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LED Lighting Module - US 3DS OUTSCALE...7 o APPENDIX - LED LIGHTING MODULE INDUSTRY TRENDS P310 •...

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From Technologies to Market LED Lighting Module Technology Industry and Market Trends September 2017 Sample
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  • From Technologies to Market

    LED Lighting Module

    Technology Industry and Market Trends

    September 2017

    Sample

  • 2

    o ACRONYM P8

    o OBJECTIVES OF THE REPORT P9

    o AUTHORS OF THE REPORT P10

    o WHAT'S NEW? P11

    o EXECUTIVE SUMMARY P12

    o LED MODULE INTEGRATION INTO LIGHTING SYSTEMS P38

    • System Integration

    • Engineering

    • Thermal Integration

    • Electrical Insulation Rules

    • Overview

    • Details on Driver Classes

    • Zhaga

    • Guideline for Interchangeability of Light Sources

    • Consortium Members

    • The Dilemma

    • What's New Since 2015?

    o LED MODULE INTEGRATION INTO LIGHTING SYSTEMS P48

    • The Different Types of LED Modules

    • Taxonomy

    • Middle Power vs. High Power vs. COB vs. AC vs. Custom vs. CSP

    • Positioning (with integration of CSP LED)

    • Geometry and Size

    • Electrical Interfaces

    • LED Module vs. LEDi Module

    • The Case of Flexible LED Strips

    • LED Market Volume and Revenue

    o ANALYSIS OF LED LIGHTING MODULES BY FUNCTION P58

    • Main Functions in LED Modules

    • System Structure

    • Parameter Interdependence

    • Why Thermal Management is Required for LED Systems?

    • Optical Design P63

    • A Large Panel of Optical Solutions

    • Generic Optical Architecture in Lighting

    • Focus on Reflectors

    • Collimators, Lenses and Refractors - Materials & Process

    • Material - Overview

    • Focus on Silicon Optics

    • Mixing Chamber

    • Other type of optics

    • Thin film

    • µstructured (=micro lens array?)

    • direction turning film

    • Freeform optics

    • Silicone coated with aluminium

    • Complex optic in Soraa lamp

    TABLE OF CONTENT (1/6)

    ©2017 | www.yole.fr | LED Lighting Module Technology Industry and Market Trends

    http://www.yole.fr/http://www.yole.fr/

  • 3

    o ANALYSIS OF MAIN FUNCTIONS IN LED MODULES P80

    • Optical Design

    • Case of harsh environment

    • What is different?

    • Where to expect defects

    • Possible solutions

    • Optical Architecture vs. LED Module Technology

    • Overview

    • Analysis per Application

    • Mapping of visible players

    • Market overview

    • Split by type

    • Split by material

    • Substrates/PCB P91

    • Overview of Technologies

    • FR4 vs MCPCB vs Ceramic

    • Mapping of Players

    • Market Overview

    • By PCB type

    • By Thermal Conductivity

    o ANALYSIS OF MAIN FUNCTIONS IN LED MODULES P110

    • Thermal Interface Materials

    • Purpose and Role of TIM

    • Criteria of Choice for a Thermal Interface Material

    • Different Types of TIM

    • Material Suppliers – Overview

    • Penetration Rate of TIM

    • Market Overview

    • Heatsink Technologies P123

    • Introduction

    • Active Cooling vs. Passive Cooling Solutions

    • Recent Developments

    • Mapping of Identified Players

    • Origin of Players

    TABLE OF CONTENT (2/6)

    ©2017 | www.yole.fr | LED Lighting Module Technology Industry and Market Trends

    http://www.yole.fr/http://www.yole.fr/

  • 4

    o ANALYSIS OF MAIN FUNCTIONS IN LED MODULES P131

    • Power Supply and Drivers

    • Overview of Drivers

    • The Different Driver Topologies

    • Driver Topology vs. LED Module Technology

    • AC Drivers

    • Low Voltage DC Minigrids

    • Driver Reliability

    • Focus on Capacitor

    • The Flicker Problem

    • Summary and Trends P143

    • Focus on New PCB Material

    • Market Overview – Split by Function

    o ANALYSIS OF MIDDLE POWER LED MODULES P148

    • Drivers for Integration

    • Why Middle Power LEDs for LED Modules?

    • Overview of Standard Design

    • Type of LEDs

    • Focus on CSP LED

    • Overview

    • Difference with middle power LED

    • Performance Aspects

    • Substrate/PCB

    • Thermal Management and Reliability

    • Power and Voltage

    • Drivers

    • Optics

    • ANALYSIS OF MIDDLE POWER LED MODULES P166

    • Focus on AC Middle Power LED Module

    • Introduction

    • Impact on Design

    • Efficacy

    • Cost Aspects

    • Performance Standards for Luminaire

    • Advantages and drawbacks (position of driver on PCB)

    • Middle Power LED Module Market Volume and Revenue

    o ANALYSIS OF HIGH POWER LED MODULES P172

    • Introduction

    • High Power LEDs vs. Middle Power LEDs vs. CSP LEDs

    • High Power LED Modules vs. Middle Power LED Modules vs. CSP LED Modules

    • The Different Type of High Power LED Modules

    • High Power LEDs compared to CSP LEDs

    • High Brightness and Large (HBL) Module

    • Overview

    • Substrate/PCB

    • Drivers and Electrical Connections

    • Thermal Management

    • Optics

    • High Quality of Light (HQL) Module

    • Overview

    • Beating CDM Lamp Evolution

    • Multichannel Technology

    • Phosphor Technology

    • High Brightness and Compact (HBC) Module

    • High Power LED Module Market Volume and Revenue

    TABLE OF CONTENT (3/6)

    ©2017 | www.yole.fr | LED Lighting Module Technology Industry and Market Trends

    http://www.yole.fr/http://www.yole.fr/

  • 5

    o ANALYSIS OF COB LED MODULES P189

    • Introduction

    • COB Technology - A Compromise Solution

    • Main COB Design Choices

    • Chip Layout

    • Trends

    • High Lumen Density in COB

    • Positioning of High Density COB

    • Market Segmentation and Uses

    • New COB Devices

    • COB Evolution and Roadmap

    • Ecosystem

    • Interconnection

    • Options for COB

    • Comparison of Technology

    • Holder Reliability

    • Diversity and Compatibility

    • Standardization

    • Zhaga Influence

    • Optics

    • Overview

    • Integration

    • Management of System Performance

    • Drivers

    • Thermal Management

    • COB LED Module Market Volume and Revenue

    o ANALYSIS OF CSP LED MODULES P220

    • Definition of CSP LED Devices

    • Price Positioning of CSP LED Modules

    • Impact of CSP LED Device on System/Module Design

    • Thermal Management

    • Optical Design

    • Electrical Management

    • Opportunities of CSP LED Modules

    • CSP LED System/Module Performance in Application

    o ANALYSIS OF FLEXIBLE LED STRIPS P244

    • Flexible LED Strips at a Glance

    • Flexible LED Strips vs. Rigid LED Strips

    • Status of the Industry

    • Differentiation Factors

    • Overview

    • Focus on “Large Variety of Flexible LED Strip Types”

    • Focus on “Quality Criteria”

    • Focus on “Specific Products and Innovative Solutions”

    • Focus on “Price”

    • Voltage

    • Connectors

    • Dust/Water Protection

    • Adhesive

    • Recent Developments

    • Flexible LED Module Market Volume and Revenue

    TABLE OF CONTENT (4/6)

    ©2017 | www.yole.fr | LED Lighting Module Technology Industry and Market Trends

    http://www.yole.fr/http://www.yole.fr/

  • 6

    o LED MODULE MARKET – SUMMARY P262

    • Application vs Module Technology

    • LED Module Market Volume – Excluding Flexible LED Module

    • LED Module Market Revenue – Excluding Flexible LED Module

    • Total LED Module Market Revenue

    o LED LIGHTING MODULE INDUSTRY AND MARKET TRENDS P268

    • Introduction – Status of The Package LED Industry P269

    • Introduction to LEDs

    • History of LED Industry

    • Overview

    • Application Diversification

    • Horticultural Lighting

    • Automotive Lighting

    • IR

    • UV

    • CSP

    • Package LED Industry and Market Trends P283

    • Focus on General Lighting Applications

    • Light quality

    • CRI and its Limitations

    • Diversity of index and evolution

    • Human Centric Lighting:

    • Definition

    • Impact on LED Module

    • Type of LED Used

    • Phosphor Modification

    • Smart Lighting

    • LED LIGHTING MODULE INDUSTRY AND MARKET TRENDS P291

    • Focus on Automotive Lighting

    • Focus on Horticultural Lighting

    • Diversity of color LEDs

    • Same evolution modules for general lighting?

    • LED Industry in 2017 - Main Challenges

    • Smart Lighting

    • Cost

    • Efficacy

    • Colour Shift

    • CONCLUSION P297

    • APPENDIX - DEFINITIONS AND USES OF LED MODULES P302

    • Definitions

    • LED Module in the Global LED Value Chain

    • Luminaire Design Approach with a LED Module

    • Benefits of LED Module for Integrator

    • Overview

    • Focus on Time and Cost Savings

    TABLE OF CONTENT (5/6)

    ©2017 | www.yole.fr | LED Lighting Module Technology Industry and Market Trends

    http://www.yole.fr/http://www.yole.fr/

  • 7

    o APPENDIX - LED LIGHTING MODULE INDUSTRY TRENDS P310

    • LED Lighting Module Industry Trends

    • History of the LED Lighting Module Industry

    • The SSL Chasm

    • Main LED Module Suppliers (Excluding COB and Flexible LED Strips)

    • Main COB LED Suppliers

    • Main Flexible LED Strip Suppliers

    • Non-COB LED Module Supplier vs. COB LED Module Supplier

    • Origin of Players

    • Overview

    • Positioning of some LED Module Suppliers

    • Example of Vossloh Schwabe

    • Focus on Packaged LED Manufacturers

    • Focus on Driver Manufacturers

    • Focus on Optic, Luminaire and Connector Manufacturers

    o APPENDIX - PRESENTATION OF YOLE DÉVELOPPEMENT P327

    TABLE OF CONTENT (6/6)

    ©2017 | www.yole.fr | LED Lighting Module Technology Industry and Market Trends

    http://www.yole.fr/http://www.yole.fr/

  • 8

    • PROVIDE A COMPREHENSIVE OVERVIEW OF LED LIGHTING MODULES, INCLUDING TECHNOLOGIES,MARKETS AND APPLICATIONS, MAIN FUNCTIONS AND INTEGRATION INTO LIGHTING SYSTEMS

    • ANALYSE THE POSITIONING OF EACH LED LIGHTING MODULE TYPE, INCLUDING MID-POWER, HIGHPOWER, COB AND FLEXIBLE STRIP,ANDTHE MAINTECHNOLOGIES IN USE

    • ANALYSE THE MAIN TECHNOLOGIES FOR EACH LED LIGHTING MODULE TYPE, INCLUDING PCB/SUBSTRATE,TIM, HEATSINK, OPTICAL DESIGN, POWER SUPPLY AND DRIVER

    • Detailed analysis of PCB,TIM, heatsink, secondary optics and power supply !

    • ANALYSE THE LED LIGHTING MODULE INDUSTRY STRUCTURE AND FUTURE TRENDS

    • PROVIDE AN OVERVIEW OF THE LED LIGHTING MODULE MARKET FORECAST (2017 – 2022) – INVOLUME ANDVALUE

    • Detailed market analysis of PCB,TIM and secondary optics !

    OBJECTIVES OF THE REPORT

    ©2017 | www.yole.fr | LED Lighting Module Technology Industry and Market Trends

    http://www.yole.fr/http://www.yole.fr/

  • 9

    • THE REPORTS PROVIDES A DETAILED ANALYSIS OF:

    • Secondary optics, including penetration rates, market forecast in volume and revenue

    • Substrate/PCB used in LED modules, including market forecast in volume and revenue split by type of PCB

    • Thermal interface material including penetration rates and market forecast in revenue

    • Heatsink with identified players and recent developments

    • Power supply with focus on challenges to overcome such as capacitor reliability or flicker

    • Note to customers of the previous version: This report is an update and some slides are similar to the previous report. Wehighlighted new slides with a box on top right corner.

    • Note to new customers: This report provides an overview of the LED module industry and analyse each function in LEDmodule (secondary optics, PCB, TIM, heatsink, power supply). The slides in the appendix will give you some definitions as well asan overview of the LED module industry.

    WHAT'S NEW?

    ©2017 | www.yole.fr | LED Lighting Module Technology Industry and Market Trends

    New Slide

    http://www.yole.fr/http://www.yole.fr/

  • 10

    Biography & contact

    ABOUT THE AUTHORS

    Pierrick Boulay

    Pierrick Boulay works as Market and Technology Analyst in the fields of LED, OLED and Lighting Systems to carry out technical, economic and

    marketing analysis at Yole Développement, the "More than Moore" market research and strategy consulting company. He has experience in both

    LED lighting (general lighting, automotive lighting…) and OLED lighting. In the past, he has mostly worked in R&D department for LED lighting

    applications. Pierrick holds a master degree in Electronics (ESEO - France).

    E-mail: [email protected]

    Pars Mukish

    ©2017 | www.yole.fr | Artificial organ | Sample

    Pars MUKISH holds a master degree in Materials Science & Polymers (ITECH - France) and a master degree in Innovation & Technology

    Management (EM Lyon - France). Since 2015, Pars MUKISH has taken on responsibility for developing LED, OLED and Sapphire activities as

    Business Unit Manager at Yole Développement. Previously, he has worked as Marketing Analyst and Techno-Economic Analyst for several years at

    the CEA (French Research Center).

    E-mail: [email protected]

    http://www.yole.fr/http://www.yole.fr/mailto:[email protected]:[email protected]

  • 11

    • From LED chip to LED lighting system, several steps of value drive the lighting industry. LED modules represent a bridge between the packagedLED offer and the luminaire shaped product.

    • A significantly integrated LED package reduces the level of know-how necessary for lighting manufacturers, thereby enabling conventional lightingsystem manufacturers to have easier access to the technology.

    • Basically, we can consider an LED module as a unit containing one or more LEDs with mechanical and optical components.

    • It may contain additional components (e.g., connectors, resistors, ESD protection devices, lenses…).

    • Generally, LED module is considered a replaceable item for use in a luminaire.

    • An LED module represents a component/sub-system optimized for a given application scope.

    LED Module in the Global LED Value Chain

    DEFINITIONS AND USES OF LED MODULES

    ©2017 | www.yole.fr | LED Lighting Module Technology Industry and Market Trends

    LED MODULES

    LED

    Die/Chip

    Packaged

    LED

    Light/LED

    ModuleLight Source(Module + Driver)

    Luminaire

    Light

    System/

    Solution

    Philips

    Lighting

    Lumileds

    http://www.yole.fr/http://www.yole.fr/

  • 12

    System Integration

    LED MODULE INTEGRATION INTO LIGHTING SYSTEMS

    • System integration is based on standardized interfaces and building blocks: LED module, driver, optic, electronic (…).

    • The design effort of the integrator is mainly focused on:

    • The interfaces between these building blocks.

    • The system performance qualification.

    ©2017 | www.yole.fr | LED Lighting Module Technology Industry and Market Trends

    Modular approach enable an easier integration of LED modules.

    PCB /

    Connector

    Packaged

    LED

    Optic

    Thermal

    System

    Driver

    Mechanical

    Assembly

    • Please note that lower efforts can be done on the LED module qualification which is under the responsibility of the LED module manufacturer / supplier.

    • Modular architecture can be developed to easier upgrade of the building blocks (→ allowing for short and efficient product development / evolution).

    • With this strategy, companies benefit from:

    • Improvement of LED performance (lm/W).

    • LED cost decrease ($/lm).

    • Work also for other components, such as driver(…).

    • Technology leverage → Same LED module for different applications.

    • Thermal redesign.

    • Optics redesign (and improvements).

    http://www.yole.fr/http://www.yole.fr/

  • 13

    Middle Power LED Module

    • The middle power LED is a solution offering lowpower consumption and high flux.

    High Power LED Module

    • The middle power LED is a solution offering smalllighting emitting surface and high flux.

    COB LED Module

    • The COB module architecture is a solution offeringgood compromise between size of the light emittingsurface, flux power and power consumption.

    CSP LED Module

    • The CSP LED is a solution offering goodcompromise between flux power, powerconsumption and price. It is the smallest solution ofLED market.

    The choice of the right LED module solution depends on requirements at application level,

    cost level (…).

    The Different Types of LED Modules - Positioning (Flux vs. Power Consumption vs. LES)

    LED MODULE INTEGRATION INTO LIGHTING SYSTEMS

    ©2017 | www.yole.fr | LED Lighting Module Technology Industry and Market Trends

    High flux

    Low power

    consumption

    Small light

    emitting surface

    LOW POWER LED

    COB

    MODULE

    http://www.yole.fr/http://www.yole.fr/

  • 14

    LED Module Market Revenue ($M) – Split by Module Type

    LED MODULE INTEGRATION INTO LIGHTING SYSTEMS

    ©2017 | www.yole.fr | LED Lighting Module Technology Industry and Market Trends

    The LED lighting module market revenue represented a size of ~$4B in 2016 and is expected to reach $13.8B in 2022.

    http://www.yole.fr/http://www.yole.fr/

  • 15

    System Structure (1/2)

    MAIN FUNCTIONS IN LED MODULES

    ©2017 | www.yole.fr | LED Lighting Module Technology Industry and Market Trends

    Power Supply & Driver

    To realize AC to DC

    conversion

    Optical Design

    To shape the light emitted

    from LED

    Thermal Management

    To dissipate heat produced

    by LEDs

    • Substrate / PCB

    • Thermal Interface Management / Material

    • Heatsink

    • External Driver

    • Integrated Driver

    • Optics (Collimator / Reflector / Lens

    Plate / Diffusers…)

    Function Associated Components / MaterialsLED Lighting Module

    http://www.yole.fr/http://www.yole.fr/

  • 16

    • A LED is not a "plug and play" light source and it requires and optical management. Because most of LEDs emit with aLambertian intensity distribution, LEDs must be associated to optics to shape the light.

    • In this context, reflectors are mostly used when the size of the light source is large or when the light source consistof an array of dies under a common phosphor (typically COB module). As reflector do not capture all the lightgenerated by LEDs, beam control is less efficient compared to a lens.

    • Collimators are more adapted to small light sources and have the ability to capture most of the light generated byLEDs leading to a better beam control than reflectors. But if the light source is too large, it does not make sense todesign a huge lens due to high manufacturing costs.

    • Both optics have advantages and drawbacks and the choice of the secondary optic depends on multiple parameterssuch as light source or light distribution among others.

    • Some hybrid optics have also been developed that combine a collimator at the bottom of a reflector for a bettercontrol of the light beam.

    Collimators, Lenses and Refractors - Reflectors vs. Collimators

    OPTICAL DESIGN FOR LED MODULES

    ©2017 | www.yole.fr | LED Lighting Module Technology Industry and Market Trends

    Reflector Collimator

    Size of Light Source Large Small

    Glare Xxx Xxx

    Light Distribution Wide angle Narrow angle

    Thermal Stress Xxx Xxx

    Beam Control Xxx Xxx

    Cost Xxx Xxx

    Total Internal Reflection (TIR)

    lens (top) vs reflector (bottom)

    Source: Ledil

    Hybrid optic

    Source: Gaggione

    http://www.yole.fr/http://www.yole.fr/

  • 17

    Overview of Technologies

    THERMAL MANAGEMENT FOR LED MODULES - SUBSTRATE/PCB

    ©2017 | www.yole.fr | LED Lighting Module Technology Industry and Market Trends

    There are 5 main types / technologies of PCB used for LED module manufacturing.

    PCB for

    LED

    Module

    Flexible PCB

    Glass-epoxy

    PCB (FR4, CEM1,

    CEM3 etc.) Xxx

    Standard

    Metal Core

    PCB

    (Aluminum,

    Copper core)

    Others

    Ceramic PCB

    (Al203,AlN)

    Standard

    Xxx

    Xxx

    Xxx

    Metal Core Glass-Epoxy

    Xxx

    Xxx

    http://www.yole.fr/http://www.yole.fr/

  • 18

    Industry - Identified Manufacturers of Glass Epoxy PCB

    THERMAL MANAGEMENT FOR LED MODULES - SUBSTRATE/PCB

    ©2017 | www.yole.fr | LED Lighting Module Technology Industry and Market Trends

    CHINA

    • Xxx

    • Xxx

    • Xxx

    • Xxx

    • Xxx

    • Kinwong Electronic

    • Mankun Electronic

    • Xxx

    • Xxx

    • Xxx

    • Xxx

    • Xxx

    • Xxx

    • Xxx

    • Xxx

    • Xxx

    • Xxx

    • Xxx

    • Xxx

    • Xxx

    • Xxx

    JAPAN

    • Xxx

    • Xxx

    • Xxx

    NORTH AMERICA

    • Xxx

    • Cofan (US)

    • Xxx

    • Xxx

    EUROPE

    • AT&S (AT)

    • Xxx

    • Xxx

    • Xxx

    • Xxx

    • NCAB Group (SW)

    • Xxx

    • Xxx

    • Xxx

    • Haeusermann (AU)

    • Xxx

    • Xxx

    • Xxx

    TAIWAN

    • Chin Poon

    Industrial

    • Xxx

    • Finpo PCB

    • Xxx

    • Xxx

    • Xxx

    • Xxx

    • Xxx

    SINGAPORE

    • Opulent (SG)

    SOUTH KOREA

    • Xxx

    http://www.yole.fr/http://www.yole.fr/

  • 19

    Criteria of Choice for TIM - Overview

    THERMAL MANAGEMENT FOR LED MODULES - TIM

    ©2017 | www.yole.fr | LED Lighting Module Technology Industry and Market Trends1. Xxx 2. Xxxx

    Xxx

    Thermal

    Interface Material

    High bulk

    thermal

    conductivityPower to

    dissipate

    Xxx

    Xxx

    Ease of

    application

    Electrically

    conductive/ insulating

    Xxx

    Maximum storage

    temperature and

    storage time

    XxxNot

    carcinogenicXxx XxxXxxXxx Conformability2

    Low cost

    Xxx

    Xxx

    Xxx

    Xxx

    Xxx1

    http://www.yole.fr/http://www.yole.fr/

  • 20

    • Although the heatsink contributes to the design ofthe luminaire, it remains a part dedicated to coolthe whole system. Shape, size, weight are directlythe consequence of the total embedded thermalpower and the thermal power density.

    • Middle power LED modules have low cooling needsdue to their large surfaces and low embeddedpower. Some lighting products like T5 tubes don’tneed a heatsink.

    • COB LED modules concentrate the light output ona small area, requiring good design of the thermalcooling system for performance and reliabilitymanagement.

    • High power LED modules in general require largeand efficient heatsinks. Active cooling is an optionto reduce the size while getting the requiredthermal performance.

    Heatsink Design vs. LED Module Technology

    THERMAL MANAGEMENT FOR LED MODULES - HEATSINK

    ©2017 | www.yole.fr | LED Lighting Module Technology Industry and Market Trends

    High heatsink performance

    Active cooling

    Moderate heatsink performance

    Passive cooling

    No heatsink needed or

    low heatsink performance

    Maximum heatsink required performance

    http://www.yole.fr/http://www.yole.fr/

  • 21

    • The main difference between CSP LEDs and middle power LEDs is its size as global size is close to the size of its die.

    • CSP LEDs are much smaller LEDs than traditional middle power LEDs but can be driven at higher current due to their conception resulting in abetter heat dissipation.

    • Internal thermal resistance of CSP LEDs is lower than standard LED chip devices.

    • Like middle power LEDs, a high number of CSP LEDs can be used to avoid the creation of hot spot in luminaire but the difference is the ability ofCSP LED to produce more light than middle power LEDs.

    Middle Power LEDs vs. CSP LEDs

    MIDDLE POWER LED MODULES

    ©2017 | www.yole.fr | LED Lighting Module Technology Industry and Market Trends

    Electrical performances of middle power and CSP LEDSingle LED Package surface (mm²)

    5 15 200 10

    CSP LEDs

    Traditional Middle Power LEDs

    In average 3,0 x 1,4mm

    Up to 5,6 x 3,0mm

    In average 0,65 x 0,65mm

    Up to 2,2 x 2,2 mm

    http://www.yole.fr/http://www.yole.fr/

  • 22

    • High CRI above 80 require a combination of X phosphors while CRI > 90 typically require X phosphors (however the use of a redder phosphorwith a broad yellow/green also allows to reach slightly above 90 values).

    HQL Module - Phosphor Technology

    HIGH POWER LED MODULES

    ©2017 | www.yole.fr | LED Lighting Module Technology Industry and Market Trends

    UV

    Chip

    Blue

    Chip

    Blue

    Phosphor

    Green

    Phosphor

    Yellow /

    Amber

    Phosphor

    Orange /

    Red

    Phosphor

    Red

    ChipCCT Typical CRI R9

    X X X X Xxx Xxx Xxx

    X X 5000K to 8300K Xxx Low

    X X High Xxx Xxx

    X X 1800K Xxx High

    X X X Xxx 80 to 90 Xxx

    X X X Low Xxx Xxx

    X X X X Xxx Xxx Xxx

    X X X Xxx Xxx Xxx

    X X X Low (2700K) Xxx Xxx

    http://www.yole.fr/http://www.yole.fr/

  • 23

    New COB Devices - Main Areas of Development

    COB LED MODULES

    • On the 55 COB LED manufacturers identified, 37 companies can beconsidered as innovators and 18 as followers.

    • Within the 37 companies considered as innovators, main area of innovationsare:

    1. High CRI COB.

    2. High Power COB.

    3. Flip Chip on Board (FCOB).

    4. Dual CCT COB.

    5. Others (UV COB,AC COB, innovative connectors…).High CRI COB is the main area of development at short term.

    Remark: Total is not equal to 37 as some companies work

    on multiple areas of development regarding COB.

    Related to high power density COB

    Related to Spectrum enhanced COB

    ©2017 | www.yole.fr | LED Lighting Module Technology Industry and Market Trends

    http://www.yole.fr/http://www.yole.fr/

  • 24

    Following packaged LED manufacturers, LED module manufacturers bet on niche applications to diversify.

    CONCLUSION

    ©2017 | www.yole.fr | LED Lighting Module Technology Industry and Market Trends

    UV applications

    IR applications

    Horticultural applications

    Automotive lighting

    applications

    Tuneable white

    applications

    Smart lighting

    applications

    From general lighting … … to many other applications

    http://www.yole.fr/http://www.yole.fr/

  • 25

    RELATED REPORTS

    ©2017 | www.yole.fr | Artificial organ | Sample

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  • Light Emitting Diode (LED) technology is increasingly penetrating general lighting applications, thanks to how easily integrators can use it. The LED lighting module market will therefore deliver a 22.6% compound annual growth rate from 2017-2022.

    Mid-power LEDs can be used in almost all applications. Mid-power LED modules are therefore driving the market, providing 60% of 2016’s market revenues. High power LEDs are used only in applications requiring high luminous flux in a small module. As a result, the number of applications using high power LED modules is limited and associated revenues represent about 7% of market revenues.

    Chip-on-board (COB) LED modules provide a compromise on size, light emitting surface (LES) area, luminous flux and power consumption. COB LED modules can therefore be used in many applications, and lead the total LED module market in volumes shipped. But as these modules are relatively easy to manufacture in few

    steps the associated average selling price is low. Consequently, COB LED modules represent only 20% of market revenue.

    Flexible LED strips can be directly used as LED lighting systems, mostly in indirect lighting applications. These modules can be easily implemented for residential and commercial lighting. Recent developments, like using LED chips instead of packaged LEDs on a flexible substrate, allow much higher efficiency, opening doors to new applications such as linear lighting.

    In this context, Yole Développement estimates that the LED lighting module market, including flexible LED strips, reached nearly $4B in 2016 and will grow to $13.8B by 2022.

    This report provides an in-depth analysis of each type of LED module, including technology, trends and market sizes. It covers the whole landscape of LED modules and their potential use in general lighting applications.

    LED LIGHTING MODULE TECHNOLOGY INDUSTRYAND MARKET TRENDSMarket & Technology report - September 2017

    LED LIGHTING MODULE MARKET VALUE WILL TREBLE IN THE NEXT FIVE YEARS, DRIVEN BY MID-POWER MODULES

    After wide use in general lighting applications, LED module manufacturers are now looking for new applications with higher margins.

    KEY FEATURES OF THE REPORT Get the sample of the report on www.i-Micronews.com• Detailed technical and market

    analysis of functions in a LED module

    • Analysis of the new trends in the LED module industry

    • Overview of key applications targeted by LED module manufacturers

    • LED lighting market volume and revenue forecast for 2012-2022

    WHAT’S NEWThe report provides a detailed analysis of:• Secondary optics, including

    penetration rates, market forecasts for volume and revenue

    • Substrates and PCBs used in LED modules, including market forecasts for volume and revenue, split by type

    • Thermal interface materials including penetration rates and market forecast for revenue

    •Heatsinkswithidentifiedplayersand recent developments

    • Future trends and growth engines, including ultraviolet, automotive or horticultural lighting

    LED lighting module market revenue forecast14

    12

    10

    8

    6

    4

    2

    Rev

    enue

    (U

    S$B

    )

    2016 2017 2018 2019 2020 2021 2022

    (Yole Développement, September 2017)

    In a luminaire, LED modules are generally associated with components shaping the light, converting between alternating and direct current or enhancing thermal behavior. Secondary optics are almost always used in LED modules to optimize light extraction and contribute to the

    aesthetic effect of the product. There are two main types of secondary optics: collimators and reflectors. The first type is mainly used in clusters with mid-power LED modules, or individually with high-power LED modules. The second type is frequently used with COB LED modules due to

    ASSOCIATED COMPONENTS AND MATERIALS ARE TAKING ADVANTAGE OF LED MODULE GROWTH

  • LED LIGHTING MODULE TECHNOLOGY INDUSTRY AND MARKET TRENDS

    NEW APPLICATIONS EMERGE AS THE LED MODULE INDUSTRY LOOKS FOR GROWTH ENGINES

    General lighting isn’t a ‘blue ocean market’ any more, due to strong price pressure and intense competition. Therefore, LED module manufacturers are seeking growth engines, following the example provided by the packaged LED industry a few years ago.

    As a consequence, industry players are diversifying and looking at what is happening in horticultural lighting, automotive lighting, smart lighting and going beyond visible light into the infrared (IR) or ultraviolet (UV) parts of the spectrum. All of these applications are emerging and the associated margins are much higher than for general lighting applications. The modules used in these applications require high levels of know-how and technical skill. LED module manufacturers targeting these new applications are betting integrators won’t have the competencies needed and that high market demand will help them move higher in the value chain. A good example is Everlight. Initially positioned as a light source supplier, it then started developing COB technology. It is now seeking to enter the automotive lighting business, positioning itself as an advanced module supplier.

    Beyond visible light, UV and IR LED modules are increasingly used, pushed by rapidly growing applications like UV curing and IR surveillance cameras. Large numbers of LEDs are used in each module, and thermal management is crucial for performance, especially for UV applications.

    This report provides insights into the next growth engines and analyzes targeted applications. Additionally, it gives an overview of the future trends facing the LED module industry.

    their large LES. Secondary optics generated $0.9B revenue in 2016, and are expected to generate $4.3B in 2022.

    Printed circuit boards (PCBs) are essential materials in the performance and reliability of LED modules. In the thermal management of LED modules an efficient conduction path has to be built to maintain a safe and optimal temperature. COB LED modules need to use high performance PCBs, such as Metal Core PCBs (MCPCBs) or ceramic PCBs, due to the high power density of these modules. But because COBs are small, so are their high performance PCBs. Also, the business is dominated by mid-power LED modules,

    which need low performance PCB materials such as FR4. The large size of these modules generates the highest volumes and revenues. The total LED module PCB business will generate more than $3.2B in revenue in 2022. Other components like Thermal Interface Materials (TIMs) and heatsinks are also important in the heat conduction path but generate less revenue.

    This report analyses the different functions associated with LED modules including secondary optics, PCBs, TIMs, heatsinks, and power supplies. It gives a comprehensive understanding of each function and its related markets, including volume and revenue forecasts.

    From general lighting to many other applications

    (Yole Développement, September 2017)

    UV applications

    IR applications

    Horticultural applications

    Automotive lighting applications

    Tuneable white applications

    Smart lighting applications

    From general lighting … … to many other applications

    Main functions in LED modules

    (Yole Développement, September 2017)

    Power Supply & Driver

    To realize AC to DC conversion

    Optical Design

    To shape the light emitted from the LEDs

    Thermal Management

    To dissipate heat produced by LEDs

    • Substrate / PCB • Thermal Interface Management / Material • Heatsink

    • External Driver • Integrated Driver

    • Optics including collimator, reflector,lens plate, diffusers...

    Function Associated components / materials LED lighting module

    REPORT OBJECTIVES• Provide a comprehensive

    overview of LED lighting modules, including technologies, markets and applications, main functions and integration into lighting systems

    • Analyse the positioning of each LED lighting module type, including mid-power, high power, COB, flexiblestrip,andthemaintechnologies in use

    • Analyse the main technologies for each led lighting module type, including PCBs and substrates, TIMs, heatsinks, optical design, power supplies and drivers

    • Analyse the LED lighting module industry structure and future trends

    • Provide an overview of the LED lighting module market forecast for 2017 – 2022

  • Find more details about

    this report here:

    MARKET & TECHNOLOGY REPORT

    What’s new? 11Executive summary 12LED module integration into lighting systems 38

    > System Integration> Engineering> Thermal Integration> Electrical Insulation Rules

    - Overview- Details on Driver Classes

    > Zhaga- Guideline for Interchangeability of Light Sources- Consortium Members- The Dilemma- What’s New Since 2015?

    LED module integration into lighting systems 48> The Different Types of LED Modules

    - Taxonomy- Middle Power vs. High Power vs. COB vs. AC vs. Custom

    vs. CSP - Positioning with Integration of CSP LED- Geometry and Size- Electrical Interfaces- LED Module vs. LEDi Module

    > The Case of Flexible LED Strips> LED Market Volume and Revenue

    Analysis of LED lighting modules by function 58 > Main Functions in LED Modules

    - System Structure- Parameter Interdependence- Why is Thermal Management Required for LED Systems?

    > Optical Design - A Large Panel of Optical Solutions- Generic Optical Architecture in Lighting- Focus on Reflectors - Collimators, Lenses and Refractors - Materials and

    Processes- Materials Overview- Focus on Silicon Optics- Mixing Chamber- Other Types of Optics- Harsh Environments- Optical Architecture vs. LED Module Technology- Mapping of Visible LED Players- Market Overview

    > Substrates/PCB- Overview of Technologies- FR4 vs MCPCB vs Ceramic- Mapping of Players- Market Overview

    > Thermal Interface Materials- Purpose and Role of TIM- Criteria of Choice for a Thermal Interface Material- Different Types of TIM- Materials Suppliers Overview- Penetration Rate of TIM- Market Overview

    > Heatsink Technologies - Introduction- Active Cooling vs. Passive Cooling Solutions- Recent Developments- Mapping of Identified Players- Origin of Players

    > Power Supply and Drivers- Overview of Drivers- The Different Driver Topologies- Driver Topology vs. LED Module Technology- AC Drivers- Summary and Trends

    Analysis of mid-power LED modules 148> Drivers for Integration> Why Mid-Power LEDs for LED Modules?> Overview of Standard Design > Type of LEDs> Focus on CSP LED> Performance Aspects

    > Substrate/PCB> Thermal Management and Reliability> Power and Voltage> Drivers> Optics> Focus on AC Mid-Power LED Module> Mid-Power LED Module Market Volume and Revenue

    Analysis of high power LED modules 172> Introduction> The Different Types of High Power LED Modules> High Brightness and Large (HBL) Modules> High Quality of Light (HQL) Modules> High Brightness and Compact (HBC) Modules> High Power LED Module Market Volume and Revenue

    Analysis of COB LED modules 189> Introduction> COB Technology - A Compromise Solution> Main COB Design Choices> Trends> High Lumen Density in COB> Positioning of High Density COB> Market Segmentation and Uses> New COB Devices> COB Evolution and Roadmap> Ecosystem> Interconnection> Holder Reliability> Diversity and Compatibility> Standardization> Zhaga Influence> Optics> Management of System Performance> Drivers> Thermal Management> COB LED Module Market Volume and Revenue

    Analysis of CSP LED modules 220> Definition of CSP LED Devices> Price Positioning of CSP LED Modules> Impact of CSP LED Device on System/Module Design> Opportunities for CSP LED Modules> CSP LED System/Module Performance in Application

    Analysis of flexible LED strips 244> Flexible LED Strips at a Glance> Flexible LED Strips vs. Rigid LED Strips> Status of the Industry> Differentiation Factors> Voltage> Connectors> Dust and Water Protection> Adhesive> Recent Developments> Flexible LED Module Market Volume and Revenue

    LED module market – summary 262> Application vs Module Technology> LED Module Market Volume and revenue – Excluding Flexible

    LED Modules> Total LED Module Market Revenue

    LED lighting module industry and market trends 268> Introduction – Status of The Packaged LED Industry

    - Introduction to LEDs- History of LED Industry

    > Packaged LED Industry and Market Trends- Focus on General Lighting Applications- Focus on Automotive Lighting- Focus on Horticultural Lighting- LED Industry in 2017 - Main Challenges

    Conclusions 297

    Appendix - definitions and uses of LED modules 302

    Appendix - LED lighting module industry trends 310

    Appendix - presentation of Yole Développement 327

    TABLE OF CONTENTS (complete content on i-Micronews.com)

    COMPANIES CITED IN THE REPORT (non exhaustive list)Acclaim Lighting, American Bright LED, APT, BAG, BJB, Bridgelux, Brightview Electronic, Cambridge Nanotherm, Carclo, CETC Huaying Electronics, Citizen, Cree, CTL, Edison, Edlan Lighting Technology, Elemental LED, Epitex, Everlight, Flexfire LED, Fusion optix, Futuro Lighting, Gaggione, GE Lighting, Harvard, Harvatek, Heatron, Helio, Helvar, Honglitronic, Hueyjann, Hugewin, HuiYuan, Itswell, KKDC, Kodenshi, LED Linear, LED Waves, Ledil, Ledman, Ledtech, LEDtronics, Ledxon, Lextar, LG, Lighten Corp, Lightspot, Lucent Lighting, Lumens, Lumichip, Lumileds, Lumimodule, Luminus Devices, Lustrous Technology, LWF, Molex, Neonica Polska, Nichia, NVC Lighting Technology, OML Technology, Opple, Optogan, Osram, ParagonLED, Philips Lighting, Powerlightec, Prolight, Rishang Optoelectronics, Samsung, Seoul Semiconductor, Shanghai Toplight Tech, Sharp, Shenzen Lingbenyang Industry, Shenzen Rebow Industrial, Shenzhen Refond, Smart Systems Controls, Sunpu-Opto, TCI, TCL Lighting, Thomas Research Product, Toyoda Gosei, Universal LED Solution, Universal Lighting Technology, Vishay, Vossloh-Schwabe, Wen Run Optoelectronics, Wooree LED, Xicato, Yi Ji Xi Guang, and more...

    AUTHORSPars Mukish holds a master degree in Materials Science & Polymers (ITECH - France) and a master degree in Innovation & Technology Management (EM Lyon - France). Since 2015, Pars Mukish has taken on responsibility for developing LED, OLED and Sapphire activities as Business Unit Manager at Yole Développement. Previously, he has worked as Marketing Analyst and Techno-Economic Analyst for several years at the CEA (French Research Center).

    • IR LEDS and VCSELs - Technology, Applications and Industry Trends

    • UV LEDs - Technology, Manufacturing and Application Trends

    • LED Packaging 2017: Market, Technology and Industry Landscape

    Find all our reports on www.i-micronews.com

    RELATED REPORTSBenef i t f rom our Bund le & Annua l Subscription offers and access our analyses at the best available price and with great advantages

    Pierrick Boulay works as Market and Technology Analyst in the fields of LED,OLED and Lighting Systems to carry out technical, economic and marketing analysis at Yole Développement, the “More than Moore” market research and strategy consultingcompany.Hehasexperienceinboth LED lighting (general lighting, automotive lighting…) and OLED lighting. In the past, he has mostly worked in R&D department for LED lighting applications. Pierrick holds a master degree in Electronics (ESEO - France).

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    Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media and corporate finance services. With a strong focus on emerging applications using silicon and/or micro manufacturing, the Yole Développement group has expanded to include more than 50 collaborators worldwide covering MEMS, Compound Semiconductors, LED, Displays, Image Sensors, Optoelectronics, Microfluidics & Medical, Advanced Packaging, Manufacturing, Nanomaterials, Power Electronics and Batteries & Energy Management.The “More than Moore” company Yole and its partners System Plus Consulting, Blumorpho, KnowMade and PISEO support industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to develop their business.

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  • 27©2017 | www.yole.fr | About Yole Développement

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    A GROUP OF COMPANIES

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    o Yole Développement publishes a comprehensive collection of market & technology reports and patent analysis in:

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  • 35©2017 | www.yole.fr | About Yole Développement

    OUR 2017 REPORTS PLANNING (1/2)

    MARKET AND TECHNOLOGY REPORTS by Yole Développement

    o MEMS & SENSORS

    − Acoustic MEMS and Audio Solutions 2017

    − Integrated Passive Devices Market Status 2017

    − 3D Imaging & Sensing 2017

    − Status of the MEMS Industry 2017

    − Silicon Photonics 2017*

    − MEMS & Sensors for Automotive 2017

    − High End Inertial Sensors for Defense and Industrial Applications 2017*

    − Magnetic Sensors Market and Technologies 2017

    − Sensors and Sensing Modules for Smart Homes and Buildings 2017

    − Sensing and Display for AR/VR/MR 2017**

    − MEMS Packaging 2017

    − Fingerprint Sensor Applications and Technologies - Consumer Market Focus 2017

    o RF DEVICES AND TECHNOLOGIES

    − RF Front End Modules and Components for Cellphones 2017

    − Advanced RF SiP for Cellphones 2017

    − 5G Impact on RF Industry: From Wireless Infrastructure to Cellphone Terminals 2017

    − RF Technologies for Automotive Applications 2017

    − GaN and Si LDMOS Market and Technology Trends for RF Power 2017

    o MANUFACTURING

    − Glass Substrate Manufacturing 2017

    − Equipment & Materials for Fan Out Technology 2017

    − Equipment and Materials for 3D TSV Applications 2017

    − Emerging Non Volatile Memories 2017*

    o MEDTECH

    − Status of the Microfluidics Industry 2017

    − Solid State Medical Imaging 2017

    − Connected Medical Devices: the Internet of Medical Things 2017

    − Sensors for Medical Robotics 2017

    − Artificial Organs: Market & Technology Analysis 2017

    − Organs-on-a Chip 2017

    o ADVANCED PACKAGING

    − Advanced Substrates Overview 2017

    − Integrated Passive Devices Market Status 2017

    − Status of the Advanced Packaging Industry 2017

    − Fan Out Packaging: Market & Technology Trends 2017*

    − 3D TSV and 2.5D Business Update - Market and Technology Trends 2017

    − Advanced QFN: Market & Technology Trends 2017**

    − MEMS Packaging 2017

    − Advanced Packaging for Memories 2017

    − Advanced RF SiP for Cellphones 2017

    − Power Packaging Market and Technology Trends 2017

    − Embedded Die Packaging: Technologies and Markets Trends 2017

    o IMAGING & OPTOELECTRONICS

    − 3D Imaging & Sensing 2017

    − Status of the CMOS Image Sensor Industry 2017*

    − Camera Module for Consumer and Automotive Applications 2017*

    − Uncooled Infrared Imaging Technology & Market Trends 2017*

    − Solid State Medical Imaging 2017

    − Embedded Software for Machine Vision Systems 2017**

    o BATTERY AND ENERGY MANAGEMENT

    − Status of the Rechargeable Li-ion Battery Industry*2016 version still available / **To be confirmed

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  • 36©2017 | www.yole.fr | About Yole Développement

    OUR 2017 REPORTS PLANNING (2/2)o POWER ELECTRONICS

    − Status of Power Electronics Industry 2017

    − Power MOSFET 2017: Market and Technology Trends

    − IGBT Market and Technology Trends 2017

    − Power Module Packaging: Material Market and Technology Trends 2017

    − Power SiC 2017: Materials, Devices, and Applications

    − Power GaN 2017: Materials, Devices, and Applications*

    − Materials Market Opportunities for Cellphone Thermal Management (Battery Cooling, Fast Charging, Data Processing, etc.) 2017

    − Gate Driver Market and Technology Trends 2017

    − Power Management ICs Market Quarterly Update 2017

    − Integrated Passive Devices Market Status 2017

    − Thermal Management for LED and Power 2017

    o COMPOUND SEMICONDUCTORS

    − Power SiC 2017: Materials, Devices, and Applications

    − Power GaN 2017: Materials, Devices, and Applications*

    − GaN and Si LDMOS Market and Technology Trends for RF Power 2017

    − 5G Impact on RF Industry: From Wireless Infrastructure to Cellphone Terminals 2017

    − Bulk GaN Substrate Market 2017

    o DISPLAYS

    − MicroLED Displays 2017

    − MicroLED IP 2017

    − Quantum Dots for Display Applications 2017

    − Phosphors & Quantum Dots 2017 - LED Downconverters for Lighting & Displays

    o SOLID STATE LIGHTING

    − UV LEDs 2017 - Technology, Manufacturing and Application Trends*

    − Horticultural Lighting 2017 - Technology, Industry and Market Trends

    − Automotive Lighting 2017 - Technology, Industry and Market Trends*

    − Active Imaging and Lidar 2017 - IR Lighting**

    − LED Lighting Module 2017 - Technology, Industry and Market Trends

    − IR LEDs and VCSELs - Technology Applications and Industry Trends 2017

    − Phosphors & Quantum Dots 2017 - LED Downconverters for Lighting & Displays

    − MicroLED Displays 2017

    − CSP LED Lighting Module 2017

    − LED Packaging 2017

    − Thermal Management Technology and Market Perspectives in Power Electronics and LEDs 2017

    PATENT ANALYSIS by Knowmade

    − Consumer Physics SCiO Molecular Sensor Patent-to-Product Mapping 2017

    − Patent Licensing Companies in the Semiconductor Market - Patent Litigation Risk and Potential Targets 2017

    − MEMS Microphone: Patent Landscape Analysis 2017

    − Knowles MEMS Microphones in Apple iPhone 7 Plus Patent-to-Product Mapping

    − Microbolometer: Patents Used in Products 2017

    − Microfluidic Technologies for Diagnostic Applications Patent Landscape 2017

    − Pumps for Microfluidic Devices Patent Landscape

    − III-N Patent Watch

    − MicroLEDs: Patent Landscape Analysis 2017

    − Uncooled Infrared Imaging: Patent Landscape Analysis 2017

    − 3D Monolithic Memory: Patent Landscape Analysis 2017

    − NMC Lithium-Ion Batteries Patent Landscape Analysis

    − FLUIDIGM Patent Portfolio Analysis

    TEARDOWN & REVERSE COSTING by System Plus Consulting More than 60 teardowns and reverse costing analysis and cost simulation tools to be

    published in 2017.

    *2016 version still available / **To be confirmed

    http://www.yole.fr/http://www.yole.fr/

  • 37©2017 | www.yole.fr | About Yole Développement

    OUR 2016 PUBLISHED REPORTS LIST (1/2)

    MARKET AND TECHNOLOGY REPORTS by Yole Développement

    o MEMS & SENSORS

    − Gas Sensors Technology and Market 2016

    − Status of the MEMs Industry 2016

    − Sensors for Cellphones and Tablets 2016

    − Market and Technology Trends of Inkjet Printheads 2016

    − Sensors for Biometry and Recognition 2016

    − Silicon Photonics 2016

    o IMAGING & OPTOELECTRONICS

    − Status of the CMOS Image Sensor Industry 2016

    − Uncooled Infrared Imaging Technology & Market Trends 2016

    − Imaging Technologies for Automotive 2016

    − Sensors for Drones & Robots: Market Opportunities and Technology Evolution 2016

    o MEDTECH

    − BioMEMS 2016

    − Point of Care Testing 2016: Application of Microfluidic Technologies

    o ADVANCED PACKAGING

    − Embedded Die Packaging: Technology and Market Trends 2017

    − 2.5D & 3D IC TSV Interconnect for Advanced Packaging: Business Update 2016

    − Fan-Out: Technologies and Market Trends 2016

    − Fan-In Packaging: Business update 2016

    − Status and Prospects for the Advanced Packaging Industry in China 2016

    o MANUFACTURING

    − Thin Wafer Processing and Dicing Equipment Market 2016

    − Emerging Non Volatile Memories 2016

    o COMPOUND SEMICONDUCTORS

    − Power GaN 2016: Epitaxy and Devices, Applications and Technology Trends

    − GaN RF Devices Market: Applications, Players, Technology and substrates 2016

    − Sapphire Applications & Market 2016: from LED to Consumer Electronics

    − Power SiC 2016: Materials, Devices, Modules, and Applications

    o LED

    − UV LED Technology, Manufacturing and Applications Trends 2016

    − OLED for Lighting 2016 – Technology, Industry and Market Trends

    − Automotive Lighting: Technology, Industry and Market Trends 2016

    − Organic Thin Film Transistor 2016: Flexible Displays and Other Applications

    − Sapphire Applications & Market 2016: from LED to Consumer Electronics

    o POWER ELECTRONICS

    − Power Electronics for EV/HEV 2016: Market, Innovations and Trends

    − Status of Power Electronics Industry 2016

    − Passive Components Technologies and Market Trends for Power Electronics 2016

    − Power SiC 2016: Materials, Devices, Modules, and Applications

    − Power GaN 2016: Epitaxy and Devices, Applications, and Technology Trends

    − Inverter Technologies Trends & Market Expectations 2016

    − Opportunities for Power Electronics in Renewable Electricity Generation 2016

    − Thermal Management Technology and Market Perspectives in Power Electronics and LEDs 2017

    − GaN RF Devices Market: Applications, Players, Technology and substrates 2016

    o BATTERY AND ENERGY MANAGEMENT

    − Beyond Li-ion Batteries: Present and Future Li-ion Technology Challengers 2016

    − Stationary Storage and Automotive Li-ion Battery Packs 2016

    − Opportunities for Power Electronics in Renewable Electricity Generation 2016

    http://www.yole.fr/http://www.yole.fr/

  • 38©2017 | www.yole.fr | About Yole Développement

    OUR 2016 PUBLISHED REPORTS LIST (2/2)

    PATENT ANALYSIS by Knowmade

    − Microbattery Patent Landscape Analysis

    − Miniaturized Gas Sensors Patent Landscape Analysis

    − 3D Cell Culture Technologies Patent Landscape

    − Phosphors and QDs for LED Applications Patent Landscape

    − TSV Stacked Memory Patent Landscape

    − Fan-Out Wafer Level Packaging Patent Landscape Analysis

    TEARDOWN & REVERSE COSTING by System Plus Consulting More than 45 teardowns and reverse costing analysis and cost simulation tools published

    in 2016.

    MORE INFORMATION

    o All the published reports from the Yole Group of Companies are available on our website

    www.i-Micronews.com.

    o Ask for our Bundle and Annual Subscription offers: With our bundle offer, you choose the

    number of reports you are interested in and select the related offer. You then have up to 12

    months to select the required reports from the Yole Développement, System Plus Consulting

    and KnowMade offering. Pay once and receive the reports automatically (multi-user format).

    Contact your sales team according to your location (see the last slide).

    http://www.yole.fr/http://www.yole.fr/http://www.i-micronews.com/

  • 39©2017 | www.yole.fr | About Yole Développement

    MICRONEWS MEDIA

    o About Micronews Media

    To meet the growing demand for market,

    technological and business information,

    Micronews Media integrates several tools able

    to reach each individual contact within its

    network.We will ensure you benefit from this.

    ONLINE ONSITE INPERSON

    @Micronews e-newsletter

    i-Micronews.com

    i-Micronewsjp.com

    FreeFullPDF.com

    Events Webcasts

    Unique, cost-effective ways

    to reach global audiences.

    Online display advertising

    campaigns are great strategies

    for improving your

    product/brand visibility. They

    are also an efficient way to

    adapt with the demands of the

    times and to evolve an effective

    marketing plan and strategy.

    Brand visibility, networking

    opportunities

    Today's technology makes it

    easy for us to communicate

    regularly, quickly, and

    inexpensively – but when

    understanding each other is

    critical, there is no substitute

    for meeting in-person. Events

    are the best way to exchange

    ideas with your customers,

    partners, prospects while

    increasing your brand/product

    visibility.

    Targeted audience

    involvement equals clear,

    concise perception of your

    company’s message.

    Webcasts are a smart,

    innovative way of

    communicating to a wider

    targeted audience. Webcasts

    create very useful, dynamic

    reference material for

    attendees and also for

    absentees, thanks to the

    recording technology.

    Benefit from the i-Micronews.com

    traffic generated by the 8,500+

    monthly visitors, the 11,500+

    weekly readers of @Micronews

    e-newsletter

    Seven main events planned for

    2017 on different topics to

    attract 100 attendees on average

    Gain new leads for your business

    from an average of 300

    registrants per webcast

    Contact: Camille Veyrier ([email protected]), Marketing & Communication Project Manager.

    http://www.yole.fr/http://www.yole.fr/mailto:[email protected]

  • 40©2017 | www.yole.fr | About Yole Développement

    CONTACT INFORMATION

    o CONSULTING AND SPECIFIC ANALYSIS

    • North America: Steve LaFerriere, Director of Northern America Business DevelopmentEmail: [email protected] – +1 31 06 008 267

    • Japan & Rest of Asia: Takashi Onozawa, General Manager, Asia Business DevelopmentEmail: [email protected] - +81 3 4405 9204

    • Greater China: Mavis Wang, Director of Greater China Business DevelopmentEmail: [email protected] - +886 979 336 809

    • RoW: Jean-Christophe Eloy, CEO & President, Yole DéveloppementEmail [email protected] - +33 4 72 83 01 80

    o REPORT BUSINESS

    • North America: Steve LaFerriere, Director of Northern America Business DevelopmentEmail: [email protected] – +1 31 06 008 267

    • Europe: Lizzie Levenez, EMEA Business Development ManagerEmail: [email protected] - +49 15 123 544 182

    • Rest of Asia: Takashi Onozawa, General Manager, Asia Business DevelopmentEmail: [email protected] - +81 3 4405 9204

    • Japan & Asia: Miho Othake, Account ManagerEmail: [email protected] - +81 3 4405 9204

    • Greater China: Mavis Wang, Director of Greater China Business DevelopmentEmail: [email protected] - +886 979 336 809

    o FINANCIAL SERVICES (in partnership with Woodside Capital Partners)

    • Jean-Christophe Eloy, CEO & PresidentEmail: [email protected] - +33 4 72 83 01 80

    o GENERAL

    • Public Relations: [email protected] - +33 4 72 83 01 89

    • Email: [email protected] - +33 4 72 83 01 80

    Follow us on

    http://www.yole.fr/http://www.yole.fr/mailto:[email protected]:[email protected]:[email protected]:[email protected]:[email protected]:[email protected]:[email protected]:[email protected]:[email protected]:[email protected]:[email protected]:[email protected]://www.linkedin.com/company/yole-d-veloppement?trk=top_nav_homehttp://www.linkedin.com/company/yole-d-veloppement?trk=top_nav_homehttps://twitter.com/Yole_Devhttps://twitter.com/Yole_Devhttp://fr.slideshare.net/Yole_Developpementhttp://fr.slideshare.net/Yole_Developpement

  • 41

    About Solid State Lighting LED, OLED… and Display Activities

    ©2017 | www.yole.fr | LED Lighting Module Technology Industry and Market Trends

    http://www.yole.fr/http://www.yole.fr/

  • 42

    Yole is active throughout the value chain: Example of LED and Sapphire activities

    FOCUS ON SOLID STATE LIGHTING LED, OLED AND DISPLAY ACTIVITIES

    ©2017 | www.yole.fr | LED Lighting Module Technology Industry and Market Trends

    We are active throughout the value chain: from substrates to systems.

    And we interact with industrial/R&D players from each level.

    Substrate

    SiC/Sapphire/Silicon/Bulk

    GaN/Engineered

    substrates

    LED epi-

    wafer

    Mesa LED, Flip Chip LED,

    Vertical LED structures

    LED dies-

    on-wafer

    LED dies

    Front-end Level 0 - Epitaxy• Nucleation layer

    • n-type layer

    • Active layers MQW

    • p-type layer

    Back-End Level 0 - Packaging• Substrate separation and Bonding

    • Die singulation

    • Testing and Binning

    LED systems and applications

    Front-end Level 1 - Device Production• Inspection

    • Masking/Lithography

    • Etching

    • Metallization/Contacts/Mirrors

    Back-End level 1 - Packaging• Die Attach and Interconnections

    • Phosphors

    • Encapsulation and Optics

    • Testing and Binning

    Packaged LEDs

    Module Packaging• Substrates PCB

    • Encapsulation and Optics

    • Heatsink

    • Testing and Binning

    LED modules

    http://www.yole.fr/http://www.yole.fr/http://www.amazon.com/gp/product/B007H7G6IE/ref=as_li_ss_tl?ie=UTF8&camp=1789&creative=390957&creativeASIN=B007H7G6IE&linkCode=as2&tag=oledinfo-20http://www.amazon.com/gp/product/B007H7G6IE/ref=as_li_ss_tl?ie=UTF8&camp=1789&creative=390957&creativeASIN=B007H7G6IE&linkCode=as2&tag=oledinfo-20

  • 43

    Insights on Forecast Methodology Example of LED and Sapphire activities

    FOCUS ON SOLID STATE LIGHTING LED, OLED AND DISPLAY ACTIVITIES

    ©2017 | www.yole.fr | LED Lighting Module Technology Industry and Market Trends

    'What’s Behind the Crystal Ball?'

    Only analysts that follow the industry on a daily basis through interviews and developed market modeling tools based on discussions with key players of the industry.

    APPLICATION

    Forecast of standard

    product market volume unite.g.: Smartphone, TVs, lamps

    Definition of functions using

    LEDse.g.: 'Flash vs. Keypad' for

    smartphone

    Definition of technical

    requirementse.g.: Efficacy, size

    Definition of LED

    penetration rate and

    competitiveness with

    alternative technologiese.g.: 'OLED vs. LED' in smartphone

    Forecast of LED market volume in unitsSplit by application, power type low vs. medium vs. high

    power, package type single vs. multi-die

    Definition of LED

    ASPPer power type, packaged

    type

    Forecast of LED market size in $Split by application, power type, package type

    Definition of manufacturing flows for

    front-end and packaging process,

    technologies, materials, yieldsSplit by application, power type, package type

    Forecast of LED manufacturing

    equipment and material markets

    in units and $e.g.: Phosphors, encapsulant, dicing equipment

    Definition of LED die

    surface in mm²

    Definition of substrate die surface in

    mm² and epiwafer volume unitSplit by type of substrate

    Forecast of LED substrate

    markets in units and $Split by type of substrate

    Definition of sales

    levels of key

    manufacturers in

    $Ex: LED, packaging

    materials, epitaxy

    materials, manufacturing

    equipment, MOCVD

    reactor, substrate

    System Plus Consulting

    expertise in reverse

    costing/reverse

    engineering

    http://www.yole.fr/http://www.yole.fr/http://www.systemplus.fr/http://www.systemplus.fr/

  • 44

    About Yole’s Analyst Team

    FOCUS ON SOLID STATE LIGHTING LED, OLED AND DISPLAY ACTIVITIES

    ©2017 | www.yole.fr | LED Lighting Module Technology Industry and Market Trends

    A team based on persons having complementary skills and expertise.

    Pars MUKISH - Business Unit Manager - SSL and Display

    Pars MUKISH holds a master degree in Materials Science and Polymers ITECH - France and a master degree in Innovation

    and Technology Management EM Lyon - France. Since 2015, Pars MUKISH has taken on responsibility for developing LED,

    OLED and Sapphire activities as Business Unit Manager at Yole Développement. Previously, he has worked as Marketing

    Analyst and Techno-Economic Analyst for several years at the CEA French Research Center.

    Dr. Eric VIREY - Senior Market and Technology Analyst - Sapphire and Display

    Eric VIREY holds a Ph-D in Optoelectronics from the National Polytechnic Institute of Grenoble INPG - France. He works

    as Market and Technology Analyst in the fields of Sapphire, LED/OLED and Display. In the last 12 years, he has held various

    R&D, engineering, manufacturing and marketing positions with Saint-Gobain. Most recently, he was Market Manager at Saint-

    Gobain Crystals, in charge of Sapphire and Optoelectronic products.

    Pierrick BOULAY - Market and Technology Analyst - SSL

    Pierrick BOULAY holds a master degree in Electronics from ESEO France. He works as Market and Technology Analyst in

    the fields of LED, OLED and Lighting Systems to carry out technical, economic and marketing analysis. He has experience in

    both LED lighting general lighting, automotive lighting… and OLED lighting. In the past, he has mostly worked in R&D

    department for LED lighting applications.

    http://www.yole.fr/http://www.yole.fr/

  • 45

    Report collection

    FOCUS ON SOLID STATE LIGHTING LED, OLED AND DISPLAY ACTIVITIES

    Previous Publications:

    • Status of the LED Industry

    • LED in Road and Street Lighting

    • LED Front End

    • GaN-on-Si Technology and Market

    • Phosphors and QDs - IP Landscape

    2016 Publications:

    • OLED For Lighting - February 2016

    • Automotive Lighting - April 2016

    • UV LED - August 2016

    • Sapphire - September 2016

    • Organic TFT - October 2016

    2017 Publications:

    • Thermal Management for LED and PE - New

    • LED Packaging - Update

    • MicroLEDs and MicroDisplays - New

    • CSP LED Lighting Module - New

    • IR LEDs and Lasers - New

    • Agricultural Lighting - New

    • LED Lighting Module - Update

    • QD for Display Applications - New

    • LED Downconverters Phosphors and QDs - Update

    • Automotive Lighting - Update

    • UV LED - Update

    • Display for Augmented Reality - New

    ©2017 | www.yole.fr | LED Lighting Module Technology Industry and Market Trends

    A collection of more than 15 reports on Solid State Lighting and Display.

    Our reports are unmatched in quality and technology depth and typically include:

    • Technology trends and evolution: costs, barriers, roadmaps

    • Supply and value chain analysis: business models, relationships

    • In-depth analysis of applications and market drivers: challenges, inflection points

    • Market data: $, units, wafer starts

    Already

    published

    http://www.yole.fr/http://www.yole.fr/


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