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7/28/2019 LDS Introduction
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Laser Direct Structure
Shenzhen V-ON Magnetic Electronic Technology CO.,LTDhttp://www.vonant.net/
Email:[email protected]
http://www.vonant.net/http://www.vonant.net/http://www.vonant.net/http://www.vonant.net/7/28/2019 LDS Introduction
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Laser Direct Struc tu re(LDS)Laser Direct Struc tu re(LDS)
Confidential Proprietary
Index
1. General introduction2. Intellectual properties
3. Process and Technology specification
4. New LDS Materials
5. Tech Application
MI (Mechanics-Integrated ) Antenna
LDS with different paintings
LDS in automotive and camera applications
6. Manufacture lead time and capacity
Section 1
Section 2
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General introduction
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General introduction
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General introduction
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Main Process
Materials preparation
Injection molding
Laser activation
Electroless plating
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Material VI in house
Outsourcing to various tier
suppliers
Equipment 1.7 million RMB 3.6 million RMB
Cycle time 50mm/s 50mm/s
Efficiency High High
Yield about 95% about 95%On line test < 6S < 6S
The raw material of injection molding and
electroless plating chemicals are made by V-ON .The Laser equipment is developed by V-ON.
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S W
OT
1. V-ON developed total solution on raw
material, laser activation and plating .
2.Innovated the first class surface pattern +paintingtechnique.
3. Developed a series material which can be used for LDS
technology (Such as :PC/ABS,PC+GF,PP,PBT
etc).
4.Owned a series of forming technology
(For example : single shot, two shot,
insert-molding etc.)
5.Applied the Material patent
6.Have set up a experienced team for
technology development
7.Fast and flexibility sample preparation
(leadtime:7 days after the pattern release).
1.BASF,SABIC etc famous Chemical
company push the material whichsuitable for LDS
2.Large area part exist the productivity
issue while have the competition on cost
breakdown with other surface
metallization technology such as:
PVD,CVD etc.
1.Limition of the client resource.
2. V-ON Brand among materialmanufacturer.
1.3D Antenna have showed the excellent
performance ,which drive the
dramatically use of the LDS
technology on smart phone market.
2. The great market potential on Other
section. Such as :The B/T earphone,dental equipment, socket, PLC, ECU of
motor and Auto ,RFID etc.
3.Cost performance advantage on 3D
design
4.No pollution process can match with
the environment need.
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2.Intellectual Properties
1. LDS owned by V-ON is a selective activation platingtechnology. Which use energy beams to sublimatethe selective plastics area so as to expose specialnano-size particles encapsulated in the polymermatrix which is very efficient to promote the
electroless plating, so only the selected area couldbe plated .
2. Processing: Polymercompounding moldingsublimation of the selective plastics area
electroless plating Cu or Ni-Cu electroless platingNi plating Au
3. Application:Manufacture complicated 3D circuits.
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Chinese Patent of LDS
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Applicable Materials
1. Currently, PC/ABS and PBT (for high temperature
application) have been tested to be applicable in
antennas. PPA may be more suitable in other applications
such as automobiles and semiconductors. SPS may be
the most ideal materials for antenna application, which is
under development.2. CRI at V-ON has strong competence in designing and
preparing materials for various applications.
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Material Test
Material characteristics Comparison between the V-ON PC/ABS and general PC/ABS.
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Material Test
Material characteristics Comparison between the V-ON PC/ABS and
general PC/ABS.
With moderate fluidity & high toughness, LDS materials could be shapedby extrusion or injection process, then people could design patternsflexibly on shaped articles via laser, cutting, burnishing, plasma, electronbeams.
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3. Process and Technology specification
Laser Activation Process
Materials
preparation
Injection
molding Laser activation Electroless plating
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Laser Activation
350*350
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Laser Activation
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Metallization
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4 . New LDS Materials
1. PA based Material will be used for high strengthcondition.
2. PC+GF based material will be used for the
current mobile-phone housing .
3. which need to match the mechanicalperformance.
4. High toughness PC/ABS based material will be
used for the secondary housing part.
L Di S (LDS)L Di S (LDS)
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New LDS Materials studying
L Di t St t (LDS)L Di t St t (LDS)
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New LDS MaterialsPI Material
L Di t St t (LDS)L Di t St t (LDS)
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New LDS MaterialsPTFE Material
L Di t St t (LDS)L Di t St t (LDS)
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5. Applications ----MI Antenna
Solution 1:
2K mold LDS
Solution 2:
PC + GF LDS
Single shot
L Di t St t (LDS)L Di t St t (LDS)
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LDS Max Space Utility
Conclusion:
With LDS antenna design, overall RF performance improvement on Eve is observedcompared to the original FPC antenna.
GF in the back cover has impact on LDS antenna performance. By removing it, further
performance improvement could be achieved.
FPC antenna LDS antenna designed by V-ON
FPC Sample LDS Sample
L Di t St t (LDS)L Di t St t (LDS)
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Section 2application of LDS
Shenzhen V-ON Magnetic Electronic Technology
CO.,LTD
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LDS antenna samples
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Applications -----MI Antenna Molding
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Antenna Test Facility
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LDS with different paintings
LDS materials decoration can be achieved viapainting , e.g. high gloss, matt finish, soft-touch,
multi-coloured painting.
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LDS paintings
Both LDS antenna and plastic can be painting , andpainting oil has good adhesion on the two parts.
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LDS tech. of painting without mark
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LDS tech. of painting without mark
We obtain no mark with plating samples with high gloss and
matt finish effects, which can meet the requirement of class 1.
No Marking painting
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LDS tech. of Via-hole without mark
Advantages in three aspects.
Innovation points:Free and credible feed-in method by sealing and polishing.
Realizing no mark for via-hole by common painting process.
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LDS In automotive applications
Car radio crash components with high reliability
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LDS In automotive applications
Light sensor
Locomotive detection sensor
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LDS In camera applications
Typical Structure
Of Cameras
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LDS In camera applications
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LDS In Aerospace applications
Hybrid manufacturing process:3D Prints + LDS.
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6.Manufacture lead time and capacity plan
Calculation based on Injection machine: 500K/month/set
Laser machine: 500K/month/3 sets
Plating line: 2M/month/line
RF Tester: 300K/month/set
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6.Manufacture lead time and capacity plan
Process Equipments 2011 2012 2013 2014 2015
Molding Inject Machine 1 2 6 8 12
Laser Laser Machine 1 2 4 8 16
Plating Plating line 1 1 1 3 5
RF Test RF Tester 1 2 2 4 6
0
2000
4000
6000
8000
10000
12000
2011 2012 2013 2014 2015
LDS CapacityUnit: Kpcs/month)
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Thank You For Attention
A V-ON-patented LDS manufacture technology
combining material preparation, equipment design
and process innovation.