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Industry Leading Provider of Outsourced Semiconductor ... · Package Test, 17.5% Wafer Sort, 11.3%...

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May 2018 Industry Leading Provider of Outsourced Semiconductor Assembly, Test & Bumping Services Q1’18 Results Conference
Transcript
Page 1: Industry Leading Provider of Outsourced Semiconductor ... · Package Test, 17.5% Wafer Sort, 11.3% Assembly, 26.5% LCD Driver, 27.1% Bumping (incl. RDL/MEMS/PM), 17.6% QoQ 0.4% -5.2%

May 2018

Industry Leading Provider of Outsourced Semiconductor

Assembly, Test & Bumping Services Q1’18 Results Conference

Page 2: Industry Leading Provider of Outsourced Semiconductor ... · Package Test, 17.5% Wafer Sort, 11.3% Assembly, 26.5% LCD Driver, 27.1% Bumping (incl. RDL/MEMS/PM), 17.6% QoQ 0.4% -5.2%

2 2

Safe Harbor Notice

This presentation contains certain forward-looking statements. These forward-looking

statements may be identified by words such as ‘believes,’ ‘expects,’ ‘anticipates,’

‘projects,’ ‘intends,’ ‘should,’ ‘seeks,’ ‘estimates,’ ‘future’ or similar expressions or by

discussion of, among other things, strategy, goals, plans or intentions. These

statements include financial projections and estimates and their underlying

assumptions, statements regarding plans, objectives and expectations with respect to

future operations, products and services, and statements regarding future

performance. Actual results may differ materially in the future from those reflected in

forward-looking statements contained in this document, due to various factors. Actual

results may differ materially in the future from those reflected in forward-looking

statements contained in this document, due to various factors. Further information

regarding these risks, uncertainties and other factors are included in the Company’s

most recent Annual Report on Form 20-F filed with the U.S. Securities and Exchange

commission (the “SEC”) and in the Company’s other filings with the SEC.

Page 3: Industry Leading Provider of Outsourced Semiconductor ... · Package Test, 17.5% Wafer Sort, 11.3% Assembly, 26.5% LCD Driver, 27.1% Bumping (incl. RDL/MEMS/PM), 17.6% QoQ 0.4% -5.2%

Agenda

3

Welcome S.J. Cheng

Q1’18 Operating Results Silvia Su

Q2’18 Business Outlook S.J. Cheng

Q&A

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4

Q1’18 Operating Results

Page 5: Industry Leading Provider of Outsourced Semiconductor ... · Package Test, 17.5% Wafer Sort, 11.3% Assembly, 26.5% LCD Driver, 27.1% Bumping (incl. RDL/MEMS/PM), 17.6% QoQ 0.4% -5.2%

Consolidated Operating Results Summary (unaudited)

5

Note:

(1) The exchange rate was NT$ 29.10 against to US$ 1.00.

(2) EBITDA = Operating Profit + Depreciation & Amortization;

(3) Annualized return on equity to the Company for the quarter;

Q1'18

Q4’17 Q1'17 (NT$ Millions)

Net Revenue 4,010.9 4,408.2 4,560.3

Profit Attributable to the Company 22.8 163.0 2,380.1

EPS Attributable to the Company- Diluted (NT$) 0.03 0.19 2.77

Earnings per ADS equivalent- Diluted (US$)(1) 0.02 0.13 1.90

Depreciation & Amortization 813.1 779.5 666.0

CAPEX 1,264.1 1,054.0 1,134.6

EBITDA(2) 1,070.6 1,114.2 1,720.4

Return on Equity(%)(3) 0.5% 3.6% 21.9%

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Consolidated Statements of Comprehensive Income (unaudited)

6

Q1'18

Q4'17 QoQ Q1'17 YoY (NT$ Millions)

Net Revenue 4,010.9 4,408.2 -9.0% 4,560.3 -12.0%

Gross Profit 584.1 749.3 -22.0% 816.6 -28.5%

Gross Margin 14.6% 17.0% -2.4ppts 17.9% -3.3ppts

Operating Expenses -359.0 -368.9 2.7% -441.3 18.6%

Operating Profit 257.5 334.7 -23.1% 1,054.4 -75.6%

Operating Profit Margin 6.4% 7.6% -1.2ppts 23.1% -16.7ppts

Non-operating Income (Expenses) -207.8 -122.8 -69.2% -431.0 51.8%

Profit Attributable to the Company 22.8 163.0 -86.0% 2,380.1 -99.0%

EPS Attributable to the Company- Basic (NT$) 0.03 0.19 -84.2% 2.82 -98.9%

Weighted Average Shares Outstanding (in

thousands)- Basic 849,571 849,571 0.0% 845,078 0.5%

EPS Attributable to the Company - Diluted (NT$) 0.03 0.19 -84.2% 2.77 -98.9%

Weighted Average Shares Outstanding (in

thousands)- Diluted 854,443 854,606 -0.02% 859,536 -0.6%

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0 200 400 600 800

1000 1200 1400

Package Test Wafer Sort Assembly LCD Driver Bumping (incl. RDL/MEMS/PM)

Q4'17 Q1'18

( NT$ M)

7

Q1’18 Revenue Breakdown By Manufacturing Segment (unaudited)

Package Test, 17.5%

Wafer Sort, 11.3%

Assembly, 26.5%

LCD Driver, 27.1%

Bumping (incl. RDL/MEMS/PM),

17.6%

QoQ 0.4% -5.2% -7.2% -17.0% -8.9%

Page 8: Industry Leading Provider of Outsourced Semiconductor ... · Package Test, 17.5% Wafer Sort, 11.3% Assembly, 26.5% LCD Driver, 27.1% Bumping (incl. RDL/MEMS/PM), 17.6% QoQ 0.4% -5.2%

8

Q1’18 Revenue Breakdown By Product (unaudited)

QoQ 12.5% 11.3% -12.1% -0.6% -22.6% -16.5% -8.0%

( NT$ M)

Niche DRAM, 16.5%

Commodity DRAM, 7.0%

FLASH, 22.2%

SRAM, 0.8% Logic/Mixed Signal, 8.0%

DDIC, 28.2%

Bumping(incl. RDL), 17.3%

0

500

1,000

1,500

2,000

2,500

Niche DRAM Commodity DRAM

FLASH SRAM Logic/Mixed Signal

DDIC Bumping (incl. RDL)

Q4'17 Q1'18

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Consolidated Statements of Financial Position & Key Indices (unaudited)

9

Q1'18 Q4'17 Q1'17

(NT$ Millions) Amount % Amount % Amount %

Current Assets 12,617.4 38.2% 14,201.0 42.7% 17,606.1 51.6%

Non-current Assets 20,432.4 61.8% 19,058.9 57.3% 16,491.0 48.4%

Total Assets 33,049.8 100.0% 33,259.9 100.0% 34,097.1 100.0%

Current Liabilities 6,189.3 18.7% 6,670.6 20.1% 5,331.4 15.6%

Non-current Liabilities 8,262.0 25.0% 8,196.0 24.6% 10,357.2 30.4%

Total Liabilities 14,451.3 43.7% 14,866.6 44.7% 15,688.6 46.0%

Total Equity 18,598.5 56.3% 18,393.3 55.3% 18,408.5 54.0%

Total Equity and Liabilities 33,049.8 100.0% 33,259.9 100.0% 34,097.1 100.0%

Key Indices

A/R Turnover Days 88 84 76

Inventory Turnover Days 50 48 46

Page 10: Industry Leading Provider of Outsourced Semiconductor ... · Package Test, 17.5% Wafer Sort, 11.3% Assembly, 26.5% LCD Driver, 27.1% Bumping (incl. RDL/MEMS/PM), 17.6% QoQ 0.4% -5.2%

Consolidated Statement of Cash Flows (unaudited)

10

Q1'18 Q1'17 (NT$ Millions)

Cash and Cash Equivalents at Beginning of Period 8,035.7 7,571.4

Net Cash Generated from(used in) Operating Activities 758.7 1,860.3

Net Cash Generated from(used in) Investing Activities -2,178.2 1,265.6

Net Cash Generated from(used in) Financing Activities 77.3 1,009.9

Effect of Exchange Rate Change on Cash -5.0 -14.4

Cash and Cash Equivalents at End of Period 6,688.5 11,692.8

Free Cash Flow -251.1 425.7

Page 11: Industry Leading Provider of Outsourced Semiconductor ... · Package Test, 17.5% Wafer Sort, 11.3% Assembly, 26.5% LCD Driver, 27.1% Bumping (incl. RDL/MEMS/PM), 17.6% QoQ 0.4% -5.2%

11

Q1’18 Capital Expenditures (unaudited)

CapEx

( NT$ M)

Q1’18 CapEx Breakdown

3,123.3

4,702.7

1,264.1 1,134.6 1,264.1

-

500

1,000

1,500

2,000

2,500

3,000

3,500

4,000

4,500

5,000

2016 2017 Q1'18 Q1'17 Q1'18

Testing, 29.3%

Assembly, 8.1% LCD Driver,

55.0%

Bumping, 7.6%

Page 12: Industry Leading Provider of Outsourced Semiconductor ... · Package Test, 17.5% Wafer Sort, 11.3% Assembly, 26.5% LCD Driver, 27.1% Bumping (incl. RDL/MEMS/PM), 17.6% QoQ 0.4% -5.2%

12

Q2’18 Business Outlook

Page 13: Industry Leading Provider of Outsourced Semiconductor ... · Package Test, 17.5% Wafer Sort, 11.3% Assembly, 26.5% LCD Driver, 27.1% Bumping (incl. RDL/MEMS/PM), 17.6% QoQ 0.4% -5.2%

13

Page 14: Industry Leading Provider of Outsourced Semiconductor ... · Package Test, 17.5% Wafer Sort, 11.3% Assembly, 26.5% LCD Driver, 27.1% Bumping (incl. RDL/MEMS/PM), 17.6% QoQ 0.4% -5.2%

Company website

14

http://www.chipmos.com


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