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HyperTransport™ Technology in 2009 and Beyond in 2009 and Beyond Mike Uhler VP, Accelerated Computing, AMD d C President, HyperTransport Consortium February 11, 2009
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HyperTransport™ Technology in 2009 and Beyondin 2009 and Beyond

Mike UhlerVP, Accelerated Computing, AMD

d CPresident, HyperTransport Consortium

February 11, 2009

Agenda

AMD Roadmap Update

Torrenza , Fusion, Stream Computing and Accelerated Computing

The HT Consortium: Thoughts on the Past, Present, and FutureFuture

Summary and Conclusions

| HT Technology in 2009 and Beyond | February 11, 20092

AMD Roadmap Update

| HT Technology in 2009 and Beyond | February 11, 20093

AMD Cross-Generation x86 Server Platforms Roadmap

2010201020082008 200920092007200720062006 2010201020082008 200920092007200720062006

“Magny-Cours”

“Sao-Paulo”Longevity – long platform life

Flexibility – power vs. performance choice

MaranelloNew DDR3 Platform

“Istanbul”6 Core

“Shanghai”ShanghaiQuad-Core

Fiorano

DualCore Quad-Core

FioranoNext-Generation DDR2 Platform with

Improved Virtualization Features

Currently Shipping DDR2 PlatformsDDR2 Memory with AMD-V™ Technology

| HT Technology in 2009 and Beyond | February 11, 20094

AMD roadmap subject to change without notice

AMD Client Processor Roadmap: 2008-2011

2008

EnthusiastDesktop

2009 2010Segment

Deneb4 cores8M cache

2011

Orochi> 4 cores> 8M cache

Agena4 cores4M cache, DDR2

NEW

pDDR2/3

MainstreamDesktop

Propus4 Core2M cacheDDR2/3

Llano4 cores4M cache

DDR3,

*APU

MainstreamNotebook

Champlain4 cores 2M cache

Caspian2 cores2M cache

Griffin2 cores2M cache

DesktopDDR2/3 DDR3

GPU

NEW NEW

Notebook 2M cacheDDR3

2M cacheDDR2

2M cacheDDR2

Geneva2 cores

Conesus2 cores

Ultraportable

Ontario2 cores

NEW NEW *APU

Mini-Notebook

2M cacheDDR3

BGA

1M cacheDDR2

BGA

Ultraportable 1M cacheDDR3GPU BGA

65nm process 45nm process 32nm process* Accelerated Processing Unit

| HT Technology in 2009 and Beyond | February 11, 20095

65nm process 45nm process 32nm processAMD roadmap subject to change without notice

1H 2009 GPG Roadmap Snapshot

ATI

ATI Radeon™

RV790

ATI RadeonDesktop

Tigris 2H09

ATI Radeon™

RV740ATI Mobility Radeon™

M97ATI FirePro™

ATI RadeonDesktop

RV790

ATI FirePro

DesktopGraphics

Card40nm

ATI FirePro™V2450

ATI MobilityRadeon

Performance

ATI FireProHigh End

3D W k i

ATI FirePro™V7750

GraphicsCard

2DWorkstation

GraphicsCard

TransitionGraphicsProcessor

3D Workstation

Graphics

Card

Card

ProfessionalGraphics

NotebookGraphics

DesktopGraphics

| HT Technology in 2009 and Beyond | February 11, 20096

p p p

Torrenza, Fusion, Stream Computing and Accelerated Computing

| HT Technology in 2009 and Beyond | February 11, 20097

ATI Stream-enabled Software Applications Leverage the Massive Parallel Processing Capability of the GPU

Graphics Workloads

Data Parallel Workloads

Graphics Workloads

Serial and Task Parallel Workloads

| HT Technology in 2009 and Beyond | February 11, 20098

Accelerated Computing

Platform Level A

HTXAccelerator AMD

Processor

Acce

lera

tor

CP

U

Acce

lera

tor

CPU

NB

Add-in

PCIe®

Accelerator

PCIe®

Chipset

Accelerator

Chipset

A l t

Processor

Package levelintegration

Silicon levelintegration

Add in p

Socket compatible

Accelerator

AMD OpteronSocket

Silicon Level

compatible accelerator

Coherent Domainnon-Coherent Domain

| HT Technology in 2009 and Beyond | February 11, 20099

The Future is Fusion

Graphics & VideoLeadership

CPU Leadership

Fusion is AMD's new corporate brand and a working philosophy that captures our main differentiating strengths It represents the coming together of strengths. It represents the coming together of people, ideas, and technologies to deliver next-

generation solutions for people at work, home and play.

| HT Technology in 2009 and Beyond | February 11, 200910

The HT Consortium:Thoughts on the Past Present and FutureThoughts on the Past, Present and Future

(In my role as HT Consortium President)

| HT Technology in 2009 and Beyond | February 11, 200911

HT, PCIe, and QPI Roadmaps:Past, Present, and Future

2001 2002 2003 2009 20102004 2005 2006 2007 2008

???1.01.63.2

1.11.63.2

HT RevGT/sGB/s

2.02.85.6

3.05.210.4

3.16.412.8

3.08.016.0

1.x2.04.0

2.04.08.0

PCIe RevGT/sGB/s

???1.06.412.8

QPI RevGT/sGB/s

All bandwidth values 16-bit unidirectional

| HT Technology in 2009 and Beyond | February 11, 200914

HT, PCIe, and QPI: The Future

Two other standards now competing for interconnect roles

PCIe extending beyond pure ‘peripheral’ interconnect– Coherency, cache injection, atomics, power management,

virtualization features

– Industry-wide investmenty

– Higher bandwidth

QPI developed by Intel– Including a role for external accelerator attach

But, HT is a superior and time-proven standard

| HT Technology in 2009 and Beyond | February 11, 200915

Summary and Conclusions

HT has a long history of leading-edge development and market success, with continued support in AMD products

The HT development model has successfully transitioned from an AMD-centric to a consortium-centric approachfrom an AMD centric to a consortium centric approach

2009 looks to be an exciting and transformative year for g ythe evolution of the HT standard and I’m excited to be part of this effort

| HT Technology in 2009 and Beyond | February 11, 200916

DISCLAIMER

The information presented in this document is for informational purposes only and may contain technical inaccuracies, omissions and typographical errors.

The information contained herein is subject to change and may be rendered inaccurate for many reasons, including b t t li it d t d t d d h t d th b d i h d l d/ but not limited to product and roadmap changes, component and motherboard version changes, new model and/or product releases, product differences between differing manufacturers, software changes, BIOS flashes, firmware upgrades, or the like. AMD assumes no obligation to update or otherwise correct or revise this information. However, AMD reserves the right to revise this information and to make changes from time to time to the content hereof without obligation of AMD to notify any person of such revisions or changes.

AMD MAKES NO REPRESENTATIONS OR WARRANTIES WITH RESPECT TO THE CONTENTS HEREOF AND ASSUMES NO RESPONSIBILITY FOR ANY INACCURACIES, ERRORS OR OMISSIONS THAT MAY APPEAR IN THIS INFORMATION.

AMD SPECIFICALLY DISCLAIMS ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. IN NO EVENT WILL AMD BE LIABLE TO ANY PERSON FOR ANY DIRECT, INDIRECT, SPECIAL OR OTHER CONSEQUENTIAL DAMAGES ARISING FROM THE USE OF ANY INFORMATION CONTAINED HEREIN EVEN IF AMD IS EXPRESSLY ADVISED OF THE POSSIBILITY OF SUCH DAMAGESHEREIN, EVEN IF AMD IS EXPRESSLY ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.

Trademark Attribution

AMD, the AMD Arrow logo, ATI, the ATI logo, AMD-V, FirePro, Mobility, Radeon and combinations thereof are trademarks of Advanced Micro Devices Inc in the United States and/or other jurisdictions HyperTransport is a trademark of the Advanced Micro Devices, Inc. in the United States and/or other jurisdictions. HyperTransport is a trademark of the HyperTransport Technology Consortium. Other names used in this presentation are for identification purposes only and may be trademarks of their respective owners.

©2009 Advanced Micro Devices, Inc. All rights reserved.

| HT Technology in 2009 and Beyond | February 11, 200917


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