Date post: | 18-Dec-2015 |
Category: |
Documents |
Upload: | buck-norris |
View: | 222 times |
Download: | 1 times |
Computer is a simple machine, in principle! Add Subtract Count Switching
Pass information for one place to another CPU to RAM
Bus = Communication with Equipment Hard Drive / RAM
At the circuit level Computers use Binary Math; a switch is either on or off
Instructions in Binary math = Machine Language
What is Hexadecimal math?
Computer Components - I Mother Board
Memory (RAM) (128 mbyte, 256 mbyte, 512 mbyte, 1024 mbyte)
Serial Communications Bus CPU with math coprocessor
and memory cache (512 k byte) Battery Clock = counting circuit
Computer Components - II Connections for
Key Board Mouse Hard Disk Drive (20-120 Giga byte) Floppy Drive (2 Mega byte) Zip Drive (100/250 Mega byte) CD Rom (650 Mega byte) DVD (4.7 Giga byte) Video Card that Drives Monitor (analogue) Sound Card that Drives Speakers (analogue) Modem Card (digital) Ethernet Card(digital) A-to-D/D-to-A Card = Data Acquisition Card IEEE bus = external communications
What does a ChE need to know to work in materials processing? Materials Nomenclature Materials are High Purity Chemicals
Silicon = 99.9999% pure Structure is Important Defects in the Structure are Important Trace Impurities Play a Critical Role
Where they are in the structure is also critical
Course Overview Physics of Solids
Materials Properties Device Physics
Materials Processing of Silicon Chips Photolithography Deposition / Etching Implantation Planarization
Course Overview Materials’ Properties
Structure – Metals, Oxides, Semi-conductors
Electrical Properties – Metals, Oxides, Semi-conductors
Other Properties – Piezo, magnetic, ferro-electric
Device Physics Conductor Resistor Capacitor Diode Transistor
Chip Devices Structures Memory CPU/Switches Multi-layer
Interconnects barrier layers
Limits on Computer speed
Course Overview - Chemical Engineering in Processing of Silicon Chips
Wafer Fabrication Doping Wafers
Diffusion Implantation
Patterning Spin Coating Photo-resist Development Photo-resist dissolution
Etching Deposition
Oxides Silicon Metals
Multi-layer Interconnects Patterning Deposition
Chemical Mechanical Polishing/Planarization