AAPM 2004Summer School
Pittsburgh PA 29 July – 1 August
31-07-2004 Tom Bruijns / Dick Stueve Philips Medical Systems
Image Quality assessment in digital X-ray detection
systems
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Outline
- Introduction- Technologies in Rad and RF- Performance Characteristics- IQ assessment- IQ design: a system approach- Summary
- Evening session QC tools19:00-21:00
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Overview Digital Technologies
1970s 1980s 20001990s
1981First CR
1981Slit-scanchest unit
1992Se drumdetector
1977Digital
subtractionangiography
1997CCD-based
imaging
1997Se-basedflat-panel
1998CsI-basedflat-panel
Neitzel
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Overview Digital Technologies
CR in 1983
CR in 2004
~ 10-20x reduction in size and price
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Product range overview Digital Technologies
Rad systems:- Thoravision (selenium drum)- Computed Radiography- Flat Detector technology
RF systems- IITV technology (CCD based)- Flat detector to come
CV systems- IITV technology (CCD based)- Flat Detector technology
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Rad systems:- Thoravision- Computed Radiography- Flat Detector technology
RF systems- IITV technology (CCD based)- Flat detector to come
CV systems- IITV technology (CCD based)- Flat Detector technology
Product range overview Digital Technologies
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- Introduction- Technologies in Rad and RF- Performance Characteristics- IQ assessment- IQ design: a system approach- Summary- Evening session QC tools
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Flat Detector technology in Digital Radiography
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CR and DR
DR
CRCR :• DQE will increase• Line scan
Frost & Sullivan
CR will coexist next to DR for many years
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European ConsortiumThales, Philips, Siemens
ProductsStatic & Dynamic Flat x-ray Detectors (FD)
Trixell Moirans France
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Scintillator(CsI)
Amplifiers
A/D-Converter
a-Si SensorMatrix
AddressLines
Glass Plate
550 µµµµm thickness
Flat Detector Technology
43 cm x 43 cm static18 cm x 18 cm dynamic30 cm x 40 cm dynamic
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- For radiographic applications
- Cesium Iodide scintillator (600 µm)
- Amorphous silicon photodiode array
- Array size: 43 cm x 43 cm
- Pixel size: 143 µm
- Bit depth:14 bits
- Image matrix: 3k x 3k
- Low noise electronics
- High sensitivity
Large area (43 cm x 43 cm) 9 Mpixel Flat Detector
43 cm 43 cm
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- For vascular (and RF) applications
- Cesium Iodide scintillator (550 µm)
- Amorphous silicon photodiode array
- Array size: 30 cm x 40 cm
- Pixel size: 154 µm
- Bit depth:14 bits
- Image matrix: 2.5 k x 2 k
- Low noise electronics
- High sensitivity
5 Mpixel Dynamic Flat Detector
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- For cardio and vascular applications
- Cesium Iodide scintillator (550 µm)
- Amorphous silicon photodiode array
- Array size: 18 cm x 18 cm
- Pixel size: 184 µm
- Bit depth:14 bits
- Image matrix: 1 k x 1 k
- Low noise electronics
- High sensitivity
1 Mpixel Dynamic Flat Detector
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CCD based IITV technology for RF applications
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- Used for dynamic applications
- II: Cesium Iodide scintillator
- II size: 38 cm diameter
- Up to 5 zoom fields
- CCD Pixel size: 12,8 µm
- CCD Full well capacity: 170 ke-
- CCD read out noise 40 e-
- Bit depth:12 bits
- Image matrix: 10242
CCD based IITV technology for RF applications
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FD technology versus CCD based IITV technology for RF applications
+ No vignetting & no distorsion for FD
+ High resolution + coverage
+ High DQE for FD
+ Flat
- Price level high for FD
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- Introduction- Technologies in Rad and RF- Performance Characteristics- IQ assessment- IQ design: a system approach- Summary- Evening session QC tools
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Image Quality Triangle
DQE(f)
Resolution
ContrastNoise,dose,
spectrum
NPS(f)MTF(f)
SNR(f)Neitzel, Malmö 2004
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- For radiographic applications
- Cesium Iodide scintillator (600 µm)
- Amorphous silicon photodiode array
- Array size: 43 cm x 43 cm
- Pixel size: 143 µm
- Bit depth:14 bits
- Image matrix: 3k x 3k
- Low noise electronics
- High X-ray sensitivity
Large area (43 cm x 43 cm) 9 Mpixel Flat Detector
43 cm 43 cmLow noise
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- For radiographic applications
- Cesium Iodide scintillator (600 µm)
- Amorphous silicon photodiode array
- Array size: 43 cm x 43 cm
- Pixel size: 143 µm
- Bit depth:14 bits
- Image matrix: 3k x 3k
- Low noise electronics
- High sensitivity
Large area (43 cm x 43 cm) 9 Mpixel Flat Detector
43 cm 43 cmResolution
(and Coverage)
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- For dynamic applications
- II: Cesium Iodide scintillator
- II size: 38 cm diameter
- Up to 5 zoom fields
- CCD Pixel size: 12,8 µm
- CCD Full well capacity: 170 ke-
- Low dark noise 40 e-
- Bit depth:12 bits
- Image matrix: 10242
CCD based IITV technology for RF applicationsLow
Noise
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- For dynamic applications
- II: Cesium Iodide scintillator
- II size: 38 cm diameter
- Up to 5 zoom fields
- CCD Pixel size: 12,8 µm
- CCD Full well capacity: 170 ke-
- Bit depth:12 bits
- Image matrix: 10242
CCD based IITV technology for RF applicationsResolution
(and coverage)
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- Introduction- Technologies in Rad and RF- Performance Characteristics- IQ assessment- IQ design: a system approach- Summary- Evening session QC tools
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Image Quality Triangle
DQE(f)
Resolution
ContrastNoise,dose,
spectrum
NPS(f)MTF(f)
SNR(f)Neitzel, Malmö 2004
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Detective Quantum Efficiency
The detective quantum efficiency (DQE) is considered to be the fundamental performance parameter of digital X-ray detectors.
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There are many ways to come to many different answers
But
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Detective Quantum Efficiency
Working group FD (DR)IEC standard 62220-1
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Neitzel, Günther-Kohfall, Borasi, SameiMedical Physics August 2004
Detective Quantum Efficiency
3 methods for analysing 1 dataset
Differences +/- 15%
After using standardIEC 62220-1
Differences +/- 5%
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Linking DQE and observer tests
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DQE versus EAK for dynamic 30x40 FD and IITV
DQE (@ low spatial frequency) versus EAK
0
20
40
60
80
100
1 10 100 1000 10000
EAK [nGy]
DQ
E (l
f)
FD
IITV
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Observation tests (using Treshold Contrast Detail Detectability)
AACAH
tt ×
=)(1
)(
A
)(AHt
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Observation tests IITV (L) and FD (R)
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Observation tests IITV and FD
0.9 uGy
1
10
100
0.1 1 10
SQRT (A)
Ht(A
)
3.5 uGy
1
10
100
0.1 1 10
SQRT (A)
Ht(A
)
---- FD
---- IITV
High dose
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TCDD versus EAKHt(max) versus EAK
10
100
0.1 1 10
EAK [ uGy ]
Ht(
max
)
FD
II
Ht(max) versus EAK
1
10
100
1 10 100
EAK [nGy]
Ht(
max
)
FDII
DQE (@ low spatial frequency) versus EAK
0
20
40
60
80
100
1 10 100 1000 10000
EAK [nGy]
DQ
E (l
f)
FD
IITV
DQE versus EAK
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- Introduction- Technologies in Rad and RF- Performance Characteristics- IQ assessment- IQ design: a system approach- Summary- Evening session QC tools
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Rationale of Image Quality (IQ) Model (Kroon)
- IQ analysis of (non-)existing systems- system (de)composition for design process- comparison of present versus future systems
- Fast acquisition of IQ characteristics- optimization requires extensive data amount- simulation (seconds) versus experiment (hours-days)
- Various IQ related studies- design of test objects and methods
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• Combines the IQ requirements of components into system level IQ specification
• All IQ main items are analyzed simultaneously, leading to a.o. DQE
• Permits tolerance and parameter studies• Allows optimisation and prevents sub-optimisation• Design of test objects & methods
Objectives of Image Quality (IQ) Model
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Image Quality Model Main Items
- X-radiation spectrum, dose, AEC
- Contrast range and transfer
- Sharpness MTF of stationary object
- Motion blur MTF of moving object
- Noise dynamic & structure WS
- Mixed geometrics & cosmetics
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- Model input:- Components- Configuration- Tuning
- IQ model:- Architecture- IP functions
- Model output- IQ descriptors
Sinar-X
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X-rayEnergy
Spectrum
IntensityTransferFunction
ModulationTransferFunction
WienerSpectrum
TemporalMTF
Input → Image Quality Model → Output
IQ model
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Image Quality Model Implementation
- PC with LabVIEW ®- Visual programming- Clear hierarchy- IQ analysis << 1 sec- 350 program parts- About 300 variables for
settings, UI and system definition
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- Introduction- Technologies in Rad and RF- Performance Characteristics- IQ assessment- IQ design: a system approach- Summary- Evening session QC tools
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Summary
We discussed:
- Products FD and IITV and their proporties- DQE and the present limitations- DQE versus observation tests- IQ modeling for fully optimized system IQ
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Thank you for your attention
See you this evening at our booth
for the session “QC tools”
Tom BruijnsDick Stueve