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Imaps presentation-high-temp-electronics-11-19-13

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Introduction to high temperature electronics greater than 150 degree C.
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Introduction to High Temperature Electronics Metro IMAPS Vendor Day By Tom Terlizzi GM Systems November 19, 2013 Clarion Hotel, Ronkonkoma, N.Y
Transcript
Page 1: Imaps presentation-high-temp-electronics-11-19-13

Introduction to High Temperature Electronics

Metro IMAPS Vendor Day

By Tom Terlizzi GM Systems November 19, 2013 Clarion Hotel, Ronkonkoma, N.Y

Page 2: Imaps presentation-high-temp-electronics-11-19-13

PURPOSE

◆  A BRIEF INTRODUCTION INTO THE WORLD

OF HIGH TEMPERATURE ELECTRONICS

2

Page 3: Imaps presentation-high-temp-electronics-11-19-13

AGENDA

◆  DEFINE HIGH TEMPERATURE ELECTRONICS

◆  DESCRIBE SOME APLICATIONS

3

Page 4: Imaps presentation-high-temp-electronics-11-19-13

WHAT ARE TYPICAL INTEGRATED CIRCUIT MILITARY OPERATING TEMPERATURE RANGES?

4

MAXIMUM JUNCTION AND STORAGE TEMPERATURE

150oC

MAXIMUM OPERATING TEMPERATURE 125oC

MIL-PRF-38535

Page 5: Imaps presentation-high-temp-electronics-11-19-13

DEFINITION OF HIGH TEMPERATURE ELECTRONICS?

◆  NO INDUSTRY STANDARDS OR AGREEMENT

◆  “ELECTRONICS OPERATING AT TEMPERATURES IN

EXCESS OF THOSE NORMALLY ENCONTERED BY

CONVENTIONAL SILICON-BASED SEMICONDUCTORS

OR THEIR AUXILLARY COMPONENTS.”1

◆  TYPICALLY >125oC OR >150oC BUT SOME REPORTED

LAB WORK TO 600oC.

1 “High Temperature Electronics” By F. Patrick McCluskey, Thomas Podlesak,

Richard Grzybowski, page 2 5

Page 6: Imaps presentation-high-temp-electronics-11-19-13

JET ENGINE TEST

6

JET ENGINE TEST STAND

ROTOR

JET ENGINE CROSS SECTION

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TELEMETRY HYBRID CROSS SECTION

7

ALUMINUM WIRE BONDABLE THICK FILM GOLD

1 MIL GOLD WIRE FROM SUBSTRATE TO PINS

1 MIL ALUMINUM WIRE FROM IC’S,

THIN FILM RESISTORS AND TRANSISTORS

TO SUBSTRATE PLUG IN METAL HYBRID HERMETIC SIDE WALL

DIP PACKAGE

THICK FILM SUBSTRATE MOUNTED WITH THIXOTROPIC

EPOXY TO PACKAGE

◆  150oC & 20KG’S FOR >2000 HOURS

◆  MONOMETALLIC ON SEMI’S AND CHIP RESISTORS

Page 8: Imaps presentation-high-temp-electronics-11-19-13

JET ENGINE TELEMETRY SYSTEM

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TELEMTRY HYBRID US PATENT 20080224845 A1 R. BIRES - PRATT AND WHITNEY

Page 9: Imaps presentation-high-temp-electronics-11-19-13

COMMERCIALLY AVAILABLE TELEMETRY SYSTEMS

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Page 10: Imaps presentation-high-temp-electronics-11-19-13

DOWNHOLE APPLICATIONS

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Page 11: Imaps presentation-high-temp-electronics-11-19-13

DOWNHOLE APPLICATIONS

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APPROXIMATELY ~20oC INCREASE IN TEMPERATURE

PER KILOMETER DEPTH

Page 12: Imaps presentation-high-temp-electronics-11-19-13

NASA HIGH TEMPERATURE ELECTRONICS

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Page 13: Imaps presentation-high-temp-electronics-11-19-13

NASA HIGH TEMPERATURE ELECTRONICS

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High-Temperature Electronics—A Role for Wide Bandgap Semiconductors PHILIP G. NEUDECK, SENIOR MEMBER, IEEE, ROBERT S. OKOJIE, MEMBER, IEEE, AND LIANG-YU CHEN

Wide Band Gap=GaN or SiC BS = BULK SILICON

SOI=SILICON N INSOLATOR

Page 14: Imaps presentation-high-temp-electronics-11-19-13

IMAPS HiTEC 2014

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