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Printed in KoreaP/NO : MFL68026206 (1402-REV00)
CHASSIS : LA46B
MODEL : 39LB5800 39LB5800-UG
CAUTIONBEFORE SERVICING THE CHASSIS,READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
LED TVSERVICE MANUAL
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- 2 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All rights reserved.Only for training and service purposes
CONTENTS
CONTENTS .............................................................................................. 2
PRODUCT SAFETY ................................................................................. 3
SPECIFICATION ....................................................................................... 4
ADJUSTMENT INSTRUCTION ................................................................ 9
BLOCK DIAGRAM .................................................................................. 18
EXPLODED VIEW .................................................................................. 19
SCHEMATIC CIRCUIT DIAGRAM ..............................................................
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- 3 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All rights reserved.Only for training and service purposes
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in theSchematic Diagram and Exploded View.It is essential that these special safety parts should be replaced with the same components as recommended in this manual to preventShock, Fire, or other Hazards.Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during theservicing of a receiver whose chassis is not isolated from the ACpower line. Use a transformer of adequate power rating as thisprotects the technician from accidents resulting in personal injuryfrom electrical shocks.
It will also protect the receiver and it's components from beingdamaged by accidental shorts of the circuitry that may beinadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposedmetallic parts of the cabinet, such as antennas, terminals, etc., tobe sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)With the instrument AC plug removed from AC source, connect anelectrical jumper across the two AC plug prongs. Place the ACswitch in the on position, connect one lead of ohm-meter to the ACplug prongs tied together and touch other ohm-meter lead in turn toeach exposed metallic parts such as antenna terminals, phone
jacks, etc.If the exposed metallic part has a return path to the chassis, themeasured resistance should be between 1 M and 5.2 M .When the exposed metal has no return path to the chassis thereading must be infinite.
An other abnormality exists that must be correc ted before thereceiver is returned to the customer.
Leakage Current Hot Check (See below Figure)Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check. Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitorbetween a known good earth ground (Water Pipe, Conduit, etc.)and the exposed metallic parts.Measure the AC voltage across the resistor using AC voltmeterwith 1000 ohms/volt or more sensitivity.Reverse plug the AC cord into the AC outlet and repeat AC voltagemeasurements for each exposed metallic part. Any voltagemeasured must not exceed 0.75 volt RMS which is corresponds to0.5 mA.In case any measurement is out of the limits specified, there ispossibility of shock hazard and the set must be checked andrepaired before it is returned to the customer.
Leakage Current Hot Check circuit
IMPORTANT SAFETY NOTICE
SAFETY PRECAUTIONS
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- 4 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All rights reserved.Only for training and service purposes
SERVICING PRECAUTIONSCAUTION: Before servicing receivers covered by this servicemanual and its supplements and addenda, read and follow theSAFETY PRECAUTIONS on page 3 of this publication.NOTE : If unforeseen circumstances create con ict between thefollowing servicing precautions and any of the safety precautionson page 3 of this publication, always follow the safety precautions.Remember: Safety First.
General Servicing Precautions1. Always unplug the receiver AC power cord from the AC power
source before;a. Removing or reinstalling any component, circuit board mod-
ule or any other receiver assembly.b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.CAUTION : A wrong part substitution or incorrect polarityinstallation of electrolytic capacitors may result in an explo-sion hazard.
2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,FETVOM, etc) equipped with a suitable high voltage probe.Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of itsassemblies.
4. Unless speci ed otherwise in this service manual, cleanelectrical contacts only by applying the following mixture to thecontacts with a pipe cleaner, cotton-tipped stick or comparablenon-abrasive applicator; 10 % (by volume) Acetone and 90 %(by volume) isopropyl alcohol (90 % - 99 % strength)CAUTION : This is a ammable mixture.Unless speci ed otherwise in this service manual, lubrication ofcontacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with whichreceivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of itselectrical assemblies unless all solid-state device heat sinks arecorrectly installed.
7. Always connect the test receiver ground lead to the receiverchassis ground before connecting the test receiver positivelead.
Always remove the test receiver ground lead last.8. Use with this receiver only the test xtures speci ed in this
service manual.CAUTION : Do not connect the test xture ground strap to anyheat sink in this receiver.
Electrostatically Sensitive (ES) DevicesSome semiconductor (solid-state) devices can be damaged eas-ily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ESdevices are integrated circuits and some eld-effect transistorsand semiconductor chip components. The following techniquesshould be used to help reduce the incidence of component dam-age caused by static by static electricity.1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostaticcharge on your body by touching a known earth ground. Alter-natively, obtain and wear a commercially available dischargingwrist strap device, which should be removed to prevent poten-tial shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ESdevices, place the assembly on a conductive surface such asaluminum foil, to prevent electrostatic charge buildup or expo-sure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ESdevices.
4. Use only an anti-static type solder removal device. Some solderremoval devices not classi ed as anti-static can generateelectrical charges suf cient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generateelectrical charges suf cient to damage ES devices.
6. Do not remove a replacement ES device from its protectivepackage until immediately before you are ready to install it.(Most replacement ES devices are packaged with leads electri-cally shorted together by conductive foam, aluminum foil orcomparable conductive material).
7. Immediately before removing the protective material from theleads of a replacement ES device, touch the protective materialto the chassis or circuit assembly into which the device will beinstalled.CAUTION : Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.8. Minimize bodily motions when handling unpackaged replace-ment ES devices. (Otherwise harmless motion such as thebrushing together of your clothes fabric or the lifting of yourfoot from a carpeted oor can generate static electricity suf -cient to damage an ES device.)
General Soldering Guidelines1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within therange or 500 F to 600 F.
2. Use an appropriate gauge of RMA resin-core solder composedof 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25 cm) brush with a metal handle.Do not use freon-propelled spray-on cleaners.5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.(500 F to 600 F)
b. Heat the component lead until the solder melts.c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.CAUTION: Work quickly to avoid overheating the circuitboard printed foil.
6. Use the following soldering technique.a. Allow the soldering iron tip to reach a normal temperature
(500 F to 600 F)b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of thecomponent lead and the printed circuit foil, and hold it thereonly until the solder ows onto and around both the compo -nent lead and the foil.CAUTION : Work quickly to avoid overheating the circuitboard printed foil.
d. Closely inspect the solder area and remove any excess orsplashed solder with a small wire-bristle brush.
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- 5 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All rights reserved.Only for training and service purposes
IC Remove/ReplacementSome chassis circuit boards have slotted holes (oblong) throughwhich the IC leads are inserted and then bent at against the cir -cuit foil. When holes are the slotted type, the following techniqueshould be used to remove and replace the IC. When working withboards using the familiar round hole, use the standard techniqueas outlined in paragraphs 5 and 6 above.
Removal 1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as thesolder melts.
2. Draw away the melted solder with an anti-static suction-typesolder removal device (or with solder braid) before removingthe IC.
Replacement 1. Carefully insert the replacement IC in the circuit board.2. Carefully bend each IC lead against the circuit foil pad and
solder it.3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor Removal/Replacement1. Remove the defective transistor by clipping its leads as close
as possible to the component body.2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.3. Bend into a "U" shape the replacement transistor leads.4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" withlong nose pliers to insure metal to metal contact then soldereach connection.
Power Output, Transistor DeviceRemoval/Replacement
1. Heat and remove all solder from around the transistor leads.2. Remove the heat sink mounting screw (if so equipped).3. Carefully remove the transistor from the heat sink of the circuit
board.4. Insert new transistor in the circuit board.5. Solder each transistor lead, and clip off excess lead.6. Replace heat sink.
Diode Removal/Replacement1. Remove defective diode by clipping its leads as close as pos-
sible to diode body.2. Bend the two remaining leads perpendicular y to the circuit
board.3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.5. Inspect (on the circuit board copper side) the solder joints ofthe two "original" leads. If they are not shiny, reheat them and ifnecessary, apply additional solder.
Fuse and Conventional Resistor Removal/Replacement1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.CAUTION: Maintain original spacing between the replacedcomponent and adjacent components and the circuit board toprevent excessive component temperatures.
Circuit Board Foil Repair Excessive heat applied to the copper foil of any printed circuitboard will weaken the adhesive that bonds the foil to the circuitboard causing the foil to separate from or "lift-off" the board. Thefollowing guidelines and procedures should be followed wheneverthis condition is encountered.
At IC ConnectionsTo repair a defective copper pattern at IC connections use thefollowing procedure to install a jumper wire on the copper patternside of the circuit board. (Use this technique only on IC connec-tions).
1. Carefully remove the damaged copper pattern with a sharpknife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.3. Bend a small "U" in one end of a small gauge jumper wire andcarefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copperpattern and let it overlap the previously scraped end of thegood copper pattern. Solder the overlapped area and clip offany excess jumper wire.
At Other ConnectionsUse the following technique to repair the defective copper patternat connections other than IC Pins. This technique involves theinstallation of a jumper wire on the component side of the circuitboard.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardouscondition will not exist if the jumper wire opens.2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly con-nected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of thenearest component on one side of the pattern break to the leadof the nearest component on the other side.Carefully crimp and solder the connections.CAUTION : Be sure the insulated jumper wire is dressed so theit does not touch components or sharp edges.
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- 6 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All rights reserved.Only for training and service purposes
SPECIFICATIONNOTE : Specifications and others are subject to change without notice for improvement .
1. Application range1.1. This spec sheet is applied all of the 32, 39, 42, 47, 50,
55, 60, 65 LED TV with LA46B chassis.1.2. Not included spec and each product spec in this spec
sheet apply correspondingly to the following each countrystandard and requirement of Buyer
2. Test conditionEach part is tested as below without special notice.
1) Temperature : 20 C 5 C2) Relative Humidity: 65 % 10 %3) Power Voltage
Market Input voltage Frequency Remark
USA 110~240V 50/60Hz Standard Voltage of eachproduct is marked bymodels
4) Specification and performance of each parts are followedeach drawing and specification by part number inaccordance with BOM
5) The receiver must be operated for about 20 minutes prior tothe adjustment
3. Test method1) Performance: LGE TV test method followed2) Demanded other specification
- Safety : UL, CSA, IEC specification- EMC: FCC, ICES, IEC specification- Wireless : WirelessHD Specification (Option)
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- 7 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All rights reserved.Only for training and service purposes
4. General SpecificationNo Item Speci cation Remark
1 Market 1) North America
2 Television System NTSC-M, ATSC, 64 & 256 QAM
3 Input Voltage AC 100 ~ 240V 50/60Hz4 Available Channel 1) VHF : 02~13
2) UHF : 14~693) DTV : 02-694) CATV : 01~1355) CADTV : 01~135
5 Aspect Ratio 16:9
6 Tuning System FS
7 LCD Module LC550DUE-FGA3 LGD 55LB5800-UA
T500HVF05.0 AUO 50LB5800-UA
LC550DUE-FGA4 LGD 55LB6100-UG
LC500DUE-FGA4 LGD 50LB5800-UG, 50LB6100-UG
LC470DUE-FGA4 LGD 47LB5800-UG, 47LB6100-UGLC420DUE-FGA4 LGD 42LB5800-UG
LC650DUF-FGA1 LGD 65LB6190-UD
HC600DUF-VHHS2 Sharp 60LB6100-UG
T550HVF04.2 AUO 55LB6100-UG/55LB5800-UG
NC500DUN-VXBP2 INX 50LB6100-UG/50LB5800-UG
T420HVF07.0 AUO 42LB5800-UG
NC390DUN-VXBP2 INX 39LB5800-UG
LC320DUE-FGA4 LGD 32LB5800-UG
NC320DXN-VSBP2 Sharp 32LB580B-UG
LC320DXE-FGA4 LGD 32LB580B-UG
8 Operating Environment 1) Temp : 0 ~ 40 deg2) Humidity : ~ 80 %
9 Storage Environment 1) Temp : -20 ~ 60 deg2) Humidity : ~ 85 %
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- 8 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All rights reserved.Only for training and service purposes
5. Supported video resolutions5.1. Component 2D input(Y, CB/PB, CR/PR)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed
1. 720*480 15.73 60 13.5135 SDTV ,DVD 480I
2. 720*480 15.73 59.94 13.5 SDTV ,DVD 480I3. 720*480 31.50 60 27.027 SDTV 480P
4. 720*480 31.47 59.94 27.0 SDTV 480P
5. 1280*720 45.00 60.00 74.25 HDTV 720P
6. 1280*720 44.96 59.94 74.176 HDTV 720P
7. 1920*1080 33.75 60.00 74.25 HDTV 1080I
8. 1920*1080 33.72 59.94 74.176 HDTV 1080I
9. 1920*1080 26.97 23.976 74.176 HDTV 1080P
10. 1920*1080 27.00 24.00 74.25 HDTV 1080P
11. 1920*1080 33.71 29.97 74.176 HDTV 1080P
12. 1920*1080 33.75 30.00 74.25 HDTV 1080P
13. 1920*1080 67.432 59.94 148.352 HDTV 1080P
14. 1920*1080 67.50 60 148.50 HDTV 1080P
5.2. HDMI Input (PC/DTV)
No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed
PC DDC
1 640*350 31.468 70.09 25.17 EGA X
2 720*400 31.469 70.08 28.32 DOS O
3 640*480 31.469 59.94 25.17 VESA(VGA) O
4 800*600 37.879 60.31 40.00 VESA(SVGA) O5 1024*768 48.363 60.00 65.00 VESA(XGA) O
6 1152*864 54.348 60.053 80.002 VESA O
7 1360*768 47.712 60.015 85.50 VESA (WXGA) X
8 1280*1024 63.981 60.020 108.00 VESA (SXGA) O
9 1920*1080 67.5 60 148.5 HDTV 1080P O
DTV
1 720*480 31.50 60 27.027 SDTV 480P
2 720*480 31.469 59.94 27.00 SDTV 480P
3 1280*720 45.00 60.00 74.25 HDTV 720P
4 1280*720 44.96 59.94 74.176 HDTV 720P
5 1920*1080 33.75 60.00 74.25 HDTV 1080I6 1920*1080 33.72 59.94 74.176 HDTV 1080I
7 1920*1080 67.500 60 148.50 HDTV 1080P
8 1920*1080 67.43 59.94 148.352 HDTV 1080P
9 1920*1080 27.000 24.000 74.25 HDTV 1080P
10 1920*1080 26.97 23.97 74.176 HDTV 1080P
11 1920*1080 33.75 30.000 74.25 HDTV 1080P
12 1920*1080 33.716 29.976 74.176 HDTV 1080P
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ADJUSTMENT INSTRUCTION1. Application
This spec. sheet applies to LA46B Chassis applied LED TV allmodels manufactured in TV factory
2. Specification(1) Because this is not a hot chassis, it is not necessary to usean isolation transformer. However, the use of isolationtransformer will help protect test instrument.
(2) Adjustment must be done in the correct order.(3) The adjustment must be performed in the circumstance of
25 5 C of temperature and 6510% of relative humidity ifthere is no specific designation
(4) The input voltage of the receiver must keep 100~240V,50/60Hz
(5) At first Worker must turn on the SET by using Power Onlykey.
(6) The receiver must be operated for about 5 minutes prior tothe adjustment when module is in the circumstance of over15 C
In case of keeping module is in the circumstance of 0C, itshould be placed in the circumstance of above 15C for 2hours
In case of keeping module is in the circumstance of below-20C, it should be placed in the circumstance of above15C for 3 hours.
CautionWhen still image is displayed for a period of 20 minutes orlonger (especially where W/B scale is strong.Digital pattern 13ch and/or Cross hatch pattern 09ch), therecan some afterimage in the black level area
3. Adjustment items3.1. Final assembly adjustment
(1) White Balance adjustment(2) RS-232C functionality check(3) Factory Option setting per destination(4) Shipment mode setting (In-Stop)(5) GND and HI-POT test
3.2. Appendix(1) Tool option menu, USB Download (S/W Update, Option
and Service only)(2) Manual adjustment for ADC calibration and White balance.(3) Shipment conditions, Channel pre-set
4. MAIN PCBA Adjustments4.1. ADC Calibration
- An ADC calibrat ion is not necessar y because MAIN SoC(LGExxxx) is already calibrated from IC Maker
4.2. MAC Address, ESN Key and WidevineKey, DTCP Key, HDCP1.4, HDCP2.0download
4.2.1. Equipment & Condition1) Play file: keydownload.exe
4.2.2. Communication Port connection1) Key Write: Com 1,2,3,4 and 115200 (Baudrate)2) Barcode: Com 1,2,3,4 and 9600 (Baudrate)
4.2.3. Download process1) Select the download items.2) Mode check: Online Only3) Check the test process- US, Ca nada model s: DET ECT -> MAC_WRITE ->
WIDEVINE_WRITE4) Play : START5) Check of result: Ready, Test, OK or NG6) Printer out (MAC Address Label)
4.2.4. Communication Port connection1) Connect: PCBA Jig -> RS-232C Port == PC -> RS-232C
Port
4.2.5. Download1) US, Canada models (14Y LED TV + MAC + Widevine +
ESN Key + DTCP Key + HDCP1.4 and HDCP2.0)
4.2.6. Inspection- In INSTART menu, check these keys.
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4.3. LAN port Inspection (Ping Test)4.3.1. Equipment setting
1) Play the LAN Port Test PROGRAM.2) Input IP set up for an inspection to Test Program. - IP number: 12.12.2.2
4.3.2. LAN PORT inspection (PING TEST)1) Play the LAN Port Test Program.2) Connect each other LAN Port Jack.3) Play Test (F9) button and confirm OK Message.4) Remove LAN CABLE
4.4. EDID Download4.4.1 Overview
It is a VESA regulation. A PC or a MNT will display anoptimal resolution through information sharing without anynecessity of user input. It is a realization of Plug and Play.
4.4.2 Equipment Since embedded EDID data is used, EDID download JIG,
HDMI cable and D-sub cable are not need. Adjust remocon
4.4.3. EDID DATA4.4.3.1. . 2D_8bit_PCM(US) _ xvYCC : off (HD)
HDMI EDID 2D_8bit_PCM(US)_xvYCC : off (HD)
Reference- HDMI1 ~ HDMI3- In the data of EDID, bellows may be different by S/W or Input
mode.
Product ID
HEX EDID Table DDC Function
0001 0100 Analog
0001 0100 Digital
Serial No: Controlled on production line. Month, Year: Controlled on production line:ex) Monthly : 01 -> 01
Year : 2014 -> 18 Model Name(Hex): LGTV
Chassis MODEL NAME(HEX)
LA46B 00 00 00 FC 00 4C 47 20 54 56 0A 20 20 20 20 20 20 20
Checksum(LG TV): Changeable by total EDID data.
1 2 3
HDMI1 A5 0C X
HDMI2 A5 FC X
HDMI3 A5 EC X
Vendor Specific(HDMI)
INPUT MODEL NAME(HEX)
HDMI1 67 03 0C 00 10 00 80 1E
HDMI2 67 03 0C 00 20 00 80 1E
HDMI3 67 03 0C 00 30 00 80 1E
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4.4.3.2. 2D_8bit_PCM(US) _ xvYCC : off HDMI EDID 2D_8bit_PCM(US)_xvYCC : off
Reference- HDMI1 ~ HDMI3- In the data of EDID, bellows may be different by S/W or Input
mode.
Product IDHEX EDID Table DDC Function
0001 0100 Analog
0001 0100 Digital
Serial No: Controlled on production line. Month, Year: Controlled on production line:ex) Monthly : 01 -> 01
Year : 2014 -> 18 Model Name(Hex): LGTV
Chassis MODEL NAME(HEX)
LA46B 00 00 00 FC 00 4C 47 20 54 56 0A 20 20 20 20 20 20 20
Checksum(LG TV): Changeable by total EDID data.1 2 3
HDMI1 E7 1C X
HDMI2 E7 0C X
HDMI3 E7 FC X
Vendor Specific(HDMI)
INPUT MODEL NAME(HEX)
HDMI1 67 03 0C 00 10 00 80 1E
HDMI2 67 03 0C 00 20 00 80 1E
HDMI3 67 03 0C 00 30 00 80 1E
4.4.3.3. 2D_10bit_PCM(US) _ xvYCC : offHDMI EDID 2D_10bit_PCM(US)_xvYCC : off
Reference- HDMI1 ~ HDMI3- In the data of EDID, bellows may be different by S/W or Input
mode.
Product IDHEX EDID Table DDC Function
0001 0100 Analog
0001 0100 Digital
Serial No: Controlled on production line. Month, Year: Controlled on production line:ex) Monthly : 01 -> 01
Year : 2014 -> 18 Model Name(Hex): LGTV
Chassis MODEL NAME(HEX)
LA46B 00 00 00 FC 00 4C 47 20 54 56 0A 20 20 20 20 20 20 20
Checksum(LG TV): Changeable by total EDID data.1 2 3
HDMI1 E7 02 X
HDMI2 E7 F2 X
HDMI3 E7 E2 X
Vendor Specific(HDMI)
INPUT MODEL NAME(HEX)
HDMI1 67 03 0C 00 10 00 B8 2D
HDMI2 67 03 0C 00 20 00 B8 2D
HDMI3 67 03 0C 00 30 00 B8 2D
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5.2. Tool Option setting & Inspection percountries
5.2.1. Overview(1) Tool option selection is only done for models in Non-USA
North America due to rating
(2) Applied model: LA46B Chassis applied to CANADA andMEXICO
5.2.2. Country Group selection(1) Press ADJ key on the Adj. R/C, and then select Country
Group Menu(2) Depending on destination, select US, then on the lower
Country option, select US, CA, MX. Selection is done using +, - KEY
5.2.3. Tool Option inspection Press Adj. key on the Adj. R/C, then select Tool option
Model Tool 1 Tool 2 Tool 3 Tool 4 Tool 5 Tool 6 Tool 7
32LB580B-UG(Sharp) 6769 13329 33152 64070 4566 1353 41771
32LB580B-UG(LGD) 625 13329 33152 64070 4310 1354 41771
32LB5800-UG 625 13329 33152 64070 4310 1353 41771
39LB5800-UG 14963 13329 33152 64070 4566 1353 41771
42LB5800-UG(LGD) 628 13329 33152 64070 4310 1433 41771
42LB5800-UG(AUO) 4724 13329 33152 64070 4310 1353 41771
47LB5800-UG 629 13329 33152 64070 4310 1353 41771
50LB5800-UG(AUO) 4726 13329 33152 64070 4310 1353 41771
50LB5800-UG(INX) 14966 13329 33152 64070 4310 1353 41771
55LB5800-UG(LGD) 631 13329 33152 64070 4310 1402 41771
55LB5800-UA(AUO) 4727 13329 33152 64070 4310 1353 41771
47LB6100-UG 677 13329 33152 64070 12502 1353 41771
50LB6100-UG(LGD) 678 13329 33152 64070 12502 1353 41771
50LB6100-UG(AUO) 4774 13329 33152 64070 12502 1353 41771
50LB6100-UG(INX) 15014 13329 33152 64070 12502 1353 41771
55LB6100-UG(LGD) 679 13329 33152 64070 12502 1402 41771
55LB6100-UG(AUO) 4775 13329 33152 64070 12502 1353 41771
60LB6100-UG 39592 13329 33152 64070 12502 1353 41771
65LB6190-UD 34467 13329 33152 64070 12502 1353 41771
Tool option can be reconstructed by Software
5.3. Magic Motion remote controller Check5.3.1. Test equipment
RF-remote c ontroller for check, IR-KEY-CODE remotecontroller.
Check AA battery before test. A recommendation is that atester change battery every lots.
5.3.2. Test(1) Make pairing with TV set by pressing Start key(Wheel
key) on RCU.(2) Check a cursor on screen by pressing Wheel key of RCU(3) Stop paring with TV set by pressing Back+ Home key of
RCU
5.3.3. Applied modelsChassis Model Name Magic RF receiver
LA46B 32LB580B-UG Dongle
32/39/42/47/50/55LB5800-UG
47/50/55/60LB6100-UG
Dongle Model : An USB dongl e-ty pe rec eiv er wil l besupplied in form of accessory. So thispairing test is not necessary for thesemodels
5.4. Wi-Fi MAC Address Check5.4.1. Using RS232 Command
Command Set ACK
Transmission [A][l][][Set ID][][20][Cr] [O][K][x] or [N][G]
5.4.2. Check the menu on in-start
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5.5. HDMI ARC Function Inspection5.5.1. Test equipment
- Optic Receiver Speaker- MSHG-600 (SW: 1220 )- HDMI Cable (for 1.4 version)
5.5.2. Test method(1) Insert the HDMI Cable to the HDMI ARC port from the
master equipment (HDMI1)
(2) Check the sound from the TV Set
(3) Check the Sound from the Speaker or using AV & OpticTEST program (Its connected to MSHG-600)
* Remark: Inspect in Power Only Mode and check SW versionin a master equipment
5.6. HDMI MHL Function Inspection5.6.1. Test method
(1) Insert the HDMI Cable to the HDMI MHL port from themaster equipment, HDMI3
(2) Check the Green LED of Tester, and TV Display
5.7. EYE-Q Green Function InspectionStep 1) Turn on the TV..Step 2) Press 'EYE button' on the adjustment remote-
controller.Step 3) Cover 'Eye Q sensor' on the front of set with your
hands, hold it for 6 seconds.Step 4) Check "the Sensor Data" on the screen, make certain
that Data is below 10. If Data isnt below 10 in 6seconds, Eye Q sensor would be bad. You shouldchange Eye Q sensor.
Step 5) Uncover your hands from Eye Q sensor, hold it for 6seconds.
Step 6) Check "Back Light(xxx)" on the screen, check dataincrease . You should change Eye Q sensor
5.8. Ship-out mode check (In-stop) After final inspection, press In-Stop key of the Adj. R/C andcheck that the unit goes to Stand-by mode
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9. Optional adjustments9.1. Manual White balance Adjustment9.1.1. Adj. condition and cautionary items
(1) Lighting condition in surrounding area surrounding lightingshould be lower 10 lux. Try to isolate adj. area into dark
surrounding.(2) Probe location: Color Analyzer (CA-210) probe should bewithin 10cm and perpendicular of the module surface(80~ 100)
(3) Aging time i) After Aging Start, Keep the Power ON status during 5
Minutes. ii) In case of LCD, Back-light on should be checked using no
signal or Full-white pattern.
9.1.2. Equipment(1) Color Analyzer: CA-210 (NCG: CH 9 / WCG: CH12 / LED:
CH14)(2) Adj. Computer (During auto adj., RS-232C protocol i s
needed)(3) Adjust Remocon(4) Video Signa l Generat or MSPG-9 25F 720p/216 -Gray
(Model: 217, Pattern: 78)
9.1.3. Adjustment(1) Set TV in Adj. mode using POWER ON(2) Zero Calibrate the probe of Color Analyzer, then place it on
the center of LCD module within 10cm of the surface.(3) Press ADJ key -> EZ adjust using adj. R/C -> 6. White-
Balance then press the cursor to the right (KEY). WhenKEY() is pressed 216 Gray internal pattern will bedisplayed.
(4) One of R Gain / G Gain / B Gain should be fixed at 192,and the rest will be lowered to meet the desired value.
(5) Adj. is performed in COOL, MEDIUM, WARM 3 modes ofcolor temperature. If internal pattern is not available, use RF input. In EZ Adj.
menu 6.White Balance, you can select one of 2 Test-pattern:ON, OFF. Default is inner(ON). By selecting OFF, you canadjust using RF signal in 216 Gray pattern.
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BLOCK DIAGRAM
A u
d i o A M P
( N T P 7 5 1 3 )
M T K A 2
C I S l o t
P_ T
S
P_ T
S
T / C D e m o
d
I F ( + / - )
U S B 1
O P T I C
L A N
D D R 3
1 6 0 0 X 1 6
( 5 1 2 M
B X 2 E A )
H D M I 1
H D M I 2
H D M I 3
A n a l o g
D e m o
d
S Y S T E M E E P R O
M
( 2 5 6 K b )
H D M I
M U X
A i r /
C a b
l e
T U N E R
( T / C / A )
L N B
U S B 2
U S B 3
4 1 P
5 1 P
e M M C
( 4 G B )
S u
b M i c o m
( R E N E S A S
R 5 F 1 0 0 0 G )
D D R 3 1 6 0 0 X 1 6
( 2 5 6 M B X 1 E A )
P_ T
S
5 0 P
5 0 P
X_ T
A L
2 7 M H z
T / C / S 2 W i t h o u
t A T V
L V D S D i a g r a m
A
B
H D C P E E P R O M
( 1 6 K b )
X_ T
A L
3 2 . 7
6 8 K H z
I 2 S O u
t
I 2 C 1
E P I
I 2 C 2
L V D S
U S B
P_ T
S
I 2 C 5
I 2 C 1
H / P
A V / C O M P
T u n e r : I
2 C 6
D V B - S : I
2 C 4
O C P
2 . 5 A
O C P
1 A
( H D D )
M H L 1 A
S I L 1 3 9 2
8 0 0 M H z
M H L : I
2 C 4
M H L
R E A R S I D E S I D E
R E A R ( H )
A M P
T I
C V B S / Y P b P r
S P D I F O U T
E T H E R N E T
I 2 C 3
L O C A L D I M M I N G
B L U T O O T H
I R / N F C
P M I C
L E V E L
S H I F T E R
W I F I
K E Y
L O G O L I G H T
S U B
A S S Y
I 2 C 1
U A R T I R
K E Y
U S B
_ W I F I
8 0 0 M H z
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EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. Theseparts are identified by in the Schematic Diagram and EXPLODED VIEW.It is essential that these special safety parts should be replaced with the same components asrecommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.Do not modify the original design without permission of manufacturer.
IMPORTANT SAFETY NOTICE
A 2
A 3
A 1 0
L V 1
* S e t + S t a n d
2 0 0
5 3 0
4 1 0
1 2 0
1 2 1
5 4 0
5 2 1
4 0 0
9 0 0
3 1 0
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Fi
b e
r
O p t
i c
HE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.IRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF ISSSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FORHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
SPDIF_OUTC36020.1uF16V
R36112.7K
OPT J
K 3 6 0 2
J S T
1 2 2 3
- 0 0 1 1
GND
2VCC
3VINPUT
4
F I X
_ P O L E
+3.3V_NORMAL
R361033
SPDIF
SPDIF OUT
r i g h t$ 2 0 1 4 L G E l e c t r o n i c s .I n c . Al lr i g h tr e s e r v eo r t r a i n i n ga n d s e r v i c ep u r p o s e s
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THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF ISESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
LED_R
R410710K
L4111BLM18PG121SN1D
WIFI
WOL/ETH_POWER_ON
R4114100
C41020.1uF
R411710K
5%
D41045.6V
AMOTECH CO., LTD.
OPT
R41341K
LOGO_LIGHT
+3.5V_ST
C41000.1uF
+3.5V_ST
R4131
22LOGO_LIGHT R4130
22
OPT
+3.5V_ST
+3.5V_ST
C41110.1uF
16V
WIFI
R 4
1 3 2
1 0
K
L O G O
_ L I G H T Q4100
MMBT3904(NXP)
LOGO_LIGHT
E
B
C
D41015.6V
AMOTECH CO., LTD.OPT
C4113
10uF10V
WIFI
R 4
1 3 3
1 0
K
O P T
WIFI_DP
WIFI_DM
P4101
12507WR-08L
NON_EYE_Q_8P
1GND
2KEY1
3KEY2
4+3.5V_ST
5GND
6LOGO/LED_R
7IR
8GND
9
L4100BLM18PG121SN1D
LOGO_LIGHT
R4113100
C41041000pF50V
R411810K5%
C4107100pF
50V
R 41 25 1 0K
LED_R
C4112
10uF10V
WIFI
KEY2
IR
C41200.1uF16V
L O G O
_ L I G H T
KEY1
+3.5V_S
D41005.6V
AMOTECH CO., LTD.OPT
R413622
WIFI
WOL/WIFI_POWER_ON
P4102
12507WR-10L
EYE_Q_10P
1
2
3
4
5
6
7
8
9
10
11
EYE_SCL
EYE_SDA
D4105ADMC 5M 02 200LOPT
D4106ADMC 5M 02 200L
OPT
R4137100
EYE_Q_10P
R4138100
EYE_Q_10P
P4100
12507WR-06L
WIFI
1
2
3
4
5
6
7
ZD4100
ADLC 5S 02 015WIFI_ESD
ZD4101
ADLC 5S 02 015WIFI_ESD
Place Near Micom
MAX 0.4A
For EMI
$ 2 0 1 4 L G E l e c t r o n i c s . I n c . A l l r i g h t r e s e r v e d .
o r t r a i n i n g a n d s e r v i c e p u r p o s e s
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HE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.IRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF ISSSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FORHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
COMP1/AV1/DVI_R_IN
COMP1/AV1/DVI_L_IN
SOC_RX
AV1_CVBS_DET
COMP1_D
C38000.1uF16V
COMP1_Y/A
+3.3V_NORMAL
+3.5V_ST
COMP1_Pb
+3.3V_NORMAL
D38005.6V
AV_COMP_ESDD38015.6V
AV_COMP_ESD
R381010K
P3800
12507WS-04L
UART_4PIN_STRAIGHT
1
2
3
4
5
COMP1_Pr
D38025.6V
AV_COMP_ESD
R380610K
D38035.6V
AV_COMP_ESD
SOC_TX
Z D
3 8 0
4
A D U C
5 S
0 2
0
R 5 L
O P T
JK3800PPJ245-01
NON_Mold_AV
6A [GN]C-SPRING
7A [GN]E-LUG
4A [GN]CONTACT
5B [BL]C-SPRING
8C [RD1]E-LUG-S
6C [RD1]C-SPRING
4C [RD1]CONTACT
5D [WH]C-SPRING
4E
[RD2]CONTACT6E
[RD2]C-SPRING7E
[RD2]E-LUG
R38111K
R38121K
JK3800-*1PPJ245N2-01
Mold_AV
6A [GN/YL]O-SPRING
7A [GN/YL]E-LUG
4A [GN/YL]CONTACT
5B [BL]O-SPRING
8C [RD1]E-LUG-S
6C [RD1]O-SPRING
4C [RD1]CONTACT
5D [WH]O-SPRING
4E [RD2]CONTACT
6E [RD2]O-SPRING
7E [RD2]E-LUG
AV/COMPONENT REAR
D
UART FOR DEBUG
Apply "AV_COMP_ESD" when your models ESD Test is failed
t $ 2 0 1 4 L G E l e c t r o n i c s . I n c . A l l r i g h t r e s e r v e d .
o r t r a i n i n g a n d s e r v i c e p u r p o s e s
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THERMAL
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF ISESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
R541112
0.1uF
C5413
16V
AMP_MUTE
0.1uFC5420
50V
+24V_AMP
AUD_LRCH
R 5 40 3 1 0 0
+24V
R541012
C 5 4
1 6
2 2 0 0 0
p F
5 0
V
L5401BLM18PG121SN1D
0.1uF
C5421
50V
R540712
C54271uF10V
R5400 10K
AMP_MUTE_MICOM
AUD_SCK
+24V_AMP
R 5 40 2 1 0 0
+3.3V_NORMAL
R540912
0.1uFC5418
50V
AUD_MASTER_CLK
I2C_SCL1
R541412
R5405 100
AMP_MUTE_MICOM
R54063.3
OPT
0.1uFC5400
50V
C542522000pF50V
AUD_LRCK
C5430390pF50V
R541312
C54281uF10V
C540833pF50V
C54400.1uF16V
OPT
C541410uF10V
C54151000pF
50V
C540633pF50V
C54240.01uF50V
OPT
AMP_RESET_N
C54331uF10V
C5431390pF50V
C54110.1uF16V
C5432390pF50V
+24V_AMP
+3.3V_NORMAL
C542622000pF50V
R540110K
AMP_MUTE_MICOM
R540812
R541212
C5417
22000pF
50V
0.1uFC5401
50V
I2C_SDA1
0.1uF
C5419
50VQ5400
MMBT3904(NXP)AMP_MUTE_MICOME
B
C
C5429390pF50V
C54041000pF
50V
1uFC5412
10V
L5
LPH604
10
L5
LPH604
10
L54
LPH6045
10uH
L54
LPH6045T
10uH
IC5400
NTP7513
3DGND_PLL2VDD_PLL
4GND
1AGND_PLL
6DVDD5DGND
7SDATA
8WCK
9BCK
10SDA
1 1
S C L
1 2
F A U L T
1 3
M O N I T O R
_ 0
1 4
M O N I T O R
_ 1
1 5
M O N I T O R
_ 2
1 6
B S T
2 B
1 7
P G N D
2 B
1 8
O U T
2 B
1 9
P V D D
2 B
2 0
P V D D
2 A
21 OUT2A22 PGND2A23 BST2A24 VDR225 AGND26 VCC527 VDR128 BST1B29 PGND1B30 OUT1B
3 1
P V D D
1 B
3 2
P V D D
1 A
3 3
O U T
1 A
3 4
P G N D
1 A
3 5
B S T
1 A
3 6
R E S E T
3 7
A D
3 8
C L K
_ I
3 9
G N D
_ I O
4 0
V D D
_ I O
41
[ E P ] G N D
C542210uF35V
C5423
10uF
35V
R 5 4
1 9
1 0 0
A M P
_ M U T E
_ P W R
_ D E T
POWER_DET
L5400UBW2012-121F
0x54
DUAL COMPONENT
Q1801 1ST : 0TRIY80001A 2ND : 0TR387500AA
MP_MUTE_PWR_DET]-->For fixing AC-OFF POP noise 32"POLA/ROW model->32"POLA/ROW LPBs 3.5st drop time is very fast
r i g h t$ 2 0 1 4 L G E l e c t r o n i c s .I n c .Al lr i g h tr e s e r v ef o rt r a i n i n ga n d s e r v i c ep u r p o s e s
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HE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.IRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF ISSSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FORHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
R610010K
HP_OUTC61011uF10VHP_OUT
C61001uF10VHP_OUT
+3.3V_NORMAL
C61051uF10V
HP_OUT
R610110K
HP_OUT
HP_LOUT_AMP
HP_LOUT
SIDE_HP_MUTE
+3.3V_NORMAL
R610443K
1%
HP_OUT
R610333K
HP_OUT_MTK
C61021uF10V
HP_OUT
R61054.7K
H P
_ O U T
C61031uF10V
HP_OUT
HP_ROUT_MAIN
L6100120-ohm
H P
_ O U T
BLM18PG121SN1D
C6104180pF
HP_OUT_MTK
R610643K
1%
HP_OUT
C61070.1uF16V
HP_OUT
C6109180pF
HP_OUT_MTK
R610233K
HP_OUT_MTK
HP_ROUT_AMP
C6104-*118pF
HP_OUT_H13C6109-*118pF
HP_OUT_H13
C610810pF50V
HP_OUT
C610610pF50V
HP_OUT
IC6100TPA6138A2
HP_OUT
3OUTR
2-INR
4GND_1
1+INR
6VSS
5MUTE
7CN
8CP
9VDD
10GND_2
11UVP
12OUTL
13-INL
14+INL
R6103-*143K
1%
HP_OUT_H13 R6102-*143K
1%
HP_OUT_H13
EARPHONE AMP
p y r g e c r o n c s .n c .r g r e s elf o rt r a i n i na n ds e r v i c eu r o s e s
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THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF ISESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
L/DIM0_VS_PWR
L/DIM0_SCLK_PWR
R760110KL/DIM_OUT_8P
P760012507WR-08L
L/DIM_OUT_8P
1
2
3
4
5
6
7
8
9
L/DIM0_MOSI_PWR
R760233
L/DIM_OUT_8P
R760333
L/DIM_OUT_8PI2C_SCL1
I2C_SDA1
[To LED DRIVER]
LOCAL DIMMING
p y r g e c r o n c s .n c .r g r e s ef o rt r a i n i na n ds e r v i c eu r o s e s
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HE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.IRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF ISSSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FORHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
+24V_AMP
C545010uF35V
OPT
g h t $ 2 0 1 4 L G E l e c t r o n i c s . I n c . A l l r i g h t r e s e r v e d .
o r t r a i n i n g a n d s e r v i c e p u r p o s e s
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HE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.IRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF ISSSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FORHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
R3706
10K
HP_LOUT
HP_ROUT
+3.3V_NORMAL
HP_DET
JK3700
PEJ034-01
6BT_TERMINAL2
7BB_TERMINAL2
5T_SPRING
4R_SPRING
3E_SPRING
R37051K
ZD3703
20VADUC 20S 02 010L
OPT
R 3
7 2 0
1 0 0
R S
2 3 2
C_
U S
R 3
7 2 1
1 0 0
R S
2 3 2
C_
U S
C37100.1uF
RS232C_US
C37130.1uF
RS232C_US
C37090.1uF
RS232C_US
+3.5V_ST
SOC_TX
ZD3702ADUC 20S 02 010L20V
OPT
C37080.1uF
RS232C_US
IC3700
MAX3232CDR
EAN41348201
RS232C_US
3C1-
2V+
4C2+
1C1+
6V-
5C2-
7DOUT2
8RIN2
9ROUT2
10DIN2
11 DIN1
12ROUT1
13RIN1
14DOUT1
15GND
16VCC
C37110.1uF
RS232C_US
SOC_RX
RS-232C Control INTERFACE(NORTH AMERICA)
Closed to Jack
t $ 2 0 1 4 L G E l e c t r o n i c s . I n c . A l l r i g h t r e s e r v e d .
o r t r a i n i n g a n d s e r v i c e p u r p o s e s
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U S B
D O W N
S T R E A M
U S B
D O W N
S T R E A M
T H E R M A L
T H E R M A L
U S B
D O W N
S T R E A M
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF ISESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
USB_CTL2
/USB_OCD2
/USB_OCD3
JK43023AU04S-305-ZC-(LG)
1
2
3
4
5
USB_DP3
USB_DP2
USB_DM2
USB_CTL3
R 4
3 0 1
1 0
K
+5V_USB_2
R 4
3 0 2
1 0
K
JK43003AU04S-305-ZC-(LG)
1
2
3
4
5
C43020.1uF16V
+5V_USB_3
USB_DM3
+5V_NORMAL
+5V_USB_2
+3.3V_NORMAL
+5V_USB_3
C430110uF
10V
C433710uF
10V
C4322
10uF10V
C4310
10uF10V
IC4306TPS2066CDGNR
USB2/3_OCP_TI
3EN1
2IN
4EN2
1GND
5FLT2
6OUT2
7OUT1
8FLT1
9
[EP]GND
IC4306-*1DIODES TAIWAN INC
USB2/3_OCP_DIODES
3EN1
2IN
4EN2
1GND
5FLG2
6OUT2
7OUT1
8FLG1
9
[EP]GND
R43032.2
USB_Serial_2.2ohm
R43042.2
USB_Serial_2.2ohm
R43052.2
USB_Serial_2.2ohm
R43062.2
USB_Serial_2.2ohm
C45000.1uF16V
R450010KOPT
+5V_USB_1
R450110K
IC4500AP2171DM8G
3IN_2
2IN_1
4EN
1GND
5FLG
6OUT_1
7OUT_2
8NC
JK45003AU04S-305-ZC-(LG)
1
2
3
4
5/USB_OCD1
USB_DP1
+5V_NORMAL
USB_CTL1
C4501
10uF10V
USB_DM1
+5V_USB_1
C450210uF10V
+3.3V_NORMAL
R45022.2
USB_Serial_2.2ohm
R45032.2
USB_Serial_2.2ohm
R4502-*10
USB_Serial_0ohm
R4503-*10
USB_Serial_0ohm
R4303-*10
USB_Serial_0ohm
R4304-*10
USB_Serial_0ohm
R4306-*10
USB_Serial_0ohm
R4305-*10
USB_Serial_0ohm
MAX 1.5AOCP USB2/3USB2
MAX 1.5AUSB3
OCP USB1USB1
MAX 1.5ADVR Ready
y r i g h t2 0 1 4LGEl e c t r o n i c s .I n c .Al lr i g h tr e s e ryf o rt r a i n i n ga n ds e r v i c ep u r p o s e s
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THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF ISESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
D5001
5.5VLAN_ESD
EPHY_TDN
D5003
5.5VLAN_ESD
D5000
5.5VLAN_ESD
D5002
5.5VLAN_ESD
EPHY_TDP
EPHY_RDN
EPHY_RDP
C50000.1uF
16V
C50010.01uF50V
JK5000
RJ45VT-01SN002
METAL_LAN_JACK
11
22
33
44
55
66
77
88
9
9
JK5000-*1
RV3-2032ADA3
MOLD_LAN_JACK
1TD+
2TCT
3TD-
4RD+
5RCT
6RD-
7R7
8GND
Ethernet Block
.n lf o rt r a i n i na n ds e r v i c eu r o s
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THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF ISESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
T U
_ G N D
_ B
T U
_ G N D
_ B
C6401
1000pF
630V
TU_TW/CO/BR
T U
_ G N D
_ A
C6402
1000pF630V
TU_TW/CO/BR/KR/US
T U
_ G N D
_ A
T U
_ G N D
_ A
R 6
4 0 2
0 T U
_ E U
/ A J
/ J A
T U
_ G N D
_ B
R 6
4 0 1
0 T U
_ E U
/ A J
/ J A
T U
_ G N D
_ A
TU6402-*3TDJM-G105D
DEV_TU_AJ_T2
1B1[+3.3V]
2NC_1
3AIF_AGC
4SCL_RF
5SDA_RF
6AIF[P]
7AIF[N]
8NC_2
9NC_3
10NC_4
11B2[+3.3V]
12ERROR
13GND_1
14MCLK
15SYNC
16VAILD
17D0
18D1
19D2
20D3
21D4
22D5
23D6
24D7
25RESET_DEMOD
26B3[+3.3V]
27SCL_DEMOD
28B4[+1.1V]
29F22_OUTPUT
30SDA_DEMOD
47
SHIELD
B1B1
A1A1
TDJH-G101D
TU6401-*1
DEV_TU_AJ_T
47
SHIELD
6IF[P]
7IF[N]
8NC_2
9NC_3
1B1[+3.3V]
2NC_1
3IF_AGC
4SCL
5SDA
A1A1
B1B1
TDJH-H101F
TU6401DEV_TU_KR_US
47
SHIELD
6IF[P]
7IF[N]
8NC_2
9 NC_3
1B1[+3.3V]
2NC_1
3IF_AGC
4SCL
5SDA
A1A1
B1B1
TU6402TDJM-H1
DEV_TU_KR_PIP
1B1[+3.3
2NC_1
3M_DIF_
4SCL_RF
5SDA_R
6M_DIF[
7M_DIF[
8S_SIF
9 S_CVB
10NC_2
11B2[+3.3
12S_ERRO
13GND_1
14S_MCL
15S_SYNC
16S_VALI
17S_DATA
18NC_3
19NC_4
20NC_5
21NC_6
22NC_7
23NC_8
24NC_9
25S_RESE
26B3[+3.3
27SCL_DE
28B4[+1.1
29NC_10
30SDA_D
47
SHIELD
B1B1
A1A1
TU6402-*2TDJM-K101F
DEV_TU_CO_T2
1B1[+3.3V]
2RF_SW_CTL
3AIF_AGC
4SCL_RF
5SDA_RF
6AIF[P]
7AIF[N]
8NC_1
9NC_2
10NC_3
11NC_4
12ERROR
13GND_1
14MCLK
15SYNC
16VAILD
17D0
18D1
19D2
20D3
21D4
22D5
23D6
24D7
25RESET_DEMOD
26B2[+3.3V]
27SCL_DEMOD
28B3[+1.1V]
29NC_5
30SDA_DEMOD
47
SHIELD
B1B1
A1A1
TU6402-*1TDJM-B101F
DEV_TU_BR
1B1[+3.3V]
2RF_SW_CTL
3AIF_AGC
4SCL_RF
5SDA_RF
6AIF[P]
7AIF[N]
8NC_1
9NC_2
10NC_3
11NC_4
12E RRO R
13G N D _1
14MCLK
15SYNC
16VA I L D
17D0
18D1
19D2
20D3
21D4
22D5
23D6
24D7
25RESET_DEMOD
26B2[+3.3V]
27SCL_DEMOD
28B3[+1.1V]
29NC_5
30SDA_DEMOD
47
SHIELD
B1B1
A1A1
TDJK-T101F
TU6403DEV_TU_TW
47
SHIELD
6IF[P]
7IF[N]
8NC_1
9 NC_2
1B1[+3.3V]
2RF_S/W_CTL
3IF_AGC
4SCL
5SDA
A1A1
B1B1
TU6402-*4TDJM-C301D
DEV_TU_HK
1B1[+3.3V]
2RF_SW_CTL
3NC_1
4SCL_RF
5SDA_RF
6NC_2
7NC_3
8SIF
9CVBS
10NC_4
11NC_5
12ERROR
13GND_1
14MCLK
15SYNC
16VAILD
17D0
18D1
19D2
20D3
21D4
22D5
23D6
24D7
25RESET_DEMOD
26B2[+3.3V]
27SCL_DEMOD
28B3[+1.1V]
29NC_6
30SDA_DEMOD
47
SHIELD
B1B1
A1A1
Global flag
g h t $ 2 0 1 4 L G E l e c t r o n i c s . I n c . A l l r i g h t r e s e r v e d .
o r t r a i n i n g a n d s e r v i c e p u r p o s e s
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THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF ISESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
R 71 07 3 3
LGD_T-Con_Scanning
R 71 06 3 3
CP_BOX
TXB4N
TXA1P
TXA1N
TXB3P
2D/3D_CTL
TXC2N
TXA2N
TXCCLKP
TXC1P
+3.3V_NORMAL
OPC_EN
TXD4P
R710310KBIT_SEL_LOW
TXB4P
R 71 05 3 3
CP_BOX
TXBCLKP
R7108 33
OPC_EN
2D/3D_CTL
TXC4N
TXA0N
TXB1N
TXB2NTXC4P
TXACLKN
TXC1N
TXC0P
TXD0N
TXC0N
TXA3N
C71020.1uF50VOPT
PWM_DIM1
I2C_SDA1
R 7 10 4 3 3
AUO_2D/3D_CTRL
TXB3N
TXA0P
TXC3N
TXB2P
R7101
3.3K
LVDS_SEL_HIGH P7101FI-RE41S-HF-J-R1500
LVDS_41PIN
1NC
2NC
3NC
4NC
5NC
6NC
7NC
8NC
9GND
10RC0N
11RC0P
12RC1N
13RC1P
14RC2N
15RC2P
16GND
17RCCLKN
18RCCLKP
19GND
20RC3N
21RC3P
22RC4N
23RC4P
24GND
25GND
26RD0N
27RD0P
28RD1N
29RD1P
30RD2N
31RD2P
32GND
33RDCLKN
34RDCLKP
35GND
36RD3N
37RD3P
38RD4N
39RD4P
40GND
41GND
42
GND
TXB1P
R710210K
LVDS_SEL_LOW
TXD3P
TXC2P
TXB0P
TXCCLKN
TXD1N
TXDCLKP
TXC3P
C710010uF16VOPT
TXDCLKN
TXBCLKN
TXA4P
R 7 10 0 3 3
LGD_2D/3D_CTRL
TXD2N
TXA3P
L7100BLM18SG121TN1DLVDS_51PIN
PANEL_VCC
TXD2P
TXA2P
TXD3N
TXD4N
I2C_SCL1
TXA4N
TXB0N
TXACLKP
TXD1P
P7100
FI-RE51S-HF-J-R1500
LVDS_51PIN
1NC
2NC
3NC
4NC
5NC
6AUO_65_MIRROR
7 LVDS_SEL
8NC
9NC
10L/DIM_ENABLE
11GND
12RA0N
13RA0P
14RA1N
15RA1P
16RA2N
17RA2P
18GND
19RACLKN
20RACLKP
21GND
22RA3N
23RA3P
24RA4N
25RA4P
26GND
27BIT_SEL
28RB0N
29RB0P
30RB1N
31RB1P
32RB2N
33RB2P
34GND
35RBCLKN
36RBCLKP
37GND
38RB3N
39RB3P
40RB4N
41RB4P
42GND
43GND
44GND
45GND
46GND
47NC
48VLCD
49VLCD
50VLCD
51VLCD
52
GND
C71011000pF50VOPT
TXD0P
R71090
OPT
R7110 33
AUO_L/D_EN
R13.
OP
TXA3N
TXA1N
TXA2N
TXA0N
+3.3V_NORMTXA3P
TXA0P
TXACLKP
TXA2P
R110
OP
TXA1P
TXACLKN
P7102
10031HR-30
HD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
BIT_SEL
LVDS
LVDS_SEL
[41Pin LVDS OUTPUT Connector][51Pin LVDS OUTPUT Connector]
RB-
RD-
NC
RD+
1
GND
2
RA+
GND
[30Pin HD 60Hz]
NC
NC
GND
RB+
GND
GND
5
8
6
VLCD
7
VLCD
9
14
GND
12
10
13
11
15
3
LVDS_HD
GND
16
GND
28
17
RCL+
GND
LVDS_SE
22
20
GND
T-CONPinAssign
25
VLCD
18
19RC+
21
27
RC-
Pin Assign is same asLN570B LVDS Cable(EAD62296501)
NC
26
RCLK-
30
29
23
24
VLCD
GND
RA-
LVDS SEL
4
$ 2 0 1 4 L G E l e c t r o n i c s . I n c . A l l r i g h t r e s e r v e d .
o r t r a i n i n g a n d s e r v i c e p u r p o s e s
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