ICTURKEY 2019ECSEL JU
Istanbul, 5/7/2019
Dr.ir. Yves GIGASEHead of ProgrammesECSEL JU
Outline
1. What is ECSEL?2. What kind of projects?3. How do I participate?4. What will come next?
TOPICS: Information & Communication Technologies (ICT) and Cross-cutting themes of H2020:• 5G• Next Generation Internet• Big Data and Applications• Digitising European Industry• Smart Health and Care
64 projects2161 beneficiaries
3 385 million Euro cost1 174 million Euros in funding
ECSEL : A UNIQUE MODEL TO PROMOTE EUROPEAN INNOVATION
3 (Industry) Associations:AENEAS EPOSS ARTEMISIA
28 ECSEL Participating States
European Commission
Re-inforce/Align National strategies and European priorities
Promote synergies between commercial strategies and societal needs
INCLUDING TURKEY
TRIPARTITE=3 – PartneringJU = Joint Undertaking
JU: COMMON GOVERNANCE + COMMON FUNDING
Participating States
Public companiesCompanies (large and small)
Universities, RTOs,…
Regions
Smart Specialization ESIF/ERDF
> 1.17B€ 1.17B€
> 1.6B€
Governing BoardECSEL Members
(Public Authorities, Private Members)
Executive DirectorProgramme Office
Public Authorities BoardEuropean Commission,
ECSEL Participating States
Private Members BoardAENEAS, ARTEMIS-IA, EPoSSSRA
WPSRA
Call
Contributions EU:EPS:Benefiaries in 1:1:2 proportionTurkey is an ECSEL participating state!
JU: common strategy: Strategic Research Agenda (SRA)
LONG TERM TOPICS
• 3 Industry Associations• AENEAS• ARTEMIS-IA• EPoSS
• Other activities of the 3IA• EFECS• Brokerage events• Matchmaking
• SRA is adopted by the Governing Board
ECSEL ARE PEOPLE, ORGANIZATIONS AND PROJECTS
BUT ALSOPUBLIC AUTHORITIES
ASSOCIATIONSEVENTS
Outline
1. What is ECSEL?2. What kind of projects?3. How do I participate?4. What will come next?
Focus Areas
High Performance Computing
ArtificialIntelligence
5G
Cybersecurity
IoT / IIoT Smart Power Grid
LONG TERM TOPICSNeuromorphic computing Quantum computing
Edge Computing
ECSEL: NETWORKS OF PARTNERS AND PROJECTS
CPS platform developments
More Moore Technology
Silicon on Insulator Technology
Other Components
MtM IC-Technology
MtM pilot lines for ISS
Digitalisation of Industry CPS with mixed
HW/SW developments
Integrated Smart Systems
Platforms for Cyber Physical Systems
Evolution also visible in the interactions between clusters
Evolution and continuity in projects
Value chain approach
Cluster: More Moore
from ASML10
Cluster: New components for ICs
11
Fully Depleted Silicon on Insulator: EU changing therules of the game for edge computing, IoT, always-on applications, radars, … made in Europe !
PLACES2BE Call 2017 ECSEL Ocean12 lowest power processorCall 2015 ECSEL Reference 4G/4G+ & 5G
Call 2014 ECSEL Ways2gofast 22 nm ultra low powerCall 2013 ECSEL Things2Do FDSOI process/design
Call 2012 ENIAC Places2Be 28nm FDSOI industrialisation
RF-SOI
Cluster: Power electronics
“Enhanced Power Pilot Line”: 2nd generation powersemiconductor devices on 300mm wafer
“Enabling Power technologies on 300mm Wafers” project wasbased on the concept of a 1:1 transfer approach from 200 mm to300 mm diameter silicon wafers.
excellence in speed and reliability for Morethan Moore technologies : high volumeproduction and quick introduction.
Power Semiconductor and Electronics Manufacturing 4.0 smart, security, variation, simulation
Infineon Austria invests 1,6 B € over 6 years on a new 300 mm fab for power semiconductors: 400 employees and 1,8 B€ additional sales. (May 2018)
Important Projects Common European Interest
ST-Italy is building a 300mm Si-fab and a 200mm SiC fab for power components and circuits.
Example
Call 2018 selected projects
All selected projects reach out to programmes outside of ECSEL: value chain stakeholders, other associations or programmes, etc by:• Developing standards• Using roadmaps and priorities of other
organisations• Integrating communities outside ECSEL in the
ECSEL value chains • Developing key enabling technologies enabling
technologies of other programmes/ sectors
Cost 800Mio€ ; Funding 390Mio€ ; 13 projects; 500 beneficiaries
Power2Power and PIN3S
The next-generation silicon-based power solutions in mobility, industry and grid for sustainable decarbonisation in the next decadeThe consortium is composed of a good mix among research institutions, automotive electronics innovation expertise, small and large industry representatives, non-profit organizations, and smart system application companies.Power2Power will enable innovations and create opportunities from possible disruptions by providing cost effective high power electronics components. The work within the project is structured in work packages along the value chain.
Pilot Integration 3nm Semiconductor technology (follow up to Tape3S)Development of new advanced alignment models: alignment and focus sensors scan every wafer creating an advanced model that intelligently combines the data from these sensor and generate a hybrid, high density wafer map which is used as input to the many actuators in the lithography system thereby further improve the performances
Focus on key enabling technologies, involvment of others through roadmapping
Comp4Drones and NewControlFramework of key enabling technologies for safe and autonomous drones’ applications: drone platform with a wide range of integrated sensors (navigation sensors, image & spectral sensors) for transport applications, smart systems focus on essential communication features for a drone: (1) position indication, (2) instructions reception, (3) coordination with other flying objects, and (4) allowing traffic management. (5) Neural network accelerators in FPGA.
Integrated, Fail-Operational, Cognitive Perception, Planning and Control Systems for Highly Automated Vehicles• reference to EPoSS European Roadmap Smart Systems for Automated Driving: 5.4.1
Technology Inside Car, 5.4.2 Infrastructure , 2.2.3 Liability and Safety, 5.4.4 System Integration and Validation,
• At the sensor level, these goals will be achieved through heterogeneous, More-than-Moore integration, improving the reliability and dependability of sensor compounds by eliminating mechanical parts.
• At the system level, this goal will be facilitated by advanced control systems that realize adaptive control circuitry close to the sensor modules
Development of smart systemsAnswering a need identified in the SESAR JUStandardsDevelopment of eco system based on open platform
Development of smart systemsDevelopment of sensors and systemsLinks to several other priority areas
HELIAUS and VIZTA
tHErmaL vIsion Augmented awarenesS • development of a novel chip architecture together with on-chip integrated functions to make the IR sensor as easy to use as visible
sensor, • design and manufacturing of innovative IR optic systems utilizing cutting edge component manufacturing technologies, • as well as cost efficient and ultraprecise packaging and assembly technologies in order to provide a thermal infrared module, • development of specific embedded systems for computer vision developments. • Innovative neural network based algorithms
Vision, Identification, with Z-sensing Technologies and key ApplicationsDevelopment of a high resolution Time-of-Flight ranging sensor module with integrated VCSEL, drivers, filters and optics and of a veryhigh resolution depth camera sensor with integrated filters and optics. Demonstrators/use cases (bringing in various expertise eg in AI and neural networks, citizen services, robotics, etc.):
• automotive in-cabin • smart building• Security• automotive medium-range LiDAR, • automotive long-range LiDAR• industry 4.0• mobile robotics for smart cities
Integrating one value chain in one project: chip manufacturing, embedded software, smart system integration technology
Smart systems use casesAI, Robotics, PhotonicsMobility, Industry, ...
UltimateGaN and APPLAUSE
Research for GaN technologies, devices and applications to address the challenges of the future GaN roadmap• project proposal with strong involvement of the vertical supply chain• spans expertise and partners from raw material research, process innovation and assembly innovation. • envisioned Use Cases will be validated and exploited in compact power application domains representing
enhanced smart systems. Bringing GaN on Silicon radio frequency (RF) performance close to GaN on Silicon Carbide thus enabling an affordable 5G rollout
Advanced packaging for photonics, optics and electronics for low cost manufacturing in Europe• use cases: cardiac implants, cardiac monitoring patches, ambient light sensor for mobile wearable applications,
thermal IR sensor for automotive, datacom transceiver, optical humidity measurement module.
Integrating existing vertical supply chains with stakeholders from different horizons: health, mobility, communication, sensors,...
Arrowhead Tools Arrowhead Tools for Engineering of Digitalisation SolutionsProvision of a mature service integration platform providing extensive interoperability between IoT services and legacy technology together with management capabilities for dynamic configuration and orchestration of System of Systems solutions.
Development of platforms for Systems of Systems
MADEIN4
Metrology Advances for Digitized ECS industry 4.0Development of predictive behavioural capability with use case in Advanced Packaging that will enable the strong European players to compete with their low cost Asian competitors more efficiently through the algorithm and use case activities.
Big dataIndustry 4.0Advanced metrologyProcess control in semiconductor and automotive manufacturing
TEMPOTechnology & hardware for nEuromorphic coMPuting• developed solutions on Deep Learning inference and Spiking Neural
Networks can be applied to embedded implementation of AI algorithms in sensors/actuator loops for industrial, health and automotive applications
• by enabling efficient intelligence (i.e. inference) at leaf nodes, it aligns with the expected achievement of technology-driven and connected intelligence
Development of advanced technologies for AI
IA projects
Project Partners Cost EU FUNDING NATIONAL FUNDING
APPLAUSE 34 34.7 8.6 8.1Arrowhead Tools 90 90.7 22.8 23.9CPS4EU 38 53.0 13.0 13.2MADEin4 47 126.2 29.4 31.5PIN3S 25 119.6 26.8 23.6Power2Power 43 74.3 17.0 15.9VIZTA 25 87.8 21.3 24.7Total 302 586.2 138.8 141.1
RIA projects
Project Partners Cost EU FUNDINGNATIONAL FUNDING
AI4DI 41 30.1 8.8 8.7COMP4DRONES 53 26.9 8.0 8.3HELIAUS 11 27.7 8.2 8.5NewControl 49 43.3 12.6 9.0TEMPO 26 35.1 10.4 9.6UltimateGaN 26 48.4 14.1 12.9Total 206 211.6 62.2 56.9
But is that enough? Why work together?
(DISSEMINATION)ü EXPLOITATION OF THE
INNOVATIONMORE IMPACT? ü CREATE SYNERGIES
BETWEEN COMMUNITIES
PROJECT LEVEL
META PROJECT LEVELLIGHTHOUSE INITIATIVES
As a programme can we achieve more impact?
LIGHTHOUSE INITIATIVES
MOBILITY.EINDUSTRY4.EHEALTH.E
A container of coordinated activities coming from different programmes using their synergy to achieve overarching common goals.
Lighthouse initiatives ≠ Lighthouse projects!!!
ECSEL projects active in Mobility.E• Total cost: 700M€• Total funding: 330M€ • Number of participants: 356• Distributed over 26 countries
MOBILITY.E LIGHTHOUSE INITIATIVE
Clean Connected Autonomous MobilityLIASE Support
Industry
Associations
Mobility.E LIASE
LIASE=Lighthouse Initiative Advisory Service
Industry4.ELIASE• Andrew Lynch (IMR)• EFFRA (Chris Decubbere)• Eduardo Beltran (Mondragon
Corporation)• Knut Hufeld (Infineon DE) • Olli Ventä (VTT)
Support• ECSEL Office• DG Connect• CSA_Industry4.E
Outline
1. What is ECSEL?2. What kind of projects?3. How do I participate?4. What will come next?
CALL SCHEDULE: example for 2019
CALL LAUNCH DECISION (PAB) 23/01/2019FINALIZATION OF WORKPLAN (GB) 24/01/2019CALLS 2019 LAUNCH 06/02/2019CALLS 2019 PO DEADLINE 07/05/2019FEEDBACK ON PO MID JUNECALLS 2019 FPP DEADLINE 18/09/2019SELECTION AND FUNDING DECISION (PAB) 19/11/2019COMMUNICATION TO CONSORTIA END NOVEMBER
BROKERAGE EVENT 2019 BRUSSELS
Calls 2020 will be similar
Call 2019 and Call 2020• Call 2019:
• Under evaluation• 27 RIAs (2 special topics) + 10 IAs
• RIA-Special Topic 1 – Architectures, components and systems for validation/simulation of connected automated vehicles (5M€)
• RIA-Special Topic 2 – Edge computing (10M€)• Information to coordinators end June• Then FPP in september• Budget: ca. 170MioEuro
• Call 2020:• Preparation of Workplan 2020 • 2 calls with special topics, eventually special call• Budget: ca. 160MioEuro
Stay tuned• ECSEL website• Websites of the 3 Associations:
• AENEAS• ARTEMIS-IA• EPoSS
• Brokerage events• EFECS in November (Helsinki)• Events of the Commission in September• TUBITAK
Matchmaking tool: see website of associations
Outline
1. What is ECSEL?2. What kind of projects?3. How do I participate?4. What will come next?
The importance of the value chain
Horizon Europe: evolution not revolutionSpecific objectives of the Programme
Foster all forms of innovation and strengthen market deployment
Strengthen the impact of R&I in supporting EU policies
Support the creation and diffusion of high-quality knowledge
Optimise the Programme’s delivery for impact in a strengthened ERA
Strengthening the European Research Area
Reforming and Enhancing the European R&I systemSharing excellence
Pillar 1Open Science
European Research Council
Marie Skłodowska-Curie Actions
Infrastructures
Pillar 3Open Innovation
European Innovation Council
European innovation ecosystems
European Institute of Innovation and Technology
Pillar 2Global Challenges and Industrial Competitiveness
• Health• Inclusive and Secure Society• Digital and Industry• Climate, Energy and Mobility• Food and natural resources
Joint Research CentreC
lust
ers
Digital Europe programme – What?Digital Europe Programme
Reinforcing digital capacitiesEnsuring their best use
END