1 March 2013

INVESTOR PRESENTATION

ANNUAL AND Q4-2012 RESULTS

2 March 2013

SAFE HARBOR STATEMENT

This presentation contains statements about management's future expectations, plans and prospects of our business that

constitute forward-looking statements, which are found in various places throughout the press release, including , but not

limited to, statements relating to expectations of orders, net sales, product shipments, backlog, expenses, timing of

purchases of assembly equipment by customers, gross margins, operating results and capital expenditures. The use of

words such as “anticipate”, “estimate”, “expect”, “can”, “intend”, “believes”, “may”, “plan”, “predict”, “project”, “forecast”,

“will”, “would”, and similar expressions are intended to identify forward looking statements, although not all forward looking

statements contain these identifying words. The financial guidance set forth under the heading “Outlook” constitutes forward

looking statements. While these forward looking statements represent our judgments and expectations concerning the

development of our business, a number of risks, uncertainties and other important factors could cause actual developments

and results to differ materially from those contained in forward looking statements, including the discovery of weaknesses in

our internal controls and procedures, our inability to maintain continued demand for our products; the impact on our

business of potential disruptions to European economies from euro zone sovereign credit issues; failure of anticipated

orders to materialize or postponement or cancellation of orders, generally without charges; the volatility in the demand for

semiconductors and our products and services; failure to adequately decrease costs and expenses as revenues decline,

loss of significant customers, lengthening of the sales cycle, incurring additional restructuring charges in the future, acts of

terrorism and violence; inability to forecast demand and inventory levels for our products, the integrity of product pricing and

protect our intellectual property in foreign jurisdictions; risks, such as changes in trade regulations, currency fluctuations,

political instability and war, associated with substantial foreign customers, suppliers and foreign manufacturing operations;

potential instability in foreign capital markets; the risk of failure to successfully manage our diverse operations; those

additional risk factors set forth in Besi's annual report for the year ended December 31, 2011 and other key factors that

could adversely affect our businesses and financial performance contained in our filings and reports, including our statutory

consolidated statements. We are under no obligation to (and expressly disclaim any such obligation to) update or alter our

forward-looking statements whether as a result of new information, future events or otherwise.

3 March 2013

AGENDA

I. Company Overview

II. Market

III. Strategy

IV. Financial Review

V. Outlook & Summary

4 March 2013

I. COMPANY OVERVIEW

5 March 2013

COMPANY OVERVIEW

• Leading assembly equipment supplier with #1 and #2 positions in key products. 27% addressable market share

• Broad portfolio: die attach, packaging, plating, wire bond

• Strategic positioning in wafer level and substrate packaging

• Global manufacturing operations in 7 countries; 1,539 employees worldwide. HQ in Duiven, the Netherlands

Corporate Profile

• 2012 revenue and net income of € 273.7 and € 15.8 million

• Cash at 12/31/12: € 106.4 million

• Total debt at 12/31/12: € 26.9 million Financial Highlights

• 2009 acquisition, restructuring and Asian production transfer have transformed company and earnings potential

• Advanced packaging, smart phone/tablet growth and Asian production transfer offer significant upside potential

• Stock market valuation at significant discount to peers

Investment Considerations

6 March 2013

15%

20%

25%

30%

35%

40%

45%

50%

55%

60%

0

50

100

150

200

250

300

350

2003 2004 2005 2006 2007 2008 2009 2010 2011 2012

Gro

ss M

arg

in

Re

ve

nu

e (

€ m

illio

n)

Revenue Gross Margin

CORPORATE TRANSFORMATION

Restructuring

Asian Production Transfer

Dragon I

complete:

€ 6 million

cost savings

Dragon II

complete:

€ 15 million

cost savings

Die Attach Acquisitions

Standard packaging and certain die

bonding systems transferred to

Malaysia

Dutch tooling &

Hungarian die bonding

transferred

Epoxy DB transferred

to Malaysia

Asia capacity expansion

Cost

savings

plan

initiated

13%

Headcount

reduction;

Plating unit

rationalized

Soft solder

DB

transfer to

Malaysia

initiated

Asian headcount increased from 34% in ‘06 to 54% of total in ‘12

Malaysian system and Chinese tooling capacity expansion

7 March 2013

• Market cap € 219.6 million: 37.5 million shares x € 5.86 price (March 4)

• Shares listed on NYSE Euronext Amsterdam (BESI) and NASDAQ OTCQX

International (BESIY). 2012 average daily volume of 42,110 shares

• Trading at significant discount to industry multiples:

Besi (a) Peers (b, c) Industry (c, d)

TTM P/S 0.8x 1.6x 2.1x

TTM EV/EBITDA 4.3x 5.9x 8.6x

2013E P/S 0.7x 1.5x 2.4x

2013E EV/EBITDA 2.6x 7.8x 9.6x

STOCK PRICE INFORMATION

Source: a) Besi: Canaccord Genuity, SNS Securities research & ABN AMRO b) Peers: ASMPT, Disco Corp, Mühlbauer, Tokyo Seimitsu, Shinkawa, Süss MicroTec and K&S c) Reuters & MS estimates d) Industry: Reuters semi equipment universe

8 March 2013

BESI EQUIPMENT PORTFOLIO

Die Attach

• Die Bonding

- 2100 xP

- 2009 series

- 2100 HS

- 2100 sD

- 2100PPP

• Multi Module Die

Attach

- 2200 evo

• Flip Chip - 8800 Quantum

- 8800 Chameo

- "Smart Line"

- 2100FC

Packaging & Plating Wire Bonding

• Die Sorting

- DS 9000E

- CS 1250

- DS 11000

• 3100

• 3100

Smart Card

• 3200 Smart

Card

• Molding

- AMS series

- AMS Foil

- AMS LM 95

• Trim & Form

- Compact series

- Power series

- Compact Line

XHD

• Singulation

- FSL

• Plating

- Leadframe

- Solar

- Film & foil

New

New

In Development

• TCB flip chip system

• Common die attach platform

• Common packaging platform

New

New

New

9 March 2013

Dicing

Back-end Semiconductor Assembly Process

Die Attach Wire Bond Packaging Plating

Leadframe Assembly

Substrate

Wire Bond Assembly

Substrate

Flip Chip Assembly

Wafer Level Packaging

Flip Chip Assembly

Wire Bond

Die Bond

FC Die Bond

FC Die Bond

Molding

Molding

Molding

Trim & Form

Singulation

Singulation

Singulation

Plating

Ball Grid Array

Ball Grid Array

Die Sort

Die Sort

Die Sort

Die Attach Packaging Ball Attach

BESI PRODUCT POSITIONING

10 March 2013

GLOBAL OPERATIONS

as of 31 December 2012

Europe/N.A. Asia

Revenue (MMs) € 71.9 26.3% € 201.8 73.7%

Headcount 703 45.7% 836 54.3%

• Development activities in Europe and USA

• Increasing production and sales/service

activities in Asia

Sales Office

Production Site

Sales & Production Site

* R&D Site

Leshan

Chengdu Shanghai

Korea

Taiwan

Philippines Malaysia

Singapore*

Salem* Suzhou

Radfeld, (Austria) Cham,

(Switzerland)

Duiven & Drunen,

(The Netherlands)

Chandler

Shenzhen

11 March 2013

Customers End Products End Use

CUSTOMER ECOSYSTEM

• Blue chip customer base, top 10 customers represent 48% of 2012 revenue

• Leading Asian Subcontractors and IDMs. 57/43% split in 2012

• Equipment utilized to produce chips for leading fabless companies: Qualcomm,

Broadcom, MediaTek

• Long term relationships, some exceeding 45 years

12 March 2013

Computer,

PCs50%

Mobile

Internet Devices

22%

Auto13%

Industrial10%

LED3%

Service2%

2008

PRODUCT SHIFT TO ADVANCED PACKAGING

END USER APPLICATIONS

Computer, PCs21%

Mobile Internet Devices

35%

Auto17%

Industrial10%

LED5%

Service12%

2012

Source: 2012 Company Estimates

• Mobile internet

devices now equal

35% of end user

revenue

• Automotive has also

increased

significantly in recent

years

• Service/spare parts

have grown to 12%.

Less cyclical revenue

stream

13 March 2013

II. MARKET

14 March 2013

ASSEMBLY EQUIPMENT MARKET COMPOSITION

• 52% assembly market 2011 represented by die attach and wire bonding equipment

• Besi focus: die attach and packaging segments

Die Attach

60%

Packaging

39%

Plating

1%

Flip Chip

12%

Die Sorting

3%

Singulation

8%

Presses

9%

Molds

15%

Lead Trim &

Form

7% Die Bonding

44%

Assembly Equipment Market *

(2011: $4.2 billion) Besi Addressable Market *

(2011: $1.7 billion)

Wire Bonding

25%

Die Attach

27%

Packaging

18%

Plating

1%

Other Assembly

(Inspection, Dicing)

29%

* Source: VLSI January 2012

Plating

2%

15 March 2013

ASSEMBLY EQUIPMENT MARKET FORECAST

Source: VLSI October 2012

• VLSI estimates total assembly market of $4.2 billion in 2011

• 2012/2013 estimates uncertain given market volatility

2.9

2.1

4.5

4.24.0 4.0

-26.2% -28.2%

120.5%

-7.8%-3.7% -1.0%

0

1

2

3

4

5

6

2008 2009 2010 2011 2012E 2013E

-40%

-20%

0%

20%

40%

60%

80%

100%

120%

140%

160%

Assembly Equipment Market Size YoY Growth Rate

16 March 2013

IC PRICING AND ASSEMBLY MARKET TRENDS

Assembly Capacity Utilization & IC Pricing

Book to Bill Ratio

• High degree of industry volatility over past 3 years due to customer uncertainty

• Assembly equipment market has been more volatile than semi equipment market

• Book/bill and pricing improved in Q4-12. Could be recent industry trough

Source: VLSI February 2013 Source: Semi February 2013

1.23

1.12 1.14

1.51

1.40

1.00

0.50

0.60

0.70

0.80

0.90

1.00

1.10

1.20

1.30

1.40

1.50

1.60

Ja

n 1

0

Fe

b 1

0

Ma

r 1

0

Ap

r 1

0

Ma

y 1

0

Ju

n 1

0

Ju

l 10

Au

g 1

0

Se

pt

10

Oc

t 1

0

No

v 1

0

De

c 1

0

Ja

n 1

1

Fe

b 1

1

Ma

r 1

1

Ap

r 1

1

Ma

y 1

1

Ju

n 1

1

Ju

l 11

Au

g 1

1

Se

pt

11

Oc

t 1

1

No

v 1

1

De

c 1

1

Ja

n 1

2

Fe

b 1

2

Ma

r 1

2

Ap

r 1

2

Ma

y 1

2

Ju

n 1

2

Ju

l 12

Au

g 1

2

Se

pt

12

Oc

t 1

2

No

v 1

2

De

c 1

2

Ja

n 1

3

Semiconductor Equipment Book to Bill Trends(3 month moving average)

Assembly Equipment

Total Semi Equipment1.14

1.16

1.18

1.20

1.22

1.24

1.26

1.28

1.30

1.32

1.34

1.36

1.38

1.40

50.0%

60.0%

70.0%

80.0%

90.0%

100.0%

2010 JAN

APR JUL OCT 2011 JAN

APR JUL OCT 2012 JAN

APR JUL OCT

3 M

on

th A

vg

Pri

cin

g (

$)

% C

ap

acit

y U

tili

zati

on

Assembly Utilization IC ASP

17 March 2013

27% 24% 27%

0%

10%

20%

30%

40%

2009 2010 2011

Addressable Market Share

13% 10%

12%

0%

10%

20%

30%

40%

2009 2010 2011

Packaging Market Share

29% 29% 32%

0%

10%

20%

30%

40%

2009 2010 2011

Die Attach Market Share

11% 14% 14%

0%

10%

20%

30%

40%

2009 2010 2011

Assembly Market Share

BESI COMPETITIVE POSITION

Mkt Size: $1,015MM Mkt Size: $668MM

*Source: VLSI Jan 2012

Mkt Size: $1,700MM Mkt Size: $4,192MM

Competition: ASM-PT, K/S, Shinkawa, Tokyo

Semitsu, Disco

Company Position: #3

• #3 leading assembly supplier

• #2 in addressable market with

27% share

• Leader in die attach

• Gained market share in 2011:

• Die attach (die bonding and

sorting)

• Packaging (molding)

• Leader in growth areas:

• Multi module die attach

• Flip Chip

• Ultra thin molding

• Accuracy, precision and

speed distinguishes Besi vs.

competition, particularly for

mainstream market

Competition: ASM-PT, Shinkawa, Panasonic,

Muhlbauer

Company Position: #1 Die Bonding, #1 Multi Module,

#1 Flip Chip,

#2 Die Sorting

Competition: Towa, ASM-PT, Yamada, Dai Ichi

Seiko, Gallant, Hanmi, Rocco

Company Position: #2 Molding, #2 T&F

#3 Singulation

Competition: ASM-PT, Disco, Shinkawa, Towa,

Hanmi, Hitachi

Company Position: #2

18 March 2013

III. STRATEGY

19 March 2013

BUSINESS STRATEGY

Vision

Technology-led, mainstream supplier of substrate and wafer level

packaging solutions

How to win

Market

positioning Fast growing, leading edge market segments

World class assembly

equipment manufacturer

Actions

Leverage "One Besi" Strategy

Enter selected

markets with

leading technology

Maximize product

value with transfer

into mainstream

Exit when

technology becomes

“commoditized”

(II) Accelerate revenue growth

(III) Reduce structural costs

(IV) Transfer production to Asia

(V) Acquire complementary companies

(I) Maintain leading edge technology

20 March 2013

PRODUCT STRATEGY:

ADVANCED PACKAGING IS THE FUTURE

Greater Miniaturization

Greater Complexity

Increased Density

Higher Performance

Lower Power Consumption

Higher Accuracy

• High growth applications require ever smaller, denser and more complex chips with increased performance, all at lower power usage.

• <40 nanometer geometry will be the standard chip design over the next 3-5 years

• System on Chip or System in Package via substrate and wafer level packaging process is the only answer

• Besi has full range of AP systems. 2012E revenue: 70% substrate/wafer level vs. 30% leadframe

Die Attach

• Die Sorting: DS 9000

• Die Bonding: ES 2009, 2100

• Flip Chip: DC 8800 FC

• Multi Module: DC EVO 2200

Packaging

• Molding: AMS-LM 95

• Singulation: FCL

High Growth End

User Areas:

Mobile internet

devices, Digital set

top boxes, Autos,

MEMS

21 March 2013

Source: Prismark

1,050 900 850 600

400 650 850 1,500

0

500

1,000

1,500

2,000

2,500

2011 2012 2013 2014 2015 2016

mill

ion

ph

on

es

Smart Phones 2011-2016

Basic Phones Smart Phones

62.5%

30.8%

76.4%

Tablets 2011 - 2014

MOBILE INTERNET DEVICE MARKET TRENDS

• Rapid unit growth in smart

phones and tablets forecast

over next 5 years

• Estimated unit growth rates:

• Smart phones:

• 2012: 62.5%

• 2016: 3.5x

• Tablets:

• 2012: 120%

• 2014: 4x

• Significant potential revenue

growth driver

22 March 2013

SMART PHONE ILLUSTRATION

Main Components Manufacturer Country Besi Systems Utilized

Processor Samsung South Korea 8800FCQ, AMS-W, Singulation

DRAM Memory Samsung South Korea 2100sD, AMS-W, Singulation

Flash Memory Chip Samsung South Korea 2100sD, AMS-W, Singulation

Battery Samsung South Korea N/A

Power Management Dialog Germany 2100sD, 2009

Compass AKM Japan N/A

Accelerator/Gyroscope ST Micro Italy/France 2100sD

Communications

Radio Frequency Memory Intel USA 8800FCQ, Singulation

Wi-Fi/Bluetooth/GPS Broadcom USA 2200 evo, AMS-W, Singulation

Receiver/Transceiver Infineon Germany 8800FCQ, AMS-I, Singulation

PA Module Skyworks, Triquint USA

2200 evo, AMS-W, Singulation, 8800 Chameo

Video/Audio

Touch Screen Control TI USA 2100sD, AMS-W, Singulation

Audio Codec Cirrus Logic USA 2100sD, AMS-W, Singulation

LCD Display LG South Korea N/A

Touch Screen Wintek USA N/A

Camera – 5/8 megapixel/VGA LG, Foxconn, CoWell

South Korea, China 2200 evo

Besi systems are capable of assembling components representing up to 50% of smart phone content

23 March 2013

Wire Bonding

$1,067 76%

Flip Chip$337 24%

2016E

FLIP CHIP/WIRE BOND OPPORTUNITY

• Move to <40 nanometer can only be accomplished by flip chip die bonding vs. wire bonding process

• Flip chip revenue represents only 16% of total potential market of $1.3 billion (2011)

• Rapid share gain vs. wire bonding over next 5 years (9.9% CAGR delta) as per VLSI

• Growth rates could accelerate depending on adoption rates of key IDMs/subcons

Wire

Bonding$1,053 84%

Flip Chip

$208 16%

2011

CAGR 2011 – 16

Flip Chip 10.2%

Wire Bond 0.3%

Wire Bonding Flip Chip Bonding

Reduces board area by up to 95%.

Requires far less height

Higher speed electrical

performance

Greater I/O connection flexibility

More durable interconnection

method

Lower cost for high volume production,

with costs below $0.01 per connection

Flip Chip Advantages

* Source: VLSI October 2012

24 March 2013

KEY STRATEGIC OBJECTIVES

2012 2013 2014

Operational Objectives

Soft Solder DB production transfer to Malaysia

50% Malaysia/100% China capacity expansion

European Die attach integration activities

Expansion of Asian supply chain. System module outsourcing

Development Objectives

TCB flip chip die bonding development

300-450 mm wafer handling

Common platform activities

25 March 2013

AQUISITION STRATEGY

1993 1995 1997 2000 2002 2005 2009

• € 50 million packaging company has become € 274 million assembly

equipment supplier

• Consolidating leading edge assembly technologies

• 4 acquisitions since 2000 totaling € 80 million, net created Die Attach leader

• Seeking technology led companies which increase advanced packaging

presence and can be incorporated into One Besi platform

Packaging Plating Leadframes Flip Chip Chip Sorting Flip Chip/

Multi Chip

Single Chip

Packaging & Plating Die Attach

26 March 2013

IV. FINANCIAL REVIEW

27 March 2013

SUMMARY FINANCIAL HIGHLIGHTS

• Financial transformation since 2008

• Scale and market presence have changed:

• Esec acquisition expanded mainstream

presence and leveraged revenue potential

• Strategic positioning in advanced

packaging has yielded benefits:

• Enhanced top line growth

• Increased gross margins

• Restructuring efforts have aided gross

margins and profits in face of 2011/2012

industry downturn due to:

• Advanced packaging presence

• Ongoing Asian production transfer

• Reduction of European based costs

• Die attach integration

• Product line restructurings

• Scalability of business model increased in

response to increased order volatility

• Solid liquidity base. Expanding net cash

Year Ended December 31,

(€ millions, except share data) 2010 2011 2012

Revenue

351.1 326.9 273.7

Orders 376.5 301.1 276.1

Gross margin 39% 40% 40%

EBITDA 60.5 45.6 32.4

Pretax income 47.4 34.4 19.5

Net income 47.3 26.4 15.8

EPS (diluted) 1.25 0.73 0.42

Net margin 13% 8% 6%

Adj. net income (loss) 41.6 27.1 18.2

Adj. EPS (diluted) 1.11 0.74 0.49

Net Cash 22.9 62.7 79.5

28 March 2013

REVENUE/GROSS MARGIN TRENDS

56.6

89.5

100.6104.4

91.1

89.9

75.6

70.4

55.8

87.0

74.6

56.3

97.3

133.7

88.1

57.4

88.3

82.5

75.1

55.2

84.2

91.1

48.752.0

36.4%

33.4%

38.7%

40.1% 40.2% 40.0%

41.2%

40.0%

38.5%39.4%

41.5%

40.3% 37.7%

30.0%

35.0%

40.0%

45.0%

50.0%

55.0%

60.0%

0

20

40

60

80

100

120

140

Q1-10 Q2-10 Q3-10 Q4-10 Q1-11 Q2-11 Q3-11 Q4-11 Q1-12 Q2-12 Q3-12 Q4-12

(eu

ro in

mil

lion

s)

Revenue OrdersGross Margin Gross Margin ex Restructuring

• Quarterly revenue/order patterns show

cyclicality of semiconductor business:

• Three cycles past 3 years; very volatile

• Global macro uncertainty = customer

caution + short term purchasing patterns

• 24.5% decrease in Q4-12 sequential

revenue

• Product mix shift past 3 years to higher

margin advanced packaging systems:

• Multi module and flip chip die attach

• Ultra thin molding systems

• Influenced by mobile internet devices and

intelligent automotive components

• Exit from lower margin plating, wire

bonding and packaging system sales

has also helped

• Gross margins have held up despite

cyclicality:

• Increased scalability of production model

• Product mix shift to higher margin

advanced packaging systems

• Lower unit costs due to Asian production

transfer

• Lower European production personnel

29 March 2013

(2.6)

15.4

19.4

3.2

1.21.2

11.0

14.4

3.93.3

10.0

15.0

9.6

8.8

4.9

0.2

4.6

-5

0

5

10

15

20

Q1-10 Q2-10 Q3-10 Q4-10 Q1-11 Q2-11 Q3-11 Q4-11 Q1-12 Q2-12 Q3-12 Q4-12

(eu

ro in

mill

ion

s)

Net Income Adjusted Net Income

NET INCOME TRENDS

• Cyclical peak earnings of € 47.3 million

reached in 2010

• Significant contribution from Esec

products/turnaround

• 2012 earnings declined to € 15.8 million.

Adversely affected by:

• 16.3% revenue decrease vs. 2011

• Customer caution in light of ongoing

global macro concerns

• € 2.4 million restructuring charges

• € 1.2 million Increased forex hedging

losses

• Partial offset:

• 11% reduction in European headcount

• 7% reduction in cost/production

employee

• 12% opex reduction

• € 3.0 million benefit from revaluation of

tax loss carry forwards

• Significant leverage in operating model

• Quarterly opex have ranged between

€ 20-24 million over past 8 quarters

• € 21.2 million in Q4-12 ex restructuring

4.3

30 March 2013

BREAK EVEN REVENUE LEVELS

270

235

200 212

-

50

100

150

200

250

300

2011 2012 2013E

(€ m

illi

on

s)

(13.0%)

(10.0% - 15.0%)

31 March 2013

47.7 48.1

55.0

69.3 65.5

61.8

76.6

87.5

93.5

77.3

89.8

106.4

46.8

49.4 49.9

46.4 45.9

16.1

27.0 24.8

23.1

27.9 30.6

26.9

0

20

40

60

80

100

120

Q1-10 Q2-10 Q3-10 Q4-10 Q1-11 Q2-11 Q3-11 Q4-11 Q1-12 Q2-12 Q3-12 Q4-12

(euro

in m

illio

ns)

Cash Debt

LIQUIDITY TRENDS

Net Cash 0.9 (1.3) 5.1 22.9 19.6 45.7 49.6 62.7 70.4 49.4 59.2 79.5

• Solid liquidity position

• € 106.4 million cash at 12/31/12

• € 2.83 per share relative to share price of

€ 5.79 at year end

• Net cash has grown to € 79.5 million

from € 19.6 million at year end 2009

• Significant increase in profitability

• Redemption and share conversion of 5.5%

convertible notes in Q2 2011

• Improved working capital management

• Shareholder value enhanced

• € 26 million spent on share repurchases

and cash dividends in 2011/2012

• 1.5 million share buyback program initiated

in October 2012

• Strong balance sheet supports future

organic growth and acquisition strategy

32 March 2013

DIVIDEND TRENDS

0.20 0.22 0.22

- -

0.08

4.0% 4.3%

3.8%

5.2%

0.0%

1.0%

2.0%

3.0%

4.0%

5.0%

6.0%

0.00

0.05

0.10

0.15

0.20

0.25

0.30

0.35

0.40

0.45

0.50

2009 2010 2011 2012 (b)

Div

ide

nd

yie

ld

Div

ide

nd

(€)

Base Dividend Special Dividend

Base Dividend Yield (a) Total Dividend Yield (a)

a) Based on year end stock price

b) Proposed for approval at April 2013 AGM

33 March 2013

V. OUTLOOK & SUMMARY

34 March 2013

Q1-2013 GUIDANCE

• Industry trough may have been reached in Q4-12. Modest improvement forecast based on

order trends

• Q1-13 sequential revenue up approximately 5% vs. Q4-12

• Gross margins will range between 37-39%

• Opex declines to approximately € 20.5 million (ex restructuring)

• Estimated restructuring charges of € 0.3 million

• Capex of € 0.9 million

Revenue Gross Margin* Operating Expenses* Capex

Q4 Q1 Q4 Q1 Q4 Q1 Q4 Q1

€ 56.3 37.7% € 21.2 € 1.8

37%

-

39%

Up

5%

Down

€ 0.9

MM

* Excluding restructuring

Down

€ 0.7

MM

35 March 2013

SUMMARY

Leading semi assembly equipment supplier with #1

or #2 positions in fast growing advanced

packaging segments

Scalability and profitability of business model greatly

enhanced

Macro uncertainty causes volatility in quarterly results

2011-2012

Near term industry outlook has improved

Solid liquidity position.

€ 79.5 million net cash at year end 2012

Significant upside potential.

Advanced packaging, mobile internet devices,

ongoing cost reduction and Asian production transfer

Attractive stock market valuation and dividend yield

relative to peers

36 March 2013

FINANCIAL CALENDAR

6-Mar-13 Netherlands Roadshow, ABN AMRO Bank

7-Mar-13 Switzerland Roadshow, ABN AMRO Bank

8-Mar-13 Rabobank International TMT Conference, Amsterdam

13-Mar-13 Annual Report Publication

4-Apr-13 London Roadshow, ABN AMRO Bank

24-Apr-13 Q1-2013 Results

24-Apr-13 Annual General Meeting of Shareholders

31-Jul-13 Q2-2013 Results

31-Oct-13 Q3-2013 Results