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HY-eVision2 7.0 User Manual

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Manual de programação para Monitor Evision TTcontrol Hydac.
50
 TTControl GmbH Schoenbrunner Str. 7, A-1040 Vienna, Austria, Tel. + 43 1 585 34 34-0, Fax +43 1 585 34 34-90, office@ttcontro l.com  No part of the document may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, without the written permission of TTControl GmbH. Company or product names mentioned in this documen t may be trademarks or registered trademarks of their r espective companies. TTControl GmbH undertakes no further obligation in relation to this documen t. Copyright © 2009, TTControl GmbH. All rights reserved. Subject to change and corrections  HY-eVision² 7.0 User Manual Author: KST;ATR Document number: D-153-G-02-002 Version: 1.31 Date: 31-Jul-15 Status: released Review: ODI
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TTControl GmbHSchoenbrunner Str. 7, A-1040 Vienna, Austria, Tel. + 43 1 585 34 34-0, Fax +43 1 585 34 34-90, [email protected] No part of the document may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, without the written permission of TTControlGmbH. Company or product names mentioned in this document may be trademarks or registered trademarks of their respective companies. TTControl GmbH undertakes no furtherobligation in relation to this document.

Copyright © 2009, TTControl GmbH. All rights reserved. Subject to change and corrections 

HY-eVision² 7.0User Manual

Author: KST;ATR 

Document number: D-153-G-02-002Version: 1.31Date: 31-Jul-15 Status: releasedReview: ODI

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Product Name: HY-eVision² 7.0

Document Title: User Manual  Page

Last Change: 31/07/2015 15:01:00 Author: KST File name: HY-eVision2 7.0 User Manual.docx  © TTControl GmbH 

Approval

Name Function Signature

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Document Title: User Manual  Page

Last Change: 31/07/2015 15:01:00 Author: KST File name: HY-eVision2 7.0 User Manual.docx  © TTControl GmbH 

Revision Chart A revision is a new edition of the document and affects all sections of this document.

Version Date Responsible Person Modification

0.1 21-Jul-10 KST Initial Creation

0.2 05-Aug-10 ATR Review

0.3 19-Aug-10 KST & WDI Review of technical data

0.4 23-Aug-10 ATR Review

0.5 22-Okt-10 JFA Minor changes in text and typos0.6 26-Jan-11 KST Changed some text to use document properties

0.7 27-Jan-11 KST Update to hardware version V3.00

0.8 01-Feb-11 KST Replaced technical drawings with vector gfx

0.9 22-Apr-11 KST/ATR Changes after review, added tolerance to cut out

1.0 22-Apr-11 ATR Minor changes after review

1.1 11-May-11 KST Added technical data

1.2 09-Jun-11 KST Fixed typos, changed wording

1.3 21-Jun-11 KST Added GPS & GSM sections

1.4 28-Jun-11 ATR Replaced cut-out drawing

1.5 29-Jul-11 ATR Reverted change in temperature range

1.6 28-Sep-11 ATR Minor changes

1.7 10-Nov-11 ATR Adaptions for new housing, cabling

1.8 16-Nov-11 RGI Added table with cable spec in chapter 5.1.5

1.9 25-Nov-11 KST Updated technical data at USB interface

1.10 29-Nov-11 ODI Review

1.11 02-Dec-11 RGI Added Leoni cable to suggested cables in 6.1.5

1.12 05-Dec-11 ATR Minor findings after review

1.13 05-Dec-11 ATR Rebuild header+footer lost since 1.8, enlargedkeep out area for panel mount option

1.14 06-Dec-11 RGI Table formatting, reworked cable types

1.15 20-Dec-11 KST Updated technical data

1.17 1-Feb-12 KST Added Vbat rise time specification

1.18 23-Apr-12 KST Added chapter about flash memory

1.19 31-Oct-12 ODI Issue49812 – CAN interfaces renamed

1.20 21-Feb-13 JSL Beeper volume added

1.21 15-Apr-13 JSL Note 2 in chapter 3.1 deleted

1.22 13-May-13 ATR updated drawings, added mounting instructions,

data for front, HY-eVision² 7.0 wave

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1.23 03-Jun-13 ATR Minor changes in text and typos

1.24 29-Jul-13 ATR Added product variant with 4 CAN interfaces;renamed CAN interfaces CAN A0, CAN B1 Added temperature range for HY-eVision² 7.0touch products

1.25 23-Oct-2013 ATR Adapted drawings for standalone mounting, addedinformation on SMA connectors

1.26 20-Dec-2013 ATR Adapted specification for HY-eVision² 7.0 touch

1.27 18-Apr-2014 ATR Added general advise on touch screen treatmentReworked chapter “ Analog video input” 

1.28 23-Apr-2014 LFA Added NTSC as supported analog video format1.29 28-May-2014 ATR, JSL Added description for SERVICE pin

16-Jun-2014 ODI Issue47041: Touch calibration

1.30 03-Oct-2014 ATR, LFA Added SERVICE pin to main connector pinoutIncrease available flash size to actual valuesFix minor review findings

1.31 17-Mar-2015 ODI Fix necessary CAN termination resistanceFix maximum USB cable lengthBeeper not volume adjustable

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Contents

General Description .............................................................................................................. 7 

1.1 

Introduction ...................................................................................................................... 7 

1.2  Interfaces and I/Os .......................................................................................................... 7 

1.3 

 Advanced Programming Possibilities ............................................................................... 7 

1.4  Features .......................................................................................................................... 8 

2  Connectors and Pins .......................................................................................................... 10 

2.1 

Main Connector pin out: ................................................................................................. 11 

Specification of Inputs and Outputs .................................................................................. 12 

3.1  Positive power supply (BAT+) ........................................................................................ 12 

3.2  Negative power supply (BAT –) ...................................................................................... 14 

3.3  Ignition on switch input (Terminal 15) ............................................................................ 15  

3.4 

Service Enable .............................................................................................................. 17 

3.5  Ethernet interface .......................................................................................................... 18 

3.6 

USB Host interface ........................................................................................................ 19 

3.7  RS232 interface ............................................................................................................. 20 

3.8 

Console interface ........................................................................................................... 22 

3.9 

CAN interface - ISO 11898 ............................................................................................ 23 

3.10 

 Analog video input ......................................................................................................... 25 

3.11  Camera supply .............................................................................................................. 26 

Extension modules ............................................................................................................. 27 

4.1 

GSM module (HY-eVision²wave 7.0 variants only) ........................................................ 27 

4.2  GPS module (HY-eVision²wave 7.0 variants only) ......................................................... 29 

4.3 

Inserting of Micro SIM and memory card ....................................................................... 30 

5  Internal structure ................................................................................................................. 32 

5.1  Temperature sensors .................................................................................................... 33 

5.2 

Beeper ........................................................................................................................... 33 

5.3  Real time clock (RTC).................................................................................................... 34 

5.4 

Flash memory ................................................................................................................ 34 

6  Device front ......................................................................................................................... 35 

6.1  Display .......................................................................................................................... 35 

6.2 

Keypad .......................................................................................................................... 36 

6.3  Keypad illumination ....................................................................................................... 36 

6.4 

 Ambient light sensor ...................................................................................................... 36 

6.5  Touchscreen (HY-eVision² 7.0 touch products only) ...................................................... 37 

6.6 

 Appearance ................................................................................................................... 38 

6.6.1 

 Acceptance criteria for scratches, dust and bubbles .................................................. 38 

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6.6.2 

Pillowing .................................................................................................................... 38 

6.7 

General advise .............................................................................................................. 39 

6.8  Cleaning ........................................................................................................................ 39 

Housing & Mounting ........................................................................................................... 40 

7.1 

Housing dimensions ...................................................................................................... 40 

7.2  General mounting instructions ....................................................................................... 41 

7.2.1 

Mounting .................................................................................................................... 41 

7.2.2  Cable harness ........................................................................................................... 41 

7.2.3 

General advice .......................................................................................................... 41 

7.2.4 

Mounting position and alignment ............................................................................... 42 

7.3 

Panel mounting option ................................................................................................... 42 

7.4  Stand-alone mounting option ......................................................................................... 44 

7.4.1  Fitting the mounting ball ............................................................................................. 44 

7.4.2 

Dimensions ................................................................................................................ 45 

Connector and wire specification ...................................................................................... 46 

8.1 

Main connector (AMP SUPERSEAL Connectors 1.0 mm System) ................................ 46 

8.1.1 

Plug housing .............................................................................................................. 46 

8.1.2  Receptacle contacts (1 mm) ...................................................................................... 47 

8.1.3 

Cavity plug ................................................................................................................. 47 

8.1.4  Crimping and wiring harness assembly ...................................................................... 48 

8.1.5 

Cables ....................................................................................................................... 48 

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1 General Description

1.1 Introduction

This document refers to device version 1.00.01 (1.00.05 for HY-eVision² 7.0 touch). Forinformation about version history please see the related release note document.

1.2 Interfaces and I/Os

 All eVision² inputs and outputs are protected against electrical surges and short circuits.

1.3 Advanced Programming Possibilities

eVision² runs the Linux operating system on an ARM Cortex A-8 processor. The unit can beprogrammed using CODESYS, a common IEC 61131-3 programming system that allowsdeveloping applications with a PC running Microsoft Windows®. In addition to the possibility towrite applications in Structured Text, several editors are supported, including the Instruction ListEditor, the Sequential Function Chart Editor and the Function Block Diagram Editor. CODESYSproduces native machine code for the main processor of eVision².New software can be uploaded to eVision² either via Ethernet or USB flash memory drives.

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1.4 Features

System Components

  Freescale i.MX51x application processor, based on 32 bit ARM Cortex A-8 technology,800 MHz CPU clock

  512 MByte DDR2 RAM

  1024 MByte flash memory

  7" LCD display, resolution 800x480, 16 bit RGB565

  Dimmable display backlight

  Keypad with 10 keys with key backlight  Ambient light sensor

  Buzzer

  Battery-backed real time clock

  32 kbit non-volatile FRAM memory

  Optional memory card socket

  Optional resistive touch screen

Interfaces

  2x CAN, 125 to 1000 kbit/s (4 x CAN optional)  2x analog camera inputs (FBAS/CVBS in PAL or NTSC-M)

  2x camera supply output (12 V DC)

  1x USB Host

  1x 10/100 Mbit/s Full Duplex Ethernet interface

  1 x RS232 (1200-115200 baud/s) 

  Linux serial console

  Terminal 15 input

  Internal temperature sensors for ambient and CPU temperature

  Internal expansion port for additional functionality1:o  GPS

o  GSMo  (WLAN)o  (Bluetooth)o  … 

1 For availability contact TTControl sales representative

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Physical Specifications

  Dimensions (H x W x D): 135 x 235 x 53 mm³ (without mounted connector, see chapter  7.1for details)

  Weight: 1100 g

  Ambient temperature (operating): −30°C to +60°C (-20°C to +60°C for products with touchscreen)

  IP65 rated housing

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2 Connectors and Pins

HY-eVision² 7.0 is equipped with a 34 pin TYCO Super Seal connector. Figure 1 shows theconnector layout on the backside of the device. Section 2.1 defines the pin out of the connector,while section 8.1 discusses the mating connector and its manufacturer part numbers. The detaileddescription of each signal is presented in section 2.1. 

Figure 1: HY-eVision² 7.0 backside view

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2.1 Main Connector pin out:

Connector used: TYCO 2-6447232-3Mates with: See 8.1

HY-eVision² 7.0 HY-eVision² 7.0, 4 x CAN option

Pin Direction Function Direction Function1 BAT−  BAT− 

10 BAT−  BAT− 

2 BAT−  BAT− 11  –––––––––––  NC (Reserved for future use) bidirectional CAN 2 High

3  –––––––––––  NC (Reserved for future use) bidirectional CAN 2 Low

12 bidirectional CAN 1 High bidirectional CAN 1 High

4 bidirectional CAN 1 Low bidirectional CAN 1 Low

13 bidirectional CAN 0 High bidirectional CAN 0 High

5 bidirectional CAN 0 Low bidirectional CAN 0 Low14 Video 2 GND Video 2 GND

6 in Video 2 Signal in Video 2 Signal

15 Camera 2 GND Camera 2 GND7 out Camera 2 Supply out Camera 2 Supply

16 Video 1 GND Video 1 GND8 in Video 1 Signal in Video 1 Signal

17 Camera 1 GND Camera 1 GND9 out Camera 1 Supply out Camera 1 Supply

26 BAT+ BAT+

18 in Terminal 15 in Terminal 1527 in SERVICE in SERVICE

19 Ethernet Shield Ethernet Shield28 out Ethernet TX+ out Ethernet TX+

20 out Ethernet TX−  out Ethernet TX− 29 in Ethernet RX+ in Ethernet RX+

21 in Ethernet RX−  in Ethernet RX− 30 out USB Vbus  out USB Vbus 22 bidirectional USB D+ bidirectional USB D+

31 bidirectional USB D−  bidirectional USB D− 

23 USB GND USB GND

32 out Console TX bidirectional CAN 3 Low24 in Console RX bidirectional CAN 3 High

33 Serial GND Serial GND

25 out RS232 TX out RS232 TX34 in RS232 RX in RS232 RX

For more detailed information on connectors and wires recommended to interface the HY-eVision²

7.0 please refer to chapter  8 on page 46. 

Figure 2: TYCO 2-6447232-3 Top View

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3 Specification of Inputs and Outputs

3.1 Positive power supply (BAT+)

Pinout

Connector Pin Number FunctionPin 26 Battery (+) Supply Input

Functional description

Nominal supply voltage for full operation is 9 to 32 V, including both voltage ranges for 12 V and

24 V battery systems. In the range of 9 to 11 V, only limited display backlight brightness isavailable. Below 9 V the display backlight might not work at all. The CPU is powered and workingeven down to 6 V battery supply (as defined in ISO7637 Part1 for 12 V systems).

Maximum ratings

Tambient = −30°C … +60°C

Symbol Parameter Note Min Max Unit

VBat+ max  permanent not-destructive supply voltage −32 32 V

VBat+ lim  Peak not-destructive supply clampingvoltage

1 −40  45 V

IBat+ lim  Peak not-destructive supply clamping current 1 −10 +100 AIBat+ max  Permanent input current 2 1.5 A

Td  Load dump protection according toISO7637-2, Pulse 5, Level IV

(superimposed 174V, Ri=2 )

1 350 ms

Note 1: Control unit is protected by transient suppressor diode, specified is clamp voltage, current andduration of voltage transient

Note 2: Without camera supply

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Characteristics

Tambient = −30°C … +60°C

Symbol Parameter Note min Typ max Unit

CBat+ Capacitance load at input 700 F

VBat+  Supply voltage for full operation 1 11 32 V 

VBat+  Supply voltage for full operation 2 9 32 V 

VBat+  Supply voltage for CPU operation 3 6 32 V 

Trise  Supply voltage rise time 4 3 s

IBat+ idle  Supply current at VBat+ = 9 V  5 800 1200 mA IBat+ idle  Supply current at VBat+ = 12 V 5 600 mA IBat+ idle  Supply current at VBat+ = 24 V 5 300 mA IBat+ STBY  Standby supply current at VBat+ = 12 V, 25°C  6 100  A

Note 1: Display with full backlight brightnessNote 2: Display with reduced backlight brightnessNote 3: Ultra low voltage operation during cranking, the display backlight may be turned off if Vbat+ is < 9 VNote 4: The time it takes for Vbat+ to get higher than 9 VoltNote 5: Without camera supplyNote 6: Terminal 15 is off, device shut down

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3.2 Negative power supply (BAT –)

Pinout

Connector Pin Number FunctionPin 1, 2, 10 Battery (−) Supply Input

Functional description

Supply pin for negative supply. Always use all pins on the connector to distribute current load.

Maximum ratings

Tambient = −30°C … +60°C

Symbol Parameter Note min Max UnitIBat – max  Permanent supply current 1.5 A

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3.3 Ignition on switch input (Terminal 15)

Pinout

Connector Pin Number FunctionPin 18 Terminal 15 Input

Functional description

Terminal 15 is used to switch the power supply of the eVision² device.

Power on/off sequence

Possible power on/off sequences of the device are shown in Figure 3. The device starts booting ifterminal 15 is pulled to high (typically BAT+).

When setting terminal 15 to low, there are two scenarios:

  If terminal 15 is set to low before the flash memory is mounted writeable, the device willswitch off immediately (Case B).

  If terminal 15 is set to low after  mounting the flash memory writeable, the application willbe responsible to save all data to flash and power off the device via software (Case A).This is necessary to ensure the data integrity before power off.

Figure 3: HY-eVision² 7.0 Power Sequence

# relevant case Description

1 A & B Terminal 15 high  eVision² power on

3 A Mount Flash writable4 A Application start

5 A Terminal 15 low  Application specific shutdown starts

6 A Application specific shutdown finished, eVision² power off2 B Terminal 15 low  Flash is not writeable yet  immediate power off

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For systems with a main power switch (not permanent supplied, switched BAT+ pin)terminal 15 must be set to low for sufficient time to allow the device to perform a propershutdown before it can be disconnected from the battery without corrupting data. Theshutdown sequence has to be implemented in the application software.

Maximum ratings

Tambient = −30°C … +60°C

Symbol Parameter Note min max Unit

Vin Permanent (DC) input voltage −32 32 V

Vin Transient peak input voltage 500 ms −50 50 V

Vin Transient peak input voltage 1 ms −100 100 V

Characteristics

Tambient = −30°C … +60°C

Symbol Parameter Note min max UnitCin Pin input capacitance 16 24 nF

Rpu  Pulldown resistor to GND  8 9 kΩ VIL  Input voltage for low level −1 1.8 V

VIH  Input voltage for high level 5.5 VBat+  V

in  Input low pass filter 0.1 0.3 Ms

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3.4 Service Enable

Pinout

Connector Pin Number Function

Pin 27 Service Enable (internal test function)

Functional description:

 Applying a voltage greater than 2V on the Service Enable pin at startup activates an internal testmode. This pin shall be left open (not connected) at all times.

Maximum ratings

Tambient = −30°C … +60°C 

Symbol Parameter Note Min Max Units

Vin max  Permanent (DC) input voltage -1 32 V

Characteristics

Tambient = −30°C … +60°C

Symbol Parameter Note Min Max Units

VIL  Input voltage for low level 0 0.8 VVIH  Input voltage for high level 2 32 V

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3.5 Ethernet interface

Pinout

Connector Pin Number FunctionPin 29 Ethernet RX+

Pin 21 Ethernet RX – Pin 28 Ethernet TX+

Pin 20 Ethernet TX – Pin 19 Ethernet Shield

Functional description

The 10/100 Mbit full duplex Ethernet port is compliant with IEEE 802.3. However, there is nostandard Ethernet socket provided, the Ethernet signals are located on the main connector.Be sure to use appropriate cabling according to the Ethernet standard; at least Ethernet CAT5cable for 100 Mbit/s and Ethernet CAT3 cable for 10 Mbit/s transmission speed. In a noisyenvironment it is recommended to use shielded cables. In this case, Pin Ethernet Shield has to beconnected to the shield of the Ethernet cable.

Maximum ratings

Tambient = −30°C … +60°C

Symbol Parameter Note min max UnitVin-CMM  Input common mode range DC or AC-peak

with line frequency (max 60 Hz)200 V 

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3.6 USB Host interface

Pinout

Connector Pin Number FunctionPin 30 USB Vbus 

Pin 22 USB D+Pin 31 USB D – 

Pin 23 USB Ground

Functional description

The USB Host interface is compliant with the USB 2.0 standard.Be sure to use an appropriate cable for the USB connection. For the USB data lines a twisted pairconnection has to be used. In a noisy environment the data line pair should be shielded separately.In this case, connect the cable shielding to USB Ground.If the USB interface is used to connect a removable device, provide a connector compliant to theUSB standard. This ensures that the pins of the USB interface are connected in the right order(first shield, then GND, then Vbus, then the data lines), thus preventing the interface from gettingdamaged.

Maximum ratings

Tambient = −30°C … +60°C

Symbol Parameter Note Min max Units

Lmax  Maximum cable length 1, 2 5 m

Vusb  Maximum voltage on Vbus, D+ and D−  −0.5 5.5 VVusbgnd  Maximum voltage on USB Ground −0.5 +0.5 V

Imax  Maximum current on Vbus  350 mA

Ioff   Overcurrent protection on Vbus  380 680 mA

Vin-CMM  Input common mode range DC or AC-peak with linefrequency (max 60Hz)

HS −0.05 0.5V 

LS/FS 0.8 2.5

Note 1: The maximum cable length depends on the type of cable used, the number of connectors between

the devices, the environment the cable is installed as well as the USB transmission speed modeused. As a rule of thumb, each connector pair decreases the maximum cable length by 0.5 meters ifa USB conform connector is used. If an arbitrary connector is used, the length penalty will be bigger.

Note 2: Please note that an USB high speed (HS) connection is more sensitive than an USB full speed (FS)or low speed (LS) connection. So the maximum possible cable length also depends on the kind ofperipheral connected to the USB interface.

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3.7 RS232 interface

Pinout

Connector Pin Number FunctionPin 25 RS232 TX – Serial Interface Output

Pin 34 RS232 RX – Serial Interface InputPin 33 Serial GND – RS232 Interface Ground Signal

Functional description

The RS232 interface is a RS232 compatible asynchronous full duplex serial interface. Nohandshake lines (RTS, CTS…) are provided. 

Please note that a proper ground connection is necessary for RS232 operation. It is recommendedto use the Serial GND pin for this purpose. When connecting with an external device (e.g. PC withRS232-interface) make sure that the maximum voltage ratings are not violated.

Maximum ratings

Tambient = −30°C … +60°C

Symbol Parameter Note min max Unit

VRS232x Bus voltage under overload conditions(i.e. short circuit to supply voltages)

−15 32 V

eVision² ECU

RS232Output

RS232Input

UART

TxD

RxD

Transceiver UART

TxD

RxD

Transceiver

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Characteristics

Tambient = −30°C … +60°C

Symbol Parameter Note min max Unit

Cout Pin output capacitance 100 150 pF

VIL  Input voltage for low level −15 +0.8 V 

VIH  Input voltage for high level +2.4 +15 V 

Rpd  Input resistor (to GND) 3 7 k VOL  Output voltage for low level −9 −5 V 

VOH  Output voltage for high level +5 +9 V 

STr   Data-rate 115 kBd

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3.8 Console interface

Pinout

Connector Pin Number FunctionPin 32 Console Interface Output (TX)

Pin 24 Console Interface Input (RX)

Functional description

The Console interface is a RS232 compatible asynchronous full duplex serial interface. Its purpose

is to connect the eVision² to a PC for diagnosis and provide access to the system’s shell. It is notpossible to use the Console interface for any other purpose. To connect to a PC, use a null-modem cable.Please note that a proper ground connection is necessary for Console interface operation. It isrecommended to use the Serial GND pin for this purpose. When connecting with an externaldevice (e.g. PC with RS232-interface) please make sure that the maximum voltage ratings are notviolated.The console interface is not available on devices with the 4xCAN option.

Maximum ratings

Tambient = −30°C … +60°C

Symbol Parameter Note min max UnitVmax Bus voltage under overload conditions

(i.e short circuit to supply voltages)−15 32 V

Characteristics

Tambient = −30°C … +60°C

Symbol Parameter Note min max Unit

Cout Pin output capacitance 100 150 pF

VIL  Input voltage for low level −15 +0.8 V 

VIH  Input voltage for high level +2.4 +15 V 

VOL  Output voltage for low level −9 −5 V 

VOH  Output voltage for high level +5 +9 V 

STr   Data-rate 1 115 kBd

Note 1: The data format used at the console interface is 115 kBd, 8 data bits, 1 stop bit and no parity bit.

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3.9 CAN interface - ISO 11898

Pinout

Connector Pin Number FunctionPin 13 CAN Interface 0 – High Line

Pin 5 CAN Interface 0 – Low LinePin 12 CAN Interface 1 – High Line

Pin 4 CAN Interface 1 – Low LinePin 11 CAN Interface 2 – High Line (4xCAN option only)

Pin 3 CAN Interface 2 –

 Low Line (4xCAN option only)

Pin 24 CAN Interface 3 – High Line (4xCAN option only)Pin 32 CAN Interface 3 – Low Line (4xCAN option only)

Functional description

CAN implements a bidirectional twisted pair bus for high speed serial data transfer up to 1Mbit/s.The bus must be terminated with 120 Ω at each end to prevent wave reflection. If an eVision² isconnected at the end of a CAN bus, it is necessary to use external termination resistors; Nointernal resistors are provided. Figure 4 shows the proper wiring of a CAN network.

Figure 4: CAN interface wiring

ECU1

CANController

CAN Hi h

ECU2

CANController

To next ECUs

CAN Low

CAN Hi h

CAN Low

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 A common ground (chassis) or a proper ground connection is necessary for CAN operation. Incase of connecting with an external device (e.g. PC with CAN-interface) ensure that the maximumvoltage ratings are not violated.

Maximum ratings

Tambient = −30°C...+60°C

Symbol Parameter Note min max UnitVCAN_CN

VCAN_CN

Bus voltage under overload conditions(i.e. short circuit to supply voltages)

−20 40 V

Characteristics

Tambient = −30°C...+60°C

Symbol Parameter Note min max Unit

Cout Pin output capacitance 100 pF

Vin-CMM  Input common mode range 1 −2 7 V 

Vin-dif   Differential input threshold voltage(VCAN_CNH - VCAN_CNL)

0.5 0.9 V 

Vout-dif   Differential output voltage dominant state(VCAN_CNH - VCAN_CNL)

1.5 3.0 V 

Vout-dif   Differential output voltage recessive state(VCAN_CNH - VCAN_CNL)

−0.1 +0.1 V

VCAN_CNL

VCAN_CNH

Common mode idle voltage (recessive state) 2 3 V

ICAN_CNL Output current limit −40 −200 mA 

ICAN_CNH Output current limit 40 200 mA 

STr   Bit-rate 2,3 1000 kbit/s

Note 1: Due to possible high currents in the wiring harness the individual ground potential of control units

may differ up to several volts. This difference will appear also between a transmitting and receivingcontrol unit as common mode voltage and does not influence the differential bus signal as long as itis within the common mode limits.

Note 2: The arbitration process will allow 1 Mbit/s operation only in small networks and reduced wire length. As example a so called “private CAN”, a short point to point connection (less than 10 m) betweenonly two nodes can be operated at 1 Mbit/s.

Note 3: For typical network size and topology (network with stub wires) and more than two nodes thepractical limit is 500 kbit/s.

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3.10 Analog video input

Pinout

Connector Pin Number FunctionPin 8 Video 1 Signal

Pin 16 Video 1 GroundPin 6 Video 2 Signal

Pin 14 Video 2 Ground

Functional description

The eVision² is able to handle PAL B/G/H/I/D (standard PAL) and NTSC-M (standard NTSC)compatible composite video signals (CVBS or FBAS). The inputs support automatic configurationand automatic gain control. One of the two video sources can be displayed at a time.

Maximum ratings

Tambient = −30°C … +60°C 

Symbol Parameter Note min max Unit

Vin Video in permanent (DC) input voltage −1 40 V

Characteristics

Tambient = −30°C … +60°C 

Symbol Parameter Note min max Unit

Vin Video in voltage level 0.6 1.6 Vpp 

General advice

To avoid noise on the video signals it is highly recommended to:

  use 75 Ω shielded coaxial cables (RG59, RG179 or likewise – depending on cable length)

  minimize connector and junction count

  use separate cable harnesses for the video signals and camera supplies

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3.11 Camera supply

Pinout

Connector Pin Number FunctionPin 9 Camera 1 Supply

Pin 17 Camera 1 GroundPin 7 Camera 2 Supply

Pin 15 Camera 2 Ground

Functional description

 A 12 Volt supply is provided for up to two cameras.

Maximum ratings

Tambient = −30°C … +60°C 

Symbol Parameter Note min max Unit

Vsc Short circuit voltage range 0 Vcam  V

Characteristics

Tambient

 =−

30°C…

+60°C

Symbol Parameter Note min max UnitVcam  output voltage 1 11 13 V

Vcam  output voltage 2 VBat+ −1 VBat+ 

Iout  overall output current 3 600 mA

Note 1: VBat+ > 13 V

Note 2: VBat+ < 13 VNote 3: Sum of all camera supplies

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4 Extension modules

4.1 GSM module (HY-eVision²wave 7.0 variants only)

 An eVision² equipped with a GSM module is able to communicate wirelessly via a GSM network.Currently, it cannot be accessed by software directly but only used in conjunction with TTControlService Tool. Please ask your sales representative for more information.

The GSM antenna must be connected to the corresponding antenna jack of the eVision².The

antenna jack for connecting the GSM antenna is located on the rear side of the housing andmarked with the letter “A” as shown in Figure 9. 

The requirements of the antenna are stated in the table below.

 A SIM card is provided by the operator of the GSM network. Together with a password (the PINnumber) it is needed for authentication with the network operator to enable the module to login tothe GSM network. The specifications of the SIM card are denoted in the table below.

The GSM antenna must be installed in a way to provide a separation distance of at least

20  cm (8 inch) from all persons at any time and must not be co-located or operating inconjunction with any other antenna or transmitter. Furthermore, the GSM antenna should

not be placed near other electronic devices or cabling to prevent interference with thecorrect operation of other devices.  Do not connect or disconnect the antenna while theeVision² is powered on.

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Characteristics

Symbol Parameter Note min max UnitTambient  Normal operation −30 +55 °C

Tambient  Restricted operation 1 +55 +60 °C

Supported frequency bands Quad band:GSM 850/900/1800/1900MHz

Output power 2 Class 4 (+33dBm ±2dB) for EGSM850Class 4 (+33dBm ±2dB) for EGSM900Class 1 (+30dBm ±2dB) for GSM1800Class 1 (+30dBm ±2dB) for GSM1900

Data transfer GPRS:• Multislot Class 12• Full PBCCH support • Mobile Station Class B • Coding Scheme 1 – 4• PPP-stack available

CSD:• V.110, RLP, non-transparent• 2.4, 4.8, 9.6, 14.4kbps • USSD 

SMS Point-to-point MT and MOCell broadcastText and PDU modeStorage: SIM card plus 25 SMS locations inmobile equipmentTransmission of SMS alternatively overCSD or GPRS. Preferred mode can beuser defined.

Fax Group 3; Class 1

SIM card Micro SIM operating at 3V or 1.8V Antenna type Passive

 Antenna impedance 50Ω 

 Antenna gain 3 0 2 dBRTC backup Yes, via BAT+ pin

Note 1: Deviations from the GSM specification may occurNote 2: These are maximum numbersNote 3: Including cable loss

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4.2 GPS module (HY-eVision²wave 7.0 variants only)

The GPS module is used to connect the eVision² device to the global positioning system. Itprovides longitude and latitude coordinates of the actual position of the receiver as well as theactual time. It can be used for navigation applications; the actual time can be used to set the on-board real time clock on the main board. The reference point on the vehicle of the delivered GPScoordinates is the position of the antenna.

The antenna jack for connecting the GPS antenna is located on the rear side of the housing andmarked with the letter “B” as shown in Figure 9. 

Do not connect or disconnect the antenna while the eVision² is powered on. Do not placethe GPS antenna near the GSM antenna.

Characteristics

Tambient = −30°C … +60°C

Symbol Parameter Note min typ max UnitReceiver type 50 Channels

GPS L1 frequency, C/A CodeSBAS: WAAS, EGNOS, MSAS, GAGAN

Time-To-First-Fix Cold Start (Autonomous) 1 32 sWarm Start (Autonomous) 1 32 s

Hot Start (Autonomous) 1 1 s

 Aided Starts 1, 2 3 sSensitivity Tracking & Navigation −160 dBm

Reacquisition −160 dBmCold Start (Autonomous) −146 dBm

Navigation update rate  1 5 Hz

Volatile memory & RTC backup supply system 3 Yes, via BAT+ pin

Horizontal position accuracy 4 2.5 m

Velocity accuracy 0.1 m/sHeading accuracy 0.5 °

 Antenna type active antenna Active antenna gain 15 50 dB

 Active antenna noise figure 1.5 dB Active antenna supply voltage 5 3.1 3.3 3.5 V

 Active antenna supply current 10 50 mA

Note 1: All satellites at −130 dBmNote 2: Dependant on aiding data connection speed and latencyNote 3: Memory content and RTC functionality is preserved as long as BAT+ is connected to vehicles

battery.Note 4: CEP, 50%, 24 hours static, −130 dBm, SEP: < 3.5 m 

Note 5: Antenna signal line / supply voltage is not protected against short circuits to battery voltage VBat+

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4.3 Inserting of Micro SIM and memory card

HY-eVision²wave 7.0 (the product variant with GSM modem and GPS receiver) features a servicehatch on the rear side of the hosing as shown in Figure 5. 

Figure 5: HY-eVision² 7.0 housing rear view (service hatch opened) 

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To open the service hatch a Torx T10 screw driver is needed to loosen two screws holding thehatch cover in place. Whenever the service hatch is opened take care to not lose the seal. Whenthe hatch cover is removed you have access to the memory card and Micro SIM card slots.

The socket for the memory card (upper slot) has a push-push mechanism. Insert the memory cardwith the contacts facing downwards into the upper socket and push it until it locks in place. Toremove the card, gently push it to release it from the socket.

Insert the Micro SIM card into the lower slot with the contacts facing upwards and push it gently into block. The chamfered edge of the Micro SIM card shall face to the outwardly to the left. Toremove the Micro SIM card use a pair of tweezers to gently pull the Micro SIM card out.

Before closing the service hatch check that the seal is clean and on its place. Tighten the screwswith 0.8 Nm.

Note: Opening the service hatch shall be performed in dry and clean environments only to preventingress of moisture or dirt (e.g. dust) into the device. If the rear side of the device is dirty clean itwith a damp cloth before opening the service hatch.

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5 Internal structure

This section gives a brief overview about the internals of the eVision². Figure 6 shows a blockdiagram of the device. The optional components are drawn in gray.

Figure 6: Block diagram 

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5.1 Temperature sensors

To allow monitoring of the internal temperature, the eVision² is equipped with two temperaturesensors. One measures the ambient air temperature within the housing, the other one is thermallycoupled to the case of the CPU.

Characteristics

Tambient = −30°C … +60°C

Symbol Parameter Note min max Unit

Top Measure temperature range −40 +125 °CTacy  Temperature accuracy at −40°C to 125°C −4 +6 K

5.2 Beeper

 A piezo beeper is mounted within the eVision² housing. It is activated via software.

Characteristics

Tambient = −30°C … +60°C

Symbol Parameter Note min max Unit

F  Beep frequency 2400 3400 HzSPL Sound pressure level, 1m distance, right

angle to the display front- 60 dBA

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5.3 Real time clock (RTC)

The eVision² includes a real-time clock with backup power system. When the eVision² is connectedto the vehicle’s battery via the BAT+ pin, the real-time clock is supplied by the vehicles batteryregardless if the device is operational or in power-off mode. If BAT+ is disconnected, the real-timeclock is supplied by an internal super-capacitor. The super-capacitor provides approximately 14days of backup time if fully charged. It is charged if the BAT+ pin is connected to the vehiclesbattery. If the device is switched on, the capacitor is fully charged in 2 hours. If the device is inpower off mode, only trickle charging is performed. Trickle charging an empty super capacitortakes at least 72 hours.

Characteristics

Tambient = −30°C … +60°C

Symbol Parameter Note min max Unit

t/day  Time variation per day at 25°C 1 −2 +2 s/day

tpr   RTC power reserve 2 14 days

Note 1: This value is measured and for reference onlyNote 2: If super-capacitor has been charged for at least 2 hours with VBat+  > 9V and device power isswitched on

5.4 Flash memory

User data can be divided into two categories: large amount of constant data (e.g. applicationprogram, pictures, manuals…) and small amounts of permanently changing data (e.g. operatingtime counter, power cycle counter …).The eVision² provides dedicated storage memory types for each category:

  NAND-flash storage, which is a huge and fast memory array but with limited write cycles

  FRAM storage, which is rather small but provides virtually unlimited write cycles

Characteristics

Tambient

 = −30°C … +60°C

Symbol Parameter Note typ. Unit

NAND flash memory available for user data 700 MByteNAND flash data retention  10 years

NAND flash erase/write cycles per erase block 1 100000 cyclesFRAM memory available for user data 4 kByte

FRAM data retention 38 years

FRAM erase/write cycles per byte 1014  cycles

Note 1: Erase block size: 512 kByte; Intelligent wear level algorithms distribute erase/write cycles among allavailable blocks. For details refer to the UBI homepage at http://www.linux-mtd.infradead.org/doc/ubi.html

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6 Device front

HY-eVision² 7.0 is equipped with a keypad with ten freely programmable keys. The blue framesaround the keys are embossed and feature an illumination which can be turned on / off bysoftware. On the upper left corner of the device front an ambient light sensor is located.

Figure 7: front view of HY-eVision² 7.0 

6.1 Display

HY-eVision² 7.0 is equipped with a 7 inch TFT Liquid Crystal Display module with a resolution of

800 x 480 pixels (WVGA) and a LED backlight unit.

Characteristics

Tambient = −30°C … +60°C

Symbol Parameter Note min typ UnitLC  center luminance of white 400 500 cd/m²

CR contrast ratio 500 600

tL  LED Life Time of backlight unit 1 50000 h

Note 1: The lifetime of LED operated at an ambient temperature of 25 ±2 °C is defined as the time until thebrightness reaches≦ 

50% of its original value. Please note that LED life will be shorter than the average life

described in the specification if operated in higher ambient temperature.

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6.2 Keypad

The keypad of HY-eVision² 7.0 consists of ten freely programmable keys  – five to the left and fiveto the right of the display.

Characteristics

Tambient = −30°C … +60°C

Symbol Parameter Note min max Unitactuations 500000 cycles

actuation force (at center of key) 0.4 0.6 N

Please note: Pressing more than two keys at a time is not supported.

6.3 Keypad illumination

The keypad illumination was designed to facilitate operation of the keys at night-time or in darkenvironments. It is based on an EL lamp which can be turned on / off by application software.

Tambient = −30°C … +60°C

Symbol Parameter Note min max Unit

⁄   half-life period (at 25°C) 1 5000 h

LV  Luminance 25 cd/m²

Note 1: Elevated temperatures during operation degrade efficiency of the lamp. To improve the life time ofthe lamp, duration of operation at elevated temperatures shall be minimized.

6.4 Ambient light sensor

The ambient light sensor has been integrated to obtain the ambient light data for adjusting the LCDbrightness and control the keyboard illumination via application software.

Tambient = −30°C … +60°C

Symbol Parameter Note min max Unit

Ev  illuminance 0 65535 lx

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6.5 Touchscreen (HY-eVi si on² 7.0 touch  products only)

Figure 8: front view of HY-eVision² 7.0 touch 

HY-eVision² 7.0 touch is equipped with a 4-wire resistive touchscreen designed to be used as aninput device for the application running on the device. It can be operated by bare finger and / orgloves. Multi-touch gestures (e.g. press by more than one finger at a time) are not supported bythe touchscreen.

Tambient = −20°C … +60°C 

Symbol Parameter Note min max Unit

 Activation force 0.8 NLife performance 106  actuations

Positional accuracy (linearity) 1 ±2 %

Surface hardness (according to ASTM D3363) 3 H

Note 1: All HY-eVision² 7.0 touch products run through a touch calibration process during manufacturing.Due to aging effects it may be necessary to repeat the calibration of the touchscreen from time to time.TTControl provides a software library to integrate calibration routines into the user application.  

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6.6 Appearance

6.6.1 Acceptance criteria for scratches, dust and bubbles

The following table specifies acceptance criteria for defects such as scratches, dust and bubbles inthe viewing area of the tempered glass and touchscreen.

Item Width (mm) Length [mm] Acceptable quantity Total

Linear(for diameter >0.1mm refer to

Circular)

0.050 < W ≤ 0.100  L ≤ 4 ≤ 2 pcs in Ø30mm

≤ 4occurrences

per product

0.025 < W ≤ 0.050 L ≤ 10 ≤ 3 pcs in Ø20mm0.010 < W ≤ 0.025 L ≤ 20 acceptable

W ≤ 0.010 acceptable acceptableCircular 0.25 < D ≤ 0.63 ≤ 3 pcs in Ø30mm

D ≤ 0.25 ≤ 4 pcs in Ø10mm

Definition:W = widthL = length

D = average diameter =( + )

 

Inspection parameters: Light shall be projected straight from above at an intensity of 1000 ±200 lux at the center of the

product. The product shall be tilted 55 ± 10° to the horizontal plane.Inspection carried out by an examiner with 1.0 (or better) eye sight at a distance of 60 cm from theproduct.

6.6.2 Pillowing

Pillowing of the touchscreen surface may occur in high temperature and / or humidityenvironments.

Symbol Parameter Note min max UnithP  Pillowing height 0.8 mm

Pillowing height can be determined as follows:

Use A and B as reference points and calculatepillowing height hP using the followingequation:

ℎ =( − ) ( − )

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6.7 General advise

The touchscreen is a sensitive component. It is constructed from two layers of material (a thinplastic foil and a glass sheet) with a small space between them. When pushing on the surface (thethin plastic foil) the two layers are pressed into contact and a touch event is registered.To prevent damage of the touchscreen protect it from excessive mechanical forces (e.g. hit) andenvironmental loads. Excessive mechanical force may result in breakage of the touch glass.

Do not use hard, sharp or spiky objects to operate the touchscreen as this will result in damage ofthe surface layer and render the touchscreen inoperable.

The touchscreen surface shall be kept clean of abrasive particles (e.g. sand, metal swarf) at anytime. Operation of the touchscreen with abrasive particles on it will result in roughening of thesurface. Over time this affects visibility of the display as it will render the screen dull and fuzzy. Forthe same reason do not use paper towels or paper tissues for cleaning as they contain wood fibersand will scratch the plastic surface.

 

The touchscreen is calibrated during production of HY-eVision² 7.0. Depending on theenvironmental conditions in which HY-eVision² 7.0 is operated recalibration of the touchscreenmay be needed from time to time.

6.8 CleaningFor cleaning of the touchscreen follow the following instructions:

  Use a soft, lint-free cloth (e.g. soft cotton or micro fiber cloth).

  The cloth may be used dry, or lightly dampened (not wet) with water.

  Wipe the surface gently, do not use excessive force.

  If needed a mild, pH neutral cleaner can be used.

  Never use acidic or alkaline cleaners, or organic chemicals such as paint thinner, acetone,toluene, xylene, propyl alcohol, isopropyl alcohol or kerosene.

  Never apply cleaner directly to touch panel surface. In case cleaner is spilled onto thetouchscreen soak it up immediately with absorbent cloth.

Use of inappropriate cleaners or cleaning methods can result in optical derogation of thetouchscreen and / or affect functionality.

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7 Housing & Mounting

HY-eVision² 7.0 housing is intended for both panel mounting and stand-alone mounting. Figure 9and Figure 10 show the housing with detailed dimensions. The housing assembled with mountingbracket is shown in Figure 12.  The required mounting space and panel cut-out dimensions aregiven in Figure 13. 

7.1 Housing dimensions

Figure 9: HY-eVision² 7.0 housing backside view with dimensions 

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Figure 10: HY-eVision² 7.0 housing bottom view with dimensions

Figure 11: HY-eVision² 7.0 touch housing bottom view with dimensions 

7.2 General mounting instructions

7.2.1 Mounting

  Permitted application area: passenger car, off-highway vehicles.

  Permitted mounting position: chassis and cabin

  Device in mounting position must not bounce

  Device has to be mounted in such a way that the pressure compensation element and theconnectors for the wiring harness are not exposed to direct splashing water.

  Device has to be mounted in such a way that its connectors are freestanding in order toallow its counterparts to be connected without obstructions.

7.2.2 Cable harness

  Cable harness needs to be fixed mechanically in the mounting position of the device toavoid mechanical stress to the connectors and possible failure of the connection caused byvibrations or weight of the cable harness.

  Cable harness needs to be fixed in such a way that, in case of an excitation, the cableharness is in phase with the device (e.g. at the fixing point of device).

7.2.3 General advice

  It has to be assured that no water can leak into the device through the wiring harness.Please refer to chapter  8 on page 46 and the documents from the connector manufacturer

referenced for detailed information on this topic.

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  The pressure compensation element as well as the sealing must not be submerged inwater.

7.2.4 Mounting position and alignment

Mounting position and alignment of the device shall be chosen in such way that:

  The device is protected against environmental loads such as excessive sunlight, rain, hailand snow.

  Water can easily drain off (no standing water on any surfaces of the device).

  The device is protected from excessive mechanical forces (e.g. hit) which could lead to

break of glass or damage of the housing.  Overheating of the device is prevented by allowing natural convection and ensuringprotection against external heat sources.

  The surrounding temperature is equal on (and acts equally to) all sides of the device.Elevated temperatures on the backside of the housing may lead to temporary fogging of thefront glass.

7.3 Panel mounting option

Figure 12: HY-eVision² 7.0 housing rear and side view with mounting bracket

For preparation of the device, screw the headless screw into the metal insert on the rear side ofthe device and pull the screw with a torque of 1 Nm.

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To mount the device into the panel insert it from the front side into the panel cut-out shown inFigure 13. Insert the mounting bracket from the back side and fix it using the butterfly nut. Tightenthe nut hand-tight (2 Nm max).

Figure 13: Recommended panel cut-out dimensions

Please note: The keep out / display frame area must be planar and clean to ensure a tight fit ofpanel backside and mounting surface.

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7.4 Stand-alone mounting option

7.4.1 Fitting the mounting ball

Figure 14: Fitting the mounting ball 

1: Socket head cap screw (Metric M8 x 45)2: 1.5 inch mounting ball

To fix the mounting ball to the housing, insert the socket head cap screw into mounting ball asshown in Figure 14 and pull the screw with a torque of 6 Nm.

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To prevent unintended slackening due to vibration thread locker (e.g. Loctite 222 low strengththread locker) may be applied.Note: Please use low strength thread locker only as using higher strength thread locker couldresult in unscrewing the metal insert from the housing when trying to loosen the linkage.

7.4.2 Dimensions

Figure 15: HY-eVision² 7.0 housing dimensions with mounting ball

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8 Connector and wire specification

8.1 Main connector (AMP SUPERSEAL Connectors 1.0 mm System)

The following sections contain useful information on the AMP Superseal 1.0 mm connector systemused as main connector on the HY-eVision² 7.0. For full specification please refer to TycoElectronics document number 108-78140.

8.1.1 Plug housing

Manufacturer: Tyco ElectronicsPart Number:  4-1437290-0 Pin count: 34Keying:  Type 1, Locking Single

Figure 16: Main connector (4-1437290-0) plug housing dimensions

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8.1.2 Receptacle contacts (1 mm)

WireSize

Range(mm²)[AWG]

InsulationDiameter

(mm)Material and Finish

Part Numbers

Strip Form Applicator 2  Hand Tool

0.50[20]

1.6-2.2 Copper Alloy

Gold over Nickel (Contact Part)Tin over Nickel (Crimp Area)

3-1447221-4  x-1463174-x  1454509-2 

0.75-1.25

[18-16] 

1.8-2.4 Copper Alloy

Gold over Nickel (Contact Part)

Tin over Nickel (Crimp Area) 

3-1447221-3  x-1463173-x  1454509-1 

Figure 17: Receptacle Contacts dimensions

8.1.3 Cavity plug

Part Number:  4-1437284-3

Figure 18: Cavity Plug dimensions 

2 The pre- and suffix for the applicators depends on the applied termination equipment. 

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8.1.4 Crimping and wiring harness assembly

The contacts shall be crimped in accordance with “Crimping Specification”, Tyco Electronicsdocument number 114-78011 and 114-78016. For detailed instructions on how to assemble thewiring harness with the AMP Superseal 1.0 mm connector System please refer to the instructionsheet with the Tyco Electronics document number 411-78017.

8.1.5 Cables

Cables with these specifications have to be used to provide proper signal quality and correctcrimping. 

Function  Type, mm2 [AWG]

Suppliers (suggestions)  Pins (34-pin AMP) 

Supply 0.5 [20] 1,18,26,27 

CAN CAN cable(twisted pair, differential,characteristic admittance 120ohms) 

LEONI Dacar® 56276731010A2x0,5

Leoni FieldLink®L45551-C22-C52x2x0.5 

5,13,4,12 

RS232, Console 0.5 [20] 25,33,34; 24,32,33 

Ethernet CAT5 Ethernet cable LEONIL45467-J15-B152YH(ST)CY 4X2X0.5.0/1.0 GN

Böhm Cable “FTP100 4P” J-02YS(ST)H 4x2x0,51

19,20,21,28,29 

USB USB cable(twisted signal pair,double shield)- see

LEONI Dacar  ®  51876981065A(2x0.35)+2x0.35+(0.35)

22,23,30,31 

Video signal Shielded video cable(Coax Type, 75 ohmsimpedance, signal cable)- see 

Leoni Camera Cable 31080x(x..2,3,4)

Lapp Cable RG-11 A/U2170009

8,16; 6,14 

Video supply 0.5 [20] 9,17; 7,15 

3 USB/Video cable: In order to fulfill the crimping specification you have to take measures e.g. toextend the cable with a thicker cable (0.5 mm2 [AWG20]) shortly before the AMP connector to notaffect the signal quality. Be aware to extend it using a shrinking tube for IP65 tightness.This figure shows a possible way to extend the video cable to crimpable cables:

shrinking tubes soldering

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8.2 Connectors for GSM and GPS antennas(HY-eVision²wave 7.0 product variants only)

The HY-eVision²wave 7.0 provides two SMA RF bulkhead jacks (female) on the backside of thehousing. The jack for the GSM antenna is marked with the letter “A”  and the jack for the GPS withthe letter “B”.

 Antennas connecting to jacks “A” and “B” must be equipped with mating SMA plugs (male) asdefined in standard MIL-C-39012 and shown in Figure 19. 

Figure 19: SMA male plug (left) and protective cap (right)

Please refer to chapters 4.1 and 4.2 for details on electrical requirements for the antennas.

To prevent ingress of water or dust into the device please use non-shorten protective caps forfemale SMA jacks (with IP6k5 rating or better) on all antenna jacks not used in your application.

Please note: Do not interchange antennas as this may lead to damage of the device.

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Disposal

Disposal of the device shall be performed in accordance with prevailing national environmental regulations.

Disclaimer

While every precaution has been taken in the preparation of this document, the publishers assume noresponsibility for any remaining errors or omissions, or for damages resulting from the use of the informationherein.

Copyright © 2001 –2014 TTControl GmbH. All rights reserved.


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