Joint Research Activity JRA 4

  Multi-coincidence detectors for low-energy particles

 

 Participating countries

France, Germany, Israel   

Tasks  

A)           Multi-pixel detectors for low-energy particles B)           CCD-camera based multifragment-detector development  C)           Optimization of the delay line technique D)           Crossed wire detector 

Coordinators:

Joachim Ullrich, Alexander Dorn

Max Planck Institut für Kernphysik, Heidelberg, Germany 

Interaction of energetic ions with matter:

• At least a few but usually many tens of electrons and ions are freed on a fs-time scale. • Many-particle imaging and detection systems become indispensable.• Present day detectors in many aspects do not fulfill the required specifications.

Well-adapted selection of solutions

Optimize the most promising and complementary concepts on the market

Develop new, more risky technologies

Joint Research Activity JRA 4:

Ion cluster collisionsC60

Observation of fragmentation and capture dynamics

Xe25+

Université Lyon Serge Martin et al.

target

recoil-ions

electrons

projectile

E-field

Sophisticated imaging techniques:

„Reaction Microscope“

Frankfurt, Heidelberg

Complete views of atomic reactions.

ne ~ 40~~~~~~~~~~~~>~~~~~~~~~~~~>~~~~~~~~~~~~>~~~~~~~~~~~~>

~~~~~~~~~~~~>~~~~~~~~~~~~>~~~~~~~~~~~~>~~~~~~~~~~~~>~~~~~~~~~~~~>~~~~~~~~~~~~>~~~~~~~~~~~~>~~~~~~~~~~~~>

Collisions with ions, electrons, laser and FEL pulses

E0 = 2000 eV|q| = 0.5 a.u.

Eb = Ec = 5 eV

ak

0k q

c

b

Electron impact double ionization (e,3e)

59 – 64 53 – 5948 – 53 43 – 4837 – 4332 – 3727 – 32 21 – 27 16 – 2110 – 16 5 – 10 0 – 5Eq

q

q

q

Coulomb explosion imaging

Max-Planck-Institut für KernphysikHeidelberg,Weizmann Institut, RehovotD. Zajfman et al.

Direct experimental determination of the molecular structure

Three-dimensional element mapping with a subnanometer spatial resolution.

Tomographic Atom Probe (TAP)

Université de ROUEN B. Deconihout et al.

HV pulse

Field ion microscope

Ion surface collisions

Institut für Kernphysik, Frankfurt Horst Schmidt-Böcking, T. Jahnke

Potentially hundreds of simultaneously hitting particles can be detected with a 20-30 position resolution and sub-ns time resolution

Presently there is no ideal read-out and electronic processing concept being able to fully exploit the MCP specifications.

Key role: The particle detector

m

Task A     Multi-pixel detectors

A. Dorn, MPIK, Heidelberg

Task B     CCD-camera based detectors

D. Zajfmann, WIS, Rehovot

Task C   Optimization of the delay line technique

O. Jagutzki, ROE, Kelkheim

Task D     Crossed wire detector

H. Rothard, CEA, CIRIL/Caen

Task A: Multi-pixel detectors

Independent readout of a large number of anode-pixels

+ direct approach + good multi-hit capability, (parallel processing)

- costly, large number of electronic processing channels

64 pixel MCP detector with parallel TDC and ADC readoutCNRS-IPNO, Orsay

256 pixel semi-conductor detector CNRS-LASIMLyon

8196 pixel detector

MPIK Heidelberg

Workpackage 1 Workpackage 2 Workpackage 3

- up to 8192 pixels - simultaneous time and amplitude processing- semiconductor pixel detector

Existing versions 256 (16x16) pixelsat most

NewLEIF

Excellent time resolution and signal processing rate at relaxed multi-hit capacity and low position resolution

Realization:

• Fast charge preamp. on board• Usage of ASICs (TDC) developed by CERN

CNRS-IPNO, Institut de Physique Nucléaire, Orsay

A detector for mass spectroscopy purposes for processes with high ion yields (many simultaneously hitting ions)

S. DellaNegraR. Selem

64 pixels, each with TDC and ADC channels

Specifications:

• 150 ps timing resolution• 2 to 4% energy resolution (analysis of the pulse hight distribution allows to determine the number of ions hitting one pixel)• dead time < 20 ns• time range 10 to 2 ms (heavy ions)• read-out rate up to 100 kHz• PCI,USB2 standard

s

Multi-pixel semiconductor detector with moderate position and good time-resolution at potentially high data-processing rates

Passivated Implanted Planar Silicon (PIPS) Detector

? Heigh threshold: tens of keV? Large integration time: microssec.? Low position resolution

• Detection of electrons accellerated to 20 keV • Signal amplification and serial data transfer with ASICs • Up to 256 individual elements

Canberra Inc.

CNRS-LASIM, University Lyon Serge Martin et al.

surface barrier silicon detector

Specifications:• ns timing resolution• Position resolution few 100 • Energy resolution sufficient to identify the number of electrons impinging on one pixel• 16 hits per pixel in a 100 ns time window • Relaxed vacuum requirements compared to MCP

m

10 ns

100 MHz samplingof 25 ns wide preamppulse

MPIK –Heidelberg

write

read

preamplifier pulse shaping

analogpipeline

1 of 160 cellspixel

1 of 128 channels

multiplexer4x 32 to 1

to vacuum-feedthrough,ADC

Up to 8192 pixels individually read-out in time and amplitude by ASICs with 128 channels each.

Germanium layer

vacuum separationceramics

induced charge

A. Dorn, J. Ullrich

• 1 ns timing resolution• < 0.2 mm position res. (0.8 mm pixel size)• No dead-time for > 3 mm, 20 ns for smaller distances• 5 hits per pixel

x

-> Improved version of the Beetle chip

First detector version with 80 mm diameter and 2048 pixels (16 chips) anode. Second version 8192 pixels (64 chips). (CERN LHCb: 450 000 channels)

Optimum multi-hit capacity at good signal processing rate and moderate time and position resolution

Beetle chip,developed byMPIK and Kirchhoff institute Heidelbergfor LHCb at CERN

Task C: Optimization of the delay-line technique

+ simple concept, low complexity and costs

+ high data processing rates

+ good time and position resolution

- restricted multi-hit cabability

Optimization of the delay-line conceptROE, Roentdek company

One workpackage:

ROE, Roentdek companyOttmar Jagutzki et al.

Good signal processing rate, good position and time resolution at relaxed multi-hit capacity.

NewLEIF developements:

• improved delay-lines• faster electronics, flash ADCs/faster multi-hit TDCs

x

y

z

MCP stack

Phosphorscreen

CCD-camera

computer

+ good position resolution

- timing has to be performed separately

- noise

- slow data readout (frame rate < 100 Hz)

Timing with segmentedanode

timing resolution < 1ns for all events on different positions

NewLEIF

Purely CCD based concept

WIS, Weizmann InstituteRehovot

CCD readout combined with delay-line techniqueCNRS – GPM Université de Rouen

Workpackage 1 Workpackage 2

Task B: CCD-camera based multifragment-detectors

WIS –Rehovot

P1

P2

P1

P2

Oded Heber, Daniel Zajfmann

A purely CCD based concept

P1

P1

P2

P2

ShutterMCP + Phosphor screen

far close

Example: Letters illuminated by a single ns laser pulse

Envisaged specifications:

+ timing resolution down to 0.2 ns+ position resolution down to < 0.05 mm+ no dead time for different positions

- no multi hit detection for the same position- low signal processing rate < 100 1/s

Optimum time-, position and multi-hit capacity at low signal processing rates

CNRS – GPM, Université de ROUEN :

Optimum time-, position and multi-hit capacity at low signal processing rates

+ timing resolution down to 0.07 ns+ position resolution down to < 0.1 mm+ no dead time for different positions

- low signal processing rate < 100/s

Phosphor screen

2 GHz digitalisation

2 ns

Delay-line

CCD readout combined with the delay-line techniqueB. Deconihout et al.

Task D: Crossed wire detector

+ simple concept

+ moderate number of signal lines / electronic units

+ no dead time for different x,y positions

- restricted multi-hit cabability

Improved crossed wire detector

CEA, CIRIL, CaenUBI, University Bielefeld

One workpackage

CEA, CIRILUBI, University Bielefeld Improved crossed wire detector

Present specifications: timing resolution down to 0.2 nsposition resolution 2.5 mm

x

y

printed circuit board 16x16 „wires“

2.5 mmNewLEIF developments:

• UHV compatibel anode

• improvement of the electronics to achieve higher count rates

Cost effective readout scheme with good timing resolution, low position and moderate multi-hit resolution

H. Rothard, U. Werner et al.

General CoordationJ. Ullrich, 4 MPIK

A. Dorn, 4 MPIK

Task AA. Dorn, 4 MPIK

S. Della-Negra, 14 IPNO

Task BD. Zajfmann, 16 WIS

B. Deconihout, 14 GPM

Task CO. Jagutzki, 12 ROE

B. Deconihout, 14 GPM

Task DH. Rothard, 1 CEA

U. Werner, 21 UBI

Working visits,Joint publications

Working visits,Joint publications

Working visits,Joint publications

Working visits,Joint publications

Newsletters,Workshops,

Annual reports

Management Structure

• Two JRA4 meetings will be held per annum as part of a larger I3 meeting • Progress reports• Working visits • Website as a subsection of the proposed I3 website

Monitoring and reporting progress

• Annual progress reports are given by the task managers• Monitoring of delivery of milestones• Evaluation after 18 month• NewLEIF newsletter • Monthly updates of the JRA4 part of the NewLEIF homepage

Communication