IMEC NANOELECTRONICS PLATFORM TECHNOLOGY R&D FOR SMART APPLICATIONS

LODE LAUWERS VICE PRESIDENT, PHD CMOS SALES/ BUSINESS DEVELOPMENT

MAY 2014

10000 m2 CR(200mm + 300mm) CMOS + MEMS, BIOlab, Pvline, lifescience lab,...

2013: 330 MEUR

2013: 2100 people

PARTNERING WITH IMEC

ACCESS to world-leading R&D in nano-electronics

EXTENDING your R&D base LEVERAGE scientific knowledge

GLOBAL partnerships ACHIEVE industry Relevant solutions

300mm pilot line Nano

biolabs

Clean Room/Pilot line [~ 10 000 m2] + Labs 24/7 Continuous operation

IMEC TOWER: Expansion of 14,208 m2 16 floors /450 people & lab space

200mm pilot line

Si & Organ. solar cell

line

Neuro- electronics

lab

2011 expansion

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I4

I5

STATE-OF-THE-ART RESEARCH FACILITIES

2012 2013 2014 2015 2016 2017 2018 2019

300mm pilot line Nano

biolabs

Clean Room/Pilot line [~ 10 000 m2] + Labs 24/7 Continuous operation

IMEC TOWER: Expansion of 14,208 m2 16 floors /450 people & lab space

2016H1: Fab Expansion

Collaboration European suppliers... Unpatterned wafer development

Advanced patterning development

Full 300/450mm process capability Advanced process development

200mm pilot line

Si & Organ. solar cell

line

Neuro- electronics

lab

2011 expansion

I1 I2 I3

I4

I5

RESEARCH PROGRAMS IMEC R&D PROGRAMS

TECHNOLOGY PLATFORMS

APPLICATION PROGRAMS SMART SYSTEMS

& ENERGY

RESEARCH PROGRAMS FOR FULL ECOSYSTEM

EXTREME SCALING SUB-14nm CMOS CONCEPTS & MATERIALS, PLATFORMS, SYSTEM

FOR LOGIC & MEMORY

IMEC CORE CMOS PROGRAM

RESEARCH COMPLEXITY

Technology complexity increases:

Multitude of material options & processing techniques

Combination of new materials & architectures

System/circuit level implications

INCREASING R&D COST

Partnering in R&D on next generation technologies: sharing costs, risk, talent & IP

IC manufacturers, IDMs, fabless & fablite companies and equipment suppliers

Largest worldwide commitment to the advancement of CMOS technology

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Lithography FEOL cluster Interconnects

Logi

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Mem

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Nan

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m e

xten

sion

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EU

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ithog

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Supporting Expertise Centers (process steps, reliability, Physical analyisis, modelling, characterisation...)

STT

MR

AM

3D IN

TEG

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TIO

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IMEC CORE CMOS PROGRAM

DS

A

OP

TIC

AL

I/O

INSITE

Patterning center motivation

Increasing R&D challenges Increasing R&D cost

Consolidating industry

Cost sharing Risk mitigation

Maximum leveraging of full eco-system

Increased supplier involvement & commitment

= Patterning Center

Increased critical mass on unit process development Most advanced equipment at affordable conditions

PATTERNING CENTER / SUPPLIERS HUB

Increased supplier involvement & commitment

Increased critical mass on unit process development Most advanced equipment at affordable conditions

IMEC CORE CMOS PROGRAM: BUILDING A ‘LAYERED ECOSYSTEM’...

.... OF WORLDWIDE PARTNERSHIPS

IMEC WORLDWIDE PARTNERSHIPS IN FULL ECOSYSTEM IMEC CORE CMOS PROGRAM: BUILDING A ‘LAYERED ECOSYSTEM’...

.... OF WORLDWIDE PARTNERSHIPS

300mm CLEANROOM

Sub-15nm chip process technology

Investment > 1B$

Unique lithography cluster centered around ASML equipment

Advanced equipment and preproduction tools

Semi-industrial operation: 24/7

4,800m² class 1,000 area, ballroom-style

450mm extension Movie

LOGIC SCALING ROADMAP

LOGIC: BEYOND 7nm / 5nm

TunnelFET: Sub-60mV/decade subtreshold slope, allowing further reduction of supply voltage and power reduction

Many different device options under research: Graphene FET, spintronics, BISFET, Ge tunnelFET, InAs tunnelFET, Graphene FET, spintorque, ...

MEMORY: BEYOND 20nm

STT MRAM DRAM replacement beyond 20nm

Non-volatile memory for both embedded and stand-alone applications

Re RAM Flash replacement beyond 10nm

Non-volatile memory

High speed, low energy, superior scalability, CMOS compatible

3D SONOS Flash replacement to 10nm

Non-volatile memory

Memory cells implemented in vertical plugs consisting of 8,16,32 ... stacks

3D STACKING TECHNOLOGY

Future applications require higher transistor density in smaller form factor

Stacking different dies on top of each other

16 x higher IO density than today’s solutions

3D & OPTICAL IO

Optical IO: extension of 3D stacking

Further performance boosting, extreme high-bandwidth

Optical interconnects using silicon photonics instead of electrical interconnects

Fabrication of optical components by using CMOS processing techniques and equipment

Need for best-in-class optical components Movie

EUV

EUV: key for keeping patterning cost manageable in advanced nodes

Since 2011: ASML preproduction scanner NXE:3100

2014: ASML NXE:3300 EUV production tool expected

INSITE

New processing technologies, materials, architectures, interconnect technologies have impact on system/circuit level

Insite program gives product designers early insight in future technology nodes and the impact on their products

RESEARCH PROGRAMS

HETEROGENEOUS INTEGRATION: PROJECTS & PLATFORMS FOR DOD

RESEARCH PROGRAMS

Economically scalable route to high-volume manufacturing

Low power, high resolution, large area, outdoor readability, flexibility & light weight

FLEXIBLE DISPLAYS & ELECTRONICS

active-matrix OLED: thin-film transistor backplane switches individual pixels on and off

Direct processing of oxide backplane

Low-temperature, state-of-the-art processing

Large-area printing of flexible diplays

Roll-to-roll printing

Flexible RFID tags,...

Ultra-high frequency Schottky diode based on IGZO

RESEARCH PROGRAMS

RESEARCH PROGRAMS

Miniaturized & highly instrumented bioreactors to cultivate cells as if they are

inside the body

Cell sorting and detection building block

Wireless device connecting to low-cost, small, disposable chip

detecting bio parameters

LIFE SCIENCES: GRAND CHALLENGES KEY ENABLING TECHNOLOGIES

Low Cost

High Throughput

High Data Accuracy

BODY AREA NETWORKS

ECG PATCH EEG HEADSET MULTI-PARAMETER WRISTBAND

RESEARCH PROGRAMS

RESEARCH PROGRAMS

RECONFIGURABLE RADIOS MM WAVE COMMUNICATION ULP CIRCUITS

RECONFIGURABLE RADIOS

Radios that adapt their transmission parameters autonomously to the environment.

Focus on low-cost & low-power, enabling future 4G & 5G networks & digital video broadcasting

Reconfigurable analog front-end / digital baseband / spectrum sensing / record-breaking ADCs

mmWAVE SOLUTIONS

Wireless solutions using bandwidth capacity available at 60 Ghz

Short-range, Gigabit/s communication (e.g. uncompressed video distribution in the home, Gbit/s wireless connections between laptop and printers

Traditionally in III-V

CMOS enables higher integration, resulting in a smaller, cheaper, single-chip radio

79GHz RADAR

Detection system that can sense the environment

Low-cost modules will open up completely new opportunities

Applications: autonomous driving, security, robotics, smart homes, immersive gaming, assisted living

PHASED ARRAY ANTENNAS

FULLY INTEGRATED CMOS MMIC

COMPLETE SOLUTION IN 1cm X 1cm PACKAGE

Building on mm-wave expertise

High resolution, compact, low-powered radar systems built in CMOS technology

ULP circuits optimized for battery & harvested operation

Radios made available for licensing:

- 400 MHz medical radio - Body area network radio - Event driven radio - IR UWB radio platform

ULTRA-LOW POWER CIRCUITS

RESEARCH PROGRAMS

RESEARCH PROGRAMS

IMAGE SENSOR PLATFORMS Backside

illuminated image sensors

Embedded CCD in CMOS image sensors

Organic photodetectors

VISION SYSTEMS Hyperspectral

imaging

Lens Free imaging

RESEARCH PROGRAMS

THIN-FILM

ORGANIC Photovoltaic

s

CZTS

RESEARCH PROGRAMS

SILICON PHOTOVOLTAICS

ORGANIC PHOTOVOLTAICS

Polymers or small molecules

Large, flexible, translucent substrates

Roll to roll development for high throughput

Increase efficiency and lifetime

Certified cell efficiencies beyond 9%

Key technologies: transient metal-oxide interfacing layers & tandem cell architectures

ENERGY: GaN POWER DEVICES

Cost-effective and efficient power conversion in tomorrow's electricity grid

Power devices on GaN-on-Si wafers in 200mm CMOS compatible process flow

RESEARCH PROGRAMS

RESEARCH PROGRAMS

Sweat analysis & physical condition

Glucose, Asthma

Level of CO2 & NO2

CMOS compatible processes

24/7 monitoring / Long autonomy / Wearable

Low cost

Electrochemical sensor in one single chip

Ethyleen ( fruit ripening)

Low detection limits, low cost, low power consumption

COLLABORATION MODEL CONCEPTS

50 © IMEC 2012 / CONFIDENTIAL

ROADMAP CHALLENGES: COST INCREASE

MULTITUDE OF MATERIALS & CONCEPTS

NARROWING DOWN OPTIONS, COST SHARING & RISK MITIGATION ARE KEY

IMEC’s CMOS PROGRAM RATIONALE

COMPLEXITY INCREASE

© IMEC 2013

ROADMAPS CONTAIN RISKS, AND ECOSYSTEMS CHANGE: PARTNERING FOR COST-EFFECTIVE R&D Equipment, material, SW

suppliers System houses, IC manufacturers & Foundries

Collaborative

PROGRAMS & PROJECTS in a

unique R&D infrastructure

World-wide R&D Platforms

EU, Regional funding University Partnerships

Build critical mass Share Risk & R&D costs

OPEN INNOVATION with NEW BUSINESS MODELS

MULTI-FACETED BUSINESS MODEL

Services

Training

Spin-offs

Transfer & licenses

Joint R&D

Programs

Bi and tri lateral

DoD

Service

training

licensing

venturing

EVERY ACTIVITY...MARKET... ECOSYSTEM REQUIRES ADJUSTED COLLABORATION MODEL FOR R&D

MULTI-FACETED BUSINESS MODEL

DoD & Services

Training

Spin-offs

Transfer & licenses

Joint R&D

CORE PROGRAM STRATEGIC VALUE DRIVERS

• Feeding and downselecting the long term innovation pipeline for device & system scaling

• Explore novel materials & device architectures for logic / memory roadmaps

• 3D & OIO technology pathfinding

• Technology feasibility assessment on 300mm development equipment

• Advanced patterning & Process module readiness • Device/reliability feasibility demonstration

modeling & characterization

• Early design-technology co-optimization • System impact, system enablement • INSITE

FULL IP MEMBERSHIP AND LICENSING

JOINT DEVELOPMENT PROGRAMS

SYSTEM ORIENTED DELIVERABLES

IDM, FOUNDRY...

EQUIPMENT & MATERIAL SUPPLIERS, EDA...

FABLESS FABLITE SYSTEM

ONE “ACTIVITY”,THREE OFFERINGS

MULTI-FACETED BUSINESS MODEL

DoD & Services

Training

Spin-offs

Transfer & licenses

Joint R&D

CMORE / DOD TURN YOUR SILICON CONCEPT INTO A PRODUCT

1. Concept design

2. Process

development, Packaging, Testing,

Reliability

3. Product qualification

4. Prototyping, Low-volume

manufacturing @ imec

5. Transfer

6. High-volume

manufacturing @ foundry partner

(Co-)development

Prototyping Production

MULTI-FACETED BUSINESS MODEL

DoD & Services

Training

Spin-offs

Transfer & licenses

Joint R&D

© IMEC 2012 / CONFIDENTIAL

ENABLING YOU ON A TECHNOLOGY NODE

Documentation (e.g. test-chips, procedures, process flow)

Equipment selection (e.g. recipes, etc.)

Ground rules; specifications

Metrology; In-line monitoring

Consulting on-site

Modules (e.g. STI, gate, interconnect)

Reliability and characterization (e.g. structures, specs)

Training (e.g. contamination protocol)

Si-processing; co-development option

Tailoring based on your need

MULTI-FACETED BUSINESS MODEL

DoD & Services

Training

Spin-offs

Transfer & licenses

Joint R&D

© IMEC 2012 / CONFIDENTIAL

FOCUS ON TRAINING COMBINING TECH TRANSFER

Class Room and on-line training

Customized packages On-campus / on-site

Hands on individual training

Engineer training

Consulting on-site

Operator training

Long Term Student class training

Tailoring based on your need: ‘white box’ collboartion focused on long term

GREAT CHALLENGES AND OPPORTUNITIES....

ASPIRE INVENT

ACHIEVE