Issue 3 - Automotive Current Sensing · 2009-03-02 · Email:[email protected] Armin Wezel...

AUTOMOTIVE CURRENT SENSINGCurrent Sensing Solutions for HybridElectric Vehicles

ISSUE 3 – APRIL 2008

Also inside this issueOpinion | Market News | CIPS 2008 | PCIM 2008 | BatteryManagement | Motion Control | Power Semiconductors/ModulesProducts | Website Locator

p01 Cover.qxd:p01 Cover 22/1/09 10:10 Page 1

CONTENTS

Power Electronics Europe Issue 3 2008

3

Editor Achim ScharfTel: +49 (0)892865 9794Fax: +49 (0)892800 132Email: [email protected]

Production Editor Elaine GladwellTel: +44 (0)1322 380057

Editorial/Advertisement AdministrationClare JacksonTel: +44 (0)1732 886495Fax: +44 (0)1732 886149

Circulation Manager Anne BackersTel: +44 (0)208 647 3133Fax: +44 (0)208 669 8013

INTERNATIONAL SALES OFFICESMainland Europe:Victoria Hufmann, Norbert HufmannTel: +49 911 9397 643 Fax: +49 911 9397 6459Email: [email protected]

Armin WezelTel: +49 9568 897 097 Fax: +49 9568 897 096Email: [email protected]

UKSteve Regnier, Tim AnsteeTel: +44 (0)1732 366555email: [email protected]

USA West Coast SalesShelley KellyTel: (310) 547 1777 Fax: (310) 519 0809Email: [email protected] East Coast SalesKaren C Smith-Kerncemail: [email protected] A KerncTel: +1 717 397 7100Fax: +1 717 397 7800email: [email protected]

ItalyFerruccio SilveraTel: +39 022 846 716 Email: [email protected] Ind. Service Corp.Tel: 886 2 2322 5266 Fax: 886 2 2322 2205

Publisher Ian AtkinsonTel: +44 (0)1732 886495Fax: +44 (0)1732 886149Email: [email protected]

Circulation and subscription: Power ElectronicsEurope is available for the following subscriptioncharges. Power Electronics Europe: annual chargeUK/NI £60, overseas $130, EUR 120; single copiesUK/NI £10, overseas US$32, EUR 25. Contact:Techmedia International Ltd, Kildonan, St Mary’sRoad, Wrotham, Kent TN15 7AP, Great Britain.Tel: +44 (0)1732 886495. Fax: +44 (0)1732886149. Refunds on cancelled subscriptions willonly be provided at the Publisher’s discretion, unlessspecifically guaranteed within the terms ofsubscription offer.Editorial information should be sent to The Editor,

Power Electronics Europe, PO Box 340131, 80098Munich, Germany.The contents of Power Electronics Europe are

subject to reproduction in information storage andretrieval systems. All rights reserved. No part of thispublication may be reproduced in any form or by anymeans, electronic or mechanical includingphotocopying, recording or any information storageor retrieval system without the express prior writtenconsent of the publisher.Origination: Elaine GladwellPrinted by: Wyndeham Heron Limited.ISSN 1748-3530

PAGE 18

PCIM 2008 - A Deeper Focus onPower Electronics

This year’s PCIM conference focuses with 12 sessions and 51 papers on powerelectronics. German speakers will supply 24 papers, 19 papers will come fromother European countries, and five papers from Asia and three from the USAround up the internationality of the conference.

PAGE 25

Active Charge Balancing for Li-ionBattery StacksInfineon’s E-Cart electric vehicle is used to demonstrate the electrical features of ahybrid car. The necessity for battery management with charge balancing is aprerequisite and the simple conventional solution -dissipating power for chargeequalisation - was replaced by an active energy shift between the cells. Theresulting active system has much better performance at material costs comparableto a passive solution. Werner Rößler, System Engineer for SafetyApplications, Infineon Technologies AG, Neubiberg, Germany

PAGE 28

Simplifying Dual Motor Control inEnergy-Efficient AppliancesWhen permanent magnet brushless motor drives were introduced to the marketmore than twenty years ago, the control algorithms were implemented using acombination of analog amplifiers and logic components. Today, highly integratedmixed signal controllers enable the implementation of complex control algorithmsthat maximise the efficiency of permanent magnet AC drives in variousapplications. Aengus Murray, International Rectifier, El Segundo, USA

PAGE 32

Power Device Technologies forSustainable Growth of PowerConversion ApplicationsPower devices have gone through a rapid technological evolution along with theadvancements in power electronics during the last few decades. More recently,the enormous advancement made by MOS-gated power device technologiessuch as IGBTs, power MOSFETs, and power modules have tremendously helpedfast proliferation of power electronics application in industrial, commercial,residential, transportation, utility, aerospace and other emerging fields that includenewer power generation systems. The first part of this keynote, given at PCIMChina, reviews the state-of-the-art key technologies related to power devices andtheir contribution in power conversion applications. Gourab Majumdar,Mitsubishi Electric Corporation, Fukuoka, Japan

PAGE 38

Product UpdateA digest of the latest innovations and new product launches

PAGE 41

Website Product Locator

Current Sensing Solutionsfor Hybrid Electric Vehicles

Increasing demand for gas, price rise andenvironmental concerns are driving a market that is inneed of alternative solutions. The advantage that aHEV offers with regard to construction and designaspects is that the engine designed in a HEV is small,which makes these vehicles more efficient. Electric carssuch as G-Wiz, Sakura and NICE, along with hybrid carsincluding Toyota Prius, Honda Civic, Lexus RX, and GSHybrids, are exempted from the London CongestionCharges. This exemption would enable commuters topotentially save over £1600 when they drive in andout of the city center. Such promotional features arelikely to boost EV and HEV markets.

With so much engineering design effort now beinginvested by so many of the Automotive world’s R&Dorganisations in various forms of electric and hybrid-electric vehicle development, perhaps now is a goodtime to review a few of the basic needs of the designengineer when dealing with current measurement.Raztec engineers have cooperated with automotiveindustry leaders to develop sensors precisely targetedat some of the more demanding roles HEVs offer.When the design engineer is faced with selecting thecorrect solution for use in the various areas of electricvehicle design – accurate current measurement reallyis ‘mission critical’. Full story on page 21.

Cover supplied by Raztec Sensors

COVER STORY

PAGE 6

Market NewsPEE looks at the latest Market News and companydevelopments

PAGE 14

CIPS 2008 -Strengthening Europe’sPosition in PowerElectronicsThe program for this year’s Conference on IntegratedPower Electronic Systems (CIPS) from March 11-13in Nuremberg/Germany included 11 conferencesessions with the presentation of 55 technicalpapers. 84% of them came from nine EuropeanCountries, 8% from North America, and 8% from FarEast. The program also included 12 invited papers,authored by qualified experts coming from importantindustrial and academic organisations.

p03 Contents.qxd:p03 Contents 22/1/09 10:10 Page 3

mailto:[email protected]









http://www.power-mag.com

Tel +41-32-344 47 47Fax +41-32-344 47 40

04_PEE_0308:04_PEE_0308 22/1/09 09:59 Page 1

OPINION 5


Achim ScharfPEE Editor

A suitablequote as alead in to

the editorsopinion


The popularity ofhybrid electricvehicles (HEVs) isincreasing across the

world, and the UK is listed as one of the top five global hybridelectric vehicle markets. Increasing demand for gas, price riseand environmental concerns are driving a market that is inneed of alternative solutions. The advantage that an HEV offerswith regard to construction and design aspects is that theengine designed in an HEV is small, which makes thesevehicles more efficient. Electric cars such as G-Wiz, Sakura andNICE, along with hybrid cars including Toyota Prius, HondaCivic, Lexus RX, and GS Hybrids, are exempted from theLondon Congestion Charges. This exemption would enablecommuters to potentially save over £1600 when they drive inand out of the city centre. Such promotional features are likelyto boost EV and HEV markets. Hybrids require much less fuelthan conventional vehicles, offering greater savings on fuelcosts. Another advantage is improved efficiency. In fact, theyoffer more mileage compared with conventional vehicles,which makes HEVs require minimal gas. They are environmentfriendly; hybrids have much fewer greenhouse gas emissions,and are therefore capable of reducing the smog-formingpollutants in the atmosphere; tax credits and incentives. Finally,many governments across different countries promote HEVs byoffering tax credits and incentives that make HEVs affordable.These advantages and technical aspects ensure that HEVs

are the most compatible next-gen vehicles, which are user-friendly as well as environment friendly.Mercedes-Benz i.e. will launch an S-Class hybrid next year,

equipped with a lithium-ion battery supplied by ContinentalAutomtive Systems. The main advantages of the newlydeveloped lithium-ion battery are its very compact dimensionsand far superior performance, relative to conventional nickel-metal hydrid batteries such as those powering the Toyota Prius.The power-to-weight ratio of the battery is 1,900W/l. It has ahigh ampere-hour efficiency, long service life, and is reliable evenat very low temperatures, the company said, adding that itssafety is the equal of that provided by today’s auto batteries. TheS 400 BlueHYBRID, powered by a 299HP engine that enables it

to sprint from 0 to 100km/h in 7.3s. It would consume onaverage 7.9l of petrol per 100km and emit 190g of carbondioxide per kilometre, compared with 10.3l of petrol and 247g ofCO2 in a comparable conventional S-Class. Conti also supplies aninverter to control the flow of energy between the electric motorand the hybrid battery, as well as a voltage converter that linksthe hybrid battery to the car’s standard electric system,eliminating the need for a conventional generator.But as the market will not accept premium prices, there is a

substantial challenge for designers to provide technologicallyinnovative and cost-effective solutions. This implies the needfor a modular automotive-grade power electronic approachwhich can be manufactured at a resonably low price. To masterthese challenges, the InGA project was initiated in Germanywith industrial partners Continental, Infineon Technologies,Epcos, SiCED and Volkswagen, with the main aim being toreduce system costs by integrating the electronics at theelectrical machine for generating hybrid drivetrain units. Thismeans developing generic technology and modular systems,built up from components that can be manufacturedessentially with similar configurations, but with differentqualities, to meet the specific performance, lifetime and costrequirements of different applications. Based on that approach,scalable mechatronics, high temperature electronics, powerelectronics, and cooling technologies will be developed andhave been presented recently at the CIPS 2008 conference.Hybrid electric vehicle technology also plays a major role at

PCIM Europe in Nuremberg. The first keynote by ReinholdBayerer, Infineon Technologies/Germany is entitled ‘HigherJunction Temperature in Power Modules - a Demand fromHybrid Cars, a Potential for the Next Step Increase of PowerDensity for Various Variable Speed Drives’. And a specialsession ‘Automotive Power’ on May 29, organised by PowerElectronics Europe, focuses with four papers on powerelectronics for efficient hybrid drivetrains.Thus, mark PCIM Europe (May 27 – 29) in Nuremberg and

particularly the session Automotive Power (May 29, 10.00 –12.00, Room Mailand) in your calendar. See you there!


Greener CarsThrough PowerElectronics

p05 Opinion.qxd:p05 Opinion 22/1/09 10:11 Page 5

New developments requiring thedissipation of up to 20MW/m² willonly be possible with heatsinksmade of materials possessingextremely high thermal conductivity(~600 W/mK), ability to withstandlarge temperature changes withoutdisintegration and deterioration ofproperties and capability to reducecomplex thermo-mechanicalstresses after bonding to supportingor protecting structures by tailoringof their thermal expansion in therange of 4 to 9ppm/K. “In the firstphases of project performance,experimental studies wereperformed on more than 40promising material systems in orderto evaluate their feasibility fortargeted applications. Two mainmaterial groups were investigated:copper alloys reinforced with fibresor (nano) particles for heatsinksworking mostly in reactors andengines where performance at hightemperatures (up to 1000°C) anddimensional stability play primaryrole; and metal matrix compositesbased on highly conductive phasessuch as diamond, highly graphitisedcarbon fibres and flakes, carbonnanotubes, etc. for use in advancedelectronic applications“, commentedproject coordinator ChristianLinsmeier.After systematic assessment

performed by industrial partnersincluding Siemens, selectedcomposites were further optimisedin phase 3 of the project. For theirpreparation several advancedtechnological methods, includinggas pressure infiltration of melts,squeeze casting, isostatic pressing,rapid sintering, PVD and plasmacoating, were utilised. Thedevelopment of composites wassupported by tailoring of interfacesbetween constituents at nanoscopiclevel, in order to stabilise them inthe whole range of workingtemperatures without degradation

of thermal conductivity.A set of (SiC, W, C) fibre

reinforced copper matrixcomposites has been produced andsubmitted to neutron irradiationtesting to evaluate their feasibilityfor fusion applications. Regardingmaterials for electronics, thermalconductivities in the range 600 to700W/mK have already beenachieved with diamond and pitchbased carbon fibres reinforcedmetals. The technology forcontinuous manufacturing of Cu-SiC-fibre mono layers in industrialscale and also industrially applicabletechnique for gas pressureinfiltration of particle/fibrouspreforms were developed tosupport future industrialisation ofobtained knowledge. In next phasesof the project, the developedmaterials will undergo a largeapplication oriented testingprogramme, which should yielddata to allow assessment of theirbehaviour at irradiation, heat fluxand thermo-mechanical loading.Various combinations of heatsink

and protection materials will beprepared, in order to demonstrateand test the mutual joinability andperformance of joints underextreme loading. Severalexperiments have already started toevaluate the performance ofdeveloped mate rials as heatsinks inelectronic packages, power- andoptoelectronic devices.Heatsinks based on copper

matrix reinforced with ceramic andintermetallic (nano) particles orfibres for use in high temperatureapplications (up to 1000°C), whereexcellent dimensional stabilitycombined with good thermalconductivity play a primary role. Thethermal conductivity should becomparable to Cu (300W/mK) witha heat flux removal capability of upto 20MW/m². The CTE in planedirection at the interface should be

adapted to the CTE of theprotection material which is typically4...9 x 10-6 K-1. Secondly, heatsinksbased on highly conductive phases(diamond, highly graphitised carbonfibres, carbon nanotubes withtheoretical thermal conductivity 800to 6000W/mK) embedded inappropriate metallic matrix for usein applications, where extreme heatfluxes combined with tailored CTEare the main requirements. The CTEin plane direction at the interfaceshould be adapted to the CTE ofthe supporting structure, typically4...9 x 10-6 K-1. The limitations ofcurrent materials will be overcomeby knowledge-based combination ofconstituents, by optimumarchitecture of composites based onmodelled performance and bytailored interfaces betweenconstituents at nanoscopic level.The main aim will be to developstable interfaces in the whole rangeof working temperatures withoutdegradation of thermal conductivity.Surface tailoring techniques

provide compatibility for the joiningof ceramic matrix composites tometallic materials, e.g. SiC joined toCu-based heatsinks. Atomicdeposition of thin interface films

followed by sophisticatedcharacterisation, like Rutherfordback-scattering and sessile droptechnique for in-vacuum wettingangle measurements at hightemperature, open enhancedoperation regimes (temperature,mechanical loads) for compoundmaterials.Improved matching of the

coefficient of thermal expansion(CTE) of different constituents ofcomposites for heatsink applicationsby interlayers. W and Mo, depositedby thermal spray or chemical vapourdeposition or implemented as solidsheets, are the main elements usedfor interlayers with intermediate CTE.As a highlight, W-Cu layers withtailored CTE and an almost four-times increase of thermal diffusivitycould be produced by a combinationof plasma spraying and HIPping.The public outreach of the

ExtreMat project will be intensifiedby the presence at the HanoverIndustry Fair 2008 and through theorganisation of an “ExtreMatConference” open for all interestedparties in June 2008.

AS

www.extremat.org

NewHeatsinkMaterials

“Extremat is a €€

35 million EU-funded project forresearch anddevelopment ofnew materialsunder extremethermalconditionsincludingheatsinks forpower modules“,states projectcoordinatorChristian Linsmeie

6 MARKET NEWS

Issue 3 2008 Power Electronics Europe

The objective of the EU project ExtreMat is to develop novel heat sink composites and to test theirperformance under extreme loading conditions. At present overheating causes more than 50% failures ofelectronic devices and the high temperature becomes a limitingfactor.

p06-12 Market News.qxd:Layout 1 22/1/09 10:12 Page 6

http://www.extremat.org

At TI, we’ve been helping our customers design high-performance power conversion products that meet strict ef ciency regulations for over 20 years. TI can help you get to market fast with a winning, energy-saving design. That’s High-Performance Analog >>Your Way.

www.ti.com/greenpower-e or call toll free:00800-ASKTEXAS (00800 275 839 27)or international: +49 (0) 8161 80 2121

Get Samples, Evaluation Modules and the Power Management Selection Guide

Energy-Effi cient Power Solutions

High-Performance Analog >>Your Way™

UCC28600 Green Mode PWM Controller Enables off-line power supplies to meet light-load ef ciency standardsTPS40140 Stackable Multiphase Controller Improves point-of-load ef ciency in power-hungry data centers and telecom equipmentTPS2410 ORing FET Power Rail Controller Replaces low-ef ciency diodes with high-ef ciency, high-reliability control and protection solutionsUCC28060 Industry’s First Single-Chip Dual phase for high-ef ciency, high-power density UCC28070 Interleaved PFC Controller and easy phase management for light-load ef ciencyUCD9112 Digital Controller w/Con gurable GUI Easy-to-use, exible point-of-load solution for multi-rail UCD9240 and multi-phase power topologiesPTH08T250W 50-A Non-Isolated Power Module 96%-ef cient, stackable, and easy-to-use point-of-load w/TurboTransTM Technology module for servers, wireless infrastructure, datacom and telecom equipmentTMS320F28335 Digital Signal Controller Highly integrated digital controller improves ef ciency of renewable energy systems

TurboTrans, High-Performance Analog >>Your Way and the platform bar are trademarks of Texas Instruments. 1997A1© 2008 TI

UCC28600 Green Mode PWM Controller Enables off-line power supplies to meet light-load ef ciency standardsTPS40140 Stackable Multiphase Controller Improves point-of-load ef ciency in power-hungry data centers and telecom equipmentTPS2410 ORing FET Power Rail Controller Replaces low-ef ciency diodes with high-ef ciency, high-reliability control and protection solutionsUCC28060 Industry’s First Single-Chip Dual phase for high-ef ciency, high-power density UCC28070 Interleaved PFC Controller and easy phase management for light-load ef ciencyUCD9112 Digital Controller w/Con gurable GUI Easy-to-use, exible point-of-load solution for multi-rail UCD9240 and multi-phase power topologiesUCD9240PTH08T250W 50-A Non-Isolated Power Module 96%-ef cient, stackable, and easy-to-use point-of-load w/TurboTransTM Technology module for servers, wireless infrastructure, datacom and telecom equipmentTMS320F28335 Digital Signal Controller Highly integrated digital controller improves ef ciency of renewable energy systems

07_PEE_0308:07_PEE_0308 22/1/09 09:58 Page 1

http://www.ti.com/greenpower-e

Liquid Gap Filler 1500 (Two-Part) Dispenses Where You Want It,Without “Stringing” Offers Superior Thermal Conductivity.,

Gap Filler 1500 forms-in-place, offers faster throughputwith reduced pressure – putting less stress on equipment.Gap Filler1500 is an advanced thermal material specifically designed tosupport optimized dispensing control and exhibits an excellent thermalconductivity of 1.8W/mK. This material features superior slump resistanceand high shear thinning characteristics for maximum dispensing control.Its smooth dispensing results in precisematerial placement, in half the time ascompared to one-part materials. As amixed system, it cures at room temper-ature and can be accelerated with theaddition of heat. It is designed to fillunique and intricate gaps and voidswithout stress.

Complete thermal solutions for automated dispensing.Gap Filler1500 is just one of our many robust thermal solutions thatboost your process performance. Confidently tackle your high volumedispensing needs by capitalizing on our expertise. Bergquist can guide you to the best thermal solution from gap fillers to dispensing. Our thermalproducts help keep the world’s electronic components running cool.

Learn more with a FREE Sample Kit.Take a closer look by getting your FREE Gap FillerSample Kit today.Simply visit our website or call usdirectly to qualify.

Now There’s A LiquidGap Filler That Won’t

Miss Any Curves.

B E R G Q U I S T H I G H - P E R F O R M A N C E L I Q U I D G A P F I L L E R S

Thermal Products • Membrane Switches • Touch Screens • Electronic Components

European Headquarters - The Netherlands. Tel: EU +31 (0) 35 5380684 . D +49-4101-803-230 . UK +44-1908-263663

Call +31 (0) 35 5380684 or visit www.bergquistcompany.com/noslump

Gap Filler1500 has natural tack and cleanly flows into positionfor final assembly without leaving thermal material behind.

FREE Promo Pocket withDispensed Sample and Data Insert.

08_PEE_0308:08_PEE_0308 22/1/09 10:05 Page 1

http://www.bergquistcompany.com/noslump

SEMIKRON’s last financial year was particularlygood for the company achieving a turnover of€430 million - doubling the figure of four yearsago. The main drivers behind this success werenew technologies in the area of renewable energy.The global manufacturer of power semiconductorsand modules operates 35 subsidiaries in 27countries and 10 production locations andemploys 1,350 people in Germany and 3,000worldwide.

Over a period of two years, the company willbe investing over €100 million into the expansionof its production locations, €65 million of this willgo into the company’s HQ in Nuremberg, wherethe main gaols are to double chip productioncapacity and further expand the NewTechnologies division.

To achieve this, more engineers with aninnovative spirit and the willingness to adoptresponsibility are needed immediately. This is thekey to design new products for emerging marketssuch as wind and solar power, hybrid vehicles,

frequency converters in electric drives, industrialinstallations and power supply systems. Thus,programmes involving internal training inmachinery and plant engineering have been set upending with a formal Chamber of Trade andCommerce qualification. For a total of 125 days,22 employees will be relieved of their normalresponsibilities in order to be able to take part inthe programme. A second group is to start trainingin October.

“This programme will raise the level ofqualification among our personnel, making themmore flexible for different areas of activity”,explains Andreas Dauer, Head of CorporateDevelopment at Semikron. Recently, GermanPresident Köhler visited Semikron in order tocheck the outcome of this training programme forsemi-skilled and non-skilled personnel carried outin cooperation with the German EmploymentAgency.

www.semikron.com

Internal Qualification atSemikron Honoured byGerman President

MARKET NEWS 9


CTO Thomas Stockmeier (left) accompanies Mr. Köhler during the production tour at Semikron’s plant in Nuremberg

MetalThermalInterfaceMaterials

ApplicationsIGBT• Die-attach• DBC-attach• Baseplate TIMs

Power Amplifi ers • Solder• Compressible TIMs

Lasers• High temp die-attach• Compressible TIMs

Products• Au/Sn solders• Pure indium• InFORMS

®

• Sn/Pb solders• SAC Pb-Free solders• Heat-Spring

®

©2008 Indium Corporation

Learn Morewww.indium.com/[email protected]

86W/m•K

See us at PCIM, Booth 12-554


http://www.semikron.com

http://www.indium.com/TIM


10 MARKET NEWS


High Growth for AutomotivePower SemiconductorsDiscrete power semiconductors and microcontrollers will find significant opportunities in automotives ashybrid and electric vehicles gain popularity. End-user market expansion, increased automobile multiplexing,and wider application of vehicle integrated circuits will likely sustain this growth.

Analysis from Frost & Sullivan,World Markets for Discrete PowerSemiconductors in Automobiles,reveals that the market earnedrevenues of $1.76 billion in 2006and estimates this to reach $2.7billion in 2010. “Governmentsafety, security, and pollutionregulations have encouraged theuse of electronic content inautomobiles in order to eliminatehuman error”, said SeniorResearch Analyst BonnieVarghese. “This has had a directand positive impact on theautomotive power discretesmarkets”. Manufacturers have toensure that attractive price pointsand technological superiority backproduct performance and quality,in order to take advantage ofmarket opportunities. They willalso have to determine how toovercome challenges associatedwith the increased integration ofpower discretes with application-specific integrated circuits (ASICs).Discretes with higher levels of

integration pose numerousproblems to manufacturers. Thehigh on-resistance interconnectsand complications involved in theisolation of power cause designcycle delays, thereby prolongingthe time-to-market. Once discretepower semiconductors resolveissues such as safety, security and

telematics, driver informationapplications will likely grow at astartling pace. The intricateprocesses required to create anintegrated solution often increasethe product cost. Therefore,manufacturers should focus onmodule solutions, particularlywithin the high-voltage discretesegment. “Having a modularsolution that integrates discretepower semiconductors with asmall high-performance packageenhances the performance at arelatively lower cost”, notedVarghese. “Another advantage ofusing the module is better thermalmanagement, which represents akey concern in the automotiveindustry”. Asia will likely becomeone of the fastest growing marketsdue to the increasing sales ofautomobiles in this region.However, Europe will likelygenerate the most revenues dueto its early technology adoption.

Gaining popularity of HEVsThe popularity of hybrid electric

vehicles (HEVs) is increasingdramatically across all thecountries in the world, and the UKis listed as one of the top fiveglobal hybrid electric vehiclemarkets. At present, thedeveloped countries are keen onpromoting HEVs, while the

developing countries are unableto enforce the usage of them.Increasing demand of gas, pricerise and environmental concernsare driving a market that is inneed of alternative solutions. “Theadvantage that a HEV offers withregard to construction and designaspects is that the enginedesigned in a HEV is small, whichmakes these vehicles moreefficient”, explained SubaSwaminathan, Frost & Sullivan’sTeam Leader Power SystemsGroup. Electric cars such as G-Wiz,Sakura and NICE along with hybridcars including Toyota Prius, HondaCivic, Lexus RX, and GS Hybridsare exempted from the LondonCongestion Charges. Thisexemption would enablecommuters to potentially saveover £1600 when they drive inand out of the city center. Suchpromotional features are likely toboost EV and HEV markets. “Oneof the advantages of HEVs isimproved fuel economy. Hybridsrequire much less fuel thanconventional vehicles, offeringgreater savings on fuel costs.Another advantage is improvedefficiency. In fact, they offer moremileage compared withconventional vehicles, whichmakes HEVs require minimal gas.They are environment friendly;

hybrids have much fewergreenhouse gas emissions, andare therefore capable of reducingthe smog-forming pollutants inthe atmosphere; tax credits andincentives. Finally, manygovernments across differentcountries promote HEVs byoffering tax credits and incentivesthat make HEVs affordable”,Swaminathan noted.These advantages and technical

aspects ensure that HEVs are themost compatible next-gen vehicles,which are user-friendly as well asenvironment friendly. With the AsiaPacific countries joining the race,the growth of HEVs is expected toaccelerate to a significant extent inthe next five years.Continental Automotive

Systems (Germany) announced inMarch that it will launch first-timevolume production of a high-performance lithium-ion batteryfor hybrid vehicles at the end of2008. It will be used in theMercedes S 400 BlueHYBRID.“This marks an importantbreakthrough for Continental as asupplier of battery systems. In thenext few years, we will belaunching production of furtherlithium-ion energy storage devicesfor mild- and full-hybrid andelectric-powered vehicles”, statedboard member Karl-ThomasNeumann. Aside from the lithium-ion battery, Continental alsosupplies the inverter and theDC/DC converter for theMercedes S 400 BlueHYBRID. Theinverter controls the flow ofenergy between the electric motorand the hybrid battery, as well asbetween the hybrid battery andthe vehicle’s standard electricsystem and thus, makes possiblethe elimination of theconventional generator.

www.semiconductors.frost.com

Automotive discretepower semiconductorworld market, baseyear is 2006Source: Frost&Sullivan


http://www.semiconductors.frost.com

The Energy Independence and Security Act of2007, passed by both houses of Congress andsigned into law by President Bush inDecember, includes stringent, mandatoryenergy-efficiency standards on external powersupplies (EPS), the AC adapters and chargersthat power cellphones, cordless phones,modems and countless other electronicproducts. Most external power suppliesmanufactured for sale in the US after July 1,2008 must comply with the standards. Thestandards are equivalent to the second, tighterversion of the California Energy CommissionEPS standards, also scheduled to take effecton July 1.

The energy law also mandates significantimprovements in the efficiency of lightingtechnologies used in general service lamps.The new lighting standards are expected toresult in the phase-out of traditionalincandescent light bulbs beginning in 2012, infavour of more efficient technologies includingcompact fluorescent bulbs and light-emittingdiodes (LEDs).

“The California efficiency standards touched

off a transformation of the external powersupply market”, said Balu Balakrishnan, CEOof Power Integrations. “Linear transformersare no longer a viable option for most endproducts. The next phase of the standards,with tighter active-mode and no-loadrequirements, will now be adoptednationwide as a result of the new energy law,and additional EPS specifications are beingdeveloped by ENERGY STAR and theEuropean Union. We are committed tohelping manufacturers meet these standardsin a timely and cost-effective manner, so thatconsumers need not pay extra for productswith efficient power supplies. The transition toefficient lighting is also part of a worldwidetrend, as plans to phase out traditional lightbulbs have also been announced in Australia,Canada and Europe”, Balakrishnan noted.“Our chips enable simple, energy-efficient off-line LED driver circuits that are compactenough to fit into the base of a standard lightbulb”.

www.powerint.com

The global voltage regulation IC marketgrew by 5% in 2007 to more than $7billion, according to recent analysis fromIMS Research.

The results reveal that the non-isolated regulation market weakened in2007, following a period of prolongedhigh growth. However, the isolatedmarket continued to perform well, dueto demand for highly efficient controllersfor AC/DC power supplies. Despite therelatively low growth seen in the voltageregulation market last year, somepockets of high growth wereapparent. “It is clear that the voltage

regulation market weakened in 2007,partly due to inventory correction;however, some applications, such asnotebook PCs and high-end consumerequipment bucked this trend”,commented Research Director AshSharma. “Vendors are hoping for a muchstronger 2008, but whilst the long-termdrivers for power management remainfavourable, short-term spending in theconsumer and computing sectors looksuncertain due to the current economicclimate”.

www.imsresearch.com

Greener EcoSmartTechnology EnablesCompliance

Voltage RegulationMarket Weakened in2007

MARKET NEWS 11



http://www.powerint.com

http://www.imsresearch.com

Strong growth of digital videorecorders, digital cameras andportable media players have beenand are expected to be significantcontributors to the healthyconsumer electronics market. Inthese, and most other consumerelectronics products, newfeatures and reductions in sizehave increased systemcomplexity. This increasedcomplexity, along with loweroperating voltages and highercurrents, is placing higherdemands on power supplies andbatteries.At the same time, consumers

are also expecting longer periodsbetween battery charges andelectronics that are increasinglyefficient in their use of electricity.New Energy Star regulations thatwent into effect in 2007 placestricter efficiency demands on awide range of consumerelectronic equipment duringboth operating and standbymodes. These regulations andthe new features that encourageconsumers to upgrade theirdevices have resulted insemiconductor manufacturersdeveloping new ICs that cansupport the higher performancedemands of consumerelectronics and still enable thedesign of equipment that canmeet or exceed Energy Star’s

specifications.OEMs have already started

to deliver greener productsand equipment, in compliancewith newly introduced EnergyStar guidelines. According tothe Environmental ProtectionAgency (EPA), just by replacingthe 180 million computers inuse in the United States withcomputers complying with theEnergy Star guidelines, energysavings would total $1.8 billionover the next five years andgreenhouse gas emissionswould be reduced by theequivalent of 2.7 million cars.Commercial organisations are

also examining their energyusage at the corporate level.Datacenters, massiveconsumers of electricity forcomputing and coolingoperations, are also becominglarger and more prevalent.Prompted by concerns overelectricity consumption,organisations like Google,Intel and HP are reexaminingtheir strategies for designingthese facilities and theequipment used in them. Thesecompanies realise that theyhave a responsibility, both totheir shareholders and theworld, to reduce the electricityusage and carbon footprintsof their equipment and

facilities. In the home,consumers are beingencouraged to look for theEnergy Star label on whitegoods, home entertainmentequipment and light bulbs.OEMs are designing their

equipment – PCs, monitors,switches, routers and powersupplies – to comply withindustry and governmentstandards – and the growingdesire of businesses,governments and privatecitizens to be more sociallyresponsible, whether bymandate or by choice. Inresearch conducted in 2007,VDC found that OEM engineerswho specified powermanagement componentsfrequently stated that efficiencywas a top factor whenspecifying components, in somecases more so than price. Highefficiency is a differentiatorwhich many powermanagement suppliers arehighlighting in product briefsand other marketing collateral.As part of their marketingstrategy, several vendors haveestablished brand names toconvey their commitment tohigh efficiency. NationalSemiconductor’s PowerWisebrand is attached not just toits power management

portfolio, but recently also toits entire analog portfolio,including op amps and dataconverters. Texas Instrumentshas established ImpedanceTrack as a brand for its line ofhighly accurate battery fuelgauge ICs. Branding is a verypowerful marketing toolthat can create an associationbetween a product and itsfeatures and benefits, and itshould not be underestimated.By displaying their brand

alongside their like-mindedOEM partners, semiconductorvendors can demonstrate theircommitment to helping endusers reduce their electricityconsumption. OEMs also standto gain, showing that they toocare about the environment andare committed to helpingconsumers reduce theirelectricity consumption. Thisadditional branding, oncerecognised by the mass market,can be used to command higheraverage selling prices, both bythe component vendors andthe OEMs. Consumers will paymore for higher efficiencyproducts because of the lowercost of ownership, and alsobecause they know they aredoing something to help theenvironment.

Aurora PVI-Central inverters havebeen selected by the EnergyDivision of Isolux Corsán for use inSpain’s largest photovoltaic-powerinstallation, and the second largestrenewable-energy facility in theworld. One hundred of these300kW inverters will be installedbefore September 2008 to

process over 34 megawatts ofsolar power.“When tested in accordance with

IEC 61683 photovoltaic-systemstandards, these products canprovide up to a 2.3% performance-ratio advantage compared to othercommercial solutions; resulting in anadditional 9,000kWh per year for

each inverter. With 100 inverters inthis installation, almost 1MWh ofadded power can be generatedannually”, commented Paolo Casini,Power-One’s Alternative EnergyMarketing Director. PVI Centralutilizes a modular architecture thatenhances flexibility and reliability.Flexibility is improved through

incorporation of modules withdifferent power ratings, whichfacilitates current-distributionoptimisation. Aurora PVI-Centralinverters are available inconfigurations from 50 to 300kW.

www.power-one.com/renewable-energy/

Green Opportunities forBranding

Power-One Inverters Selected forSolar-Power Installation in Spain

12 MARKET NEWS



http://www.power-one.com/

Visit us at PCIM 2008, Hall 12, Stand 408

... the other Alternative Fuel

Efficiency ...

ABB Switzerland Ltd SemiconductorsTel: +41 58 586 1419 www.abb.com/semiconductors

Power and productivityfor a better world™

Presenting the world’s lowest-loss 6.5 kV switches:

HPT IGCT SPT+ IGBT

6.5 kV / 4200 A(4V @ 4 kA)

6.5 kV / 750 A(4V @ 750 A)

13_PEE_0308:13_PEE_0308 22/1/09 10:04 Page 1

http://www.abb.com/semiconductors

14 CIPS 2008


General Chairman J. Daan van Wykwas proud to announce theparticipation of more than 180delegates for this first stand-aloneconference, while in previous yearsCIPS has been held in conjunctionwith ISPSD oder PESC. For the firsttime a Session on ‘TechnologyRoadmaps’ for Power Electronics hasbeen organised, and fivecontributions gave an insight to theECPE initiative on technologyroadmaps.

Projections up to the year 2020General Chairman Leo Lorenz

introduced this roadmap initiative.“Our vision in ECPE is to devisemedium to long-term researchroadmaps up to 2020 to offerguidelines for power electronicresearch by universities and researchcentres, but also to provide anorientation for public researchprogrammes and to help industry toprepare for upcoming technologies.The focus is on power electronics indifferent key systems andapplications, installing system-oriented teams with experts from

industry and university“.Basically, the roadmap

development process can start fromthe application or the technologyview. The chosen application-oriented approach is focussing onthe requirements in different keysystems using power electronics.Therefore, seven system-orientedteams have been formed for thepower electronics applications ofhighest strategic importance whichare coordinated from the universityside. Included are Power GridInfrastructure (power generation &distribution, energy storage) andRenewable Energy Sources (wind,PV); Large Drives (large industry andtraction drives); High PerformanceMotor Drives; Small Drives for HomeAppliances; High Frequency PowerConversion >1kW (e.g. telecom,server, heating, welding); HighFrequency Power Supplies <1kW(e.g. stand-alone & integrated powersupplies, chargers, lighting); andAutomotive Power Electronics (lowand high voltage applications).

“In the vision 2020, the role ofpower electronics in 2020 isdescribed with special focus on therole of Europe regarding industryposition and R&D institutions inpower electronics. In the next step,megatrends in society are related topower electronics. Trends and driversfrom the customer and end-userside, as well as technology trendsand drivers, are investigated. Limitingchallenges driven by market needsand major technology gaps to beclosed to meet the challenges haveto be analysed. Finally, strategic goalsare defined answering the keyquestion for the roadmapdevelopment process: where do wewant to stand in 2020 and what arereasonable intermediate steps in2010 and 2015, in thepowerelectronic systems view?“,Lorenz explained.

Bottom-up approach“The use of technology roadmaps

in microelectronics is indispensable,but little has been done so far inpower electronics, except the activityof the power supply manufacturersassociation. For this reason, ECPEhas started an own technologyroadmap initiative in which all powerelectronics systems are usingcommon materials, components andtechnologies“, Technical ChairmanEckhard Wolfgang stated. For powersemiconductors roadmaps areprovided by the manufacturers, i.e.by Infineon Technologies.

Automotive power electronicsThe automotive industry has

specific requirements for its powerelectronic systems, such as acompact design, high reliability, longlifetime and an extremely low cost topower ratio. The systems are furtherrequired to operate over a wide

ambient temperature range and withliquid cooling temperatures oftypically 105°C. “In a study from theUSA FreedomCAR project, it isprojected that the required cost ofthe power electronic systems has toreduce by a factor of three until theyear 2020. The task of theAutomotive Roadmap Committeewas to clarify which technologies areneeded to achieve the performanceand cost targets of the automotiveindustry“, Wolfgang said.

Thus, the road mapping effort isfocused on three systems such as anon-isolated DC/DC converter inthe 40 to 100kW power range, thatcan be used as a fuel cell interface;an AC/DC inverter that is integratedinto the machine housing of a hybriddrive system (since an integratedsolution provides the greatest costreduction potential); and an isolatedDC/DC converter to providebidirectional power flow between thehigh-voltage bus and the 14Vaccessory power system, where therequired power range is up to 3kW.

Strengthening Europe’s Position inPower Electronics

CIPS General Chairman J. Daan van Wykwas proud to announce the participationof more than 180 delegates

“The use of technology roadmaps inmicroelectronics is indispensable, butlittle has been done so far in powerelectronics“, Technical Chairman EckhardWolfgang stated

“Our vision in ECPE is to devise mediumto long term research roadmaps up to2020 to offer guidelines for powerelectronic research“, General ChairmanLeo Lorenz explained

The program for this year’s Conference on Integrated Power Electronic Systems (CIPS) from March 11-13 inNuremberg/Germany included 11 conference sessions with the presentation of 55 technical papers. 84%of them came from nine European Countries, 8% from North America, and 8% from Far East. The programalso included 12 invited papers, authored by qualified experts coming from important industrial andacademic organisations.

p14-16 CIPS 2008.qxd:Layout 1 22/1/09 10:16 Page 14

Power Modules

Positioning Products

Electronic Manufacturing Services

The Power to Move AheadTeam up with us!

www.vincotech.com

15_PEE_0308:15_PEE_0308 22/1/09 10:05 Page 1

http://www.vincotech.com

16 MARKET NEWS


The roadmap utilised the bottom-upapproach, here mathematicaldescriptions for the electrical, thermal,packaging and magnetic componentsare developed. Using thesedescriptions a component technologyspace is formed. By using thespecifications, topologies, andoperating parameters, the componentspace can be mapped into a systemperformance space, which givessystem performance measures suchas efficiency, power density andcosts.

High frequency power supplies“Europe is in a good position with

regard to semiconductor technologyand some system level applications,like automotive, medical and lighting,but on the other hand, Europe is in aweak position in power supplies andpackaging, especially in the lowpower range. The proposed strategyfor Europe is to use our strengths toimprove our weak points“, José A.Cobos (Universidad Politécnica deMadrid) pointed out.

Diversity is a keyword in powersupplies, since they may be classified

from very different perspectives.Different requirements apply from anapplication viewpoint, ranging fromIndustrial or Telecom to Lighting orInformation Technology. The energysource also makes a difference:typical off-line AC power supplies

show different metrics than batterysupplied converters, and evengreater distance from self-poweredor autonomous devices. There is alsodiversity in the loads, which imposedifferent requiremens to the powersupplies. New power managementtrends are based on the own natureof the load. Some techniquesapplied to reduce powerconsumption in digital circuits(voltage scaling) differ from thoseused in highly efficient non-linear RFamplifiers. They are also differentfrom the requirements of contact-less chargers (i.e. in bodyimplants),and they also differ fromthe strategy to supply flat paneldisplays. Power device technologyalso makes a difference, lateralCMOS devices are more appropriatethan standard vertical devices insome low power applications.

Therefore, groups with somecommonalities need to be identified,so that the same strategic goals applyto all the possible applications of thatgroup. Pursuing this objective, fourdifferent groups (off-line electronics,digital circuits, mobile electronics, andself powered) have been selected, allof them under the umbrella of theIntegrated Power Supplies.

High frequency power conversion“Europe’s worldwide market

position has a big chance ofremaining very strong in the field ofindustrial high power supplies,because of two important factors -the innovation in high-power suppliesis key prerequisite for industrialmanufacturing technologies for high-

volume goods such as electroplatingor induction heating, and the finalproduct is not only the power supplyitself, but also the sum of technicalquality, cost-performance relation,customer support during the design-in process, application as well astechnology specific knowledge,maintenance issues, and much more.Moreover, the power supply is thekey-part of a very complex finalproduct“, Tobias Reimann fromISLE/Germany stated. “Thus, acompletely different added-valuesharing situation can be utilised,compared to mass market products,and therefore, it is absolutelynecessary to gain the basic R&Dactivities to defend this position in thefuture.

Examples for main research topicsfor the next ten to twenty yearsinclude fully digital, self-learningconverter to load and converter togrid interfaces; active-passiveintegration at very high power levels;efficient prototyping platformsincluding electrical, thermal, EMI,EMF, mechanical, and economicalissues; materials for high powerdensity passives; self-protectedintelligent high power semiconductorswitches with high load andtemperature cycling capability;multifunctional materials forimpedance-optimised system designand shielding; and high performancesystems for remote diagnosticsmaintenance and service.

AS

www.cips-conference.dewww.ecpe.org

ECPE bottom-up roadmap

Roadmap for 1200V IGBTs – on-state voltage and chipsize

Power electronic key systems for the cars of tomorrow, three considered systems in the automotive roadmap are encircled

p14-16 CIPS 2008.qxd:Layout 1 22/1/09 10:16 Page 16

http://www.cips-conference.de

http://www.ecpe.org

®

21 Napier Place, Wardpark North, Cumbernauld Scotland G68 0LL+44/1236/730595 Fax +44/1236/730627

Only Coilcraft offers such a broad range of highcurrent, low DCR power inductors.

They’re perfect for Point of Load and VoltageRegulator applications. Or any place you needmaximum current handling in minimum space.

Several models are rated up to 100 A rms.Others have powdered iron cores for maximumsaturation current and minimum thermal aging.

If you’re doing POL or VRD,check out our

SLC, MVR, MLC or SER.

Still others offer 5% DCR tolerance, makingthem ideal for current sensing applications.

As always, you can get free evaluationsamples from our web site with just aclick of the mouse. We ship same day!

Check out our full line of POLand VRM magnetics ASAP. Visitwww.coilcraft.com/POL

And get samples NOW!

SLC75300.05 - 0.4 µH

Up to 50 A6.7 x 7.5 mm3 mm high

SLC76490.04 - 0.1 µHUp to 100 A7.5 x 7.6 mm5 mm high

MLC12000.36 - 4 µHUp to 37 A

10.5 x 11.2 mm4.1 - 6.1 mm high

MLC15000.5 - 4.5 µHUp to 32 A

13.2 x 13.8 mm3.9 - 6.5 mm high

SER13600.33 - 10 µHUp to 48 A

13.1 x 12.9 mm5.8 mm high

SER15900.3 - 1 µHUp to 50 A

16.3 x 15.8 mm10.2 mm high

SER20000.3 - 2 µH

Up to 100 A19.6 x 20.1 mm

8.6 - 14 mm high

SLC10490.08 - 0.15 µH

Up to 61 A6.9 x 10.2 mm

5 mm high

MVRT0.25 -0.56 µH

Up to 35 A9.8 x 11.5 mm5.1 mm high

MVRC0.36 - 2.3 µH

Up to 36 A9.8 x 11.5 mm

4.7- 7.8 mm high

RoHSCCOOMMPPLLIIAANNTT

17_PEE_0308:17_PEE_0308 22/1/09 10:03 Page 1

http://www.coilcraft.com/POL

18 PCIM 2008


The 12 sessions are categorisedaround special topics such asHigh Voltage Devices, HighFreuency Converters, AutomotiveSystems, Module Reliability, FastSwitching Devices, AdvancedPower Management, NewPackaging Concepts, ProtectionStrategies, Power FactorCorrection and Compensation,High Efficiency, Advanced IGBTTechnology, and last, butnot least, a Special SessionAutomotive Power organised byPower Electronics Europe.

Awards and keynotesThe opening ceremony on

May 27 from 9.00 – 9.45 is notonly an opportunity to givesome welcome addresses, butalso for presenting the YoungEngineers Award (for 3 authorsup to 35 years receiving€1000,00 each) and the BestPaper Award for industrial orautomotive applications (flightand accomodation for PCIMChina 2009). The latter hasbeen sponsored by PowerElectronics Europe.The following keynote by

Reinhold Bayerer, InfineonTechnologies/Germany isentitled ‘Higher JunctionTemperature in Power Modules- a Demand from Hybrid Cars, aPotential for the Next StepIncrease of Power Density forVarious Variable Speed Drives’.Though many data sheets of

power devices show maximumratings in junctiontemperature of up to 175°C,reliable application is mainlylimited to junctiontemperatures of 125 or 150°C.

Driven by automotiverequirements and hybrid carapplication, further increaseof junction temperatures is onthe roadmap. It would simplifypower electronics, becausethe coolant of the combustionengine could be used to coolthe power electronics as well.For other drives applicationsthe question arises as towhether they could alsobenefit from the relatedincrease of power density. 600and 1200V IGBT and diodescan be operated at up to200°C in the junction. Theresults are demonstrated, forexample, by blockingcharacteristics, turn-off andshort circuit test results. Thelimit in junction temperatureis therefore not set by thesemiconductor, but rather bythe lifetime of solder jointsand interconnects. Assemblyand Interconnectiontechnologies have to changefor enabling high temperatureoperation in the range of 175to 200°C. As a replacement ofsolder joints, the lowtemperature joining techniquehas been known since 1986and has been in productionfor high power thyristors anddiodes at InfineonTechnologies since then.Power cycling results provethe elimination of fatigue. Asthis process is not thatattractive for power modulesfrom the process point ofview, other assemblytechnologies, which can beconsidered to meet the targetof eliminating the solder

fatigue, are investigated too.High voltage applications suchas traction may not approachthe junction temperature ashigh as foreseen for the 1200Vdevices, but such applicationmay take advantage of theextended reliability gained bynew packaging technologies.The second keynote on May

27 in the afternoon by JacquesLaeuffer, Supèlec/France dealswith ‘Higher Frequencies PowerTransformers Designs’.Increasing power supplies

frequencies leads to new issuesfor transformers andinductances design, related toelectromagnetic powerpropagation delays inside thestructure of the windings. Whensemiconductors commutationstimes are less than this delay,this leads to strong and noisyHF oscillations. Thus, EMC -including winding insulationsand semiconductors safety -requires reduced propagationdelays, to be designed throughnew rules, including analysis ofenergy densities and powerflow density inside thetransformer structure.Introduction of very fastswitching SiC diodes willreinforce this for transformerssuch as planar, round wire, orpulse, and last, but not least,windings of electric machinesfed by inverters.The keynote on May 28

morning by Ikuya Sato, FujiElectric Advanced Technology/Japan covers ‘Technologies forPractical Motor Drive Systemwith Matrix Converters’.Recently, matrix converter

has attracted a lot of attention,because it has bi-directionalpower flow, has no largeelectrolytic capacitors, and canmake its input current ofsinusoidal waveform.Therefore, it is highly efficient,has long life-time, and haslower input harmonicdistortion than an invertersystem with diode rectifier. Andit has a potential of additionalenergy saving by using a novelIGBT that has reverse blockingcapability. This paper describesseveral technologies to realisepractical matrix convertersystem with nine bi-directionalswitches.The final keynote on May 29

morning by Christof Zwyssig,Swiss Federal Institute ofTechnology is entitled ‘MegaSpeed Drive Systems: PushingBeyond 1 Million RPM’.Research in mesoscale drive

systems is targeting rotationalspeeds up to and beyond onemillion rpm in a power rangefrom 1W to 1kW. Emergingapplications for mega-speeddrives are to be found in futureturbo compressor systems forfuel cells and heat pumps,generators/starters for portablenano-scale gas turbines, PCBdrilling and machining spindles,and electric power generationfrom pressurised gas flow. Theselection of the machine typeand the challenges involved indesigning a machine for mega-speed operation are presented.Prototypes and experimentalresults originating from

A Deeper Focus onPower ElectronicsThis year’s PCIM conference focuses with 12 sessions and 51 paperson power electronics. German speakers will supply 24 papers, 19papers will come from other European countries, and five papersfrom Asia and three from the USA round up the internationality of theconference.

p18-19 PCIM 2008.qxd:Layout 1 22/1/09 10:17 Page 18

PCIM 2008 19


MegaNdrive research at ETHZurich are given.

Special session automotivepower

Just after the final keynote,this special session organised byPower Electronics Europe will beheld in the room Mailand from10.00 – 12.00. The focus is onpower electronics for hybridelectric vehicles which is alsoattracting growing interest inEurope as the market increases.

The first paper in this session‘Semiconductors in HybridDrives Applications – A surveylecture’ by Ingo Graf fromInfineon Technologies AGdescribes the structure andfunction of the different hybriddrive components, as well asused semiconductors. The latestIGBT, MOSFET and SiCtechnologies will be shown.According to the special needsin hybrid drive applications,

future trends like increasedjunction temperature or newinterconnection technologieswill be illustrated.

The second paper ‘ResonantMotor Drive Topology withStandard Modules for ElectricVehicles’ by Michael Frisch fromTyco Electronics shows thatweight and volume reduction ofthe system have highest priorityin electric vehicles, which leadsto high motor frequencies. Togain the advantage of highspeed drives without thedisadvantage of high powerlosses, resonant switchingtopologies are required, withoutbecoming too complex andwhilst still satisfying therequired reliability. A newstandard component whichsupports an innovativeswitching topology might be animportant step forward.

‘From vehicle drive cycle toreliability testing of Power

Modules for hybrid vehicleinverter’ is the third paper givenby Markus Thoben from InfineonTechnologies. In HEV the battery,motor, and inverter are coreelements of the electric drivetrain. In the inverter powersemiconductors are packaged ina module. To qualify such powermodules amongst others,extensive power and thermalcycling tests have to beperformed, which ensure thereliability over the vehiclelifetime. This paper describesrequirements of power modulesregarding reliability and lifetimein HEVs. A general approach ispresented and applied toevaluate drive cycles andestimate required test cycles.

The final paper, entitled‘Thermal Management inAutomotive/HEV and Outlookon Energy Storage’ by ClausPeter Kluge from CeramTec,focuses on new ceramic

materials. Technologicaldevelopments are focused onsmaller products with tendencyto functional ceramics, as wellas on the consequences due tominiaturisation. Therefore,future high priority challengesare thermal management,reliability and durability underrough environmental conditions.The primary topic ‘energyconversion’ will be discussed inthe example of light generation.The outlook targets applicationsfor high performance ceramic inenergy management, energystorage and energy conversion.CeramTec provides and developshigh volume ceramic materialsfor these challengingapplications.

Thus, PCIM 2008 will featurehighly interesting topics of thepower electronics world.

AS

www.mesago.de/en/PCIM/

This year’ PCIM conference will feature four keynotes and 50 papers on power electronics, including a special session Automotive Power organised by Power Electronics Europe

p18-19 PCIM 2008.qxd:Layout 1 22/1/09 10:17 Page 19

http://www.mesago.de/en/PCIM/

April 22-24 2008NEC, Birmingham

www.electrex08.comOpening hours:

Tuesday and Wednesday: 09.30-16.30Thursday: 09.30-15.30

www.electrex08.comONE PLACE – ONE WEEKTHE WHOLE OF MANUFACTURING WILL BE THERE

Co-located events:

Primary partners

In association with

AVOID THE QUEUES BY REGISTERING IN ADVANCE AT

FREE TECHNICAL

SEMINAR PROGRAMME

- 17TH EDITION REVISIONS

- COMPETENT PERSON SCHEMES

- DOMESTIC PERIODIC TESTING

AND REPORTING

DFA Media Ltd . Cape House . 60a Priory Road . Tonbridge TN9 2BL . tel: 01732 370340 . fax: 01732 360034 . [email protected]

ELECTREX1 wp:Layout 1 29/1/08 14:21 Page 1

http://www.electrex08.com

http://www.electrex08.com


Current Sensing Solutions forHybrid Electric VehiclesWith so much engineering design effort now being invested by so many of the Automotive world’s R&Dorganisations in various forms of electric and hybrid-electric vehicle development, perhaps now is a goodtime to review a few of the basic needs of the design engineer when dealing with current measurement.Warren Pettigrew, CTO Raztec Sensors, Christchurch, New Zealand

Good current measurement techniqueshave long been identified as a basicrequirement in the automotive industry.Now, with the advent of EVs (ElectricVehicles), HEVs (Hybrid-Electric Vehicles)and FCEVs (Fuel Cell Electric Vehicles)the idea of ‘good current measurement’just isn’t good enough any longer – nowwe need ‘excellent currentmeasurement!’In a previous article [1] we looked at

some of the more widely used methodsof current measurement and then wenton to discuss their various merits, andshortfalls. When we now consider theprospect of accurately measuringcurrent, in some cases from many100’s of Amps through to perhaps afew milliamps, all via the same device,and then couple that with a prettyhostile environment, subject toelectrical noise, vibration, mechanicalshock, extremes of temperature, ingressof contaminants, etc…whilst alsodemanding a robust, reliable, galvanicisolation, high speed, yet low-costdevice with extreme ease of integrationallied with incredibly low powerconsumption – the open-loop Halleffect current transducer showed itselfto be a truly formidable candidate.Building upon the experience in the

development of the current sensingtechnologies used on the New Zealandentrant for the 2007 Panasonic World SolarChallenge, Raztec engineers havecooperated with automotive industryleaders to develop sensors preciselytargeted at some of the more demandingroles HEVs offer. When the design engineeris faced with selecting the correct solutionfor use in the various areas of electricvehicle design – accurate currentmeasurement really is ‘mission critical (seeFigure 1).

Traction motor current sensorThe function of the traction motor

current sensor is to provide phase Figure 1: Typical HEV showing major areas requiring accurate current measurement

www.raztec.co.nz AUTOMOTIVE CURRENT SENSING 21


p21-23 Feature Raztec.qxd:Layout 1 22/1/09 10:18 Page 21

http://www.raztec.co.nz

current measurement for the currentloop within the traction controller itself.This essential parameter is critical forthe stability and dynamic performance

of the speed/torque controller. Keyrequirements are high frequencyresponse (>100kHz), galvanicisolation to avoid issues related to HF

common mode voltages, compactsize, 5V operation, stable performanceover the automotive temperaturerange, immunity to stray magnetic fields,low quiescent current, and modestprice.

High performance open-loop currentsensors that meet all of the above criteria,and additionally can be shaped to fit anytight physical requirements that thecontroller configuration may demand, willprovide hybrid vehicle engineers thefreedom to be more creative in theirdesigns.

The drive to optimise efficiency leads tosix or more speed gearboxes with electricactuators managing all gear shifts. Toassure correct function, it is useful tomonitor not only deflection but also theactuation forces or current flow in theactuators. This is a reasonablystraightforward task, but again widetemperature range stability is importantalong with low installed cost, robusttrouble-free design and small size.

Traction battery managementOne of the most important

requirements in hybrid vehicles is alsoone of the most demanding applicationsfor current sensing; this is themeasurement of battery current todetermine its state of charge (SOC) andstate of health (SOH). Absolutely criticalfor battery performance and longevity isthe strict management of charge anddischarge currents. Thoroughmanagement involves the measurementof current in each string of cells. Withthe trend to very small cell sizes, therewill almost certainly be a multitude ofseries/parallel cell combinations whichmust be kept in equal state of charge. Aweak string must be detected

22 AUTOMOTIVE CURRENT SENSING www.raztec.co.nz


Figure 2: Tractionbattery string detailwith alternativecurrent measurementoptions

Figure 3: Currentsensor types forbattery sensing needs



immediately and corrected, before it causes the rest of the battery to bedamaged (see Figure 2). This is particularly relevant for Lithiumchemistry.Ideally, we need a sensor that is able to detect a weak cell in a string. This

weak cell would cause just a very small increase of float current of some 10’sof mA, and at the same time the sensor must be capable of measuringdischarge currents of 100’s of Amps. No normal sensor based on Hall sensortechnology is, at present, capable of doing this. However, this need is currentlythe matter of intense engineering development that should result in a suitablesolution being generally available imminently.A possible option for sensing string current could be to use shunts in the

battery negative line, but their application is not straightforward. There will becommon mode voltage differences that the interface amplifiers must copewith. The current waveforms will be noisy with noise levels far exceeding signallevels, and the dynamic range requirements are demanding.For example, if the current range is 25mA to 150A and we choose a

0.5mΩ shunt, peak power dissipation is 11.25W, signal at 150A = 75mV, andsignal at 25mA = 12.5µV. It is quite common to experience thermoelectricvoltages of this magnitude resulting in signal corruption, thus a high qualityamplifier would definitely be required, there may be volts of noise, andbiasing resistors must be very stable as current flow will be both negative andpositive.Typical battery current sensor requirements would be galvanic isolation,

easy/flexible application, current range from ~50mA to 150A, excellentperformance stability throughout automotive temperature range, compact size,modest price, 5V operation, high immunity to stray fields, and very lowquiescent current (Figure 3).

Monitoring of cranking currentsIf the cranking currents are monitored, a great deal of diagnostic information

becomes available such as the condition of the battery, the condition of themotor/generator, the condition and compression of the engine, and thecondition of the starter circuit.For this application, the sensor must be able to operate reliably and

accurately over a wide temperature range. Galvanic isolation makes themonitoring of small signals that are superimposed on PWM voltages muchless problematic. Key requirements include high frequency operation, galvanicisolation, compact size, 5V operation, very low quiescent current, stable over awide range of temperatures, and modest price level.Auxiliary motor current control includes power steering motors, cooling

fans and water pump motors. The needs are very similar as those fortraction control, but price and small size is more important.Overload protection is applicable to protect seat adjust motors, window

motors, power locks etc. Some intelligence could be included with currentmonitoring to help protect against trapping in power windows.

ConclusionWhilst this article attempts to throw some light on the demands placed

upon the design engineer when it comes to the best selection of aparticular current sensing technology for HEV applications, it is far frombeing a comprehensive guide to all options. The intention of the author isto offer ‘food for thought’ regarding both the sensing needs of successfulcontrol design relating to HEVs, and to suggest alternatives to the type ofcurrent sensor historically used in the automotive industry. HEVs are goingto require a complete re-think regarding those attributes of a current sensordeemed essential for ‘excellent’ performance. It’s obvious that theimmense interest now being shown in the development of these type ofvehicle is going to continue driving product design and innovation. Wealready see the absolute need for a current sensor operating in the ~50mAthrough 150A range, you can be sure that any current sensor manufacturerworth his salt is going to be working on the early release of a device thatextends this range – at both ends!

Literature[1] Selecting the Most Effective Current Sensing Technology, Power

Electronics Europe issue 8/2007, pages 27-31

www.raztec.co.nz 23


For superior solutionsin power electronics

www.epcos.com



http://www.epcos.com

Exhibition & ConferenceApril 22-24 2008 – NEC, Birmingham

www.drives08.comOpening hours:

Tuesday and Wednesday: 09.30-16.30Thursday: 09.30-15.30

www.drives08.comONE PLACE – ONE WEEKTHE WHOLE OF MANUFACTURING WILL BE THERECo-located events:

Primary partners

In association with

AVOID THE QUEUES BY REGISTERING IN ADVANCE AT

DFA Media Ltd . Cape House . 60a Priory Road . Tonbridge TN9 2BL . tel: 01732 370340 . fax: 01732 360034 . [email protected]

FREETECHNICAL SEMINARS:

- ENERGY MANAGEMENT

- MACHINE SAFETY

- PROFIBUS/NET

- SAFETYBUS/NET

Drives wp.qxd:Layout 1 7/2/08 12:48 Page 1

http://www.drives08.com

http://www.drives08.com


www.infineon.com BATTERY MANAGEMENT 25


Active Charge Balancing for Li-ionBattery StacksInfineon’s E-Cart electric vehicle is used to demonstrate the electrical features of a hybrid car. The necessityfor battery management with charge balancing is a prerequisite and the simple conventional solution -dissipating power for charge equalisation - was replaced by an active energy shift between the cells. Theresulting active system has much better performance at material costs comparable to a passive solution.Werner Rößler, System Engineer for Safety Applications, Infineon Technologies AG, Neubiberg,Germany

The E-Cart (see Figure 1) is poweredby a big Lithium-Ion (Li-Ion) battery stack.Nickel-Cadmium cells and their successors,Nickel-Metal Hydride cells, have been thedominating technology for many years.Recently, new Li-Ion batteries came ontothe market. With significantly betterperformance, their market share has beenrising rapidly. These cells have amazingenergy-storage capacity. Nevertheless, thiscapacity is insufficient to support a hybridmotor using a single cell. The voltage andthe current are both too low. To increasethe current capability, cells may beconnected in parallel. Higher voltages canbe achieved by connecting cells in series.

Battery assemblers describe theirarrangements usually using shorthandterms such as ‘3 P 50 S’, which means3 cells in parallel and 50 cells in series. Amodular architecture is ideal for batterymanagement with many cells in series. Aserial connection of up to 12 cells iscombined into one block in a 3 P 12 Sarray, for example. These cells are managedand balanced by an electronic circuit with amicrocontroller in its heart. The outputvoltage of a block depends on the numberof cells in series, and the cell voltage. Thevoltage of Li-ion cells is typically between3.3 and 3.6V. This leads to block voltagesbetween 30 and 45V. Hybrid drives need aDC supply voltage in the range of 450V. Tocompensate for variations in cell voltagedepending on the charge state, a DC/DCconverter is a suitable link between thebattery stack and the motor drive. Theconverter is also able to limit the current.For optimal operation of the DC/DCconverter, a stack voltage of 150 to 300V isrequired. Therefore, 5 to 8 blocks have tobe connected in series.

Necessity for balancingLi-Ion cells are very susceptible to

damage outside the allowed voltage range(Figure 2). If the upper and lower voltage

limits (e.g. 2 and 3.6V for nanophosphatetypes) are exceeded, the cells may bedamaged irreversibly. At a minimum, anextended self-discharge rate is the

consequence. Over a wide state-of-charge(SOC) range, the output voltage is stable.The risk of leaving the safe area is low.However, at the beginning and at the end

Figure 1: E-Cart prototype

Figure 2: Li-iondischargecharacteristics(nanophosphate type)

p25-27 Feature Infineon.qxd:Layout 1 22/1/09 10:19 Page 25

http://www.infineon.com

26 BATTERY MANAGEMENT www.infineon.com


of the safe range, the curve steepenssharply. As a precaution, the voltage has tobe monitored carefully.

If the voltage reaches a critical value, thedischarge or the charge process has to bestopped immediately. With a strongbalancing circuit, the voltage for theaffected cells can be driven back into a safearea. To reach this target, energy must bemoved among the cells whenever thevoltage of any cell in the stack begins todiffer from the others.

In the conventional passive method,each cell is connected to a load resistor viaa switch. In such a passive circuit,individually selected cells can bedischarged. This method is only suitable inthe charge mode to suppress a voltage risein the strongest cells. In order to limit thedissipated power, small currents in therange of 100mA are used, resulting inbalancing times that may take severalhours.

Various methods for active balancingcan be found in the literature. A storageelement to move energy is required.Using a capacitor requires a huge array ofswitching elements to link the storagecapacitor to any cell. It is more efficientto store the energy in a magnetic field.The key component of the circuit is atransformer. A prototype was developedin co-operation with VOGT electronic. It isused for moving energy between thecells and multiplexing the single cellvoltages to a ground-voltage-basedAnalog-to-Digital-Conversion (ADC)input.

The construction principle is the flybackconverter. This type of transformer canstore energy in a magnetic field. An airgap in the ferrite core increases themagnetic resistance to avoid the magneticsaturation of the core material. Theprimary side of the transformer isconnected to the complete battery stack,and each cell is connected to a secondarywinding (see Figure 3). A feasible modelof the transformer supports up to 12 cells.The limiting factor is the number ofpossible connections. The prototypetransformer described has 28 pins. Theswitches are realised with OptiMOS3MOSFETs that have an extremely low on-resistance, so the conducting losses arenegligible.

Each block is controlled by an 8bitmicrocontroller (XC886CLM) featuring aflash and 32kbyte data memory. Twohardware-based CAN interfaces supportcommunication using the commonautomotive Controller Area Network (CAN)bus protocol with a low processor load. Ahardware-based multiplication and divisionunit (MDU) speeds up the calculationprocess.

Balancing methodsThe bi-directional use of the

transformer allows the application of twodifferent balancing methods, dependingon the situation. After a voltage scan of all

cells the average value is calculated. Thenthe cell with the largest deviation fromthe average is examined. If its voltage islower than the average, the bottom-balancing method is applied; if it is

Figure 3: Principal circuit of a battery-management module

Figure 4: Bottom-balancing principle

Figure 5: Top-balancing principle



www.infineon.com BATTERY MANAGEMENT 27


higher, the top-balancing variant is applied.The example in Figure 4 shows a situation in which the

bottom-balancing method is required. Cell 2 is recognisedas weakest cell which has to be supported. When theprimary (‘prim’) switch is closed, the transformer ischarged from the stack. After the primary switch isopened, the stored energy of the transformer can beshifted into a selected cell. This happens if thecorresponding secondary (‘sec’) switch - in this examplesec2 - is closed.

A cycle period consists of two active pulses and apause. In this example, the period of 40µs equates to afrequency of 25kHz. The transformer should be designedfor a frequency over 20kHz to avoid a whistling noise inthe audible frequency range generated by themagnetostriction of the transformer’s ferrite core.Especially where the lower end of the SOC of a cell hasbeen reached, the bottom-balancing method helps toprolong the operational time of the stack. As long as thecurrent drawn from the stack is less than the averagebalancing current, vehicle operation can be continueduntil the last cell is empty.

If one cell has a higher voltage than the others, it isuseful to draw energy from the cell. In the charge mode,this is absolutely necessary. Without balancing, thecharging process has to be stopped immediately whenthe first cell is full. Balancing will help to avoid this bykeeping the cells at the same voltage.

The example in Figure 5 shows the energy flow in thetop-balancing mode. After the voltage scan, cell 5 has beendetected as the strongest member of the stack. When theswitch sec5 is closed, a current flows from the battery intothe transformer. Because of the inductance, the currentrises linearly over time. As the inductance is a fixedcharacteristic of the transformer, the on-time of the switchdefines the maximum current value. The energy portionout of the cell is stored as a magnetic field. After sec5 isopened, the prim switch has to be closed. The transformerbehaviour changes into a generator mode. The energy isfed into the complete stack via the large primary winding.The current and timing conditions are similar to thebottom-balancing example. Only the sequence and currentdirections are reversed.

With the prototype configuration used in the E-Cart, anaverage balancing current of 5A is reached. This is50 times higher compared to the passive method. Thepower dissipation in the complete block caused by thebalancing with 5A is only about 2W. This requires nospecial cooling effort and improves the energy balance ofthe system.

Voltage scanningTo manage the charge-state of the individual cells, their

individual voltages have to be measured. As only cell 1 isinside the ADC range of the microcontroller, voltages inthe remaining cells of the block cannot be measureddirectly. A possible solution would be an array ofdifferential amplifiers, which would have to sustain thevoltage of the complete battery block.

The method described below allows the measurementof all voltages with only a small amount of additionalhardware. The transformer, whose main task is the chargebalancing, can be used as well as a multiplexer. In thevoltage-scanning mode, the flyback mode of thetransformer is not used. When one of the switches S1 toSN is closed, the voltage of the connected battery cell is

Battery Chargers

Welders

Solar Inverters

Trademarks property of Microsemi Inc. © 2007 Microsemi Inc.

Phone: 541-382-8028

High Speed SwitchingReduced Eoff

NPT TechnologyShort Circuit RatedHigh ReliabilityHigh Noise ImmunityLLow EMIRoHS Compliant

For High Switching Frequencies Over 100kHz

www.microsemi.com

transformed to all windings in the transformer.Simply preprocessed by a discrete filter, themeasurement signal is fed into an ADC input ofthe microcontroller.

The measurement pulses generated whenone of the switches S1 to Sn is closed may bevery short. A practicalon-time is 4µs. Therefore, there is not muchenergy stored in the transformer. In any case,after the switch is opened, the magneticallystored energy is fed back to the completebattery block via the primary transistor.Consequently, the energy content of the battery

block is not affected. After one scanning cycleover all cells, the system returns to the originalstate.

ConclusionThe benefits of the new Li-ion batteries for

vehicle applications can be advantageous onlywith a capable battery-management system. Anactive charge-balancing system offerssignificantly better performance than theconventional passive approach. The ingenioususe of a relative simple transformer helps tokeep the material costs low.



http://www.microsemi.com

28 MOTION CONTROL www.irf.com


Simplifying Dual Motor Control inEnergy-Efficient AppliancesWhen permanent magnet brushless motor drives were introduced to the market more than twenty yearsago, the control algorithms were implemented using a combination of analog amplifiers and logiccomponents. Today, highly integrated mixed signal controllers enable the implementation of complexcontrol algorithms that maximise the efficiency of permanent magnet AC drives in various applications.Aengus Murray, International Rectifier, El Segundo, USA

Advances in power and digital controlsilicon technology over the past few decadeshave enabled a continuous improvement inmotor drive technology. Japanese airconditioning manufacturers recently startedswitching from sensorless control based onback EMF (electro-magnetic force) sensingto sensorless field oriented control based oncurrent feedback. Field oriented control(FOC) with current angle phase advancemaximises the efficiency of interiorpermanent magnet motors, providing anefficiency gain of almost 5%. The switchfrom trapezoidal to sinusoidal control alsominimises torque ripple to reduce acousticnoise in the fan motor.

A recently introduced mixed signalcontrol IC can simultaneously run both thecompressor and fan motors in an airconditioning system. A combination ofhighly optimised hardware control blocksand a configurable control sequencerenables rapid execution of complex motorcontrol algorithms. The IC is one element inan appliance design platform that includesall the power and control silicon needed todrive the fan and compressor motor in an

air conditioning system. The same IC canalso be applied to the latest energy efficientlaundry systems that use an energy savingheat pump in the drying cycle.

Air conditioning design platformThe circuit schematic in Figure1 includes

the major components in the outdoor unitcontroller for an air conditioning system.The mixed signal motor control IC drivesthe compressor motor, the fan motor andthe power factor correction circuit. The ICintegrates three major functions: theMotion Control Engine (MCE), the AnalogSignal Engine (ASE) and an 8bitmicrocontroller. The MCE executes themotor control algorithms, while anindependent 8bit microcontroller coreimplements the application functions.

The sensorless field oriented controlalgorithm derives all the required motorinformation from the currents flowing in theDC link shunts. This avoids the need forposition sensors on the motor shaft andisolated current transducers in the powerinverter circuit. The Analog Signal Engineincludes the fast A/D converter, multiple

sampling circuits and differential amplifiersneeded to extract the motor windingcurrent from the DC link current signal.

The Motion Control Engine executes thesensorless FOC algorithm described by thecontrol schematic in Figure 2. Thealgorithm includes a reverse rotationfunction that transforms the measuredstator currents into a reference framesynchronised with the angle of the rotormagnet flux. The transformed currents havetwo quasi DC components: a direct axiscurrent is aligned with the rotor flux and aquadrature axis component that generatesmotor torque due interaction with the rotormagnet.

The d and q axis current loopcompensators calculate the stator voltagesto force the currents to track the set pointvalues. The forward rotation functiontransforms these voltages to sinusoidal ACvoltages in the stator reference frame. Thespace vector PWM generator uses thesesignals to derive transistor switching signalsfor the three-phase inverter. When driving aclassical permanent magnet synchronousmotor with surface mounted rotor magnets,

Figure 1: Airconditioning designplatform

p28-30 Feature IR.qxd:Layout 1 22/1/09 10:21 Page 28

http://www.irf.com

www.irf.com MOTION CONTROL 29


the d axis reference current is set to zero tomaximise the torque per amp. However,when driving an interior permanent magnetmotor, the d axis current will generate areluctance torque component to augmentthe torque produced by the rotor magnets.The IPM control function is the key controlelement that enables the operation at ahigher efficiency when driving the IPMmotor.The other key feature of the sensorless

FOC algorithm is that it does not requirehigh resolution rotor angle sensors typicallyfound in industrial drive systems. Inappliance drives, where low speedperformance is not important, the rotorangle can be derived from the windingback EMF signal. In brushless DC driveswith a six-step commutation sequence, theback EMF is available directly by samplingthe voltage on the unconnected winding.However, when driving the motor withsinusoidal currents the back EMF has to becalculated indirectly from the motor circuit

model. The equations 1

and 2

describe the two-phase equivalent circuitfor the permanent magnet synchronousmotor. The two-phase currents are derivedusing the Clarke transform that calculatesthe currents in two quadrature windingsthat will produce the same field as thecurrents in the three phase windings. Thetwo-phase winding currents are the outputsof the forward rotation function that drivethe space vector PWM generator.The important aspect of the two-phase

circuit model is that the back EMF termsare time derivatives of cosine and sine fluxfunctions, and so they can be determined

through integration. The detailed controlschematic for angle and speed estimatorshown in Figure 3 has two majorsubsystems. During the first stage, the fluxestimator derives the rotor cosine and sineflux functions. The flux integrators includelow frequency gain compensation to avoidDC saturation. At the second stage, therotor angle phase locked loop (PLL) forcesthe error between the rotor angle and theestimated angle to zero. The error iscalculated using a vector rotation functionwhose quadrature output will be zero whenthe rotation angle input matches the angleof the cosine and sine flux functions. Thesecond order feedback loop in the PLLgenerates both angle and velocity signals.A further feature of the PLL is the start

up sequencer that is required at lowspeeds when the winding back EMF signalis swamped by circuit noise. The first partof the start up sequence is a parkingfunction that drives DC current into thestator windings to align the rotor at a

Figure 2: Sensorless field oriented control algorithm

Figure 3: Rotor angle and speed estimator


http://www.irf.com

known angle. Then the motor is driven witha constant current to generate a constanttorque. The PLL speed integrator is fed by amotor mechanical model that estimates themotor speed from the accelerating torqueand system inertia. Once the motorreaches a certain minimum speed, the PLLswitches to a closed loop mode and tracksthe rotor flux angle.

The motion control engineWhen using a traditional DSP or RISC

processor, the motor control schematic isfirst translated into state equations that arewritten in C code before softwaredevelopment tools can generate machinecode for the processor. The motion controlengine (MCE) supports a unique approachto motor control algorithm development.The MCE graphical compiler is analgorithm development tool thattransforms the control schematic directly toMCE sequencer code avoiding allintermediary steps. This allows thedeveloper to modify the referencealgorithm directly, making use of a libraryof optimised control blocks such as PIcompensators and vector rotations.The reference algorithm includes the

basic AC motor control functions, includingthe FOC current loop with sensorless rotorposition estimation and an outer velocityloop. The inner current loop is a well-

established FOC algorithm used for PMSMcontrol, and typically does not requiremodification, but the optimal algorithm forthe outer control loops will vary withapplication. Fan or pump controllers, forexample, may need to regulate torque tomaintain pressure, while compressorcontrollers may just regulate speed. Incompressor control, a simple velocity loopmay not properly regulate at low speedsbecause of the load torque ripple. A feedforward algorithm can compensate for theload torque to eliminate mechanicalvibration at low speeds.In washing machines, the controller can

detect the wash load imbalance byanalysing the ripple signature in the motorspeed and torque before entering the spincycle. The appliance designer edits thecontrol algorithm schematic using theMatlab Simulink graphical user interfaceand can add control blocks such ascomparators, summing junctions, switchesand integrators. The digital control ICexecutes the algorithm on the IC using thematching hardware blocks from the MCEcontrol library based on the MCEsequencer code generated by the graphicalcompiler.Optimised control blocks enable a

significant reduction in execution timerelative to software implementations. Oneexample of an optimised control block is

the vector rotator shown in Figure 4. TheCORDIC vector rotation has beendeveloped specifically for ASICimplementation that relies on a series add,subtract and shift functions that yield 12bitaccuracy in only 13 cycles [1]. Thiscalculation is 10 times faster than thecalculation using Taylor expansion on a32bit RISC processor.The digital timing circuits that generate

the inverter PWM signals also generate thesample timing signals that allow the ASE toextract the motor winding current from theinverter DC link. This optimisedcombination of analog and digital signalprocessing circuits can simultaneouslycontrol two permanent magnetsynchronous motors. There is additionalsignal conditioning and MCE processingcapacity to support the execution of apower factor control (PFC) algorithm. Thus,the air conditioning control IC can controlthe input power factor, the fan andcompressor motor, while traditional RISCprocessor based systems require separatefan and PFC control ICs.

Literature[1] Ray Andraka, ‘A survey of CORDIC

algorithms for FPGA based computers’,Proc. of ACM/SIGDA Sixth InternationalSymposium on FPGAs, 1998, Monterrey,CA, pp. 191-200.

Figure 4: Vector rotation hardware


MOTION CONTROL www.irf.com30


http://www.irf.com

HVCA diodes are ideal for use in high voltage power supplies

and multipliers found in medical equipment and instrumentation.

They are also well-suited for aerospace, military, automotive,

down hole and high temperatureapplications and X-ray equipment

used for medical, dental, industrial and security purposes.

1 kV to 300 kV Fast Recovery

down to 35nS Average Forward

Current up to 10 Amps

REPLACEMENTS FOR MANY

FUJI DIODES AVAILABLE

IN EUROPE CONTACT:

HVP High Voltage Products GmbHBunsenstr. 5 82152 Martinsried/MünchenTel: +49 (0) 89/891 374 80Fax: +49 (0) 89/891 375 [email protected]

TO CONTACT THE FACTORY:

HVCAP.O. Box 848 Farmingdale, NJ 07727(732) 938-4499(732) 938-4451 FAXe-mail: [email protected]

To receive your own copy of

subscribe today at:

www.power-mag.com

To receive your own copy of

subscribe today at:

www.power-mag.com

31_PEE_0308:31_PEE_0308 22/1/09 10:07 Page 1


http://www.hvproducts.de


http://www.hvca.com

http://www.power-mag.com

32 POWER SEMICONDUCTORS/MODULES www.mitsubishichips.com


Power Device Technologiesfor Sustainable Growth ofPower ConversionApplicationsPower devices have gone through a rapid technological evolution along with the advancements in powerelectronics during the last few decades. More recently, the enormous advancement made by MOS-gatedpower device technologies such as IGBTs, power MOSFETs, and power modules have tremendously helpedfast proliferation of power electronics application in industrial, commercial, residential, transportation, utility,aerospace and other emerging fields that include newer power generation systems. The first part of thiskeynote, given at PCIM China, reviews the state-of-the-art key technologies related to power devices andtheir contribution in power conversion applications. Gourab Majumdar, Mitsubishi ElectricCorporation, Fukuoka, Japan

A continuous advancement of powerdevices is considered to be the key to asustainable future growth of powerconversion application that can adequatelycope with the increasing global energy andenvironmental issues. In the following,requirements from various application fieldswill be briefly reviewed with an overview ofkey power semiconductors that haveemerged so far. This includes state-of-the-art key technologies related to theadvancement of IGBT modules andintelligent power modules (IPMs) as keycomponents for power conversiontechnologies.

Application environmentAs it has been until today, the demand

for energy saving and ecologicalcompatibility in power consumption willcontinue to enforce thrusts for newerconsumption equipment andadvancements of power electronics as thekey enabler for power savings. It isestimated that, presently, a total of17000TWh of electric power is beingconsumed globally every year and thisnumber has increased by about threetimes in the past 30 years. However, only asmall percentage of this is being processedby use of efficient conversion methodswhich can be achieved by application ofPower Electronics (PE) engineering. In spiteof that, a huge growth rate in applying PE isobserved in some specific new areas, such

as alternative and renewable energygeneration systems and automotive power-train controls. Both of these new fields aregrowing at a rate higher than 20% per yearand are expected to continue growing formany more years to come.The history of power electronics has

been closely allied with advances in

electronic devices that provide thecapability to handle high-power levels.Although the trend in this growth indicatesan ‘application-driven’ behaviour in specificsegments, it still shows a ‘device-driven’characteristic. Therefore, the trend followedby power devices and continuousimprovement of them is extremely

Figure 1: Projected growth of power density in power electronics system designs in relation with thetrend in power semiconductors

p32-37 Feature Mitsubishi.qxd:Layout 1 22/1/09 10:22 Page 32

http://www.mitsubishichips.com

www.mitsubishichips.com 33


important for reaching a sustainable energystructure globally.

Of the various requirements from powerapplications of today, one of the key trendsfollowed in the design of newer systems istoward achieving higher ‘power-density’ ina structural concept. This trend is heavilydependent on evolution of power devicesin terms of performance improvement andfunctional integration. Progress made in‘power-density’ improvement and relatedcontributions by various power devices sofar, and expectations in the future, isillustrated in Figure 1.

Power MOSFETsPower MOSFETs appeared in the late

‘70s. This device became possible byvirtue of the development of metal-oxide-semiconductor (MOS) technology formicroelectronic applications. Unlike thebipolar junction transistor (BJT) theMOSFET, which belongs to the Field EffectTransistor (FET) family, is a unipolarvoltage controlled device, and it operatesonly by majority carrier transport in theconduction mode requiring very low drivepower compared the to current-controlledbipolar BJT.

Out of various categories of powerMOSFETs in the FET family, the verticallystructured n-channel enhancement modetype is the most popular one for poweramplification and conversionapplications. Simple cell structures basedon a planar gate concept and a trenchedgate concept are shown in Figure 2. Thisfigure also illustrates the primeconstituents of the device’s drain-to-source on-resistance and its specificvalue related to the device’s breakdownvoltage in relation with the theoreticalsilicon limit (Si-limit) for an unipolar

Figure 2: PowerMOSFET cellstructures andrelations withunipolar Si-limitdefining scope forspecific on-resistanceversus breakdownvoltage trade-offimprovement

Figure 3: Super-junction concept andoperation principle



34 POWER SEMICONDUCTORS/MODULES www.mitsubishichips.com


structure. As also described in the figure,a trench-gate cell concept is veryeffective for reducing Rj and RCH

components of the total RON and,therefore, has been the trend for lowvoltage (<200V) class devices.

On the other hand, as the resistivecomponent RD increases exponentiallywith higher breakdown voltagerequirements, which, in turn, requires athicker N-layer, the power MOSFET hasnot been an appropriate solution for highvoltage applications. Therefore, itsapplication has been mainly concentratedin the low voltage (<200V) range. Here,advanced processes have been used tooptimise static on-state resistance versusbreakdown voltage trade-off relationships.Today, less than 0.2µm design rule basedsuperfine trenched-gate power MOSFETprocesses have been made practical forless than 100V class, where specific on-resistance (rsp) values have been reachedvery close to the theoretical Si-limit[1,2,3].

Also, as only majority carriers contributeto the current flow, a power MOSFET canswitch very fast and, therefore, it has beenthe primary device solution for high-frequency applications. By comparison,bipolar transistors have greater powerhandling capability, but due to slowerswitching speed characteristic, thesedevices have been mostly used for lowfrequency type applications. PowerMOSFETs have lesser power handlingcapability, but the fast switching speedperformance has made these devicesparticularly suitable for high frequencyapplications.

Super-junction conceptAs discussed, the most important issue

throughout the development history ofpower semiconductor devices has beensearching for methods to improve trade-offbetween on-state voltage drop andbreakdown voltage (BV) characteristics withnewer devices structures andsemiconductor material. In the case ofunipolar devices like a power MOSFET, ittranslates to attaining the best trade-offbetween rsp and BV, and to shrink thefeature size without degrading the device’scharacteristics.

As discussed before, much effort hasbeen put into the reduction of rsp whilemaintaining the desired BV. However, thetheoretical Si-limit is understood to be theextreme that can be achieved. Recently, athree-dimensional structural concept,named the superjunction (SJ) concept,has been investigated for practical useand has given significant results in termsof rsp and BV trade-off improvement,compared to conventional powerMOSFET devices.

Figure 3 summarises some features ofthe SJ concept, in comparison with theprinciple of a pn-junction operationmechanism. This SJ principle has beenextended to create practical MOS-gatedpower switching devices in recent years. AnSJ power MOSFET, which has a conceptsimilar to a multi-RESURF idea, allowsdoping levels of its n-region to be typicallyone order of magnitude higher than thatused in standard high-voltage MOSFETs.The additional charge is counter-balancedby the adjacent charges of a p-column. Thiscounter-balancing contributes to a

horizontal electrical field without affectingthe vertical field distribution. The electricfield inside the structure is fixed by the netcharge of the two oppositely dopedcolumns. In this way, if both regionscounter-balance each other perfectly, anearly flat field distribution can beachieved.

Practically, the main advantage of an SJpower MOSFET is a drastic reduction of thedevice area because of the device’s low rspfeature. The trade-off between rsp and BVbeing dependent on the column pitch orwidth, refined process techniques forcolumn building, can achieve better valuein the future. This small chip size of the SJpower MOSFET leads to a low gate charge,which also results in higher switchingfrequencies, compared to conventionalpower MOSFETs with comparable voltageand current ratings.

However, this device concept is not verypractical for very high voltage ratings(>1000V) because of the processdifficulties in achieving a perfectly balancedcharge condition. Also, unlike a standardpower MOSFET, the integral body diodepresent in an SJ structure exhibits a veryinferior performance in terms of reverserecovery characteristics and avalancheenergy rating due to its spaced chargedbased operation. Therefore, in applicationssuch as power inverters or converters,where the integral body-diode is used forregenerative conduction and, by that, thesame diode is required to be low loss typeand robust in reverse recoveryperformance, the SJ device concept is notcapable of serving the applicationadequately [4].

Figure 4: Applicationmap of differentpower electronicsequipment and theirmajor technologicalrequirements



www.mitsubishichips.com POWER SEMICONDUCTORS/MODULES 35


Power module technologiesPower modules, including standard

IGBT type and intelligent type (IPM), havebeen widely used in power systems suchas industrial motor drives, power supplies,home appliances, electric vehicles, ortraction control for railways. In suchapplications, system designers havecontinuously demanded improved deviceperformances regarding loss reduction,higher power density and higher powerhandling capability, lower electromagneticnoise generation, better switchingcontrollability and wider safe operatingarea (SOA). Figure 4 depicts a summaryof such requirements from various

application fields. The two most commonthrusts have been the reduction of powerlosses and improvement of powerdensity.

In order to visualise the performanceimprovement of IGBTs on a relative basis,a new figure-of-merit (FOM) term relatingcurrent density, saturation voltage dropand turn-off switching energy has beenproposed by the author. The FOMexpression and chronograph of IGBT’sperformance improvement is given inFigure 5. The key technologies related tothe structural aspect of variousgenerations of IGBT devices are alsodescribed in the diagram. The Carrier

Stored Trench Gate Bipolar Transistor(CSTBT) device cell concept has helpedimproving the defined FOM greatly sinceits debut at the 5th generation level ofIGBT evolution. Along with theimprovement of FOM, the various newgenerations of IGBT device structures havealso contributed greatly in power lossreduction. In Figure 6, this trend has beenplotted in comparison with theperformance made by an equivalent BJTmodule in the early ‘80s.

The latest CSTBT technology basedpower modules are extensively used todaybecause of low loss characteristic (1/3rd

compared to 1st generation IGBT and

Figure 5: The chronograph ofIGBTs FOM improvement

Figure 6: Trend ofoperating losses ofvarious powerdevices



36 POWER SEMICONDUCTORS/MODULES www.mitsubishichipscom


Figure 7: Changes inIGBT cell design from3rd to 5th generationsand trend toward thenext step

1/5th compared to the old BJTtechnology). Another new trend in IGBTdevice technology is the wafer thinningapproach. The main objective was toeliminate the need for any epitaxial activelayer in the device’s structure. Figure 7describes briefly how such a structuralchange has come in play and itsoptimisation aspect.

An optimised non-epitaxial type devicestructure works on the principle known asthe light-punchthrough (LPT) voltageblocking mechanism, and lately has beencombined with the CSTBT cell concept to

achieve superior IGBT performance. Figure8 describes some features of this advancedLPT based CSTBT structure. On thisstructural innovation line, a new IGBTdevice concept featuring integrated diodefunction to create a Reverse-Conductingtype of IGBT (RC-IGBT) has becomefeasible. Such multi-functional new deviceshave opened up new hopes for powerdensity improvement in future systemdesign.

Figure 6 also projects that the 6thgeneration in the IGBT trend will bring theloss ratio down by another five points,

which is about a 30% reduction,compared to the losses of current 5thgeneration. This large-step improvement isexpected by the introduction of advancedprocess technologies for fabrication ofCSTBT chips. New generation chips arealso expected to be based on cellconcepts that can reduce terminalcapacitances effective for suppressing EMIand improving the dynamic performanceof the device. On the other hand, forhigher voltage class IGBTs (1700V andabove) somewhat different chiptechnologies are expected to be playing

Figure 8:Advancement ofCSTBT on waferthinning


http://www.mitsubishichipscom

37


the key role for some years in the future.A planar gate design concept is still

going to voltage ratings higher than 2kV.Figure 9 explains structural featuresadopted in such chip designs [5,6]. Seethe next part in our May issue!

Literature[1] A. Narazaki, et al: ‘A Marvelous

Low On-resistance 20V Rated SelfAlignment Trench MOSFET in a 0.35umLSI Design Rule’, ISPSD 2004Proceedings, pp. 393-396.[2] G.E.J. Koops, et al: ‘Resurf Stepped

Oxide (RSO) MOSFET for 85V having arecord low specific on-resistance’, ISPSD2004 Proceedings, pp. 185-188.[3] G. Majumdar, et al:

‘Characteristics of a new 50A, 500VHigh Power MOSFET ModuleManifested for High Frequency InverterApplications’, PCI, June, 1986Proceedings, pp. 260-274.[4] K. Takahashi, et al: ’20mohm.cm²

660V Super Junction MOSFETsFabricated by Deep Trench Etching andEpitaxial Growth, ISPSD 2006Proceedings, pp. 297-300.[5] G. Majumdar, et al: ‘A New

Generation High Speed Low Loss IGBTModule’, IEEEISPSD, 1992 Proceedings,pp. 168-171[6] K. Nakamura, et al: ‘The Second

Stage of a Thin Wafer IGBT Low Loss1200V LPTCSTBT with a BacksideDoping Optimization Process’, ISPSD2006, pp. 133-136.

Figure 9: IGBT chiptechnologies for high-voltage applications

TYPE VDS ID25 RDS(ON)typ QG(ON) Package CircuitMax Tc=25°C Tc=25°C typ

V A nC IXKR 47N60C5 600 47 0,045 150 ISOPLUS 247 SingleFMD 15-06KC5 600 15 0,165 40 ISOPLUS i4 BoostFMD 47-06KC5 600 47 0,045 150 ISOPLUS i4 BoostFDM 15-06KC5 600 15 0,165 40 ISOPLUS i4 BuckFDM 47-06KC5 600 47 0,045 150 ISOPLUS i4 BuckLKK 47-06C5 600 2 x 47 0,045 2 x 150 ISOPLUS 264 DualIXKT 70N60C5 600 66 0,045 150 TO-268AA Single

POWER SEMICONDUCTORS/MODULES


38 PRODUCT UPDATE


Prod Head 1Prod text no indentProd text indent

Prod bold text no indentProd bold text indent

www.ne1.comEnquiry No: 000

Prod head 2 150mADual-Level OutputLDOs

4.5kV RatedAsymmetricBlocking GTO

6 Channel Constant-CurrentLED DriverThe A6285 from AllegroMicroSystems Europe is a 16-channelconstant-current LED driver featuringindividual channel currentadjustment via a 7bit dot correctionregister. Each channel can sink aconstant current up to 80mA, and asingle external resistor sets themaximum LED drive current for allchannels. Each channel’s drivecurrent can be individually adjustedfrom 0 to 100% of the maximumvalue via the dot correction register,and the brightness of all the channelsmay be adjusted simultaneously by pulse-width modulation of the output enable (OE) input.

The A6285’s serial interface can interface directly with microprocessor or FPGA-basedsystems. A serial data output permits cascading of multiple devices in applications requiringmore than 16 channels. The A6285’s CMOS logic runs on a 3.3 to 5V supply. LED supply voltagecan range up to 12V, accommodating a series string of several LEDs on each channel.Applications include large-scale displays and signs in the industrial, communication and officeautomation markets.www.allegromicro.com

New Power MOSFETs for DC/DCSuppliesSTMicroelectronic’sSTD60N3LH5 andSTD85N3LH5 are the firstin a new series ofSTripFET V devices whichprovide betterperformance andincreased efficiency as aresult of low on-resistance andsignificantly lower totalgate charge. Both are 30V(BVDSS) devices. Withgate charge (Qg) of just8.8nC and on-resistanceof 7.2mΩ at 10V, theSTD60N3LH5 can applied as a control FET in non-isolated DC/DC step-down converters,whereas the 4.2mΩ on-resistance at 10V and Qg of 14nC of the STD85N3LH5 can be appliedas a synchronous FET.Both devices are housed in DPAK and IPAK packages and will be soon available in other

package options including SO-8, PowerFLAT 3.3 x 3.3, PowerFLAT 6 x 5, and PolarPAK.STripFET technology makes use of very high ‘equivalent cell density’ and smaller cell featuresto achieve low on-resistance and losses, while using less silicon area.STripFET V is the latest generation achieving 35% improvement in the silicon resistance

and active area, plus some 25% reduction in total gate charge per active area, compared tothe earlier generation.www.st.com/pmos

Texas Instruments has introduced 150mA, low-dropout linear regulators (LDOs) with dual-levelvoltage output for MSP430 microcontroller-based,battery-powered devices consuming low quiescentcurrent of 500nA. The TPS780xx LDOs withselectable dual-level output voltages allow todynamically shift to a lower voltage level in abattery-powered design when the microprocessoris in sleep mode. The two voltage levels are factorypreset by an EPROM, which provides multipleoutput voltage options.The LDO requires no external parts to

implement the device’s dynamic voltage scaling(DVS) feature for an 8 or 16bit MSP430 or othermicrocontroller design. The TPS780xx is stable withany output capacitor greater than 0.1µF. Thedevices come in a 6pin, 2mm x 2mm SONpackage, which is targeted at portable applicationsthat require low power, while maintaining a smallfootprint.http://power.ti.com

Westcode Semiconductors, an IXYS company,has launched a new asymmetric blocking GTOwith nominal current rating of 1000A whenused with a 2µF snubber capacitor and suitablefor DC link voltages up to 2.8kV. The device hasbeen developed using Westcode’s uniquecathode design and is encapsulated in a 38mmpole face hermetic pressure contact package.The device is offered in two voltage grades:

G1000QC400 with a repetitive peak off-statevoltage of 4kV and G1000QC450 with arepetitive peak off-state voltage of 4.5kV. Targetapplications for the new GTO thyristor areauxiliary converters in railway applications suchas coach hotel facilities, as well as main drives inmass transport systems such as the tram ortrolley bus. This device is also suitable for otherapplications outside traction including all powerconversion systems up to 500kW. The industrystandard outline makes it a substitute in themaintenance of existing equipment. The newGTO is also a replacement for the now obsoleteWestcode GTO thyristor types WG5045S andWG8045S.www.westcode.com

p38-40 Products.qxd:Products - 1 page 22/1/09 10:25 Page 38

http://www.allegromicro.com

http://www.ne1.com

http://power.ti.com

http://www.st.com/pmos

http://www.westcode.com

Name:

Company Name:

Address:

Post Code:

Tel: Total Number of Copies @ £ p+p Total £

Drives S & S Hyd H/B Pne H/B Ind Mot CompH/B H/B Air

DFA MEDIA LTD,Cape House,

60a Priory Road,Tonbridge,

Kent TN9 2BL

QUANTITY QUANTITY

Hydraulics&Pneumatics

There are now 6 of these handy reference books from the publishers ofthe Drives & Controls and Hydraulics & Pneumatics magazines.

Published in an easily readable style and designed to help answer basicquestions and everyday problems without the need to refer to weighty textbooks.

We believe you’ll find them invaluable items to have within arms reach.

From the publishers of

QUANTITY QUANTITY QUANTITY

If you would like to obtain additional copiesof the handbooks, please complete the formbelow and either fax it on 01732 360034or post your order to:

Engineers Handbook, DFA MEDIA LTD,Cape House, 60a Priory Road, Tonbridge,Kent TN9 2BL.

You may also telephone your order on01732 370340

Cheques should be made payable toDFA MEDIA LTD and crossed A/C Payee.

Copies of the handbooks are available at£4.99 per copy.

Discounts are available for multiple copies.2-5 copies £4.30, 6-20 copies £4.10,20+ copies £3.75.

Postage and Packaging:1-3 copies £2.494 copies and over £3.49

QUANTITY

PRACTICAL ENGINEER’S HANDBOOKSPRACTICAL ENGINEER’S HANDBOOKS

HYDRAULICS

INDUSTRIALMOTORS

SERVOSAND STEPPERS PNEUMATICS

COMPRESSED AIR INDUSTRIALELECTRIC DRIVES

PLEASE ALLOW UPTO 28 DAYS FOR DELIVERY

M6 DC APR 03 Handbooks Ad.qxd:M6 DC APR 03 Handbooks Ad.qxd 22/1/09 10:47 Page 1

40 PRODUCT UPDATE


ProdHead 1Prod text no indentProd text indent

Prod bold text no indentProd bold text indent

www.ne1.com

Prod head 2 15A CurrentSenseTransformers

Power ICs ineSIP Package

Digitally Powered DC/DCConvertersLambda, a unit of TDKCorporation, hasexpanded its half-brickDC/DC converter with theiHG series. Using theindustry standard half-brick footprint with nobase plate, these modulesare intended for lowairflow, high temperature,48V power architectures intelecom, wireless,industrial and many otherapplications. The initialoffering includes 5V/10A,5V/20A and 3.3V/30Adevices. The 93% efficiency delivers a very high level of useable power in convection cooledenvironments, particularly where airflow rates are low. Furthermore, the digital controlcircuitry reduces component count and improves reliability at lower cost. A double ended-power train topology with FET driven synchronous rectification combined with a secondaryside auxiliary control rail ensures safe operation under functional and fault conditions.www.lambda-europe.com

900V SuperjunctionMOSFETsInfineon Technologies has introduced its first900V superjunction MOSFETs specificallyintended for high-efficiency SMPS, industrialand renewable energy applications. CoolMOSuses an innovative approach to overcome thesilicon limit, a characteristic of MOSFETs inwhich doubling of voltage blocking capabilityleads to a five-fold increase in on-stateresistance.In overcoming the silicon limit, the CoolMOS

900V devices achieve on-state resistances of0.12Ω in a TO-247 package, 0.34Ω in a TO-220package and 1.2Ω in D-PAK packages, which isat least 75% lower than can be achieved insuch packages with conventional 900VMOSFETs.CoolMOS 900V devices can offer an FOM (figure-of-merit, calculated as on-state resistance

times gate charge) as low as 34Ω*nC, which results in low conduction, driving and switchinglosses, and leads to increased efficiency. Quasi-resonant flyback designs for LCD TV powersupplies can benefit from a higher flyback voltage, which provides a longer primary dutycycle with reduced peak current, zero-voltage switching and significantly lower voltagestress on the secondary side. Because of their low on-resistance, a single CoolMOS 900V in aTO-220-FP package can be used in such a design, rather than the two or more TO-220-FPpackages that must be used with conventional 900V MOSFETS. Compared to the mostcommon solution today, which uses 600V MOSFETs, a CoolMOS 900V solution gives apremium efficiency of more than 0.5%.www.infineon.com/coolmos

Murata Power Solutions has introduced three newranges of surface-mount current sensetransformers.The 5300, 5400 and 5500 series can be used

to measure or monitor AC currents in highfrequency applications such as switched-modepower supplies, motor controllers, and electroniclighting ballasts. Designed to measure AC currentsup to 10A, the 5300 series comprises tendifferent devices with a primary current rating to10A and between 20 and 200 turns, dependingon the resolution of current measurementdesired. A primary to secondary isolation of500Vrms in an industry-standard footprint helpssimplify their inclusion into existing productdesigns.The 5400 and 5500 series are designed to

measure AC currents up to 15A and are availablewith 50, 100 or 200 turns. The 5400 seriesfeatures a small footprint package style andprovides 1200Vrms primary to secondaryisolation. The 5500 series is offered in a low profilepackage with a primary to secondary isolation of1000Vrms.www.murata-ps.com

Power Integrations has announced the TOPSwitch-HX series of AC/DC power conversion ICs in thenew eSIP-7C Eco-Single-Inline-Package.This package exhibits the same low thermal

impedance as the traditional TO-220, yet standsless than 10mm above the PCB - half the height ofthe 45 year old package.The heatsink attached tothe eSIP package is at source potential andtherefore electrically quiet without the use of aninsulating pad, greatly reducing system EMI andassembly cost.In addition to thermal and physical size

benefits, the new eSIP package also reducespower supply manufacturing costs. A low-costclip reduces heatsink assembly time andimproves package to heatsink contactrepeatability, ensuring consistently good thermalperformance in contrast to the asymmetrically-mounted screw tab on the older TO-220 packagedesign.The clip-mounted eSIP passes shock and

vibration tests to IEC 60068.www.powerint.com

p38-40 Products.qxd:Products - 1 page 22/1/09 10:25 Page 40

http://www.ne1.com

http://www.murata-ps.com

http://www.lambda-europe.com

http://www.infineon.com/coolmos

http://www.powerint.com

WEBSITE LOCATOR 41


AC/DC Connverters

www.irf.comInternational Rectifier Co. (GB) LtdTel: +44 (0)1737 227200

DiodesDiscrete Semiconductors

Drivers ICS

www.microsemi.comMicrosemiTel: 001 541 382 8028

Fuses

GTO/Triacs

IGBTs

DC/DC Connverters

DC/DC Connverters


www.power.ti.comTexas InstrumentsTel: +44 (0)1604 663399


www.neutronltd.co.ukNeutron LtdTel: +44 (0)1460 242200


Harmonic Filters

www.murata-europe.comMurata Electronics (UK) LtdTel: +44 (0)1252 811666

EMC/EMI

www.icecomponents.comIce Components IncTel: 001 703 257 7740

Direct Bonded Copper(DPC Substrates)

www.curamik.co.ukcuramik electronics GmbHTel: +49 9645 9222 0


www.mark5.comMark 5 LtdTel: +44 (0)2392 618616









www.protocol-power.comProtocol Power ProductsTel: +44 (0)1582 477737

Busbars

www.auxel.comAuxel FTGTel: +44 (0)7714 699967

Capacitors

www.powersemiconductors.co.ukPower Semiconductors LtdTel: +44 (0)1727 811110

www.powersemiconductors.co.ukPower Semiconductors LtdTel: +44 (0)1727 811110

Connectors & TerminalBlocks


Current Sensors

www.collmer.comCollmer Components IncTel: 001 972 248 2888

www.hvca.comHV Component AssociatesTel: +49 (0) 89/891 374 80


p41-42 Website Locator.qxd:p41-42 Website Locator 22/1/09 10:27 Page 41

http://www.irf.com

http://www.collmer.com

http://www.irf.com

http://www.power.ti.com

http://www.protocol-power.com

http://www.mark5.com


http://www.neutronltd.co.uk

http://www.curamik.co.uk

http://www.irf.com



http://www.icecomponents.com

http://www.powersemiconductors.co.uk


http://www.murata-europe.com

http://www.irf.com


http://www.irf.com




http://www.hvca.com

http://www.irf.com

http://www.auxel.com

http://www.hvca.com

http://www.powersemiconductors.co.uk


Power Modules

Power Protection Products

Power Substrates

Resistors & Potentiometers

Simulation Software

Thyristors

Smartpower Devices

Transformers/Inducers

Voltage References

Power ICs

Suppressors

Switches & Relays

Switched Mode PowerSupplies

Thermal Management &Heatsinks








www.icecomponents.comIce Components IncTel: 001 703 257 7740










www.power.ti.comTexas InstrummentsTel: +44 (0)1604 663399


www.power.ti.comTexas InstrummentsTel: +44 (0)1604 663399


www.dau-at.comDau GmbH & Co KGTel: +43 3143 23510

www.denka.co.jpDenka Chemicals GmbHTel: +49 (0)211 13099 50

www.lairdtech.comLaird Technologies LtdTel: 00 44 1342 315044

www.universal-science.comUniversal Science LtdTel: +44 (0)1908 222211



www.isabellenhuette.deIsabellenhütte Heusler GmbH KGTel: +49/(27 71) 9 34 2 82

42 WEBSITE LOCATOR


ADVERTISERS INDEX

ADVERTISER PAGE

ABB 13

CKE 31

COILCRAFT 17

CT CONCEPTS 4

DANFOSS 31

DFA MEDIA LTD 39

DRIVES AND CONTROLS 24

ELECTREX 20

EPCOS 23

FUJI ELECTRIC OBC

INDIUM CORORATION 9 & 11

INTERNATIONAL RECTIFIER IFC

IXYS 37

MICROSEMI POWER 27

PCIM 2008 IBC

TEXAS INSTRUMENTS 7

THE BERGQUIST COMPANY 8

TYCO POWER 15

Linear Converters

Mosfets

Optoelectronic Devices



Packaging & Packaging Materials






p41-42 Website Locator.qxd:p41-42 Website Locator 22/1/09 10:27 Page 42

http://www.irf.com


http://www.irf.com






http://www.isabellenhuette.de


http://www.icecomponents.com

http://www.irf.com

http://www.irf.com

http://www.irf.com

http://www.irf.com

http://www.hvca.com

http://www.irf.com




http://www.irf.com









http://www.dau-at.com

http://www.denka.co.jp

http://www.lairdtech.com

http://www.universal-science.com



Date post:	11-Apr-2020
Category:	Documents
Upload:	others
View:	5 times
Download:	0 times

Issue 3 - Automotive Current Sensing · 2009-03-02 · Email:[email protected] Armin Wezel...

Documents