IT 327 - Schweber Chap 8 1

Thought of the Day

I have believed all my life that that which was worth doing was worth doing well, and have considered it as much a part of my religion to do honest, reliable work, such as would endure, for those who employed me, as to attend to the services of God's worship on the Sabbath.

  

- Brigham Young(1876)

IT 327 - Schweber Chap 8 2

Thought of the Day

The development of our spiritual nature should concern us most. Spirituality is the highest acquisition of the soul, the divine in man, the supreme, crowning gift that makes him king of all created things. It is the consciousness of victory over self and of communion with the infinite. It is spirituality alone which really gives one the best in life.

Pres. David O. McKayConference Report, Oct 1936, p. 103

IT 327 - Schweber Chap 8 3

Schweber, Chap 8:Transmission Lines

Characteristic Z (Zo)

IT 327 - Schweber Chap 7 4

𝑍 𝑜=√ 𝑅+ 𝑗2 π 𝑓 L𝐺+ 𝑗2 π 𝑓 C

𝑍 𝑜≈ √ 𝐿𝐶Assume: R << XL, and G << XC:

𝑍 𝑜≈ √ 𝑗 2π 𝑓 L𝑗2 π 𝑓 C

L = (µoµrN²A)/l C = (εoεr A)/d

IT 327 - Schweber Chap 8 5

Line Losses

1. I²R heating2. Skin effect losses (R now α f)3. Capacitively coupled to ground4. Radiation losses5. Imperfections in materials6. Dielectric heating

IT 327 - Schweber Chap 8 6

Waveguide

IT 327 - Schweber Chap 8 7

Microstrip Lines

IT 327 - Schweber Chap 8 8

PCB Performance WebinarWhy this Webcast is Important:Breaking the 32 Gb/s barrier for printed circuit board (PCB) channels requires a strong understanding of PCB stack-up design, simulation methods, and measurement techniques.  How a PCB fabrication document calls out the materials, such as fiber weave and surface roughness, is critical to high speed performance.  Accuracies of channel performance time and frequency domain simulations at the higher data rates require knowledge of as-fabricated material properties and tolerances.  Design and measurement of test structures to validate the PCB stack-up performance require custom fixtures and implementation of high frequency calibration techniques, such as fixture removal.  Understanding the basic flow and interaction of stack-up design, simulation, and measurement is critical for leverage of existing low cost PCB manufacturing technology for repeatable design performance.  This webcast brings together experts in each of these three areas to demonstrate the basic flow of successful stack-up design with robust correlation between measurements and simulations at 32 Gb/s and beyond.

Who should view this webcast:Signal Integrity Engineers working with Printed Circuit Board Channels at Multi-Gigabit Data Rates

Electronic Design, Jan 22, 2015

IT 327 - Schweber Chap 8 9

Line & Load Matching

IT 327 - Schweber Chap 8 10

Line & Load Matching

IT 327 - Schweber Chap 8 11

Line & Load Matching

IT 327 - Schweber Chap 8 12

Line & Load Matching

IT 327 - Schweber Chap 8 13

The Smith Chart:

loads of fun

IT 327 - Schweber Chap 8 14

The Smith Chart:

loads of fun

IT 327 - Schweber Chap 8 15

Impedance Matching & Data Rates

IT 327 - Schweber Chap 8 16

When is a connection

not a connection?

IT 327 - Schweber Chap 8 17

When is a connection

not a connection?