SYNOVAVA

Incorporating Laser MicroJetIncorporating Laser MicroJet®® Technology Technology

LASER CUTTING SYSTEMLASER CUTTING SYSTEMLASER CUTTING SYSTEMLASER CUTTING SYSTEM

bilities with the Latest Developmebilities with the Latest DevelopmeExpand your CapabExpand your Capab nt in Laser Technologynt in Laser Technology

LCS 300LCS 300

The Laser Microjet® surpasses laser

cutting and water cutting technologies.

The laser beam is contained within a

hair-thin water jet through total

reflection.

Machined parts are cooled by the

water jet at the cutting face, producing

what is effectively "cold laser cutting".

The resulting minimal thermal damage

ensures that almost no structural

changes occur during machining.

Low water jet pressure ensures that

virtually no mechanical force is exerted

during processing, allowing rapid,

trouble-free production of delicate and

composite parts.

Precise, parallel cutting is achieved over

the entire depth of the workpiece,

even with porous or layered materials,

leaving a fine, clean surface.

Complex 3-D cutting is possible due to

the long working distance and

constantly focused, parallel laser beam.

Extremely hard and brittle materials

can be machined rapidly and with high

precision.

In short, the Laser Microjet®

signif icantly expands your micro-

machining capabilities, especially with

difficult-to-machine parts.

500 micron wide hole drilled in

150 micron thick stainless steel

Cut edge of 650 micron thick

pacemaker PCB

Half polished, half ground Si wafer 75 micron thick groove machined in

PV Si-solar cell

The Laser MicroJet®

Cold Laser Cold Laser Power for:Power for:

CuttingCutting

GrindingGrinding

DrillingDrilling

GroovingGrooving

ScribingScribing

New Capabilities

Electronics

Complex, multi-layer PCB's & chip scale packages can be cut

economically to high precision. Ultra-precise stencils for

screen printing can be cut with no deformation of the sheet,

and no post-treatment being required. Air gaps of ferrite

cores can be machined rapidly with high precision, ensuring

ultra-low running costs.

Medical

Metal endoscope parts, micro-needles, and implants can all

be produced to very high precision with an excellent surface

finish. Scalpel blades made of silicon can be manufactured

economically and with a perfect cutting edge.

Tooling

Super-hard materials such as CBN, silicon nitride or synthetic

diamond employed in cutting tools can be manufactured very

economically. Advantages of the Laser Microjet include a high

cutting speed, very low tolerances, a smooth surface and no

thermal damages, all ensuring constant results.

Automotive

Complex parts such as catalytic converters can be cut with

no material deformation and minimal thermal damage to

active materials. Injection nozzles can be drilled to very high

tolerances and surface finishes.

Energy

Solar PV Si-cells with contoured edges can be cut out with no

mechanical stress, chipping, heat damage, or changes to

electrical properties. Further advantages over conventional

sawing include low running costs, higher quality, and very

high flexibility. Additional applications include turbine blades

and parts for nuclear energy.

Semiconductor

Economical, high quality cutting of silicon power

semiconductors is achieved with the Laser Microjet.

Advantages over conventional lasers and saws include a

smooth edge, no burrs, no thermal stress, and no micro-

cracks or chipping. Additional processes include drilling,

grooving, scribing, edge grinding, thinning and marking.

The LCS 300

The Water JeThe Water JeLaser SLaser S

Ease of Use

A large colour TFT flat screen with touch panel

allows comfortable operation of all machine

functions. Using the latest generation of real-time

processors has enabled an entirely new concept in

CNC control and man-machine communication.

Fast Process Control

Due to the integration of the latest software in image

processing, nothing is faster in the market for

alignment and quality control. Work piece alignment

and quality checking are executed in milliseconds.

Low Cost of Ownership

LCS 300 employs Laser Microjet®

technology, eliminating the need for

expensive tools. LCS 300 has only

negligible needs for consumables. In

fact, the laser beam has no wear,

and water consumption is

negligible.

0 at a glance

et - Guided et - Guided SystemSystem

High Accuracy

A stable structure made of granite is the key to high

precision, ensuring an outstanding, dynamic

response. Linear motors are used to achieve high

speed and accuracy.

Reliability

LCS 300's component parts are backed by the

reliability of our carefully chosen suppliers, each one

a market leader within his own field. In addition, a

vast array of sensors provides constant control and

allows continuous diagnostic transparency through a

modem connection.

LCS 300's Laser Microjet® has

negligible tool wear, enabling

reliable machining of components

to exact tolerances, batch after

batch. The Laser Microjet®

eliminates heat damage associated

with conventional lasers. The

dimensions and finish of machined

parts are excellent, with no burrs,

contamination or slag.

Unmatched Cutting Quality

General Specifications LCS 300

AXESType XY-Table with separate axes on granite baseDrive Linear motorsUseable working area 300 x 300 mm Maximum stroke (X x Y) 600 x 400 mm Accuracy < 0.003 mmRepeatability < 0.001 mmMaximum axis speed 600 mm/sMaximum acceleration 20 m/s2

Index 0.0001 mm

LASER Type Solid state Nd:YAG, pulsedAvailable Wavelengths 1064 nm, 532 nmAverage power 100 W, optional 200 WLaser beam transmission Optical fiber 0.200 mm, length 10 m

WATER PUMP Type Two-cylinder pressure amplifierAverage Water flow 0.05 l/minWater pressure 50 to 500 bars (5 to 50 Mpa)Pressure transmission Flexible water hose

OPTICAL HEADType Projection of fiber exit into water jet nozzleImage ratio 4:1, 6:1 or 8:1Nozzle diameter 0.050 mm, 0.075 mm or 0.100 mmAlignment Vision controlled

VISION SYSTEMType Image matchingMagnification Two-level (high/low magnification)Optical magnification x 0.5 to x 5.0Illumination Coaxial and ring light, fiber-coupledAutomatic alignment method Image processing, alignment time < 5 sQuality control Kerf check by image analysis

UTILITIESElectrical power 3 x 400 V or 3 x 200 V, 50/60 HzTotal power consumption 20 kVA Air pressure 5 - 6 bars, oil freeLaser cooling water Max. 25 l/min, max 16°C, industrial water Average DI-Water flow for cutting 0.05 l/min, < 0.3 mm, degasifiedDI-Water flow for cleaning Max. 1 l/min, DI-water, particles < 0.0003 mm

DIMENSIONS/WEIGHTBasic machine (W x D) LCS 300: 1100 x 900 mm, 1100 kg Laser (W x D) 2550 x 650 mm, 900 kgWater pump (W x D) 1300 x 700 mm, 350 kg

Options

200 V/400 V transformer Vacuum pumpWater treatment systemLaser chiller20 m fibre length Z-axisRotary axis2D-Reference plate 0.001 mm precision

The above specifications are subject to change without notice due to technical improvement.The Laser Cutting System incorporates the worldwide patented technology of water jet guided laser, invented at the Swiss Federal Institute of Technology Lausanne, Switzerland.

This machine conforms to CE and CDRH regulations.

CORPORATE HEADQUARTERSYNOVA SAChemin de la Dent d'OcheCH - 1024 EcublensTel (41) 21 694 35 00Fax (41) 21 694 35 01email info@synova.chhttp://www.synova.ch

EUROPE SYNOVA SAChemin de la Dent d'OcheCH - 1024 EcublensTel (41) 21 694 35 00Fax (41) 21 694 35 01http://www.synova.chSales OfficeTel (41) 21 694 35 13Fax (41) 21 694 35 01email info@synova.chTechnology CenterTel (41) 21 694 35 17email test@synova.ch

USAContact SYNOVA SAPending the opening ofSYNOVA Inc.

JAPANItochu Mechatronics Co.2-8-4, Nihonbashi-horidomechoChuo-ku,Tokyo ,103-0012http://www.itcm.co.jpSales Office Tokyo Tel (81) 3 5640 0724Fax (81) 3 5640 0741email y-iwata@itcm.co.jpSales Office OsakaTel (81) 6 6252 0601Fax (81) 6 6552 0610email h-okada@itcm.co.jpSales Office NagoyaTel (81) 5 2211 3673Fax (81) 5 2202 0385Email m-ooshiro@itcm.co.jpTechnology CenterTel (81) 5 66 83 22 29

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