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Lecture 2 1 ECE 412: Microcomputer Laboratory Lecture 2: Design Methodologies.

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Lecture 2 1 ECE 412: Microcomputer Laboratory Lecture 2: Design Methodologies
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Page 1: Lecture 2 1 ECE 412: Microcomputer Laboratory Lecture 2: Design Methodologies.

Lecture 2 1

ECE 412: Microcomputer Laboratory

Lecture 2: Design Methodologies

Page 2: Lecture 2 1 ECE 412: Microcomputer Laboratory Lecture 2: Design Methodologies.

Lecture 2 2

Objectives

• Have a feel for the different technologies that can be used to implement a design– Both hardware technologies and implementation methods

Page 3: Lecture 2 1 ECE 412: Microcomputer Laboratory Lecture 2: Design Methodologies.

Lecture 2 3

LOGIC

MEMORY

Page 4: Lecture 2 1 ECE 412: Microcomputer Laboratory Lecture 2: Design Methodologies.

Lecture 2 4

Graphical illustration of Moore’s law

1981 1984 1987 1990 1993 1996 1999 2002

Leading edgechip in 1981

10,000transistors

Leading edgechip in 2002

150,000,000transistors

• Something that doubles frequently grows more quickly than most people realize!– A 2002 chip can hold about 15,000 1981 chips inside itself

Page 5: Lecture 2 1 ECE 412: Microcomputer Laboratory Lecture 2: Design Methodologies.
Page 6: Lecture 2 1 ECE 412: Microcomputer Laboratory Lecture 2: Design Methodologies.

Intel i4004

2,300 transistors

Page 7: Lecture 2 1 ECE 412: Microcomputer Laboratory Lecture 2: Design Methodologies.

Intel i486DX2

1,200,000 transistors

Page 8: Lecture 2 1 ECE 412: Microcomputer Laboratory Lecture 2: Design Methodologies.

SUN Ultrasparc

5,400,000 transistors

Page 9: Lecture 2 1 ECE 412: Microcomputer Laboratory Lecture 2: Design Methodologies.

Pentium 4

55,000,000 transistors

Page 10: Lecture 2 1 ECE 412: Microcomputer Laboratory Lecture 2: Design Methodologies.

Intel Core 2 Duo

291,000,000 transistors

Page 11: Lecture 2 1 ECE 412: Microcomputer Laboratory Lecture 2: Design Methodologies.

Lecture 2 11

Design Productivity Gap• 1981 leading edge chip required 100 designer months

– 10,000 transistors / 100 transistors/month

• 2002 leading edge chip requires 30,000 designer months– 150,000,000 / 5000 transistors/month

• Designer cost increase from $1M to $300M

10,000

1,000

100

10

1

0.1

0.01

0.001

Logic transistors per chip

(in millions)

100,000

10,000

1000

100

10

1

0.1

0.01

Productivity(K) Trans./Staff-Mo.

1981

1983

1985

1987

1989

1991

1993

1995

1997

1999

2001

2003

2005

2007

2009

IC capacity

productivity

Gap

Page 12: Lecture 2 1 ECE 412: Microcomputer Laboratory Lecture 2: Design Methodologies.

Lecture 2 12

Increasing Design Abstraction• Old way: specify/layout each device by hand

– Early chips were laid out by cutting patterns in rubylith with knives

• Current State of the Art: Combination of synthesis and hand design– Specify entire system in HDL (Verilog or VHDL), simulate, and test– Use synthesis tools to convert non-performance-critical parts of the design to

transistors/gates– Human designs critical components by hand for performance

• Depending on how critical it is (tools can deliver as well for some cases)

• Where Things are Going: System-on-a-Chip Design– Specify design out of high-level components (cores)– Integrate sensors, transmitters, actuators, computers on a chip– Rely very heavily on tools to map design to software and hardware.– XUP is an SoC design vehicle

Page 13: Lecture 2 1 ECE 412: Microcomputer Laboratory Lecture 2: Design Methodologies.

Lecture 2 13

Design Flow

Design Entry

Implementation

Physical Device

Simulation

Page 14: Lecture 2 1 ECE 412: Microcomputer Laboratory Lecture 2: Design Methodologies.

Lecture 2 14

Design EntryTwo main methods:

• Text entry (VHDL/Verilog):– Compact format, no special tools required– Good for high-level designs and control logic

• Schematic Capture: Draw pictorial representation of circuit, tool converts into design (typically HDL description)

– Traditionally used for low-level (transistor) designs, regular structures– Commonly used today in conjunction with text entry to provide visual viewing of

overall structure of a design• ECE 412 uses both text and schematic capture to achieve the best of both methods

Page 15: Lecture 2 1 ECE 412: Microcomputer Laboratory Lecture 2: Design Methodologies.

Lecture 2 15

Simulation• Two types of HDL simulators

– Interpreted: runs slower but more versatile and no compilation time– Compiled: runs faster but require compilation time and often not as versatile

partly due to needs to compile all library components used.

• Both typically use Discrete-Event techniques– Divide time into discrete steps

• User can select time step to trade accuracy vs. run-time– Keep lists of events that have to be resolved at each time step.

• At each time step, resolve all events for the time step and schedule events for later time steps

• Output:– Text from output/print statements in your design– Errors from assert statements– Waveform traces

• Like any testing, the key is having good tests

Page 16: Lecture 2 1 ECE 412: Microcomputer Laboratory Lecture 2: Design Methodologies.

Lecture 2 16

Implementation

Going from simulated VHDL design to circuits

• 3 Phases– Synthesis

– Timing Analysis

– Place and Route

(Sometimes do additional timing analysis after place and route)

Page 17: Lecture 2 1 ECE 412: Microcomputer Laboratory Lecture 2: Design Methodologies.

Lecture 2 17

Synthesis

Transforms program-like VHDL into hardware design (netlist)

• Inputs– HDL description– Timing constraints (When outputs need to be ready, when inputs will be

ready, data to estimate wire delay)– Technology to map to (list of available blocks and their size/timing

information)– Information about design priorities (area vs. speed)

For big designs, will typically break into modules and synthesize each module separately– 10K gates/module was reasonable size 5 years ago, tools can probably

handle somewhat more now

Page 18: Lecture 2 1 ECE 412: Microcomputer Laboratory Lecture 2: Design Methodologies.

Lecture 2 18

Timing Analysis

Static timing analysis is the most commonly-used approach• Calculate delay from each input to each output of all

devices• Add up delays along each path through circuit to get

critical path• Works as long as no cycles in circuit

– Tools let you break cycles at registers to handle feedback

• Trade off some accuracy for run time– Simulation tools like SPICE will give more accurate numbers, but take

much longer to run

Page 19: Lecture 2 1 ECE 412: Microcomputer Laboratory Lecture 2: Design Methodologies.

Lecture 2 19

Place and Route

Synthesis generates netlist -- list of devices and how they’re interconnected

Place and route determines how to put those devices on a chip and how to lay out wires that connect them

Results not as good as you’d like -- 40-60% utilization of devices and wires is typical for FGPA– Can trade off run time of tool for greater utilization to some degree, but

there are serious limits

Page 20: Lecture 2 1 ECE 412: Microcomputer Laboratory Lecture 2: Design Methodologies.

Lecture 2 20

Implementation Technologies

Three broad approaches, increasing programmability and decreasing power efficiency

• Application specific integrated circuits– SSI/MSI/LSI/VLSI

• Programmable Logic – FPGA, CPLD

• Programmable processors– Microcontrollers, Network processors, DSP’s

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• Very high capacity today -- 10-100M transistors• Very high speed – 500MHz+

– Integration

– Specificity

• Can use any design style– Full Custom

– Standard-cell (synthesized) – dominating methodology due to manufacturing considerations

– Hybrid

• Long fabrication time– Weeks-months from completed design to product

• Only economical for high-volume parts– Making the masks required for fabrication is becoming very expensive,

in the order of $1M per design

Application Specific Integrated Circuits

Page 22: Lecture 2 1 ECE 412: Microcomputer Laboratory Lecture 2: Design Methodologies.

Lecture 2 22

Next Lecture

• Introduction to FPGAs


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