Reliability

Moisture sensitivity level 1(MSL1) Pass Ball pull after multi-reflow Pass Thermal cycle test-IPC-TC3 Pass High temperature/humidity test Pass Biased HTMT Pass

MOS device

Metal layerCu pillar/Si interposer/Si-Si stack

Wire bond/Bump/Princo uBump

OrganicSubstrate/Assembly

PCB/FPC/Assembly

TSV

MOS device

Metal layerWire bond/Bump/Princo uBump

OrganicSubstrate/Assembly

PCB/FPC/Assembly

Front-end/Foundry Back-end/OSAT PCB/EMS/Module

Front-end/Foundry

Middle-end/Foundry or OSAT Back-end/OSAT

PCB/EMS/Module

Chip owner’s solution

At present:

Near future:

Princo’s solution

Ready for your questions & requirement!