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Service Manual
Model : LG
-P500h
Internal Use Only
Service ManualLG-P500h
Date: October, 2010 / Issue 1.0
- � -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Table Of Contents
1. INTRODUCTION ..................................................................5
1.1 Purpose ............................................................................................... 5
1.2 Regulatory Information ............................................................... 5
1.� Abbreviations ................................................................................... 7
2. PERFORMANCE ...................................................................9
2.1 Product Name .................................................................................. 9
2.2 Supporting Standard .................................................................... 9
2.� Main Parts : GSM Solution ........................................................... 9
2.4 HW Features ....................................................................................10
2.5 SW Features ....................................................................................12
2.6 HW SPEC. .........................................................................................14
3. TECHNICAL BRIEF .............................................................22
�.1 GENERAL DESCRIPTION .............................................................22
�.2 GSM MODE ......................................................................................24
�.� UMTS MODE ...................................................................................26
�.4 GPS RECEIVER .................................................................................29
�.5 LO GENERATION and DISTRIBUTION CIRCUIT ...................29
�.6 OFF-CHIP RF COMPONENTS ....................................................29
�.7 Digital Baseband(DBB/MSM7227) .........................................�5
�.8 Hardware Architecture ...............................................................�6
�.9 Subsystem (MSM7227)...............................................................�8
�.10 Power Block ..................................................................................41
�.11 External memory interface ....................................................46
�.12 H/W Sub System .........................................................................47
�.1� Audio and sound ........................................................................54
�.14 Display ............................................................................................60
�.15 Proximity Sensor ........................................................................62
�.16 Vibrators (Q-Coin Motor) .........................................................6�
�.17 Compass Sensor .........................................................................64
�.18 Motion Sensor .............................................................................66
�.19 Main Features ..............................................................................67
4. TROUBLE SHOOTING .......................................................75
4.1 RF Component...............................................................................75
4.2 SIGNAL PATH ..................................................................................77
4.� Checking TCXO Block ..................................................................80
4.4 Checking GSM TX Module(GSM PAM + FEM) Block .......82
4.5 Checking WCDMA Block ............................................................85
4.6 Checking GSM Block ...................................................................97
4.7 GPS/WIFI/BT RF Component ................................................. 105
4.8 GPS/WIFI/BT SIGNAL PATH ..................................................... 107
4.9 GPS/WIFI/BT Trouble shooting ............................................. 109
4.10 Power ON Troubleshooting ................................................ 117
4.11 Charging Trouble shooting ................................................. 120
4. 12 �M AF Camera trouble ......................................................... 122
4. 1� Main LCD trouble ................................................................... 125
4.14 Proximity Sensor on/off trouble ....................................... 127
4.15 Motion Sensor on/off trouble ............................................ 129
4.16 Compass Sensor on/off trouble ........................................ 1�1
4.17 Q coin Motor ............................................................................. 1��
5. DOWNLOAD ................................................................... 136
6. BLOCK DIAGRAM ........................................................... 149
7. CIRCUIT DIAGRAM ........................................................ 155
8. BGA Pin Map .................................................................. 163
9. PCB LAYOUT ................................................................... 167
10. RF CALIBRATION ......................................................... 171
10.1 Configuration of Tachyon .................................................... 171
10.2 How to use Tachyon ............................................................... 17�
11. STAND ALONE TEST .................................................... 176
12. EXPLODED VIEW & REPLACEMENT PART LIST ......... 183
12.1 EXPLODED VIEW ...................................................................... 18�
12.2 Replacement Parts.................................................................. 185
12.� Accessory ................................................................................... 204
- 4 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
- 5 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
1. INTRODUCTION
1. INTRODUCTION1. INTRODUCTION
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the features of this model.
1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services. System users are responsible for the security of own system. There are may be risks of toll fraud associated with your telecommunications system. System users are responsible for programming and configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this product is immune from the above case but will prevent unauthorized use of common carrier telecommunication service of facilities accessed through or connected to it. The manufacturer will not be responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly causing harm or interruption in service to the telephone network, it should disconnect telephone service until repair can be done. A telephone company may temporarily disconnect service as long as repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the phones or compatibility with the net work, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on the phones must be performed only by the manufacturer or its authorized agent. The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system and may void any remaining warranty.
- 6 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
1. INTRODUCTION
E. Notice of Radiated Emissions
This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.
G. Interference and Attenuation
A phone may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign.
Following information is ESD handling:
• Service personnel should ground themselves by using a wrist strap when exchange system boards. • When repairs are made to a system board, they should spread the floor with anti-static mat which is also grounded.
• Use a suitable, grounded soldering iron. • Keep sensitive parts in these protective packages until these are used.
• When returning system boards or parts like EEPROM to the factory, use the protective package as described.
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LGE Internal Use Only
1. INTRODUCTION
6/140
1.3 AbbreviationsFor the purposes of this manual, following abbreviations apply:
Offset Phase Locked LoopOPLL
Light Emitting DiodeLED
Low Drop OutputLDO
Liquid Crystal DisplayLCD
Intermediate FrequencyIF
International Portable User IdentityIPUI
Global System for Mobile CommunicationsGSM
General Purpose Interface BusGPIB
Gaussian Minimum Shift KeyingGMSK
Flexible Printed Circuit BoardFPCB
Electrostatic DischargeESD
Electrical Erasable Programmable Read-Only MemoryEEPROM
Digital Signal ProcessingDSP
dB relative to 1 milli wattdBm
Digital Communication SystemDCS
Digital to Analog ConverterDAC
Constant Current – Constant VoltageCC-CV
Bit Error RatioBER
BasebandBB
Automatic Power ControlAPC
1. INTRODUCTION
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1. INTRODUCTION
7/140
Wireless Application ProtocolWAP
Voltage Control Temperature Compensated Crystal OscillatorVCTCXO
Voltage Controlled OscillatorVCO
Universal Asynchronous Receiver/TransmitterUART
Time Division Multiple AccessTDMA
Time Division DuplexTDD
Travel AdapterTA
Side Tone Masking RatingSTMR
Pseudo SRAMPSRAM
Static Random Access MemorySRAM
Sending Loudness RatingSLR
Subscriber Identity ModuleSIM
Surface Acoustic WaveSAW
Real Time ClockRTC
Root Mean SquareRMS
Receiving Loudness RatingRLR
Radio FrequencyRF
Public Switched Telephone NetworkPSTN
Phase Locked LoopPLL
Programmable Gain AmplifierPGA
Printed Circuit BoardPCB
Power Amplifier ModulePAM
1. INTRODUCTION
- 9 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
2. PERFORMANCE
2. PERFORMANCE2. PERFORMANCE 2.1 Product Name
LGP500h : WCDMA850/1900/2100+EGSM/GSM850/DCS/PCS
(HSDPA 7.2Mbps GPRS Class 10 / EDGE Class 10)
2.2 Supporting Standard
Item Feature Comment
Supporting Standard WCDMA(FDD1,2,5)/EGSM/GSM850/DCS1800/PCS1900
with seamless handover
Phase 2+(include AMR)
SIM Toolkit: Class 1, 2, 3, C-E
Frequency Range WCDMA(FDD1) TX : 1920 – 1980 MHz
WCDMA(FDD1) RX : 2110 – 2170 MHz
WCDMA(FDD2) TX : 1850 – 1910 MHz
WCDMA(FDD2) RX : 1930 – 1990 MHz
WCDMA(FDD5) TX : 824 – 849 MHz
WCDMA(FDD5) RX : 869 – 894 MHz
EGSM TX: 880 – 915 MHz
EGSM RX: 925 – 960 MHz
GSM850 TX: 824 – 849 MHz
GSM850 RX: 869 – 894 MHz
DCS1800 TX : 1710 – 1785 MHz
DCS1800 RX: 1805 – 1880 MHz
PCS1900 TX: 1850 – 1910 MHz
PCS1900 RX: 1930 – 1990 MHz
Application Standard WAP 2.0
2.3 Main Parts : GSM Solution
Item Part Name Comment
Digital Baseband MSM7227 : Qualcomm
Analog Baseband PM7540 : Qualcomm
RF Chip RTR6285 : Qualcomm
- 10 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
2. PERFORMANCE
2.4 HW Features
Item Feature Comment
Form Factor DOP type
1) Capacity
Standard : Li-Ion polymer, 1500mAh
Battery
2) Packing Type : Soft Pack
Size Standard :
113.5 x 59 x 13.3 mm
Weight 127g With Battery
Volume TBD
PCB L1B1 type, 10 Layers , 0.8t
Stand by time 2G Up to 350 hrs
3G Up to 3500 hrs
@ Paging Period 9 (2G)
@ DRX 7 (3G)
Charging time 3 hrs @ Power Off / 1500mAh
Talk time 2G Up to 250mins
3G Up to 250mins
@ Power Level 5 (2G)
@ Tx = 12dBm (3G)
RX sensitivity
WCDMA(FDD1) : -106.7 dBm WCDMA(FDD2) : -104.7 dBm WCDMA(FDD5) : -104.7 dBm EGSM : -105 dBm GSM850 : -105 dBm DCS 1800 : -105 dBm PCS 1900 : -105 dBm
WCDMA/
GSM/
GPRS
WCDMA : 24dBm/3.84MHz,+1/-3dBm
EGSM : 33dBm
GSM850 : 33 dBm
DCS 1800 : 30 dBm
PCS 1900 : 30 dBm
Class3(WCDMA)
Class4 (EGSM)
Class4 (GSM850)
Class1 (PCS)
Class1 (DCS)
TX
output
power
EDGE
GSM 900 : 27 dBm
DCS 1800 : 26 dBm
PCS 1900 : 26 dBm
E2 (GSM900)
E2 (PCS)
E2 (DCS)
GPRS compatibility GPRS Class 10
EDGE compatibility EDGE Class 10
SIM card type Plug-In SIM
3V /1.8V
- 11 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
2. PERFORMANCE
Display Main LCD
TFT Main LCD(3.2’, 320 x 480)
Built-in Camera 3M CMOS Camera
Status Indicator No
Keypad Function Key : 4
Side Key : 3
Function Key:
Home, Back, Menu, Search
Side Key :
Volume up/down,
Power Key
ANT Main : Internal Fixed Type
System connector 5 Pin
Ear Phone Jack 3.5Phi, 4 Pole, Stereo
PC synchronization Yes
Memory NAND Flash : 4Gbit
SDRAM : 4Gbit
Speech coding FR, EFR, HR,AMR
Data & Fax Built in Data & Fax support
Vibrator Built in Vibrator
Blue Tooth V2.1+ EDR
MIDI(for Buzzer Function) SW Decoded 72Poly
Music Player MP3/ WMA/AAC/HE-AAC/EAAC+
Video Player MPEG4, H.263, WMV9
Camcorder MPEG4, H.263,
Voice Recording Yes
Speaker Phone mode
Support Yes
Travel Adapter Yes
CDROM No
Stereo Headset Yes
Data Cable Yes
T-Flash
(External Memory) Yes
- 12 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
2. PERFORMANCE
2.5 SW Features
Item Feature Comment
RSSI 0 ~ 4 Levels
Battery Charging 0 ~ 6 Levels
Key Volume 0 ~ 7 Level
Audio Volume 1 ~ 15 Level
Time / Date Display Yes
Multi-Language Yes English/French/German/Spanish/Italia
n/Danish/Dutch/Korean
Quick Access Mode Dialing/ Contact / Menu / Message /
Camera
PC Sync No
Speed Dial No Voice mail center -> 1 key
Profile Yes not same with feature phone setting
CLIP / CLIR Yes
Phone Book
Name / Number / Email / Chat Id/
Website/Postal
addresses/Organizations/Groups/
BirthdayNotes / Ringtone
There is no limitation on the number
of items.
It depends on
available memory amount.
Last Dial Number Yes
Last Dial Numbers, Last Received
Numbers and Last Missed Numbers
can store up to a total of 500.
Last Received
Number Yes
Last Dial Numbers, Last Received
Numbers and Last Missed Numbers
can store up to a total of 500.
Last Missed Number Yes
Last Dial Numbers, Last Received
Numbers and Last Missed Numbers
can store up to a total of 500.
Search by Number
/ Name Name
Group Yes
There is no limitation on the number
of items. It depends on
available memory amount.
Fixed Dial Number Yes
- 1� -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
2. PERFORMANCE
Service Dial Number No
Own Number Yes
Read only
(add/edit/delete are not
supported)
Voice Memo Yes
Call Reminder No
Network Selection Automatic
Mute Yes
Call Divert Yes
Call Barring Yes
Call Charge (AoC) Yes
Call Duration Yes
SMS (EMS)
There is no limitation on the
number of items. It depends on
available memory
amount.
EMS does not support.
SMS Over GPRS No
EMS Melody / Picture No
Send / Receive / Save No
MMS MPEG4
Send / Receive / Save Yes
Long Message MAX 459 characters SMS 3pages
Cell Broadcast Yes
Download Over the Web
Game Yes
Calendar Yes
Memo Yes
There is no limitation on the number
of items.
It depends on available memory
amount.
World Clock No
Unit Convert No
Stop Watch No
Wall Paper Yes
- 14 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
2. PERFORMANCE
WAP Browser No
Support only web browser based on
webkit. WAP stack and wml are not
supported.
Download Melody /
Wallpaper Yes Over web browser
SIM Lock Yes Operator Dependent
SIM Toolkit Class 1, 2, 3, C
MMS Yes Google MMS Client
EONS Yes
CPHS Yes V4.2
ENS No
Camera Yes 5M AF /
Digital Zoom : x4
JAVA Yes CLDC V1.1 / MIDP V2.1
Download Over Web
Voice Dial No
IrDa No
Bluetooth Yes Ver. 2.1+EDR
(HSP,HFP,A2DP,AVRCP)
FM radio Yes
GPRS Yes Class 10
EDGE Yes Class 10
Hold / Retrieve Yes
Conference Call Yes Max. 6
DTMF Yes
Memo pad No
TTY No
AMR Yes
SyncML Yes
IM Yes
Email Yes
- 15 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
2. PERFORMANCE
2.6 HW SPEC.
1) GSM transceiver specification
Item Specification
Phase Error Rms : 5°
Peak : 20 °
Frequency Error GSM : 0.1 ppm
DCS/PCS : 0.1 ppm
EMC(Radiated Spurious Emission
Disturbance) GSM/DCS : < -28dBm
Transmitter Output power and Burst
Timing
GSM : 5dBm – 33dBm ± 3dB
DCS/PCS : 0dBm – 30dBm ± 3dB
Burst Timing <3.69us
Spectrum due to modulation out to
less than 1800kHz offset
200kHz : -36dBm
600kHz : -51dBm/-56dBm
Spectrum due to modulation out to
larger than 1800kHz offset to the
edge of the transmit band
GSM :
1800-3000kHz :< -63dBc(-46dBm)
3000kHz-6000kHz : <-65dBc(-46dBm)
6000kHz < : < -71dBc(-46dBm)
DCS :
1800-3000kHz :< -65dBc(-51dBm)
6000kHz < : < -73dBc(-51dBm)
Spectrum due to switching transient 400kHz : -19dBm/-22dBm(5/0), -23dBm
600kHz : -21dBm/-24dBm(5/0), -26dBm
Reference Sensitivity – TCH/FS Class II(RBER) : -105dBm(2.439%)
Usable receiver input level range 0.012(-15 - -40dBm)
Intermodulation rejection – Speech
channels
± 800kHz, ± 1600kHz
: -98dBm/-96dBm (2.439%)
AM Suppression
GSM : -31dBm
- DCS : -29dBm
-98dBm/-96dBm (2.439%)
Timing Advance ± 0.5T
- 16 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
2. PERFORMANCE
2) WCDMA transmitter specification
Item Specification
Transmit Frequency Band1 : 1920 MHz ~ 1980 MHz
Band2 : 1850MHz ~ 1910 MHz
Band5 : 824MHz ~ 849MHz
Maximum Output Power +24 dBm / 3.84 MHz, +1 / -3 dB
Frequency Error within ±0.1 PPM
Open Loop Power Control Normal Conditions : within ±9 dB,
Extreme Conditions : within ±12 dB
Minimum Transmit Power < -50 dBm /3.84 MHz
Occupied Bandwidth < 5 MHz at 3.84 Mcps (99% of power)
Adjacent Channel Leakage
Power Ratio (ACLR)
> 33 dB @ ±5 MHz,
> 43 dB @ ±10 MHz
Spurious Emissions
|f-fc| > 12.5 MHz
< -36 dBm / 1 kHz RW @ 9 kHz ≤ f < 150 kHz
< -36 dBm / 10 kHz RW @ 150 KHz ≤ f < 30 MHz
< -36 dBm / 100 kHz RW @ 30 MHz ≤ f < 1 GHz
< -30 dBm / 1 MHz RW @ 1 GHz ≤ f < 12.75 GHz
< -60 dBm / 3.84 MHz RW @ 869 MHz ≤ f ≤ 894 MHz
< -60 dBm / 3.84 MHz RW @ 1930 MHz ≤ f ≤ 1900 MHz
< -60 dBm / 3.84 MHz RW @ 2110 MHz ≤ f ≤ 2155 MHz
< -67 dBm / 100 kHz RW @ 925 MHz ≤ f ≤ 935 MHz
< -79 dBm / 100 kHz RW @ 935 MHz < f ≤ 960 GHz
< -71 dBm / 100 kHz RW @ 1805 MHz ≤ f ≤ 1880 MHz
< -41 dBm / 300 kHz RW @ 1884.5 MHz < f < 1919.6 MHz
Transmit Intermodulation < -31 dBc @ 5 MHz & < -41 dBc @ 10 MHz
when Interference CW Signal Level = -40 dBc
Error Vector Magnitude < 17.5 %, when Pout ≥ -20 dBm
Peak Code Domain Error < -15 dB at Pout -20 dBm
- 17 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
2. PERFORMANCE
3) WCDMA receiver specification
Item Specification
Receive Frequency Band1 : 2110 ~ 2170 MHz
Band2 : 1930 ~ 1990 MHz
Band5 : 869 ~ 894MHz
Reference Sensitivity Level Band1 : BER < 0.001 when Îor = -106.7 dBm / 3.84 MHz
Band2 : BER < 0.001 when Îor = -104.7 dBm / 3.84 MHz
Band5 : BER < 0.001 when Îor = -104.7 dBm / 3.84 MHz
Maximum Input Level BER < 0.001 when Îor = -25 dBm / 3.84 MHz
Adjacent Channel Selectivity
(ACS)
ACS > 33 dB where BER < 0.001 when
Îor = -92.7 dBm / 3.84 MHz
& Ioac = –52 dBm / 3.84 MHz @ ±5 MHz
Blocking Characteristic BER < 0.001 when Îor = -103.7 dBm / 3.84 MHz
& Iblocking = -56 dBm / 3.84 MHz @ Fuw(offset) = ±10 MHz
or Iblocking = -44 dBm / 3.84 MHz @ Fuw(offset) = ±15 MHz
Spurious Response BER < 0.001 when Îor = -103.7 dBm / 3.84 MHz
& Iblocking = -44 dBm
Intermodulation BER < 0.001 when Îor= -103.7 dBm / 3.84 MHz
& Iouw1 = -46 dBm @ Fuw1(offset) = ±10 MHz
& Iouw2 = -46 dBm / 3.84 MHz @ Fuw2(offset) = ±20 MHz
Spurious Emissions < -57 dBm / 100 kHz BW @ 9 kHz ≤ f < 1 GHz
< -47 dBm / 1 MHz BW @ 1 GHz ≤ f ≤ 12.75 GHz
Inner Loop Power Control
In Uplink
Adjust output(TPC command)
cmd 1dB 2dB 3dB
+1 +0.5/1.5 +1/3 +1.5/4
0 -0.5/+0.5 -0.5/+0.5 -0.5/+0.5
-1 -0.5/-1.5 -1/-3 -1.5/-4
group(10equal command group)
+1 +8/+12 +16/+24
- 18 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
2. PERFORMANCE
4) HSDPA transmitter specification
Item Specification
Transmit Frequency Band1 : 1920 MHz ~ 1980 MHz
Band2 : 1850MHz ~ 1910 MHz
Band5: 824MHz ~ 849MHz
Maximum Output Power Sub-Test
1=1/15, 2=12/15 21~25dBm / 3.84 MHz
3=13/15 4=15/8 20~25dBm / 3.84 MHz
5=15/7 6=15/0 19~25dBm / 3.84 MHz
HS-DPCCH
Sub-test
in table
C.10.1.4
Power
step
Power step slot
boundary
Power
step size,
P [dB]
Transmitter power
step tolerance [dB]
1 Start of
Ack/Nack
6 +/- 2.3
2 Start of CQI 1 +/- 0.6
3 Middle of CQI 0 +/- 0.6
5
4 End of CQI 5 +/- 2.3
Spectrum Emission Mask
Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0
Frequency offset
from carrier f Minimum requirement
Measurement
Bandwidth
2.5 ~ 3.5 MHz -35-15×( f-2.5)dBc 30 kHz
3.5 ~ 7.5 MHz -35-1×( f-3.5)dBc 1 MHz
7.5 ~ 8.5 MHz -35-10×( f-7.5)dBc 1 MHz
8.5 ~ 12.5 MHz -49dBc 1 MHz
Adjacent Channel Leakage
Power Ratio (ACLR)
Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0
> 33 dB @ ±5 MHz
> 43 dB @ ±10 MHz
Error Vector Magnitude < 17.5 %, when Pout ≥ -20 dBm
- 19 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
2. PERFORMANCE
5) HSDPA receiver specification
Item Specification
Receive Frequency
Band1 : 2110 ~ 2170 MHz
Band2 : 1930 ~ 1990 MHz
Band5 : 869 ~ 894MHz
Maximum Input Level
(BLER or R), 16QAM Only
Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0
BLER < 10% or R >= 700kbps
6) WLAN 802.11b transceiver specification
Item Specification
Transmit Frequency 2400 MHz ~ 2483.5 MHz ( CH1~CH13 )
Tx Power Level ≤ 20dBm under (Europe), ≤ 30dBm under (USA)
Frequency Tolerance within ±25 PPM
Chip clock Frequency
Tolerance
within ±25 PPM
Spectrum Mask ≤ -30 @ fc-22MHz< f <fc-11MHz and fc+11MHz< f <fc+22MHz
≤ -50 @ f < fc-22MHz and f > fc+22MHz
Power ramp on/off time ≤ 2us
Carrier Suppression ≤ -15dB
Modulation Accuracy
(Peak EVM)
≤ 35%
Spurious Emissions < -36 dBm @ 30MHz ~ 1GHz
< -30 dBm above @ 1GHz ~ 12.75GHz
< -47 dBm @ 1.8GHz ~ 1.9GHz
< -47 dBm @ 5.15GHz ~ 5.3GHz
Rx Min input Sensitivity ≤ -76dBm(1Mbps,2Mbps,5.5Mbps,11Mbps) @ FER ≤ 8%
Rx Max input Sensitivity ≥ -10dBm(1Mbps,2Mbps,5.5Mbps,11Mbps) @ FER ≤ 8%
Rx Adjacent Channel
Rejection
≥ 35dB @FER ≤ 8%,
interference input signal -70dBm@fc±25MHz(11Mbps)
- 20 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
2. PERFORMANCE
7) WLAN 802.11g transceiver specification
Item Specification
Transmit Frequency 2400 MHz ~ 2483.5 MHz ( CH1~CH13 )
Tx Power Level ≤ 20dBm under (Europe), ≤ 30dBm under (USA)
Frequency Tolerance within ±25 PPM
Chip clock Frequency
Tolerance
within ±25 PPM
Spectrum Mask ≤ -20 @ ±11MHz offset (9Mhz ~ 11MHz)
≤ -28 @ ±20MHz offset (11MHz ~ 20Mhz)
≤ -40 @ ±30MHz offset (20MHz ~ 30Mhz)
Transmitter constellation error
(rms EVM)
≤ -5dB
Spurious Emissions < -36 dBm @ 30MHz ~ 1GHz
< -30 dBm above @ 1GHz ~ 12.75GHz
< -47 dBm @ 1.8GHz ~ 1.9GHz
< -47 dBm @ 5.15GHz ~ 5.3GHz
Rx Min input Sensitivity PER ≤ 10%
-82dBm@6Mbps, -81dBm@9Mbps, -79dBm@12Mbps
-77dBm@18Mbps, -74dBm@24Mbps, -70dBm@36Mbps
-66dBm@48Mbps, -65dBm@54Mbps
Rx Max input Sensitivity ≥ -20dBm(6,9,12,18,24,36,48,54Mbps) @ PER ≤ 10%
Rx Adjacent Channel
Rejection
PER ≤ 10%, ACR ≥ 16dB@6Mbps, ACR ≥ 15dB@9Mbps, ACR ≥ 13dB@12Mbps, ACR ≥ 11dB@18Mbps, ACR ≥ 8dB@24Mbps, ACR ≥ 4dB@36Mbps ACR ≥ 0dB@48Mbps, ACR ≥ -1dB@54Mbps
ACR shall be measured by setting the desired signal's strength 3 dB above the rate-dependent sensitivity specified in min input sensitivity
8) GPS receiver specification
Item Specification
Receive Frequency 1574.42 MHz ~ 1576.42 MHz
Minimum Sensitivity 1 satellite ≥-142dBm, 7 satellites ≥ -147dBm at coarse time aiding
- 21 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
2. PERFORMANCE
7) WLAN 802.11g transceiver specification
Item Specification
Transmit Frequency 2400 MHz ~ 2483.5 MHz ( CH1~CH13 )
Tx Power Level ≤ 20dBm under (Europe), ≤ 30dBm under (USA)
Frequency Tolerance within ±25 PPM
Chip clock Frequency
Tolerance
within ±25 PPM
Spectrum Mask ≤ -20 @ ±11MHz offset (9Mhz ~ 11MHz)
≤ -28 @ ±20MHz offset (11MHz ~ 20Mhz)
≤ -40 @ ±30MHz offset (20MHz ~ 30Mhz)
Transmitter constellation error
(rms EVM)
≤ -5dB
Spurious Emissions < -36 dBm @ 30MHz ~ 1GHz
< -30 dBm above @ 1GHz ~ 12.75GHz
< -47 dBm @ 1.8GHz ~ 1.9GHz
< -47 dBm @ 5.15GHz ~ 5.3GHz
Rx Min input Sensitivity PER ≤ 10%
-82dBm@6Mbps, -81dBm@9Mbps, -79dBm@12Mbps
-77dBm@18Mbps, -74dBm@24Mbps, -70dBm@36Mbps
-66dBm@48Mbps, -65dBm@54Mbps
Rx Max input Sensitivity ≥ -20dBm(6,9,12,18,24,36,48,54Mbps) @ PER ≤ 10%
Rx Adjacent Channel
Rejection
PER ≤ 10%, ACR ≥ 16dB@6Mbps, ACR ≥ 15dB@9Mbps, ACR ≥ 13dB@12Mbps, ACR ≥ 11dB@18Mbps, ACR ≥ 8dB@24Mbps, ACR ≥ 4dB@36Mbps ACR ≥ 0dB@48Mbps, ACR ≥ -1dB@54Mbps
ACR shall be measured by setting the desired signal's strength 3 dB above the rate-dependent sensitivity specified in min input sensitivity
8) GPS receiver specification
Item Specification
Receive Frequency 1574.42 MHz ~ 1576.42 MHz
Minimum Sensitivity 1 satellite ≥-142dBm, 7 satellites ≥ -147dBm at coarse time aiding
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3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
3.1 GENERAL DESCRIPTION
The LG-P500h supports UMTS-850, UMTS-1900, UMTS-2100, GSM-850, GSM-850, GSM-900, GSM-1800, and GSM-1900 based GSM/GPRS/EDGE/UMTS. All receivers and the UMTS transmitter use the radioOne1Zero-IF architecture to eliminate intermediate frequencies, directly converting signals between RF and baseband. The quad-band GSM transmitters use a baseband-to-IF upconversion followed by an offset phase-locked loop that translates the GMSK-modulated or 8-PSK-modulated signal to RF.
[Figure 1-1] Block diagram of RF part
3. TECHNICAL BRIEF
RF Block Diagram
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3. TECHNICAL BRIEF
A generic, high-level functional block diagram of LGP509 is shown in Figure 1-1. One antenna collects base station forward link signals and radiates handset reverse link signals. The antenna connects with receive and transmit paths through a ASM(Antenna-Switch-Module).
The UMTS receive paths each include an LNA, an RF band-pass filter, and a downconverter that translate the signal directly from RF-to-baseband using radioOne ZIF techniques. The RFIC’s Rx analog baseband outputs, for the receive chains, connect to the MSM IC. The UMTS and GSM Rx baseband outputs share the same inputs to the MSM IC.
For the transmit chains, the RTR6285 IC directly translates the Tx baseband signals (from the MSM device) to an RF signal using an internal LO generated by integrated onchip PLL and VCO. The RTR6285 IC outputs deliver fairly high-level RF signals that are first filtered by Tx SAWs and then amplified by their respective UMTS PAs. In the GSM receive path, the received RF signals are applied through their band-pass filters and down-converted directly to baseband in the RTR6285 transceiver IC. These baseband outputs are shared with the UMTS receiver and routed to the MSM IC for
further signal processing.
The GSM/EDGE transmit path employs one stage of up-conversion and, in order to improve efficiency, is divided into phase and amplitude components to produce an open-loop Polar topology:
1. The on-chip quadrature up-converter translates the GMSK-modulated signal or 8-PSK modulated signal, to a constant envelope phase signal at RF;
2. The amplitude-modulated (AM) component is applied to the ramping control pin of Polar power amplifier from a DAC within the MSM LGP509 power supply voltages are managed and regulated by the PM7540 Power Management IC. This versatile device integrates all wireless handset power management, general housekeeping, and user interface support functions into a single mixed signal IC.
It monitors and controls the external power source and coordinates battery recharging while maintaining the handset supply voltages using low dropout, programmable regulators.
The device’s general housekeeping functions include an ADC and analog multiplexer circuit for monitoring on-chip voltage sources, charging status, and current flow, as well as user-defined off-chip variables such as temperature, RF output power, and battery ID.
Various oscillator, clock, and counter circuits support IC and higher-level handset functions. Key parameters such as under-voltage lockout and crystal oscillator signal presence are monitored to protect against detrimental conditions.
LGP500h
LGP500h
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3. TECHNICAL BRIEF
3.2 GSM MODE
3.2.1 GSM RECEIVER
The GSM-850, GSM-900, GSM-1800, and GSM-1900 receiver inputs of RTR6285 are connected directly to the transceiver front-end Module. GSM-850, GSM-900, GSM-1800, and GSM-1900 receiver inputs use differential configurations to improve common-mode rejection and second-order non-linearity performance. For example Figure 1-2 shows receiver input topologies for DCS and PCS (GSM-850/900 have the same receiver input topologies). The balance between the complementary signals is critical and must be maintained from the RF filter outputs all the way into the IC pins.
[Figure 1-2] DCS and PCS Receiver Inputs Topologies
Since GSM-850, GSM-900, GSM-1800, and GSM-1900 signals are time-division duplex (the handset can only receive or transmit at one time), switches are used to separate Rx and Tx signals in place of frequency duplexers – this is accomplished in the switch module. The GSM-850, GSM-900, GSM-1800, and GSM-1900 receive signals are routed to the RTR6285 through band selection filters and matching networks that transform single-ended 50-Ω sources to differential impedances optimized for gain and noise figure. The RTR input uses a differential configuration to improve second-order intermodulation and common mode rejection performance. The RTR6285 input stages include MSM-controlled gain adjustments that maximize receiver dynamic range.
The amplifier outputs drive the RF ports of the quadrature RF-to-baseband downconverters. The downconverted baseband outputs are multiplexed and routed to lowpass filters (one I and one Q) having passband and stopband characteristics suitable for GMSK or 8-PSK processing. These filter circuits include DC offset corrections. The filter outputs are buffered and passed on to the MSM7227 IC for further processing asshown in Figure 1-2.
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3.2.2 GSM TRANSMITTER
The RTR6285 transmitter outputs(HB_RF_OUT1 and LB_RF_OUT1) include on-chip output matching inductors. 50ohm output impedance is achieved by adding a series capacitor at the output pins. The capacitor value may be optimized for specific applications and PCB characteristics based on pass-band symmetry about the band center frequency as shown in Figure 1-3.
[Figure 1-3] GSM Transmitter Outputs Topologies
The RTR6285 IC is able to support GSM 850/900 and GSM 1800/1900 mode transmitting. This design guideline shows a tri-band GSM application. Both high-band and low band outputs are followed by resistive pads to ensure that the load presented to the outputs remains close to 50ohm.
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3. TECHNICAL BRIEF
3.3 UMTS MODE
3.3.1 UMTS RECEIVER
The UMTS duplexer receiver output is routed to LNA circuits within the RTR6285 device as shown in Figure 1-4. The UMTS Rx input is provided with an on-chip LNA that amplifies the signal before a second stage filter that provides differential downconverter as shown in Figure 1-5. This second stage input is configured differentially to optimize secondorder intermodulation and common mode rejection performance. The gain of the UMTS frontend amplifier and the UMTS second stage differential amplifier are adjustable, under MSM control, to extend the dynamic range of the receivers. The second stage UMTS Rx amplifiers drive the RF ports of the quadrature RF-to-baseband downconverters. The downconverted UMTS Rx baseband outputs are routed to lowpass filters having passband and stopband characteristics suitable for UMTS Rx processing. These filter circuits allow DC offset corrections, and their differential outputs are buffered to interface shared with GSM Rx to the MSM IC. The UMTS baseband outputs are turned off when the RTR6285 is downconverting GSM signals and on when the UMTS is operating.
[Figure 1-4] UMTS Receiver Inputs Topologies
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3.3.2 UMTS TRANSMITTER
The UMTS Tx path begins with differential baseband signals (I and Q) from the MSM device. These analog input signals are amplified, filtered, and applied to the quadrature up-converter mixers. The up-converter output is amplified by multiple variable gain stages that provide transmit AGC control. The AGC output is filtered and applied to the driver amplifier; this output stage includes an integrated matching inductor that simplifies the external matching network to a single series capacitor to achieve the desired 50-Ω interface.
The RTR6285 UMTS output is routed to its power amplifier through a bandpass filter, and delivers fairly high-level signals that are filtered and applied to the PA. Transmit power is delivered from the duplexer to the antenna through the switch module. The transceiver LO synthesizer is contained within the RTR6285 IC with the exception of the off-chip loop filter components and the VC-TCXO. This provides a simplified design for multimode applications. The PLL circuits include a reference divider, phase detector, charge pump, feedback divider, and digital logic generator.
UMTS Tx. Using only PLL1, the LO generation and distribution circuits create the necessary LO signals for nine different frequency converters. The UMTS transmitter also employs the ZIF architecture to translate the signal directly from baseband to RF. This requires FLO to equal FRF, and the RTR6285 IC design achieves this without allowing FVCO to equal FRF. The RTR6285 IC is able to support UMTS 2100/1900/1800/1700 and 850 mode transmitting. This design guideline shows only UMTS 2100 applications.
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3. TECHNICAL BRIEF
[Figure 1-5] RTR6285 IC Functional Block Diagram
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3. TECHNICAL BRIEF
3.4 GPS RECEIVER
The GPS receiver input employs a single-ended connection realized by this pin. The GPS input is routed from the GPS antenna switch, through a band pass filter and then an impedance transformer circuit that optimally matches the impedance looking into the GPS LNA. The impedance transformer circuit topology is shown in Figure 1-6.
[Figure 1.6] GPS Input Network Topology
3.5 LO GENERATION and DISTRIBUTION CIRCUIT
The integrated LO generation and distribution circuits are driven by internal VCOs to support various modes to yield highly flexible quadrature LO outputs that drive all GSM/EDGE, UMTS band and GPS up-converters and down-converters; with the help of these LO generation and distribution circuits, true zero-IF architecture is employed in all GSM and UMTS band receivers and transmitters to translate the signal directly from RFto-baseband and from baseband-to-RF. Two fully functional fraction-N synthesizers, including VCOs and loop filters, are integrated within the RTR6285 IC. In addition, the RTR6285 has a third synthesizer used for GPS operation. The first synthesizer (PLL1) in the RTR6285 creates the transceiver Los that support the UMTS transmitter, and all four GSM band receivers and transmitters including: GSM850, GSM900, GSM1800, and GSM1900. The second synthesizer (PLL2) in the RTR6285 IC provides the LO for the UMTS primary receiver. For the RTR6285 IC only, the second synthesizer also provides the LO for the secondary UMTS receiver. The third synthesizer (PLL3), only in the RTR6285 IC, provides the LO for the GPS receiver. An external TCXO input signal is required to provide the synthesizer frequency reference to which the PLL is phase and frequency locked. The RTR6285 ICs integrate most of the PLL loop filter components on-chip except for three off-chip loop filter-series capacitors, which significantly reduces off-chip component requirement. With the integrated fractional-N PLL synthesizers, the RTR6285 ICs have the advantage of more flexible loop bandwidth control, fast lock time, and low-integrated phase error.
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3. TECHNICAL BRIEF
3.6 OFF-CHIP RF COMPONENTS
3.6.1. UMTS PAM
3.6.1.1 W2100, W850 (U1003,SKY77197)
The SKY77197 Power Amplifier Module (PAM) is a fully matched, 14-pad, surface mount module developed for Wideband Code Division Multiple Access (WCDMA) applications. This small and efficient module packs full WCDMA Band I and Band VIII coverage into a single compact package. The SKY77197 meets the stringent spectral linearity requirements of WCDMA transmission, with high power added efficiency for power output to 27.5 dBm (Band I) and 28 dBm (Band V). The SKY77197 meets the stringent spectral linearity requirements of High Speed Downlink Packet Access (HSDPA) data transmission with high power added efficiency. A directional coupler is integrated into the module thus eliminating the need for any external coupler. The single Gallium Arsenide (GaAs) Microwave Monolithic Integrated Circuit (MMIC) contains all active circuitry in the module. The MMIC contains on-board bias circuitry, as well as input and interstage matching circuits. Output match into a 50-ohm load is realized off-chip within the module package to optimize efficiency and power performance. The SKY77197 PAM is manufactured with Skyworks’ InGaP GaAs Heterojunction Bipolar Transistor (HBT) BiFET process that provides for all positive voltage DC supply operation while maintaining high efficiency and good linearity. No VREF voltage is required. Power down is accomplished by setting the voltage on VENABLE to zero volts. No external supply side switch is needed as typical “off” leakage is a few microamperes with full primary voltage supplied from the battery.
SKY77197 (W2100,W850)
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3.6.1.2 W1900 (U1005, SKY77702)
The SKY77702 Power Amplifier Module (PAM) is a fully matched 10-pad surface mount module developed for
Wideband Code Division Multiple Access (WCDMA) applications. This small and efficient module packs full
1850–1910 MHz bandwidth coverage into a single compact package. Because of high efficiencies attained
throughout the entire power range, the SKY77702 delivers unsurpassed talk-time advantages. The SKY77702
meets the stringent spectral linearity requirements of High Speed Downlink Packet Access (HSDPA), High
Speed Uplink Packet Access (HSUPA), and Long Term Evolution (LTE) data transmission with high power
added efficiency. A directional coupler is integrated into the module thus eliminating the need for any
external coupler. The single Gallium Arsenide (GaAs) Microwave Monolithic Integrated Circuit (MMIC)
contains all active circuitry in the module. The MMIC contains on-board bias circuitry, as well as input and
interstage matching circuits. Output match into a 50-ohm load is realized off-chip within the module
package to optimize efficiency and power performance. The SKY77702 PAM is manufactured with Skyworks’
InGaP GaAs Heterojunction Bipolar Transistor (HBT) BiFET process that provides for all positive voltage DC
supply operation while maintaining high efficiency and good linearity. Primary bias to the SKY77702 is
supplied directly from any three-cell Ni-Cd, a single-cell Li-Ion, or other suitable battery with an output in the
3.2 to 4.2 volt range. No VREF voltage is required. Power down is accomplished by setting the voltage on
VENABLE to zero volts. No external supply side switch is needed as typical “off” leakage is a few
microamperes with full primary voltage supplied from the battery.
SKY77702 (W1900)
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3. TECHNICAL BRIEF
3.6.2 19.2MHz VCTCXO (X250, KT3225L19200DCW28RA0)
The Voltage Controlled Temperature Compensated Crystal Oscillator (VCTCXO) provides the reference frequency for all RFIC synthesizers as well as clock generation functions within the MSM6285 IC. The oscillator frequency is controlled by the MSM6285 ICs.
TRK_LO_ADJ pulse density modulated signal in the same manner as the transmit gain control TX_AGC_ADJ. A two-pole RC lowpass filter is recommended on this control line.
The PM7540 IC controls the handset power-up sequence, including a special VCTCXO warm-up interval before other circuits are turned on. This warm-up interval (as well as other TCXO controller functions) is enabled by the MSM TCXO_EN line . The PM7540 IC VREG_TCXO regulated output voltage is used to power the VCTCXO and is enabled before most other regulated outputs. Any GSM mode power control circuits within the MSM7227 IC require a reference voltage for proper operation and sufficient accuracy. Connecting the PM7540 IC REF_OUT directly to the MSM7227 IC GSM_PA_PWR_CTL_REF provides this reference. This sensitive analog signal needs a 0.1 μF low frequency filter near to MSM side, and isolate from digital logic and clock traces with ground on both sides, plus ground above and below if routed on internal layers.
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3.6.3 ASM + GSM PAM (U1002, SKY77544)
SKY77544 is a transmit and receive Front End Module (FEM) designed in a very low profile (0.9 mm), compact form factor for quad-band cellular handsets comprising GSM850/900, DCS1800, and PCS1900 operation — a complete transmit VCO-to-Antenna and Antenna-toreceive SAW filter solution. The FEM also supports Class 12 General Packet Radio Service (GPRS) multi-slot operation and EDGE Polar Modulation. WCDMA switch-through support is provided by three dedicated high-linearity ports.
The module consists of a GSM850/900 PA and DCS1800/PCS1900 PA block, impedancematching circuitry for 50 Ω input and output impedances, Tx harmonic filtering, high linearitylow insertion loss switches, and a CMOS Power Amplifier Control (PAC) block. A custom silicon integrated circuit contains decoder circuitry to control the RF switch while providing a low current external control interface. An integrated temperature sensor provides an analog voltage based on the temperature of the module.
Fabricated in InGaP/GaAs, the Heterojunction Bipolar Transistor (HBT) PA blocks support the GSM850/900 bands and DCS1800/PCS1900 bands. Both PA blocks share common power
supply pads to distribute current. The output of the PA block and the outputs to the seven
receive pads connect to the antenna pad through a highly linear antenna switch. The WCDMA
and Rx ports feature a 0 volts DC offset level, which eliminates any need for external blocking capacitors. The InGaP/GaAs die, switch die, Silicon (Si) controller die, and passive components are mounted on a multi-layer laminate substrate and the entire assembly is encapsulated with plastic overmold.
RF input and output ports of the SKY77544 are internally matched to a 50 Ω load to reduce the number of external components for a quad-band design. Extremely low leakage current of the FEM maximizes handset standby time. Band selection and control of transmit and receive RF signal flows are performed by use of four external control pads. See Figure 1.9 shown on overleaf. Mode of operation Tx, Rx, Band (GSM850, GSM900, DCS, PCS, and UMTS) is controlled with 4 logic inputs: BS1, BS2, Mode, and TxEN. Proper timing of the TxEN input and the VAPC input ensures high isolation between the antenna and Tx-VCO while the VCO is being tuned prior to the transmit burst. The Enable input controls the initial turn-on of the PAC circuitry to minimize battery drain.
The integrated power amplifier control (PAC) function provides envelope amplitude control by reducing sensitivity to input drive, temperature, power supply, and process variation.
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[Figure 1.9] SKY77544 Block Diagram
[Figure 1.10] SKY77544 Control Logic
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3. TECHNICAL BRIEF
3.7 Digital Baseband(DBB/MSM7227)
3.7.1 General Description
A. Features(MSM7227)
The basic MSM7227 system solution consists of the MSM7227, RTR6285™, and PM7540™ ICs, plus AMSS™ system software with the SURF7227™ platform available for development. General features include:
-WCDMA Rel ‘99 plus HSDPA and HSUPA
-GSM/GPRS/EDGE
-High-performance ARM1136JF-S™ application processor at up to 600 MHz; QDSP5000™ at 320 MHz
-High-performance ARM926EJ-S™ modem processor at up to 400 MHz; QDSP4000™ at 122.88 MHz
-Java® hardware acceleration for faster Java-based games and other applets
-Support for Bluetooth® 2.1 EDR via an external Bluetooth System-on-Chip (SoC)
-High-speed, serial mobile display digital interface (MDDI) that optimizes the interconnection cost
between the MSM device and the LCD panel
-Receive diversity support for WCDMA mode, thereby providing improved capacity and data throughput
-USB 2.0 compliant high-speed USB core with limited OTG capabilities
-Integrated high-speed USB PHY
-Integrated wideband stereo codec for digital audio applications
-Direct interface to digital camera module with video front-end (VFE) image processing
-GPS position location capabilities
-Vocoder support (GSM-HR, FR, EFR, AMR, and AMR-WB/+)
-Advanced 12 × 12 ×1.05 mm, 0.4 mm pitch, 560 NSP
3.6.4 GPS LNA (U1004, RF2815)
The RF2815 is a GPS Low Noise Amplifier with an integrated SAW filter at the output. Low noise figure, along with high gain, achieved by the RF2815 makes it ideal for GPS recievers requiring high sensitivity. This module builds upon RFMD’s leading edge pHEMT process and integrates input matching and low loss high rejection SAW filter at the output. This results in high performance and a reduced solution size. The ease of implementation simplifies the reciever design.
The RF2185 is packaged in a compact 3.3 mm x 2.1 mm x 1.0 mm package with low external component count required to achieve the best-in-class performance.
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3. TECHNICAL BRIEF
3.8 Hardware Architecture
<System HW Block>
Figure. Block Diagram
USBH DM & DP
Transceiver(RTR6285)
Transceiver(RTR6285)
BT_UART
Capacitive Touch(Melpas + LGIT)
Key LEDKey LED
MUIC_I2C
MMC
USBPHY
SIM
UART3
LCD Backlight ICAAT2862
BL_I2C
DDR SDRAM(4G)NAND FRESH (4G)
EBI1 (DDR)
CAM I/F
TX_IQ, PRX_IQ
MOTION_I2C
BT_PCM
FM_L&R
RF I/F
USIM KPD_PWR_N
I2C
PRX_IQ
GPS
CAM_I2C
MSM7227EBI2 (NAND)
WLAN_SDIOLINE_L& R
LBEH19UNBC-338
Bluetooth v2.1Wi-Fi 802.11b/g
FM Radio
BT & Wi-Fi
FM
FEM(SKY77544)
FEM(SKY77544)DRX_IQ DRX_IQ
GPIO59
GPS
GSM & WCDMA
CAM 3M
TOUCH I2C
MCP(Micron)
Prox Sensor(GP2AP002S00F)
PROX_I2C
SBDT
MOTION Sensor(KR3DM) MOTION_INT
FUEL_I2C
Back Key
UART3
Array TPREMOTE_PWR_ON
MPP3,4
USIMUSIM I/F
GPIO106 SBDT_SSBI
PM7540KPD_DRV_N
PMIC_SSBI
AMUX_OUTHKAIN2 AMUX_OUT
AMUX_OUTPM_INT_N MSM_INT_NGPIO24
PWR/End Key
PON_RESET_N
PS_HOLDGPIO25RESIN_N
nJTAG_RESOUTJTAG_PS_HOLD
JTAG
JTAG CONN.JTAG(TCK,TDI,TDO…)UART3_TX/RX
QTKEY_I2C
System HW Block Diagram All System
Fuel Gauge(MAX17040G)Fuel Gauge(MAX17040G)
PS_HOLD
MDDI Interface
Home Key
Send Key
MUIC(TS5USBA)
MUIC(TS5USBA)
I2C
5pin
_USB
Con
nect
or5p
in_U
SBC
onne
ctor
Main Board
LINE_ON&OP
EAR1_OP&ON
HPH_L&R
LINE_OP, LINE_ON
RCV_P & N
HPH_R, HPH_L
Q-Motor(WHVM-1030Q10)
Q-Motor(WHVM-1030Q10)
GPIO_28 LIN_PWM_FREQ
Menu Key
Volume Key
Sub FPCB
MT29C4G96MAZAPCJA-5 IT
MIC MIC
USIM
SPK_RCVP, N
Speaker & Receiver
3.5 piEarjack
EAR_L, RCOMPASS_I2CDigital Compass
(AMI304) COMPASS_INT
Key COL, Key ROW
MDDI Interface
3.2" HVGA 320*480
Audio SubWM9093ECS-R
TOUCH INT
GPIO_27
GPIO36 ~ 38
Backlight_Key
AUDIO_I2C
TCXO_19.2MHz(Kyocera)
RTR_TRK_LO_ADJ
TCXO_IN
TCXO
TCXO_RTR_19.2MHzTCXO_PM_19.2MHz
TCXO_26MHz
FM_L&RF_CLK_IN
CLK_REQ
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<Power Block>
Figure. Simplified Block Diagram
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3. TECHNICAL BRIEF
3.9 Subsystem (MSM7227)
3.9.1. ARM Microprocessor Subsystem
The MSM7227 device uses an embedded ARM1136JF-S, ARM926EJ-S microprocessor. This microprocessor, through the system software, controls most of the functionality for the MSM, including control of the external peripherals such as the keypad, LCD, SDRAM, and NANDFlash devices. Through a QUALCOMM proprietary single-wire SBI (SSBI) the ARM926EJ-S configures and controls the functionality of the RTR6285 and PM7540 devices.
3.9.2. WCDMA Subsystem
The WCDMA subsystem performs the data conversions and signal processing necessary to maintain the WCDMA air interface between the handset and the base station (and also the WCDMA network). The subsystem components include:
-Searcher engine
-Demodulating fingers
-Combining block
-Frame deinterleaver
-Viterbi decoder
-Reverse link subsystem
-Turbo decoder
On the forward link traffic channel, the WCDMA subsystem searches, demodulates, and decodes incoming pilot, sync, paging, and traffic channel information. It extracts low bit-rate packet data from the forward link traffic channel and sends the packet data to the vocoder for processing. On the reverse link, the WCDMA subsystem processes the packet data from the vocoder and modulates the reverse traffic channel.
3.9.3. GSM Subsystem
The GSM subsystem performs the data conversions and signal processing necessary to maintain the GSM air interface, including PA gain control for GPRS support. For GSM, the power profile ramps up before the burst and ramps down afterward. For GPRS, transmit bursts can occur in as many as four sequential slots and the PA must be ramped up and down smoothly between each slot, holding the desired output power level during each burst. GSM support includes:
-GSM release ‘99 (circuit switching)
-GPRS (packet switching)
-EDGE E2 power class for 8 PSK
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3.9.4. RF Interface
The RF interface communicates with the mobile station’s external RF and analog baseband circuits. Signals to these circuits control signal gain in the Rx and Tx signal path and maintain The system’s frequency reference.
3.9.5. Single-wire serial bus interface (SSBI)
The MSM7227 device’s SSBI is designed specifically to be a quick, low pin count control protocol for QUALCOMM’s RTR6285 and PM7540 ASICs. Using the SSBI, the RTR6285 and PM7540 devices can be configured for different operating modes and for minimum power consumption, extending battery life in Standby mode. The SBI also controls DC baseband offset errors.
3.9.6. Audio function
MSM7227 audio functions include the analog Rx and Tx paths (or stereo wideband codec), audio digital signal processing (DSP) that provides adjustable gains and filtering, PCM circuits for interfacing with external devices, and additional audio DSP that actually implements encoding and decoding. Other key features include:
-The wideband codec supports stereo music/ringer melody applications in addition to the 8 kHz voice
band applications on the forward link.
-A PCM interface allows an external codec to be used instead of the internal codec; this supports inter-IC
Sound (I2S) modes that allow an external stereo DAC or SADC to be used.
-Currently in AMSS baseline only I2S output mode is supported (SDAC-only, no SADC support).
-Audio decoder summing and headset switch detection are included.
-Audio DSP includes the Rx and Tx filters needed to meet ITU-T G.712 requirements.
-A programmable sidetone path provides for summing part of the Tx audio into the Rx path.
-Many codec parameters are configurable via SBI registers.
-The audio processing is configured through QDSP5 command types and is not directly controlled by the
microprocessor.
3.9.7. Vocoder Subsystem
The MSM7227 device’s QDSP4000 supports AMR,FR,EFR and HR. In addition, the QDSP4000 has modules to support the following audio functions: DTMF tone generation, DTMF tone detection, Tx/Rx volume controls, Tx/Rx automatic gain control (AGC), Rx Automatic Volume Control (AVC), EarSeal Echo Canceller (ESEC), Acoustic Echo Canceller (AEC), Noise Suppression (NS), and programmable, 13-tap, Type-I, FIR, Tx/Rx compensation filters. The MSM7227 device’s integrated ARM9TDMI processor downloads the firmware into the QDSP4000 and configures QDSP4000 to support the desired functionality.
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3. TECHNICAL BRIEF
3.9.8. Mode Select and JTAG Interfaces
The mode pins to the MSM7227 device determine the overall operating mode of the ASIC. The options under the control of the mode inputs are Native mode, which is the normal subscriber unit operation, ETM mode, which enables the built-in trace mode, and test mode for factory testing. The MSM7227 device meets the intent of the ANSI/IEEE 1149.1A-1993 feature list. The JTAG interface can be used to test digital interconnects between devices within the mobile station during manufacture.
3.9.9. General-Purpose Input/Output Interface
The MSM7227 IC includes 133 general purpose input/output (GPIO) pins, and each can be configured as a digital input or digital output. Inputs can be set to have a pull-up, pull-down, keeper, or no-pull. Output drive strength is also programmable. Software assigns functions to the GPIOs and their configurations are set accordingly. Some of the GPIO pins have alternate functions supported on them. The alternate functions include USB interface, additional RAM, ROM, general-purpose chip selects, parallel LCD interface, and a UART interface. The function of these pins is documented in the various software releases.
3.9.10. UART
The MSM7227 device employs three UARTs. UART1 has dedicated pins while UART2 and UART3 share multiplexed pins.
-UART1 for Bluetooth
-UART2 for USIM interface
-UART3 for data
.
3.9.11. USB
The MSM7227 IC supports one High Speed USB (HS-USB) USBH port with built-in PHY and one Full Speed USB-UICC port. The MSM7227 IC supports USB interfaces using two controllers:
-The primary controller is the HS-USB port with an integrated physical layer (PHY). This HS-USB port is
also capable of supporting USB operations at low-speed and full-speed.
-The secondary controller is the FS USB-UICC port, which only supports host mode functionality.
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3. TECHNICAL BRIEF
3.10 Power Block
3.10.1. General
MSM7227, included RF, is fully covered by PM7540 (Qualcomm PMIC). PM7540 cover the power of MSM7227, MSM memory, RF block, Bluetooth, USIM and TCXO.
Major power components are :
PM7540 (U403) : Phone main PMIC
3.10.2 PM7540
The PM7540 device (Figure) integrates all wireless handset power management. The power management portion accepts power from all the most common sources – battery, external charger, adapter, coin cell back-up – and generates all the regulated voltages needed to power the appropriate handset electronics. It monitors and controls the power sources, detecting which sources are applied, verifying that they are within acceptable operational limits, and coordinates battery and coin cell recharging while maintaining the handset electronics supply voltages. Eight programmable output voltages are generated using low dropout voltage regulators, all derived from a common trimmed voltage reference. A dedicated controller manages the TCXO warm-up and signal buffering, and key parameters (under-voltage lockout and crystal oscillator signal presence) are monitored to protect against detrimental conditions. MSM device controls and statuses the PM7540 IC using Single-wire SBI(SSBI) supplemented by an Interrupt Manager for time-critical information. Another dedicated IC Interface circuit monitors multiple trigger events and controls the power-on sequence.
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3. TECHNICAL BRIEF
Figure. PM7540 functional block diagram Figure. PM7540 functional block diagram
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3. TECHNICAL BRIEF
3.10.3. Charging control
A programmable charging block in PM7540 is used for battery charging. It is possible to set limits for the charging current. The external supply typically connects directly to pin (VCHG). The voltage on this pin (VCHG) is monitored by detection circuitry to ascertain whether a valid external supply is applied or not. For additional accuracy or to capture variations over time, this voltage is routed internally to the housekeeping ADC via the analog multiplexer. PM7540 circuits monitor voltages at VCHARGER and ICHARGE pins to determine which supply should be used and when to switch between the two supplies. These pins are connected to the Source (or emitter) and Drain (or collector) contacts of the pass transistor respectively.
3.10.3.1. Trickle Charging
Trickle Charging of the main battery, enabled through SBI control and powered from VDD, is provided by the PM7540 IC, The trickle charger is on-chip programmable current source that supplies current from VDD to pin (VBAT). Trickle charging can be used for lithium-ion and nickel-based batteries, with its performance specified below (3.2V). The charging current is set to 80mA.
Parameter Min Typ Max Unit
Trickle Current 60 80 100 mA
Figure. PM7540 Charging Flow (TC Charging)
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3. TECHNICAL BRIEF
3.10.3.2. Constant Current Charging
The PM7540 IC supports constant current charging of the main battery by controlling the charger pass transistor and the battery transistor. The constant current charging continues until the battery reaches its target voltage, 4.2V.
Figure. PM7540 Charging Flow (CC Charging)
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LGE Internal Use Only
3. TECHNICAL BRIEF
3.10.3.3. Constant Voltage Charging
Constant voltage charging begins when the battery voltage reaches a target voltage, 4.2V. The end of constant voltage charging is commonly detected 10% of the full charging current.
3.10.3.4. LGP509 Charging Specification
-Charging Method : CC & CV (Constant Current & Constant Voltage)
-Maximum Charging Voltage : 4.2V
-Maximum Charging Current : 700mA
-Nominal Battery Capacity : 1500mAh
-Charging time : Max. 3h 30m
- Full charge indication current (icon stop current) : 50mA
3.10.3.5. LGP509 battery bar icon display
Battery Bar Number Specification
BAR 6 (Full) 90% over
BAR 6 --> 5 90% 89%
BAR 5 --> 4 70% 69%
BAR 4 --> 3 50% 49%
BAR 3 --> 2 30% 29%
BAR 2 --> 1 15% 14%
BAR 1 --> 0 5% 4%
Low Battery Pop-up 4% ~ 15% : One Time popup (No call)
Critical Low Battery Pop-up 0% ~ 3% : Level change popup (No call)
POWER OFF 0%
Remain %
Table. LGP509 battery bar specification
LGP500h
LGP500h
LGP500h
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3. TECHNICAL BRIEF
3.11 External memory interface
3.11.1. MSM7227
The MSM7227 device was designed to provide two distinct memory interfaces. EBI1 was targeted for supporting DDR synchronous memory devices. EBI2 was targeted towards supporting slower asynchronous devices such as LCD, NAND flash, SRAM, NOR flash etc. To support the high-bandwidth, high-density, and low-latency requirements of the advanced on-chip applications, the MSM7227 IC has two high-speed, high-performance memory slave interfaces: the external bus interface 1 (EBI1) and the stack memory interface (SMI). To achieve higher bandwidth and better use of the memory device interface, the SMI accepts multiple commands for the external memory
device. The SMI interface acts as a slave device to all of the bus masters within the MSM device. The masters arbitrate to gain access to the SMI, and upon obtaining the access, they issue commands to the SMI. The bus masters are connected to the SMI through an advanced extensible interface (AXI) bus bridge (or global interconnect block) and communicate over a 64-bit, non-blocking AXI bus protocol. The AXI bus bridge provides the arbitration logic for all of the bus masters.
EBI1 Features - Support for only low-power memories at 1.8-V I/O power supply voltage - AXI bus frequencies up to 133 MHz - A 16-bit/32-bit static and dynamic memory interface DDR SDRAM interface features include: - Supports both 32-bit DDR SDRAM devices, up to 133-MHz bus speed - Supports auto precharge and manual precharge - Supports partial refresh - Separate CKE pin per chip-select to support partial operation mode - Idle power down to save idling power consumption EBI2 Features - Support for asynchronous FLASH and SRAM(16bit & 8bit). - Interface support for byte addressable 16bit devices(UB_N & LB_N signals). - 2Mbytes of memory per chip select. - Support for 8 bit/16bit wide NAND flash.
- Support for parallel LCD interfaces, port mapped of memory mapped(8 or 16 bit)
3.11.2.LGP509 External memory Interface
-Multi Chip Package : DDR SDRAM and NAND Flash merged 1 package -4Gbit Mobile DDR SDRAM / 4Gbit NAND Flash
Interface Spec
Part Name Product Gr Maker Operation Voltage Speed
NAND 1.8V 42ns K524G2GACB-A050
SDRAM
SEC
1.8V 200MHz
LGP500h
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3. TECHNICAL BRIEF
3.12 H/W Sub System
3.12.1. RF Interface
3.12.1.1. RTR6285 (WCDMA_Tx, GSM_Tx/Rx)
MSM7227 controls RF part(RTR6285) using these signals.
-RTR6285_SSBI : SSBI I/F signals for control Sub-chipset -RTR_TXON : Power AMP on RF part -RTR_RX_I/Q_M/P, RTR_TX_I/Q_M/P : I/Q for T/Rx of RF -RTR_DAC_REF : Reference input to the MSM Tx data DACs
3.12.1.2. the others
TRK_LO_ADJ : TCXO(19.2M) Control PA_ON0/PA_RANGE0 : WCDMA(2100) TX Power Amp Enable ANT_SEL[0-3] : Ant Switch Module Mode Selection(WCDMA,GSM Tx/Rx,DCS-PCS Tx/Rx) GSM_PA_RAMP : Power Amp Gain Control of APC_IC
3.12.1.3. RF2815 (GPS LNA)
* GPS_LNA_EN : GPS LNA Enable Signal (GPS LNA Shutdown)
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3. TECHNICAL BRIEF
3.12.1.4. LBEH19UNBC-338 (BT / WiFi module )
WiFi
* WLAN_CMD : WLAN SDIO Command Line.
* WLAN_CLK : WLAN SDIO Clock Input.
* WLAN_SDIO[3:0] : WLAN SDIO Data Line.
* WLAN_RESET_N : Low asserting reset for WLAN core.
* WLAN_HOST_WAKEUP : WL_HOST_WAKEUP signal output.
BT
* BT_UART_RXD : Bluetooth UART Serial Input.
* BT_UART_RTS : Bluetooth UART Request to Send. Active-low request.
* BT_UART_CTS : Bluetooth UART Clear to Send. Active-low clear.
* BT_UART_TXD : Bluetooth UART Serial Output.
* BT_PCM_CLK : BT PCM clock, can be PCM-master (output) or PCM-slave (input).
* BT_PCM_DIN : BT PCM data input.
* BT_PCM_SYNC : BT PCM sync signal, can be PCM-master (output) or PCM-slave (input).
* BT_PCM_OUT : BT PCM data output.
* BT_WAKEUP : BT Wakeup Input.
* BT_HOST_WAKEUP : BT Host Wakeup Output
* BT_RESET_N : Low asserting reset for BT core.
Common
* WLAN_REG_ON : If low the internal regulators will be disabled.
* SLEEP_CLK : LPO clock (32.768kHz) input. Used for low-power mode timing.
* CLK_IN : Crystal amplifier input or frequency reference input.
* CLK_REQ : Crystal Circuit / Reference Clock Enable (active-high)
FM Radio
* FM_ANT : FM RF input.
* SLEEP CLK : External reference oscillator input. (32.768KHz)
* FM_R : Right audio line output – digital input data.
* FM_L : Left audio line output – digital frame synchronization.
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3. TECHNICAL BRIEF
Figure. Wifi/BT/FM Interface Block Diagram
WiFi/BT/FM Radio Block Diagram
26MHzTCXO
32.768KHz
PM7540
SLEEP_CLK(LPO Clock:32.768KHz)
3.5Ear JackFM_ANT
LBEH
19U
NB
C
MSM
7227
CLK_IN
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3. TECHNICAL BRIEF
3.12.2 MSM Sub System
3.12.2.1. USIM Interface
SIM interface scheme is shown in Figure.
And, there control signals are followed
-USIM_CLK : USIM Clock -USIM_Reset : USIM Reset -USIM_Data : USIM Data T/Rx
3.12.2.2. UART Interface
UART signals are connected to MSM GPIO through IO connector with 115200 bps speed.
GPIO_Map Name Note
GPIO_86 UART3_RX Data_Rx
GPIO_87 UART3_TX Data_Tx
Table. UART Interface
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3. TECHNICAL BRIEF
3.12.2.3. HS-USB
The High-Speed USB module contains an embedded UTMI+ core with a built-in transceiver eliminating the need for an external PHY. The HS-USB port is a standard 4-pin interface that connects directly to the USB connector (USBPHY_DP, USBPHY_DN, USBPHY_ID and USBPHY_VBUS). Two additional pins are required for PHY operations which include an external reference resistor pin (USBPHY_REXT) and a USB system clock pin which the USB PHY uses to lock its internal PLL (SYS_CLK)
Figure. HS-USB connections and architecture
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3. TECHNICAL BRIEF
3.12.3 KEY
3.12.3.1 Side key
There are 3 side key buttons that are controlled by MSM7227.
Refer to the circuit.
Figure. Volume Side key
Figure. Power key
016AV
CN3
4
3
2
1
470R25
1AV
906AV
R613 470
R610 470
KEY_COL[2]KEY_ROW[1]
KEY_ROW[0]
0603
CN5
2
1VA2
KPD_PWR_N
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3. TECHNICAL BRIEF
3.12.3.3 KEY Backlight
There are 4 White side view LED, 4 white LED in key backlight circuit
Figure. KEY Backlight
2711R
1
371 1R
1
5711R
1
LD1 LD4 LD3 LD2
C1931
2.2u
4711R
1
+VPWR
BACKLIGHT_KEY
- 54 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
3. TECHNICAL BRIEF
3.13 Audio and sound
3.13.1 Overview of Audio path
3.5
1.8V LDORP103K181D
Audio Block Diagram
Figure. Block diagram of Audio & Sound path
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LGE Internal Use Only
3. TECHNICAL BRIEF
3.13.2. Audio signal processing & interface
3.13.2.1 MSM7227 audio interface
The MSM7227A audio front end comprises the stereo wideband codec, PCM interface, and additional DSP audio processing. The stereo wideband codec allows the MSM7227 device to support stereo music/ringer melody applications in addition to the 8 kHz voice band applications on the forward link.
In the audio transmit path, the device operates as 13-bit linear converter with software, selectable 8 kHz and 16 kHz sampling rate. In the audio receive path, the device operates as a software-selectable 13-bit or 16-bit linear converter with software selectable 8 kHz,16 kHz, 22.05 kHz, 24 kHz, 32 kHz, 44.1 kHz, or 48 kHz sampling rate. Through software, the Rx path can be configured as either a mono or stereo output. New to the MSM7227 device is a transmit (Tx) ADC path that now supports stereo wideband sampling. The integrated codec contains all of the required conversion and amplification stages for the audio front end. The codec operates as a 13-bit linear codec with the transmit (Tx) and receive (Rx) filters designed to meet ITU-T G.712 requirements.
The codec includes a programmable side tone path for summing a portion of the Tx audio into the Rx path. An on-chip voltage/current reference is provided to generate the precise voltages and currents required by the codec. This circuit requires a single capacitor of 0.1 μF to be connected between the CCOMP and GND pins. The on-chip voltage reference also provides a microphone bias voltage required for electret condenser microphones typically used in handset applications. The MICBIAS output pin is designed to provide 1.8 V DC while delivering as much as 1 mA of current. Audio decoder summing and headset switch detection are included. The codec interface includes the amplification stages for both the microphone and earphone. On the transmit (Tx) path, the interface supports two differential microphone inputs, a differential auxiliary input, and a stereo line input. On the receive (Rx) path the interface supports one differential earphone output, a stereo single-ended headphone output, one differential auxiliary output, and stereo single-ended line outputs. The codec is configured by the codec SBI registers. The codec interface is shown in Figure.
Also part of the audio front end is the PCM interface. The PCM interface allows for an external codec to be used instead of the internal codec. This interface can be used in I2S mode which will allows for an external stereo DAC to be used. Finally, the audio front end includes additional DSP audio processing that does gains, filtering and other audio processing.
The DSP audio processing is configured through the QDSP5000 command types and is
not directly controlled by the microprocessor.
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3. TECHNICAL BRIEF
Figure. Detailed diagram of MSM7227 audio interface
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LGE Internal Use Only
3. TECHNICAL BRIEF
3.13.2.2 WM9093 audio interface
The WM9093 is a high performance low power audio subsystem, including headphone driver and Class AB/D earpiece/speaker driver. The Class D speaker driver support 650mV output power at 3.6V, 1%THD.
The unique dual mode charge pump architecture provides ground referenced headphone outputs removing the requirement for external coupling capacitors. Class G technology is integrated to increase the efficiency and extend playback time by optimizing the headphone driver supply voltages according to the volume control.
The flexible input configuration allows single ended or differential stereo inputs. Mixers allow highly flexible routing to the outputs, A ‘voice Bypass’ path is also available for low-power voice applications.
The WM9093 is controlled using a two-wire I2C interface. An integrated oscillator generates all internal clocks. Removing the need to provide any external clock.
Separate mixer and volume controls are provided for each headphone and speaker driver. Automatic Gain control limits the speaker output signal in order to prevent clipping. DC offset correction to less than 1mV Guarantees a pop/click-free headphone start up.
The WM9093 is available in a 2.0mm × 2.5mm 20-bump CSP package.
Figure. Detailed diagram of WM9093 audio interface
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3. TECHNICAL BRIEF
FB7011800
FB7001800
33p
C702
1
2
MIC_BIAS
33p
C703
MIC1
6
5
4
3
2
1OUT
G1
G2
G3
PWR
G4
VA615
33p
C700
MIC_1P
MIC_1N
changed 12/28MIC
R509 12
J2
2
36
5
4
1M5_MIC
M4_L
M3_DETECT
M4D-DETECT
M1_R
M6_GND
10K
R521
FB502 1800
10K
R520
106Q
D
G
S
005D
2 05D
305D
47p
C542
105D
33p
C544
M1
8 611R
15p
C545C543
47p
405D
270n
L504
VREG_MSMP_2.6V
U502
5
3 24 1
VOUTVINGNDSTBY
DN
GP
9611R
K74
VREG_MSMP_2.6V
K2. 2
705R
33p
C538
2.2u
C539
R515 12
FB5001800
FB5011800
10uC537
FM_ANT
EAR_L
EAR_R
EARJACK_SENSE
HS_MIC_BIAS_EN
HS_MIC
HIGH
LOW(DEFAULT)
STATE
UNMATING
EAR_SENSE
MATING
2009.11.16 added
10.04.08 Changed Rev.C
3.5pi Ear Jack Connector
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3. TECHNICAL BRIEF
R1170 2.2K
205C
p93
305R
02
505R
K7.4
2.2KR1171
405C
u1
R1177 10
+VPWR_AUDIO
10R1176
C522
2.2u
C509 33n
33nC510
C518
2.2u
205R
02
405R
K7.4
47pC505
47pC506
u1.
03
15C
u1
.0
215C
1uC511
1uC514
VREG_MSMP_2.6V
C519
2.2u
IC5003
B
A4
C3
C2
2B
D1
D34
D
C1
A1D2
1B
D5
A2
A5
A3B5
4B
C5
4C
DN
G
OUT+
DD
VP
H
CPVDDCPVSS
CN
HPL
OUT-
SAI
B
IN2- HPR
IN1+
DD
VS
IN3-
IN2+
AD
S
IN1-
IN3+
CP
LC
S
1uC507
C508 1u
C523
2.2u
u01
30
5C
2.2uC515
VREG_HPVDD_1.8V
LINE_ON
LINE_OP
AUDIO&MOTION_I2C_SDA
HPH_R
HPH_L
AUDIO&MOTION_I2C_SCL
RCV_PRCV_N
EAR_L
EAR_R
SPK_RCV+
SPK_RCV-
Audio SUB SYSTEM
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3. TECHNICAL BRIEF
3.14 Display
LCD module is connected to Main PCB with 24-pin connector.
The LCD is controlled by MDDI Interface in MSM7227.
Figure. Schematic of LCD connector (Main Board)
CN601
1312
1411
1510
169
178
187
196
205
214
223
232
241
1DZ
FL603
019
84736251
P1 P5P2 P6P3 P7P4 P8
1G
2G
VREG_LCD_2.8VVREG_LCD_1.8V
D600
4 3
5 2
6 12.2uC616 C617
2.2u
WLED_PWR
C4
4.7u
WLED5 WLED4
WLED3 WLED2
WLED1
WLED6WLED7
LCD_RESET_N
LCD_MAKERID_LOWMDDI_P_STB_MMDDI_P_STB_P
MDDI_P_DATA_MMDDI_P_DATA_P
LCD_VSYNC_O
3.2" HVGA LCD Connector
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Table. Interface between LCD Module and MAIN Board
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3. TECHNICAL BRIEF
3.15 Proximity Sensor
When call connected, the object is moved nearer to the proximity sensor.
LCD backlight and Touch screen is disable operation automatically.
U700 : GP2AP002S00F IC used I2C interface to MSM7227
Figure. Proximity Sensor Schematic
Figure. Proximity Sensor Block Diagram
VREG_MSMP_2.6V
U700
5 4
6 3
7 2
8 1LEDASCL
LEDCSDA
VCCVIO
VOUTGND
C707
1u
R700
10
C708
0.1u
R703
10
VREG_PROX_2.8V
R702
4.7Kohms
R701
4.7Kohms
C709
4.7u
10u
C705
PROX_OUT
PROX_COMPASS_I2C_SCL
PROX_COMPASS_I2C_SDA
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3. TECHNICAL BRIEF
3.16 Vibrators (Q-Coin Motor)
The strength of vibration is determined by the duty cycle of PWM (LIN_PWM_FREQ)
U602 : EUSY0404001 is Q-Coin motor driver IC.
Figure. Q-Coin Moter IC Schematic
Figure. Vibrator Block Diagram
C623
0.1u
R614
4.7KohmsR617
51K
C625 10n
R612 100K
R618
1K
R615
1K
R616
51K
VREG_MOTOR_3.3V VREG_MOTOR_3.3V
U602
B2C1
A1B1
B3C2
A3C3IN- VDD
IN+ VO+
_SHUTDOWN VO-
BYPASS GND
Q600
C
B
E GND
IN
OUT
C624
0.1u
R619 100K
LIN_PWM_FREQ
MTR_P_2sub
MTR_N_2sub
1%
1%
1%
1%1%
1%
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3. TECHNICAL BRIEF
3.17 Compass Sensor
If a customer buy the application SW, The Sensor Support a Eletric Compass function
U1 : AMI304 IC used I2C interface to MSM7227
Figure. Compass Sensor Schematic
C706
470n
VREG_MSMP_2.6VVREG_MOTION_3.0V
407C
n 01
U1
12
11
10
9
5
4
6
37
28
1D
DV
D
GE
RV
AD
NG
SD
NG
DD
VA
ADDR
SCL
NC1
TN
I
VPP
DRDY
SDA
PROX_COMPASS_I2C_SCL
PROX_COMPASS_I2C_SDACOMPASS_DRDY
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Figure. Compass Sensor Block Diagram
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3. TECHNICAL BRIEF
3.18 Motion Sensor
According to tilt the cell phone, the screen is had rotated automatically.
U503 : KR3DH IC used I2C interface to MSM7227
Figure. Motion Sensor Schematic
Figure. Compass Sensor Block Diagram
045C
u1.0
U503
61
7 6
5
4
8
3
9
2
10
1
11
12
13
41 512
DE
VR
ES
ER
DD
V
GND3
GND2
INT1
VDD_IO
RESERVED1
NC1
INT2
NC2
SC
SCL_SPC
GND1
OD
S_ID
S_A
DS
0A
S_O
DS
4D
NG
VREG_MOTION_3.0V
10u
C541
815R
K2. 2
915R
K2.2
MOTION_INTMOTION_I2C_SCL
MOTION_I2C_SDA
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3.19 Main Features
3.19.1. LG-P500h Main Features
- DOP Type design
- UMTS 2100 + UMTS 1900 + UMTS 850 + GSM 900 + DCS 1800 + PCS 1900 + GSM850 based
GSM/GPRS/EDGE/UMTS
- HSDPA 7.2Mbps
- TFT Main LCD(3.2’ HVGA, 320 x 480)
- Capacitive/Electrostatic Touch Window
- 3M AF Camera
- 3.5Phi Stereo Headset & Speaker phone
- Mobile XMF –Mobile DLS / Scaleable Polyphony
- MP3/AMR/AAC/AAC/WAV/WMA decoder and play
- MPEG4 encoder/decoder and play/save
- JPEG en/decoder
- Supports Bluetooth and HS-USB
- Supports WLAN(802.11b, 802.11g)
- Supports FM Radio
- 1500 mAh (Li-Ion)
LG-P500h
- 68 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
3. TECHNICAL BRIEF
3.19.2. LG-P509 Main component (bottom)
Main Board Bottom
Logic
RF
PMIC
WLAN GPS
LG-P500h
- 69 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL BRIEF
3.19.2. LG-P509 Main component (bottom & Sub carrier)
Main Board Bottom & Sub carrier
Vibrator
Camera
SD memory
soket
LG-P500h
- 70 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
3. TECHNICAL BRIEF
3.19.2. LG-P509 Main component (Top)
Main Board Top
Power key
Side Volume key
Dome key
LG-P500h
- 71 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL BRIEF
3.19.3. RF of LG-P500h
FL1006
FL1010
WCDMA PAM(II)
DCS/PCS RX Dual SAW Filter
FL1001 TCXOX200
RF Antenna connector SW1001 WCDMA (I) RX SAW Filter
EGSM/850 RX Dual SAW Filter
U1005 WCDMA (I) TX SAW Filter
FL1003
WCDMA (I) Duplexer
FL1002 External LNA(I, II ,V) U2
WCDMA (II) Duplexer WCDMA PAM(I, V) U1003
WCDMA (II) RX SAW Filter FL1012 GSM PAM/FEM module U1002
WCDMA (II) TX SAW Filter FL1009 RTR6285 U1001
Description Reference Description Reference
SW1001
X200
FL1006
U1002 FL1008
FL1009
FL1002
FL1010
FL1001
U1001
U1003
U1005
FL1003
FL1012
U2
FL1008
FL1
FL1005
FL2
FL1
FL2
WCDMA (V) RX SAW FILTER FL1005 WCDMA (V) TX SAW FILTER
WCDMA (V) Duplexer
- 72 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
3. TECHNICAL BRIEF
3.19.4. BaseBand of LG-P509
GPS D flip-flop U502 Level shifter U601
LCD CONN. CN601 MDDI filter FL603
J-TAG CONN. CN200 Q-coin Motor drive amp U602
Motion sensor U503 MSM7227 U200
Charge pump U1007 Memory U301
Description Reference Description Reference
U301 U602
U1007
U503 U202
FL603
U601
CN200
CN601
LG-P500h
- 7� -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL BRIEF
3.19.5. Power and Logic of LG-P509
Q400
Fuel gauge IC U404
Sleep X-tal X400SIM connector J1
Battery Conn. CN401 Digital Compass U1
Charging IC Q400PM7540 U403
Description Reference Description Reference
X400
U403
U1
J1
CN401
U404
LG-P500h
- 74 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
3. TECHNICAL BRIEF
3.19.6. Audio of LG-P509
CN1 CN600 U502 IC500
Audio Sub system IC500
Headset Bias LDO U502 Sub FPCB B2B conn. CN2
Camera conn. CN600 Touch Conn. CN1
Description Reference Description Reference
LG-P500h
- 75 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
TROUBLE SHOOTING
4.1 RF Component
U1002 FEM
SW1001 RF SW
FL1008 W2100 Duplexer
FL1010 W1900 Duplexer
U1003 W2100/W850
PAM
U1001 RF Transceiver
FL1009 W1900 Tx saw filter
FL1006 W2100 Tx saw filter
U2 WCDMA LNA
FL1001 EGSM/850
Rx saw filter
FL1002 DCS/PCS
Rx saw filter
X200 VCTCXO
U1005 W1900
PAM
FL1003 W2100 Rx saw filter
FL1012 W1900 Rx saw filter
FL1005 W850 Tx saw filter
FL1 W850 Rx saw filter
FL2 W850 Duplexer
4. TROUBLE SHOOTING
- 76 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
4. TROUBLE SHOOTING
RF component (WCDMA / GSM)
Reference Description Reference Description
U1001 RTR6285(Transceiver) FL1001 EGSM/850 Rx saw filter
U1002 GSM TX Module
(FEM + GSM/EDGE PAM)
U2 WCDMA (I, IV)
LNA
U1003 WCDMA Dual (I,VIII) PAM U1005 WCDMA (IV) PAM
FL1006 WCDMA (I) TX SAW Filter X200 VCTCXO(19.2MHz)
FL1003 WCDMA (I) RX SAW Filter U1004 GPS LNA
FL1008 WCDMA (I) Duplexer FL1007 GPS SAW Filter
FL1009 WCDMA (IV) TX SAW Filter
FL1012 WCDMA (IV) RX SAW Filter
FL1010 WCDMA (IV) Duplexer
FL1002 DCS/PCS Rx saw filter
SW1001 RF Antenna Connector
U1004 GPS LNA
FL1007 GPS Rx saw filter
- 77 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
4.2 SIGNAL PATH
WCDMA I and II and V Band TX Signal PATH
D2. WCDMA 2100 TX PATH
E2. WCDMA 1900 TX PATH
F2. WCDMA 850 TX PATH
G1. COMMON TX/RX PATH
- 78 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
4. TROUBLE SHOOTING
WCDMA I and II and V Band RX Signal PATH
D1. WCDMA 2100 RX PATH
E1. WCDMA 1900 RX PATH
F2. WCDMA 850 TX PATH
F1. COMMON TX/RX PATH
- 79 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
GSM850/GSM900/DCS/PCS’s RX/TX Signal PATH
A. GSM850/GSM900/DCS1800/PCS1900 RX PATH
B. GSM850/GSM900/DCS1800/PCS1900 TX PATH
C. COMMON TX/RX PATH
- 80 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
4. TROUBLE SHOOTING
4.3 Checking TCXO Block
The output frequency (19.2MHz) of TCXO (X200) is used as the reference one of RTR6285 and PM7540 internal
VCO.
Schematic of the Crystal Part (19.2MHz)
TP3 TP2
TP1
TP2 TP3
TP1
R208 220
R210 100K
U201
3
2
4
15
VCC
GND
C220 0.1u
C221 330p
VREG_MSMA_2.6V
VREG_TCXO_2.85V
330pC210
330pC207
C205
1n
C206
0.1u
19.2MHzKT3225L19200DCW28RA0
X200
42
31VCONT OUT
GND VCC
R205 100
R209 33
C208
10n
TCXO_EN
TCXO_RTR_19.2MHZ
TCXO_PM_19.2MHZRTR_TRK_LO_ADJ
USBH_SYSCLK
Clesed to TCXO
TCXO Circuit
1.0TFFA Rev.C(220Ohm@100MHz)
TP2
TP1
TP3
- 81 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
Check TP1VCC of TCXO
VCC ≥ 2.85V Check the PM7540No
Yes
Check TP2
2.4V ≥ Voltage ≥ 0.4V Check the MSM7227No
Yes
Check TP�
19.2 MHz Signal Check soldering and components
No
Yes
TCXO is OK
- 82 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
4. TROUBLE SHOOTING
4.4 Checking GSM TX Module(GSM PAM + FEM) Block
VBATT(TP1)
ANT_SEL0
ANT_SEL3
ANT_SEL2
ANT_SEL1
- 8� -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
Schematic of the Antenna Switch Block
TP1
2.2K
R1006
U1002
313029
44434241
403938
736353
1615
4131211101
343332
17
9
188 197 206 215 224
32
3
42
2
52627282
1DCS_PCS_IN
11D
NG
01D
NG
9D
NG
8D
NG
GND1
7D
NG
GSM_IN
6D
NG
VAPCGND5VBATTGND4BS2GND3BS1GND2_TXEN
ANT
ED
OM
WCDMA3
PGND4PGND5PGND6 P
MET
4X
R3
XR
2X
R1
XR
WCDMA1WCDMA2
7D
NG
P8
DN
GP
9D
NG
P PGND10PGND11PGND12
PGND13PGND14PGND15PGND16
PGND1PGND2PGND3
39pC1024
031
4R
47
R6031
5R
+VPWR_RF
C1043
10u
75
R7
19
61R
C1045 1n1nC10471nC1048
C1051 1n
19
51R
47pC1044
ANT_SEL1
ANT_SEL2ANT_SEL0
ANT_SEL3
GSM_PA_RAMP
DCS_PCS_TX
GSM_TX
0603
2mm
11dB
7dB
GSM850(824-849MHz)
8061
GSM900(880-915MHz)
PCS(1850-1910 MHz)
DCS(1710-1785 MHz)
0603
TP1
- 84 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
4. TROUBLE SHOOTING
Check ANT_SEL 0, 1, 2, �High Level
1.2V < Voltage < �V Check the TP1(VBATT)No
Yes
Check the Logic in each mode
- 85 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
4.5 Checking WCDMA Block
START
1. Check TCXO 19.2MHz
6. Ro-download SW & Cal.
2. Check FEM Block Refer to 1.4
�. Check RF Tx Level
4. Check PAM BlockRefer to 1.5.4
5. Check RF Level
- 86 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
4. TROUBLE SHOOTING
4.5.1Checking TCXO Block
Refer to 1.3
4.5.2. Checking FEM Block
Refer to 1.4
4.5.3. Checking RF TX Level
Test Point (TX Level)
TP1
TP2
TP3
TP4
- 87 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
U1002
313029
44434241
403938
736353
1615
4131211101
343332
17
9
188 197 206 215 224
32
3
42
2
52627282
1DCS_PCS_IN
11D
NG
01D
NG
9D
NG
8D
NG
GND1
7D
NG
GSM_IN
6D
NG
VAPCGND5VBATTGND4BS2GND3BS1GND2_TXEN
ANT
ED
OM
WCDMA3
PGND4PGND5PGND6 P
MET
4X
R3
XR
2X
R1
XR
WCDMA1WCDMA2
7D
NG
P8
DN
GP
9D
NG
P PGND10PGND11PGND12
PGND13PGND14PGND15PGND16
PGND1PGND2PGND3
18nL1004L11
DNI
33pC1005
SW1001
43
2
1ANT COMMON
G3 G4
GND
WCDMA_2100_RTX
WCDMA_850_RTX
WCDMA_1900_RTX
TP1
33p
C1087
C1079
8.2p
L1030DNI
L1151
3n
C1929
100p
L1027 3.3n
FL1005
836.5MHz
3 2
4 1
5GND
INOUTG1G2
51
11R
C1153
33p
IN
D
3611R
C1086DNI
FL1009
1880MHz
5 2
4 1
3G3
INOUTG1G2
C1090
12p
2.7nL1035
FL2
836.5 MHz,881.5 MHz
75
84 92
3
16ANT RX
TX
GND1GND5GND2GND6
GND3 GND4
C1081DNI
8711R
0
L10216.8n
C1088
15p
L1025
1.5n
C1084
3n
L1033DNI
FL1008
75
84
92
3
16ANT RX
TX
GND1 GND6GND2 GND5GND3 GND4
DNIL1020
U1003
61 51
8 7
9 6
10 5
11 4
12 3
13 2
14 1IN_BAND_VOUT_BAND_V
VMODE_0GND3
VMODE_1VCC2_2
VCC2_1GND2
VEN_BAND_VOUT_BAND_I
VEN_BAND_IGND1
IN_BAND_ICPL_OUT
1D
NG
P
2D
NG
P
3.3p
C1089
5.6nL1029
33
R1022
18
R1023
+VPWR_RF
C10750.001uF 10u
C1077330pC1076
L1026DNI
C1109
33L1041
1.5n
C1154
4.7n
C10921.5n
C1083
33p
100p
C1094 C1096
100p 100p
C1095
L1031DNI
U1005
6 5
7 4
8 3
9 2
10 1
11PGND
VCC1VCC2
RFINRFOUT
VMODE_1CPL_IN
VMODE_0GND
VENCPL_OUT
C11121.5p
+VPWR_RF
1950MHz
FL1006
5 2
4 1
3G3
INOUTG1G2
C11111.5p
C1113100p
C1104
1n
C1110100
C1114100p 100p
C1115
2.2uC1102
33pC1103
C1108 33p
C11160.5p
L1040
2.4n
FL1010
1880,1960MHz
75
84
92
3
16ANT RX
TX
GND1 GND6
GND2 GND5
GND3 GND4
C1078
22p
C1117DNI
L113018n
10nL1022
L1150DNI
L1120DNI
100p
C12
100p
C13
9.94
7201R
PA_ON1
PA_ON0
PA_R0
PA_R0
PA_ON2
WCDMA_2100_RTX
WCDMA_2100_TX_OUT
PDET_IN
WCDMA_1900_TX_OUT
WCDMA_850_RTX
WCDMA_850_TX_OUTPA_R1
PA_R1
WCDMA_1900_RTX
W1900
0603
Band I
Band 5
W2100
W850
WCDMA 1900 Tx (1850-1910MHz)
Band 2
Near to 12 Pin Near to 12 PinNear to 4 Pin
Near to 10 Pin Near to 1 Pin
TP2
TP2
TP3
TP3
TP4TP2
TP3
TP4
TP4
- 88 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
4. TROUBLE SHOOTING
For testing, Max power output is needed.
Check ANT_SEL 0, 1, 2(High, Low, Low)
Check TP1 Over 21dBm? RF Tx Level is OKYes
No
Check PAM BlockRefer to 1.5.4
Check TP2 Over 21dBm? Check TX ModuleYes
No
Check TP� Over 21dBm? Check DuplexerYes
No
Check TP4 Over 7dBm? Check RTR6285Yes
No
RTR6285 Maximun output Power = 7dBmRTR6285 minimun output Power = -80dBm
- 89 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
4.5.4. Checking PAM Block
PAM control signal
W_PA_ON (W_1900_PA_ON(C1115), W_2100_PA_ON(C1095) and W_850_PA_ON(C1096)) :
PAM Enable
W_PA_RO: PAM Gain Control
W_PA_ON must be HIGH (over 2.6V)
- 90 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
4. TROUBLE SHOOTING
PAM IN/OUT Signal :
When PAM is under the operation of high power mode (WCDMA_PA_R0(C1929):Low),
PAM OUT power must be over 21 dBm
PAM IN power must be under 10 dBm
TP3
TP1
TP2
- 91 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
33p
C1087
C1079
8.2p
L1030DNI
L1151
3n
C1929
100p
L1027 3.3n
FL1005
836.5MHz
3 2
4 1
5GND
INOUTG1G2
51
11R
C1153
33p
IN
D
3611R
C1086DNI
FL1009
1880MHz
5 2
4 1
3G3
INOUTG1G2
C1090
12p
2.7nL1035
FL2
836.5 MHz,881.5 MHz
75
84 92
3
16ANT RX
TX
GND1GND5GND2GND6
GND3 GND4
C1081DNI
8711R
0
L10216.8n
C1088
15p
L1025
1.5n
C1084
3n
L1033DNI
FL1008
75
84
92
3
16ANT RX
TX
GND1 GND6GND2 GND5GND3 GND4
DNIL1020
U1003
61 51
8 7
9 6
10 5
11 4
12 3
13 2
14 1IN_BAND_VOUT_BAND_V
VMODE_0GND3
VMODE_1VCC2_2
VCC2_1GND2
VEN_BAND_VOUT_BAND_I
VEN_BAND_IGND1
IN_BAND_ICPL_OUT
1D
NG
P
2D
NG
P
3.3p
C1089
5.6nL1029
33
R1022
18
R1023
+VPWR_RF
C10750.001uF 10u
C1077330pC1076
L1026DNI
C1109
33L1041
1.5n
C1154
4.7n
C10921.5n
C1083
33p
100p
C1094 C1096
100p 100p
C1095
L1031DNI
U1005
6 5
7 4
8 3
9 2
10 1
11PGND
VCC1VCC2
RFINRFOUT
VMODE_1CPL_IN
VMODE_0GND
VENCPL_OUT
C11121.5p
+VPWR_RF
1950MHz
FL1006
5 2
4 1
3G3
INOUTG1G2
C11111.5p
C1113100p
C1104
1n
C1110100
C1114100p 100p
C1115
2.2uC1102
33pC1103
C1108 33p
C11160.5p
L1040
2.4n
FL1010
1880,1960MHz
75
84
92
3
16ANT RX
TX
GND1 GND6
GND2 GND5
GND3 GND4
C1078
22p
C1117DNI
L113018n
10nL1022
L1150DNI
L1120DNI
100p
C12
100p
C13
9.94
7201R
PA_ON1
PA_ON0
PA_R0
PA_R0
PA_ON2
WCDMA_2100_RTX
WCDMA_2100_TX_OUT
PDET_IN
WCDMA_1900_TX_OUT
WCDMA_850_RTX
WCDMA_850_TX_OUTPA_R1
PA_R1
WCDMA_1900_RTX
W1900
0603
Band I
Band 5
W2100
W850
WCDMA 1900 Tx (1850-1910MHz)
Band 2
Near to 12 Pin Near to 12 PinNear to 4 Pin
Near to 10 Pin Near to 1 Pin
TP3
TP3
TP2
TP1
TP3 TP1
TP1
- 92 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
4. TROUBLE SHOOTING
Set the phone Tx is On andPDM is 210
Check TP� Over 21dBm? RF Tx Level is OKYes
No
Change the board
Check TP2 PA_RO ≥ 2.6V Check MSM7227Yes
No
Check TP1 Over 10 dBm? Check RTR6285Yes
No
- 9� -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
4.5.5. Checking RF Rx Level
Test Point (RF Rx Level)
TP1
TP2
TP3
TP5
Bias
TP4
4.5.5. Checking RF Rx Level
- 94 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
4. TROUBLE SHOOTING
2.2K
R1006
U1002
313029
44434241
403938
736353
1615
4131211101
343332
17
918
8 197 206 215 224
32
3
42
2
52627282
1DCS_PCS_IN
11D
NG
01D
NG
9D
NG
8D
NG
GND1
7D
NG
GSM_IN
6D
NG
VAPCGND5VBATTGND4BS2GND3BS1GND2_TXEN
ANTE
DO
M
WCDMA3
PGND4PGND5PGND6 P
MET
4X
R3
XR
2X
R1
XR
WCDMA1WCDMA2
7D
NG
P8
DN
GP
9D
NG
P PGND10PGND11PGND12
PGND13PGND14PGND15PGND16
PGND1PGND2PGND3
39pC1024
031
4R
47
R6
031
5R
R10050.75p
18nL1004
+VPWR_RF
C1043
10u
75
R7
ANT1003
L11DNI
19
61R
C1045 1n1nC1047
ANT1002
C1003
15p
100pC1007
33pC1005
1nC1048C1051 1n
C10098.2n
19
51R
47pC1044
SW1001
43
2
1ANT COMMON
G3 G4
R1004
3.3n
ANT_SEL1
ANT_SEL2ANT_SEL0
ANT_SEL3
GSM_PA_RAMP
GND
DCS_PCS_TX
GSM_TX
0603
2mm
11dB
7dB
GSM850(824-849MHz)
8061
GSM900(880-915MHz)
PCS(1850-1910 MHz)
DCS(1710-1785 MHz)
0603
TP1
C1079
8.2p
C1090
12p
2.7nL1035
FL2
836.5 MHz,881.5 MHz
75
84 92
3
16ANT RX
TX
GND1GND5GND2GND6
GND3 GND4
C1081DNI L1021
6.8n
FL1008
75
84
92
3
16ANT RX
TX
GND1 GND6GND2 GND5GND3 GND4
L1041
1.5n
L1031DNI
C11160.5p
FL1010
1880,1960MHz
75
84
92
3
16ANT RX
TX
GND1 GND6
GND2 GND5
GND3 GND4
C1117DNI
L113018n
L1120DNI
100p
C12
100p
C13WCDMA_2100_RTX
WCDMA_850_RTX
WCDMA_1900_RTX
Band I
Band 5
Band 2
TP2
TP2
TP2
- 95 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
C36
1.2p
DNI
R9
C11221.2p
C2310p
FL1012
1960MHz45
1
32G1 O1
ING2 O2
8.2n
L2
8R 0
10n
C20
DNI
R12
L1042
5.6n
VREG_TCXO_2.85V
BGA735L16U2
9
8
7
6
5
014
113
212
311
14
15
16
17PGND
RFOUTM
RFOUTH
RFOUTL
CN
FE
RR
SG
V1
NE
V
CC
V2
NE
V
1H
DN
GFR
LN IF
R
2H
DN
GFR
RFINM
RFINH
RFGNDM1
RFGNDM2
L1048
5.6n
C1123DNI
C37
1.2p
C14
27p
10p
C27
C11480.5p
2.7nL6
22n
L8
10nL9
2.2n
L10 DNIC1128
R24
33p
22p
C24
L4000DNI
L7
1n
3.3n
C1012p
C28
001R 27K
R18
C1728DNI
4.7p
C15
C1928DNI
FL1881.5MHz
45
1
32G1 O1
ING2 O2
0
R14
C262.7p
RX_WCDMA_2100
RX_WCDMA_1900_M
RX_WCDMA_1900_P
RX_WCDMA_850_P
RX_WCDMA_850_M
RX_WCDMA_1900_SE
INTER_RX_SW_SEL_1
INTER_RX_SW_SEL_2
LNA_GAIN_CONTROL
0603
22p
C25
22pC22
L53.3n
TP3
TP3TP4
TP4
K191 01
R
76 01C
u1.0
p00186 01
C 3.9pC1069L1018
1.8n2nL1017
L1019
1.8n
DNIC1070
C1080 3.9p
C1073DNI
VDD_RX
C1072 33p33pC1071
2140MHz
FL1003
45
1
32G1 O1
ING2 O2
DNI
R1021
R1029DNI
WB2100_MIX_INM
WB2100_MIX_INPRX_WCDMA_1900_LNA_OUT
RX_WCDMA_2100_LNA_OUT
30
60
W2100 RX(2110 - 2170 MHz)
Bias
TP5
TP3
TP4
- 96 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
4. TROUBLE SHOOTING
Set the phone Rx is On
Check BIAS over 2.1V Check bias block solderingNo
Yes
Change the board
Check TP1 Signal exist? Check RF Switch (M/S)No
Yes
Check TP2 Signal exist? Check TX Module Refer 1.4No
Yes
Check TP� Signal exist? Check DuplexerNo
Yes
Check TP4 Signal exist? Check LNANo
Yes
Check TP5 Signal exist? Check RTR6285 and Rx SAW filterNo
Yes
- 97 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
Start
1. Check TCXO Block
4. Ro-download SW & Cal.
2. Check ANT_SW Module
�. Check RF TRX Level
4.6 Checking GSM Block
- 98 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
4. TROUBLE SHOOTING
1
2,3
- 99 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
4.6.1 Checking TCXO Block
Refer to 1.3
4.6.2 Checking FEM Block
Refer to 1.4
4.6.3 Checking RF TX level
TP1
TP2
TP3
- 100 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
4. TROUBLE SHOOTING
2.2K
R1006
U1002
313029
44434241
403938
736353
1615
4131211101
343332
17
9
188 197 206 215 224
32
3
42
2
52627282
1DCS_PCS_IN
11D
NG
01D
NG
9D
NG
8D
NG
GND1
7D
NG
GSM_IN
6D
NG
VAPCGND5VBATTGND4BS2GND3BS1GND2_TXEN
ANT
ED
OM
WCDMA3
PGND4PGND5PGND6 P
MET
4X
R3
XR
2X
R1
XR
WCDMA1WCDMA2
7D
NG
P8
DN
GP
9D
NG
P PGND10PGND11PGND12
PGND13PGND14PGND15PGND16
PGND1PGND2PGND3
39pC1024
031
4R
47
R6
031
5R
R10050.75p
18nL1004
+VPWR_RF
C1043
10u
75
R7
ANT1003
L11DNI
19
61R
C1045 1n1nC1047
ANT1002
C1003
15p
100pC1007
33pC1005
1nC1048C1051 1n
C10098.2n
19
51R
47pC1044
SW1001
43
2
1ANT COMMON
G3 G4
R1004
3.3n
ANT_SEL1
ANT_SEL2ANT_SEL0
ANT_SEL3
GSM_PA_RAMP
GND
DCS_PCS_TX
GSM_TX
0603
2mm
11dB
7dB
GSM850(824-849MHz)
8061
GSM900(880-915MHz)
PCS(1850-1910 MHz)
DCS(1710-1785 MHz)
0603
TP1
TP3
Schematic of GSM/DCS/PCS Tx Block
TP2
- 101 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
Check TCXO Block Refer to 1.�
Check TP1If GSM over �1 dBm?
If DCS/PCS over 28 dBm?
GSM/DCS/PCS Tx is OKCheck other part
Yes
No
Change the board
Check TP2, �If GSM(TP2) under 6 dBm?
If DCS/PCS(TP�) over 6 dBm?
Check ANT SW Block (ASM+EDGR PAM)Refer to 1.4
Yes
No
Check RTR & PAD Check soldering and componentsNo Problem
Still exist Problem
START
No
- 102 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
4. TROUBLE SHOOTING
4.6.4 Checking RF Rx Block
TP1
TP2
- 10� -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
U1002
313029
44434241
403938
736353
1615
4131211101
343332
17
9
188 197 206 215 224
32
3
42
2
52627282
1DCS_PCS_IN
11D
NG
01D
NG
9D
NG
8D
NG
GND1
7D
NG
GSM_IN
6D
NG
VAPCGND5VBATTGND4BS2GND3BS1GND2_TXEN
ANT
ED
OM
WCDMA3
PGND4PGND5PGND6 P
MET
4X
R3
XR
2X
R1
XR
WCDMA1WCDMA2
7D
NG
P8
DN
GP
9D
NG
P PGND10PGND11PGND12
PGND13PGND14PGND15PGND16
PGND1PGND2PGND3
L100382n
82nL1008
0.5pL1011
DNIL1014
18nL1004
18nL1005
1842.5MHz,1960MHz
FL1002
103
52
81
9
6
74IN_1842_5 OUT_1842_5_1
OUT_1842_5_2
OUT_1960_1
IN_1960 OUT_1960_2
GND1 GND3
GND2 GND4
C1042
6.8n
5.6n
C1040
C1052
6.8n
5.6n
C1036
C1023
4.7p
L100718n
L11DNI
C1025
4.7p
22nL1010
2.2p
C1016
2.2p
C1004
12nL1013
33pC1005
881.5MHz,942.5MHz
FL1001
103
52
81
9
6
74IN_881_5 OUT_881_5_1
OUT_881_5_2
OUT_942_5_1
IN_942_5 OUT_942_5_2
GND1 GND3
GND2 GND4
SW1001
43
2
1ANT COMMON
G3 G4
DNIL1002
33p
C1014
33p
C1021
DNIL1006
33pC1039
27nL1009
33pC1041
DNIL1012
GND
WCDMA_2100_RTX
RX_PCS_P
RX_PCS_M
RX_DCS_M
RX_GSM_900_P
RX_GSM_900_M
RX_GSM_850_P
RX_GSM_850_M
RX_DCS_P
WCDMA_850_RTX
WCDMA_1900_RTX
DCS(1805-1880 MHz)
PCS(1930-1990 MHz)
GSM(925-960 MHz)
GSM(869-894 MHz)
Schematic of GSM/DCS/PCS Rx Block
TP1TP2
- 104 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
4. TROUBLE SHOOTING
Set the phone Rx is On
Check TP1 Signal exist? Check RF Switch (M/S)No
Yes
Change the board
Check TP2 Signal exist? Check FEM Block Refer 1.4No
Yes
- 105 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
4.7 GPS/WIFI/BT RF Component
RF Component(GPS)
Reference Description
ANT1005 ANTENNA PAD
connected to Carrier type antenna
ANT1006 GND PAD
FL1007 GPS SAW FILTER
U1004 GPS LNA
ANT1005
ANT1006
FL1007
U1004
- 106 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
4. TROUBLE SHOOTING
RF component (WiFi / BT )
Reference Description
ANT1 ANTENNA PAD
connected to Carrier type antenna
ANT2 GND PAD
U500 WiFi / BT module
- 107 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
4.8 GPS/WIFI/BT SIGNAL PATH
GPS Signal PATH (main board bottom)
GPS Rx PATH
- 108 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
4. TROUBLE SHOOTING
WiFi / BT Signal PATH
WiFi / BT Tx and Rx PATH
- 109 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
4.9 GPS/WIFI/BT Trouble shooting
4.9.1 A-GPS Block
TP1
TP2
- 110 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
4. TROUBLE SHOOTING
Set the phone GPS is ON
Check TP1 About 2.7V? Check power LRC filter solderingNo
Yes
Change the board
Check TP2 About 2.6V? Check SW and NV itemNo
Yes
12
R1025
FL1007
52
64
31IN
OUT
GOUT_NON
1G
2G
DNIC1097
L1034DNIL12
100p
L1032DNI
DNIC1105
U1004
3
2
5
4
1NI_F
R
FIL_OUT
VDD
S_D
GND
C10990.1u18p
C1098
L1036
3.3n
R1026
1K
6.8pC1107
C1093DNI
ANT1006 C1091
47p
VREG_RF_2.7V
ANT1005
5.6n
L1028
L1039100p
8.2nC1106
GPS_INGPS_MODE
DIVERSITY_IN
Near To LNA
Schematic of the A-GPS block
TP1
TP2
- 111 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
4.9.2 WLAN/BT/FM Block
1
2
3
START
1. Check the Power
Component Change
2. Check the Clock
�. Check the Module
- 112 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
4. TROUBLE SHOOTING
TP5
8pFC7
DNIC16
ANT2
10uFC18
TP7
4.7uFC5
0.1uFC2
L1
3.3uH
L3
4.7u
605R
K001
C536
1u
U500
039282726252423222120 291817 161
31
3215
14
33
3413
3512
3611
3710
389
398
407
6
415
4
42
433
442
45
1
64748494051525354 51
DN
G
2D
NG
3D
NG
4D
NG
B_E
KA
W _TS
OH_L
W
DXT_T
RA
U_TB
N_ST
C_TR
AU_T
B
N _ST
R_TR
AU_T
B
DX
R_TR
AU_T
B
ANT
BT_PCM_CLK
GND5 BT_PCM_OUT
VDD_WL_PA BT_PCM_SYNC
BT_PCM_IN
SDIO_CMD
SDIO_CLK VDD_BT_PA
SDIO_D3
SDIO_D2 S_CLK_IN
SDIO_D1 GND6
SDIO_D0 FM_ANT
WL_RST_N BT_GPIO_0
WL_WAKE_B BT_GPIO_1
REG_ON BT_GPIO_3
VBAT_IN BT_GPIO_4
BT_GPIO_7
SR_VLX1
SR_VLX1BB F_CLK_IN
F_CLK_OUT
BB2
XLV_
RS
BB T
UO
V _R
S
OID
DV
UP_L
ATX
DS_
OID
DV
TU
O_ 2P1_
GID
TU
O_2P1_
GLN
A
ODL
V2P1_
NIV
TU
O _2O
DLNL
AD
S_TB
LC
S_TB
1OI
DU
A
2OI
DU
A
N_TS
R_ TB
7D
NG
C30
0.1u
435C
u2.2
C32
0.1u
C533
1u
C535 1n
C334.7uF
ANT1
1u
C8
C17
47p
C9
2.2u
TP12
C1 0.001uF
TP9TP1TP3TP11
TP4
TP10R1
0
C62.2uF
TP13
+VPWR
VREG_MSMP_2.6V
C34 4.7uF
TP8
10uFC19
0.1u
C31 TP6
VREG_MSMP_2.6V
U501
5
3 24 1
VOUTVINGNDSTBY
DN
GP
L4DNI
+VPWR
VDD_TCXO
VDD_TCXO
26MHzX500
TG-5010LH-87N
4 2
3 1NCOUT
GNDVCC
SLEEP_CLK
FM_L
FM_R
WLAN_HOST_WAKEUP
WLAN_RESET_N BT_WAKEUP
BT_PCM_CLK
BT_PCM_SYNC
BT_UART_TXD
BT_UART_RXD
BT_UART_CTSBT_UART_RTS
BT_HOST_WAKEUP
FM_ANTQ
ER_
KLC
CLK_REQ
CLK_IN
CLK_IN
RF_IN_OUT
RF_IN_OUT
BT_PCM_DOUT
BT_PCM_DIN
WLAN_CLKWLAN_CMD
BT_RESET_N
WLAN_REG_ON
WLAN_SDIO[3]WLAN_SDIO[2]WLAN_SDIO[1]WLAN_SDIO[0]
0603
0603
306
0
306
0
306
0
306
0
30
60 306
0
close to 3
close to 17
Must Check Schematic
26MHz TCXO
Wi-Fi&BT&FM MODULE
TCXO LDO
[Figure] Schematic of WiFi/BT module
- 11� -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
TP1
TP2
TP3
- 114 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
4. TROUBLE SHOOTING
START
TP1 1, 2, � is OK? Check the power blockNo
Yes
Board change
SDIO OK? UART OK? Module check
Yes
No
- 115 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
Main clock part
CLK_IN
TP1TP2
TP1
TP2
605R
K001
C536
1u
435C
u2.2 C533
1u
C535 1n
U501
5
3 24 1
VOUTVINGNDSTBY
DN
GP
+VPWR
VDD_TCXO
VDD_TCXO
26MHzX500
TG-5010LH-87N
4 2
3 1NCOUT
GNDVCCCLK_REQ
CLK_IN0603
0603
3060
3060
26MHz TCXOTCXO LDO
TP1
Main clock part
TP2
- 116 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
4. TROUBLE SHOOTING
- Bluetooth RF Test procedure
1. Set phone to Bluetooth test-mode.
- Blue tooth ON: Enter Test Mode(277634#*#) Module test set BT DUT BT DUT ON
2. Insert a phone in a TEMCELL (in case of radiation test)
3. Set ‘discover’ after push menu button of the tester and select the link analyzer.
4. After ‘set test mode’, confirm the connection state.
5. Measure the power of full channel after hopping mode is selected to ‘ON’
6. You can select wanted test cases after getting an optimized power
7. Blue tooth On/Off
- Menu Key settings Wireless controls Bluetooth Turn on/Turn off
- 117 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
4.10 Power ON Troubleshooting
Power On sequence of P509 is :
Power key press KPD_PWR_N go to low PM7540 Power Up VREG_MSMC1_1.2V(C433), VREG_MSMC2_1.2V(C434), VREG_MSME_1.8V(C435), VREG_MSMP_2.7V(C453), VREG_MSMA_2.6V(C452), VREG_TCXO_2.85V(C457) power ON Phone booting and PS_HOLD(D404) go to High
START
Battery voltage higher than �.70V(OCV)? Change or charging the Battery
No
Yes
Redownload SW image
VA20 hight to low when key pness? Check correctly working powerkeyNo
Yes
VMSMC1_1.2V, VMSMC2_1.2V,VMSMP_2.6V, VMSME_1.8V, VTCXO_2.85V,
VMSMA_2.6V power up?Change the Main board
No
Yes
is clock OK?X1:19.2M Change the Main board
No
Yes
P500h
- 118 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
4. TROUBLE SHOOTING
TP1 : KPD_PWR_N go to low
- 119 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
VMSMC2_1.2V
VMSMC1_1.2V
VMSME_1.8V
VMSMP_2.6V
VMSMA_2.6V
VTCXO_2.85V
PS_HOLD
- 120 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
4. TROUBLE SHOOTING
4.11 Charging Trouble shooting
U400
96
53
4
82
71IN1 OUT1
IN2 OUT2
IC1
OVLO IC2DN
G
DN
GP
CN4
11
10
9
5
4
3
2
1
8
7
6
u 14 04
C
504C
u1
VCHG_VBUS
C40222p
FL1013
5
6
31
42P2 P4
P1 P3
6P
5P
p2 23 04
C
004DZ
FL400
1IN OUT
GND1 GND2
D400
USB_IDMAX_DP
MAX_DM
10.04.08 Changed Rev.C
2mm
REV.E_CHANGED_0517
2mm
TA OVP Circuit
VBUS 2mm
u-USB Connector
C407100u
+VPWR_RF10nC408
VCHG_VBUS
VBAT
Q400
56473829110
DRAIN_B
NC1 COLLECTOR_B
COLLECTOR EMITTER
SOURCE BASE
DRAIN NC2
GATE
004R
1.0
10u
C409
+VPWR
+VPWR_RF|+VPWR
ISNS_P
CHG_CTL_N
BATT_FET_N
2mm1608
2009.11.16 changed
160810V
2mm1%ISNS_M
Charging Procedure- Connect TA or u-USB Cable- Control the charging current by PM7540 IC- Charging current flows into the battery
Check Point- Connection of TA or USB Cable- Charging current path(NUS55�0MIN)- Battery
Troubleshooting Setup- Connect TA and battery to the phone
Troubleshooting Procedure- Check the charger (TA or USB Cable) connector- Check the OVP Circuit- Check the charging current Path- Check the battery
Charging Current Flow
TA(5.1V)
MainBattery
- 121 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
Check the pin and battery Connect terminals of I/O connector
Connection OK?No
Yes
Is the u- USB Cable)voltage 4.8V (or 5.0V)?
No
Yes
Is it charging properlyAfter turning on?
START
Check PMIC SMT status by X-ray Exchange PMIC or Change the main
board and Retest
Change I/O connector
Change TA (or u-USB cable)
ENDYes
No
Charger Troubleshooting Flow
- 122 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
4. TROUBLE SHOOTING
4. 12 3M AF Camera trouble
3M camera control signals are generated by ISX005 and MSM7227.
Check the camera Conn. and reconnect the camera
Camera is OK?
No
Change the Main board
ENDYes
Check IOVDD(TP5), DVDD(TP6), AVDD(TP7)
START
Yes
Check the EMI Filter(FL601, FL602)
Camera is OK
No
No
Yes
MSM 7227 output signal checkMCLK(TP1), PCLK(TP2),
Reset(TP�), Standby(TP4)
Change the camera
YesEND
Change the Filter(FL601, FL602)
No
No
Yes
- 12� -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
47
R211
DNI
C222
7.5p
C223
U15
W15
AC16
AB16
AF15
Y15
AC15
AB15
W14
AE14
AC14
Y14
AC13
U13
Y13
AB13
W13
W12
AB12
Y12
AC12
AC11
AF10
W9
AE10
U12
AF9
AC20
AF20
AB21
AE20
AF21
AF22
AC23
AE23
AC21
AF23
AE21
AB22
AC22
AE24
AE25
AF24GPIO_0GPIO_1GPIO_2GPIO_3GPIO_4GPIO_5GPIO_6GPIO_7GPIO_8GPIO_9
GPIO_10GPIO_11GPIO_12GPIO_13GPIO_14GPIO_15GPIO_16GPIO_17GPIO_18GPIO_19GPIO_20GPIO_21GPIO_22GPIO_23GPIO_24GPIO_25GPIO_26GPIO_27GPIO_28GPIO_29GPIO_30GPIO_31GPIO_32GPIO_33GPIO_34GPIO_35GPIO_36GPIO_37GPIO_38GPIO_39GPIO_40GPIO_41GPIO_42
MOTION_INT
BT_WAKEUP
AUDIO&MOTION_I2C_SDA
CAM_DATA[3]CAM_DATA[2]
PS_HOLDPM_INT_N
CAM_MCLKCAM_VSYNCCAM_HSYNC
AUDIO&MOTION_I2C_SCLLIN_PWM_FREQ
MUIC_I2C_SDA
MUIC_I2C_SCL
MUIC_INT
EARJACK_SENSE
PA_ON1
HS_MIC_BIAS_EN
CAM_DATA[1]CAM_DATA[0]
CAM_RESET_NCAM_PWDN
CAM_DATA[4]CAM_DATA[5]CAM_DATA[6]CAM_DATA[7]CAM_PCLK
COMPASS_DRDY
KEY_COL[2]
KEY_COL[1]
KEY_COL[0]
KEY_ROW[1]
KEY_ROW[0]
WLAN_REG_ON
LNA_GAIN_CONTROL
DIVERSITY_LNA_EN
MOTION_I2C_SCLMOTION_I2C_SDA
REV.E_CHANGED_0517
TP1
FL600
7.5pF
015
64
73
82
91INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1G
2G
FL601
7.5pF
015
64
73
82
91INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1G
2G
FL602
7.5pF
015
64
73
82
91INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1G
2G
CAM_DATA[3]CAM_DATA[2]
CAM_VSYNCCAM_HSYNC
CAM_DATA[1]CAM_DATA[0]
FLT_CAM_VSYNCFLT_CAM_HSYNC
CAM_DATA[4]CAM_DATA[5]CAM_DATA[6]CAM_DATA[7]
FLT_CAM_DATA[0]FLT_CAM_DATA[1]FLT_CAM_DATA[2]FLT_CAM_DATA[3]
FLT_CAM_DATA[4]FLT_CAM_DATA[5]FLT_CAM_DATA[6]FLT_CAM_DATA[7]
1608
1608
1608
MSM7227
EMI FILTER
- 124 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
4. TROUBLE SHOOTING
516C
u1.0
FB600
120
FB602
120
33p
C608
C606
4.7u
416C
F u1
VA607
120
FB601
CAM_IOVDD_2.6V
CAM_AF_2.8V
FB603
120
CAM_DVDD_1.2V
CN600
17
16
15
14
13
12
11
10
9
8
7
6
5
314
323
332
341
30
29
28
27
26
25
24
23
22
21
20
19
18
R605 12
CAM_AVDD_2.7V
316C
u01406
RK2.2
30 6R
K2. 2C605
4.7uC604
4.7u
CAM_MCLK
CAM_I2C_SCLCAM_I2C_SDA
FLT_CAM_VSYNCFLT_CAM_HSYNC
CAM_RESET_N
CAM_PWDN
CAM_PCLK
FLT_CAM_DATA[0]FLT_CAM_DATA[1]FLT_CAM_DATA[2]FLT_CAM_DATA[3]FLT_CAM_DATA[4]FLT_CAM_DATA[5]FLT_CAM_DATA[6]FLT_CAM_DATA[7]
TP7TP6 TP5
TP3
TP4
TP2
- 125 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
4. 13 Main LCD trouble
Main LCD control signals are generated by MSM7227. Those signal’s path are :
MSM7227 -> LCD Module
Press END key to tun the power On
Is the circuit powered?
Yes
END
Follow the Power ON trouble shooting
No
LCD display OK?
START
No
Check Power VREG_LCD_1.8V(TP1)VREG_LCD_2.8V(TP2)
No
Change the Main board
Disconnect and reconnect LCD connector
Change the LCD module
The LCD works
Yes
Yes
Yes
- 126 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
4. TROUBLE SHOOTING
CN601
1312
1411
1510
169
178
187
196
205
214
223
232
241
1DZ
FL603
019
84736251
P1 P5P2 P6P3 P7P4 P8
1G
2G
VREG_LCD_2.8VVREG_LCD_1.8V
D600
4 3
5 2
6 12.2uC616 C617
2.2u
WLED_PWR
C4
4.7u
WLED5 WLED4
WLED3 WLED2
WLED1
WLED6WLED7
LCD_RESET_N
LCD_MAKERID_LOWMDDI_P_STB_MMDDI_P_STB_P
MDDI_P_DATA_MMDDI_P_DATA_P
LCD_VSYNC_O
3.2" HVGA LCD Connector
TP2TP1
- 127 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
4.14 Proximity Sensor on/off trouble
Proximity Sensor is worked as below :
Send Key click Phone number click Call connected Object moved at the sensor
Control the screen’s on/off operation automatically
Measurement
VREG_MSMP_2.6V
VREG_PROX_2.6V
PROX_OUT
PROX_COMPASS_I2C_SCL / SDA
Object moved at the Proximity Sensor
LCD off?
No
Check PROXI_SDA / SCL output & Prox_out
No
No
Work well?
START
END
Change the Proximity Sensor U700
No
Yes
Send Key click & call connected
Chang the main board
Yes
- 128 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
4. TROUBLE SHOOTING
VREG_MSMP_2.6V
U700
5 4
6 3
7 2
8 1LEDASCL
LEDCSDA
VCCVIO
VOUTGND
C707
1u
R700
10
C708
0.1u
R703
10
VREG_PROX_2.8V
R702
4.7Kohms
R701
4.7Kohms
C709
4.7u
10u
C705
PROX_OUT
PROX_COMPASS_I2C_SCL
PROX_COMPASS_I2C_SDATP1
TP2
TP3
- 129 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
4.15 Motion Sensor on/off trouble
Motion Sensor is worked as below :
Accelerometer Sensor function On Tilt the phone (90˚) The screen is had rotated automatically.
Measurement
VREG_MSMP_3.0V
MOTION_INT
MOTION_I2C_SDA / SCL
Tilt the phone
The screen is ratated
No
MOTION_INT outputNo
Yes
Work well?
START
END
Change the Main board
No
Yes
Accelerometer Sensor function On
Change the Main board
Yes
Check mation_I2C_SDA / SCLoutput
NoChange the Motion Sensor U50�
Yes
- 1�0 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
4. TROUBLE SHOOTING
045C
u1.0
U503
61
7 6
5
4
8
3
9
2
10
1
11
12
13
41 512
DE
VR
ES
ER
DD
V
GND3
GND2
INT1
VDD_IO
RESERVED1
NC1
INT2
NC2
SC
SCL_SPC
GND1
OD
S_ID
S_A
DS
0A
S_O
DS
4D
NG
VREG_MOTION_3.0V
10u
C541
815R
K2. 2
915R
K2.2
MOTION_INTMOTION_I2C_SCL
MOTION_I2C_SDA
TP1
TP3
TP2
- 1�1 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
4.16 Compass Sensor on/off trouble
Compass Sensor is worked as below :
Compass Sensor function On
Measurement
VREG_MSMP_2.6V
VREG_MOTION_3.0V
PROX_COMPASS_I2C_SCL / SDA
COMPASS_DRDY
Chang the position of thr phone
The direction is correct?
No
Check the COMPASS_DRDY &PROX_COMPASS_I2C_SDA
/ SCL output
No
Yes
Work well?
START
END
Change the Compass Sensor U1
No
Yes
Compass Sensor function On
Chang the main board
Yes
- 1�2 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
4. TROUBLE SHOOTING
C706
470n
VREG_MSMP_2.6VVREG_MOTION_3.0V
407C
n 01
U1
12
11
10
9
5
4
6
37
28
1D
DV
D
GE
RV
AD
NG
SD
NG
DD
VA
ADDR
SCL
NC1
TN
I
VPP
DRDY
SDA
PROX_COMPASS_I2C_SCL
PROX_COMPASS_I2C_SDACOMPASS_DRDY
TP3 TP2
TP1
- 1�� -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
4.17 Q coin Motor
Q coin Motor is worked as below :
touch touch-window Vibration feedback
U601 : Used the PWM pulse
Measurement
VREG_MOTOR_3.3V
LIN_PWM_FREQ
MTR_N_2sub/MTR_P_2sub
Output of U602 OK? (L42-L18)
Yes
No
VREG_MOTOR_�.�V(C624) is �.�V?LIN_PWM_FREQ(U602)is working?
START
Check SW
Change the Q coin Motor(VB700)
Yes
No
Reboot
Check an U602 SMT status by X-ray, Exchange it
Work well?Yes
No
END
Measurement
VREG_MOTOR_�.�V
LIN_PWM_FREQ
MTR_N_2sub/MTR_P_2sub
- 1�4 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
4. TROUBLE SHOOTING
C623
0.1u
R614
4.7KohmsR617
51K
C625 10n
R612 100K
R618
1K
R615
1K
R616
51K
VREG_MOTOR_3.3V VREG_MOTOR_3.3V
U602
B2C1
A1B1
B3C2
A3C3IN- VDD
IN+ VO+
_SHUTDOWN VO-
BYPASS GND
Q600
C
B
E GND
IN
OUT
C624
0.1u
R619 100K
LIN_PWM_FREQ
MTR_P_2sub
MTR_N_2sub
1%
1%
1%
1%1%
1%
TP2
VB700
2
1
3 L
n51
4AV
3AV
n51
1L
MTR_N_2sub
MTR_P_2sub
TP1
TP4
TP3
- 1�5 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
- 1�6 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
5. DOWNLOAD
- 164 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
5. DOWNLOAD
5. DOWNLOAD
LG-P500h
LG-P500h
5. DOWNLOAD
- 1�7 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
5. DOWNLOAD
- 165 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
5. DOWNLOAD
LG-P500h
LG-P500h
LG-P500h
- 1�8 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
- 166 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
5. DOWNLOAD
LG-P500h
LG-P500h
5. DOWNLOAD
- 1�9 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only- 167 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
5. DOWNLOAD
LG-P500h
LG-P500h
LG-P500h
5. DOWNLOAD
- 140 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
- 168 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
5. DOWNLOAD
LG-P500h
5. DOWNLOAD
- 141 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only- 169 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
5. DOWNLOAD5. DOWNLOAD
- 142 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
- 170 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
5. DOWNLOAD5. DOWNLOAD
- 14� -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only- 171 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
5. DOWNLOAD5. DOWNLOAD
- 144 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
- 172 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
5. DOWNLOAD5. DOWNLOAD
- 145 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only- 173 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
5. DOWNLOAD5. DOWNLOAD
- 146 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
- 174 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
5. DOWNLOAD
LG-P500h
LG-P500h
LG-P500h
LG-P500h
LG-P500h
LG-P500h
LG-P500hLG-P500h
5. DOWNLOAD
- 147 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only- 175 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
5. DOWNLOAD
LG-P500h LG-P500h
LG-P500h LG-P500h
LG-P500h
LG-P500h LG-P500h
5. DOWNLOAD
- 148 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
- 176 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
5. DOWNLOAD
LG-P500h LG-P500h
LG-P500h
LG-P500h
5. DOWNLOAD
- 149 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
6. BLOCK DIAGRAM
6. BLOCK DIAGRAM
USBH DM & DP
Transceiver(RTR6285)
Transceiver(RTR6285)
BT_UART
Capacitive Touch(Melpas + LGIT)
Key LEDKey LED
MUIC_I2C
MMC
USBPHY
SIM
UART3
LCD Backlight ICAAT2862
BL_I2C
DDR SDRAM(4G)NAND FRESH (4G)
EBI1 (DDR)
CAM I/F
TX_IQ, PRX_IQ
MOTION_I2C
BT_PCM
FM_L&R
RF I/F
USIM KPD_PWR_N
I2C
PRX_IQ
GPS
CAM_I2C
MSM7227EBI2 (NAND)
WLAN_SDIOLINE_L& R
LBEH19UNBC-338
Bluetooth v2.1Wi-Fi 802.11b/g
FM Radio
BT & Wi-Fi
FM
FEM(SKY77544)
FEM(SKY77544)DRX_IQ DRX_IQ
GPIO59
GPS
GSM & WCDMA
CAM 3M
TOUCH I2C
MCP(Micron)
Prox Sensor(GP2AP002S00F)
PROX_I2C
SBDT
MOTION Sensor(KR3DM) MOTION_INT
FUEL_I2C
Back Key
UART3
Array TPREMOTE_PWR_ON
MPP3,4
USIMUSIM I/F
GPIO106 SBDT_SSBI
PM7540KPD_DRV_N
PMIC_SSBI
AMUX_OUTHKAIN2 AMUX_OUT
AMUX_OUTPM_INT_N MSM_INT_NGPIO24
PWR/End Key
PON_RESET_N
PS_HOLDGPIO25RESIN_N
nJTAG_RESOUTJTAG_PS_HOLD
JTAG
JTAG CONN.JTAG(TCK,TDI,TDO…)UART3_TX/RX
QTKEY_I2C
System HW Block Diagram All System
Fuel Gauge(MAX17040G)Fuel Gauge(MAX17040G)
PS_HOLD
MDDI Interface
Home Key
Send Key
MUIC(TS5USBA)
MUIC(TS5USBA)
I2C
5pin
_USB
Con
nect
or5p
in_U
SBC
onne
ctor
Main Board
LINE_ON&OP
EAR1_OP&ON
HPH_L&R
LINE_OP, LINE_ON
RCV_P & N
HPH_R, HPH_L
Q-Motor(WHVM-1030Q10)
Q-Motor(WHVM-1030Q10)
GPIO_28 LIN_PWM_FREQ
Menu Key
Volume Key
Sub FPCB
MT29C4G96MAZAPCJA-5 IT
MIC MIC
USIM
SPK_RCVP, N
Speaker & Receiver
3.5 piEarjack
EAR_L, RCOMPASS_I2CDigital Compass
(AMI304) COMPASS_INT
Key COL, Key ROW
MDDI Interface
3.2" HVGA 320*480
Audio SubWM9093ECS-R
TOUCH INT
GPIO_27
GPIO36 ~ 38
Backlight_Key
AUDIO_I2C
TCXO_19.2MHz(Kyocera)
RTR_TRK_LO_ADJ
TCXO_IN
TCXO
TCXO_RTR_19.2MHzTCXO_PM_19.2MHz
TCXO_26MHz
FM_L&RF_CLK_IN
CLK_REQ
- 150 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
6. BLOCK DIAGRAM
RF Block Diagram
- 151 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
6. BLOCK DIAGRAM
- 152 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
5. DOWNLOAD
3.5
1.8V LDORP103K181D
Audio Block Diagram
- 15� -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
5. DOWNLOAD
WiFi/BT/FM Radio Block Diagram
26MHzTCXO
32.768KHz
PM7540
SLEEP_CLK(LPO Clock:32.768KHz)
3.5Ear JackFM_ANT
LBEH
19U
NB
C
MSM
7227
CLK_IN
- 154 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
- 155 -
7. CIRCUIT DIAGRAM
LGE Internal Use OnlyCopyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
33p
C1087
C36
1.2p
12
R1025
L1045
DNI
C1079
8.2p
DNI
R9
FL1007
52
64
31IN
OUT
GOUT_NON
1G
2G
2.2K
R1006
C11221.2p
L1030DNI
U1002
313029
44434241
403938
736353
1615
413121110 1
343332
17
9
188 197 206 215 224
32
3
42
2
52627282
1DCS_PCS_IN
11D
NG
01D
NG
9D
NG
8D
NG
GND1
7D
NG
GSM_IN
6D
NG
VAPCGND5VBATTGND4BS2GND3BS1GND2_TXEN
ANT
ED
OM
WCDMA3
PGND4PGND5PGND6 P
MET
4X
R3
XR
2X
R1
XR
WCDMA1WCDMA2
7D
NG
P8
DN
GP
9D
NG
P PGND10PGND11PGND12
PGND13PGND14PGND15PGND16
PGND1PGND2PGND3
DNIC1097
39pC1024
L1034DNI
L100382n
82nL1008
0.5pL1011
DNIL1014
L1015
100pL10165.6n
L1151
3n
C1929
100p
2.2R1010
10R1012
031
4R
47
R6
031
5R
C10090.0082uH
C2310p
FL1012
1960MHz45
1
32G1 O1
ING2 O2
8.2n
L2
L1027 3.3n
16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
L
K
J
I
H
G
F
E
D
C
B
A
L
K
J
I
H
G
F
E
D
C
B
A
16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
R1004
2.7n
18nL1004
FL1005
836.5MHz
3 2
4 1
5GND
INOUTG1G2
9401C
u1.0
10u
C1163
51
11R
+VPWR_RF
C1043
10u
100pC1065
75
R7
VREG_SMPS_2.1V
C1153
33p
33pC1046
C1022 33p
R19
0
18nL1005
5501C
u1.0
u1.00301
C
IN
D
3611R
p227201
C
12KR10181842.5MHz,1960MHz
FL1002
103
52
81
9
6
74IN_1842_5 OUT_1842_5_1
OUT_1842_5_2
OUT_1960_1
IN_1960 OUT_1960_2
GND1 GND3
GND2 GND4
K19101
R
33pC1020
C1086DNI
C1042
6.8n
U1001
32
92
82
53
43
96
62
61
60
54
4336
3738
2768
2552
2142
8
745
144
5347
2246
10
649
448
3
51
6750
1939
40
18
1741
16
1533
32
1331
1430
12
1159
58
956
24
557
55
65
6620
632
6426RF_ON TX_IP
TCXO TX_IN
SBDT TX_QP
TX_QN
LB_RF_OUT1
LB_RF_OUT2 VTUNE1
VTUNE2
HB_RF_OUT1 VTUNE_GPS
HB_RF_OUT2
HB_RF_OUT3 PRX_QP
PRX_QN
WPRXLBP PRX_IP
WPRXLBN PRX_IN
WPRXHBP
WPRXHBN DRX_QP
DRX_QN
WDRXLB DRX_IP
DRX_IN
WDRXHB1
WDRXHB2 NC
GCELL_INP DAC_IREF
GCELL_INN
VDDA1_1
EGSM_INP VDDA1_2
EGSM_INN VDDA1_3
VDDA1_4
DCS_INP VDDA1_5
DCS_INN VDDA1_6
GPCS_INP VDDA2_1
GPCS_INN VDDA2_2
VDDA2_3
GPS_IN VDDA2_4
PDET_IN VDDA2_5
TX_RBIAS VDDA2_6
WPRXSE1 VDDA2_7
WPRXSE2 VDDA2_8
VDDA2_9
VDDA2_10
VDDA2_11
VDDA2_12DN
GP
TU
O_2E
SX
RP
W
TU
O_1E
SX
RP
W
PNI_
XM_
BW
MNI_
XM_
BW
MD
DV
5.6n
C1040
C1011 100p
VREG_RF_2.7V
10 R1016
u1.08301
C
C1052
6.8n
5.6n
C1036
1nC1018
C1023
4.7p
L100718n
FL1009
1880MHz
5 2
4 1
3G3
INOUTG1G2
C1090
12p
R101710
68pC1010
ANT1003
C1012 100p
C1017 33p
VREG_MSMP_2.6V
7601C
u1.0
C101968p
L11DNI
3501C
u1.0
u010501
C
p229201
C
7301C
n1
u1.09501
C
0601C
u1.0
C1025
4.7p
22nL1010
u7.46501
C
4501C
u7.4
u1.08501
C
7501C
u1.0
22pC1064
p0018601
C
0.1uC1066
3601C
u1.0
2.2p
C1016
2.2p
C1004
19
61R
C1045 1n
L12100p
VDD_RX
1nC1047
2.7nL1035
FL2
836.5 MHz,881.5 MHz
75
84 92
3
16ANT RX
TX
GND1GND5GND2GND6
GND3 GND4
FB2
0
C1081DNI
8711R
0
ANT1002
L10216.8n
C1088
15p
12nL1013
L1025
1.5n
R10051p
33pC1005
C1084
3n
1nC1048
2140 MHz
FL1011
52
41
3G3
IN OUTG1 G2
3.9pC1069
L1033DNI
L1018
1.8n
0R1015
C1051 1n
2nL1017
L1019
1.8n
DNIC1070
C100756p
DNIC1105
C1080 3.9p
U1004
3
2
5
4
1NI_F
R
FIL_OUT
VDD
S_D
GND
C10990.1u18p
C1098
19
51R
C1073DNI
L1036
3.3n
R1026
1K
VDD_RX
C1072 33p33pC1071
6.8pC1107
8R 0
47pC1044
22p
C25
FL1008
75
84
92
3
16ANT RX
TX
GND1 GND6GND2 GND5GND3 GND4
C1093DNI
2140MHz
FL1003
45
1
32G1 O1
ING2 O2
10nC1013
10n
C20
DNIL1020
U1003
61 51
8 7
9 6
10 5
11 4
12 3
13 2
14 1IN_BAND_VOUT_BAND_V
VMODE_0GND3
VMODE_1VCC2_2
VCC2_1GND2
VEN_BAND_VOUT_BAND_I
VEN_BAND_IGND1
IN_BAND_ICPL_OUT
1D
NG
P
2D
NG
P
DNI
R12
3.3p
C1089
L1042
5.6n
5.6nL1029
33
R1022
18
R1023
+VPWR_RF
C10750.001uF 10u
C1077330pC1076
L1026DNI
C1109
33L1041
1.5n
C1154
4.7n
C10921.5n
C1083
33p
100p
C1094 C1096
100p 100p
C1095
C11
100p
4301C
u1.0
33pC1118
C1127
DNI
p221301
C
p223301
C
VREG_TCXO_2.85V
ANT1006 C1091
47p
BGA735L16U2
9
8
7
6
5
014
113
2 12
311
14
15
16
17PGND
RFOUTM
RFOUTH
RFOUTL
CN
FE
RR
SG
V1
NE
V
CC
V2
NE
V
1H
DN
GFR
LNIF
R
2H
DN
GFR
RFINM
RFINH
RFGNDM1
RFGNDM2U1006
7
43
52
61RFIN RFOUT
EN RREF
GS VCCDN
GP
C1130
10n
VREG_RF_2.7V
ANT1005
R1030 27K
5.6n
L1028
C1120 10p C1121 33p
C1015 10n
u1.02301
C
2601C
u1.0
u1.01601
C
VREG_TCXO_2.85V
L1031DNI
L1044
3.6n
10pC1119
L1043
2n
100p
C1129
FB3
0
U1005
6 5
7 4
8 3
9 2
10 1
11PGND
VCC1VCC2
RFINRFOUT
VMODE_1CPL_IN
VMODE_0GND
VENCPL_OUT
C11121.5p
881.5MHz,942.5MHz
FL1001
103
52
81
9
6
74IN_881_5 OUT_881_5_1
OUT_881_5_2
OUT_942_5_1
IN_942_5 OUT_942_5_2
GND1 GND3
GND2 GND4
+VPWR_RF
L1048
5.6n
C1123DNI
1950MHz
FL1006
5 2
4 1
3G3
INOUTG1G2
22pC22
C37
1.2p
C14
27p
10p
C27
C11480.5p
2.7nL6
C11111.5p
22n
L8
10nL9
2.2n
L10
C1113100p
C1104
1n
DNIC1128
C1110100
C1114100p 100p
C1115
2.2uC1102
33pC1103
C1108 33p
C11160.5p
R24
33p
L1040
2.4n
FL1010
1880,1960MHz
75
84
92
3
16ANT RX
TX
GND1 GND6
GND2 GND5
GND3 GND4
22p
C24
C1078
22p
L4000DNI
C1117DNI
L113018n
L10326.8n
SW1001
43
2
1ANT COMMON
G3 G4
u1.08201
C
DNIL1002
33p
C1014
33p
C1021
DNIL1006
33pC1039
27nL1009
33pC1041
DNIL1012
10nL1022
L53.3n
L7
1n
3.3n
C10
L1039100p
8.2nC1106
12p
C28
L1150DNI
001R
L1120DNI
L1110DNI
100p
C12
100p
C13
27K
R18
C1728DNI
4.7p
C15
C1928DNI
FL1881.5MHz
45
1
32G1 O1
ING2 O2
DNI
R1021
0
R14
C262.7p
C1003
10p
9.94
7201R
4.7uC1162
4.7uC1160
R1029DNI
ANT_SEL1
ANT_SEL2ANT_SEL0
ANT_SEL3
TCXO_RTR_19.2MHZ
GSM_PA_RAMP
TX_ON
VSNS_RF_SMPS
VREG_SMPS_2.1V|VSNS_RF_SMPS
PA_ON1
GND
GND
PA_ON0
PA_R0
PA_R0
PA_ON2
GPS_IN
GPS_IN
DCS_PCS_TX
DCS_PCS_TX
GSM_TX
GSM_TX
WCDMA_2100_RTX
WCDMA_2100_RTX
RX_PCS_P
RX_PCS_P
RX_PCS_M
RX_PCS_M
RX_DCS_MRX_DCS_M
RX_GSM_900_P
RX_GSM_900_P
RX_GSM_900_M
RX_GSM_900_M
RX_GSM_850_P
RX_GSM_850_P
RX_GSM_850_M
RX_GSM_850_M
WCDMA_2100_TX_OUT
WCDMA_2100_TX_OUT
RX_WCDMA_2100
RX_WCDMA_2100
PDET_IN
PDET_IN
DAC_REF
TX_I_P
TX_I_M
TX_Q_P
TX_Q_MRX0_I_PRX0_I_M
RX0_Q_MRX0_Q_P
RX1_I_PRX1_I_M
RX1_Q_MRX1_Q_P
GPS_MODE
RTR6285_SSBI
RX_DCS_P
RX_DCS_P
RX_WCDMA_1900_M
RX_WCDMA_1900_M
RX_WCDMA_1900_P
RX_WCDMA_1900_P
WCDMA_1900_TX_OUT
WCDMA_1900_TX_OUT
RX_WCDMA_850_P
RX_WCDMA_850_P
RX_WCDMA_850_M
RX_WCDMA_850_M
WB2100_MIX_INM
MNI_
XIM_0012
BW
WB2100_MIX_INP
PNI_
XIM_0012
BW
WCDMA_850_RTX
WCDMA_850_RTX
WCDMA_850_TX_OUT
WCDMA_850_TX_OUTRX_WCDMA_1900_LNA_OUT
RX_WCDMA_1900_LNA_OUT
RX_WCDMA_1900_SE
RX_WCDMA_1900_SE
PA_R1
PA_R1
WCDMA_1900_RTX
WCDMA_1900_RTX
DIVERSITY_IN
DIVERSITY_IN
AWS_RXDIV_LNA_OUT
AWS_RXDIV_LNA_OUT
RX_WCDMA_2100_LNA_OUT
RX_WCDMA_2100_LNA_OUT
INTER_RX_SW_SEL_1
INTER_RX_SW_SEL_2
LNA_GAIN_CONTROL
DIVERSITY_LNA_EN
0603
W1900
0603
80
61
0603
30
60
50
01
50
01
W2100
VDDA1 : Pin 3,4,6,10,22,53 = +2.7V VDC
GSM Quad
LOW
GSM850 RX
ANT_SEL0 ANT_SEL1 ANT_SEL2
GSM900 RX
DCS1800 RX
VDDA2 : Pin 1,7,8,21,25,27,37,43,54,60,61,62 = +2.1V VDC
ANT_SEL3
LOW
LOW
ANTENNA SWITCH MODULE LOGIC(SKY77544)
LOW
HIGH HIGH LOW
LOW
LOWLOWLOW
LOW
2mm
11dB
LOW
DCS(1805-1880 MHz)
PCS(1930-1990 MHz)
GSM(925-960 MHz)
LOW
LOW (X)
GSM(869-894 MHz)
LOW (X)
LOW (X)
EUSY0344001
W900(W850)
LOW (X)
HIGH
HIGH
7dB
HIGH
HIGH
LOW LOW
LOW
LOW
HIGH
HIGH
+2.1V
GSM850(824-849MHz)
1%
HIGH
PCS1900 RX
W1700
GSM850/GSM900 TX
8061
+2.7V
DCS1800/PCS1900 TX
HIGH
HIGH
HIGH
HIGH
GSM900(880-915MHz)
HIGH
HIGH
LOW
PCS(1850-1910 MHz)
DCS(1710-1785 MHz)
Band I
Band 5
W2100
W850
AWS DIVERSITY
WCDMA Triple
LNA for the GPS
W2100 RX(2110 - 2170 MHz)
WCDMA RX 2100 LNA Circuit
0603
0603
WCDMA 1900 Tx (1850-1910MHz)
Band 2
0603
0603
0603
0603
3060
306
0
30
60
30
60
0603
0603
0603
Near To LNA
Near To RTR
Near to 12 Pin Near to 12 PinNear to 4 Pin
Near to 10 Pin Near to 1 Pin
7. CIRCUIT DIAGRAM
- 156 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
L
K
J
I
H
G
F
E
D
C
B
A
12 11 10 9 8 7 6 5 4 3 2 1
L
K
J
I
H
G
F
E
D
C
B
A
12 11 10 9 8 7 6 5 4 3 2 1
302R
K01
R208 220
2.2n
C204
VBAT
UAT200
12
11
10
9
8
7
6
5
4
3
2
1GND
RX
TX
NC1
ON_SW
VBAT
NC2
NC3
NC4
DSR
RTS
CTS
GND
RX
TX
VCHAR
ON_SW
VBAT
PWR
URXD
UTXD
3G2.5G
VCHG_VBUS
VREG_MSMP_2.6V
11 2C
Fu1
202R
K1
CN200
1615
87
96
105
114
123
132
141
1817
102R
K01
R210 100K
U201
3
2
4
15
VCC
GND
R218 100
202A
V
002A
V
102A
V
312R
K01
R215 100
C220 0.1u
C221 330p
VREG_MSMA_2.6V
412C
u1.051 2
Cu 1. 0
712C
u1.0
VREG_TCXO_2.85V
R216 1K
330pC210
C227
0.1u
330pC207
C202
0.1u
612C
u1.0
C201
47p
VREG_MSMP_2.6V
402R K 2. 2
VREG_MSMA_2.6V
VREG_MSMP_2.6V
R217 100
312C
F u1
102D
49.9
R214
002C
p74
R219 1K
C205
1n
812C
u1.0
302A
V
C20322u
702R
IND
R26
0
R220 K001
002D
21 2C
u1.0
15002
R
U202
43
52
61D VCC
CP NC
GND Q
912C
u1.0
TP201
33p
C225
47
R211
DNI
C222
7.5p
C223
C206
0.1u
0.1u
C224
VREG_TCXO_2.85V
C226
33n
2KR212
19.2MHzKT3225L19200DCW28RA0
X200
42
31VCONT OUT
GND VCC
402A
V
502A
V
TP202
TP203
R205 100
TP200
602R
0406
SU
BV_
GH
CV
MIC_BIAS
R209 33
U200
M5
Y18
AC19
AF18
Y17
U16
AC18
AF17
W16
AE17
AC17
Y16
AB17
W5
W3
V5
V6
AB9
V9
V8
Y9
W8
AB8
V3
V2
U2
U8
U9
AF4
AE2
AB7
AE4
AE3
AD3
L2
L8
L3
L9
AD2
AC6
AC3
AC2
U15
W15
AC16
AB16
AF15
Y15
AC15
AB15
W14
AE14
AC14
Y14
AC13
U13
Y13
AB13
W13
W12
AB12
Y12
AC12
AC11
AF10
W9
AE10
U12
AF9
AC20
AF20
AB21
AE20
AF21
AF22
AC23
AE23
AC21
AF23
AE21
AB22
AC22
AE24
AE25
AF24
6M
8M
9M
8E
A
7F
A
8C
A
6F
A
7C
A
6E
A
11
R
81
BA
81
W
11
Y
71
C
71
B
61
H
81
H
71
M
62
G
01
Y
11
T
01
W
61
EA
8F
A
61
FA
5F
A
31
F
21
C
21
B
11
H
11
J
21
H
21
J
11
E
21
F
11
F
21
E
91
EA
91
FA
02
BA
51
C
61
F
31
H
41
H
41
J
31
J
11
C
41
L
3F
2F
3E
2E
2D
52
G
61
L
91
C
91
B
91
H
62
F
02
H
81
J
71
J
32
H
22
F
32
F
61
J
71
E
51
J
71
F
61
B
61
C
51
H
81
B
52
B
12
F
02
B
02
F
71
H
02
E
02
C
81
C
81
F
B21
B22
C21
E21
C22
C24
E26
B24
F25
C26
D26
C23
B23
C25
D25
E23
W20
AD26
N17
T20
J25
M20
N25
V26
H26
L25
P20
U26
V19
AC25
U19
U20
AB23
W25
W26
R19
T19
W22
AC26
V23
AB26
AB25
AA23
AA25
Y26
Y23
T17
Y22
W23
AA26
V20
J26
K20
J20
J23
J22
K19
K26
L22
L19
L23
L20
M19
L26
M26
M22
M23
N26
N19
N20
P26
R26
P19
R25
T26
R22
R23
R20
T23
T22
U25
U23
U22
4C
6G
5G
6N
3N
2N
2W
6W
3M
8T
2K
3K
2J
3J
2H
3H
2G
3G
6R
2P
3P
2R
3R
11
B
41F
A
31
FA
21
FA
11
FA
5B
A
3B
A
2B
A
3A
A
2A
A
2Y
6A
A
2M
3U
11
W
9E
A
9C
A
6B
A
3Y
71
W
91B
A
51
E
41
C
31
C
51
B
41
B
31
B
8H
6F
5F
01
J
01
H
9H
01
C
01
B
9C
9B
8F
8E
7F
7E
7C
7B
6C
5C
6B
5B
PI_R_E
NIL
NI
_R_EN
IL
PI_L_E
NIL
NI_L_E
NIL
P1CIM
N1CIM
P2CIM
N2CIM
PIXUA
NIXUA
PO_ENI
LNO_EN
IL
PO_1R
AE
NO_1
RA
ETUOXUA
R_H
PH
L_HPH
PM
OCC
SAIB_C
IM
FERV_
HPH
KL
CS
YS_YH
PBSU
PD
_Y
HPBSU
ND_
YHPBS
UD
I_YHPB
SU
SUBV_Y
HP
BSU
TXER_Y
HPBSU
N_NISER
N_TUO
SER
NE_G
ODW
0_E
DOM
1_E
DOM
2_
EDOM
3_EDOM
OXCT
JDA_
OL_KRT
KLC_
PEELS
IDTSMTN
_TSRT
OD
TKCTKCTR
P_
ATAD_I
DDM
N_ATAD_I
DDM
P_BTS_I
DDM
N_BTS_I
DDM
KLCP_C
DCL
P_TU
O_I
N_TU
O_I
P_T
UO_Q
N_T
UO_Q
FE
R_CAD
0HC_PI
_I
0HC_M
I_I
0HC_P
I_Q
0HC_
MI_Q
1HC
_PI_I
1H
C_MI_I
1HC_PI_Q
1HC_MI_
Q
NO_XT
JDA_
CGA_XT
0NO
_AP
0E
GNAR_AP
LTC_RWP
_AP
M_LTC_R
WP_AP
FER_GB_
MSG
0NIAK
H1NIAK
H2NI
AKH
EBI1_DQ_0EBI1_DQ_1EBI1_DQ_2EBI1_DQ_3EBI1_DQ_4EBI1_DQ_5EBI1_DQ_6EBI1_DQ_7EBI1_DQ_8EBI1_DQ_9EBI1_DQ_10EBI1_DQ_11EBI1_DQ_12EBI1_DQ_13EBI1_DQ_14EBI1_DQ_15EBI1_DQ_16EBI1_DQ_17EBI1_DQ_18EBI1_DQ_19EBI1_DQ_20EBI1_DQ_21EBI1_DQ_22EBI1_DQ_23EBI1_DQ_24EBI1_DQ_25EBI1_DQ_26EBI1_DQ_27EBI1_DQ_28EBI1_DQ_29EBI1_DQ_30EBI1_DQ_31
EBI1_ADR_0EBI1_ADR_1EBI1_ADR_2EBI1_ADR_3EBI1_ADR_4EBI1_ADR_5EBI1_ADR_6EBI1_ADR_7EBI1_ADR_8EBI1_ADR_9EBI1_ADR_10EBI1_ADR_11EBI1_ADR_12EBI1_ADR_13
EBI1_CKE0EBI1_CKE1EBI1_DCLKEBI1_DCLKBEBI1_WE_NEBI1_CS0_NEBI1_CS1_NEBI1_BA_0EBI1_BA_1EBI1_DQS_0EBI1_DQS_1EBI1_DQS_2EBI1_DQS_3EBI1_DM_0EBI1_DM_1EBI1_DM_2EBI1_DM_3EBI1_RAS_NEBI1_CAS_NEBI1_RESOUT_NEBI1_CAL
EBI2_DATA_0EBI2_DATA_1EBI2_DATA_2EBI2_DATA_3EBI2_DATA_4EBI2_DATA_5EBI2_DATA_6EBI2_DATA_7EBI2_DATA_8EBI2_DATA_9EBI2_DATA_10EBI2_DATA_11EBI2_DATA_12EBI2_DATA_13EBI2_DATA_14EBI2_DATA_150
_R
DA
_2
IB
E
1_
RD
A_2
IB
E
2_R
DA_2IBE
3_R
DA_2IBE
4_R
DA_2IBE
5_R
DA_2IBE
6_R
DA_2IBE
7_R
DA_2IBE
8_R
DA_2IBE
9_R
DA_2IBE
01_R
DA_2IBE
11_R
DA_2IBE
21_R
DA_2IBE
31_R
DA_2IBE
41_R
DA_2IBE
51_R
DA_2IBE
61_R
DA_2IBE
N_0
SC_2IBE
N_1
SC_2IBE
N_4
SC_2IBE
N_5
SC_2IBE
N_6
SC_2IBE
N_7
SC_2IBE
KLC_2IBE
N_
EW_2IBE
N_
EO_2IBE
N_
BU_2IBE
N_
BL_2IBE
N_0YS
UB_2IBE
REPIW
RL_ST
LL_ST
RU_ST
LU_ST
231_OIPG
131_OIPG
031_OIPG
921_OIPG
821_OIPG
721_OIPG
621_OIPG
521_OIPG
421_OIPG
321_OIPG
221_OIPG
121_OIPG
021_OIPG
911_OIPG
811_OIPG
711_OIPG
611_OIPG
511_OIPG
411_OIPG
311_OIPG
211_OIPG
111_OIPG
011_OIPG
901_OIPG
801_OIPG
701_OIPG
601_OIPG
501_OIPG
401_OIPG
301_OIPG
201_OIPG
101_OIPG
001_OIPG
99_OIPG
89_OIPG
79_OIPG
69_OIPG
59_OIPG
49_OIPG
39_OIPG
29_OIPG
19_OIPG
09_OIPG
98_OIPG
88_OIPG
78_OIPG
68_OIPG
58_OIPG
GPIO_0GPIO_1GPIO_2GPIO_3GPIO_4GPIO_5GPIO_6GPIO_7GPIO_8GPIO_9GPIO_10GPIO_11GPIO_12GPIO_13GPIO_14GPIO_15GPIO_16GPIO_17GPIO_18GPIO_19GPIO_20GPIO_21GPIO_22GPIO_23GPIO_24GPIO_25GPIO_26GPIO_27GPIO_28GPIO_29GPIO_30GPIO_31GPIO_32GPIO_33GPIO_34GPIO_35GPIO_36GPIO_37GPIO_38GPIO_39GPIO_40GPIO_41GPIO_42GPIO_43GPIO_44GPIO_45GPIO_46GPIO_47GPIO_48GPIO_49GPIO_50GPIO_51GPIO_52GPIO_53GPIO_54GPIO_55GPIO_56GPIO_57GPIO_58GPIO_59GPIO_60GPIO_61GPIO_62GPIO_63GPIO_64GPIO_65GPIO_66GPIO_67GPIO_68GPIO_69GPIO_70GPIO_71
GPIO_72_GRFC_9GPIO_73_GRFC_8GPIO_74_GRFC_7GPIO_75_GRFC_6GPIO_76_GRFC_5GPIO_77_GRFC_4GPIO_78_GRFC_3GPIO_79_GRFC_2GPIO_80_GRFC_1GPIO_81_GRFC_0
GPIO_82GPIO_83GPIO_84
C208
10n
SDRAM_ADDR[13]
TS
R_N
OPn
SMT_
MS
M
MSM_TMS
ODT_
MS
M
MSM_TDO
IDT_
MS
M
MSM_TDI
PMIC_TCXO
OX
CT_CI
MP
KCT_
MS
M
MSM_TCK
TU
OS
ER_
GATJn
nJTAG_RESOUT
KLC_
PE
ELS
KCT
R_M
SM
MSM_RTCK
nRESETOUT
IB
SS_
CIM
PN
E_O
XCT
TCXO_EN
2E
Wn
2B
Un2
EOn
2BLn
EBI2_DATA[9]EBI2_DATA[8]EBI2_DATA[7]EBI2_DATA[6]EBI2_DATA[5]EBI2_DATA[4]EBI2_DATA[3]EBI2_DATA[2]
EBI2_DATA[15]EBI2_DATA[14]EBI2_DATA[13]EBI2_DATA[12]EBI2_DATA[11]EBI2_DATA[10]
EBI2_DATA[1]EBI2_DATA[0]
SC_
HS
ALF_D
NA
Nn
YD
AE
R_H
SALF_
DN
AN
nSDRAM_WE
nSDRAM_RAS
SDRAM_DQS3SDRAM_DQS2SDRAM_DQS1SDRAM_DQS0
SDRAM_DQM3SDRAM_DQM2SDRAM_DQM1SDRAM_DQM0
SDRAM_DCLK1SDRAM_DCLK0
nSDRAM_CAS
SDRAM_BA1SDRAM_BA0
SDRAM_ADDR[9]SDRAM_ADDR[8]SDRAM_ADDR[7]SDRAM_ADDR[6]SDRAM_ADDR[5]SDRAM_ADDR[4]SDRAM_ADDR[3]SDRAM_ADDR[2]
SDRAM_ADDR[12]SDRAM_ADDR[11]SDRAM_ADDR[10]
SDRAM_ADDR[1]SDRAM_ADDR[0]
ANT_SEL1ANT_SEL2
ANT_SEL0
ANT_SEL3
TCXO_RTR_19.2MHZ
PM
AR_
AP_
MS
G
JTAG_PS_HOLD
MOTION_INT
TU
O_X
OR
P
NO_
ENIL
PO _
ENIL
L_MF
R_M F
MD_
HB
SU
PU
EK
AW_T
SO
H_N
ALW
N_TE
SE
R_N
ALW
BT_WAKEUP
MICROSD_DET_N
AUDIO&MOTION_I2C_SDA
REMOTE_PWR_ON
REMOTE_PWR_ON
TU
O_X
UM
A
FE
R_C
AD_
AP_
MS
G
TCXO_PM_19.2MHZ
RTR_TRK_LO_ADJ
RTR_TRK_LO_ADJ
P1_CI
M
UART3_TX
XT_3TR
AU
UART3_TX
UART3_TX
UART3_RX
XR_3T
RA
U
UART3_RX
UART3_RX
BT_PCM_CLKBT_PCM_SYNC
PD_
HB
SUR_
HP
HL_
HP
H
MMC_CMDMMC_DATA[0]MMC_DATA[1]MMC_DATA[2]MMC_DATA[3]MSM_USIM_DATA
MSM_USIM_RSTMSM_USIM_CLKBT_UART_TXDBT_UART_RXDBT_UART_CTSBT_UART_RTS
CAM_DATA[3]CAM_DATA[2]
PS_HOLDPM_INT_N
BT_HOST_WAKEUP
CAM_MCLKCAM_VSYNCCAM_HSYNC
AUDIO&MOTION_I2C_SCLLIN_PWM_FREQ
P_V
CR
N_V
CR
NO_
XT
MUIC_I2C_SDA
MUIC_I2C_SCL
MUIC_INT
BT_PCM_DOUTBT_PCM_DIN
EARJACK_SENSE
AD
S_C2I_
HC
UOT
TNI_
HC
UOT
LC
S_C2I_
HC
UOT
LCD_BL_EN
PA_ON1
MMC_CLK
SDRAM_DATA[31]SDRAM_DATA[30]SDRAM_DATA[29]SDRAM_DATA[28]SDRAM_DATA[27]SDRAM_DATA[26]SDRAM_DATA[25]SDRAM_DATA[24]SDRAM_DATA[23]SDRAM_DATA[22]SDRAM_DATA[21]SDRAM_DATA[20]SDRAM_DATA[19]SDRAM_DATA[18]SDRAM_DATA[17]
SDRAM_DATA[15]SDRAM_DATA[14]SDRAM_DATA[13]SDRAM_DATA[12]SDRAM_DATA[11]SDRAM_DATA[10]SDRAM_DATA[9]SDRAM_DATA[8]SDRAM_DATA[7]SDRAM_DATA[6]SDRAM_DATA[5]SDRAM_DATA[4]SDRAM_DATA[3]SDRAM_DATA[2]SDRAM_DATA[1]SDRAM_DATA[0]
SDRAM_DATA[16]
nSDRAM_CS0
KLC
SY
S_H
BS
U
USBH_SYSCLK
AD
S_
C2
I_
LE
UF
FUEL_I2C_SCL
SDRAM_CKE0
HS_MIC_BIAS_EN
WLAN_CLKWLAN_CMD
CI
M_
SH
CIM_
SH
NTS
RT_M
SM
MSM_TRSTN
CAM_I2C_SCLCAM_I2C_SDA
N_
TES
ER
_D
CL
LC
S_C2I_
SS
AP
MO
C_X
OR
P
WO
L_D
IR
EK
AM_
DC
L
AD
S_C2I_
SS
AP
MO
C_X
OR
P
CAM_DATA[1]CAM_DATA[0]
N1_CI
M
GND|MIC_1N
N_
TES
ER
_T
B
nSDRAM_CS1
SDRAM_CKE1
CAM_RESET_NCAM_PWDN
CAM_DATA[4]CAM_DATA[5]CAM_DATA[6]CAM_DATA[7]
LC
S_C2I_L
B_D
CLA
DS_
C2I_LB_
DCL
CAM_PCLK
M_
BTS
_P
_IDD
MP_B
TS
_P_
IDD
MM
_AT
AD
_P_I
DDM
P_AT
AD_
P_I
DDM
O_
CNY
SV
_D
CLM
COMPASS_DRDY
KEY_COL[2]
KEY_COL[1]
KEY_COL[0]
KEY_ROW[1]
KEY_ROW[0]
WLAN_REG_ON
0N
O_A
P0
R_A
P
2N
O_A
P
FE
R_C
AD
P_I_XT
M_I_XT
P_Q_
XTM_
Q_XT
P_I_0X
RM_I_0
XR
M_Q_0
XR
P_Q_0
XR
P_I_1X
RM_I_1
XR
M_Q_1
XR
P_Q_1
XR
GPS_MODE
RTR6285_SSBI
1R
_AP
INTER_RX_SW_SEL_1
INTER_RX_SW_SEL_2
LNA_GAIN_CONTROL
DIVERSITY_LNA_EN
TRK_LO_ADJ
JD
A_OL_
KRT
WLAN_SDIO[3]WLAN_SDIO[2]WLAN_SDIO[1]WLAN_SDIO[0]
MMC_COVER_DETECT
MOTION_I2C_SCLMOTION_I2C_SDA
GPS D FLIP-FLOP
MPM Port
Array TP
Clesed to NC7SZ74L8X
Clesed to TCXO
TCXO Circuit
ARM9&ARM11 JTAG
1.0T
0000 : Native, ARM9 on PJTAG, ARM11 on AJTAG
ARM9&ARM11 JTAG
MODE[3:0]
0001 : Native, ARM9 + ARM11 on PJTAG
FFA Rev.C(220Ohm@100MHz)
2010.01.18 updatedNEST JIG
(MIC_1N)
RX
1X
_H
CU
OT
UY
2Y
_H
CU
OT
LX
2X
_H
CU
OT
DY
1Y
_H
CU
OT
FFA
71
ppm)
3B(
04
57M
P
;ES
NES
_TA
BV
REV.E_CHANGED_0517
- 157 -
7. CIRCUIT DIAGRAM
LGE Internal Use OnlyCopyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
833C
u01
u01323
C
R301
0
C301 0.1u
C300 0.1u
u2.2413
C
L
K
J
I
H
G
F
E
D
C
B
A
12 11 10 9 8 7 6 5 4 3 2 1
L
K
J
I
H
G
F
E
D
C
B
A
12 11 10 9 8 7 6 5 4 3 2 1
613C
n01
u22513
C
R304
0
813C
n01
913C
n1
71 3C
n1
523C
u1.0
623C
u1.0
923C
u1.0
033C
u1.0
023C
n01
423C
n1
823C
n1
233C
n1
533C
u1.0
VREG_MSMC1_1.25V
133C
n01
933C
u1.0
143C
u1.0
043C
n01
633C
n01
733C
n1
243C
n1
903C
n01
213C
u2.2u2.2
703C
U301
01P
1P
4M
M3
5G
1G
5E
01B
1B
H8
7H
7J01R
9R
G10
2R
F9
1R
E10
01A
D9
9A
C10
2A
N10
M9
E7
L10
F8
K10
G6
J9
J8
H2
G9
G2
F10
K1
E9
B2
D10
E3
C9
G8
N9
F3
M10
J2
L9
K9
C7
J10
C8
D7
M2
D8
P9
D6
J1
E8
H9
D5
C1
F6
B9
F7
E6
M1
H4
P8
H3
H10
F5
H1
E4
D1
F4
B8
G4
G3
P6
J4
C5
H5
H6
N5
J5
B5
J6
G7
C6
K6
C3
K5
C4
K7
B4
L8
B7
K8
B3
L7
B6
L6
L5
N8
L4
M7
N7
K2
P5
J3
P4
F1
N4
F2
P3
K3
P2
D4
M8
E2
N6
D3
M6
E1
P7
D2
M5
C2
N3
L3
N2
L2
N1
L1
K4A0
A1
IO0
A2
IO1
A3
IO2
A4
IO3
A5
IO4
A6
IO5
A7
IO6
A8
IO7
A9
IO8
A10
IO9
A11
IO10
A12
IO11
BA0
IO12
BA1
IO13
IO14
DQ0
IO15
DQ1
DQ2
CE#
DQ3
RE#
DQ4
WE#2
DQ5
CLE
DQ6
ALE
DQ7
WP#
DQ8
R_B#
DQ9
DQ10
VCC1
DQ11
VCC2
DQ12
DQ13
VSS6
DQ14
VSS7
DQ15
DQ16
VDD6
DQ17
VDD1
DQ18
VDD2
DQ19
VDD3
DQ20
VDD4
DQ21
VDD5
DQ22
DQ23
VSS8
DQ24
VSS1
DQ25
VSS2
DQ26
VSS3
DQ27
VSS4
DQ28
VSS5
DQ29
DQ30
VDDQ0
DQ31
VDDQ1
VDDQ5
CS0#
VDDQ3
CS1#
VDDQ4
CK
VDDQ2
CKE0
VDDQ7
CKE1
VDDQ6
WE#1
VDDQ8
RAS#
VDDQ9
CAS#
DM0
VSSQ0
DM1
VSSQ1
DM2
VSSQ2
DM3
VSSQ3
VSSQ4
0U
ND
VSSQ5
1U
ND
VSSQ6
2U
ND
VSSQ7
3U
ND
VSSQ8
4U
ND
VSSQ9
5U
ND
6U
ND
0S
QD
2S
QD
CK#
4C
N
6C
N
3S
QD
UN
D
1S
QD
A13
1UF
R
2UF
R
KC
OL
223C
u1.0
VREG_MSME_1.8V
003R
K001
TP301TP302203
RK001
U200
L5
E10
AE22
AD25
AE18
AE15
AE11
AE7
Y5
T5
H25
E25
E22
Y25
V25
T25
P25
M25
K25
AE12
AC10
AC5
Y8
AF26
AF25
AF3
AF2
AE26
AB11
Y20
W19
U17
U11
P23
N23
M11
L17
L12
K23
K9
J19
G23
E19
C2
B26
B3
B2
T2
R8
R5
P9
N8
K6
K5
J6
J5
F9
E6
C8
C3
U6
T6
T3
R9
P8
P5
N9
K8
J9
J8
H6
H5
E9
E5
D3
B8
AE13
AE5
AB14
AB10
AA22
Y19
Y6
V22
U14
T16
T15
T14
T13
T12
R17
R16
R15
R14
R13
R12
P22
P17
P16
P15
P14
P13
P12
P11
P6
N22
N16
N15
N14
N13
N12
M16
M15
M14
M13
M12
L15
L13
L6
K22
G22
F19
F15
F10
E14
B4
7G
A
6G
A
5G
A
4G
A
3G
A
72
GA
62
GA
52
GA
42
GA
32
GA
22
GA
12
GA
02
GA
2G
A
91
GA
81
GA
71
GA
61
GA
51
GA
41
GA
31
GA
21
GA
11
GA
01
GA
1G
A
72
FA
1F
A
72
EA
1E
A
72
DA
1D
A
72
CA
1C
A
72
BA
1B
A
72
AA
1A
A
72
A
62
A
52
A
42
A
32
A
22
A
12
A
02
A
91
A
81
A
71
A
61
A
51
A
41
A
31
A
21
A
11
A
01
A
9A
8A
7A
6A
5A
4A
3A
2A
1A
61E
41F
5AA
22
H
11
N
5N
81E
31
E
5U
9T
72Y
1Y
72W
1W
72
V
1V
72
U
1U
72T
1T
72R
1R
72P
1P
72
N
1N
72M
1M
72L
1L
72K
1K
72
J
1J
72H
1H
72G
1G
72F
1F
72E
1E
72
D
1D
72C
1C
72B
1B
9GA
8G
A56_C
N66_
CN
76_
CN
86_
CN
96
_CN
07
_CN
17_CN
27_CN
37_C
N47_CN
57_
CN
67
_CN
77
_CN
87
_CN
97
_CN
08_CN
18_C
N28_C
N38_
CN
48
_CN
58
_CN
68
_CN
78
_CN
88_CN
98_C
N09_C
N19_
CN
29
_CN
39
_CN
49
_CN
59
_CN
69
_CN
79
_CN
89_CN
99_C
N001
_CN
101
_CN
20
1_CN
30
1_CN
40
1_CN
1DVSR
2DVSR
8P_
DDV
9P
_DDV
01
P_DD
V
GRP
_E
SU
FQ_
DDV
1C
_SNS_
DD
V2C
_SNS_D
DV
6P
2_YH
PBSU_DD
V3P
3_Y
HPBSU_
DDV
1_C
N2_C
N3_C
N4_C
N5_C
N6_C
N7_C
N8_C
N9_C
N01_C
N11_C
N21_C
N31_C
N41_C
N51_C
N61_C
N71_C
N81_C
N91_C
N02_C
N12_C
N22_C
N32_C
N42_C
N52_C
N62_C
N72_C
N82_C
N92_C
N03_C
N13_C
N23_C
N33_C
N43_C
N53_C
N63_C
N73_C
N83_C
N93_C
N04_C
N14_C
N24_C
N34_C
N44_C
N54_C
N64_C
N74_C
N84_C
N94_C
N05_C
N15_C
N25_C
N35_C
N45_C
N55_C
N65_C
N75_C
N85_C
N95_C
N06_C
N16_C
N26_C
N36_C
N46_C
N
GND1GND2GND3GND4GND5GND6GND7GND8GND9GND10GND11GND12GND13GND14GND15GND16GND17GND18GND19GND20GND21GND22GND23GND24GND25GND26GND27GND28GND29GND30GND31GND32GND33GND34GND35GND36GND37GND38GND39GND40GND41GND42GND43GND44GND45GND46GND47GND48GND49GND50
GND_A1GND_A2GND_A3GND_A4GND_A5GND_A6GND_A7GND_A8GND_A9GND_A10GND_A11GND_A12GND_A13GND_A14GND_A15GND_A16
VDD_A1VDD_A2VDD_A3VDD_A4VDD_A5VDD_A6VDD_A7VDD_A8VDD_A9VDD_A10VDD_A11VDD_A12VDD_A13
VDD_C1_1VDD_C1_2VDD_C1_3VDD_C1_4VDD_C1_5VDD_C1_6VDD_C1_7VDD_C1_8VDD_C1_9VDD_C1_10VDD_C1_11VDD_C1_12VDD_C1_13VDD_C1_14VDD_C1_15VDD_C1_16VDD_C1_17VDD_C1_18VDD_C1_19VDD_C1_20VDD_C1_21VDD_C1_22VDD_C1_23VDD_C1_24
VDD_C2_1VDD_C2_2VDD_C2_3
VDD_MDDI
VDD_P1_1VDD_P1_2VDD_P1_3VDD_P1_4VDD_P1_5VDD_P1_6
VDD_P2_1VDD_P2_2VDD_P2_3
VDD_P3_1VDD_P3_2VDD_P3_3VDD_P3_4VDD_P3_5VDD_P3_6
VDD_P4_1VDD_P4_2
VDD_P7_1VDD_P7_2
92R
0
TP300
VREG_MSME_1.8V
VREG_MSME_1.8V
113C
Fu1
VREG_MSME_1.8V
313C
Fu1
V3.3_B
SU
V6.2_A
MS
M_G
ER
V
V9.2_2X
UA_
GE
RV
VREG_MSMP_2.6V
VREG_MSME_1.8V
VREG_MSMC2_1.25V
VREG_MSMC1_1.25V
VREG_MSMA_2.6V
R303
0VSNS_MSMC2_1.25V
VSNS_MSMC1_1.25V
VSNS_MSME_1.8V
u01333
C
723C
u01
013C
u1.0
VREG_MSMP_2.6VVREG_MSMA_2.6VVREG_MSMC2_1.25V VREG_MSME_1.8VVREG_MSMC1_1.25V
V8.1_E
MS
M_G
ER
V
V6.2_P
MS
M_G
ER
V
V8.1_E
MS
M_G
ER
V
603C
Fu 1
503C
u1.0
803C
u7.4
203C
IND
SDRAM_ADDR[13]
nRESETOUT
nWE2nUB2
nOE2
nLB2
]9[A
TA
D_2
IB
E
EBI2_DATA[9]EBI2_DATA[8]EBI2_DATA[7]EBI2_DATA[6]EBI2_DATA[5]EBI2_DATA[4]EBI2_DATA[3]EBI2_DATA[2]
EBI2_DATA[15]EBI2_DATA[14]EBI2_DATA[13]EBI2_DATA[12]EBI2_DATA[11]EBI2_DATA[10]
EBI2_DATA[1]EBI2_DATA[0]
nNAND_FLASH_CS
NAND_FLASH_READY
nSDRAM_WEnSDRAM_RAS
3SQ
D_
MA
RD
S
2SQ
D_
MA
RD
S
1SQ
D_M
AR
DS
0SQ
D_
MA
RD
S
SDRAM_DQM3SDRAM_DQM2SDRAM_DQM1SDRAM_DQM0
SDRAM_DCLK1SDRAM_DCLK0
nSDRAM_CAS
SDRAM_BA1SDRAM_BA0
SDRAM_ADDR[9]SDRAM_ADDR[8]SDRAM_ADDR[7]SDRAM_ADDR[6]SDRAM_ADDR[5]SDRAM_ADDR[4]SDRAM_ADDR[3]SDRAM_ADDR[2]
SDRAM_ADDR[12]SDRAM_ADDR[11]SDRAM_ADDR[10]
SDRAM_ADDR[1]SDRAM_ADDR[0]
PM
AR_
AP_
MS
G
MD_
HB
SU
PD _
HB
SU
SDRAM_DATA[31]SDRAM_DATA[30]SDRAM_DATA[29]SDRAM_DATA[28]SDRAM_DATA[27]SDRAM_DATA[26]
]52
[A
TA
D_MA
RD
S
SDRAM_DATA[25]SDRAM_DATA[24]SDRAM_DATA[23]SDRAM_DATA[22]SDRAM_DATA[21]SDRAM_DATA[20]SDRAM_DATA[19]
]8
1[
AT
AD_
MA
RD
S
SDRAM_DATA[18]SDRAM_DATA[17]
]51[AT
AD_
MA
RD
SSDRAM_DATA[15]SDRAM_DATA[14]SDRAM_DATA[13]
]21
[A
TAD_
MA
RD
S
SDRAM_DATA[12]SDRAM_DATA[11]SDRAM_DATA[10]SDRAM_DATA[9]SDRAM_DATA[8]SDRAM_DATA[7]SDRAM_DATA[6]SDRAM_DATA[5]SDRAM_DATA[4]SDRAM_DATA[3]SDRAM_DATA[2]SDRAM_DATA[1]SDRAM_DATA[0]
SDRAM_DATA[16]
nSDRAM_CS0
KLC
SY
S_H
BS
U
SDRAM_CKE0
nSDRAM_CS1
SDRAM_CKE1
M_B
TS_P_IDD
MP_B
TS_P_IDD
MM_A
TAD_P_IDDM
P_A
TAD_P_
IDD
M
IBS
S_
58
26
RT
R
JD
A_O
L_
KR
T
80
61
u2
2 >
-
u01
D
.veR
AFF
V8.
1 -
8P
:
CDC
L E
SU
UOY
FI
Cap for MSM7227 Power
MSM7227 Power Part MCP (4G NAND FLASH +4G DDR SDRAM)
8061
80
61
8061
8061
For Artwork
REV.C_0408_CHANGED
2010.01.25 updated
7. CIRCUIT DIAGRAM
- 158 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
C426 1n
2.2u
L400
10uC438
C411 0.1u
VREG_MSMP_2.6V
634C
u7.4
C415 0.1u
C444 2.2u
VREG_LCD_2.8V
CN401
3
24
1
C407100u
VREG_AUX2_2.9V
524R
K1
VBAT
u7.4254
C
C437 1n
+VPWR_AUDIO
C412
33p
C413 0.1u
C458 0.1u
+VPWR
C419 0.1uC418 0.1uC417 0.1u
C422 0.1uC421 0.1uC420 0.1u
434C
u7.4
10uC427
4.7uL402
VBAT
104D
U404
9
7 4
8 1
6
5
3 2CELLVDD
SEO
EO
CTGSDA
GNDSCL DN
GP
R415
10K
D404
C443
1u
2.2u
C454
VREG_MOTION_3.0V
D402
C442
1u
VREG_MSMP_2.6V
714R
K2.2
+VPWR_RF
C457
1u
n1134
C
VREG_SMPS_2.1V
VREG_MSMC2_1.25V
2.2u
C451
u7.4334
C
L
K
J
I
H
G
F
E
D
C
B
A
12 11 10 9 8 7 6 5 4 3 2 1
L
K
J
I
H
G
F
E
D
C
B
A
12 11 10 9 8 7 6 5 4 3 2 1
VREG_MSMA_2.6V
C448
2.2u
u2.2424
C
VREG_RUIM_3.0V
n1034
CVCHG_VBUS
VREG_MSMC1_1.25V
VBAT
C455
2.2u
C410 0.1u
C447
2.2u
234C
n1
R424 51
VREG_TCXO_2.85V
814R
K2. 2
IC1
4B
D2
B2
A1 A2
B3
C2
A4
C1
A3 D1
E4
D3 D4
E3
E2 C3
E1 C4
1B
YLP
PU
SV
UART_TXVBUS
UART_RXDM
DP
USB_DMID
USB_DP
AUDIO_LR2_2K
AUDIO_R
MIC
DSS
_INT
SDACLDO
SCL
GNDTE
SI
R423 121K
U403
9J
8J
7J
6J
5J
9H
8H
7H
6H
5H
9G
8G
7G
6G
5G
9F
8F
7F
6F
5F
9E
8E
7E
6E
5E
H1
E10F1
F10E1
C12N2
B1
M12B2
K7
A5
N13A4
M13B5
B4
G10A7
D9A6
H12B7
B6
C13
A13D10
A12K10
H10
G12J10
G1
M1K4
D13J4
E12H4
N11M2
A3L2
A10H2
A8
H13K2
G13J2
A11G4
K13F4
E13D5
B13B3
A9M5
N12N3
J13N1
A2M3
K6
M4K5
N4K9
M9K8
N10M11
M6L12
N6A1
M8D4
N8B12
J1D8
K1N5
M7
2G
21
D
7D
8B
01
M
6D
9B
21
J
31
F
21
F
21
K
7N
9N
01
B
31
L
11
B
2F
4E
2C
1C
1D
1L
2D
2E
GH
CV
N_LTC_
GH
C
SU
BV_
BS
U
N_LTC_
BS
U
P_S
NSI
M_S
NS I
N_ TEF_T
AB
TA
BV
NIO
CV
PU
KC
AB_
V
AN
A_D
DV
E_1C_
DD
V
AP_2
C_D
DV
2P
G_D
DV
6P
G_D
DV
2E
MS
M_D
DV
PM
SM_
DD
V
1FR_
DD
V
2FR_
DD
V
MIU
R_D
DV
RK
PS_L_
DD
V
RK
PS_
R _D
DV
OX
CT_D
DV
NAL
W_D
DV
MPP_1
MPP_2 VSW_5V
MPP_3 VREG_5V
MPP_4 VSW_MSMC1
MPP_5 VREG_MSMC1
MPP_6 VSW_MSMC2
MPP_7 VREG_MSMC2
MPP_8 VSW_MSME
MPP_9 VREG_MSME
MPP_10 VSW_PA
MPP_11 VREG_PA
MPP_12
MPP_13 VREG_GP1
MPP_14 VREG_GP2
MPP_15 VREG_GP3
MPP_16 VREG_GP4
MPP_17 VREF_GP5
MPP_18 VREG_GP6
MPP_19 VREG_MMC
MPP_20 VREG_MSMA
MPP_21 VREG_MSME2
MPP_22 VREG_MSMP
VREG_RFRX1
USB_ID VREG_RFRX2
USB_D_P VREG_RFTX
USB_D_M VREG_RUIM1
USB_OE_N VREG_SYNT
USB_DAT VREG_TCXO
USB_SE0 VREG_USB
VREG_WLAN
SBST MIC_BIAS
SBCK
SBDT_SSBI REF_ISET
MSM_INT_N REG_GND
REF_BYP
SPKR_IN_L_M
SPKR_IN_L_P TCXO_IN
SPKR_OUT_L_M TCXO_EN
SPKR_OUT_L_P TCXO_OUT
SPKR_IN_R_P
SPKR_IN_R_M XTAL_IN
SPKR_OUT_R_P XTAL_OUT
SPKR_OUT_R_M
SLEEP_CLK
VIDEO_IN AMUX_OUT
VIDEO_OUT
VIB_DRV_N KPD_PWR_N
KPD_DRV_N PON_RESET_N
LCD_DRV_N PS_HOLD
FLSH_DRV_N
1D
NG
2D
NG
3D
NG
4D
NG
5D
NG
6D
NG
7D
NG
8D
NG
9D
NG
01D
NG
11D
NG
21D
NG
31D
NG
41D
NG
51D
NG
61D
NG
71D
NG
81D
NG
91D
NG
02D
NG
12D
NG
22D
NG
32D
NG
42D
NG
52D
NG
VREG_RF_2.7V
C450
2.2u
VREG_MSME_1.8V
+VPWR
924C
n1
L404 4.7u
VREG_LCD_1.8V
VREG_MSME_1.8V
VREG_MSMP_2.6V
4.7uL401
R407
4.7
K051
624R
VREG_HPVDD_1.8V
TP400TP401
VREG_MSMP_2.6V
TP402
200K
R428
+VPWR
USB_3.3V
VREG_TOUCH_3.0V
4.7uL403
U400
96
53
4
82
71IN1 OUT1
IN2 OUT2
IC1
OVLO IC2DN
G
DN
GP
CN4
11
10
9
5
4
3
2
1
8
7
6
u7.4354
C
1u
C40
1 64C
Fu1
004C
u1.0
2.2u
C456C3
2.2u
R401 2.2K
504R
smho
K7.4
404R
K2
0391C u1
02R
K7.4
R413
470Kohms
804R
K01
C441
u1.0
u7.4534
C
C425 1n
R4141K
u1404
C
214R
051
10u
C428
114R
051
U401
5
3 24 1
VOUTVINGNDSTBY
DN
GP
K6.08
904R
VREG_MSMP_2.6V
0.1u
C439
VBAT
304D
104DZ
C440
10n
VREG_PROX_2.8V
2.2u
C446
614R
smho
K086
SC2
1
724R
smho
K034
VREG_MMC_3.0V
C460 10pF
C459 10pF
304R
K2
C462
DNI
014R
K074
1u
C45
CAM_AF_2.8V
504C
u1
VCHG_VBUS
zHK8
67
.23
AS5123
XN
004X
21
C40222p
FL1013
5
6
31
42P2 P4
P1 P3
6P
5P
10nC408
VCHG_VBUS
VBAT
Q400
56473829110
DRAIN_B
NC1 COLLECTOR_B
COLLECTOR EMITTER
SOURCE BASE
DRAIN NC2
GATE
004R
1.0
p22304
C
0.1u
C401
00 4D Z
FL400
1IN OUT
GND1 GND2
VCHG_VBUS
VREG_MSMP_2.6V
C48
10n
+VPWR
D400
10u
C409
1n
C414
+VPWR
+VPWR_RF|+VPWR
RW
PV+
USB_3.3V_EN
USB_3.3V_EN
nPON_RST
PMIC_TCXO
SLEEP_CLK
PMIC_SSBI
TCXO_EN
JTAG_PS_HOLD
USBH_DM
REMOTE_PWR_ON
AMUX_OUT
GSM_PA_DAC_REF
TCXO_PM_19.2MHZ
UART3_TXUART3_RX
USBH_DP
MSM_USIM_DATA
MSM_USIM_RST
MSM_USIM_CLK
PS_HOLD
PM_INT_N
SIM_RST
SIM_CLK
VBAT_TEMP
VBAT_TEMP
VBAT_SENSE
VBAT_SENSE
USB_ID
USB_IDMAX_DP
MAX_DP
MAX_DM
MAX_DM
KPD_PWR_N
P_S
NSI
ISNS_P
N_LTC_
GH
C
CHG_CTL_N
N_TEF_TT
AB
BATT_FET_N
VSNS_MSME_1.8V
PCB_REVISION
PCB_REVISION
MUIC_I2C_SDAMUIC_I2C_SCL
MUIC_INT
VSNS_RF_SMPS
VSNS_MSMC1_1.25V
FUEL_I2C_SDAFUEL_I2C_SCL
VSNS_MSMC2_1.25V
NIO
CV
SIM_IO
BACKLIGHT_KEY
Place crystal and load caps close to PM7540
Must Check Battery Conn. Pin Map
1%
rehtegot etu oR
REV.C_0408_CHANGED
0.5mm
Local Ground Plan
PM7540
Place in PM7540 room at shield edge
0.6mm
0.6mm
These CAPs close to inductors
REV.C_0408_CHANGED
1.1
.ve
R
0.6mm
USB 3.3V LDO
Route together
Place close to PM7540 pins
1608
150K
1%
150K
150K
R1
ADC
150K
A&F
150K
R2
R2
2.13V
10K
68K
47K
150K
150K
REV
1.93V
D&I
C&H
B&G
Rev.1.1
150K
150K
HKAIN0 : PCB Revision Check ADC
0.16V
Rev.1.0
E&J
Rev.1.2 680K
0.81V
100K
1.73V
0.62V
300K
R1
430K
M_S
NS
I
1.30V
1.04V
close to each other
2mm
mm5.0 9N ,7N
0603
VOLTAGE DETECTOR REMOVED
Fuel Gauge IC & Battery Conn.
2mm
10.04.08 Changed Rev.C
SERIAL RESISTOR REMOVED
1608
Am
08
e
ldn
aH
n
aC
e
ca
rT
2mm
REV.1.0_0624_CHANGED
2mm
09.12.17 added
Turbo Mode
09.11.12 added
2009.11.16 changed
160810V
Aloha 091209
0.3mm0.3mm
REV.C_0408_CHANGED
REV.E_CHANGED_0517
REV.E_CHANGED_0517
REV.C_0408_CHANGED
2mm
Battery Charging Circuit
MUIC
TA OVP Circuit
VBUS 2mm
u-USB Connector
2mm1%ISNS_M
CITIZEN -> NDK
- 159 -
7. CIRCUIT DIAGRAM
LGE Internal Use OnlyCopyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
TP5
8pFC7
R509 12
DNIC16
R1170 2.2K
FB7011800
ANT2
C523
DNI
10uFC18
FB7001800
205C
p93
TP7
4.7uFC5
305R
02
0.1uFC2
505R
K7.4
2.2KR1171L1
3.3uH
C545
47pF
J2
2
36
5
4
1M5_MIC
M4_L
M3_DETECT
M4D-DETECT
M1_R
M6_GND
L3
4.7u
405C
u1
10K
R521
FB502 1800
10K
R520
33p
C702
1
2
605R
K001
106Q
D
G
S
R1177 10
+VPWR_AUDIO
C536
1u
10R1176
U500
039282726252423222120291817161
31
3215
14
33
3413
3512
3611
3710
389
398
407
6
415
4
42
433
442
45
1
6474849405152535451
DN
G
2D
NG
3D
NG
4D
NG
B_E
KA
W _TS
OH_L
W
DXT_T
RA
U_TB
N_ST
C_TR
AU_T
B
N_ST
R_TR
AU_T
B
DX
R_TR
AU_T
B
ANT
BT_PCM_CLK
GND5 BT_PCM_OUT
VDD_WL_PA BT_PCM_SYNC
BT_PCM_IN
SDIO_CMD
SDIO_CLK VDD_BT_PA
SDIO_D3
SDIO_D2 S_CLK_IN
SDIO_D1 GND6
SDIO_D0 FM_ANT
WL_RST_N BT_GPIO_0
WL_WAKE_B BT_GPIO_1
REG_ON BT_GPIO_3
VBAT_IN BT_GPIO_4
BT_GPIO_7
SR_VLX1
SR_VLX1BB F_CLK_IN
F_CLK_OUT
BB2
XLV_
RS
BBT
UO
V_R
S
OID
DV
UP_L
ATX
DS_
OID
DV
TU
O_ 2P1_
GID
TU
O_2P1_
GLN
A
ODL
V2P1_
NIV
TU
O _2O
DLNL
AD
S_TB
LC
S_TB
1OI
DU
A
2OI
DU
A
N_TS
R_TB
7D
NG
C30
0.1u
MIC_BIAS
435C
u2 .2
C32
0.1u
C533
1u
C535 1n
005D
205D
305D
47p
C542
C334.7uF
ANT1
105D
1u
C8
33p
C703
C17
47p
33p
C544
M1
8611R
C543
47p
405D
270n
L504
C522
2.2u
VREG_MSMP_2.6V
C9
2.2u
TP12
C1 0.001uF
TP9TP1TP3TP11
TP4
C509 33n
U502
5
3 24 1
VOUTVINGNDSTBY
DN
GP
TP10R1
0
C62.2uF
9611R
K74
TP13
+VPWR
VREG_MSMP_2.6V
MIC1
6
5
4
3
2
1OUT
G1
G2
G3
PWR
G4
C34 4.7uF 33nC510
TP8
10uFC19
0.1u
C31 TP6
VREG_MSMP_2.6V
C518
2.2u
L
K
J
I
H
G
F
E
D
C
B
A
12 11 10 9 8 7 6 5 4 3 2 1
L
K
J
I
H
G
F
E
D
C
B
A
12 11 10 9 8 7 6 5 4 3 2 1
VA615
205R
02
VREG_MSMP_2.6V
K2.2
705R
33p
C538
2.2u
C539
U501
5
3 24 1
VOUTVINGNDSTBY
DN
GP
L4DNI
405R
K7.4
47pC505
47pC506
u1
.0
31
5C
u1.
0215
C
1uC511
1uC514
VREG_MSMP_2.6V
C519
2.2u
IC500
3B
A4
C3
C2
2B
D1
D3
4D
C1
A1D2
1B
D5
A2
A5
A3B5
4B
C5
4C
DN
G
OUT+
DD
VP
H
CPVDDCPVSS
CN
HPL
OUT-
SAI
B
IN2- HPR
IN1+
DD
VS
IN3-
IN2+
AD
S
IN1-
IN3+
CP
LC
S
1uC507
C508 1u
u01
30
5C
R515 12
2.2uC515
VREG_HPVDD_1.8V
FB5001800
FB5011800
33p
C700
+VPWR
VDD_TCXO
VDD_TCXO
26MHzX500
TG-5010LH-87N
4 2
3 1NCOUT
GNDVCC
10uC537
SLEEP_CLK
LINE_ON
LINE_OP
FM_L
FM_R
WLAN_HOST_WAKEUP
WLAN_RESET_N BT_WAKEUP
AUDIO&MOTION_I2C_SDA
MIC_1P
BT_PCM_CLK
BT_PCM_SYNC
HPH_R
HPH_L
BT_UART_TXD
BT_UART_RXD
BT_UART_CTSBT_UART_RTS
BT_HOST_WAKEUP
AUDIO&MOTION_I2C_SCL
FM_ANT
FM_ANT
QE
R_K
LC
CLK_REQ
CLK_IN
CLK_IN
RF_IN_OUT
RF_IN_OUT
RCV_PRCV_N
EAR_L
EAR_L
EAR_R
EAR_R
BT_PCM_DOUT
BT_PCM_DIN
EARJACK_SENSE
HS_MIC_BIAS_EN
WLAN_CLKWLAN_CMD
HS_MIC
MIC_1N
BT_RESET_N
SPK_RCV+
SPK_RCV-
WLAN_REG_ON
WLAN_SDIO[3]WLAN_SDIO[2]WLAN_SDIO[1]WLAN_SDIO[0]
changed 12/28
0603
MIC
0603
3060
306
0
30
60
30
60
306
0 30
60
close to 3
close to 17
HIGH
LOW(DEFAULT)
STATE
UNMATING
Audio SUB SYSTEM
EAR_SENSE
MATING
Must Check Schematic
2009.11.16 added
10.04.08 Changed Rev.C
3.5pi Ear Jack Connector
26MHz TCXO
Wi-Fi&BT&FM MODULE
TCXO LDO
7. CIRCUIT DIAGRAM
- 160 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
0.1u
C623
516C
u1.0
FB600
120
J1
51
62
73
84
910GND2 GND1
RESERVED1 RESERVED2
CLK I_O
RST VPP
VCC GND
2711R
1
VREG_MMC_3.0V
FB602
120
33p
C608
C619
33p
37 11R
1
CN2
1312
1411
1510
169
178
187
196
205
214
223
232
241
C621
33p
C620
0.1u
C618
33p
R614
4.7KohmsR617
51K
C625 10n
VREG_MSMP_2.6V
FL600
7.5pF
015
64
73
82
91INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1G
2G
OJ600 OJ601
CN601
1312
1411
1510
169
178
187
196
205
214
223
232
241
1DZ
16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
L
K
J
I
H
G
F
E
D
C
B
A
L
K
J
I
H
G
F
E
D
C
B
A
16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
5711R
1
FL601
7.5pF
015
64
73
82
91INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1G
2G
FL602
7.5pF
015
64
73
82
91INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1G
2G
C6114.7uF
LD1
R612 100K
C606
4.7u
FL603
019
84736251
P1 P5P2 P6P3 P7P4 P8
1G
2G
416C
Fu1
LD4
VREG_LCD_2.8VVREG_LCD_1.8V
D600
4 3
5 2
6 12.2uC616 C617
2.2u
WLED_PWR
006L
smho1
R618
1K
VA607
116R
smh o
K1.5
R615
1K
VREG_RUIM_3.0VVREG_RUIM_3.0V
106BF
smho7.4
D601
43
52
61R616
51K
VREG_MOTOR_3.3V VREG_MOTOR_3.3V
U1007
520 26
114
8
3
9
105
16
17
18
19
15
14
13
1223
17
1222422+2
C
+1C
- 1C
-2C
IN1 OUT
IN2 BL1
BL2
BL3
BL4
BL5
BL6
BL7_AUX1
BL8_AUX2
EN LDOA
LDOB
SDA
LDOC
SCL LDOD
DN
GA
DN
GP
PE
CAM_IOVDD_2.6V
U602
B2C1
A1B1
B3C2
A3C3IN- VDD
IN+ VO+
_SHUTDOWN VO-
BYPASS GND
Q600
C
B
E GND
IN
OUT
C624
0.1u
WLED_PWR
LD3 LD2
C1931
2.2u
CAM_IOVDD_2.6V
CAM_DVDD_1.2V
CAM_AVDD_2.7V
C6102.2u
C6092.2u
C622
33pF
2.2uC612
VREG_MOTOR_3.3V
4.7K
R601
4.7K
R600
VREG_MSMP_2.6V
206
R
K0
01
+VPWR
C600
1u
C601
1u
706
Cu2.
2u2
.2
20
6C
471 1R
1
CAM_AF_2.8V
FB603
120
CAM_DVDD_1.2V
CN600
17
16
15
14
13
12
11
10
9
8
7
6
5
314
323
332
341
30
29
28
27
26
25
24
23
22
21
20
19
18
R605 12
CAM_AVDD_2.7V
316C
u01406
RK2.2
306R
K2.2
VREG_LCD_1.8V VREG_MSMP_2.6V
U601
43
52
61VCCA VCCB
A B
GND OE_
+VPWR
C605
4.7uC604
4.7u
C4
4.7u
R619 100K
MICROSD_DET_N
MMC_CMD
MMC_DATA[0]
MMC_DATA[1]
MMC_DATA[2] MMC_DATA[3]
CAM_DATA[3]CAM_DATA[2]
CAM_MCLK
CAM_VSYNCCAM_HSYNC
LIN_PWM_FREQ
SIM_RST
SIM_RST
SIM_CLK SIM_CLK
LCD_BL_EN
MMC_CLK
CAM_I2C_SCLCAM_I2C_SDA
VCOIN
WLED5
WLED5
WLED4
WLED4
WLED3
WLED3
WLED2
WLED2
WLED1
WLED1
WLED6
WLED6
WLED7
WLED7
LCD_RESET_N
LCD_MAKERID_LOW
MTR_P_2sub
MTR_P_2sub
MTR_N_2sub
MTR_N_2sub
CAM_DATA[1]CAM_DATA[0]
FLT_CAM_VSYNC
FLT_CAM_VSYNC
FLT_CAM_HSYNC
FLT_CAM_HSYNC
CAM_RESET_N
CAM_PWDN
CAM_DATA[4]CAM_DATA[5]CAM_DATA[6]CAM_DATA[7]
LCD_BL_I2C_SCL
LCD_BL_I2C_SDA
CAM_PCLK
FLT_CAM_DATA[0]
FLT_CAM_DATA[0]
FLT_CAM_DATA[1]
FLT_CAM_DATA[1]
FLT_CAM_DATA[2]
FLT_CAM_DATA[2]
FLT_CAM_DATA[3]
FLT_CAM_DATA[3]
FLT_CAM_DATA[4]
FLT_CAM_DATA[4]
FLT_CAM_DATA[5]
FLT_CAM_DATA[5]
FLT_CAM_DATA[6]
FLT_CAM_DATA[6]
FLT_CAM_DATA[7]
FLT_CAM_DATA[7]
MDDI_P_STB_MMDDI_P_STB_P
MDDI_P_DATA_MMDDI_P_DATA_P
MLCD_VSYNC_O
LCD_VSYNC_O
LCD_VSYNC_O
SPK_RCV+ SPK_RCV-
SIM_IO
SIM_IO
MMC_COVER_DETECT
BACKLIGHT_KEY
MAIN-SUB CONNECTOR
1608
1608
1608
KEY BACKLIGHT LED
Rev.E Changed _ 0517
BACKLIGHT CHARGE PUMP
3.2" HVGA LCD Connector
CAMERA EMI FILTER
LEVEL SHIFTREV.E_CHANGED_0517
USIM Socket
3M CAMERA
1%
1%
LGIT_1/4'' SVCY0024801(C3AA-Y314A)
1%
Q-coin MOTOR
1%1%
1%
- 161 - LGE Internal Use OnlyCopyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
7. CIRCUIT DIAGRAM
045C
u1.0
C706
470n
VREG_TOUCH_3.0V
VREG_MSMP_2.6V
4.7Kohms
R2
4.7Kohms
R3
VA612
VREG_MOTION_3.0V
016AV
VREG_MSMP_2.6V
VREG_MOTION_3.0V
U700
5 4
6 3
7 2
8 1LEDASCL
LEDCSDA
VCCVIO
VOUTGND U503KR3DH
2D
EV
RE
SE
R
DD
V
GND3
GND2
INT1
VDD_IO
RESERVED1
NC1
INT2
NC2
SC
SCL_SPC
GND1
OD
S_ID
S_A
DS
0A
S_O
DS
4D
NG
10u
C541
CN3
4
3
2
1
470R25
1AV
906AV
VA613VA611 VA614
C707
1u
815R
K2.2
915R
K2.2
R613 470
R700
10
R610 470
C708
0.1u
407C
n01
CN1
65
74
83
92
101
G1 G2
G3 G4
KB702KB701
KB703
R703
10
KB704
VREG_PROX_2.8V
16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
L
K
J
I
H
G
F
E
D
C
B
A
L
K
J
I
H
G
F
E
D
C
B
A
16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
R702
4.7Kohms
R701
4.7Kohms
C709
4.7u
U1
12
11
10
9
5
4
6
37
28
1D
DV
D
GE
RV
AD
NG
SD
NG
DD
VA
ADDR
SCL
NC1
TNI
VPP
DRDY
SDA
10u
C705
CN5
2
1VA2
MOTION_INT
PROX_OUT
KPD_PWR_N
TOUCH_I2C_SDATOUCH_INT
TOUCH_I2C_SCL
PROX_COMPASS_I2C_SCL
PROX_COMPASS_I2C_SCL
PROX_COMPASS_I2C_SDA
PROX_COMPASS_I2C_SDACOMPASS_DRDY
KEY_COL[2]
KEY_COL[1]KEY_COL[0]
KEY_ROW[1]
KEY_ROW[1]
KEY_ROW[0]
KEY_ROW[0]
MOTION_I2C_SCL
MOTION_I2C_SDA
TOUCH
DOCKING
2010.01.20 updated
Must Check Schematic
HALL IC(N.A)
HOT KEY
Acceleration Sensor
VOLUME SIDEKEY
0603
Digital Compass
REV.E_CHANGED_0517
HOMESEND
MENU
Proximity Sensor
0603
REV.C_0408_CHANGED
POWER KEY
SEVY0008101
33010S5CLVE
7. CIRCUIT DIAGRAM
- 162 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
1uC701
16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
L
K
J
I
H
G
F
E
D
C
B
A
L
K
J
I
H
G
F
E
D
C
B
A
16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
VB700
2
1 K0
22
00
7R
4L
n33
1K
R709
BAT1
1AV
2AV
3L
n5 1
50
7A
V
40
7A
V
30
7A
V
00
7A
V
20
7A
V
10
7A
V
CN1
ENBY0034101
GB042-24P-H10-E3000
1312
1411
1510
169
178
187
196
205
214
223
232
241
n33
2L
4AV
3AV
017R
K022
S700GND
DAT2
CD_DAT3
CMD
VDD
CLK
VSS
CARD_DETECT
DAT0
COVER_DETECT1
DAT1
n5 1
1L
C7051u
60
7A
VK
74
30
7R
K7
44
07
R
K7
45
07
R
60
7R
K7
4
K7
47
07
R
VREG_MMC_3.0V VREG_MSMP_2.6V
VREG_MMC_3.0V
VREG_MSMP_2.6V
CN701
2
1
MMC_DATA[3] MMC_DATA[3]
MMC_DATA[0]
MMC_DATA[0]
MMC_DATA[1]
MMC_DATA[1]
MMC_DATA[2]
MMC_DATA[2]
MMC_CD
MMC_CD
MMC_CMD
MMC_CMD
MMC_CLK
MMC_CLK
MTR_N_2sub
MTR_N_2sub
MTR_P_2sub
MTR_P_2sub
SPK_RCV-
SPK_RCV-
SPK_RCV+
SPK_RCV+
VCOIN
VCOIN
MMC_COVER_DETECT
MMC_COVER_DETECT
LGP500_SUB_PCB_Rev A
BACK-UP BATTERY Micro SD SocketMain2Sub B2B VIBRATOR(Q-Motor)
SPEAKER PAD
- 16� -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
8. BGA PIN MAP
8. BGA PIN MAP8. BGA PIN MAP
MCP
- 164 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
8. BGA PIN MAP
MSM7227
- 165 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
8. BGA PIN MAP
RTR6285(Top View)
- 166 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
8. BGA PIN MAP
PM7540(PMIC)
- 167 -
9. PCB LAYOUT
LGE Internal Use OnlyCopyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
107BK
C203
102C
3DL
R1175
LD2
5NC
MIC
1
202C
307BK
007BF
107BF
VA615
3711R
C1931
VA614VA6122711R
VA613VA611
4DL407BK
507C
C709
R700
007U
C707
C708
307R
107R
9611R
Q601
207R
8611R
207BK
LD1R1174
LG-P500h_MAIN_SPFY0233701-1.1_PLACE_TOP
MIC1 : Microphone- no far-end voice- no voice recording
9. PCB LAYOUT
- 168 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
E
D
A
F
ADM
7
5
13A B C D
1
6
12
10
10
NHGF MLKJ
24 20
E
13
11
1
1
ABC
5
4
27
110
A EDCB
K LJHGFEDCB
B
LJ KHG
U V W Y AA ABACN P R T
4
E
D
C
1834
RPNM
AGAFAE
17
12
24
13
814
1001U
106NC
514 C
R414
2AV52 R
1AV
CN
3D
404
254 C
454 C
854 C
324 R
744 C
014 C
224 C
344 C
114 R
214 R
044 C
804 C
TP4
304U
C420
2NC
31PT
005 U23 C
TP109PT
C448
064 C
C438
302PT
1J
104 NC
R409
C513
915 C
503 C
TP6
535 C
605 R
C533
534 C
134 C
C430
C433
634 C
234 C
92 R
R415
D403
004 DZ
002U2BF
0311L
206BF
103U
613 C702R
402 CC337
502 R
602 C
7101 R
0501 C
5101 R
C1096
1LF
9011 C 9701 C
5001 U
C1115
R403
FL603C
339C
1064
9201R
125 R
105BF
FB601 7011 C
R1026
C1106
5011 C
C341
002 C
L1015L1016
C27
U2
L1012
1001WS
AN
T1003
5001TNA
C1063
6001TNA
2301L
0211 C
906 C
216 C
106 U
016 C
116 C
8001L
7001L
1001LF
1 U
704 R
102AV
VA
202
C622
C620
C407
2TNA
1TNA
016AV
316 R
C706
C704
R219
502AV
424 C
R218 V
A204
804 R
VA
200R
217
L600
512 R
R216
126 C
302AV
C618
D601
116 R
C619
244 C
C409
R410
D401
C16
71 C 4L
TP8
C419
C421
C450
C418
C457
TP402
Q400
R400
2 R3 R
1NC
906AV
016 R
C18
TP7
1PT
R1
11PT
5 C
3PT
C2
C446
C444
C456
164 C
824 R
524 R
C34
TP401
C428
714 C
114 C
314 C
404U
305 C205 C
L1
L3
C453
405 C
C451
004X
954 C
D402
004L
214 C
102PT
614 R
314 R ZD401934 C
R1171
R1177
R1176
6 C
R427
R426
305 R
C510
R1170
C508
C512
205 R
C507
54 C
C509
115 C
415 C
C505
C8C
33
C19
C31
624 C
03 C
3 C C41404 C
U401
304L
524 C
144 C
554 C724 C
204L
104L
734 C 0391 C
404L
202PT
714 R
814 R
C522
IC500
003 R
812 C
212 C
505 R
405 R
C515
C506
325 C
C518
9 C
406 C5PT21PT
7 C
1 C
005X
TP302
635 C
113 C
203 RC534
U501
203 C
723 C
264 C
133 C
233 C
913 C
223 C
TP301
R424 003 C
004PT
402 R
033 C
103 C
602 R
403 R
C434
712 C
512 C
612 C
207 C
C429 007 C
412 C
C213
C211
307 C
504 C
004 D
C402
FL1005R
1163
9201L
8011 C
C404
004 U
C401
006BF 506 C
903 C 413 C
C320
103 R
C219
C315
U201
022 C 802 R
122 C012 R
4801 C
3511 C
6801 C
L1030
C1087
C1095
L1027
R1022
R1023
9801 C
3301L
0511L
FL1009
L1151R
1178
C1104
C1114
C1113
R20
C48
R404
C400
FL400
304 C
4NC
C1056
C207
C1094
U1003
2201L
C1077
R1027
406 R 306 R
703 C
C313213 C
62 R
C336
C333
C335
902 R 802 C
002X
3611 C
012 C 502 C
2701 C
C1071
C1068
L1017
7601 C
5501 C
3701 C
R1019
3001LF
C1076 3801 C
6201L
5201L
C1929
0201LC1078
5701 C
C1154
0111 C
2LF
1201L
C1103
C1111
C1102
C1112
L1040
11 R
R405
R401
FL1013
1 CI
CN
600TP
300R
211
C222
C340
6101 R
C224
C1053
C1054
C1070
2211 C
9601 C 8101L
C13
L1120
C1081
C11
R14
013 C
603 C 606 CC
317
C318
R214
R220TP
200
C342
523 C
323 C
C338C
324
623 C
303 R
R212
C226
302 R
202U
C225
0801 C 9101L
C1062
C1061C
1162
C1049 5101 C
L4000
C11232401L
L8
8401L
73 C
63 C
9R
C1728
L10
C1128
FL1012
51 C
5L
52 C
02 C
22 C
L1110
C12
1401L
7111 C
0101LFC
1116
025 R
C625
803 C
R615
R618
C223
R19
C540
R202
C601
ZD1
C1065
C1066
C1032
915 R
C1031
815 R
R1021
8 R
L1035R
18
L1031
C1005
2J
005BF
905 R
D501
245 C
005D
006LF
206LF
216 R
206U
R616
C624
C623
R617
R614
R619
Q600
C328
C616
C617
D600
923 C
C4R
201
102 D
002 D
C607
305U
145 C
L7
C1928
6L
C1148
82 C
R24
01 R
01 C
R12
C14
L9 32 C
L2
C26
C24
FL1008
0901 C
4001L
L11
R1004
3001 C
9001 C
5001 R
C615
C537
5201 R
7001 U
C1029
C1028
C1030
C1018
C1013
C1027
C1007
FB502
C545
445 C
L504
D503
205D
U502
705 R
C539
C543
C614
R515
C613
405D
106LF
R605
VA
607
FB603C
608
4001U
C1097
3901 C
6301L
8201L
8901 C
C1121
L1045
9901 C
0301 RL1039
C602
R602
R600
006 C
R601
722 C
002 R 312 R
C1023
C1042
1101L
C1052
C1036
4101L
C1040
3101L 0101L
C1021
L1006
L1009
C1041
2001LF
C1039
2001U
AN
T1002
L1044FL1011
CN
200
8301 C0101 R
C1046
2201 C 8801 C
3301 C
1501 C 7401 C
C538
L12
1901 C 4301L
7211 C
FL1007
C1118
6001U
0311 C
L1043
C1119
9211 C
2101 R 7301 C
6001LF
8101 R3BF
0611 C
C1010
C1019
1101 C
7501 C
0201 C
8501 C
7101 C
2901 C
0601 C
9501 C
2101 C
3001L
C1016
C1025
5001L
C1004
4301 C
L1002
C1024
6001 R
C1014
C1044
3401 C
8401 C
7 R
5401 C
R15
61 R
R5 6 R
4 R
LG-P500h_MAIN_SPFY0233701-1.1_PLACE_BOT
J2 : 3.5pi Ear-Jack- no Sound
CN600 : 3M Camera DOP Connector- no Camera
U301 : Memory- no Booting
CN601 : LCD Conn.- no Display
U200 : DBB- no Power On- no Servive
U1007 : ChargePump- no LCD backlight
X200 : 19.2Mhz X-tal- no Power On- no Service
U1001 : Transceiver- no Service- RF Sensitivity & TX Power
U1002 : FEM&GSM PAM- no Service- RF Sensitivity & TX Power
IC1 : MUIC- no Booting- no USB/Serial Connection
CN4 : I/O conn.- no USB Connection.- no Serial Connection.
CN2 : GPS,WIFI,Motor Connector - no GPS/WiFi/Motor
CN1 : Touch Connector - no touch sensing
IC500 : Audio AMP Sub System & Signal Distributor
- no Sound
U500 : BT+FM Radio Module- no BT Connection- no FM Radio
U403 : PMIC- no Booting- no Power On- no Service
U1003 : PAM- no Service- RF Sensitivity & TX Power
J1 : SIM Conn.- No SIM
CN401 : Battery Conn.- no power On
Q400 : Charging IC- no Battery Charge
U1005 : PAM- no Service- RF Sensitivity & TX Power
- 169 -
9. PCB LAYOUT
LGE Internal Use OnlyCopyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
R703
VA
702
407R
507AV
1AV
2AV
VA
706507C
R700
VA
704
VA
703
C706
R706
017R
R705
VA
700
3AV
4AV
107C
907R
107AV
707R
BA
T1
LG-P500h_F_SUB_SPCY0242301-1.1_TOP
9. PCB LAYOUT
- 170 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LG-P500h_F_SUB_SPCY0242301-1.1_BOT
107 NC
007S
007BV
4L
L3
CN
1
2L
L1
- 171 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
10. RF CALIBRATION
10. RF CALIBRATION
10.1 Configuration of Tachyon
10.1.1 Configuration of directory
LG-P500h/ LG-P500h
LG-P500h
LG-P500h LG-P500h LG-P500h
- 172 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
10. RF CALIBRATION
F o ld e r D e s c r ip tio n
Tachyon Exe file and MFC dll, UI dll is present.
CommonCommon dll files.(XML Data I/O , Auto Test Logic, Tachyon Logic Control, Communication)
ConfigEnvirement files.(Port configuration, Loss adjust)
Instrument Tester control dll.
ModelModel files is present. (Model -> Solution (Qualcomm, EMP, ADI, INFINEON) -> MODEL NAME(LGGW620, LGSH470, ..) -> BUYER NAME(SKT, TEL, VIVO, …)
OCX Conponent files.
PhoneCmd Phone communication file
ReportReport Files is present.(Cal data, test data)
F i le D e s c r ip tio n
‘MODEL NAME’_Calibration.XMLThere are imformations to calibrate.It consist of calibration items.
‘MODEL NAME’_CallSetup.XML There are imformations to call.
‘MODEL NAME’_NV.INIIt consists of default values.It is written when ‘cal&auto’ is begun.
‘MODEL NAME’_Sequence.XML It is described a testing procedures.
10.1.2 Description of basic folders
10.1.3 Description of configuration files
- 17� -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
10.2 How to use Tachyon
10.2.1 Model selection
Follow the procedure before start calibration & auto test
a. Click the icon, in tool bar. Then, you can see the below screen.
b. Select Model “LGP500h”
10. RF CALIBRATION
- 174 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
10. RF CALIBRATION
c. Select the model : You should select “LGP500h”
d. Select the buyer (must be double clicked) Then, you can see “PASS” in Config File Check.
e. Click select button
C
D
E
- 175 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
10.2.2 Start cal & auto
a. Click calibration & autotest button, in Tool bar.
b. Calibration & autotest will be executed in order.
1) Precede Action.
- NV write
- Test command send.
2) Calibration
�) Auto test
4) After action
- Phone reset
- Change UE to AMSS
10. RF CALIBRATION
- 176 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
11. STAND ALONE TEST
11. STAND ALONE TEST
Hidden Menu Start
Start shortcut keys: �845#*500#
Hidden Menu List
Start the desired menu: Menu, click
Version Info
Classified Information representation
Factory Reset
Format SD Card : SD Card Data reset
Factory Reset : Changing the Factory
Delete Userdata : Disabled
- 177 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
11. STAND ALONE TEST
Device Test List
Auto All Test :
-> Auto All Test menu click
-> Continuous information on the menu, giving you ability test
Auto All Test Result
Auto All Test Result
-> From the factory with the ability to view the results screen
Device Test List
Auto All Test : Device functionality testing at the factory to use
Auto All Test Result : Test Result
LCD Test : Display test(Color)
Proximity Test : Proximity Sensor
Vibrator Test : Vibrator test
Camera Test : Camera & Cam test
Sound Test : Sound test
RTC Test : Date/Time Setting
Touch Test : Display touch test
Motion Sensor test : Motion Sensor test
External Memory Test : SD Card Write test
Compass Test : Compass Test
GPS Test : GPS Test
IRT Test : N/A
- 178 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
11. STAND ALONE TEST
LCD Test List
Manual Test : Click on the following screen
Automatic Test : Automatically, without clicking
- White Display
- Black Display
- Red,Green, Blue, White Display
- Red,Green, Blue, White Display 2
Proximity Test
Phone contact with your fingers in the top of the sensor
determine the sensor response
- Away 1
- Near 0
Vibrator test
A case-by-state vibration tests
- 179 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
11. STAND ALONE TEST
Camera test
Menu features disabled
This feature is part of Auto All Test replaced by
-> Auto All Test
-> Camera test
-> Cam test
Sound test
Ring : Ringtone test
Effect Sound :
Message Tone :
Loop Back test : Mic & Speak loop Back test
Audio CAL Tool : Setting
-> Ring menyujung Enabled
RTC test
Date & time : setting
- 180 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
11. STAND ALONE TEST
Touch test
Finger Print : Free mode test
Grid Touch Test : Block mode on touch point mode test
Touch Key Test : key test
Grid Touch Color Change
Block Touch Test
Motion Sensor test
Motion Sensor test
-> 4 Check the operation of the sensor in the direction of lean
External Memory Test
SD Card test
-> Write a test check of the SD Card memory
- 181 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
11. STAND ALONE TEST
Key / Compass Test
SD Card : Check Recognition
SIM Card : Check Recognition
Up/Down key : Check Recognition
End Call key : Check Recognition
Menu key : Check Recognition
Home key : Check Recognition
Back key : Check Recognition
Search key : Check Recognition
Compass test
GPS Test
GPS test : GPS check recognition
ELT Test
Automatic Mode
Manual Mode :
- 182 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
11. STAND ALONE TEST
ELT Test
Automatic Mode : LCD Automatic on/off test
-> time setting
ELT Manual Test
LCD Backlight
Ringtone
Vibrator
Camera
Audio Loopback
-> test on the device is working
(The ability to use plant)
- 183 -
12. EXPLODED VIEW & REPLACEMENT PART LIST
12.1 EXPLODED VIEW
LGE Internal Use OnlyCopyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
SMJY00ACGM01
MTAD00
SPKY01
ADCA00
SPKY00
EBP00
ABFZ01ACGM00
GMEY00
SBPL00
ACQ00
EAA00
MBFZ00
GMZZ00
SUSY00 SJMY00EBR00
ACKA00
SUMY00
EBR01
MBJZ01
MBJZ00
SVLM00 ABFZ00
AKAC00
Description
Bracket Assembly
Motor,DC
PCB Assembly,Flexible
Speaker Module
Cover Assembly,Rear
Antenna,PIFA
Touch Window Assembly
Keypad Assembly,Main
LCD,Module-TFT
Cover Assembly,Front
Tape,Window
Button
Button
Bracket Assembly
PCB Assembly,Main
Can Assembly,Shield
Dome Assembly,Metal
PCB,Sidekey
Camera Module
PCB,Sidekey
Microphone,Condenser
Screw,Machine
SCREW MACHINE
Bracket
Rechargeable Battery,Lithium Ion
Cover Assembly,Battery
Location
ABFZ01
SJMY00
EBR00
SUSY00
ACGM00
EAA00
SMZY00
AKAC00
SVLM00
ACGM01
MTAD00
MBJZ00
MBJZ01
ABFZ00
EBR01
ACKA00
ADCA00
SPKY00
EBP00
SPKY01
SUMY00
GMEY00
GMZZ00
MBFZ00
SBPL00
ACQ00
- 184 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
- 185 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
12. EXPLODED VIEW & REPLACEMENT PART LIST
by SBOM standard on GCSC
Level LocationNo. Description Part Number Spec Remark
1 AGQ000000 Phone Assembly - AGQ86291501 LGP500H.AVIVBK BK:Black -
2 ACQ100400 Cover Assembly,EMS - ACQ85324601 LGP500H.AVIVBK BK:Black -
3 ABFZ01 Bracket Assembly - ABFZ0027801 LG-P500 ORF ZZ:Without Color -
3 ACGM00 Cover Assembly,Rear - ACGM0169610 LG-P500H SS:SHINE SILVER -
4 MDJ000000 Filter MFBZ0024401 COMPLEX LG-P500 ZZ:Without Color FILTER, MIC_REAR
4 MEG000000 Holder MHGZ0035901 COMPLEX LG-P500 ORF ZZ:Without Color MOLD, SiliconeRubber K-770, , , , ,
4 MCQ000000 Damper MPBZ0318301 COMPLEX LG-P500 ZZ:Without Color PAD, CAMERA
4 MCQ000002 Damper MPBZ0318501 COMPLEX LG-P500 ZZ:Without Color PAD, MOTOR
4 MCQ000001 Damper MPBZ0326101 COMPLEX LG-P500 ZZ:Without Color PAD, CONN_LCD
4 MJN061100 Tape,Protect MTAB0447002 COMPLEX LG-P500 BL:Blue TAPE,PROTECTION_REAR_B_2
4 MCR000000 Decor MDAY0085204 COMPLEX LG-P500 ORF BK:Black 3.2 Mega Pixels Printed
4 MCK063300 Cover,Rear MCJN0126901 COMPLEX LG-P500 ORF SS:SHINE SILVER MOLD, PCLUPOY GP-2102, , , , ,
4 MBK070300 Can,Shield MCBA0085901 COMPLEX LG-P500 ORF ZZ:Without Color PRESS,STS,
4 MJN061101 Tape,Protect MTAB0447102 COMPLEX LG-P500 BL:Blue TAPE,PROTECTION_REAR_C_2
4 MKC009400 Window,Camera MWAE0064901 COMPLEX LG-P500 ORF ZZ:Without Color COMPLEX,(empty), , , , ,
4 MJN000000 Tape MTAZ0353001 COMPLEX LG-P500 ZZ:Without Color TAPE, MIC
4 MJN089300 Tape,Window MTAD0133101 COMPLEX LG-P500 ZZ:Without Color TAPE,WINDOW_CAMERA
3 ACQ003400 Cover Assembly,Bar - ACGV0021801 LG-P500 ORF BK:Black -
4 AKAC00 Keypad Assembly,Main AKAC0018601 LG-P500 ORF ZZ:Without Color -
4 ACGM01 Cover Assembly,Front - ACGK0170701 LG-P500 ORF ZZ:Without Color -
5 MEG000000 Holder MHGZ0036001 COMPLEX LG-P500 ORF ZZ:Without Color MOLD, SiliconeRubber K-770, , , , ,
5 MCQ043300 Damper,LCD MPBG0118401 COMPLEX LG-P500 ZZ:Without Color PAD, LCD
5 MJN061100 Tape,Protect MTAB0451701 COMPLEX LG-P500 ZZ:Without Color TAPE,PROTECTION_VOL
5 MJN061101 Tape,Protect MTAB0451901 COMPLEX LG-P500 ZZ:Without Color TAPE,PROTECTION_PWR
5 MTAD00 Tape,Window MTAD0134201 COMPLEX LG-P500 ZZ:Without Color TAPE, MAIN_WINDOW
12.2 Replacement Parts Note: This Chapter is used for reference, Part order is ordered
<Mechanic component>
- 186 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level LocationNo. Description Part Number Spec Remark
5 MBJZ00 Button MBJZ0041201 COMPLEX LG-P500 ORF SS:SHINE SILVER MOLD, PCLUPOY SC-1004A, , , , ,
5 MBJZ01 Button MBJZ0041301 COMPLEX LG-P500 ORF SS:SHINE SILVER MOLD, PCLUPOY SC-1004A, , , , ,
5 MCK032700 Cover,Front - MCJK0134701 COMPLEX LG-P500 ORF BK:Black MOLD, PC LUPOY SC-2302, , , , ,
6 MFEZ00 Frame MFEZ0037101 COMPLEX LG-P500 ORF ZZ:Without Color PRESS, STS, , , , ,
6 MICE001 INSERT,NUT MICE0016901 MECH_COMMON ZY,ZZ,PRESS, STS, , , , ,
6 MICE00 INSERT,NUT MICE0016909 MECH_COMMON ZY,ZZ,PRESS, STS, , , , ,
5 MCR000000 Decor MDAY0086601 COMPLEX LG-P500 ORF ZZ:Without Color COMPLEX,(empty), , , , ,
5 MDJ000000 Filter MFBZ0024201 COMPLEX LG-P500 ZZ:Without Color FILTER_SPEAKER
5 MDS000000 Gasket MGAZ0109001 COMPLEX LG-P500 ZZ:Without Color Gasket_ESD
5 MJN000000 Tape MTAZ0353301 COMPLEX LG-P500 ZZ:Without Color TAPE,RUBBER_PROXIMITY
4 MHK000000 Sheet MSAZ0074801 COMPLEX LG-P500 ZZ:Without Color SHEET_LCD_COG
4 MJN061100 Tape,Protect MTAB0447401 COMPLEX LG-P500 ZZ:Without Color TAPE,PROTECTION_BAR
4 MJN061102 Tape,Protect MTAB0450301 COMPLEX LG-P500 ZZ:Without Color TAPE,PROTECTION_WINDOW
4 MJN061101 Tape,Protect MTAB0447201 COMPLEX LG-P500 ZZ:Without Color TAPE,PROTECTION_KEYPAD
4 ABFZ00 Bracket Assembly - ABFZ0026601 LG-P500 ORF ZZ:Without Color -
5 MJN000001 Tape MJN67672601 COMPLEX LG-P500 ZZ:Without Color TAPE, BRACKET_SIDE
5 MBFZ00 Bracket MBFZ0053801 COMPLEX LG-P500 ORF ZZ:Without Color PRESS, STS, , , , ,
5 MTAZ00 Tape MTAZ0353101 COMPLEX LG-P500 ZZ:Without Color TAPE, BRACKET_LCD
5 ACKA00 Can Assembly,Shield - ACKA0032401 LG-P500 ORF ZZ:Without Color -
6 MEZ000900 Label,After Service MLAB0006701 COMPLEX GS505 TMO ZZ:Without Color COMPLEX, (empty),, , , ,
6 MCQ000000 Damper MCQ66465901 COMPLEX LG-P500 ZZ:Without Color PAD, CAN_SHIELD
6 MCBA00 Can,Shield MCBA0089101 COMPLEX LG-P500 ORF ZZ:Without Color PRESS, STS, , , , ,
6 MTAZ01 Tape MTAZ0347201 COMPLEX LG-P500 ZZ:Without Color TAPE, CAMERA_BACK
6 MTAZ00 Tape MTAZ0366501 COMPLEX LG-P500 ZZ:Without Color TAPE, CAMERA_SIDE
5 ADCA00 Dome Assembly,Metal ADCA0117901 LG-P500 ORF ZZ:Without Color -
5 MDJ000000 Filter MFBZ0031701 COMPLEX LG-P500 ORF ZZ:Without Color COMPLEX,(empty), , , , ,
6 SC2 Can Assembly,Shield - ABM73436401 LGP500.AORFZY ZZ:Without Color -
- 187 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level LocationNo. Description Part Number Spec Remark
7 MDQ000000 Frame MFEZ0045301 COMPLEX LG-P500 ORF ZZ:Without Color PRESS,Ni,
7 MBK070300 Can,Shield MCBA0103101 COMPLEX LG-P500 ORF ZZ:Without Color PRESS,Ni,
5 MEZ000000 LABEL MLAZ0038301 LG-VX6000 SV,ZZ,PID Label 4 Array
3 GMEY00 Screw,Machine GMEY0013901 BH + 1.4mM 4mM MSWR FZB N - ARIMACOMMUNICATIONS CORP.
3 GMZZ00 SCREW MACHINE GMZZ0019003 111111,3.5 mm,1.5 mm,MSWR3 ,N ,+ ,- ,NYLOK Coating(ZnB-BLACK)
3 MBFZ00 Bracket MBFZ0059701 COMPLEX LG-VS660 VRZ ZZ:Without Color PRESS, STS, , , ,,
2 MEZ002100 LABEL,APPROVAL MLAA0062320 GU280 OREBK BK,ZZ,COMPLEX, (empty), , , , ,
1 AGF000000 Package Assembly APAY0151823 LGP500H.AVIVBK ZZ:Without Color LGP500H VIV BrazilPacking
1 AAD000000 Addition Assembly - AAD85597901 LGP500H.AVIVBK BK:Black -
2 ACQ00 Cover Assembly,Battery - ACQ85319907 LGP500.AORFZY BK:Black -
3 MCK004100 Cover,Battery MCJA0119607 COMPLEX LG-P509 BK:Black MOLD,PC LUPOY SC-1004A,
3 MJN061100 Tape,Protect MTAB0448101 COMPLEX LG-P500 ZZ:Without ColorTAPE_GUIDE_COVER_BATTERY
2 AFN053800 ManualAssembly,Operation - AFN75252824 LGP500H.AVIVBK ZZ:Without Color LGP500H manual assy for
VIV
3 MBM062600 Card,Quick Reference MBM63198501 COMPLEX LGP500H.AVIVBK ZZ:Without Color Brazil Leafletfor LGP500H
- 188 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
12. EXPLODED VIEW & REPLACEMENT PART LIST
by SBOM standard on GCSC
Level LocationNo. Description Part Number Spec Remark
2 EAN011400 IC,Memory Card,MICRO SD EAN61826701
MMAGR02GUECA-2MBTN 2GBYTE 2.7VTO3.6V MICRO SDCARD 15.0x11.0x1.0MM TR 8P MicroSD Card 2GBSAMSUNG ELECTRONICS CO., LTD.
4 SJMY00 Motor,DC SJMY0007116 WHVM-1030Q10 2 V,65 mA,10 *3.0T,3V, WOOSUNG G&TCO.,LTD
4 EBR00 PCB Assembly,Flexible - EBR72701001 LG-P500 FLEXIBLE 1.0
5 SACE00 PCB Assembly,Flexible,SMT - EBR72700601 LGP500.AORFBK FLEXIBLE 1.0
6 SACC00 PCB Assembly,Flexible,SMT Bottom - EBR72700701 LGP500.AORFBK FLEXIBLE 1.0
7 L1,L3 Inductor,Multilayer,Chip ELCH0001032HK1005 18NJ-T 18NH 5% 0V 8A 3.1GOHM 350mHZ 300mNON SHIELD 1 1.0X0.5X0.5MM R/TP TAIYO YUDENCO.,LTD
7 CN1 Connector,BtoB ENBY0034101 GB042-24P-H10-E3000 24P 0.40MM STRAIGHT PLUG SMDR/TP 1M - LS Mtron Ltd.
7 L2,L4 Inductor,Multilayer,Chip ELCH0001417 LL1005-FHL33NJ 33NH 5% 0V 200mA 1OHM 1.7GHZ 10NON SHIELD 1 1.0X0.5X0.5MM R/TP TOKO, INC.
7 S700 Socket,Card ENSY0023802 SCHB1B0201 Micro-SD 8P ANGLE SMD R/TP - ALPSELECTRIC KOREA CO.,LTD.
6 SACD00 PCB Assembly,Flexible,SMT Top - EBR72700801 LGP500.AORFBK FLEXIBLE 1.0
7 EAX010700 PCB,Flexible SPCY0242301SPCY0242301 POLYI Multi - 0.25 LG-P500OREBK,FLEXIBLE,F,POLYI,0.25 mm,MULTI-3 LGInnotek.com
7
VA1,VA2,VA3,VA4,VA700,VA701,VA702,VA703,VA704,VA705,VA706
Varistor SEVY0004301 ICVL0518100Y500FR 18V 0% 10F 1.0*0.5*0.55 NONE SMDR/TP INNOCHIPS TECHNOLOGY
7 BAT1 Module,Assembly SMZY0026701EECEP0F333YD GM750 SFRTN BackupCapacitor,0.03F,3.8pi,Module Assembly PANASONICINDUSTRIAL KOREA CO., LTD
7R703,R704,R705,R706,
R707Resistor,Chip ERHZ0000486 MCR01MZP5J473 47KOHM 5% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
7 C706 Capacitor,Ceramic,Chip ECCH0017601 CL05A475MQ5NRNC 4.7uF 20% 6.3V X5R -55TO+85C 1005R/TP 0.5MM SAMSUNG ELECTRO-MECHANICS CO., LTD.
7 R700,R710 Resistor,Chip ERHZ0000445 MCR01MZP5J224 220KOHM 5% 1/16W 1005 R/TP - ROHMSemiconductor KOREA CORPORATION
12.2 Replacement Parts Note: This Chapter is used for reference, Part order is ordered
<Main component>
- 189 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level LocationNo. Description Part Number Spec Remark
7 C701 Capacitor,Ceramic,Chip ECZH0001215 C1005X5R1A105KT000F 1uF 10% 10V X5R -55TO+85C 1005R/TP - TDK KOREA COOPERATION
7 C705 Capacitor,Ceramic,Chip ECCH0004904 GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C 1005 R/TP- MURATA MANUFACTURING CO.,LTD.
7 R709 Resistor,Chip ERHY0000241 MCR01MZP5J102 1KOHM 5% 1/16W 1005 R/TP - ROHMSemiconductor KOREA CORPORATION
4 SUSY00 Speaker Module SUSY0028914 ISDT-181230-08W-04 ASSY,8 ohm,91 dB,1812mm,3.0T,20mm,WIRE GoerTek Inc.
4 EAA010400 Antenna,Helical SNMF0066301 HIR-02A16-0000AA DUAL -5DB 50OHM 5 E.M.W CO., LTD.
4 EAA00 Antenna,PIFA EAA62385801 HIR-02A62-0000AA MULTI -5DB 3:1 E.M.W CO., LTD.
4 SMZY00 Touch Window Assembly SMZY0029602 TSMC-P304A Captive TSM Assembly,3.2" ,; ,Module AssemblyLG INNOTEK.,LTD.
4 SVLM00 LCD,Module-TFT SVLM0041401TX08D42VM0BAAMain,3.2,HVGA,49.52x77.83x1.9t,16.7M,TFT,TM,S6D05A1(Samsung),Bending Type, HITACHI DISPLAYS.,LTD
3 EBR01 PCB Assembly,Main - EBR72673401 LG-P500h MAIN 1.0
4 EBR071500 PCBAssembly,Main,Insert - EBR72701401 LG-P500 MAIN 1.0
5 SPKY00 PCB,Sidekey SPKY0093201 SPKY0093201 POLYI Double DOUBLE 0.15 LG-P500TMO,SIDEKEY,E,POLYI,0.15 mm,DOUBLE LG Innotek.com
5 EBP00 Camera Module EBP61301801 C3AA-Y314C C3AA-Y314C 3M AF, Sony(1/5"), 8.5x8.5x5.4t,FPCB 3.5mm, 90degree LG INNOTEK CO., LTD
5 SPKY01 PCB,Sidekey SPKY0093401 SPKY0093401 POLYI Double DOUBLE 0.15 LG-P500TMO,SIDEKEY,E,POLYI,0.15 mm,DOUBLE LG Innotek.com
4 EBR071800 PCB Assembly,Main,SMT - EBR72673501 LG-P500h MAIN 1.0
5 SAD010000 Software,Mobile SAD32751001 V10a - CENTRAL AND SOUTH AMERICA QCT -
5 EBR071700 PCB Assembly,Main,SMT Top - EBR72673601 LG-P500h MAIN 1.0
6 EAX010000 PCB,Main SPFY0233701SPFY0233701 FR-4 - LX-BUMP 10 0.8 LG-P500TMO,MAIN,F,FR-4,0.8 mm,LX-BUMP 10 UNITECH PRINTEDCIRCUIT BOARD CORP.
6 SUMY00 Microphone,Condenser SUMY0010610SPM0410LR5H-QB SPM0410LR5H-QB,UNIT,42dB,4.72*3.76*1.25,mems TDMA Improve KNOWLESACOUSTICS
6 C1931 Capacitor,Ceramic,Chip ECCH0000198 CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C 1005R/TP . SAMSUNG ELECTRO-MECHANICS CO., LTD.
6 C202,C708 Capacitor,Ceramic,Chip ECZH0003103 GRM36X7R104K10PT 100nF 10% 10V X7R -55TO+125C1005 R/TP - MURATA MANUFACTURING CO.,LTD.
6 R1169 Resistor,Chip ERHZ0000287 MCR01MZP5F4702 47KOHM 1% 1/16W 1005 R/TP - ROHMSemiconductor KOREA CORPORATION
- 190 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level LocationNo. Description Part Number Spec Remark
6
R1172,R1173,R1174,R1175
Resistor,Chip ERHZ0000434 MCR01MZP5J1R0 1OHM 5% 1/16W 1005 R/TP - ROHMSemiconductor KOREA CORPORATION
6 LD1,LD2,LD3,LD4 LED,Chip EDLH0014803 SSC-WH107 WHITE 2.7~3.1 20mA 100~230mcd x, y 64mW
1608 R/TP 2P - SEOUL SEMICONDUCTOR CO.,LTD
6 R701,R702 Resistor,Chip ERHY0000254 MCR01MZP5J472 4.7KOHM 5% 1/16W 1005 R/TP - ROHMSemiconductor KOREA CORPORATION
6 FB700,FB701 Filter,Bead SFBH0008102 BLM15HD182SN1 1800 1.0x0.5x0.5MM SMD R/TP 2P
MURATA MANUFACTURING CO.,LTD.
6 U700 IC,Proximity EUSY0376201 GP2AP002S00F GP2AP002S00F,8,R/TP SHARPCORPORATION.
6 R700,R703 Resistor,Chip ERHZ0000402 MCR01MZP5J100 10OHM 5% 1/16W 1005 R/TP - ROHMSemiconductor KOREA CORPORATION
6 C705 Capacitor,Ceramic,Chip ECCH0007803 CL10A106MP8NNNC 10uF 20% 10V X5R -55TO+85C 1608R/TP 0.8MM SAMSUNG ELECTRO-MECHANICS CO., LTD.
6
VA611,VA612,VA613,VA614
Varistor SEVY0008101 EVLC5S01033 EVLC5S01033,5.5 V, ,SMD ,0603 AMOTECHCO., LTD.
6 C706 Capacitor,Ceramic,Chip ECCH0017601 CL05A475MQ5NRNC 4.7uF 20% 6.3V X5R -55TO+85C 1005R/TP 0.5MM SAMSUNG ELECTRO-MECHANICS CO., LTD.
6 Q601 FET EQFP0004501SI1305-E3 P-CHANNEL MOSFET -8V +-8 -0.92A 0.28OHM340mW SOT323 R/TP 9P VISHAY INTERTECHNOLOGYASIA PTE LTD
6 VA615 Varistor SEVY0007902 ICVS0305500FR ICVS0305500FR,5.6 V,M ,SMD ,0603 SIZEINNOCHIPS TECHNOLOGY
6 C203 Capacitor,TA,Conformal ECTH0001903 F980J226MMA 22 uF,6.3V,M,L_ESR,1608,R/TP NICHICONCORPORATION, EAST JAPAN SALES OFFICE
6 C705 Capacitor,Ceramic,Chip ECCH0004904 GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C 1005 R/TP- MURATA MANUFACTURING CO.,LTD.
6 R1168 Resistor,Chip ERHZ0000407 MCR01MZP5J105 1MOHM 5% 1/16W 1005 R/TP - ROHMSemiconductor KOREA CORPORATION
6 C201 Capacitor,Ceramic,Chip ECCH0000122 MCH155A470JK 47pF 5% 50V NP0 -55TO+125C 1005 R/TP -ROHM Semiconductor KOREA CORPORATION
5 EBR071600 PCB Assembly,Main,SMT Bottom - EBR72673701 LG-P500h MAIN 1.0
6 C1079 Capacitor,Ceramic,Chip ECZH0000846 C1005C0G1H8R2CT000F 8.2pF 0.25PF 50V NP0 -55TO+125C 1005 R/TP - TDK KOREA COOPERATION
6 C1007 Capacitor,Ceramic,Chip ECZH0000841 C1005C0G1H560JT000F 56pF 5% 50V NP0 -55TO+125C1005 R/TP - TDK KOREA COOPERATION
6 FL1009 Filter,Saw SFSY0034701 SAFEA1G88KB7F00 1880 1.4*1.1*0.5 SMD R/TP 5PMURATA MANUFACTURING CO.,LTD.
6 FL1012 Filter,Saw SFSY0034601 SAFEB1G96FL0F00 1960 1.4*1.1*0.6 SMD R/TP 5PMURATA MANUFACTURING CO.,LTD.
- 191 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level LocationNo. Description Part Number Spec Remark
6 FL1 Filter,Saw SFSY0030001 SAFEB881MFM0F00 881.5 1.4X1.1X0.6 SMD R/TP 5PMURATA MANUFACTURING CO.,LTD.
6 FL1005 Filter,Saw SFSY0029901 SAFEB836MAL0F00 836.5 1.4X1.1X0.6 SMD R/TP 5PMURATA MANUFACTURING CO.,LTD.
6FL600,FL601,FL602
Filter,EMI/Power SFEY0011401 ICVE10184E070R101FR ESD/EMI 0HZ 7.5pF 0H SMD R/TPINNOCHIPS TECHNOLOGY
6 FL2 Filter,Duplexer,DCN SDDY0005201SAYFP836MAJ0F00 881500000 869 to 894 836500000 824 to849 2.4 1.8 2.5x2.0x0.55 DUAL SMD R/TP - MURATAMANUFACTURING CO.,LTD.
6 U503 IC,Acceleration Sensor EUSY0408701 KR3DH NONE NONE LGA R/TP 16P - STMICROELECTRONICS ASIA PACIFIC PTE LTD.
6 C1122,C36,C37 Capacitor,Ceramic,Chip ECCH0000701 C1005C0G1H1R2CT000F 1.2pF 0.25PF 50V NP0 -
55TO+125C 1005 R/TP - TDK CORPORATION
6 C26 Capacitor,Ceramic,Chip ECCH0000175 GRM1555C1H2R7B 2.7pF 0.1PF 50V NP0 -55TO+125C 1005R/TP - MURATA MANUFACTURING CO.,LTD.
6 FL1010 Filter,Duplexer,PCS SDPY0004701
ACMD-7407 ACMD-7407,1880 MHz,1960 MHz,2.8 dB,3.2dB,55 dB,50 dB,2.5*2.0*0.95,SMD,FBAR,Band2 Rx unbal.AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE.LIMITED
6 R416 Resistor,Chip ERHZ0000537 MCR01MZP5F6803 680KOHM 1% 1/16W 1005 R/TP - ROHMSemiconductor KOREA CORPORATION
6 L1040 Inductor,Multilayer,Chip ELCH0003828LQG15HS2N4S02D 2.4NH 0.3NH 0V 300mA 0.15OHM 6GHZ8 NON SHIELD 1 1X0.5X0.5MM R/TP MURATAMANUFACTURING CO.,LTD.
6 C1111,C1112 Capacitor,Ceramic,Chip ECZH0000822 C1005C0G1H1R5CT000F 1.5pF 0.25PF 50V NP0 -
55TO+125C 1005 R/TP - TDK KOREA COOPERATION
6 U1003 IC,Power Amplifier SMPY0021701SKY77197 28.25 dBm,40 %,A,-36 dBc,27dB,4x5x0.85,SMD,3G Dual PAM Band 1+5 w/coupler,LGA,R/TP,14, SKYWORKS SOLUTIONS INC.
6 U1005 IC,Power Amplifier SMPY0022801
SKY77702-12 28.6 dBm,36 %,10 mA,-34 dBc,27dB,3.0*3.0*1.0,SMD,USPCS,WBNAD 2,CPL,3MODE,3.2V~4.2V,-35dBc at 28.6dBm2nd,28.6dBm,595mA,1,SMD,R/TP,10 SKYWORKSSOLUTIONS INC.
6 L5 Inductor,Multilayer,Chip ELCH0001034HK1005 3N3S-T 3.3NH 0.3NH 0V 8A 8GOHM 100mHZ 300mNON SHIELD 1 1.0X0.5X0.5MM R/TP TAIYO YUDENCO.,LTD
6 L1130 Inductor,Multilayer,Chip ELCH00010521005GC2T18NJLF 18NH 5% 0V 200mA 0.65OHM 1.6GHZ 8NON SHIELD 1 1.0X0.5X0.5MM R/TP PILKORELECTRONICS LTD.
6 L1042,L1048 Inductor,Multilayer,Chip ELCH0001054
1005GC2T5N6SLF 5.6NH 0.3NH 0V 300mA 0.27OHM 3.2GHZ8 NON SHIELD 1 1.0X0.5X0.5MM R/TP PILKORELECTRONICS LTD.
6 L7 Inductor,Multilayer,Chip ELCH0001403 LL1005-FHL1N0S 1NH 0.3NH 0V 500mA 0.1OHM 20GHZ 8NON SHIELD 1 1.0X0.5X0.5MM R/TP TOKO, INC.
6 L1025,L1041 Inductor,Multilayer,Chip ELCH0001404 LL1005-FHL1N5S_ 1.5NH 0.3NH 0V 500mA 0.13OHM 12GHZ
8 NON SHIELD 1 1.0X0.5X0.5MM R/TP TOKO, INC.
- 192 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level LocationNo. Description Part Number Spec Remark
6 C1084,L1151 Inductor,Multilayer,Chip ELCH0003820
LQG15HS3N0S02D 3NH 0.3NH 0V 300mA 0.17OHM 6GHZ 8NON SHIELD 1 1.0X0.5X0.5MM R/TP MURATAMANUFACTURING CO.,LTD.
6 C1009 Inductor,Multilayer,Chip ELCH00047051005GC2T8N2J00 8.2NH 5% 0V 250mA 0.37OHM 2.8GHZ 8NON SHIELD 1 1.0X0.5X0.5MM R/TP PILKORELECTRONICS LTD.
6 C1110 Resistor,Chip ERHY0003301 MCR01MZP5J101 100OHM 5% 1/16W 1005 R/TP - ROHM.
6 R427 Resistor,Chip ERHZ0000284 MCR01MZP5F4303 430KOHM 1% 1/16W 1005 R/TP - ROHMSemiconductor KOREA CORPORATION
6 FB2,FB3 Resistor,Chip ERHZ0000401 MCR01MZSJ000 0OHM 5% 1/16W 1005 R/TP - ROHMSemiconductor KOREA CORPORATION
6 C14 Capacitor,Ceramic,Chip ECCH0000117 CL05C270JB5NNNC 27pF 5% 50V NP0 -55TO+125C 1005R/TP 0.5 SAMSUNG ELECTRO-MECHANICS CO., LTD.
6 R611 Resistor,Chip ERHZ0000530 MCR01MZP5J512 5.1KOHM 5% 1/16W 1005 R/TP - ROHM.
6 R1030,R18 Resistor,Chip ERHY0000137 MCR01MZP5F2702 27KOHM 1% 1/16W 1005 R/TP - ROHMSemiconductor KOREA CORPORATION
6
C1130,C20,C208,C309,C316,C318,C320,C331,C336,C340,C408,C440,C48,C625,C
704
Capacitor,Ceramic,Chip ECCH0000155 MCH153CN103KK 10nF 10% 16V X7R -55TO+125C 1005R/TP - ROHM Semiconductor KOREA CORPORATION
6R201,R203,R213,R408,R520,R521
Resistor,Chip ERHZ0000405 MCR01MZP5J103 10KOHM 5% 1/16W 1005 R/TP - ROHMSemiconductor KOREA CORPORATION
6
C1005,C1014,C1017,C1020,C1021,C1022,C1039,C1041,C1071,C1072,C1083,C1087,C1103,C1108,C1118,C1121,C1153,
C225,C412,C538,C544,C608,C618,C619,C621,C622,C700,C702,C703,
R24
Capacitor,Ceramic,Chip ECZH0000830 C1005C0G1H330JT000F 33pF 5% 50V NP0 -55TO+125C1005 R/TP - TDK KOREA COOPERATION
- 19� -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level LocationNo. Description Part Number Spec Remark
6 C202,C708 Capacitor,Ceramic,Chip ECZH0003103 GRM36X7R104K10PT 100nF 10% 10V X7R -55TO+125C1005 R/TP - MURATA MANUFACTURING CO.,LTD.
6 L1018,L1019 Inductor,Multilayer,Chip ELCH0001412 LL1005-FHL1N8S 1.8NH 0.3NH 0V 500mA 0.14OHM 12GHZ
8 NON SHIELD 1 1.0X0.5X0.5MM R/TP TOKO, INC.
6 R600,R601 Resistor,Chip ERHZ0000485 MCR01MZP5J472 4.7KOHM 5% 1/16W 1005 R/TP - ROHMSemiconductor KOREA CORPORATION
6 R205,R215,R217,R218 Resistor,Chip ERHY0009503 MCR006YZPJ101 100OHM 5% 1/20W 0603 R/TP - ROHM
Semiconductor KOREA CORPORATION
6 C1013,C1015 Capacitor,Ceramic,Chip ECCH0009106 C0603X7R1C103KT 10nF 10% 10V X7R -55TO+125C 0603
R/TP - TDK CORPORATION
6
D400,D500,D501,D502,D503,D504,
ZD1
Diode,TVS EDTY0010101 ESD9B5.0ST5G ESD9B5.0ST5G,SOD-923,5 V,300mW,R/TP,15pF SCG HONG KONG SAR LTD.
6 C1107 Capacitor,Ceramic,Chip ECCH0001001 C1005C0G1H6R8CT000F 6.8pF 0.5PF 50V NP0 -55TO+125C1005 R/TP - TDK KOREA COOPERATION
6 L1022 Inductor,Multilayer,Chip ELCH00010481005GC2T10NJLF 10NH 5% 0V 250mA 0.42OHM 2.5GHZ 8NON SHIELD 1 1.0X0.5X0.5MM R/TP PILKORELECTRONICS LTD.
6 U500 Module,WLAN SMZY0024901 LBEH19UNBC-338 2.3VTO5.5V LGA 54P 9.0x7.8x1.3MMMURATA MANUFACTURING CO.,LTD.
6 C201 Capacitor,Ceramic,Chip ECCH0000122 MCH155A470JK 47pF 5% 50V NP0 -55TO+125C 1005 R/TP -ROHM Semiconductor KOREA CORPORATION
6 C705 Capacitor,Ceramic,Chip ECCH0004904 GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C 1005 R/TP- MURATA MANUFACTURING CO.,LTD.
6 R1016,R1017 Filter,Bead SFBH0007102 BLM15AG100PN1 10ohm 1.0x0.5x0.55 SMD R/TP 2P
MURATA MANUFACTURING CO.,LTD.
6 C1931 Capacitor,Ceramic,Chip ECCH0000198 CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C 1005R/TP . SAMSUNG ELECTRO-MECHANICS CO., LTD.
6
R1006,R1170,R1171,
R204,R401,R417,R418,R507,R518,R519,R603,
R604
Resistor,Chip ERHZ0000443 MCR01MZP5J222 2.2KOHM 5% 1/16W 1005 R/TP - ROHMSemiconductor KOREA CORPORATION
6 R415 Resistor,Chip ERHZ0000203 MCR01MZP5F1002 10KOHM 1% 1/16W 1005 R/TP - ROHMSemiconductor KOREA CORPORATION
6C1076,
C207,C210,C221
Capacitor,Ceramic,Chip ECCH0000137 C1005X7R1H331KT000F 0.33nF 10% 50V X7R -55TO+125C1005 R/TP - TDK KOREA COOPERATION
6 C1069,C1080 Capacitor,Ceramic,Chip ECCH0000195 GRM1555C1H3R9C 3.9pF 0.25PF 50V NP0 -55TO+125C
1005 R/TP - MURATA MANUFACTURING CO.,LTD.
6 R701,R702 Resistor,Chip ERHY0000254 MCR01MZP5J472 4.7KOHM 5% 1/16W 1005 R/TP - ROHMSemiconductor KOREA CORPORATION
- 194 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level LocationNo. Description Part Number Spec Remark
6 FL1007 Filter,Saw SFSY0027101 B7742 - - - - 5P EPCOS PTE LTD.
6
C1065,C1068,C1094,C1095,C1096,C1113,C1114,C1115,C1929
Capacitor,Ceramic,Chip ECCH0009103 C0603C0G1H101JT00NN 100pF 5% 50V X7R -55TO+125C0603 R/TP - TDK CORPORATION
6 R1176,R1177 Resistor,Chip ERHZ0000206 MCR01MZP5F10R0 10OHM 0.1% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
6 U601 IC,TTL EUSY0391601 NLSV1T244-D 0.9~4.5V - LEVEL SHIFTER - R/TP 6P - SCGHONG KONG SAR LTD.
6 R1005 Capacitor,Ceramic,Chip ECZH0000802 C1005C0G1H010CT 1pF 0.25PF 50V NP0 -55TO+125C 1005R/TP - TDK KOREA COOPERATION
6 R1023 Resistor,Chip ERHZ0000428 MCR01MZP5J180 18OHM 5% 1/16W 1005 R/TP - ROHMSemiconductor KOREA CORPORATION
6
C1028,C1030,C1032,C1034,C1038,C1049,C1053,C1055,C1057,C1058,C1059,C1060,C1061,C1062,C1063,C1066,C1067,
C224,C30,C31,C32
Capacitor,Ceramic,Chip ECCH0009101 C0603X5R0J104KT00NN 0.1uF 10% 6.3V X5R -55TO+85C0603 R/TP - TDK CORPORATION
6 C705 Capacitor,Ceramic,Chip ECCH0007803 CL10A106MP8NNNC 10uF 20% 10V X5R -55TO+85C 1608R/TP 0.8MM SAMSUNG ELECTRO-MECHANICS CO., LTD.
6 L1 Inductor,WireWound,Chip ELCP0012101
CIG21L3R3MNE 0H 20% - 800mA 0.22OHM - - SHIELD2X1.25X1MM NONE - SAMSUNG ELECTRO-MECHANICSCO., LTD.
6 C204 Capacitor,Ceramic,Chip ECCH0000147 MCH155CN222KK 2.2nF 10% 50V X7R -55TO+125C 1005R/TP - ROHM.
6
C1011,C1012,
C11,C1129,C12,C13,
L1015,L1039,L12
Capacitor,Ceramic,Chip ECZH0000813 C1005C0G1H101JT 100pF 5% 50V NP0 -55TO+125C 1005R/TP - TDK KOREA COOPERATION
6 R502,R503 Resistor,Chip ERHZ0000435 MCR01MZP5J200 20OHM 5% 1/16W 1005 R/TP - ROHMSemiconductor KOREA CORPORATION
- 195 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level LocationNo. Description Part Number Spec Remark
6 C33,C34,C606 Capacitor,Ceramic,Chip ECCH0006201 C1608X5R0J475KT000N 4.7uF 10% 6.3V X5R -55TO+85C
1608 R/TP - TDK CORPORATION
6 C1046 Capacitor,Ceramic,Chip ECZH0025916 GRM0335C1E330J 33pF 5% 25V NP0 -55TO+125C 0603R/TP - MURATA MANUFACTURING CO.,LTD.
6 R1018 Resistor,Chip ERHY0009555 MCR006YZPF1202 12KOHM 1% 1/20W 0603 R/TP - ROHMSemiconductor KOREA CORPORATION
6 D402 Diode,Switching EDSY0011901 SDB310Q 340mV 30V 200mA 1A 0SEC 150mW EMD2 R/TP2P 1 AUK CORP
6R210,R220,R300,R302,R612,R619
Resistor,Chip ERHZ0000204 MCR01MZP5F1003 100KOHM 1% 1/16W 1005 R/TP - ROHMSemiconductor KOREA CORPORATION
6
C1018,C1037,C1045,C1047,C1048,C1051,C414,C535
Capacitor,Ceramic,Chip ECZH0025920 GRM033R71C102K 1nF 10% 16V X7R -55TO+125C 1608R/TP - MURATA MANUFACTURING CO.,LTD.
6 C537 Capacitor,TA,Conformal ECTH0004801 TCM0J106M8R 10 uF,6.3V,M,STD,1608,R/TP ROHM.
6
VA611,VA612,VA613,VA614
Varistor SEVY0008101 EVLC5S01033 EVLC5S01033,5.5 V, ,SMD ,0603 AMOTECHCO., LTD.
6
C1,C1075,C1104,
C205,C317,C319,C324,C328,C332,C337,C342,C425,C426,C429,C430,C431,C432,
C437
Capacitor,Ceramic,Chip ECCH0000143 MCH155CN102KK 1nF 10% 50V X7R -55TO+125C 1005 R/TP- ROHM Semiconductor KOREA CORPORATION
6
R202,R216,R219,R414,R425,R615,
R618
Resistor,Chip ERHY0003201 MCR01MZP5F1001 1KOHM 1% 1/16W 1005 R/TP - ROHM.
6 U1007 IC,Sub PMIC EUSY0378001 AAT2862 AAT2862,TQFN34,24,R/TP,3x4x0.8 AdvancedAnalogic Technologies HK Limited
6 C7 Capacitor,Ceramic,Chip ECCH0000109 MCH155A080DK 8pF 0.25PF 50V NP0 -55TO+125C 1005R/TP - ROHM Semiconductor KOREA CORPORATION
6 CN600 Connector,BtoB ENBY0040301 GB042-34S-H10-E3000 34P 0.4MM STRAIGHT SOCKETSMD R/TP 1M - LS Mtron Ltd.
6 R25,R610,R613 Resistor,Chip ERHY0009541 MCR006YZPF4700 470OHM 1% 1/20W 0603 R/TP - ROHM
Semiconductor KOREA CORPORATION
6 C701 Capacitor,Ceramic,Chip ECZH0001215 C1005X5R1A105KT000F 1uF 10% 10V X5R -55TO+85C 1005R/TP - TDK KOREA COOPERATION
- 196 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level LocationNo. Description Part Number Spec Remark
6C4,C433,
C434,C435,C436,C5
Capacitor,Ceramic,Chip ECCH0007802 CV105X5R475M10AT 4.7uF 20% 10V X5R -55TO+85C 1608R/TP - KYOCERA CORP.
6 U200 IC,Digital BasebandProcessor,3G EUSY0392302 MSM7227 0VTO0V 0W BGA R/TP 560P - QUALCOMM
INCORPORATED.
6 C10,L1036 Inductor,Multilayer,Chip ELCH00047091005GC2T3N3S00 3.3NH 0.3NH 0V 300mA 0.19OHM 4.5GHZ8 NON SHIELD 1 1.0X0.5X0.5MM R/TP PILKORELECTRONICS LTD.
6 D200,D201,D401,D404 Diode,Switching EDSY0010501 KDS114E 900mV 30V 100mA 1A 0SEC 100mW ESC R/TP 2P
1 KEC CORPORAITION
6 IC1 IC,Analog Multiplexer EUSY0372001 TS5USBA33402YZPR TS5USBA33402,WCSP,20,R/TP,MUICTEXAS INSTRUMENTS KOREA LTD, HONGKONG BRANCH.
6 FL1003 Filter,Saw SFSY0028201 SAFEB2G14FB0F00 - - - - 2P MURATA MANUFACTURINGCO.,LTD.
6 R1025,R509,R515 Resistor,Chip ERHZ0000348 MCR01MZP5F12R0 12OHM 1% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
6 R15,R16 Resistor,Chip ERHZ0000517 MCR01MZP5J910 91 ohm,1/16W,J,1005,R/TP ROHMSemiconductor KOREA CORPORATION
6R1,R26,
R29,R301,R303,R304
Wire Pad,Short SAFP0000501 LG-VS760 VRZ
6FB600,FB602,FB603
Filter,Bead SFBH0009901 HB-1M1005-121JT 120 1.0x0.5x0.5MM SMD R/TP 2PCERATECH CORPORATION
6 U1002 RF Module SMRH0006201SKY77544 MHz,MHz,POLA EDGE QUAD TXMODULE,SP9T,6.0*6.0*1.0,28p, SKYWORKS SOLUTIONSINC.
6 C1088 Capacitor,Ceramic,Chip ECCH0000112 MCH155C150J 15pF 5% 50V NP0 -55TO+125C 1005 R/TP -ROHM Semiconductor KOREA CORPORATION
6 C1024,C502 Capacitor,Ceramic,Chip ECCH0000120 MCH155A390J 39pF 5% 50V NP0 -55TO+125C 1005 R/TP -ROHM Semiconductor KOREA CORPORATION
6 FL400 Filter,EMI/Power SFEY0015301 NFM18PC104R1C3 ESD/EMI 0HZ 0.1uF 0H SMD R/TPMURATA MANUFACTURING CO.,LTD.
6 L401,L402 Inductor,WireWound,Chip ELCP0008005
CPI2520LZ4R7ME 4.7UH 20% 0V 900mA 0.3OHM 0HZ 0SHIELD 2.5X2X1MM NONE R/TP SAMWHA CAPACITORCO, LTD.
6
C1050,C1077,C1163,
C18,C19
Capacitor,Ceramic,Chip ECCH0005604GRM188R60J106M 10000000pF,6.3V,M,X5R,TC,1608,R/TP,0.8 mm MURATAMANUFACTURING CO.,LTD.
6 C1106,L2 Inductor,Multilayer,Chip ELCH0003838LQG15HS8N2J02 8.2NH 5% - 300mA 0.24OHM 3.7KHZ 8SHIELD 1 1.0X0.5X0.55MM R/TP MURATAMANUFACTURING CO.,LTD.
6 R411,R412 Resistor,Chip ERHZ0000420 MCR01MZP5J151 150OHM 5% 1/16W 1005 R/TP - ROHMSemiconductor KOREA CORPORATION
6 U202 IC,TTL EUSY0408201 74LVC1G79GM 1.65~5.5V - D FLIP-FLOP SOT R/TP 6P -STC CORP.
- 197 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level LocationNo. Description Part Number Spec Remark
6 J2 Jack,Phone ENJE0007601 KJA-PH-0-0176 1P 4P ANGLE R/TP 4mM BLACK 6P - KSDCO., LTD
6 R605 Resistor,Chip ERHZ0000410 MCR01MZP5J120 12OHM 5% 1/16W 1005 R/TP - ROHMSemiconductor KOREA CORPORATION
6 FB700,FB701 Filter,Bead SFBH0008102 BLM15HD182SN1 1800 1.0x0.5x0.5MM SMD R/TP 2P
MURATA MANUFACTURING CO.,LTD.
6 U301 IC,MCP,NAND EUSY0426801
MT29C4G96MAZAPCJA-5 IT FBGA ,137 ,ETC,4G(LB/256Mx16)NAND+4G(DDR400/16Mx4x32*2_2CS_2CKE) SDRAM ,;,IC,MCP MICRON SEMICONDUCTOR ASIA PTE LTD.
6R10,R1015,
R14,R19,R8
PCB ASSY,MAIN,PAD SHORT SAFP0000401 LG-LU3000 LGTBK,MAIN,A,
6 R200 Resistor,Chip ERHZ0000490 MCR01MZP5J510 51OHM 5% 1/16W 1005 R/TP - ROHMSemiconductor KOREA CORPORATION
6 CN2,CN601 Connector,BtoB ENBY0034201 GB042-24S-H10-E3000 24P 0.40MM STRAIGHT SOCKETSMD R/TP 1M - LS Mtron Ltd.
6
C1078,C22,C24,
C25,C402,C403
Capacitor,Ceramic,Chip ECCH0000115 MCH155A220JK 22pF 5% 50V NP0 -55TO+125C 1005 R/TP -ROHM Semiconductor KOREA CORPORATION
6 C1089 Capacitor,Ceramic,Chip ECCH0000180 GRM1555C1H3R3C 3.3pF 0.25PF 50V NP0 -55TO+125C1005 R/TP - MURATA MANUFACTURING CO.,LTD.
6 L1008 Inductor,Multilayer,Chip ELCH00047171005GC2T82NJ00 89NH 5% 0V 150mA 2.1OHM 700MHZ 8NON SHIELD 1 1.0X0.5X0.5MM R/TP PILKORELECTRONICS LTD.
6
C1027,C1029,C1031,C1033,C1064
Capacitor,Ceramic,Chip ECCH0009216 GRM0335C1E220J 22pF 5% 25V X7R -55TO+125C 0603R/TP - MURATA MANUFACTURING CO.,LTD.
6 R403,R404 Resistor,Chip ERHZ0000437 MCR01MZP5J202 2KOHM 5% 1/16W 1005 R/TP - ROHMSemiconductor KOREA CORPORATION
6 R1027,R214 Resistor,Chip ERHY0000104 MCR01MZP5F49R9 49.9OHM 1% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
6 C1010,C1019 Capacitor,Ceramic,Chip ECCH0009206 GRM0335C1E680J 68pF 5% 25V X7R -55TO+125C 0603
R/TP - MURATA MANUFACTURING CO.,LTD.
6 L10 Inductor,Multilayer,Chip ELCH0003832LQG15HS2N2S02 2.2NH 0.3NH - 300mA 0.12OHM 6KHZ 8SHIELD 1 1.0X0.5X0.55MM R/TP MURATAMANUFACTURING CO.,LTD.
6 U501 IC,LDO VoltageRegulator EUSY0407101
BU28TD4WNVX SSON004,4,R/TP,2.8V 150mA SingleLDO,IC,LDO Voltage RegulatorIC,LDO Voltage RegulatorROHM.
6 L1027 Inductor,Multilayer,Chip ELCH0001405 LL1005-FHL3N3S LL1005-FH3N3S,3.3 nH,S ,1005 ,R/TP ,TOKO, INC.
6 R207 Wire Pad,Open SAFO0000501 AX3100 ATL SV_SHIPBACK,MAIN,A,0OHM_1005_DNI
- 198 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level LocationNo. Description Part Number Spec Remark
6L1004,L1005,L1007
Inductor,Multilayer,Chip ELCH00047141005GC2T18NJ00 18NH 5% 0V 200mA 0.65OHM 1.6GHZ 8NON SHIELD 1 1.0X0.5X0.5MM R/TP PILKORELECTRONICS LTD.
6 R428 Resistor,Chip ERHY0000161 MCR01MZP5F2003 200KOHM 1% 1/16W 1005 R/TP - ROHMSemiconductor KOREA CORPORATION
6 U404 IC,A/D Converter EUSY0242303 MAX17040G DFN,8,R/TP,Fuel gauge,IC,CMOSIC,CMOSMAXIM INTEGRATED PRODUCTS INC.
6 L3 Inductor,Wire Wound,chip ELCP0008001 MIP2520D4R7M 4.7UH 30% 0V 1.1A 0.11OHM 0HZ 0 SHIELD
2.5X2X1MM NONE R/TP FDK CORPORATION.
6 R7 Resistor,Chip ERHZ0000509 MCR01MZP5J750 75OHM 5% 1/16W 1005 R/TP - ROHMSemiconductor KOREA CORPORATION
6 L1016 Inductor,Multilayer,Chip ELCH00047181005GC2T5N6S00 5.6NH 0.3NH 0V 300mA 0.27OHM 3.2GHZ8 NON SHIELD 1 1.0X0.5X0.5MM R/TP PILKORELECTRONICS LTD.
6 L1017,L1043 Inductor,Multilayer,Chip ELCH0003844 LQG15HS2N0S02 LQG15HS2N0S02,2 nH,S,1005,R/TP,Chip
coil MURATA MANUFACTURING CO.,LTD.
6
C1036,C1040,L1028,L1029
Inductor,Multilayer,Chip ELCH0001036HK1005 5N6S-T 5.6NH 0.3NH 0V 8A 5.7GOHM 150mHZ300m NON SHIELD 1 1.0X0.5X0.5MM R/TP TAIYO YUDENCO.,LTD
6 C706 Capacitor,Ceramic,Chip ECCH0017601 CL05A475MQ5NRNC 4.7uF 20% 6.3V X5R -55TO+85C 1005R/TP 0.5MM SAMSUNG ELECTRO-MECHANICS CO., LTD.
6
C1003,C1119,C1120,
C23,C27,C459,C460
Capacitor,Ceramic,Chip ECCH0000110 MCH155A100D 10pF 0.25PF 50V NP0 -55TO+125C 1005R/TP - ROHM Semiconductor KOREA CORPORATION
6 C1092 Inductor,Multilayer,Chip ELCH0001033HK1005 1N5S-T 1.5NH 0.3NH 0V 8A 13GOHM 50mHZ 300mNON SHIELD 1 1.0X0.5X0.5MM R/TP TAIYO YUDENCO.,LTD
6 C1098 Capacitor,Ceramic,Chip ECCH0000113 MCH155A180J 18pF 5% 50V NP0 -55TO+125C 1005 R/TP -ROHM Semiconductor KOREA CORPORATION
6
R1172,R1173,R1174,R1175
Resistor,Chip ERHZ0000434 MCR01MZP5J1R0 1OHM 5% 1/16W 1005 R/TP - ROHMSemiconductor KOREA CORPORATION
6 C223 Capacitor,Ceramic,Chip ECCH0010501 GRM1555C1H7R5D 7.5pF C0G TYPE(No X7R) MURATAMANUFACTURING CO.,LTD.
6 U401 IC,LDO VoltageRegulator EUSY0407201
BU33TD4WNVX SSON004,4,R/TP,3.3V 150mA SingleLDO,IC,LDO Voltage RegulatorIC,LDO Voltage RegulatorROHM.
6 CN4 Connector,I/O ENRY0010501 GU075-5P-SD-E1500 5P 0.65MM ANGLE RECEPTACLE DIPR/TP - LS Mtron Ltd.
6 R409 Resistor,Chip ERHZ0000318 MCR01MZP5F8062 80.6KOHM 1% 1/16W 1005 R/TP -ROHM Semiconductor KOREA CORPORATION
6 C407 Capacitor,TA,Conformal ECTH0002703 TCTAL1A107M8R 0.0001F 20% 10V 50UA -55TO+125C0OHM 3.2x1.6x1.1 NONE SMD R/TP ROHM CO.,LTD.
- 199 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level LocationNo. Description Part Number Spec Remark
6
VA200,VA201,VA202,VA203,VA204,VA205
Varistor SEVY0004401 ICVL0518400V500FR 18V 0% 40F 1.0*0.5*0.55 NONE SMDR/TP INNOCHIPS TECHNOLOGY
6 L1035,L6,R1004 Inductor,Multilayer,Chip ELCH0001056
1005GC2T2N7SLF 2.7NH 0.3NH 0V 300mA 0.17OHM 5.5GHZ8 NON SHIELD 1 1.0X0.5X0.5MM R/TP PILKORELECTRONICS LTD.
6 R506 Resistor,Chip ERHY0009506 MCR006YZPJ104 100KOHM 5% 1/20W 0603 R/TP - ROHMSemiconductor KOREA CORPORATION
6 C1102,C602,C607 Capacitor,Ceramic,Chip ECCH0005602 GRM188R61C225K 2.2uF 10% 16V X5R -55TO+85C 1608
R/TP - MURATA MANUFACTURING CO.,LTD.
6 L1010 Inductor,Multilayer,Chip ELCH00047111005GC2T22NJ00 22NH 5% 0V 200mA 0.8OHM 1.5GHZ 8NON SHIELD 1 1.0X0.5X0.5MM R/TP PILKORELECTRONICS LTD.
6 R4,R5 Resistor,Chip ERHZ0000415 MCR01MZP5J131 130OHM 5% 1/16W 1005 R/TP - ROHMSemiconductor KOREA CORPORATION
6 U1004 IC,RF Amplifier SMZY0025501 RF2815 3.3*2.1*1.0,FILTER+GPS LNA+FILTERMODULE,GPS, RF MICRO DEVICES INC
6 U1 IC,A/D Converter EUSY0418501 AMI304 QFN,12,R/TP,Geomagnetic Sensor,IC,A/DConverterIC,A/D Converter AICHI STEEL CORPORATION
6 CN200 Connector,BtoB ENBY0045901 AXT614124 14P 0.4MM STRAIGHT HEADER SMD R/TP 1M -BJ PANASONIC ELECTRONIC PARTS CO.,LTD
6 R11 Resistor,Chip ERHY0000181 MCR01MZP5F15R0 15 ohm,1/16W,F,1005,R/TP ROHM.
6 SW1001 Connector,RF ENWY0008701 MS-156C NONE STRAIGHT SOCKET SMD T/REEL AU50OHM 400mDB HIROSE KOREA CO.,LTD
6 C534 Capacitor,Ceramic,Chip ECCH0007804 CL05A225MP5NSNC 2.2uF 20% 10V X5R -55TO+85C 1005R/TP 0.5MM SAMSUNG ELECTRO-MECHANICS CO., LTD.
6 R400 Resistor,Chip ERHZ0003901 MCR10EZHFLR100 0.1OHM 1% 1/4W 2012 R/TP - ROHM.
6 L8 Inductor,Multilayer,Chip ELCH0001413 LL1005-FHL22NJ 22NH 5% 0V 300mA 0.7OHM 2.1GHZ 10NON SHIELD 1 1.0X0.5X0.5MM R/TP TOKO, INC.
6 R423 Resistor,Chip ERHZ0004201 MCR01MZP5F1213 121KOHM 1% 1/16W 1005 R/TP -ROHM.
6 L403,L404 Inductor,Wire Wound,Chip ELCP0008004 MIP2016D4R7M 4.7UH 30% 0V 900mA 0.16OHM 0HZ 0
SHIELD 2.0X1.6X1.0MM NONE R/TP FDK CORPORATION.
6 L1009 Inductor,Multilayer,Chip ELCH0005005 HK100527NJ 27NH 5% 0V 8A 2.3GOHM 470mHZ 300m NONSHIELD 1 1.0X0.5X0.5MM R/TP TAIYO YUDEN CO.,LTD
6
VA1,VA2,VA3,VA4,VA700,VA701,VA702,VA703,VA704,VA705,VA706
Varistor SEVY0004301 ICVL0518100Y500FR 18V 0% 10F 1.0*0.5*0.55 NONE SMDR/TP INNOCHIPS TECHNOLOGY
- 200 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level LocationNo. Description Part Number Spec Remark
6 D600,D601 Diode,TVS EDTY0009801 VSMF05LCC 5V 6V 12V 2A 25W SOT-963 R/TP 6P 5PROTEK DEVICES INC.
6 C400,C401 Capacitor,Ceramic,Chip ECCH0000182 GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C 1005R/TP - MURATA MANUFACTURING CO.,LTD.
6 C1154 Inductor,Multilayer,Chip ELCH0001035HK1005 4N7S-T 4.7NH 0.3NH 0V 8A 6GOHM 120mHZ 300mNON SHIELD 1 1.0X0.5X0.5MM R/TP TAIYO YUDENCO.,LTD
6 C1090,C28 Capacitor,Ceramic,Chip ECZH0000816 C1005C0G1H120JT000F 12pF 5% 50V NP0 -55TO+125C1005 R/TP - TDK KOREA COOPERATION
6 C613 Capacitor,TA,Conformal ECTH0003701 TCSCM0J106MJAR 10 uF,6.3V,M,L_ESR,1608,R/TPSAMSUNG ELECTRO-MECHANICS CO., LTD.
6 CN401 Connector,TerminalBlock ENZY0029201 04-9247-003-017-829+ 3,2.5 mm,STRAIGHT,Gold,Twin
contact KYOCERA ELCO KOREA SALES CO.,LTD.
6 U602 IC,Audio Amplifier EUSY0404001TPA6202A1ZQVR BGA,8,R/TP,Class AB SPK Amp,IC,AudioAmplifierIC,Audio Amplifier TEXAS INSTRUMENTS KOREALTD, HONGKONG BRANCH.
6 R1010 Resistor,Chip ERHZ0000456 MCR01MZP5J2R2 2.2OHM 5% 1/16W 1005 R/TP - ROHMSemiconductor KOREA CORPORATION
6 FB601,R407 Resistor,Chip ERHZ0000488 MCR01MZP5J4R7 4.7OHM 5% 1/16W 1005 R/TP - ROHM
Semiconductor KOREA CORPORATION
6 FL1001 Filter,Saw,Dual SFSB0001802 SAWEN881MCN0F00 881.5MHz, 1960MHz 1.8*1.4*0.5 SMDR/TP 10P MURATA MANUFACTURING CO.,LTD.
6 C1023,C1025,C15 Capacitor,Ceramic,Chip ECZH0000839 C1005C0G1H4R7CT000F 4.7pF 0.25PF 50V NP0 -
55TO+125C 1005 R/TP - TDK KOREA COOPERATION
6
C1042,C1052,L1021,L1032
Inductor,Multilayer,Chip ELCH0004713 1005GC2T6N8J00 1005GC2T6N8J00,6.8 nH,J ,1005 ,R/TP ,PILKOR ELECTRONICS LTD.
6 FL1013 Filter,EMI/Power SFEY0016301 ICMEF112P900M COMMON MODE NOISE FILTER 0HZ 0F0H SMD R/TP INNOCHIPS TECHNOLOGY
6 U403 IC,PMIC EUSY0342201 PM7540 -0.5~18 N/A 0W CSP R/TP 137P - QUALCOMMINCORPORATED.
6 C315 Capacitor,Ceramic,Chip ECCH0017501 CL10A226MQ8NRNE 22uF 20% 6.3V X5R -55TO+85C 1608R/TP 0.8MM SAMSUNG ELECTRO-MECHANICS CO., LTD.
6 R602 Resistor,Chip ERHZ0000406 MCR01MZP5J104 100KOHM 5% 1/16W 1005 R/TP - ROHMSemiconductor KOREA CORPORATION
6 C533,C536,C8 Capacitor,Ceramic,Chip ECCH0017301 CL03A105MQ3CSNH 0.000001F 20% 6.3V X5R -45TO+85C
0603 R/TP - SAMSUNG ELECTRO-MECHANICS CO., LTD.
6 R1178 Resistor,Chip ERHY0009501 MCR006YZPJ000 0OHM 5% 1/20W 0603 R/TP - ROHMSemiconductor KOREA CORPORATION
6C1109,R1022,R209
Resistor,Chip ERHZ0000463 MCR01MZP5J330 33OHM 5% 1/16W 1005 R/TP - ROHMSemiconductor KOREA CORPORATION
6 C226 Capacitor,Ceramic,Chip ECCH0009203 GRM033R60J333K 33nF 10% 6.3V X5R -55TO+85C 0603R/TP - MURATA MANUFACTURING CO.,LTD.
- 201 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level LocationNo. Description Part Number Spec Remark
6 FL1011 Filter,Saw SFSY0039301
SAFEB2G14AL0F00 2140MHz,1.4*1.1*0.6,SMD,2110M~2170M,IL 3.5,5pin,U-U,50-50,W-BAND I RxDIVERSITY,2140,1.4*1.1*0.6,SMD,R/TP,2140,1.4*1.1*0.6,SMD,R/TP MURATA MANUFACTURING CO.,LTD.
6C1116,C1148,L1011
Capacitor,Ceramic,Chip ECZH0001002 C1005CH1H0R5BT000F 0.5pF 0.1PF 50V NP0 -55TO+125C1005 R/TP - TDK KOREA COOPERATION
6 ZD401 Diode,TVS EDTY0008601 PSD05-LF 5V 6 13.5V 42A 500W SOD323 R/TP 2P 1PROTEK DEVICES INC.
6 D403 Diode,TVS EDTY0008606 PRSB6.8C 4.7V 5.7 - - 10W - R/TP 2P 1 PROTEK DEVICESINC.
6 R616,R617 Resistor,Chip ERHZ0000295 MCR01MZP5F5102 51KOHM 1% 1/16W 1005 R/TP - ROHMSemiconductor KOREA CORPORATION
6 R211,R6 Resistor,Chip ERHZ0000483 MCR01MZP5J470 47OHM 5% 1/16W 1005 R/TP - ROHMSemiconductor KOREA CORPORATION
6 X200 Oscillator,VCTCXO EXSK0008901 KT3225L19200DCW28RA0 19.2MHZ 2PPM 2.8V0.0x0.0x0.0MM NONE SMD R/TP KYOCERA CORP.
6 R410,R413 Resistor,Chip ERHZ0000288 MCR01MZP5F4703 470KOHM 1% 1/16W 1005 R/TP - ROHMSemiconductor KOREA CORPORATION
6 L1044 Inductor,Multilayer,Chip ELCH0003816LQG15HS3N6S02D 3.6NH 0.3NH 0V 300mA 0.18OHM 6GHZ8 NON SHIELD 1 1.0X0.5X0.5MM R/TP MURATAMANUFACTURING CO.,LTD.
6 L504 Inductor,Multilayer,Chip ELCH0010402 LK1005R27-T LK1005R27-T,270 nH,M ,1005 ,R/TP ,CHIPTAIYO YUDEN CO.,LTD
6 U2 IC,RF Amplifier EUSY0365001 BGA735 -0.3~3.6 2.7-3.0 NA 0W 0W NA 0 TSLP R/TP 16P -INFINEON TECHNOLOGIES (ASIA PACIFIC) PTE LTD.
6 U201 IC,MCP,NOR EUSY0216301 NC7SV00P5X_NL SC70 ,5 PIN,R/TP ,Single 2-Input NANDGate FAIRCHILD SEMICONDUCTOR
6 R1019 Resistor,Chip ERHY0009504 MCR006YZPJ102 1KOHM 5% 1/20W 0603 R/TP - ROHMSemiconductor KOREA CORPORATION
6 R208 Filter,Bead SFBH0009601 HB-1T1005-221JT 220 ohm 1.0*0.5*0.5 SMD R/TP 2PCERATECH CORPORATION
6 ZD400 Diode,TVS EDTY0008602 PSD12-LF 12V 13.3 25.9V 21A 500W SOD323 R/TP 2P 1PROTEK DEVICES INC.
6 FL1006 Filter,Saw SFSY0028101 SAFEB1G95KA0F00 1950 1.4*1.1*0.6 SMD R/TP 5PMURATA MANUFACTURING CO.,LTD.
6 C1099 Capacitor,Ceramic,Chip ECCH0002001 C1005JB0J104KT000F 0.1uF 10% 6.3V Y5P -30TO+85C 1005R/TP - TDK CORPORATION
6 IC500 IC,Audio Sub System EUSY0403901 WM9093ECS/R 1.71~5.5V 0W WLCSP R/TP 20P -WOLFSON MICROELECTRONICS PLC
6 J1 Card Socket ENSY0024701 GCA26C-8S-H15-E1500 SIM 8P ANGLE SMD R/TP - LSMtron Ltd.
6 R1026 Resistor,Chip ERHZ0000404 MCR01MZP5J102 1KOHM 5% 1/16W 1005 R/TP - ROHMSemiconductor KOREA CORPORATION
- 202 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level LocationNo. Description Part Number Spec Remark
6 C1004,C1016 Capacitor,Ceramic,Chip ECCH0000901 C1005C0G1H2R2CT000F 2.2pF 0.25PF 50V NP0 -
55TO+125C 1005 R/TP - TDK KOREA COOPERATION
6 U1006 IC,RF Amplifier EUSY0365401 BGA711L7 -0.3~3.6 2.7-3.0 NA 0W 0W NA 0 TSLP R/TP 7P -INFINEON TECHNOLOGIES (ASIA PACIFIC) PTE LTD.
6 U1001 IC,Tx/Rx EUSY0344001 RTR6285 1.8VTO3V,2.7VTO3V 500mW QFN R/TP 68P -QUALCOMM INCORPORATED.
6 R700,R703 Resistor,Chip ERHZ0000402 MCR01MZP5J100 10OHM 5% 1/16W 1005 R/TP - ROHMSemiconductor KOREA CORPORATION
6 U400 IC,Voltage Detector EUSY0374601 MAX14528 MAX14528,TDFN,8,R/TP,Programmable OVPMAXIM INTEGRATED PRODUCTS INC.
6 R212 Resistor,Chip ERHY0009592 MCR006YZPJ202 2KOHM 5% 1/20W 0603 R/TP - ROHMSemiconductor KOREA CORPORATION
6 C404 Capacitor,Ceramic,Chip ECZH0003503 GRM188R61E105K 1uF 10% 25V X5R -55TO+85C 1608 R/TP- MURATA MANUFACTURING CO.,LTD.
6 Q400 FET EQFP0008601 NUS5530MN P-CHANNEL MOSFET -20V 20 -3.9A 0.07OHM1.3W TSOP6 R/TP 8P ON SEMICONDUCTOR
6 X400 Crystal EXXY0026801 NX3215SA 32.768KHZ 20PPM 0F NONE SMD R/TP NIHONDEMPA KOGYO CO.,LTD.
6 L400 Inductor,Wire Wound,Chip ELCP0011901
CPI2012NHL2R2MT 2.2UH 20% - 800mA 0.25OHM - -SHIELD 2X1.25X1MM NONE - SAMWHA CAPACITOR CO,LTD.
6 U502 IC,LDO VoltageRegulator EUSY0407501
BU18TD4WNVX SSON004,4,R/TP,1.8V 150mA SingleLDO,IC,LDO Voltage RegulatorIC,LDO Voltage RegulatorROHM.
6 R426 Resistor,Chip ERHZ0000222 MCR01MZP5F1503 150KOHM 1% 1/16W 1005 R/TP - ROHMSemiconductor KOREA CORPORATION
6 L9 Inductor,Multilayer,Chip ELCH0001409 LL1005-FHL10NJ 10NH 5% 0V 400mA 0.3OHM 3.6GHZ 9NON SHIELD 1 1.0X0.5X0.5MM R/TP TOKO, INC.
6 C509,C510 Capacitor,Ceramic,Chip ECCH0000161 MCH153CN333KK 33nF 10% 16V X7R -55TO+125C 1005R/TP - ROHM Semiconductor KOREA CORPORATION
6 Q600 TR,Bipolar EQBN0012401 KRC402E NPN 30V 0V 50V 100mA 500mA 50 100mW ESMR/TP 3P KEC CORPORAITION
6 FL603 Filter,EMI/Power SFEY0015901 ICMEF214P101MFR ICMEF214P101MFR,SMD,ESD Commonmode Filter INNOCHIPS TECHNOLOGY
6 CN1 Connector,BtoB ENBY0058601 51338-9873 10P 0.40MM STRAIGHT FEMALE SMD R/TP1.5M - HANKOOK MOLEX
6 L1003 Inductor,Multilayer,Chip ELCH0001425 LL1005-FHL82NJ 82NH 5% 0V 200mA 1.9OHM 970MHZ 10NON SHIELD 1 1.0X0.5X0.5MM R/TP TOKO, INC.
6 R424 Resistor,Chip ERHY0000105 MCR01MZP5F51R0 51OHM 1% 1/16W 1005 R/TP - ROHMSemiconductor KOREA CORPORATION
6 FL1002 Filter,Saw,Dual SFSB0001902 SAWEN1G84CN0F00 1842.5MHz, 1960MHz 1.8*1.4*0.5 SMDR/TP 10P MURATA MANUFACTURING CO.,LTD.
6 C706 Capacitor,Ceramic,Chip ECZH0001217 GRM155R60J474K 470nF 10% 6.3V X5R -25TO+70C 1005BK-DUP - MURATA MANUFACTURING CO.,LTD.
6 R206 Resistor,Chip ERHY0024201 MCR01MZP5F6041 6040 ohm,1/16W,F,1005,R/TP ROHM.
- 20� -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level LocationNo. Description Part Number Spec Remark
6 FL1008 Filter,Duplexer,IMT SDMY0001901
SAYFP1G95AA0B00 SAYFP1G95AA0B00,1950 MHz,2140MHz,1.8 dB,2.4 dB,52 dB,43dB,2.5*2.0*0.55,SMD,Band1,2520size,SAW,Rx unbal MURATAMANUFACTURING CO.,LTD.
6 C1044 Capacitor,Ceramic,Chip ECZH0025917 GRM0335C1E470J 47pF 5% 25V NP0 -55TO+125C 0603R/TP - MURATA MANUFACTURING CO.,LTD.
6 L1013 Inductor,Multilayer,Chip ELCH0003819LQG15HS12NJ02D 12NH 5% 0V 300mA 0.28OHM 3GHZ 8NON SHIELD 1 1.0X0.5X0.5MM R/TP MURATAMANUFACTURING CO.,LTD.
6 X500 Oscillator,TCXO EXST0001901 TG-5010LH-87N 26MHZ 2.5PPM 2.8V 32.0x25.0x10.0MM -SMD R/TP EPSON TOYOCOM CORP
- 204 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
12. EXPLODED VIEW & REPLACEMENT PART LIST
by SBOM standard on GCSC
Level LocationNo. Description Part Number Spec Remark
2 EBX000000 Accessory,Data Cable SGDY0016701 KCA-ET-8-0020 KCA-ET-8-0020 Micro USB, 1.2M KSD CO.,LTD
2 EAB010200 Earphone,Stereo SGEY0003744EMB-LGE004MSKB 3mW 16OHM 115DB 85HZTO126HZ 1MBLACK 3.5 L TYPE STEREO 4POLE PLUG - CRESYNCO.,LTD
2 SBPL00 RechargeableBattery,Lithium Ion SBPL0102301 LGIP-400N-WW-LGC 3.7 V,1500 mAh,1
CELL,PRISMATIC,PRISMATIC,BLACK, LG Chem,LTD.
2 EAY060000 Adapters SSAD0036001 STA-U12BR 90Vac~264Vac 5.1V 700mA 5060 GOST NONENONE - SUNLIN ELECTRONICS CO.,LTD
12.3 Accessory Note: This Chapter is used for reference, Part order is ordered