JMAD-S-14-06376.pdf

Elsevier Editorial System(tm) for Materials and Design Manuscript Draft Manuscript Number Title Influence of ZnO nanoparticles addition on thermal analysis microstructure evolution and tensile behavior of Sn-50 wt Sb-05 wt Cu Lead-free solder alloy Article Type Original Article Keywords Keywords Sn-5Sb solder composite lead free yield stress ultimate tensile stress Corresponding Author Dr Eid A Eid Ph D Corresponding Authors Institution Basic Science Department Higher Technological Institute 44629 10th of Ramadan City Egypt First Author Eid A Eid Ph D Order of Authors Eid A Eid Ph D Aly Fouda Abstract AbstractSn-5wtSb-05wtCu (plain SSC505) and Sn-5wtSb-05wtCu-05wt ZnO (SSC-ZnO) composite solder alloys have been studied The variation in thermal behavior microstructure and tensile characteristics associated with mixing of 05wt ZnO nano-metric particles to plain SSC505 sousing differential scanning calorimetry (DSC) after addition of ZnO X-ray diffraction (XRD) analysis

-Sn SbSn and Cu6Sn5 intermetallic compounds (IMCs) beside some of ZnO planes in SSC-ZnO composite solder Field emission scanning electronic microscope (EF-SEM) investigation of SSC-ZnO composite solder revealed a homogenous uniform distribution size

-Sn grains Addition of ZnO nano-metric particles into the plain SSC505

addition adding ZnO nano-metric particles were found to be effective for reducing ductility by 43 of -Sn grains within SSC305-ZnO composite solder

Dear Editor

Irsquom pleased to present our work titled

Influence of ZnO nano-particles addition on thermal analysis

microstructure evolution and tensile behavior of Sn-50 wt Sb-05 wt

Cu Lead-free solder alloy

The effect of adding ZnO nano-particles to Sn-5wtSb-05wtCu

(plain SSC505) were studied The variation in thermal behavior

microstructure and tensile characteristics associated with mixing of

05wt ZnO nano-metric particles to plain SSC505 solder were

investigated X-ray diffraction analysis of SSC-ZnO confirms the

existence of SbSn Cu6Sn5 IMCs and ZnO The microstructure

observations revealed finer IMCs due to active surface area of ZnO

nanoparticles that supports the strong adsorption effect Improvement in

the tensile parameters was achieved because of presence of ZnO

nanopowders as reinforcement agent The nano-sized particles are

dispersed uniformly and homogeneously distributed in Sn matrix which

provide high barrier by impeding grain boundary sliding and dislocation

movement

The work is valuable to be published in Materials and Design

We here confirm that

1 The article is original

2 The article has been written by the stated authors who are ALL aware

of its content and approve its submission

3 The article has not been published previously

4 The article is not under consideration for publication elsewhere

5 No conflict of interest exists or if such conflict exists the exact nature

Cover Letter

of the conflict must be declared

6 If accepted the article will not be published elsewhere in the same

form in any language without the written consent of the publisher

Please accept my best regards

Dr E A Eid

Dr Aly Nabeih Fouda

1

Highlights

1- Melting point of SSC505-ZnO composite solder is slightly increased by 089 0C

compared with the plain SSC505 solder

2- XRD and EDX analysis reflect the presence of SbSn Cu6Sn5 IMCs

3- EF-SEM images of SSC-ZnO composite solder revealed homogenous uniform

distribution of -Sn grains and fine IMC particles

4- A detectable improvement in the Young modulus ultimate tensile strength and

yield strength were observed after addition of 05wt ZnO nano-metric particles

Highlights (for review)

1

Influence of ZnO nanoparticles addition on thermal analysis

microstructure evolution and tensile behavior of

Sn-50 wt Sb-05 wt Cu

Lead-free solder alloy

E A Eid a A N Fouda

b

(a) Basic Science Department Higher Technological Institute 44629 10th of Ramadan City Egypt

(b) Physics department Faculty of Science Suez-Canal University 41522 Ismailia Egypt

Abstract

Sn-5wtSb-05wtCu (plain SSC505) and Sn-5wtSb-05wtCu-05wt ZnO

(SSC-ZnO) composite solder alloys have been studied The variation in thermal behavior

microstructure and tensile characteristics associated with mixing of 05wt ZnO nano-

metric particles to plain SSC505 solder were investigated A slight increment in the

melting temperature [Tm= 089 oC] was recorded using differential scanning calorimetry

(DSC) after addition of ZnO X-ray diffraction (XRD) analysis confirmed the existence

of -Sn SbSn and Cu6Sn5 intermetallic compounds (IMCs) beside some of ZnO planes in

SSC-ZnO composite solder Field emission scanning electronic microscope (EF-SEM)

investigation of SSC-ZnO composite solder revealed a homogenous uniform distribution

size refinement of IMCs and -Sn grains Addition of ZnO nano-metric particles into the

plain SSC505 enhanced the yield stress YS by ~12 and improved the ultimate tensile

strength UTS by ~13 In addition adding ZnO nano-metric particles were found to be

effective for reducing ductility by 43 of the plain solder due to the refinement of -Sn

grains within SSC305-ZnO composite solder

Keywords Sn-5Sb solder composite lead free yield stress ultimate tensile stress

ManuscriptClick here to view linked References

2

1 Introduction

Sn based alloys is promising for advance electronics components connections as a

lead-free composite solder The substitution of toxic lead element (Pb) in the electronics

industry is one of the key issues in the current drive towards green ecology [1] Recently

high-temperature solders have been widely used in various types of applications like

assembling optoelectronic components automobile circuit boards circuit modules for

step soldering etc [2] Eutectic composition of goldndashtin (Au-20wt Sn) is the best

solder alloy for most applications in optoelectronic packaging because of its high creep

resistance wettability and good reliability Although goldndashtin solders have brittle phases

more expensive and has a melting point of 278 degC which is unacceptable for some

bonding applications [3 4] Certainly high soldering temperatures could damage the

properties of optical fibers and sensitive optoelectronics such as lasers light emitting

devices photodetectors or waveguide devices [5 2] To solve this problem great efforts

have been made to develop a new generation of solders with a low melting point

reasonable cost high dimension stability and supporting solder joints performance With

increasing miniaturization and more inputoutput terminals [6]

In high temperature applications Snndash5wt Sb solder is one of great potential

alternative material to push out the AundashSn solders and toxic Pb-rich solder alloys [7]

Snndash5wtSb solder has stable microstructure good mechanical properties highly creep

and corrosion resistance and good solderability (contact angle of about 43o) [7 8] To

enhance the performance of Tin-Antimony solders a third or more materials incorporated

as secondary phase with Sn-based matrix is one of the conventional approaches [9 10]

Micronano size metallic intermetallic or oxide particles are the most widely used in the

reinforcement of composite materials Consequently great numbers of researches focus

their study on the effect of adding reinforcement compound to lead free solder alloys

[11]

literature survey indicate that no attempt has been made to reinforce the binary

Sn-5wtSb solder or Sn-5wt Sb-05wt Cu solders by ZnO nanoparticle Meanwhile

a nano-size oxide intermetallic or ceramic particles are used to reinforce the composite

solders of Sn-Ag and Sn-Ag-Cu (SAC) Babaghorbani et al [12] added a different

3

addition of SnO2 nanopowders to Sn-35Ag lead-free solder alloy Taso et al [4] mixed a

different addition of TiO2 nano-size particles to Sn35Ag025Cu solder Their results

showed profound effects on the thermal characteristics of solder solidification and

reduction of the grain size Nai et al reported that the mechanical properties of the carbon

nano-tubescomposite solders improved significantly [11] However some efforts have

been made to reinforce Sn-35Ag solder with nanopowders of ZrO2 SiC Cu Co Ni Ag

and intermetallic particulates (Cu6Sn5 Ni3Sn4) using different processing methods

[612131415] Their results exhibit effective influence on the mechanical behavior

measurements indicated significant increases in yield strength ultimate tensile strength

and microhardness due to hinder the dislocation motion However the ductility decreased

with increasing amounts of nanoparticles additions Moreover the secondary phase must

be sufficiently fine bond well stable have a higher flow resistance than the alloy matrix

un-deformable and resist the fracture of solder joint

The literature survey revealed that no studies have been reported so far on lead-

free SSC505 solder joints containing nano-metric ZnO particles So the present work is

devoted for investigating the effect of addition of nano-metric ZnO particles on thermal

microstructure and tensile properties of Snndash5wt Sbndash05 wt Cu (SSC505) lead free

solder for trying to improve its microstructure and tensile properties

2 Experimental

Zinc oxide (ZnO) nanopowders were selected as a reinforcement oxide because of

its capability to form physical bond with metallic matrix Additionally the main

advantages of nano-sized ZnO particles are (i) it has density of (567 gcm3) which is

nearly close to density of Sn-5wtSb (7530 gcm3) (ii) high hardness when compared to

Sn-50Sb matrix (iii) chemical stability and (iv) low cost when compared to other

nanoparticles such as TiO2 Y2O3 SiC and ZrO2 [19]

A lead-free solder Sn-50 wt Sb-05 wt Cu (plain SSC505) solder alloy was

prepared by melting together Sn Sb and Cu ingots of 9999 purity SSC-ZnO

composite solder was prepared by mechanical mixing of 05 wt nano-metric ZnO

particles into plain SSC505 solder with subsequent remelting in a vacuum furnace at 300

oC for 2 hr to obtain a homogeneous composition A stainless steel mold was used for

4

casting then left to cool slowly to room temperature The two solder alloys in the form of

rods were cold drawn into a wire of 08 mm diameter A part of each alloy was rolled into

a sheet of 05 mm thick for microstructure investigations Specimens with a gauge length

of 50 mm were pulled for tensile testing Prior to the tensile testing all specimens were

heat-treated at a temperature of 150 oC for 2 h Then they cooled slowly to room

temperature in order to stabilize the microstructure and remove the residual defects which

produced during the cold drawn process The densities ) of plain and composite solders

were determined using Archimedesrsquo principle Polished samples taken from various

sections of the solidified rods were weighted in air and when immersed in distilled water

using an electronic balance (AampD HM-202) with an accuracy of plusmn 00001 g

For metallographic observations as-solidified specimens were prepared initially

by mounting in cold epoxy They were finely polished using 3m and 1m alumina

powder which suspended in distilled water as a lubricant Final polishing to near mirror-

like surface was achieved using 03m diamond paste The as-polished samples were

chemically etched in a solution of 80 glycerin 10 nitric acid and 10 acetic acid for

a few seconds

The etched surfaces of the solder samples were observed in an optical microscope

The surface morphology of the samples was characterized by using field emission

scanning electron microscopy (FESEM) SU8000 series equipped with energy dispersive

X-ray analysis EDX X-ray diffractometry (Philips diffractometer (40 kV) with Cu K1

radiation (λ = 015406 nm) was used for XRD measurements XRD patterns were

recorded in the 2θ range of 20ondash90deg (step size 002deg per 1 second)

The melting temperature and fusion heating of solders were analyzed using a

differential scanning calorimetry (DSC) Shimadzu DSC-50 DSC measurements were

carried out at heating rate of 5 oCmin and high purity nitrogen gas pass through heating

chamber to avoid oxidation of samples Tensile testing was performed by straining each

specimen to fracture under a strain rate of 47times10-3

s-1

and testing temperature of 27 oC

5

3 Results and Discussion

31 Thermal analysis

For the soldering process the melting temperature of solders is a crucial

parameter because it is main factor in deciding the process temperature The melting

point of the prepared plain and composite solders was accurately determined by DSC

thermograms Fig 1(a-b) shows the endothermic peak as a function of temperature of the

prepared solders during the heating rate of 5 oCmin The melting temperature of the plain

and composite solders is 23738 and 23827 oC respectively This result is agree with

other previous studies on SAC composite solders [4 20 21] The slightly increase in

melting point of the SAC355 composite solder can be attributed to the effect of the nano-

sized ZnO particles on the rate of solidification Such particles may serve as retardation

sites for the solidification process of the IMCs [22]

Additionally The endothermic peak of DSC curve in Fig 1 is initiated at solidus

temperature Ts and ended at liquidus temperature TL that are estimated by using intersection

point between the horizontal tangent of baseline and the tangent line for each side of

endothermic peak The features of endothermic peak of synthesized solder alloys are

summarized in Table 1 For plain SSC505 and composite solders there is a significant

difference between solidus temperatures Ts = 211oC) and a negligible difference

between liquidus temperatures TL = 013 oC) For any alloy to be worthwhile as a solder

for electronics industry it must possess certain specific quantities like melting range or pasty

range which is an essential parameter to estimates the time required for finishing the soldering

process The pasty range of plain and composite solder alloys are 2388 and 2190 degC

respectively The results reflect that the solidus and liquidus temperature of the synthesized

solder alloys are lower than Sn-5wt Sb binary solder alloy On the other hand Sn-5wt Sb

has the smallest pasty range of 100 degC and a higher melting temperature of 246 oC that

provides a useful compromise between them [9 23]

The calculated values of fusion heat of both solder alloys are tabulated in table 1 The

heat of fusion of plain is higher than composite solder alloy [HSSC505 ndash HSSC-ZnO = 3656 Jg)

Indeed The heat of fusion H) plays an important role in packaging technology Therefore

SSC-ZnO composite solder alloy is considered as a promising solder for saving energy

6

andor the consumed energy for its melting process is lower than Sn-5wt Sb HSn-5Sb = 1405 Jg)

by 37 [9]

32 Microstructure evolution

321 XRD analysis

Representative x-ray diffraction of plain solder and composite solders are shown in Fig

2a-b The diffraction pattern exhibits sharp peaks which are attributed to the crystalline

nature of the two samples The qualitative analysis of the peaks reflects the existence of

the body center tetragonal β-Sn-rich phase The diffraction planes (101) (110) (021) and

(202) at angles of (2 293o 419

o 423

o and 605

o) respectively confirm the existence

of cubic SbSn IMC Regarding to Fig 2b it consists of the same phases which exist in

the plain solder (Fig 2a) On the other hand the emergence of (101) and (002) peaks at

angles 327 o

and 343 o

of ZnO is an evident of ZnO nanoparticles dispersion within -Sn

matrix Moreover the disappearance of some ZnO peaks can be attributed to interfere of

its peaks with the peaks of -Sn phases However a slow speed scan (002 degs)

conducted on the plain and composite solders revealed several peaks at angles of (2=

3036 4288o 5365 5758 6233 and 7971) that corresponding to Cu6Sn5 IMC The

small peaks of Cu6Sn5 IMC assigned to the low volume fraction of the copper in the

solder matrix Fig 3 shows a comparison between diffraction peaks (200) and (101) of

-Sn for plain and composite solders One can observe that the diffraction lines are

slightly shifted towards lower angles indicating a refinement of -Sn grain size with

addition of ZnO nano-metric particles [24 25]

It is well known that the broadening of XRD peaks of an alloy is caused not only by the

small grain size but also by the lattice micro-deformations of the alloy [15] The

crystallite size d and an approximate upper limit of the lattice strain can be evaluated by

XRD peaks analysis according to the Williamson-Hall formula [25]

sin2cos d

K (1)

where β is the peak width at half the maximum intensity (FWHM) in radian of the main

peak θ is the Bragg angle K is the Scherrer constant (09) η is average of lattice strain

and λ is the X-ray wavelength (λCu = 0154056 nm)

7

When β cosθ was plotted against sinθ using main peaks of -Sn a straight line is

obtained with the slope of 2η and the intercept as (09λd) Results of linear fitting of

extracting data summarized in table 2 The crystallite size of Sn-based supersaturated

solid solution was measured to be 116 and 99 nm for the plain and composite solders

respectively From table 2 one observed that the average of lattice strain of -Sn phase

for SSC-ZnO composite solder was higher than plain solder The lattice strains observed

in the solid-solution phases during solidification are caused not only by defect formation

but also by another factor this strain was originally introduced during sample

preparation particularly in crushing of the sample [26] The peaks in the X-ray

diffraction (XRD) patterns for composite solder broadened This broadening was

supposed to be due to lattice strain Moreover lattice strain is introduced upon phase

transition from coarsen -Sn phase to refinement phase The anisotropic strain in the

diffraction peaks has the same orientation as the Burgers dislocation vectors [24] That

indicating the strain is accompanied by density dislocations which is closely related to

defect formation

3 2 2 Metallographic Analysis

Results of microstructural characteristics of the plain and composite solders are discussed

in terms of (i) grain morphology size and homogenous distribution (ii) the presence

distribution and morphology of the second phase particles and (iii) percentage of

porosity cracks and voids Fig 4 shows two optical images (OM) with same powers of

magnification for the as-cast plain and composite solders that solidified at cooling rate of

2 oCmin Results revealed the plain solder composed of larger non-equiaxed grains non-

uniform solidification microstructure the large dark islands are rich-Sn grains with grain

size in the range of 100-140 m The bright region between Sn grains actually consists of

mixture of lamellar phases of Sn matrix phase (dark phase) and the circular bright dot

phase termed as SnSb IMC Moreover the finer rich-Sn grains within composite solder

reveal near-equiaxed grains with average grain size in the range of 90-50 m

approximately homogenous distribution and narrower dendrites are shown in Fig 4b

The decrement of average grain size of -Sn phase with addition of 05 wt Zinc nano-

metric particles can be attributed to its pinning action on grain boundaries and by the

8

second phases resulting in limited grain growth [18] In Fig 4b the -Sn phase is not

only composed of pure Sn crystals but rather contain several of tiny intermetallic particles

that scattered throughout Sn matrix Furthermore with higher magnification of field

emission scanning electronic microscope (FE-SEM) the precipitated particles like as

platelets or scallop morphology of the Cu6Sn5 IMC are observed in both solders (see Fig 5a-b)

The precipitation of IMCs within -Sn matrix is confirmed by utilizing energy

dispersion X-ray (EDX) analysis the eutectic areas were found to contain Zn O Cu Sb

and Sn elements in composite solder Thus it can be concluded that the network eutectic

areas are Cu6Sn5 and SbSn besides the ZnO particles as shown in Figs 6a-c Stichometric

analysis of EDX data implies the existence of Sn Sb and Cu atoms and termed IMCs

according to the atomic ratio of each element in compound [see table 3] An identified

reduction in size of SbSn Cu6Sn5 IMCs was confirmed by FE-SEM images (see Fig5a-

b) This was assigned to ZnO nanoparticles which incorporated into the solder matrix

According to the adsorption theory increasing the adsorption of elements could decrease

the surface energy andor decrease the growth of IMCs size [14] For the composite

solder the micro-size of SbSn and Cu6Sn5 IMCs are larger than the size of the ZnO nano-

metric particles Therefore the incorporation of active surface ZnO nano-metric particles

refines the size of IMCs Previously similar behavior has been reported [20 22]

The Curve of EDX analyses of a selected area (+) in Fig 6b shows that the

Cu6Sn5 IMC contain 701 at of Sb element [see table 3] The existence of antimony

atoms inside the Cu6Sn5 grain confirms that tin-antimony intermetallic compound might

be the nucleating agent acting as a heterogeneous nucleation of Cu6Sn5 grains The

proposed mechanism for the effect of Sb on IMC formation can be summarized as

follows because Sb has higher affinity to the constituent element of Sn in SnndashCundashSb

ternary system it will reduce the activity of Sn at the Sn-Cu interface by forming SnSb

compound resulting in a decreased driving force for CundashSn IMC formation [27] SnSb

particles may be initially formed and finely dispersed in the molten solder and then some

of them precipitate and become the heterogeneous nucleation sites of Cu6Sn5 IMC

According to the theory of heterogeneous nucleation the Cu6Sn5 phase prefers to

nucleate on the SnSb surface in order to reduce the thermodynamic barrier [28] The

increase in nucleation probability of Cu6Sn5 grains consequently lends to the refinement

9

of the grains As a result the small and uniform grains obtained in the composite solder

slow down the ripening rate and the refinement effect is achieved

33 Density measurement

The results of density measurements were conducted on the solidified plain and

composite solders In Table 4 all the density values were very close which is predicted

because of the slight difference in density between Sn and ZnO The porosity

measurement was theoretically calculated [12 24] The value of porosity implied that the

higher percentage of pores exists in the case of SSC-ZnO composite solder

34 Strengthening effect

Fig 7 shows the typical tensile stressndashstrain curves of plain and composite solders

stretched with constant strain rate of 74times10-3

s-1

and performed 27oC The stressndashstrain

obtained curves exhibited plateau shaped with steady stable flow stress of the two solder

alloys It was found to be strongly dependent on alloy composition of the tested material

Furthermore steady state flow of composite solder was higher than plain solder by ~12

This observation can be explained as during plastic deformation the solder alloy suffers

from simultaneous work hardening and dynamic recovery [17] They have contrary

influences on the mechanical deformation of the alloy Hence the steady stable stresses

seem to be represented equal combination effects for those Additionally existences of

the ZnO nanoparticles must increase dislocation densities because of their restrict effect

for the motion of dislocation besides the dispersion hardening mechanism of the IMCs

Therefore the dislocations have much less freedom that cant pass through climb and

cross slip planes that lead to increase the flow stresses [20]

The average values of Young modulus E ultimate tensile strength UTS yield

stress YS fracture stress f and ductility ɛ of the synthesized solder alloys were tabulated

in Table 5 Addition of 05 wt ZnO nanopowders was found to have a significant effect

on the tensile parameters Detectable increments in E by 52 UTS by 11 and in YS by

13 were recorded However the ductility of SSC-ZnO composite solder was less than

plain solder by 43 Improvement in the tensile parameters was achieved because of

presence of ZnO nanopowders as reinforcement agent The nano-sized particles are

10

dispersed uniformly and homogeneously distributed in Sn matrix which provide high

barrier by impeding grain boundary sliding and dislocation movement

The reinforcement nanoparticles play two different roles They may strengthen the

alloy matrix and enhance the formation of large dislocation pile-ups at grain boundaries

Simultaneously the higher friction of nanoparticles generates microcracks nucleation at

the interface between Sn matrix and IMCs which speed up the failure process [29 30]

So ductility decreased because of a large amount of microporosity throughout grain

boundaries and crack nucleation sites in the form of hard and brittle ZnO nanopowders

[20 24 31]

Eventually the influence of the nano-metric size particles can be summarized in

(i) pinning grain boundaries and thus impeding sliding of the grain boundaries (ii) the

increase of dislocation densities and obstacles to restrict the motion of dislocation and

(iii) the dispersion hardening mechanism of the IMCs and ZnO nanopowders [30 32]

4 Conclusion

ZnO nanoparticles dissolve and react with the molten SSC505 solder at 600 oC during the

fabrication of SSC-ZnO composite solder Thermal behavior microstructure and

mechanical characteristics were discussed The melting point of SSC505 solder is slightly

increased after the addition of ZnO nanoparticles X-ray diffraction analysis of SSC-ZnO

confirms the existence of SbSn Cu6Sn5 IMCs and ZnO The microstructure observations

revealed finer IMCs due to active surface area of ZnO nanoparticles that supports the

strong adsorption effect According to the tensile measurements an improvement in UTS

and YS were established However the ductility of SSC-ZnO composite solder was

decreased The variation in tensile properties is attributed to ZnO pinning effect which

obstructed dislocations and migration of grain boundaries

11

5 Reference

[1] M Abtew G Selvaduray Mater Sci Eng 27 (2000) 95-141

[2] V Chidambaram J Hattle J Hald Microelectronic Engineering 88 (2011) 981- 989

[3] H Mavoori S Jin J Electron Mater 27 No (11) (1998) 1216-1222

[4] LC Tsao SY Chang Materials and Design 31 (2010) 990-993

[5] H Mavoori JOM 52 No 6 (2000) 29

[6] J Shen Y C Chan Microelectronic Reliability 49 (2009) 223-234

[7] J Rodney McCabe and E Morris Fine Metallurgical and Materials Transactions A

No 33A (2002) 1531-1593

[8] M D Mathew H Yang S Movva and K L Morty Metallurgical and Materials

Transactions A No 36A (2005) 99-105

[9] A A El-Daly Y Swilem A E Hammad Journal of Alloy and Compounds 471

(2009) 98-104

[10] H Mavoori S Jin JOM 52 No 6 (2000) 30-32

[11] S M L Nai J Weib M Gupta Material Science and Engineering A No 423A

(2006) 166-169

[12] P Babaghorbani S M L Nai M Gupta Journal of Material Science Mater

Electron 20 (2009) 571-576

[14] J Shen Y C Chan Journal of Alloys and Compounds 477 (2009) 552-559

[15] J Shen Y C Liu Y J Han Y M Tian and H X Gao Journal of electronic

material 35 No 8 (2006) 1672-1679

[16] P Babaghorbani S M L Nai M Gupta Journal of Alloys and Compounds 478

(2009) 458-461

[17] A A El-Daly G S Al-Ganainy A Fawzy M J Younis Materials and Design 55

(2014) 837-845

[18] M E Alam S M L Nai and M Gupta Journal of Alloys and Compounds 476

(2009) 199-206

[19] Hadis Morkoccedil and Uumlmit Oumlzguumlr Zinc Oxide Fundamentals Materials and Device

Technology WILEY-VCH Verlag GmbH amp Co KGaA Weinheim (2009)

ISBN978-3-527-40813-9

12

[20] A Fawzy S A Fayek M Sobhy E Nassr M M Mousa G Saad Journal of

Material Science Mater Electron 24 (2013) 3210-3218

[21] L C Tsao S Y Chang C I Lee W H Sun C H Huang Material and Design

31 (2010) 990-993

[22] A Fawzy S A Fayek M Sobhy E Nassr M M Mousa G Saad Materials Science and

Engineering A 603 (2014) 1-10

[23] M M EL-Bahay M E EL-Mossalamy M Mahdy and A A Bahga phys stat sol

(a) 198 No 1 (2003) 76-90

[24] B D Cullity Elements of X-ray Diffraction (second edition) Addison-Wesley

Publishing Company Inc MA USA (1978)

[25] N Hosseini M H Abbasi F Karimzadeh M H Enayati Materials Science and

Engineering A 525 (2009) 107-111

[26] S Yamazaki J Nakamura K Sakaki Y Nakamura and E Akiba Materials

Transactions 52 No 4 (2011) 586-590

[27] B L Chen G Y Li Thin Solid Films 462-463 (2004) 395-401

[28] W Juumlrn P Schmelzer Nucleation Theory and Applications WILEY-VCH Verlag

GmbH amp Co (2005) ISBN-13 978-3-527-40469-8 ISBN-10 3-527-40469-4

[29] K S Tun M Gupta Composite Science Technology 67 (2007) 2657

[30] S M L Nai J Wei M Gupta Thin Solid Films 504 (2006) 401-404

[31] S M L Nai J Wei M Gupta Journal Electronic Material 35 No 7 (2006) 1518-

1522

[32] S Ugandhar N Srikanth M Gupta S K Sinha Advanced Engineering Material 6

No 12 (2004) 957-964

13

Figure caption

Fig 1 DSC curves of (a) SSC505 and (b) SSC-ZnO composite solder alloys

Fig 2 XRD profiles of (a) SSC505 solder and (b) SSC-ZnO composite solder alloys

Fig 3 Comparison between diffraction peaks of (200) and (101) of -Sn for plain and

composite solders

Fig4 Optical images showing the grains of (a) SSC505 solder and (b) SSC-ZnO

composite solder alloys

Fig 5 FE-SEM micrographs showing the grains of (a) SSC505 solder and (b) SSC-ZnO


Fig 6 High-magnification FE-SEM micrographs with corresponding EDX of

intermetallic compound of (a) SbSn (b) Cu6Sn5 (c) eutectic region in SSC-ZnO

composite solder

Fig 7 StressndashStrain curves showing the effect of adding 05 wt ZnO nanoparticles to

SSC505 plain solder alloy

14

Highlights








Table1 Comparison of melting temperatures(Tm) solidus temperature (Ts)

liquidus temperature (TL) pasty range T) and heat of fusion ( H) for various

solder alloys

Material Tm oC Ts

oC TL

oC T= TL-TS

oC

H

(kJkg)

Reference

Sn-5Sb

SSC505

SSC-ZnO

246

23738

23827

240

22345

22556

249

24733

24746

90

2388

2190

141

12552

8896

El-Dally[9]

This study

This study

Table 2 The average crystallite size (d) and lattice strain () for plain SSC505 solder

SSC-ZnO composite solder and SbSn Cu6Sn5 IMCs

-Sn (Matrix) SbSn (IMC)

Cu6Sn5 (IMC)

SSC505

(R2 = 0042)

R2

R

R

SSC-ZnO

(R2 = 0061)

SSC505

(R2 = 03337)

SSC-ZnO

(R2 = 06108)

SSC505

(R2= 04255)

SSC-ZnO

(R2= 07218)

d(nm) times d(nm)

(nm)

times d (nm) times

d(nm) times

d(nm) times

d (nm) times

116 10 99 55 693 300 116 565 754 346 205 588

Table

Table 3 Energy dispersive R-Ray (EDX) analysis

Zone

Composition Phase

identification Sn Sb Cu Zn O2

Wt At Wt At Wt At Wt At At Wt

+ (See fig 6a)

+ (See fig 6b)

+ (See fig 6c)

6543

7276

8359

6601

6161

4053

3457

368

875

3399

701

661

-------

2356

206

-------

2737

298

------

-------

351

-------

-------

494

-------

-------

360

-------

-------

1308

SnSb

Cu6Sn5

Eutectic

Table 4 Results of density and porosity

Material Density (gcm3)a Porosity (gcm

3) Reference

Sn-5wt Sb

SSC505

SSC-ZnO

7526plusmn0005

7553plusmn0006

7533plusmn0006

050

075plusmn017

087plusmn020

M El-Bahay [23]

This study

This study

Table 5 Tensile Results at room temperature and strain rate of 47 x 10-3

s-1

Material E (GPa) UTS (MPa) YS (MPa) f (MPa) f Reference

Sn-5wt Sb

SSC505

SSC-ZnO

445

434

603

3550

7748

8635

2570

6468

7310

---

4259

7280

22

170

97

El-daly [9]

This study

This study

1

0 100 200 300 400 500

23738 0C

23827 oC

TEMPERATURE (C)

SSC505

SSC-ZnOH

EA

T F

LO

W (

mW

)

Fig1 Eid etal

Figure

2

30 40 50 60 70 80

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Zn

O(0

02

)Z

nO

(10

1)

Sn

(31

2)

Sn

Sb

(10

4)

Sn

(41

1)

Sn

(42

0)

Sb

Sn

(11

3)

Sn

(32

1)

Sn

(40

0)

Sn

(11

2)

Sb

Sn

(20

2)

Sn

(30

1)

Sb

Sn

(00

3)

Cu

6S

n5

Sn

(21

1)

Sb

Sn

(11

0)

Sn

(10

1) a)SSC505

INT

EN

SIT

Y (

arb

un

its

)

2 (degree)

Sn

(20

0)

Sn

(22

0)

Sb

Sn

(01

0)

IN

TE

NS

ITY

(a

rbu

nit

s)

b) SSC-ZnO

Fig2 Eid et al

3

302 304 306 308 31 312 314 316 318 32 322 324 326

2 (degree)

Inte

ns

ity

(a

rbu

nt)

SSC505 SSC-ZnO

Fig3 Eid et al

4

Fig4 Eid et al

-Sn

-Sn

5

Fig5 Eid et al

Cu6Sn5

SbSn

Cu6Sn5

SbSn

6

0 1 2 3 4 5 6 7 8 9 10

Energy (keV)

Sn

Sn

SnSn

Sn

Sb

Sb

Sb

SbSn

+

+

(a)

0 1 2 3 4 5 6 7 8 9 10Energy (keV)

Sn

Sb

Sn

SnCuCu

Cu

Cu6Sn5

BA

+

Sn

(b)

0 1 2 3 4 5 6 7 8 9 10Energy (keV)

Sn

Sb

Sn

Sn

CuZn

Sn

(C)

CuO2

+

Fig6a-c Eid et al

7

000 005 010 015 0200

20

40

60

80

100

SSC505

ST

RE

SS

(M

Pa

)

STRAIN

SSC-ZnO

Room temperature

=4710

-4 s

-1

Fig7 Eid et al

Dear Editor

Irsquom pleased to present our work titled

Influence of ZnO nano-particles addition on thermal analysis

microstructure evolution and tensile behavior of Sn-50 wt Sb-05 wt

Cu Lead-free solder alloy

The effect of adding ZnO nano-particles to Sn-5wtSb-05wtCu

(plain SSC505) were studied The variation in thermal behavior

microstructure and tensile characteristics associated with mixing of

05wt ZnO nano-metric particles to plain SSC505 solder were

investigated X-ray diffraction analysis of SSC-ZnO confirms the

existence of SbSn Cu6Sn5 IMCs and ZnO The microstructure

observations revealed finer IMCs due to active surface area of ZnO

nanoparticles that supports the strong adsorption effect Improvement in

the tensile parameters was achieved because of presence of ZnO

nanopowders as reinforcement agent The nano-sized particles are

dispersed uniformly and homogeneously distributed in Sn matrix which

provide high barrier by impeding grain boundary sliding and dislocation

movement

The work is valuable to be published in Materials and Design

We here confirm that

1 The article is original

2 The article has been written by the stated authors who are ALL aware

of its content and approve its submission

3 The article has not been published previously

4 The article is not under consideration for publication elsewhere

5 No conflict of interest exists or if such conflict exists the exact nature

Cover Letter





Dr E A Eid

Dr Aly Nabeih Fouda

1

Highlights









1





E A Eid a A N Fouda

b



Abstract

















2

1 Introduction

























[11]





3



















2 Experimental












4
















a few seconds












s-1


5


31 Thermal analysis





























6


by 37 [9]


321 XRD analysis





(202) at angles of (2 293o 419

o 423

o and 605




angles 327 o

and 343 o















sin2cos d

K (1)




7















defect formation
















8
































9












s-1




















10









[20 24 31]





4 Conclusion











11

5 Reference





[5] H Mavoori JOM 52 No 6 (2000) 29



No 33A (2002) 1531-1593




(2009) 98-104



(2006) 166-169


Electron 20 (2009) 571-576



material 35 No 8 (2006) 1672-1679


(2009) 458-461


(2014) 837-845


(2009) 199-206



ISBN978-3-527-40813-9

12




31 (2010) 990-993




(a) 198 No 1 (2003) 76-90




Engineering A 525 (2009) 107-111









1522


No 12 (2004) 957-964

13

Figure caption




composite solders







composite solder



14

Highlights










solder alloys

Material Tm oC Ts

oC TL

oC T= TL-TS

oC

H

(kJkg)

Reference

Sn-5Sb

SSC505

SSC-ZnO

246

23738

23827

240

22345

22556

249

24733

24746

90

2388

2190

141

12552

8896

El-Dally[9]

This study

This study




Cu6Sn5 (IMC)

SSC505

(R2 = 0042)

R2

R

R

SSC-ZnO

(R2 = 0061)

SSC505

(R2 = 03337)

SSC-ZnO

(R2 = 06108)

SSC505

(R2= 04255)

SSC-ZnO

(R2= 07218)

d(nm) times d(nm)

(nm)

times d (nm) times

d(nm) times

d(nm) times

d (nm) times

116 10 99 55 693 300 116 565 754 346 205 588

Table


Zone

Composition Phase



+ (See fig 6a)

+ (See fig 6b)

+ (See fig 6c)

6543

7276

8359

6601

6161

4053

3457

368

875

3399

701

661

-------

2356

206

-------

2737

298

------

-------

351

-------

-------

494

-------

-------

360

-------

-------

1308

SnSb

Cu6Sn5

Eutectic



3) Reference

Sn-5wt Sb

SSC505

SSC-ZnO

7526plusmn0005

7553plusmn0006

7533plusmn0006

050

075plusmn017

087plusmn020

M El-Bahay [23]

This study

This study


s-1


Sn-5wt Sb

SSC505

SSC-ZnO

445

434

603

3550

7748

8635

2570

6468

7310

---

4259

7280

22

170

97

El-daly [9]

This study

This study

1

0 100 200 300 400 500

23738 0C

23827 oC

TEMPERATURE (C)

SSC505

SSC-ZnOH

EA

T F

LO

W (

mW

)

Fig1 Eid etal

Figure

2

30 40 50 60 70 80

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Zn

O(0

02

)Z

nO

(10

1)

Sn

(31

2)

Sn

Sb

(10

4)

Sn

(41

1)

Sn

(42

0)

Sb

Sn

(11

3)

Sn

(32

1)

Sn

(40

0)

Sn

(11

2)

Sb

Sn

(20

2)

Sn

(30

1)

Sb

Sn

(00

3)

Cu

6S

n5

Sn

(21

1)

Sb

Sn

(11

0)

Sn

(10

1) a)SSC505

INT

EN

SIT

Y (

arb

un

its

)

2 (degree)

Sn

(20

0)

Sn

(22

0)

Sb

Sn

(01

0)

IN

TE

NS

ITY

(a

rbu

nit

s)

b) SSC-ZnO

Fig2 Eid et al

3

302 304 306 308 31 312 314 316 318 32 322 324 326

2 (degree)

Inte

ns

ity

(a

rbu

nt)

SSC505 SSC-ZnO

Fig3 Eid et al

4

Fig4 Eid et al

-Sn

-Sn

5

Fig5 Eid et al

Cu6Sn5

SbSn

Cu6Sn5

SbSn

6

0 1 2 3 4 5 6 7 8 9 10

Energy (keV)

Sn

Sn

SnSn

Sn

Sb

Sb

Sb

SbSn

+

+

(a)

0 1 2 3 4 5 6 7 8 9 10Energy (keV)

Sn

Sb

Sn

SnCuCu

Cu

Cu6Sn5

BA

+

Sn

(b)

0 1 2 3 4 5 6 7 8 9 10Energy (keV)

Sn

Sb

Sn

Sn

CuZn

Sn

(C)

CuO2

+

Fig6a-c Eid et al

7

000 005 010 015 0200

20

40

60

80

100

SSC505

ST

RE

SS

(M

Pa

)

STRAIN

SSC-ZnO

Room temperature

=4710

-4 s

-1

Fig7 Eid et al





Dr E A Eid

Dr Aly Nabeih Fouda

1

Highlights









1





E A Eid a A N Fouda

b



Abstract

















2

1 Introduction

























[11]





3



















2 Experimental












4
















a few seconds












s-1


5


31 Thermal analysis





























6


by 37 [9]


321 XRD analysis





(202) at angles of (2 293o 419

o 423

o and 605




angles 327 o

and 343 o















sin2cos d

K (1)




7















defect formation
















8
































9












s-1




















10









[20 24 31]





4 Conclusion











11

5 Reference





[5] H Mavoori JOM 52 No 6 (2000) 29



No 33A (2002) 1531-1593




(2009) 98-104



(2006) 166-169


Electron 20 (2009) 571-576



material 35 No 8 (2006) 1672-1679


(2009) 458-461


(2014) 837-845


(2009) 199-206



ISBN978-3-527-40813-9

12




31 (2010) 990-993




(a) 198 No 1 (2003) 76-90




Engineering A 525 (2009) 107-111









1522


No 12 (2004) 957-964

13

Figure caption




composite solders







composite solder



14

Highlights










solder alloys

Material Tm oC Ts

oC TL

oC T= TL-TS

oC

H

(kJkg)

Reference

Sn-5Sb

SSC505

SSC-ZnO

246

23738

23827

240

22345

22556

249

24733

24746

90

2388

2190

141

12552

8896

El-Dally[9]

This study

This study




Cu6Sn5 (IMC)

SSC505

(R2 = 0042)

R2

R

R

SSC-ZnO

(R2 = 0061)

SSC505

(R2 = 03337)

SSC-ZnO

(R2 = 06108)

SSC505

(R2= 04255)

SSC-ZnO

(R2= 07218)

d(nm) times d(nm)

(nm)

times d (nm) times

d(nm) times

d(nm) times

d (nm) times

116 10 99 55 693 300 116 565 754 346 205 588

Table


Zone

Composition Phase



+ (See fig 6a)

+ (See fig 6b)

+ (See fig 6c)

6543

7276

8359

6601

6161

4053

3457

368

875

3399

701

661

-------

2356

206

-------

2737

298

------

-------

351

-------

-------

494

-------

-------

360

-------

-------

1308

SnSb

Cu6Sn5

Eutectic



3) Reference

Sn-5wt Sb

SSC505

SSC-ZnO

7526plusmn0005

7553plusmn0006

7533plusmn0006

050

075plusmn017

087plusmn020

M El-Bahay [23]

This study

This study


s-1


Sn-5wt Sb

SSC505

SSC-ZnO

445

434

603

3550

7748

8635

2570

6468

7310

---

4259

7280

22

170

97

El-daly [9]

This study

This study

1

0 100 200 300 400 500

23738 0C

23827 oC

TEMPERATURE (C)

SSC505

SSC-ZnOH

EA

T F

LO

W (

mW

)

Fig1 Eid etal

Figure

2

30 40 50 60 70 80

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Zn

O(0

02

)Z

nO

(10

1)

Sn

(31

2)

Sn

Sb

(10

4)

Sn

(41

1)

Sn

(42

0)

Sb

Sn

(11

3)

Sn

(32

1)

Sn

(40

0)

Sn

(11

2)

Sb

Sn

(20

2)

Sn

(30

1)

Sb

Sn

(00

3)

Cu

6S

n5

Sn

(21

1)

Sb

Sn

(11

0)

Sn

(10

1) a)SSC505

INT

EN

SIT

Y (

arb

un

its

)

2 (degree)

Sn

(20

0)

Sn

(22

0)

Sb

Sn

(01

0)

IN

TE

NS

ITY

(a

rbu

nit

s)

b) SSC-ZnO

Fig2 Eid et al

3

302 304 306 308 31 312 314 316 318 32 322 324 326

2 (degree)

Inte

ns

ity

(a

rbu

nt)

SSC505 SSC-ZnO

Fig3 Eid et al

4

Fig4 Eid et al

-Sn

-Sn

5

Fig5 Eid et al

Cu6Sn5

SbSn

Cu6Sn5

SbSn

6

0 1 2 3 4 5 6 7 8 9 10

Energy (keV)

Sn

Sn

SnSn

Sn

Sb

Sb

Sb

SbSn

+

+

(a)

0 1 2 3 4 5 6 7 8 9 10Energy (keV)

Sn

Sb

Sn

SnCuCu

Cu

Cu6Sn5

BA

+

Sn

(b)

0 1 2 3 4 5 6 7 8 9 10Energy (keV)

Sn

Sb

Sn

Sn

CuZn

Sn

(C)

CuO2

+

Fig6a-c Eid et al

7

000 005 010 015 0200

20

40

60

80

100

SSC505

ST

RE

SS

(M

Pa

)

STRAIN

SSC-ZnO

Room temperature

=4710

-4 s

-1

Fig7 Eid et al

1

Highlights









1





E A Eid a A N Fouda

b



Abstract

















2

1 Introduction

























[11]





3



















2 Experimental












4
















a few seconds












s-1


5


31 Thermal analysis





























6


by 37 [9]


321 XRD analysis





(202) at angles of (2 293o 419

o 423

o and 605




angles 327 o

and 343 o















sin2cos d

K (1)




7















defect formation
















8
































9












s-1




















10









[20 24 31]





4 Conclusion











11

5 Reference





[5] H Mavoori JOM 52 No 6 (2000) 29



No 33A (2002) 1531-1593




(2009) 98-104



(2006) 166-169


Electron 20 (2009) 571-576



material 35 No 8 (2006) 1672-1679


(2009) 458-461


(2014) 837-845


(2009) 199-206



ISBN978-3-527-40813-9

12




31 (2010) 990-993




(a) 198 No 1 (2003) 76-90




Engineering A 525 (2009) 107-111









1522


No 12 (2004) 957-964

13

Figure caption




composite solders







composite solder



14

Highlights










solder alloys

Material Tm oC Ts

oC TL

oC T= TL-TS

oC

H

(kJkg)

Reference

Sn-5Sb

SSC505

SSC-ZnO

246

23738

23827

240

22345

22556

249

24733

24746

90

2388

2190

141

12552

8896

El-Dally[9]

This study

This study




Cu6Sn5 (IMC)

SSC505

(R2 = 0042)

R2

R

R

SSC-ZnO

(R2 = 0061)

SSC505

(R2 = 03337)

SSC-ZnO

(R2 = 06108)

SSC505

(R2= 04255)

SSC-ZnO

(R2= 07218)

d(nm) times d(nm)

(nm)

times d (nm) times

d(nm) times

d(nm) times

d (nm) times

116 10 99 55 693 300 116 565 754 346 205 588

Table


Zone

Composition Phase



+ (See fig 6a)

+ (See fig 6b)

+ (See fig 6c)

6543

7276

8359

6601

6161

4053

3457

368

875

3399

701

661

-------

2356

206

-------

2737

298

------

-------

351

-------

-------

494

-------

-------

360

-------

-------

1308

SnSb

Cu6Sn5

Eutectic



3) Reference

Sn-5wt Sb

SSC505

SSC-ZnO

7526plusmn0005

7553plusmn0006

7533plusmn0006

050

075plusmn017

087plusmn020

M El-Bahay [23]

This study

This study


s-1


Sn-5wt Sb

SSC505

SSC-ZnO

445

434

603

3550

7748

8635

2570

6468

7310

---

4259

7280

22

170

97

El-daly [9]

This study

This study

1

0 100 200 300 400 500

23738 0C

23827 oC

TEMPERATURE (C)

SSC505

SSC-ZnOH

EA

T F

LO

W (

mW

)

Fig1 Eid etal

Figure

2

30 40 50 60 70 80

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Zn

O(0

02

)Z

nO

(10

1)

Sn

(31

2)

Sn

Sb

(10

4)

Sn

(41

1)

Sn

(42

0)

Sb

Sn

(11

3)

Sn

(32

1)

Sn

(40

0)

Sn

(11

2)

Sb

Sn

(20

2)

Sn

(30

1)

Sb

Sn

(00

3)

Cu

6S

n5

Sn

(21

1)

Sb

Sn

(11

0)

Sn

(10

1) a)SSC505

INT

EN

SIT

Y (

arb

un

its

)

2 (degree)

Sn

(20

0)

Sn

(22

0)

Sb

Sn

(01

0)

IN

TE

NS

ITY

(a

rbu

nit

s)

b) SSC-ZnO

Fig2 Eid et al

3

302 304 306 308 31 312 314 316 318 32 322 324 326

2 (degree)

Inte

ns

ity

(a

rbu

nt)

SSC505 SSC-ZnO

Fig3 Eid et al

4

Fig4 Eid et al

-Sn

-Sn

5

Fig5 Eid et al

Cu6Sn5

SbSn

Cu6Sn5

SbSn

6

0 1 2 3 4 5 6 7 8 9 10

Energy (keV)

Sn

Sn

SnSn

Sn

Sb

Sb

Sb

SbSn

+

+

(a)

0 1 2 3 4 5 6 7 8 9 10Energy (keV)

Sn

Sb

Sn

SnCuCu

Cu

Cu6Sn5

BA

+

Sn

(b)

0 1 2 3 4 5 6 7 8 9 10Energy (keV)

Sn

Sb

Sn

Sn

CuZn

Sn

(C)

CuO2

+

Fig6a-c Eid et al

7

000 005 010 015 0200

20

40

60

80

100

SSC505

ST

RE

SS

(M

Pa

)

STRAIN

SSC-ZnO

Room temperature

=4710

-4 s

-1

Fig7 Eid et al

1





E A Eid a A N Fouda

b



Abstract

















2

1 Introduction

























[11]





3



















2 Experimental












4
















a few seconds












s-1


5


31 Thermal analysis





























6


by 37 [9]


321 XRD analysis





(202) at angles of (2 293o 419

o 423

o and 605




angles 327 o

and 343 o















sin2cos d

K (1)




7















defect formation
















8
































9












s-1




















10









[20 24 31]





4 Conclusion











11

5 Reference





[5] H Mavoori JOM 52 No 6 (2000) 29



No 33A (2002) 1531-1593




(2009) 98-104



(2006) 166-169


Electron 20 (2009) 571-576



material 35 No 8 (2006) 1672-1679


(2009) 458-461


(2014) 837-845


(2009) 199-206



ISBN978-3-527-40813-9

12




31 (2010) 990-993




(a) 198 No 1 (2003) 76-90




Engineering A 525 (2009) 107-111









1522


No 12 (2004) 957-964

13

Figure caption




composite solders







composite solder



14

Highlights










solder alloys

Material Tm oC Ts

oC TL

oC T= TL-TS

oC

H

(kJkg)

Reference

Sn-5Sb

SSC505

SSC-ZnO

246

23738

23827

240

22345

22556

249

24733

24746

90

2388

2190

141

12552

8896

El-Dally[9]

This study

This study




Cu6Sn5 (IMC)

SSC505

(R2 = 0042)

R2

R

R

SSC-ZnO

(R2 = 0061)

SSC505

(R2 = 03337)

SSC-ZnO

(R2 = 06108)

SSC505

(R2= 04255)

SSC-ZnO

(R2= 07218)

d(nm) times d(nm)

(nm)

times d (nm) times

d(nm) times

d(nm) times

d (nm) times

116 10 99 55 693 300 116 565 754 346 205 588

Table


Zone

Composition Phase



+ (See fig 6a)

+ (See fig 6b)

+ (See fig 6c)

6543

7276

8359

6601

6161

4053

3457

368

875

3399

701

661

-------

2356

206

-------

2737

298

------

-------

351

-------

-------

494

-------

-------

360

-------

-------

1308

SnSb

Cu6Sn5

Eutectic



3) Reference

Sn-5wt Sb

SSC505

SSC-ZnO

7526plusmn0005

7553plusmn0006

7533plusmn0006

050

075plusmn017

087plusmn020

M El-Bahay [23]

This study

This study


s-1


Sn-5wt Sb

SSC505

SSC-ZnO

445

434

603

3550

7748

8635

2570

6468

7310

---

4259

7280

22

170

97

El-daly [9]

This study

This study

1

0 100 200 300 400 500

23738 0C

23827 oC

TEMPERATURE (C)

SSC505

SSC-ZnOH

EA

T F

LO

W (

mW

)

Fig1 Eid etal

Figure

2

30 40 50 60 70 80

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Zn

O(0

02

)Z

nO

(10

1)

Sn

(31

2)

Sn

Sb

(10

4)

Sn

(41

1)

Sn

(42

0)

Sb

Sn

(11

3)

Sn

(32

1)

Sn

(40

0)

Sn

(11

2)

Sb

Sn

(20

2)

Sn

(30

1)

Sb

Sn

(00

3)

Cu

6S

n5

Sn

(21

1)

Sb

Sn

(11

0)

Sn

(10

1) a)SSC505

INT

EN

SIT

Y (

arb

un

its

)

2 (degree)

Sn

(20

0)

Sn

(22

0)

Sb

Sn

(01

0)

IN

TE

NS

ITY

(a

rbu

nit

s)

b) SSC-ZnO

Fig2 Eid et al

3

302 304 306 308 31 312 314 316 318 32 322 324 326

2 (degree)

Inte

ns

ity

(a

rbu

nt)

SSC505 SSC-ZnO

Fig3 Eid et al

4

Fig4 Eid et al

-Sn

-Sn

5

Fig5 Eid et al

Cu6Sn5

SbSn

Cu6Sn5

SbSn

6

0 1 2 3 4 5 6 7 8 9 10

Energy (keV)

Sn

Sn

SnSn

Sn

Sb

Sb

Sb

SbSn

+

+

(a)

0 1 2 3 4 5 6 7 8 9 10Energy (keV)

Sn

Sb

Sn

SnCuCu

Cu

Cu6Sn5

BA

+

Sn

(b)

0 1 2 3 4 5 6 7 8 9 10Energy (keV)

Sn

Sb

Sn

Sn

CuZn

Sn

(C)

CuO2

+

Fig6a-c Eid et al

7

000 005 010 015 0200

20

40

60

80

100

SSC505

ST

RE

SS

(M

Pa

)

STRAIN

SSC-ZnO

Room temperature

=4710

-4 s

-1

Fig7 Eid et al

2

1 Introduction

























[11]





3



















2 Experimental












4
















a few seconds












s-1


5


31 Thermal analysis





























6


by 37 [9]


321 XRD analysis





(202) at angles of (2 293o 419

o 423

o and 605




angles 327 o

and 343 o















sin2cos d

K (1)




7















defect formation
















8
































9












s-1




















10









[20 24 31]





4 Conclusion











11

5 Reference





[5] H Mavoori JOM 52 No 6 (2000) 29



No 33A (2002) 1531-1593




(2009) 98-104



(2006) 166-169


Electron 20 (2009) 571-576



material 35 No 8 (2006) 1672-1679


(2009) 458-461


(2014) 837-845


(2009) 199-206



ISBN978-3-527-40813-9

12




31 (2010) 990-993




(a) 198 No 1 (2003) 76-90




Engineering A 525 (2009) 107-111









1522


No 12 (2004) 957-964

13

Figure caption




composite solders







composite solder



14

Highlights










solder alloys

Material Tm oC Ts

oC TL

oC T= TL-TS

oC

H

(kJkg)

Reference

Sn-5Sb

SSC505

SSC-ZnO

246

23738

23827

240

22345

22556

249

24733

24746

90

2388

2190

141

12552

8896

El-Dally[9]

This study

This study




Cu6Sn5 (IMC)

SSC505

(R2 = 0042)

R2

R

R

SSC-ZnO

(R2 = 0061)

SSC505

(R2 = 03337)

SSC-ZnO

(R2 = 06108)

SSC505

(R2= 04255)

SSC-ZnO

(R2= 07218)

d(nm) times d(nm)

(nm)

times d (nm) times

d(nm) times

d(nm) times

d (nm) times

116 10 99 55 693 300 116 565 754 346 205 588

Table


Zone

Composition Phase



+ (See fig 6a)

+ (See fig 6b)

+ (See fig 6c)

6543

7276

8359

6601

6161

4053

3457

368

875

3399

701

661

-------

2356

206

-------

2737

298

------

-------

351

-------

-------

494

-------

-------

360

-------

-------

1308

SnSb

Cu6Sn5

Eutectic



3) Reference

Sn-5wt Sb

SSC505

SSC-ZnO

7526plusmn0005

7553plusmn0006

7533plusmn0006

050

075plusmn017

087plusmn020

M El-Bahay [23]

This study

This study


s-1


Sn-5wt Sb

SSC505

SSC-ZnO

445

434

603

3550

7748

8635

2570

6468

7310

---

4259

7280

22

170

97

El-daly [9]

This study

This study

1

0 100 200 300 400 500

23738 0C

23827 oC

TEMPERATURE (C)

SSC505

SSC-ZnOH

EA

T F

LO

W (

mW

)

Fig1 Eid etal

Figure

2

30 40 50 60 70 80

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Zn

O(0

02

)Z

nO

(10

1)

Sn

(31

2)

Sn

Sb

(10

4)

Sn

(41

1)

Sn

(42

0)

Sb

Sn

(11

3)

Sn

(32

1)

Sn

(40

0)

Sn

(11

2)

Sb

Sn

(20

2)

Sn

(30

1)

Sb

Sn

(00

3)

Cu

6S

n5

Sn

(21

1)

Sb

Sn

(11

0)

Sn

(10

1) a)SSC505

INT

EN

SIT

Y (

arb

un

its

)

2 (degree)

Sn

(20

0)

Sn

(22

0)

Sb

Sn

(01

0)

IN

TE

NS

ITY

(a

rbu

nit

s)

b) SSC-ZnO

Fig2 Eid et al

3

302 304 306 308 31 312 314 316 318 32 322 324 326

2 (degree)

Inte

ns

ity

(a

rbu

nt)

SSC505 SSC-ZnO

Fig3 Eid et al

4

Fig4 Eid et al

-Sn

-Sn

5

Fig5 Eid et al

Cu6Sn5

SbSn

Cu6Sn5

SbSn

6

0 1 2 3 4 5 6 7 8 9 10

Energy (keV)

Sn

Sn

SnSn

Sn

Sb

Sb

Sb

SbSn

+

+

(a)

0 1 2 3 4 5 6 7 8 9 10Energy (keV)

Sn

Sb

Sn

SnCuCu

Cu

Cu6Sn5

BA

+

Sn

(b)

0 1 2 3 4 5 6 7 8 9 10Energy (keV)

Sn

Sb

Sn

Sn

CuZn

Sn

(C)

CuO2

+

Fig6a-c Eid et al

7

000 005 010 015 0200

20

40

60

80

100

SSC505

ST

RE

SS

(M

Pa

)

STRAIN

SSC-ZnO

Room temperature

=4710

-4 s

-1

Fig7 Eid et al

3



















2 Experimental












4
















a few seconds












s-1


5


31 Thermal analysis





























6


by 37 [9]


321 XRD analysis





(202) at angles of (2 293o 419

o 423

o and 605




angles 327 o

and 343 o















sin2cos d

K (1)




7















defect formation
















8
































9












s-1




















10









[20 24 31]





4 Conclusion











11

5 Reference





[5] H Mavoori JOM 52 No 6 (2000) 29



No 33A (2002) 1531-1593




(2009) 98-104



(2006) 166-169


Electron 20 (2009) 571-576



material 35 No 8 (2006) 1672-1679


(2009) 458-461


(2014) 837-845


(2009) 199-206



ISBN978-3-527-40813-9

12




31 (2010) 990-993




(a) 198 No 1 (2003) 76-90




Engineering A 525 (2009) 107-111









1522


No 12 (2004) 957-964

13

Figure caption




composite solders







composite solder



14

Highlights










solder alloys

Material Tm oC Ts

oC TL

oC T= TL-TS

oC

H

(kJkg)

Reference

Sn-5Sb

SSC505

SSC-ZnO

246

23738

23827

240

22345

22556

249

24733

24746

90

2388

2190

141

12552

8896

El-Dally[9]

This study

This study




Cu6Sn5 (IMC)

SSC505

(R2 = 0042)

R2

R

R

SSC-ZnO

(R2 = 0061)

SSC505

(R2 = 03337)

SSC-ZnO

(R2 = 06108)

SSC505

(R2= 04255)

SSC-ZnO

(R2= 07218)

d(nm) times d(nm)

(nm)

times d (nm) times

d(nm) times

d(nm) times

d (nm) times

116 10 99 55 693 300 116 565 754 346 205 588

Table


Zone

Composition Phase



+ (See fig 6a)

+ (See fig 6b)

+ (See fig 6c)

6543

7276

8359

6601

6161

4053

3457

368

875

3399

701

661

-------

2356

206

-------

2737

298

------

-------

351

-------

-------

494

-------

-------

360

-------

-------

1308

SnSb

Cu6Sn5

Eutectic



3) Reference

Sn-5wt Sb

SSC505

SSC-ZnO

7526plusmn0005

7553plusmn0006

7533plusmn0006

050

075plusmn017

087plusmn020

M El-Bahay [23]

This study

This study


s-1


Sn-5wt Sb

SSC505

SSC-ZnO

445

434

603

3550

7748

8635

2570

6468

7310

---

4259

7280

22

170

97

El-daly [9]

This study

This study

1

0 100 200 300 400 500

23738 0C

23827 oC

TEMPERATURE (C)

SSC505

SSC-ZnOH

EA

T F

LO

W (

mW

)

Fig1 Eid etal

Figure

2

30 40 50 60 70 80

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Zn

O(0

02

)Z

nO

(10

1)

Sn

(31

2)

Sn

Sb

(10

4)

Sn

(41

1)

Sn

(42

0)

Sb

Sn

(11

3)

Sn

(32

1)

Sn

(40

0)

Sn

(11

2)

Sb

Sn

(20

2)

Sn

(30

1)

Sb

Sn

(00

3)

Cu

6S

n5

Sn

(21

1)

Sb

Sn

(11

0)

Sn

(10

1) a)SSC505

INT

EN

SIT

Y (

arb

un

its

)

2 (degree)

Sn

(20

0)

Sn

(22

0)

Sb

Sn

(01

0)

IN

TE

NS

ITY

(a

rbu

nit

s)

b) SSC-ZnO

Fig2 Eid et al

3

302 304 306 308 31 312 314 316 318 32 322 324 326

2 (degree)

Inte

ns

ity

(a

rbu

nt)

SSC505 SSC-ZnO

Fig3 Eid et al

4

Fig4 Eid et al

-Sn

-Sn

5

Fig5 Eid et al

Cu6Sn5

SbSn

Cu6Sn5

SbSn

6

0 1 2 3 4 5 6 7 8 9 10

Energy (keV)

Sn

Sn

SnSn

Sn

Sb

Sb

Sb

SbSn

+

+

(a)

0 1 2 3 4 5 6 7 8 9 10Energy (keV)

Sn

Sb

Sn

SnCuCu

Cu

Cu6Sn5

BA

+

Sn

(b)

0 1 2 3 4 5 6 7 8 9 10Energy (keV)

Sn

Sb

Sn

Sn

CuZn

Sn

(C)

CuO2

+

Fig6a-c Eid et al

7

000 005 010 015 0200

20

40

60

80

100

SSC505

ST

RE

SS

(M

Pa

)

STRAIN

SSC-ZnO

Room temperature

=4710

-4 s

-1

Fig7 Eid et al

4
















a few seconds












s-1


5


31 Thermal analysis





























6


by 37 [9]


321 XRD analysis





(202) at angles of (2 293o 419

o 423

o and 605




angles 327 o

and 343 o















sin2cos d

K (1)




7















defect formation
















8
































9












s-1




















10









[20 24 31]





4 Conclusion











11

5 Reference





[5] H Mavoori JOM 52 No 6 (2000) 29



No 33A (2002) 1531-1593




(2009) 98-104



(2006) 166-169


Electron 20 (2009) 571-576



material 35 No 8 (2006) 1672-1679


(2009) 458-461


(2014) 837-845


(2009) 199-206



ISBN978-3-527-40813-9

12




31 (2010) 990-993




(a) 198 No 1 (2003) 76-90




Engineering A 525 (2009) 107-111









1522


No 12 (2004) 957-964

13

Figure caption




composite solders







composite solder



14

Highlights










solder alloys

Material Tm oC Ts

oC TL

oC T= TL-TS

oC

H

(kJkg)

Reference

Sn-5Sb

SSC505

SSC-ZnO

246

23738

23827

240

22345

22556

249

24733

24746

90

2388

2190

141

12552

8896

El-Dally[9]

This study

This study




Cu6Sn5 (IMC)

SSC505

(R2 = 0042)

R2

R

R

SSC-ZnO

(R2 = 0061)

SSC505

(R2 = 03337)

SSC-ZnO

(R2 = 06108)

SSC505

(R2= 04255)

SSC-ZnO

(R2= 07218)

d(nm) times d(nm)

(nm)

times d (nm) times

d(nm) times

d(nm) times

d (nm) times

116 10 99 55 693 300 116 565 754 346 205 588

Table


Zone

Composition Phase



+ (See fig 6a)

+ (See fig 6b)

+ (See fig 6c)

6543

7276

8359

6601

6161

4053

3457

368

875

3399

701

661

-------

2356

206

-------

2737

298

------

-------

351

-------

-------

494

-------

-------

360

-------

-------

1308

SnSb

Cu6Sn5

Eutectic



3) Reference

Sn-5wt Sb

SSC505

SSC-ZnO

7526plusmn0005

7553plusmn0006

7533plusmn0006

050

075plusmn017

087plusmn020

M El-Bahay [23]

This study

This study


s-1


Sn-5wt Sb

SSC505

SSC-ZnO

445

434

603

3550

7748

8635

2570

6468

7310

---

4259

7280

22

170

97

El-daly [9]

This study

This study

1

0 100 200 300 400 500

23738 0C

23827 oC

TEMPERATURE (C)

SSC505

SSC-ZnOH

EA

T F

LO

W (

mW

)

Fig1 Eid etal

Figure

2

30 40 50 60 70 80

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Zn

O(0

02

)Z

nO

(10

1)

Sn

(31

2)

Sn

Sb

(10

4)

Sn

(41

1)

Sn

(42

0)

Sb

Sn

(11

3)

Sn

(32

1)

Sn

(40

0)

Sn

(11

2)

Sb

Sn

(20

2)

Sn

(30

1)

Sb

Sn

(00

3)

Cu

6S

n5

Sn

(21

1)

Sb

Sn

(11

0)

Sn

(10

1) a)SSC505

INT

EN

SIT

Y (

arb

un

its

)

2 (degree)

Sn

(20

0)

Sn

(22

0)

Sb

Sn

(01

0)

IN

TE

NS

ITY

(a

rbu

nit

s)

b) SSC-ZnO

Fig2 Eid et al

3

302 304 306 308 31 312 314 316 318 32 322 324 326

2 (degree)

Inte

ns

ity

(a

rbu

nt)

SSC505 SSC-ZnO

Fig3 Eid et al

4

Fig4 Eid et al

-Sn

-Sn

5

Fig5 Eid et al

Cu6Sn5

SbSn

Cu6Sn5

SbSn

6

0 1 2 3 4 5 6 7 8 9 10

Energy (keV)

Sn

Sn

SnSn

Sn

Sb

Sb

Sb

SbSn

+

+

(a)

0 1 2 3 4 5 6 7 8 9 10Energy (keV)

Sn

Sb

Sn

SnCuCu

Cu

Cu6Sn5

BA

+

Sn

(b)

0 1 2 3 4 5 6 7 8 9 10Energy (keV)

Sn

Sb

Sn

Sn

CuZn

Sn

(C)

CuO2

+

Fig6a-c Eid et al

7

000 005 010 015 0200

20

40

60

80

100

SSC505

ST

RE

SS

(M

Pa

)

STRAIN

SSC-ZnO

Room temperature

=4710

-4 s

-1

Fig7 Eid et al

5


31 Thermal analysis





























6


by 37 [9]


321 XRD analysis





(202) at angles of (2 293o 419

o 423

o and 605




angles 327 o

and 343 o















sin2cos d

K (1)




7















defect formation
















8
































9












s-1




















10









[20 24 31]





4 Conclusion











11

5 Reference





[5] H Mavoori JOM 52 No 6 (2000) 29



No 33A (2002) 1531-1593




(2009) 98-104



(2006) 166-169


Electron 20 (2009) 571-576



material 35 No 8 (2006) 1672-1679


(2009) 458-461


(2014) 837-845


(2009) 199-206



ISBN978-3-527-40813-9

12




31 (2010) 990-993




(a) 198 No 1 (2003) 76-90




Engineering A 525 (2009) 107-111









1522


No 12 (2004) 957-964

13

Figure caption




composite solders







composite solder



14

Highlights










solder alloys

Material Tm oC Ts

oC TL

oC T= TL-TS

oC

H

(kJkg)

Reference

Sn-5Sb

SSC505

SSC-ZnO

246

23738

23827

240

22345

22556

249

24733

24746

90

2388

2190

141

12552

8896

El-Dally[9]

This study

This study




Cu6Sn5 (IMC)

SSC505

(R2 = 0042)

R2

R

R

SSC-ZnO

(R2 = 0061)

SSC505

(R2 = 03337)

SSC-ZnO

(R2 = 06108)

SSC505

(R2= 04255)

SSC-ZnO

(R2= 07218)

d(nm) times d(nm)

(nm)

times d (nm) times

d(nm) times

d(nm) times

d (nm) times

116 10 99 55 693 300 116 565 754 346 205 588

Table


Zone

Composition Phase



+ (See fig 6a)

+ (See fig 6b)

+ (See fig 6c)

6543

7276

8359

6601

6161

4053

3457

368

875

3399

701

661

-------

2356

206

-------

2737

298

------

-------

351

-------

-------

494

-------

-------

360

-------

-------

1308

SnSb

Cu6Sn5

Eutectic



3) Reference

Sn-5wt Sb

SSC505

SSC-ZnO

7526plusmn0005

7553plusmn0006

7533plusmn0006

050

075plusmn017

087plusmn020

M El-Bahay [23]

This study

This study


s-1


Sn-5wt Sb

SSC505

SSC-ZnO

445

434

603

3550

7748

8635

2570

6468

7310

---

4259

7280

22

170

97

El-daly [9]

This study

This study

1

0 100 200 300 400 500

23738 0C

23827 oC

TEMPERATURE (C)

SSC505

SSC-ZnOH

EA

T F

LO

W (

mW

)

Fig1 Eid etal

Figure

2

30 40 50 60 70 80

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Zn

O(0

02

)Z

nO

(10

1)

Sn

(31

2)

Sn

Sb

(10

4)

Sn

(41

1)

Sn

(42

0)

Sb

Sn

(11

3)

Sn

(32

1)

Sn

(40

0)

Sn

(11

2)

Sb

Sn

(20

2)

Sn

(30

1)

Sb

Sn

(00

3)

Cu

6S

n5

Sn

(21

1)

Sb

Sn

(11

0)

Sn

(10

1) a)SSC505

INT

EN

SIT

Y (

arb

un

its

)

2 (degree)

Sn

(20

0)

Sn

(22

0)

Sb

Sn

(01

0)

IN

TE

NS

ITY

(a

rbu

nit

s)

b) SSC-ZnO

Fig2 Eid et al

3

302 304 306 308 31 312 314 316 318 32 322 324 326

2 (degree)

Inte

ns

ity

(a

rbu

nt)

SSC505 SSC-ZnO

Fig3 Eid et al

4

Fig4 Eid et al

-Sn

-Sn

5

Fig5 Eid et al

Cu6Sn5

SbSn

Cu6Sn5

SbSn

6

0 1 2 3 4 5 6 7 8 9 10

Energy (keV)

Sn

Sn

SnSn

Sn

Sb

Sb

Sb

SbSn

+

+

(a)

0 1 2 3 4 5 6 7 8 9 10Energy (keV)

Sn

Sb

Sn

SnCuCu

Cu

Cu6Sn5

BA

+

Sn

(b)

0 1 2 3 4 5 6 7 8 9 10Energy (keV)

Sn

Sb

Sn

Sn

CuZn

Sn

(C)

CuO2

+

Fig6a-c Eid et al

7

000 005 010 015 0200

20

40

60

80

100

SSC505

ST

RE

SS

(M

Pa

)

STRAIN

SSC-ZnO

Room temperature

=4710

-4 s

-1

Fig7 Eid et al

6


by 37 [9]


321 XRD analysis





(202) at angles of (2 293o 419

o 423

o and 605




angles 327 o

and 343 o















sin2cos d

K (1)




7















defect formation
















8
































9












s-1




















10









[20 24 31]





4 Conclusion











11

5 Reference





[5] H Mavoori JOM 52 No 6 (2000) 29



No 33A (2002) 1531-1593




(2009) 98-104



(2006) 166-169


Electron 20 (2009) 571-576



material 35 No 8 (2006) 1672-1679


(2009) 458-461


(2014) 837-845


(2009) 199-206



ISBN978-3-527-40813-9

12




31 (2010) 990-993




(a) 198 No 1 (2003) 76-90




Engineering A 525 (2009) 107-111









1522


No 12 (2004) 957-964

13

Figure caption




composite solders







composite solder



14

Highlights










solder alloys

Material Tm oC Ts

oC TL

oC T= TL-TS

oC

H

(kJkg)

Reference

Sn-5Sb

SSC505

SSC-ZnO

246

23738

23827

240

22345

22556

249

24733

24746

90

2388

2190

141

12552

8896

El-Dally[9]

This study

This study




Cu6Sn5 (IMC)

SSC505

(R2 = 0042)

R2

R

R

SSC-ZnO

(R2 = 0061)

SSC505

(R2 = 03337)

SSC-ZnO

(R2 = 06108)

SSC505

(R2= 04255)

SSC-ZnO

(R2= 07218)

d(nm) times d(nm)

(nm)

times d (nm) times

d(nm) times

d(nm) times

d (nm) times

116 10 99 55 693 300 116 565 754 346 205 588

Table


Zone

Composition Phase



+ (See fig 6a)

+ (See fig 6b)

+ (See fig 6c)

6543

7276

8359

6601

6161

4053

3457

368

875

3399

701

661

-------

2356

206

-------

2737

298

------

-------

351

-------

-------

494

-------

-------

360

-------

-------

1308

SnSb

Cu6Sn5

Eutectic



3) Reference

Sn-5wt Sb

SSC505

SSC-ZnO

7526plusmn0005

7553plusmn0006

7533plusmn0006

050

075plusmn017

087plusmn020

M El-Bahay [23]

This study

This study


s-1


Sn-5wt Sb

SSC505

SSC-ZnO

445

434

603

3550

7748

8635

2570

6468

7310

---

4259

7280

22

170

97

El-daly [9]

This study

This study

1

0 100 200 300 400 500

23738 0C

23827 oC

TEMPERATURE (C)

SSC505

SSC-ZnOH

EA

T F

LO

W (

mW

)

Fig1 Eid etal

Figure

2

30 40 50 60 70 80

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Zn

O(0

02

)Z

nO

(10

1)

Sn

(31

2)

Sn

Sb

(10

4)

Sn

(41

1)

Sn

(42

0)

Sb

Sn

(11

3)

Sn

(32

1)

Sn

(40

0)

Sn

(11

2)

Sb

Sn

(20

2)

Sn

(30

1)

Sb

Sn

(00

3)

Cu

6S

n5

Sn

(21

1)

Sb

Sn

(11

0)

Sn

(10

1) a)SSC505

INT

EN

SIT

Y (

arb

un

its

)

2 (degree)

Sn

(20

0)

Sn

(22

0)

Sb

Sn

(01

0)

IN

TE

NS

ITY

(a

rbu

nit

s)

b) SSC-ZnO

Fig2 Eid et al

3

302 304 306 308 31 312 314 316 318 32 322 324 326

2 (degree)

Inte

ns

ity

(a

rbu

nt)

SSC505 SSC-ZnO

Fig3 Eid et al

4

Fig4 Eid et al

-Sn

-Sn

5

Fig5 Eid et al

Cu6Sn5

SbSn

Cu6Sn5

SbSn

6

0 1 2 3 4 5 6 7 8 9 10

Energy (keV)

Sn

Sn

SnSn

Sn

Sb

Sb

Sb

SbSn

+

+

(a)

0 1 2 3 4 5 6 7 8 9 10Energy (keV)

Sn

Sb

Sn

SnCuCu

Cu

Cu6Sn5

BA

+

Sn

(b)

0 1 2 3 4 5 6 7 8 9 10Energy (keV)

Sn

Sb

Sn

Sn

CuZn

Sn

(C)

CuO2

+

Fig6a-c Eid et al

7

000 005 010 015 0200

20

40

60

80

100

SSC505

ST

RE

SS

(M

Pa

)

STRAIN

SSC-ZnO

Room temperature

=4710

-4 s

-1

Fig7 Eid et al

7















defect formation
















8
































9












s-1




















10









[20 24 31]





4 Conclusion











11

5 Reference





[5] H Mavoori JOM 52 No 6 (2000) 29



No 33A (2002) 1531-1593




(2009) 98-104



(2006) 166-169


Electron 20 (2009) 571-576



material 35 No 8 (2006) 1672-1679


(2009) 458-461


(2014) 837-845


(2009) 199-206



ISBN978-3-527-40813-9

12




31 (2010) 990-993




(a) 198 No 1 (2003) 76-90




Engineering A 525 (2009) 107-111









1522


No 12 (2004) 957-964

13

Figure caption




composite solders







composite solder



14

Highlights










solder alloys

Material Tm oC Ts

oC TL

oC T= TL-TS

oC

H

(kJkg)

Reference

Sn-5Sb

SSC505

SSC-ZnO

246

23738

23827

240

22345

22556

249

24733

24746

90

2388

2190

141

12552

8896

El-Dally[9]

This study

This study




Cu6Sn5 (IMC)

SSC505

(R2 = 0042)

R2

R

R

SSC-ZnO

(R2 = 0061)

SSC505

(R2 = 03337)

SSC-ZnO

(R2 = 06108)

SSC505

(R2= 04255)

SSC-ZnO

(R2= 07218)

d(nm) times d(nm)

(nm)

times d (nm) times

d(nm) times

d(nm) times

d (nm) times

116 10 99 55 693 300 116 565 754 346 205 588

Table


Zone

Composition Phase



+ (See fig 6a)

+ (See fig 6b)

+ (See fig 6c)

6543

7276

8359

6601

6161

4053

3457

368

875

3399

701

661

-------

2356

206

-------

2737

298

------

-------

351

-------

-------

494

-------

-------

360

-------

-------

1308

SnSb

Cu6Sn5

Eutectic



3) Reference

Sn-5wt Sb

SSC505

SSC-ZnO

7526plusmn0005

7553plusmn0006

7533plusmn0006

050

075plusmn017

087plusmn020

M El-Bahay [23]

This study

This study


s-1


Sn-5wt Sb

SSC505

SSC-ZnO

445

434

603

3550

7748

8635

2570

6468

7310

---

4259

7280

22

170

97

El-daly [9]

This study

This study

1

0 100 200 300 400 500

23738 0C

23827 oC

TEMPERATURE (C)

SSC505

SSC-ZnOH

EA

T F

LO

W (

mW

)

Fig1 Eid etal

Figure

2

30 40 50 60 70 80

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Zn

O(0

02

)Z

nO

(10

1)

Sn

(31

2)

Sn

Sb

(10

4)

Sn

(41

1)

Sn

(42

0)

Sb

Sn

(11

3)

Sn

(32

1)

Sn

(40

0)

Sn

(11

2)

Sb

Sn

(20

2)

Sn

(30

1)

Sb

Sn

(00

3)

Cu

6S

n5

Sn

(21

1)

Sb

Sn

(11

0)

Sn

(10

1) a)SSC505

INT

EN

SIT

Y (

arb

un

its

)

2 (degree)

Sn

(20

0)

Sn

(22

0)

Sb

Sn

(01

0)

IN

TE

NS

ITY

(a

rbu

nit

s)

b) SSC-ZnO

Fig2 Eid et al

3

302 304 306 308 31 312 314 316 318 32 322 324 326

2 (degree)

Inte

ns

ity

(a

rbu

nt)

SSC505 SSC-ZnO

Fig3 Eid et al

4

Fig4 Eid et al

-Sn

-Sn

5

Fig5 Eid et al

Cu6Sn5

SbSn

Cu6Sn5

SbSn

6

0 1 2 3 4 5 6 7 8 9 10

Energy (keV)

Sn

Sn

SnSn

Sn

Sb

Sb

Sb

SbSn

+

+

(a)

0 1 2 3 4 5 6 7 8 9 10Energy (keV)

Sn

Sb

Sn

SnCuCu

Cu

Cu6Sn5

BA

+

Sn

(b)

0 1 2 3 4 5 6 7 8 9 10Energy (keV)

Sn

Sb

Sn

Sn

CuZn

Sn

(C)

CuO2

+

Fig6a-c Eid et al

7

000 005 010 015 0200

20

40

60

80

100

SSC505

ST

RE

SS

(M

Pa

)

STRAIN

SSC-ZnO

Room temperature

=4710

-4 s

-1

Fig7 Eid et al

8
































9












s-1




















10









[20 24 31]





4 Conclusion











11

5 Reference





[5] H Mavoori JOM 52 No 6 (2000) 29



No 33A (2002) 1531-1593




(2009) 98-104



(2006) 166-169


Electron 20 (2009) 571-576



material 35 No 8 (2006) 1672-1679


(2009) 458-461


(2014) 837-845


(2009) 199-206



ISBN978-3-527-40813-9

12




31 (2010) 990-993




(a) 198 No 1 (2003) 76-90




Engineering A 525 (2009) 107-111









1522


No 12 (2004) 957-964

13

Figure caption




composite solders







composite solder



14

Highlights










solder alloys

Material Tm oC Ts

oC TL

oC T= TL-TS

oC

H

(kJkg)

Reference

Sn-5Sb

SSC505

SSC-ZnO

246

23738

23827

240

22345

22556

249

24733

24746

90

2388

2190

141

12552

8896

El-Dally[9]

This study

This study




Cu6Sn5 (IMC)

SSC505

(R2 = 0042)

R2

R

R

SSC-ZnO

(R2 = 0061)

SSC505

(R2 = 03337)

SSC-ZnO

(R2 = 06108)

SSC505

(R2= 04255)

SSC-ZnO

(R2= 07218)

d(nm) times d(nm)

(nm)

times d (nm) times

d(nm) times

d(nm) times

d (nm) times

116 10 99 55 693 300 116 565 754 346 205 588

Table


Zone

Composition Phase



+ (See fig 6a)

+ (See fig 6b)

+ (See fig 6c)

6543

7276

8359

6601

6161

4053

3457

368

875

3399

701

661

-------

2356

206

-------

2737

298

------

-------

351

-------

-------

494

-------

-------

360

-------

-------

1308

SnSb

Cu6Sn5

Eutectic



3) Reference

Sn-5wt Sb

SSC505

SSC-ZnO

7526plusmn0005

7553plusmn0006

7533plusmn0006

050

075plusmn017

087plusmn020

M El-Bahay [23]

This study

This study


s-1


Sn-5wt Sb

SSC505

SSC-ZnO

445

434

603

3550

7748

8635

2570

6468

7310

---

4259

7280

22

170

97

El-daly [9]

This study

This study

1

0 100 200 300 400 500

23738 0C

23827 oC

TEMPERATURE (C)

SSC505

SSC-ZnOH

EA

T F

LO

W (

mW

)

Fig1 Eid etal

Figure

2

30 40 50 60 70 80

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Zn

O(0

02

)Z

nO

(10

1)

Sn

(31

2)

Sn

Sb

(10

4)

Sn

(41

1)

Sn

(42

0)

Sb

Sn

(11

3)

Sn

(32

1)

Sn

(40

0)

Sn

(11

2)

Sb

Sn

(20

2)

Sn

(30

1)

Sb

Sn

(00

3)

Cu

6S

n5

Sn

(21

1)

Sb

Sn

(11

0)

Sn

(10

1) a)SSC505

INT

EN

SIT

Y (

arb

un

its

)

2 (degree)

Sn

(20

0)

Sn

(22

0)

Sb

Sn

(01

0)

IN

TE

NS

ITY

(a

rbu

nit

s)

b) SSC-ZnO

Fig2 Eid et al

3

302 304 306 308 31 312 314 316 318 32 322 324 326

2 (degree)

Inte

ns

ity

(a

rbu

nt)

SSC505 SSC-ZnO

Fig3 Eid et al

4

Fig4 Eid et al

-Sn

-Sn

5

Fig5 Eid et al

Cu6Sn5

SbSn

Cu6Sn5

SbSn

6

0 1 2 3 4 5 6 7 8 9 10

Energy (keV)

Sn

Sn

SnSn

Sn

Sb

Sb

Sb

SbSn

+

+

(a)

0 1 2 3 4 5 6 7 8 9 10Energy (keV)

Sn

Sb

Sn

SnCuCu

Cu

Cu6Sn5

BA

+

Sn

(b)

0 1 2 3 4 5 6 7 8 9 10Energy (keV)

Sn

Sb

Sn

Sn

CuZn

Sn

(C)

CuO2

+

Fig6a-c Eid et al

7

000 005 010 015 0200

20

40

60

80

100

SSC505

ST

RE

SS

(M

Pa

)

STRAIN

SSC-ZnO

Room temperature

=4710

-4 s

-1

Fig7 Eid et al

9












s-1




















10









[20 24 31]





4 Conclusion











11

5 Reference





[5] H Mavoori JOM 52 No 6 (2000) 29



No 33A (2002) 1531-1593




(2009) 98-104



(2006) 166-169


Electron 20 (2009) 571-576



material 35 No 8 (2006) 1672-1679


(2009) 458-461


(2014) 837-845


(2009) 199-206



ISBN978-3-527-40813-9

12




31 (2010) 990-993




(a) 198 No 1 (2003) 76-90




Engineering A 525 (2009) 107-111









1522


No 12 (2004) 957-964

13

Figure caption




composite solders







composite solder



14

Highlights










solder alloys

Material Tm oC Ts

oC TL

oC T= TL-TS

oC

H

(kJkg)

Reference

Sn-5Sb

SSC505

SSC-ZnO

246

23738

23827

240

22345

22556

249

24733

24746

90

2388

2190

141

12552

8896

El-Dally[9]

This study

This study




Cu6Sn5 (IMC)

SSC505

(R2 = 0042)

R2

R

R

SSC-ZnO

(R2 = 0061)

SSC505

(R2 = 03337)

SSC-ZnO

(R2 = 06108)

SSC505

(R2= 04255)

SSC-ZnO

(R2= 07218)

d(nm) times d(nm)

(nm)

times d (nm) times

d(nm) times

d(nm) times

d (nm) times

116 10 99 55 693 300 116 565 754 346 205 588

Table


Zone

Composition Phase



+ (See fig 6a)

+ (See fig 6b)

+ (See fig 6c)

6543

7276

8359

6601

6161

4053

3457

368

875

3399

701

661

-------

2356

206

-------

2737

298

------

-------

351

-------

-------

494

-------

-------

360

-------

-------

1308

SnSb

Cu6Sn5

Eutectic



3) Reference

Sn-5wt Sb

SSC505

SSC-ZnO

7526plusmn0005

7553plusmn0006

7533plusmn0006

050

075plusmn017

087plusmn020

M El-Bahay [23]

This study

This study


s-1


Sn-5wt Sb

SSC505

SSC-ZnO

445

434

603

3550

7748

8635

2570

6468

7310

---

4259

7280

22

170

97

El-daly [9]

This study

This study

1

0 100 200 300 400 500

23738 0C

23827 oC

TEMPERATURE (C)

SSC505

SSC-ZnOH

EA

T F

LO

W (

mW

)

Fig1 Eid etal

Figure

2

30 40 50 60 70 80

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Zn

O(0

02

)Z

nO

(10

1)

Sn

(31

2)

Sn

Sb

(10

4)

Sn

(41

1)

Sn

(42

0)

Sb

Sn

(11

3)

Sn

(32

1)

Sn

(40

0)

Sn

(11

2)

Sb

Sn

(20

2)

Sn

(30

1)

Sb

Sn

(00

3)

Cu

6S

n5

Sn

(21

1)

Sb

Sn

(11

0)

Sn

(10

1) a)SSC505

INT

EN

SIT

Y (

arb

un

its

)

2 (degree)

Sn

(20

0)

Sn

(22

0)

Sb

Sn

(01

0)

IN

TE

NS

ITY

(a

rbu

nit

s)

b) SSC-ZnO

Fig2 Eid et al

3

302 304 306 308 31 312 314 316 318 32 322 324 326

2 (degree)

Inte

ns

ity

(a

rbu

nt)

SSC505 SSC-ZnO

Fig3 Eid et al

4

Fig4 Eid et al

-Sn

-Sn

5

Fig5 Eid et al

Cu6Sn5

SbSn

Cu6Sn5

SbSn

6

0 1 2 3 4 5 6 7 8 9 10

Energy (keV)

Sn

Sn

SnSn

Sn

Sb

Sb

Sb

SbSn

+

+

(a)

0 1 2 3 4 5 6 7 8 9 10Energy (keV)

Sn

Sb

Sn

SnCuCu

Cu

Cu6Sn5

BA

+

Sn

(b)

0 1 2 3 4 5 6 7 8 9 10Energy (keV)

Sn

Sb

Sn

Sn

CuZn

Sn

(C)

CuO2

+

Fig6a-c Eid et al

7

000 005 010 015 0200

20

40

60

80

100

SSC505

ST

RE

SS

(M

Pa

)

STRAIN

SSC-ZnO

Room temperature

=4710

-4 s

-1

Fig7 Eid et al

10









[20 24 31]





4 Conclusion











11

5 Reference





[5] H Mavoori JOM 52 No 6 (2000) 29



No 33A (2002) 1531-1593




(2009) 98-104



(2006) 166-169


Electron 20 (2009) 571-576



material 35 No 8 (2006) 1672-1679


(2009) 458-461


(2014) 837-845


(2009) 199-206



ISBN978-3-527-40813-9

12




31 (2010) 990-993




(a) 198 No 1 (2003) 76-90




Engineering A 525 (2009) 107-111









1522


No 12 (2004) 957-964

13

Figure caption




composite solders







composite solder



14

Highlights










solder alloys

Material Tm oC Ts

oC TL

oC T= TL-TS

oC

H

(kJkg)

Reference

Sn-5Sb

SSC505

SSC-ZnO

246

23738

23827

240

22345

22556

249

24733

24746

90

2388

2190

141

12552

8896

El-Dally[9]

This study

This study




Cu6Sn5 (IMC)

SSC505

(R2 = 0042)

R2

R

R

SSC-ZnO

(R2 = 0061)

SSC505

(R2 = 03337)

SSC-ZnO

(R2 = 06108)

SSC505

(R2= 04255)

SSC-ZnO

(R2= 07218)

d(nm) times d(nm)

(nm)

times d (nm) times

d(nm) times

d(nm) times

d (nm) times

116 10 99 55 693 300 116 565 754 346 205 588

Table


Zone

Composition Phase



+ (See fig 6a)

+ (See fig 6b)

+ (See fig 6c)

6543

7276

8359

6601

6161

4053

3457

368

875

3399

701

661

-------

2356

206

-------

2737

298

------

-------

351

-------

-------

494

-------

-------

360

-------

-------

1308

SnSb

Cu6Sn5

Eutectic



3) Reference

Sn-5wt Sb

SSC505

SSC-ZnO

7526plusmn0005

7553plusmn0006

7533plusmn0006

050

075plusmn017

087plusmn020

M El-Bahay [23]

This study

This study


s-1


Sn-5wt Sb

SSC505

SSC-ZnO

445

434

603

3550

7748

8635

2570

6468

7310

---

4259

7280

22

170

97

El-daly [9]

This study

This study

1

0 100 200 300 400 500

23738 0C

23827 oC

TEMPERATURE (C)

SSC505

SSC-ZnOH

EA

T F

LO

W (

mW

)

Fig1 Eid etal

Figure

2

30 40 50 60 70 80

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Zn

O(0

02

)Z

nO

(10

1)

Sn

(31

2)

Sn

Sb

(10

4)

Sn

(41

1)

Sn

(42

0)

Sb

Sn

(11

3)

Sn

(32

1)

Sn

(40

0)

Sn

(11

2)

Sb

Sn

(20

2)

Sn

(30

1)

Sb

Sn

(00

3)

Cu

6S

n5

Sn

(21

1)

Sb

Sn

(11

0)

Sn

(10

1) a)SSC505

INT

EN

SIT

Y (

arb

un

its

)

2 (degree)

Sn

(20

0)

Sn

(22

0)

Sb

Sn

(01

0)

IN

TE

NS

ITY

(a

rbu

nit

s)

b) SSC-ZnO

Fig2 Eid et al

3

302 304 306 308 31 312 314 316 318 32 322 324 326

2 (degree)

Inte

ns

ity

(a

rbu

nt)

SSC505 SSC-ZnO

Fig3 Eid et al

4

Fig4 Eid et al

-Sn

-Sn

5

Fig5 Eid et al

Cu6Sn5

SbSn

Cu6Sn5

SbSn

6

0 1 2 3 4 5 6 7 8 9 10

Energy (keV)

Sn

Sn

SnSn

Sn

Sb

Sb

Sb

SbSn

+

+

(a)

0 1 2 3 4 5 6 7 8 9 10Energy (keV)

Sn

Sb

Sn

SnCuCu

Cu

Cu6Sn5

BA

+

Sn

(b)

0 1 2 3 4 5 6 7 8 9 10Energy (keV)

Sn

Sb

Sn

Sn

CuZn

Sn

(C)

CuO2

+

Fig6a-c Eid et al

7

000 005 010 015 0200

20

40

60

80

100

SSC505

ST

RE

SS

(M

Pa

)

STRAIN

SSC-ZnO

Room temperature

=4710

-4 s

-1

Fig7 Eid et al

11

5 Reference





[5] H Mavoori JOM 52 No 6 (2000) 29



No 33A (2002) 1531-1593




(2009) 98-104



(2006) 166-169


Electron 20 (2009) 571-576



material 35 No 8 (2006) 1672-1679


(2009) 458-461


(2014) 837-845


(2009) 199-206



ISBN978-3-527-40813-9

12




31 (2010) 990-993




(a) 198 No 1 (2003) 76-90




Engineering A 525 (2009) 107-111









1522


No 12 (2004) 957-964

13

Figure caption




composite solders







composite solder



14

Highlights










solder alloys

Material Tm oC Ts

oC TL

oC T= TL-TS

oC

H

(kJkg)

Reference

Sn-5Sb

SSC505

SSC-ZnO

246

23738

23827

240

22345

22556

249

24733

24746

90

2388

2190

141

12552

8896

El-Dally[9]

This study

This study




Cu6Sn5 (IMC)

SSC505

(R2 = 0042)

R2

R

R

SSC-ZnO

(R2 = 0061)

SSC505

(R2 = 03337)

SSC-ZnO

(R2 = 06108)

SSC505

(R2= 04255)

SSC-ZnO

(R2= 07218)

d(nm) times d(nm)

(nm)

times d (nm) times

d(nm) times

d(nm) times

d (nm) times

116 10 99 55 693 300 116 565 754 346 205 588

Table


Zone

Composition Phase



+ (See fig 6a)

+ (See fig 6b)

+ (See fig 6c)

6543

7276

8359

6601

6161

4053

3457

368

875

3399

701

661

-------

2356

206

-------

2737

298

------

-------

351

-------

-------

494

-------

-------

360

-------

-------

1308

SnSb

Cu6Sn5

Eutectic



3) Reference

Sn-5wt Sb

SSC505

SSC-ZnO

7526plusmn0005

7553plusmn0006

7533plusmn0006

050

075plusmn017

087plusmn020

M El-Bahay [23]

This study

This study


s-1


Sn-5wt Sb

SSC505

SSC-ZnO

445

434

603

3550

7748

8635

2570

6468

7310

---

4259

7280

22

170

97

El-daly [9]

This study

This study

1

0 100 200 300 400 500

23738 0C

23827 oC

TEMPERATURE (C)

SSC505

SSC-ZnOH

EA

T F

LO

W (

mW

)

Fig1 Eid etal

Figure

2

30 40 50 60 70 80

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Zn

O(0

02

)Z

nO

(10

1)

Sn

(31

2)

Sn

Sb

(10

4)

Sn

(41

1)

Sn

(42

0)

Sb

Sn

(11

3)

Sn

(32

1)

Sn

(40

0)

Sn

(11

2)

Sb

Sn

(20

2)

Sn

(30

1)

Sb

Sn

(00

3)

Cu

6S

n5

Sn

(21

1)

Sb

Sn

(11

0)

Sn

(10

1) a)SSC505

INT

EN

SIT

Y (

arb

un

its

)

2 (degree)

Sn

(20

0)

Sn

(22

0)

Sb

Sn

(01

0)

IN

TE

NS

ITY

(a

rbu

nit

s)

b) SSC-ZnO

Fig2 Eid et al

3

302 304 306 308 31 312 314 316 318 32 322 324 326

2 (degree)

Inte

ns

ity

(a

rbu

nt)

SSC505 SSC-ZnO

Fig3 Eid et al

4

Fig4 Eid et al

-Sn

-Sn

5

Fig5 Eid et al

Cu6Sn5

SbSn

Cu6Sn5

SbSn

6

0 1 2 3 4 5 6 7 8 9 10

Energy (keV)

Sn

Sn

SnSn

Sn

Sb

Sb

Sb

SbSn

+

+

(a)

0 1 2 3 4 5 6 7 8 9 10Energy (keV)

Sn

Sb

Sn

SnCuCu

Cu

Cu6Sn5

BA

+

Sn

(b)

0 1 2 3 4 5 6 7 8 9 10Energy (keV)

Sn

Sb

Sn

Sn

CuZn

Sn

(C)

CuO2

+

Fig6a-c Eid et al

7

000 005 010 015 0200

20

40

60

80

100

SSC505

ST

RE

SS

(M

Pa

)

STRAIN

SSC-ZnO

Room temperature

=4710

-4 s

-1

Fig7 Eid et al

12




31 (2010) 990-993




(a) 198 No 1 (2003) 76-90




Engineering A 525 (2009) 107-111









1522


No 12 (2004) 957-964

13

Figure caption




composite solders







composite solder



14

Highlights










solder alloys

Material Tm oC Ts

oC TL

oC T= TL-TS

oC

H

(kJkg)

Reference

Sn-5Sb

SSC505

SSC-ZnO

246

23738

23827

240

22345

22556

249

24733

24746

90

2388

2190

141

12552

8896

El-Dally[9]

This study

This study




Cu6Sn5 (IMC)

SSC505

(R2 = 0042)

R2

R

R

SSC-ZnO

(R2 = 0061)

SSC505

(R2 = 03337)

SSC-ZnO

(R2 = 06108)

SSC505

(R2= 04255)

SSC-ZnO

(R2= 07218)

d(nm) times d(nm)

(nm)

times d (nm) times

d(nm) times

d(nm) times

d (nm) times

116 10 99 55 693 300 116 565 754 346 205 588

Table


Zone

Composition Phase



+ (See fig 6a)

+ (See fig 6b)

+ (See fig 6c)

6543

7276

8359

6601

6161

4053

3457

368

875

3399

701

661

-------

2356

206

-------

2737

298

------

-------

351

-------

-------

494

-------

-------

360

-------

-------

1308

SnSb

Cu6Sn5

Eutectic



3) Reference

Sn-5wt Sb

SSC505

SSC-ZnO

7526plusmn0005

7553plusmn0006

7533plusmn0006

050

075plusmn017

087plusmn020

M El-Bahay [23]

This study

This study


s-1


Sn-5wt Sb

SSC505

SSC-ZnO

445

434

603

3550

7748

8635

2570

6468

7310

---

4259

7280

22

170

97

El-daly [9]

This study

This study

1

0 100 200 300 400 500

23738 0C

23827 oC

TEMPERATURE (C)

SSC505

SSC-ZnOH

EA

T F

LO

W (

mW

)

Fig1 Eid etal

Figure

2

30 40 50 60 70 80

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Zn

O(0

02

)Z

nO

(10

1)

Sn

(31

2)

Sn

Sb

(10

4)

Sn

(41

1)

Sn

(42

0)

Sb

Sn

(11

3)

Sn

(32

1)

Sn

(40

0)

Sn

(11

2)

Sb

Sn

(20

2)

Sn

(30

1)

Sb

Sn

(00

3)

Cu

6S

n5

Sn

(21

1)

Sb

Sn

(11

0)

Sn

(10

1) a)SSC505

INT

EN

SIT

Y (

arb

un

its

)

2 (degree)

Sn

(20

0)

Sn

(22

0)

Sb

Sn

(01

0)

IN

TE

NS

ITY

(a

rbu

nit

s)

b) SSC-ZnO

Fig2 Eid et al

3

302 304 306 308 31 312 314 316 318 32 322 324 326

2 (degree)

Inte

ns

ity

(a

rbu

nt)

SSC505 SSC-ZnO

Fig3 Eid et al

4

Fig4 Eid et al

-Sn

-Sn

5

Fig5 Eid et al

Cu6Sn5

SbSn

Cu6Sn5

SbSn

6

0 1 2 3 4 5 6 7 8 9 10

Energy (keV)

Sn

Sn

SnSn

Sn

Sb

Sb

Sb

SbSn

+

+

(a)

0 1 2 3 4 5 6 7 8 9 10Energy (keV)

Sn

Sb

Sn

SnCuCu

Cu

Cu6Sn5

BA

+

Sn

(b)

0 1 2 3 4 5 6 7 8 9 10Energy (keV)

Sn

Sb

Sn

Sn

CuZn

Sn

(C)

CuO2

+

Fig6a-c Eid et al

7

000 005 010 015 0200

20

40

60

80

100

SSC505

ST

RE

SS

(M

Pa

)

STRAIN

SSC-ZnO

Room temperature

=4710

-4 s

-1

Fig7 Eid et al

13

Figure caption




composite solders







composite solder



14

Highlights










solder alloys

Material Tm oC Ts

oC TL

oC T= TL-TS

oC

H

(kJkg)

Reference

Sn-5Sb

SSC505

SSC-ZnO

246

23738

23827

240

22345

22556

249

24733

24746

90

2388

2190

141

12552

8896

El-Dally[9]

This study

This study




Cu6Sn5 (IMC)

SSC505

(R2 = 0042)

R2

R

R

SSC-ZnO

(R2 = 0061)

SSC505

(R2 = 03337)

SSC-ZnO

(R2 = 06108)

SSC505

(R2= 04255)

SSC-ZnO

(R2= 07218)

d(nm) times d(nm)

(nm)

times d (nm) times

d(nm) times

d(nm) times

d (nm) times

116 10 99 55 693 300 116 565 754 346 205 588

Table


Zone

Composition Phase



+ (See fig 6a)

+ (See fig 6b)

+ (See fig 6c)

6543

7276

8359

6601

6161

4053

3457

368

875

3399

701

661

-------

2356

206

-------

2737

298

------

-------

351

-------

-------

494

-------

-------

360

-------

-------

1308

SnSb

Cu6Sn5

Eutectic



3) Reference

Sn-5wt Sb

SSC505

SSC-ZnO

7526plusmn0005

7553plusmn0006

7533plusmn0006

050

075plusmn017

087plusmn020

M El-Bahay [23]

This study

This study


s-1


Sn-5wt Sb

SSC505

SSC-ZnO

445

434

603

3550

7748

8635

2570

6468

7310

---

4259

7280

22

170

97

El-daly [9]

This study

This study

1

0 100 200 300 400 500

23738 0C

23827 oC

TEMPERATURE (C)

SSC505

SSC-ZnOH

EA

T F

LO

W (

mW

)

Fig1 Eid etal

Figure

2

30 40 50 60 70 80

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Zn

O(0

02

)Z

nO

(10

1)

Sn

(31

2)

Sn

Sb

(10

4)

Sn

(41

1)

Sn

(42

0)

Sb

Sn

(11

3)

Sn

(32

1)

Sn

(40

0)

Sn

(11

2)

Sb

Sn

(20

2)

Sn

(30

1)

Sb

Sn

(00

3)

Cu

6S

n5

Sn

(21

1)

Sb

Sn

(11

0)

Sn

(10

1) a)SSC505

INT

EN

SIT

Y (

arb

un

its

)

2 (degree)

Sn

(20

0)

Sn

(22

0)

Sb

Sn

(01

0)

IN

TE

NS

ITY

(a

rbu

nit

s)

b) SSC-ZnO

Fig2 Eid et al

3

302 304 306 308 31 312 314 316 318 32 322 324 326

2 (degree)

Inte

ns

ity

(a

rbu

nt)

SSC505 SSC-ZnO

Fig3 Eid et al

4

Fig4 Eid et al

-Sn

-Sn

5

Fig5 Eid et al

Cu6Sn5

SbSn

Cu6Sn5

SbSn

6

0 1 2 3 4 5 6 7 8 9 10

Energy (keV)

Sn

Sn

SnSn

Sn

Sb

Sb

Sb

SbSn

+

+

(a)

0 1 2 3 4 5 6 7 8 9 10Energy (keV)

Sn

Sb

Sn

SnCuCu

Cu

Cu6Sn5

BA

+

Sn

(b)

0 1 2 3 4 5 6 7 8 9 10Energy (keV)

Sn

Sb

Sn

Sn

CuZn

Sn

(C)

CuO2

+

Fig6a-c Eid et al

7

000 005 010 015 0200

20

40

60

80

100

SSC505

ST

RE

SS

(M

Pa

)

STRAIN

SSC-ZnO

Room temperature

=4710

-4 s

-1

Fig7 Eid et al

14

Highlights










solder alloys

Material Tm oC Ts

oC TL

oC T= TL-TS

oC

H

(kJkg)

Reference

Sn-5Sb

SSC505

SSC-ZnO

246

23738

23827

240

22345

22556

249

24733

24746

90

2388

2190

141

12552

8896

El-Dally[9]

This study

This study




Cu6Sn5 (IMC)

SSC505

(R2 = 0042)

R2

R

R

SSC-ZnO

(R2 = 0061)

SSC505

(R2 = 03337)

SSC-ZnO

(R2 = 06108)

SSC505

(R2= 04255)

SSC-ZnO

(R2= 07218)

d(nm) times d(nm)

(nm)

times d (nm) times

d(nm) times

d(nm) times

d (nm) times

116 10 99 55 693 300 116 565 754 346 205 588

Table


Zone

Composition Phase



+ (See fig 6a)

+ (See fig 6b)

+ (See fig 6c)

6543

7276

8359

6601

6161

4053

3457

368

875

3399

701

661

-------

2356

206

-------

2737

298

------

-------

351

-------

-------

494

-------

-------

360

-------

-------

1308

SnSb

Cu6Sn5

Eutectic



3) Reference

Sn-5wt Sb

SSC505

SSC-ZnO

7526plusmn0005

7553plusmn0006

7533plusmn0006

050

075plusmn017

087plusmn020

M El-Bahay [23]

This study

This study


s-1


Sn-5wt Sb

SSC505

SSC-ZnO

445

434

603

3550

7748

8635

2570

6468

7310

---

4259

7280

22

170

97

El-daly [9]

This study

This study

1

0 100 200 300 400 500

23738 0C

23827 oC

TEMPERATURE (C)

SSC505

SSC-ZnOH

EA

T F

LO

W (

mW

)

Fig1 Eid etal

Figure

2

30 40 50 60 70 80

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Zn

O(0

02

)Z

nO

(10

1)

Sn

(31

2)

Sn

Sb

(10

4)

Sn

(41

1)

Sn

(42

0)

Sb

Sn

(11

3)

Sn

(32

1)

Sn

(40

0)

Sn

(11

2)

Sb

Sn

(20

2)

Sn

(30

1)

Sb

Sn

(00

3)

Cu

6S

n5

Sn

(21

1)

Sb

Sn

(11

0)

Sn

(10

1) a)SSC505

INT

EN

SIT

Y (

arb

un

its

)

2 (degree)

Sn

(20

0)

Sn

(22

0)

Sb

Sn

(01

0)

IN

TE

NS

ITY

(a

rbu

nit

s)

b) SSC-ZnO

Fig2 Eid et al

3

302 304 306 308 31 312 314 316 318 32 322 324 326

2 (degree)

Inte

ns

ity

(a

rbu

nt)

SSC505 SSC-ZnO

Fig3 Eid et al

4

Fig4 Eid et al

-Sn

-Sn

5

Fig5 Eid et al

Cu6Sn5

SbSn

Cu6Sn5

SbSn

6

0 1 2 3 4 5 6 7 8 9 10

Energy (keV)

Sn

Sn

SnSn

Sn

Sb

Sb

Sb

SbSn

+

+

(a)

0 1 2 3 4 5 6 7 8 9 10Energy (keV)

Sn

Sb

Sn

SnCuCu

Cu

Cu6Sn5

BA

+

Sn

(b)

0 1 2 3 4 5 6 7 8 9 10Energy (keV)

Sn

Sb

Sn

Sn

CuZn

Sn

(C)

CuO2

+

Fig6a-c Eid et al

7

000 005 010 015 0200

20

40

60

80

100

SSC505

ST

RE

SS

(M

Pa

)

STRAIN

SSC-ZnO

Room temperature

=4710

-4 s

-1

Fig7 Eid et al



solder alloys

Material Tm oC Ts

oC TL

oC T= TL-TS

oC

H

(kJkg)

Reference

Sn-5Sb

SSC505

SSC-ZnO

246

23738

23827

240

22345

22556

249

24733

24746

90

2388

2190

141

12552

8896

El-Dally[9]

This study

This study




Cu6Sn5 (IMC)

SSC505

(R2 = 0042)

R2

R

R

SSC-ZnO

(R2 = 0061)

SSC505

(R2 = 03337)

SSC-ZnO

(R2 = 06108)

SSC505

(R2= 04255)

SSC-ZnO

(R2= 07218)

d(nm) times d(nm)

(nm)

times d (nm) times

d(nm) times

d(nm) times

d (nm) times

116 10 99 55 693 300 116 565 754 346 205 588

Table


Zone

Composition Phase



+ (See fig 6a)

+ (See fig 6b)

+ (See fig 6c)

6543

7276

8359

6601

6161

4053

3457

368

875

3399

701

661

-------

2356

206

-------

2737

298

------

-------

351

-------

-------

494

-------

-------

360

-------

-------

1308

SnSb

Cu6Sn5

Eutectic



3) Reference

Sn-5wt Sb

SSC505

SSC-ZnO

7526plusmn0005

7553plusmn0006

7533plusmn0006

050

075plusmn017

087plusmn020

M El-Bahay [23]

This study

This study


s-1


Sn-5wt Sb

SSC505

SSC-ZnO

445

434

603

3550

7748

8635

2570

6468

7310

---

4259

7280

22

170

97

El-daly [9]

This study

This study

1

0 100 200 300 400 500

23738 0C

23827 oC

TEMPERATURE (C)

SSC505

SSC-ZnOH

EA

T F

LO

W (

mW

)

Fig1 Eid etal

Figure

2

30 40 50 60 70 80

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Zn

O(0

02

)Z

nO

(10

1)

Sn

(31

2)

Sn

Sb

(10

4)

Sn

(41

1)

Sn

(42

0)

Sb

Sn

(11

3)

Sn

(32

1)

Sn

(40

0)

Sn

(11

2)

Sb

Sn

(20

2)

Sn

(30

1)

Sb

Sn

(00

3)

Cu

6S

n5

Sn

(21

1)

Sb

Sn

(11

0)

Sn

(10

1) a)SSC505

INT

EN

SIT

Y (

arb

un

its

)

2 (degree)

Sn

(20

0)

Sn

(22

0)

Sb

Sn

(01

0)

IN

TE

NS

ITY

(a

rbu

nit

s)

b) SSC-ZnO

Fig2 Eid et al

3

302 304 306 308 31 312 314 316 318 32 322 324 326

2 (degree)

Inte

ns

ity

(a

rbu

nt)

SSC505 SSC-ZnO

Fig3 Eid et al

4

Fig4 Eid et al

-Sn

-Sn

5

Fig5 Eid et al

Cu6Sn5

SbSn

Cu6Sn5

SbSn

6

0 1 2 3 4 5 6 7 8 9 10

Energy (keV)

Sn

Sn

SnSn

Sn

Sb

Sb

Sb

SbSn

+

+

(a)

0 1 2 3 4 5 6 7 8 9 10Energy (keV)

Sn

Sb

Sn

SnCuCu

Cu

Cu6Sn5

BA

+

Sn

(b)

0 1 2 3 4 5 6 7 8 9 10Energy (keV)

Sn

Sb

Sn

Sn

CuZn

Sn

(C)

CuO2

+

Fig6a-c Eid et al

7

000 005 010 015 0200

20

40

60

80

100

SSC505

ST

RE

SS

(M

Pa

)

STRAIN

SSC-ZnO

Room temperature

=4710

-4 s

-1

Fig7 Eid et al


Zone

Composition Phase



+ (See fig 6a)

+ (See fig 6b)

+ (See fig 6c)

6543

7276

8359

6601

6161

4053

3457

368

875

3399

701

661

-------

2356

206

-------

2737

298

------

-------

351

-------

-------

494

-------

-------

360

-------

-------

1308

SnSb

Cu6Sn5

Eutectic



3) Reference

Sn-5wt Sb

SSC505

SSC-ZnO

7526plusmn0005

7553plusmn0006

7533plusmn0006

050

075plusmn017

087plusmn020

M El-Bahay [23]

This study

This study


s-1


Sn-5wt Sb

SSC505

SSC-ZnO

445

434

603

3550

7748

8635

2570

6468

7310

---

4259

7280

22

170

97

El-daly [9]

This study

This study

1

0 100 200 300 400 500

23738 0C

23827 oC

TEMPERATURE (C)

SSC505

SSC-ZnOH

EA

T F

LO

W (

mW

)

Fig1 Eid etal

Figure

2

30 40 50 60 70 80

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Zn

O(0

02

)Z

nO

(10

1)

Sn

(31

2)

Sn

Sb

(10

4)

Sn

(41

1)

Sn

(42

0)

Sb

Sn

(11

3)

Sn

(32

1)

Sn

(40

0)

Sn

(11

2)

Sb

Sn

(20

2)

Sn

(30

1)

Sb

Sn

(00

3)

Cu

6S

n5

Sn

(21

1)

Sb

Sn

(11

0)

Sn

(10

1) a)SSC505

INT

EN

SIT

Y (

arb

un

its

)

2 (degree)

Sn

(20

0)

Sn

(22

0)

Sb

Sn

(01

0)

IN

TE

NS

ITY

(a

rbu

nit

s)

b) SSC-ZnO

Fig2 Eid et al

3

302 304 306 308 31 312 314 316 318 32 322 324 326

2 (degree)

Inte

ns

ity

(a

rbu

nt)

SSC505 SSC-ZnO

Fig3 Eid et al

4

Fig4 Eid et al

-Sn

-Sn

5

Fig5 Eid et al

Cu6Sn5

SbSn

Cu6Sn5

SbSn

6

0 1 2 3 4 5 6 7 8 9 10

Energy (keV)

Sn

Sn

SnSn

Sn

Sb

Sb

Sb

SbSn

+

+

(a)

0 1 2 3 4 5 6 7 8 9 10Energy (keV)

Sn

Sb

Sn

SnCuCu

Cu

Cu6Sn5

BA

+

Sn

(b)

0 1 2 3 4 5 6 7 8 9 10Energy (keV)

Sn

Sb

Sn

Sn

CuZn

Sn

(C)

CuO2

+

Fig6a-c Eid et al

7

000 005 010 015 0200

20

40

60

80

100

SSC505

ST

RE

SS

(M

Pa

)

STRAIN

SSC-ZnO

Room temperature

=4710

-4 s

-1

Fig7 Eid et al

1

0 100 200 300 400 500

23738 0C

23827 oC

TEMPERATURE (C)

SSC505

SSC-ZnOH

EA

T F

LO

W (

mW

)

Fig1 Eid etal

Figure

2

30 40 50 60 70 80

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Zn

O(0

02

)Z

nO

(10

1)

Sn

(31

2)

Sn

Sb

(10

4)

Sn

(41

1)

Sn

(42

0)

Sb

Sn

(11

3)

Sn

(32

1)

Sn

(40

0)

Sn

(11

2)

Sb

Sn

(20

2)

Sn

(30

1)

Sb

Sn

(00

3)

Cu

6S

n5

Sn

(21

1)

Sb

Sn

(11

0)

Sn

(10

1) a)SSC505

INT

EN

SIT

Y (

arb

un

its

)

2 (degree)

Sn

(20

0)

Sn

(22

0)

Sb

Sn

(01

0)

IN

TE

NS

ITY

(a

rbu

nit

s)

b) SSC-ZnO

Fig2 Eid et al

3

302 304 306 308 31 312 314 316 318 32 322 324 326

2 (degree)

Inte

ns

ity

(a

rbu

nt)

SSC505 SSC-ZnO

Fig3 Eid et al

4

Fig4 Eid et al

-Sn

-Sn

5

Fig5 Eid et al

Cu6Sn5

SbSn

Cu6Sn5

SbSn

6

0 1 2 3 4 5 6 7 8 9 10

Energy (keV)

Sn

Sn

SnSn

Sn

Sb

Sb

Sb

SbSn

+

+

(a)

0 1 2 3 4 5 6 7 8 9 10Energy (keV)

Sn

Sb

Sn

SnCuCu

Cu

Cu6Sn5

BA

+

Sn

(b)

0 1 2 3 4 5 6 7 8 9 10Energy (keV)

Sn

Sb

Sn

Sn

CuZn

Sn

(C)

CuO2

+

Fig6a-c Eid et al

7

000 005 010 015 0200

20

40

60

80

100

SSC505

ST

RE

SS

(M

Pa

)

STRAIN

SSC-ZnO

Room temperature

=4710

-4 s

-1

Fig7 Eid et al

2

30 40 50 60 70 80

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Cu

6S

n5

Zn

O(0

02

)Z

nO

(10

1)

Sn

(31

2)

Sn

Sb

(10

4)

Sn

(41

1)

Sn

(42

0)

Sb

Sn

(11

3)

Sn

(32

1)

Sn

(40

0)

Sn

(11

2)

Sb

Sn

(20

2)

Sn

(30

1)

Sb

Sn

(00

3)

Cu

6S

n5

Sn

(21

1)

Sb

Sn

(11

0)

Sn

(10

1) a)SSC505

INT

EN

SIT

Y (

arb

un

its

)

2 (degree)

Sn

(20

0)

Sn

(22

0)

Sb

Sn

(01

0)

IN

TE

NS

ITY

(a

rbu

nit

s)

b) SSC-ZnO

Fig2 Eid et al

3

302 304 306 308 31 312 314 316 318 32 322 324 326

2 (degree)

Inte

ns

ity

(a

rbu

nt)

SSC505 SSC-ZnO

Fig3 Eid et al

4

Fig4 Eid et al

-Sn

-Sn

5

Fig5 Eid et al

Cu6Sn5

SbSn

Cu6Sn5

SbSn

6

0 1 2 3 4 5 6 7 8 9 10

Energy (keV)

Sn

Sn

SnSn

Sn

Sb

Sb

Sb

SbSn

+

+

(a)

0 1 2 3 4 5 6 7 8 9 10Energy (keV)

Sn

Sb

Sn

SnCuCu

Cu

Cu6Sn5

BA

+

Sn

(b)

0 1 2 3 4 5 6 7 8 9 10Energy (keV)

Sn

Sb

Sn

Sn

CuZn

Sn

(C)

CuO2

+

Fig6a-c Eid et al

7

000 005 010 015 0200

20

40

60

80

100

SSC505

ST

RE

SS

(M

Pa

)

STRAIN

SSC-ZnO

Room temperature

=4710

-4 s

-1

Fig7 Eid et al

3

302 304 306 308 31 312 314 316 318 32 322 324 326

2 (degree)

Inte

ns

ity

(a

rbu

nt)

SSC505 SSC-ZnO

Fig3 Eid et al

4

Fig4 Eid et al

-Sn

-Sn

5

Fig5 Eid et al

Cu6Sn5

SbSn

Cu6Sn5

SbSn

6

0 1 2 3 4 5 6 7 8 9 10

Energy (keV)

Sn

Sn

SnSn

Sn

Sb

Sb

Sb

SbSn

+

+

(a)

0 1 2 3 4 5 6 7 8 9 10Energy (keV)

Sn

Sb

Sn

SnCuCu

Cu

Cu6Sn5

BA

+

Sn

(b)

0 1 2 3 4 5 6 7 8 9 10Energy (keV)

Sn

Sb

Sn

Sn

CuZn

Sn

(C)

CuO2

+

Fig6a-c Eid et al

7

000 005 010 015 0200

20

40

60

80

100

SSC505

ST

RE

SS

(M

Pa

)

STRAIN

SSC-ZnO

Room temperature

=4710

-4 s

-1

Fig7 Eid et al

4

Fig4 Eid et al

-Sn

-Sn

5

Fig5 Eid et al

Cu6Sn5

SbSn

Cu6Sn5

SbSn

6

0 1 2 3 4 5 6 7 8 9 10

Energy (keV)

Sn

Sn

SnSn

Sn

Sb

Sb

Sb

SbSn

+

+

(a)

0 1 2 3 4 5 6 7 8 9 10Energy (keV)

Sn

Sb

Sn

SnCuCu

Cu

Cu6Sn5

BA

+

Sn

(b)

0 1 2 3 4 5 6 7 8 9 10Energy (keV)

Sn

Sb

Sn

Sn

CuZn

Sn

(C)

CuO2

+

Fig6a-c Eid et al

7

000 005 010 015 0200

20

40

60

80

100

SSC505

ST

RE

SS

(M

Pa

)

STRAIN

SSC-ZnO

Room temperature

=4710

-4 s

-1

Fig7 Eid et al

5

Fig5 Eid et al

Cu6Sn5

SbSn

Cu6Sn5

SbSn

6

0 1 2 3 4 5 6 7 8 9 10

Energy (keV)

Sn

Sn

SnSn

Sn

Sb

Sb

Sb

SbSn

+

+

(a)

0 1 2 3 4 5 6 7 8 9 10Energy (keV)

Sn

Sb

Sn

SnCuCu

Cu

Cu6Sn5

BA

+

Sn

(b)

0 1 2 3 4 5 6 7 8 9 10Energy (keV)

Sn

Sb

Sn

Sn

CuZn

Sn

(C)

CuO2

+

Fig6a-c Eid et al

7

000 005 010 015 0200

20

40

60

80

100

SSC505

ST

RE

SS

(M

Pa

)

STRAIN

SSC-ZnO

Room temperature

=4710

-4 s

-1

Fig7 Eid et al

6

0 1 2 3 4 5 6 7 8 9 10

Energy (keV)

Sn

Sn

SnSn

Sn

Sb

Sb

Sb

SbSn

+

+

(a)

0 1 2 3 4 5 6 7 8 9 10Energy (keV)

Sn

Sb

Sn

SnCuCu

Cu

Cu6Sn5

BA

+

Sn

(b)

0 1 2 3 4 5 6 7 8 9 10Energy (keV)

Sn

Sb

Sn

Sn

CuZn

Sn

(C)

CuO2

+

Fig6a-c Eid et al

7

000 005 010 015 0200

20

40

60

80

100

SSC505

ST

RE

SS

(M

Pa

)

STRAIN

SSC-ZnO

Room temperature

=4710

-4 s

-1

Fig7 Eid et al

7

000 005 010 015 0200

20

40

60

80

100

SSC505

ST

RE

SS

(M

Pa

)

STRAIN

SSC-ZnO

Room temperature

=4710

-4 s

-1

Fig7 Eid et al

Date post:	25-Dec-2015
Category:	Documents
Upload:	eidelsayed
View:	218 times
Download:	4 times

JMAD-S-14-06376.pdf

Documents