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Agilent Restricted
In Circuit Test for Automotive Industry
By Sam Wong
Agilent Technologies
Business Development Manager
Page 1
Agilent Restricted
1. The Automotive Electronics Industry
2. Challenges in the Automotive industry ICT
3. How did Agilent solved these Challenges
4. More of Agilent ICT Features to meet your needs
5. Questions and Answers
Page 2
Agenda
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1. The Automotive Electronics Industry
2. Challenges in the Automotive industry ICT
3. How did Agilent solved these Challenges
4. More of Agilent ICT Features to meet your needs
5. Questions and Answers
Page 3
Agenda
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Page 4
Automotive Electronics in Cars Today
Body Electronics - Comfort / Convenience
- Instrument Cluster
- Remote Keyless Entry
- Climate Control
Power Train & Hybrid - Engine Management
- Braking System
- Power Steering
- EV and HV
Infotainment &
Communications - Audio Systems
- Multimedia Systems
- Rear Seat Entertainment
Safety and Driver
Assistance - Adaptive Cruise Control
- Collision Warning
-Tire pressure Monitoring
- Airbag Time to market and market penetration periods
are becoming shorter , example ABS started in
1970s and take 20 years for mass acceptance.
It’s typically accepted to be 2 to 7 years today
Agilent Restricted
1. The Automotive Electronics Industry
2. Challenges in the Automotive industry ICT
3. How did Agilent solved these Challenges
4. More of Agilent ICT Features to meet your needs
5. Questions and Answers
Page 5
Agenda
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INTENSE COST PRESSURE
• Fierce competition in the global market
• Customers expecting more functionality, better quality and at lower cost
• Lower equipment cost
• Lower deployment cost
• Lower cost of ownership
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General ICT Challenges in the Industry
LOST OF TEST ACCESS
• Increased board functionality
• Highly dense board and design complexity
• No layout space for targets
• Finer trace-spacing routing
• Higher frequencies
0%
20%
40%
60%
80%
100%
1990 1995 2000 2005 2010 2015
In Traditional ICT,
Lost of Access = Lost of
Test Coverage
Test Access (%) over the years
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ICT Challenges in Automotive Industry
Mandatory Programming of Serial Controllers and
Serial Protocol Testing (example CANBUS,
FlexRay, LIN)
Increase in IC functionality, Use of Boundary Scan
in Testing and Larger Memory devices
Reduction in Cycle Time with Increasing Nodes
Count, example 1200 nodes in Engine controllers
and Electric Car Modules.
1
2
3
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4 Global deployment with hardware / fixture support
– programs transportability and guarantee
protection of zero unauthorized change.
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Fast
Faster
Fastest
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Challenge #1: Larger Boards and Faster Cycle Time
Engine controllers modules have node counts that
are close to the limit of a single 3070 module.
In
Circuit
Test
Pretest
with/without
temperature
Final
Test
Programming
Station
Production
Challenges and
Concerns:
Quality, Product
Traceability,
Costs, etc
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Boundary Scan usage, IC BIST and IC embedded
measurement capability will increase and be
accessible through the boundary scan port.
Challenge #2: Larger IC with Increased functionality
Boundary scan usage
Page 9
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Programmable Device Market Analysis
Technology Trends
ICT Flash Programming Solution
Challenge #3: Mandatory On Board Programming
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Challenge #4: Worldwide deployment Management
Software revision control
Local Support for fixtures
Local Application expertise
System configurations differences
Spare parts inventory management
Quality
Time
Cost
Agilent Restricted
1. The Automotive Electronics Industry
2. Challenges in the Automotive industry ICT
3. How did Agilent solved these Challenges
4. More of Agilent ICT Features to meet your needs
5. Questions and Answers
Page 12
Agenda
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Average price of a 3070 have steadily declined over 50% in the last
10 years, while test throughput has increased.
Advanced parallel testing capability with Throughput Multiplier and
Dual Well fixturing
2x throughput for CET and increased ICT throughput with ASRU-N
and VTEPv2.0 enhancements
Agilent’s respond to ICT Cost of Ownership
Page 13
By Bill Lycette & Duane Lowenstein, IEEE 2010 Paper, The
Real Total Cost of Ownership of Your Test Equipment
Continued R&D emphasis on
compatibility and upgradeability
with previous generation ICT, to
preserve your investments
Lower deployment costs and
lower cost of ownership
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Agilent’s Respond to Limited Access Challenges
Page 14
Suite of Test Point Accessibility Technology
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Page 15
Agilent’s Response to challenge #1
Larger Boards and Faster Cycle Time
Build in Features • Panel Test
• Throughput Multiplier
• Dual Well Fixture
• Vacuum Fixture
• FPY Monitoring
Platform Scalability • S1, S2 to S5
• Expandable slots
• Module Activation
Throughput by bank
New ASRU-N cards will give
20% to 30% faster Tests Time by
using the Digitized Measurement
Circuits
Includes Power Monitoring
Circuit to prevent damage to ICs
during debug and testing
A 1259 node board with 1670 Analog and 44 Digital Components
Coming
Soon
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Agilent solutions provide full support and diagnostics for IEEE 1149.1
and IEEE 1149.6
Cover Extend Technology test devices connected to Boundary Scan
components.
Leading IEEE 1149.1 extensions for IC Initialization
Leading IEEE 1149.8.1 standard – Vectorless test extensions
Participating in IEEE 3D IC test study committee
IC Embedded Measurement technology
Multiple divisions contributing R&D, Marketing and Sales resources to
leverage Agilent’s expertise and technology to deliver embedded
measurements.
Participating with iNEMI working group to leverage IC BIST
Participating in IEEE P1687(IJTAG) working group
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Agilent’s Response to challenge #2
Larger IC and Increase in Boundary scan usage
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COMPLETE BUNDLE AVAILABLE.
• PC Controlled (Ethernet).
• Four TAP/IO.
- 1x TAP(TMS,TCK,TDI,TDO).
- 4x Digital input ports.
- 5x Digital output ports.
• One Diagnostic Clip.
• Add-on Cover-Extend Technology capability
- Vectorless testing of ICs or Connectors through boundary scan
• Scan Path Linker
- Connecting physically separate chains to test the interconnecting nets
NEW
Page 17
Agilent’s response to challenge #3:
Mandatory On Board Serial Programming
Lower Cost
Reduced inventory of pre-programmed device
Fewer devices damaged by handling
Increase flexibility in code or engineering
changes
Ease of implementation
A wide range of supported device protocols, with
extensive device coverage
Collaboration with programmer partners, end
users will have a significant source of competitive
advantage
Key benefits of Utility card flash programming
FlashProgFR
by
Essepie S.R.L
ISP3070
by
Xeltek
FR3070A
by
SMH
Page 18
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Agilent’s Response to challenge #4
Worldwide Deployment Management
• Highest accuracy and signal fidelity
• Fast analog 2/4 wire Analog Stimulus Response Unit
• Power monitoring protection & per pin programmability
Stable, Reliable, Repeatable System
ONE supplier
NEW hardware upgrades
EXPERT help
SOFTWARE upgrades
TRACEABLE and trusted
calibration
ORIGINAL and qualified parts
PARTS availability worldwide
ONE
STOP SHOP
Agilent Restricted
1. The Automotive Electronics Industry
2. Challenges in the Automotive industry ICT
3. How did Agilent solved these Challenges
4. More of Agilent ICT Features to meet your needs
5. Questions and Answers
Page 20
Agenda
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Agilent Medalist ICT Family History
Series I Series II Series III 3070 Window/i5000 i3070/i1000
1989 1994 1998 2000/2005 2007
Continuous series of compatible upgrades to:
Preserve program and fixture investments
Extend the test capability and support life of the 3070
Continuous product improvement and features enhancement
Provide the best balance between compatibility and low cost
The introduction of i3070 Series 5 and i1000.
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Fuse Box Test – Stage 1 Hi-Potential Available in Agilent i1000
DUT PS-HV
150V, 50uA
DUT A Bus
(using
existing
Zener
channel)
B Bus
Volt Meter
Com
pare
Threshold
i R=4.7k
Test
Result
Objective is to measure Resistance between the pins to be > 3 Mohms
Method is to run a 150V through the nodes and make sure the current is <50uA
The boundaries are:
Test Method and Sequence don’t damage the components
Automated and integrated into the Test Flow
Start
Open Test
Shorts Test
Analog Test
150V Test
End
DUT
i1000 Test card
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Fuse Box Test – Stage 2 Hi-Current Test for Relays Available in Agilent i1000
Start
Open Test
Shorts Test
Analog Test
1Amp Test
End
Max 2Amps
Source
Measurement
Engine
DUT
Hi-Current
Relay Matrix
Objective is to make sure the
relays in red circles are not
misaligned
Method: Run 1A current thru the
relays to make sure the pins can
handle 1A
The boundaries are:
Reed relays normal range
is about 300mA
Automated and integrated
into Test Flow
Test terminal voltage without
turning on the relay
Test terminal voltage with the
relay turned on while 1A is
applied.
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LED Testing Available in Agilent i3070 Series 5 and i1000
LED Test modules
Using digital camera
Integrated with i1000D
powered test
Each module provides
154 LED tests
i1000D tests voltage and
current
LED module test color
and brightness
Flexibility on the ICT to
add external
functional circuits.
Software and
hardware support
included
FEASA LED Analyser
3rd Party Solution
Test up to 480 LEDs in 1
Utility card
www.feasa.ie
I3070 LED Test
Technology will test your
LEDs to
+/-3nm for color
Luminosity within +/-10%
Integrated
and 128 LEDs in <1.5
seconds
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High Voltage Zener Test Available in Agilent i3070 Series 5 08.20p
New High Voltage Power Supply provides one output from 0 to 50
volts @ 0 to 10 amps (500W).
Installed on Channel 3 or 4 of ASRU-N card, or can be installed on
Channel 7 or 8 on Utility card
Support up to 60V
Voltage references – shunt regulators
Surge protection - to limit transient voltage spikes
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Use of DLL Available in Agilent i3070 Series 5 08.30
The DLL Integration feature allows user to call external DLL functions from
within the BT-Basics.
New Commands:
Dllload “<dll-name>”, <dll-handle>
dllcall <dll-handle>, “<custom function name>”, [<return number>],
[“<return string>”]; [“<custom parameters>”]
dllunload [<dll-handle>]
Multiple DLLs are allowed to be loaded at the same time
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BT-Basic
dllcall Handle_1, “blank_check”, Var_1, ErrMsg$; “0, 0xffff”
External DLL
BTBasic_DLL_Call(“blank_check”, “0, 0xffff”, ErrMsg, Var_1)
External DLL
blank_check(0, 0xffff)
Calls Calls
Open up opportunities to integrate external third party devices for testing of
standards (such as CANBUS, FlexRay and LIN )
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Other Key Features: 4U Rack box
RLC analog measurement
Voltage measurement
Frequency measurement
Boundary Scan, Cover Extend Technology
On Board Programming
Digital Library Test and SPI or I2C
Client-Server Software API
Diagnostic Test System Available in Functional Test Rack
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Diagnostics Test Solution Concept
+ Just enough test 4-256 points ICT
+ Boundary scan (4 test points) for IC interconnect
+ CETBSCAN for devices connected to Boundary Scan devices
+ Utilize board-level test software for CETBIST
+ Opportunistic ICT during NPI for limited access boards
+ Standalone Repair Station or Integrated to functional tester
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Automation Ready Available in Agilent i3070
Complete Solution from Agilent
Built on industry leading i3070
ICT Platform
Short Wire Fixture – preserving
core value of TRS
Small Footprint, better mobility
Easy maintenance and fixture
change
Lower Upgrade costs
Card cage can be rotated 110 deg
anti-clockwise to access blower door
Video Link NEW
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Automation Ready Available in Agilent i1000
Off-line System In-line System
Complete Solution from Agilent
Smallest Foot Print ICT
Convertible between Inline and
Offline
Highest Top and Bottom
Clearance
Solution for Test Access on the
Edge
ICT with full powered testing
capabilities, with simple fixtures
Video Link NEW
In-circuit Test
Technology To Meet
Future Challenges
and Trends
Measurement Systems Division
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In-line Flash
Programming In-line ICT
Stretch $
In-line Test
(CAN & Functional)
Test coverage
Modular &
Compatible
Manufacturing Line – Test Strategy
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Boundary Scan
device Connector or
other device
TDI TCK
TMS
TD0
VTEP
sensors
to ICT
tester …
Test Access
pins
Cover Extend Technology (VTEP + Boundary Scan)
Remove Test Access
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CET : NOW on ICs! Greater Throughput
Greater Coverage
Greater Usability
Greater Stability
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Bead Probe Technology (adopted by >70 companies)
Conventional Test
points and probes
Bead probes
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ABPT is a patented innovation,
To be used in Agilent Testers only.
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Features of our i3070 over the decade Throughput Coverage Ease of Use
i30
70
S5
2012 Rel 8.30P LED Test Ext DLL
Windows 7
2011 Rel 8.20P 60V Zener
N5747A Pwr Supp Unit
2010 Rel 8.10P DC test for big Caps
RP5700 PC 100KHz & 200KHz for small Caps
CET on IC
2009 Rel 8.00P ASRU N "AS" Utility card Pwr Monitor
High Pwr Channels
TestPlan Analyzer Flexible Pwr Channels Fixture Pwr Supp
i30
70
2008 Rel 7.20P VTEP v2.0 CET VTEP enhanced guarding
2008 Rel 7.10P VTEP speed up 1149.6 Enhanced Log record
2007 Rel 7.00P IPG enhanced Auto Optimizer
VTEP v2.0 NPM Switch btw Mux : Unmux Browser Pin locator
i30
70
S3
2006 Rel 6.00P XW4200 PC
New GUI FPY, Worst Probe AutoDebug WinXP
2005 Rel 5.40P iYET iVTEP
2003 Rel 5.30P
NAND/XOR Tree Pattern VTEP
Coverage Analyst User Fixture Component
Scanworks GUI Localization
2001 Rel 4.00P-5.20P 50% faster in sys diag ISP suite
ControlXTP - SW5.0 Auto Si nails Windows NT
< 2001 < Rel 4.00 Panel Test
Throughput Multiplier Testjet
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for business continuity
after 22nd Oct 2011
Is Is not
supported on Win XP/Win 7 32-bit OS supported on Win 7 64-bit OS
the same as 08.20pb with additional
feature to support Win 7 OS
developed based on new
CR/enhancement
available on new system, controller
upgrade & one-time software update
available via software update
subscription (SUS)
Note:
1. Board test program developed in earlier Win XP software releases is transportable to 08.21p
Windows 7
2. 08.30p will support Windows 7 32/64-bit OS
3. 08.21p WinXP and 08.21p Win 7 are compatible
4. Old PCs prior to RP5700 are not supported for Win 7.
5. Version 8.21p has the same functionality as 8.20pb
6. 08.20p or earlier are not supported for Win 7
7. Microsoft does not allow Agilent to downgrade to WinXP.
Window 7 migration
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