Intel® Xeon® Processor E5-1600/2600/4600 v1 and v2 … · 3-9 ILM Back Plate .....31 3-10...

Document Number: 326512-003

Intel® Xeon® Processor E5-1600/2600/4600 v1 and v2 Product FamiliesThermal / Mechanical Design Guide

September 2013

2 Document Number: 326512-003

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Document Number: 326512-003 3

Contents

1 Introduction ..............................................................................................................91.1 References ....................................................................................................... 101.2 Definition of Terms ............................................................................................ 10

2 LGA2011-0 Socket ................................................................................................... 132.1 Contact/Land Mating Location ............................................................................. 162.2 Board Layout .................................................................................................... 16

2.2.1 Suggested Silkscreen Marking for Socket Identification................................ 172.3 Attachment to Motherboard ................................................................................ 182.4 Socket Components........................................................................................... 18

2.4.1 Socket Body Housing .............................................................................. 182.4.2 Solder Balls ........................................................................................... 192.4.3 Contacts ............................................................................................... 192.4.4 Pick and Place Cover............................................................................... 192.4.5 Socket Standoffs and Package Seating Plane.............................................. 21

2.5 Durability ......................................................................................................... 212.6 Markings .......................................................................................................... 212.7 Component Insertion Forces ............................................................................... 222.8 Socket Size ...................................................................................................... 22

3 Independent Loading Mechanism (ILM)................................................................... 233.1 Square ILM Design Concept ................................................................................ 24

3.1.1 Square ILM Assembly Design Overview ..................................................... 243.2 ILM Features .................................................................................................... 26

3.2.1 ILM Closing sequence ............................................................................. 263.2.2 ILM Opening Sequence............................................................................ 283.2.3 ILM Back Plate Design Overview............................................................... 30

3.3 ILM Assembly ................................................................................................... 313.3.1 Manufacturing Assembly Flow .................................................................. 31

3.4 Processor Installation......................................................................................... 323.5 Narrow ILM ...................................................................................................... 34

3.5.1 Introduction .......................................................................................... 343.5.2 Comparison Between Square ILM and Narrow ILM ...................................... 353.5.3 ILM Keepout Zones................................................................................. 35

3.6 ILM Cover ........................................................................................................ 363.7 Heatsink to ILM interface.................................................................................... 37

4 LGA2011-0 Socket and ILM Electrical, Mechanical, andEnvironmental Specifications................................................................................... 394.1 Component Mass............................................................................................... 394.2 Package/Socket Stackup Height .......................................................................... 394.3 Loading Specifications........................................................................................ 394.4 Electrical Requirements...................................................................................... 404.5 Environmental Requirements .............................................................................. 41

5 Thermal Solutions ................................................................................................... 435.1 Performance Targets.......................................................................................... 43

5.1.1 Performance Targets - Square ILM/Heatsink Application .............................. 435.1.2 Performance Targets - Narrow ILM/Heatsink Application .............................. 475.1.3 Reference Heatsink Assembly .................................................................. 49

5.2 Structural Considerations ................................................................................... 515.3 Thermal Design Guidelines ................................................................................. 51

5.3.1 Intel® Turbo Boost Technology................................................................. 525.3.2 Thermal Characterization Parameter ......................................................... 525.3.3 Fan Speed Control .................................................................................. 53


5.3.4 Thermal Features....................................................................................535.3.5 Tcontrol Relief ........................................................................................545.3.6 Short Duration TCC Activation and Catastrophic Thermal Management for Intel®

Xeon® Processor E5-1600/2600 / 4600 v1 and v2 Product Families ..............565.4 Absolute Processor Temperature and Thermal Excursion .........................................565.5 DTS Based Thermal Specification .........................................................................57

5.5.1 Implementation......................................................................................575.5.2 Considerations for Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 v2

Product Family Processors........................................................................575.5.3 DTS Based Thermal Profile, Tcontrol and Margin for the Intel Xeon Processor E5-

1600/E5-2600/E5-4600 v1 Product Family .................................................575.5.4 Power Calculation for the Intel Xeon Processor E5-1600/E5-2600/E5-4600 v1

Product Family .......................................................................................585.5.5 Averaging the DTS Based Thermal Specification for the Intel Xeon E5-1400/E5-

2600/E5-4600 v1 Product Family ..............................................................595.5.6 Capabilities for the Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 v2

Product Family .......................................................................................59

6 Quality and Reliability Requirements .......................................................................636.1 Use Conditions ..................................................................................................636.2 Intel Reference Component Validation ..................................................................64

6.2.1 Board Functional Test Sequence ...............................................................646.2.2 Post-Test Pass Criteria Examples ..............................................................656.2.3 Recommended BIOS/Processor/Memory Test Procedures .............................65

6.3 Material and Recycling Requirements....................................................................65

A Mechanical Drawings ...............................................................................................67

B Socket Mechanical Drawings ....................................................................................93

C Component Suppliers ...............................................................................................99C.1 Intel Enabled Supplier Information .......................................................................99

C.1.1 Intel Reference or Collaboration Thermal Solutions......................................99C.1.2 Socket and ILM Components ..................................................................100

D Thermal Test Vehicle..............................................................................................103D.1 LGA2011-0 TTV ...............................................................................................104D.2 Thermocouple Attach Drawing ...........................................................................105

E Embedded Thermal Solutions .................................................................................107E.1 Performance Targets ........................................................................................107E.2 Thermal Design Guidelines................................................................................108

E.2.1 High Case Temperature Thermal Profile ...................................................108E.3 Mechanical Drawings and Supplier Information ....................................................109

F Heatsink Load Characterization..............................................................................115F.1 Introduction....................................................................................................115F.2 Heatsink Load Fixture.......................................................................................115F.3 Procedure for Measuring Heatsink Load...............................................................115

Figures1-1 Platform Socket Stack ............................................................................................ 92-1 Hexagonal Array in LGA2011-0 ...............................................................................132-2 Contact Wiping Direction ........................................................................................142-3 Schematic of LGA2011-0 Socket with Pick and Place Cover Removed ...........................142-4 LGA2011-0 Socket Contact Numbering (Top View of Socket).......................................152-5 Offset between LGA Land Center and Solder Ball Center .............................................162-6 LGA2011-0 Socket Land Pattern (Top View of Board) .................................................17


2-7 Suggested Board Marking ...................................................................................... 182-8 LGA2011-0 Pick and Place Cover............................................................................. 202-9 Pick and Place Cover ............................................................................................. 213-1 Square ILM Part Terminology ................................................................................. 243-2 Square ILM Assembly............................................................................................ 253-3 Square ILM as a Universal Retention Mechanism ....................................................... 263-4 ILM Interlocking Feature........................................................................................ 273-5 ILM Lever Closing Sequence................................................................................... 283-6 Opening ILM ........................................................................................................ 293-7 Opening Sequence for ILM and Loadplate (cont.) ...................................................... 293-8 ILM Keying .......................................................................................................... 303-9 ILM Back Plate ..................................................................................................... 313-10 Assembling Socket, Back Plate and ILM onto the Motherboard .................................... 313-11 Optional Step: Lock down the Hinge Lever ............................................................... 323-12 Pin 1 Markings on the ILM Frames........................................................................... 333-13 Package Insertion ................................................................................................. 333-14 Closing ILM and Loadplate ..................................................................................... 343-15 Narrow ILM.......................................................................................................... 353-16 ILM with Cover ..................................................................................................... 363-17 Heatsink to ILM Interface....................................................................................... 374-1 Flow Chart of Knowledge-Based Reliability Evaluation Methodology.............................. 415-1 2U Square Heatsink Performance Curves Using Socket-LGA2011-0 TTV........................ 455-2 1U Square Heatsink Performance Curves Using Socket-LGA2011-0 TTV........................ 465-3 1U Narrow Heatsink Performance Curves Using Socket-LGA2011-0 TTV ....................... 495-4 Reference Square ILM/Heatsink Assembly ................................................................ 505-5 Reference Narrow ILM/Heatsink Assembly................................................................ 515-6 Processor Thermal Characterization Parameter Relationships ...................................... 53A-1 Square ILM Board Keepouts 1 of 4 .......................................................................... 68A-2 Square ILM Board Keepouts 2 of 4 .......................................................................... 69A-3 Square ILM Board Keepouts 3 of 4 .......................................................................... 70A-4 Square ILM Board Keepouts 4 of 4 .......................................................................... 71A-5 Narrow ILM Board Keepouts 1 of 4 .......................................................................... 72A-6 Narrow ILM Board Keepouts 2 of 4 .......................................................................... 73A-7 Narrow ILM Board Keepouts 3 of 4 .......................................................................... 74A-8 Narrow ILM Board Keepouts 4 of 4 .......................................................................... 75A-9 2U Square Heatsink Assembly Without TIM 1 of 2 ..................................................... 76A-10 2U Square Heatsink Assembly Without TIM 2 of 2 ..................................................... 77A-11 2U Square Heatsink Volumetric 1 of 2 ..................................................................... 78A-12 2U Square Heatsink Volumetric 2 of 2 ..................................................................... 79A-13 Heatsink Screw M4x0.7 ......................................................................................... 80A-14 Heatsink Compression Spring ................................................................................. 81A-15 Heatsink Retaining Ring......................................................................................... 82A-16 Heatsink Delrin Spacer .......................................................................................... 83A-17 1U Square Heatsink Assembly 1 of 2 ....................................................................... 84A-18 1U Square Heatsink Assembly 2 of 2 ....................................................................... 85A-19 1U Square Heatsink Geometry 1 of 2....................................................................... 86A-20 1U Square Heatsink Geometry 2 of 2....................................................................... 87A-21 Heatsink Cup For Spring Retention .......................................................................... 88A-22 1U Narrow Heatsink Assembly 1 of 2 ....................................................................... 89A-23 1U Narrow Heatsink Assembly 2 of 2 ....................................................................... 90A-24 1U Narrow Heatsink Geometry 1 of 2 ...................................................................... 91A-25 1U Narrow Heatsink Geometry 2 of 2 ...................................................................... 92B-1 Socket Mechanical Drawing (Sheet 1 of 4)................................................................ 94B-2 Socket Mechanical Drawing (Sheet 2 of 4)................................................................ 95B-3 Socket Mechanical Drawing (Sheet 3 of 4)................................................................ 96B-4 Socket Mechanical Drawing (Sheet 4 of 4)................................................................ 97


D-1 Groove for Thermocouple Attach on Intel® Xeon® Processor E5-2600 Product Family Thermal Test Vehicle ...........................................................................................106

E-1 ATCA Heatsink Performance Curves .......................................................................108E-2 High Case Temperature Thermal Profile..................................................................109E-3 ATCA Reference Heatsink Fin and Base (Sheet 1 of 2) ..............................................111E-4 ATCA Reference Heatsink Fin and Base (Sheet 2 of 2) ..............................................112F-1 Heatsink Load Fixtures.........................................................................................115F-2 Heatsink Fixture Assembly....................................................................................116

Tables1-1 Reference Documents ............................................................................................101-2 Terms and Descriptions..........................................................................................102-1 LGA2011-0 Socket Attributes..................................................................................133-1 Square ILM Assembly Component Thickness and Material ...........................................254-1 Socket and Retention Component Mass ....................................................................394-2 2011-land Package and LGA2011-0 Socket Stackup Height .........................................394-3 Socket and ILM Mechanical Specifications .................................................................404-4 Electrical Requirements for LGA2011-0 Socket ..........................................................415-1 Intel® Xeon® Processor E5-1600/2600/4600 v1 Product Families, 8 Core/6 Core Processor

Reference Thermal Boundary Conditions (Square ILM/HS) ..........................................435-2 Intel® Xeon® Processor E5-1600/2600/4600 v1 Product Families, 4 Core Processor

Reference Thermal Boundary Conditions (Square ILM/HS) ..........................................435-3 Intel® Xeon® Processor E5-1600/2600 v2 Product Families, Processor Reference Thermal

Boundary Conditions (Square ILM/HS) .....................................................................445-4 Performance Curve Data (Graphs in Fig 5-1 and 5-2) .................................................465-5 Intel® Xeon® Processor E5-1600/2600/4600 v1 Product Families, 8 Core/6 Core Processor

Reference Thermal Boundary Conditions (Narrow ILM/HS) ..........................................475-6 Intel® Xeon® Processor E5-1600/2600/4600 v1 Product Families, 4 Core Processor

Reference Thermal Boundary Conditions (Narrow ILM/HS) ..........................................475-7 Intel® Xeon® Processor E5-1600/2600 v2 Product Families, Processor Reference Thermal

Boundary Conditions (Narrow ILM/HS) .....................................................................485-8 Performance Curve Data ........................................................................................495-9 TCONTROL and DTS Relationship.............................................................................545-10 Sign Convention....................................................................................................545-11 TCONTROL Relief for E5-1600/E5-2600/E5-4600 v1 Product Families..............................555-12 Averaging Coefficients ...........................................................................................596-1 Server Use Conditions Environment (System Level) ...................................................636-2 Server Use Conditions Environment (System Level) ...................................................64A-1 Mechanical Drawing List .........................................................................................67B-1 Socket Drawing List...............................................................................................93C-1 Suppliers for the Intel Reference Thermal Solutions ...................................................99C-2 Suppliers for the LGA2011-0 Socket and ILM ..........................................................100C-3 Suppliers for the LGA-2011-0 Socket and ILM (Continued)........................................101D-1 Correction Offsets Intel® Xeon® Processor E5-1600 / E5-2600 / E5-4600 v1 Product

Families ..........................................................................................................................................................................................................................................103

D-2 Correction Offsets Intel® Xeon® Processor E5-1600/ E5-2600/ E5-4600 v2 Product Families........................................................................................................................103

E-1 8-Core/6-Core Processor Reference Thermal Boundary Conditions (E5 v1 Product Family)........................................................................................................................107

E-2 Processor Reference Thermal Boundary Conditions (E5 v2 Product Family)..................107E-3 Embedded Heatsink Component Suppliers ..............................................................109E-4 Mechanical Drawings List......................................................................................110


Revision History

§

Revision Number Description Revision Date

-001 • Initial Release March 2012

-002 • Added section 5.3.6 Short Duration TCC Activation and Catastrophic Thermal Management September 2012

-003 • Added E-5 v2 Product Family information September 2013



Introduction

1 Introduction

This document provides guidelines for the design of thermal and mechanical solutions for the:

• Intel® Xeon® Processor E5-1600/2600/4600 v1 and v2 Product Families

processors in 2 and 4-socket servers, and 2-socket workstations. The processors covered are listed in the processor family datasheets listed in Table 1-1.

The components described in this document include:

• The processor thermal solution (heatsink) and associated retention hardware.

• The LGA2011-0 socket, the Independent Loading Mechanism (ILM) and back plate.

The goals of this document are:

• To assist board and system thermal mechanical designers.

• To assist designers and suppliers of processor heatsinks.

Thermal profiles and other processor specifications are provided in the appropriate processor Datasheet.

Figure 1-1. Platform Socket Stack

Heatsink

Independent Loading Mechanism (ILM)

Processor

LGA 2011-0 Socket

Motherboard

ILM Back Plate

Introduction


1.1 ReferencesMaterial and concepts available in the following documents may be beneficial when reading this document.

Notes:1. Available at http://www.blauer-engel.de2. Available at http://ssiforum.oaktree.com/3. Available at https://learn.intel.com/portal/scripts/general/logon.aspx (Code: ME709). Available

electronically.4. Contact your Intel representative for the latest version.

1.2 Definition of Terms

Table 1-1. Reference Documents

Document Notes

European Blue Angel Recycling Standards 1

Platform Environment Control Interface (PECI) Specification 4

Platform Digital Thermal Sensor (DTS) Based Thermal Specifications and Overview 4

Manufacturing With Intel Components Using Lead-Free Technology 3

Entry-level Electronics Bay Specification 2

Intel® Xeon® Processor E5-1600/2600/4600 v1 Product Families Datasheet - Volume One(326508)

3

Intel® Xeon® Processor E5-1600/2600/4600 v1 Product Families Datasheet - Volume Two(326509)

3

Intel® Xeon® Processor E5-1600 and E5-2600 v2 Product Families Datasheet - Volume One(329187)

3

Intel® Xeon® Processor E5-1600 and E5-2600 v2 Product Families Datasheet - Volume Two(329188)

3

Intel® Xeon® Processor E5-1600/2600/4600 v1 Product Families Specification Update(326510)

3

Intel® Xeon® Processor E5-1600 and E5-2600 v2 Product Families Specification Update(329189)

3

Intel® Xeon® Processor E5-1600/2600/4600 v1 and v2 Product Families – Thermal Model (326608)

3

Intel® Xeon® Processor E5-1600/2600/4600 v1 Product Families – Mechanical Model(326609)

3

Intel® Xeon® Processor E5-1600 and E5-2600 v2 Product Families – Mechanical Model(329299)

3

Table 1-2. Terms and Descriptions (Sheet 1 of 2)

Term Description

Bypass Bypass is the area between a passive heatsink and any object that can act to form a duct. For this example, it can be expressed as a dimension away from the outside dimension of the fins to the nearest surface.

DTS Digital Thermal Sensor reports a relative die temperature as an offset from TCC activation temperature.

FSC Fan Speed Control

IHS Integrated Heat Spreader: a component of the processor package used to enhance the thermal performance of the package. Component thermal solutions interface with the processor at the IHS surface.

Square ILM Independent Loading Mechanism provides the force needed to seat the 2011-LGA package onto the socket contacts and has 80 × 80mm heatsink mounting hole pattern.


Introduction

§

Narrow ILM Independent Loading Mechanism provides the force needed to seat the 2011-LGA package onto the socket contacts and has 56 × 94mm heatsink mounting hole pattern

LGA2011-0 socket The processor mates with the system board through this surface mount, 2011-contact socket for Intel® Xeon® Processor 5-1600/E5-2600/E5-4600 Product Families-based platform.

PECI The Platform Environment Control Interface (PECI) is a one-wire interface that provides a communication channel between Intel processor and chipset components to external monitoring devices.

ΨCA Case-to-ambient thermal characterization parameter (psi). A measure of thermal solution performance using total package power. Defined as (TCASE – TLA) / Total Package Power. Heat source should always be specified for Ψ measurements.

ΨCS Case-to-sink thermal characterization parameter. A measure of thermal interface material performance using total package power. Defined as (TCASE – TS) / Total Package Power.

ΨSA Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal performance using total package power. Defined as (TS – TLA) / Total Package Power.

TCASE The case temperature of the processor measured at the geometric center of the topside of the IHS.

TCASE_MAX The maximum case temperature as specified in a component specification.

TCC Thermal Control Circuit: Thermal monitor uses the TCC to reduce the die temperature by using clock modulation and/or operating frequency and input voltage adjustment when the die temperature is very near its operating limits.

TCONTROL TCONTROL is a static value below TCC activation used as a trigger point for fan speed control. When DTS > TCONTROL, the processor must comply to the thermal profile.

TDP Thermal Design Power: Thermal solution should be designed to dissipate this target power level. TDP is not the maximum power that the processor can dissipate.

Thermal Monitor A power reduction feature designed to decrease temperature after the processor has reached its maximum operating temperature.

Thermal Profile Line that defines case temperature specification of a processor at a given power level.

TIM Thermal Interface Material: The thermally conductive compound between the heatsink and the processor case. This material fills the air gaps and voids, and enhances the transfer of the heat from the processor case to the heatsink.

TLA The measured ambient temperature locally surrounding the processor. The ambient temperature should be measured just upstream of a passive heatsink or at the fan inlet for an active heatsink.

TSA The system ambient air temperature external to a system chassis. This temperature is usually measured at the chassis air inlets.

U A unit of measure used to define server rack spacing height. 1U is equal to 1.75 in, 2U equals 3.50 in, and so forth.

Table 1-2. Terms and Descriptions (Sheet 2 of 2)

Term Description

Introduction


LGA2011-0 Socket


2 LGA2011-0 Socket

This section describes a surface mount, LGA (Land Grid Array) socket intended for the processors in the Intel® Xeon® Processor E5-1600/2600/4600 v1 and v2 Product Families-based platform. The socket provides I/O, power and ground contacts. The socket contains 2011 contacts arrayed about a cavity in the center of the socket with lead-free solder balls for surface mounting on the motherboard.The socket has 2011 contacts. The LGA2011-0 socket is introducing a hexagonal area array ball-out which provides many benefits:

• Socket contact density increased by 12% while maintaining 40 mil minimum via pitch requirements.

• Corresponding square pitch array’s would require a 38 mil via pitch for the same package size.

LGA2011-0 has 1.016 mm (40 mil) hexagonal pitch in a 58x43 grid array with 24x16 grid depopulation in the center of the array and selective depopulation elsewhere.

Contact wiping direction is 180 degrees as shown in Figure 2-2.

Figure 2-1. Hexagonal Array in LGA2011-0

Table 2-1. LGA2011-0 Socket Attributes

LGA2011-0 Socket Attributes

Component Size 58.5 mm(L)X51 mm (W)

Pitch 1.016 mm (Hex Array)

Ball Count 2011

40 m

il

40 mil

40 mil

34.7 mil

40 m

il

40 mil

40 mil

34.7 mil

40 m

il

40 mil

40 mil

34.7 mil

LGA2011-0 Socket


The socket must be compatible with the package (processor) and the Independent Loading Mechanism (ILM). The design includes a back plate which is integral to having a uniform load on the socket solder joints and the contacts. Socket loading specifications are listed in Chapter 4. Schematic for LGA2011-0 socket is shown in Figure 2-3. The seating plane is shown on the outer periphery of the socket.

Figure 2-2. Contact Wiping Direction

Contact Wiping DirectionContact Wiping DirectionContact Wiping Direction

Figure 2-3. Schematic of LGA2011-0 Socket with Pick and Place Cover Removed

LGA2011-0 Socket


Figure 2-4. LGA2011-0 Socket Contact Numbering (Top View of Socket)

LGA2011-0 Socket


2.1 Contact/Land Mating LocationAll socket contacts are designed such that the contact tip lands within the substrate pad boundary before any actuation load is applied and remain within the pad boundary at final installation, after actuation load is applied. The offset between LGA land center and solder ball center is defined in Figure 2-5.

Note: All dimensions are in mm.

2.2 Board LayoutThe land pattern for the LGA2011-0 socket is 40 mils hexagonal array. For CTF (Critical to Function) joints, the pad size will primarily be a circular Metal Defined (MD) pad and these pads should be designated as a Critical Dimension to the PCB vendors with a 17 mil ±1 mil tolerance. Some CTF pads will have a SMD Pad (20 x 17 mil). For additional pad configurations details including the NCTF (Non-Critical to Function) joints, see Section 2.3.

Note: There is no round-off (conversion) error between socket pitch (1.016 mm) and board pitch (40 mil) as these values are equivalent.

Figure 2-5. Offset between LGA Land Center and Solder Ball Center

LGA2011-0 Socket


2.2.1 Suggested Silkscreen Marking for Socket IdentificationIntel is recommending that customers mark the socket name approximately where shown in Figure 3-7. The final silkscreen location may vary with different motherboard designs, but should always be visible after ILM and component assembly.

Figure 2-6. LGA2011-0 Socket Land Pattern (Top View of Board)

LGA2011-0 Socket


2.3 Attachment to MotherboardThe socket is attached to the motherboard by 2011 solder balls. There are no additional external methods (that is, screw, extra solder, adhesive, and so forth) to attach the socket.

As indicated in Figure 2-9, the Independent Loading Mechanism (ILM) is not present during the attach (reflow) process.

2.4 Socket ComponentsThe socket has two main components, the socket body and Pick and Place (PnP) cover, and is delivered as a single integral assembly. Refer to Appendix B for detailed drawings.

2.4.1 Socket Body HousingThe housing material is thermoplastic or equivalent with UL 94 V-0 flame rating capable of withstanding 260°C for 40 seconds (typical reflow/rework). The socket coefficient of thermal expansion (in the XY plane), and creep properties, must be such that the integrity of the socket is maintained for the conditions listed in Chapter 6.

The color of the housing will be dark as compared to the solder balls to provide the contrast needed for pick and place vision systems.

Figure 2-7. Suggested Board Marking

Pin 1 of Socket

Add SilkscreenIn this location

LGA2011-0 Socket


2.4.2 Solder BallsA total of 2011 solder balls corresponding to the contacts are on the bottom of the socket for surface mounting with the motherboard.

The socket has the following solder ball material:

• Lead free SAC305 (SnAgCu) solder alloy with a silver (Ag) content 3%, copper (Cu) 0.5%,tin (Sn) 96.5% and a melting temperature of approximately 217°C. The immersion silver (ImAg) motherboard surface finish and solder paste alloy must be compatible with the SAC alloy solder paste.

The co-planarity (profile) and true position requirements are defined in Appendix B.

2.4.3 ContactsThe base material for the contacts is high strength copper alloy.

For the area on socket contacts where processor lands will mate, there is a 0.381 μm [15 μinches] minimum gold plating over 1.27 μm [50 μinches] minimum nickel underplate.

No contamination by solder in the contact area is allowed during solder reflow.

2.4.4 Pick and Place CoverThe cover provides a planar surface for vacuum pick up used to place components in the Surface Mount Technology (SMT) manufacturing line. The cover remains on the socket during reflow to help prevent contamination during reflow. The cover can withstand 260°C for 40 seconds (typical reflow/rework profile) and the conditions listed in Chapter 6 without degrading.

LGA2011-0 Socket


As indicated in Figure 2-9, the pick and place (PnP) cover remains on the socket during ILM installation. Once the ILM with its cover is installed, Intel is recommending the PnP cover be removed to help prevent damage to the socket contacts. To reduce the risk of bent contacts the PnP Cover and ILM Cover were designed to not be compatible. See Section 3.3 for additional information on ILM assembly to the board.

Cover retention must be sufficient to support the socket weight during lifting, translation, and placement (board manufacturing), and during board and system shipping and handling. Covers can be removed without tools.

The pick and place covers are designed to be interchangeable between socket suppliers.

Figure 2-8. LGA2011-0 Pick and Place Cover

LGA2011-0 Socket


Note: Figure is representative and may not show the most current revision of parts.

2.4.5 Socket Standoffs and Package Seating PlaneStandoffs on the bottom of the socket base establish the minimum socket height after solder reflow and are specified in Appendix B.

Similarly, a seating plane on the topside of the socket establishes the minimum package height. See Section 4.2 for the calculated IHS height above the motherboard.

2.5 DurabilityThe socket must withstand 30 cycles of processor insertion and removal. The maximum part average and single pin resistances from Table 4-4 must be met when mated in the 1st and 30th cycles.

The socket Pick and Place cover must withstand 15 cycles of insertion and removal.

2.6 MarkingsThere are three markings on the socket:

• LGA2011-0: Font type is Helvetica Bold - minimum 6 point (2.125 mm).

• Manufacturer's insignia (font size at supplier's discretion).

• Lot identification code (allows traceability of manufacturing date and location).

Figure 2-9. Pick and Place Cover

Pick and Place Cover

ILM

LGA2011-0 Socket


All markings must withstand 260°C for 40 seconds (typical reflow/rework profile) without degrading, and must be visible after the socket is mounted on the motherboard.

LGA2011-0 and the manufacturer's insignia are molded or laser marked on the side wall.

2.7 Component Insertion ForcesAny actuation must meet or exceed SEMI S8-95 Safety Guidelines for Ergonomics/Human Factors Engineering of Semiconductor Manufacturing Equipment, example Table R2-7 (Maximum Grip Forces). The socket must be designed so that it requires no force to insert the package into the socket.

2.8 Socket SizeSocket information needed for motherboard design is given in Appendix B.

This information should be used in conjunction with the reference motherboard keep-out drawings provided in Appendix A to ensure compatibility with the reference thermal mechanical components.

§



3 Independent Loading Mechanism (ILM)

The Independent Loading Mechanism (ILM) provides the force needed to seat the 2011-land LGA package onto the socket contacts. The ILM is physically separate from the socket body. The assembly of the ILM is expected to occur after attaching the socket to the board. The exact assembly location is dependent on manufacturing preference and test flow. See the Manufacturing Advantage Service (MAS) document for this platform for additional guidance.

The mechanical design of the ILM is a key contributor to the overall functionality of the LGA2011-0 socket. Intel performs detailed studies on integration of processor package, socket and ILM as a system. These studies directly impact the design of the ILM. The Intel reference ILM will be “built to print” from Intel controlled drawings. Intel recommends using the Intel Reference ILM. Custom non-Intel ILM designs do not benefit from Intel's detailed studies and may not incorporate critical design parameters.

There are two types of ILMs for socket LGA2011-0:

1. Square ILM - This ILM has 80x80 mm heatsink mounting hole pattern. Please refer to Section 3.1 for more details

2. Narrow ILM - This ILM has 56x94 mm heatsink mounting hole pattern. Please refer to Section 3.1 and Section 3.5 for common features with square ILM and specific features of narrow ILM.

Note: The ILM has two critical functions: deliver the force to seat the processor onto the socket contacts and distribute the resulting load evenly through the socket solder joints. Another purpose of ILM is to ensure electrical integrity/performance of the socket and package.

Note: This design will be “built to print” from Intel controlled drawings.



3.1 Square ILM Design ConceptThe square ILM consists of two assemblies that will be procured as a set from the enabled vendors. These two components are the ILM assembly and back plate.

3.1.1 Square ILM Assembly Design Overview

The square ILM assembly consists of five major pieces as shown in Figure 3-1 and Figure 3-2, hinge lever, active lever, load plate, load frame, ILM cover and the captive fasteners. For clarity the ILM cover is not shown in this view.

Note: The ILM assembly also contains an ILM cover as described in Section 3.6.

Figure 3-1. Square ILM Part Terminology

Loadplate Hinge LeverLoadplate

Active Lever

Hinge Lever

Captive Nut(4X) C

Active Clevis

Hinge Clevis

(4X)

Heat Sink stud(4X)

Clevis Rivet(4X)

Frame Insulator

(4X)Frame



Note: For clarity, the ILM cover is not shown in Figure 3-2.

The hinge lever and active lever are designed to place equal force on both ends of the ILM load plate.The frame provides the hinge locations for the levers. The hinge lever connects the load plate to the frame. When closed, the load plate applies four point loads onto the IHS at the “finger” features shown in Figure 3-2. Four point loading contributes to minimizing package and socket warpage as compared to two point loading. The reaction force from closing the load plate is transmitted to the frame and through the captive fasteners to the back plate. Some of the load is passed through the socket body to the board inducing a slight compression on the solder joints.

Figure 3-3 shows the attachment points of the thermal solution to the ILM frame and the ILM to the back plate. This attachment method requires four holes in the motherboard for the ILM and no additional holes for the thermal solution. Orientation of the ILM is controlled with a key on the socket body. Orientation of the thermal solution is an option with a key to the ILM.

Note: Some customer reference boards (CRB) have four additional outer holes in the board. These holes are legacy and are not required for the current ILM reference design.

Figure 3-2. Square ILM Assembly

4 point load plate(fingers)

Hinge lever arm

ILM frame

Active lever arm

Table 3-1. Square ILM Assembly Component Thickness and Material

Component Thickness (mm) Material

ILM Frame 1.5 301 Stainless Steel

ILM Loadplate 1.5 301 Stainless Steel

ILM Backplate 2.2 S50C Low Carbon Steel



3.2 ILM FeaturesThese features are common to the square and narrow ILM:

• Allows for topside thermal solution attach to a rigid structure. This eliminates the motherboard thickness dependency from the mechanical stackup.

• Captive nuts clamp the ILM frame to the board, providing good clamping and hence reduced board bending leading to higher solder joint reliability.

• ILM levers provide an interlocking mechanism to ensure proper opening or closing sequence for the operator. This has been implemented in both square and narrow ILM.

3.2.1 ILM Closing sequenceWhen closing the ILM, the interlocking features are intended to prevent the hinge lever from being latched first. If an attempt is made to close the hinge lever first, the hinge lever end stop will prevent the user from latching the active lever, indicating something is done wrong. Text on the ILM cover indicates the proper order of operation. Please refer to Figure 3-4.

Figure 3-3. Square ILM as a Universal Retention Mechanism



If hinge lever is pressed down first, it raises the load plate up at an angle higher than the active lever can make contact with, forcing a user to push it down. Also the hinge lever end stop will block the active lever from being able to be latched.

Figure 3-4. ILM Interlocking Feature

Hinge Lever

I t l ki f tInterlocking featureon hinge lever. Active Lever.



ILM lever closing sequence is shown in Figure 3-5.

1. Latch Active Lever first.2. Close Hinge Lever second.

Note: The ILM closing sequence is marked on the ILM load plate.

3.2.2 ILM Opening SequenceFor the opening sequence, the goal is to always open the hinge lever first to prevent the loadplate from springing open. The only option is to release the hinge lever first. The hinge lever in a closed position will block the active lever from being unlatched. By opening hinge lever first, it creates clearance to open the active lever.

Figure 3-5. ILM Lever Closing Sequence

Step 1Close Active Lever

Step 2Step 2Close Hinge Lever



The ILM opening sequence is shown in Figure 3-6.

1. Open hinge lever2. Open active lever

Note: The opening sequence is also marked on the ILM load plate

3. Open the load plate by pushing down on the hinge lever Figure 3-7, this will cause the load plate tab to rise above the socket. Grasp the tab, only after it has risen away from the socket, open load plate to full open position.

Figure 3-6. Opening ILM

Opening the hinge lever provides the clearance to open the active lever

Step 1Open Hinge Lever

Step 2Open Active Lever

Figure 3-7. Opening Sequence for ILM and Loadplate (cont.)



Note: ILM cover not shown for clarity.

3.2.2.1 ILM Keying

This feature is incorporated in the square and narrow ILM. As indicated in Figure 3-8, the socket protrusion and ILM key features prevent 180-degree rotation of ILM assembly with respect to socket. This result in a specific orientation with respect to ILM active lever and pin 1 of the socket body.

3.2.3 ILM Back Plate Design OverviewThe backplate design is common for square and narrow ILM. The back plate for dual processor server products consists of a flat steel back plate with threaded studs to attach to the ILM frame. A clearance hole is located at the center of the plate to allow access to test points and backside capacitors. Two additional cut-outs on the backplate provide clearance for backside voltage regulator components. An insulator is pre applied by the vendor to the side with the threaded studs.

Note: The ILM Back Plate is designed to work with board thicknesses from 0.062 to 0.100 inches. If the board is outside of this range, the backplate will require modification.

Figure 3-8. ILM Keying

If the ILM is attempted to be installed 180° out of phase, the ILM frame will interfere with

ILM keying feature molded in

ILM frame will interfere withsocket protrusion

ILM keying feature molded insocket body and corresponding ILM key feature in the frame.



3.3 ILM AssemblyThe ILM assembly instructions are briefly outlined here.The ILM assembly instructions shown here are for illustration. For High Volume Manufacturing please refer to the appropriate platform Manufacturing Advantage Service document.

3.3.1 Manufacturing Assembly FlowThe assembly of the ILM to the socket is documented in the steps below and graphically in Figure 3-10.

Note: The steps in Figure 3-10 are for illustration only and may not show the most current revision of parts.

Figure 3-9. ILM Back Plate

Clearance cutouts (3x)

6-32 Threaded Studs (4x)

Figure 3-10. Assembling Socket, Back Plate and ILM onto the Motherboard

2 21

33



1. Using SMT, mount the socket onto the circuit board. Intel provides detailed instruction for lead free manufacturing of complex interconnects on the Intel Learning Network (http://iln.intel.com/Portal/Scripts/Home/Home.aspx).

2. Assemble the back plate onto the bottom side of the board ensuring that all 4 studs protrude through the board.

3. Place the Independent Load Mechanism (ILM) with cover onto the board. The load plate should be unlatched. See Section 3.2.2.

4. Tighten the (4) Torx-20 screwed to 9 ±1 in-lb.

5. Lift the load plate to the open position and with the tool remove the PnP cover from the socket body.

6. Close the ILM and latch it per the instructions in Section 3.2.1.

3.4 Processor InstallationNote: For complete ILM assembly instructions please refer to the appropriate Manufacturing

Advantage Service document.

he hinge lever can be locked down to keep it out of the way when removing the PnP cover and installing the processor (Figure 3-11). If the hinge lever is locked down when the ILM is open, then the load plate will be locked in the open position and less likely to fall closed if bumped.

Both the Square and Narrow ILM have a Pin 1 marking on the frame to help indicate proper package alignment (Figure 3-12).

Figure 3-11. Optional Step: Lock down the Hinge Lever

Optional StepLock down Hinge Lever



Note: Figure 3-13 is for illustration only and may not show the most current revision of parts. A tool is available for the installation or removal of the processor. Please work with your local CQE for tool availability.7. Hold processor along the right and left edges of the package to match socket finger

cutouts (East - West edges). Make sure processor’s Pin1 indicator is aligned with Pin 1 indicator on the socket corner. Keeping the processor horizontal, lower it gently into the socket with a purely vertical motion.Verify the package is fully seated; package corners must be at the same height with respect to all four socket corners.

Figure 3-12. Pin 1 Markings on the ILM Frames

Figure 3-13. Package Insertion

Pin 1 indicators

Package Keying features 4x

Finger Cutouts for Package insertion & removal

Matching corner heights 4x

Pin 1 indicators

Package Keying features 4x

Finger Cutouts for Package insertion & removal






Note: Figure 3-14 is for or illustration only and may not show most current parts.8. Carefully lower the ILM load plate on top of the processor,

9. Verify that Load-lever-cam is over the load-plate-tab; actuate Load lever with a smooth uniform motion and latch to the ILM (with thumb).

10. Close the Hinge lever with a smooth uniform motion and latch to the ILM.

3.5 Narrow ILM

3.5.1 IntroductionIn addition to the square ILM discussed in Section 3.1, Intel is enabling a second sku of ILM referred to as the narrow ILM (Figure 3-15.) This second ILM is targeted for constrained layouts where the space available on either side of the LGA2011-0 socket requires narrow heatsink mount points.

Note: This alternate narrow ILM should only be used if space constraints on the board require it. The topside keepouts and restricted heatsink width associated with this design present increased challenges in routing, component placement, and thermals.

Note: This design will be “built to print” from Intel controlled drawings.

Figure 3-14. Closing ILM and Loadplate



3.5.2 Comparison Between Square ILM and Narrow ILM

3.5.2.1 Part Comparison

The narrow ILM is a similar design to the square ILM and shares a majority of the parts. The only parts that are different in the narrow ILM are the ILM frame, hinge lever arm, and active lever arm.

3.5.2.2 Mechanical Requirements

The narrow ILM has the same mechanical requirements as the square ILM (refer to the LGA2011-0 Socket and ILM Electrical, Mechanical, and Environmental Specifications in this document.)

3.5.3 ILM Keepout ZonesILM keepout zones (KOZ) refer to zones around the socket on the top and bottom of the board that must be kept clear of components to accommodate the ILM assembly and back plate. Appendix A, “Mechanical Drawings” shows the different KOZ for both the square and the narrow ILM.

Note: The keepout zones only account for the mechanical clearance. It is up to the system/board architect to determine additional clearance required for finger and/or tool access.

Figure 3-15. Narrow ILM

Narrow frame

Narrow hinge lever arm

Narrow active lever arm



Note: Some customer reference boards (CRB) have four additional outer holes in the board. These holes are legacy and are not required for the current ILM reference design and are thus not shown in the current KOZ.

3.6 ILM CoverIntel has developed a cover that will snap on to the ILM for the LGA2011 socket family.

The ILM cover is intended to reduce the potential for socket contact damage from the operator / customer fingers being close to the socket contacts to remove or install the pick and place cover. By design the ILM cover and pick and place covers can not be installed simultaneously.

The ILM cover concept is shown in Figure 3-16.

This cover is intended to be used in place of the pick and place cover once the ILM is assembled to the board. The ILM will be offered with the ILM cover pre assembled as well as a discrete part.

ILM cover features:

• Pre-assembled by the ILM vendors to the ILM load plate. It will also be offered as a discrete component.

• The ILM cover will pop off if a processor is installed in the socket.

• ILM Cover can be installed while the ILM is open.

• Maintain inter-changeability between validated ILM vendors for LGA2011-0 socket.

• The ILM cover for the LGA2011-0 socket will have a flammability rating of V-0 per UL 60950-1.

Note: Intel recommends removing the Pick and Place cover (PnP) of the socket body in manufacturing as soon as possible at the time when ILM is being installed.

Figure 3-16. ILM with Cover



3.7 Heatsink to ILM interfaceHeatsinks for processors in the LGA2011-0 socket attach directly to the ILM via M4 fasteners. Figure 3-17 shows the critical dimension features the thermal solution vendor must meet.

Note: For IHS height above board see Table 4-1

§

Figure 3-17. Heatsink to ILM Interface

4.178 +0.38/ -0.20 See Note Below

80.00

80.00

38.00

38.00

M4x0.74 PL



LGA2011-0 Socket and ILM Electrical, Mechanical, and Environmental Specifications


4 LGA2011-0 Socket and ILM Electrical, Mechanical, andEnvironmental Specifications

This chapter describes the electrical, mechanical, and environmental specifications for the LGA2011-0 socket and the Independent Loading Mechanism.

4.1 Component Mass

Note:1. This is an approximate mass.

4.2 Package/Socket Stackup HeightTable 4-2 provides the stackup height of a processor in the 2011-0-land LGA package and LGA2011-0 socket with the ILM closed and the processor fully seated in the socket.

Notes:1. This data is provided for information only, and should be derived from: (a) the height of the socket seating

plane above the motherboard after reflow, given in Appendix B, (b) the height of the package, from the package seating plane to the top of the IHS, and accounting for its nominal variation and tolerances that are given in the corresponding processor EDS listed in Table 1-1.

2. This value is a RSS calculation at 3 Sigma.

4.3 Loading SpecificationsThe socket will be tested against the conditions listed in Section 6 with heatsink and the ILM attached, under the loading conditions outlined in this chapter.

Table 4-3 provides load specifications for the LGA2011-0 socket with the ILM installed. The maximum limits should not be exceeded during heatsink assembly, shipping conditions, or standard use condition. Exceeding these limits during test may result in component failure. The socket body should not be used as a mechanical reference or load-bearing surface for thermal solutions.

Table 4-1. Socket and Retention Component Mass

Component Mass

Socket Body, Contacts and PnP Cover 251g

Square ILM Assembly 82g

Narrow ILM Assembly 79g

Backplate 84g

Table 4-2. 2011-land Package and LGA2011-0 Socket Stackup Height

Integrated Stackup Height (mm)From Top of Board to Top of IHS

8.014 ±0.34 mm



Notes:1. These specifications apply to uniform compressive loading in a direction perpendicular to the IHS top

surface.2. This is the minimum and maximum static force that can be applied by the heatsink and it’s retention

solution to maintain the heatsink to IHS interface. This does not imply the Intel reference TIM is validated to these limits.

3. Loading limits are for the LGA2011-0 socket.4. This minimum limit defines the compressive force required to electrically seat the processor onto the socket

contacts.5. Dynamic loading is defined as an 11 ms duration average load superimposed on the static load

requirement.6. Test condition used a heatsink mass of 550 gm [1.21 lb.] with 50 g acceleration measured at heatsink

mass. The dynamic portion of this specification in the product application can have flexibility in specific values, but the ultimate product of mass times acceleration should not exceed this dynamic load.

7. Conditions must be satisfied at the beginning of life (BOL) and the loading system stiffness for non-reference designs need to meet a specific stiffness range to satisfy end of life loading requirements.

8. These loading values are preliminary and subjected to change.9. End of Life (EOL) minimum heatsink static load. The methods and techniques to evaluate heat sink EOL

load are included in Appendix F.10. Beginning of Life (EOL) heat sink load. The methods and techniques to evaluate heat sink BOL load will be

included in a later release of this document.11. The maximum mass includes all components in the thermal solution. This mass limit is evaluated using the

POR heatsink attached to a PCB.

4.4 Electrical RequirementsLGA2011-0 socket electrical requirements are measured from the socket-seating plane of the processor to the component side of the socket PCB to which it is attached. All specifications are maximum values (unless otherwise stated) for a single socket contact, but includes effects of adjacent contacts where indicated.

Table 4-3. Socket and ILM Mechanical Specifications

Parameter Min Max Notes

Static compressive load from ILM cover to processor IHS

445 N [100 lbf] 712 N [160 lbf] 3, 4, 7, 8

Heatsink Static Compressive Load BOL 222 N [50 lbf] 356 N [80 lbf] 1, 2, 3, 4, 8, 10

Heatsink Static Compressive Load EOL 178 N [40 lbf] 356 N [80 lbf] 1, 3, 4, 8, 9

Dynamic Load (with heatsink installed) N/A 540 N [121 lbf] 1, 3, 5, 6, 8

Pick and Place Cover Insertion / Removal force N/A 6.2 N [1.7 lbf] 8

Load Lever actuation force N/A 31 N [7.0 lbf] in the vertical direction

8

Maximum heatsink mass N/A 550g 11



4.5 Environmental RequirementsDesign, including materials, shall be consistent with the manufacture of units that meet the following environmental reference points.

The reliability targets in this chapter are based on the expected field use environment for these products. The test sequence for new sockets will be developed using the knowledge-based reliability evaluation methodology, which is acceleration factor dependent. A simplified process flow of this methodology can be seen in Figure 4-1.

A detailed description of this methodology can be found at:

ftp://download.intel.com/technology/itj/q32000/pdf/reliability.pdf

§

Table 4-4. Electrical Requirements for LGA2011-0 Socket

Parameter Value Comment

Maximum Socket Part Average Resistance (EOL @ 100°C)

25 mΩ This is the maximum allowable part average socket resistance allowed under all use conditions (EOL and 100°C). This is monitored by measuring the daisy chain resistance of all socket contacts in series across the socket and dividing by the number of contacts measured. The resulting value must be below 25 mΩ at all use conditions (EOL) and elevated temperature (100C).

Maximum Single Pin Resistance(mean + 4 sigma) (EOL @ 100°C)

38 mΩ This is the maximum validated single contact resistance on the socket under all use conditions (EOL) and at elevated temperature (100°C). This accounts for resistance variation across the socket. While it is possible that a single contact may reach a resistance of 38 mΩ, the maximum socket part average resistance spec insures that all contacts averaged together will not be higher than 25 mΩ

Dielectric Withstand Voltage 360 Volts RMS

Insulation Resistance 800 MΩ

Figure 4-1. Flow Chart of Knowledge-Based Reliability Evaluation Methodology

Establish the market/expected use environment for the technology

Develop Speculative stress conditions based on historical data, content experts, and literature search

Perform stressing to validate accelerated stressing assumptions and determine acceleration factors

Freeze stressing requirements and perform additional data turns



Thermal Solutions


5 Thermal Solutions

This section describes a 1U reference heatsink and design targets for 2U heatsinks.

5.1 Performance Targets

5.1.1 Performance Targets - Square ILM/Heatsink ApplicationTable 5-1, Table 5-2, and Table 5-3 provide boundary conditions and performance targets for 1U, 2U, and Tower heatsinks used in conjunction with the square ILM for 8 core/6 core and 4 core processors, respectively. These values are used to generate processor thermal specifications and to provide guidance for heatsink design.

All Boundary Conditions are specified at 35°C system ambient temperature and at sea level. Figure 5-1 shows Ψca and pressure drop for the 1U heatsink versus the airflow provided. Best-fit equations are provided to prevent errors associated with reading the graph.

Table 5-1. Intel® Xeon® Processor E5-1600/2600/4600 v1 Product Families, 8 Core/6 Core Processor Reference Thermal Boundary Conditions (Square ILM/HS)

TDP Heatsink Technology

ΨCA2

(oC/W)TLA1 (oC)

Airflow3

(CFM)

Delta P inch of

H2O (Pa)

Heatsink Volumetric4

(mm)

150W (2S WS Only) Cu Base, Al Fins (Cu-Al)/ Heatpipe

0.208 35.2 21.8 0.120 100x100x124

135W(2U) Cu Base, Al Fins (Cu-Al)/Heatpipe

0.179 47.4 26 0.140 91.5x91.5x64


0.192 39 2600 RPM N/A 100x100x124

130W (1U)

Cu Base, Al Fins (Cu-Al)

0.243 53.3 16 0.406 91.5x91.5x25.5

115W(1U) 0.241 51.7 16 0.406 91.5x91.5x25.5

95W (1U) 0.241 49.5 16

0.406 91.5x91.5x25.570W (1U) 0.239 46.8 16

60W (1U) 0.239 45.7 16

Thermal Solutions


Notes:1. Local ambient temperature of the air entering the heatsink.2. Max target (mean + 3 sigma) for thermal characterization parameter (Section 5.3.2).3. Airflow through the heatsink fins with zero bypass. Max target for pressure drop (dP) measured in inches

H2O.4. Dimensions of heatsink do not include socket or processor. 5. General note: All heatsinks are Non-Direct Chassis Attach (DCA).

Table 5-2. Intel® Xeon® Processor E5-1600/2600/4600 v1 Product Families, 4 Core Processor Reference Thermal Boundary Conditions (Square ILM/HS)

4 Core Processor Heatsink Technology

ΨCA2

(oC/W)TLA1

(oC)Airflow3(

CFM)

Delta P (inch of

H2O)


(mm)


0.210 39 2600 RPM N/A 100x100x124

130W (2U) Cu Base, Al Fins (Cu-Al)/Heatpipe

0.199 47.126 0.140 91.5x91.5x64

95W (1U) Cu Base, Al Fins (Cu-Al)

0.261 49.5 16 0.406 91.5x91.5x25.5


0.269 47.9 16 0.406 91.5x91.5x25.5

Table 5-3. Intel® Xeon® Processor E5-1600/2600 v2 Product Families, Processor Reference Thermal Boundary Conditions (Square ILM/HS) (Sheet 1 of 2)

Processor Heatsink Technology6

ΨCA2

(oC/W)TLA1 (oC)

Airflow3

(CFM)

Delta P inch of

H2O (Pa)


(mm)

EP 12-core 130W (1U)


0.252 53.3 16 0.406 91.5x91.5x25.5

EP/EP 4S 12-core 115W (1U)


0.251 51.7 16 0.406 91.5x91.5x25.5

EP WS 8-core150W

Cu Base, Al Fins (Cu-Al)/ Heatpipe

0.236 35.2 21.8 0.120 100x100x124

EP/EP 4S 10-core130W (1U)


0.265 53.4 16 0.406 91.5x91.5x25.5

EP 4S 8-core 130W (1U)


0.269 52.8 16 0.406 91.5x91.5x25.5

EP 8-core130W (2U)

Cu Base, Al Fins (Cu-Al)/Heatpipe

0.207 47.1 26 0.140 91.5x91.5x64

EP 6-core130W (2U)


0.207 47.126 0.140 91.5x91.5x64

EP 10-core115W (1U)


0.265 51.7 16 0.406 91.5x91.5x25.5



0.264 49.5 16 0.406 91.5x91.5x25.5



0.269 49.5 16 0.406 91.5x91.5x25.5

EP 10-core70W (1U)


0.262 46.8 16 0.406 91.5x91.5x25.5

EP 1S WS 6-core130W


0.232 39.0 21.8 0.120 100x100x124

Thermal Solutions


Notes:1. Local ambient temperature of the air entering the heatsink.2. Max target (mean + 3 sigma) for thermal characterization parameter (Section 5.3.2).3. Airflow through the heatsink fins with zero bypass. Max target for pressure drop (dP) measured in inches


EP 1S WS 4-core130W


0.234 39.0 21.8 0.120 100x100x124

EP 4-core130W (2U)


0.221 47.126 0.140 91.5x91.5x64

EP 4S 6-core95W (1U)


0.283 49.5 16 0.406 91.5x91.5x25.5



0.285 49.5 16 0.406 91.5x91.5x25.5

EP 6-core80W (1U)


0.281 47.9 16 0.406 91.5x91.5x25.5

EP 4-core80W


0.285 47.9 16 0.406 91.5x91.5x25.5

EP 6-core60W


0.280 45.7 16 0.406 91.5x91.5x25.5

Table 5-3. Intel® Xeon® Processor E5-1600/2600 v2 Product Families, Processor Reference Thermal Boundary Conditions (Square ILM/HS) (Sheet 2 of 2)

Processor Heatsink Technology6

ΨCA2

(oC/W)TLA1 (oC)

Airflow3

(CFM)

Delta P inch of

H2O (Pa)


(mm)

Thermal Solutions


Figure 5-1. 2U Square Heatsink Performance Curves Using Socket-LGA2011-0 TTV

Table 5-4. Performance Curve Data (Graphs in Fig 5-1 and 5-2)

Design Type σ α β γ A B Airflow(CFM)

1U Cu/Al 0.006 0.156 1.609 1.0366 2.41E-04 2.15E-02 16

2U Heatpipe 0.005 0.131 1.39 0.9862 6.91E-05 3.6E-03 26

Thermal Solutions


Equation 5-1.

Equation 5-2.

Figure 5-2. 1U Square Heatsink Performance Curves Using Socket-LGA2011-0 TTV

0.15

0.20

0.25

0.30

0.35

0.40

0.45

0.50

0 5 10 15 20 25 30 35 40 45 50

Airflow (CFM)

0.00

0.20

0.40

0.60

0.80

1.00

1.20

1.40

1.60

ψ c

a (

°C/W

)

∆P

(in

H20

)

Ψca = 0.156+1.609*(CFM)-1.0366=0.265°C/W

ΔP =2.41E-4x(CFM)2 + 2.15E-2x(CFM)=0.406 "H20 @16 CFM

Ψca mean( ) α βx CFM( ) γ–+=

ΔP Ax CFM( ) 2 Bx CFM( )+=

Thermal Solutions


5.1.2 Performance Targets - Narrow ILM/Heatsink ApplicationTable 5-5 and Table 5-6 provides boundary conditions and performance targets for 1U narrow heatsink used in conjunction with the narrow ILM for 8 core/6 core and 4 core processors respectively. These values are used to generate processor thermal specifications and to provide guidance for heatsink design.

All Boundary Conditions are specified at 35°C system ambient temperature and at sea level and Figure 5-3 shows ΨCA and pressure drop for the 1U heatsink versus the airflow provided. Best-fit equations are provided to prevent errors associated with reading the graph.

Boundary Conditions added for the narrow ILM/heatsink reference design have no impact on the released thermal profiles/Tcase specifications. There is no change to the Tcase specification.

Notes:1. Local ambient temperature of the air entering the heatsink.2. Max target (mean + 3 sigma) for thermal characterization parameter (Section 5.3.2). 3. Airflow through the heatsink fins with zero bypass. Max target for pressure drop (dP) measured in inches


Table 5-5. Intel® Xeon® Processor E5-1600/2600/4600 v1 Product Families, 8 Core/6 Core Processor Reference Thermal Boundary Conditions (Narrow ILM/HS)

TDP Heatsink Technology

ΨCA2

(oC/W)TLA1 (oC)

Airflow3

(CFM)

Delta P inch of

H2O (Pa)


(mm)

130W (1U)


0.323

43 14 0.347 70x106x25.595W (1U) 0.316

70W (1U) 0.300

60W (1U) 0.283

Table 5-6. Intel® Xeon® Processor E5-1600/2600/4600 v1 Product Families, 4 Core Processor Reference Thermal Boundary Conditions (Narrow ILM/HS)

4 Core Processor Heatsink Technology

ΨCA2

(oC/W)TLA1

(oC)Airflow3(

CFM)

Delta P (inch of

H2O)


(mm)


0.325 43 14 0.347 70x106x25.5

Thermal Solutions


Notes:1. Local ambient temperature of the air entering the heatsink.2. Max target (mean + 3 sigma) for thermal characterization parameter (Section 5.3.2). 3. Airflow through the heatsink fins with zero bypass. Max target for pressure drop (dP) measured in inches

H2O.4. Dimensions of heatsink do not include socket or processor.

General note: All heatsinks are Non-Direct Chassis Attach (DCA).

Table 5-7. Intel® Xeon® Processor E5-1600/2600 v2 Product Families, Processor Reference Thermal Boundary Conditions (Narrow ILM/HS)

Processor Heatsink Technology

ΨCA2

(oC/W)TLA1 (oC)

Airflow3

(CFM)

Delta P inch of

H2O (Pa)


(mm)

12-core 130W (1U)


0.331

43 14 0.347 70x106x25.5

12-core 115W (1U) 0.322

10-core 130W (1U) 0.346

8-core 130W (1U) 0.352

10-core 115W (1U) 0.339

10-core 95W (1U) 0.337

8-core 95W (1U) 0.337

10-core 70W (1U) 0.329

6-core 95W (1U) 0.358

4-core 95W (1U) 0.358

6-core 80W (1U) 0.350

4-core 80W (1U) 0.350

6-core 60W (1U) 0.334

Thermal Solutions


Equation 5-3.

Equation 5-4.

5.1.3 Reference Heatsink AssemblyThe assembly process for the reference heatsink begins with application of PCM45F TIM to improve conduction from the IHS. The recommended TIM to ensure full coverage of the IHS is 35x35 mm square with a thickness of 0.25 mm.

Next, position the heatsink such that the heatsink fins are parallel to system airflow. While lowering the heatsink onto the IHS, align the four captive screws of the heatsink to the four threaded studs on the ILM frame.

Figure 5-3. 1U Narrow Heatsink Performance Curves Using Socket-LGA2011-0 TTV

Table 5-8. Performance Curve Data

Design Type σ α β γ A B Airflow(CFM)

1U Cu/Al 0.006 0.151 1.254 0.874 5.12E-04 1.76E-02 14

Ψca mean( ) α βx CFM( ) γ–+=

ΔP Ax CFM( ) 2 Bx CFM( )+=

Thermal Solutions


Using a #2 Phillips driver, torque the four captive screws to 9 inch-pounds ±1 inch-pound.

Fastener sequencing (starting the threads on all four screws before torquing), may mitigate against cross-threading.

Compliance to Board Keepout Zones in Appendix A is assumed for this assembly process.

Square ILM/Heatsink assembly shown below in Figure 5-4. Narrow ILM/Heatsink assembly shown below in Figure 5-5.

Figure 5-4. Reference Square ILM/Heatsink Assembly

Thermal Solutions


5.2 Structural ConsiderationsMass of the reference heatsink and the target mass for heatsinks does not exceed 550 g (Server segment).

From Table 4-3, the Dynamic Compressive Load of 540N[121 lbf] max allows for designs that exceed 550 g[1.21lb] as long as the dynamic load does not exceed 540N[121 lbf]. The Static Compressive Load (Table 4-3) should also be considered in dynamic assessments.

The heatsink limit of 550 g[1.21lb] and use of ILM Frame have eliminated the need for Direct Chassis Attach retention (as used with previous Intel® Xeon® processors using socket LGA771).

Placement of board-to-chassis mounting holes also impacts board deflection and resultant socket solder ball stress. Customers need to assess shock for their designs as their heatsink retention, heatsink mass and chassis mounting holes may vary.

5.3 Thermal Design GuidelinesAdditional information regarding processor thermal features is contained in the appropriate datasheet.

Figure 5-5. Reference Narrow ILM/Heatsink Assembly

1U Narrow Heatsink

Processor Package

LGA2011 Socket

Motherboard

Backplate with Insulator

Independent Loading Mechanism (ILM) with Load Plate

Thermal Solutions


5.3.1 Intel® Turbo Boost TechnologyIntel® Turbo Boost Technology available on certain processor SKUs, opportunistically, and automatically, allows the processor to run faster than the marked frequency if the part is operating below its power, temperature and current limits.

Heatsink performance (lower ΨCA as described in Section 5.3.2) is one of several factors that can impact the amount of Intel Turbo Boost Technology frequency benefit. Intel Turbo Boost Technology performance is also constrained by ICC, and VCC limits.

Increased IMON accuracy may provide more Intel Turbo Boost Technology benefit on TDP limited applications, as compared to lower ΨCA, as temperature is not typically the limiter for these workloads. Voltage Regulator Module (VRM) and Enterprise Voltage Regulator-Down (EVRD) 12.0 Design Guidelines

With Intel Turbo Boost Technology enabled, the processor may run more consistently at higher power levels (but still within TDP), and be more likely to operate above TCONTROL, as compared to when Intel Turbo Boost Technology is disabled. This may result in higher acoustics.

5.3.2 Thermal Characterization ParameterThe case-to-local ambient Thermal Characterization Parameter (ΨCA) is defined by:

Equation 5-5.

ΨCA = (TCASE - TLA) / TDP

Where:TCASE = Processor case temperature (°C). For TCASE specification see Intel®

Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families External Design Specification (EDS) - Volume One.

TLA = Average ambient temperature entering the processor heat sink fin section (°C).

TDP = TDP (W) assumes all power dissipates through the integrated heat spreader. This inexact assumption is convenient for heatsink design. TTVs are often used to dissipate TDP. .

Equation 5-6.

ΨCA = ΨCS + ΨSA

Where:ΨCS = Thermal characterization parameter of the TIM (°C/W) is dependent

on the thermal conductivity and thickness of the TIM.ΨSA = Thermal characterization parameter from heatsink-to-local ambient

(°C/W) is dependent on the thermal conductivity and geometry of the heatsink and dependent on the air velocity through the heatsink fins.

Figure 5-6 illustrates the thermal characterization parameters.

Thermal Solutions


5.3.3 Fan Speed ControlIn server platforms, processors often share airflow provided by system fans with other system components such as chipset, memory and hard drives. As such, the thermal control features in chipset, memory and other components not covered in this document, should influence system fan speed control to reduce fan power consumption and help systems meet acoustic targets.

The addition of thermal sensors placed in the system (for example, on front panel or motherboard) to augment internal device sensors (for example, in processor, chipset and memory) will improve the ability to implement need-based fan speed control. The placement of system sensors in cooling zones, where each zone has dedicated fan(s), can improve the ability to tune fan speed control for optimal performance and/or acoustics.

System events such as fan or power supply failure, device events such as TCC Activation or THERMTRIP, and maintenance events such as hot swap time allowance, need to be comprehended to implement appropriate fan speed control to prevent undesirable performance or loss of data.

Tcontrol and its upper and lower limits defined by hysteresis, can be used to avoid fan speed oscillation and undesirable noise variations.

5.3.4 Thermal FeaturesMore information regarding processor thermal features is contained in the appropriate datasheet.

5.3.4.1 TCONTROL and DTS RelationshipImproved acoustics and lower fan power can be achieved by understanding the TCONTROL and DTS relationship, and implementing fan speed control accordingly.

Figure 5-6. Processor Thermal Characterization Parameter Relationships

Thermal Solutions


5.3.4.2 Sign Convention and Temperature Filtering

Digital Thermal Sensor (DTS) and Tcontrol are relative die temperatures offset below the Thermal Control Circuit (TCC) activation temperature. As such, negative sign conventions are understood. While DTS and Tcontrol are available over PECI and MSR, use of these values in fan speed control algorithms requires close attention to sign convention. See Table 5-10 for the sign convention of various sources.

Where a positive (+) sign convention is shown in Table 5-10, no sign bit is actually assigned, so writers of firmware code may mistakenly assign a positive sign convention in firmware equations. As appropriate, a negative sign should be introduced.

Where a negative (-) sign convention is shown in Table 5-10, a sign bit is assigned, so firmware code will read a negative sign convention in firmware equations, as desired.

DTS obtained thru MSR (PACKAGE_THERM_STATUS) is an instantaneous value. As such, temperature readings over short time intervals may vary considerably using this MSR. For this reason, DTS obtained thru PECI GetTemp() may be preferred since temperature filtering will provide the thermal trend.

5.3.5 Tcontrol ReliefFactory configured TCONTROL values are available in the appropriate Dear Customer Letter or may be extracted by issuing a Mailbox or an RDMSR instruction. See the appropriate datasheet for more information.

Due to increased thermal headroom based on thermal characterization on the latest processors, customers have the option to reduce TCONTROL to values lower than the factory configured values.

In some situations, use of TCONTROL Relief can reduce average fan power and improve acoustics. There are no plans to change Intel's specification or the factory configured TCONTROL values on individual processors.

To implement this relief, customers must re-write code to set TCONTROL to the reduced values provided in the table below. Implementation is optional. Alternately, the factory configured TCONTROL values can still be used, or some value between factory configured and Relief. Regardless of TCONTROL values used, BIOS needs to identify the processor type.

Table 5-9. TCONTROL and DTS Relationship

Condition Fan Speed Control

DTS ≤ TCONTROL Adjust fan speed to maintain DTS ≤ TCONTROL.

DTS > TCONTROL Adjust fan speed to keep TCASE at or below the TCASE based thermal profile in the EDS, or adjust fan speed to keep DTS at or below the DTS based thermal profile in the EDS.

Table 5-10. Sign Convention

MSR (BWG) PECI (EDS)

DTS (+) using PACKAGE_THERM_STATUS (22:16, Digital Readout)

(-) using GetTemp()

TCONTROL (+) using TEMPERATURE_TARGET (15:8, Temperature Control Offset)

(+) using Temperature Target Read from RdPkgConfig()

Thermal Solutions


Notes:1. Unless otherwise specified, Relief values apply to 2-socket and 4-socket SKUs. 1S = 1-socket, 4S = 4-socket.2. Relief values do not apply to Embedded (NEBS) SKUs.

Implementation of TCONTROL Relief above maintains Intel standards of reliability (based on modeling of the Intel Reference Design). Thermal Profile still applies. If PECI >= TCONTROL Relief, then the temperature must meet the TCASE or the DTS based Thermal Profile.

In some cases, use of Tcontrol Relief as the trigger point for fan speed control may result in excessive TCC activation. To avoid this, the adjusted trigger point for fan speed control (FSC) is defined as:

Tcontrol_FSC = - TCONTROL + Tcontrol_offset

Tcontrol_offset must be chosen such that Tcontrol_FSC < Tcontrol Relief. As such, Tcontrol_FSC is an earlier trigger point for fan speed control, as compared to Tcontrol Relief, and can be interpreted as overcooling. When overcooling to Tcontrol_FSC, margin as defined in Section 5.5.3 and Section 5.5.6 can be ignored. As compared to cooling to Tcontrol Relief, overcooling to Tcontrol_FSC:

• May increase frequency benefit from Intel Turbo Boost Technology as defined in Section 5.3.1.

• Will increase acoustics

• May result in lower wall power

Customers must characterize a Tcontrol_offset value for their system to meet their goals for frequency, acoustics and wall power.

Table 5-11. TCONTROL Relief for E5-1600/E5-2600/E5-4600 v1 Product Families

TDP, # Core TCONTROL Relief Max Core Frequency Factory Configured

150W 8C -6 3.10 GHz or Lower -10

135W 8C -6 2.90 GHz or lower -10

130W 8C NONE -6

130W 6C NONE -6

130W 8C, 1S -6 3.30 GHz or lower -10

115W 8C -6 2.60 GHz or lower -10

95W 8C -6 2.40 GHz or lower -10

95W 6C -6 2.50 GHz or lower -10

70W 8C -6 1.80 GHz or lower -10

60W 6C -6 2.00 GHz or lower -10

130W 4C, 1S NONE 3.60 GHz -18

130W 4C, 1S -6 3.00 GHz or lower -10

130W 4C -6 3.30 GHz or lower -8

95W 4C, 4S -6 2.00 GHz or lower -10

80W 4C -6 2.40 GHz or lower -10

80W 2C -6 3.00 GHz or lower -10

Thermal Solutions


For for E5-1600/E5-2600/E5-4600 v2 Product Families, Tcontrol_offset is programmable in the processor. For more information, see the Digital Thermal Sensor (DTS) Based Thermal Specifications and Overview.

5.3.6 Short Duration TCC Activation and Catastrophic Thermal Management for Intel® Xeon® Processor E5-1600/2600 / 4600 v1 and v2 Product FamiliesSystems designed to meet thermal capacity may encounter short durations of throttling, also known as TCC activation, especially when running nonsteady processor stress applications. This is acceptable and is functionally within the intended temperature control parameters of the processor. Such short duration TCC activation is not expected to provide noticeable reductions in application performance, and is typically within the normal range of processor to processor performance variation. Normal amounts of TCC activation occur at PECI values less than -0.25. Such occurrences may cause utilities or operating systems to issue error logs.

PECI = -0.25 indicates a catastrophic thermal failure condition in all studies conducted. As such, to help prevent loss of data, a soft shutdown can be initiated at PECI = -0.25. Since customer designs, boundary conditions, and failure scenarios differ, this guidance should be tested in the customer's system to prevent loss of data during shutdown. PECI command GetTemp() can be used to obtain non-integer PECI values. Similar guidance is expected to be available for Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Family v2 processors.

5.4 Absolute Processor Temperature and Thermal ExcursionIntel does not test any third party software that reports absolute processor temperature. As such, Intel cannot recommend the use of software that claims this capability. Since there is part-to-part variation in the TCC (thermal control circuit) activation temperature, use of software that reports absolute temperature can be misleading.

See the appropriate External Design Specification (EDS) for details regarding use of TEMPERATURE_TARGET register to determine the minimum absolute temperature at which the TCC will be activated and PROCHOT# will be asserted.

Under fan failure or other anomalous thermal excursions, Tcase may exceed the thermal profile for a duration totaling less than 360 hours per year without affecting long term reliability (life) of the processor. For more typical thermal excursions, Thermal Monitor is expected to control the processor power level as long as conditions do not allow the Tcase to exceed the temperature at which Thermal Control Circuit (TCC) activation initially occurred. Under more severe anomalous thermal excursions when the processor temperature cannot be controlled at or below this Tcase level by TCC activation, then data integrity is not assured. At some higher threshold, THERMTRIP_N will enable a shut down in an attempt to prevent permanent damage to the processor. Thermal Test Vehicle (TTV) may be used to check anomalous thermal excursion compliance by ensuring that the processor Tcase value, as measured on the TTV, does not exceed Tcase_max at the anomalous power level for the environmental condition of interest. This anomalous power level is equal to 75% of the Thermal Design Power (TDP) limit.

Thermal Solutions


This guidance can be applied to 150W, 135W, 130W, 115W, 95W, 80W, 70W, 60W Standard or Basic SKUs in the Intel® Xeon® processor E5-1600/E5-2600/E5-4600 v1 product families. Similar guidance is expected to be available for E5-1600/E5-2600/E5-4600 v2 product families.

5.5 DTS Based Thermal SpecificationNote: This section only applies to Intel® Xeon® Processor E5-1600/2600/4600 v1 Product

Families.

5.5.1 ImplementationProcessor heatsink design must still comply with the Tcase based thermal profile provided in section 5.1 of the Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 v1 Product Families Datasheet - Volume One. Heatsink design compliance can be determined with thermocouple and TTV as with previous processors.

The heat sink is sized to comply with the Tcase based thermal profile. Customers have an option to either follow processor based Tcase spec or follow the DTS based thermal specification. In some situations, implementation of DTS based thermal specification can reduce average fan power and improve acoustics as compared to the Tcase based thermal profile.

When all cores are active, a properly sized heatsink will be able to meet the DTS based thermal specification. When all cores are not active or when Intel Turbo Boost Technology is active, attempting to comply with the DTS based thermal specification may drive system fans to increased speed. In such situations, the TCASE temperature will be below the TCASE based thermal profile by design.

5.5.2 Considerations for Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 v2 Product Family ProcessorsThe Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 v2 Product Famiy processor will have new capabilities as compared to the Intel Xeon Processor E5-1600/E5-2600/E5-4600 v1 Product Family. For example, the v2 processor has a new Package Configuration Space (PCS) command to read margin (M) from the processor: RdPkgConfig(), Index 10. For the Intel Xeon Processor E5-1600/E5-2600/E5-4600 Product Family v1, margin (M) must be calculated in firmware. In the following sections, implementation details specified for the Intel Xeon Processor E5-1600/E5-2600/E5-4600 v1 Product Family can also be used for the Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 v2 Product Family processor.

For more information regarding the differences between the Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 v1 Product Family and the Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 v2Product Family see the Platform Digital Thermal Sensor (DTS) Based Thermal Specifications and Overview.

5.5.3 DTS Based Thermal Profile, Tcontrol and Margin for the Intel Xeon Processor E5-1600/E5-2600/E5-4600 v1 Product FamilyCalculation of the DTS based thermal specification is based on both Tcontrol and the DTS Based Thermal Profile (TDTS):

TDTS = min[TLA + Ψpa * P * F, TEMPERATURE_TARGET [23:16] - Tcc_Offset]

Thermal Solutions


Where TLA and Ψpa are the intercept and slope terms from the TDTS equations in section 5.1 of the Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 v1 Product Families Datasheet - Volume One. To implement the DTS based thermal specification, these equations must be programmed in firmware. Since the equations differ with processor SKU, SKUs can be identified by TDP, Core Count, and a profile identifier (CSR bits). For associated commands, see Platform Digital Thermal Sensor (DTS) Based Thermal Specifications and Overview.

Power (P) is calculated in Section 5.5.4. As power dynamically changes, the specification also changes, so power and TDTS calculations are recommended every 1 second.

Correction factor (F) compensates for the error in power monitoring. The current estimate for F is 0.95.

The Tcontrol portion of the DTS based thermal specification is a one time calculation:Tcontrol_spec = TEMPERATURE_TARGET [23:16] - Tcontrol + Tcontrol_offset

Tcontrol is defined in Section 5.3.3. Tcontrol_offset is defined in Section 5.3.5

The final DTS based thermal specification is the maximum of both:TDTS_max = max[Tcontrol_spec , TDTS]

The margin (M) between the actual die temperature and the DTS based thermal specification is used in the fan speed control algorithm. When M < 0, increase fan speed. When M > 0, fan speed may decrease.

M = TDTS_max - TsensorORM = TDTS_ave – Tsensor

Tsensor represents the absolute temperature of the processor as power changes: Tsensor = TEMPERATURE_TARGET [23:16] + DTS

TDTS_ave is defined in Section 5.5.5.

TEMPERATURE_TARGET [23:16], the temperature at which the processor thermal control circuit activates, is a one time PECI readout: RdPkgConfig(), Temperature Target Read, 23:16.

DTS, the relative temperature from thermal control circuit activation, is negative by definition, and changes instantaneously. DTS command info is given in Section 5.3.3.

5.5.4 Power Calculation for the Intel Xeon Processor E5-1600/E5-2600/E5-4600 v1 Product FamilyTo implement DTS based thermal specification, average power over time must be calculated:

P = (E2 - E1) / (t2 - t1)

Where:t1 = time stamp 1t2 = time stamp 2E1 = Energy readout at time t1E2 = Energy readout at time t2

Thermal Solutions


The recommended time interval between energy readings is 1 second. This helps ensure the power calculation is accurate by making the error between time stamps small as compared to the duration between time stamps.

For details regarding energy readings, see Platform Digital Thermal Sensor (DTS) Based Thermal Specifications and Overview.

5.5.5 Averaging the DTS Based Thermal Specification for the Intel Xeon E5-1400/E5-2600/E5-4600 v1 Product FamilyAveraging the DTS Based Thermal Specification helps keep the rate of change of the temperature specification on the same scale as the actual processor temperature, and helps avoid rapid changes in fan speed when power changes rapidly.

An exponential average of the specification can be calculated using a two time constant model:

TDTS_f = αf x Δt x TDTS_max + TDTS_f_previous x (1- αf x Δt)TDTS_s = αs x Δt x TDTS_max + TDTS_s_previous x (1- αs x Δt)TDTS_ave = C x TDTS_f x (1-C) x TDTS_s

Where: TDTS_max is the instantaneous specTDTS_f and TDTS_s are the fast and slow time averagesTDTS_ave is the final two time constant average specificationαf and αs are the time constant coefficientsC is a scale factorΔt is the scan rate and is recommended to be approximately 1 second

Table 5-12 below shows the initial coefficients recommended for averaging. These values may change per processor SKU. Customers should tune these coefficients based on their thermal solutions.

5.5.6 Capabilities for the Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 v2 Product FamilyFor Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 v2 Product Family, the intercept and slope terms from the TDTS equations (TLA, Ψpa), as defined in Section 5.5.3, are stored in the processor. This allows margin (M) to be reported by the processor. The PECI command for margin (M) will be RdPkgConfig(), Index 10.

M < 0; gap to spec, fan speed must increaseM > 0; margin to spec, fan speed may decrease

Use of RdPkgConfig(), Index 10 with the Intel Xeon E5-1600/E5-2600/E5-4600 v1 Product Family will return an illegal command.

Table 5-12. Averaging Coefficients

Heatsink Performance αf (1/s) αs (1/s) C Comment

Low 1.0 0.04 0.30 Based on typical processor

Medium 1.0 0.07 0.30 Based on typical processor

High 1.0 0.10 0.40 Based on typical processor

Thermal Solutions


For Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Family v2, coefficients (αf, αs), scale factor (C), and correction factor (F) will be factory configured.

Thermal Solutions


Quality and Reliability Requirements


6 Quality and Reliability Requirements

6.1 Use ConditionsIntel evaluates reliability performance based on the use conditions (operating environment) of the end product by using acceleration models.

The use condition environment definitions provided in Table 6-1 and Table 6-2 are based on speculative use condition assumptions, and are provided as examples only.

Based on the system enabling boundary condition, the solder ball temperature can vary and needs to be comprehended for reliability assessment.

Table 6-1. Server Use Conditions Environment (System Level)

Use Environment Speculative Stress Condition

Example Use Condition

Example 7-Yr Stress Equiv.

Example 10-Yr Stress Equiv.

Slow small internalgradient changes dueto external ambient(temperature cycle or externally heated)Fast, large gradienton/off to maxoperating temp.(power cycle orinternally heatedincluding power savefeatures)

Temperature Cycle ΔT = 35 - 44°C(solder joint)

550-930 cyclesTemp Cycle (-25°C to 100°C)

780-1345 cyclesTemp Cycle (-25°C to 100°C)

High ambient moisture during low-power state (operating voltage)

THB/HAST T = 25 –30°C85%RH(ambient)

110-220 hrs at110°C 85%RH

145-240 hrs at 110°C 85%RH

High Operatingtemperature and short duration hightemperatureexposures

Bake T = 95 - 105°C(contact)

700 – 2500 hrs at125°C

800 – 3300 hrs at125°C



6.2 Intel Reference Component ValidationIntel tests reference components individually and as an assembly on mechanical test boards and assesses performance to the envelopes specified in previous sections by varying boundary conditions.

While component validation shows a reference design is tenable for a limited range of conditions, customers need to assess their specific boundary conditions and perform reliability testing based on their use conditions.

Intel reference components are also used in board functional tests to assess performance for specific conditions.

6.2.1 Board Functional Test SequenceEach test sequence should start with components (baseboard, heatsink assembly, and so on) that have not been previously submitted to any reliability testing.

Prior to the mechanical shock & vibration test, the units under test should be preconditioned for 72 hours at 45ºC. The purpose is to account for load relaxation during burn-in stage.

The test sequence should always start with a visual inspection after assembly, and BIOS/Processor/memory test. The stress test should be then followed by a visual inspection and then BIOS/processor/memory test.

Table 6-2. Server Use Conditions Environment (System Level)

Use Environment Speculative Stress Condition Example Use

Condition

Shipping and Handling

Mechanical Shock• System-level• Unpackaged• Trapezoidal• 25 g• velocity change is based on packaged weight

Total of 12 drops per system:• 2 drops per axis• ± direction

Product Weight (lbs) Non-palletized Product Velocity Change (in/sec)

< 20 lbs 20 to > 40 40 to > 80 80 to < 100 100 to < 120≥120

250225205175145125

Change in velocity is based upon a 0.5 coefficient of restitution.

Shipping and Handling

Random Vibration• System Level• Unpackaged• 5 Hz to 500 Hz• 2.20 g RMS random• 5 Hz @ 0.001 g2/Hz to 20 Hz @ 0.01 g2/Hz (slope up)• 20 Hz to 500 Hz @ 0.01 g2/Hz (flat)• Random control limit tolerance is ± 3 dB

Total per system:• 10 minutes per axis• 3 axes



6.2.2 Post-Test Pass Criteria ExamplesThe post-test pass criteria examples are:1. No significant physical damage to the heatsink and retention hardware. 2. Heatsink remains seated and its bottom remains mated flat against the IHS

surface. No visible gap between the heatsink base and processor IHS. No visible tilt of the heatsink with respect to the retention hardware.

3. No signs of physical damage on baseboard surface due to impact of heatsink.4. No visible physical damage to the processor package.5. Successful BIOS/Processor/memory test of post-test samples.6. Thermal compliance testing to demonstrate that the case temperature specification

can be met.

6.2.3 Recommended BIOS/Processor/Memory Test ProceduresThis test is to ensure proper operation of the product before and after environmental stresses, with the thermal mechanical enabling components assembled. The test shall be conducted on a fully operational baseboard that has not been exposed to any battery of tests prior to the test being considered.

Testing setup should include the following components, properly assembled and/or connected:

• Appropriate system baseboard.• Processor and memory.• All enabling components, including socket and thermal solution parts.

The pass criterion is that the system under test shall successfully complete the checking of BIOS, basic processor functions and memory, without any errors. Intel PC Diags is an example of software that can be utilized for this test.

6.3 Material and Recycling RequirementsMaterial shall be resistant to fungal growth. Examples of non-resistant materials include cellulose materials, animal and vegetable based adhesives, grease, oils, and many hydrocarbons. Synthetic materials such as PVC formulations, certain polyurethane compositions (for example, polyester and some polyethers), plastics which contain organic fillers of laminating materials, paints, and varnishes also are susceptible to fungal growth. If materials are not fungal growth resistant, then MIL-STD-810E, Method 508.4 must be performed to determine material performance.Cadmium shall not be used in the painting or plating of the socket.CFCs and HFCs shall not be used in manufacturing the socket.

Any plastic component exceeding 25 gm should be recyclable per the European Blue Angel recycling standards.

Supplier is responsible for complying with industry standards regarding environmental care as well as with the specific standards required per Supplier's region. More specifically, Supplier is responsible for compliance with the European regulations related to restrictions on the use of Lead and Bromine containing flame-retardants. Legislation varies by geography, European Union (RoHS/WEEE), China, California, and so forth.

The following definitions apply to the use of the terms lead-free, Pb-free, and RoHS compliant.



Halogen flame retardant free (HFR-Free) PCB: In future revisions of this document, Intel will be providing guidance on the mechanical impact to using a HFR-free laminate in the PCB. This will be limited to workstations.

Lead-free and Pb-free: Lead has not been intentionally added, but lead may still exist as an impurity below 1000 ppm.

RoHS compliant: Lead and other materials banned in RoHS Directive are either (1) below all applicable substance thresholds as proposed by the EU or (2) an approved/pending exemption applies.

Note: RoHS implementation details are not fully defined and may change.§

Mechanical Drawings


A Mechanical Drawings

Table A-1 lists the Mechanical drawings included in this appendix.

Table A-1. Mechanical Drawing List

Description Figure

Square ILM Board Keepouts 1 of 4 Figure A-1




Narrow ILM Board Keepouts 1 of 4 Figure A-5




2U Square Heatsink Assembly Without TIM 1 of 2 Figure A-9

2U Square Heatsink Assembly Without TIM 2 of 2 Figure A-10

2U Square Heatsink Volumetric 1 of 2 Figure A-11

2U Square Heatsink Volumetric 2 of 2 Figure A-12

Heatsink Screw M4x0.7 Figure A-13

Heatsink Compression Spring Figure A-14

Heatsink Retaining Ring Figure A-15

Heatsink Delrin Spacer Figure A-16

1U Square Heatsink Assembly 1 of 2 Figure A-17

1U Square Heatsink Assembly 2 of 2 Figure A-18

1U Square Heatsink Geometry 1 of 2 Figure A-19

1U Square Heatsink Geometry 2 of 2 Figure A-20

Heatsink Cup For Spring Retention Figure A-21

1U Narrow Heatsink Assembly 1 of 2 Figure A-22

1U Narrow Heatsink Assembly 2 of 2 Figure A-23

1U Narrow Heatsink Geometry 1 of 2 Figure A-24

1U Narrow Heatsink Geometry 2 of 2 Figure A-25

Mechanical Drawings


Figure A-1. Square ILM Board Keepouts 1 of 4

13

45

67

8

BCD A

12

34

56

78

BCD A

2X 4

6.0

SOC

KET

ILM

H

OLE

PAT

TER

N

2X 6

9.2

SOC

KET

ILM

HO

LE P

ATTE

RN

2200

MIS

SIO

N C

OLL

EGE

BLVD

.R

P.O

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Mechanical Drawings



Mechanical Drawings



13

45

67

8

BCD A

12

34

56

78

BCD A

2X 2

3.40

2200

MIS

SIO

N C

OLL

EG

E B

LVD

.R

P.O

. BO

X 5

8119

SA

NTA

CLA

RA

, CA

950

52-8

119

2X 5

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6.50

14.0

R T

YP

1.00

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Mechanical Drawings



13

45

67

8

BCD A

12

34

56

78

BCD A

76.5

081

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2200

MIS

SIO

N C

OLL

EG

E B

LVD

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P.O

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X 5

8119

SA

NTA

CLA

RA

, CA

950

52-8

119

MIN

97.0

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04.

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3

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Mechanical Drawings


Figure A-5. Narrow ILM Board Keepouts 1 of 4

Mechanical Drawings



Mechanical Drawings



Mechanical Drawings



Mechanical Drawings


Figure A-9. 2U Square Heatsink Assembly Without TIM 1 of 2

13

45

67

8

BCD A

12

34

56

78

BCD A2200 MISSION COLLEGE BLVD.

P.O. BOX 58119

SANTA CLARA, CA 95052-8119

R

E95133

1B

DWG. NO

SHT.

REV

SHEET 1 OF 2

DO NOT SCALE DRAWING

SCALE: 1.500

BE95133

DREV

DRAWING NUMBER

SIZE

ROMLEY 2U HS ASSEMBLY,

DIE CAST BASES ONLY

TITLE

PTMI

DEPARTMENT

SEE NOTES

SEE NOTES

FINISH

MATERIAL

DATE

APPROVED BY

--

3/29/10

D. LLAPITAN

DATE

CHECKED BY

3/29/10

N. ULEN

DATE

DRAWN BY

3/29/10

N. ULEN

DATE

DESIGNED BY

UNLESS OTHERWISE SPECIFIED

INTERPRET DIMENSIONS AND TOLERANCES

IN ACCORDANCE WITH ASME Y14.5-1994

DIMENSIONS ARE IN MILLIMETERS

TOLERANCES:

.X �# 0.5 Angles �# 1.0�$

.XX �# 0.25

.XXX �# 0.127

THIRD ANGLE PROJECTION

PARTS LIST

DESCRIPTION

PART NUMBER

ITEM NO

QTY

ROMLEY 2U HS ASSEMBLY

E95133-002

TOP

ROMLEY 2U HS VOLUMETRIC

E95132-002

11

SPRING, COMPRESSION, PRELOADED

E86113-001

24

ROMLEY HS SCREW, M4 X 0.7

E91775-001

34

DELRIN RETAINER/SPACER

G13624-001

44

ROMLEY HS RETAINING RING

E75155-001

54

REVISION HISTORY

ZONE

REV

DESCRIPTION

DATE

APPROVED

-A

RELEASE FOR SUPPLIER FEEDBACK, DIE CAST VER ONLY

3/29/10

-

BROLLED PART TO -002

UPDATED VOLUMETRIC TO -002

UPDATED SCREW TO CLIENT VERSION

ADDED DELRIN SPACER TO ASSEMBLY

7/21/10

THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS

MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.

NOTES:

1. THIS DRAWING TO BE USED IN CORRELATION WITH

SUPPLIED 3D DATABASE FILE. ALL DIMENSIONS AND TOLERANCES

ON THIS DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE.

2. PRIMARY DIMENSIONS STATED IN MILLIMETERS,

[BRACKETED] DIMENSIONS STATED IN INCHES.

CRITICAL TO FUNCTION DIMENSION.

3. ALL DIMENSION AND TOLERANCES PER ANSI Y14.5-1994.

4. REMOVE ALL BURRS, SHARP EDGES, GREASES, AND/OR

SOLVENTS AFTER FINAL ASSEMBLY.

5 PART NUMBER AND TORQUE SPEC MARK.

PLACE PART NUMBER AND TORQUE SPEC IN ALLOWABLE AREA,

EITHER SIDE OF PART WHERE SHOWN. BELOW PART NUMBER

CALLOUT, PLACE THE FOLLOWING TEXT:

"RECOMMENDED SCREW TORQUE: 8 IN-LBF"

THE MARK CAN BE AN INK MARK, LASER MARK, PUNCH MARK

OR ANY OTHER PERMANENT MARK THAT IS READABLE AT 1.0X

MAGNIFICATION.

8 CRITICAL TO FUNCTION DIMENSION.

9 INSTALL E-RING SO BURR/PUNCH DIRECTION/SHARP

EDGE IS AWAY FROM DELRIN SPACER.

9

2

3

4

1

5

5

Mechanical Drawings


Figure A-10. 2U Square Heatsink Assembly Without TIM 2 of 2

13

45

67

8

BCD A

12

34

56

78

BCD A

AA

2200 MISSION COLLEGE BLVD.

P.O. BOX 58119


R

(9.36

)[0.369]

SPRING PRELOAD

ASSEMBLY HEIGHT

E95133

2B

DWG. NO

SHT.

REV



SHEET 2 OF 2


SCALE: 1.500

PTMI

BE95133

DREV

DRAWING NUMBER

SIZE

DEPARTMENT

ASSEMBLY DETAILS

SECTION A-A

SEE DETAIL A

DETAIL A

SCALE 10.000

1

2

3

59 E-RING PUNCH DIRECTION

AWAY FROM THIS SURFACE

4

Mechanical Drawings


Figure A-11. 2U Square Heatsink Volumetric 1 of 2

Mechanical Drawings


Figure A-12. 2U Square Heatsink Volumetric 2 of 2

13

45

67

8

BCD A

12

34

56

78

BCD A

AA


P.O. BOX 58119


R

38.00�#0.50

1.496�#0.019

[]

38.00�#0.50

1.496�#0.019

[]

80.00

[3.150]

80.00

[3.150]

1.00

0.039

[]

ORDINATE BASELINE

0.00

0.000

[]

BASE THICKNESS

9

4.50�#0.13

0.177�#0.005

[]

5.50

0.217

[]

9

7.95+0.13

0

0.313+0.005

-0.000

[]

9

5.40+0.13

0

0.213+0.005

-0.000

[]

10.450

[0.4114]

E95132

2B

DWG. NO

SHT.

REV



SHEET 2 OF 2


SCALE: 1.500

PTMI

BE95132

DREV

DRAWING NUMBER

SIZE

DEPARTMENT

FLATNESS ZONE,

SEE NOTE 7

BOTTOM VIEW

9

9AIRFLOW DIRECTION

AIRFLOW DIRECTION

TOP VIEW

SECTION A-A

SEE DETAIL B

SEE DETAIL C

DETAIL B

SCALE 10.000

0.5 x 45�$

ALL AROUND

DETAIL C

SCALE 6.000

3.0 [0.118] X 45�$ TYP

SEE NOTE 8

0.077 [0.0030]

0.1 [0.00]

ABC

Mechanical Drawings


Figure A-13. Heatsink Screw M4x0.7

13

45

67

8

BCD A

12

34

56

78

BCD A

A

A


P.O. BOX 58119


R

5

MAJOR DIA,

M4 x 0.7 FULL LENGTH

TOLERANCE CLASS 6G

3.96�#0.06

0.156�#0.002

[]

7.80

[0.307]

6.00

[0.236]

5 7

5.10�#0.05

0.201�#0.001

[]

R0.20

0.008

[]

5

12.50�#0.13

0.492�#0.005

[]

0.00

0.000

[]

3.50

0.138

[]

2X

6

4.06�#0.17

0.160�#0.006

[]

6

2.00�#0.32

0.079�#0.012

[]

4X 0.72

MIN. 6

[0.028]

5 7

5.10�#0.05

0.201�#0.001

[]

5 8

3.250+0.075

0

0.128+0.002

-0.000

[]

8

10.96

0.43

[]

5 8

11.66�#0.13

0.459�#0.005

[]

(5.58

)[0.220]

5

3.50�#0.20

0.138�#0.007

[]

5.100

[0.2008]

(12.50

)[0.492]

E91775

1B

DWG. NO

SHT.

REV

SHEET 1 OF 1


SCALE: 1

BE91775

DREV

DRAWING NUMBER

SIZESCREW, M4 X 0.7, PHILLIPS #2

TITLECPE/CMTE

DEPARTMENT

SEE NOTES

SEE NOTES

FINISH

MATERIAL

FEB-02-10

T.AULT

DATE

APPROVED BY

FEB-02-10

A.VALPIANI

DATE

CHECKED BY

FEB-02-10

K.KOZYRA

DATE

DRAWN BY

FEB-02-10

K.KOZYRA

DATE

DESIGNED BY





TOLERANCES:

.X �# .5 Angles �# 1.0�$

.XX �# 0.25

.XXX �# 0.127


REVISION HISTORY

ZONE

REV

DESCRIPTION

DATE

APPROVED

-A

ORIGINAL RELEASE

FEB-02-10

T.AULT

B-5

BFULL THREAD LENGTH GROOVE ADDED

APR-14-10

K.KOZYRA



NOTES:

1. THIS DRAWING TO BE USED IN CONJUNCTION WITH SUPPLIED

3D DATABASE. ALL DIMENSIONS AND TOLERANCES ON THIS

DRAWING TAKE PRECEDENCE OVER SUPPLIED DATABASE.

2. PRIMARY DIMENSIONS STATED IN MILLIMETERS.


3. MATERIAL: 18-8 STAINLESS STEEL; AISI 303, 304, 305; JIS SUS304;

OR EQUIVALENT. MINIMUM YIELD STRENGTH = 90,000 PSI.

4. TORQUE TO FAILURE SHALL BE NO LESS THAN 20 IN-LBF,

WITH A -3 SIGMA DISTRIBUTION

5 CRITICAL TO FUNCTION DIMENSION

6 PHILLIPS PATTERN PER ASME B18.6.3-1998

7 INSPECT SHAFT DIAMETER IN THESE LOCATIONS

8 E-RING GROOVE DIMENSIONS SHALL CONFORM TO JIS B 2805 STANDARDS

9. THREAD FORMING SHALL CONFORM TO ASME B1.13M-2005 OR JIS X XXXX STANDARDS

FOR REVIEW ONLY

M4 X 0.7 FULL LENGTH

EXTERNAL THREAD

TOLERANCE CLASS 6G

SEE DETAIL A

SEE DETAIL B

CRITICAL INTERFACE FEATURE:

4THIS SHOULDER MUST

BE SQUARE

0.40x45�$

TYPE 1, CROSS RECESSED

#2 DRIVER 6

DETAIL A

SCALE 40.000

0.5 X 45�$

SECTION A-A

INNER CORNERS OF

E-RING GROOVE MUST

BE SQUARE,

R0.10 MAX

DETAIL B

SCALE 40.000

Mechanical Drawings


Figure A-14. Heatsink Compression Spring

13

45

67

8

BCD A

12

34

56

78

BCD A

AA


P.O. BOX 58119


R

12.70

[0.500]

FREE HEIGHT

O.D. 7.62+0.08

-0.13

0.300+0.003

-0.005

[]

1.100

[0.0433]

WIRE DIA.

5.50+0.30

0

0.217+0.011

-0.000

[]

I.D. 5.42+0.08

-0.13

0.213+0.003

-0.005

[]

E86113

1C

DWG. NO

SHT.

REV

SHEET 1 OF 1


SCALE: 1

CE86113

DREV

DRAWING NUMBER

SIZE

SPRING, COMPRESSION, PRE-LOAD

TITLE

EASD / PTMI

DEPARTMENT

SEE NOTES

SEE NOTES

FINISH

MATERIAL

DATE

APPROVED BY

11/16/09

D. LLAPITAN

DATE

CHECKED BY

11/15/09

N. ULEN

DATE

DRAWN BY

11/15/09

N. ULEN

DATE

DESIGNED BY





TOLERANCES:

.X �# .5 Angles �# 1.0�$

.XX �# 0.25

.XXX �# 0.127


REVISION HISTORY

ZONE

REV

DESCRIPTION

DATE

APPROVED

-A

SUPPLIER FEEDBACK

11/15/09

-

BALL SPRING SPECIFICATIONS UPATED. SEE NOTE 3.

12/08/09

NOTE 3

CUPDATED SPRING STIFFNESS AND COIL INFO

01/14/10



NOTES:






3. SPRING RATE: K=15.80 +/- 1.5 N/MM [K=90.2 +/- 9.0 LBF/IN]

4 FREE HEIGHT: 12.7 MM [0.500 IN]

SOLID HEIGHT: 5.5 MM [0.217 IN]

WIRE DIAMETER: 1.1 MM [0.043 IN]

TOTAL COILS: 5.0 (ONLY TOTAL COILS SHOWN IN THIS DRAWING)

ACTIVE COILS: 3.0

ENDS: GROUND & CLOSED

TURN: LEFT HAND (AS SHOWN IN VIEWS)

MATERIAL: MUSIC WIRE, ASTM A228 OR JIS-G-3522

FINISH: ZINC PLATED

OTHER GEOMETRY: PER THIS DRAWING


4

4

4

FREE HEIGHT

SOLID HEIGHT

4

SECTION A-A

Mechanical Drawings


Figure A-15. Heatsink Retaining Ring

13

45

67

8

BCD A

12

34

56

78


P.O. BOX 58119


R

5

3.20 0

-0.12

0.126+0.000

-0.004

[]

5

0.60�#0.04

0.0236�#0.0015

[]

MAX.

5.20�#0.10

0.205�#0.003

[]

4X R

MIN.

0.50

0.020

[]

5

7.00�#0.20

0.276�#0.007

[]

5

2.80�#0.30

0.110�#0.011

[]

E75155

1C

SHEET 1 OF 1


SCALE: 1

CE75155

DREV

DRAWING NUMBER

SIZE


TITLE

EASD / PTMI

DEPARTMENT

SEE NOTES

SEE NOTES

FINISH

MATERIAL

DATE

APPROVED BY

06/19/09

C. HO

DATE

CHECKED BY

06/19/09

N. ULEN

DATE

DRAWN BY

06/19/09

N. ULEN

DATE

DESIGNED BY





TOLERANCES:

.X �# .5 Angles �# 1.0�$

.XX �# 0.25

.XXX �# 0.127


REVISION HISTORY

ZONE

REV

DESCRIPTION

DATE

APPROVED

-A

RELEASE FOR THERMAL TARGET SPECIFICATION

06/19/09

-

C5B6C5B4

BO.D. TOLERANCE +/-0.10 TO +/-0.20

SNAP DIAMETER 3.175 TO 3.20, PLUS TOLS

I.D. 5.18 TO 5.20

THICKNESS 0.64 +/-.05 TO 0.60 +/- .04

07/07/09

C6

NOTE 6

NOTE 5

CADDED RING GAP DIMENSION 2.8 +/- 0.3

ADDED NOTE 6 FOR OFF THE SHELF COMPLIANCE

MODIFIED NOTE 5 TO INDICATE CTF MEASUREMENTS BE

TAKEN AFTER ONE (1) INSTALLATION

11/18/09



NOTES:






3. MATERIAL: SPRING STEEL OR STAINLESS STEEL

YIELD STRENGTH >= 90000 PSI (620 MPA)

5

MODULUS OF ELASTICITY >= 28000 KSI (193 GPA)

5 MATERIAL PROPERTIES MUST BE MET AFTER FINAL

E-RING MANUFACTURING PROCESS

4. FINISH: NI PLATED IF NOT STAINLESS


CTF DIMENSIONS SHOULD BE VERIFIED AFTER ONE (1) INSTALLATION

AND REMOVAL FROM THE GROOVE GEOMETRY SPECIFIED IN DRAWING E86111.

6. E-RING SPECIFICATION JIS B 2805 APPLIES FOR OFF THE

SHELF COMPONENT COMPLIANCE.

Mechanical Drawings


Figure A-16. Heatsink Delrin Spacer

A

4

B

3

CD

43

21

A

2

C

1

D

AA


P.O. BOX 58119


R

9.10

.70

1.10

.60

5.40�#.10

7.70�#.10

X 45�$

.50

G13624 1 ADWG. NO SHT. REV

THIS DRAWING CONTAINS INTEL CORPORAT

ION CONFIDENTIAL INFORMATION. IT IS

DISCLOSED IN CONFIDENCE AND ITS CONT

ENTS

MAY NOT BE DISCLOSED, REPRODUCED, DI

SPLAYED OR MODIFIED, WITHOUT THE PRI

OR WRITTEN CONSENT OF INTEL CORPORAT

ION.

SHEET 1 OF 1


SCALE: 8.000

AG13624

CREV

DRAWING NUMBER

SIZE

DELRIN RETAINER, SKT R

TITLE

PTMI

DEPARTMENT

SEE NOTES

SEE NOTES

FINISH

MATERIAL

DATE

APPROVED BY

7/21/10

D. LLAPITAN

DATE

CHECKED BY

7/21/10

N. ULEN

DATE

DRAWN BY

7/21/10

N. ULEN

DATE

DESIGNED BY



IN ACCORDANCE WITH ASME Y14.5M-1994

DIMENSIONS ARE IN MM

TOLERANCES:

.X �# .25 Angles �# .5�$

.XX �# .20

.XXX �# .125


PARTS LIST

DESCRIPTION

PART NUMBER

ITEM NO

QTY

RTNR, E-RING, DELRIN, SNB

G13624-001

TOP

REVISION HISTORY

ZONE

REV

DESCRIPTION

DATE

APPR

-A

RELEASE FOR SUPPLIER FEEDBACK

7/21/10

-

6

NOTES; UNLESS OTHERWISE SPECIFIED:

1. REFERENCE DOCUMENTS

99-0007-001 - INTEL WORKMANSHIP STANDARD - SYSTEMS MANUFACTURING

18-1201 - INTEL ENVIRONMENTAL PRODUCT CONTENT SPECIFICATION FOR

SUPPLIERS & OUTSOURCED MANUFACTURERS (FOUND ON

EHS WEBSITE - https://supplier.intel.com/static/EHS/)

2. INTERPRET DIMENSIONS PER ASME Y14.5M-1994.

FEATURES NOT SPECIFIED ON DRAWING SHALL BE CONTROLLED BY 3D CAD

DATABASE. IF PROVIDED, MEASUREMENTS SHOULD REFERENCE DATUM

-A- PRIMARY, DATUM

-B- SECONDARY, AND

-C- TERTIARY.

3. MATERIAL: MAY USE INTEL ENGINEERING APPROVED EQUIVALENT.

ALL SUBSTANCES IN THIS PART MUST CONFORM TO INTEL ENVIRONMENTAL

PRODUCT SPECIFICATION (BS-MTN-0001).

A) DELRIN ACETAL RESIN. 500P NC010.

B) PIGMENT: EAGLE 7058 (1%)

C) COLOR: BLACK.

4. PART MUST COMPLY WITH INTEL WORKMANSHIP STANDARD (99-0007-001).

PART SHALL BE FREE OF OIL AND DEBRIS.

FINISH: UNSPECIFIED SURFACES MUST CONFORM WITH CLASS C REQUIREMENTS.

5 CRITICAL TO FUNCTION DIMENSION (CTF).

6 NO GATING ALLOWED ON THESE COMPONENT MATING SURFACES.

SECTION A-A

6

Mechanical Drawings


Figure A-17. 1U Square Heatsink Assembly 1 of 2

13

45

67

8

BCD A

12

34

56

78


P.O. BOX 58119


R

E97839

1B

DWG. NO

SHT.

REV

SHEET 1 OF 2


SCALE: 1.500

BE97839

DREV

DRAWING NUMBER

SIZE


TITLE

PTMI

DEPARTMENT

SEE NOTES

SEE NOTES

FINISH

MATERIAL

DATE

APPROVED BY

--

5/5/10

D. LLAPITAN

DATE

CHECKED BY

5/5/10

N. ULEN

DATE

DRAWN BY

5/5/10

N. ULEN

DATE

DESIGNED BY





TOLERANCES:

.X �# 0.5 Angles �# 1.0�$

.XX �# 0.25

.XXX �# 0.127


PARTS LIST

DESCRIPTION

PART NUMBER

ITEM NO

QTY


E97839-002

TOP

ROMLEY 1U HS GEOMETRY

E97838-001

11

CUP, SPRING RETENTION, WITH SKIRT

E97837-002

24


E86113-001

34


E91775-001

44


E75155-001

54


G13624-001

64

REVISION HISTORY

ZONE

REV

DESCRIPTION

DATE

APPROVED

-A

INITIAL SUPPLIER RELEASE

5/5/10

-

BROLLED ASSEMBLY TO -002

UPDATED CUP TO -002



8/12/10



NOTES:

















MAGNIFICATION.

6 PRESS FIT BOTTOM OF CUP LIP FLUSH TO TOP SURFACE OF HEAT SINK.

7 MINIMUM PUSH OUT FORCE = 30 LBF PER CUP.



EDGE IS AWAY FROM BASE CUP SURFACE.

10 ALLOWABLE PROTRUSION OF CUP FROM BASE.

9

2

3

4

5

1

6

5

Mechanical Drawings


Figure A-18. 1U Square Heatsink Assembly 2 of 2

13

45

67

8

BCD A

12

34

56

78

BCD A

AA


P.O. BOX 58119


R

8

1.00+0.13

0

0.039+0.005

-0.000

[]

(4X 9.36

)[0.369]

SPRING PRELOAD

ASSEMBLY HEIGHT

10

0.00�#0.35

0.000�#0.013

[]

E97839

2B

DWG. NO

SHT.

REV



SHEET 2 OF 2


SCALE: 1.500

PTMI

BE97839

DREV

DRAWING NUMBER

SIZE

DEPARTMENT

PRESS FIT DETAILS

ASSEMBLY DETAILS

E-RING ORIENTATION DETAILS

SECTION A-A

SEE DETAIL A

SEE DETAIL B

DETAIL A

SCALE 6.000

12

3

4

5

SEE DETAIL C

6

DETAIL B

SCALE 6.000

6 & 7

DETAIL C

SCALE 30.000



Mechanical Drawings


Figure A-19. 1U Square Heatsink Geometry 1 of 2

13

45

67

8

BCD A

12

34

56

78


P.O. BOX 58119


R

4X 12.00+1.00

0

0.472+0.039

-0.000

[]

4X 13.22+1.00

0

0.520+0.039

-0.000

[]

9

21.00�#0.25

0.827�#0.009

[]

72X 0.200

[0.0079]

FIN THICKNESS

71X 1.272

[0.0501]

FIN PITCH

71X 1.072

[0.0422]

FIN GAP

END GAP

BOTH SIDES OF HEATSINK

10

0.500�#0.250

0.0197�#0.0098

[]

B

91.50 0

-0.25

3.602+0.000

-0.009

[]

A91.50 0

-0.25

3.602+0.000

-0.009

[]

C

E97838

1B

DWG. NO

SHT.

REV

SHEET 1 OF 2


SCALE: 1

BE97838

DREV

DRAWING NUMBER

SIZE

ROMLEY 1U HS GEOMETRY

TITLE

EASD / PTMI

DEPARTMENT

SEE NOTES

SEE NOTES

FINISH

MATERIAL

DATE

APPROVED BY

--

5/5/10

D. LLAPITAN

DATE

CHECKED BY

5/5/10

N. ULEN

DATE

DRAWN BY

5/5/10

N. ULEN

DATE

DESIGNED BY





TOLERANCES:

.X �# .5 Angles �# 1.0�$

.XX �# 0.25

.XXX �# 0.127


REVISION HISTORY

ZONE

REV

DESCRIPTION

DATE

APPROVED

-A


5/5/10

-

BADDED NOTE 10, CENTER FIN ARRAY

8/12/10



NOTES:

1. THIS DRAWING TO BE USED IN CONJUNCTION WITH







4. BASE: COPPER, K=380 W/M-K MIN

FINS: QTY 72X 0.2 MM, ALUMINUM, K=220 W/M-K MIN

5. NA


SOLVENTS AFTER MACHINING AND FIN ASSEMBLY.

7. LOCAL FLATNESS ZONE .077 MM [0.003"] CENTERED ON

HEAT SINK BASE.

8. MECHANICAL STITCHING OR CONNECTION ALLOWED ON TOP SURFACE

OF HEATSINK TO INCREASE FIN ARRAY STRUCTURAL STABILITY,

OVERALL FIN HEIGHT MUST STILL BE MAINTAINED.


10 CENTER FIN ARRAY ON HEAT SINK BASE.

TOP VIEW

AIRFLOW DIRECTION

SEE NOTE 8

SEE DETAIL A

DETAIL A

SCALE 5.000

Mechanical Drawings


Figure A-20. 1U Square Heatsink Geometry 2 of 2

13

45

67

8

BCD A

12

34

56

78

BCD A

AA


P.O. BOX 58119


R

38.00

[1.496]

38.00

[1.496]

80.00

[3.150]

80.00

[3.150]

BASE THICKNESS

4.50�#0.13

0.177�#0.005

[]

0.10 [0.003]

ABC

9.35 0-0.06

0.368+0.000

-0.002

[]

E97838

2B

DWG. NO

SHT.

REV



SHEET 2 OF 2


SCALE: 1.500

PTMI

BE97838

DREV

DRAWING NUMBER

SIZE

DEPARTMENT

FLATNESS ZONE,

SEE NOTE 7

BOTTOM VIEW

9

9

9

9

AIRFLOW DIRECTION

AIRFLOW DIRECTION

TOP VIEW

SECTION A-A

SEE DETAIL B

SEE DETAIL D

DETAIL B

SCALE 6.000

DETAIL D

SCALE 6.000

3.0 [0.118] X 45�$

ALL FINS

0.077 [0.0030]

1.00 [0.039]

AB

Mechanical Drawings


Figure A-21. Heatsink Cup For Spring Retention

13

45

67

8

BCD A

12

34

56

78

BCD A

AA


P.O. BOX 58119


R

4

9.45+0.06

0

0.372+0.002

-0.000

[]

4

5.40+0.13

0

0.213+0.005

-0.000

[]

4

7.95+0.13

0

0.313+0.005

-0.000

[]

10.45+0.06

0

0.411+0.002

-0.000

[]

1.000

0.0394

[]

0.000

0.0000

[]

4.500

0.1772

[]

4.50

0.177

[]

0.000

0.000

[]

5.50

0.217

[]

E97837

1B

DWG. NO

SHT.

REV

SHEET 1 OF 1


SCALE: 1

BE97837

DREV

DRAWING NUMBER

SIZE

CUP, SPRING RETENTION

TITLE

EASD / PTMI

DEPARTMENT

SEE NOTES

SEE NOTES

FINISH

MATERIAL

DATE

APPROVED BY

5/5/10

D. LLAPITAN

DATE

CHECKED BY

5/5/10

N. ULEN

DATE

DRAWN BY

5/5/10

N. ULEN

DATE

DESIGNED BY





TOLERANCES:

.X �# .5 Angles �# 1.0�$

.XX �# 0.25

.XXX �# 0.127


REVISION HISTORY

ZONE

REV

DESCRIPTION

DATE

APPROVED

-A


5/5/10

-

BROLLED PART TO -002

REMOVED SKIRT AND MADE SHORTER

8/12/10



NOTES:






3. MATERIAL: SUS301, 304, 430


4

SECTION A-A

0.5 x 45�$ TYP.

Mechanical Drawings


Figure A-22. 1U Narrow Heatsink Assembly 1 of 2

13

45

67

8

BCD A

12

34

56

78


P.O. BOX 58119


R

E95474

1B

DWG. NO

SHT.

REV

SHEET 1 OF 2


SCALE: 1.500

BE95474

DREV

DRAWING NUMBER

SIZE

ROMLEY 1U NARROW

HS ASSEMBLY

TITLE

PTMI

DEPARTMENT

SEE NOTES

SEE NOTES

FINISH

MATERIAL

DATE

APPROVED BY

--

3/23/10

C. HO

DATE

CHECKED BY

3/23/10

N. ULEN

DATE

DRAWN BY

3/23/10

N. ULEN

DATE

DESIGNED BY





TOLERANCES:

.X �# 0.5 Angles �# 1.0�$

.XX �# 0.25

.XXX �# 0.127


PARTS LIST

DESCRIPTION

PART NUMBER

ITEM NO

QTY

ROMLEY 1U NARROW HS ASSEMBLY

E95474-002

TOP

ROMLEY 1U NARROW HS GEOMETRY

E95465-001

11

CUP, SPRING RETENTION

E97837-002

24


E86113-001

34


E91775-001

44


E75155-001

54


G13624-001

64

REVISION HISTORY

ZONE

REV

DESCRIPTION

DATE

APPROVED

-A


3/23/10

-

BROLLED ASSEMBLY TO -002

UPDATED CUP TO -002



8/13/10



NOTES:

















MAGNIFICATION.

6 PRESS FIT BOTTOM OF CUP LIP FLUSH TO TOP SURFACE OF HEAT SINK.

7 MINIMUM PUSH OUT FORCE = 30 LBF PER CUP.



EDGE IS AWAY FROM BASE CUP SURFACE.

10 ALLOWABLE PROTRUSION OF CUP FROM BASE.

9

2

3

4

5

1

6

5

Mechanical Drawings


Figure A-23. 1U Narrow Heatsink Assembly 2 of 2

13

45

67

8

BCD A

12

34

56

78

BCD A

AA


P.O. BOX 58119


R

8

1.00+0.13

0

0.039+0.005

-0.000

[]

(4X 9.36

)[0.369]

SPRING PRELOAD

ASSEMBLY HEIGHT

10

0.00�#0.13

0.000�#0.005

[]

E95474

2B

DWG. NO

SHT.

REV



SHEET 2 OF 2


SCALE: 1.500

PTMI

BE95474

DREV

DRAWING NUMBER

SIZE

DEPARTMENT

PRESS FIT DETAILS

ASSEMBLY DETAILS

E-RING ORIENTATION DETAILS

SECTION A-A

SEE DETAIL A

SEE DETAIL B

DETAIL A

SCALE 6.000

12

3

4

5

SEE DETAIL C

6

DETAIL B

SCALE 6.000

6 & 7

DETAIL C

SCALE 30.000



Mechanical Drawings


Figure A-24. 1U Narrow Heatsink Geometry 1 of 2

13

45

67

8

BCD A

12

34

56

78


P.O. BOX 58119


R

4X 12.00+1.00

0

0.472+0.039

-0.000

[]

4X 13.76+1.00

0

0.542+0.039

-0.000

[]

9

21.00�#0.25

0.827�#0.009

[]

46X 0.20

[0.008]

FIN THICKNESS

45X 1.53

[0.060]

FIN PITCH

45X 1.33

[0.052]

FIN GAP

106.00 0-0.25

4.173+0.000

-0.009

[]

70.00 0

-0.25

2.756+0.000

-0.009

[]

C

E95465

1B

DWG. NO

SHT.

REV

SHEET 1 OF 2


SCALE: 1

BE95465

DREV

DRAWING NUMBER

SIZE

ROMLEY 1U NARROW

HS GEOMETRY

TITLE

EASD / PTMI

DEPARTMENT

SEE NOTES

SEE NOTES

FINISH

MATERIAL

DATE

APPROVED BY

--

3/23/10

C. HO

DATE

CHECKED BY

3/23/10

N. ULEN

DATE

DRAWN BY

3/23/10

N. ULEN

DATE

DESIGNED BY





TOLERANCES:

.X �# .5 Angles �# 1.0�$

.XX �# 0.25

.XXX �# 0.127


REVISION HISTORY

ZONE

REV

DESCRIPTION

DATE

APPROVED

-A


3/23/10

-

BCHANGED FIN COUNT TO 46, AND FIN ALIGNMENT CALLOUTS

8/13/10



NOTES:

1. THIS DRAWING TO BE USED IN CONJUNCTION WITH







4. BASE: COPPER, K=380 W/M-K MIN

FINS: QTY 46X 0.2 MM, ALUMINUM, K=220 W/M-K MIN

5. NA


SOLVENTS AFTER MACHINING AND FIN ASSEMBLY.

7. LOCAL FLATNESS ZONE .077 MM [0.003"] CENTERED ON

HEAT SINK BASE.

8. MECHANICAL STITCHING OR CONNECTION ALLOWED ON TOP SURFACE

OF HEATSINK TO INCREASE FIN ARRAY STRUCTURAL STABILITY,

OVERALL FIN HEIGHT MUST STILL BE MAINTAINED.


TOP VIEW

AIRFLOW DIRECTION

SEE NOTE 8

SEE DETAIL A

SEE DETAIL C

DETAIL A

SCALE 4.000

ALIGNMENT OF FIN ARRAY TO ONE

SIDE OF HEAT SINK BASE IS ALLOWED

DETAIL C

SCALE 4.000

NO SHARP PROTRUSIONS ALLOWED

ALONG SIDES OR TOP SIDE EDGE

OF OUTER FINS

GAP ON ONE SIDE OF FIN

ARRAY ALLOWED

Mechanical Drawings


§

Figure A-25. 1U Narrow Heatsink Geometry 2 of 2

13

45

67

8

BCD A

12

34

56

78

BCD A

AA


P.O. BOX 58119


R

38.00

[1.496]

38.00

[1.496]

94.00

[3.701]

56.00

[2.205]

BASE THICKNESS

4.50�#0.13

0.177�#0.005

[]

0.10 [0.003]

ABC

9.35 0-0.06

0.368+0.000

-0.002

[]

E95465

2B

DWG. NO

SHT.

REV



SHEET 2 OF 2


SCALE: 1.500

PTMI

BE95465

DREV

DRAWING NUMBER

SIZE

DEPARTMENT

FLATNESS ZONE,

SEE NOTE 7

BOTTOM VIEW

9

9

9

9

AIRFLOW DIRECTION

AIRFLOW DIRECTION

TOP VIEW

SECTION A-A

SEE DETAIL B

SEE DETAIL D

DETAIL B

SCALE 6.000

DETAIL D

SCALE 6.000

3.0 [0.118] X 45�$

ALL FINS

0.077 [0.0030]

1.00 [0.039]

AB

Socket Mechanical Drawings


B Socket Mechanical Drawings

Table B-1 lists the socket drawings included in this appendix.

Table B-1. Socket Drawing List

Drawing Description Figure Number

Socket Mechanical Drawing (Sheet 1 of 4) Figure B-1






Figure B-1. Socket Mechanical Drawing (Sheet 1 of 4)









§




Component Suppliers


C Component Suppliers

C.1 Intel Enabled Supplier InformationPerformance targets for heatsinks are described in Section 5.1. Mechanical drawings are provided in Appendix A. Mechanical models of the keep in zone and socket are listed in Table 1-1.

C.1.1 Intel Reference or Collaboration Thermal SolutionsCustomers can purchase the Intel reference or collaboration thermal solutions from the suppliers listed in Table C-1 and Table C-2.

Table C-1. Suppliers for the Intel Reference Thermal Solutions (Sheet 1 of 2)

Item Intel Part Number Supplier PN Supplier Supplier Contact Info

1U Square HeatsinkAssywith TIM(91.5x91.5x25.5)

E89208-002 1A22KDL00_XP01

Foxconn Ray Wang (worldwide)[email protected]+1-512-351-1493 x273

1U Narrow HeatsinkAssywith TIM(70x106x25.5)

G16544-001 1A22JRB00_XP01

Foxconn Ray Wang (worldwide) [email protected] +1-512-351-1493 x273

2U Active/Combo Heatsink Assy w/TIM, Fan Guard

E62452-004 1A014QD00- NRC_XA14

Foxconn Ray Wang (worldwide) [email protected] +1-512-351-1493 x273

Delrin eRing retainer

G13624-001 FT1008-A ITW Electronics Business Asia Co., Ltd.

Chak Chakir [email protected] 512-989-7771

Thermal Interface Material (TIM)

N/A PCM45F Honeywell Judy Oles [email protected] +1-509-252-8605

N/A TC-5022 Dow Corning Ed Benson [email protected] +1-617-803-6174

2U Square Heatpipe Heatsink150W, 135W, 130W 1S WS, 130W, 115W, 95W, 80W, 70W, 60W

N/A SR41H00001 Asia Vital Components (AVC)*

www.avc.com.tw

2U Narrow Heatpipe Heatsink150W, 135W, 130W, 115W, 95W, 80W, 70W, 60W

N/A HEL00007-N1-GP

Coolermaster*

www.coolermaster.com

(Not recommended for shadowed processor configurations)

1U Square Heatpipe Heatsink130W, 115W, 95W, 80W, 70W, 60W

N/A SQ42Q00001 Asia Vital Components (AVC)*

www.avc.com.tw

Component Suppliers


C.1.2 Socket and ILM ComponentsThe LGA2011-0 Socket and ILM Components are described in Chapter 2 and Chapter 3, respectively. Socket mechanical drawings are provided in Appendix A. Mechanical models are listed in Table 1-1.

1U Square Vapor-Chamber Heatsink150W, 130W, 115W, 95W, 80W, 70W, 60W

N/A R2 Dynatron Corporation* (Top Motor/Dynaeon)

www.dynatron-corp.com

(Exceeds SSI blade height standard)

1U Narrow Heatpipe Heatsink130W, 115W, 95W, 80W, 70W, 60W

N/A SQ42T00001 Asia Vital Components (AVC)*

www.avc.com.tw

(Not recommended for shadowed processor configurations)

1U Narrow Vapor-Chamber Heatsink130W, 115W, 95W, 80W, 70W, 60W

N/A 98-12038-M43 Taiwan Microloops*

www.microloops.com

Table C-1. Suppliers for the Intel Reference Thermal Solutions (Sheet 2 of 2)

Item Intel Part Number Supplier PN Supplier Supplier Contact Info

Table C-2. Suppliers for the LGA2011-0 Socket and ILM

Item Intel PN Amtek Foxconn (Hon Hai) Lotes

LGA2011-0 Socket

E64556-002 None PE201127-4351-01H

TBD

LGA2011-0 ILMSquare

E91838-003 ITLE91838003 PT44L41-4411 ACA-ZIF-129-Y02

LGA2011-0 ILMNarrow

E93875-002 ITLE93875002 PT44L43-4411 ACA-ZIF-130-Y02

LGA2011-0 Backplate

E91834-001 ITLE91834001 PT44P41-4401 DCA-HSK-182-T02

Supplier Contact Info

SJ [email protected]

(86) 752 263 4562

(Socket) Katie [email protected]: +1-714-608-2085Fax:+1-714-680-2099(ILM) Julia Jiang [email protected] +1-408-919-6178

Cathy [email protected]: +1-86-20-84686519

Component Suppliers


§

Table C-3. Suppliers for the LGA-2011-0 Socket and ILM (Continued)

Item Intel PN Molex Tyco

LGA2011-0 Socket

E64556-002 1051420132 2069458-1

LGA2011-0 ILMSquare

E91838-003 1051428100 2134439-2

LGA2011-0 ILMNarrow

E93875-002 1051429100 2134439-1

LGA2011-0 Backplate

E91834-001 1051427000 2134440-1

Supplier Contact Info

Carol [email protected]

Josh [email protected]: +1-503-327-8348;+1-503-327-8346

(Asia) Billy [email protected]

Component Suppliers


Thermal Test Vehicle


D Thermal Test Vehicle

For thermal analysis of Intel® Xeon® Processor E5-1600 / E5-2600 / E5-4600 v1 and v2 Product Families, the Thermal Test Vehicle (TTV) can be used with appropriate correction factors, as shown in Table D-1.

Actual processors experience non-uniform heating that is not simulated by the uniform heating of the Thermal Test Vehicle (TTV). As a result, to find the actual thermal characterization parameter (Section 5.3.2), correction offsets must be added to the thermal characterization parameter found for each TTV.

Equation D-1. ΨCA, Intel Xeon processor = mean ΨCA, TTV + 3σ + Correction Offset

Mean ΨCA, TTV + 3σ accounts for variation (standard deviation) in heatsink and thermal interface material performance and is determined by the customer.

There are two versions of TTV, depending on Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 v1 or v2 Product Family processor. Refer to the appropriate processor datasheet to determine the package size. The correction factors for the processors along with applicable TTV are listed below.

Table D-1. Correction Offsets Intel® Xeon® Processor E5-1600 / E5-2600 / E5-4600 v1 Product Families

Processor TDP (Watts) Correction Offset for TTV (°C/W)

8-core/6-core 150 -0.027

8-core 135 -0.024

8-core/6-core 130 -0.023

8-core/6-core 115 -0.026

8-core/6-core 95 -0.026

8-core/6-core 70 -0.031

8-core/6-core 60 -0.030

4-core 130 -0.006

4-core 95 -0.008

4-core 80 -0.009

2-core 80 0.005

Table D-2. Correction Offsets Intel® Xeon® Processor E5-1600/ E5-2600/ E5-4600 v2 Product Families (Sheet 1 of 2)

Processor TDP (Watts)

Correction Offset for TTV (°C/W) Applicable TTV1

EP 12-core 130W (1U) 130 0.007 ---

EP/EP 4S 12-core 115W (1U) 115 0.006 ---

EP WS 8-core150W

150 0.005 ---


130 -0.001 ---



D.1 LGA2011-0 TTVAs with past programs, a TTV has been developed to allow thermal solution development. The LGA2011-0 TTV fits in the LGA2011-0 socket to have the correct mechanical stack up in the testing.

The TTV can be powered using the socket or through pads on the top of the package substrate.

Either method will provide the user a uniform heating of the embedded thermal source.

Contact your Intel Field Representative for a thermal test board and the collateral for that board.

EP 4S 8-core 130W (1U)

130 0.003 ---

EP 8-core130W (2U)

130 0.004 ---

EP 6-core130W (2U)

130 0.003 ---

EP 10-core115W (1U)

115 -0.002 ---


95 -0.002 ---


95 0.003 ---

EP 10-core70W (1U)

70 -0.004 ---

EP 1S WS 6-core130W

130 0.018 ---

EP 1S WS 4-core130W

130 0.020 ---

EP 4-core130W (2U)

130 0.017 ---


95 0.018 ---


95 0.020 ---

EP 6-core80W (1U)

80 0.016 ---

EP 4-core80W

80 0.019 ---

EP 6-core60W

60 0.014 ---

Notes:1. Refer to appropriate Processor Datasheet for package size.

Table D-2. Correction Offsets Intel® Xeon® Processor E5-1600/ E5-2600/ E5-4600 v2 Product Families (Sheet 2 of 2)

Processor TDP (Watts)

Correction Offset for TTV (°C/W) Applicable TTV1



D.2 Thermocouple Attach DrawingFigure D-1 shows groove dimensions for thermocouple attach on Intel® Xeon® Processor E5-1600 / E5-2600 / E5-4600 Product Families and Intel® Xeon® Processor E5-1600 V2/ E5-2600 V2/ E5-4600 V2 Product Families TTV. This drawing is also applicable to the larger Lukeville test vehicle as it shares the same IHS with the smaller TTV.

Note: The following supplier can machine the groove and attach a thermocouple to the IHS. The supplier information is provided s a convenience to Intel’s general customers and the list may be subject to change without notice. THERM-X OF CALIFORNIA, 3200 Investment Blvd., Hayward, Ca 94544. Ernesto B Valencia +1-510-441-7566 Ext. 242 [email protected]. The vendor part number is XTMS1565.



§

Figure D-1. Groove for Thermocouple Attach on Intel® Xeon® Processor E5-2600 Product Family Thermal Test Vehicle

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Embedded Thermal Solutions


E Embedded Thermal Solutions

Embedded Server SKU’s target higher case temperatures and/or NEBS thermal profiles for embedded communications server and storage form factors. This section describes reference heatsinks for NEBS (Network Equipment Building Systems) compliant ATCA (Advanced Telecommunications Computing Architecture) systems. These higher case temperature processors are good for any form factor that needs to meet NEBS requirements.

E.1 Performance TargetsTable E-1 and Table E-2 provide boundary conditions and performance targets for 1U and ATCA heatsinks. These values are used to generate processor thermal specifications and to provide guidance for heatsink design.

Notes:1. Local ambient temperature of the air entering the heatsink. 2. Max target (mean + 3 sigma + offset) for thermal characterization parameter (Section 5.3.2). 3. Dimensions of heatsink do not include socket or processor.4. Local Ambient Temperature written X/Yo C means Xo C under Nominal conditions but Yo C is allowed for Short-

Term NEBS excursions. 5. All heatsinks are Non-Direct Chassis Attach (DCA)6. See Section 5.1 for standard 1U solutions that do not need to meet NEBS.

Notes:1. Local ambient temperature of the air entering the heatsink. 2. Max target (mean + 3 sigma + offset) for thermal characterization parameter (Section 5.3.2). 3. Dimensions of heatsink do not include socket or processor.4. Local Ambient Temperature written X/Yo C means Xo C under Nominal conditions but Yo C is allowed for Short-

Term NEBS excursions. 5. All heatsinks are Non-Direct Chassis Attach (DCA)6. See Section 5.1 for standard 1U solutions that do not need to meet NEBS.

Table E-1. 8-Core/6-Core Processor Reference Thermal Boundary Conditions (E5 v1 Product Family)

TDP Heatsink Technology5, 6 Ψca2 (oC/W) TLA1, 4 (oC) Heatsink

Volumetric3 (mm)

LV95W (8-core) 1U or Custom 0.265 52/67 90x90x25.5

LV70W (6-core) ATCACu Base/Cu Fins

0.506 52/67 90x90x12.6

Table E-2. Processor Reference Thermal Boundary Conditions (E5 v2 Product Family)

TDP Heatsink Technology5, 6 Ψca2 (oC/W) TLA1, 4 (oC) Heatsink

Volumetric3 (mm)

10-core95W

1U or Custom 0.235 51/66 90x90x25.5

10-core70W

ATCACu Base/Cu Fins

0.400 49/64 90x90x12.6

8-core70W

ATCACu Base/Cu Fins

0.403 49/64 90x90x12.6

6-core50W

ATCACu Base/Cu Fins

0.541 52/67 90x90x12.6



Detailed drawings for the ATCA reference heatsink can be found in Section E.3. Table E-1 above specifies ΨCA and pressure drop targets and Figure E-1 below shows ΨCA and pressure drop for the ATCA heatsink versus the airflow provided. Best-fit equations are provided to prevent errors associated with reading the graph.

Note: Other LGA1366 compatible thermal solutions may work with the same retention. ATCA heatsink performance curves were created using Socket R TTV.

E.2 Thermal Design Guidelines

E.2.1 High Case Temperature Thermal ProfileHigh case temperature thermal profiles help relieve thermal constraints for Short-Term NEBS conditions. To ensure reliability, processors must meet the nominal thermal profile under standard operating conditions and can only rise up to the Short-Term specification for NEBS excursions (see Figure E-2). The definition of Short-Term time is defined for NEBS Level 3 conditions but the key is that it cannot be longer than 360 hours per year.

Fan speed control is treated the same as standard processors. When DTS (Digital Temperature Sensor) value is less than Tcontrol, the thermal profile can be ignored.

Figure E-1. ATCA Heatsink Performance Curves

0

0.05

0.1

0.15

0.2

0.25

0.3

0

0.2

0.4

0.6

0.8

1

1.2

0 2 4 6 8 10 12 14

Ψca [

°C/W

]

Airflow [CFM]

Yca = 0.180 + 1.374 * CFM ^ - 0.642

DP = 0.0009 * x^2 + 0.0106 * x

ΔP

[in



Notes:1.) The thermal specifications shown in this graph are for reference only. In case of conflict, the data in the

datasheet supersedes any data in this figure.2.) The Nominal Thermal Profile must be used for all normal operating conditions, or for products that do not

require NEBS Level 3 compliance.3.) The Short-Term Thermal Profile may only be used for short-term excursions to higher ambient operating

temperatures, not to exceed 360 hours per year as compliant with NEBS Level 3. 4.) Implementation of either thermal profile should result in virtually no TCC activation.5.) Utilization of a thermal solution that exceeds the Short-Term Thermal Profile, or which operates at the Short-

Term Thermal Profile for a duration longer than the limits specified in Note 3 above, do not meet the processorthermal specifications and may result in permanent damage to the processor.

§

E.3 Mechanical Drawings and Supplier InformationSee Appendix B for assembly, retention, and keep out drawings.

The part number below represent Intel reference designs for an ATCA reference heatsink. Customer implementation of these components may be unique and require validation by the customer. Customers can obtain these components directly from the supplier below.

Figure E-2. High Case Temperature Thermal Profile\

Thermal Profile

40

50

60

70

80

90

0 5 10 15 20 25 30 35 40 45 50 55 60

Power [W]

Tc

as

e [

C]

Short-Term Thermal Profile Tc = 0.302 * P + 66.9

Nominal Thermal Profile Tc = 0.302* P + 51.9

Short-term Thermal Profile may only be used for short term excursions to higher ambient temperatures, not to exceed 360 hours per year

Table E-3. Embedded Heatsink Component Suppliers

Component Description Supplier PN Supplier Contact Info

ATCA Reference Heat SinkIntel P/N: G47264-001

ATCA Copper Fin, Copper Base

10A01NE500 Foxconn/FTC Technology, Inc.Cary [email protected](512) 670-2638 x191



Table E-4. Mechanical Drawings List

Parameter Value

ATCA Reference Heatsink Fin and Base (Sheet 1 of 2) Figure E-3

ATCA Reference Heatsink Fin and Base (Sheet 2 of 2) Figure E-4



Figure E-3. ATCA Reference Heatsink Fin and Base (Sheet 1 of 2)



Figure E-4. ATCA Reference Heatsink Fin and Base (Sheet 2 of 2)



§



Heatsink Load Characterization


F Heatsink Load Characterization

F.1 IntroductionSocket LGA2011-0 requires load sharing with the ILM and heatsink for end of life (EOL) performance. This places additional requirements on the heatsink beyond just providing the minimum pressure for thermal interface performance.

This Appendix outlines the recommended procedure for verifying the heatsink load on a fixture that simulates an ILM and processor interface.

F.2 Heatsink Load FixtureThe heatsink load fixtures shown in Figure F-1 has four mount points for the heatsink, a middle protrusion simulating the surface of the processor’s integrated heat spreader, and a machined pocket to accept a load cell. There are two versions, one simulating the square ILM heatsink mount pattern, and one with the narrow ILM geometry.

Heatsink load fixtures, square and narrow version, aluminum block with steel threaded inserts.

The recommended load cell is the Omega* LCKD-100 available separately from Omega*. Additionally, a system is needed to query the load cell to obtain the force provided by the heatsink. Loadcell calibration certification is also recommended.

F.3 Procedure for Measuring Heatsink LoadThe following steps are suggested for characterizing the heatsink load with the heatsink load fixture and load cell.

Note: This fixture will only measure beginning of life (BOL) load and not end of life load (EOL). However, if BOL loads as measured here are between approximately 60 and

Figure F-1. Heatsink Load Fixtures

Sqaure Heatsink Load Fixture Narrow Heatsink Load Fixture

Heatsink Load Characterization


70 lbf at low and high stack respectively, then there should be no EOL concerns for the socket.

• Insert Omega* LCKD-100 load cell into pocket in fixture ensuring no debris is between the interface that would skew the load measurement. See Figure F-2 for example assembly.

• Install the heatsink (without any TIM material) to be characterized using a #2 Phillips driver and torque the four captive screws to 9 inch-pounds ±1 inch-pound. It is recommended that each thread be started before final torquing to avoid any cross-threading.

• The fixture is designed to provide a low stack height (8.014 minus 0.34 mm), simulating the low tolerance side of the processor IHS above the board. With this low stack height, the heatsink load should be above approximately 60 lbf to ensure adequate end of life load.

• Once the minimum heatsink load from the previous step has been recorded, shim the fixture by placing a spacer with thickness 0.68 mm between the top of the load cell and the heatsink base to bring the base of the heatsink to the high tolerance stack (8.014 plus 0.34 mm) and measure the load. This load should be kept under approximately 70 blf.

Assembly for measuring heatsink load

Note: The loadcell has a point on it. For heatsinks susceptible to damage in this area of contact, it is recommended to insert the load cell with the point down.

§

Figure F-2. Heatsink Fixture Assembly

Heatsink

Load cell

Fixture

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