iNEMI Roadmap And ITRS Plans
For Collaboration Regarding “More
Than Moore” Technology
Beyond 2020
Chuck Richardson, iNEMI
Paolo Gargini, ITRS
225th ECS Meeting
Hilton Orlando Bonnet Creek Hotel
Orlando, FL
May 12, 2014
Topics
• iNEMI Introduction
• 2013 iNEMI Roadmap Statistics/Deliverables
• iNEMI Roadmap Process 2015
• ITRS Introduction
• ITRS / iNEMI Roadmap Comparison
• Collaboration Plans – present / future
• Summary/Next Steps
1
About iNEMI
International Electronics Manufacturing Initiative (iNEMI) is an industry-led
consortium of 110 global manufacturers, suppliers, industry associations,
government agencies and universities. A Non Profit Fully Funded by Member
Dues; In Operation Since 1994.
Visit us at www.inemi.org
5 Key Deliverables:
• Technology Roadmaps
• Collaborative Deployment
Projects
• Research Priorities Document
• Proactive Forums
• Position Papers
Mission: Forecast and Accelerate improvements in the Electronics
Manufacturing Industry for a Sustainable Future.
3
OEM / EMS Members
4Supplier Members
Supplier Members – PWB Supply Chain
5
6Academia / Organization Members
iNEMI Roadmap Statistics/Deliverables
• > 650 participants
• > 350 companies/organizations
• 18 countries from 4 continents
• 20 Technology Working Groups (TWGs)
• 6 Product Emulator Groups (PEGs)
• > 8 Man Years of Development Time
• > 1900 pages of information
• Roadmaps the needs for 2013-2023
• Workshops held in Europe (Berlin, Germany), Asia (Hong
Kong, China) and North America (ECTC, San Diego) in June
2012
• A Full Global Perspective
2013 Roadmap
8
Technical Plan for Members
5 Year Plan for
Implementation
2013
Technical
Plan
(iNEMI Members Only)
• Implementation Plan for Key
Areas
• Areas selected by TC
• Plans developed and
Prioritized by Members
• 2013 Plan Covers 7 Project
Areas
2013 Research Priorities
Chapter 1: Introduction
Chapter 2: Research Needs to support iNEMI Technology
Implementation Groups (TIGs) and current Projects
Chapter 3: Emerging Technologies
Chapter 4: Research Priorities Summarized by Research
Area
Design
Manufacturing Processes
Materials & Reliability
Sustainability
Summary
Chapter 5: Conclusions and Recommendations
Appendixes
2013
Research
Priorities
iNEMI Roadmap Process
12
Product
Needs
Technology
Evolution
GAP
AnalysisResearch
Projects
Methodology
Competitive
Solutions
Roadmap
Industry Solution
Needed
Academia
Government
iNEMI
Members
Collaborate
No Work
Required
Available
to Market
Place
Global
Industry
Participation Disruptive
Technology
13
Industry Led Teams
• Technical Working Group Teams
– Develops the roadmap technology chapters
– Presently 22 Teams and Chapters
• Product Emulator Group Teams
– “Virtual Product”: future product attributes plus key cost and
density drivers – Presently 6 Teams and Chapters
• Portable / Wireless
• Office / Consumer Systems
• High-End Systems
• Medical Products
• Automotive
• Aerospace/Defense
2015 Product Emulator Descriptions
Emulator Characteristics
Wireless / Portable
Produced in high volumes, cost is a primary driver, hand held battery
powered products are also driven by features, size, weight reduction and
battery life
Office / Consumer Systems Driven by the need for maximum performance and lowest cost
Automotive Products Products that must operate in an automotive environment
High-End Systems Products that serve the high end computing, networking, datacom and
telecom markets and cover a wide range of cost and performance targets
Medical ProductsProducts that must operate with high reliability and, in some cases,
support life critical applications
Aerospace / Defense Products that must operate reliably in extreme environments
14
15
Format for Product Emulator Chapters • Executive Summary (≈ 1 page)
• Introduction
• Situation Analysis
– Benchmark state of Industry and Technology
– Key Drivers: cost, performance, size, market
– Chart any actual 2013 vs. 2013 forecast differences
• Roadmap of Quantified Key Attribute Needs (2015 – 2025)
• Critical (Infrastructure) Issues –
– Identify Potential Paradigm Shifts
– Provide Vision of Final Assembly Process
– Discuss System Test
– Discuss Environmental Issues
• Prioritized Technology Requirements and Trends: Research,
Development, Implementation
• Contributors
16
September 27th
Key Attribute Workshop Results
1717
2015 Technology Working Groups (TWGs)
Organic PCBBoard
Assembly Customer
RF Components &
Subsystems
OptoelectronicsLarge Area, Flexible Electronics
Energy Storage
Modeling, Simulation,
and Design
Packaging
&
Component
Substrates
Semiconductor
Technology
Final
Assembly
Mass Storage (Magnetic & Optical)
Passive Components
Information
Management
Systems
Test, Inspection &
Measurement
Environmentally
Sustainable
Electronics
Ceramic
Substrates
Thermal
Management
Connectors
MEMS/
Sensors
Red=Business Green=Engineering Purple=Manufacturing Blue=Component &
Subsystem
Solid State Illumination
Photovoltaics
Power Conversion Electronics
18
Format for TWG Chapters • Executive Summary (~1page of highlights)
• Introduction
• Situation (Infrastructure) Analysis
– Manufacturing Equipment
– Manufacturing Processes
– Materials
– Quality/Reliability
– Environmental Technology
– Test, Inspection, Measurement (TIM)
• Roadmap of Quantified Key Attribute Needs
• Critical (Infrastructure) Issues
• Technology Needs:
– Prioritized Research Needs (> 5 years result)
– Prioritized Development & Implementation Needs (< 5 years result)
• Gaps and Showstoppers
• Recommendations on Potential Alternative Technologies
• Contributors
Roadmap Development
Product Emulator Groups TWGs
Medical Products
Automotive
Defense and Aerospace
Desig
n T
ech
no
log
ies
Man
ufa
ctu
ring
Tech
no
log
ies
Mo
de
ling
, Th
erm
al, e
tc.
Bo
ard
Asse
mb
ly, T
est, e
tc.
Product Sector Needs vs. Technology Evolution
Bu
sin
ess P
rocesses
Portable / Wireless
Office / Consumer Systems
High-End (e.g. netcom, server)
Sem
ico
nd
ucto
r Tech
no
log
y
Pro
d L
ifecycle
Info
rma
tion M
gm
t.
Co
mp
./Su
bsys
t. Tech
no
log
ies
Pa
cka
gin
g, S
ubstra
tes, D
isp
lays, e
tc.
Optoelectronics and
Optical Storage
Organic Printed
Circuit Boards
Magnetic and
Optical Storage
Semiconductors
iNEMI
Mass Data
Storage TWG
iNEMI / IPC / EIPC
/ TPCA
Organic PWB
TWG
iNEMI / ITRS /
MIG/PSMA
Packaging
TWG
iNEMI
Board
Assembly
TWG
Interconnect
Substrates—Ceramic
iNEMI Roadmap
iNEMI
Optoelectronics
TWG
iNEMI / MIG
/ ITRS
MEMS
TWG
iNEMI
Passives
TWG
Fourteen Contributing Organizations
2121
2015 Roadmap Schedule• 3Q2013: Recruit Product Sector Champions, teams and refine data
charts/Begin 2015 Roadmap Newsletter & send 2013 PEG chapters
• 3/4Q13: Product Sector Champions Develop Emulators
– September 16, 2013 – Teleconference with P.E. Group Chairs
– September 27, 2013 Web based meeting TWG/PEG Chairs (key attributes)
– October 16, 2013 – SMTAI Presentation on 2015 Plans
– October 17, 2013 - Roadmap PEG Kick-off with PEG/TWG/TC at SMTAI
• 2013 Roadmap chapter, format, Exec. Summary emailed to each TWG chair
(Word) 1/3/2014
• Organizing Teleconference with TWG Chairs 1/10/2014:
• Feb 19,20 2014 PEG Workshop/TWG Kick-off – Agilent Technologies, Santa
Rosa, CA
– Product Sector Tables Complete – PEG Chapter rough drafts written
– Cross cut issues are initially addressed
• May 13, 2014 Telecon With TWG Chairs, Preliminary PEG Chapters Due
2222
2015 Roadmap Schedule - Continued• May 27, 2014 – N.A. RM WS - Open Roadmap TWG Presentations in
Orlando, FL (ECTC)
• June 11, 2014 European Roadmap Workshop/Webinar – 9:00 AM EDT
• June 18, 2014 – Asian Roadmap Workshop/Webinar – 8:00 PM EDT
• July 14, 2014 – TWG Drafts Due for TC Review
• August 20,21, 2014 – TC Face-to-Face Review with TWG Chairs at IBM,
RTP, N.C.
• September 22, 2014 Final Chapters of Roadmap Due
• October 2, 2014 TC Briefing/SMTA at SMTAI (Rosemont, Illinois)
• October 31, 2014 – Edit, Prepare Appendix A-D, Executive Summary
• November 20, 2014 – Go To “Press”
• December 5, 2014 – Ship to Members
• April TBD, 2015 – Global industry roadmap presentations via webinars
ITRS Introduction
24
1991
Micro Tech 2000
Workshop Report
1994NTRS1992NTRS 1997NTRS
The NTRS
Mission: Provide unified roadmap for US Industry, Academia and Government
25
Tutorial for SEMI P.Gargini
1998 ITRS Update
• Participation extended to: EECA, EIAJ, KSIA, TSIA
at WSC on April 23,1998
• 1st Meeting held on July 10/11,1998 in San
Francisco
• 2nd meeting held on December 10/11,1998 at SFO
• 50% of tables in 1997 NTRS required some changes
• 1998 ITRS Update posted on web in April 1999
26
ITRS 7/11/1998
From My Files
27
1991
Micro Tech 2000
Workshop Report
1994NTRS1992NTRS 1997NTRS
The Start of the ITRS
Japan KoreaEurope Taiwan USA
http://www.itrs.net
2001 ITRS1999 ITRS1998 ITRS
Update
2000 ITRS
Update
2002 ITRS
Update
Mission: Identify Technology Needs and Possible Solutions
for the Global Semiconductor industry
28
1997-2009
Center for
Materials,
Structures and
Devices
2911/29/2006 CONFIDENTIAL - SIA Board Meeting – November 16, 2006 – San Jose, CA - CONFIDENTIAL 4
U Washington
Portland Univ.
Stanford
U.C. Berkeley
U.C. Santa Barbara
UC Davis
UCLA
U.C. San Diego
Caltech
UC Riverside
S. California
UC Irvine
UC Santa Cruz
Arizona State
U. Michigan
Purdue U.
U. Wisconsin
U. Illinois
U. Minnesota
RPI
Albany U.
U. Mass
MIT
Harvard
Stony Brook
Columbia
NYU
Princeton
Carnegie Mellon
Penn State U.
U.Virginia
N.Carolina State
Georgia Tech
U.Florida
U.T. Austin
Texas A&M
U.T. Dallas
Cornell
38 Universities and ~200 research faculty in 2007
US Universities in FCRP
29
30
STARnet2013-2015
https://www.src.org/program/starnet/
Semiconductor Technology
Advanced Research Network The TerraSwarm Research
Center
Function Accelerated
nanoMaterial Engineering
Center for Spintronic Materials,
Interfaces and Novel Architectures
Center for Future Architectures
Research
Systems On Nanoscale
Information fabriCs Center
31
NRI
The Institute for Nanolectronics Discovery and Exploration (INDEX)
The South West Academy of Nanoelectronics (SWAN)
The Center for NanoFerroic Devices (CNFD)
NRI-NSF Research Centers with Supplemental Grants
2013-2015
https://www.src.org/program/nri/
Nanoelectronics
Research Initiative
32
11/15/2006 CONFIDENTIAL - SIA Board Meeting – November 16, 2006 – San Jose, CA - CONFIDENTIAL 6
NRI ProgressNRI Progress
J F M A M J J A S O N DDNOSAJJMAMFJ
2005 2006
• SIA White Paper on
Post-CMOS presented
to SIA Board
• SIA Board resolution for
formation of NRI
6 companies sign NRI
participation agreement
(AMD, Freescale, IBM,
Intel, Micron, TI)
NSF/NRI solicitation
released
NSF/NRI Awards
announced for 2006-2008
NRI research programs
started
WIN
formed
INDEX
formed
SWAN
formed
WIN = Western Institute of Nanoelectronics
INDEX = Institute for Nanoelectronics Discovery and Exploration
SWAN = South West Academy for Nanoelectronics
Second NSF/NRI
solicitation released for
2007-2009
First year review results
from NSF/NRI centers, plus
project plans and initial
results from WIN, INDEX
and SWAN
33
NRI Funded UniversitiesFinding the Next Switch
UC Los AngelesUC BerkeleyUC IrvineUC Santa BarbaraStanfordU DenverPortland StateU Iowa
Notre Dame PurdueIllinois-UC Penn StateMichigan UT-DallasCornell GIT
UT-Austin Rice Texas A&MUT-Dallas ASU Notre DameU. Maryland NCSU Illinois UC
ColumbiaHarvardPurdueUVAYaleUC Santa BarbaraStanfordNotre DameU. Nebraska/LincolnU. MarylandCornellIllinois UCCaltechUC BerkeleyMITNorthwesternBrownU Alabama
SUNY-Albany GIT HarvardPurdue RPI ColumbiaCaltech MIT NCSUYale UVA
Over 30 Universities in 20 States
SPIN
TUNNEL FETGRAPHENE
SPIN LOGIC
GRAPHENE
34
1991
Micro Tech 2000
Workshop Report
1994NTRS1992NTRS 1997NTRS
21st Anniversary of TRS
Japan KoreaEurope Taiwan USA
http://www.itrs.net
2001 ITRS1999 ITRS1998 ITRS
Update
2000 ITRS
Update
2002 ITRS
Update
2004 ITRS
Update
2006 ITRS
Update2003 ITRS 2005 ITRS 2007 ITRS
2008 ITRS
Update
2010 ITRS
Update2009 ITRS
2012 ITRS
Update2011 ITRS
2013 ITRS
2013 ITRS ITWGs1. System Drivers
2. Design
3. Test & Test Equipment
4. Process Integration, Devices, & Structures
5. RF and A/MS Technologies
6. Emerging Research Devices
7. Emerging Research Materials
8. Front End Processes
9. Lithography
10. Interconnect
11. Factory Integration
12. Assembly & Packaging
13. Environment, Safety, & Health
14. Yield Enhancement
15. Metrology
16. Modeling & Simulation
17. MEMs
35
ITRS / iNEMI Roadmap
MtM Process Plans
ITRS / iNEMI Roadmap Comparison
The iNEMI Technology Roadmap is focused on
the business & technology areas (26-28) associated
with the electronics’ industries global supply
chain. It is a “Market Pull” roadmap that defines
desired product attributes & asks what
technologies are needed to support them.
iNEMI’s large OEM membership is a benefit and
an advantage in needs identification.
The iNEMI Roadmap collaborates with 13 other
organizations including the IPC and ITRS in
developing it’s chapters.
The roadmap is the starting point of the iNEMI
process for identifying technology or business
gaps. The iNEMI gap identification process is
distinctive and sets the iNEMI roadmap apart
from others.
The ITRS is focused on semiconductor
technology and has been a “Technology Push”
roadmap that looks at the progress of technology
and asks what products subsequently can be
developed.
The ITRS roadmap has utilized Moore's Law
and heuristic equations as its foundation. With
the options for scaling shrinking, a “More-than-
Moore” approach is needed.
The ITRS collaborates with the iNEMI
Roadmap in several areas to drive product
attribute needs down to the semiconductor
technology level.
The Packaging and MEMS chapters of both
roadmaps are developed by a common set of
leaders and subsets of participants.
38
Moore’s Law & More
More than Moore: DiversificationM
ore
Mo
ore
: M
inia
turi
zati
on
Mo
re M
oo
re:
Min
iatu
rizati
on
Combining SoC and SiP: Higher Value System
sBaseli
ne C
MO
S:
CP
U,
Mem
ory
, L
og
icBiochips
Sensors
Actuators
HV
PowerAnalog/RF Passives
130nm
90nm
65nm
45nm
32nm
22nm...V
130nm
90nm
65nm
45nm
32nm
22nm...V
Information
Processing
Digital content
System-on-chip
(SoC)
Interacting with people
and environment
Non-digital content
System-in-package
(SiP)
Beyond CMOS
•Traditional
•ORTC Models• [
Geo
metr
ical
& E
qu
ivale
nt
scali
ng
]
• Scali
ng
(M
ore
Mo
ore
)•Functional Diversification (More than Moore)
•HVPower •Passives
• Scali
ng
(M
ore
Mo
ore
)
•Movement from System to Chip
Design and System Drivers
ITRS-iNEMI Domain Space
•Chip level •System level
•Technology
•Requirements
•Market
•Requirements
•ITRS
•(Drivers)
•*Source: ITRS Design/System Drivers TWG Chairman, Dr. Juan-Antonio Carballo
Increasing
Overlap
•iNEMI
•(emulators)
Present • ITRS (International Technology Roadmap For Semiconductors) shares leadership and
participants with the iNEMI Roadmap Packaging & Component Substrates TWG and the MEMS TWG.
• IRC (European Members) released a More-than-Moore Whitepaper in 2010 that presents the ITRS investigation on what is needed to roadmap MtM. Available at http://www.itrs.net/Links/2010ITRS/IRC-ITRS-MtM-v2%203.pdf
• The ITRS is fully updated biennially and tables annually.
• The ITRS Packaging chapter focuses on semiconductor fabrication and packaging while the iNEMI chapter focuses on the impacts of semiconductor packaging and component substrates evolution on assembly and test issues.
• Some iNEMI PEGs (Product Emulator Groups) provide “key attribute” drivers for the ITRS Design and System Drivers ITWGs (International Technology Working Groups).
• The ITRS is presently completing their 2013 total roadmap update – becoming the input for the iNEMI 2015 Roadmap.
• The ITRS went through a major restructuring in April more closely aligning the technology requirements with system requirements.
• iNEMI and the ITRS co-hosted (with IPC participating) a one-day workshop on April 24th , 2013 in Lyon, France followed by a meeting at Stanford in August, to plan for iNEMI 2015 Roadmap Cycle – unable to complete plans in time for 2015 cycle. Continuing discussions and co-hosted another MtM Workshop on April 9th in New Nauheim, Germany.
40
41
More Moore Beyond Moore
More than Moore
Heterogeneous Integration
System Integration
Customized FunctionalityO
P
S
Y
S
T
E
M
A
P
P
L
E
T
S
Outside System Connectivity
Beyond 2020
ITRS 2012
NEW ITRS 2014/2015 Themes
42
Beyond 2020(ITRS 2012->ITRS 2014)
Outside System Connectivity Outside System Connectivity
System Integration System Integration
Heterogeneous Integration Heterogeneous Integration
Beyond Moore Beyond CMOS
More than Moore Heterogeneous Components
More Moore More Moore
Manufacturing Manufacturing
THEMES NEW ITWGs
Definitions of Focus Topics
System Integration—studies and recommends system architectures to meet the needs of
the industry. It prescribes ways of assembling heterogeneous building blocks into
coherent systems.
Outside System Connectivity—refers to physical and wireless technologies that connect
different parts of systems.
Heterogeneous Integration—refers to the integration of separately manufactured
technologies that in the aggregate provide enhanced functionality.
Heterogeneous Components —describes devices that do not necessarily scale according
to “Moore's Law,” and provide additional functionalities, such as power generation and
management, or sensing and actuating.
Beyond CMOS—describes devices, focused on new physical states, which provide
functional scaling substantially beyond CMOS, such as spin-based devices, ferromagnetic
logic, and atomic switch.
More Moore—refers to the continued shrinking of horizontal and vertical physical feature
sizes to reduce cost and improve performance.
Manufacturing consists of tools and processes necessary to produce items at affordable
cost in high volume.
Existing/Potential Holistic Roadmapping Links
iNEMI RF TWG
ITRS RF ITWG (1)
iNEMI/ITRS Packaging TWG
iNEMI PEGS
ITRS Design and System ITWG
iNEMI Test TWG
ITRS Test ITWG
(2)
iNEMI MEMS TWG
ITRS MEMS ITWG
iNEMI ECE TWG
ITRS EHS ITWG
(3)
iNEMI MS&DT TWG
ITRS MS&D ITWG
(4)
Green = Working History
Yellow = Some Contact
Red = Active Discussion
Number = Suggested Priority
iNEMI / ITRS Acronyms
iNEMI PEGS
(Product Emulator Groups)
iNEMI / ITRS MEMS (Micro-Electro Mechanical
Systems)
ITWG / TWG (International / Technology Working
Group)
iNEMI ECE(Environmentally
Conscious Electronics)
ITRS EHS (Environmental, Health Services)
iNEMI MSD (Modeling, Simulation & Design)
ITRS MS&D ITWG
Future
• Develop graphic to show holistic links
• For these linked TWGs provide URL links in roadmap chapters
– Leverage ITRS semiconductor focus and iNEMI system focus to facilitate
collaboration between key chapters to help effect a holistic approach to
technology development
• Emphasize need for industrial cooperation to develop optimized
system solutions to today’s brick walls
• Expand and formalize the process for iNEMI PEGs (Product
Emulator Groups) providing “key attribute” drivers for the ITRS
Design and System Drivers ITWGs (International Technology
Working Groups) soon to become “System Integration ITWG”.
• iNEMI and the ITRS again co-sponsored a one-day workshop in
Frankfort, Germany this April to discuss advancing the collaborative
relationship in “More Than Moore” or heterogeneous integration in
future roadmaps.
46
47•47•47
•ITRS-iNEMI Domain Space
•SiP-SoC More-than-Moore Proposal Example
•Chip level •System level
•Tech
•requirements
•Market
•requirements
•Portable emulator
•RF/AMS Driver
•Portable consumer
driver •1 •2 •3
•Update
•portable
•driver
•Update
•portable
•emulator
•PA Case
•Study
•(SoC v. SiP)
Completed the 2013 iNEMI Roadmap / ITRS Cycles
• 2013 iNEMI Roadmap Development Cycle is wrapped up!
• iNEMI Technology Plan completed & available to members
• iNEMI Free Research Priorities Document completed & available at
www.inemi.org
• iNEMI Roadmap available to members and industry now:
– Order the 2013 iNEMI Roadmap flash drive at www.inemi.org
– Individual roadmap chapters are also available as a PDF document at www.inemi.org
– Also available at IPC/SMTA Bookstores
• 2013 ITRS Roadmap posted and available free on-line at
http://www.itrs.net/Links/2013ITRS/Home2013.htm
• iNEMI Invites anyone interested in participating in the 2015
Roadmap to contact [email protected]
48
49
www.inemi.orgEmail contacts:
Grace O’Malley (Europe)
Haley Fu (Asia)
Chuck Richardson (Roadmap)
Grace O’Malley (V.P. Operations)
Bill Bader (CEO)
2015 Product Emulator Groups
50
Product Emulator Chair(s) 2015
Automotive Products Jim Spall, Delphi
Medical Products Fred Sporon-Fiedler, Micro Systems Eng.
Wireless / Portable Products Kartik Ananth, Intel
Office / Consumer Products TBD
High- End System Products Dale Becker, IBM
Aerospace/Defense James Faoro, Raytheon
2015 TWG Leadership Status
5151
Business Processes /
Technologies
Chair(s) Co-Chair(s)
Information Management TBD
Design Technologies
Modeling, Simulation & Design
Tools
TBD
Environmentally Sustainable
Electronics
Jackie Adams, IBM Stephen Tisdale, Intel
Mark Leimbeck, UL
Thermal Management Azmat Malik, Consultant
Manufacturing Technologies
Final Assembly TBD
Board Assembly Paul Wang, Mitac
Test, Inspection & Measurement Christopher Cain, Agilent
2015 TWG Leadership (cont.)
52
Component / Subsystem
Technologies
Chair(s) Co-Chair(s)
Semiconductor Technology Paolo Gargini, Stanford Alan K. Allan, Intel
Optoelectronics Dick Otte, Promex
Photovoltaics Jim Handy Objective-Analysis
Packaging Bill Bottoms, 3MTS
William Chen, ASE
Passive Components Ed Mikoski, ECIA
Connectors John MacWilliams, Bishop
RF Components TBD
MEMS / Sensors Michael Gaitan, NIST Chris Van Hoof, IMEC
Large Area, Flexible Electronics Dan Gamota, Jabil Margaret Joyce, Western Michigan U.
Energy Storage Systems Pramod Kulkarni, CES Nadim Maluf, QNovo
Interconnect Substrates (Ceramic) Howard Imhof, Metalor Ton Schless, Sibco; Mike Ehlert,
Consultant
Interconnect PCB (Organic) John T. Fisher, IPC
Michelle Hung, TPCA Liaison
Henry Utsunomiya, Consultant
Michael Weinhold, EIPC
Dieter Bergman, IPC
Mass Data Storage Roger F. Hoyt, Consultant Tom Coughlin, Coughlin Associates
Solid State Illumination Gyan Dutt, Alpha/Alent Marc Chason, Consultant
Power Conversion Eric Persson, International
Rectifier
Aung Tu – Fairchild, PSMA
