron’s tip from the parts being soldered.

Step 12: Let the lampholder assembly cool to room temperature. Clean the assembly with appropriate solvent(alcohol) and a natural bristle brush or industrial towel.

Step 13: Keep the tip tinned with solder to maintain a good, clean heating surface.

3.26 Lamp Contacts

Sweating a lamp contact is accomplished when:

• Assemble contact assembly per drawing• Place a buildup of solder on top of the washer• Place small drop of flux on top of solder buildup• Set the contact on top of buildup of solder and flux• Place small drop of flux on top of contact• Place cleaned iron tip on to flux area on contact (no solder on iron tip)• When solder flow (sweating) is accomplished remove iron tip• Clean with approved solvent• Inspect

3.27 Safety

The supervisory personnel are responsible for ensuring that all safety regulations are followed and must meet the applicable Local and Federal Occupational, Safety and Health Regulations.

Materials used in this process are flammable. They are also toxic and as such must be handled with extreme



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care. All flammable materials shall be kept in approved containers and disposed of properly. Personnel handling any of these materials shall exercise caution. Before eating or smoking, operators shall wash their hands thoroughly with soap and water. Hands must be thoroughly cleaned before handling soldering materials.

Refer to MSDS sheets for special handling precautions.

3.28 Special Provisions

3.29 Visual Inspection Criteria for Resistance Soldering

Visually inspect resistance-soldered connections according to the following criteria:

• A dark spot where the carbon tip touched the metal is acceptable.• Remove flux and flux residue.• Poor wetting of solder to base metals, as evidenced by convex fillets, non-wetting and de-wetting, cold

joints, etc., shall be rejected.• Cracked or fractured solder joints shall be rejected.• Small pinholes and voids are acceptable unless otherwise directed by drawing.• Dull solder or unevenness on the surface of the solder fillet is acceptable, when using high temperature

solder (hard solder). Proper wetting of the solder must be evident.• Lampholders and non-electrical connections soldered together with no sealing requirements shall have

a minimum of 25% of the total circumference of the soldered connection showing a solder fillet. If a greater amount is required to meet the structural integrity of the design, the requirements shall be placed on the engineering drawing.

3.30 Visual Inspection Criteria for Conductive Soldering of Lampholders

Visually inspect conductive soldered connection according to the following criteria:

• Remove flux and flux residue.• Poor wetting of solder to base metals, as evidenced by convex fillets, non-wetting and de-wetting, cold


solder (hard solder). Proper wetting of the solder must be evident.• Lampholders and non-electrical connections soldered together with no sealing requirements shall have a

minimum of 25% of the total circumference of the soldered connection showing a solder fillet. If a greater amount is required to meet the structural integrity of the design, the requirements shall be placed on the engineering drawing.

• No solder peaks or icicles are acceptable. (Filing or cutting off peaks or icicles is prohibited)



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• No damage to plating is acceptable

3.31 Visual Inspection Criteria for Lamp Contact Assemblies

• Remove flux and flux residue.• Poor wetting of solder to base metals, as evidenced by convex fillets, non-wetting and de-wetting, cold


solder (hard solder). Proper wetting of the solder must be evident.• No solder peaks or icicles are acceptable (Filing or cutting off peaks or icicles is prohibited).• No damage to plating is acceptable.

3.32 Quality Records

Record retention shall be in accordance with the applicable section of the Sarica Quality Manual.

3.33 Termination Requirements:

Component leads in supported holes may be terminated using a straight through, partially clinched, or clinched configuration. The Clinch should be sufficient to provide mechanical restraint during the soldering process. The orientation of the clinched relative to any conductor is optional. DIP leads should have at least two diagonally opposing leads partially bend outwards.

Lead Terminations in unsupported holes shall be clinched a minimum of 45 degrees.

If a lead or wire is clinched, the lead shall be wetted in the clinched area. The outline of the lead should be discernible in the solder connection.

Tempered leads shall not be terminated with a full clinched configuration.

Lead protrusion shall not violate minimum electrical clearance requirements. Lead protrusion shall be in accordance with Table 6-2 for supported holes or Table 6-3 for unsupported holes.

Connector leads, relay leads, tempered leads and leads greater than 0.051 inch in diameter are exempt from the maximum length requirement provided that they do not violate minimum electrical spacing.



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3.34 Jumper Wires

Jumper wires are considered as components and are covered by a customer or engineering drawing for routing, termination, staking, wire type. Tools to be used and cleaning instructions will be present on process router.

Keep jumper wires as short as practical and unless otherwise documented do not route over or under other replaceable components. Design constraints such as real estate availability and minimum electrical clearance need to be taken into consideration when routing or staking wires. A jumper wire 0.984 inches maximum in length whose path does not pass over conductive areas and do not violate the designed spacing requirements may be uninsulated. Insulation, when required on the jumper wire, shall be compatible with conformal coating when conformal coating is required.

FIGURE 1Hole Break Out



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FIGURE 2

Nonwetting Dewetting

FIGURE 3Wetting

FIGURE 4Edge-Board Contacts



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FIGURE 5EXCESS CONDUCTOR MATERIAL

FIGURE 6Date Rev. Page9/24/2015 M 51 of 217


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Heat Sinks and Anti-Wicking Tools

Anti-Wicking Tool

FIGURE 7



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FIGURE 8Component with a Welded Bead

FIGURE 9

FIGURE 10Lampholder Assembly: Conductive Solder Method



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FIGURE 11

Component holder is seated on board and holds component firmly in place.Component Cradle Rivet to board.

Spring clip under component

FIGURE 12



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FIGURE 14

Acceptable• Funnelet set uniformly and concentric to the hole• Strain or stress marks caused by setting kept to a minimum• Splits in set flange, but not into the barrel• No more than three splits in any one eyelet

FIGURE 15

Reject

• Funneled periphery is uneven or jagged.• Splits enter into the barrel.



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FIGURE 16

Preferred

The elliptical funnel is flared smooth with the funnel concentric to the terminal. The terminal is seated snugly (it does not move up or down in the hole, but can be turned by hand).

FIGURE 17

Acceptable

Any cracks, cuts, or fractures in the funnel do not touch the lip of the plated-through hole. Maximum snugness grips the board firmly (terminal cannot be turned by hand), but the plated- through hole is not deformed.



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FIGURE 18

Reject

Cracks, cuts, fractures, or gaps in the funnel contact the lip of the plated-through hole. The terminal is swaged too tightly, deforming the circuit plating (stretched hole, lifted pad, etc.).

FIGURE 19

Acceptable



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FIGURE 20

Not Acceptable



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FIGURE 21Terminal Wrap Prior to Soldering

Turret Terminal Bifurcated Terminal

• Minimum 180°• Maximum full wrap, no overlap

Inside curvature of wire contacts post for full wrap

• Minimum 90°• Maximum full wrap, no

overlap

Positive contact of wires with two corners of post, all four corners if full wrap

Pierced Terminal Hook Terminal



Wire contacts two opposite flat surfaces Inside curvature of wires contacts hook for full wrap.



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FIGURE 22Multiple Connection Wrap

NOTE: All wires are shown wrapped clockwise. Reverse wrap direction for counter-clockwise.

FIGURE 23-A



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FIGURE 23-BPlacement of Terminal-Mounted Components

FIGURE 24Proper Wrap around the Terminal



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FIGURE 25Stress Relief Bend

FIGURE 26



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FIGURE 27

Minimum spacing between clinched lead length and any other conductive pad, trace, etc.

FIGURE 28Mechanical Strippers Fixed Dies



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FIGURE 30Solder Pot Stripping

FIGURE 31Removing Insulation Slug

FIGURE 32Insulation Slug



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FIGURE 33Properly Stripped Wire

FIGURE 34Rejected Stripped Wire



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FIGURE 35Solder in a Lead’s Bend Radius

Acceptable

Solder in the Lead’s Bend Radius

FIGURE 36Hermetically Sealed Components

Not Acceptable Acceptable

Seals are chipped and cracked. Seals not damaged; leads bent 0.060 inch beyond the seal of the component



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FIGURE 37Coated Components

Not Acceptable Acceptable

Seal damaged; coating removed beyond the point where lead enters the component’s body

Seals not damaged

FIGURE 38

NOTE: The following standards apply only to vitreous (of or resembling glass) enameled parts that are ultimately encapsulated with potting (hot or cold) or that are to receive conformal coating.

Preferred

• The component body is clean and free ofvisible defects such as chips, cracks, orcrazing.



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FIGURE 38 (Continued)

NOTE: The following standards apply only to vitreous (of or resembling glass) enameled parts that are ultimately encapsulated with potting (hot or cold) or that are to receive conformal coating.

Acceptable

• Small random stress crazing of the component body at the junction of the lead and the body is acceptable.

Acceptable Maximum

• Minor chipping of the component body does not expose the inner component body.

• The area where chipping has occurred is clean and does not exhibit cracks that could propagate or enlarge the damaged area.

Reject

• Severe chipping of the outer component body exposes the inner component body.



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FIGURE 39

FIGURE 40Sleeving

Unacceptable Acceptable

FIGURE 41

Acceptable Unacceptable

The component leads’ ceramic coating shall not extend into the component’s mounting hole.



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FIGURE 42

Unacceptable

Acceptable

A. Component is less than 0.060 inch from the board

B. Leads twisted excessively

C. Misalignment from the vertical greater than0.032 inch, top to bottom

A. Minimum of 0.060 inch between the board and the component body

B. Visually centered and aligned

C. Misalignment from the vertical less than0.032 inch

FIGURE 43

Unacceptable Acceptable



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FIGURE 44Planar Mounting

Unacceptable

Acceptable

(A) Planar mounted components not flat against the board.

(B) The leads on the planar components or jumpers are not clinched.

(C) Component crowding (metal cases of components shorting against each other).

(D) The component leads shall extend a minimum of 0.030 inch beyond the opposite surface of the printed circuit board.



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(A) Planar mounted components flat against the board.

(B) The leads are clinched on the planar mounted parts.

(C) No interference between the electrical non- common component cases.

FIGURE 45Example of Wire Routing to Multi-Terminal Components

FIGURE 46Wire Dress at Multi-Terminal Component



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FIGURE 47Round Nose Pliers

FIGURE 48Wire and Lead Cutting Tool

FIGURE 49Date Rev. Page9/24/2015 M 74 of 217


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Pretinned Wire

FIGURE 50Solder Application

1.

2. 3.

FIGURE 51Cable Clamp



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FIGURE 52Shield Termination



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FIGURE 53Stripping Dimensions for Shielded Wires

FIGURE 54Printed Wiring Board Contacts

Preferred

• Free from all types of surface defects inprinted contact area.

Acceptable

• Surface defects do not expose copper or nickel in the specified contact area.

• Pits, pinholes, and surface nodules do not exceed the total dimensional area and/or height requirement in the specified contact area.

• Voids should not exceed product requirements in the specified contact area.



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Reject• Pits, pinholes, and surface nodules expose

copper or nickel and/or exceed either or both of the following criteria:

The minimum allowance

The dimensional area or height allowed in the specified contact area

• Blisters, excessive stains, and discoloration are present in the specified contact area.

• Voids reduce the specified printed contact area to less than the specified minimum.



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SECTION 4: ESD PREVENTION

• ESD requirement criterion is contained in ANSI/ESD-S20.20 ESD

4.0 Forms

The purpose of this section is to establish guidelines to meet requirements for an electrostatic discharge (ESD) control program to minimize the effects of ESD on components, assemblies, and equipment. An effective ESD control program will increase reliability of our products and decrease maintenance activity and lifetime cost.

This document provides guidelines for establishing and implementing an ESD control program for any activity that designs, tests, inspects, services, manufactures, processes, assembles, installs, packages, labels, or otherwise handles electrical or electronic components, assemblies, and equipment susceptible to damage by static electricity. The ESD protected area “EPA” is clearly identified and shall be maintained per the S20.20 guidelines.

No simplistic solution exists for a complex technical procedure such as ESD control because ESD-related damage is not always detectable by feeling, seeing, or hearing a discharge. Nor is the damage always detected at functional testing. Therefore, an ESD control program shall be custom-tailored to meet specific requirements for each area affected by this standard.

This document defines the requirements for an ESD control program (not including electrically initiated explosive devices, flammable liquids or powders) and provides the following information for assemblies and equipment that require ESD control:

• Identification• Testing• Classification• Protected work areas• Protective covering• Packaging and marking• Installation

• Quality assurance provisions

Handling procedures• Training• Marking of documentation and hardware• Data requirements• Audits• Reviews


Form Name Form # ProcedureElectrostatic Discharge (ESD) Control

F765 Process form to be used to record results of the daily or prior to use testing Wrist Straps. Retain for two (2) years then dispose.


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This document prescribes ESD controls consistent with those used for Class I ESD sensitivity (susceptibility to damage from ESD potentials of 0–1,999 volts). Regardless of components’ and assemblies’ actual susceptibility to ESD damage, these controls shall be observed for all components and assemblies at Sarica Mfg. excluding the exceptions covered under Conflict. Note: Any ESDS Assembly, where the class of sensitivity, for the ESDS components, is not called out on the print, this section of the Workmanship Standard shall govern how the components/assemblies are to be handled to protect from ESD damage.

4.1 Conflict

In the event of conflict between approved customer drawings and this specification, the approved customer drawing shall govern. Where customers elect to disregard ESD protection per this document, ESD requirements can be waived at final inspection and shipped per purchase order or contract requirements shown on the Work Instructions (router), or written instructions from a customer representative (Source), Engineer representing the customer, or Design Engineering.

4.2 Equipment/Supplies

This section is intended to define the various types of equipment and supplies that will be used in various segments of the ESD protection program. Unless so stated in the definition, this section does not specify whether a particular piece of equipment or supply must be used.

4.2.1 Workstation Equipment /Storage

Because static charges are more readily generated in low humidity and/or extremely hot or cold environments, workstations should be located in areas where the temperature is between 64.4 - 86° F and the relative humidity between 30 and 60 percent. Avoid levels of humidity higher than 60% due to the accelerated corrosion of electronic parts and units and physical discomfort associated with a higher humidity. ESD workstations and storage should be located away from exterior doors or other areas where large movement. All non-essential insulators packaging waste etc. shall be removed from EPA. Sarica controls workstation environments. Humidity and Temperature are recorded every work day on form# F770 and must be within acceptable limits to prevent contamination of electrical components. In the event that humidity drops below 30% all work shall be stopped until humidity is within acceptable range.

4.2.1.1 Equipment/supplies for workstations are as follows:

• Static dissipative table top

A laminated work surface capable of discharging an electrostatic potential to earth ground through a1-megohm resistance. Surface Resistivity of <109 ohms.

• Static mat

A conductive or static dissipative mat (depending on the application) with hardware for connection to



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earth ground through a 1-megohm resistance Surface Resistivity of <109 ohms.

• Wrist strap

An adjustable, conductive fabric or metalized button wrist strap with a strap and hardware for connection to earth ground through a 1-megohm resistance. The wrist strap must be adjustable to a snug fit on the operator’s wrist. Watch band style wrist straps shall not be used unless the outside surface is covered with an insulating material to prevent possible electrical shock.

• Foot straps

Foot straps are permissible for use in areas with a grounded static floor mat is in place. The surface mount area has static mats runners are placed in where ESD items are handled and transported from machine to machine. Foot straps shall be tested every time they are put on and logged in the foot strap log.

• ESD Smocks

ESD smocks with built in wrist strap and hardware for connection to earth ground through a 1-megohm resistance. Shall be tested the same as wrist straps and logged accordingly.

• Common point ground

A wire with built in 1-megohm resistance and connectors that allow the simultaneous hook-up of wrist straps and mats or laminated tabletops from an electrically common point to earth ground.

• Ionizers

Ionizers emit equal amounts of positive and negative ions, which can neutralize charges on the surfaces of objects to help eliminate the potential of ESD damage. They are used at workstations where relative humidity and static producing articles cannot be adequately controlled. To stabilize the work area, ionizers shall be operated for a minimum of 5 minutes prior to removing ESDS components or assemblies from their protective coverings.

• Soldering irons

Soldering irons used at ESD-controlled work stations must have a tip to ground resistance of less than 5 ohms and a potential of 2 mV RMS or less and meet Soldering Iron Test of this section.

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• ESD protective bags

ESD protective bags used for primary packaging (layer closest to the packaged item) of circuit card assemblies and Cable and Harness with ESD products, and components shall:

• Have a buried conductive layer covered by a static dissipative material that can be folded over or sealed to form a Faraday cage

• Bags shall meet the requirements of EIA-541• Bags shall be labeled per EIA- 583

• ESD protective totes, kitting trays, and parts bins

Totes, kitting trays, and parts bins used for storing ESDS circuit card assemblies, products, and components shall be conductive (usually black in color). Totes shall be capable of being fitted with a conductive lid to form a faraday cage. Kitting trays are used to transport work in process.

For effective control of ESD, totes, when in use, shall be closed using the conductive lid. TheProtective containers and packaging must be kept clean.

4.3.1 Personnel Grounding Testers

• Wrist Strap & Heel Strap checkers

Wrist strap and Heel Straps testers shall be used by all employees that work inside ESD work area on a daily basis at the beginning of each shift and whenever a wrist strap or Heel Strap is suspect. The testers shall be easily operated and provide an easily deciphered pass/fail or go/no go indication. The results are recorded on Sarica Log Form F-765 or F-763.

• Megohmeter

A megohmeter can be used for continuity to ground through wrist strap and table mat snaps. When used in conjunction with aluminum foil test electrodes, the megohmeter can be used to measure the surface resistivity of a mat or table top laminate.

4.4 Specification of ESD Sensitive Components

4.4.1 Definition of Electronic Component

For the purpose of this document, an electronic component is defined as any component that is designed to carry or affect an electric current (with the exception of pure conductors such as terminals, wires, connectors, and headers).



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4.5 Engineering Drawings of ESD Sensitive Components

Engineering drawings for assemblies containing electronic components shall contain a note signifying that ESDSensitive components may be present on the assembly.

The note shall also indicate that the assembly/sub-assemblies must be handled and labeled in accordance with this section. In cases where handling and labeling procedures inconsistent with this section are required, the engineering drawing shall specify those requirements and will override this manual.

Engineering drawings generated before this document’s release need not be updated until other changes are also necessary. The lack of these notes on a drawing does not eliminate the requirement for the assembly to be labeled and handled in accordance with this section.

4.6. Packaging of Components

Until they are assembled into a product or otherwise consumed, all ESDS components must be contained in either their originally supplied packaging, if re-sealable, or approved ESDS protective packaging except when physical handling is necessary during processing.

4.6.1 Receiving and Stocking Components

ESDS components may be received and stocked in original manufacturer packaging. ESDS components that have been broken out of original manufacturer packaging by a distributor shall be received in ESD protective packaging. Purchasing shall be responsible for communicating these requirements to our vendors.

4.6.2 Procurement Quality/Receiving

Procurement Quality/Receiving shall be responsible to ensure that ESDS components are received and forwarded to stock areas in original manufacturer packaging or proper ESD protective packaging.

4.6.2.1 Receiving and Stocking Moisture Sensitive Devices and Components:

Any moisture sensitive devices once opened or shelf life in sealed bag exceeded must be stored inside a dry cabinet for applicable time before use. All moisture sensitive devices are to be stored in original packing and sealed until use is needed.

4.6.2.2 Moisture Sensitive Devices Violations:

Any moisture sensitive device violations shall be recorded on a reject tag and given to manufacturer engineer for disposition.

4.6.3 Repackaging of Components

Once removed from the original manufacturer’s packaging, ESDS components shall be repackaged only in Date Rev. Page9/24/2015 M 83 of 217


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approved ESD protective packaging such as static-shielding bags. Paper envelopes, plastic bags, plastic bubble wrap (unless static dissipative), cardboard boxes, and Styrofoam (unless anti-static or static dissipative) are all unacceptable.

4.6.4 Storage of Components

ESDS components in storage areas must be packaged in the original manufacturer’s packaging or approved ESD protective packing, be contained within a conductive tote, be stored within a metal cabinet to provide a faraday cage surrounding the component, or be stored in a properly sealed static shielding bag. If stored in a static shielding bag, the surroundings shall not be detrimental to parts when they are exposed.

4.6.5 Processing of Components

Static dissipative or conductive kitting trays and bins shall be used to contain ESDS components that are sorted, processed, and kitted for a pending production job.

4.6.6 Packaging of assemblies and products

All assemblies and products shall be packaged or contained to prevent ESD damage before being removed from the static controlled workstation where they are assembled and/or inspected.

4.6.7 Circuit Card Assemblies

Circuit card assemblies and small electronic modules shall be contained (one board/assembly per static bag) within a conductive tote or static shielding bag for transport through the manufacturing process. Completed circuit card assemblies and small electronic modules shall be packaged in approved static-shielding bags for storage or transport to final assembly areas. Static and non-static parts shall not be mixed in the same static bag.

4.6.8 Upper Level Electronic Assemblies and Products

Upper level electronic assemblies and products must be contained within conductive totes or static shielding bags for transport through the manufacturing process. Completed units must either have protective coverings (such as static dissipative or conductive dust covers and connector caps) placed over all electrical openings or be packaged in approved ESDS protective bags or wrap.

4.6.9 Handling

No person shall handle an ESDS component, assembly, or product or remove it from its protective packaging unless he/she is:

• Properly connected to ground at an ESD workstation by a wrist strap and at an ESD workstation• Fully trained and certified in ESD requirements



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Personnel not certified to work with ESDS components shall not be permitted to handle any unpackaged ESDS component, assembly, or electronic component. It is the responsibility of the Group Leader, Engineer or Operator to ensure visitors in the ESD controlled workstations are properly grounded by a wrist strap if sitting at the workstation. ESD sensitive items removed from the ESD containers stay within EPA.

4.6.10 Responsibility for Compliance

The Group Leadership, in each area shall be responsible for ensuring that all activities performed in their area that involve ESDS components and assemblies comply with this specification.

4.7 Procedures for Areas where Unpackaged and Unprotected ESDS Components are Handled Routinely

4.7.1 Areas Specifically Included

• Circuit card assembly areas• Areas assembling circuit card assemblies containing ESDS components into subassemblies and final

assemblies or stamping these parts• Test and inspection benches within these areas• Conformal coating spray booths and associated circuit card handling areas• Storage areas, such as Point of Use storage and stockrooms, where ESDS components and assemblies are

handled• Procurement Quality (Certain workstations in Procurement Quality fall under this specification.

Workstations where no ESDS components are handled may be exempt from this specification.

4.7.2 Definition of ESD Sensitive Components

To ensure complete protection of electronic products in these areas, all electronic components will be considered as ESD sensitive and should be handled accordingly.

4.7.3 Labeling of Entrances

ESD criterion on labeling is contained in ANSI/ESD-S20.20

4.7.4 Personal and Workstation Grounding

4.7.4.1 Static Dissipative Laminate Tabletops and/or Static Dissipative Tablemats: All workstations where assembly, testing, or inspection of ESDS components and assemblies is performed shall have either a static dissipative laminate table top or be covered with a static dissipative tablemat. This laminate or the tablemat shall be connected to earth ground through a 1-megohm resistance. The surface resistivity of the mat or laminate and the connection to ground shall be tested as outlined in Appendix A A2.2.An insulating mat must be available at test stations for use when electric power is to be applied to units, or you can disconnect and insulate the unit under tests as described in this section.



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Mats and table laminates must be kept clean to function correctly. They shall be thoroughly cleaned daily or on an as needed basis with a cleaner specifically designed for static mats or per manufacturer's instructions.

4.7.4.2 Static Dissipative and Conductive Wrist Straps:

Whenever working at a static controlled workbench or handling any components or assemblies at such a workstation, personnel shall wear a static dissipative or conductive wrist strap connected either to the grounded tablemat or directly to ground through a 1-megohm resistor. (No more than 2 megohms resistance should exist between the person and earth ground via the wrist strap.)

Wrist straps shall be worn so that the entire band and conductive contact area fit snuggly against the skin.

Wrist straps shall be examined for wear on a monthly basis. Wrist straps and ground cords shall be electrically tested for continuity to ground on a daily basis, and the results shall be recorded on the Electrostatic Discharge (ESD) Control (F-765).

Foot straps shall be examined for wear on a weekly basis. Foot straps shall be electrically tested for continuity to ground on a daily basis when in use, and the results shall be recorded on the Foot Strap Testing Log (F-763).

4.7.5 Tests Involving Operating Voltages

Technicians performing tests involving operating voltages shall first set up the test fixture and ESDS device while their personal grounding mechanism is still connected. Prior to applying voltage, the technician should place an insulating mat between the unit being tested and the static dissipative mat or laminate. Then, for operating potentials of over 50 volts, the technician should disconnect his/her personal grounding system.

After the test is complete and the operating voltage is removed, the technician should reconnect their personal grounding device and remove the insulating mats.

WARNING: Failure to disconnect personal grounding devices and insulate the unit being tested from grounding systems may result in severe injury to personnel and damage to the unit being tested.

4.8 Procedures in Areas where Unpackaged and Unprotected ESDS Components are Handled Occasionally

4.8.1 Areas Specifically Included

• C.C. and Cable/Harness Assembly Areas• Paint Rooms

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3.8.2.1 ESD Control Ready: Specified workstations in these areas shall be made ESD control ready; a suitable grounding system shall be wired to the station; approved mats, wrist straps, and packaging and storage supplies shall be near at hand; and other requirements of this section shall be readily attainable.

4.9 Processing and Handling of ESDS Components

Whenever ESDS components, assemblies, or products are to be processed or handled in the area, they must be handled only at an ESD control ready workstation, which must be fully set up to meet the requirements set forth in this section. When ESD sensitive components, assemblies, or products are removed from ESD control ready workstation they must be stored in an ESD protective bags, or ESD protective totes prior to the removal from the ESD control ready workstation. When removed and transported from ESD control ready workstation all ESD sensitive components, assemblies, or products shall be transported in an ESD protective bag or ESD protective tote. Two exceptions to this requirement shall be allowed:

• Engineers and engineering technicians handling components, assemblies, and units that are for in- house or prototype use only (and will never become part of a shippable product) may waive this requirement.

• Components, assemblies, and products that shall remain packaged in closed ESD protective packaging may be processed at non-ESD controlled workstations.

4.10 Other procedures

4.10.1 Training of Personnel

Personnel working in these areas shall receive the intensive ESD awareness per the S20.20-2007 and handling training and the certification program prior to being allowed to work on or handle any product/assembly that is ESDS. Trainers are certified in IPC-610/620.

4.10.2 Responsibility for Proper Operation of Grounding Devices

Operators in these areas shall be responsible for ensuring proper operation of all workstation and personal grounding devices before allowing any work to begin on ESDS components and assemblies.

Work shall stop any time ESD is felt by an operator while he/she is grounded via a wrist strap. An occurrence of ESD could indicate that the common point ground is faulty and needs to be investigated.

4.10.3 Responsibility for Monitoring and Correcting the Presence of ESDS Component Issues

Group Leaders or Supervisors in these areas shall be responsible for monitoring workflow through the area when ESDS components are present in a production job and for instituting the required ESDS control procedures. Any violations will be handled through Sarica C.A.R. system.



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4.10.4 Responsibility for Visitors

The Group Leaders, Supervisors and Assembly Employees who are ESD trained shall be responsible for ensuring that visitors who come in to the ESD area do not violate control procedures (wrist straps, etc.).

4.11 Safety

Because static control devices such as wrist straps, and table mats are designed to shunt ESD voltages to ground, they pose an inherent shock hazard for technicians working on live circuits. Insulating mats must be available for use at workstations where potentials higher than 50 volts AC or DC will be applied to exposed circuitry. Personnel working at these stations must follow the precautions to protect themselves from electrical shock and the circuitry from damage.

4.12 Packaging

4.12.1 Primary Packaging

Conductive packaging material (static shielding bags) shall be used as the primary packaging for all circuit card assemblies and ESD sensitive products. Primary packaging is the layer of packaging that is closest to the product.

4.12.2 Secondary Packaging

Secondary packaging for shipping is used as a cushion for products that are already static-shielded by primary packaging. However, since secondary packaging will be used in ESD sensitive areas, it should be constructed of ESD protective materials, normally static dissipative material, as required.

4.13 Labeling

Circuit card assemblies, sub-assemblies, modules, products, and shipping packages that contain ESD sensitive components must be identified with an ESD label or symbol. Unless otherwise specified on the engineering drawing, purchase order, or contract, assemblies and products shall be labeled according to the following guidelines.

4.13.1 Circuit Card Assemblies and Sub-Assemblies with ESDS Components

Circuit card assemblies and sub-assemblies containing ESDS components shall be identified with ESD labels as shown below or with similar labels.



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4.13.2 Boxes and Static Shielding/Static Dissipative Bags

Boxes and static shielding or static dissipative bags shall display the ESD labels as shown below or similar labels. Refer to Code Book for appropriate label number.

4.13.3 End Items and Products

End items and products shall display the ESD label as shown below, or a similarly worded.

4.14 Quality Assurance

ANSI/ESD-S20.20 prescribes test methods for all equipment tests specified herein. Those test methods and equipment or any test methods and equipment that produce the specified results may be used to conduct ESD quality assurance tests. The Manufacturer’s Instructions will be followed for each tool.

4.14.1 Quality Assurance Audits

4.14.1.1 Work Station Certification: Work stations test will be performed once a year unless problems arise then test as needed, the technicians and/or trained personnel associated with each ESD work cell or area shall conduct the workstation tests outlined in Appendix A:

• Resistance from earth ground to the ESD mat (or table laminate) snap terminals 3.2• Surface resistivity of ESD mats (or table laminates)



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• Wrist StrapThe test results shall be recorded on the ESD Workstation Audit Log (Form F-765), and the workstations that pass the tests shall be labeled and certified as ESD acceptable workstations.

4.14.1.2 Solder Iron Tests:

Solder Iron test will be performed once a year unless problems arise with a certain iron then test as needed, soldering irons shall be tested for:

• Tip to ground resistance of 5 ohms or less (measured hot)• Potential to ground of less than 2 millivolts RMS• Tip temperature ±9° F of a preselected temperature

The results shall be recorded as pass or fail on the Soldering Iron Log (Form F-783). Soldering irons that pass the test shall be labeled as acceptable.

Failure of a soldering iron to pass these tests shall not affect the workstation’s certification, but the soldering iron must be repaired or replaced before further use.

Unless used on known static sensitive devices, irons exempt from testing are irons not used on printed circuit boards or wires to terminals (i.e. lampholder assemblies, lamp contacts). Solder irons used to solder non-static sensitive devices such as wires to terminals and need to justify tip temperature only.

4.15 Manufacturing Audits

A written audit is required annually using the audit checklist and walk through audits are required quarterly.

4.15.1 Wrist Strap Testing and Logs

At the beginning of each shift, or if the wrist strap is not used daily, prior to using wrist strap, operators at each workstation are responsible for conducting a test of their wrist strap and logging the results. The testers used shall use pass/fail or high resistivity/OK/short to indicate that a conductive path through a 1-megohm resistance exists. Any wrist straps failing the test must be replaced immediately by the supervisor or designated person. Log results on the Electrostatic Discharge (ESD) Control (Form F-765).

4.16 Quality Records

Record retention shall be in accordance with the Sarica Mfg. procedures.

4.17 Preventive Maintenance

Calibration of soldering irons and verification of work stations and ESD mats shall be verified annually and



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recorded. Cleaning of ESD mats will be cleaned with only approved ESD cleaners and shall be cleaned on a regular basis.

APPENDIX A: Certification Procedure for ESD Workstations

A1.0 SCOPE

This procedure is to be performed within any once a year unless a failure happens at a station. This is to verify proper grounding of ESD workstations. Results of these tests shall be logged on Form F-765 and are subject to audit by Quality Assurance at any time.

A2.0 PROCEDURE

A2.1 Test 1: Resistance from Earth Ground to ESD Mat Snap Terminals

A2.1.1 Procedure 1:

Step 1: Measure resistance between earth ground and all snap terminals on the ESD mat. An acceptable measurement is less than 2 megohms.

Step 2: If the measurement is acceptable, log the results in the ESD workstation form and proceed to Test 2.

Step 3: If the measurement is not acceptable, notify the area supervisor to stop work at the workstation and initiate corrective action. Work may not continue at the workstation until corrective action has been accomplished and an acceptable measurement is obtained.

A2.1.2 Equipment:

Procedure 1 Megohmeter (500 VDC) Aluminum test electrode (2 inch by 3 inch) Five pound metal weight

A2.1.3 Procedure 1

Step 1: Connect the negative (black) test lead of the megohmeter to the ground post and the positive (red) test lead to the aluminum foil test electrode.



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Step 2: Place the electrode approximately 12 inches from the ground post, towards the center of the mat/laminate.

Step 3: Position the 5-pound weight on top of the test electrode.

Step 4: Set the megohmeter to a 500-volt output.

Step 5: Turn the megohmeter power switch to the on position.

Step 6: Set the discharge switch to the measure position.

Step 7: Repeat the test at two or three other points on the work surface.

An acceptable measurement is 0.8 x 106 to 109 ohms. The lower limit of this range allows for the resistance in the cord to the ground post. This allowance is 20% less than the 1-megohm resistance in the cord to the ground post. The upper limit allows for the resistance in the static dissipative material of the mat.

Step 8: If the measurement is acceptable, log the results in the ESD workstation’s form and proceed to Test 3 (if required). If Test 3 is not required, proceed to workstation identification.

Step 9: If the measurement is not acceptable, notify the area supervisor to stop work at the workstation and initiate corrective action. Work may not continue at the workstation until corrective action has been accomplished and an acceptable measurement is obtained.

A2.2 Identification of Workstations and/or Equipment

All ESD workstations and equipment shall be identified with the following labels or similar labels. ReferenceCode Book for appropriate label.



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APPENDIX B: SOLDERING IRON TESTS

Record the results of these tests on Form F-765

B1.0 TEST 1: RESISTANCE FROM TIP TO GROUND

B1.1 Equipment

Procedure 1 (B1.2) Megohmeter (500 VDC) Test leads, 2 Or Pace PM200 Soldering Iron Tester

B1.2 Procedure 1

Step 1: Make sure the soldering iron is thoroughly heated and is switched to the off position.

Step 2: Connect the negative (black) test lead of the megohmeter to earth ground, and attach the positive (red) test lead to the tip of the soldering iron.



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Step 3: Set the megohmeter to a 500-volt output.

Step 4: Turn the megohmeter power switch to the on position.

Step 5: Set the discharge switch to the measure position.

Step 6: If an acceptable measurement (5 ohms or less) is achieved, continue with Test 2 (2.0 of this appendix).

If a reading of over 5 ohms is achieved, remove the soldering iron from service until corrective action is taken and an acceptable reading (5 ohms or less) can be obtained.

B1.3 ACCEPTANCE CRITERIA

The potential difference between earth ground and the tip of the soldering iron cannot exceed 2 mV RMS. (If the potential difference is greater than 2 mV RMS, remove the soldering iron from service until the problem is corrected.

B2.0 IDENTIFICATION OF SOLDERING IRONS

All soldering irons used in ESD controlled areas shall be identified with a label.

APPENDIX C: PERSONAL GROUNDING DEVICE TESTS

C1.0 SCOPE

These procedures confirm the integrity of the wrist straps that form the basis of our ESD protection program. Wrist straps must be tested at the beginning of each shift, and the results of the tests must be logged. The logs are subject to audit by Quality Assurance at any time.

C2.0 WRIST STRAP TESTS

Two types of wrist strap testers are used. Determine which type of tester is in use before continuing with the test.

• TYPE A

The wrist strap tester has a wire with an alligator clip that must be connected to ground. The wrist strap is left connected to the ESD mat or tabletop terminal during the test. (This type of tester also checks for continuity to ground from the mat or tabletop.)



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• TYPE B

The wrist strap is plugged into a jack on the wrist strap checker for the test. Wrist straps shall be tested at the beginning of each shift, or whenever changed.

C2.1 Procedure

Step 1 For Type A testers:

1. Ensure that the ground wire is making good connection with the tester.2. Attach the alligator clip on the ground wire to a suitable ground on the workbench.3. Place the wrist strap on your wrist and attach it to the workstation where it will be used. (Disregard this step if testing a conductive foot strap).

Step 1 For Type B testers:

1. Plug the end of the wrist strap cord into the wrist strap tester per the manufacturer’s instructions.

2. Ensure that the cord is making good connection with the tester.3. Ensure that the wrist strap fits snuggly on the wrist; or, if the tester is equipped with a strap connection,

attach the strap to the connection per the manufacturer’s instructions.

Step 2: Press the test switch and observe the tester’s reading. While pressing the test switch, use your free hand to stretch the wrist strap cord to check for intermittence.

An acceptable wrist strap test will display a PASS or OK indication on the tester.

Unacceptable indications include FAIL, HIGH RESISTANCE, HAZARD, LOW RESISTANCE, and SHORT.

Step 3: Record the test results on the Electrostatic Discharge (ESD) Control (Form F-765)Step 4: If an acceptable indication is received during the test, the wrist strap tester can be disconnected, the wrist strap can be re-attached to the workstation (necessary for TYPE B testers only), and work at the station may commence.

If an unacceptable indication is received during the test, discontinue all work at the station until the problem is corrected. (NOTE: A failure may be due to dry skin causing additional surface resistance. If this is the case, the failure can be corrected by the operator applying a skin lotion approved for use in electronics assembly environments to his/her wrist.)

Step 5: Once a wrist strap has been tested good, the operator should use the wrist strap and cord all day. Also, operators should not switch wrist straps with other operators. If any changes are made, a new test shall be conducted.



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SECTION 5: TE RM I NA L CR I MP I NG

Terminal Crimping requirements and workmanship/ inspection criteria is contained in IPC/WHMA-A-620

5.0 Forms

Form Name Form # Form DescriptionCrimping Equipment/ToolUsage Log

F-762 Process form to Record the results of certification of crimping tool. Retain for two (2) years then

The purpose of this section is to detail the method and materials to be used in preparing the wire lead and applying the crimp terminal to its prepared end. The wire and terminal used for the pull test shall not be used in the assembly. The wire and terminal shall be prepared for the pull test per the drawing and or manufacturing specification. This specification provides instruction and workmanship standards by which terminal/wire termination is to be inspected. This specification covers all terminal crimping produced by Sarica Manufacturing. It shall be used as a standard when the approved Engineering drawing does not specify tolerances. Stranded wires smaller than 26 AWG are not crimped unless otherwise specified. Sarica does not allow using crimp tooling other than manufacturer approved. All pull test results shall be written in the crimp log.

Sarica does not crimp solid wire. Sarica only uses full cycle ratchet crimp tools. Conductor strands shall not be cut or modified in any manner to reduce the (CMA) to fit a termination. CMA is not built up unless the volume and material allowed is specified on drawings. When it is required, the filler must be visible in the brush inspection and the cut end must be visible.

NOTE: The use of crimp terminals on solid lead wire is prohibited unless called out on the EngineeringDrawing then handle as you would a stranded wire. The use of this configuration could cause:

• A breaking point on the solid wire due to stress, vibration or movement• An inadequate crimp, which would allow the wire to pull out

5.1 Training Requirements

5.1.1 Crimp Tools (Automatic, Semi-Automatic and Hand Crimp)

The certified trainer of the crimp tools shall be responsible to assure that the employee be thoroughly familiar with the use of these tools. Each crimp tool is verified each day while in use by a pull test visual inspection. Each operator shall receive a minimum of 3 hours instruction on the care and handling of the equipment and shall demonstrate his/her understanding of this standard. The assembler shall also demonstrate his/her ability



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to properly use the equipment as it pertains to this standard. Location of the wire into the terminal to be crimped for the pull test or production shall be to the manufacture instructions.

NOTE: The equipment referenced herein is intended to include both the tool and the terminal.

5.1.1.1 Crimped Connections: No crimped connections or wires to be crimped will be soldered or tinned unless specified by the customer.

5.1.2 Control and Use of Automatic Crimping Equipment

5.1.2.1 References

• Crimp tool book• Applicator manufacturer’s manual, instruction sheet, or data sheet

5.1.2.2 Safety

• Turn off power and air supply to press when making adjustments to applicator.• When working on press itself, disconnect power and air supply.• Always use manufacturer supplied guards. Do not bypass any safety device (ex: door interlock switch)

to operate equipment.

5.1.2.3 Prior to set-up

• Determine terminal to be crimped from Process Router, Drawing, or B.O.M.• Determine and obtain the correct applicator to use by referring to Tool Book, Process Router,

Manufacturer’s Instruction Sheet, or Terminal Data Sheet.

5.1.2.4 Set-up of Equipment

• Load terminal reel:

1. Place terminal reel onto reel support of press.2. Apply reel holder to keep reel in place while press is in operation.

Load applicator into press:

NOTE: Clear bottom of applicator and top of plate for any materials that may interfere with crimp height (ex: cut pieces of terminal carrier strip, etc.)

1. Fit the applicator ram post into the ram post adaptor on the press.2. Allow applicator to drop down onto press plate. If applicator does not drop down, apply light

downward force to bring it down to the press plate.3. Slide applicator into place on press plate.



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4. Secure applicator to plate by tightening applicator base clamp hardware.

Load terminals into applicator:

1. Raise terminal hold down feature and feed terminal strip into applicator. Lift feed pawl and continue feeding until lead terminal is over the crimping anvil.

2. Lower feed pawl into feed track. Ensure it catches one of the holes in the feed strip so it will advance another terminal. Lower the terminal hold down feature.

Determine wire gauge and set applicator to gauge needed from the data plate. Turn wire disc to where the appropriate letter is lined up under the ram post adaptor.

Set insulation disc to adjust insulation crimp according to insulation diameter of wire being crimped.

NOTE: In general, lower numbers or letters = looser crimps and higher numbers or letters = tighter crimps.

5.1.2.5 Set-up Verification

NOTE: Run a minimum of one cycle by hand or “creep” mode to verify tooling will not crash during normal cycle operation.

Refer to later sections in Process Manual on verifying set-up according to type of terminal used.

5.1.2.6 Operation

Ensure next terminal feeds directly onto center of anvil after each crimp produced. Some slack may be necessary in terminal reel to ensure proper advancement of terminals.

5.1.2.7 Proper Storage

Place a piece of insulated wire (scrap) between the crimper and anvil of the applicator.

5.1.3 Control and Use of Semi-Automatic and Manual Crimping Tools

5.1.3.1 References

Crimp tool book Hand tool manufacturer’s manual, instruction sheet, or data sheet

5.1.3.2 Safety

Disconnect power source if equipped (battery or air supply) before making adjustments.5.1.3.3 Prior to Set-up



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Determine terminal to be crimped from Process Router, Drawing, or B.O.M. Determine and obtain the correct hand tool to use by referring to Tool Book, Process Router,

Manufacturer’s Instruction Sheet, or Terminal Data Sheet.

5.1.3.4 Set-up of Equipment

Verify that the tool is in calibration by checking the date listed on the calibration sticker. Take tool to Engineer if tool is out of calibration.

Install correct dieset, positioner, or head (if required) per manufacturer’s instruction sheet, data sheet, Tool Book, or Process Router.

5.1.3.5 Set-up Verification

Refer to later sections in Process Manual for detail on verifying set-up according to type of terminal used.

5.1.3.6 Operation

Refer to manufacturer’s instruction sheet, data sheet, or Process Router for questions on tool usage.

5.1.3.7 Proper Storage

Place hand tool back into its storage bin with the handles closed.

5.2 Material/Solution/Equipment

The following equipment, or equivalent, and materials and data shall be used in accomplishing the requirements of this procedure.

• Dial Calipers (calibrated)• Connector assemblies (various types and sizes)• Crimping tools [automatic/semi-automatic/pneumatic or manual (hand crimp)• Extraction tool• Go/no go plug gages (calibrated)• Insertion tool• Mechanical wire strippers• Pin gages (calibrated)• Probes• Solid solder slugs (various sizes)• Tensile/pull tester (calibrated)• Terminals



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• Wire (Stranded or Solid)• Stoddard Solvent or equivalent• Crimp Micrometer• Circular Mil Area (CMA) = (Diam. of single strand in mils) x (Diam. of single strand in mils) x (# of

strands)

5.3 Control, Maintenance, and Storage of Crimping Equipment

The cable and harness department, plant maintenance, and engineering will be responsible to store and maintain the automatic, semi-automatic and hand crimping tools to include adjustable ratchet tools and to verify that the equipment is within the tolerance specified by the manufacturer's instruction/maintenance/ inspection sheets.

This verification shall be accomplished by completing a Tensile Strength Test (Pull-Test) of this section or, if determined necessary by the Engineering Department, must meet verification per the manufacturer’s instruction/maintenance/ inspection sheets.

The crimping equipment shall be used only to crimp wires and terminals of the part numbers indicated on the approved print. To determine the appropriate crimping equipment, refer to the Tooling Reference Book. Wire positioning/placement into terminals shall be per the manufacturer’s specification.

5.3.1 General Maintenance

The importance of general maintenance and calibration cannot be over emphasized, as this can easily and efficiently be performed during or after each use or when deemed necessary, ensuring satisfactory performance and continuous production. Semi-Automatic and Fully Automatic equipment shall be on a Preventative Maintenance schedule controlled by the Maintenance Department. Hand crimp tools are reviewed and calibrated once a year and inspected every time used.

5.3.1.1 Calibration Seals on Hand Tools: Ratchet adjustment screws will be covered by a tamper resistant label, filled with white colored paint, or similar means of “sealing” the tool’s adjustment feature from unauthorized adjustment. Tools without the label or with chipped paint must pass calibration test and be re-sealed before being allowed for use in production.

• Tools must be lubricated periodically per the Tool Manufacturing Instruction Sheet.• Remove dust, moisture, and any extraneous matter with a clean brush or soft lint-free cloth.

Do not use objects that could damage the tool. Do not clean crimping tools in Freon tanks.Use a Stoddard Solvent or equivalent to clean.• Make sure proper retaining pins are in place and secured with the proper retaining rings.• Inspect the head assembly, giving special attention to the crimp area for flattened, chipped,

cracked, worn, or broken areas. Also look for missing parts such as locators, wire stops, pins, etc.

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• Clean dot identifiers (indentations) in the wire barrel dies to ensure the clarity of dots in the crimped terminal. Clean with a soft bristled brush and a Stoddard Solvent or equivalent.

• Tool verification test has not been completed. Do appropriate testing (Pull Test, etc.) and record applicable information in each column on the Pull test/log.

All suspect, broken, worn out or obsolete tools shall be turned into the Engineer for scrap or repair disposition. The Engineer shall investigate suspect tool and determine whether the tool can be repaired in-house, returned to vendor/outside repair facility, or scrapped.

5.3.2 Verification of Fully Automatic, Semi-Automatic, and Manual Crimping Equipment

This specification is designed to verify that the crimping equipment meets the expectation of the manufacturer’s instructions/maintenance/inspection sheets or equivalent.

All suspect, broken, worn out, or obsolete tools shall be turned in to Engineering for scrap or repair disposition. The Engineer shall investigate suspect tool and determine whether the tool can be repaired either in-house or returned to vendor/outside repair facility or scrapped.

5.3.2.1 Crimp Verification (Using Solid Solder Slug): For crimpers that require verification using the solid solder slug method, you should complete the following steps (Testing interval is once per applicator set up).

Step 1: Select the correct crimping tool from the information provided in the tool book, router, manufacturer’s instruction sheets, terminal data sheets, or from the Engineering Department. Do not use solder slugs in tools that crimp uninsulated contacts unless specified by the manufacturer's instruction sheets. (The solder could jam tooling locators, wire stops, ejectors, etc.) Refer to AMP IS-7424 or the manufacturer’s instruction sheets for solid solder slug sizes.

Step 2: Select the solder slug size as determined by the manufacturer’s instruction/ maintenance/inspection sheets or Ref. AMP IS-7424. Record the solder slug size on the Crimping Equipment/Tool Usage Log for further reference.

Step 3: Using the correct size solder slug and the crimp size on the tool head, position the solder slug between the crimping dies and fully crimp the slug. Hold for a minimum of ten (10) seconds. Log test results on F780 crimp height solder slug log at machine.

NOTE: A maximum of one (1) crimp per one (1) inch of the solder slug length for a total of (2) sample crimps.

Step 4: Release the handle and remove the solder slug. Using the crimp (O.D. Micrometer), measure the crimp height of solder slug. If all (2) crimp heights conform to that shown in the manufacturer’s instruction/maintenance/inspection sheets or equivalent, the tool is considered dimensionally correct. Record the actual crimp height dimension of all two (2) samples on the Crimping Equipment/Tool Usage Log.

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If die closures conform, the tool is ready to use. If die closures do not conform, the Engineer will remove tool from service for evaluation and disposition.

NOTE: Solder slugs shall be discarded after each use.

5.3.2.2 Crimp Verification (Using Terminal/Wire Combination)

Refer to AMP IS-7424 or the manufacturer’s instruction sheet for instructions to use calibrated Crimp Height micrometers. Refer to Figure 63 and record the actual crimp height dimension of all the (2) samples on the Crimping Equipment/Tool Usage Log.

Use this method to verify (2) sample crimps. If crimps conform to crimp height requirements the tool will be put into service. If crimps do not conform to crimp height requirements, the Engineer will remove tool from service for evaluation and disposition.

5.3.2.3 Crimp Verification (Using Go/No Go Gages)

For crimpers that require verification with go/no go gages, complete the following steps for the wire crimp barrel and, when specified, the insulation crimp barrel:

Step 1: Close the handles of the tool until the wire barrel crimping jaws bottom; do not apply additional pressure to the tool handles. Check the die closure by using the proper gages. (Reference the chart in the manufacturer’s instruction sheets.) Hold the gage in alignment with the die closure and carefully insert, without forcing. The go-gage must pass completely through closure (Reference Figure 64).

Step 2: Try to insert the No-Go gage. It may enter partially, but must not pass completely through the die closure (Reference Figure 64). If the die crimp closures meet Go/No-Go gage conditions, die closures are dimensionally correct.

If die closures do not conform to the go/no-go gage conditions, the Engineer will remove the tool from service for evaluation and repair.

5.3.2.4 Tensile Strength Testing Requirements

5.3.2.4.1 Crimp Tool Frequency and Tensile Strength Test: Two (2) samples, consisting of the terminal and wire size called out on the print, shall be provided from each tool being tested in test intervals of once per day for each combination of tool, wire and contact. Tensile strength values are found in TABLE 1 for all terminals having to meet SAE-AS7928 or MIL-C-22520 requirements and TABLE 2 for all Molex terminals not covered by military requirements or manufacturer’s instruction sheets. If the contact has a wire insulation support it shall be rendered ineffective by manually opening the insulation crimp or stripping the wire extra long so the un-insulated wire extends beyond the insulation crimp. Correct application per the

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manufacturer’s instruction/maintenance sheets shall be obtained. For multiple wire applications, pull test is performed on the smallest wire in the crimp. Contact deformation from crimp does not interfere with fit, form or function of the connector. When crimp force values are not established, the tensile strength of the crimp connection is no less than 60% of the tensile strength of the wire. Test wire and terminal will be disposed of after pull test is completed. Any changes made to the tooling setup after initial verification will require a new verification of the crimp to be performed and logged.

Step 1: Place the specimen on the tensile strength tester between the two grips per the Manufacturer’s instruction sheets/manual found at the tensile strength tester location and apply the poundage as required by applicable TABLE 1 or TABLE 2.

NOTE: It may be necessary to tie a knot in the wire so that the insulation won’t slip out of the grip or pull off the wire.

The termination shall not break at the crimp or pull out from the crimp before the minimum load has been applied. If minimum load is not achieved, termination is suspect and the Engineer shall remove the tool from service for evaluation and disposition. Log test results of the 2 sample parts in the test log F762 at the pull test machine.

NOTE: OPEN OR CLOSED BARREL TERMINALS OR CONNECTOR PINS OR SOCKETS—These are terminals that one or more wires can be crimped into the same end of the terminal during the same crimping procedure. To pull test this type of terminal with m u l t i p le w i re s do the following:

1. Since the multiple wires are crimped into this terminal all at the same time you cannot crimp just one wire and pull. Pulling one wire you do not have the total wire CMA for all wires being crimped accounted for. Therefore you must calculate the CMA of all wires involved in this crimp and use a (one) generic wire meeting the CMA size requirements. Crimp wire into three terminals being tested per the manufacturer instructions.

2. Place splice into the pull tester per the manufacturer instructions. Continue to Step 2.3. Insulation greater than one wire diameter from the end of the barrel for insulated terminals or

a machined contact is rejected.4. Conductors extending greater than one wire diameter beyond the crimped barrel of crimped

splices are rejected.

BUTT SPLICES—These are terminals with one or more wires crimped into the terminal from opposite sides during two (2) separate crimping procedures. To pull test this type of terminal with m u l t i p le w i re s do the following:

1. Crimp wire into one side of the three butt splices being tested per the manufacturer's instructions.

NOTE: If more than one wire is to be crimped into that side, calculate the CMA (Circular Mill Area) of all wires being crimped into that side and use a generic wire meeting the CMA size requirements

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3. Insulation gaps of the crimped splices exceeding 1 wire diameter are rejected.

NOTE: Follow this same procedure for the other side of the butt splice terminal using 3 new terminals because the first 3 splices have been destroyed.

PARALLEL SPLICES—These are terminals with one or more wires crimped into the terminal from opposite ends or the same end during the same crimping procedure. To pull test this type of terminal with m u l t i p le w i re s do the following:

1. Since the wires are crimped into this terminal all at the same time you cannot crimp just oneside and pull. Pulling one side you do not have the total wire CMA for all wires being crimped accounted for. Therefore you must calculate the CMA of all wires involved in this crimp (both sides) and use a (one) generic wire meeting the CMA size requirements. Crimp wire into three terminals being tested per the manufacturer instructions.

2. Place splice into the pull tester per the manufacturer instructions. Continue to Step 2.

CLOSED END (bombtail or bobtail) SPLICES—these are terminals with one or more wires crimped into the same end of the terminal during the same crimping procedure. To pull test this type of terminal with m u l t i p le w i res do the following:

1. Since the wires are crimped into this terminal all at the same time you cannot crimp just one wire at a time and pull. Pulling one wire at a time you do not have the total wire CMA for all wires being crimped accounted for. Therefore you must calculate the CMA of all wires involved in this crimp and use a (one) generic wire meeting the CMA size requirements. Crimp wire into three terminals being tested per the manufacturer instructions.

2. Place splice into the pull tester per the manufacturer instructions.

NOTE: Terminals used on lanyard assemblies whether the wire in the lanyard assembly is a solid, stranded, or braided wire shall be tested with a pull test weight of 15 lbs. minimum. More important with this type of crimp is that the crimp can hold the weight of the lens assembly, etc. that it is attached to. In the event the lens assembly or etc. is actually a heavier weight than the pull test minimum tensile strength, 15 lb. min. the weight of the lens assembly or etc. + 50% of the weight of the assembly shall be used as the minimum tensile strength.

NOTE: Lanyard assemblies where the terminals are crimped onto fabric braid with a knot tied in the braid to be positioned on the contact side of the crimped terminal do not need to have a pull test completed.

NOTE: Insulation over lanyards is for protection of mating part (reduces chattering) and is not rejectable when ends of tubing are not held in the terminal insulation crimp.

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for the wire to break at the crimp after meeting minimum load. This breaking after meeting minimum load simply means the wire’s maximum tensile strength has been achieved.

4. Record the actual tensile strength on the Crimping Equipment/Tool Usage Log.

5. Upon successful completion of the tensile strength test, the crimping tool shall be available for use and sticker/label is attached.

Failure of any type on any sample during testing shall prompt an investigation into the proper wire gage, terminal, application, and tool that provided the samples. The crimping tool shall not be available for use until a successful tensile test is achieved.

Successful or failed tensile strength test or visual rejections of a tool shall be recorded on the CrimpingEquipment/Tool Usage Log as indication of tool status.

All suspect, broken, worn out or obsolete tools shall be turned into the Engineer for scrap or repair disposition. The Engineer shall investigate suspect tool and determine if it can be either repaired in-house or if it must be returned to vendor/outside repair facility.

5.4 Repair Disposition

The Engineer determines if tool can be repaired. Tooling may be determined to be repairable in-house or forwarded to an outside vendor for repair.

5.4.1 In-House Repair

Step 1: Engineer shall be responsible for in-house repair of tool and recording of what was done to repair the tool shall be entered on to the Crimping Equipment/Tool Usage Log.

Step 2: Upon repair the Engineer shall verify tool by completing a pull test or alternate test as applicable.

Step 3: Tool may be returned to production for use upon completion of repair and test.

5.4.2 Outside Repair

Step 1: Engineer shall be responsible for shipment of the tool to the chosen repair facility. A pack slip shall be obtained from purchasing and all required shipping procedures shall be applicable.

Step 2: Upon receipt of the repaired tool, the Engineer shall be responsible for verifying tool by completing a pull test or alternate test as applicable and recording results on the Crimping Equipment/Tool Usage Log.Step 3: Tool may be returned to production for use upon completion of repair and test.

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All go/no go gages, crimp height micrometers, and other measuring devices used shall be calibrated and accurate to the class requirements specified.

5.6 Mechanical Wire Strippers

Mechanical wire strippers shall not require calibration. The user shall be responsible for ensuring that they are functioning properly and blades are in sharp condition. The wire stripping shall be acceptable to the appropriate workmanship standard. Mechanical strippers shall have grit pad for gripping insulation and one of the following types of blades to ensure accurate stripping without nicking or scraping wire and without marking insulation.

Blade types meeting MIL-W-16878 standards:

Type EE, Teflon wire 1000V Type E, Teflon wire 600V

Wire stops and latch mechanisms can be used to control the length of wire strip and to leave insulation slug on wire to prevent birdcaging of strands prior to use. Place the wire in left hand and slug in right hand; twist the slug of insulation off by twisting slug up and away from your body and pulling at the same time. By doing this it will keep the wire strands in the natural lay (spiralness).

5.7.1 Requirements for Crimped Terminations and Connections

5.7.2 Preparation of the Wire Lead

If required, strip the insulation from the lead wire for the distance recommended by the manufacturer of the terminal (for wire being used). Reference Figure 55. No solid or stranded conductor damage shall be evident.

If Manufacturer’s Instruction Sheet is not available, use the following steps to determine wire installation strip length.

1. With dial calipers, measure the wire crimp barrel of the appropriate terminal. Add 0.0625” to this measurement. OR estimate the strip length visually.

2. Strip insulation to meet this dimension.

3. Inspect to verify strip length measurement meets requirements for Open or Closed barrel terminals or for solid pin or socket terminals.

4. If wire strip length is undersize, strip additional insulation to meet required measurement.

5. If wire strip length is oversize, cut wire to appropriate length prior to crimping onto terminal.

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Note: Do not cut wire length after crimp has been accomplished. Terminal plating could be damaged by cutting tools.

• The exposed wire shall not be tinned unless noted on print to do so.

5.8 Damage of Wire Insulation

The primary reason for having insulation covering conductors is to separate electrically the conductors inside of an assembly.

The wire's insulation shall not be pierced, split, frayed, or otherwise damaged. Maximum insulation thickness damage is 20%, usually caused by mechanical strippers (minor depressions).

5.9 Insulation Crimp

The insulation crimp shall support the wire sufficiently to prevent flexural stress on the wire crimp (Reference Figures 56 and 57). During initial set-up, the requirements of Insulation Crimp Adjustment Test Instruction of this specification shall be met.

5.9.1 Wire Strands

All wire strands shall be contained in the wire crimp barrel. No strands shall be nicked, damaged or missing.

5.9.2 Form and Location of Crimps

Crimps shall be properly formed and located on the crimped terminal. Double crimping to correct deformities or rejectable conditions reduces the integrity of the crimp and is prohibited.

5.9.3 Axial Wire Movement

Axial wire movement shall not be discernible in the crimped terminal.

5.9.4 Damaged Terminal or Other Connecting Device

Terminals or any other connecting device shall not be deformed or otherwise damaged before or after the crimping operation. Damaged terminals will not be used (i.e. metal fractures, damaged plating, damaged insulating sleeve, damaged contact areas, etc.).

5.9.5 Proper Crimp Heights

Crimping tool(s) must be gauged and checked for proper crimp heights as set forth in manufacturer’s instruction sheets for the specific terminal/wire combination. Crimp height results will be entered into the F780 Crimp Height Solder Slug log book.

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5.9.6 Wire’s Mechanical Connection

The mechanical connection of the wire shall be such that it will not release itself from the crimp or break at the crimp prior to minimum tensile load being applied per SAE AS7928 (open or closed barrel terminals) or the manufacturer's requirements (Reference Table 1 or 2).

5.9.7 Wire’s Electrical Connection

Electrical connection of the wire shall be such that it will have the resistance value of an equal length of wire. No insulation is allowed into the wire crimp barrel.

To verify the resistance value, use a digital ohm multimeter and probes. The Engineer or Technician or designee shall follow these steps or equivalent test:

1. Measure the length of the crimped metal wire barrel and contact combined.2. Using the same wire as above, make two openings (the same distance apart as length recorded in #1) in

the insulation.3. Measure the resistance of this piece of wire between the two openings.4. All crimped connections shall be inspected for cleanliness and cleaned if needed.5. Results: The #1 crimped terminal and #2 wire shall have the same resistance value. If they do not,

notify the Engineer of the cell.

5.9.8 Protective Coverings

The primary purpose of coverings is abrasion resistance to protect internal wires. If woven, they can either be woven directly over a core or obtained in prefab form and installed by sliding over the wire bundle. Other types of protective coverings (if drawing requirements are not flowed down) including heat shrink tubing, spiral wrap, conduit, and tapes are applied per customer specifications. If customer specification is not available, these items are applied per manufacturer specifications.

5.9.9 Braid Shield/Coaxial and Twinaxial (Shrink Ring)

The inner and outer ferrules should be centered over each other. The exposed shield should be less than .125 in length. Shield wire is located on a flat of the hex crimp. Crimp is centered on crimp area of terminal and standard crimp practices are applied. Sleeving overlaps .25” minimum beyond the exposed shield in each direction. No damage to terminal or dielectric. No loose strands of shield or shield wire outside ferrules. When the braid is not terminated it shall be covered with heat shrink sleeving. When a crimp ring is used, no movement of the ring or connector is evident after crimping. Shield strands not contained prior to the crimp ring are trimmed and do not exceed 10% of total strands. If a shrinkable ring is used, when it is shrunk on, no movement of the ring or shield is evident. Shield is visible between shrinkable area and the backshell. Shield should be approximately .125 from the backshell. Shield weave pattern is intact. On solder connection assemblies, the conductor must be visible across full diameter of the window. The inspection window must be filled with solder but solder must not protrude beyond terminal barrel. Solder must be wetted to both connector and terminal. Remove any temporary holding devices before adding braiding. Assemblies shall be cleaned if needed. Assemblies shall be designed to meet the requirements of the IPC-620 (13.0-13.12.2) or customer

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drawing in line with manufacturer instructions. 5.9.10 Shield Termination

Shield termination may be located under strain relief clamps as long as protection is provided under the clamp. Shield should terminate behind the connector/accessory as close as possible to the inner conductor termination point. Terminations made with self-sealing heat shrinkable devices are exempt from cleaning requirements. Heat shrinkable solder devices may be changed one size up or down to achieve correct fit when size is not called out. When specified by design, shield terminations in a daisy chain application are staggered within the specified limits from the end of the wire to minimize buildup. Braided shield shall be protected with shrink sleeving when not terminated.

5.9.11 Solder / Stripping Biaxial wire

In the assembly of a Biaxial cable, all adjacent parts need to contact each other to insure the stability of the connector. This criteria applies to both male and female connectors. Tip conductor insulation is extended more than 50% of the window length in notched insert. Solder in the inspection window is flush to slightly concave. Sarica follows the IPC-620 (13.12-13.12.2) or manufacturing instructions whichever is specified on the customer drawing.

5.10 Insulation Crimp Adjustment Test Instruction (Open or Closed Barrel Terminals)

The insulation crimp minimizes undue strain and vibration that might affect the wire crimp portion of the termination.

To obtain the best insulation crimp, for any given wire size, use the following crimping/inspection procedure:

Step 1: Refer to the appropriate manufacturer’s instruction material for the initial adjustment procedure.

Step 2: Using an unstripped wire, make a test crimp according to the instruction material.

Step 3: Inspect the insulation crimp by:1. Holding the terminal in one hand and the wire about 3 inches from the terminal in the

other hand.

2. Bend the wire up 90° once and down 90° once (Reference Test Instruction 1)

Step 4: If the wire pulls out during the bend test, the insulation crimp is not tight enough and must be adjusted to a tighter setting according to the procedure in the instruction material shipped with the tool (or machine).

Insulation crimp is to be tight enough to grip and hold insulation in the crimp barrel, but not so tight that it deforms the insulation more than slightly (Reference Figures 56 and 57). If there is visible damage, such as tearing or piercing of the insulation, the insulation crimp is too tight and must be readjusted.

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5.10.1 Semirigid Coax

Semirigid cable assembly acceptability depends on three factors: application, cleanliness, and tooling. Assemblies must meet the criteria of the IPC-620 (13.10 – 13.10.5). The inside bend radius must be equal to or greater than the material manufacturer’s specifications. The diameter of the cable must be constant and not deformed in the bend area. The outside surface of the cable must be smooth.

The dielectric should be flush with the connector face and perpendicular to the center conductor. Dielectric material has no foreign particles embedded in or on its surface. With the exception of obvious damage or improper solder connections, the correct function of the cable assembly will be the determining factor of acceptance.

Test Instruction 1

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TABLE 1Tensile Strength (in pounds)

Wire Size SAE AS7928 Strength (Open or Closed Barrel Terminals)

MIL-C-22520 Strength (Connector Pins or Sockets)

32 - 1.0

30 - 1.5

28 - 2.7

26 7.0 4.5

24 10.0 8.0

22 15.0 12.0

20 19.0 20.0

18 38.0 35.0

16 50.0 50.0

14 70.0 70.0

12 110.0 110.0

10 150.0 -

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NOTE: Use Table 1 for Non Molex type terminals. Use Table 2 for Molex type terminals that do not have a minimum tensile call out on the Manufacturers Instruction Sheets.

5.11 Crimp Terminals

Several types of crimp terminals are used by Sarica Mfg.

In all cases the terminal used shall be appropriate to the wire size and compatible with the environment unless specified otherwise by customer documentation. This is readily identifiable by the color of the plastic barrel, the number(s) stamped on the terminal, or the manufacturer’s data sheets.

5.11.1 Closed Barrel/Open Barrel Terminals

Closed barrel terminals have an O-shaped barrel, open barrel terminals have a U-shaped barrel. An insulating or metal sleeve over the wire crimp area of the terminal is common on closed barrel terminals. The insulating or metal sleeve of a closed barrel terminal may extend beyond the wire crimp area to support insulation, or the insulation barrel may extend behind the wire crimp barrel of an open barrel terminal (Reference Figures 59a and59b).

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TABLE 2Molex Tensile Strength Standards

Tensile Strength (in pounds)Pull Required by Material Thickness

A.W.G. Tensile Strength forWire .015"–.013"

Tensile Strength forWire .010"

Tensile Strength forWire .008"–.006"

10 80.0 - -

12 70.0 - -

14 58.0 40.0 -

16 45.0 35.0 -

18 35.0 25.0 20.0

20 18.0 15.0 14.0

22 - 12.0 10.0

24 - 8.0 8.0

26 - 6.0 6.0

28 - 4.0 4.0

30 - 3.0 3.0


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Use the terminal called out on the applicable engineering drawing and determine if it is compatible with both the lead wire and the mechanical connection.

For terminals with the insulation crimp, the lead wire's insulation shall be stripped per the manufacturer’s instruction sheets or so that the bare wire is visible between the insulation crimp barrel and the wire crimp barrel to a maximum dimension of 1/16”. The insulation must not be in the wire crimp, but visible between the insulation crimp barrel and the wire crimp barrel.

NOTE: This requirement also applies to closed barrel terminals in which this area is not visible, but very crucial to the electrical connection of the terminal. Using an ohm's meter to check the resistance of the crimped terminal is one way to verify that there is no insulation in the wire crimp (Refer to Figure 59b).

The wire end of the lead wire shall be flush with or extend up to 1/16 inch beyond the wire opening in the terminal. It shall not interfere with the mating hardware (screw, nut, washer, connector, etc.) when the terminal is installed (Reference Figures 59a and 59b).

The finished terminal shall be accepted or rejected in accordance with Figure 59a or 59b and/or applicable inspection criteria found in the manufacturer's instruction sheets.

5.11.2 Tongue Terminals/Open Barrel or Closed Barrel

These are terminals without an insulation support barrel or insulation barrel extension (Reference Figure 58).

Use the terminal called out on the applicable engineering drawing and determine if it is compatible with both the lead wire and the mechanical connection.

The maximum allowable gap between the wire lead's insulation and the end of the wire crimp barrel shall be1/16 inch (Reference Figure 58).

The end of the lead wire shall be flush with or extend up to 1/16 inch beyond the wire opening in the terminal. It shall not interfere with the mating hardware (screw, nut, washer, connector, etc.) when the terminal is installed (Reference Figure 58).

The finished terminal shall be accepted/rejected in accordance with Figure 58 and/or applicable inspection criteria found in the manufacturer’s instruction sheets.

5.11.3 Multiple Lead/Single Terminal

The crimping of multiple lead wires to a single terminal is acceptable. The requirements are as stated in this section (Reference Figures 60a and 60b)

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multiple wires being crimped together prior to inserting them into the terminal for crimping.5.11.4 Terminal Connections

The maximum of three ring terminals may be connected to any one point provided the mounting screw is engaged for a distance equal to the nominal thread diameter or the mounting nut is fully engaged on the screw.

In the case of open-ended terminals, only one terminal may be connected at any one point. Binding head screws require neither a lock-washer nor a flat washer; non-binding head screws require both (Reference Figure 61).

The following general requirements apply to the connections:

• Ring terminals shall be oriented so any terminal movement will tighten the mounting screws or nuts.

• Only accepted material and appropriate equipment and methods shall be used in insulation displacement connections.

• Multiple terminals to any one point shall be staggered or alternately inverted to minimize deformation.

• Multiple terminals to any one point shall be stacked in order of decreasing size.• Open-end terminals shall be fully inserted against the mounting screw or stud.• The wire end on terminals shall not extend under the mounting screws, washers, or other

terminals.• Wire crimp barrels must be facing upwards for wire extension verification and orientation.

5.11.5 Solid Pin and Socket Terminal

The solid pin and socket terminals without an insulation barrel shall not have the wire insulation extending into the cylindrical barrel or into the crimp. The wire insulation gap shall not exceed 1/32 inch (Reference Figure 62).

5.11.6 Solid Pin and Socket Terminal Accept/Reject Criteria

• The lead wire shall be visible when viewed through the inspection hole (Reference Figure 62).• All of the wire strands shall be in the wire crimp barrel.

NOTE: This requirement also applies to closed barrel terminals in which this area is not visible, but very crucial to the electrical connection of the terminal. Using an ohm's meter to check the resistance of the crimped terminal is one way to verify that there is no insulation in the wire crimp (Reference Figure 59b).

• The terminals shall not have metal fractures.• Minor deformity of the circular end of the terminal barrel or the inspection hole is acceptable, provided that

the extent of deformity allows visual verification of the conductor penetration and the proper method and tooling were used (Reference Figure 62a). Double crimping to correct deformities is prohibited.

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• Insulation clearance does not exceed 1/32”.

5.12 Connector Assemblies

Sarica Mfg. uses several types and shell sizes of connector assemblies purchased from several different vendors.

In all cases, the connector assembly used shall be compatible with the environment in which it will be used.

Use the manufacturer’s data sheets, customer or military documents, for proper application requirements.

NOTE: Military or vendor part number shall be on the end item drawing. Mating part number is optional. Both are reference information.

5.12.1 Insertion/Extraction Tools

Insertion and Extraction tools adhere to the following industry standards:

ContactSize

Color of Tools

20 Red

16 Blue

12 Yellow

NOTE: Always inspect tools for damage and wear. Store tools in appropriate protective containers. Follow manufacturer instructions for proper use of tools. Retention test is performed 100% of all contacts. Operators are trained to the contact retention testing requirements and the tooling used.

5.12.1.1 Insertion Tools: The insertion tool commonly has a U-shaped tip in which the wire lays during insertion into the rear of the receptacle or plug. The U-shaped barrel will have one of the two following configurations:

• The tip may fit inside of the wire barrel. This configuration is used for insulation diameters of .060" or less.

• The tip may fit on the outside of the wire barrel. This configuration is used for insulation diameters of .060" or greater.

5.12.1.2 Extraction Tools: The extraction tool commonly has an O-shape tip if the terminal is pushed out the front of the connector receptacle or plug. It will be U-shaped if removal is from the rear. This will spread the retaining fingers of the connector contact apart for ease of wire removal.

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5.12.2 Keys and Keyways

The front of the connector assembly receptacle or plug has keys or keyways on it (the mating end). Keyways are slots usually found on the receptacle (the half with the flange). Keys are tabs usually found on the plug (the half with the coupling ring). Keyways and keys are used to properly align the receptacle and plug electrically.

5.12.3 Placing Terminals into Receptacles or Plugs

To properly place terminals into receptacles or plugs, follow the trace line to the proper hole location. To use the trace line, remember the first and last holes are always numbered; between the first and last hole, every tenth hole is circled.

Place the terminal straight into the center of the hole. Do not place the terminal in at an angle. Doing so could damage the fingers or insulating materials inside of the hole.

The clicking sound of the retaining fingers inside the plug or receptacle indicates that the terminal is securely positioned. Straightening of contacts to meet requirements is not allowed.

5.12.4 Confirming Retention

To confirm retention, tug lightly (using reasonable force) on the wire. Do not yank on it. The fingers are made of sturdy materials able to withstand 10 insertion/extraction operations, but pulling too hard may prematurely damage the material and allow the terminal to back out or not set correctly. This test to be performed as an in-process test only and shall not be performed as part of the final inspection. The push-click-pull method of installing contacts is approved.

Force gauge Contact size Pull Force

Not recommend(maximum)

Push Force

(Min to Max)

Pull gauge: Pull wire; this method may damage the wire, so is not recommended

Push gauge: Push on the mating end of the terminal.WARNING: Applying too much pressure can damage the ends of the terminal and make electrical connection impossible.

22 3 to 5 lbs. 6 to 8 lbs.

20 3 to 5 lbs. 7 to 9 lbs.

16 4 to 7 lbs. 8 to 10 lbs.

12 4 to 7 lbs. 10 to 12 lbs.

5.12.5 Visual Inspection

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Visual inspection of the mating ends of the terminals can be accomplished by physically looking at:

• The end of the pins and making sure they are the same height and not bent.• The sockets and making sure that they are almost flush with the front surface of the insert material.

5.12.6 Installation of Seal Plugs and Filler Rods

If the receptacle or plug has empty connector holes, spare contacts may be used and installed as required by the engineering drawing. Seal Plugs may be installed into the spare contacts when required by the engineering drawing. When spare contacts are not required in the connector, install sealing plugs or filler rods in accordance with the engineering drawing, manufacturer’s documentation, customer specification, or the following chart

NOTE: If required by Customer specification(s) all holes in the connector(s) shall be filled with contacts. All holes and contacts not wired shall have seal plugs or filler rods installed.

Contact Cavity Seal Plug Color Filler Rod Diameter23-22 Black 0.045”20 Red 0.058”16 Blue 0.079”12 Yellow 0.125”8 Red 0.1754 Blue 0.2830 Yellow 0.431

5.12.6.1 Installing Filler Rods

Step 1: Insert the rod into the spare hole until the rod locks against the contact fingers.

Step 2: Trim the rods so that they protrude slightly to a maximum of .12” from the backside of the plug or receptacle insert.

5.12.6.2 Installing End Seal Plugs

Step 1: Trim the end of the seal plug so that it will protrude approximately 0.12” from the back of the plug or receptacle insert.

Step 2: Contact Size 20 (red plug): Insert the large end into the spare hole until it bottoms out in the spare hole contact insulation support area.Contact Size 16 or 12: Insert either end of size 16 or 12 plugs into the spare hole and bottom it out against the ends of the spare contacts inside.

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5.13 Barrel Terminal Splice Crimping

The preferred type of barrel terminal splice to be utilized is the pre-insulated type. However, a non-insulated type may be used provided that sleeving or an insulation that has a dielectric strength at least as high as the wire's insulation is placed completely over the crimp splice.

Splices utilizing insulation crimp supports or barrel assemblies shall not have the insulation entering into the wire crimp barrels of these splices. The insulation crimp support or barrel shall support the insulation to prevent flexural stress.

Splices without an insulation crimp barrel shall have a maximum insulation gap of 1/16" between the wire crimp barrel and insulation. Parallel type splices shall have a maximum wire extension of 1/16" from the barrel (Reference Figure 62b).

5.14 Safety

Assembly personnel shall have received ample instructions to safely use all terminal crimping and wrapping tools. It is the responsibility of the said person to read instruction sheets for all tools and/or ask for assistance from the supervisor or designated person.

For any solvents, solid solder, etc. use applicable Material Safety Data Sheets for proper handling and Personal Protection Equipment.

5.15 Insulation Displacement Connection (IDC)

I.D.C. is a method for terminating an insulated wire to a connector or terminal without pre-stripping the insulation from the conductor. It is important to assure that the wire, connector, and the assembly process are compatible. Variations in wire gage, wire to wire spacing, insulation type, application tooling, insulation thickness, or alignment of the cable to the connector may result in a unreliable connection or an electrical open or short circuit. Sarica builds (IDC) to the requirements of the IPC-620 (6.0-6.2.9). IDC shall not be mechanically stressed after making connection. IDC connections shall not be reworked by removing the wire and reterminating. Handling of the wires will be per the IPC-620.


5.16.1 Assembly Criteria

Assembly personnel shall have received instruction in the use of crimp tools and wrap tools. They shall also determine that the correct wire and terminal are being used.All personnel shall determine that each (100% inspection) of the terminations (crimp or wrap) meet the requirements stated in this procedure.

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As recommended by the manufacturer

Figure 56 Closed Barrel Terminals

Nickel-plated

Color-coding

Wire insulation

Wire end

Cotter sleeve

Contact

Nylon insulation

Funnel ramp entry and insulation restriction sleeve (limits terminal to one wire size only)

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Figure 57Open Barrel Terminals

Figure 58Barrel Open seam

Wire barrel

Serrations provide maximum contact and tensile strength

after crimpingStud hold (size varies)

Tongue(style varies) Maximum insulation

clearance: 1/16” to a minimum of visual clearance

Maximum wire extension:1/16” to a minimum of flush

Stud hole (size varies) Tongue (style varies)

Wire strand

must not extend above this plane

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No damage or distortion in this area

wBellmouth must be visible

Figure 59a

Wire strands must be visible anywhere in this area

Wire strands and insulation must both be visible

Flush to a maximum of 1/16” wire extension, and it shall not interfere with hardware

Insulation and bare wire shall be visible. Maximum insulation clearance: 1/16”

Locking lances not deformed

Cutoff tabmust be visible

anywhere in this area

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Figure 59b

Wire insulation must be inside insulation barrel

Dot code from crimp tooling

Wire strands must be visible anywhere in this areaMaximum wire extension of 1/16” to a minimum of flush. Wire extensionshall not interfere with hardware.

Additional dot code from interchangeable crimping dies

Bellmouthmust be visible

Figure 60a

Figure 60b

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Figure 61

Figure 62

Inspection hole

<1/32”

Crimp

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Figure 62A

Inspection hole

<1/32”

Crimp

Figure 62B

Parallel Splice

Visual clearance to a maximum of 1/16” Flush to 1/16”

maximum extension

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WIRE SIZE Color COD

22-14 Pur"le18-16 Translucent18-10 PorpL•

18-8 Green16-14 6h.1e12-10 Yel1ow

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Nylx

oo

Typical Standard Splices and Closed End Splices

FOR WIRE SIZE22-14

(Translucent)--Faraltl Splice

(8cozed}

+18-10

!ns;Jiation(Color Coded!

+ /Parallel Splieit

IBr.zedl.and Clindled)

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Figure 63

Figure 64

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FIGURE 65 – TERMINAL LUGS – CRIMPED

A. CUT-AWAY – Shows proper location of wire in terminal lug.

1. Insulation fully inserted within insulation support.

2. Insulation support.

3. Stripped wire extends fully through terminal barrel, but does not extend into hardware mounting area.

4. Terminal barrel.

5. Hardware mounting area.

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FIGURE 65 – (continued)

B. PREFERRED CRIMPS1. Example

(a) Terminal has been fully inserted into crimping tool.

(b) The barrel indent is properly positioned and well formed.

(c) The insulation support is properly crimped and prevents wire movement without damage to insulation.

(d) Stripped wire is fully extended through crimp barrel without entering hardware mounting area (ideally, bare conductor extends 1/32 inch through crimp barrel).

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A. (continued)2. Terminal lug without insulation

support.

(a) Lug is properly positioned in tool.

(b) Stripped wire is crimped flush to the terminal stop.

(c) Crimp is properly located and well formed.

(d) Wire insulation is fully covered by terminal insulation.

3. Terminal lug over/under crimp.

(e) The criteria of (1) above have been met.

(f) The insulation support (end on view) has been crimped evenly and firmly. There is no evidence of over-crimping – the insulation is not fully closed (see arrow)

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C. ACCEPTABLE

Wire strands are just flush with crimp barrel.

D. ACCEPTABLE MINIMUM

Wire strands extend beyond the crimp barrel the maximum distance, 1/16 inch.

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E. UNACCEPTABLE CRIMP CONDITIONS

1. Examples

(a) Terminal lug not fully inserted into crimping tool. Front end of barrel pinched.

(b) Wire strands extend beyond crimp barrel more than allowable distance (1/16 inch).

2. Stripped area is too long. Conductor insulation is not inserted into the insulation support area.

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E. (continued)

3. This terminal appears properly crimped but the wire insulation has been damaged exposing the conductor.

4. An open split in the barrel is grounds for rejection.

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E. (continued)

2.

3.

4.

5. Terminal barrel insulation has been loosened. Insulation could slip and expose barrel completely.

6. Damage has occurred in the mounting area of the terminal, exposing the base metal.

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E. (continued)

7. This terminal was inserted into the crimping tool backwards.

8. This terminal was not crimped sufficiently as evidenced by the absence of pronounced indentation markings normally accompanying a good crimp.

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E. (continued)

9. This terminal was rotated 30 degrees prior to crimping. The resultant crimp may interfere with other hardware when installed to a terminal post.

10. Terminal was rotated 180 degrees in the crimping tool. This is grounds for rejection.

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E. (continued)

11. This terminal has been over-crimped. The insulation support has been completely collapsed and this indentation is noticeably too deep.

12. The wire was excessively stripped exposing bare conductor between the wire insulation and terminal insulation.

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FIGURE 66 – MULTI-WIRE TERMINAL LUGS – CRIMPED

A. PREFERRED

1. Barrel crimp is properly positioned and securely clamps both conductors.

2. The insulation grip indent is smoothly formed and provides support without damage to the wire.

3. The conductor ends extend beyond crimp barrel 1/32 to 1/8 inch depending on lug size and recommended tool stop.

B. ACCEPTABLE

1. Conductor ends are flush with ends of crimp barrel.

2. Crimp is properly positioned and well formed.

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C. ACCEPTABLE MINIMUM

Wire strands are unevenly trimmed. Both sets extend beyond crimp barrel but not onto lug tongue flat.

D. UNACCEPTABLE

1. Wire strands extend onto lug tongue flat.

2. The insulation grip indent is poorly formed and will not provide adequate gripping.

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FIGURE 67 – CONNECTOR CONTACTS – CRIMPED

A. CUT-AWAY

1. Insulation of wire is inserted until it bottoms in the insulation support.

2. Insulation support.

3. Wire strands extend beyond inspection hole and wire is properly seated so as to be visible through inspection hole.

4. Inspection hole.

B. PREFERRED

1. Example

(a) Wire strands are visible through inspection hole.

(b) The cut end of the wire insulation bottoms in the insulation support.

(c) The connector is crimped midway between the inspection hole and the shoulder of the insulation support.

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B. (continued)2. Example

a.Left pin: insulation is fully inserted in insulation support well.

b. Right pin: insulation has been evenly trimmed and butts neatly on rear of contact (see arrow). Where no inspection hole exists, a small insulation gap should exist to permit inspection of wire strands.

c.Conductors are bottomed in the their support wells and visible through the inspection hole.

C. ACCEPTABLE

1. Left pin: conductor insulation is not bottomed in insulation support well, but is approximately 1/32 from bottom of well.

2. Right pin: exposed wire strands are approximately 1/16 inch from rear of contact.

3. Conductors are visible through inspection hole.

4. Crimps are properly positioned and well formed.

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D. ACCEPTABLE MINIMUM

1. Example

(a) Right pin: wire insulation is not fully inserted in insulation support well, but no bare strands are visible outside support well.

(b) Right pin: wire strands are visible through inspection hole.

(c) Right pin: crimp is properly positioned and well formed.

(d) Left pin: Crimp located on shoulder radius is minimally acceptable. Crimps that extend onto the flat of the shoulder shall be rejected.

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D. (continued)

2. Example

(a) Left pin: wire insulation is not fully inserted in insulation support well, but no bare wire strands are visible outside the support well.

(b) Right pin: wire strands are exposed but do not exceed the maximum distance from rear of contact barrel (1X wire diameter plus 1/16 inch).

(c) The crimps are properly formed and wire strands are visible through inspection hole.

NOTE: When the inspection hole is located in the crimp area, a crimp over the inspection hole shall be permitted provided that the wire strands are visible and the integrity of the pin remains intact.

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E. UNACCEPTABLE

1. Insulation is not seated in insulation support. Bare wire strands are at lip of support well and could kink or break (see arrow).

2. Wire is not visible in the inspection hole. This can occur when wire is not sufficiently stripped or improperly seated.

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E. (continued)

3. Crimps over inspection hole, when inspection hole is located outside of normal crimp area, are unacceptable.

4. Example

(a) Left pin: wire strands are visible outside of support well.

(b) Right pin: wire strands extend more that the maximum distance beyond rear of contact.

(c) Wire strands are not visible through inspection holes.

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5.A Crimp Pull Test (Tensile Strength Test) Procedure5.A.1 Objective:

5.A.1.1 This procedure defines the method of performing a Crimp Pull Test. Note: this testing is destructive in nature therefore no product used to perform testing shall be used in customer product.

5.A.2 Responsibilities:

5.A.2.1 The Quality Manager is responsible for ensuring the person performing this procedure is properly trained for the requirements herein and training records kept.

5.A.2.2 The Quality Manager is responsible for all the customer/custom product assemblies.

5.A.3 Procedure:

Scope: Applies to terminals (Ex. Rings, QD, Flags, Forks, etc). Pins and Sockets such as M39029 terminals need to be verified to meet manufacturer requirements. Frequency: Test two samples per day for each wire size/terminal combination.Equipment: Model PT 20 Pull Tester, set to 1”/min pull rate and units of “lbs”. (note: these settings are entered by engineering into machine memory. Once entered, they do not need re-set for production testing.)

Procedure:

1. Assemble two samples (per manufacturer’s instructions, SAE-AS7928, or MIL-C-22520 requirements) to be verified. Ensure strip length extends past the insulation crimp barrel. Ensure wire length will be sufficient for pull test machine.

2. Turn on power to pull test machine. Wait for machine to perform self-test and display numeric value before continuing.

3. Mount terminal in slotted wheel so wire extends toward the wire clamp. Rotate wheel if needed to select slot that will hold terminal without binding the wire.

4. Reset the display to zero by pressing the middle button marked “C”.5. Begin the test by pressing the button on the right marked “V”.6. When test is complete the wire clamp will return to it’s home position.7. Record displayed value on Pull Test Log sheet with all Job, Wire, and Terminal data completed.8. Sample passes test if displayed value is greater than min. value specified by Mfr, AS7928, or

MIL-C-22520 specification.

5.A.4 Quality Records

• Initialed Work Order• Reject Tag if necessary• F762 Pull Test Log

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SECTION 6: LACING, TYING, WRAPPING and SECURING ELECTRIC CABLE and WIRE HARNESSES

Tie-Wrap/Lacing requirements and workmanship/inspection criteria is contained in IPC/WHMA-A-620 and IPC-A-610/CLASS 3. Sarica also works to customer drawings and requirements for lacing, tying, and wrapping needs.This section details the workmanship standards for the materials, equipment, procedures, and controls used by Sarica Manufacturing for lacing, tying and securing electric cable and wire harness.

This section is applicable to all lacing and tying of electrical wire bundles produced. It is to be used as a standard when the engineering drawing does not specify documentation. The use of impregnated beeswax lacing tape is not allowed. The cleaning of wax impregnated lacing tape with solvents is not allowed. Cleaning of Cable and Harness assemblies must be done prior to lacing, tying or wrapping of units, and after build clean if necessary.

This section covers three basic methods for tying wire groups and bundles:

• The Spot Tie Method• The Plastic Tie Strap Method• The Adhesive Tape Method

NOTE: Continuous lacing is only used when specified on the engineering drawing.

6.1 Materials

6.1.1 Requirements for Materials Used for Lacing ,Tying and Securing

Materials used in this specification for lacing, tying and securing shall meet the requirements set forth by the manufacturers, Types I, II, III, IV, and V. All raw materials are white in color. If a special color is required per print, the finish color of the tape shall comply with the light and dark limits of MIL-STD-104. Use a dark green colored tracer in all tape containing Nomex. Restraining devices and lacing tape that exhibit any minor fraying, nicks, or wear are rejected

NOTE: Materials used shall be specified on the applicable engineering drawing.

6.1.2 Nylon Varnish/Electrical Insulating Enamel

To minimize fraying of lacing and tying tape or to ensure that knots do not slip, the use of materials listed inTable 3 is acceptable

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TABLE 3

Vendor Name Vendor Part Number Where Used

Nycote 88 Multi - Not on Type IV Tape

Nycote 7-11 Multi - Type IV Tape

General Electric Glyptal #1201 Multi - Not on Type IV Tape

6.1.3 Requirements for Plastic Tie Straps

Materials used in this specification for plastic tie straps to wire bundles shall meet the requirement set forth in SAE AS33671. (Sarica # MS3367-4-9)

6.2 Requirements for Adhesive

6.2.1 Equipment

• Side cuts or equivalent• Solder iron• Lint-free gloves or finger cots (If dealing with ESD Sensitive Devices refer to the ESD section of this

document)• Adjustable hand tools for installing plastic cable straps• Calibrated scale

NOTE: All tools shall be inspected by the operator prior to usage to ensure that tools are not in disrepair or unclean. All cable and harness assemblies must be clean and free of all extraneous matter such as but not limited to insulation slugs, wire clippings or any other item not required to be present.

6.3 Requirements

6.3.1 Spacing of Spot Ties on Wiring Bundles

Spacing of spot ties on electric wire bundles shall in general be determined by considering existing conditions such as breakouts, bends, rigidity of bundles, irregular bundle size and shape, and wire size. For preferred spacing of spot ties, maximum spacing, and exceptions to these spacing requirements, reference Table 4.

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TABLE 4Spacing of Spot Ties

Bundle Diameter Preferred Minimum Spot TieSpacing

Maximum Spot Tie Spacing

½ inch and less ≈ ½ inch 1–½ inch

+½”–1” ≈ bundle diameter 1–½”

Over 1” ≈ bundle diameter Bundle diameter + ½”

6.3.1.1 Spacing of Spot Ties on Wire Harnesses: Spot ties on wire harnesses shall be spaced 3” to 12” apart, except as noted.

NOTE: Double spot ties may be placed on harness assemblies at the breakout of major harness bundles. Reference Figure 68G.

6.3.1.2 Spacing Exceptions: The following exceptions apply to the spacing between spot ties on wire bundles:

• Curved Bundles

Spacing of spot ties on curved bundles shall be close enough to maintain compactness of the bundle.

• Breakouts

Spot ties shall be located at breakouts as shown in Figure 68.

FIGURE 68Securing of Breakouts

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6.3.2 Routing and Tying Wires at Bundle Breakouts

The following requirements apply when routing wires and applying ties at bundle breakouts:

• Make the wire bundle breakouts on the side of the main bundle facing the direction in which the breakout is to be routed.

• Do not route the breakout bundle across the parent bundle.

• When routing the breakout, do not go below the minimum bend radius of the largest wire in the breakout group. The minimum bend radius is defined as three (3) times the wire including the insulation’s thickness or cable thickness. Shielded Cables including RF Cables minimum bend radius is defined as (6) times the wire including the insulation’s thickness or cable thickness.

• Install the bundle ties in front of, behind, and on the wire bundle breakout at a distance no greater than one (1) inch from the breakout point as illustrated in Figures 68A and 68B.

• HIGH VIBRATION REQUIREMENT: Use a slip resistant tie at all breakouts to positively prevent slippage. The detail of this method is described in this section and shown in Figure 68F.

FIGURE 68ABundle Breakout and Crossover

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Bundle Breakout and Crossovers

• If the breakout requirements cannot be met due to a limited ability to route the wires or adjust the bundle, isolate the crossover area by tape wrapping the main bundle or sleeving the breakout as shown in Figure 68C. Apply per drawing requirements.

FIGURE 68CProtection of Crossover Areas on Wire Bundles

• If the wires contained in a breakout of five (5) wires or less approach the breakout point from opposite directions, the following requirements apply. Reference Figure 68D.

Step 1: Route the breakout wires to the side of the bundle where the breakout occurs.

Step 2: Place the breakout wires in parallel and adjacent to one another.

Step 3: Tie the bundle or group on both sides of the breakout a maximum distance of one(1) inch before the breakout occurs.

Step 4: Place a tie at the breakout point to form a loop with the breakout wires.

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Step 5: Tie the breakout wire group together at a maximum distance of one (1) inch from the breakout point.

FIGURE 68DTying Breakouts with Wires Approaching from Opposite Directions

(Five Wires or less in the Breakout)

• If a breakout contains more than five (5) wires and those wires approach the breakout point from the opposite direction, then the following requirements apply. Reference Figure 68E. This method may be used as an alternate to the method described for breakouts with five (5) or less wires.

Step 1: Route the breakout wires to the side of the bundle where the breakout occurs.

Step 2: Place the breakout wires in parallel and adjacent to one another.

Step 3: Tie the bundle or group on both sides of the breakout a maximum distance of one(1) inch before the breakout occurs.

Step 4: If the wires in the main bundle tend to spread apart at the breakout point, place a tie on the main bundle or group at the breakout point.

Step 5: Do not place the breakout wires under this tie.

Step 6: This is an optional requirement to be applied only if necessary to keep the wires in the main bundle together.

Step 7: Tie the breakout wire group together at a maximum distance of one (1) inch from the breakout point. This will form a triangular window as shown in Figure 68E.

FIGURE 68ETying Breakouts with Wires Approaching from Opposite Directions

(More than Five Wires in the Breakout)

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6.3.2.1 Slip Resistant Tie for High Vibration Applications

Step 1: For wiring on which ties tend to slip, make the ties by passing an initial loop through the bundle prior to making the clove hitch (Reference Figure 68F).

FIGURE 68FSlip Resistant Loop Tie

Step 2: Tighten the clove hitch on the opposite side of the bundle from the initial loop.

Step 3: Tie a square or surgical knot over the clove hitch as shown in Figures 70C and 70D.

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FIGURE 68GExamples of Spot Tying

6.4 Termination Points

Spot ties shall be located on wire bundles at termination points, in a manner similar to that shown in Figure 69, to permit at least one identification number between tie and terminating end.

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FIGURE 69Stitches or Spot Ties at Termination Points

6.5 Boot Areas

Spot ties are not required in boot areas.

6.6 Conduit or Flexible Tubing

Wires in conduit or flexible tubing shall not be secured together using spot ties.

6.6.1 Strain Relief

Clamps, as specified on the drawing shall support cables, harnesses or individual wires to prevent wire movement That may place strain on the wire / connector terminations .Split lock washers incorporated as part of the backshell or strain relief clamp shall be fully compressed .If the number of wires terminating into the connector is insufficient to allow the strain relief clamp to grip the wires properly then material shall be used to build up the bundle diameter to provide contact and support between cable and strain relief clamp. Build up material may be insulating tape, sleeving or a grommet

6.7 Connectors without Strain Relief Clamps

Step 1: Form wires and bundles so as to minimize and prevent stress on wires and connectors due to wire bends and clamping during installation .Wire groups and branches of 2 or more adjacent parallel wires are secured using approved devices.Step 2: Untangle wires as much as possible before tying into bundles. This is a general guideline for workmanship. Some crossing of the wires may be unavoidable depending on the direction a wire needs to be routed. This condition is acceptable. Run all wire as parallel as possible.

Step 3: Place the first bundle tie a minimum of one (1) inch from the face of the rear grommet for shell size 14 and smaller.

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NOTE: Place the first bundle tie a minimum of one and one half (1.50) inches from the face of the rear grommet for shell size 16 and larger connectors.

6.8 Application of Bundle Ties

6.8.1 Number of Ties

Tie wire groups or bundles using the minimum number of ties necessary to provide support and to hold the bundle shape at bends and breakouts, and to keep wires in place when installed adjacent to moving parts.

6.8.2 Junction and Terminal Boxes

Tie the wires inside junction or terminal boxes together to prevent interference with the removal of other wiring and equipment.

6.8.3 Tying to Terminals

Do not support wire groups and bundles by tying the bundles to terminals.

6.8.4 Breakouts Made of AWG 22 or Smaller

Do not support wire groups and bundles with wire breakouts made of AWG 22 or smaller.

6.9 Tying Methods for Plastic Tie Straps

Do not use plastic tie straps for High Vibration applications.

Select the tying strap from the print.

6.10 Tying Methods for Tape

When using pressure sensitive banding tape, use the methods in this document to tie the bundle.

6.10.1 Spot Tie Method

6.10.1.1 Procedure

Tie knot per Figure 70A. Pull the knots tight and remove excess tape. Leave .38 to .50 inch of tape extending beyond the securing knot. The tolerance is not critical.

NOTE: If working in restricted spaces, use Figure 70E Modified Clove Hitch with either a square knot or surgical knot.

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6.10.2 Type II Tape

Type II tape has a non-slip treatment, which makes it difficult to pull the clove hitch or slipknot tight. It is permissible, after pulling a clove hitch tight, to rotate the ends of the tape 90º as shown in Figure 70A, to maintain tightness during tying of the securing knot. Slipknots made of Type II tape can be pulled tight by pulling the tape ends in opposite directions prior to tying the securing knot.

6.10.2.1 Type II Tape Knot Ends: Type II tape knot ends may be cut to a minimum of .20 inch if the tying knot is on a small bundle in a close breakout area, and if the tape ends are cut or seared with a solder iron.

FIGURE 70AClove Hitch and Surgeon’s Knot

FIGURE 70BSlip Knot and Surgeon’s Knot

FIGURE 70CClove Hitch and Square Knot

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FIGURE 70DModified Clove Hitch and Surgeon’s Knot

FIGURE 70EModified Clove Hitch for Areas with Restricted Work Space

(Square Knot Shown)

6.10.2.2 Uniform Length of Knot Tape Ends: Cut knot tape ends uniform in length.

6.10.3 Cut Ends of Type III Tape

After tying Type III tape, place a drop of G.E. Glyptal #1201 or equivalent on the knot and cut ends. Apply only enough enamel to secure the knot and cover the cut ends.

6.10.4 Securing with Pressure Sensitive Tape6.10.4.1 Procedure: On lengths less than 12 inches or diameters less than 1.5 inches and containing wires no

larger than 10 AWG, Polyester or Teflon pressure-sensitive tape may be substituted for spot ties or lacing tape. Wrap the tape around the wire groups or bundle three (3) times with a two-thirds (2/3) overlap for each turn.

NOTE: When wrapping tape by hand, avoid touching adhesive with fingers.

6.10.4.1.2 Spacing of Spot Taping: Space the spot taping per section above or per drawing requirements.

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6.11 Protecting Wire at Multiconductor Splices

Place a tie over any multiple conductor splices (Reference Figure 71) containing AWG 16 or smaller wire if the splice is not already supported by an overall wire bundle or group sleeve.

When two or more splices are located in the same area, a single tie may be used provided the tie is located directly over some metal portion of all splices.

FIGURE 71Bundle Tie over Multiple Conductor Splice Terminations

6.11.1 Tying of First Wire Breakout for Multiconductor Cables

Do not exceed one (1) inch for the unshielded distance between the shield termination and the first wire breakout point of the multiconductor cable, unless otherwise specified on the engineering drawing (Reference Figure 72).

FIGURE 72Tie Spacing for First Wire Breakout

6.11.2 Plastic Tie Strap Method

This section details requirements and procedures for applying plastic tie straps to wire bundles (Reference Figure 73). Unless otherwise indicated, plastic tying straps may be used as an option to Grade A lacing and tying tape for wire bundle ties.

6.12 Exception Areas

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Do not use plastic tying straps in areas where:• The engineering drawings prohibit the use of plastic tie straps.• Failure of the strap permits wiring to move against unprotected abrasive surfaces or to foul

mechanical linkage.• The strap fastener head abrades adjacent wires.• There is high vibration.• Sections of bundles or groups contain coaxial cable.

6.12.1 Military Programs

For military programs plastic strap shall be white in color unless otherwise specified on engineering drawing. If special color is required, the strap shall meet SAE AS33671 standard color coding schemes.

FIGURE 73Plastic Straps

6.12.2 Installation Tie Wrap Using Manual Tooling

• Check to see if the assembly is cleaned prior to the wrap application clean if needed.

Step 1: Select the strap to be used from print.

Step 2: Select the corresponding tool for the strap from manufacture instructions.

Step 3: Set the tension on the installation tool using the settings in Table 5 as a guide. Adjust as necessary to meet the following criteria:

• The installed strap must be tight enough to keep from slipping during normal handling and transport.

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• The installed strap must grip securely so as not to slip along the bundle unless forced by hand but, at the same time, not bind the bundle so tightly as to deform the wire or cable.

Step 4: Place the strap around the wiring with the ribbed side in.

Step 5: Thread the tapered tip of the strap through the slotted head of the strap and draw snug.

Step 6: Slip the nose guide of the installation tool over the strap tip.

Step 7: Pull the trigger of the tool until the strap is tightened.

Step 8: Using following procedure, cut the strap flush to the strap head’s surface to eliminate cuts and scratches from protruding strap ends.

1. Hold the tool’s face snugly and squarely against the strap’s head before cutting the strap. 2. Press the cutting tool firmly against the strap head to position the cutting edge at the lowest

possible point on the protruding strap. 3. Cut the strap: the end of the strap should be flush to the strap head when viewed by the unaided

eye.4. Properly installed TY-903 and TY-904 straps have the cut off ends twisted 90º and aligned in

the slot of the strap head.5. No dimensional check is required when using this procedure.

TABLE 5ST9M559CableStrap

1/ConnectorShell Size

Wire Bundle(s) Diameter (Inches) MS90387-2 ToolTension Settings

Minimum Maximum

-1 8–19 - - 6

-3 and -35 20–25 - - 8

-1 - 1/16 1¾ 6

-3 - 3/16 3½ 8

-35 - 3/16 2 8

NOTE: 1/ Use -1 strap with M85049/57-24A and M85049/63-20 and -22 backshell.

6.13 Spacing between Stitches

Make the space between the stitches of length (L) according to the bundle diameter (D) as illustrated in Figure74.

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FIGURE 74Continuous Lacing Tie

NOTE: Continuous Lacing is not permitted on the F18 program

6.13.1 Inadequate Lacing

Lacing shall not be spliced. If the length of lacing to tie a bundle is inadequate, it shall be terminated and a new length shall be started two stitches back from the end of the initial length.

6.13.2 Lacing Direction

The lacing direction for lock stitching is optional.

6.13.3 Starting and Finishing Knots

A double lock stitch shall be used immediately after a starting knot and immediately before a finishing knot (Reference Figure 75).

6.13.4 Broom Stitches

Broom stitches along wire bundles shall be placed at intervals not to exceed one inch (Reference Figure 76).

FIGURE 75Starting and Finishing Knots

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TABLE 6Continuous Lacing Tie Spacing

D (inches) L (inches)

Less than 0.5 0.75 ± 0.18

0.5 to 1 1.50 ± 0.38

Greater than 1.0 2.0 ± 0.56


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FIGURE 76Types of Broom Stitches

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6.4 Safety

6.14.1 Responsibility

The enforcement of and adherence to safety regulations and procedures is the responsibility of the supervisory personnel in the department.

6.14.2 Precautions

Materials used in this process are flammable. They are also toxic and as such must be handled with extreme care:

• All flammable materials shall be kept in approved containers and disposed of properly.• Personnel handling any of these materials shall exercise caution.• Before eating or smoking, operators shall wash their hand thoroughly with soap and water.• Review the required MSDS sheet prior to using any of the materials for any special handling

precautions or to find the proper personal protection equipment. MSDS is the controlling document.

CAUTION: Type III Tape shall not be heated to temperatures above 400° F (204° C)

6.15 Cleanliness of Work Station

At work stations, dust and dirt shall not be allowed to accumulate to visible levels. Cleaning shall be performed on a regular basis to prevent such accumulation. To prevent contamination of hardware and to meet OSHA requirements, eating, drinking, and smoking at the workstation shall not be allowed.

6.15.1 Knot Slip Resistance

The application of an additional finish to type IV glass tape with a tetra fluorocarbon coating may be used when knot-holding characteristics are desired.

6.15.2 Acceptance Criteria

A unit that does not meet the requirements of this specification shall be rejected.

6.15.3 Cause for Rejection

Evidence of any of the following shall be cause for rejection. This list does not include all defect criteria found in this specification. Inspection shall be performed 100% on all knots and lacing found on wire bundles. Defects shall be documented. Rework shall not be performed until the defects have been documented.

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• Wires tangled and routed improperly• Wrong tying material used• Bundles are tied to a terminal for support• Tying material frayed• Spot ties are too far apart for the applicable situation• Spot ties are too close for the applicable situation• Wrong plastic Ty-wrap was used• Breakouts are located in the wrong location• Spot ties on breakouts are improperly located• Continuous lacing stitches are in wrong location• Knot slips when finger pressure is applied to the knot• Plastic tying strap is prohibited by blueprint• Failure of the strap permits the wiring to move against unprotected abrasive surfaces or to foul

mechanical linkage• Strap fastener head abrades adjacent wires• Plastic tying straps have been used in a high vibration area• Plastic tying straps have been used on bundles containing coaxial cable• Plastic tying strap is loose• Plastic tying strap is not cut off flush to the strap head when viewed by the unaided eye

6.16 Wire/Harness Installation

As an exception to the above inspection criteria, inspection may be used when performed as part of a process inspection system that is fully documented and subject to review. The process inspection system shall, as a minimum, include the following elements:

• Training, commensurate with their responsibilities, shall be provided to personnel assigned to the development, implementation, and utilization of process inspection.

• Quantitative evidence shall be maintained that the process is in inspection control and is a capable process.

• Sampling techniques shall be consistent with data collection requirements for maintaining inspection controls.

• Sampling may be used unless the defect rate is high. When processes become out of control, revert to 100% inspection for the lot that is represented by the sample lot.

• When defects defined in this specification are identified in the inspection sample, all wire bundles in that lot shall be 100% inspected for other occurrences of that defect or defects. The re-inspection of the lot shall be documented.

• When the wire approaches the terminal with a loop or a bend sufficient to relieve any tension on the connection during thermal/vibration stress.

• Wire is formed around terminal opposite to the feed-in direction, bends cannot have kinks.

6.17 Cable and Wire Harness, Bend Radius

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Bend radius is measured along the inside curve of the wire or wire bundles. The outside diameter of the wire or cable, including insulation. Harness assemblies minimum bend radius requirements is the minimum bend radius of any individual wire /cable with in the harness. The harness is installed to meet required form, fit and function.

6.18 Braided Shield

Braided sleeving is to be secured at the ends by spot ties, clamps, tape or heat shrink tubing. When secured, the covering will not slide freely. The mesh maybe folded under, adhesive bonded, hot knife seared or other process is used to prevent fraying. Temporary holding devices shall be removed from wire bundles prior to braid application. The braided strands must be smooth and evenly placed. When required by drawing, install a separator between the cable /harness and the braid to protect the cable from potential damage. When braid is not terminated it is covered with a heat shrink sleeve.

6.18.1 Adhesive/ Nonadhesive Tape protective coverings

Applying Tape as a protective covering adhesive or nonadhesive the tape overlap for class 3 is 25% but 50% of the tape width. The tape must conform to the wire bundle shape. The tape ends must be secured. Follow manufacturer’s instructions when not called out on drawing.

6.19 Braid – Prewoven

Prewoven braid is to be secured at the ends by spot ties, clamps, tape or heat shrink tubing. When secure, the covering will not slide freely. The mesh may be folded under, adhesive bonded, hot knife seared or other process used to prevent end fraying. For breakouts and branches the sleeving is not to be cut to allow passage of the wire. Direct applied braids are back braided to lock the weave. Depending on the weave the strands may be separated to allow wires to pass through. The braid must be smooth with firm contact against the wires, free of ballooning or bunching. Ends secured with no fraying or unraveling. Multiple braids over lap at least 2 bundle diameters.

6.20 Routing of Wiring, Cables, and Harnesses

6.20.1 Wiring Layout

The relative position of single or

Minimum Bend Radii

Single Wire 3x wire diameter

Twisted Wire 3x wire diameter

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Shielded Cable(Including RF Cables)

6x cable diameter

Radial twisting of harness or cable wiring is permissible provided the twisting exhibits uniformity.

6.20.2 Typical Methods of Wire Dress (Wire Routing)

Spot tying or plastic tie straps may be used to enhance neatness and preserve the dress but the strain relief loops shall not be tied or prevented from moving freely. The requirements for service and strain relief loops are shown in Figures 45 and 46.

6.20.3 Securing Harness

6.20.3.1 Cable Clamping

• Clamps shall be used to hold the wiring securely, unless it is only for routing. (Reference Figure 51)• Clamps shall not deform the outer conductor of coaxial cable.• Clamps shall be securely fastened to the chassis, and they shall be aligned with the routing of the

wiring.• Solder sleeves may be placed under the clamp(s) as long as the following conditions exist:

The clamp is not tight around the solder sleeve. The clamp does not compress or deform the solder sleeve.

• When the specified clamp is too large to secure the wiring, approved electrical tape may be wrapped around the wiring. The width of the tape shall be greater than the width of the clamp.

NOTE: Clamps and Tape used shall be specified on the applicable engineering drawing.

6.20.4 Identification Markings

Markings on the wires, cables, and harnesses shall be legible.

Identifying bands shall be firmly attached to the wiring and shall be oriented to permit easy reading. Whenever possible, the marking should be readable from the same side as the component's markings.The maximum spacing between individual wire numbers shall be 6 inches or less from their termination point, and the wire numbers shall be oriented to permit ease of reading.

6.20.5 Termination of Overall Shields

The overall shield shall be loosened by pushing it back over the cable conductors.

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The cable shall then have a piece of heat shrinkable insulating tubing applied over the folded- back shielding.

The tubing shall be shrunk in place.

The tubing shall completely cover the shielding and extend approximately ¼ inch beyond the fold back point on the shield (Reference Figure 52).

On inside type cable or harness having no outer sheath:

A piece of heat shrinkable tubing shall be applied over the wire bundle approximately ¾ inch back from the cut end of the shield and extending approximately ½ inch.

The shield shall be loosened by pushing the shield back over the conductors. The loosened shield shall then be folded back over the previously applied tubing and pulled taut. A second piece of insulating tubing shall then be applied over the folded shield and extend from the

fold point on the shield to at least ¼ inch beyond both the previously applied tubing and the shielding. The tubing shall then be shrunk in place.

6.20.6 Stripping Dimensions for Shielded Wires

The exposed shielding must be ¼ inch (± 1/32 inch), and an inner Teflon sleeve ¼ inch long shall be used between the shield braid and the conductor wires and shall be positioned as far back under the braid as possible.

The length of the shielded cable conductors shall be from ½ inch to 2 inches from the end of the shield.

SECTION 7: WIRE PREPARATION AND MARKING/LABELING

7.1 Twisting of Wires

This criterion applies to all cable or harness bundles, the length of lay (or twist) as measured from the midpoint of wires crossover through a complete spiral to the next crossover midpoint of the same wire shall be 8 to 16 times the outer diameter of the bundle (Reference Figure 3-9 in the IPC-620).

7.2 Wire Stripping

Strand/Braid wire conductor ends are cut perpendicular to the wire longitudinal axis. All of the strands are the same length. Wire ends that fit into connectors must be cut to the manufactures length requirements. Wires that are scraped, nicked, cut, flattened, scored, or otherwise damaged are not acceptable. Mechanical hand strippers are the non-adjustable fixed die type that are used. Wire cutting machines will be inspected by plant maintenance every three months. Wires are handled to minimize contamination, and wires are inspected after

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stripping for any damage. Braid /Shield cable is manufactured using different shield configurations that give different percentage of coverage values.

7.3 Marking / labeling

Marking and Labeling are referred to as marking. Marking is not required unless specified on the controlling document. When the marking method is used markings shall contain the required information, be legible, be permanent in the intended application, and shall not damage the product or impair its function. If needed surfaces are to be cleaned prior to being marked. Sleeves are rejected if they have splits or holes. Marking inspection is to be performed without magnification. Prior to delivery any nonpermanent markings are removed from product.

7.3.1 Shrink Label Sleeves / Tooling

Inspect label for cleanliness, clean if needed in preparation to print/install Install label on cable in correct direction and location Turn heat gun on low setting and adjust as needed to complete task without causing damage to product Rotate cable until label shrinks tight on to cable

7.3.2 Wire Insulation

Insulation has to be trimmed neat with no signs of pinching, pulling, fraying, discoloration, cuts, breaks, cracks, splits, charring or burning. Slight discoloration of insulation from thermal processing is permissible

Insulation clearance of 1 wire diameter between the end of the wire insulation and the top of the solder fillet.

Insulation thickness shall not be reduced by more than 20% Insulation shall not have uneven or ragged pieces of insulation (fray, tails, tags) greater than 50% of the

insulation diameter of 0.039 inches whichever is less.

7.4 Connection Requirements

The wrap condition achieves a mechanical connection between the wire and terminal. Typically the mechanical connection includes a 180° wrap. Wire ends that overlap are rejected.

Wire is permanently staked by a permanent mounting device. Wire contacts base of terminal or the previous wire. Wire extends through post of bifurcated terminal. Wire contacts 2 sides of pierced/perforated terminal

Knowledge and proficiency shall be subject to Quality Control audits. Excessive wire length when dressing wires into connectors is rejected.

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SECTION 8: REWORK and MODIFICATION

Rework workmanship/inspection criterion is contained in the IPC-7711/IPC-7721 shall be performed with Preliminary Review Process Authority and/or within the terms of MRB Authority granted under the contract or with customer approval on single, double sided, or multiple layer boards (top and bottom layers only), no inner layer repairs. Sarica if required will follow customer’s detailed requirements for rework as far as procedures, equipment, tooling, methods and materials. The number of reworks per location on cables, wires, or harnesses is only limited by the assembly drawing or specification with respect to physical dimensions unless otherwise specified by customer. Rework is documented thru the corrective action and or the rejection tag programs. No used parts may be used unless authorized by engineering. Once testing is complete assembly must go through inspection process again. After the rework is completed, if needed, a cleaning step may be required and masking of areas that are incompatible with the cleaning process. Any testing that was previously done must be redone in areas that have been affected. Material handling and storage of components used will meet standard requirements. All assemblers have completed required training for rework requirements.

All items to be cleaned shall be cleaned by methods within this manual.

8.1 Repair

No repair of any type shall be done on circuit card assemblies or printed wire boards, unless specifically authorized in writing by customer.

8.2 Rework Wave and Reflow Soldering

Solder wave flow and reflow soldering may only be repeated once, unless otherwise authorized in writing by customer.

8.3 Rework Hand Soldering

Hardware defects shall be documented on reject tag before rework. Rework includes hand solder touch up after mass soldering operations. Rework does not include a second application of a soldering iron during a hand soldering operation on a single connection. The number of manual reworks per solder joint shall be limited to a maximum of three times. Rework procedures shall be in accordance with IPC-7711 Class 3.

Tools and equipment shall be selected, used and maintained such that no damage or degradation that would be detrimental to the designed function of parts of assemblies would result from their use. Soldering equipment used for reworking shall be approved by engineering before rework process has started. If specialized tooling is used for rework or removal or components or assemblies operators shall be instructed by engineering for proper use, this may include specific temperature profiles for component type.

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SECTION 9: I N ST A LL A T I O N OF BOLTS, NU TS, S CR EWS AN D T O R Q U E R EQ U I R E M E N TS AND STRAIN RELIEF

This specification details procedures to be followed by Sarica Mfg. for installation of all bolts, nuts and screws.

9.1 Effect of Surface Coatings

When a detail part has a final surface coating of paint, primer, etc., the dimensional limits apply before painting.

9.1.1 Length of Screw Engagement

Whenever practicable and for highly stressed applications, the length of thread engagement into "blind" holes shall be one and a half times the outside diameter of the screw or bolt. In normal applications, screws or bolts shall have a minimum engagement length equal to their nominal diameter in tapped parts other than nuts.

"Blind" holes are holes drilled and/or tapped in castings and/or other thick materials where through-hole drilling and tapping would be impractical.

TABLE 7 lists several common screw or bolt numbers (or sizes), their basic major diameters and the minimum length of engagement (One and a half times the outside diameter).

TABLE 7

No. Outside Diameter (inch)

Length of Engagement (inch)

Number orSize

Outside Diameter (inch)

Length of Engagement (inch)

0 0.060 0.090 1/4" 0.250 0.375

1 0.073 0.110 16 0.268 0.402

2 0.086 0.129 18 0.294 0.441

3 0.099 0.149 5/16" 0.3125 0.469

4 0.112 0.168 20 0.320 0.480

5 0.125 0.188 22 0.346 0.519

6 0.138 0.207 24 0.372 0.558

7 0.151 0.227 3/8" .0375 0.563

8 0.164 0.246 26 0.398 0.597

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9 0.177 0.266 28 0.424 0.636

10 0.190 0.285 7/16" 0.4375 0.657

14 0.242 0.363 1/2" 0.500 0.750

The length of engagement (Reference TABLE 7) applies to both tapped holes and to holes with helicoil inserts.

9.2 Selection of Fastener

The following shall be used as a guide to the selection of bolts, nuts, and screws.

9.2.1 Nuts

Nuts, other than those specified on the Drawing, may be substituted, only if authorized by MRB, DDA, or drawing revision. Self-locking nuts shall not be reused.

For installation, removal and replacement of self locking screws and nuts shall be preformed to manufacturer’s recommendations.

9.2.2 Threaded Fasteners

Bolts or screws lengths shall meet the applicable engineering drawing for manufacturing torque values. Be sure that none of the bolt threads are in the bearing area of the hole and that the shank of the bolt does not bottom in the nut.

Bolts with drilled heads may be used in lieu of bolts without drilled heads (Bolts without drilled heads shall never be substituted for bolts with drilled heads).

Bolts 1/4 inch in diameter or smaller, or used with self-locking nuts, shall not have "cotter pin" holes.

Bolts and screws shall run "free" enough to engage the threads of the threaded section (up to the locking device, when applicable) using the hands only (without the aid of a tool). Bolts that have been over torque are discarded.

9.2.3 Fastener Flushness Requirements

General Fastener flushness requirement is ± .010. Flushness on a contoured surface shall be measured as shown in Figure 77 or Figure 78.

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FIGURE 77Concave Surfaces

Measure flushness only at the points indicated in Figure 77 or Figure 78, as applicable.

NOTE: Measure flushness at point indicated by X.

9.3 Safety Wiring

FIGURE 78Convex Surfaces

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The following procedure must be followed when safety wiring, using self-locking nuts or lock washers.

9.3.1 Safety Wiring Requirements General Purpose

When locking devices such as cotter pins, lock wire or tab-lock washers or other thread locking agents are specified on the applicable Engineering drawing and applied per manufacturer’s specification the following requirements apply. Torque values are adjusted to compensate for additions to torque tool.

When securing castellated or slotted nuts, the center of the hole in the fastener shall not extend beyond the end of the nut (Reference Figure 79).

In all instances, the bolt or screw shall have a minimum of one and one-half threads projecting beyond the nut. This requirement ensures adequate thread engagement.

If lock wire is used, it shall be carbon steel zinc-coated wire applied per the manufacturer’s specification. Exceptions to this requirement shall be noted on the approved applicable drawing.

The size of the lock wire to be used shall have a minimum diameter of 0.032 inch for general purpose safety wiring. Lock wire of 0.020 inch may be used on small parts having holes with a nominal diameter of 0.045 inch.

Carbon steel zinc-coated wire, 0.041 inch in diameter, and/or Inconel wire, 0.040 inch in diameter, may be used where small diameters of corresponding wire are specified on the approved drawing, provided there is no interference occurring as a result. Exceptions to this requirement shall be noted on the approved applicable Sarica Drawing.

9.3.2 Safety Wiring Emergency Devices

FIGURE 79

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When safety wiring is required by the Drawing, copper wire, 0.020 inch in diameter, complying with safety wiring emergency devices

NOTE: Use only 0.020-inch diameter wire.

9.3.3 Installation of Lock wire

Lock wire shall be installed only one time. If for any reason the lock wire has to be removed, new lock wire shall be used for each subsequent installation.

Under no circumstances shall the lock wire be reused.

Avoid nicking and sharp bends (kinks) when installing the lock wire. If either of these conditions occur, replacement is mandatory.

The lock wire shall be as short as possible and it shall be attached in the most direct manner. The twisted pair method of safety wiring shall be used.

When safety-wiring widely-spaced multiple fastening units, the number of fastening units that can be accommodated with a twenty four inch length of wire shall be the maximum number in that series. Parts shall be safety-wired in such a manner that the safety wire shall be put in tension in the event the fastening unit starts to loosen. The pigtail end of the wire shall have a minimum of three and a maximum of six twists and it shall be bent back or under (in a direction that would increase tension) to prevent it from snagging.

The single-wire method of safety wiring may be used only on small screws in a closely spaced "closed" geometric pattern (triangle, square, rectangle, circle, etc.), on parts in electrical systems and in places that are difficult to reach.

Safety-wire passing around the fastening unit is preferred. Safety-wire passing over the fastening unit is acceptable, where clearance is not a consideration and when there is no danger of the wire being sheared from above.

Installation shall be as shown in Figure 80.

NOTE: All illustrations shown in Figure 6 are for right-hand threaded fasteners; reverse the placement of the safety-wire for left-hand threaded fasteners.

Table 8 illustrates the number of twists per inch and Figure 80 gives the pictorial view.

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TWISTS PER INCH

FIGURE 80 SAFETY WIRE TWIST DEFINITIONS

9.3.4 Installation of Cotter Pins

Cotter pins shall be installed only one time. If for any reason a cotter pin has to be removed, a new cotter pin shall be used for the new installation.

NOTE: Under no circumstances shall a cotter pin be reused.

Avoid nicking the cotter pin during installation. If this condition occurs, the cotter pin shall be replaced.

There are two approved methods of installing cotter pins:

Preferred Method: One end of the cotter pin goes over the top of the nut Optional Method: The ends go around the flats of nut.

The first method is preferred and should be used whenever possible, except for precautions where human safety is concerned, and in the prevention of interference with clothing and/or equipment. Another exception is flat head pins (Reference Figure 82).

FIGURE

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81

FIGURE 82

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The surface under the nuts and head of the fastener shall provide a complete seat for the nut and fastener, and be reasonably smooth.

The maximum allowable tilt under the head of bolts, screws and nuts, including flush head fasteners shall not exceed 0.005 inch.

9.4.1 Strain Relief Connector

Clamps and supporting cables, harnesses or individual wires to prevent movement may place strain on wire or connector termination. Split washers used as part of the backshell or strain relief clamp must be fully compressed. If the strain relief clamp is unable to grip the wires properly then use the approved material to build up the bundle diameter to provide contact between the cable and the strain relief clamp.

An exception to the maximum "gap" under screw heads and nuts is allowed when the screw or nut is holding a clamp or clamping band to retain a lamp.

9.5 Workmanship Criteria

9.5.1 Screws

Screws secured by nuts, or other retaining devices that permit projection beyond the retaining device shall be of such length to permit a minimum protrusion of 1-1/2 threads and a maximum protrusion of 1/8 inch in addition to the 1-1/2 threads. This shall be for screws with a length up to 1 inch (Reference Figure 83).

Screws whose length is 1 inch or longer, the minimum protrusion shall be 1-1/2 threads and a maximum protrusion of 1/4 inch in addition to the 1-1/2 threads.

NOTE: The requirements above shall not apply for the use of screws assembled in tapped holes in castings, spacers, etc., or where design restrictions require the screw length to be such that the threaded portion of the screw be flush with the retaining device. The ends of the screws shall not be clipped or deformed in any manner to meet these criteria.

9.5.2 General Requirements and Conditions

• Cleaning, if needed, shall be done before application of agents, the application of agents and inspection for contamination must be per manufacturer specifications. Removal of locking agents or corrosion protection shall be per manufacturer specification. The customer requirements shall be met.

• Screws shall be tightened and fully seated.• Screw slots shall not have hanging burrs.• Retaining compound such as Loctite shall not be used unless specified on the applicable

Engineering Drawing.• When using a retaining compound or corrosion protection threads should be free of preservatives

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such as oil or grease prior to application of the retaining compound.• Anti-seize compound can be used on aluminum threads for interior applications unless prohibited by

the applicable Engineering Drawing.• Material shall be used per manufacturing specifications unless drawing requirements are different.

FIGURE 83

ACCEPT

Minimum: At least 1½ threads through the nut.

Maximum: Limited by next larger standard bolt/screw length.

REJECT

Less than 1½ threads through the nut.

9.6 Torque and Stripping Requirements

A specific torque wrench shall be used for torqueing threaded fasteners in critical or high strength applications as identified on the applicable Engineering Drawing (The torque value must also be specified on the applicable Engineering Drawing). The values in Table 9 may be used as general design/assembly guidelines to establish specific requirements when the drawing or router does not specify any requirements. Torque sequence and pattern if required must be on Drawing. Torque striping shall be used on parts when critical torque or installation is required by the engineering drawing, clean the assembly if needed before applying the torque stripe. A torque stripe of a contrasting color shall be applied on an identified part when required by engineering drawing.

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During the following steps keep the torque the same amount on each end of bolt/nut. Use the pattern supplied on the drawing.

• First time around snug up by hand • Second time around tighten firmly with wrench• Third time around apply 25% of recommended torque • Fourth time apply 75% of recommended torque• Fifth time apply 100% of recommended torque• Repeat this process until nut’s/bolt’s do not move under 100% torque

9.6.1.1 Torque Training: A department cross-functional team or Quality Assurance Trainer shall be

responsible for providing procedural and on-the-job training covering at a minimum the reference material outlined in the Torque Training Reference/IPC-620. The department cross-functional team shall consist of the Trainer and Group Leadership. The depth of training shall be department specific as defined by the cross-functional team, thus ensuring the employee demonstrates the knowledge and proficiency required to produce an acceptable torque. Torque wrench adapter is used to extend forward from the axis and is attachable to the torque wrench. Torque wrench extension purpose is to extend forward the longitudinal axis and is attachable to the torque wrench. Torque training will include fasteners with locking features, devices, installation and removal, replacement, and re-use. Torque tools are in Sarica calibration list.

Employees meeting the acceptance criteria for the appropriate workmanship standards, as observed by the department cross-functional team and/or Quality Assurance Trainer shall receive a certification for successful completion of the initial training class and all records of training shall be kept by Sarica.

9.6.2 Refresher Training

Upon return from a scheduled or unscheduled leave or other non-continuous employment, or following revocation, an employee shall be required to complete a refresher program conducted by the department cross-functional team. The department cross-functional team shall determine the level of refresher training required. Upon successful completion of the refresher program, the employee’s certification shall be updated.

9.6.3 Torque Training Records and Recall System

Training shall be documented on the Associate’s Training File. A list of employees successfully completing training shall be maintained in the recall system on the database maintained by the Quality Assurance Trainer. The recall system shall be the primary source of the training recall records.

TABLE 9General Design/Assembly Guidelines

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Size Torque3/8-24 275 in lbs.7/16-14 390 in lbs.7/16-20 430 in lbs.

1/2-13 630 in lbs.1/2-20 675 in lbs.9/16-12 870 in lbs.9/16-18 975 in lbs.5/8-11 1200 in lbs.5/8-18 1350 in lbs.3/4-10 2200 in lbs.3/4-16 2330 in lbs.7/8-9 3450 in lbs.7/8-14 3720 in lbs.1-8 433 ft. lbs.1-14 475 ft. lbs.1-1/8-7 608 ft. lbs.1-1/8-12 667 ft. lbs.1-1/4-7 812 ft. lbs.1-1/4-12 942 ft. lbs.1-3/8-6 1133 ft. lbs.1-3/8-12 1333 ft. lbs.1-1/2-6 1500 ft. lbs.1-1/2-12 1666 ft. lbs.


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Size Torque0-00 16 in oz.1-64 24 in oz.

1-72 32 in oz.

9.7 Flat Head Screws

Flat head screws utilized for flush finished surfaces must be of the correct degree so as to fit the mating countersunk hole (Reference Figure 84).

9.8 Flat Washers and Lock washers

Flat washers and lock washers shall be installed per the application per IPC-620 and or customer Drawing Date Rev. Page9/24/2015 M 181 of 217

2-56 36 in oz.2-64 44 in oz.3-48 56 in oz.3-56 64 in oz.4-40 5 in lbs.4-48 7 in lbs.5-40 8 in lbs.5-44 9 in lbs.6-32 10 in lbs.6-40 12 in lbs.8-32 22 in lbs.8-36 22 in lbs.10-24 29 in lbs.10-32 34 in lbs.12-24 62 in lbs.12-28 62 in lbs.1/4-20 70 in lbs.1/4-28 80 in lbs.5/16-18 140 in lbs.5/16-24 150 in lbs.3/8-16 250 in lbs.


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(Reference Figures 85 and 86).

FIGURE 84

Open Gap

[improper Countersink Depth Gap Exists Under Head

NOT ACCEPTABLE NOT ACCEPTABLE

FIGURE 85

CORRECT USE OF FLAT-HEAD SCREW

FIGURE 86

External Internal Countersunk ExternalInternal

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9.9 General Requirements

All bolts shall be installed perpendicular to the surface on which the bolt head bears. Gaps under the head which permit insertion of a 0.005-inch feeler gauge to the shank shall not be accepted.

Gaps that permit insertion of a 0.004-inch feeler gauge are acceptable, provided the gap is less than forty percent of the circumference.

Externally threaded fasteners shall protrude through self-locking nuts per Table 11.

Only use countersink cutters with the specified radius at the pilot to countersink intersection (Reference Figure 87 and Table 10).

TABLE 10Head to Shank Fillet Relief

FastenerDiameter

Fillet Relief ® (±0.005”)

1/8 in 0.020 in

5/32 in 0.020 in

3/16 in 0.025 in

1/4 in 0.025 in

5/16 in 0.035 in

3/8 in 0.035 in

7/16 in 0.045 in

1/2 in 0.045 in

9/16 in 0.055 in

5/8 in 0.055 in

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FIGURE 87

NOTE: R must lie on the bisector of angle 0 within 2 degrees

TABLE 11Minimum Permissible Protrusion of Bolts and Screws through Self-Locking Nuts

Nominal Bolt or ScrewSize

Minimum Bolt Protrusion2

Through Nut (Dim. A)

#4, #6 & #8 0.060

#10 & 1/4 0.060

5/16 & 3/8 0.070

7/16 & 1/2 0.080

9/16 & 5/8 0.090

¾ 0.120

7/8 0.140

1, 1 1/8 & 1 1/4 0.170

NOTES:1. All dimensions are in inches.

2. EXCEPTION: All bolts and screws used with 3M155 barrel nuts shall have the full chamfer on the fastener or 1/32 inch, whichever is greater, extending through the locking feature of the barrel nut.

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9.9.1 Thread Locking Agents

All thread locking agents shall be used to manufacturer’s recommended specifications unless specified by engineering drawing.

9.10 Allowable Gap Dimensions

Table 12 and Figure 88 depict the allowable gap dimensions under the heads and nuts of flush or protruding head bolts.

9.10.1 Gap Evaluation

A. The heads of all flush and protruding head bolts shall seat such that:

A 0.004 (+ 0.0005, - 0.0000) inch thick shim cannot be inserted between the bolt head and the structure for more than 40 percent of the circumference of the head.

A 0.004 (+0.0005, - 0.0000) inch thick shim does not contact the fastener shank when inspected as shown in Figure 88)

B. Gaps listed in Table 8 for installed nuts shall not be continuous for more than 40 percent of the circumference of the nut base, when inspected as shown in Figures 88.

TABLE 12Installed Nut Gap Allowable

Fastener Size Maximum Nut Gap (Inch)10-32 0.0041/4 0.0055/16 0.0063/8 0.0077/16 0.0081/2 0.0099/16 0.0105/8 0.0113/4 0.0137/8 0.0151 0.0171-1/8 0.0191-1/4 0.0211-3/8 0.0231-1/2 0.025

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1-5/8 0.0271-3/4 0.0292 0.033

C. There shall be no measurable gap at interfaces between structure, shims, fillers, etc. If a 0.002 inch thick shim can be slid between the parts and contact the fastener shank, the fasteners shall be rejected.

9.10.2 Torque Striping

FIGURE 88


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9.11.1 Assembly Criteria

Assembly personnel shall determine that the work satisfies the requirements

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9.11.2 Thread measurement requirements are as follows:

9.11.2.1 Internal Threads: For internal thread applications, threads are considered acceptable when:

The “GO” thread plug gage will enter the internal threaded hole. The “HI” thread plug gage cannot enter the internal threaded hole or a definite drag is

encountered on or before the third turn of entry.

NOTE: Gaging with the “HI” thread plug gage will be accomplished upon fabrication and after all processing is completed. Any further gaging will be avoided unless required by customer specifications. Excessive gaging may wear out the threads and result in rejection.

• When a depth dimension is stated for a “blind hole,” it shall be interpreted and defined as minimum thread depth for manufacturing and inspection purposes.

Threads shall be inspected using the class and series of thread gauge specified on the applicable Engineering document.

When inspecting coated standard Class 2A external 60° threads, a basic Class 3A size “GO” gauge and a class 2A size “NOT GO” gauge shall be used for acceptance and rejection.

9.11.2.2 External Threads: For external thread applications, threads are considered acceptable when:

• The “GO” thread ring gage rotates freely over the entire threaded length of the product.• The “NOT GO” thread ring gage will not accept more than two turns of the threaded length of the

product.

OR

• The “LO” threaded ring gage will not accept the threaded length of the product or a definite drag is encountered on or before the third turn of entry.

NOTE: Gaging with the “LO” thread ring gage will be accomplished upon fabrication of the part, and after all processing is completed. Any further gaging will be avoided unless required by customer specifications. Excessive gaging may wear out the threads and result in rejection.

9.11.2.3 Thread Criteria: The thread criteria for helical coil inserts are controlled by the dimensions of the threaded hole into which the insert is installed.

9.12 Acceptance Criteria

All acceptance criteria associated with this procedure are contained in the documents listed in Section 8.


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9.14. Assembly Criteria

Assembly personnel shall determine that the work satisfies the requirements detailed herein.

In the event this specification conflicts with the Engineering Drawing the engineering drawing shall govern.

9.15 Training

Training material is found in IPC-620.

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SECTION 10: AD HES I V ES, C O MP O U N DS , SLEEVING AND BOOTS

10.1 Definitions

10.1.1 Organics

By definition, an organic is any chemical or compound having a carbon basis. This means that the chemical contains carbon. For the case of a compound, all of the chemicals in the compound contain carbon. Some commonly used organic solvents and compounds include: Naphtha, MEK, Dibasic Ester, methylene chloride, toluene, xylene, acetone, isopropyl alcohol, paint thinner, mineral spirits, Kwik Solv, and glass cleaner. Applying water to the surface of an RTV containing acidic acid may also decrease the time required to cure.

10.1.2 RTV

RTV stands for room temperature vulcanizing. This means that the sealant/adhesive changes from a liquid/paste state to a solid/flexible rubber at room temperature. Many RTVs, especially those containing acidic acid, need moisture and heat in the air to cure. In this case, if either humidity or temperature decreases, the potting will take longer to cure. For instance, in a regular oven the humidity goes down as the temperature is increased. Even though the heat is raised, the adhesive/sealant will take longer to cure since the moisture content of the air in the oven has been lowered. This can be rectified by either using a humidity oven or placing a tub of water in the oven with the part if the part can withstand raised humidity. Other RTVs cure by catalytic conversion, meaning that they cure through a chemical reaction by the use of a catalyst, or chemical substance that increases the rate of a reaction without being consumed.

One-Part Moisture Cure RTV

Dow Corning one-part moisture cure adhesives are generally cured at room temperature and in a range of 30 to 80 percent relative humidity. Greater than 90 percent of their full physical properties should be attained within 24 to 72 hours depending on the product chosen. Materials and parts can be handled in much shorter times of about 10 to 120 minutes depending on the product chosen and the amount of material used per part. These materials are not typically used for highly confined or deep section cures. Materials will generally cure about 0.25 inch per seven days from any exposed surface. Cure progresses from the outer surface and is dependent on the moisture in the air. Working time is generally a few minutes to an hour for these products until a surface skin begins to form. Mild heat acceleration of the cure rate may be possible, but temperatures above 60°C (140°F) are not recommended.

10.1.3 Potting

Potting material provides intimate contact with the wires or cable jacket for entire circumference of the wires or cables .Potting material use must be verified in accordance with print, router or job specifications. Potting material mixing ratios is done per the mfg. specifications. Potting material adheres to at least 75% of the circumference of the wires or cable jacket when the drawing or specification requires the potting material to bond to the wires or cable jacket .No potting material on the mating surface of the connector. Potting is processed in the ESD area to reduce FOD. No bubbles or entrapped air. No exposed conductors. No spillage

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that interferes with the electrical or physical function of the connector. Most pottings can be removed and reworked per manufacture specification instructions. Tooling requiring calibration is listed in the log F 760. Non-porous containers and mixing tools are used.

10.1.4 Ultrasonic Welding

In multiple wire applications, the operator should place smaller wires on the side of the bundle away from the horn. End of Insulation is between 1 and 2 wire diameters from weld nugget. Nugget width to height ratio is 1.5 per the IPC-620 (7.0) to 1.0.Individual wire strands are distinguishable on compression surfaces and no loose strands. Welding machines shall be operated per the manufacture instructions unless authorized by engineering.

10.2 Application and Curing

10.2.1 Surface preparation

If possible, metal parts should be cleaned with Alcohol, Naphtha, or L5 Thinner before application of adhesive/compound to prevent contamination. Plastic parts should be cleaned with Naphtha or L5 Thinner, DO NOT use isopropyl alcohol, as it leaves a residue.

10.2.2 Preferred Solvents

Preferred solvents shall be used on the joint to remove and/or smooth adhesives/compounds in uncured state.Other solvents, not specified, may be used to remove potting from adjacent surfaces, avoi d i n g j oi n t a re a if at all possible, only after approval from Engineer and adhesives in joint shall be in a tack free condition. Engineering approval shall be given for use of any other solvent in the joint to be used other than the specified solvent

NOTE: Water used on adhesives/compounds should be purified water such as reverse osmosis, distilled or deionized water.

10.2.3 Cure Time

Unless otherwise noted, Cure Time and Relative Humidity values are minimum values, whereas temperature values are maximum values. Actual cure times may vary depending on the thickness and usage of the adhesive, compound and potting. Refer to Manufacturer’s Instructions, drawing and/or router for more information on mixing and or work time and pot life. Potting materials should be with in specified hardness range and tack-free to the touch after curing.

10.2.4 Masking

If a temporary mask is required, extreme caution shall be used to prevent contamination of the cleaned assembly. All areas to be masked shall be designated on applicable drawing or assembly instruction sheet. If tape is required apply as smoothly as possible and take care to avoid air pockets between surface and tape. Masking will be removed per manufactures

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10.2.5 Dry Curing Ovens

The curing ovens are in Sarica calibration program and are calibrated annually. The curing ovens are in the Plant maintenance scheduled program. Cure times a based on the manufacture instructions.

10.2.6 Training / Tooling

The certified trainer of each assembler shall be responsible to assure that the employee is thoroughly familiar with the use of the tooling and set-up, cleaning, calibration and maintenance of equipment required and matches the work ticket. Equipment used for measuring viscosity, mixing, and curing silicone is not used for applying non-silicone based polymers.

10.3 Sleeves and Boots

If required or needed cleaning shall be accomplished prior to shrink of the sleeve.

When shrinking a sleeve or a boot on to connectors they must not cover the adapter rings or interfere with operation of a locking ring. Boot overlap of cable sleeving or jacket is at least 3 cable diameters in length to prevent exposed wires or braid when flexed. Heating process used (heat guns ex.) to shrink sleeve per manufacture instructions and the insulation must not damage the connector ,wire, sleeve or adjacent components or reflow solder connections. Sarica purchases sleeves and Boots with the adhesive already applied. (Use and maintain per manufacture instructions)

When conductive adhesive is required in the assembly process the material must be verified with the documented procedure. Separate testing shall be accomplished to assure that the resultant conductive path is acceptable .The boot is bonded to the connector on all sides with minimal adhesive buildup. The structural adhesive fillet is visible, the boot is parallel with the face of the connector in both axes. When used there is no conductive adhesive on the outside of the boot. Boot and adhesive buildup does not exceed .125 from connector surface. Pin–holes with a visible bottom are acceptable, bubbles are not acceptable. Adhesives are applied per the manufacturer instructions for thickness, hardness, curing unless noted on customers drawing .The environment contaminants shall be controlled in the ESD area to minimizes foreign object debris. (FOD)

10.4 Solder Sleeve Devices

Strip length on braid and shield wires does not exceed .25” and is greater than .15”. The solder ring shall be completely melted and there should be a smooth concave solder fillet to the wires in the connection. The shield weave pattern should be visible. The outer sleeve should conform to the splice contour and be a snug fit. Meltable sealing rings can flow over outside of the solder fillet as long as it does not affect the solder fillet. For direct applied braided shield any scrap, nick or severed wire strands are rejected. The absence of the thermal indicator of the shrinkable solder sleeve in the installed part is not a reason for rejection. When soldering joints with shrink sleeve, joints must be cleaned before shrinking sleeve on. Inspection shall follow to inspect the solder and other areas for damage.

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10.4.1 Sleeving /Shrink Tubing

Sleeving / tubing when used as protective coverings and abrasion protection to contain wires/cables must be tight on the cable and accessories. No cracks or tears. Multiple pieces overlapped by at least 3 cable diameter, or .5” whichever is larger. Maintain sufficient sleeve thickness. Sleeving covers wire insulation on both ends of the spliced area by minimum 2 wire diameter.

10.4.2 Spiral Plastic Wrap / Spiral Wrap

Spiral wrap sleeving is used for two purposes. One is to contain a group of wires and cables. Another is for abrasion protection. The sleeving may be butted or applied as an open spiral and frequently the inner wires are visible. The ends of the spiral wrap sleeving need to be trimmed to eliminate sharp edges or points that might damage the insulation. When spiral sleeving is applied, the ends of the wire bundle need to be secured. The sleeving should make firm contact with the bundle.

10.5 Bonding

Bonding material use must be verified in accordance with print, process router, manufacturer work instructions, or job specifications. Bonding material if required to be mixed, the mixing ratios is done per the mfg. specifications. If any surface preparation is required it will be called out on process router, print, manufacturer work instructions, or job specifications. All bonding shall be done to IPC-A-610 class 3.

10.5.1 Cleanliness Prior to Bonding

All boards shall be cleaned by cleaning procedure within this process manual. If any component, or part is required to be cleaned prior to bonding it will be called out on process router, manufacturer work instructions and or customer drawing.

10.5.2 Tooling

If any tooling is required it will be called out on process router, manufacturer work instructions and or customer drawings. Non-porous containers and mixing tools shall be used.

10.5.3 Packaging during process or transit

When bonding material is used it will be labeled with part number in container, the container shall also include expiration date of product inside. The bonding material will be used within the applicable working time specified by manufactures recommendations. All bonding material mixed or unmixed that has been poured in a container shall not be pour back into original container, and must be discarded.

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10.5.4 Curing of Bonding Material

Actual cure times may vary depending on the thickness and usage of the adhesive, compound and potting. Refer to Manufacturer’s Instructions, drawing and/or process router for more information on curing time, and pot life. Bonding materials should be with in specified hardness range and tack-free to the touch after curing. After curing alignment will be inspected for dimensions and shall not exceed dimensions on customer drawing, or manufacture’s work instructions, and or process router.

Curing time of bonding if required shall be recorded on work ticket. Curing time will include time placed in oven and time removed from oven.

10.5.5 Application of Bonding Material

For application of bonding material refer to manufacturer’s instructions, work instructions and or process routers. For dispensing tips, and or tooling refer to manufacturer’s instructions.

10.5.6 Rework

Most pottings can be removed and reworked per manufacture specification instructions. If rework is required instructions will be written on reject tag and dispositioned by a manufacture engineer.

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SECTION 11: THROUGH HOLE SOLDERING

11.1 Wave Flow Soldering

This section details the materials and procedures to be used for machine wave flow soldering. Wave flow soldering requirements and workmanship/inspection criterion is contained in the class 3 requirements of IPC/EIA J-STD-001/Class 3 and IPC-A-610/Class 3.

11.1.1 Operation of Wave Flow Soldering

The Wave Soldering machine shall be operated only by individuals that have been properly trained and are fully confident operation of the equipment. Failure to abide by the manufacturer’s instruction manual may result in extensive damage to the equipment.

Operator shall set up the wave soldering machine by program called out on the circuit card set up sheet F707. The circuit card set up sheet will also tell the operator if the board requires board supports and the orientation of the board to be loaded into the machine. All set points must be stabilized before a board is run through wave flow soldering operation.

11.2 Flux

The flux shall have no harmful effects on the components, their markings, or the PWB and shall be easily removed with the solutions specified in the Cleaning Section 1 of this specification. The flux shall meet all requirements of J-STD-004.

11.3 Flux Thinner

The flux thinner shall be as specified by the manufacturer of the flux used. It shall meet all requirements of J-STD-004.

11.4 Solder

Bar solder shall be type SN63/PB37 which complies with J-STD-006.

11.5 Solder Purity Maintenance

The solder sample to be analyzed shall be drawn from the solder bath of the wave solder machine, allowed to cool, and sent out for analysis. The solder shall be analyzed quarterly. Due to holidays, weekends, test lab scheduling, etc., the quarter to quarter analysis will not always be performed within a calendar quarter. It is the responsibility of Engineer, or Technician for the department to ensure that the analyses are completed and to implement appropriate route cause corrective action when solder analyses returned are found to be non-compliant to the workmanship standard. Adjustments to the solder chemistry shall be made by wave solder operator and or Engineer as required by results on the quarterly wave flow machine solder analysis form.

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It is required that the solder contamination does not exceed the percentages stated in J-STD-001. If percentages are not within tolerances all work shall be stopped on wave flow until percentages are within tolerance. It is the responsibility manufacture engineer to correct these issues. It may be necessary to add bars of pure tin, if solder analysis report states that the tin tolerance is under the minimum percentage. For other contaminants higher than acceptable range it may be necessary to drain and refill the solder bath.

11.6 Process

• Step 1: Cleaning (if required)

Unpopulated printed wiring boards shall be cleaned, as needed, in the Aqua Storm inline cleaning machine prior to assembly of components. After cleaning the circuit cards should be handled only by their edges whenever possible.

• Step 2: Pre-baking (if required)

Baking the printed wiring board (PWB) assemblies prior to flow solder removes entrapped moisture in the boards, which can cause blowholes, measling and voids. Boards shall be baked in recirculating air oven at 120 degrees Fahrenheit (+/- 10 degrees Fahrenheit) for a period of four hours. The baking temperature shall never exceed 180 degrees Fahrenheit. Wave flow soldering shall be done within eight hours of removal from oven. Note: Boards may bypass the bake operation if needed to expedite production; however, any degradation of the boards will be cause to scrap parts.

• Step 3: Masking

If a temporary mask is required, such as on edge card connector fingers, or plated mounting holes, extreme caution shall be used to prevent contamination of the cleaned assembly.

Edge card connector fingers areas should always be masked. All other areas to be masked shall be called out on customer drawing and/or process router. Temporary solder masking used to prevent solder on edge card connectors, mounting holes, etc. Masking should be water soluble and able to be cleaned off through Aqua Storm inline cleaning machine. Solder masking to be allowed to cure per manufacturer’s instruction before running through the Wave Flow machine.

• Step 4: Soldering

A solder profile shall be established for each assembly by the Engineer based on the optimal conditions prescribed in the manufacturer’s technical data sheet for the flux and prior experience with the assembly. The profile shall include:

Conveyor speed Preheat settings Solder pot temperature Any other specific requirements for the assembly

The profile may be adopted from the profile for a similarly sized and populated assembly.

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All Assemblies shall be cleaned as prescribed in the cleaning section of this document within one hour (and preferably immediately once cooled) after wave soldering.

Flux application shall fully cover the bottom of the board. The operator shall be responsible for verifying flux coverage on the board with periodical checks during the run. Any adjustments shall be corrected by adding flux or adjusting the PSI regulator to get the correct about of coverage on the bottom of the board.

Step 5: Cleaning

Flux must be removed from printed wiring boards as soon as possible after soldering process within 1 hour of soldering. All items to be cleaned shall be cleaned in a manner that will prevent thermal shock and or detrimental intrusion of cleaning media into components that are not totally sealed. All Wave solder boards will be cleaned through Aquastorm inline cleaning system unless specified by engineering drawing.

Temporary fixtures used in wave solder like board supports shall be removed from product before cleaning, fixtures used shall be washed through Aquastorm inline cleaning machine to remove flux residue.

11.7 Resoldering:

The flow soldering operation on a printed wiring board may be repeated, once, if required providing that reheating and resoldering does not introduce degradation of parts of the printed circuit board. Parts then will be routed for hand touch up if needed. The printed wiring boards shall be visually examined for degradation.

11.8 Inspection Criteria:

A part that does not satisfy the requirements specified IPC/EIA-J-STD-001/CLASS 3 and the workmanship/inspection criteria of IPC-A-610/CLASS 3 shall be rejected.

11.9 Dross Removal:

Dross shall be manually removed from solder wave machine every time of use. Removal of dross will be done after production lot has finished, so no contamination of circuit card assembly occurs.

11.11 Select Soldering

The Select Soldering Machine shall be operated only by individuals that have been properly trained and are fully confident operation of the equipment. Failure to abide by the manufacturer’s instruction manual may result in extensive damage to the equipment.

To run the select soldering machine the operator shall load the appropriate profile called out in the Circuit Card Setup sheet F707.

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11.11.1 New Files and Profiling

Before an assembly is run for the first time, a new file may need to be created and a profile established. The Technician is responsible for performing this procedure and shall receive technical advice from Engineering.

Established files will be reviewed and profiled as needed. Profile programs will be saved and approved on by engineering on Circuit Card Set Up Sheet F707.

11.11.2 Solder Purity Maintenance

The solder sample to be analyzed shall be drawn from the solder bath of the select solder machine, allowed to cool, and sent out for analysis. The solder shall be analyzed quarterly. Due to holidays, weekends, test lab scheduling, etc., the quarter to quarter analysis will not always be performed within a calendar quarter. It is the responsibility of Engineer, or Technician for the department to ensure that the analyses are completed and to implement appropriate route cause corrective action when solder analyses returned are found to be non-compliant to the workmanship standard. Adjustments to the solder chemistry shall be made by select solder operator and or Engineer as required by results on the quarterly select solder machine solder analysis form.

It is required that the solder contamination does not exceed the percentages stated in J-STD-001. If percentages are not within tolerances all work shall be stopped on select solder until percentages are within tolerance. It is the responsibility manufacture engineer to correct these issues. It may be necessary to add pure tin, if solder analysis report states that the tin tolerance is under the minimum percentage. For other contaminants higher than acceptable range it may be necessary to drain and refill the solder pot.

11.20 Preventative Maintenance:

Daily Maintenance (when in use):

Clean Fluxer and Fluxer area. Remove Dross add solder if needed. Clean and wipe down machine.

Preventative Maintenance:

All other maintenance shall be performed by maintenance personal, and recorded in preventative maintenance log on the frequency it occurs.

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• SMT Soldering requirements and workmanship/inspection criterion on the Class 3 requirements of IPC/EIA J-STD-001/CLASS 3, IPC-HDBK-001 with AMENDMENT 1/CLASS 3 and IPC-A-610/CLASS 3.

The purpose of this section is to provide an overview of processes used in the manufacture of Printed Wiring (PW) assemblies that utilize Surface Mounted Technology (SMT). This Process Specification shall also serve as a workmanship guide and it shall establish accept/reject criteria.

The Process Specification applies to the manufacture of PW assemblies utilizing SMT. In the case of PW Assemblies designed to incorporate both Surface Mounted Devices (SMD) and Through Hole Technology (THT) this Process Specification shall apply only to the use of SMT.

Assembly and Quality Control shall be used to maximize workmanship, quality, and consistency within the constraints of the design or other specific applicable criteria (i.e. customer specifications, component specifications, etc.).

All SMT jobs are to be run with the appropriate machines with appropriate programs called out on the circuit card set up sheet. In the event

12.1 Materials

• PW Boards• Electronic Components• Static Sensitive Components and Assemblies• Solder Paste• Epoxy

12.2 Application of Solder Paste or Epoxy

The decision to apply solder paste and/or epoxy is based on the soldering process to be used. If wave flow or hand soldering is to be used on the assembly, epoxy may be used and solder paste may not be required.

12.3 Placement of Surface-Mounted Components

Component placement may be done by machine or by hand. The choice of method, within the confines of this section, shall be delegated to the assembly department foreperson unless otherwise specified by Engineering. Placement by machine is the preferred method.

• Reflow Soldering: Place the components on the PW board within one hours of the application of solder paste or within the solder paste manufacturer’s specified working life, whichever is less. The solder paste acts as a temporary adhesive, holding the components in place until the actual solder joints are formed. The time interval between component placement and soldering should be minimized. The working time of the paste as specified by the paste manufacturer should not be exceeded. Maximum time between solder paste applied to reflow not to exceed 4 hours.

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• Profile Verification:

All profiles are to be designed with the KIC profiler for reflow operation. The profile is designed with manufacturer solder paste requirements through software. The profile called out on the circuit card set up sheet shall be loaded and allowed to reach all set points of the profile. All set points must be in acceptable range before any CCA is reflowed through the reflow oven. Once all set points are meet the required settings the light tower will show green light signifying that set points are all within range. In an event of an alarm on the oven the alarm must be address and corrected before further processing occurs.

• Wave Flow Soldering SMT Parts: The components shall be held in place by an adhesive dispensed at or before the time of component placement. This adhesive must be cured prior to wave soldering. Component location shall meet the requirements of this section.

• Hand Soldering: The components may be located, held in place, and soldered as one operation provided the requirements of this section are satisfied.

12.3.1 Operation of QSP-2 Pick and Place machine:

The QSP-2 shall be operated only by individuals that have been properly trained and are fully confident operation of the equipment. Failure to abide by the manufacturer’s instruction manual may result in extensive damage to the equipment.

Operator shall load appropriate program called out on the circuit card set up sheet F707. The program loaded on the QSP-2 will show you where to load each feeder and has audible responses. Once the machine has been loaded with correct parts the operator shall insert the appropriate board into the machine with the same orientation as indicated on the monitor display.

A first piece inspection will be done on the first piece to verify all parts are correctly placed. If the first piece has been found acceptable the operator shall continue to run the full order checking each piece to verify each piece is still acceptable and the machine is running correctly.

12.3.1.1 Authorization of Pick and Place equipment

Only trained pick and place programmers are authorized to program, edit, or override pick and place programs. Pick and place operators do not have authority to program edit, or override pick and place programs.

12.4 Soldering

Acceptable methods of soldering are reflow, wave, and hand soldering. Reflow soldering requires that solder paste be deposited on the PW board before component placement. The choice of method shall be delegated to

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the assembly department foreperson unless otherwise specified by Engineering. Reflow soldering is the preferred method.

Reflow soldering shall be accomplished in accordance with the manufacturer’s instruction manual and the Reflow section of the document. Wave soldering shall be accomplished in accordance with the manufacturer’s instruction manual and the wave solder section of this document and hand soldering shall be in accordance with the manufacturer’s instruction manuals of soldering devices and the hand soldering section of this document.

12.5 Further Processing

This area is included to accommodate PW assemblies that combine SMT and conventional through-hole technology. All through-hole mounted components shall be installed in accordance with the manufacturer’s instruction manual and the hand soldering section of this document.

12.6 Rework and Repair

It shall be the goal and responsibility of all departments to minimize the need for rework. There shall be an assembly checkpoint after each step of process at which the operator or assembler will evaluate the results of the process according to the applicable Sarica Mfg. Process Specification. If rework or touch up is required, it shall be accomplished such that the requirements of the section are satisfied.

Any repair and/or modification of PW assemblies utilizing SMT shall be performed in accordance with the manufacturer’s instruction manual for tools and materials used and the Repair/Rework section of this document.

12.7 Solder Joints

Preferred solder joints are continuous, shiny and smooth with no evidence of porosity or entrapped flux. Solder joints that have a dull, grainy, or rigid surface are acceptable provided all of the other requirements of this section are satisfied.

12.8 Solder Paste & Screen Printing

The purpose of this section is to provide the guidelines and procedures for correct operation of the MPM surface mount screen printer. This document is not intended to serve as an instruction manual or to replace the instruction manual for the machine. Solder tin/lead composition Sn60, Sn62, or Sn63 (soft solders) solder form optional; conforming to J-STD-006 shall be used. High temperature (hard solder) tin/lead solders conforming to J-STD-006 may be used when specified on the approved engineering assembly drawing.

12.8.1 Equipment

• MPM 125• Solder Paste

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• Latex Gloves• Spatula• Screen Stencils• Squeegee Blades• Paper Towels• Alcohol• Lubricant

12.8.2 Vision System

The MPM 125 is equipped with a downward looking vision system. The use of the camera is part of the programming operation that will be handled by operators or Automation Programmer.

12.8.3 Operating Procedure

The MPM 125 shall be operated only by individuals that have been properly trained and are fully confident operation of the equipment. Failure to abide by the manufacturer’s instruction manual may result in extensive damage to the equipment.

Running MPM 125

When running the MPM 125 screen printer the operator shall load the appropriate profile called out in the Circuit Card Setup sheet F707. Once the profile is loaded the operator will follow the instructions based on the software that will walk you through the initializing and loading of the machine. The stencil ID number and type of paste are called out in program loaded on the MPM 125. Once the set up on the screen printer is complete the operator will load the board into the screen printer to the orientation on the display screen of the screen printer. If board supports are need they will be shown on tooling setup when program is loaded. Place the components on the PW board within one hours of the application of solder paste or within the solder paste manufacturer’s specified working life, whichever is less. The solder paste acts as a temporary adhesive, holding the components in place until the actual solder joints are formed. The time interval between component placement and soldering should be minimized. The working time of the paste as specified by the paste manufacturer should not be exceeded. Maximum time between solder paste applied to reflow not to exceed 4 hours.

Storage of Solder Paste

Solder paste to be refrigerated upon receipt at 32-50 degrees Fahrenheit. This will be sufficient to maintain a nominal shelf life. Solder paste should be permitted to reach room temperature before use. Warm-up time is specified by paste manufacturer. Solder paste will be checked by operator before use to verify it is within shelf life. All expired paste to be properly disposed of.

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Use of Solder Paste

Stencil life not to exceed manufactures specifications. Solder paste when not in use must be storage in refrigerator at 32-50 degrees Fahrenheit. Do not remove worked paste from stencil and mix with unused paste in jar. This will alter the rheology of the unused paste.

Paste Coverage

The MPM 125 is equipped with a 2D paste inspection, after the paste has been applied by the machine. The screen printer will inspect both the board and stencil and check for lack of paste, solder bridging, and excessive paste on pads of the circuit card. The inspection will look for clogged apertures on the stencil and automatically wipe the screen if needed. The inspection operation will look at 100% of pads on every board to verify appropriate coverage of solder paste is applied. Once a board has passed inspection it will travel out the conveyer and is ready for further processing. If a board has defects on solder paste coverage it shall be washed through the aqueous cleaning system or wiped with alcohol.

12.8.4 Incorrectly Printed Boards

Once a board has been processed through the print cycle and had solder paste applied to it, the board must not be cycled through the print operation a second time. After solder paste has been applied to a board, cycling the board the print cycle a second time will trap solder paste on the bottom of the stencil. This condition can lead to solder printing problems.

Incorrectly printed boards to which solder paste has been applied shall be wiped with alcohol and towels then run through the aqueous cleaning system.

12.8.5 Cleaning the Screen Printer Daily Maintenance

The screen printer must be cleaned at the end of the shift or at the end of an assembly run.

Step 1: Scrape the majority of the solder paste from the stencil using a spatula. Place the solder paste that is removed from the stencil in a container for disposal.

Step 2: Use paper towels and isopropyl alcohol or stencil wipe to wipe off any remaining paste and residue.

Step 3: Remove the stencil and squeegee blades from the machine, and wash them with alcohol or hot water. Stencils and blades must be stored properly at the end of the day. Blades to be checked for damage before loading and when removed from machine.

Used solder must not be used on any assemblies that have “Fine Pitch” printing requirements. Solder paste that does not have good consistency, is dried out, or is in a questionable condition shall be placed in a container for disposal.

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12.8.7 Maintenance of the MPM 125

Preventative Maintenance:

All other maintenance shall be performed by maintenance personal, and recorded in preventative maintenance log on the frequency it occurs.

12.8.8 Stencil design

Stencil design which include size of stencil, stencil thickness, aperture size, use and size of step-downs and stencil material type will be determined and approved by manufacturer engineering before ordering stencil.

12.9 Reflow Soldering

The purpose of this section is to provide instructions for the operation and routine maintenance of the Reflow Oven.

12.9.1 Equipment

• BTU Reflow Oven or equivalent• Show Vacuum• KIC Reflow Profiler or equivalent

12.9.2 Operation of BTU reflow oven

The BTU reflow oven shall be operated only by individuals that have been properly trained and are fully confident operation of the equipment. Failure to abide by the manufacturer’s instruction manual may result in extensive damage to the equipment.

Running BTU reflow oven

When running the BTU reflow oven the operator shall load the appropriate profile called out in the Circuit Card Setup sheet F707. Once a profile is loaded the operator will wait for oven to be within tolerance of the load the circuit card into the reflow oven. The profile will be within tolerance when all oven temperatures and convey speed are all green on the monitor display and the light on the light tower is green.

Drying of PB/CCA

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Prior to soldering, the assembly may be treated to reduce detrimental moisture and other volatiles. All boards prior to solder will be stored in “Hot Box” to reduce moisture before assembly process. All boards will be stored in “Hot Box” for a minimum of 48 hours before further processing.

12.9.3 New Files and Profiling

Before an assembly is run for the first time, a new file may need to be created and a profile established. The Automation Programmer is responsible for performing this procedure and shall receive technical advice from Engineering.

Established files will be reviewed and profiled as needed. Use of the KIC Reflow Profiler is recommended for establishing soldering profiles. Profile programs will be saved and approved on by engineering on Circuit Card Set Up Sheet F707.

All CAD/CAM data processing shall be done by the automation programmer, and shall receive technical advice from engineering.

12.9.4 Monthly Maintenance

Monthly maintenance of the reflow oven is performed by the Automation Programmer.

Step 1: Open hood/heating panels. Vacuum out oven.

Step 2: Check chain conveyor for uncommon wear, binding, and/or damage.

Step 3: Lubricate the chain conveyor, adjustment shafts, and guide rails.

Step 4: Wipe down the outside of oven.

Step 5: Notify the Engineer if any unusual conditions are found.

12.10 AOI

This section details the setup and use of the Automated Optical Inspection Machine. AOI operation will inspect 100% of boards for part presence, part marking, polarity, orientation, solder presence, and solder shorts.

12.10.1 Programming

Initial setup of program shall be done by technician from surface mount dept. all parts must be verified to match the customer drawing or bill of material. All parts are verified for correct orientation, part marking, presence, polarity, solder presence, and solder shorts during initial setup. Program will be saved to current revision level.

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12.10.2 Operation of AOI

Operation of AOI is to be conducted by trained inspection quality control personnel. The Circuit Card Setup Sheet form# F707 will include the correct program to be loaded in the AOI software. Inspection Operator will be logged in under “Inspection Operator” mode with username and password of personnel.

The Inspection Operator has to verify false defects to be false or accurate. If any parts are loaded with incorrect part numbers they will be verified by an engineer to be incorrect part or substitute part number. If a defect is found a reject tag form #768 shall be wrote with information on the defect including part number, unit designator, and defect found.

12.10.3 Authorized Personnel

Personnel authorized to run Automated Optical Inspection machine are restricted by user defined group in AOI software. Engineers and technicians have full access to programming features under “Inspection Recipe Programmer” this allows for modifications of the software programming. Quality control personnel will log on to “Inspection Operator” this allows to operator to run the software and does not allow for any modifications to the program.

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SECTION 13: CONFORMAL COATING

This section establishes the requirements for applying coating materials to printed wiring boards and electronic modules.

Conformal coating requirements and workmanship/inspection criteria is contained in HPS1007, IPC/EIA J-STD-001/CLASS 3, IPC-HDBK-001 with AMENDMENT 1/CLASS 3 and IPC-A-610/CLASS 3.

13.1 Materials/Solutions/Equipment

The following materials, solutions and equipment or equivalents shall be used as necessary to accomplish a satisfactory coating on a printed wiring board and electronic module assembly.

Tubing, shrink, sizes as required Spot mask, CM-148 (TC-533) Tape disks, tape scotch 233+, Shercon (Kapton Tape), rubber boots Solvent, cleaning, Isopropyl alcohol Gloves, cotton, lint free or disposable, static dissipative Coating material per print and/or Codebook Circuit Card cleaning equipment; Aqueous cleaner or equivalent Spatula, non-absorbent; Metal or Teflon Ionograph, Model 500; Alpha Metals, Inc. or equivalent Conventional spray equipment: DeVilbiss Co., or equivalent

Air transformer, pressure feed gun, pressure tank, insert container, suction feed gun, suction cup, hose and fittings

The spray system shall have an air filter, an oil filter and a desiccate dryer Spray booth, exhausted to the outside and free of contaminants Forced air oven with a filter in the recirculating air path. The oven shall be free of contaminants

and it shall be vented

CAUTION: conformal coating of electrostatic discharge sensitive components (ESDS) and assemblies shall be performed at a static safe workstation.

13.2 Cleaning and Drying

Step 1: Clean the board assembly to remove dust, residual flux residue and other contaminants.

Step 2: Wear clean, lint free gloves or finger cots whenever handling cleaned circuit card assemblies to be masked and/or coated.

Step 3: Ensure that the assemblies are dry to the touch with no trapped solvents or water before continuing with the process. Assemblies with SMT components (and any other assemblies exhibiting moisture) shall be dried in an oven set to 150° F (±10°) for four hours to assure dryness. This oven drying cycle may be done before or after masking operations.

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Step 4: Store clean assemblies in covered containers, bags, etc., to prevent subsequent soiling.

Step 5: Prior to masking for conformal coating, the masking operator shall examine assemblies for cleanliness. Any assembly on which there is present flux residue, dust, dirt, oil, grease, corrosion or corrosive products, finger prints, or any other extraneous material must be re-cleaned before masking is applied.

13.3 Masking

Masking operation of ESD products to take place at ESD work station with Air Ionizer.

Step 1: Mask the designated areas with tubing, spot mask, tape or tape disks (Reference materials section).

Step 2: Apply tape smoothly as possible and take care to avoid air pockets between the board surface and tape adhesive.

13.3.1 Un-Masking

Un-Masking operation of ESD products to take place at ESD work station with Air Ionizer.

13.4 Preparation of Coating

Conformal coating shall be used in accordance of manufacturers recommendations, this includes shelf life and pot-life after mixing.

13.4.1 Two Part Coating Material

Step 1: Thoroughly mix the coating material in accordance with the supplier instructions. Use a container that has approximately three times the volume of material.

Step 2: Check to assure that the mixture has the proper thickness.

Step 3: Mark the time of mixing and the pot life (where applicable) on the container.

13.4.2 One Part Coating Material

Step 1: Check thickness and add thinner as required in accordance to supplier’s instructions.

Step 2: Mark the time of mixing and the pot life (where applicable) on the container.

13.5 Application of Coating Material

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To Prevent the potential of cross contamination during the use of silicon conformal coating ensure any product that does not require silicon coating has been protected by being covered by ESD blankets or stored inside a sealed ESD tote with lid prior to spraying.

The thinning of one part conformal coatings is to be accomplished by weighing of thinner to base material per manufacture specifications.

NOTE: TO TRACK THE APPLICABLE BOARDS THROUGH THE CONFORMAL COATING PROCESS USE PROCESS FORM FOR ALL BOARDS.

13.5.1 Primer

A primer (DOW CORNING 1204) shall be used before applying DOW CORNING 3140 silicone conformal coatings to ensure a satisfactory adhesion between substrate and the conformal coating.

Allow the primer to air dry for a minimum period of 2 hours at normal room temperature and humidity conditions.

NOTE: A THIN FILM OF PRIMER PRODUCES THE BEST RESULTS

13.5.2 Spray Coating

13.5.2.1 Air and Heat Cure Conformal Coatings

Step 1: Prepare the coating per the supplier’s instructions for spraying.

Step 2: Using the spray equipment specified, apply the coating on the bottom side of the board. Hold the spray gun 6-12 inches (or as required for a consistent, run free coating) from the board and apply the coating by making overlapping successive passes until the board is coated or use the automatic conformal coating spray to apply coating to the bottom side of the board.

Step 3: Allow the coating to gel at room temperature for a minimum of 30 minutes, then apply additional coats as required until a uniform coverage is acquired (allowing the coating to gel between coats).

Step 4: Air cure per the supplier’s instruction.

Step 5: Repeat steps 2, 3, and 4 for the component side of the assemblies.

Step 6: Examine under ultraviolet light (black light) to determine that all surfaces are coated, and then remove tape, adhesives, and mold seal. Make sure that solvents used are compatible with the board materials.

NOTE: IF NEEDED, LIGHTLY SCORE COATING (SR ONLY), AT EDGE OF TAPE TO AID IN EASY REMOVAL OF TAPE. TAKE CARE NOT TO DAMAGE P. C. BOARD.

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13.6 General Requirements

Preparation and fixing of materials, as well as the cleaning and coating process shall be done in a clean area free of dust and debris.

Coating materials shall be thoroughly mixed in accordance with the supplier’s instructions. The thickness of conformal coating shall be as follows for the type specified when measured on flat

unencumbered surfaces. Fillets between connectors, brackets and components are permitted and the maximum specified thickness does not apply.

Epoxy, Polyurethane and Acrylic Manual Spray Process 0.003 ± 0.002 inches on each side.

Silicone Manual Spray Process 0.005 + 0.003, -0.002 inches on each side.

13.7 Rework procedure for finished assemblies due to functional failure:

Step 1: Remove the coating in the area to be reworked with a hot soldering iron or solvent (acrylic coating materials). Exercise care when removing coating so as not to damage the board, conductors or components.

Step 2: Clean the debris from the area by wiping with a clean cloth wetted with the solvent, allow the area to dry at room temperature for a minimum of 15 minutes.

Step 3: Using a soft bristle brush, carefully brush an even, continuous coat of coating material on the board. Break bubbles with the brush or a probe.

Step 4: Cure the coating per the supplier’s instructions.

Step 5: Examine the coating to determine that all surfaces are covered. For coatings with a UV tracer (for example, DOW CORNING 3140, Hysol PC18M, and Hysol PC29M) examine the coatings under an ultraviolet light.

13.8 Safety

13.8.1 Responsibility

The enforcement of and adherence to safety regulations, MSDS and procedures is the responsibility of the supervisory personnel in the department involved.

13.8.2 Warning

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These products are harmful if swallowed and/or inhaled. They may cause eye and/or skin irritation. Avoid breathing the vapor mist. Use these products with adequate ventilation and eye protection. In the event some splatters into the eye(s), immediately flush the eyes with plenty of water. Avoid skin contact, if contact occurs, wash the contacted area with soap and water immediately.

13.9 Storage

Keep containers closed to avoid contamination. Contents may solidify if exposed to moisture. Store in a dry place at 64.4° F to 86° F. Assemblies shall be maintained in an air environment of 30 to 70 percent relativehumidity prior to coating.

13.10 Inspection Criteria

The conformal coating operator (or the area manager’s designate) shall visually examine assemblies prior to coating. Assemblies in which there is present flux residue, dust, dirt, line, oil, grease, corrosion or corrosion products, finger prints or other extraneous materials unrelated to the assembly design shall be returned to the previous work station for re-cleaning and masking.

Finished boards shall be inspected by the conformal coating operator (or the area manger’s designate), as follows:

Step 1: Examine coated boards to ensure that the coating covers all intended areas. Coatings that include a UV tracer for inspection purposed (for example, DOW CORNING 3140, Hysol PC18M, Hysol PC29M, and Cytec CE-1155) shall be inspected under an ultraviolet light. Uncoated or thinly coated area will appear black and shall be reworked by brushing coating onto the deficient area.

Step 2: The cured coating is free of voids and open bubbles that expose components, conductors or base laminate.

Step 3: The assembly shall be considered acceptable if the conformal coating is tacky (sticky) to the touch.

Step 4: The assembly shall be considered acceptable if the conformal coating does not exhibit flaking, peeling or areas without adhesion on either the component(s) or printed wiring board.

Step 5: Discoloring of the conformal coating (light yellow to brown) is acceptable on or around high temperature components.

Step 6: A cloudy appearance of the conformal coating is acceptable.

Step 7: All inclusions except minor nonconductive surface inclusions (dust, cotton fiber) shall be cause for rejection.

Step 8: A single bubble connecting adjacent printed circuit pads, or tracks, shall be cause for rejection.

Step 9: Verify that designated coated and uncoated areas conform to the Engineering Drawing.

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Step 10: Verify thickness.

NOTE: CONFORMAL COATING ON EDGE OF PRINTED CIRCUIT BOARD IS OPTIONAL.

13.11 Rework for defects in the conformal coating material:

Rework of minor defects that require only brushing additional coating onto a deficient area is considered a normal part of the conformal coating process and will not require a reject tag. The following conditions shall require a reject tag and disposition before rework is performed:

The defect involves non-adhesion that cannot be rectified easily by brushing coating onto the area. Coating must be removed and re-sprayed to attain an acceptable coverage. Major inclusions of foreign material exist in the coating. The coating exhibits orange peeling.


The compounds referenced herein have a shelf life and it shall be marked on the containers, with the date the compound is no longer usable.

13.13 Cleaning and Preventative Maintenance

Cleaning of spray guns shall be cleaned and maintained to manufactures recommendations as required.

Conformal coating booths and filter shall be cleaned as required.

SECTION 14: TESTING 14.1 Electrical Test

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In the IPC-620 table 19-1 is a list of Cable and/Wire Harness testing options that may be agreed upon between the user and the manufacturer. The tests are defined in 19.7.1 through 19.7.8 and tables 19-2 through 19-8 are used to specify test parameters when a test is required. Appendix C is a summary of test requirements. User or manufacturer defined test should consider the range of possible defects. If both DWV and IR test are performed independently, the IR test shall be conducted after the DWV. If additional test are required then Sarica will meet customers supplied ATP requirements. Unless otherwise specified, tests conform to IPC-620 class 3 section. If a rework action takes place any test that was previously performed are repeated in the portion of the product that was affected. For additional test not listed Sarica works to customers’ drawings or documentation requirements. Test equipment, fixtures, etc. supplied by customers the responsibility for the calibration and maintenance is the customers. Sarica test equipment is under the company calibration and maintenance program. After testing, operators sign or stamp work ticket that material has verified the compliance and the records are storied.

Finished Circuit Card Assemblies shall be allowed to dry in bake out oven before testing can occur. All Circuit Card Assemblies shall be tested to customer requirements and must meet all criteria listed in the documented acceptance test. Once Circuit Card Assemblies pass functional testing they may be stamped “FT” for functional test.

Test equipment, tools, fixtures, jigs, and customer supplied testers used in acceptance test for customer product will be called out in customer supplied acceptance test procedure. Order in which test are carried out will be called out in customer supplied test procedure.

Non-conforming product will be issued a reject tag and be dispositioned by engineering.

14.2 Mechanical Test

In the absence of specific agreed on test requirements between manufacturer and user the requirements of table 19-9 in the IPC-620 shall apply.

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SECTION 15: FOREIGN OBJECT DEBRIS/DAMAGE (FOD) PROGRAM

15.1 Document Information

15.2 Purpose

The purpose of this work instruction is to identify the responsibilities for maintaining and operating a FOD free environment.

15.3 Scope

The foreign object debris/damage prevention program is in place to protect products from: Damage, Deterioration, Degradation, Foreign objects.

15.4 Definitions:

• Foreign Object Debris: A substance, debris, or article foreign to a system which would potentially cause damage.

• Foreign Object Damage: Any damage attributed to a foreign object that can be expressed in physical or economic terms which may or may not degrade the product’s required safety and /or performance.

• FOD Sensitive Area: A manufacturing area that requires extreme FOD prevention controls detailed in this work instructions.

15.5 FOD area do not enter with:

• Open food or beverages with no screw on lids.• Hardware, carts, tooling, fixtures, etc. with chips, dirt, or other FOD generating debris.

15.6 Training

FOD prevention training will be conducted annually for all workers by Sarica qualified trainers to increase employee awareness to the causes and the effect of FOD. Training records will be maintained.

15.7 Training Subjects to include:

• Proper storage, shipping and handling of material, material and equipment.• Housekeeping standards.• Cleaning and inspection of components and assemblies.• Quality workmanship “Clean-As-You-Go” inspection.• How to report FOD incidents and review past or potential incidents.

15.8 Work Instruction

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The following sections listed below identify the minimum actions that are to be taken to reduce the potential for FOD.

• Food and beverages without screw on lids are only allowed in designated areas away from where hardware is being processed.

• Workbenches will be kept clean and organized to prevent damage or contamination of hardware.• Walls, benches etc. shall not have any peeling paint or chipped wood, metal or drywall, etc.• All tooling will be visually inspected prior to use for cleanliness rust, chipping paint.• Assembly aids shall be maintained in good condition to prevent introduction of FOD during usage.• Compounds will be stored per MSDS sheets requirements to prevent deterioration as a result of age,

temperature, etc. Containers are to be covered/capped after use.• Carts/shelves used for storage and/or transportation hardware ,tooling and /or fixtures will be inspected for

and cleaned to remove metal chips or other loose debris prior to use. Protect hardware from exposure to physical or environmental damage.

• Contact the appropriate team leader when FOD is found in a supplier furnished part.

15.9 Preventative Practice: to help eliminate FOD.

• Follow procedures• Practice good housekeeping (clean- as-you-go) • Clean the immediate work area after work is completed and/or the end of the shift.• If you hear something drop pick it up. If it is hardware used for assembly inspect it for FOD or damage and

take the necessary action to insure it is acceptable for work.• Facility maintenance will coordinate sub-contract work such as cleaning and maintenance type work to

prevent damage and FOD induction and/or contamination of hardware.• Tubs/Totes will be inspected and cleaned as necessary to prevent contaminating stored hardware each time

they are used.• Shipping use guidelines/ instructions to packaging parts to prevent damage or contamination during

shipments, inspect reusable shipping containers for cleanliness (no FOD) prior to use.

15.10 FOD Sensitive Areas

• FOD sensitive areas are assembly, test and inspection.• No food or drink (without a screw-on lid) are allowed in these areas.• Practice good housekeeping as listed in this section.• Have periodical audits and review findings with workers. • No FOD generating materials such as sand paper, files, stones, etc. are allowed in this area.

15.12 Compliance Control

• All employees should be trained to assure compliance with this program.• Materials and accessories used in assembly, packing, handling, shipping and storage should be clean and

free of contamination.• Ensure that all production and test areas meet “good housekeeping” standards.• Record any findings and a documented CAR shall be written.

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• Documented Audits every quarter.

SECTION 16: FINAL INSPECTION

All inspection shall be in accordance of J-STD-001 Class 3 and IPC-A-610 Class 3 unless otherwise authorized in writing by engineering department. All assemblies shall be evaluated by 100% visual inspection. Inspection of conformal coating, staking or encapsulation shall be performed after and not combined with, soldering and cleaning process inspections.

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NOTE: The following shall be in addition to section 5.2.7.1 IPC-A-610

There shall be no loose plating slivers on the surface of the board which includes solder balls. If solder balls meet all of the listed conditions below, the PBA shall not be rejected for this condition:

A. Shall not violate minimum electrical spacing. B. Shall be physically connected and fused to metallic surface.C. Shall not be visible at magnifications of 10X or less. Solder balls only visible at the magnifications

greater than 10X are acceptable provided conditions A and B above are met.

Section 17: X-Ray

Operation and setup of X-Ray is to be conducted by trained personnel. All operators of x-ray equipment shall be trained before any operation of equipment is used. Operators will inspect any blind solder joints including BGA’s to IPC-A-610 Class 3 requirements. If X-ray inspection is required it will called out on the process router as an operation including unit designator for part to be inspected.

All preventative maintenance will be done to manufactures recommendations.

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