Intel C620 Series Chipset

Reference Number: 336068-003US

Intel® C620 Series ChipsetThermal Mechanical Specifications and Design Guide

April 2019

Revision 003

2 Intel® C620 Series ChipsetThermal/Mechanical Specifications and Design Guide, April 2020

Intel technologies’ features and benefits depend on system configuration and may require enabled hardware, software or service activation. Learn more at Intel.com, or from the OEM or retailer.No computer system can be absolutely secure. Intel does not assume any liability for lost or stolen data or systems or any damages resulting from such losses.You may not use or facilitate the use of this document in connection with any infringement or other legal analysis concerning Intel products described herein. You agree to grant Intel a non-exclusive, royalty-free license to any patent claim thereafter drafted which includes subject matter disclosed herein.No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document.The products described may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.This document contains information on products, services and/or processes in development. All information provided here is subject to change without notice. Contact your Intel representative to obtain the latest Intel product specifications.Intel disclaims all express and implied warranties, including without limitation, the implied warranties of merchantability, fitness for a particular purpose, and non-infringement, as well as any warranty arising from course of performance, course of dealing, or usage in trade.Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an order number and are referenced in this document may be obtained by calling 1-800-548-4725 or by visiting www.intel.com/design/literature.htm.Intel, Xeon, and the Intel logo are trademarks of Intel Corporation in the U.S. and/or other countries.Copyright © 2020, Intel Corporation. All rights reserved.* Other brands and names may be claimed as the property of others.

http://www.intel.com/design/literature.htm

Intel® C620 Series Chipset 3Thermal/Mechanical Specifications and Design Guide, April 2020

Contents

1 Introduction ..............................................................................................................61.1 Design Flow........................................................................................................61.2 Definition of Terms ..............................................................................................71.3 Reference Documents ..........................................................................................7

2 Packaging Technology ...............................................................................................82.1 Package Mechanical Specifications .........................................................................82.2 Non-critical to Function Solder Joints......................................................................8

3 Thermal Specifications ..............................................................................................93.1 Thermal Design Power .........................................................................................93.2 Case Temperature ...............................................................................................93.3 Die Temperature .................................................................................................9

3.3.1 Thermal Sensor........................................................................................93.3.2 Thermal Thresholds ..................................................................................93.3.3 Tcontrol ................................................................................................103.3.4 Thermal Trip..........................................................................................103.3.5 Thermal Monitoring and Response ............................................................103.3.6 Thermal Registers ..................................................................................11

3.4 Thermal Specifications .......................................................................................113.5 Storage Specifications........................................................................................12

4 Thermal Metrology ..................................................................................................134.1 Case Temperature Measurements........................................................................134.2 Thermal Solution Performance Characterization .....................................................14

5 Design Considerations .............................................................................................165.1 Operating Environment ......................................................................................165.2 Altitude Correction.............................................................................................165.3 Effect of Pressure on TIM Performance .................................................................175.4 Board-Level Components Keepout Dimensions ......................................................17

6 PCB Design Considerations ......................................................................................186.1 Land Pattern Guidance .......................................................................................186.2 Pad Type Recommendations ...............................................................................186.3 Strain Guidance ................................................................................................206.4 Board Deflection................................................................................................216.5 Reliability Guidelines..........................................................................................216.6 Shock Strain Guidance .......................................................................................21

7 Reference Thermal Solution.....................................................................................247.1 Reference Thermal Solution ................................................................................24

7.1.1 Operating Environment ...........................................................................247.1.2 Reference Design Heatsink Performance ....................................................247.1.3 Heatsink Assembly .................................................................................267.1.4 Heatsink Mass........................................................................................287.1.5 Heatsink Retention .................................................................................28

A Component Suppliers...............................................................................................29

B Mechanical Drawings ...............................................................................................31

C Thermal Metrology ..................................................................................................46C.1 Thermocouple Attachment ..................................................................................46C.2 Zero Degree Angle Attach Methodology ................................................................46

4 Intel® C620 Series ChipsetThermal/Mechanical Specifications and Design Guide, April 2020

Figures1-1 Thermal Design Process .......................................................................................... 64-1 Zero Degree Angle Attach Methodology (Top View) ................................................... 134-2 Thermal Solution Decision Flowchart ....................................................................... 144-3 Processor Thermal Characterization Parameter Relationships...................................... 156-1 Pad Definition ...................................................................................................... 196-2 1310 FCBGA15 Land Pattern Guidance .................................................................... 196-3 Intel® C620 Series Chipset BGA Shock Strain Gage Location ..................................... 237-1 59 x 65.5 x 30 mm Heatsink Thermal Performance Versus Approach Velocity ............... 257-2 59 x 65.5 x 10.9 mm Heatsink Thermal Performance Versus Approach Velocity ............ 257-3 Heatsink Assembly ............................................................................................... 27B-1 1310-FCBGA15 Package Mechanical Drawing (Sheet 1 of 2) ....................................... 32B-2 1310-FCBGA15 Package Mechanical Drawing (Sheet 2 of 2) ....................................... 33B-3 PCB Mechanical Keep-out Drawing - 4 Hole Heatsink (Sheet 1 of 2) ............................ 34B-4 PCB Mechanical Keep-out Drawing - 4 Hole Heatsink (Sheet 2 of 2) ............................ 35B-5 PCB Mechanical Keep-out Drawing - 2 Hole Heatsink (Sheet 1 of 2) ............................ 36B-6 PCB Mechanical Keep-out Drawing - 2 Hole Heatsink (Sheet 2 of 2) ............................ 37B-7 H53980 - Reference Heatsink Assembly Drawing - Sheet 1 of 2 .................................. 38B-8 H53980 - Reference Heatsink Assembly Drawing - Sheet 2 of 2 .................................. 39B-9 H54219 - Reference Heatsink Assembly Drawing - Sheet 1 of 2 .................................. 40B-10 H54219 - Reference Heatsink Assembly Drawing - Sheet 2 of 2 .................................. 41B-11 H73752 - Reference Heatsink Assembly Drawing - Sheet 1 of 2 .................................. 42B-12 H73752 - Reference Heatsink Assembly Drawing - Sheet 2 of 2 .................................. 43B-13 H62045 - Reference Heatsink Assembly Drawing - Sheet 1 of 2 .................................. 44B-14 H62045 - Reference Heatsink Assembly Drawing - Sheet 2 of 2 .................................. 45C-1 IHS Groove Dimensions ........................................................................................ 48C-2 Thermocouple Attachment..................................................................................... 49C-3 TC Bead Location ................................................................................................. 49

Tables1-1 Definition of Terms................................................................................................. 71-2 Reference Documents ............................................................................................. 72-1 Package Mechanical Load Specifications .................................................................... 83-1 Thermal Thresholds .............................................................................................. 103-2 Thermal Specification............................................................................................ 113-3 Storage Conditions ............................................................................................... 125-1 Honeywell PCM45 F* TIM Performance as a Function of Attach Pressure ...................... 176-1 Land Pattern Notes............................................................................................... 206-2 Reliability Guidelines............................................................................................. 216-3 Shock Strain Guidance .......................................................................................... 226-4 Intel® C620 Series Chipset BGA Shock Strain Gage Coordinates Location .................... 227-1 Operating Environmental Boundary Conditions ......................................................... 247-2 59 x 65.5 x 10.9 mm Heatsink Performance Curve Alpha, Beta, Gamma Values............ 267-3 Reference Heatsinks Cooling Capabilities ................................................................. 267-4 Reference Heatsinks Mass ..................................................................................... 287-5 Push-Pin P/N ....................................................................................................... 28A-1 Thermal Solution Enabled Supplier Listing................................................................ 29B-1 Mechanical Drawing List ........................................................................................ 31


Revision History

§

Document Number

Revision Number Description Date

336068 001 • Initial Release July 2017

336068 002 • Updated Table 3-2, “Thermal Specification” with C629 Thermal Specifications July 2018

336068 003• Updated Table 3-2, “Thermal Specification”• Updated Table B-1, “Mechanical Drawing List”• Updated Figure B-1

April 2020

Introduction

6 Intel® C620 Series Chipset Thermal/Mechanical Specifications and Design Guide, April 2020

1 Introduction

This document addresses thermal design and specifications for the Intel® C620 Series Chipset Platform Controller Hub (PCH). Information provided in this document is intended only for use with this product. Unless otherwise specified, specification and guidance provided in this document applies only to this product. In this document the term ‘PCH’ refers to Intel® C620 Series Chipset, unless otherwise identified.

The goals of this document are to:• Outline the thermal and mechanical operating limits and specifications

for Intel® C620 Series Chipset.

• Describe reference thermal solutions that meet the specifications of Intel® C620 Series Chipset.

Properly designed thermal solutions provide adequate cooling to maintain the component die temperature within its thermal specifications. This is accomplished by providing a low local-ambient temperature, ensuring adequate local airflow, and minimizing the die to local-ambient thermal resistance. By maintaining the PCH die temperature at or below the specified limits, a system designer can ensure the proper functionality, performance, and reliability of the component. Operation outside the functional limits of the component is not supported and can cause loss of data integrity. Operation outside the damage limit can cause permanent, non-recoverable damage to the component.

The simplest and most cost-effective method to improve the inherent system cooling characteristics is through careful chassis design and placement of fans, vents, and ducts. When additional cooling is required, component thermal solutions may be implemented in conjunction with system thermal solutions. The size of the fan or heatsink can be varied to balance size and space constraints with acoustic noise.

1.1 Design FlowTo develop a reliable, cost-effective thermal solution, several tools have been provided to the system designer. The following figure illustrates the design process implicit to this document and the tools appropriate for each step.

Figure 1-1. Thermal Design Process


Introduction

1.2 Definition of Terms

1.3 Reference DocumentsThe reader of this specification should also be familiar with material and concepts presented in the following documents:

§

Table 1-1. Definition of Terms

Term Definition

BLT Bond Line Thickness - Final settled thickness of the thermal interface material after installation of heatsink.

DTS Digital Thermal Sensor

FC-BGA Flip Chip Ball Grid Array - A package type defined by a plastic substrate where a die is mounted using an underfill C4 (Controlled Collapse Chip Connection) attach style. The primary electrical interface is an array of solder balls attached to the substrate opposite the die. Note that the device arrives at the customer with solder balls attached.

MD Metal Defined pad is one where a pad is individually etched into the PCB with a minimum width trace exiting it.

PCH Platform Controller Hub

PECI Platform Environment Control Interface (PECI) - One-wire interface that provides a communication channel between Intel processor and chipset components to external monitoring devices.

TCASE_MAX Maximum die operating temperature, as measured at the geometric center of the package substrate at top of the IHS.

TCASE_MIN Minimum die operating temperature, as measured at the geometric center of the package substrate at top of the IHS.

TIM Thermal Interface Material - A thermally conductive material used between the components and heatsink to improve thermal conduction.

TDP Thermal Design Power - Thermal solutions should be designed to dissipate this target power level. TDP is not the maximum power that the chipset can dissipate.

TSENSOR Die temperature as reported by the device DTS.

Table 1-2. Reference Documents

Title Document Number Notes

Intel® Xeon® Processor Scalable Family Datasheet: Volume 1 - Electrical 336062

Intel® Xeon® Processor Scalable Family Datasheet: Volume 2 - Registers 336063


Packaging Technology

2 Packaging Technology

Intel® C620 Series Chipset is a surface mounted FCBGA15 package with a total of 1310 lead-free solder balls. PCH package substrate is 34 mm x 28 mm with an Integrated Heat Spreader (IHS) of 30.4 x 24.4 mm. See Appendix B for the package detailed drawing.

Solder Ball Grid Regions:

• Die Area: Uniform solder ball pitch

• Die Parameter: Staggered solder ball pitch

• Package Edges: Condensed staggered solder ball pitch

• Package Corners: Staggered solder ball pitch.

Additional package attributes can be found in the package mechanical drawing.

2.1 Package Mechanical SpecificationsThe PCH package mechanical load limits must not be exceeded during heatsink installation, mechanical stress testing, standard shipping conditions, and/or any other use condition.

Notes:1. The heatsink attach solutions must not include continuous stress onto the package with the exception of a

uniform load to maintain the heatsink-to-package thermal interface.2. These specifications apply to uniform compressive loading in a direction perpendicular to the IHS

top surface.3. These specifications are based on limited testing for design characterization. Loading limits are for the

package only.

2.2 Non-critical to Function Solder JointsSeveral selected solder joints of the PCH are defined as non-critical to function (NCTF) when evaluating package solder joints post environmental testing. The PCH signals at NCTF locations are typically redundant ground or non-critical reserved pins, so the loss of the solder joint continuity at end of life conditions will not affect the overall product functionality. See Section 6.1, “Land Pattern Guidance” for additional information on PCB land pattern recommendation.

§

Table 2-1. Package Mechanical Load Specifications

Parameter Value Notes

Maximum Allowable Static Normal Load 062 mil PCB thickness: 111 N [25 lbf]>093 mil PCB thickness: 156 N [35 lbf]

1, 2, 3

Maximum Transient Compressive Package Load See Board Flexure Initiative (BFI) Strain 2, 3

Maximum Dynamic Compressive Package Load See Q Strain Metric Guidance for Shock


Thermal Specifications

3 Thermal Specifications

This section lists the thermal specifications of the platform controller hub. Systems should be designed to meet the PCH maximum continuous power dissipation as defined in this section.

3.1 Thermal Design PowerAnalysis indicates that real applications are unlikely to cause the component to consume maximum power dissipation for sustained time periods. Therefore, in order to arrive at a more realistic power level for thermal design purposes, Intel® characterizes power consumption based on known platform benchmark applications. The resulting power consumption is referred to as the Thermal Design Power (TDP). Hence, TDP is the design target for the thermal solution. TDP is not the maximum power that the PCH can dissipate.

FC-BGA packages have poor heat transfer capability into the board and have minimal thermal capability without a thermal solution. Intel recommends that system designers plan for a heatsink when using Intel® C620 Series Chipset.

3.2 Case TemperatureTCASE_MAX is provided for the purpose of designing the PCH thermal solution. Refer to “Thermal Metrology,” section for guidelines on accurately measuring package case temperature. Maintaining the PCH case temperature at or below the TCASE_MAX ensures the component is operating within its functional limits.

3.3 Die Temperature To ensure proper operation and reliability of the platform controller hub, die temperature must be kept within its thermal specifications. System and/or component level thermal solutions are required to maintain these temperature specifications.

3.3.1 Thermal SensorThe PCH uses a thermal sensing device on the die to monitor its temperature status in real-time. The thermal sensor output, TSENSOR is in degrees Celsius, and is available over PECI through the Intel® Management Engine (Intel® ME). This enables system thermal management to monitor and to implement policies such as fan speed control to maintain the die temperature within its operation and reliability temperatures. Die temperature is also compared with the PCH thermal trip set point. Platform compatible processors will monitor the PCH temperature via integrated iMC on the processor (host). The PCH is at its maximum operating temperature when TEMP_MID setpoint is reached. The PCH thermal thresholds on the processor enable the processor to implement policies in response to the changes in the die temperature.

3.3.2 Thermal ThresholdsThe PCH thermal set points are programmed in the host controller. If enabled, the host upon reaching these thermal conditions will initiate throttling resulting in reduction of traffic through the PCH and hence reduction in its power.



TEMP_MID: Is a TSENSOR based setpoint. Die temperature shall not exceed this setpoint while under any load to ensure functionality when using the sensor-based limiting specification. TEMP_MID is programmed in the processor at boot time. Additional margin, meaning lower than specified TEMP_MID value, can be programed if so desired in reducing occurrence of throttling caused by exceeding PCH thermal specifications.

TEMP_HI: Is a TSENSOR based setpoint. Die temperature shall not exceed this setpoint while under any load to prevent damage to the component. TEMP_HI is programmed in the processor at boot time. Additional margin, meaning lower than specified TEMP_HI but greater than TEMP_MID value, can be programed to prevent damage to the component which may result from operating at higher temperature.

Note: PCHHOT# is configured and asserted with either (TEMP_MID or TEMP_HI) threshold crossing.

3.3.3 TCONTROL

TCONTROL is the temperature limit which must be maintained to ensure the component operates reliably over its expected life. TCONTROL is a thermal monitoring set point which is specified based on the thermal sensor output in degrees Celsius. Its value must be compared against the thermal sensor reading. The value of the TCONTROL threshold is specified in the PCH thermal specification table. TCONTROL value applies to the full range of the PCH operating power. Note that no internal response is generated by the PCH at TCONTROL. Long term operation above the TCONTROL temperature set point reduces the life of the product.

A server thermal management controller can monitor the PCH temperature, and use the TCONTROL value as the threshold at which active system thermal management can be engaged. This will ensure reliable PCH operation over its expected life. In cases where maximum fan speed is reached and TSENSOR cannot be maintained at or below the TCONTROL value, the TSENSOR must still be maintained to be less than or equal to TEMP_MID if the thermal sensor specification is applied.

3.3.4 Thermal TripOnce the thermal sensing device observes that the temperature of the die, TSENSOR, has reached it catastrophic limit, the PCH will initiate shutdown. See ‘Catastrophic Overtemp’ error condition described in the Intel® C620 Series Chipset Datasheet.

3.3.5 Thermal Monitoring and ResponseWhen:

• TSENSOR<TCONTROL, the system can run under any desired conditions.• TSENSOR=TCONTROL, TCONTROL limit attained, system must increase fan speed until

TCONTROL limit can no longer be maintained.• TSENSOR>TCONTROL, fan speed increase is required to maintain TCASE below

TCASE_MAX or the TSENSOR to remain below TEMP_MID.• TSENSOR=TEMP_MID, PCH will issue PCHHOT#.

Table 3-1. Thermal Thresholds

Thresholds Description Action

TEMP_MID TSENSOR approaching functional limit See Intel® C620 Series Chipset Datasheet

TEMP_HI TSENSOR approaching damage limit See Intel® C620 Series Chipset Datasheet

Therm

al Sp

ecifications

Intel ® C

620 Series C

hipset11

Thermal/M

echanical Specifications and D

esign Guide, A

pril 2020

• TSENSOR=TEMP_HI, PCH will transition the system to S5 state unconditionally.

3.3.6 Thermal RegistersIntel® C620 Series Chipset thermal registers have another name in the Datasheet. In order to make sure the same references are used when comparing the Datasheet to the TMDG, below is corresponding thermal registers for Intel® C620 Series Chipset thermal set points. Please refer to Intel® C620 Series Chipset Datasheet for details on the thermal registers.

— Catastrophic trip point = TEMP_HI— Thermal Alert High = TEMP_MID— Thermal Alert Low = Tcontrol

3.4 Thermal Specifications

Notes:1. TDP value for each SKU is based on SKU features2. Refer to the PCH Datasheet document for thermal management mechanism3. Temperature value is based on thermal sensor output.4. These specifications are based on preliminary measurement and subject to change.5. Use TCASE for heatsink sizing6. Use temperature sensor output in maintain die temperature within its specifications7. Where temperature sensor is not used to monitor die temperature, maintaining PCH TCASE at TCONTROL (TCASE based) ensures compliance with product rel requirements.8. x16 PCIe3 uplink, 100 kops PKE/100Gbps crypto/100Gbps compression, 120 Gbps max concurrent 9. x24 PCIe3 uplink, 100kops PKE/>100 Gbps crypto/100Gbps compression, >120Gbps max concurrent

Table 3-2. Thermal Specification

Parameter C621 C622 C624 C625 C626

C627 / C629 C628

Notes120 Gbps Application8

High Performance Application9

120 Gbps Application8

High Performance Application9

TDP (W) 15 17 19 21 23 26.6 28.6 24.3 26.3 1, 3, 4

TEMP_HI (°C) 107 106 105 106 106 106 106 106 106 2, 3, 4, 6

TEMP_MID (°C) 87 86 85 86 86 92 91 92 91 2, 3, 4, 6

TCONTROL (°C) [Sensor Based]

7 yrs 77 76 75 76 76 82 81 82 82 4, 6

10 yrs 67 66 65 66 66 72 71 72 71 4, 6

TCASE_MAX@TDP (°C) 86 86 85 86 86 88 87 89 87 4, 5

TCASE_MIN (°C) 5 5 5 5 5 5 5 5 5

10 yrs 66 66 65 66 66 68 67 69 67 4, 5, 7



Dual thermal specifications based on TCASE and Digital Thermal Sensor enables the thermal solution designer to optimize the component thermal solution and the system thermal management in a way that is best suited for the integration of the PCH thermal management. Systems not utilizing thermal threshold must ensure compliance with TCASE specifications. Equation below provides a conversion between TSENSOR and TCASE at the PCH maximum operating temperature.

TSENSOR = (TCASE ± 7) at TCASE ranges of 65°C to Tcase_max @ TDP

3.5 Storage SpecificationsThe following table includes a list of the specifications for device storage in terms of maximum and minimum temperatures and relative humidity.These conditions should not be exceeded in storage or transportation.

Notes:1. Refers to a component device that is not assembled in a board or socket that is not to be electrically

connected to a voltage reference or I/O signals.2. Specified temperatures are based on data collected. Exceptions for surface mount reflow are specified in by

applicable JEDEC standard and MAS document. Non-adherence may affect component reliability.3. Tabsolute storage applies to the unassembled component only and does not apply to the shipping media,

moisture barrier bags or desiccant.4. Intel® branded board products are certified to meet the following temperature and humidity limits that are

given as an example only (Non-Operating Temperature Limit: -40 °C to 70 °C & Humidity: 50% to 90%, non-condensing with a maximum wet bulb of 28 °C). Post board attach storage temperature limits are not specified for non-Intel® branded boards.

5. The JEDEC, J-JSTD-020 moisture level rating and associated handling practices apply to all moisture sensitive devices removed from the moisture barrier bag.

6. Nominal temperature and humidity conditions and durations are given and tested within the constraints imposed by Tsustained and customer shelf life in applicable Intel® box and bags.

§

Table 3-3. Storage Conditions

Parameter Description Min Max Notes

Tabsolute storage

The non-operating device storage temperature. Damage (latent or otherwise) may occur when subjected to for any length of time.

-25 °C 125 °C 1, 2, 3

Tsustained storage The ambient storage temperature limit (in shipping media) for a sustained period of time. -5 °C 40 °C 4, 5

RHsustained storage The maximum device storage relative humidity for a sustained period of time. 60% @24 °C 5, 6

TIMEsustained storage A prolonged or extended period of time; typically associated with customer shelf life. 0 Months 6 Months 6


Thermal Metrology

4 Thermal Metrology

The system designer must make temperature measurements to accurately determine the thermal performance of the system. Intel has established guidelines for proper techniques to measure the component die temperatures. This section of the document provides guidelines on how to accurately measure the component die temperatures.

4.1 Case Temperature MeasurementsTo ensure functionality and reliability, the chipset component TCASE must be maintained at or between the maximum/minimum operating range of the temperature specification. The surface temperature at the geometric center of the die corresponds to TCASE. Measuring TCASE requires special care to ensure an accurate temperature measurement.

Temperature differences between the temperature of a surface and the surrounding local ambient air can introduce errors in the measurements. The measurement errors could be due to a poor thermal contact between the thermocouple junction and the surface of the package, heat loss by radiation and/or convection, conduction through thermocouple leads, and/or contact between the thermocouple cement and the heatsink base (if a heatsink is used). For maximum measurement accuracy, only the 0° thermocouple attach approach is recommended.

Figure 4-1. Zero Degree Angle Attach Methodology (Top View)

IHS

Substrate

Thermocouple Wire

IHS Groove

Thermal Metrology


4.2 Thermal Solution Performance CharacterizationThe case-to-local ambient Thermal Characterization Parameter (CA) is defined by:

Equation 4-1.CA = (TCASE - TLA) / TDP

Where:TCASE = PCH case temperature (°C). TLA = Local ambient temperature in chassis at PCH (°C).TDP = TDP (W) assumes all power dissipates through the integrated heat

spreader. This inexact assumption is convenient for heatsink design.

Equation 4-2.CA = CS + SA

Where:CS = Thermal characterization parameter of the TIM (°C/W) is dependent

on the thermal conductivity and thickness of the TIM.SA = Thermal characterization parameter from heatsink-to-local ambient

(°C/W) is dependent on the thermal conductivity and geometry of the heatsink and dependent on the air velocity through the heatsink fins.

Figure 4-3 illustrates the thermal characterization parameters.

Figure 4-2. Thermal Solution Decision Flowchart


Thermal Metrology

§

Figure 4-3. Processor Thermal Characterization Parameter Relationships

CH


Design Considerations

5 Design Considerations

When designing a thermally capable system, all critical components must be simultaneously considered. The responsible engineer must determine how each component will affect another, while ensuring target performance for all components. The system design team must set these target performance goals during the design phase so that they can be achieved with the selected component layout.

The location of components and their interaction must be considered during the layout phase. A poorly cooled device will have worse performance. The thermal engineer’s responsibility is to ensure that each and every component meets its performance goals bounded by thermal and acoustic specifications but also to determine optimum system configuration.

To develop a reliable and cost-effective thermal solution, thermal characterization and simulation should be carried out at the entire system level, accounting for the thermal requirements of each component. In addition, acoustic noise constraints may limit the size, number, placement, and types of air-movers that can be used in a particular design.

5.1 Operating EnvironmentThe reference thermal solution design assumes both a max fan speed condition and an acoustic fan speed condition. The thermal designer must carefully select the location to measure airflow to obtain an accurate estimate.

5.2 Altitude CorrectionSimulated performance of a thermal solution will change by varying approach air velocity. For data that is modeled at sea level a correction factor would be required to estimate thermal performance at a different altitudes. Equation 5-1 can be used to determine the heatsink performance based on the adjusted altitude.

Equation 5-1.Altitude Correction

, and can be obtained from the heatsink thermal performance curve versus the approach air velocity.

Q - “velocity through heatsink fin area (m/s)”. Velocity is the value on X axis of the heatsink thermal performance curve versus the approach air velocity.

alt - Air density at given altitude

0 - Air density at sea level

ca Qalt–+alto------ –

=


Design Considerations

5.3 Effect of Pressure on TIM PerformanceAs mechanical pressure increases on the TIM, the thermal resistance of the TIM decreases. This phenomenon is due to the decrease of the bond line thickness (BLT). BLT is the final settled thickness of the thermal interface material after installation of the heatsink. The effect of pressure on the thermal resistance of the Honeywell PCM45 F* TIM is shown in Table 5-1. Intel provides both End of Line and End of Life TIM thermal resistance values for Honeywell PCM45 F*.

End of Line and End of Life TIM thermal resistance values are obtained through measurement on a Test Vehicle similar to the component’s physical attributes using an extruded aluminum heatsink. The End of Line value represents the TIM performance post heatsink assembly while the End of Life value is the predicted TIM performance when the product and TIM reaches its end of life. The heatsink retention provides enough pressure for the TIM to achieve an End of Line thermal resistance.

5.4 Board-Level Components Keepout DimensionsThe location of hole patterns and keepout zones for the reference thermal solution are shown in Figure B-3. Note that additional keep-out may be necessary to address board assembly and rework process tool requirements.

§

Table 5-1. Honeywell PCM45 F* TIM Performance as a Function of Attach Pressure

Pressure on Thermal solution and package interface (PSI)

Thermal Resistance (°C × cm2)/W

End of Life

4.35 0.187


PCB Design Considerations

6 PCB Design Considerations

6.1 Land Pattern GuidanceRecommendation for Printed Circuit Board (PCB) Land Patterns is to ensure solder joint reliability during dynamic stresses, often encountered during shipping and handling and hence to increase package reliability. For specific product land pattern specification refer to Intel product thermal/mechanical specifications and design guide or the related Intel product Manufacturing Advantage Services collateral.

6.2 Pad Type RecommendationsIntel defines two types of pad types based on how they are constructed. A metal defined (MD) pad is one where a pad is individually etched into the PCB with a minimum width trace exiting it. The solder mask defined (SMD) pad is typically a pad in a flood plane where the solder mask opening defines the pad size for soldering to the component.

In thermal cycling a MD pad has shown to be more robust than a SMD pad type. The solder mask that defines the SMD pad can create a sharp edge on the solder joint as the solder ball / paste conforms to the window created by the solder mask.

For certain failure modes the MD pad may not be as robust in shock and vibration (S&V). During S&V, the predominant failure mode for a MD pad in the corner of the BGA layout is pad craters and solder joint cracks. A corner MD pad can be made more robust and behave like a SMD pad by having a wide trace enter the pad. This trace should be 10 mil minimum but not to exceed the pad diameter and exit the pad at a 45 degree angle (parallel to the diagonal of the package). During board flexure that results from shock & vibration a SMD pad is less susceptible to a crack initiating due to the larger surface area.

MD: Metal Defined (traditional trace Via to BGA-Pad

— I/O Driven, typical 5 mil trace because of impedance matching.— No Connect is a metal pad with no trace connected.

WTMD: Wide Trace Metal Defined (trace is equal to or less than the pad diameter)

— xWTMD >> 1WTMD = 1 Wide Trace, 2WTMD = 2 wide Traces— Multiple “Wide Traces”, can look or behave as a Spoke design

SMD: Solder Mask Defined (100%, flood copper and/or larger metal pad)

Note: MD pad type is preferred for T/C performance. SMD preferred for shock performance.



Figure 6-1. Pad Definition

Figure 6-2. 1310 FCBGA15 Land Pattern Guidance

Copper Pad

Acceptable orientation of1.59x3.07mmKOZ for non-testable balls atClass test



6.3 Strain GuidanceIntel provides manufacturing strain guidance commonly referred to as Board Flexure Initiative or BFI Strain Guidance. The BFI strain guidance apply only to transient bend conditions seen in board manufacturing assembly environment. It should be noted that any strain metrology is sensitive to boundary conditions.

Intel recommends the use of BFI to prevent solder joint defects. For additional guidance on BFI, see Manufacturing With Intel® Components - Strain Measurement for Circuit Board Assembly, also referred to as BFI MAS (Manufacturing Advantage Services) and BFI STRAIN GUIDANCE SHEET (1310-FCBGA). Consult your Intel Customer Quality Engineer for additional guidance in setting up a BFI program in your facility.

Table 6-1. Land Pattern Notes

Symbol Count Pad Type Diameter Comments

Qty 6 SMD 558.8 μm (22 mil) pad, 406.4 μm (16 mil) SRO 254 μm (10mil) traces 45° outward from die center nCTF

Qty 20 MD 406.4 μm (16 mil) pad, 508 μm (20 mil) SROWhere possible 254 μm (10mil) traces 45° outward from die center nCTF

Qty 8 MD 355.6 μm (14 mil) pad, 457.2 μm (18 mil) SRO

nCTF

Qty 16 MD 355.6 μm (14 mil) pad, 457.2 μm (18 mil) SROCTF

Qty 88 MD / SMD MD/SMD 254 x 342.9 μm (10 x 13 mil) Oblong Pads Long axis perpendicular to closest pkg edge355.6 x 431.8 μm (14 x 17 mil) SRO

CTF

Qty 400 MD / SMD MD/SMD304.8 μm (12 mil) pad, 406.4 μm (16 mil) SROCTF

Qty 772 MD / SMD MD/SMD381 μm (15 mil) pad, 482.6 μm (19 mil) SRO CTF

N/A All pins inside the dotted box are non-testable during package e- test. Any

MD / Spoke

Pads Only

The area shaded in gray (under Die Shadow Area should be MD or Spoke Pad). Cannot be SMD due to TC risk (entire die interior and 1 row outside die edge). Use 1WTMD or spoked pads in this area.For Die shadow: Because this LP covers Intel® Atom Processor C3000 Product Family, Intel C624 PCH and C626, refer to the package specification to define the “Die Shadow” region.

Only MD / Spoke Pads



6.4 Board DeflectionExceeding the maximum Board Deflection may result in solder joint failure. Board deflection under the package can be kept to an acceptable level by adhering to the maximum load values.

Method by which the PCB is supported with the chassis will have an impact on board deflection and resultant package solder ball stress. Customers need to assess shock for their designs as their heatsink retention, heatsink mass, and the PCB attachment mechanism may vary.

Designs that exceed the maximum Heatsink Static Compressive Load, should follow Board Deflection Measurement Methodology as outlined to assess risk to package solder joint reliability.

6.5 Reliability GuidelinesEach motherboard, heatsink and attach combination may vary the mechanical loading of the component. Based on the end user environment, the user should define the appropriate reliability test criteria and carefully evaluate the completed assembly prior to use in high volume. The reference solution is to be mounted to a fully configured system. Some general recommendations are shown in Table 6-2.

6.6 Shock Strain GuidanceA useful metric to compare the impact of design modifications to SJR and assess SJR risk during shock events is strain measurement. This strain measurement, also referred to as shock strain, utilizes strain gages to measure the surface strain of a motherboard. Please note that Intel also publishes strain guidance specifically for manufacturing. This manufacturing guidance is part of the Board Flexure Initiative (BFI) and those strain limits are commonly referred to as BFI strain. More information is available in the BFI Manufacturing Advantage Service (MAS). DO NOT use BFI strain values for shock strain testing and DO NOT use shock strain guidance for BFI. These two strain metrics are significantly different and are not interchangeable. Using the BFI strain values for a design metric will likely result in a poor system design.

Given parameters unique to the board of interest, such as board thickness, the board surface strain directly correlates to the amount of board curvature. The amount of motherboard curvature in the critical locations directly beneath the solder balls is indicative of the reliability of the component solder joints. This measurement is typically made at the corners of the BGA components. The shock strain results are sensitive to the application of the strain gages. Guidance for strain gage application is available in the Shock Strain Monitoring Customer Reference Document (CRD). Your Intel Corporate Quality Engineer is also available for help with strain gage attach

Table 6-2. Reliability Guidelines

Test[1] Objective Inspection Guidelines[2]

Mechanical Shock 50g, board level, 10 msec, 3 shocks/axis Visual Check and Electrical Functional Test

Random Vibration 3.13g, board level, 10 min/axis, 20 Hz to 500 Hz

Visual Check and Electrical Functional Test

Temperature Life 85°C, 2000 hours total, check points at 168, 500, 1000 and 2000 hours

Visual Check

Thermal Cycling -5°C to +70°C, 500 cycles Visual Check

Humidity 85% relative humidity, 55°C, 1000 hours Visual Check



training. This Shock Strain Monitoring CRD outlines the proper selection, application, and usage of the strain gages and strain instrumentation to attain repeatable and valid results. The Shock Strain Monitoring CRD also discusses proper reduction of the data in order to use the data to compare to the Intel strain guidance.

The strain guidance was developed from simulations and empirical testing using the Intel reference thermal solution for the PCH and Intel recommended pad types and sizes. Three strain ranges are determined to quantify associated SJR risk for the Critical to Function solder joints. The Non-Critical to Function solder balls may have some cracking and fractures when the strain measurements are within this guidance.

The following table lists the three ranges for the PCH.

Notes:1. The Minimum Principal Strain (E-min) Metric values in all corners should be less than the E-min guidance.2. In a design exceeding the guidance, a change to the design is strongly recommended to reduce the

bending of the motherboard under shock.3. This E-min metric guidance value is only applicable to this package.4. Strain value is provided for guidance only. Testing is recommended on actual design to confirm SJR

performance.

The associated risk levels correspond to the likelihood of solder joint failure. A Low level of risk is unlikely to result in critical to function solder joint failures. When strain measurements are made from a small sample of boards or systems and fall within the Medium risk range, there is insufficient information to assess the risk. It is suggested that additional systems or boards are tested and failure analysis, such as dye and peel, is conducted to assess the risk. A High risk is likely to result in a significant quantity of solder joint failures of critical solder balls. A change to the design is strongly recommended to reduce the bending of the motherboard under shock. Incorporating the Intel Reference Design Heatsink into the design or adopting the design practices outlined in the Desktop, Workstation, and Server System Mechanical Design Guidance for Dynamic Events will improve the strain response and therefore reduce SJR risk.

The BGA Shock strain gage location is a critical parameter for strain accuracy. The strain gage rosette center will be published in x,y coordinates with the (0,0) located at the package center. Please take note that the PCB coordinate system may have a different center (0,0) location; so the strain gage coordinates may need to be offset or adjusted for local package coordinate center. Please refer to Table 6-4 and Table 6-3 for specifics on the coordinates and strain gage rosette centers.

Table 6-3. Shock Strain Guidance

For 0.062” boards Shock Strain

(micro strain, μe)


(micro strain, μe)


(micro strain, μe)Associated Risk Comments

1500 1200 1100 1,2 3,4

Table 6-4. Intel® C620 Series Chipset BGA Shock Strain Gage Coordinates Location

Corner Strain Gage Coordinates (x, y)

C3 15.497 mm, -12.497 mm

BW3 15.497 mm, 12.497 mm

BW70 -15.497 mm, 12.497 mm

C70 -15.497 mm, -12.497 mm



§

Figure 6-3. Intel® C620 Series Chipset BGA Shock Strain Gage Location


Reference Thermal Solution

7 Reference Thermal Solution

7.1 Reference Thermal SolutionIntel has developed a reference thermal solutions to meet the cooling needs of the component under operating environments and specifications defined in this document. This chapter describes the overall requirements for the push-pinned heatsink reference thermal solution, including critical-to-function dimensions, operating environment, and validation criteria.

7.1.1 Operating EnvironmentThe reference thermal solution was designed assuming both a max fan speed condition and an acoustic fan speed condition. Table 7-1 provides operating environmental conditions applied in defining and designing the reference cooling solution.

Notes:1. TSA refers to the environment external to the system.2. TLA refers to the inlet temperature at the component heatsink.3. Power dissipated by the device under acoustic conditions is considered to be at mid point between idle

power and TDP.

7.1.2 Reference Design Heatsink PerformanceThe simulated thermal performance of reference heatsink performance characterization is provided in Figure 7-1. Since this data was measured at sea level, a correction factor would be required to estimate thermal performance at other altitudes.

Table 7-1. Operating Environmental Boundary Conditions

Conditions

Parameter High Fan Speed Acoustic Fan Speed Notes

TSA 35 °C 25 °C 1

Altitude 900 m

TLA 60 °C 60 °C 2

Air Flow 2 m/s > 0.65 m/s

Power TDP 3



Notes:1. Where Alpha= 0.8757, Beta = 0.6207, Gamma= 0.8689 based on SKU T.2. Thermal Interface Material (TIM): Honeywell PCM45F*3. IM effective end of life (EOLife) performance model derived from test results:Psi-cs=0.187C/W, Effective K=1.2 W/MK, 0.127 mm thickness, for pressure at 4.35 Psi TIM preload on IHS.

Notes:1. See the following table for Alpha, Beta and Gamma values.2. Thermal Interface Material (TIM): Honeywell PCM45F*3. IM effective end of life (EOLife) performance model derived from test results:Psi-cs=0.187C/W, Effective K=1.2 W/MK, 0.127 mm thickness, for pressure at 4.35 Psi TIM preload on IHS.

Figure 7-1. 59 x 65.5 x 30 mm Heatsink Thermal Performance Versus Approach Velocity

Figure 7-2. 59 x 65.5 x 10.9 mm Heatsink Thermal Performance Versus Approach Velocity



Notes:1. Heatsink performance determined based on C627 SKU.2. Heatsink performance determined based on C628SKU.3. Performance analysis are only based on CFD modeling. 4. Thermal environmental conditions are based on a 4U reference system5. Thermal environmental conditions are based on a 2U reference system

7.1.3 Heatsink AssemblyThe reference thermal solution for the components is a passive extruded heatsink with thermal interface. It is secured to the PCB using 4 push-pin fasteners. Following illustration shows the reference thermal solution assembly and associated components.

Full mechanical drawings of the thermal solution assembly and the heatsink clip are provided in the appendix.

Table 7-2. 59 x 65.5 x 10.9 mm Heatsink Performance Curve Alpha, Beta, Gamma Values

H62045-001

59 X 65.5 X 10.9

SKU 1G 2 4 E M L T

Alpha 0.3581 0.3564 0.3560 0.3394 0.3339 0.3156 0.3198

Beta 1.5515 1.5376 1.5246 1.5154 1.5005 1.5192 1.4938

Gamma 0.7866 0.7867 0.7875 0.7879 0.7876 0.7878 0.7875

Table 7-3. Reference Heatsinks Cooling Capabilities

Heatsink Description Heatsink P/N System Altitude

(m)Velocity(m/s)

Trise(°C) TLA

Max Cooling Capability

(W)Notes

59 x 65.5 x 30 mmExtruded Al

H53980-001H54219-001H73752-001

Max airflow 900 2 18 53 37.9 1, 3, 5

HTA 900 2 18 63 29.6 1, 3, 5

Fan Failure 900 1 13 48 33.9 1, 3, 5

Max airflow 900 1.8 23 58 32.8 1, 3, 4

Fan Failure 900 1.6 25 60 30.1 1, 3, 4

59 x 65.5 x 10.9 mmExtruded Al

H62045-001

Max airflow 900 2 18 53 23.9 2, 3, 5

HTA 900 2 18 63 18.6 2, 3, 5

Fan Failure 900 1 13 48 19.8 2, 3, 5



7.1.3.1 Heatsink Orientation

Since this solution is based on a unidirectional heatsink, it implies that the airflow direction must be aligned with the direction of the heatsink fins.

7.1.3.2 Extruded Heatsink Profiles

The reference thermal solution uses an extruded heatsink for cooling the components. Other heatsinks with similar dimensions and increased thermal performance may be available. See full mechanical drawings for additional details.

7.1.3.3 Thermal Interface Material

A thermal interface material (TIM) improves conductivity between the package IHS and heatsink. The reference thermal solution uses Honeywell PCM45F, 0.25 mm (0.010 in.) thick, 35 mm x 35 mm (1.38 in. x 1.38 in.) square.

Note: Unflowed or “dry” Honeywell PCM45F has a material thickness of 0.010 in. The flowed or “wet” Honeywell PCM45F has a material thickness of ~0.003 in. after it reaches its phase change temperature.

To achieve TIM performance target, heatsink shall apply 22.3 N [5.0 lbf]. This defines the minimum heatsink load requirement insuring minimum TIM bond line thickness (BLT) is achievable.

Figure 7-3. Heatsink Assembly



7.1.4 Heatsink Mass

7.1.5 Heatsink RetentionThe reference solution uses a 4 push-pins. Push-pins are selected to support boards thickness ranges 1.57 mm to 3.3 mm [0.062” and 0.130”].

Notes:

1. Push-pins are designed for specific board thickness. See supplier specifications for details.

2. Heatsink preload ranges are based on 3 sigma worst case analysis.

§

Table 7-4. Reference Heatsinks Mass

Heatsink Description Heatsink P/N Mass(g)

59 x 65.5 x 30 mmExtruded Al

H53980-001 120±10

H53980-001H54219-001H73752-001

120±12

59 x 65.5 x 10.9 mmExtruded Al

H62045-001 46±4.6

Table 7-5. Push-Pin P/N

Part Number MB Thickness Heatsink Preload Range Pullout Force

83FT02-03-9909 62-78 mil 62 mil: 7.0 to 12.72 lbf78 mil: 7.75 to 13.6 lbf

30 lbf each push-pin

83FT05-03-9909 93 mil 6.9 to 12.7 lbf 30 lbf each push-pin

83FT11-03-9909 130 mil 6.6 to 12.9 lbf 30 lbf each push-pin


Component Suppliers

A Component Suppliers

Third-party suppliers are enabled so that reference thermal and mechanical components are available. Suppliers identified in Table A-1 have notified Intel of their intent to support the Intel® C620 Series Chipset PCH by supplying thermal and mechanical solutions based on Intel reference design.

Notes:1. Supplier information provided in the table was deemed accurate at the time of this

document release. Customers planning on using Intel reference designs should contact the component suppliers for the latest information.

2. These vendors are listed by Intel as a convenience for its customers. Intel does not make any representations or warranties whatsoever regarding the quality, reliability, functionality, or compatibility of these devices.

Table A-1. Thermal Solution Enabled Supplier Listing

PartIntel Part Number Supplier (Part

Number) Contact Information

59 x 65.5 x 30 mmHeatsink Assembly includes:• Heatsink• Thermal InterfaceMaterial• Push-pin Assembly

62 to 78 mil boards H53980-001 0A15064101

Chaun-Choung Technology Corp (CCI)*Monica Chih (Taiwan)866-2-29952666, [email protected]

93 mil board H54219-001 0A15117101

130 mil board H73752-001 0A15118101

59 x 65.5 x 10.9 mm Heatsink Assembly includes:• Heatsink• Thermal InterfaceMaterial• Push-pin Assembly

62 to 78 mil boards H62045-001 0A14015101

Thermal Interface0.25 x 35 x 35 mm

PCM45F_35x35 Honeywell PCM45F*

Andrew Ho (Worldwide, HK)(852)[email protected] Shen (PRC)[email protected]

Component Suppliers


Notes:1. Contact the supplier directly to verify time of component availability.2. Heatsink fastener is independent of heatsink assembly. Proper push-pin fastener selection protects the chipset heatsink from

shock and vibration.

§

Heatsink Attach Fastener

62 to 78 mil boards 83FT02-03-9909 ITW Electronics

Business Asia Co. LtdA4, 3-2, K.E.PZ.Kaohsiung, TaiwanTel. 886-7-811-9206~10 (5 lines)Fax: 886-7-811-1795Taipei Office:3F-7, No.193, Ching-Hsing RD.,Wen-Shan District,Taipei, TaiwanTel. 886-2-2930-8340~1 (2lines) Fax: 886-2-2930-8342

93 mil board 83FT05-03-9909

130 mil board 83FT11-03-9909

62 to 78 mil boards 83FT02-37-9909

Table A-1. Thermal Solution Enabled Supplier Listing

PartIntel Part Number Supplier (Part

Number) Contact Information


Mechanical Drawings

B Mechanical Drawings

Table B-1 lists the mechanical drawings included in this appendix.

Table B-1. Mechanical Drawing List

Drawing Description Figure Number

1310-FCBGA15 Package Mechanical Drawing (Sheet 1 of 2) Figure B-1

1310-FCBGA15 Package Mechanical Drawing (Sheet 2 of 2) Figure B-2

PCB Mechanical Keep-out Drawing - 4 Hole Heatsink (Sheet 1 of 2) Figure B-3




H53980 - Reference Heatsink Assembly Drawing - Sheet 1 of 2 Figure B-7








Mechanical Drawings


Figure B-1. 1310-FCBGA15 Package Mechanical Drawing (Sheet 1 of 2)


Mechanical Drawings

Figure B-2. 1310-FCBGA15 Package Mechanical Drawing (Sheet 2 of 2)

Mechanical Drawings


Figure B-3. PCB Mechanical Keep-out Drawing - 4 Hole Heatsink (Sheet 1 of 2)

43

43

21

21

2200

MIS

SIO

NP.

O. B

OX

581

SAN

TA C

LAR

R

4X3.

18[.1

25]

NO

N-P

LATE

D T

HR

OU

GH

HO

L

4X3.

94[.1

55]

RO

UTE

KEE

POU

T TH

RO

UG

H

4X4.

95[.1

95]

NO

CO

MPO

NEN

TS, T

RAC

ES O

AT T

HE

TOP

LAYE

R

33.751.329 []

0.000 []

30.5 1.20

1[

]

0 .000

[]

2X281.102 []

14.13.556 []

14.13.556 []

2X281.102 []

30.5 1.20

1[

]

2X19 .7

48[

]

2X19 .7

48[

]

DO N

OT

SCAL

E DR

AWIN

GSC

ALE:

1:1

KOZ_

H53

980_

BGA

CD

RAW

ING

NU

MBE

RSI

ZE

TALL

HS

KOZ

TIT

LE

DE

PA

RT

ME

NT

SEE

NO

TES

SEE

NO

TES

FIN

ISH

MAT

ERIA

L

-DA

TE

AP

PR

OV

ED

BY

--DA

TE

CH

EC

KE

D B

Y

06/1

0/14

DA

TE

DR

AW

N B

Y

06/1

0/14

DA

TE

DE

SIG

NE

D B

Y

THIR

D A

NG

LE P

RO

JEC

TIO

N

PA

RT

S L

IST

DE

SC

RIP

TIO

NP

AR

T N

UM

BE

RIT

EM N

OQ

TY

-KO

Z_H

5398

0_BG

A-H

STO

P

RE

VIS

ION

HIS

TO

RY

ZON

ER

EVD

ESC

RIP

TIO

N

1A

INIT

IAL

REL

EASE

2B

ADD

PIN

1 L

OC

ATIO

N

HS

BASE

AR

EA:

0.06

0'' M

AX C

OM

PON

ENT

HEI

GH

T AL

LOW

ED H

ERE

AIR

FLO

W D

IREC

TIO

N

LBG

PAC

KAG

E 28

MM

X 3

4MM

BOAR

D P

RIM

ARY

SID

EAS

VIE

WED

FR

OM

TH

E TO

P O

F TH

E BO

ARD

A1

SEE

DET

AIL

A

SCAL

E 1

0:1

DET

AIL

A

x

yz

ECAD

xyz

ECAD


Mechanical Drawings


43

43

21

21

2200

MIS

SIO

N C

OLL

EGE

BLVD

.P.

O. B

OX

5811

9SA

NTA

CLA

RA,

CA

9505

2-81

19

R

4X3.

18[.1

25]

NO

N-P

LATE

D T

HR

OU

GH

HO

LE

4X4.

45[.1

75]

NO

CO

MPO

NEN

TS, T

RAC

ES O

R V

IAS

ALLO

WED

AT T

HE

BOTT

OM

LAY

ER

56 [2.2

05]

38 [1.4

96]

DO N

OT

SCAL

E DR

AWIN

GSC

ALE:

1:1

KOZ_

H53

980_

BGA

CD

RAW

ING

NU

MBE

RSI

ZED

EP

AR

TM

EN

T

BOAR

D S

ECO

ND

ARY

SID

EAS

VIE

WED

FR

OM

TH

E BO

TTO

M O

F TH

E BO

ARD

x

yz

ECAD

Mechanical Drawings



43

43

21

21

2200

MIS

SIO

NP.

O. B

OX

581

SAN

TA C

LAR

R

4X3.

18[.1

25]

NO

N-P

LATE

D T

HR

OU

GH

HO

L

4X3.

94[.1

55]

RO

UTE

KEE

POU

T TH

RO

UG

H

4X4.

95[.1

95]

NO

CO

MPO

NEN

TS, T

RAC

ES O

AT T

HE

TOP

LAYE

R

0.000 []

33.751.329 []

0.000 []

0 .000

[]

30.5 1.20

1[

]

0 .000

[]

14.13.556 []

14.13.556 []

2X281.102 []

2X19 .7

48[

]

30.5 1.20

1[

]

DO N

OT

SCAL

E DR

AWIN

GSC

ALE:

1:1

KOZ_

H62

045_

BGA

CD

RAW

ING

NU

MBE

RSI

ZE

SHO

RT

HS

KO

TIT

LE

DE

PA

RT

ME

NT

SEE

NO

TES

SEE

NO

TES

FIN

ISH

MAT

ERIA

L

-DA

TE

AP

PR

OV

ED

BY

--DA

TE

CH

EC

KE

D B

Y

11/1

3/14

DA

TE

DR

AW

N B

Y

11/1

3/14

DA

TE

DE

SIG

NE

D B

Y

THIR

D A

NG

LE P

RO

JEC

TIO

N

PA

RT

S L

IST

DE

SC

RIP

TIO

NP

AR

T N

UM

BE

RIT

EM N

OQ

TY

-KO

Z_H

6204

5_BG

A-H

STO

P

RE

VIS

ION

HIS

TO

RY

ZON

ER

EVD

ESC

RIP

TIO

N

1A

INIT

IAL

REL

EASE

2B

ADD

PIN

1 L

OC

ATIO

N

HS

BASE

AR

EA:

0.06

0'' M

AX C

OM

PON

ENT

HEI

GH

T AL

LOW

ED H

ERE

AIR

FLO

W D

IREC

TIO

N

LBG

PAC

KAG

E 28

MM

X 3

4MM

BOAR

D P

RIM

ARY

SID

EAS

VIE

WED

FR

OM

TH

E TO

P O

F TH

E BO

ARD

A1

SEE

DET

AIL

A

SCAL

E 1

0:1

DET

AIL

A


Mechanical Drawings


43

43

21

21

2200

MIS

SIO

N C

OLL

EGE

BLVD

.P.

O. B

OX

5811

9SA

NTA

CLA

RA,

CA

9505

2-81

19

R

56 [2.2

05]

38 [1.4

96]

2X3.

18[.1

25]

NO

N-P

LATE

D T

HR

OU

GH

HO

LE

2X4.

45[.1

75]

NO

CO

MPO

NEN

TS, T

RAC

ES O

R V

IAS

ALLO

WED

AT T

HE

BOTT

OM

LAY

ER

DO N

OT

SCAL

E DR

AWIN

GSC

ALE:

1:1

KOZ_

H62

045_

BGA

CD

RAW

ING

NU

MBE

RSI

ZED

EP

AR

TM

EN

T

BOAR

D S

ECO

ND

ARY

SID

EAS

VIE

WED

FR

OM

TH

E BO

TTO

M O

F TH

E BO

ARD

Mechanical Drawings


Figure B-7. H53980 - Reference Heatsink Assembly Drawing - Sheet 1 of 2

43

43

21

21

2200

MIS

SIO

NP.

O. B

OX

581

SAN

TA C

LAR

R

12±0

.5

15

DO N

OT

SCAL

E DR

AWIN

GSC

ALE:

1:1

H53

980-

001

CD

RAW

ING

NU

MBE

RSI

ZE

TALL

HEA

T SI

N

TIT

LE

DE

PA

RT

ME

NT

SEE

NO

TES

SEE

NO

TES

FIN

ISH

MAT

ERIA

L

-DA

TE

AP

PR

OV

ED

BY

--DA

TE

CH

EC

KE

D B

Y

07/2

9/14

DA

TE

DR

AW

N B

Y

07/2

9/14

DA

TE

DE

SIG

NE

D B

YTO

LER

ANC

ES O

N D

IMEN

SIO

NED

AN

D U

ND

IMEN

SIO

NED

FE

ATU

RES

UN

LESS

OTH

ERW

ISE

SPEC

IFIE

D:

DIM

ENSI

ON

S AR

E IN

MIL

LIM

ETER

S.TO

LER

ANC

ES:

LIN

EAR

± 0

.25

ANG

ULA

R ±

0.5

°

THIR

D A

NG

LE P

RO

JEC

TIO

N

PA

RT

S L

IST

DE

SC

RIP

TIO

NP

AR

T N

UM

BE

RIT

EM N

OQ

TY

-H

5398

0-00

1TO

PTA

LL H

EAT

SIN

KH

5398

0_C

P01

11

TIM

, 0.2

5x35

x35M

M, H

ON

EYW

ELL

PCM

45F_

35X3

52

183

FT02

-03-

9909

34

RE

VIS

ION

HIS

TO

RY

ZON

ER

EVD

ESC

RIP

TIO

N

1A

INIT

IAL

REL

EASE

2B

UPD

ATE

PER

DFM

3C

ADD

0.7

5MM

STE

PS T

O H

OLE

S

4D

UPD

ATE

0.75

MM

DEP

TH S

TEP

HO

LES

TO 1

.80M

M D

EPTH

5E

UPD

ATE

THE

TOLE

RAN

CE

OF

HO

LES

O B

E U

SED

IN C

ON

JUN

CTI

ON

WIT

H S

UPP

LIED

3D

DAT

ABAS

E.S

AND

TO

LER

ENC

ES O

N T

HIS

DR

AWIN

G T

AKE

PREC

EDEN

CE

DAT

ABAS

EAT

ED IN

MIL

LIN

ETER

S.R

RS,

SH

ARP

EDG

ES, G

REA

SES,

AN

D/O

R S

OLV

ENTS

AFT

ER

RED

TO

MAK

E TH

IS P

ART

SHAL

L BE

TH

E PR

OPE

RTY

OF

INTE

LER

MAN

ENTL

Y M

ARKE

D W

ITH

INTE

L'S

NAM

E AN

D A

PPR

OPR

IATE

HAL

L BE

SU

BMIT

TED

TO

AN

D A

PPR

OVE

D B

Y IN

TEL

ENG

INEE

RIN

GTR

UC

TIO

N O

F TH

E TO

OLS

.

1

2

3

PUSH

PIN

FR

OM

ITW

, FO

R 6

2-78

MIL

TH

ICKN

ESS

BOAR

D

MAR

K W

ITH

IPN

"H53

980-

001"

TIM

ATT

ACH

ED IN

TH

E C

ENTE

R O

F H

S BA

SE


Mechanical Drawings


43

43

21

21

2200

MIS

SIO

N C

OLL

EGE

BLVD

.P.

O. B

OX

5811

9SA

NTA

CLA

RA,

CA

9505

2-81

19

R

0.1

597

307

2X2.

76SI

DE

FIN

PIT

CH

36

36

X8.7

54X

8

65.5

7

3 HS

BASE

TH

ICKN

ESS

4X2.

87

SPR

ING

SEA

TIN

G P

LAN

E TO

HS

BOTT

OM

2X1.

01TO

P O

F SI

DE

FIN

S

2X1.

39R

OO

T O

F SI

DE

FIN

S

21X2

.48

MID

DLE

FIN

PIT

CH

22X

TOP

OF

MID

DLE

FI N

0.7

0.15

22X0

.90.

15R

OO

T O

F M

IDD

LE F

I

8x(R

2.5)

715 M C

HAM

FER

4X7

NO

TH

REA

D H

OLE

3.47

+0.0

8-0

.02

2X7

380.

15

8X4

4X6

S:1.

80M

M D

EPTH

DO N

OT

SCAL

E DR

AWIN

GSC

ALE:

1:1

H53

980-

001

CD

RAW

ING

NU

MBE

RSI

ZED

EP

AR

TM

EN

T

NO

TES:

1.TH

IS D

RAW

ING

IS T

O B

E U

SED

IN C

ON

JUN

CTI

ON

WIT

H T

EH S

UPP

LIED

3D

D

ATAB

ASE

FILE

. ALL

DIM

ENSI

ON

S AN

D T

OLE

RAN

CES

ON

TH

IS D

RAW

ING

TA

KE P

REC

EDEN

CE

OVE

R S

UPP

LIED

FIL

E.2.

REM

OVE

ALL

BU

RR

S, S

HAR

P ED

GES

, GR

EASE

S, A

ND

/OR

SO

LVEN

TS A

FTER

MAC

HIN

ING

3.TO

OLI

NG

REQ

UIR

ED T

O M

AKE

THIS

PAR

T SH

ALL

BE T

HE

PRO

PER

TY O

F IN

TEL.

AND

SH

ALL

BE P

ERM

ANEN

TLY

MAR

KED

WIT

H IN

TEL'

S N

AME

AND

APP

RO

PRIA

T EPA

RT

NU

MBE

R.

4.TO

OL

DES

IGN

SH

ALL

BE S

UBM

ITTE

D T

O A

ND

APP

RO

VED

BY

INTE

LEN

GIN

EER

PR

IOR

TO

CO

NST

RU

CTI

ON

OF

THE

TOO

LS5.

MAT

ERIA

L:AL

6063

,T5

6.FI

NIS

H:B

LAC

K AN

OD

IZED

(AN

OD

IZED

PER

MIL

STD

862

5,TY

PE II

,CLA

SSII)

7 C

RIT

ICAL

TO

FU

NC

TIO

N D

IMEN

SIO

NS

(8)R

EFER

ENC

E D

IMEN

SIO

NS

9.D

IMEN

SIO

NS

FOR

INSP

ECTI

ON

PU

RPO

SES.

ALL

OTH

ER D

IMEN

SIO

NS

SHO

ULD

BE

DER

IVED

FR

OM

CAD

MO

DEL

.10

.FIN

GAP

S C

AN B

E AP

PEAR

ED W

HIT

E AN

D B

LAC

K C

OLO

R.

11 L

OC

AL F

LATN

ESS

ZON

E 0.

10M

M.

12.H

S M

ASS:

120

GR

AM +

/-10

GR

AM

LOC

AL F

LATN

ESS

ZON

E 0.

10M

M7

11

H53

980_

CP0

1 D

ETAI

LLB

G T

ALL

HEA

T SI

NK

SCAL

E 6

:1D

ETAI

L A

Mechanical Drawings



43

43

21

21

2200

MIS

SIO

NP.

O. B

OX

581

SAN

TA C

LAR

R

12±0

.5

DO N

OT

SCAL

E DR

AWIN

GSC

ALE:

1:1

H54

219-

001

CD

RAW

ING

NU

MBE

RSI

ZE

TALL

HEA

T SI

NK,

93

MIL

TIT

LE

DE

PA

RT

ME

NT

SEE

NO

TES

SEE

NO

TES

FIN

ISH

MAT

ERIA

L

-DA

TE

AP

PR

OV

ED

BY

--DA

TE

CH

EC

KE

D B

Y

07/2

9/14

DA

TE

DR

AW

N B

Y

07/2

9/14

DA

TE

DE

SIG

NE

D B

YTO

LER

ANC

ES O

N D

IMEN

SIO

NED

AN

D U

ND

IMEN

SIO

NED

FE

ATU

RES

UN

LESS

OTH

ERW

ISE

SPEC

IFIE

D:

DIM

ENSI

ON

S AR

E IN

MIL

LIM

ETER

S.TO

LER

ANC

ES:

LIN

EAR

± 0

.25

ANG

ULA

R ±

0.5

°

THIR

D A

NG

LE P

RO

JEC

TIO

N

PA

RT

S L

IST

DE

SC

RIP

TIO

NP

AR

T N

UM

BE

RIT

EM N

OQ

TY

TALL

HEA

TSIN

K FO

R 9

3MIL

BO

ARD

H54

219-

001

TOP

TALL

HEA

TSIN

KH

5421

9_C

P01

11

TIM

, 0.2

5x35

x35M

M, H

ON

EYW

ELL

PCM

45F_

35X3

52

183

FT05

-03-

9909

_ASM

34

RE

VIS

ION

HIS

TO

RY

ZON

ER

EVD

ESC

RIP

TIO

N

1A

INIT

IAL

REL

EASE

2B

UPD

ATE

PER

DFM

3C

ADD

0.7

5MM

STE

PS T

O H

OLE

S

4D

UPD

ATE

0.75

MM

DEP

TH S

TEP

HO

LES

TO 1

.80M

M D

EPTH

5E

UPD

ATE

THE

TOLE

RAN

CE

OF

THE

HO

LES

O B

E U

SED

IN C

ON

JUN

CTI

ON

WIT

H S

UPP

LIED

3D

DAT

ABAS

E.S

AND

TO

LER

ENC

ES O

N T

HIS

DR

AWIN

G T

AKE

PREC

EDEN

CE

DAT

ABAS

EAT

ED IN

MIL

LIN

ETER

S.R

RS,

SH

ARP

EDG

ES, G

REA

SES,

AN

D/O

R S

OLV

ENTS

AFT

ER

RED

TO

MAK

E TH

IS P

ART

SHAL

L BE

TH

E PR

OPE

RTY

OF

INTE

LER

MAN

ENTL

Y M

ARKE

D W

ITH

INTE

L'S

NAM

E AN

D A

PPR

OPR

IATE

HAL

L BE

SU

BMIT

TED

TO

AN

D A

PPR

OVE

D B

Y IN

TEL

ENG

INEE

RIN

GTR

UC

TIO

N O

F TH

E TO

OLS

.

1 2

3

PUSH

PIN

FR

OM

ITW

, FO

R 9

3 M

IL T

HIC

KNES

S BO

ARD

MAR

K W

ITH

IPN

"H54

219-

001"

TIM

ATT

ACH

ED IN

TH

E C

ENTE

R O

F H

S BA

SE


Mechanical Drawings


43

43

21

21

2200

MIS

SIO

N C

OLL

EGE

BLVD

.P.

O. B

OX

5811

9SA

NTA

CLA

RA,

CA

9505

2-81

19

R

0.1

597

36

36

65.5

7

4X8

8X4

4X8.

75

7

2X7

380.

15

307

4X2.

87

SPR

ING

SEA

TIN

G P

LAN

E TO

HS

BOTT

OM

3 HS

BASE

TH

ICKN

ESS

0.25

MM

CH

AMFE

R

4X7

NO

TH

REA

D H

OLE

3.47

+0.0

8-0

.02

2X2.

76SI

DE

FIN

PIT

CH

21X2

.48

MID

DLE

FIN

PIT

CH

8x(R

2.5)

2X1.

01TO

P O

F SI

DE

FIN

S2X

1.39

RO

OT

OF

SID

E FI

NS

22X

TOP

OF

MID

DLE

FIN

S0.

70.

15

22X0

.90.

15R

OO

T O

F M

IDD

LE F

INS

4X6

STEP

HO

LES:

1.80

MM

DEP

TH

DO N

OT

SCAL

E DR

AWIN

GSC

ALE:

1:1

H54

219-

001

CD

RAW

ING

NU

MBE

RSI

ZED

EP

AR

TM

EN

T

NO

TES:

1.TH

IS D

RAW

ING

IS T

O B

E U

SED

IN C

ON

JUN

CTI

ON

WIT

H T

EH S

UPP

LIED

3D

DAT

ABAS

E FI

LE. A

LL D

IMEN

SIO

NS

AND

TO

LER

ANC

ES O

N T

HIS

DR

AWIN

GTA

KE P

REC

EDEN

CE

OVE

R S

UPP

LIED

FIL

E.2.

REM

OVE

ALL

BU

RR

S, S

HAR

P ED

GES

, GR

EASE

S, A

ND

/OR

SO

LVEN

TS A

FTER

MAC

HIN

ING

3.TO

OLI

NG

REQ

UIR

ED T

O M

AKE

THIS

PAR

T SH

ALL

BE T

HE

PRO

PER

TY O

F IN

TEL.

AND

SH

ALL

BE P

ERM

ANEN

TLY

MAR

KED

WIT

H IN

TEL'

S N

AME

AND

APP

RO

PRIA

T EPA

RT

NU

MBE

R.

4.TO

OL

DES

IGN

SH

ALL

BE S

UBM

ITTE

D T

O A

ND

APP

RO

VED

BY

INTE

LEN

GIN

EER

PR

IOR

TO

CO

NST

RU

CTI

ON

OF

THE

TOO

LS5.

MAT

ERIA

L:AL

6063

,T5

6.FI

NIS

H:B

LAC

K AN

OD

IZED

(AN

OD

IZED

PER

MIL

STD

862

5,TY

PE II

,CLA

SSII)

7 C

RIT

ICAL

TO

FU

NC

TIO

N D

IMEN

SIO

NS

(8)R

EFER

ENC

E D

IMEN

SIO

NS

9.D

IMEN

SIO

NS

FOR

INSP

ECTI

ON

PU

RPO

SES.

ALL

OTH

ER D

IMEN

SIO

NS

SHO

ULD

BE

D

ERIV

ED F

RO

M C

AD M

OD

EL.

10.F

IN G

APS

CAN

BE

APPE

ARED

WH

ITE

AND

BLA

CK

CO

LOR

.11

LO

CAL

FLA

TNES

S ZO

NE

0.10

MM

.12

.HS

MAS

S: 1

20G

RAM

+/-1

2 G

RAM

LOC

AL F

LATN

ESS

ZON

E 0.

10M

M7

11

H54

219_

CP0

1 D

ETAI

LLB

G T

ALL

HEA

T SI

NK

SCAL

E 2

:1

SCAL

E 6

:1D

ETAI

L A

Mechanical Drawings



43

43

21

21

2200

MIS

SIO

NP.

O. B

OX

581

SAN

TA C

LAR

R

12±0

.5

15

DO N

OT

SCAL

E DR

AWIN

GSC

ALE:

1:1

H73

752-

001

CD

RAW

ING

NU

MBE

RSI

ZE

TALL

HEA

T SI

NK,

130

MIL

TIT

LE

DE

PA

RT

ME

NT

SEE

NO

TES

SEE

NO

TES

FIN

ISH

MAT

ERIA

L

-DA

TE

AP

PR

OV

ED

BY

--DA

TE

CH

EC

KE

D B

Y

02/0

9/15

DA

TE

DR

AW

N B

Y

02/0

9/15

DA

TE

DE

SIG

NE

D B

YTO

LER

ANC

ES O

N D

IMEN

SIO

NED

AN

D U

ND

IMEN

SIO

NED

FE

ATU

RES

UN

LESS

OTH

ERW

ISE

SPEC

IFIE

D:

DIM

ENSI

ON

S AR

E IN

MIL

LIM

ETER

S.TO

LER

ANC

ES:

LIN

EAR

± 0

.25

ANG

ULA

R ±

0.5

°

THIR

D A

NG

LE P

RO

JEC

TIO

N

PA

RT

S L

IST

DE

SC

RIP

TIO

NP

AR

T N

UM

BE

RIT

EM N

OQ

TY

-H

7375

2-00

1TO

PTA

LL H

EAT

SIN

KH

7375

2_C

P01

11

TIM

, 0.2

5x35

x35M

M, H

ON

EYW

ELL

PCM

45F_

35X3

52

183

FT11

-03-

9909

34

RE

VIS

ION

HIS

TO

RY

ZON

ER

EVD

ESC

RIP

TIO

N

1A

INIT

IAL

REL

EASE

2 B

U

PDAT

E 0.

75M

M D

EPTH

STE

P H

OLE

S TO

1.8

0MM

DEP

TH

3 C

UPD

ATE

THE

TOLE

RAN

CE

OF

THE

HO

LES

O B

E U

SED

IN C

ON

JUN

CTI

ON

WIT

H S

UPP

LIED

3D

DAT

ABAS

E.S

AND

TO

LER

ENC

ES O

N T

HIS

DR

AWIN

G T

AKE

PREC

EDEN

CE

DAT

ABAS

EAT

ED IN

MIL

LIN

ETER

S.R

RS,

SH

ARP

EDG

ES, G

REA

SES,

AN

D/O

R S

OLV

ENTS

AFT

ER

RED

TO

MAK

E TH

IS P

ART

SHAL

L BE

TH

E PR

OPE

RTY

OF

INTE

LER

MAN

ENTL

Y M

ARKE

D W

ITH

INTE

L'S

NAM

E AN

D A

PPR

OPR

IATE

HAL

L BE

SU

BMIT

TED

TO

AN

D A

PPR

OVE

D B

Y IN

TEL

ENG

INEE

RIN

GTR

UC

TIO

N O

F TH

E TO

OLS

.

1

2

3

PUSH

PIN

FR

OM

ITW

, FO

R 1

30M

IL T

HIC

KNES

S BO

ARD

MAR

K W

ITH

IPN

"H73

752-

001"

TIM

ATT

ACH

ED IN

TH

E C

ENTE

R O

F H

S BA

SE


Mechanical Drawings


43

43

21

21

2200

MIS

SIO

N C

OLL

EGE

BLVD

.P.

O. B

OX

5811

9SA

NTA

CLA

RA,

CA

9505

2-81

19

R

0.1

597

307

2X2.

76SI

DE

FIN

PIT

CH

36

36

X8.7

54X

8

65.5

7

3 HS

BASE

TH

ICKN

ESS

4X2.

87

SPR

ING

SEA

TIN

G P

LAN

E TO

HS

BOTT

OM

2X1.

01TO

P O

F SI

DE

FIN

S

2X1.

39R

OO

T O

F SI

DE

FIN

S

21X2

.48

MID

DLE

FIN

PIT

CH

22X

TOP

OF

MID

DLE

FI N

0.7

0.15

22X0

.90.

15R

OO

T O

F M

IDD

LE F

I

8x(R

2.5)

715 M C

HAM

FER

4X7

NO

TH

REA

D H

OLE

3.47

+0.0

8-0

.02

2X7

380.

15

8X4

4X6

S:1.

80M

M D

EPTH

DO N

OT

SCAL

E DR

AWIN

GSC

ALE:

1:1

H73

752-

001

CD

RAW

ING

NU

MBE

RSI

ZED

EP

AR

TM

EN

T

NO

TES:

1.TH

IS D

RAW

ING

IS T

O B

E U

SED

IN C

ON

JUN

CTI

ON

WIT

H T

EH S

UPP

LIED

3D

D

ATAB

ASE

FILE

. ALL

DIM

ENSI

ON

S AN

D T

OLE

RAN

CES

ON

TH

IS D

RAW

ING

TA

KE P

REC

EDEN

CE

OVE

R S

UPP

LIED

FIL

E.2.

REM

OVE

ALL

BU

RR

S, S

HAR

P ED

GES

, GR

EASE

S, A

ND

/OR

SO

LVEN

TS A

FTER

MAC

HIN

ING

3.TO

OLI

NG

REQ

UIR

ED T

O M

AKE

THIS

PAR

T SH

ALL

BE T

HE

PRO

PER

TY O

F IN

TEL.

AND

SH

ALL

BE P

ERM

ANEN

TLY

MAR

KED

WIT

H IN

TEL'

S N

AME

AND

APP

RO

PRIA

T EPA

RT

NU

MBE

R.

4.TO

OL

DES

IGN

SH

ALL

BE S

UBM

ITTE

D T

O A

ND

APP

RO

VED

BY

INTE

LEN

GIN

EER

PR

IOR

TO

CO

NST

RU

CTI

ON

OF

THE

TOO

LS5.

MAT

ERIA

L:AL

6063

,T5

6.FI

NIS

H:B

LAC

K AN

OD

IZED

(AN

OD

IZED

PER

MIL

STD

862

5,TY

PE II

,CLA

SSII)

7 C

RIT

ICAL

TO

FU

NC

TIO

N D

IMEN

SIO

NS

(8)R

EFER

ENC

E D

IMEN

SIO

NS

9.D

IMEN

SIO

NS

FOR

INSP

ECTI

ON

PU

RPO

SES.

ALL

OTH

ER D

IMEN

SIO

NS

SHO

ULD

BE

DER

IVED

FR

OM

CAD

MO

DEL

.10

.FIN

GAP

S C

AN B

E AP

PEAR

ED W

HIT

E AN

D B

LAC

K C

OLO

R.

11 L

OC

AL F

LATN

ESS

ZON

E 0.

10M

M.

12.H

S M

ASS:

120

GR

AM +

/-12

GR

AM

LOC

AL F

LATN

ESS

ZON

E 0.

10M

M7

11

H73

752_

CP0

1 D

ETAI

LLB

G T

ALL

HEA

T SI

NK

SCAL

E 6

:1D

ETAI

L A

Mechanical Drawings



43

43

21

21

2200

MIS

SIO

NP.

O. B

OX

581

SAN

TA C

LAR

R

12±0

.5

15.2

5±0.

DO N

OT

SCAL

E DR

AWIN

GSC

ALE:

1:1

H62

045-

001

CD

RAW

ING

NU

MBE

RSI

ZE

SHO

RT

HEA

TSIN

TIT

LE

DE

PA

RT

ME

NT

SEE

NO

TES

SEE

NO

TES

FIN

ISH

MAT

ERIA

L

-DA

TE

AP

PR

OV

ED

BY

--DA

TE

CH

EC

KE

D B

Y

10/1

4/14

DA

TE

DR

AW

N B

Y

10/1

4/14

DA

TE

DE

SIG

NE

D B

YTO

LER

ANC

ES O

N D

IMEN

SIO

NED

AN

D U

ND

IMEN

SIO

NED

FE

ATU

RES

UN

LESS

OTH

ERW

ISE

SPEC

IFIE

D:

DIM

ENSI

ON

S AR

E IN

MIL

LIM

ETER

S.TO

LER

ANC

ES:

LIN

EAR

± 0

.25

ANG

ULA

R ±

0.5

°

THIR

D A

NG

LE P

RO

JEC

TIO

N

PA

RT

S L

IST

DE

SC

RIP

TIO

NP

AR

T N

UM

BE

RIT

EM N

OQ

TY

-H

6204

5-00

1TO

PSH

OR

T H

EATS

INK

H62

045_

CP0

11

1SP

RIN

G-L

OAD

ED F

ASTE

NER

(ITW

PN

: 83F

T02-

37-9

909)

83FT

02-3

7-99

092

2TI

M, 0

.25x

35x3

5MM

, HO

NEY

WEL

LPC

M45

F_35

X35

31

RE

VIS

ION

HIS

TO

RY

ZON

ER

EVD

ESC

RIP

TIO

N

1A

INIT

IAL

REL

EASE

2B

DES

IGN

UPD

ATED

PER

DFM

3C

ADD

0.7

5MM

STE

PS T

O H

OLE

S

4D

UPD

ATE

THE

TOLE

RAN

CE

OF

HO

LES

TO B

E U

SED

IN C

ON

JUN

CTI

ON

WIT

H S

UPP

LIED

3D

DAT

ABAS

E.S

AND

TO

LER

ENC

ES O

N T

HIS

DR

AWIN

G T

AKE

PREC

EDEN

CE

D D

ATAB

ASE

TATE

D IN

MIL

LIN

ETER

S.U

RR

S, S

HAR

P ED

GES

, GR

EASE

S, A

ND

/OR

SO

LVEN

TS A

FTER

IRED

TO

MAK

E TH

IS P

ART

SHAL

L BE

TH

E PR

OPE

RTY

OF

INTE

LPE

RM

ANEN

TLY

MAR

KED

WIT

H IN

TEL'

S N

AME

AND

APP

RO

PRIA

TE

HAL

L BE

SU

BMIT

TED

TO

AN

D A

PPR

OVE

D B

Y IN

TEL

ENG

INEE

RIN

GST

RU

CTI

ON

OF

THE

TOO

LS.

1

3

2

TIM

ATT

ACH

ED IN

TH

E C

ENTE

R O

F H

S BA

SE

MAR

K W

ITH

IPN

"H62

045-

001"


Mechanical Drawings


43

43

21

21

2200

MIS

SIO

N C

OLL

EGE

BLVD

.P.

O. B

OX

5811

9SA

NTA

CLA

RA,

CA

9505

2-81

19

R

0.1

597

738

0.15

756

0.15

75

10.5

7

757

2X7

NO

TH

REA

D H

OLE

3.47

+0.0

8-0

.02

65.5

7

36

36

72 H

S BA

SE T

HIC

KNES

S

2X2.

27

SPR

ING

SEA

TIN

G P

LAN

E TO

HS

BOTT

OM

2X0.

8TO

P O

F SI

DE

FIN

S 2X1

BOTT

OM

OF

SID

E FI

NS

2X2.

36SI

DE

FIN

PIT

CH

24X2

.22

MID

DLE

FIN

PIT

CH

25X

BOTT

OM

OF

M0.

70.

1

25X

TOP

OF

MID

D0.

40.

1

4X(R

3) 2X6

STEP

HO

LES:

0.75

MM

DEP

TH

DO N

OT

SCAL

E DR

AWIN

GSC

ALE:

1:1

H62

045-

001

CD

RAW

ING

NU

MBE

RSI

ZED

EP

AR

TM

EN

T

NO

TES:

1.TH

IS D

RAW

ING

IS T

O B

E U

SED

IN C

ON

JUN

CTI

ON

WIT

H T

EH S

UPP

LIED

3D

DAT

ABAS

E FI

LE. A

LL D

IMEN

SIO

NS

AND

TO

LER

ANC

ES O

N T

HIS

DR

AWIN

GTA

KE P

REC

EDEN

CE

OVE

R S

UPP

LIED

FIL

E.2.

REM

OVE

ALL

BU

RR

S, S

HAR

P ED

GES

, GR

EASE

S, A

ND

/OR

SO

LVEN

TS A

F TM

ACH

ININ

G3.

TOO

LIN

G R

EQU

IRED

TO

MAK

E TH

IS P

ART

SHAL

L BE

TH

E PR

OPE

RTY

OF

AND

SH

ALL

BE P

ERM

ANEN

TLY

MAR

KED

WIT

H IN

TEL'

S N

AME

AND

APP

RO

PAR

T N

UM

BER

.4.

TOO

L D

ESIG

N S

HAL

L BE

SU

BMIT

TED

TO

AN

D A

PPR

OVE

D B

Y IN

TEL

ENG

INEE

R P

RIO

R T

O C

ON

STR

UC

TIO

N O

F TH

E TO

OLS

5.M

ATER

IAL:

AL60

63,T

56.

FIN

ISH

:BLA

CK

ANO

DIZ

ED(A

NO

DIZ

ED P

ER M

IL S

TD 8

625,

TYPE

II,C

LASS

II)7

CR

ITIC

AL T

O F

UN

CTI

ON

DIM

ENSI

ON

S(8

)REF

EREN

CE

DIM

ENSI

ON

S9.

DIM

ENSI

ON

S FO

R IN

SPEC

TIO

N P

UR

POSE

S.AL

L O

THER

DIM

ENSI

ON

S SH

OD

ERIV

ED F

RO

M C

AD M

OD

EL.

10.F

IN G

APS

CAN

BE

APPE

ARED

WH

ITE

AND

BLA

CK

CO

LOR

.11

LO

CAL

FLA

TNES

S ZO

NE

0.10

MM

.12

.HS

MAS

S: 4

6GR

AM +

/-4.6

GR

AM

LOC

AL F

LATN

ESS

ZON

E 0.

10M

M7

11

H62

045_

CP0

1 D

ETAI

LLB

G S

HO

RT

HEA

T SI

NK

AIL

A

SCAL

E 1

0:1

DET

AIL

A


Thermal Metrology

C Thermal Metrology

C.1 Thermocouple AttachmentThe thermocouple must be calibrated before measurements are taken. Measurement error can be reduced by improving the thermal contact between the thermocouple and the measured surface and by minimizing the heat loss by conduction and radiation through the thermocouple leads. To minimize the measurement errors, it is recommended that the following approach be used:

1. Use 36-gauge or finer diameter K, T, or J type thermocouples. Intel's laboratory testing is usually done with type T thermocouples made by Omega (part number: 5SRTC-TT-T-36-72).

2. Attach the thermocouple bead or junction to the package top surface at the location define in the product Thermal-Mechanical Specification and Design Guide.

3. Using a heatsink with a metal base, the thermocouple should be attached at zero degree angle (parallel to package IHS surface).

C.2 Zero Degree Angle Attach MethodologyIHS Preparation:

1. Mill a 0.38 mm [15 mil] wide and 0.38 mm [0.15 mil] deep slot on the surface of the IHS starting at the centered package toward the edge IHS. The slot should be at least 1 mm (40 mil) in length and parallel to the heatsink fins.

2. Mill a second slot 0.79 mm [30 mil] wide and 0.51 mm [20 mil] deep in-line with the previous slot reaching the edge of the IHS. This slot should start or end at 1.02 mm [40 mil] from the center of the package.

Thermocouple Attachment:

1. Clean the IHS groove with IPA and a lint free cloth removing all residues prior to thermocouple attachment.

2. Place the thermocouple wire inside the groove letting the exposed wire and bead extend about 3.2 mm [125 mil] past the end of groove. Secure it with Kapton* tape as in Figure C-2, “Thermocouple Attachment” on page 49.

3. Lift the wire at the middle of groove with tweezers and bend the front of wire to place the thermocouple in the channel ensuring the tip is in contact with the end of the channel grooved in the IHS.

4. Press the wire down about 6mm [0.125"] from the thermocouple bead using the tweezers. Place a piece of Kapton* tape to hold the wire inside the groove. It is critical that the thermocouple bead makes contact with the IHS.

5. Measure resistance from thermocouple end wires (hold both wires to a DMM probe) to the IHS surface. This should be the same value as measured during the thermocouple conditioning.

6. Place a small amount of Loctite* 498 adhesive in the groove where the bead is installed. Using a fine point device, spread the adhesive in the groove around the needle, the thermocouple bead and the thermocouple wires already installed in the groove. Avoid moving the thermocouple bead during this step.


Thermal Metrology

7. Allow time for the Loctite to cure.

a. Allow the thermocouple attach set in open-air for at least 30 minutes. It is not recommended to use any curing accelerator, such as Loctite* Accelerator 7452 for this step, as rapid contraction of the adhesive during curing may weaken bead attach on the IHS.

b. Remove the Kapton* tape, straighten the wire in the groove so it lays flat all the way to the end of the groove.

c. Use a blade to shave excess adhesive above the IHS surface.

d. Install new Kapton* tape to hold the thermocouple wire down and fill the rest of groove with adhesive. Make sure the wire and insulation is entirely within the groove and below the IHS surface.

e. Curing time for the rest of the adhesive in the groove can be reduced using Loctite* Accelerator 7452.

f. Repeat step ‘c.’ to remove any access adhesive to ensure flat IHS for proper mechanical contact to the heatsink surface.

8. Measure the resistance from the thermocouple end wires again using the DMM and verify the bead is still properly contacting the IHS.

Thermal Metrology


Figure C-1. IHS Groove Dimensions


Thermal Metrology

Note: Package from factor used in the illustration is only an example and may be different than the package described in this document.

Note: Not to scale.

§

Figure C-2. Thermocouple Attachment

Figure C-3. TC Bead Location

Date post:	23-Mar-2022
Category:	Documents
Upload:	others
View:	26 times
Download:	0 times