Kokomo Operations of GM Components Holdings, LLC

1GM Components Holdings, LLC Kokomo Operations

Kokomo Operations Overview www.kokomogmch.com

Brian King Business Development Manager, Kokomo Operations (765) 451-9904, [email protected]

Tim Guse Business Development Manager, Electronic Assembly, Thick Film Printing (765) 451-9188, [email protected]

Greg Bozarth Business Development Manager, Semiconductors (765) 451-7142, [email protected]


Bypass Campus



History

1930’s– Haynes – Home Avenue Building 1930’s– Crosley – home radios– Delco Radio – 1936

1940’s– Military production supporting war effort– Speaker, household radios

1950’s– Administration Building added– All-transistor radio introduced

1960’s– Plant 8 opens in 1962– Plants 7 & 9 open in 1965– AM/FM radio, AM/FMST/Tape player– automatic HVAC control

1970’s– Electronic ignition– Delco Electronics Division of GM - 1970– Seat belt interlock– ETR – Electronically Tuned Radio– ESC – Electronic Spark Control– ECM – Engine Control Modules

1980’s– Semiconductors– Fab III opens in 1983– Speaker production ceases– PASS-Key anti-theft device– Delco Electronics Corporation, Subsidiary of

Hughes Electronics – 1986– AM/FMST/Compact Disc– BCM – Body Computer Modules

1990’s– 50-millionth ECM produced– Monsoon high-end audio brand– QS-9000 registration– ISO 14001 Environmental certification– Delphi Delco Electronics Systems – 1999– Consolidation to Bypass site– SDM – Sensing & Diagnostic Modules

2000’s– PODS – Passive Occupant Detection System– Delphi Electronics & Safety – 2004– Audio production ceases– Power Electronics products– Consolidated Milwaukee ECMs, BCMs– GM Components Holdings, LLC - 2009


Formation of GM Components Holdings, LLC

Delphi Reorganization – October 7, 2009.

General Motors purchased four U.S. Manufacturing sites from Delphi to create GM Components Holdings, LLC (GMCH).

GM Components Holdings, LLC includes:– Kokomo, IN – automotive electronics, integrated circuits products– Grand Rapids, MI – powertrain products– Lockport, NY – heating, ventilation & air conditioning products– Rochester, NY – powertrain products

GMCH owns the facilities and manufacturing support in Kokomo formerly owned by Delphi Electronics and Safety.


Kokomo Operations

Plant population– Hourly – 726 employees – Salaried – 328 employees

» 127 Engineering

3 Manufacturing Areas– Electronic Assembly Operations– Thick Film Printing– Semiconductors


Facility Key Facts

Facility – 3M + Square feet

» EA 2.5M Sq ft (temp/humid control)» Thick Film Print 42K sq ft (Cleanrooms)» Semiconductors 500K sq ft (Cleanrooms)

– 5 Cleanrooms» 8” Semiconductor - Class 1» 5” Semiconductor - Class 10» Wafer Bumping - Class 100» Wafer Testing - Class 1000» Thick Film Printing - Class 10K


Electronic Assembly Processes Surface Mount

– 18 SMT Lines (16 laminate, 2 hybrid)– Single or double sided capability– Standard reflow Pb or Pb free– Wave soldering– Selective soldering

Highly Reconfigurable Assembly Cells– Adhesive dispense– Conformal coat– Auto/semi-auto/manual assembly– “Smart” screw-driving– Wire bonding: Au and Al

Test– In circuit– Functional– Programming– Conditioning


Current Electronic Assembly Products

Body Control Module - BCM

Engine Control Module – ECMTransmission Control Module – TCM

Sensors

Sensing Diagnostic Module– SDMBelt Alternator Starter (BAS+)


Precision Fabrication CenterFabrication from tooling and fixtures to entire machines. Precision Sheet Metal Fabrication 3D Modeling (Unigraphics) CNC and General Machining Wire Electrical Discharge Machining (EDM) Laser Cutting Fabrication Precision Welding Stereolithography (SLA) Urethane Rubber Molding Plastic Injection Molding Stamping Press Capability Quartz Glass Fabrication and Repair Custom Designed Cabling


Thick Film Printing Processes

Typical Base Materials– Alumina (typical ceramic material) – AlN (high-power applications)– Stainless Steel (specialty)

Low to High-Volume Production– Standard substrate sizes 3.25”x5.5” or 6”x8”– Multi-layer printing including multiple metal levels– Through hole printing– Double sided printing– Resistor printing and trimming– Thermistor printing and trimming– Fixed probe or Flying probe testing

In-house capability to develop and produce custom inks for specific applications.

– Including sense resistor technology down to 8 milliohm.


Why Thick Film?

Hybrid thick film is typically chosen for high reliability applications, harsh environment or high power dissipation applications.

– Used extensively in Automotive, Military and Aerospace applications as well as high-power applications.

Hybrids typically run single digit ppm.

Significant cost advantage over LTCC– Can provide a significant savings over comparable

LTCC technology up to 30 print layers. Ceramic Substrates


Kokomo Operations Thick Film Advantage

Largest volume thick-film production facility in the world has created significant price advantages with material suppliers

– Ceramic and Ink make up the largest portion of overall costs.– Kokomo printer cycle times 4 sec/print. – Industry average 12-15 sec/print.

Direct Screen Imaging– Capable of 3mil lines and 5mil spaces. Well beyond industry average. – Small via openings (6mil) allow true multi-level metal capability.– Provides lead time advantage over competitors.

Our LAS technology allows us the capability of printing on the largest ceramic in the industry

– Advantage of higher circuit count for the same labor content.

Ultra Thick Thick Film Capability– Ultra Thick Thick Film (UTTF > 50 microns thick in one print) is technology that was

developed here that could provide significant cost and thermal advantage in power electronics (vs. thick plated or clad technology).


Semiconductor Products/Processes

Application Specific Integrated Circuits (ASIC)– Complimentary Metal-Oxide Semiconductor (CMOS)– Bipolar– BiCMOS– SmartPower (BCDMOS)– MEMS

Discrete– Discrete Metal-Oxide Semiconductor (DMOS)– Insulated Gate Bipolar Transistor (IGBT)– Diodes


Quality Certifications

– TS16949/ISO9001– ISO 14001

Awards:– JD Powers– Shingo

On site certified metrology and calibration Six Sigma and Shainin master problem solvers on site Failure Analysis Capability

– Multiple electrical analysis labs– Scanning Electron Microscope (SEM)– Elemental analysis– Cross sectioning– Sono-scan– X-ray– FTIR


Summary

Very robust manufacturing capabilities designed for high reliability products.

Strong technical team.

Expertise in building high quality automotive-grade electronics suitable for demanding operating environments.

Vertical Integration opportunities.– Wafer Fabrication– Thick Film Printing– Electronics Assembly

www.kokomogmch.com

Date post:	21-Jan-2015
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