iNEMI Roadmap Facilitates Commercialization of Large Area Flexible Electronics Applications
Masahiro Tsuriya, iNEMI Daniel Gamota, Chair Margaret Joyce, Co-Chair Jie Zhang, Co-Chair
From Concept to Product
… many routes can be taken and a roadmap simplifies the process
Large Area Flexible Electronics Roadmap History
09/2005 – iNEMI Stakeholders identify Flexible Electronics as Future Growth Market and authorize formation of TWG 01/2006 – Flexible Electronics TWG formed 01/2007 – 1st Edition iNEMI Roadmap released
01/2009 – 2nd Edition iNEMI Roadmap released 01/2011 – 3nd Edition iNEMI Roadmap released 04/2013 - 4th Edition iNEMI Roadmap released
1st Edition Released at APEX 2007
Processing/ Equipment Platforms
Applications
Shift in Roadmap Topic Participation – Movement Along Supply Chain
Testing Equipment
2007 Roadmap greatest participation in “Materials”. 2009 Roadmap greatest participation shifted to “Substrates” and “Processing Equipment”. 2011 Roadmap greatest participation shifted to “Processing Equipment” and “Applications”. 2013 Roadmap greatest participation shifted to “Applications” and “Standards”.
Materials Substrates Packaging
Roadmap Contents
Situation Analysis • Business Issues & Drivers Overview • Functional Inks • Substrates • Packaging/Barriers • Manufacturing Platforms and Processing Equipment • Testing and Quality Control Tools • Large Area Flexible Electronics • Reliability • Standards
Roadmap Contents Roadmap of Quantified Key Attribute Needs, Gaps, and Showstoppers • Functional Inks: Technology Requirements • Substrates: Technology Requirements • Packaging/Barriers: Technology Requirements • Manufacturing Platforms and Processing Equipment: Technology
Requirements • In-line Characterization Tools: Technology Requirements • Off-line Characterization Tools: Technology Requirements • Devices and Circuits: Technology Requirements • Flexible Electronics: Technology Requirements • Reliability: Technology Requirements • Standards: Technology Requirements
Application/Substrate Properties
Smoo
thne
ss
Bar
rier
Pr
oper
ties
Opt
ical
T
rans
pare
ncy
Dim
ensi
onal
St
abili
ty
The
rmal
Sta
bilit
y
Mec
hani
cal
Stre
ngth
/ Fl
exib
ility
RFID tag Antenna 2 3 3 2 2 2
Circuitry 1 2 3 1 2 2
OLEDs 1 1 DS 1 1 APS
Display Backplanes
Inorganic
Passive 2 3 DS 2 2 APS
Active 1 2 DS 1 1 APS
Organic Active 1 1 DS 1 2 APS
Organic Photovoltaics 2 1 DS 2 1 2
Batteries 3 2 3 2 2 2
1 – very important, 2 – medium and 3 – less important, APS – application and product specific and DS – design specific
Introduction 1) Polymer (PET, PEN, PI) 2) Metal (Al, SS) 3) Paper (natural, synthetic) 4) Textiles (woven, non-woven) 5) Glass (silica) 6) Ceramics (alumina)
iNEMI Roadmap Format - Substrates
Haze %
Moisture pickupat 20oC, 40%RH
Youngs Modulusat 20oC, GPa
Youngs Modulus at 150oC, GPa
Shrinkage in MD at 150o C after 30 mins (%)
Upper temperature for processing, oC
78oC
120oC
180-220oC
18-20ppm/oC
0.05%
1000ppm
0.7%
150oC 4GPa
0.1%
1000ppm
0.7%
5GPa
3GPa20-25ppm/oC 1GPa
Heat stabilised PET
Heat stabilised PEN
Non stabilised PET and PEN shrink at TgThis limits processingto Tg
Situation Analysis Substrates
Status and Current Developments
Polymer Films
Polyesters: Applications Properties Major Past and Current Developments
iNEMI Roadmap Format - Substrates
State of the Art (2009) Mid term (2014) Long term (2019)
Attributes Attributes Technology needs Attributes Technology needs
Surface morphology:
roughness – bare foil
50nm RMS
15 nm RMS Development of advanced foil manufacturing technologies
5 nm RMS Development of advanced, yet low cost, polishing technologies
Flatness (per 500mm of
length): 2.0mm
1.0mm Development of advanced foil manufacturing technologies
0.5mm Development of advanced foil manufacturing and inspection technologies
Coefficient of thermal
expansion: 10ppm/oC
<5ppm Development and scale-up of alternative materials
<5ppm Development and scale-up of alternative materials
Roadmap of Key Technology Needs for Substrates Roadmap of Quantified Key Attribute Needs, Gaps, and Showstoppers
Substrates Polyester
Technology Requirements Needs, Gaps, and Showstoppers
iNEMI Roadmap Format - Substrates
Functional Inks
SS
SS
RR
n
Semiconductor Inks
Attributes • High performance • Long shelf life and pot life • Solution processable • Compatibility with other functional
inks (chemical and electrical interfacial integrity)
• Robust synthesis/formulating routes • Materials and device stability in-air • Compatible with large area scalable
processing platforms
Silver Nanoparticle Conductive Inks
Thin Film Deposition – Physical Vapor Deposition (sputtering, pulsed laser, etc.) – Chemical Vapor Deposition (PECVD) – Molecular Beam Epitaxy (MBE) – Atomic Layer Deposition (ALD) – Spin coating
Pattern Transfer
– Photolithography – Nanolithography – Soft Lithography – Liquid Imaging
Implantation
– Ion Implantation – Diffusion Furnace
Removal
– Reactive Ion Etch – Dry Etch, Wet Etch – Plasma Ashing – Chemical Mechanical Planarization
Substrate must be compatible to fabrication process – temperature, materials, process environment, handling, etc.
Gravure Flexography
Screen
Jetting
Embossing
Traditional Electronics Processes Emerging Electronics Processes
Manufacturing Platforms and Processing Equipment
Manufacturing Platforms and Processing Equipment
Deposition Technology
Description Pros Cons
Evaporation Formation of a film by the boiling or sublimation of a source material followed by condensation on a target substrate.
Wide range of materials. Very good for metal and organic deposition.
Dissimilar materials may require markedly varying source technology.
Sputtering Ejection of atoms from a target material via momentum transfer of bombarding ions to the surface of the target.
Fast, low temperature deposition possible. Wide range of multi-component materials.
Potential for ion damage of underlying films.
PECVD Deposition of thin-films from a gas state via the reaction of chemical constituents within a reactive plasma.
Excellent control of stochiometry. High deposition rates (esp. with elevated T)
Requires specialized precursor materials. Control of film density at low T problematic.
ALD Gas phase deposition which breaks the chemical formation of thin films into two discrete half reactions.
Exceptional thickness control and step coverage. Process T as low as ambient.
Low deposition rate.
Seshan, K. (2002). Handbook of Thin-Film Deposition Processes and Techniques - Principles, Methods, Equipment and Applications (2nd Edition).
System Attribute Specification
Reduction ratio 2:1 (reduces reticle image)
Resolution ≤ 4.0 µm line/space pattern
Available depth of focus 25 µm at +/- 10% dose points
Numerical Aperture 0.15
Image field size 80 mm round; 56.5mm square
Image stitching error ≤ ± 1.0 µm
Overlay accuracy ≤ ± 1.0 µm
Scale compensation
± 400 ppm
Wavelength G-Line (436 nm)
Power at image plane ≥ 180 mw/cm 2
Uniformity ± 3%
Azores Specification Document..
Thin Film Deposition Technologies
Key Technology Needs for Imaging System
In-Line/Off-Line Characterization Tools
Critical Parameters •Resolution •Registration •Layer thickness •Orientation of features •Dimensions of features •Processing conditions •Material quality (pot life) •In-process electrical testing •Final product electrical testing
L
b
Gate Dielectric
Substrate
a
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
Source Drain
Material Attributes
Process Parameters
Deposition Issues
• Rheology • Curing/Sintering/Annealing
temperature and schedules • Solution stability/shelf-life
• Excitation frequency • Meniscus oscillation • Droplet pinch-off
• Material/substrate wettability
• Droplet evaporation • “Coffee Stain”
phenomena
In-Line/Off-Line Characterization Tools
Development of Characterization Tools and Standard Operating Procedures based on materials and processes.
In-Line/Off-Line Characterization Tools
R2R Defect Inspection System (Flexible Electronics Roadmap Chapter Figure 13).
System Attributes • Web scratch identification • Defect mapping • Inspection width of 6” (extendable) • Web handling: widths up to 24” • Target defect size to detect: ≤ (1 to 5) μm • Minimum defect size: 3 μm • Pass/fail sensitivity parameters automated • Scratch detection algorithm ( ≥ 1 x 10 μm) • Interleaf capable web handling
Electrical Design, Layout, and Simulation Tools
Pre-Press Production Systems RIPing
Imaging device
(CtP, Film setter)
Semiconductor/ Microelectronics Layout Software
Graphic Arts File Conversion
CAD file/Gerber file
TIFF file
BIT map file
PDF/JDF Interface
Plate Cylinder
Film
Potential flow processes for circuit layout data conversion to R2R printing manufacturing (Flexible Electronics Roadmap Chapter: Figure 4).
Common software for microelectroinics, graphic arts, and printing (Flexible Electronics Roadmap Chapter: Table 2).
Process and Device Modeling
Semiconductor/Microelectronics Layout Software
Graphic Arts Software
Pre-Press Production Systems
CADENCE™PSPICE™SUPREM™FLOOPS™
OrCAD™L Edit™GerbTool™Graphics™AutoCAD™
Illustrator™Photoshop™Quark™In Design™
Kodak PrinergyAGFA ApogeeEsko Artwork
Electrical Design, Layout, and Simulation Tools
Measured
Simulated
Circuit Design
Confirmation of Experimental to Simulation
Circuit Simulation
Circuit Layout
Products and Applications Lighting & Displays RF Enabled Sensors Photovoltaics
Reliability Testing Methods and Equipment
Reliability Testing Parameters • Air to air temperature cycling (-
20°C to +60°C, 30 min dwell) • Liquid to liquid thermal shock (-
20°C to +60°C, 5 min dwell) • Flexure (30 degree off-axis bend) • Humidity exposure (60°C at 90%
R.H.) • Oxygen exposure • Solvent resistance (Bleach, water,
ammonia, etc.) • Tearing, crumpling, crushing
Reliability is application specific
Standards Development Community
Printed Electronics Standards
ASTM
IEC
IEEE
IPC
JAPERA JPCA
NIST
NPES
SGIA
Standards community expanding to include representatives from various organizations.
Ballot for IPC/JPCA-2291 closes in May 2013.
Motivation • Establish a design
process flow to facilitate the practice of printed electronics.
Requirements • Performance
Specifications • Materials Selection • Design and
Architecture • Manufacturing
Process Layout
IPC D61 Subcommittee Design Guidelines for Printed Electronics (IPC/JPCA-2291)
21
Approved by Consensus Body – Ballot Closed on June 1, 2012 (Released to Public July 2012).
Motivation • Base (substrate)
material strongly influences final device performance.
Materials Requirements • Chemical • Electrical • Mechanical • Optical
IPC D62 Subcommittee Printed Electronics Base Materials (IPC/JPCA-4921)
22
IPC D63 Subcommittee Printed Electronics Functional Materials (IPC/JPCA-4591)
Motivation • Multiple classes of
conductive functional materials available.
Requirements • Mechanical Properties • Electrical Properties • Optical Properties • Test Vehicle Designs • Shelf and Working Life
Approved by Consensus Body – Ballot Closed on October 8, 2012 (Released to Public December 2012).
23
IPC D64 Subcommittee Printed Electronics Final Assembly (IPC/JPCA-6901)
D64 Subcommittee identifying the necessary technical structure to design and manufacture printed electronics assemblies that meet conformance to industry established metrics as determined by industry accepted testing methods.
Motivation • Provide developers the
tools to design and manufacture printed electronics assemblies.
Requirements • Classification System -
Market • Classification System -
Level • Performance Criteria • Testing Methods
24
IPC PE Standards Portfolio Near term needs
D60
D61 D62 D63 D64 D65 D66
Design Guidelines for Printed Electronics (IPC-2291)
Requirements for Printed Electronics Base Materials (IPC-4921)
Requirements for Printed Electronics Functional Materials (IPC-4591)
Performance Requirements for Printed Electronics Assemblies (IPC-6901)
25
Test Methods for Printed Electronics
Process Guidelines for Printed Electronics *
*D-66 subcommittee formed, 1st meeting @ JPCA PE in Tokyo, 4 June 2013 D65 gathering members and background data
Large Area Flexible Electronics “Top Four” Needs and Gaps
#1 In-line inspection and testing equipment #2 Simulation and design tools #2 Robust R2R, roll-fed, and large format
manufacturing platforms #4 Higher performance inks (semiconducting,
OLED, PV active, etc.)
www.inemi.org
Masahiro Tsuriya [email protected]
Daniel Gamota [email protected]
Bob Pfahl [email protected]
