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Chapter 1 Introduction to RF and Wireless
Technology
1.1 A Wireless World 1.2 RF Design is Challenging
1.3 The Big Picture
Behzad Razavi, RF M icroelectronics.
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Scope of Course
Active Devices(transistor &
diode)
Passive Components(transmission line
& lump LC)
Concept and Design
of Microwave and Millimeter-wave
Circuits (non MIC or MMIC technology)
MicrowaveCommunication &
Applications
Microwave and Millimeter-wave
Subsystem and System
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Radio-Frequency Bands (1)
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Radio-Frequency Bands (2)
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Radio-Frequency Bands (3)
Absorption by the atmosphere in clear weather
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Chapter1 Introduction to RF and Wireless Technology 6
Chapter Outline
A Wireless WorldRF Design Challenges
Big Picture of
RF System Wireless Communicationin Life
Trend in RF Development
Multitude of
Disciplines
RF Trade-offs Demand for cost and
performance
TX and RX
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Chapter1 Introduction to RF and Wireless Technology 7
A Wireless World
High-speed wireless links (WiFi, Bluetooth) allow seamless connections
among device and appliance.
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Chapter1 Introduction to RF and Wireless Technology 8
Explosive Growth of Wireless Communication
The affordability of low cost and multiple functions finds its roots in
Integrat ion
Performance of RF circuits has also improved.
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Chapter1 Introduction to RF and Wireless Technology 9
RF Design is Challenging: Multi-discipline
RF design draws upon a multitude of disciplines.
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Chapter1 Introduction to RF and Wireless Technology 10
RF Design is Challenging: Trade-offs
RF circuits and transceivers must deal with numerous trade-offs.
Demand for higher performance, lower cost and greater functionality
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Chapter1 Introduction to RF and Wireless Technology 11
The Big Picture: RF Communication
TX: Drive antenna withhigh power level
RX: Sense small signal(amplify with low noise)
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Chapter1 Introduction to RF and Wireless Technology 12
The Big Picture: Generic RF Transceiver
Signals are upconverted/downconverted at TX/RX, by an oscillator controlled
by a Frequency Synthesizer
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Microwave Communication System (1)
RF transceiver including passive components
(SAW filter, LC matching network) and
active circuits (switch, PA, LNA, mixer, VGA,
VCO, synthesizer)
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Microwave Communication System (2)
Analog RF system Digital RF system
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Microwave Communication System (3)
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Microwave Communication System (4)
Channel access method used by various radio communication technologies.
The methods allow multiple users simultaneous access to a transmission system.
TDMA (Time division multiple access)
FDMA (Frequency division multiple access)
CDMA (Code division multiple access)
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Microwave Communication System (5)
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Microwave Communication System (6)
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Standard Multiple
Access
Receive
Frequency
(MHz)
Transmit
Frequency
(MHz)
Channel
Spacing
(kHz)
Mod.
Scheme
Region
DAMPS
(IS-54)
TDMA/FDMA 869-894 824-849 30 /4 DQPSK USA
GSM TDMA/FDMA 935-960 890-915 200 GMSK Europe
CDMA
(IS-95)
CDMA/FDMA 869-894 824-849 1250 BPSK/QPSK USA
JDC TDMA/FDMA 940-9561447-1489
1501-1513
810-8261429-1441
1453-1465
25 /4 QPSK Japan
W-CDMA CDMA Emerging 40,000 M-PSK USA
ISM TDMA/CDMA/
FDMA
902-928 902-928 10,000 BPSK USA
DCS-1800 TDMA/FDMA 1895-1907 1710-1785 200 GFSK UK
CT2 FDMA 864-868 864-868 100 GFSK Europe
Asia
DECT TDMA/FDMA 1800-1900 1800-1900 1728 GFSK Europe
PHS TDMA/FDMA 1895-1907 1895-1907 300 /4 DQPSK Japan
Digital Cellular and Cordless Phone Standards
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3G/3.5G/3.75G Distance(km)
Data rate(Mbps)
Band(GHz)
TX peak power(dBm)
CDMA2000
WCDMA
TD-SCDMA
3~12 0.3~2 0.82~0.85
1.92~1.98
2.11~2.17
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HSDPA 3~12 3.6/7.2/14.4 0.85/1.9/2.1 24
HSUPA 3~12 3.6/7.2/14.4 0.85/1.9/2.1 24
Specifications for 3G/4G Communication
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Chapter1 Introduction to RF and Wireless Technology 21
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Specifications for 3G/4G Communication
4G Distance(km)
Data rate(Mbps)
Band(GHz)
TX peak power(dBm)
WiMAX 802.16e up to 50 10/30/70 2.3~2.7
3.4~3.7
5.8
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LTE 3 50/100 0.7~0.86 (FDD)
1.5~2.1 (FDD)
2.3~2.6 (TDD)
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RF ICs and Modules (1)
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RF ICs and Modules (1)
GaAs X-band PA
SiGe PA for WiMAX
PA module for GSM mobile phone
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RF ICs and Modules (2)
GaN 40 W Class-E PA
SiC 10 W Class-AB PA
LDMOS PA for VHF band
VHF transmitter
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System on Chip (SoC)
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Microwave/millimeter-wave Applications (1)
Microwave Oven Specification
AC Power: 120 Volts AC 60 Hz (13.3A) 1500 Watts, Single phase,
3 wire grounded
Output Power: 1200 Watts full microwave power (IEC60705)
Frequency: 2450 MHz
Magnetron: 2M246-050GFTimer: 0 ~ 99 min. 99 sec.
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Microwave/millimeter-wave Applications (2)
77 GHz
Automotive Radar
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Microwave/millimeter-wave Applications (3)
94 GHz MMW image obtained from a scanning radiometer