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© 2011 ANSYS, Inc. 8/29/11 1 Introduction To ANSYS EM Solutions
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© 2011 ANSYS, Inc. 8/29/111
Introduction To ANSYS EM Solutions
© 2011 ANSYS, Inc. 8/29/112
• Electromagnetic product/industry overview
• Electromechanical product/industry overview
• Product Updates
Agenda
© 2011 ANSYS, Inc. 8/29/113
Two Product Segments
Electronics (HF/SI) or “High
Frequency”
Electromechanical (EM) or “Low Frequency”
© 2011 ANSYS, Inc. 8/29/114
Electronics Application Segments
RF & Microwave
IC Design & Verification
FEA
sourceA1
sourceA2
sourceB1
sourceB2
sourceC1
sourceC2
Magnet01
Magnet02
Name ValueFEA1.FEA_STEPS
SIMPARAM1.RunTime [s] 26.41kSIMPARAM1.TotalIterations 34.51k
SIMPARAM1.TotalSteps 6.00k
ω+
ICA:
+
ΦGAIN
CONST
CONST
EQUBL
EQUBL
EQUBL
1500 rpm
LL:=922u
RA:=2.991
ANGRAD
57.3
-60+PWM_PER
-30+PWM_PER
QS1
QS2
QS3
VAL[0] := mod( INPUT[0] ,INPUT[1] )
PWM_T:=60
I_TARG:=9
I_HYST:=0.2
Q1
Q2
Q3 Q5
Q4 Q6
400 V
THRES := PWM_T
EQUBL
CONST
QS4
-90+PWM_PER
EQUBL
CONST
QS5
-120+PWM_PER
EQUBL
CONST
QS6
-150+PWM_PER
RA Ohm LL H
LDUM:=10m
0
8.50
5.00
0 30.00m20.00m
Q1.CTRL + 7.50 Q2.CTRL + 6.00 Q3.CTRL + 4.50 Q4.CTRL + 3.00 Q5.CTRL + 1.50 Q6.CTRL
-10.30
10.00
0
0 30.00m20.00m
LA.I [A] LB.I [A] LC.I [A] PWM_PER:=180
INPUT[1] := PWM_PER
INPUT := -LB.I
LC.I
-LA.I
LB.I
-LC.I
LA.I
THRES1 := I_TARG - I_HYST
THRES2 := I_TARG + I_HYSTVAL1 := 1VAL2 := 0Y0 := 1
-14.50
7.80
0
0 30.00m20.00m
Torque Output
-30.00k
302.00k
200.00k
0 30.00m20.00m
FEA Outputs
FEA1.WIRELOSS FEA1.CORELOSS FEA1.IsourceA FEA1.VsourceA FEA1.EIsourceA FEA1.FLUXsourceA FEA1.IsourceB FEA1.VsourceB FEA1.EIsourceB FEA1.FLUXsourceB FEA1.IsourceC FEA1.VsourceC FEA1.EIsourceC FEA1.FLUXsourceC FEA1.PHI FEA1.OMEGA
0
8.50
5.00
0 30.00m20.00m
QS1.VAL + 7.50 QS2.VAL + 6.00 QS3.VAL + 4.50 QS4.VAL + 3.00 QS5.VAL + 1.50 QS6.VAL
Electromechanical Systems
Signal & Power Integrity
© 2011 ANSYS, Inc. 8/29/115
Electronic TrendsElectronic Systems drive toward smaller, faster, higher power,
higher complexity, and higher density.• RF, digital, data conversion, and high-performance DSP on single
platform• Switching power supplies at high frequency
Consumer market driving unit growth.• Increasing demand volatility• Shorter product life cycles• Extreme price sensitivity.
System EMI Predicts Display Anomaly System SI Predicts Receiver Desensitization
PCB noise
© 2011 ANSYS, Inc. 8/29/116
Cornerstone: Rigorous, Physics Based Solutions
© 2011 ANSYS, Inc. 8/29/117
Cornerstone: Automatic Adaptive Meshing for Accuracy
© 2011 ANSYS, Inc. 8/29/118
Cornerstone: Circuit + Electromagnetics
Port1
Port2
Port3
Port4
1
2
3
4
Package
2
1WavePort1:T1
WavePort1:T2
WavePort2:T1
WavePort2:T2
Dif ferential_Via
2
1WavePort1:T1
WavePort1:T2
WavePort2
WavePort3
Transition_SL
12
Connector
12
Connector
Dynamic Link
Simulated Measured
© 2011 ANSYS, Inc. 8/29/119
Products for Electronics
© 2011 ANSYS, Inc. 8/29/1110
HFSS: High Frequency Structure Simulator
Full-wave 3D electromagnetic field solver
• Computes electromagnetic behavior of high-frequency and high-speed components and systems
• Extracts S-, Y-, and Z-parameters• Provides 3D electromagnetic fields Simulation of RFIC in Package
Antenna on UAV
© 2011 ANSYS, Inc. 8/29/1111
SIwaveFull-wave Printed Circuit Board
and BGA IC Package Solver• Unique Field Solver Based on Finite
Element Method coupled with transmission lines
• Computes electrical behavior of high-frequency and high-speed PCBs and BGAs
• Extracts S-, Y-, and Z-parameters• Provides electromagnetic fields Circuit Board Resonances
Model Extraction for Complex Memory Interface
© 2011 ANSYS, Inc. 8/29/1112
Ansoft Designer
Ansoft Designer• Design Environment for
System-Level Electronics– Design framework with
schematic, layout, and post-processing
– Links to EM field solvers and Circuit Simulation
Nexxim• Advanced Circuit Simulator
– Transient, Harmonic Balance, and Statistical Eye Simulation
© 2011 ANSYS, Inc. 8/29/1113
Signal Integrity
© 2011 ANSYS, Inc. 8/29/1114
Applications: Signaling Standards
Standard interfaces• DDR3, PCI Express,
HDMI, SATA, USB 3
Serial rates of 3 to 10 Gb/s point-to-point serial buses.
This requires reliable signal transmission across a host board or between daughter cards on a backplane at GHz speeds.
+
-
+
-
Via Via Via
MS SL SL
Package PackageConnectorBackplane Daughter Card
© 2011 ANSYS, Inc. 8/29/1115
The Fundamental High Speed Challenge
Tx +
-
+
-
Rcvpath +
-
+
-
Clean, open, logical 1 & 0 at launch from transmitter
Smeared edges at end of long interconnect.
Logical 1 & 0 can be hard to distinguish at end of long interconnects; (this is often called a “closed eye”)
Fast, sharp, edges at transmitter launch
We want to get digital 1’s and 0’s from transmitter to receiver.However, the channel over which this occurs is a low pass filter.
© 2011 ANSYS, Inc. 8/29/1116
6 Gb/s SATA Interconnect:“Divide and Conquer” Solver technology
Vss
inh inl
outl outh
Vdd
i20m
M1558P_12_MML130E
L=0.12uW=80uM=2
M1559P_12_MML130E
L=0.12uW=80u
M=2
l=6uw=1.8um=63
rnhr_rfr_zbt_m=0.05k
l=6uw=1.8um=63
rnhr_rfr_zbt_m=0.05k
Vss Vss
Vdd Vdd
Tx +
- +
-
RxVia
FR-4 FR-4 FR-4
Controller Backplane SAS/SATA Drive
Models courtesy of
© 2011 ANSYS, Inc. 8/29/1117
Validation: Nexxim + QuickEye
Eye Diagram
QuickEye
© 2011 ANSYS, Inc. 8/29/1118
EMI/EMC
© 2011 ANSYS, Inc. 8/29/1119
Network Camera System
Flexible Printed Circuit (FPC)
Flat Flexible Cable (FFC)
CPU Board
TILT Board
Video Board
CCD
Panasonic Electronic DevicesPanasonic Communications Co.Molex JapanAki Nakatani, Ansoft Japan
© 2011 ANSYS, Inc. 8/29/1120
EMI Measurements
EMI regulation limit
© 2011 ANSYS, Inc. 8/29/1121
SIwaveHFSS
HFSS connector modelsNexxim W-element
HFSS connector modelsNexxim W-element
Simulation Methodology
SIwaveHFSS
SIwaveHFSS
Video board TILT board CPU boardFPC FFC
0
0
0
0
Port1
Port2
Port3
Port4
n1 n2
n3 n4
n5n6
n7n8
n1 n2
n3 n4
n5n6
n7n8
Port1 Port2
Port3 Port4
Port5 Port6
Port7 Port8
U4seg2
Port1
Port2
Port3
Port4
Port5
Port6
Port7
Port8
U2seg1
1 2
3 4
ref
0
12
34
ref
Port1
Port2
Port3
Port4
FFC
n1 n2
n3 n4
n5 n6
n7 n8
1 2
3 4
ref
12
34
ref
FFC
n1 n2
n3 n4
n5 n6
n7 n8
FFC Mid Section
n8n7
n6n5
n4n3
n2n1
© 2011 ANSYS, Inc. 8/29/1122
Problem Discovery: TDR
0.00 1.00 2.00 3.00 4.00 5.00 6.00 7.00 8.00 9.00 10.00Time [ns]
50.00
60.00
70.00
80.00
90.00
100.00
110.00
120.00
130.00
140.00
150.00
-V(D
iff1
)/I(
Diff
1)
Ansoft Corporation LVDS TDR foldedImpedance
Curve Info
-V(Dif f1)/I(Dif f1)Transient
Video board TILT board CPU boardFPC FFC
© 2011 ANSYS, Inc. 8/29/1123
Reducing Differential Skew
1. Asymmetrical component pads removed
2. Differential vias re-arranged so signal will arrive at the same time.
3. EMI test passed
© 2011 ANSYS, Inc. 8/29/1124
RF/Microwave
© 2011 ANSYS, Inc. 8/29/1125
Space-based Antenna Arrays
Typical spacecraft is host to numerous antennas
• Important to understand interactions between structures
• Avoid performance degradations
Added reflector antenna to spacecraft bus
• X-band data relay link• Need to evaluate potential
impact on helix array• Antenna placement scenario
© 2011 ANSYS, Inc. 8/29/1126
From Components to System
Antenna element design• Distributed solve option
– Remote Simulation Manager• Analytical derivatives
– Design sensitivities– SNLP optimization
Finite array design• Multi-processing option• Post-processing variables
Integration onto spacecraft• 64-bit mesher• Domain decomposition solver
© 2011 ANSYS, Inc. 8/29/1127
Helix Pitch
Fre
que
ncy
1 in0.63 in3GHz
4GHzReturn Loss
Acceptable Helix Pitch
Helix Radius
Fre
que
ncy
0.7 in0.32 in3GHz
4GHzReturn Loss
Acceptable Helix
Radius
Design Exploration: Critical Antenna Design Parameters
Large solution space efficiently mapped using DSO
• 1 hr total time
Acceptable ranges for design parameters easily determined
Helix Radius
Helix Pitch
© 2011 ANSYS, Inc. 8/29/1128
Space-based Multi-Physics
Electromagnetic
Thermal
Mechanical Stress and Strain
© 2011 ANSYS, Inc. 8/29/1129
Ansoft Solutions for Electromechanical
© 2011 ANSYS, Inc. 8/29/1130
Maxwell: 3D Electromagnetics
© 2011 ANSYS, Inc. 8/29/1131
Maxwell B Field Around Motor
© 2011 ANSYS, Inc. 8/29/1132
Simplorer
© 2011 ANSYS, Inc. 8/29/1133
Simplorer:Multiphysics Integration Framework
Simulink
IcePak Simulation
ANSYS Mechanical
Maxwell
Q3DFluent
CustomModel, C
© 2011 ANSYS, Inc. 8/29/1134
Hybrid Electric Vehicles
© 2011 ANSYS, Inc. 8/29/1135
GAIN
n
GAIN
ust_in
GAIN iq
Y t
ust
d-q-Current Controller
Speed Control
Yt
M_LOAD
Phase Transformation / Control Signal Generation by Space Vector Modulation
G(s)
GS2
I
I_id
GAIN
id
LIMIT
yq
UL := 10
LL := -10
LIMIT
yd
UL := 10
LL := -10
GAIN
P_id
KP := 1.96
G(s
)
GS1
I
I_n
KI := 29 .02k
UL := 10
LL := -10
GAIN
P_PART_n
LIMIT
m_ref
KP := 0.1161k
IGBT1 IGBT2 IGBT3
IGBT4 IGBT5 IGBT6
CONST
id_ref
KI := 240
GAIN
P_Iq
KP := 1.96
I
I_iq
KI := 240
ICA: EQU
PI3:=pi / 3.
P18:=pi / 180.Tp:=1./fp
wu32:=sqrt(3.) / 2.
kA:=0.1
wu3:=sqrt(3.) gam1:=0.
fp:=10k
tx:=0 costhe:=cos(theta_e l)
yalph:=costhe * yd .VAL - sin the * yq .VAL
i1q:=i1beta * costhe - i1alph * sinthe
i1d:=i1alph * costhe + i1beta * si nthe
ybeta:=sinthe * yd.VAL + costhe * yq .VAL
sin the:=sin(the ta_el)
theta_el:=SYMPOD1.PHIDEG * P18
i1beta:=(SYMPOD1.I1A + 2 * SYMPOD1.I1B) / wu3
theta_m:=theta_el / 3.
i1alph:=SYMPOD1.I1A
SET: k:=k+1 SET: gam1:=ga m1
SET: kr:=(k-1)*PI3
SET: kl:=k*PI3
kl <= gam1
true
t-tx >= Tp
kr <= gam1 and kl > gam1
yalph > 0 and ybeta >= 0
SET: tx:=t SET: k:=1yalph = 0 and ybeta = 0PRI := 1
(ybeta > 0 and yalph <= 0) or (yalph < 0 and ybeta <= 0)ybeta < 0 and yalph >= 0
SET: gam1:=pi-ASIN(ybeta/y)SET: gam1:=2*pi+ASIN(ybeta/y)true
true
A126SET: z3:=0
SET: z6:=1
B345SET: z6:=0
SET: z3:=1
A234SET: z1:=0
SET: z4:=1
B246SET: z5:=0SET: z2:=1
A135SET: z2:=0
SET: z5:=1
B156
SET: z4:=0
SET: z1:=1
A123 SET: z3:=1
SET: z4:=0SET: z1:=1
SET: z6:=0
SET: z5:=0SET: z2:=1
E456 SET: z2:=0
SET: z6:=1
SET: z1:=0
SET: z3:=0
SET: z5:=1
SET: z4:=1
t-tx >= t02+tr+tl
t-tx>=t02 and k=2
t-tx >= t02+tr+tl
t-tx>=t02 and k=4
t-tx >= t02+tr+tl
t-tx>=t02 and k=6 t-tx>=t02 and k=5
t-tx >= t02+tr+tlt-tx >= t02+tr+tl
t-tx>=t02 and k=3
t-tx >= t02+tr+tl
t-tx>=t02 and k=1
B234
SET: z3:=1
SET: z6:=0A246
SET: z4:=1
SET: z1:=0
B135SET: z4:=0
SET: z1:=1
A345
SET: z5:=1
SET: z2:=0
A156SET: z3:=0
SET: z6:=1
B126SET: z2:=1
SET: z5:=0
t-tx >= t02+trt-tx >= t02+trt-tx >= t02+tr t-tx >= t02+tr t-tx >= t02+tr t-tx >= t02+tr
E123
SET: z6:=0
SET: z4:=0
SET: z3:=1
SET: z5:=0
SET: z1:=1
SET: z2:=1
A456
SET: z4:=1
SET: z5:=1
SET: z6:=1
SET: z1:=0
SET: z3:=0SET: z2:=0
SET: tl:=kA*y*Tp*sin (gamr)
SET: gamr:=gam1-kr
SET: tr:= kA*y*Tp*sin(PI3 - gamr)
SET: t02:=(Tp-tr-tl)/2
k=2 or k=4 or k=6 k=1 or k=3 or k=5
SET: k:=0true PRI := 1
t-tx >= Tp and k = 0 SET: tx:=t
SET: gam1:=ASIN(ybeta/y)
true
true
t-tx >= Tp
y:=SQRT(SQU(yalph)+SQU(ybeta))
if (y>10.) {y:=10.}
ω+
T
ECE - LINKECE - LINK
TA B C
Imβ
Rotor
V_ROT1
TTheta_IN
Im_IN
beta_IN
Battery- +
LBATT_A1
HEV: System Simulation
-172.00
172.00
-100.00
0
100.00
74.95m 85.00m80.00m
Phase Current RA.I [A] RB.I [A] RC.I [A]
MULTIPHYSICS
© 2011 ANSYS, Inc. 8/29/1136
HEV: Battery Thermal Management with ANSYS CFD
► Increase power capability, while avoiding hot spots that cause premature failure.
► Accurate circuit simulation for battery packs includes temperature dependencies
MULTIPHYSICS
( )
)()()()(
1
1
10
00
1
11111
tIRRVSOCVtV
tIC
QV
SOC
CRV
SOC
dt
d
PTCsOCV +−+=
−+
−=
ANSYS-CFD
TemperaturePower
© 2011 ANSYS, Inc. 8/29/1137
GAIN
n
GAIN
ust_in
GAIN iq
Y t
ust
d-q-Current Controller
Speed Control
Yt
M_LOAD
Phase Transformation / Control Signal Generation by Space Vector Modulation
G(s)
GS2
I
I_id
GAIN
id
LIMIT
yq
UL := 10
LL := -10
LIMIT
yd
UL := 10
LL := -10
GAIN
P_id
KP := 1.96
G(s
)
GS1
I
I_n
KI := 29 .02k
UL := 10
LL := -10
GAIN
P_PART_n
LIMIT
m_ref
KP := 0.1161k
IGBT1 IGBT2 IGBT3
IGBT4 IGBT5 IGBT6
CONST
id_ref
KI := 240
GAIN
P_Iq
KP := 1.96
I
I_iq
KI := 240
ICA: EQU
PI3:=pi / 3.
P18:=pi / 180.Tp:=1./fp
wu 32:=sqrt(3.) / 2.
kA:=0.1
wu3:=sqrt(3.) gam1:=0.
fp:=10k
tx:=0 costhe:=cos(theta_el)
yalph:=costhe * yd .VAL - sin the * yq .VAL
i1q:=i1beta * costhe - i1alph * sinthe
i1d:=i1alph * costhe + i1beta * si nthe
ybeta:=sinthe * yd.VAL + costhe * yq .VAL
sinthe:=sin(the ta_el)
theta_el:=SYMPOD1.PHIDEG * P18
i1beta:=(SYMPOD1.I1A + 2 * SYMPOD1.I1B) / wu3
theta_m:=theta_el / 3.
i1alph:=SYMPOD1.I1A
SET: k:=k+1 SET: gam1:=gam1
SET: kr:=(k-1)*PI3
SET: kl:=k*PI3
kl <= gam1
true
t-tx >= Tp
kr <= gam1 and kl > gam1
yalph > 0 and ybeta >= 0
SET: tx:=t SET: k:=1yalph = 0 and ybeta = 0PRI := 1
(ybeta > 0 and yalph <= 0) or (yalph < 0 and ybeta <= 0)ybeta < 0 and yalph >= 0
SET: gam1:=pi-ASIN(ybeta/y)SET: gam1:=2*pi+ASIN(ybeta/y)true
true
A126SET: z3:=0
SET: z6:=1
B345SET: z6:=0
SET: z3:=1
A234SET: z1:=0
SET: z4:=1
B246SET: z5:=0SET: z2:=1
A135SET: z2:=0
SET: z5:=1
B156
SET: z4:=0
SET: z1:=1
A123 SET: z3:=1
SET: z4:=0SET: z1:=1
SET: z6:=0
SET: z5:=0SET: z2:=1
E456 SET: z2:=0
SET: z6:=1
SET: z1:=0
SET: z3:=0
SET: z5:=1
SET: z4:=1
t-tx >= t02+tr+tl
t-tx>=t02 and k=2
t-tx >= t02+tr+tl
t-tx>=t02 and k=4
t-tx >= t02+tr+tl
t-tx>=t02 and k=6 t-tx>=t02 and k=5
t-tx >= t02+tr+tlt-tx >= t02+tr+tl
t-tx>=t02 and k=3
t-tx >= t02+tr+tl
t-tx>=t02 and k=1
B234
SET: z3:=1
SET: z6:=0A246
SET: z4:=1
SET: z1:=0
B135SET: z4:=0
SET: z1:=1
A345
SET: z5:=1
SET: z2:=0
A156SET: z3:=0
SET: z6:=1
B126SET: z2:=1
SET: z5:=0
t-tx >= t02 +trt-tx >= t02+trt-tx >= t02+tr t-tx >= t02+tr t-tx >= t02+tr t-tx >= t02+tr
E123
SET: z6:=0
SET: z4:=0
SET: z3:=1
SET: z5:=0
SET: z1:=1
SET: z2:=1
A456
SET: z4:=1
SET: z5:=1
SET: z6:=1
SET: z1:=0
SET: z3:=0SET: z2:=0
SET: tl:=kA*y*Tp*sin (gamr)
SET: gamr:=gam1-kr
SET: tr:= kA*y*Tp*sin(PI3 - gamr)
SET: t02:=(Tp-tr-tl)/2
k=2 or k=4 or k=6 k=1 or k=3 or k=5
SET: k:=0true PRI := 1
t-tx >= Tp and k = 0 SET: tx:=t
SET: gam1:=ASIN(ybeta/y)
true
true
t-tx >= Tp
y:=SQRT(SQU(yalph)+SQU(ybeta))
if (y>10.) {y:=10.}
ω+
T
ECE - LINKECE - LINK
TA B C
Imβ
Rotor
V_ROT1
TTheta_IN
Im_IN
beta_IN
Battery- +
LBATT_A1
HEV: System Simulation with Simplorer
-172.00
172.00
-100.00
0
100.00
74.95m 85.00m80.00m
Phase Current RA.I [A] RB.I [A] RC.I [A]
MULTIPHYSICS
© 2011 ANSYS, Inc. 8/29/1138
HEV MultiPhysics
STRUCTURAL MECHANICS
Mapped Losses
Temperature
Losses
© 2011 ANSYS, Inc. 8/29/1139
GAIN
n
GAIN
ust_in
GAIN iq
Y t
ust
d-q-Current Controller
Speed Control
Yt
M_LOAD
Phase Transformation / Control Signal Generation by Space Vector Modulation
G(s)
GS2
I
I_id
GAIN
id
LIMIT
yq
UL := 10
LL := -10
LIMIT
yd
UL := 10
LL := -10
GAIN
P_id
KP := 1.96
G(s
)
GS1
I
I_n
KI := 29.02k
UL := 10
LL := -10
GAIN
P_PART_n
LIMIT
m_ref
KP := 0.1161k
IGBT1 IGBT2 IGBT3
IGBT4 IGBT5 IGBT6
CON ST
id_ref
KI := 240
GAIN
P_Iq
KP := 1.96
I
I_iq
KI := 240
ICA: EQU
PI3:=pi / 3.
P18:=pi / 180.Tp:=1./fp
wu32:=sqrt(3.) / 2.
kA:=0.1
wu3:=sqrt(3.) gam1:=0.
fp:=10k
tx:=0 costhe:=cos(theta_el)
yalph:=costhe * yd .VAL - sin the * yq.VAL
i1q:=i1beta * costhe - i1alph * sinthe
i1d:=i1alph * costhe + i1beta * si nthe
ybeta:= sinthe * yd.VAL + costhe * yq.VAL
sinthe:=sin(theta_el )
theta_el:=SYMPO D1.PHI DEG * P18
i1beta:=(SYMPOD1.I1A + 2 * SYMPOD1.I1B) / wu3
theta_m: =theta_el / 3.
i1alph:=SYMPOD1.I1A
SET: k:=k+1 SET: gam1:=gam1
SET: kr:=(k-1)*PI3
SET: kl: =k*PI3
kl <= gam1
true
t-tx >= Tp
kr <= gam1 and kl > gam1
yal ph > 0 and ybeta >= 0
SET: tx:=t SET: k:=1yalph = 0 and ybeta = 0PRI := 1
(ybeta > 0 an d yalph <= 0) or (yalph < 0 and yb eta <= 0)ybeta < 0 and yalph >= 0
SET: gam1:=pi -ASIN(ybeta/y)SET: gam1: =2*pi+ASIN(ybeta/y)true
true
A126SET: z3:=0
SET: z6:=1
B345SET: z6:=0
SET: z3:=1
A234SET: z1:=0
SET: z4:=1
B246SET: z5:=0SET: z2:=1
A135SET: z2:=0
SET: z5:=1
B156
SET: z4:=0
SET: z1:=1
A123SET: z3:=1
SET: z4:=0SET: z1:=1
SET: z6:=0
SET: z5:=0SET: z2:=1
E456 SET: z2:=0SET: z6:=1
SET: z1:=0
SET: z3:=0
SET: z5:=1
SET: z4:=1
t-tx >= t02+tr+tl
t-tx> =t02 an d k=2
t-tx >= t02+tr+tl
t-tx> =t02 and k=4
t-tx >= t02+tr+tl
t-tx>=t02 and k=6 t-tx>=t02 and k=5
t-tx >= t02+tr+tlt-tx >= t02+tr+tl
t-tx> =t02 and k=3
t-tx >= t02+tr+tl
t-tx>=t02 and k=1
B234
SET: z3:=1
SET: z6:=0A246
SET: z4:=1
SET: z1:=0
B135SET: z4:=0
SET: z1:=1
A345
SET: z5: =1
SET: z2:=0
A156SET: z3:=0
SET: z6:=1
B126SET: z2:=1
SET: z5:=0
t-tx >= t 02+trt-tx >= t02+trt-tx >= t02+tr t-tx >= t02+tr t-tx >= t02+tr t-tx >= t02+tr
E123
SET: z6:=0
SET: z4:=0
SET: z3:=1
SET: z5:=0
SET: z1:=1
SET: z2:=1
A456
SET: z4:=1
SET: z5:=1
SET: z6:=1
SET: z1:=0
SET: z3:=0
SET: z2:=0
SET: tl:=kA*y*Tp*sin(gamr)
SET: gamr:=gam1-kr
SET: tr:= kA*y*Tp*sin(PI3 - gamr)
SET: t02: =(T p-tr-tl)/2
k=2 or k=4 or k=6 k=1 or k=3 or k=5
SET: k:=0true PRI := 1
t-tx >= Tp and k = 0 SET: tx:= t
SET: gam1:=ASIN(ybet a/ y)
true
true
t-tx >= Tp
y:=SQRT(SQU(yalph)+SQU(ybeta))
if (y>10.) {y:=10.}
ω+
T
ECE - LINKECE - LINK
TA B C
Imβ
Rotor
V_ROT1
TTheta_IN
Im_IN
beta_IN
Ba tte ry- +
LBATT_A1
-172.00
172.00
-100.00
0
100.00
74.95m 85.00m80.00m
Phase Current RA.I [A] RB.I [A] RC.I [A]
Electronics Solutions
HF/SI• Extractors
– HFSS– Q3D– SIwave
• System– Ansoft Designer
EM• Extractor
– RmXprt– Maxwell 2D/3D
• System– Simplorer with Multiphysics
Integration
© 2011 ANSYS, Inc. 8/29/1140
Product UpdatesHigh Frequency
© 2011 ANSYS, Inc. 8/29/1141
• Advanced Integrated Solver Technologies– Finite Arrays with Domain Decomposition– Hybrid solving
• FEBI• IE Regions
• Physical Optics Solver in HFSS-IE• New Layout interface for HFSS: Solver on
Demand in Designer• Usability Enhancement
– Radiated fields…..– 3D modeler improvements
• CAD Integration in Workbench– Improved Multiphysics flow
Overview
© 2011 ANSYS, Inc. 8/29/1142
Advanced Solvers:Finite Arrays with DDM
© 2011 ANSYS, Inc. 8/29/1143
Finite Arrays with Domain DecompositionEfficient solution for
repeating geometries (array) with domain decomposition technique (DDM)
© 2011 ANSYS, Inc. 8/29/1144
A Review: Domain Decomposition
Distributed memory parallel solver technique
Distributes mesh sub-domains to network of processors
Significantly increases simulation capacity
Highly scalable to large numbers of processors
Automatic generation of domains by mesh partitioning
• User friendly• Load balance
Hybrid iterative & direct solver• Multi-frontal direct solver
for each sub-domain• Sub-domains exchange
information iteratively via Robin’s transmission conditions (RTC)
Distributes mesh sub-domains to networked processors and memory
© 2011 ANSYS, Inc. 8/29/1145
Finite ArraysSolve large finite
array designsEfficient setup and
solutionDefine unit cell and
array dimensions• Efficient geometry
creation and representation
Efficient Domain Decomposition solution
• Leverages repeating nature of array geometries
• Only mesh unit cell• Virtually repeat
mesh throughout array
Post-process full S-parameter
• Couplings included• Edge effects
included3D field visualizationFar field patterns for
full array
Ø Memory efficientØ Enabled with the HFSS HPC
product
© 2011 ANSYS, Inc. 8/29/1146
Example: Skewed Waveguide Array
• 16X16 (256 elements and excitations)
• Skewed Rectangular Waveguide (WR90) Array– 1.3M Matrix Size
• Using 8 cores– 3 hrs. solution
time– 0.4GB Memory
total• Using 16 cores
– 2 hrs. solution time
– 0.8GB Memory total
• Additional Cores– Faster solution
time– More memory.
Unit cell shown with wireframe view of virtual array
© 2011 ANSYS, Inc. 8/29/1147
Hybrid Solving: Finite Element-Boundary Integral
© 2011 ANSYS, Inc. 8/29/1148
• Antenna Placement Study: UHF Antenna on Apache UH64 airframe– Finite Elements with DDM– Boundary Integral (3D Method of Moments)– Hybrid Finite Element-Boundary Integral (FE-BI)
Finite Element-Boundary IntegralSolving Larger Problems with Rigor
© 2011 ANSYS, Inc. 8/29/1149
Hybrid Solving: Finite Element- Boundary Integral
Apache helicopter
• UHF antenna placement study @ 900 MHz
Solution volume• 1,250 m3• 33,750 λ3
Solution Specs• 72 engines• Matrix size =
47M• 6 adaptive
passes• 300 GB RAM• 5 hr 30 min
Finite Elements with DDM
© 2011 ANSYS, Inc. 8/29/1150
Hybrid Solving: Finite Element- Boundary Integral
Apache helicopter• UHF antenna
placement study @ 900 MHz
Solution surface• 173 m2• 1557 λ2
Solution Specs• 12 core MP• 680k unknowns• 9 adaptive passes• 83 GB RAM• 5 hr 28 min
Boundary Integral, 3D MoM with HFSS-IE
© 2011 ANSYS, Inc. 8/29/1151
Hybrid Solving: Finite Element- Boundary Integral
Apache helicopter• UHF antenna placement
study @ 900 MHz
FEM solution volume• 69 m3• 1863 λ3
IE solution surface• 236 m2• 2124 λ2
Solution Specs• 12 cores total using
DDM with MP• Matrix Size = 2.9M• 6 adaptive passes• 21 GB RAM• 1 hr 3 min
Hybrid Finite Element – Boundary Integral
Compared to 72 core FEM solution14X less memory5.5 times faster
© 2011 ANSYS, Inc. 8/29/1152
Summary of FEBI performance
Type Time, Ratio Memory, Ratio
FEM + DDM 5hr 30min, 1 300GB, 1
IE 5hr 28min, 1 83GB, 3.6
FEBI 1hr 3min, 5.5 21 GB, 14.3
© 2011 ANSYS, Inc. 8/29/1153
Hybrid Solving: IE Regions
© 2011 ANSYS, Inc. 8/29/1154
FEBI and Physically Separate “Domains”
1meter10λ
1meter20λ
1meter30λ
Frequency Memory Required
3 GHz 2GB
Frequency Memory Required
6 GHz 10GB
Frequency Memory Required
9GHz 30GB
Reflector with multiple FE-BI domains
• Conducting reflector and feed horn each surrounded by air with FEBI applied to surface of air volumes– Provides integral equation “link”
between FEM domains• But 3D MoM solution from integral
equations could be applied directly to conducting surface only
© 2011 ANSYS, Inc. 8/29/1155
HFSS Hybrid Solving – IE Regions
• Parallelized– IE regions
solved in parallel.
– Analogous to FEM domains
• Rigorous– Multiple
reflection• Automate
d
© 2011 ANSYS, Inc. 8/29/1156
HFSS IE Regions - Example
© 2011 ANSYS, Inc. 8/29/1157
Physical Optics
© 2011 ANSYS, Inc. 8/29/1158
HFSS-IE PO
Asymptotic solver for extremely large problems
• In HFSS-IE• Solves electrically huge
problems– And provides first pass
“quick solution” for IE• Currents are
approximated in illuminated regions– Set to zero in shadow
regions• No ray tracing or multiple
“bounces”
Target applications:• Large reflector antennas• RCS of large objects
such as a windmill
Option in solution setup for HFSS-IE.
Sourced by incident wave excitations
• Plane waves or linked HFSS designs as a source
© 2011 ANSYS, Inc. 8/29/1159
PO Examples
Notice the shadowing of the gun barrel on the tank and the tank on the ground.
© 2011 ANSYS, Inc. 8/29/1160
HFSS Transient
© 2011 ANSYS, Inc. 8/29/1161
Transient problems
© 2011 ANSYS, Inc. 8/29/1162
Aircraft: Pulsed RCS
© 2011 ANSYS, Inc. 8/29/1163
HFSS Transient
Introduced in HFSS 13.0Discontinuous Galerkin Time
Domain (DGTD)• Finite element solution
– Retains accuracy and reliability of adapted unstructured-mesh
• Supports higher order basis functions– Efficient for geometries with a wide
range of geometric detail• Local time stepping
– Based on element size, order and material property mesh elements may advance in time with different time steps
© 2011 ANSYS, Inc. 8/29/1164
HFSS Transient
Transient Network Analysis• Separate Frequency and Time
domain “Edit Source“ settings• Specify delay of TDR to
synchronize rise times• Handling of partial S due to
passive ports
Transient• Scaling and delay of individual
sources
General• Support for general frequency
dependent materials
© 2011 ANSYS, Inc. 8/29/1165
Solver on Demand
© 2011 ANSYS, Inc. 8/29/1166
Designer RF with HFSS - Solver on Demand
HFSS - Solver on Demand• Intuitive PCB design entry for
HFSS• Chips, packages, channels,
modules, …• Designer layouts simulated
with HFSS– Automated boundary and port
setups– Finite dielectrics and ground
supported• Wave and Lumped Gap Port
– Single ended and Differential– Vertical and Horizontal– Coaxial, CPW and Grounded
CPW
© 2011 ANSYS, Inc. 8/29/1167
Usability Enhancements
© 2011 ANSYS, Inc. 8/29/1168
General Enhancements• Save Radiated field
data only– Reduced the amount
of stored data
• Import list for Edit Sources– Can include
parametric variables
• Network Installation for clusters– Improved reliability on
Linux• Non-graphical solves
without product-links
• Solves are independent of Mainwin registry
– Installations on Windows• Non-graphical solves
without product-links
• New Registry Configurations– Installation: Lowest
precedence– Defaults applicable
to all users– Machine:
• Defaults applicable to all users on a machine.
– User :• Machine
independent user specific default
– User and machine: Highest precedence• Defaults specific to
user + machine
~10X Reduction
© 2011 ANSYS, Inc. 8/29/1169
CAD Integration on WB Improvements
• CAD integration in ANSYS Workbench provides direct link to 3rd party CAD tools
• Such as ProEngineer, Catia, SpaceClaim• Added support for parametric analysis and
distributed solving of CAD parameter
© 2011 ANSYS, Inc. 8/29/1170
Ansoft to ANSYS Geometry Transfer•Geometry and material assignment
transfer from Ansoft to ANSYS •Consume geometry from multiple upstream CAD sources – Source can be any of CAD, DesignModeler or Ansoft products
– Further geometry edits are possible in ANSYS Design Modeler
•Creates User Defined Model (UDM) for each geometry input.
© 2011 ANSYS, Inc. 8/29/1171
Signal-, Power-Integrity, & EMI Update
Steve Pytel, PhD.Signal Integrity Product Manager
© 2011 ANSYS, Inc. 8/29/1172
• ANSYS ECAD Solutions• HFSS for Signal Integrity• SIwave Full BRD and PKG Solutions • SI Circuit Simulation for IBIS-AMI and
Memory• Q3D Extractor 11.0 Updates• General SI Updates for HFSS, Q3D
Extractor, and DesignerSI• TPA Enhancements
Overview
© 2011 ANSYS, Inc. 8/29/1173
ANSYS ECAD Solutions
© 2011 ANSYS, Inc. 8/29/1174
AnsoftLinks Translation Paths
Cadence Mentor ODB++ Zuken
Q3D SIwave HFSS DesignerTPA Icepak Mechanical
AnsoftLinks
HFSS PlanarEM
Solver on Demand
Static ECAD Transfer (.anf)
AnsoftLinks with Extracta
Dynamic ECAD Transfer
CadenceVirtuoso SiP APD Allegro
Altium
Nexxim HSPICE
© 2011 ANSYS, Inc. 8/29/1175
Cadence• Allegro 16.0, 16.1, 16.2, 16.3 and 16.5• APD 16.0, 16.1, 16.2, 16.3 and 16.5• SiP Digital/RF 16.0, 16.1, 16.2, 16.3 and 16.5• Virtuoso 4.46, 5.0, 5.0.32 and 6.x
Mentor Graphics• Expedition v2005, v2007.1 thru v2007.8• Boardstation 8.x• Boardstation XE v2007, v2007.1, v2007.2,
v2007.3 and v2007.7• PADS PowerPCB v5.2a, v2005 and
v2007
Zuken• CR5000 9.x and lower
ODB++• Altium Designer R10• Mentor Expedition EE7.9.1 and greater• Zuken Cadstar 12.1 (limited support)• Sigrity UPD V 11.0 (limited support)
ECAD Translation Updates
© 2011 ANSYS, Inc. 8/29/1176
HFSS for Signal Integrity
ECAD & Field Solver Improvements
© 2011 ANSYS, Inc. 8/29/1177
Solver on Demand: An ECAD Interface for HFSS
Problem Description:1. Converting package and printed circuit board layout
data to 3D mechanical CAD models creates a large amount of unnecessary overhead in the geometry database
2. A key capability needed for wide-spread use of HFSS as an extraction tool is to make it accessible to non experts
Solution:3. When HFSS is used for package and PCB extraction a
2D Electrical CAD layout editor is better suited for model creation and setup
4. The Designer Layout editor with Solver on Demand improves HFSS accessibility for non-expert engineers who need to use HFSS for package and PCB extraction
– It provides an EMI solution for 2 layer pkg and board design with HFSS and PlanarEM
5. The Designer Layout editor with Solver on Demand significantly reduces the engineering time required to set up package and pcb models for extraction with HFSS
6. Cadence design flows allows a user to solve with HFSS from within the Cadence environment using Cadence Extracta and an IPC link
© 2011 ANSYS, Inc. 8/29/1178
“HFSS for ECAD”
Two Design Flows for Electrical Design• Mechanical CAD
– Connectors, Waveguides– HFSS
• Electric CAD (layout)– PCBs, Packages, On-chip Passives– HFSS - Solver on Demand
© 2011 ANSYS, Inc. 8/29/1179
Highly automated for in layout design environment– Primitives = traces, pads, bondwires, vias– Net name definition
Significantly reduce engineering time interacting with software
Lightweight interface for geometrically complex structures
Direct import of Cadence products using Cadence Extracta
– Allegro, APD, and SiP
Direct HFSS solve from within the Cadence environment – Virtuoso, Allegro, APD, and SiP
“HFSS for ECAD”
© 2011 ANSYS, Inc. 8/29/1180
HFSS within Cadence SPB & Virtuoso
• Dynamic ECAD Flow• Create and Solve models with HFSS from within Cadence SPB
& Virtuoso
HFSS Solution Progress
© 2011 ANSYS, Inc. 8/29/1181
HFSS Setup & Solve in Virtuoso
Back annotation scheduled
for final release
© 2011 ANSYS, Inc. 8/29/1182
HFSS ECAD Layout Editor• HFSS Solver Technology is embedded in Designer as “Solver
on Demand”
Export 3D HFSS Model
Solve in Designer using HFSS
2D+3D Layout view in one
© 2011 ANSYS, Inc. 8/29/1183
HFSS Solve for PKG merged to PCB
Lumped ports on package bumps
Wave Port at coutout boundary
© 2011 ANSYS, Inc. 8/29/1184
Parameterized Differential Vias
© 2011 ANSYS, Inc. 8/29/1185
HFSS for the SI Community SummaryNew in R14
• Parameterized padstacks• Automated causal material• Multi-frequency point adapting• Integrated 2D/3D views• Huray Surface Roughness Models• Lumped Port De-embedding• Trapezoidal Trace Cross-sections• Automated Virtuoso HFSS Design• Passivity Enforced Interpolation
• HFSS Solves from within Cadence
HFSS Padstack Editor with
Parameterization
© 2011 ANSYS, Inc. 8/29/1186
SIwave Full BRD and PKG Solutions
DDR3 and High Speed Serial Improvements
© 2011 ANSYS, Inc. 8/29/1187
Table Impedance MoM Calculator
• Ideal and non-ideal lumped parameters (i.e Zo)
• Nexxim and HSPICE RLC simulations
Via to Via Coupling• Differential pair accuracy
improvements
Solver Support for Arbitrary Antipad Cutouts
• Improvement in via modeling accuracy
SYZ Solver Improvements• Guaranteed passive/causal
SYZ solutions
FWS Improvements for Large Port Count Devices
• Faster convergence and reduced RAM when using “Iterated Fitting of Passivity” for large port count devices
Improved “Push Excitation” Accuracy & Robustness
• SIwave now forces required interpolation from Designer 7.0.
Improved Surface Roughness
• Added Huray surface roughness model
PI Advisor Improvements• Genetic Algorithm
supports weighting of constraints
• Genetic Algorithm supports new constraints– Maximum Total
Capacitor Area– Maximum Number of
Capacitor Types
Improved SYZ Storage Architecture
• 6x reduction in disk space for SYZ parameters
SolverMemory and High Speed Serial Improvements
64 bit GUI for Windows
Table Impedance Calculator
• Flight time plots• Transient Simulations with
Nexxim or HSPICE
PKG & PCB Automation• Graphical selection
Pin Grouping Automation• Multi-part select with
group per part/net definitions
Improved Validation Checker
• Detection of pins belonging to multiple pin groups
Automated DCIR ReportsEquipotential Pads for
DCIR Solver
Temperature Profile Plotting from Icepak
Improved Surface Roughness
• Addition of Huray model in GUI
PI Advisor Improvements• Allowance of weighting
constraints in GUI• Additional constraints
added– Maximum Total
Capacitor Area– Maximum Number of
Capacitor Types
Improved ODB++ SupportSupport for X2Y Low
Inductance Capacitors
GUI
© 2011 ANSYS, Inc. 8/29/1188
DDR3 Solutions: Signal Net Analyzer
• Displays Z0, length, time delay, and reference layer• All possible paths (from each pin to every other pin on net)
are displayed– Sorted in descending order of path distance
• User can click on an individual path in the table– Variation in Z0 is graphically displayed
– Path is highlighted in SIwave’s main layout window
• Ideal reference layer mode (default)– Traces on top & bottom metal layers are assumed to be
microstrips
– Interior traces are assumed to be striplines
• Non-ideal reference layer mode– Reference layer is explicitly calculated for each trace segment
– Some traces may be floating (no suitable reference layer available)
© 2011 ANSYS, Inc. 8/29/1189
Huray Surface Roughness & Via-Via Coupling
© 2011 ANSYS, Inc. 8/29/1190
Equipotential Pads for DCIRPower Density Plot: Without Pad Power Density Plot: With Pad
Current Density Plot: Without Pad Current Density Plot: With Pad
© 2011 ANSYS, Inc. 8/29/1191
SI Circuit Simulation for IBIS-AMI and Memory
© 2011 ANSYS, Inc. 8/29/1192
Macro-modeling Functionality
Circuit Simulation
• Designer• Simplorer• Other
• State-space fitting• Passivity enforcement• Passivity checker• S-parameter visualization• S-matrix reduction• Macro-model generation
HFSS
SIwave
Q3D
Network Data Explorer
Designer
• State Space• Simplorer• Spectre• HSPICE• PSPICE
Measured Data
New functionality for the SI market
© 2011 ANSYS, Inc. 8/29/1193
Network Data Explorer
Graphic comparison showing the difference between the Z-Matrix entries for two different decoupling capacitor schemes.
© 2011 ANSYS, Inc. 8/29/1194
Vendor Libraries
Design Engineers require accurate electrical models for components when designing circuits
A key feature of the web based library support is ease of use. Library installation generally requires users to download files, uncompress them and place them in the correct location on a local drive.
Automated web based download from within Designer automates these steps, making it easy for users to keep their component libraries up to date.
Design Kits • DDR3, PCIe 3.0, HDMI , SATA, SAS, …
Scripting Libraries
• FWS commands, Footprinting, Reporting Templates, …
© 2011 ANSYS, Inc. 8/29/1195
Vendor Libraries
Accessible from the menu via Tools > Download Component Libraries…
Filtering limits the number of components to be updated.
© 2011 ANSYS, Inc. 8/29/1196
Automated IBIS-AMI Importing
© 2011 ANSYS, Inc. 8/29/1197
High Speed Serial Design With IBIS-AMI
• Automated IBIS-AMI Importing– IBIS-AMI Specification
Testing• Pass/Fail• Advanced
© 2011 ANSYS, Inc. 8/29/1198
QuickEye Multi-core Speed Up
Linear speed improvement with multiple cores!
© 2011 ANSYS, Inc. 8/29/1199
Q3D Extractor 11.0
© 2011 ANSYS, Inc. 8/29/11100
Touch Screen Accuracy Improvements
• Added the ability to converge on off diagonal terms with Touch Panel displays
© 2011 ANSYS, Inc. 8/29/11101
0.00 0.01 0.10 1.00 10.00 100.00Freq [MHz]
25.00
30.00
35.00
40.00
45.00
50.00
55.00
AC
L(C
oil:
Co
il_in
,Co
il:C
oil_
in)
[nH
]
Q3DDesign2XY Plot 1 ANSOFT
Curve Info
ACL(Coil:Coil_in,Coil:Coil_in)Setup1 : Sw eep2
Q3D – Magnetic Materials
Q3D AC 10 sMaxwell 3D 50 min
Q3D DC 6min 30 s Sweep 2 s
Total < 7 min 50 minPeak RAM 0.6 GB 5 GB
L(f)
Simulation Time
HFSS
Maxwell*
Q3D
* Each additional frequency point takes ~ 15 minutes to solve with Maxwell
Electroplated Nickel has 5Bulk Nickel has 600
© 2011 ANSYS, Inc. 8/29/11102
Ansoft HPC Enhancements: Fixed Variables
Desktop supports fixed variables
• Solution database is NOT indexed by these variables
• User will not sweep them• Any change to these
variables invalidate existing solutions
Benefits• Faster access to solution
database– Faster post-processing
• Improved reporter-dialog response
• Via Wizard generated project with 746 variables– Only one variable, called Pad, is
swept in a parametric setup– Turn off “Sweep” checkbox for all
variables except Pad
