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INVESTOR PRESENTATION June 2019
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Page 1: INVESTOR PRESENTATION · Semiconductor wafer growth Diode processing, chip mounting & burn-in Laser Diode Packaging Over 200 watts of output power from 100 μm core fiber Optical

INVESTOR PRESENTATION

June 2019

Page 2: INVESTOR PRESENTATION · Semiconductor wafer growth Diode processing, chip mounting & burn-in Laser Diode Packaging Over 200 watts of output power from 100 μm core fiber Optical

The statements in this presentation that relate to future plans, market forecasts, events or performance are forward-looking statements.

These statements involve risks and uncertainties, including, risks associated with the strength or weakness of the business conditions in

industries and geographic markets that IPG serves, particularly the effect of downturns in the markets IPG serves; uncertainties and adverse

changes in the general economic conditions of markets; IPG's ability to penetrate new applications for fiber lasers and increase market share;

the rate of acceptance and penetration of IPG's products; inability to manage risks associated with international customers and operations;

foreign currency fluctuations; high levels of fixed costs from IPG's vertical integration; the appropriateness of IPG's manufacturing capacity for

the level of demand; competitive factors, including declining average selling prices; the effect of acquisitions and investments; inventory

write-downs; intellectual property infringement claims and litigation; interruption in supply of key components; manufacturing risks;

government regulations and trade sanctions; and other risks identified in the Company's SEC filings. Readers are encouraged to refer to the

risk factors described in the Company's Annual Report on Form 10-K and its periodic reports filed with the SEC, as applicable. Actual results,

events and performance may differ materially. Readers are cautioned not to rely on the forward-looking statements, which speak only as of

the date hereof. The Company undertakes no obligation to release publicly the result of any revisions to these forward-looking statements

that may be made to reflect events or circumstances after the date hereof or to reflect the occurrence of unanticipated events.

2

Safe Harbor Statement

Page 3: INVESTOR PRESENTATION · Semiconductor wafer growth Diode processing, chip mounting & burn-in Laser Diode Packaging Over 200 watts of output power from 100 μm core fiber Optical

PRODUCT ACROSS ALL INDUSTRIES

are made better AND at lower cost with

IPG FIBER LASERS

Page 4: INVESTOR PRESENTATION · Semiconductor wafer growth Diode processing, chip mounting & burn-in Laser Diode Packaging Over 200 watts of output power from 100 μm core fiber Optical

4

Revolutionizing the Laser Industry

Carbon Dioxide (CO2)

Expensive Bulky Unreliable Difficult to Operate

Inefficient Frequent Maintenance Costly Consumables Not scalable

Traditional Lasers

Lamp-Pumped Nd: YAG

IPG Fiber Lasers

Higher Productivity Compact Reliable Robust

Efficient Minimal Maintenance No Consumables Scalable

Ultra High Power Continuous Wave (CW) Lasers

High Peak Power Lasers with Quasi CW (QCW) Option

High Power Nanosecond Pulsed Pico & Femtosecond Pulsed

Adjustable Mode Beam and QCW Lasers

Page 5: INVESTOR PRESENTATION · Semiconductor wafer growth Diode processing, chip mounting & burn-in Laser Diode Packaging Over 200 watts of output power from 100 μm core fiber Optical

Making our fiber laser technology the tool of choice in mass production

Our Mission

5

Page 6: INVESTOR PRESENTATION · Semiconductor wafer growth Diode processing, chip mounting & burn-in Laser Diode Packaging Over 200 watts of output power from 100 μm core fiber Optical

Key Takeaways

6

Expanding multi-billion dollar addressable market opportunity

Strong growth in earnings and cash flow

Vertical integration, manufacturing scale, and technology driving industry-leading margins

Global market leader in fiber laser technology across multiple end markets and applications

Page 7: INVESTOR PRESENTATION · Semiconductor wafer growth Diode processing, chip mounting & burn-in Laser Diode Packaging Over 200 watts of output power from 100 μm core fiber Optical

$0B

$20B

$40B

$60B

$80B

$100B

2008 2010 2012 2014 2016 2018 2020 2022

Non-Laser Machine Tools

Laser-Based Systems

Global Machine Tool Consumption in 2018: $81B Global Cutting Laser Systems in 2018: ~$6B Laser Cutting Tools 6-7% of Worldwide Machine Tools & Growing

(1) Conversion from Non-Laser to Laser Technologies

Source: Oxford Economics, Optech Consulting and IPG Photonics Corporation

$0B

$1B

$2B

$3B

2015 2016 2017 2018 2019 2020 2021 2022 2023

Fiber Lasers a Growing Percentage of Annual Demand for High-Power Industrial Laser Cutting Sources

Source: Optech Consulting and IPG Photonics Corporation

(2) Conversion from Traditional Lasers to Fiber Lasers

7

Dual Growth Strategies in Largest Market

Page 8: INVESTOR PRESENTATION · Semiconductor wafer growth Diode processing, chip mounting & burn-in Laser Diode Packaging Over 200 watts of output power from 100 μm core fiber Optical

8

Broadest Portfolio of Fiber Lasers

Thick steel cut with a continuous wave laser

Surface Cleaning using a pulsed laser

Micromachining using an ultrafast laser

Drilling using a quasi-continuous wave laser

Peak Power (Megawatts)

Continuous Wave

Time Quasi-Continuous

Wave

Nanosecond Pulsed

Picosecond Pulsed

Femtosecond Pulsed

Nanosecond Pulsed

Throughput Precision

Pulse Duration: <500 fs Peak Power: >20 MW Applications: thin metal cutting and drilling, ophthalmic surgery, high precision, scientific

Pulse Duration: ~2 ps Peak Power: >10 MW Applications: black marking, sapphire and glass scribing, solar thin films, OLED film cutting, scientific

Pulse Duration: 0.7-5 ns Peak Power: >150 kW Applications: thin-film ablation, low-k and silicon dicing, glass scribing

Pulse Duration: 1-200 ns Peak Power: 1 MW Applications: scribing, thin-film ablation, via drilling and flex cutting, surface preparation, texturing, annealing, marking, drilling and scribing

Pulse Duration: 0.05-50 ms Peak Power: 23kW Applications: cutting, welding, soldering, drilling, brazing, annealing

Peak Power: 120kW Applications: cutting, welding, soldering, drilling, brazing

Any wavelength, mode of operation, power, beam parameters or application

X-Ray

10 nm 400 nm

Ultraviolet

UV Lasers

Visible

700 nm

Blue, Green, Yellow, Orange , Red Lasers

1.5 μm

Near-Infrared

Ytterbium Lasers

Erbium Lasers

Diode Lasers

Mid-Infrared Far-IR

10 μm

Thulium Lasers

Holmium Lasers

Cr:Zn/Se/S Lasers

Fe:ZnSe/S Lasers

Page 9: INVESTOR PRESENTATION · Semiconductor wafer growth Diode processing, chip mounting & burn-in Laser Diode Packaging Over 200 watts of output power from 100 μm core fiber Optical

Monolithic Design

Highest Power

Record Power

Efficiency

Beam Quality

Modular / Scalable

Architecture Reliability

MOPA Configuration

9

Advantages of Our Fiber Lasers

Faster Processing

Speed

Lower Operating

Costs

Easy Systems Integration

Small Footprint

Efficient Cooling

Page 10: INVESTOR PRESENTATION · Semiconductor wafer growth Diode processing, chip mounting & burn-in Laser Diode Packaging Over 200 watts of output power from 100 μm core fiber Optical

10

Significant Barriers to Entry

Technology: IP & Process

Know-How

Business: Vertical Integration & Scale

Page 11: INVESTOR PRESENTATION · Semiconductor wafer growth Diode processing, chip mounting & burn-in Laser Diode Packaging Over 200 watts of output power from 100 μm core fiber Optical

Vertical Integration

11

INTEGRATED SYSTEMS DEEP IN TECHNOLOGY DEEP IN EXPERIENCE

Fab Operations

Semiconductor wafer growth

Diode processing, chip mounting & burn-in

Laser Diode Packaging

Over 200 watts of output power from 100 μm core fiber

Optical Preform

Silica based glass

MCVD method

Dope with rare earth ions

Components

Bragg Gratings | Isolators | Couplers

Modules

Up to 2000 Watts

Laser Sources

Coupling | Final burn in | Shipment

Process Heads and Switches

All fiber beam delivery

Welding | Cladding Drilling | Ablation

Page 12: INVESTOR PRESENTATION · Semiconductor wafer growth Diode processing, chip mounting & burn-in Laser Diode Packaging Over 200 watts of output power from 100 μm core fiber Optical

12

IPG Diodes: Highest Volume, Lowest Cost, Leading Power

Source: IPG Photonics Corporation

0%

10%

20%

30%

40%

50%

60%

70%

80%

90%

100%

0 Million

2 Million

4 Million

6 Million

8 Million

10 Million

12 Million

2009 2010 2011 2012 2013 2014 2015 2016 2017 2018

Pac

kage

d D

iod

e C

ost

s %

Ch

g.

Test

ed C

hip

s P

rod

uce

d

Tested Chip Production Cost/Watt Decrease (2009 Base Year)

Page 13: INVESTOR PRESENTATION · Semiconductor wafer growth Diode processing, chip mounting & burn-in Laser Diode Packaging Over 200 watts of output power from 100 μm core fiber Optical

13

Global Presence

G&A 7% Sales

5%

Manufacturing 73%

R&D 11%

Contractors 4%

6,294 Current

Employees Fryazino, Russia ► Components and final assembly ► ~1,700 employees 550,000

sq. ft.

Clean Room Percent

Oxford & Marlborough, MA, USA ► Wafer fab operation, chip-on-

submount assembly, wafer packaging, components and final assembly

► ~2,000 employees

650,000 sq. ft.

Clean Room Percent Burbach, Germany

► Components and final assembly ► ~1,300 employees 415,000

sq. ft.

Clean Room Percent

US 37%

Germany 21%

Russia 29%

China 4%

Other 9%

6,294 Current

Employees

US 14%

Germany 8%

Other Europe 20%

China 43%

Other Asia 15%

RoW 0%

Sales by Region, 2018

Page 14: INVESTOR PRESENTATION · Semiconductor wafer growth Diode processing, chip mounting & burn-in Laser Diode Packaging Over 200 watts of output power from 100 μm core fiber Optical

14

Total Addressable Market

Metal Processing

Industrial Lasers $2.8B

New Laser

Applications $4.4B

Estimated $7B

Market in 2018

$0B

$1B

$2B

$3B

$4B

$5B

$6B

$7B

$8B

$9B

$10B

2015 2016 2017 2018 2019 2020 2021 2022 2023

Source: Optech Consulting, Strategies Unlimited and IPG Photonics Corporation

Page 15: INVESTOR PRESENTATION · Semiconductor wafer growth Diode processing, chip mounting & burn-in Laser Diode Packaging Over 200 watts of output power from 100 μm core fiber Optical

15

Industrial Laser Market

Metal Processing

$0B

$1B

$2B

$3B

$4B

2015 2016 2017 2018 2019 2020 2021 2022 2023

$0B

$1B

$2B

$3B

$4B

2015 2016 2017 2018 2019 2020 2021 2022 2023

Fiber Lasers 63% Market Share in 2018

CO2, Solid State and Diode Lasers

Source: Optech Consulting, Strategies Unlimited and IPG Photonics Corporation

Page 16: INVESTOR PRESENTATION · Semiconductor wafer growth Diode processing, chip mounting & burn-in Laser Diode Packaging Over 200 watts of output power from 100 μm core fiber Optical

16

New Industrial Laser Products

Metal Processing

CO2, Solid State and Diode Lasers

Adjustable Mode Beam (AMB)

+ =

Broadest range of beam profile tunability

Virtually eliminates welding spatter

Increases welding speed and quality

Widens range of material thickness in cutting

Reliable adjustment of output beam

Up to 12 kilowatt core & 25 kilowatt total output power

High Peak Power (HPP) – QCW Option

Pulses up to 2X peak power

Faster piercing, improved processing speed

High quality cutting of intricate parts

Faster, cleaner hold drilling

Reduces material waste

Ensures consistency of finished parts

2/4, 3/5 and 6/10 kilowatt configurations

Page 17: INVESTOR PRESENTATION · Semiconductor wafer growth Diode processing, chip mounting & burn-in Laser Diode Packaging Over 200 watts of output power from 100 μm core fiber Optical

Laser Systems

17

Welding, Drilling, Cladding, Ablation & Other Materials Processing

Micromachining for

Microelectronic and

Electronic Parts

Multi-Axis Workstations

for Industrial Parts

Precision Workstations

for Medical Parts

Robotic Workcells

for Larger Parts

Page 18: INVESTOR PRESENTATION · Semiconductor wafer growth Diode processing, chip mounting & burn-in Laser Diode Packaging Over 200 watts of output power from 100 μm core fiber Optical

18

Emerging Laser Applications

$0B

$1B

$2B

$3B

$4B

$5B

$6B

$7B

2015 2016 2017 2018 2019 2020 2021 2022 2023

Source: Strategies Unlimited and IPG Photonics Corporation

Sensors and Instruments

R&D and Scientific

Defense

Non-Metal Micro Materials Processing

Accelerating growth and diversifying end market exposure

Page 19: INVESTOR PRESENTATION · Semiconductor wafer growth Diode processing, chip mounting & burn-in Laser Diode Packaging Over 200 watts of output power from 100 μm core fiber Optical

19

Solid Growth and Industry-Leading Margins

$648

$1,460

34% 36%

0%

10%

20%

30%

40%

50%

$0

$300

$600

$900

$1,200

$1,500

$1,800

2013 2014 2015 2016 2017 2018

Op

era

tin

g M

argi

n

Rev

enu

e ($

Mill

ion

s)

Revenue Operating Margin

Page 20: INVESTOR PRESENTATION · Semiconductor wafer growth Diode processing, chip mounting & burn-in Laser Diode Packaging Over 200 watts of output power from 100 μm core fiber Optical

20

Free Cash Flow

$48

$233 $71

$160

$0

$50

$100

$150

$200

$250

$300

$350

$400

$450

2013 2014 2015 2016 2017 2018

$ M

illio

ns

Free Cash Flow Capex

Page 21: INVESTOR PRESENTATION · Semiconductor wafer growth Diode processing, chip mounting & burn-in Laser Diode Packaging Over 200 watts of output power from 100 μm core fiber Optical

19%

20% 21% 19% 19%

19%

36% 36%

0%

5%

10%

15%

20%

25%

30%

35%

40%

45%

2013 2014 2015 2016 2017 2018

Return on Equity Return on Invested Capital, Excluding Cash

21

Return Profile

Page 22: INVESTOR PRESENTATION · Semiconductor wafer growth Diode processing, chip mounting & burn-in Laser Diode Packaging Over 200 watts of output power from 100 μm core fiber Optical

22

Target Business Model

Revenue Growth 16% CAGR

40% 4% Double Digit

Growth *

Gross Margin 54%

Average 57% 55% 50%-55% *

Operating Margin

36% Average

39% 36% 32%-37% *

* Revenue growth and margins can be below long-term targets during periods of macroeconomic weakness that give rise to lower demand for our products

Page 23: INVESTOR PRESENTATION · Semiconductor wafer growth Diode processing, chip mounting & burn-in Laser Diode Packaging Over 200 watts of output power from 100 μm core fiber Optical

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