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Instrumentation
Surface Mount Technology for Surface Mount Technology for Process Analytic Sampling SystemsProcess Analytic Sampling Systems
Steve Doe, Parker Hannifin CorporationSteve Doe, Parker Hannifin Corporation
Surface Mount Technology for Surface Mount Technology for Sample Systems: Update 2002Sample Systems: Update 2002
““Surface Mount” Definition:Surface Mount” Definition:
Component’s control function Component’s control function is detachable from its flowpath is detachable from its flowpath
functionfunction
Providing increased Providing increased servicability and flexibility servicability and flexibility
while reducing overall space while reducing overall space requirementsrequirements
Surface Mount Technology for Surface Mount Technology for Sample Systems: Update 2002Sample Systems: Update 2002
Surface Mount System OptionsSurface Mount System Options
1) 1) Parker Integrated Conditioning System (PICS) w/ SP76 compliant Parker Integrated Conditioning System (PICS) w/ SP76 compliant 1½” and 2¼” elastomeric seal interfaces & instrumentation 1½” and 2¼” elastomeric seal interfaces & instrumentation componentscomponents
2) 1½” compliant interface w/ metallic seals and semiconductor grade 2) 1½” compliant interface w/ metallic seals and semiconductor grade & instrumentation components (“old” ultra-high purity “standard”)& instrumentation components (“old” ultra-high purity “standard”)
3) 13) 111//88” interface w/ metallic seals and semiconductor grade & ” interface w/ metallic seals and semiconductor grade & instrumentation components (emerging ultra-high purity instrumentation components (emerging ultra-high purity “standard”)“standard”)
4) R-Max™ stream switching interface (proprietary)4) R-Max™ stream switching interface (proprietary)
SSaammppllee
CCoonnddiittiioonniinngg
SP-76 Interface StandardSP-76 Interface Standard(Elastomeric)(Elastomeric) Roots in semiconductor Roots in semiconductor
industryindustry
Geometrically defines device Geometrically defines device features to match substrate features to match substrate
Everything above the interface Everything above the interface is device supplier specificis device supplier specific
Everything below the interface Everything below the interface is substrate supplier specificis substrate supplier specific
Surface Mount Technology for Surface Mount Technology for Sample Systems: Update 2002Sample Systems: Update 2002
1½” Interface
2¼” Interface
Keys to SP-76 Interface Standard Keys to SP-76 Interface Standard Specifies 1/8” ID flow channelsSpecifies 1/8” ID flow channels
Liquid service?Liquid service?
System commonly uses diaphragm System commonly uses diaphragm valves in lieu of ball valvesvalves in lieu of ball valves
Surface Mount Technology for Surface Mount Technology for Sample Systems: Update 2002Sample Systems: Update 2002
Geometry specifications do not allow for Geometry specifications do not allow for captured o-rings; housed in captured o-rings; housed in counterbore counterbore onlyonly
Ideal world would incorporate Ideal world would incorporate centerline spacing to support centerline spacing to support captured o-ring designcaptured o-ring design
PICS SystemPICS System Designed w/ 5 flow channels Designed w/ 5 flow channels
specifically for the majority of specifically for the majority of sample conditioning systemssample conditioning systems
Utilizes 1½” SP76 (o-ring) Utilizes 1½” SP76 (o-ring) compliant elastomeric interface compliant elastomeric interface
Incorporates larger 2¼” footprint Incorporates larger 2¼” footprint to utilize existing instrumentation to utilize existing instrumentation devices; SP76 (o-ring) compliantdevices; SP76 (o-ring) compliant
Substrate heating capability Substrate heating capability available w/ minimal developmentavailable w/ minimal development
Surface Mount Technology for Surface Mount Technology for Sample Systems: Update 2002Sample Systems: Update 2002
PICS SystemPICS System Substrate assembled via bolts Substrate assembled via bolts
with tapped holes in headwith tapped holes in head
Bolt interface incorporates dowel Bolt interface incorporates dowel pin feature for alignment and pin feature for alignment and added rigidityadded rigidity
O-ring connections between O-ring connections between substrate blocks substrate blocks
Surface Mount Technology for Surface Mount Technology for Sample Systems: Update 2002Sample Systems: Update 2002
1½” Interface1½” Interface 1½” Interface 1½” Interface 2¼” Interface 2¼” Interface
Surface Mount Technology for Surface Mount Technology for Sample Systems: Update 2002Sample Systems: Update 2002
Std 3 channel access 5 channel accessStd 3 channel access 5 channel access 3 or 5 channel access 3 or 5 channel access
Surface Mount Technology for Surface Mount Technology for Sample Systems: Update 2002Sample Systems: Update 2002
COMMON
NORMALLY CLOSED
NORMALLY OPEN
AIR
3-WAY R-max
FILTER
(1.5 CR)
H2O CELL
(1.5 CR)
FLOW CONTROLLERWITH EXTERNAL NEEDLE VALVE
UPSTREAM REFERENCE
(2.5 CL)
DOME
DOME
BPR-4000
(2.5 CL)
BACK PRESSURE REGULATOR
123
3L45
IR-4000
(2.5 CR)
PRESSURE REGULATOR
3R45
123
4 3R
33R4
a123
ANALYZERCELL
METERING VALVE1.5" SUBSTRATE
123
3R45 FLOW
CONTROLLER
23
3L4
15
1
4
2
3
(2.5 C)
2
1
3
12
(2.5 CR)
4
(1.5 CL)
TEMP. SENSOR1.5" SUBSTRATE
123L
345
TEMP
a
NeSSI SYSTEMNo. 3
H20 ANALYZER
ACTUATING AIR
ASPIRATOR
ACTUATING AIR
VENT RECOVERY
ASPIRATOR
SAMPLE IN
RTN.
RETURN HDR.
IN
9
6
BY-PASS
4
TO R-max
FROM R-max
FROM R-max
3TO R-max
1½” UHP System1½” UHP System Designed for delivery of ultra high Designed for delivery of ultra high
purity gasses used in semiconductor purity gasses used in semiconductor applicationsapplications
Recommended for detection Recommended for detection thresholds in the PPB rangethresholds in the PPB range
Utilizes metallic “C” or “W” seals at Utilizes metallic “C” or “W” seals at interfaces; can be adapted for o-ringsinterfaces; can be adapted for o-rings
Field connections are normally welded Field connections are normally welded faceseal type fittings; however, faceseal type fittings; however, compression can be insteadcompression can be instead
Surface Mount Technology for Surface Mount Technology for Sample Systems: Update 2002Sample Systems: Update 2002
1111//88” UHP System” UHP System
Same features as 1½” Same features as 1½” system, only smallersystem, only smaller
Emerging as de-facto Emerging as de-facto standard based on desires standard based on desires of leading semiconductor of leading semiconductor equipment OEM equipment OEM
Cartridge heaters availableCartridge heaters available
Currently in full production Currently in full production
Surface Mount Technology for Surface Mount Technology for Sample Systems: Update 2002Sample Systems: Update 2002
Block Assembly & ManifoldingBlock Assembly & Manifolding
Surface Mount Technology for Surface Mount Technology for Sample Systems: Update 2002Sample Systems: Update 2002
R-Max Stream Select SystemR-Max Stream Select System SP-76 geometrically non-compliantSP-76 geometrically non-compliant
SP-76 intent compliantSP-76 intent compliant
Surface Mount Technology for Surface Mount Technology for Sample Systems: Update 2002Sample Systems: Update 2002
NeSSI & R-Max MarriageNeSSI & R-Max Marriage SP-76 geometrically SP-76 geometrically
compliant 1½” blocks for compliant 1½” blocks for sample conditioningsample conditioning
R-Max for stream switchingR-Max for stream switching
Compression fitting Compression fitting interfaceinterface
Lower cost than same Lower cost than same functionality with all-SP76 functionality with all-SP76 block systemblock system
Surface Mount Technology for Surface Mount Technology for Sample Systems: Update 2002Sample Systems: Update 2002
Surface Mount Technology for Sample Surface Mount Technology for Sample Systems: Update 2002Systems: Update 2002