1. INTRODUCTION
- 3 -
1. INTRODUCTION
1.1 PurposeThis manual provides the information necessary to repair, calibration, description and download the
features of the phones.
1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (forexample, persons other than your company’s employees, agents, subcontractors, or personworking on your company’s behalf) can result in substantial additional charges for yourtelecommunications services. System users are responsible for the security of own system.
There are may be risks of toll fraud associated with your telecommunications system. System usersare responsible for programming and configuring the equipment to prevent unauthorized use. LGEdoes not warrant that this product is immune from the above case but will prevent unauthorized useof common-carrier telecommunication service of facilities accessed through or connected to it. LGEwill not be responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possiblycausing harm or interruption in service to the telephone network, it should disconnect telephoneservice until repair can be done. A telephone company may temporarily disconnect service as longas repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. Ifthese changes could reasonably be expected to affect the use of the phones or compatibility withthe network, the telephone company is required to give advanced written notice to the user,allowing the user to take appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on the phones must be performed only by the LGE or its authorized agent.The user may not make any changes and/or repairs expect as specifically noted in this manual.Theref ore, note that unauthorized alternations or repair may affect the regulatory status of thesystem and may void any remaining warranty.
E. Notice of Radiated Emissions
The phones complies with rules regarding radiation and radio frequency emission as defined bylocal regulatory agencies. In accordance with these agencies, you may be required to provideinformation such as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightlydifferent.
G. Interference and Attenuation
An the phones may interfere with sensitive laboratory equipment, medical equipment, etc.
Interference from unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign. Followinginformation is ESD handling:
Service personnel should ground themselves by using a wrist strap when exchange systemboards.
When repairs are made to a system board, they should spread the floor with anti-static matwhich is also grounded.
Use a suitable, grounded soldering iron.
Keep sensitive parts in these protective packages until these are used.
When returning system boards or parts like EEPROM to the factory, use the protectivepackage as described.
1. INTRODUCTION
- 4 -
1. INTRODUCTION
- 5 -
1.3 AbbreviationsFor the purposes of this manual, following abbreviations apply:
APC Automatic Power Control
BB Baseband
BER Bit Error Ratio
CC-CV Constant Current – Constant Voltage
CLA Cigar Lighter Adapter
DAC Digital to Analog Converter
DCS Digital Communication System
dBm dB relative to 1 milliwatt
DSP Digital Signal Processing
EEPROM Electrical Erasable Programmable Read-Only Memory
EL Electroluminescence
ESD Electrostatic Discharge
FPCB Flexible Printed Circuit Board
GMSK Gaussian Minimum Shift Keying
GPIB General Purpose Interface Bus
GPRS General Packet Radio Service
GSM Global System for Mobile Communications
IPUI International Portable User Identity
IF Intermediate Frequency
LCD Liquid Crystal Display
LDO Low Drop Output
LED Light Emitting Diode
The phones GSM Phone
LGE Electronics
OPLL Offset Phase Locked Loop
PAM Power Amplifier Module
PCB Printed Circuit Board
PGA Programmable Gain Amplifier
PLL Phase Locked Loop
PSTN Public Switched Telephone Network
RF Radio Frequency
RLR Receiving Loudness Rating
RMS Root Mean Square
RTC Real Time Clock
SAW Surface Acoustic Wave
SIM Subscriber Identity Module
SLR Sending Loudness Rating
SRAM Static Random Access Memory
STMR Side Tone Masking Rating
1. INTRODUCTION
- 6 -
TA Travel Adapter
TDD Time Division Duplex
TDMA Time Division Multiple Access
UART Universal Asynchronous Receiver/Transmitter
VCO Voltage Controlled Oscillator
VCTCXO Voltage Control Temperature Compensated Crystal Oscillator
WAP Wireless Application Protocol
2. PERFORMANCE
- 7 -
2. PERFORMANCE
2.1 H/W Features
Item Feature Comment
Li-Polymer, 760mAh(820 mAh)
Standard Battery Size: 44 68.6 5.6 mm
Weight: 22 g
Extended Battery T.B.D.
AVG TCVR Current Min: 150mA(Pwr Level 19), Max: 300mA(Pwr Level 5)
Standby Current < 4.1 mA
Talk time Min : 2hr30min (2hr40min) @760(820)mAh
Max : 5hr(5hr20min)
Stand by time Up to 200 hours @820mAh
Charging time 2 hours
RX Sensitivity GSM, EGSM: -108 dBm, DCS: -107 dBm
TX output power GSM, EGSM: 33(32.5) dBm (Level 5)
DCS: 30(29.5) dBm (Level 0)
GPRS compatibility Class 10(This only applies to G7020)
SIM card type Plug-In SIM 3V/5V
Display Main : 65K Color-STN(128X160)
Sub : Mono(96X64)
Status Indicator : 7-color LED
Key Pad :
Status Indicator & KeyPad • 0 ~ 9, #, *, Navigation Key, Up/Down Side Key
• Side Key, Confirm Key, Record Key
• Send Key, END/PWR Key
ANT Fixed Type
EAR Phone Jack Ear-Mic connector
PC Synchronization Yes
Speech coding EFR/FR
Data and Fax Yes
Vibrator Yes
Speaker Yes
Voice Recording Yes
C-Mic Yes
Receiver Yes
Travel Adapter Yes
Options Hands-free kit, CLA, Data Kit
2.2 Technical Specification
2. PERFORMANCE
- 8 -
Item Description Specification
GSM
TX: 890 + n 0.2 MHzRX: 935 + n 0.2 MHz (n = 1 ~ 124)
EGSM1 Frequency Band TX: 890 + (n - 1024) 0.2 MHz
RX: 935 + (n - 1024) 0.2 MHz (n = 975 ~ 1024)
DCSTX: 1710 + (n-512) 0.2 MHzRx: 1805 + (n-512) 0.2 MHz (n = 512 ~ 885)
2 Phase ErrorRMS < 5 degreesPeak < 20 degrees
3 Frequency Error < 0.1 ppm
GSM, EGSM
Level Power Toler. Level Power Toler.
5 33 dBm 2dB 13 17 dBm 3dB
6 31 dBm 3dB 14 15 dBm 3dB
7 29 dBm 3dB 15 13 dBm 3dB
8 27 dBm 3dB 16 11 dBm 5dB
9 25 dBm 3dB 17 9 dBm 5dB
10 23 dBm 3dB 18 7 dBm 5dB
11 21 dBm 3dB 19 5 dBm 5dB
4 Power Level 12 19 dBm 3dB
DCS
Level Power Toler. Level Power Toler.
0 30 dBm 2dB 8 14 dBm 3dB
1 28 dBm 3dB 9 12 dBm 4dB
2 26 dBm 3dB 10 10 dBm 4dB
3 24 dBm 3dB 11 8 dBm 4dB
4 22 dBm 3dB 12 6 dBm 4dB
5 20 dBm 3dB 13 4 dBm 4dB
6 18 dBm 3dB 14 2 dBm 5dB
7 16 dBm 3dB 15 0 dBm 5dB
2. PERFORMANCE
- 9 -
Item Description Specification
GSM, EGSM
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600 ~ 1,200 -60
1,200 ~ 1,800 -60
1,800 ~ 3,000 -63
3,000 ~ 6,000 -65
5 Output RF Spectrum 6,000 -71(due to modulation)
DCS
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600 ~ 1,200 -60
1,200 ~ 1,800 -60
1,800 ~ 3,000 -65
3,000 ~ 6,000 -65
6,000 -73
GSM, EGSM
Offset from Carrier (kHz) Max. (dBm)
400 -19
600 -21
1,200 -21
6 Output RF Spectrum 1,800 -24(due to switching transient)
GSM
Offset from Carrier (kHz) Max. (dBm)
400 -22
600 -24
1,200 -24
1,800 -27
7 Spurious EmissionsConduction, Emission StatusConduction, Emission Status
2. PERFORMANCE
- 10 -
Item Description Specification
GSM, EGSM
8 Bit Error RatioBER (Class II) < 2.439% @-102 dBm
DCSBER (Class II) < 2.439% @-100 dBm
9 RX Level Report Accuracy 3 dB
10 SLR 8 3 dB
Frequency (Hz) Max.(dB) Min.(dB)
100 -12 -
200 0 -
300 0 -12
11 Sending Response 1,000 0 -6
2,000 4 -6
3,000 4 -6
3,400 4 -9
4,000 0 -
12 RLR 2 3 dB
Frequency (Hz) Max.(dB) Min.(dB)
100 -12 -
200 0 -
300 2 -7
500 * -5
13 Receiving Response 1,000 0 -5
3,000 2 -5
3,400 2 -10
4,000 2
* Mean that Adopt a straight line in between 300 Hzand 1,000 Hz to be Max. level in the range.
14 STMR 13 5 dB
15 Stability Margin > 6 dB
dB to ARL (dB) Level Ratio (dB)
-35 17.5
-30 22.5
16 Sending Distortion-20 30.7
-10 33.3
0 33.7
7 31.7
10 25.5
17 Side tone Distortion Three stage distortion < 10%
18 System frequency (13 MHz) tolerance ≤ 2.5 ppm
2. PERFORMANCE
- 11 -
Item Description Specification
19 32.768KHz tolerance ≤ 30 ppm
At least 80 dB under below conditions:20 Ringer Volume 1. Ringer set as ringer.
2. Test distance set as 50 cm
21 Charge VoltageFast Charge : < 500 mA
Slow Charge: < 60 mA
Antenna Bar Number Power
5 -85 dBm ~
4 -90 dBm ~ -86 dBm
22 Antenna Display 3 -95 dBm ~ -91 dBm
2 -100 dBm ~ -96 dBm
1 -105 dBm ~ -101 dBm
0 ~ -105 dBm
Batter Bar Number Voltage
0 ~ 3.62 V
23 Battery Indicator 1 3.62 ~ 3.73 V
2 3.73 ~ 3.82 V
3 3.82 V ~
24 Low Voltage Warning3.5 0.03 V (Call)
3.62 0.03 V (Standby)
25 Forced shut down Voltage 3.35 0.03 V1 Li-Polymer Battery
26 Battery TypeStandard Voltage = 3.7 V
Battery full charge voltage = 4.2 V
Capacity: 760 mAh(820 mAh)
Switching-mode charger
27 Travel Charger Input: 100 ~ 240 V, 50/60 Hz
Out put: 5.2 V, 600 mA
3. TECHNICAL BRIEF
3.1 ReceiverThe receiver part consists of a dual band(GSM & DCS) antenna switch, two RF SAW filters, aexternal dual RF VCO and a transceiver IC(TRF6150). All active circuits for a complete receiverchain with the exception of RF VCO are contained in the transceiver IC(TRF6150).
The TRF6150 chip set has direct conversion structure, so the received RF signal is directlyconverted to base band I and Q signal by the transceiver IC(IF frequency is 0 Hz), which containstwo LNAs and three direct conversion demodulators for E-GSM, DCS and PCS. The demodulated Iand Q signals pass two base band AGC amplifiers and a channel filter, which are on both I and Qsignal paths. The RF front-end circuit is shown Fig. 3-1.
Figure 3-1. RF front-end circuit.
3. TECHNICAL BRIEF
- 12 -
3. TECHNICAL BRIEF
- 13 -
3.1.1 RF front end
RF front end consists of an antenna, a dual band antenna switch, two RF SAWs and two LNAs forE-GSM, DCS band, which are contained in the transceiver IC (TRF6150).
The RF received signals (GSM 925MHz ~ 960MHz, DCS 1805MHz ~ 1880MHz) are input via theantenna or coaxial connector. An antenna matching circuit is between the antenna and theconnector.
VC2 that are connected to 4-Input NOR Gate (U607) to switch either TX or RX path on. When theRX path is turned on, the received RF signal, which has passed through the dual band antennaswitch, is filtered by an appropriate RF SAW filter for better stop band rejection. The filtered RFsignal is amplified by an LNA integrated in the transceiver IC(TRF6150) and pass to a directconversion demodulator. This process is thecsame both GSM and DCS.
The logic and current is given below. Table 3-1.
Table 3-1. The logic and current
3.1.2 Demodulator and Baseband Processing
IF stage is not necessary in this system because the receiver is based on direct conversionarchitecture. So the RX LO frequency is the same as input radio frequency. The amplified signal atLNA stage passes to a direct conversion demodulator and is mixed down to generate I&Q BBsignals. The BB I&Q signals pass via two integrated baseband amplifiers with digitallyprogrammable gain and two fully integrated baseband channel filters to the baseband A/Dconverters which is contained in baseband chipset. Fig.3-2 shows RX path block diagram.
3.1.3 DC offset compensation
The transceiver IC(TRF6150) is based on direct-conversion architecture. This implies that aparasitic DC offset may appear at the output of the IQ demodulator. To reduce the static offset dueto components mismatch and LO self-mixing, the IC includes a hardware DC offset compensationcircuit on both I and Q base band paths. The transceiver IC uses a divider by 2 for LO generation inEGSM and a multiplier by 2 in DCS to minimize the DC offset generated by self mixing and the LOradiation. In addition, a quadrature demodulator gain mismatch calibration system is used to reducethe signal distortion.
VC1 VC2
GSM TX 2.7 V 0 V
DCS TX 0 V 2.7 V
GSM/DCS RX 0 V 0 V
Figure 3-2. RX path block diagram.
Table 3-2. Gain and Noise Figure of RX path.
Table 3-3. Total Gain and Noise Figure of RX path.
3. TECHNICAL BRIEF
- 14 -
Ant. switch RF SAW Filter I,Q demodulator(LNA+Mixer)
Gain(dB)GSM -0.6 -2.5 26
DCS -0.7 -3.2 23
NF(dB)GSM 3
DCS 3.5
Total Gain Total Noise FigureGSM, EGSM 22.9 dB 7.2 dBDCS 19.1 dB 8.2 dB
3. TECHNICAL BRIEF
- 15 -
3.2 SynthesizerThe TRF6150 includes two synthesizer parts. Two synthesizers consist of an IF synthesizer, whichis an integer-N synthesizer, and a RF synthesizer, which is a fractional-N synthesizer. The TRF6150is a transceiver IC suitable for GSM and DCS GPRS up to class 12 applications. So, synthesizersuse a number of techniques to improve lock time, making them well suited to GPRS.
The main fractional-N synthesizer (RF synthesizer), which includes a RF VCO with external tankcircuits, is necessary for both transmitting and receiving operation. The RF VCO works only whenthe transmitting operation is on. The main fractional-N synthesizer has frequency band from 1294MHz to 1356 MHz. Output frequency of the RF VCO is set by the factional number, prescaler andcounter. An buffer amplifier follows the RF VCO. The purpose of the buffer is to give reverseisolation and prevent any frequency pulling of the VCO when the transceiver is powered UP andDOWN.
A dual band external VCO, which uses the PLL block of the main fractional-N synthesizer, isnecessary for transmitting and receiving operation. The dual band means that it can support GSM,DCS frequency operation. For transmitting operation, the OPLL block of the TRF6150 directlymodulates the dual band external VCO with I and Q signals. For receiving operation, the externalVCO output frequency band is fr 90902 to 940MHz for DCS Rx and from 1850 to 1920MHz for GSMRx. The frequency of the signal from the external VCO is divided by 2 for GSM Rx and is doubled by2 for DCS Rx operation before entering into the direct conversion mixer.
The auxiliary integer-N synthesizer (IF synthesizer), which includes an IF VCO with external tankcircuits, is necessary for transmitting operation only. The IF VCO has a frequency band from 832MHz to 858 MHz. Output frequency of IF VCO is settled by prescaler and counter. The fractionalcounter in the RF synthesizer just differs from the IF synthesizer. The IF VCO is also followed by abuffer amplifier, which is to give reverse isolation and prevent any frequency pulling of the VCOwhen the transceiver is powered UP and DOWN.
A fixed reference frequency of 1.3MHz for Rx (or 2.6MHz for Tx) is generated by a reference dividerfrom the external applied 13 MHz crystal oscillator.
The phase frequency detector with charge pump provides programmable output current, whichcould drive the capability and the pulse width.
The counter and mode settings of the synthesizer in the TRF6150 are programmed via 3-wireinterface.
Table 3-4. 3-wire BUS of Synthesizer in the TRF6150
Pin Number DescriptionCLK 11 Serial clock input to the synthesizerDATA 12 Serial data input to the synthesizerEN 13 Input latches the serial data transferred to the synthesizer
Figure 3-3. Synthesizer internal Block Diagram.
3. TECHNICAL BRIEF
- 16 -
The IF and RF output frequencies of the TRF6150 are set by programming the internal divider registers.The frequency setting equations of the IF and RF frequencies are as follows.
is the output frequency of the IF VCO (the auxiliary integer-N synthesizer) and is the outputfrequency of the RF VCO (the main fractional-N synthesizer). The frequency band of the RF VCO is from1294MHz to 1356 MHz, and the frequency band of the IF VCO is from 832MHz to 858Mhz, whichfrequency bands are for the transmitting operation only.
Figure 3-4. Synthesizer Circuit.
3. TECHNICAL BRIEF
- 17 -
3.3 Transmitter The Transmitter part contains TRF6150 active parts, PAM, coupler, dual schottky diode and dualband VCO. The TRF6150 active parts consist of the vector modulator and offset phase-locked loopblock (OPLL) including down-converter, phase detector, and APC IC for power control. The VCOfeed the output frequencies into PAM and TRF6150 for Tx local frequency. The peak output powerof the PAM is controlled by means of a closed feedback loop. A dual band directional coupler isused to control the RF output from the PAM. The PAM outputs from the directional coupler pass tothe antenna connector via an integrated dual band antenna switch module.
Figure 3-5. Transmitter Block Diagram.
3. TECHNICAL BRIEF
- 18 -
3. TECHNICAL BRIEF
- 19 -
3.3.1 Tx Modulator
The Tx I & Q signals from BB analog chipset are fed to the TRF6150 Tx modulator, where they aremodulated onto either a Tx of 880 MHz(for GSM-Tx) or 1710 MHz(for DCS-Tx) by the quadraturemixer inside the U604. The Tx LO signal(1294 – 1356 MHz, 426.4 MHz) is fed from the internalmain and aux.
VCO.
The modulator provides more than 40dBc of carrier and unwanted side-band rejection andproduces a GMSK modulated signal. The BB software is able to cancel out differential DC offsets inthe I/Q BB signals caused by imperfections in the D/A converters. The Tx-Modulator implements aquadrature modulator. The frequency input signal is split into two precise orthogonal carriers, whichare multiplied by the BB modulation signal IP/IN and QP/QN. It is used as reference signal for theOPLL.
Figure 3-6. TX IF Modulator and OPLL Circuit.
3.3.2 OPLL
The down converter contained inside of the TRF6150 (U604) mixes the Tx RF frequency with theRF VCO signal from the ENFVZ4L07(U600) to generate a feedback signal at 414.4MHz for GSM,EGSM and DCS operation. The feedback signal passes to one port of the phase detector.
The GMSK reference signal from the Tx IF modulator passes via a second limiter to the otherinput port of the phase detector. The phase detector generates an error current proportional to thephase difference between the feedback signal from the down-converter and the `reference’ signalfrom the Tx IF modulator. The error current is filtered by a second order low-pass filter to generatean output voltage, which depends on the GMSK modulation and the desired channel frequency.This voltage controls the transmit VCO such that the VCO output signal, centered on the correct RFchannel is frequency modulated with the original GMSK data.
The center frequency of the transmit VCO is offset from the RF VCO frequency by 414.4MHz forGSM ,EGSM and DCS operation.
3.3.3 Power Amplifier
The PF08122B (U601) is Dual band power amplifier for EGSM (880 to 915 MHz) and DCS (1710 to1785 MHz). The efficiency of module is the 55% at 35 dBm for E-GSM and the 50% at 32.5 dBm forDCS for 3.5 V nominal battery use.
This module should be operated under the GSM burst pulse. To avoid permanent degradation, CWoperation should not be applied. To avoid the oscillation at no input power, before the input is cutoff, the control voltage Vapc should be control to less than 0.5 V. We have to improve thermalresistance, the through holes should be layouted as many as possible on PCB under the module.And to get good stability, all the GND terminals and the metal cap should be soldered to groundplane of PCB.
Figure 3-7. Power Amplifier and its Control Part Circuits.
3. TECHNICAL BRIEF
- 20 -
3. TECHNICAL BRIEF
- 21 -
3.3.4 PA Circuit and Control
The power amplifier control circuit ensures that the RF signal is regulated to the required limits ofoperation. RF power is controlled by driving the power control pins of power amplifier and sensing.The resultant RF output power via a directional coupler (N600). The RF sense voltage is peakdetected using an schottky diode of BAT15-099(D600). This detected voltage is compared to theDAC voltage in the TRF6150 to control the output power.
An internal input signal (PA_LEVEL) from CALYPSO, digital BB chipset, (U200) is applied to theAPC IC in TRF6150 during the PA_ON mode and a directional coupler near the antenna feeds aportion of the RF output signal back to the APC IC and peak detector converts this signal to a lowfrequency feedback signal that balances the amplifier when this signal equal to the RAMP inputsignal level.
3.4 13 MHz ClockThe 13 MHz clock (VC-TCXO-208C) consists of a TCXO (Temperature Compensated CrystalOscillator), which oscillates at a frequency of 13 MHz.The 13MHz clock is used within the Synthesizer block of the TRF6150, BB Analog chip-set(NAUCICA_CS), and Digital (CALYPSO). The inverter IC, SN74AHC1GU04 buffer the output toNAUCICA_CS and CALYPSO.
Figure 3-8. VCTCXO Circuit.
3.5 Power Supplies and Control SignalsThree Regulators are integrated in the TRF6150 to provide DC power to the RF blocks (RegulatorR1, R2 R3). The Regulator R1 is used to provide DC power to the receiver, the transmitter and thePA control loop of the TRF6150. The Regulator R2 is used to provide DC power to the DC offsetcompensation circuit, the auxiliary synthesizer, the main synthesizer and VCOs. The Regulator R3is used for the external Rx/Tx VCO. An external regulator is used to provide DC power to theVCTCXO(U605).
Table 3-5. Regulator Specification
Figure 3-9. External Regulator Circuit.
3. TECHNICAL BRIEF
- 22 -
Regulator Voltage Powers Enable SignalRegulator R1, R2, R3 Receiver, Transmitter,
(These are all integrated 2.8 V 0.1 V Synthesizers, VCOsin the TRF6150)
ADP3330_2V85 (U605) 2.85 V 0.5 V VCTXO RF_ENA, XO_ENA
3. TECHNICAL BRIEF
- 23 -
3.6 Digital Baseband (DBB) Processor
Figure 3-10. Top level block diagram of the Calypso G2(HERCROM400G2).
3.6.1 General Description
CALYPSO is a chip implementing the digital base-band processes of a GSM/GPRS mobile phone.This chip combines a DSP sub-chip (LEAD2 CPU) with its program and data memories, a Micro-Controller core with emulation facilities (ARM7TDMIE), internal 8Kb of Boot ROM memory, 4M bitSRAM memory, a clock squarer cell, several compiled single-port or 2-ports RAM and CMOSgates.
The chip will fully support the Full-Rate, Enhanced Full-Rate and Half-Rate speech coding.
CALYPSO implements all features for the structural test of the logic (full-SCAN, BIST, PMT, JTAG
boundary-SCAN).
3.6.2 Block Description
CALYPSO architecture is based on two processor cores ARM7 and DSP using the generic RHEAbus standard as interface with their associated application peripherals.
CALYPSO is composed from the following blocks:
• ARM7TDMIE : ARM7TDMI CPU core
• DSP subchip
• ARM peripherals:
General purpose peripherals• ARM Memory Interface for external RAM, Flash or ROM• 4 Mbit Static RAM with write-buffer
Application peripherals• ARM General purposes I/O with keyboard interface and two PWM modulation signals• UART 16C750 interface (UART_IRDA) with
- IRDA control capabilities (SIR)- Software flow control (UART mode).
• UART 16C750 interface (UART_MODEM) with
- hardware flow protocol (DCD, CTS/RTS)- autobaud function
• SIM Interface.
• TPU(Time Processing Unit) : Processing for GSM time base
• TSP(Time Serial Port) : GSM data interface with RF and ABB
Memory Interface : External/Internal Memory Interface
nCS0 : FLASH1, 16bit access, 3 wait state
nCS1 : FLAHS2, 16bit access, 3 wait state
nCS2 : Ext SRAM, 16bit access, 3 wait state
nCS3 : Main LCD, Sub LCD, MIDI IC addressing, 8bit access, 3 wait state ( See Fig 3-2 )
nCS6 : Int SRAM, 32bit access, 0 wait state
* Calypso internal 39MHz machine � 3wait state is necessary for the 80ns access because of 25nsmachine cycle. (25*4 = 100ns)
3. TECHNICAL BRIEF
- 24 -
3. TECHNICAL BRIEF
- 25 -
Figure 3-6. Decoding Section Block Diagram
3.6.3 External Devices connected to memory interface
Table 3-6. External Device Spec connected to memory interface
3.6.4 RF Interface (TPU, TSP block)
Calypso uses this interface to control Nausica_CS(ABB Processor) and Clara(RF Processor) withGSM Time Base
Table 3-7. RF Interface Specification
Interface SPECMaker Write
Device Name Access Access ReadTime Time
FLASH 1 TH50VPF5683BASB Toshiba 80ns 80nsFLASH 2 TC58FVB641FT/XB Toshiba 80ns 80nsSRAM TH50VPF5683BASB Toshiba 70ns 70nsMAIN LCD S6B0023/S6B0018 SDI TBD TBDSUB LCD KS0723 SDI 60ns 60nsMelody IC YMU762 Yamaha 50ns 80ns
TSP (Time Serial Port)
Resource Interconnection DescriptionTSPDO ABB & RF main Chip Control Data
TSPEN0 ABB ABB Control Data Enable Signal
TSPEN1 RF main Chip RF Control Data Enable Signal
TPU (Time Processing Unit) Parallel PortTSPACT00 RESET_RF RF main Chip Reset Signal
TSPACT05 PA_ON Power Amp ON signal
3.6.5 SIM interface
SIM interface scheme is shown in (Fig. 3-12).
SIM_IO, SIM_CLK, SIM_RST ports are used to communicate DBB with ABB and the Charge Pumpin ABB enables 3V/5V SIM operation
Table 3-8. SIM Interface
Figure 3-12. SIM Interface
3.6.6 UART Interface
The phones has two UART Drivers as follow :
- UART1 : Hardware Flow Control / Fax&Data Modem
- UART2 : Handsfree Control / SW trace or IrDA Modem
Table 3-9. UART Interface Specification
3. TECHNICAL BRIEF
- 26 -
SIM (Interface between DBB and ABB)SIM_RST SIM card async/sync reset
SIM_PWCTRL SIM card power activation
SIM_IO SIM card bidirectional data line
SIM_CLK SIM card reference clock
UART MODEM(UART1)Resource Name Note
TX_MODEM TXD Transmit Data
RX_MODEM RXD Receive Data
CTS_MODEM CTS Clear To Send
RTS_MODEM RTS Request To Send
GPIO 3 DSR Data Set Ready
GPIO 2 DCD Data Carrier Detect
UART IRDA(UART2)TXIR_IRDA TXIR_IRDA Infra-Red Transmit Pulse
TX_IRDA TX Transmit Data(UART2)
RXIR_IRDA RXIR_IRDA Infra-Red Receive Pulse
RX_IRDA RX Receive Data(UART2)
SD_IRDA SD_IRDA IRDA transceiver ShutDown Mode
3. TECHNICAL BRIEF
- 27 -
3.6.7 GPIO map
In total 16 allowable resources, the phones is using 13 resources except 3 resources dedicated toSIM and Memory. the phones GPIO(General Purpose Input/Output) Map, describing application,I/O state, and enable level, is shown in below table.
Table 3-10. GPIO Map Table
3.7 Analog Baseband (ABB) Processor
3.7.1 General Description
Nausica CS is Analog Baseband (ABB)Chip supports GSM900, DCS1800, GPRS Class 10 with
Digital Basband Chip(Calypso G2) Nausica_CS processes GSM modulation/demodulation andpower management operations.
Block Description
- Audio Signal Processing & Interface- Baseband in-phase(I), quadrature(Q) Signal Processing- RF interface with DBB (time serial port)- Supply voltage regulation- Battery charging control- Switch ON/OFF- 3V/5V SIM card Interface- 4 internal & 5external ADC channels
I/O # Application I/O Resource Inactive ActiveState State State
I/O (0) FOLDER I GPIO HIGH LOW(Open) (Closed)
I/O (1) MELODY_INT I GPIO HIGH LOW
I/O(2) DCD O GPIO LOW HIGH
I/O (3) DSR I GPIO HIGH LOW
I/O (4) Sub_backlight O GPIO LOW HIGH
I/O (5) SIM_PWCTL O SIM
I/O (6) Jack_Detect O GPIO LOW HIGH
I/O (7) LCD_RESET O GPIO HIGH LOW
I/O (8) SPK_EN O GPIO LOW HIGH
I/O (9) MELODY_RESET O GPIO HIGH LOW
I/O (10) SUB_LED1 O GPIO LOW HIGH
I/O (11) SUB_LED2 O GPIO LOW HIGH
I/O (12) SUB_LED3 O GPIO LOW HIGH
I/O (13) HANDSFREE I GPIO HIGH LOW
I/O (14) NBHE O MEMORY
I/O (15) NBLE O MEMORY
3.7.2 Audio Signal Processing & Interface
Audio signal processing is divided Uplink path and downlink path..
The uplink path amplifies the audio signal from MIC and converts this analog signal to digital signaland then transmit it to DBB Chip. This transmitted signal is reformed to fit in GSM Frame format anddelivered to RF Chip. MICBIAS is 2.5Vlevel.
The downlink path amplifies the signal from DBB chip and outputs it to Receiver(or Speaker).
Figure 3-13. Audio Interface Block Diagram
3.7.3 Baseband Codec(BBC)
Baseband codec is composed of baseband uplink path(BUL) and baseband downlink path(BDL).
BUL makes GMSK(Gaussian Minimum Shift Keying) modulated signal which has In-phase(I) com-ponent and quadrature(Q) component with burst data from DBB. This modulated signal istransmitted through RF section via air.
BDL process is opposite procedure of BUL. Namely, it performs GMSK demodulation with inputanalog I&Q signal from RF section, and then transmit it to DSP of DBB chip with 270KHz data ratethrough BSP.
Figure 3-14. Baseband Codec Block Diagram
3. TECHNICAL BRIEF
- 28 -
3. TECHNICAL BRIEF
- 29 -
3.7.4 Voltage Regulation(VREG)
There are 5 LDO(Low Drop Output) regulators in ABB chip.
The output of these 5 LDOs are as following table. (Figure 3-6) shows the power supply relatedblocks of DBB/ABB and their interfaces in the phones.
Figure 3-15. Power Supply Scheme
Table 3-11. LDO Output Table
3.7.5 ADC Channels
ABB ADC block is composed of 4 internal ADC(Analog to Digital Converter) channels and 5external ADC channel. This block operates charging process and other related process by readingbattery voltage and other analog values.
Output Voltage Usage
VR1 1.8V Digital Core of DBB
VR1B 2.0V Digital Core of ABB
VR2 2.9V Memory Interface of DBB
VR2B 2.9V Digital I/Os of DBB & ABB
VR3 2.9V Analog Block
Table 3-12. ADC Channel Spec
3.7.6 Charging
Charging block in ABB processes charging operation by using VBAT, ICHG value through ADCchannel. Battery Block Indication and SPEC of the phones is as follow.
Figure 3-16. Battery Block Indication
1. Charging method : CC-CV2. Charger detect voltage : 4.0V3. Charging time : 2h4. Icon stop current : 100mA5. Charging current : 420mA6. CV voltage : 4.2V7. Cutoff current : 40mA8. Full charge indication current (icon stop current) : 100mA9. Recharge voltage : 4.16V10. Low battery alarm
a. Idle : 3.62Vb. Dedicated : 3.50V
11. Low battery alarm interval :a. Idle : 3minb. Dedicated:1min
12. Switch-off voltage : 3.35V13. Charging temperature adc range
a. ~ -2°C : not charging operation.b. -2°C ~ 47°C : charging.c. 47°C ~ : not charging operation.
3. TECHNICAL BRIEF
- 30 -
ADC 9 channels
Resource Name
VCHG VCHG
VBAT VBAT Charging Management
ICHG ICHG
VBACKUP VBACKUP Backup Battery
ADCIN1 Not Use
ADCIN2 BATT_Themister Battery Detect
ADCIN3 RADIO_TEMP Temperature Sensing
ADCIN4/TSCXP Hook_Detect HOOK_DETECT
ADCIN5/TSCYP Not Use
3. TECHNICAL BRIEF
- 31 -
3.7.7 Switch ON/OFF
The phones Power State : Defined 4cases as follow
- Power-ON : mobile is powered by main battery or backup battery.- Power-OFF : mobile isn’t any battery.- Switch-ON : mobile powered and waken up from switch-off state.- Switch-OFF : mobile is powered to maintain only the permanent function(ULPD).
To enter into Switch-ON state, one of following 4 condition is satisfied.
- PWR-ON : pushed after a debouncing time of 30ms.- ON_REMOTE : After debouncing, when a falling edgeis detected on RPWON pin.- IT_WAKE_UP : When a rising edge is detected on RTC_ALARM pin.- CHARGER_IC : When a charger voltage is above VBAT+0.4V on VCHG.
3.7.8 Memories
• 64Mbit/32Mbit Flash/SRAM MCP + 64Mbit Flash� 128Mbit Flash + 32Mbit SRAM
• 16 bit parallel data bus
• ADD01 ~ ADD22
3.7.9 Display & FPC Interface
LCD module include:
LCD module is connected to main board with 32 pin FPC and connected to Speaker, Receiver,Vibrator with 8 pin FPC connector.
FPC Interface Between LCD module and Speaker, Receiver, Vibrator
FPC Interface Between LCD module and main board
Main LCD 128 160 65K Color STN LCD
Sub LCD 96 64 mono FSTN LCD
Main LCD Backlight White LED illumination and AC/DC converter Module
Sub LCD Backlight EL Backlight
7 color Indicator LED KOHA HL006-W11
Table 3-13. FPC Interface Spec
3. TECHNICAL BRIEF
- 32 -
Pin # NAME Category Description
1 VDD3.0V PWR Driver IC power supply
2 /CS Main Driver Chip Select
3 A(1) Instruction/Data Identification(RS)
4 D0
5 D1
6 D2MAIN7 D3INTERFACE Data BUS
8 D4
9 D5
10 D6
11 D7
12 /WR Main Driver Write Enable
13 /RES Main & Sub LCD driver Reset
14 VSS GND Ground
15 LED_EN BACKLIGHTMain LCD backlight Enable(Enable High)
16 VBACKUP PWR Backup Battery
17 I_LED1 BACKLIGHT Indicator LED Enable 1(Enable High)
18 I_LED2 BACKLIGHT Indicator LED Enable 2(Enable High)
19 I_LED3 BACKLIGHT Indicator LED Enable 3(Enable High)
20 EL_EN BACKLIGHTSub LCD EL backlight Enable(Enable High)
21 VBAT PWR VBAT for White LED operation
22 SUB_CS Sub Interface Sub LCD Chip Select1 (Low Enable)
23 CS2(A2) (Parallel) Sub LCD Chip Select2 (High Enable)
24 VSS1 GND Ground
25 VBAT1 PWR VBAT for White LED operation
26 MOTOR VIBRATOR Vibrator Enable
27 REC(-) Receiver Negative
28 REC(+)AUDIO
Receiver Positive
29 SPK(-) Speaker Negative
30 SPK(+) Speaker Positive
3. TECHNICAL BRIEF
- 33 -
3.7.10 KeyPad Switching & Scanning
Table 3-14. Keypad Map
DBB supports 25 Keymap and Switch-ON Key is directly connected to ABB(see Figure 3-17).
Figure 3-17. Keypad Scanning Scheme
KBC0 KBC1 KBC2 KBC3 KBC4
KBR0 [ ] [ ] [ ] [ ] [CFM]
KBR1 [1] [2] [3] [F4] [Voice Memo]
KBR2 [4] [5] [6] [F1] [Vol Up]
KBR3 [7] [8] [9] 1[F2] [Vol Down]
KBR4 [*] [0] [#] [SEND] [F3]
3.7.11 Audio
Figure 3-18. Audio Section Scheme
UplinkThe microphone is soldered to the main PCB. The uplink signal is passed to MICIP and MICIN pinsof Nausica_CS. The MICBIAS voltage is supplied from Nausica_CS(dedicated mode only) throughswitching IC(U404) and R401. The MICBIAS voltage path is switchable by control the U404.
When the headset is inserted, U400 outputs 2.8V high state and it’s input of U404(#1) and Calypso(Jack_Detect). On detecting this 2.8V output, Calypso makes Nausica_CS switches the micamplifier path from main to auxiliary. In addition, this 2.8V output applied to U404(#1) and U404switches the MICBIAS voltage path from main mic to headset mic through D401 and R419.
Figure 3-19. Uplink Path
3. TECHNICAL BRIEF
- 34 -
DownlinkThe downlink signal is passed from EARP and EARN pins of Nausica_CS. When the headset isinserted and Calypso detects ‘Jack_Detect’ signal(output of U400), Calypso makes Nausica_CSswitches the downlink path from ‘EARP’ and ‘EARN’ to ‘AUXOP’ and ‘AUXON’.
Figure 3-20. Downlink Path
Speaker PhoneIn speakerphone mode, Calypso makes ‘SPK_EN’ to 2.8V and EARP signal is passed to speakerthrough MIDI IC(U403).
3.7.12 KeyPad and Main LCD back-light Illumination
There are 19 Deep Blue LEDs in Main Board and 3 LEDs in LCD module for KeyPad Back-light and
Main LCD Back-light respectively, which are driven by ‘KEYLIGHT’ line from Calypso.
Figure 3-21. KeyPad and Main LCD Back-light Scheme
3. TECHNICAL BRIEF
- 35 -
3. TECHNICAL BRIEF
- 36 -
3.7.13 Sub_LCD EL Illumination
In Sub-LCD EL illumination, there is an EL driver in FPCB Board, which is driven bySUB_BACKLIGHT line from Calypso(GPIO4).
Figure 3-22. Sub-LCD EL Illumination
3.7.14 Indicator Illumination
Indicator LED control circuit can make 7 colors using multi-color LED. Multi-color LED consists ofRed LED, Green LED and Blue LED. The combination of these LEDs makes 7 colors
Figure 3-23. Indicator LED Illuination
In the case of power off mode(ON_OFF=Low), if TA is inserted, R509 is connected to VCHG and
I_LED1(Red LED) is turned-on. In other cases(ON_OFF=High), Multi-color LED is controlled bySUB_LED1, SUB_LED2 and SUB_LED3 signal of Calypso
4. SERVICE S/W AND CALIBRATION
- 37 -
4. SERVICE S/W AND CALIBRATION
4.1 Service S/W
4.1.1 Overview
This service S/W is used for Calibration and Standalone test.
4.1.2 Hardware and software environment
- More than 486 computer
- 16Mbyte RAM
- Remained more than 10Mbyte in Hard Disk Memory
- Under Microsoft windows 98 or more than
4.1.3 Software installation
Unzip the phones service software provided where folder you want there are some files extracted inthat folder. Start Setup.exe in Service software setup folder. RampTable.dat, default transmitramping table, and rf_original_L300.epm, default calibration data, are located in window systemfolder so that these files are loaded automatically, if you execute LaputaService.exe.
4.1.4 Common Properties of Service Software
When you execute this program, you’ll see the below user interface window titled
LAPUTA_Service Tool in figure 4-1. The LAPUTA_Service Tool has five main frames.
Figure 4-1. LAPUTA Service Tool
4. SERVICE S/W AND CALIBRATION
- 38 -
A. Target system frameThis is for initializing the target phone. When you use this program to test the phones, you haveto initialize target at first. To initialize target phone, select target (the phones is default) and COMport used at your computer and then click the Initialize button. If target initializing is endedsuccessfully, the box in red below the initialize button will turn into green.
B. Rx AGC Test frameAt this part, you can control receiver path of target phone.
- Serving Freq. Setting (TCH)
You can set TCH of phone. The number means ARFCN of Traffic channel. You can change thevalue by clicking arrow button by one step or just entering the number directly.
- Beacon Freq. Setting (BCH)
You can set BCH of phone. The number means ARFCN of base station broadcasting channel.
- AGC Value Setting
You can set AGC gain of phone. The number means gain of AGC amplifier in Rx path.
- Power Measurement
The number means channel index according to pre-defined ARFCN. There are 12 pre-definedARFCNs within Rx band. 4 ARFCNs are for GSM and others for DCS. Clicking arrow button tochange number, you can see TCH and BCH ARFCN changed automatically.
PM window displays the power level measured in baseband chip. PM value is useful tocalculate the received absolute power. The unit of PM is dBd.
- PM Start
You can measure Rx power that target received from test equipment. When you click thisbutton the result of power measurement displayed at PM blank in Power Measurement frame.You can measure PM for all 12-channel indexes by changing Number and clicking PM Start.
- Calculate
You have to do this work after measuring PM for all 12-channel indexes. When you click thisbutton, service software calculate the calibration data from measured 12 PM data.
- Standalone
This button makes target operate in Rx mode continuously. Target will be operated under thecondition that you set. During continuous receiving mode, label of Standalone button ischanged to Stop. If you want stop receiving mode operating, click this button one more.
4. SERVICE S/W AND CALIBRATION
- 39 -
C. Tx APC Test frameAt this part, you can control transmit path of target phone.
- Serving Freq. Setting (TCH)
You can set TCH of phone. The number means ARFCN of Traffic channel.
- Beacon Freq. Setting (BCH)
You can set BCH of phone. The number means ARFCN of base station broadcasting channel.
- Power Level Setting
First, you have to choose operating mode (GSM or DCS) according to TCH and BCH frequencythat you selected before. Then select the Level and adjust the DAC value. Level meansGSM/DCS output power level. Usable range is 5 to 19 for GSM, 0 to 15 for DCS. DAC value isa factor to determine output power. Its variable range is 0 to 1023.
- Uplink Normal Burst test
You can also control the traffic slot number be using by changing TCS value. Because GSMhas 8-time slot, TCS value varies 0 to 7. Patten is to select data format that is transmitted. Youcan send all data 0, or 1 or repeating of 1010. But it is good to you to using the default valuebecause data format doesn’t affect to RF characteristics.
- Test
Transmitting is started when you click this button. During Transmitting, label of Test button ischanged to Stop. If you want stop transmitting, click this button one more.
D. RF Parameter Download frame- Saving epm file into Flash
When you have a epm file, contains calibrated data, and you want to download into targetFlash, check Flash and click File Download button. Then you can see RF parameters Savewindow. Select epm file you want to save into Flash then click Open. During saving file intoFlash, The statement bar indicating download process is displayed under the RF ParameterDownload frame. As successfully ending download, information box will be appeared. Click Ok.
- Saving Cal. Data to Flash
After Rx or Tx calibration, you can save the calibration results into Flash and epm file. CheckFlash and click Calib Save button. Then you can see RF parameters Save window. Write thefile name and click Save button.
E. User Command and Results frameWhenever you click button or make some event in service software, every ordered event isdisplayed in this frame. You can also see calibration results here.
F. Ramp Shape buttonThis button is for burst shape table. But it is deactivated in service software.
4. SERVICE S/W AND CALIBRATION
- 40 -
4.2 Calibration
4.2.1 Overview
All tuning operations of the phone are carried out using the service software. The service softwareturns the phone into the locals mode, in which the phone can be outwardly controlled via the testJig.The calibration values of the phone reside on the Flash. The contents of the Flash can be read bythe service software and saved as a file. This is advisable when there is need to retain thatinformation, e.g. in view of replacement of the circuit. The program also enables writing the defaultparameters on the Flash, in which case all calibration steps should be carried out. The servicesoftware can’t control the equipment, so only manual calibration process is possible.
4.2.2 Equipment List
Table 4-1. Calibration Equipment List.
Equipment for Calibration Type / Model BrandWireless Communication HP8960,HP8922, CMU200, any other call equipmenTest Set
RS-232 Cable and Test JIG
RF Cable
Power
Service SW (LAPUTA)
Test SIM Card
PC(for Software Installation) Pentium II class above 300MHz
4. SERVICE S/W AND CALIBRATION
- 41 -
4.2.3 Equipment Setup
Figure 4-2. Calibration Equipment Setup
+ -
+
-
- 42 -
4. SERVICE S/W AND CALIBRATION
4.2.4 Calibration Steps
A. RX CalibrationIn order for the RSSI measurements to be within the GSM specifications, some calibration isnecessary. Also, due to AGC implementation, some AGC specific constants need calibration. Intotal, three calibrations are required per receive band, AGC calibration, channel compensationand temperature compensation. Of these, temperature compensation is not needed inreplacement of the circuit. In AGC calibration the reference power fed into the phone viapermanent antenna connector is –74dBm. In channel compensation, the channel numbers in Rxband are;
E-GSM band : 0, 40, 124, 975, and 1023.
DCS band : 512, 574, 636, 700, 760, 822 and 885.
- Procedure
a) Initialize phone by clicking Initialize button.
b) Set the GSM test equipment CW mode and BCH and TCH of GSM test equipment ‘0’, samewith phone.
c) Set the power of GSM test equipment ‘–74dBm’.
d) Click the PM Start button, then the value, received power by phone, is displayed in PMmeasurement window at service software.
e) Change the BCH and TCH of phone by clicking the Number button and set the channel(BCH & TCH) of equipment to be same.
f) Click the PM Start button.
g) Repeat above procedure until the displayed number in Power Measurement window is 12.
h) Click the Calculate button, then the service software calculate the channel compensationparameters.
i) Saving updated calibration data into phone by clicking Calib Saving button.
NOTE
If the calibration does not done for all channels, 5 channels for EGSM900 and 7 channels forDCS1800, the service software reports, “Please execute after measuring the PM”.
B. TX CalibrationIn order for the Tx power to be within the GSM specifications for each Tx level, some calibrationis necessary. In total, four calibrations are required per transmit band, power calibration, channelcompensation, temperature compensation and low voltage compensation. Of these, temperaturecompensation and low voltage compensation are not needed in replacement of the circuit andchannel compensation is not needed because the transmit power is in GSM specification withenough margin.In power compensation, the channel numbers used in Tx band are;
E-GSM band : 62.
DCS band : 699.
And the target powers in dBm for each power level are;
- 43 -
Table 4-2. Tx targer powers
-Procedure
a) Initialize phone by clicking Initialize button.
b) Set the BCH and TCH of the phone 62 for E-GSM900 and 699 for DCS1800. Of cause youhave to match test equipment’s BCH and TCH ARFCN with this value. For each power level,adjust the DAC value to get target power and click Test button. Then you can see the outputpower displayed on test equipment.
c) Saving updated calibration data into phone by clicking Calib Saving button.
4. SERVICE S/W AND CALIBRATION
Power level GSM DCS
0 29
1 28
2 26
3 24
4 22
5 32 20
6 31 18
7 29 16
8 27 14
9 25 12
10 23 10
11 21 8
12 19 7
13 17 6
14 15 5
15 13 4
16 11
17 9
18 7
19 6
4.2.5 Test JIG Operation
Table 4-3. JIG Power
Table 4-4. JIG DIP Switch
Table 4-5. LED Description
- Operation1) Connect the RS232 Serial Cable between COM port of notebook and MON port of test JIG in
general.
2) Set the Power Supply 4.0V. Also DC adapter may be used.
3) Set the 3rd of DIP SW ON state. In case of DC adapter, set 4th ON state.
4) Press the Phone power key. If the Remote Power On is used, switch the 1st of Dip Switch ON.
4. SERVICE S/W AND CALIBRATION
- 44 -
Description
Power Supply Usually 4.0 V
DC Adaptor 9.5V, 500mA
Switch Number Name Description
Switch 1 RPWRON In ON state, phone is awaked.
Switch 2 HF_DETECT Turn on for AUDIO TEST.
Switch 3 Power Supply Power is provided for phone from Power Supply.
Switch 4 D.C power Power is provided for phone from DC adaptor.
LED Number Name Description
LED 1 POWER Power is provided for Test Jig
LED 2 CHARGER Indicate charging state of the Phone Battery with TravelCharger.
LED 3 UART IRDA Indicate date transfer state through the UART IRDA.
LED 4 UART MODEM Indicate date transfer state through the UART MODEM.
- 45 -
5. DOWNLOAD
5. DOWNLOAD
5.1 Download Setup
5.1.1 Download Equipment
1) Data Kit
2) Desktop or Notebook PC
3) Download Monitor Program
4) The phones mobile phone
+ -
5.2 Download Procedure
5.2.1 General Purpose
This document gives a guideline for upgrading software of the phones using UART port.
5.2.2 Download Environment
In order to download software of the phones, the following working environments should beprepared: the phones Data Link Kit, DK-10G that is connected to COM1 or COM2 serial port in theDesktop or Notebook PC.
The phones Data Kit Download Monitor Program that is copied to Desktop PC or Notebook PC.
Target SW* downloaded to the phones mobile phone.
Note : Target SW* means any necessary software to be downloaded to the mobile phone.
- 46 -
Warning
You must use the Data Link Kit(DK-10G) and UART Download Monitor program that are providedfrom LGE. Otherwise downloading process won’t properly
5. DOWNLOAD
5. DOWNLOAD
- 47 -
5.2.3 Download Procedure
A. Unzip the phones UART Download monitor program(monitor 663.zip) in PC.
B. Execute monitor663.exe. And then select the “Target” Menu shown in Figure 5-1. Then, choose“Connect” in the Target Menu.
Figure 5-1.
C. A table will be displayed as shown in Figure 5-2. Then press the arrow-button and choose acorrect serial port. And press “OK” button.
Figure 5-2.
- 48 -
5. DOWNLOAD
D. As the following window shown in Figure 5-3. is displayed, connect the phones Phone to DataLink Kit, DK-10G and power on the phones. If the connection is succeeded, the following screenwill show the contents as shown in Figure 5-4.
Figure 5-3.
Figure 5-4.
5. DOWNLOAD
- 49 -
E. Click on “Flash” on the top menu and select “Get type” item as shown in Figure 5-4. and select“Erase and Program Appli Only+Boot” item as shown in Figure 5-5.
Figure 5-5.
F. Finally choose the target SW that you want to download. And then you can see the followingwindow in Figure 5-6.
Figure 5-6.
5. DOWNLOAD
- 50 -
G. If the downloading procedure is succeeded, then the following window is shown.
Figure 5-7.
6. TROUBLE SHOOTING
- 51 -
6. TROUBLE SHOOTINGFigure 6-1. shows a measurement set-up.
Figure 6-1. Measurement set-up
6. TROUBLE SHOOTING
- 52 -
6.1 Rx Trouble (EGSM)
6.2 Rx Trouble (DCS)
6. TROUBLE SHOOTING
- 53 -
6. TROUBLE SHOOTING
- 54 -
6.3 Tx Trouble
1111
U200 : CALYPSO(BB Digital Main Chip)
U201 : NAUSICA CS(BB Analog Main Chip)
U601 : PAM (PF08122B)
U604 : RF Main Chip (TRF6150)
U600 : TXVCO (ENFVZ4LO7)
U603 : Antenna S/W(SHS-M090B)
N600 : Directional coupler(LDC15D 190A0007A)
D600 : Shottky Diode(BAT 15-099)
6. TROUBLE SHOOTING
- 55 -
111
6.4 Voice Function TroubleA. Receiver
B. Speaker
6. TROUBLE SHOOTING
- 56 -
C. Microphone
6. TROUBLE SHOOTING
- 57 -
6.5 Display Function TroubleA. LCD
6. TROUBLE SHOOTING
- 58 -
6. TROUBLE SHOOTING
- 59 -
B. Indicator LED
6. TROUBLE SHOOTING
- 60 -
6.6 Other Function TroubleA. Vibrator
6. TROUBLE SHOOTING
- 61 -
B. Charger
7. STAND ALONE TEST AND TEST POINTS
7.1 Testing Set-up
7.1.1 Received RF Level and Checks
This section shows the typical RF levels expected throughout the receiver path. A block diagramshowing the locations of the RF measurement points and levels is shown in Figure 7-3.
Receiver Testing Set-upTo check the receiver the following conditions have to be set:
1. On a signal generator or a GSM/DCS test box, output a CW signal of amplitude = -60 dBm ateither: 947.4 MHz (CH62) when testing the GSM RX path or 1842. 6 MHz (CH699) when testingthe DCS RX path.
2. Set the DC power supply to 4.0 V.
Note: All RF values shown are only intended as a guide figure and may differ from readings takenwith other test equipment and leads. Lead and connector losses should always be taken intoaccount when performing such RF measurements.
Testing ReceiverUsing a suitable high frequency probe measure the RF levels at the relevant points shown in Figure 7-2. and compares your measurements with those shown in the diagram. If there are anymajor difference between the readings taken and those indicated then further investigation of thatparticular point will be required. It will also be necessary to ensure that all the following powersupplies and signals are present which control this part of the receiver circuit:
1. The Control Signal of Antenna switch (see Figure 7-9,10,11 )
2. Vreg 1,2,3 (see Figure 7-7 )
3. 2V85_VCTCXO (see Figure 7-8)
4. 13MHz(see Figure 7-12)
5. CLK, DATA, EN (see Figure 7-13)
6. RX IP, IN, QP, QN (see Figure 7-16,19)
7. Vtune(see Figure 7-17,18)
7. STAND ALONE TEST AND TEST POINTS
- 62 -
7.1.2 Transmitted RF Level and Checks
This section shows the typical RF levels expected throughout the transmitter path. A block diagramshowing the locations of the RF measurement points and levels is shown in Figure 7-5.
Transmitter Testing Set-upTo check the transmitter the following conditions have to be set:
1. Configure the testing equipments as Figure equipment setup.
2. Set the GSM/DCS test equipment to be stand-alone mode (asynchronous mode).
3. Set the BCH and TCH ARFCN ‘62’ for EGSM900 or ‘700’ for DCS1800 on GSM/DCS testequipment.
4. Set the DC power supply 4.0volts.
5. Initialize target on service software.
6. Set TCH and BCH value to be same with GSM/DCS test equipment on service software.
7. Select GSM or DCS mode on service software.
8. Set DAC ‘600’ for EGSM900 or ‘700’ for DCS1800 on service software.
9. Click Test.
Note: All RF values shown are only intended as a guide figure and may differ from readings takenwith other test equipment and leads. Lead and connector losses should always be taken intoaccount when performing such RF measurements.
Testing TransmitterUsing a suitable high frequency probe measure the RF levels at the relevant points shown in Fig. 7-4 and compare your measurements with those shown in the diagram. If there are any majordifference between the readings taken and those indicated then further investigation of thatparticular point will be required. It will also be necessary to ensure that all the following powersupplies and signals are present which control this part of the transmitter circuit:
1. The Control Signal of Antenna Switch(see Figure 7-9, 10, 11)
2. Vreg 1,2,3 (see Figure. 7-7)
3. 2V85_VTCXO (see Figure. 7-8)
4. 13 MHz (see Figure. 7-12)
5. PA_ON, PA_LEVEL, Vapc (see Figure. 7-14)
6. TX IP, IN, QP, QN (see Figure. 7-15)
7. STAND ALONE TEST AND TEST POINTS
- 63 -
7.2 Testing Points
7.2.1 RF components (Component Side)
Figure 7-1. RF components (Component Side).
Table 7-1. RF components
7. STAND ALONE TEST AND TEST POINTS
Reference Reference
U604 RF main chipset U600 Dual RF VCO
U603 Antenna Switch U606 VCTCXO
U601 PAM U602 Balun
N600 Coupler BPF601 GSM RF SAW Filter
U607 NOR Gate BPF600 DCS RF SAW Filter
U629 Inverter SW600 Mobile Switch
U605 LDO D600 Dual Schottky Diode
D601 Varactor Diode D602 Varactor Diode
- 64 -
U604
U600
U601
SW600
N600 D600
D601
U605
U606
U629
D602
U603
U607
BPF600
BPF601
U602
7. STAND ALONE TEST AND TEST POINTS
- 65 -
7.2.2 Test point of Rx Levels
Figure 7-2. Test point of Rx Levels.
1
6
4
3
2
5
2
7. STAND ALONE TEST AND TEST POINTS
- 66 -
GS
M:
CH
.62,
-60
dB
mD
CS
: C
H.6
99, -
60d
Bm
Fig
ure
7-3
. Rec
eive
r R
F L
evel
s
7.2.3 Test point of TX Levels
Figure 7-4. Test point of TX Levels.
7. STAND ALONE TEST AND TEST POINTS
- 67 -
6
12
11
1, 7
2, 8
13 5
4
10
9
3
7. STAND ALONE TEST AND TEST POINTS
- 68 -
GS
M:
Pw
r L
vI 5
, Ch
.62,
-32
dB
mD
CS
: P
wr
LvI
0, C
h.7
00, -
29d
Bm
Fig
ure
7-5
. Tra
nsm
itte
r R
F L
evel
s
7. STAND ALONE TEST AND TEST POINTS
- 69 -
7.2.4 Control signal test points
Figure 7-6. Control signal test points
VC1
VC2
VAPC
LB_SW
HB_SW
TXRX_SW
PA_LEVEL PA_ON CLK, DATA, EN
Vtune
Vtune
I / Q
Regulator 2V85
13MHz
Figure 7-7. 2V85_Vreg 1, 2, 3 Output
Figure 7-8. 2V85_VCTCXO Supply Voltage
7. STAND ALONE TEST AND TEST POINTS
- 70 -
7. STAND ALONE TEST AND TEST POINTS
- 71 -
Figure 7-9. Antenna S/W control voltage in EGSM_TX
Figure 7-10. Antenna S/W control voltage in DCS_TX
VC1VC1VC1
VC2VC2VC2
Figure 7-11. Antenna S/W control voltage in RX
Figure 7-12. 13MHz Clock
7. STAND ALONE TEST AND TEST POINTS
- 72 -
VC1VC1VC1
VC2VC2VC2
7. STAND ALONE TEST AND TEST POINTS
- 73 -
Figure 7-13. CLK, DATA, EN
Figure 7-14. PA_ON, PA_LEVEL, VAPC (GSM Tx Level=7)
CLKCLKCLK
DATADATADATA
ENENEN
Figure 7-15. Tx I / Q Signal
Figure 7-16. Rx I / Q Signal
7. STAND ALONE TEST AND TEST POINTS
- 74 -
7. STAND ALONE TEST AND TEST POINTS
- 75 -
Figure 7-17. PA_ON, Vtune (U600 pin 13, GSM 1CH)
Figure 7-18. PA_ON, Vtune (U600 pin 13, DCS 512CH)
Figure 7-19. RX I/Q Signal(Extended)
7. STAND ALONE TEST AND TEST POINTS
- 76 -
8. DISASSEMBLY INSTRUCTION1. Remove the battery and screws.
Figure 8-1. Removing Screws
8. DISASSEMBLY INSTRUCTION
- 77 -
1
2
8. DISASSEMBLY INSTRUCTION
- 78 -
2. Use a thin plastic sheet to slide and open the gap between front and rear covers, and detachthem carefully with both hands.
3. Then carefully remove the rear cover from the hooks as shown in Figure 8-2.
Figure 8-2. Disassembling covers
4. Unlock the PCB and remove other components as shown in Figure 8-3.
Figure 8-3. Unlocking and removing the PCB
2
1
1
2
8. DISASSEMBLY INSTRUCTION
- 79 -
5. Firstly, insert one side of FPCB carefully into the slot.Then place the PCB under the hook 1 first and push the other end of PCB under the hook 2
Figure 8-4. Assembly of PCB with the cover
2
1
8. DISASSEMBLY INSTRUCTION
- 80 -
6. Remove the antenna and use a sharp awl to push away the antenna-bushing.
Figure 8-5. Removing antenna-bushing
1
2
3
8. DISASSEMBLY INSTRUCTION
- 81 -
7. Use a tweezers to remove the battery locker.
Figure 8-6. Removing battery locker
8. When removing the side button from the main front, please see the insert-nut next to the buttonand carefully remove it.
Figure 8-7. Removing a side button
1
12
3
Insert-nut
8. DISASSEMBLY INSTRUCTION
- 82 -
9. Push away the hinge to remove the folder.
Figure 8-8. Removing Folder
10. Remove the hinge, and detach screw caps by using a pin.
Figure 8-9. Removing hinge and screws
8. DISASSEMBLY INSTRUCTION
- 83 -
11. Use a thin plastic sheet to slide and open the gap between the folders.Then detach them carefully with both hands.
Figure 8-10. Disassembling Folders
12. Finally detach the rest components as shown in Figure 8-11.
Figure 8-11. Disassembly of the rest components
8. DISASSEMBLY INSTRUCTION
- 84 -
9. BLOCK DIAGRAM
- 85 -
9. BLOCK DIAGRAM
9.1 Main BoardThe phones is made up of two PCBs. In lower part of the folder, there is a main board. And in theupper part of the folder, there is a FPCB. Below you can see the block diagram of both PCBs.
Figure 9-1. Main Block diagram.
9. BLOCK DIAGRAM
- 86 -
9.2 FPCB
Figure 9-2. FPCB Block diagram.
9.3 RF
Figure 9-3. RF Block diagram
9. BLOCK DIAGRAM
- 87 -
- 89 -
10. CIRCUIT DIAGRAM
10.1 BB Circuit
(A2)
(D/I)
4
D.S.JUNG
62 3 4
B
A
6
DCD
02.04.11
02.04.11
F
N.S.KIM
LGElectronics Inc
Date
A
7
1 2 3
BASEBAND INTERFACE
Sign & Name
Designer
C
D
B
Name
7
Checked
F
8
1
DrawingNo.
Sheet/Sheets
1/6
A_case
issue
E
5
C
Model
D
8
Approved
Drawing
Notice NO. Data Name
L
(REC_N)
Section
5
E
R12110K
VR2B
47pC107
HS
P11
0
HS
P10
7
R10410K
VBACKUP
R1230R
HS
P10
6D100
CRS08
R1160.2R(1%)
(2012)
HS
P11
8
HS
P11
6
C10547p
12
9B3
7 GND
3 O0
O16
11O2
O3 8
VCC 14
HS
P12
6
MC74VHC126
U102
1 A0
A14
13A2
A3 10
B02
5 B1
B2
24VSS1
13_RES
12_WR
C108
47p
I_LED11718
I_LED219
I_LED3
15LED_EN
MAIN_CS2
MOTOR26
REC+2827
REC-
30SPK+
29SPK-
SUB_CS22
16VBACKUP
21VBAT
VBAT125
1VDD_3.0V
VSS14
J102LG_LCD_CON_30P
A03
CS223
D04
D15
D26
D37
D48
D59
D610
D711
20EL_EN
47RR110 MNR0412345678
HS
P10
2
HS
P11
7
C10122n
HS
P12
9
HS
P12
2 HS
P12
7
C10010u/16V
HS
P11
3
V101
P0402FC12C
VR2B
R10120K
VR2B
NC7SZ32U103
1
2
3
4
5
R1240R
P0402FC12C
V100
VR2B
VBAT
TXTXD
14
5VCHG1VCHG2
4
HS
P10
0
HS
P10
9
3
27 2625
19GND1GND2
12
HANDSFREE2
POWER_ON6
16
RTS20
RX1013
RXD
TCK87
TDI
11TDO
9TMS
15
78
J101
LG-IO_CONN_24P
1AUXGND
AUXI24
17AUXONAUXOP
18
BATT12221
BATT2
23CTS
DSR
1 2
3
4
5
6
10KMNR04R103
12
34
56
HS
P12
0
HS
P10
3
VBAT_2
Q100NDC652P
12345678
R108 4.7R
1M
R114
SN74HC1GU04DCKRU101
2
3
4
5
n.mR113 MNR04
10KR118
0RR119
100n/16VC109
0RR120
HS
P10
8
(2012)
HS
P11
2
HS
P11
4
HS
P12
1
VR2B
BLM15AG121PN1L104
GN
D
IO7
2R
ST
VC
C1
VP
P6
HS
P12
8
R109220R
BLM15AG121PN1L119
LG_AMP_SIM
J100
CLK
3
5
BLM15AG121PN1L113
BLM15AG121PN1L115
BLM15AG121PN1L117
R1150R
HS
P11
9
HS
P11
1
20KR100
HS
P10
4 HS
P51
2
L111
L190 BLM15AG121PN1
VCC_EXT
VCHG
R1170R
BLM15AG121PN1L110
VR2B
BLM15AG121PN1
150pC103
BLM15AG121PN1L108
P04
02F
C12
C
RN1307Q101
GN
D
IN
OU
T
BLM15AG121PN1L106
C110
(1608)1uF
V10
2
R12210K
4.7RR107
HS
P13
7
HS
P51
4
VBAT
100RR105
BLM15AG121PN1L124
L120 BLM15AG121PN1
HS
P13
4
L118 BLM15AG121PN1
C10647p
L114 BLM15AG121PN1
VBAT
L116 BLM15AG121PN1
HS
P10
1
L100BLM15AG100PN1
(2012)
BLM15AG100PN1L102
2345678
C10410u
R111
HS
P51
3
47R MNR04R106
1
L112 BLM15AG121PN1
L103 BLM15AG121PN1
1K
8
L105 BLM15AG121PN1
L107 BLM15AG121PN1
L109 BLM15AG121PN1
R10233K
MNR04R112 47R1234567
HS
P11
5
HS
P10
5 HS
P13
3H
SP
135
HS
P13
6
HS
P13
1H
SP
130
MIDI_CS
SUB_CS
BATT_TEMP
HS
P13
2
_WR
A(1)
A(0)
SPKP
MAIN_CS
SUB_CSA(2)
RPWRON
FOLDER
ON_OFF
VCHG
_CS3
A(2)
A(3)
MAIN_CS
D(0:7)
LCD_RESET
MAIN_BACKLIGHT
I_LED1I_LED2I_LED3
SUB_BACKLIGHT
MOTOREARN
REC_PSPKN
D(0)D(1)D(2)D(3)D(4)D(5)D(6)D(7)
DCD
RTS
RX
TDI
TMS
TXD
PCM_SYNC
PCM_RX
AUX_IN
ICTL
HANDSFREE
SIM_CLKSIM_RST
SIM_VDDSIM_I_O
CTS
TX
AUXOPAUXON
RXD
DTR
RPWRON
TCK
TDO
PCM_TX
PCM_CLK
10. CIRCUIT DIAGRAM
- 90 -
10. CIRCUIT DIAGRAM
F
Drawing
7
Electronics Inc
Designer
1 2 8 9 10
H
Notice NO.
5 6
3
C
Name
12
2 3
4 6
Model
8 9
A
Name
5
Section Date Sign & Name
B
C
Sheet/Sheets
2/6
BASEBAND CHIPSET
10 11
A
LG
12
G
DrawingNo.
H
E
Checked
Approved
D.S.JUNG
N.S.KIM
7
D
Data
100n
11
02.04.11
F
G
4
02.04.11
issue
D
E
1
B
VR2
C223
390RR207
UPR
20PC203
(2012)
C22010u
R281 0R
VBATUPR
270p
C213270p
TP206
0RR280
C211
C227100n
R203
10K
TP
214
FW
E
TM
S
TP221 TP222
C218
100n
nSCS2_TSPEN3G12
niB
OO
TN
1
R205 390R
K6
XD
1_03
_KB
R0
XD
1_04
_KB
R1
M6
P6
XD
1_05
_KB
R2
XD
1_06
_KB
R3
N6
L6X
D1_
07_K
BR
4
X_A
1RX
IR_I
RD
AA
8C
7X
_A4_
TX
IR_I
RD
A
nBH
E_I
_O14
F5
E4
nBLE
_I_O
15
C2
nCS
0_nC
S1_
C3
C1
nCS
2_nC
S3_
D3
nFO
E_X
_A3
E2
E3
nFW
E_X
_A0
D12nRESPWON
E1
VD
D5
VD
DS
_1_1
L14
VD
DS
_1_2
N5
VD
DS
_2A
11
VD
DS
_MIF
0A
4B
6V
DD
S_M
IF1
G1
VD
DS
_MIF
2D
1V
DD
S_M
IF3
VD
DS
_RT
CD
13
VD
D_A
NG
E11
F11
VD
D_P
LL
D14
VD
D_R
TC
N13VDRVDX
P14
VFSRXM13
VS
SO
A14
TSPACT11J13
TSPCLKXJ14
TS
PD
I_I_
O4
H10
TSPDOH11
H13TSPEN0TSPEN1
H12H14
TSPEN2
TX
D_M
CS
I_1_
09L1
0
TX
_IR
DA
C8
B9
TX
_MO
DE
M
N12VCLKRX
VD
D0
A5
B12
VD
D1
VD
D2
N14
VD
D3
P7
M1
VD
D4
TCKB10
A12
TC
XO
EN
TDID10C10
TDO
E9TMS
M12TSPACT00TSPACT01
M14L12
TSPACT02TSPACT03
L13J10
TSPACT04TSPACT05
K11K13
TSPACT06TSPACT07
K12K14
TSPACT08TSPACT09
J11J12
TSPACT10
PW
T_B
UK
7
RF
EN
_NoP
CA
13
RT
S_M
OD
EM
_TO
UT
E8
M10
RX
D_M
CS
I_1_
010
D8
RX
_IR
DA
RX
_MO
DE
MA
9
B2
RnW
_
P9
SC
LK_I
NT
1nS
DI_
SD
AM
9K
8S
DO
_IN
T10
n
SIM_CD_MAS0G11
SIM_CLKF13G13
SIM_IO
F14SIM_PWCTRL_I_O5
G10SIM_RST
F12START_BIT_CLK13M_OUT
KB
C4_
XD
1_02
M5
MCUDIN7M7
MCUDOM8
MCUEN0P8
MCUEN1_I_O8MCUEN2_I_O13
L8
C11
N.C
D11NBSCAN_
B11NEMU0_NEMU1_
E10
NS
CS
0_S
CL
L9 N9
NS
CS
1_X
_A2
ON_OFFF10
C13
OS
C32
K_I
NO
SC
32K
_OU
TB
13L7P
WL_
LTG
ND
8A
10 A7
GN
D9
E12
GN
D_A
NG
GN
D_P
LLE
14
GN
D_R
TC
C14
M2
IDD
Q
INT4n_IT_WAKEUPB14
I_00
1_T
PU
_ID
LEP
3N
3I_
O0_
TP
U_W
AIT
L4I_
O2_
IRQ
4I_
O3_
SIM
_RnW
M4
N2
I_O
7_N
RE
SE
T_O
UT
KB
C0_
NF
IQN
4K
BC
1_N
IRQ
K5
KB
C2_
XD
1_00
L5K
BC
3_X
D1_
01P
5
DATA15B3
D9
DS
R_M
OD
EM
_LP
G
P1EXT_FIQEXT_IRQ
M3
FD
P_n
IAC
KF
4
FS
YN
CH
_MC
SI_
1_01
2K
9
GN
D0
F1
GN
D1
N8
A2
GN
D10
GN
D11
B1
GN
D2
K1
P2
GN
D3
GN
D4
P4
P10
GN
D5
GN
D6
P13
G14
GN
D7
C9
CT
S_M
OD
EM
_XF
B7DATA00
D7DATA01
E7DATA02DATA03
D6A6
DATA04DATA05
C6E6
DATA06DATA07
C5B5
DATA08DATA09
D5E5
DATA10DATA11
B4C4
DATA12DATA13
D4A3
DATA14
K4ADD17ADD18
J5L1
ADD19ADD20
L2
ADD21L3D2
ADD22
AR
MC
LK_B
CLK
RP
11
BC
LKX
_I_O
6N
11
K10BDR
M11BDX
BFSRL11
BFSXP12
C12
CLK
32K
_OU
T
CLK
OU
T_D
SP
_SD
_IR
DA
B8
CLKTCXOE13
N10
CLK
_MC
SI_
1_01
1
F2ADD01ADD02
G5G4
ADD03ADD04
G2G3
ADD05ADD06
H1H3
ADD07ADD08
H2H4
ADD09ADD10
H5J1
ADD11ADD12
J2J3
ADD13ADD14
J4K3
ADD15ADD16
K2
R204 390RU200
CALYPSO
ADD00F3
C229100n
TD
I
C230100n
VR
2B
100nC217
10KR672
R206 390R
VDD_RTC
(1608)
C216 1u
(2012)2.2uC222
0RR2280RR227
120K
R219
TP219
TP
211
VR3
TP
213
0RR231
TC
K
1SS388D200
20KR208
VR2B
GN
D
VR1
C20220P
C226
33n
100n
0RR283
C206
R282 0R
B1VS1VS2
A1
(2012)10u
C219
K3VCC1
D2VCC2
G9VCC3
VCHGE4
H6VCK
VDRK7G6
VDXVFS
G7
VR1BOUTC1
H1VR1OUT
VR2BOUTD1
VR2INE2
E1VR2OUT
D3VR2SEL
H10VR3OUT
F4VREF
K4
TE
N
C8TEST1
B8TEST2
A9TEST3TEST4
B9
TESTRESETZF2
TMSA8
TSCXMB6
TSCYMA6
UDRK6J6
UDX
F5UEN
C3UPR
VAUXA3
J3VBACKUP
VBATE5
H3RESERVED
RESPWRONZF6
A10
RP
WO
N
D7RTC_ALARM
SCLK3C4
B4SCLK5
B2SDIO3
SDIO5D4
SRST3B3
SRST5D5
SVDDA2
SWITCHK2
TCKB7
TDIA7C7
TDO
TD
RJ4
FDBKJ1
K1
GR
ND
1G
RN
D2
C2
G10
GR
ND
3
IBIASG1
E3ICTL
F7INT1INT2
H4
C5LCDSYNC
K9MICBIAS
MICINJ8K8
MICIP
ON_OFFD10
F1
OS
CA
SB
10P
WO
N
RE
FG
ND
F3
G5BFSR
J5BFSX
G4BGTR1
G3BGTR2
G2BGTR3BGTR4
H2J2
BGTR5
C10BULIM
C9BULIP
D9BULQM
D8BULQP
BUZZOPK10
CK
13M
A4
DACF10
EARNH8
EARPH9
E6ADIN3
ADIN4_TSCXPD6
ADIN5_TSCYPC6
F8AFC
AGNDA1J7
F9APC
AUXGNDG8
AUXIH7
AUXONJ10J9
AUXOP
E8BDLIM
E7BDLIP
BDLQME10E9
BDLQP
BDRH5
BDXK5
VR2B
TP216
U201NAUSICA_CS
B5ADIN1
A5ADIN2
RP
WR
ON
VB
AT
1M
VBACKUP
R201220K
UPR
VBACKUP
100nC224
R225
(2012)10uC221
VBAT
100nC228
nBS
CA
N
1nC205
S-817
GND1
IN2
4NC
3OUT
TP205
n.mR221
D2011SS388
U202
n.m
TP
209
TP220
0RR229
VBACKUP
R226
C225100n
C233
1SS388D202
10K
R202
100p
33u/6.3V
V1B
UPR
TP204
A-CASE
C232
VBAT_2
TD
O
R2240R
TP
210
UPR
VDD_RTC
18pC204
TD
O_A
RM
TP
212
VR2B
TP208
1M
R209
VDD_RTC
100n
C231
UPR
10KR220R
222
n.m
220nC215
10K
R22
3
_WR
TP218
(2012)10u
C234
X200MC-146
1
23
4
R21120K
TP217
QNQPINIP
DTRDCD
KEYLIGHT
_WR
PWT
JACK_DETECT
A(0)A(0:22)
PA_ON
RESET_RF
HOOK_DETECT
13MHZ
CLK
D(0:15)
RPWRON
_WR
TXIR_IRDA
_CS2_CS3
SUB_LED1
HANDSFREE
PCM_RX
RX
SUB_BACKLIGHT
EN
PCM_TX
KB
R(0
)K
BR
(1)
KB
R(2
)K
BR
(3)
KB
R(4
)
RXIR_IRDA
D(14)D(15)
PCM_SYNC
MELODY_INTFOLDER
LCD_RESET
KB
C(0
)K
BC
(1)
KB
C(2
)K
BC
(3)
KB
C(4
)
SPK_EN
D(5)D(6)D(7)D(8)D(9)D(10)D(11)D(12)D(13)
A(20)A(21)A(22)
SD_IRDA
PCM_CLK
D(0)D(1)D(2)D(3)D(4)
A(9)A(10)A(11)A(12)A(13)A(14)A(15)A(16)A(17)A(18)A(19)
ON_OFF
A(1)A(2)A(3)A(4)A(5)A(6)A(7)A(8)
MCLK
END_ON_OFF
AFCPA_LEVEL
VCHGICTL
SIM_VDDSIM_I_OSIM_CLKSIM_RST
MICBIAS
MICIPMICINEARPEARNAUXOPAUXON
_CS1
SUB_LED2SUB_LED3
MELODY_RESET
FDP
_BHE_BLE
_CS0
_RD
TDO
TDITMSTCK
AUXI
KBR(0:4)
KBC(0:4)
BATT_TEMPRADIO_TEMP
XO_ENARF_ENA
CTSRXD
RTSTXD
TX
DATA
- 91 -
10. CIRCUIT DIAGRAM
A
B
C
D
E
F
MEMORY DEVICE
issue Notice NO. Data Name
Section Date Sign & Name
B
6
F
C
D
LGElectronics Inc
Model
A
E
02.04.11
D.S.JUNG
N.S.KIM
1 52
Designer
Checked
Approved
43
02.04.11
DrawingName
DrawingNo.
Sheet/Sheets
3/6
4 5
7 8
1 2 3 6 7 8
R301 n.m
R305
VR2
C304
33n
C300
10K
K7
WE_C5
D4WP_
R300 0R
100n
M2M7
NC13NC14
M8
NC2A7A8
NC3NC4
B1B7
NC5NC6
B8
L1NC7NC8
L2L7
NC9
J2OE_
RESET_D5
RY_BY_C4
VDDJ5
K2VSS0VSS1
H5J6
DQ13DQ14
H6J7
DQ15
DQ2G4K4
DQ3DQ4
K5G5
DQ5DQ6
K6G6
DQ7DQ8
H3J3
DQ9
NC0A1A2
NC1
NC10L8M1
NC11NC12
A2
F4A20A21
E5
A3C2D2
A4A5
F3E3
A6A7
C3D6
A8A9
C6
H7BYTE_
CE_H2
DQ0G3K3
DQ1
DQ10H4J4
DQ11DQ12
TC58FVB641
U302
G2A0A1
F2
E6A10A11
F6D7
A12A13
C7E7
A14A15
F7G7
A16A17
D3E4
A18A19
F5
E2
0RR303
C1
NC5F1
F10NC6
G1NC7
G10NC8NC9
L1
OE_H3
D5RESET_
E5RY_BY_
D4UB_
VCCFJ5J6
VCCS
J9VSS0VSS1
G3
C6WE_
C5WP_
DQ4DQ5
K7G7
DQ6DQ7
J8K3
DQ8DQ9
H4
DUG8
DU_CIOSK6
LB_C4
NC0A1
A10NC1
NC10L10M1
NC11NC12
M10
NC2B1
B10NC3NC4
C7E7
A9
BYTE_H9
CE1S_J2D6
CE2S_
H2CEF_
J3DQ0DQ1
G4
J4DQ10DQ11
K5J7
DQ12H7
DQ13K8
DQ14DQ15
H8
K4DQ2DQ3
H5H6
D8E8
A13A14
F8D9
A15A16
G9F4
A17A18
E4D7
A19
A2E2
A20E6E9
A21
A3D2
A4F3E3
A5A6
D3C3
A7A8
U301
TH50VSF4683
A0G2F2
A1
A10F7C8
A11A12
TP301
VR2
100n
C301
0RR302
VR2
D(5)
_CS2
_CS0
A(4)
A(8)A(9)A(10)A(11)A(12)A(13)A(14)A(15)A(16)A(17)A(18)A(19)A(20)A(21)A(22)
_BHE
A(5)A(6)A(7)A(8)A(9)
A(10)A(11)A(12)A(13)A(14)A(15)A(16)A(17)A(18)A(19)A(20)A(21)
A(1:22)
A(22)
A(1)A(2)A(3)
A(5)A(6)A(7)
D(1)D(2)D(3)D(4)
D(6)D(7)D(8)D(9)D(10)D(11)D(12)D(13)D(14)D(15)
A(1)A(2)A(3)A(4)
_BLE
FDP
_CS1_RD_WR
D(0)D(1)D(2)D(3)D(4)D(5)D(6)D(7)D(8)D(9)
D(10)D(11)D(12)D(13)D(14)D(15)
D(0:15)
D(0)
- 92 -
10. CIRCUIT DIAGRAM
Sign & Name
2 3 5
6
7 8
1 3 4
D
E
Drawing
issue
Receiver
D.S.JUNG
A
N.S.KIM
Data
DrawingNo.
Checked
A0
4/6
Headset jack
2
LG
Speaker
Electronics Inc
Model
02.04.11
7 8
Date
4
_RDIOVDD
C
NC
MT
R
LED
Microphone
6
Name
_CS
Sheet/Sheets
Approved
B
F
C
A
02.04.11
Section
B
Notice NO.
D
E
F
Designer
Name
5
1
AUDIO
HSP405
VR3
HSP404
4.7RR408
100nC408
P0402FC05C
V401
R407
1M
R4197.5K
n.mC403
47pC407
n.mR422
VR3
100n
VCC_EXT
HSP401
VR3
150KR450
C413
10nC419
R4183.3K
R4021.2K
V400
P0402FC05C
C41147p
10K
R417
1nC426
C414
HSP402
C410
4.7RR410
47p
VBAT
9001-8905-040J400
1
2
34
33p
47pC406
C404100n
C427
V403
P0402FC05C
HSP400
47p
100RR420
R41539K
R41682K
R421 0R
2.4K
R401(2012)
C40110u
47p
MIC400
OB-22S40-C33
1KR400
C400
KDS160EMAX4599U404
1
2
3
45 6
3
8SD_
6SENSE_ADJ
4VIN VOUT
5
18K
R404
VR3
D401
U401
SI9182
CNIOSE12
DELAY ERROP_7
GND
-2
1
5
HSP406
47pC402
C42118p
MAX9075U400
3+
4
47pC423
47pC422
C4172.2u
HSP403
C424100n
(2012)
47p
HSP407 1
2
C405
C412
100n
47p
1M
R405
C425
220nC416
47p
C41822n
45
6
HSP4081
2
C415
7V
DD
VR
EF
98V
SS
28WR_
VR2B
VR3
U402MAX4624
+
2
-31
1213
EQ2EQ3
14
2
19
HPOUT-L1011
HPOUT-R
5
PLL
C6
31
29
32
SPOUT11718
SPOUT2
15SPVDDSPVSS
16
30
U403YMU762
-IR
Q3
-RS
T4
CLK
11
27D
0D
126
D2
25
D3
24
D4
23 22D
5D
621 20
D7
EQ1
P0402FC05C
V402
4.7RR409
R41433K
390pC420
C40947p
D(5
)D
(6)
D(7
)
D(0:7)
VIBRATOR
SUB_LED1
JACK_DETECT
HOOK_DETECT
_WR
D(0
)D
(1)
D(2
)D
(3)
D(4
)
ON_OFF
MICBIAS
MICIP
MICIN
AUX_INAUXOP
AUXI
EARNEARN
SPK_EN
REC_P
EARP
JACK_DETECT
MELODY_INTMELODY_RESET
MCLK
_RD
MIDI_CS
SPKNSPKP
A(1)
- 93 -
10. CIRCUIT DIAGRAM
FOLDER SWITCH
E
PROTECTION
Approved
Date
6
B
C
8
1
Data
A
Checked
SUB LCD BACKLIGHT
No.
Sheet/Sheets
4 52
Electronics Inc
A
Model
D
02.04.11
02.04.11
Name
Section
3
E
4
Drawing
7
DOME SWITCH
5/6
1
8
Name
issue
B
VIBRATOR
Notice NO.
LOCKUP
D.S.JUNG
N.S.KIM
Drawing
7
FSign & Name
2
D
5 6
X21
3
C
KEYPAD BACKLIGHT
Designer
MAIN LCD BACKLIGHT
LG
MMI
F
SW518
HSP500
1 2
SW523DOWN
D51
1
SEND
SW5148
SW501MAIL
56p
C502
10K
R50810K
SW5119
C500100n
R513
R519
F3SW519
F1SW508
P0402FC12CV405
V406P0402FC12C
47K
OUT
HS
P51
6
12
P04
02F
C12
CV
404
SW5091
RN1307Q502
GND
IN
SW500A3212
123
D51
4
D52
0
SW5043
D51
9
6
27RR502
100NL502
R517
4.7R
2
D51
5
Q500
IMX9
12
3
4
5
HSP507
VBAT
HS
P51
5
1
R50910K
R505100K
0SW516
V40
7P
0402
FC
12C
SW5032
HSP502
1 2
HSP501
1 2
D50
9
HSMR-C197
D51
8
D51
7
HSP508
10KR512
R5180R
C504100n
6
SW512F2
HSP506
1.5KR520
5SW506 SW507
R51633R
HSP511
1 2
VR2B
VR2B
VBAT
SW517#
6.2KR510
62R
RN1307Q504GND
IN
OUT
Q503RN1307
GND
IN
OUT
END-ON/OFFSW526
HSP504
1 2
R531
C5031u
R50327R
2
3
1
100KR521
VBAT
(1608)C505
Q506
2SC5585TL
4
56
D50
6
100n
D51
2
U502MAX4599
1
2
3
1 2
7SW510
HSP510
SW515
*
LEFTSW520
UPSW522
HSP503
D50
0
ISS302D521
12
3
L500100N
D50
3
D50
2
D50
1
D50
5
D50
4
D50
8
D51
6
SW524CFM
VBAT
100KR501
D51
3
SW502
SIDE_KEY
CO43
VD
1VMVU
2
HSP505
D51
0
R532
VBAT
4SW505
R533 n.m
D50
7
27R
U501CIM-80S7B
7GND
1LEDALEDK
2
RXD45
SD
3TXD
VCC6
SW521RIGHT
1.5KR500
KBR(3)
KBR(2)
HSP509
R504270R
180RR530
SUB_LED1SUB_LED2
I_LED2
I_LED3
I_LED1
VIBRATOR
PWT
KBR(1)
KB
C(4
)
KBR(0:4)
ON_OFF
VCHG
KBC(0:4)
KB
C(0
)
KBR(0)
KB
C(1
)
KB
C(2
)
KB
C(3
)
RXIR_IRDASD_IRDA
TXIR_IRDA
FOLDER
MOTOR
END_ON_OFF
KBR(4)
KEYLIGHT
MAIN_BACKLIGHT
SUB_LED3
LB_HP
B
0
Drawing
8
Model
1
Drawing
HBSW
Name
Sheet/Sheets
issue
Date
D
2
1
C
1
1
A
Data Name
02.04.11
No.LGElectronics Inc
4 5
B
Section
02.04.11
D
3
1
1
86 7
C
0
7
1
LB_LP
5
Designer
0
Sign & NameF
A
Checked
6
E
F
Y.M.CHO
D.H.KIM
Approved
3 4
E
LBSW
RF MAIN
10
TXRXSW
0
0
Notice NO.
HB_LP HB_HP
2
6/6
C681
1KR631
R6100R
R6473.3N
4.7p
C660 3.3p
R6754.7k
1KR629
27p
1nC619
C639n.m
18RR600
C62
0
5.6n(1608)
C600
47p
C673
L609
3.9N
1n
100nC623
R6382.2K(1%)
C66
6
100nC698
C6111.5p
C684n.m
12n(3216)
C6701.2n
C614
C671
51RR608
R6441.5K
330p
n.mC
622
27p
C602
1n
TP610
R633
12p
C601
10nC665
U629
2
3
4
5
SAFSD1G84CB0T00R00
BPF600
1
2
3
4
5
6
C630
SN74HC1GU04DCKR
C62927P n.m
3pC662
C63
3
1.2K
R62
1
R616n.m 51R
R617
100n
C67912p
VBAT
n.mR676
C6457p
(1608)1.2n
C672
12GND3
7
GND4
14
GND5
10GSM_SW
6H_H_PWR
4H_L_PWR
1L_H_PWR
3L_L_PWR
8PWR_SW
11VCC
13VT
120RR622
C609ENFVZ4L07
U600
9DCS_SW
2GND1
5GND2
C643
R601300R
47p
33u/6.3VA-CASE
7p
SW600MHC-173
12
3456
C636
C638 100n
9.76K(1%)R634
C647 100n
100nC641
2.2uC661
(2012)
R637
P-CASE
C6354.7u
R6421K
1K
100nC648
47p
1.2pC613
470u
1KR657
C608
5
6
78
C603
2.2K
R61
5
U607NC7WZ02
1
2
34
4.7p
C63
2
R61
9n.
m34
VCC1
VCC103
VCC238
VCC342
VC
C4
52
VC
C5
63 55V
CC
6
22V
CC
733
VCC8VCC9
15
VR4IN10
VR
EG
149
VREG27
62V
RE
G3
58R
2
R3
60
17R
ES
ET
Z
RX
LON
5354R
XLO
P28
RX
MIX
IN
27R
XM
IXIP
26R
XM
IXQ
NR
XM
IXQ
P25 29
TE
ST
VC
O
TXRX-SW2
59T
XR
XC
P
48VAPC
VB
AT
150
VBAT26
VB
AT
361
GN
DT
XC
P56
GSMLNAN3736
GSMLNAP
1HB-SW
IN20 21
IP
LB-S
W64
MAINCP54
MAINSPUP1
57M
AIN
SP
UP
2
MAINVCO35
51O
MIX
RF
PCSMIXN4140
PCSMIXP
18Q
N19
QP
14AUXCP
AU
XV
CO
N2423
AU
XV
CO
P
32B
AN
DG
AP
BIA
SR
EF
31
11CLK
CRF16
12DATA
44DCSLNANDCSLNAP
43
30D
EC
RX
MIX
DETD4645
DETR
EN13
FILT47
GNDLNAN39
C627
U604
TRF61508APC
9APCEN
100nC663
1n
1KR635
L6323.3N
R6462.2K
n.mC606
BPF601SAFSD942MCL0T00R00
1
2
3
4
5
6
R604 1K
HVC369BD601
2AN
1CAT
LDB32942M05D-429U602
8DCS
1GND1
3GND2
2 GSM4 NC1
6NC2
7OUTN
5OUTP
2.7NL603
R6780R
C66
7
R656 1K
LDC15D190A0007AN600
1
2 3
4
5
67
8
1n
1nC625
(1608)
12nC615
(3216)
680RR674
C6741n
(2012)
100nC683
(2012)
C6872.2u
10pR603
100RR606
ANT600ANT_PAD_LGX
0RL600
L60112n
ADP3330_2V85U605
3-ERR
6-SD G
ND
4
2IN
5NR
1OUT
33R
R62
0
0.5p
C6801n
n.m
L6116.8N
C690
3.3pC658
R623
VBAT
1.2nC691
CA
T
PF08122BU601 9
GN
D1
10G
ND
2
8PIN_DCS
1PIN_GSM
5POUT_DCS
4POUT_GSM
2V
AP
C7
VC
TL
3
VD
D1
6
VD
D2
R6362.7K(1%)
300RR602
HVB387BWKD602
1
A1
2
A2
3
C649
3p
12pC605
100n
R607100R
C675
VBAT
C657
C646 100n
1n
0RR632
1KR625
n.mC612
1MR643
620KR624
L602 2.7N15pC642
100n
C63
4
n.mR640
1n
L60518N
VBAT
R677 0R
C628
2.2uC624
(2012)
n.m R641390R(1%)
6.8NL612
R6090R
C678
R630 1K
27p
C62
1
4.7uP-CASE
3.3NL608
C604
C626
4
R6261K
R64910R
27p
C637
BAT15-099D600
1
2
3
VC-TCXO-208CU606
1CTL
2GND
3OUT
4
VCC
39p
C66
910
0n
12p
TH60122K_NTC
L635 4.7N
2.2KR648
C686
n.m
68RR605
R673270k
C610
C6824.7p
GND211
GND39
GND45
GND53
GND6
1
VC
1
7
VC
2
C685100n
18NL606
SHS-M090BU603
4
AN
T
6 DCS_RX
8 DCS_TX
2 EGSM_RX
10EGSM_TX
13GND1
12
n.mC640
C66
8
3.3NL633
C692 1n
100n2.2uC664
(2012)
n.mR679
1KR645
RADIO_TEMP
VR2B
LBSW
TXRXSWHBSW
VREG3
HBSW
TXRXSW
LBSWVREG3
VR3
RF_ENA
XO_ENA
AFC
RESET_RF
13MHZ
CLKDATA
EN
QNQP
PA_ONPA_LEVEL
INIP
- 94 -
10. CIRCUIT DIAGRAM
10.2 RF Circuit
- 95 -
11. PCB LAYOUT
11.1 TOP
11. PCB LAYOUT
- 96 -
11. PCB LAYOUT
11.2 BOTTOM
- 97 -
12. EXPLODED VIEW & REPLACEMENT PART LIST
12.1 Exploded View
12. EXPLODED VIEW & REPLACEMENT PART LIST
M27
M28M31 M32
M29
M25
M2
M34
M35
M5
M6M7
M8
M4
M10
M14
M15
M12 M13
M16
M19
M17
M22
M20
M23M26
M11
M18M21 M24
M9
M30
M3M1
M33
- 98 -
< Parts List Of Exploded View >
12. EXPLODED VIEW & REPLACEMENT PART LIST
No. Location No. Part No. Description QTY Specification Color Sevice RemarkM1 MWAF00 MWAF0005701 WINDOW,LCD(SUB) 1 G7020 G7028 Common use (ALL BRAND) YM2 ACGJ00 ACGJ0016302 COVER ASSY,FOLDER(UPPER) 1 Cobalt Blue Y
ACGJ0016301 COVER ASSY,FOLDER(UPPER) 1 Metal Silver YACGJ0016303 COVER ASSY,FOLDER(UPPER) 1 Red Y
M3 MHFD00 MHFD0002101 HINGE,FOLDER 1 G7000 5 PHI YM4 SVLM00 SVLM0003701 LCD MODULE 1 128*160, 96*64 ,32.05*40.20 ,39.5*58.7*6.4(t), 65K COLOR LCD YM5 SUSY00 SUSY0006001 SPEAKER 1 ASSY ,8 ohm,86 dB,15 mm,G7000 SPEAKER YM6 SACY00 SURY0004501 RECEIVER 1 YM7 SJMY00 SJMY0002801 VIBRATOR,MOTOR 1 3.0 V,80 mA,12*15 ,height 2.7+0.1T YM8 SBCL00 SBCL0001001 BATTERY,CELL,LITHIUM 1 3 V,1.2 mAh,COIN ,ASAHI BATTERY (ML414NB/F9D) YM9 SACY00 SACY0004601 PCB ASSY,FLEXIBLE 1 G7000 Receiver YM10 SACY01 SACY0004501 PCB ASSY,FLEXIBLE 1 G7000 LCD YM11 ACGH00 ACGH0006702 COVER ASSY,FOLDER(LOWER) 1 Cobalt Blue Y
ACGH0006703 COVER ASSY,FOLDER(LOWER) 1 Metal Silver YACGH0006704 COVER ASSY,FOLDER(LOWER) 1 Red Y
M12 GMZZ00 GMZZ0003201 SCREW MACHINE 2 3.5 mm,3.5 mm,MSWR3(FN) ,N ,STR ,- , M1.7X3.5 DIA3.5 YM13 MCCH00 MCCH0003902 CAP,SCREW 2 Cobal Blue Y
MCCH0003903 CAP,SCREW 2 Metal Silver YMCCH0003904 CAP,SCREW 2 Red Y
M14 MBHY00MBHY0003503 BUMPER 1 LG-510,511,512,common use for METALIC SILVER,diameter=2.4
Cobalt BlueYMetal Silver
MBHY0003505 BUMPER 1 LG-510,511,512,common use, diameter=2.4 Red YM15 MWAC00 MWAC0021401 WINDOW,LCD 1 65K COLOR (LG Brand) YM16 ABGC00 ABGC0000701 BUTTON ASSY,SIDE 1 G7000 YM17 ACGK00 ACGK0014702 COVER ASSY,FRONT 1 Cobalt Blue Y
ACGK0014703 COVER ASSY,FRONT 1 Metal Silver YACGK0014704 COVER ASSY,FRONT 1 Red Y
M18 MDAC00 MDAC0005001 DECO,SIDE 2 G7000 YM19 MCCC00 MCCC0003502 CAP,EARPHONE JACK 1 G7000 Pearl White Color Cobalt Blue Y
MCCC0003501 CAP,EARPHONE JACK 1 Metal Silver YMCCC0003503 CAP,EARPHONE JACK 1 Red Y
M20 ABGA00 ABGA0000901 BUTTON ASSY,DIAL 1 OK key + i (English version) YM21 ADCA00 ADCA0006001 DOME ASSY,METAL 1 G7000 YM22 SAKY00 SAKY0001101 PCB ASSY,SIDEKEY 1 G7000 YM23 SAFY00 SAFY0050102 PCB ASSY,MAIN 1 65K color PCB ASSY MAIN YM24 SUMY00 SUMY0003503 MICROPHONE 1 FPCB,-40 dB,6*1.8,TOLERANCE +-2 YM25 MLEA00 MLEA0003802 LOCKER,BATTERY 1 Cobalt Blue Y
MLEA0003803 LOCKER,BATTERY 1 Metal Silver YMLEA0003804 LOCKER,BATTERY 1 Red Y
M26 MWAZ00 MWAZ0001701 WINDOW 1 G7000 IrDA YM27 ACGM00 ACGM0011902 COVER ASSY,REAR 1 Cobalt Blue Y
ACGM0011903 COVER ASSY,REAR 1 MetalSilver YACGM0011904 COVER ASSY,REAR 1 Red Y
M28 SNGF00 SNGF0000702 ANTENNA,GSM,FIXED 1 1.5 ,-2.5 dBd,P426C ,G7000 ANTENNA Cobalt Blue YSNGF0000701 ANTENNA,GSM,FIXED 1 1.5 ,-2.5 dBd,P427 ,G7000 ANTENNA (PANTONE 427C) Metal Silver YSNGF0000702 ANTENNA,GSM,FIXED 1 1.5 ,-2.5 dBd,P426C ,G7000 ANTENNA Red Y
M29 ACFY00 ACFY0000701 CONTACT ASSY,ANTENNA 1 G7000 YM30 MCCF00 MCCF0002002 CAP,MOBILE SWITCH 1 LG-510,511,512 Cobalt Blue Y
MCCF0002003 CAP,MOBILE SWITCH 1 LG-510,511,512 Metal Silver YMCCF0002005 CAP,MOBILE SWITCH 1 LG-510,511,512 Red Y
M31 GMZZ00 GMZZ0003201 SCREW MACHINE 2 3.5 mm,3.5 mm,MSWR3(FN) ,N ,STR ,- , M1.7X3.5 DIA3.5 YM32 SBPP00 SBPP0005103 BATTERY PACK,LI-POLYMER 1 3.7 V,820 mAh,1 CELL,PRISMATIC ,G7000-BATTERY PACK (CB) Cobalt Blue Y
SBPP0005102 BATTERY PACK,LI-POLYMER 1 3.7 V,820 mAh,1 CELL,PRISMATIC ,G7000-BATTERY PACK (SV) Metal Silver YSBPP0005104 BATTERY PACK,LI-POLYMER 1 3.7 V,820 mAh,1 CELL,PRISMATIC ,G7000-BATTERY PACK (RD) Red Y
M33 MTAE00 MTAE0004901 TAPE,WINDOW(SUB) 1 G7020 G7028 Common use YM34 MCCZ00 MCCZ0002702 CAP 1 Cobalt Blue Y
MCCZ0002703 CAP 1 Metal Silver YMCCZ0002704 CAP 1 Red Y
M35 ACGG00 ACGG0021702 COVER ASSY,FOLDER 1 Cobalt Blue YACGG0021701 COVER ASSY,FOLDER 1 Metal Silver YACGG0021703 COVER ASSY,FOLDER 1 Red Y
- 99 -
12. EXPLODED VIEW & REPLACEMENT PART LIST
12.2 Accessories
Portable Handsfree Travel Adapter
Cigar Lighter Adapter Data-cable
< Accessories >No. Location No. Part No. Description QTY Specification Color Service Remark2 SGEY00 SGEY0002901 EAR PHONE/EAR MIKE SET 1 EG890B, G5200 3P EAR MIC (EM-412GS) Yes2 SSAD00 SSAD0007806 TRAVEL ADAPTOR,AC-DC 1 100-240V, 50/60 Hz,5.2 V,850 mA,CE (Europe: TA-20G) Yes
SSAD0007807 TRAVEL ADAPTOR,AC-DC 1 100-240V, 50/60 Hz,5.2 V,850 mA,CE (Russian(CIS): TA-20GR) Yes2 SGCC00 SGCC0001802 CIGARETTE LIGHT ADOPTER 1 CLA (CLA-20G) Yes2 SGDY00 SGDY0004401 DATACABLE 1 (DK-20G) Yes
- 100 -
12. EXPLODED VIEW & REPLACEMENT PART LIST
12.3REPLACEMENT PARTS
<Mechanic components>Level Location No. Part No. Description QTY Specification Service Color Remark
3 ABGA00 — BUTTON ASSY,DIAL 1 Please refer to the 'Exploded View' Y M203 ACGG00 — COVER ASSY,FOLDER 1 Please refer to the 'Exploded View' Y Cobalt Blue M353 ACGG00 — COVER ASSY,FOLDER 1 Please refer to the 'Exploded View' Y Metal Silver3 ACGG00 — COVER ASSY,FOLDER 1 Please refer to the 'Exploded View' Y Red4 ACGH00 — COVER ASSY,FOLDER(LOWER) 1 Please refer to the 'Exploded View' Y Cobalt Blue M114 ACGH00 — COVER ASSY,FOLDER(LOWER) 1 Please refer to the 'Exploded View' Y Metal Silver4 ACGH00 — COVER ASSY,FOLDER(LOWER) 1 Please refer to the 'Exploded View' Y Red5 MBHY00 — BUMPER 2 Please refer to the 'Exploded View' Y M144 MCCH00 — CAP,SCREW 2 Please refer to the 'Exploded View' Y Cobalt Blue M134 MCCH01 — CAP,SCREW 2 Please refer to the 'Exploded View' Y Metal Silver4 MCCH02 — CAP,SCREW 2 Please refer to the 'Exploded View' Y Red5 MCJH00 MCJH0004203 COVER,FOLDER(LOWER) 1 N5 MDAF00 MDAF0000702 DECO,FOLDER(LOWER) 1 N Cobalt Blue5 MDAF00 MDAF0000703 DECO,FOLDER(LOWER) 1 N Metal Silver5 MDAF00 MDAF0000704 DECO,FOLDER(LOWER) 1 N Red5 MDAH01 MDAH0000201 DECO,RECEIVER 1 G7000 N5 MFBB00 MFBB0001901 FILTER,RECEIVER 1 G7000 N5 MPBG00 MPBG0004801 PAD,LCD 1 G7000 N5 MPBJ00 MPBJ0003201 PAD,MOTOR 1 G7000 N5 MTAA00 MTAA0006801 TAPE,DECO 1 G7000 RECEIVER N Pearl White5 MTAA00 MTAA0006501 TAPE,DECO 1 G7000 FOLDER(LOWER) N Metal Silver5 MTAA00 MTAA0006401 TAPE,DECO 1 G7000 FRONT N Red5 MTAA01 MTAA0006501 TAPE,DECO 1 G7000 FOLDER(LOWER) N Pearl White5 MTAA01 MTAA0006801 TAPE,DECO 1 G7000 RECEIVER N Metal Silver5 MTAA01 MTAA0006701 TAPE,DECO 2 G7000 SIDE N Red5 MTAD00 MTAD0010301 TAPE,WINDOW 1 NITTO No.5000NS (t=0.16) N4 ACGJ00 — COVER ASSY,FOLDER(UPPER) 1 Please refer to the 'Exploded View' Y Cobalt Blue M24 ACGJ00 — COVER ASSY,FOLDER(UPPER) 1 Please refer to the 'Exploded View' Y Metal Silver4 ACGJ00 — COVER ASSY,FOLDER(UPPER) 1 Please refer to the 'Exploded View' Y Red5 ADBY00 ADBY0001202 DECO ASSY 1 Y Cobalt Blue5 ADBY00 ADBY0001201 DECO ASSY 1 PROJECTION ASSY (RUSSIA) Y Metal Silver5 ADBY00 ADBY0001203 DECO ASSY 1 Y Red6 MDAE00 MDAE0009802 DECO,FOLDER(UPPER) 1 N Cobalt Blue6 MDAE00 MDAE0009801 DECO,FOLDER(UPPER) 1 PROJECTION N Metal Silver6 MDAE00 MDAE0009803 DECO,FOLDER(UPPER) 1 N Red6 MFBC00 MFBC0001901 FILTER,SPEAKER 1 G7010,G7020 COMMON USE N6 MTAA00 MTAA0016601 TAPE,DECO 1 UPPER DECO(LEATHER ASSY) N5 MCCZ00 — CAP 1 Please refer to the 'Exploded View' Y Cobalt Blue M345 MCCZ00 — CAP 1 Please refer to the 'Exploded View' Y Metal Silver5 MCCZ00 — CAP 1 Please refer to the 'Exploded View' Y Red5 MCJJ00 MCJJ0010202 COVER,FOLDER(UPPER) 1 N Cobalt Blue5 MCJJ00 MCJJ0010201 COVER,FOLDER(UPPER) 1 G7028 (EASTCOM BRAND) N Metal Silver5 MCJJ00 MCJJ0010203 COVER,FOLDER(UPPER) 1 N Red5 MDAE00 MDAE0008403 DECO,FOLDER(UPPER) 1 W7020 LG-COLOR DISPLAY (RUSSIA) N5 MDAY00 MDAY0004201 DECO 1 G7020 G7028 Common use (SUS) N5 MIAA00 MIAA0006701 INDICATOR,LED 1 G7020 G7028 COMMON USE N5 MICA00 MICA0001201 INSERT,FRONT 2 LG-G510,511,512 common use, DIA = 1.7mm+2.3t N5 MMAA00 MMAA0000901 MAGNET,SWITCH 1 G7000 12x2x0.7t N5 MPBQ00 MPBQ0005501 PAD,LCD(SUB) 1 G7010 & G7020 SUB LCD PAD N5 MPBZ00 MPBZ0017401 PAD 1 G7010, G7020 INDICATOR PAD (Common use) N5 MPFD00 MPFD0001001 PLATE,GROUND 1 G7010 N5 MTAA00 MTAA0015501 TAPE,DECO 1 G7020 folder uppper (Electro Forming) ) N5 MTAA01 MTAA0015601 TAPE,DECO 1 G7020 FOLDER UPPER SUS (#615 OR#668) N5 MTAE00 — TAPE,WINDOW(SUB) 1 Please refer to the 'Exploded View' Y M335 MTAZ00 MTAZ0005401 TAPE 1 G7000 MAGNET SWITCH N
- 101 -
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level Location No. Part No. Description QTY Specification Service Color Remark4 ACGK00 — COVER ASSY,FRONT 1 Please refer to the 'Exploded View' Y Cobalt Blue M174 ACGK00 — COVER ASSY,FRONT 1 Please refer to the 'Exploded View' Y Metal Silver4 ACGK00 — COVER ASSY,FRONT 1 Please refer to the 'Exploded View' Y Red5 ABGC00 — BUTTON ASSY,SIDE 1 Please refer to the 'Exploded View' Y M165 MCCC00 — CAP,EARPHONE JACK 1 Please refer to the 'Exploded View' Y Cobalt Blue M195 MCCC00 — CAP,EARPHONE JACK 1 Please refer to the 'Exploded View' Y Pearl White5 MCCC00 — CAP,EARPHONE JACK 1 Please refer to the 'Exploded View' Y Red5 MCJK00 MCJK0006602 COVER,FRONT 1 N Cobalt Blue5 MCJK00 MCJK0006603 COVER,FRONT 1 N Metal Silver5 MCJK00 MCJK0006604 COVER,FRONT 1 N Red5 MDAC00 — DECO,SIDE 2 Please refer to the 'Exploded View' Y M185 MDAG00 MDAG0000902 DECO,FRONT 1 N Cobalt Blue5 MDAG00 MDAG0000903 DECO,FRONT 1 N Metal Silver5 MDAG00 MDAG0000904 DECO,FRONT 1 N Red5 MICA00 MICA0001201 INSERT,FRONT 4 LG-G510,511,512 common use, DIA = 1.7mm+2.3t N5 MPBH00 MPBH0001101 PAD,MIKE 1 G7000 FRONT N5 MTAA00 MTAA0006401 TAPE,DECO 1 G7000 FRONT N5 MTAA01 MTAA0006701 TAPE,DECO 2 G7000 SIDE N4 GMZZ00 — SCREW MACHINE 2 Please refer to the 'Exploded View' Y M124 MGAD00 MGAD0006001 GASKET,SHIELD FORM 2 G7000 10x5x1.5t N 4 MHFD00 — HINGE,FOLDER 1 Please refer to the 'Exploded View' Y M34 MTAB00 MTAB0005101 TAPE,PROTECTION 1 G7000 FOLDER UPPER PROTECTION TAPE Y4 MTAB01 MTAB0005001 TAPE,PROTECTION 1 G7000 MAIN LCD WINDOW PROTECTION TAPE N4 MTAB02 MTAB0005201 TAPE,PROTECTION 1 G7000 sublcd window tape N4 MWAC00 — WINDOW,LCD 1 Please refer to the 'Exploded View' Y M154 MWAF00 — WINDOW,LCD(SUB) 1 Please refer to the 'Exploded View' Y M14 SACY00 — PCB ASSY,FLEXIBLE 1 Please refer to the 'Exploded View' Y M95 SACY00 — RECEIVER 1 Please refer to the 'Exploded View' Y M65 SBCL00 — BATTERY,CELL,LITHIUM 1 Please refer to the 'Exploded View' Y M85 SJMY00 — VIBRATOR,MOTOR 1 Please refer to the 'Exploded View' Y M75 SPCY00 SPCY0007304 PCB,FLEXIBLE 1 POLYI ,0.3 mm,DOUBLE ,G7000 Receiver N5 SUSY00 — SPEAKER 1 Please refer to the 'Exploded View' Y M54 SACY01 — PCB ASSY,FLEXIBLE 1 Please refer to the 'Exploded View' Y M105 ENBY00 ENBY0011001 CONNECTOR,BOARD TO BOARD 1 30 PIN,0.5 mm,STRAIGHT , ,B to B CNT (SOCKET) N5 ENBY01 ENBY0010901 CONNECTOR,BOARD TO BOARD 1 30 PIN,0.5 mm,STRAIGHT , ,B to B CNT (HEAER) N5 SPCY00 SPCY0007202 PCB,FLEXIBLE 1 POLYI ,0.3 mm,DOUBLE ,G7000 LCD N4 SPCY00 SPCY0013401 PCB,FLEXIBLE 1 FR-1 ,0.07 mm,DOUBLE ,GND FPCB N4 SVLM00 — LCD MODULE 1 Please refer to the 'Exploded View' Y M43 ACGM00 — COVER ASSY,REAR 1 Please refer to the 'Exploded View' Y Cobalt Blue M273 ACGM00 — COVER ASSY,REAR 1 Please refer to the 'Exploded View' Y Metal Silver3 ACGM00 — COVER ASSY,REAR 1 Please refer to the 'Exploded View' Y Red4 ACFY00 — CONTACT ASSY,ANTENNA 1 Please refer to the 'Exploded View' Y M295 MBIA00 MBIA0000301 BUSHING,ANTENNA 1 G7000 (KS-D-5101 C3603B ), N3 MCCF00 MCCF0002002 CAP,MOBILE SWITCH 1 Please refer to the 'Exploded View' Y Cobalt Blue M303 MCCF01 MCCF0002003 CAP,MOBILE SWITCH Please refer to the 'Exploded View' Metal Silver3 MCCF02 MCCF0002005 CAP,MOBILE SWITCH Please refer to the 'Exploded View' Red5 MCIA00 MCIA0003701 CONTACT,ANTENNA 1 G7000 N4 MCJN00 MCJN0005402 COVER,REAR 1 N Cobalt Blue4 MCJN00 MCJN0005403 COVER,REAR 1 N Metal Silver4 MCJN00 MCJN0005404 COVER,REAR 1 N Red4 MGAD00 MGAD0011901 GASKET,SHIELD FORM 1 (2.8X7.5X0.3t) N4 MGAD01 MGAD0012001 GASKET,SHIELD FORM 1 (6.0X6.0X3.0t) N4 MIDZ00 MIDZ0008001 INSULATOR 1 G7000 BB INSULATOR N4 MIDZ01 MIDZ0008101 INSULATOR 1 G7000 RF INSULATOR N4 MLEA00 — LOCKER,BATTERY 1 Please refer to the 'Exploded View' Y Cobalt Blue M25
- 102 -
Level Location No. Part No. Description QTY Specification Service Color Remark4 MLEA00 — LOCKER,BATTERY 1 Please refer to the 'Exploded View' Y Metal Silver4 MLEA00 — LOCKER,BATTERY 1 Please refer to the 'Exploded View' Y Red4 MPBH00 MPBH0001201 PAD,MIKE 1 G7000 BACK N4 MSAZ00 MSAZ0007603 SHEET 1 FDK Company(PE72 11.0*11.0*0.25t) N4 MSAZ01 MSAZ0007602 SHEET 1 FDK Company (PE72 4.2*11.8 0.25t) N4 MSDB00 MSDB0001701 SPRING,COIL 1 G7000 N4 MWAZ00 — WINDOW 1 Please refer to the 'Exploded View' Y M263 ADCA00 — DOME ASSY,METAL 1 Please refer to the 'Exploded View' Y M213 GMZZ00 — SCREW MACHINE 4 Please refer to the 'Exploded View' Y M313 MLAK00 MLAK0006301 LABEL,MODEL 1 LG (30.5x21.54-1R) Y3 SAKY00 — PCB ASSY,SIDEKEY 1 Please refer to the 'Exploded View' Y M223 SUMY00 — MICROPHONE 1 Please refer to the 'Exploded View' Y M242 SBPP00 — BATTERY PACK,LI-POLYMER 1 Please refer to the 'Exploded View' Y Cobalt Blue M322 SBPP00 — BATTERY PACK,LI-POLYMER 1 Please refer to the 'Exploded View' Y Metal Silver2 SBPP00 — BATTERY PACK,LI-POLYMER 1 Please refer to the 'Exploded View' Y Red2 SNGF00 — ANTENNA,GSM,FIXED 1 Please refer to the 'Exploded View' Y Cobalt Blue M282 SNGF00 — ANTENNA,GSM,FIXED 1 Please refer to the 'Exploded View' Y Metal Silver2 SNGF00 — ANTENNA,GSM,FIXED 1 Please refer to the 'Exploded View' Y Red
- 103 -
Leve Location No. Part No. Description QTY Specification Service Remark3 SAFY00 — PCB ASSY,MAIN 1 Please refer to 'Exploded View' Y M234 SAFA00 SAFA0015702 PCB ASSY,MAIN,AUTO 1 65K color PCB ASSY MAIN AUTO N5 BPF600 SFSY0012301 FILTER,SAW 1 1842.5 MHz,2.0*2.5*1.0 ,SMD ,DCS BAND Y5 BPF601 SFSY0012201 FILTER,SAW 1 942.5 MHz,2.0*2.5*1.0 ,SMD ,GSM BAND Y5 BPF602 SFSY0014101 FILTER,SAW 1 897 MHz,2.0*2.0*1.8 ,SMD , Y5 C100 ECTZ0003901 CAP,TANTAL,CHIP,MAKER 1 10 uF,16V ,M ,STD ,ETC ,R/TP Y5 C101 ECCH0000179 CAP,CERAMIC,CHIP 1 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP Y5 C103 ECCH0000130 CAP,CERAMIC,CHIP 1 150 pF,50V,J,SL,TC,1005,R/TP Y5 C104 ECCH0000379 CAP,CERAMIC,CHIP 1 2.2 uF,6.3V ,K ,X5R ,HD ,2012 ,R/TP Y5 C105 ECCH0000122 CAP,CERAMIC,CHIP 1 47 pF,50V,J,NP0,TC,1005,R/TP Y5 C106 ECCH0000122 CAP,CERAMIC,CHIP 1 47 pF,50V,J,NP0,TC,1005,R/TP Y5 C107 ECCH0000122 CAP,CERAMIC,CHIP 1 47 pF,50V,J,NP0,TC,1005,R/TP Y5 C108 ECCH0000143 CAP,CERAMIC,CHIP 1 1 nF,50V,K,X7R,HD,1005,R/TP Y5 C109 ECZH0003902 CAP,CHIP,MAKER 1 0.1 uF,50V ,K ,X7R ,HD ,2012 ,R/TP Y5 C110 ECCH0000276 CAP,CERAMIC,CHIP 1 1 uF,10V,Z,Y5V,HD,1608,R/TP Y5 C118 ECCH0000186 CAP,CERAMIC,CHIP 1 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP Y5 C119 ECCH0000186 CAP,CERAMIC,CHIP 1 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP Y5 C120 ECCH0000186 CAP,CERAMIC,CHIP 1 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP Y5 C124 SEVY0004901 VARISTOR 1 5.6 V, ,SMD ,CAP=370pF+-30% Y5 C202 ECCH0000114 CAP,CERAMIC,CHIP 1 20 pF,50V,J,NP0,TC,1005,R/TP Y5 C203 ECCH0000114 CAP,CERAMIC,CHIP 1 20 pF,50V,J,NP0,TC,1005,R/TP Y5 C204 ECCH0000113 CAP,CERAMIC,CHIP 1 18 pF,50V,J,NP0,TC,1005,R/TP Y5 C205 ECCH0000143 CAP,CERAMIC,CHIP 1 1 nF,50V,K,X7R,HD,1005,R/TP Y5 C206 ECCH0000161 CAP,CERAMIC,CHIP 1 33 nF,16V,K,X7R,HD,1005,R/TP Y5 C211 ECCH0000135 CAP,CERAMIC,CHIP 1 270 pF,50V ,K ,X7R ,HD ,1005 ,R/TP Y5 C213 ECCH0000135 CAP,CERAMIC,CHIP 1 270 pF,50V ,K ,X7R ,HD ,1005 ,R/TP Y5 C215 ECCH0001811 CAP,CERAMIC,CHIP 1 0.22 uF,50V ,Z ,Y5V ,HD ,1005 ,R/TP Y5 C216 ECCH0000276 CAP,CERAMIC,CHIP 1 1 uF,10V,Z,Y5V,HD,1608,R/TP Y5 C217 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C218 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C219 ECCH0000379 CAP,CERAMIC,CHIP 1 2.2 uF,6.3V ,K ,X5R ,HD ,2012 ,R/TP Y5 C220 ECCH0000379 CAP,CERAMIC,CHIP 1 2.2 uF,6.3V ,K ,X5R ,HD ,2012 ,R/TP Y5 C221 ECCH0000379 CAP,CERAMIC,CHIP 1 2.2 uF,6.3V ,K ,X5R ,HD ,2012 ,R/TP Y5 C222 ECCH0000379 CAP,CERAMIC,CHIP 1 2.2 uF,6.3V ,K ,X5R ,HD ,2012 ,R/TP Y5 C223 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C224 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C225 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C226 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C227 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C228 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C229 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C230 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C231 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C232 ECTZ0003101 CAP,TANTAL,CHIP,MAKER 1 33 uF,10V ,M ,STD ,ETC ,R/TP Y5 C233 ECCH0000128 CAP,CERAMIC,CHIP 1 100 pF,50V,J,NP0,TC,1005,R/TP Y5 C234 ECCH0000379 CAP,CERAMIC,CHIP 1 2.2 uF,6.3V ,K ,X5R ,HD ,2012 ,R/TP Y5 C300 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C301 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C304 ECCH0000161 CAP,CERAMIC,CHIP 1 33 nF,16V,K,X7R,HD,1005,R/TP Y5 C400 ECCH0000122 CAP,CERAMIC,CHIP 1 47 pF,50V,J,NP0,TC,1005,R/TP Y5 C401 ECCH0000379 CAP,CERAMIC,CHIP 1 2.2 uF,6.3V ,K ,X5R ,HD ,2012 ,R/TP Y5 C402 ECCH0000122 CAP,CERAMIC,CHIP 1 47 pF,50V,J,NP0,TC,1005,R/TP Y5 C404 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C405 ECCH0000122 CAP,CERAMIC,CHIP 1 47 pF,50V,J,NP0,TC,1005,R/TP Y5 C406 ECCH0000122 CAP,CERAMIC,CHIP 1 47 pF,50V,J,NP0,TC,1005,R/TP Y5 C407 ECCH0000122 CAP,CERAMIC,CHIP 1 47 pF,50V,J,NP0,TC,1005,R/TP Y5 C408 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C409 ECCH0000122 CAP,CERAMIC,CHIP 1 47 pF,50V,J,NP0,TC,1005,R/TP Y5 C410 ECCH0000189 CAP,CERAMIC,CHIP 1 680 pF,50V ,J ,X7R ,HD ,1005 ,R/TP Y5 C411 ECCH0000189 CAP,CERAMIC,CHIP 1 680 pF,50V ,J ,X7R ,HD ,1005 ,R/TP Y5 C412 ECCH0000189 CAP,CERAMIC,CHIP 1 680 pF,50V ,J ,X7R ,HD ,1005 ,R/TP Y
< Main PCB >
- 104 -
Leve Location No. Part No. Description QTY Specification Service Remark5 C413 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C414 ECCH0000122 CAP,CERAMIC,CHIP 1 47 pF,50V,J,NP0,TC,1005,R/TP Y5 C415 ECCH0000122 CAP,CERAMIC,CHIP 1 47 pF,50V,J,NP0,TC,1005,R/TP Y5 C416 ECCH0001811 CAP,CERAMIC,CHIP 1 0.22 uF,50V ,Z ,Y5V ,HD ,1005 ,R/TP Y5 C417 ECCH0000379 CAP,CERAMIC,CHIP 1 2.2 uF,6.3V ,K ,X5R ,HD ,2012 ,R/TP Y5 C418 ECCH0000179 CAP,CERAMIC,CHIP 1 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP Y5 C419 ECCH0000155 CAP,CERAMIC,CHIP 1 10 nF,16V,K,X7R,HD,1005,R/TP Y5 C421 ECCH0000113 CAP,CERAMIC,CHIP 1 18 pF,50V,J,NP0,TC,1005,R/TP Y5 C422 ECCH0000122 CAP,CERAMIC,CHIP 1 47 pF,50V,J,NP0,TC,1005,R/TP Y5 C423 ECCH0000122 CAP,CERAMIC,CHIP 1 47 pF,50V,J,NP0,TC,1005,R/TP Y5 C424 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C425 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C426 ECCH0000143 CAP,CERAMIC,CHIP 1 1 nF,50V,K,X7R,HD,1005,R/TP Y5 C427 ECCH0000122 CAP,CERAMIC,CHIP 1 47 pF,50V,J,NP0,TC,1005,R/TP Y5 C428 ECCH0000143 CAP,CERAMIC,CHIP 1 1 nF,50V,K,X7R,HD,1005,R/TP Y5 C450 ECCH0003401 CAP,CERAMIC,CHIP 1 10 uF,6.3V ,Z ,Y5V ,HD ,2012 ,R/TP Y5 C500 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C501 ECCH0000143 CAP,CERAMIC,CHIP 1 1 nF,50V,K,X7R,HD,1005,R/TP Y5 C502 ECCH0000124 CAP,CERAMIC,CHIP 1 56 pF,50V,J,NP0,TC,1005,R/TP Y5 C503 ECCH0000276 CAP,CERAMIC,CHIP 1 1 uF,10V,Z,Y5V,HD,1608,R/TP Y5 C504 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C505 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C600 ECCH0000122 CAP,CERAMIC,CHIP 1 47 pF,50V,J,NP0,TC,1005,R/TP Y5 C601 ECCH0000111 CAP,CERAMIC,CHIP 1 12 pF,50V,J,NP0,TC,1005,R/TP Y5 C602 ECCH0000143 CAP,CERAMIC,CHIP 1 1 nF,50V,K,X7R,HD,1005,R/TP Y5 C603 ECTZ0003801 CAP,TANTAL,CHIP,MAKER 1 470 uF,6.3V ,M ,L_ESR ,ETC ,R/TP Y5 C604 ECCH0000117 CAP,CERAMIC,CHIP 1 27 pF,50V,J,NP0,TC,1005,R/TP Y5 C605 ECCH0000111 CAP,CERAMIC,CHIP 1 12 pF,50V,J,NP0,TC,1005,R/TP Y5 C608 ECCH0000117 CAP,CERAMIC,CHIP 1 27 pF,50V,J,NP0,TC,1005,R/TP Y5 C609 ECCH0000117 CAP,CERAMIC,CHIP 1 27 pF,50V,J,NP0,TC,1005,R/TP Y5 C611 ECCH0000103 CAP,CERAMIC,CHIP 1 1.5 pF,50V,C,NP0,TC,1005,R/TP Y5 C613 ECCH0000701 CAP,CERAMIC,CHIP 1 1.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP Y5 C614 ECCH0000137 CAP,CERAMIC,CHIP 1 330 pF,50V ,K ,X7R ,HD ,1005 ,R/TP Y5 C615 ECFD0000101 CAP,FILM,MPP 1 8200 pF,16V ,J ,NI ,SMD ,2012 mm,R/TP Y5 C619 ECCH0000143 CAP,CERAMIC,CHIP 1 1 nF,50V,K,X7R,HD,1005,R/TP Y5 C620 ECCH0000117 CAP,CERAMIC,CHIP 1 27 pF,50V,J,NP0,TC,1005,R/TP Y5 C621 ECCH0000117 CAP,CERAMIC,CHIP 1 27 pF,50V,J,NP0,TC,1005,R/TP Y5 C622 ECCH0000117 CAP,CERAMIC,CHIP 1 27 pF,50V,J,NP0,TC,1005,R/TP Y5 C623 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C624 ECCH0000379 CAP,CERAMIC,CHIP 1 2.2 uF,6.3V ,K ,X5R ,HD ,2012 ,R/TP Y5 C625 ECFD0000601 CAP,FILM,MPP 1 1 nF,16V ,J ,NI ,SMD ,1608 mm,R/TP Y5 C626 ECTZ0003401 CAP,TANTAL,CHIP,MAKER 1 4.7 uF,6.3V ,M ,STD ,2012 ,R/TP Y5 C627 ECCH0000143 CAP,CERAMIC,CHIP 1 1 nF,50V,K,X7R,HD,1005,R/TP Y5 C628 ECCH0000143 CAP,CERAMIC,CHIP 1 1 nF,50V,K,X7R,HD,1005,R/TP Y5 C629 ECCH0000117 CAP,CERAMIC,CHIP 1 27 pF,50V,J,NP0,TC,1005,R/TP Y5 C632 ECCH0000181 CAP,CERAMIC,CHIP 1 4.7 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP Y5 C633 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C634 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C635 ECTZ0003401 CAP,TANTAL,CHIP,MAKER 1 4.7 uF,6.3V ,M ,STD ,2012 ,R/TP Y5 C636 ECTZ0003101 CAP,TANTAL,CHIP,MAKER 1 33 uF,10V ,M ,STD ,ETC ,R/TP Y5 C637 ECCH0000120 CAP,CERAMIC,CHIP 1 39 pF,50V,J,NP0,TC,1005,R/TP Y5 C638 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C641 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C642 ECCH0000112 CAP,CERAMIC,CHIP 1 15 pF,50V,J,NP0,TC,1005,R/TP Y5 C643 ECCH0000108 CAP,CERAMIC,CHIP 1 7 pF,50V,D,NP0,TC,1005,R/TP Y5 C645 ECCH0000108 CAP,CERAMIC,CHIP 1 7 pF,50V,D,NP0,TC,1005,R/TP Y5 C646 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C647 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C648 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C649 ECCH0000104 CAP,CERAMIC,CHIP 1 3 pF,50V,C,NP0,TC,1005,R/TP Y5 C657 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C658 ECCH0000180 CAP,CERAMIC,CHIP 1 3.3 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP Y5 C660 ECCH0000180 CAP,CERAMIC,CHIP 1 3.3 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP Y5 C661 ECCH0000379 CAP,CERAMIC,CHIP 1 2.2 uF,6.3V ,K ,X5R ,HD ,2012 ,R/TP Y
12. EXPLODED VIEW & REPLACEMENT PART LIST
- 105 -
Leve Location No. Part No. Description QTY Specification Service Remark5 C662 ECCH0000104 CAP,CERAMIC,CHIP 1 3 pF,50V,C,NP0,TC,1005,R/TP Y5 C663 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C664 ECCH0000379 CAP,CERAMIC,CHIP 1 2.2 uF,6.3V ,K ,X5R ,HD ,2012 ,R/TP Y5 C665 ECCH0000155 CAP,CERAMIC,CHIP 1 10 nF,16V,K,X7R,HD,1005,R/TP Y5 C666 ECCH0000143 CAP,CERAMIC,CHIP 1 1 nF,50V,K,X7R,HD,1005,R/TP Y5 C667 ECCH0000143 CAP,CERAMIC,CHIP 1 1 nF,50V,K,X7R,HD,1005,R/TP Y5 C669 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C670 ECCH0000144 CAP,CERAMIC,CHIP 1 1.2 nF,50V,K,X7R,HD,1005,R/TP Y5 C671 ECFD0000701 CAP,FILM,MPP 1 12 nF,16V ,J ,NI ,SMD ,3216 mm,R/TP Y5 C672 ECCH0000248 CAP,CERAMIC,CHIP 1 1.2 nF,50V,K,X7R,HD,1608,R/TP Y5 C673 ECCH0000256 CAP,CERAMIC,CHIP 1 5.6 nF,50V,K,X7R,HD,1608,R/TP Y5 C674 ECFD0000601 CAP,FILM,MPP 1 1 nF,16V ,J ,NI ,SMD ,1608 mm,R/TP Y5 C675 ECCH0000143 CAP,CERAMIC,CHIP 1 1 nF,50V,K,X7R,HD,1005,R/TP Y5 C679 ECCH0000111 CAP,CERAMIC,CHIP 1 12 pF,50V,J,NP0,TC,1005,R/TP Y5 C680 ECCH0000143 CAP,CERAMIC,CHIP 1 1 nF,50V,K,X7R,HD,1005,R/TP Y5 C681 ECCH0000181 CAP,CERAMIC,CHIP 1 4.7 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP Y5 C682 ECCH0000181 CAP,CERAMIC,CHIP 1 4.7 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP Y5 C683 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C685 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 C686 ECCH0000111 CAP,CERAMIC,CHIP 1 12 pF,50V,J,NP0,TC,1005,R/TP Y5 C687 ECCH0000379 CAP,CERAMIC,CHIP 1 2.2 uF,6.3V ,K ,X5R ,HD ,2012 ,R/TP Y5 C690 ECCH0000101 CAP,CERAMIC,CHIP 1 0.5 pF,50V,C,NP0,TC,1005,R/TP Y5 C691 ECCH0000144 CAP,CERAMIC,CHIP 1 1.2 nF,50V,K,X7R,HD,1005,R/TP Y5 C692 ECCH0000143 CAP,CERAMIC,CHIP 1 1 nF,50V,K,X7R,HD,1005,R/TP Y5 C698 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y5 D100 EDSY0005201 DIODE,SWITCHING 1 SMD ,30 V,1.5 A,R/TP , Y5 D200 EDSY0010401 DIODE,SWITCHING 1 1-1G1A ,40 V,300 A,R/TP ,Silicon Epitaxial Schottky Barrier Type Diode Y5 D201 EDSY0010401 DIODE,SWITCHING 1 1-1G1A ,40 V,300 A,R/TP ,Silicon Epitaxial Schottky Barrier Type Diode Y5 D202 EDSY0010401 DIODE,SWITCHING 1 1-1G1A ,40 V,300 A,R/TP ,Silicon Epitaxial Schottky Barrier Type Diode Y5 D401 EDSY0009901 DIODE,SWITCHING 1 ESC ,80 V,300 A,R/TP ,1.6*0.8*0.6(t) Y5 D501 EDLH0004502 DIODE,LED,CHIP 1 BLUE ,1608 ,R/TP ,0.35T Y5 D502 EDLH0004502 DIODE,LED,CHIP 1 BLUE ,1608 ,R/TP ,0.35T Y5 D503 EDLH0004502 DIODE,LED,CHIP 1 BLUE ,1608 ,R/TP ,0.35T Y5 D505 EDLH0004502 DIODE,LED,CHIP 1 BLUE ,1608 ,R/TP ,0.35T Y5 D506 EDLH0004502 DIODE,LED,CHIP 1 BLUE ,1608 ,R/TP ,0.35T Y5 D507 EDLH0004502 DIODE,LED,CHIP 1 BLUE ,1608 ,R/TP ,0.35T Y5 D508 EDLH0004502 DIODE,LED,CHIP 1 BLUE ,1608 ,R/TP ,0.35T Y5 D511 EDLH0004502 DIODE,LED,CHIP 1 BLUE ,1608 ,R/TP ,0.35T Y5 D512 EDLH0004502 DIODE,LED,CHIP 1 BLUE ,1608 ,R/TP ,0.35T Y5 D513 EDLH0004502 DIODE,LED,CHIP 1 BLUE ,1608 ,R/TP ,0.35T Y5 D514 EDLH0004502 DIODE,LED,CHIP 1 BLUE ,1608 ,R/TP ,0.35T Y5 D517 EDLH0004502 DIODE,LED,CHIP 1 BLUE ,1608 ,R/TP ,0.35T Y5 D518 EDLH0004502 DIODE,LED,CHIP 1 BLUE ,1608 ,R/TP ,0.35T Y5 D519 EDLH0004502 DIODE,LED,CHIP 1 BLUE ,1608 ,R/TP ,0.35T Y5 D520 EDLH0004502 DIODE,LED,CHIP 1 BLUE ,1608 ,R/TP ,0.35T Y5 D521 EDSY0005301 DIODE,SWITCHING 1 SC-70 ,80 V,0.1 A,R/TP , Y5 D600 EDSY0010301 DIODE,SWITCHING 1 SOT-143 ,4 V,.11 A,R/TP ,Silicon Dual Schottky Diode Y5 D601 EDVY0001201 DIODE,VARIABLE CAP 1 UFP ,4.65 pF,R/TP ,diode capacitance:C1:4.65~5.15pF/C4:1.85~2.15pF Y5 D602 EDVY0001401 DIODE,VARIABLE CAP 1 CMPAK ,4.50 pF,R/TP ,diode capacitance:C1:4.50~5.00pF/C3:1.85~2.80pF Y5 HSP402 ERHY0000201 RES,CHIP 1 0 ohm,1/16W,J,1005,R/TP Y5 J100 ENSY0007601 CONN,SOCKET 1 6 PIN,ETC ,SOCKET ,2.54 mm,G7000 SIM CNT (2.4t) Y5 J101 ENRY0000901 CONNECTOR,I/O 1 24 PIN,0.5 mm,ETC , , Y5 J102 ENBY0010901 CONNECTOR,BOARD TO BOARD 1 30 PIN,0.5 mm,STRAIGHT , ,B to B CNT (HEAER) Y5 J400 ENJE0002301 CONN,JACK/PLUG,EARPHONE 1 3,5 PIN,G7000 EAR JACK 3 pole, 5 pin KSD Y5 L100 SFBH0007102 FILTER,BEAD,CHIP 1 10 ohm,1005 ,Ferrite Bead Y5 L102 SFBH0007102 FILTER,BEAD,CHIP 1 10 ohm,1005 ,Ferrite Bead Y5 L103 SFBH0007101 FILTER,BEAD,CHIP 1 120 ohm,1005 ,Ferrite Bead Y5 L104 SFBH0007101 FILTER,BEAD,CHIP 1 120 ohm,1005 ,Ferrite Bead Y5 L105 SFBH0007101 FILTER,BEAD,CHIP 1 120 ohm,1005 ,Ferrite Bead Y5 L106 SFBH0007101 FILTER,BEAD,CHIP 1 120 ohm,1005 ,Ferrite Bead Y5 L107 SFBH0007101 FILTER,BEAD,CHIP 1 120 ohm,1005 ,Ferrite Bead Y5 L108 SFBH0007101 FILTER,BEAD,CHIP 1 120 ohm,1005 ,Ferrite Bead Y5 L109 SFBH0007101 FILTER,BEAD,CHIP 1 120 ohm,1005 ,Ferrite Bead Y5 L110 SFBH0007101 FILTER,BEAD,CHIP 1 120 ohm,1005 ,Ferrite Bead Y
12. EXPLODED VIEW & REPLACEMENT PART LIST
- 106 -
Leve Location No. Part No. Description QTY Specification Service Remark5 L111 SFBH0007101 FILTER,BEAD,CHIP 1 120 ohm,1005 ,Ferrite Bead Y5 L112 SFBH0007101 FILTER,BEAD,CHIP 1 120 ohm,1005 ,Ferrite Bead Y5 L113 SFBH0007101 FILTER,BEAD,CHIP 1 120 ohm,1005 ,Ferrite Bead Y5 L114 SFBH0007101 FILTER,BEAD,CHIP 1 120 ohm,1005 ,Ferrite Bead Y5 L115 SFBH0007101 FILTER,BEAD,CHIP 1 120 ohm,1005 ,Ferrite Bead Y5 L116 SFBH0007101 FILTER,BEAD,CHIP 1 120 ohm,1005 ,Ferrite Bead Y5 L117 SFBH0007101 FILTER,BEAD,CHIP 1 120 ohm,1005 ,Ferrite Bead Y5 L118 SFBH0007101 FILTER,BEAD,CHIP 1 120 ohm,1005 ,Ferrite Bead Y5 L119 SFBH0007101 FILTER,BEAD,CHIP 1 120 ohm,1005 ,Ferrite Bead Y5 L120 SFBH0007101 FILTER,BEAD,CHIP 1 120 ohm,1005 ,Ferrite Bead Y5 L124 SFBH0007101 FILTER,BEAD,CHIP 1 120 ohm,1005 ,Ferrite Bead Y5 L190 SFBH0007101 FILTER,BEAD,CHIP 1 120 ohm,1005 ,Ferrite Bead Y5 L500 ELCH0005009 INDUCTOR,CHIP 1 100 nH,J ,1005 ,R/TP , Y5 L502 ELCH0005009 INDUCTOR,CHIP 1 100 nH,J ,1005 ,R/TP , Y5 L600 ECCH0000112 CAP,CERAMIC,CHIP 1 15 pF,50V,J,NP0,TC,1005,R/TP Y5 L601 ELCH0005003 INDUCTOR,CHIP 1 12 nH,J ,1005 ,R/TP , Y5 L602 ELCH0005002 INDUCTOR,CHIP 1 2.7 nH,S ,1005 ,R/TP , Y5 L603 ELCH0005002 INDUCTOR,CHIP 1 2.7 nH,S ,1005 ,R/TP , Y5 L605 ELCH0001402 INDUCTOR,CHIP 1 18 nH,J,1005,R/TP Y5 L606 ELCH0001402 INDUCTOR,CHIP 1 18 nH,J,1005,R/TP Y5 L608 ELCH0001405 INDUCTOR,CHIP 1 3.3 nH,S,1005,R/TP Y5 L609 ELCH0005012 INDUCTOR,CHIP 1 3.9 nH,S ,1005 ,R/TP , Y5 L610 SFBH0007101 FILTER,BEAD,CHIP 1 120 ohm,1005 ,Ferrite Bead Y5 L611 ELCH0001003 INDUCTOR,CHIP 1 6.8 nH,J,1005,R/TP Y5 L612 ELCH0001003 INDUCTOR,CHIP 1 6.8 nH,J,1005,R/TP Y5 L632 ELCH0001405 INDUCTOR,CHIP 1 3.3 nH,S,1005,R/TP Y5 L633 ELCH0001405 INDUCTOR,CHIP 1 3.3 nH,S,1005,R/TP Y5 L635 ELCH0005013 INDUCTOR,CHIP 1 4.7 nH,S ,1005 ,R/TP , Y5 N600 SCHY0000101 COUPLER,RF HYBRID 1 19.0 dB,0.35 dB,24.0 dB,2.0*1.25*0.95 ,SMD ,DUAL COUPLER Y5 Q100 EQFP0003301 TR,FET,P-CHANNEL 1 SOT-6 ,1.6 W,30 V,2.4 A,R/TP ,use for charge P- CHANNEL FET Y5 Q101 EQBN0007001 TR,BJT,NPN 1 SC-70 ,0.1 W,R/TP , Y5 Q500 EQBN0004801 TR,BJT,NPN 1 SMT6 ,0.2 W,R/TP , Y5 Q502 EQBN0007001 TR,BJT,NPN 1 SC-70 ,0.1 W,R/TP , Y5 Q503 EQBN0007001 TR,BJT,NPN 1 SC-70 ,0.1 W,R/TP , Y5 Q504 EQBN0007001 TR,BJT,NPN 1 SC-70 ,0.1 W,R/TP , Y5 Q506 EQBN0007101 TR,BJT,NPN 1 EMT3 ,0.15 W,R/TP ,LOW FREQUENCY Y5 R100 ERHY0000265 RES,CHIP 1 20K ohm,1/16W,J,1005,R/TP Y5 R101 ERHY0000265 RES,CHIP 1 20K ohm,1/16W,J,1005,R/TP Y5 R102 ERHY0000299 RES,CHIP 1 33000 ohm,1/16W ,J ,1005 ,R/TP Y5 R103 ERNR0000403 RES,ARRAY,R 1 10000 ohm, ohm,8 PIN,J ,1/32 W ,SMD ,R/TP Y5 R104 ERHY0000261 RES,CHIP 1 10K ohm,1/16W,J,1005,R/TP Y5 R105 ERHY0000220 RES,CHIP 1 100 ohm,1/16W,J,1005,R/TP Y5 R106 ERNR0000401 RES,ARRAY,R 1 47 ohm, ohm,8 PIN,J ,1/32 W ,SMD ,R/TP Y5 R107 ERHY0000202 RES,CHIP 1 4.7 ohm,1/16W,J,1005,R/TP Y5 R108 ERHY0000202 RES,CHIP 1 4.7 ohm,1/16W,J,1005,R/TP Y5 R109 ERHY0000226 RES,CHIP 1 220 ohm,1/16W,J,1005,R/TP Y5 R110 ERNR0000401 RES,ARRAY,R 1 47 ohm, ohm,8 PIN,J ,1/32 W ,SMD ,R/TP Y5 R111 ERHY0000241 RES,CHIP 1 1K ohm,1/16W,J,1005,R/TP Y5 R112 ERNR0000401 RES,ARRAY,R 1 47 ohm, ohm,8 PIN,J ,1/32 W ,SMD ,R/TP Y5 R114 ERHY0000296 RES,CHIP 1 1M ohm,1/16W,J,1005,R/TP Y5 R115 ERHY0000201 RES,CHIP 1 0 ohm,1/16W,J,1005,R/TP Y5 R116 ERHY0001102 RES,CHIP 1 0.2 ohm,1/4W ,F ,2012 ,R/TP Y5 R117 ERHY0000201 RES,CHIP 1 0 ohm,1/16W,J,1005,R/TP Y5 R118 ERHY0000250 RES,CHIP 1 3.3K ohm,1/16W,J,1005,R/TP Y5 R120 ERHY0000201 RES,CHIP 1 0 ohm,1/16W,J,1005,R/TP Y5 R121 ERHY0000250 RES,CHIP 1 3.3K ohm,1/16W,J,1005,R/TP Y5 R122 ERHY0000261 RES,CHIP 1 10K ohm,1/16W,J,1005,R/TP Y5 R123 ERHY0000201 RES,CHIP 1 0 ohm,1/16W,J,1005,R/TP Y5 R124 ERHY0000201 RES,CHIP 1 0 ohm,1/16W,J,1005,R/TP Y5 R150 ERHY0000201 RES,CHIP 1 0 ohm,1/16W,J,1005,R/TP Y5 R151 ERHY0000201 RES,CHIP 1 0 ohm,1/16W,J,1005,R/TP Y5 R152 ERHY0000201 RES,CHIP 1 0 ohm,1/16W,J,1005,R/TP Y5 R201 ERHY0000287 RES,CHIP 1 220K ohm,1/16W,J,1005,R/TP Y5 R202 ERHY0000299 RES,CHIP 1 33000 ohm,1/16W ,J ,1005 ,R/TP Y
12. EXPLODED VIEW & REPLACEMENT PART LIST
- 107 -
Leve Location No. Part No. Description QTY Specification Service Remark5 R203 ERHY0000261 RES,CHIP 1 10K ohm,1/16W,J,1005,R/TP Y5 R204 ERHY0000231 RES,CHIP 1 390 ohm,1/16W,J,1005,R/TP Y5 R205 ERHY0000231 RES,CHIP 1 390 ohm,1/16W,J,1005,R/TP Y5 R206 ERHY0000231 RES,CHIP 1 390 ohm,1/16W,J,1005,R/TP Y5 R207 ERHY0000231 RES,CHIP 1 390 ohm,1/16W,J,1005,R/TP Y5 R208 ERHY0000265 RES,CHIP 1 20K ohm,1/16W,J,1005,R/TP Y5 R209 ERHY0000296 RES,CHIP 1 1M ohm,1/16W,J,1005,R/TP Y5 R211 ERHY0000265 RES,CHIP 1 20K ohm,1/16W,J,1005,R/TP Y5 R219 ERHY0000282 RES,CHIP 1 120K ohm,1/16W,J,1005,R/TP Y5 R220 ERHY0000261 RES,CHIP 1 10K ohm,1/16W,J,1005,R/TP Y5 R222 ERHY0000261 RES,CHIP 1 10K ohm,1/16W,J,1005,R/TP Y5 R225 ERHY0000296 RES,CHIP 1 1M ohm,1/16W,J,1005,R/TP Y5 R227 ERHY0000201 RES,CHIP 1 0 ohm,1/16W,J,1005,R/TP Y5 R228 ERHY0000201 RES,CHIP 1 0 ohm,1/16W,J,1005,R/TP Y5 R229 ERHY0000201 RES,CHIP 1 0 ohm,1/16W,J,1005,R/TP Y5 R231 ERHY0000201 RES,CHIP 1 0 ohm,1/16W,J,1005,R/TP Y5 R250 ERHY0000201 RES,CHIP 1 0 ohm,1/16W,J,1005,R/TP Y5 R280 ERHY0000201 RES,CHIP 1 0 ohm,1/16W,J,1005,R/TP Y5 R281 ERHY0000201 RES,CHIP 1 0 ohm,1/16W,J,1005,R/TP Y5 R282 ERHY0000201 RES,CHIP 1 0 ohm,1/16W,J,1005,R/TP Y5 R283 ERHY0000201 RES,CHIP 1 0 ohm,1/16W,J,1005,R/TP Y5 R300 ERHY0000201 RES,CHIP 1 0 ohm,1/16W,J,1005,R/TP Y5 R302 ERHY0000201 RES,CHIP 1 0 ohm,1/16W,J,1005,R/TP Y5 R303 ERHY0000201 RES,CHIP 1 0 ohm,1/16W,J,1005,R/TP Y5 R305 ERHY0000261 RES,CHIP 1 10K ohm,1/16W,J,1005,R/TP Y5 R400 ERHY0000241 RES,CHIP 1 1K ohm,1/16W,J,1005,R/TP Y5 R401 ERHY0006701 RES,CHIP 1 2400 ohm,1/16W ,J ,1005 ,R/TP Y5 R402 ERHY0000243 RES,CHIP 1 1.2K ohm,1/16W,J,1005,R/TP Y5 R404 ERHY0000264 RES,CHIP 1 18K ohm,1/16W,J,1005,R/TP Y5 R405 ERHY0000280 RES,CHIP 1 100K ohm,1/16W,J,1005,R/TP Y5 R407 ERHY0000286 RES,CHIP 1 200K ohm,1/16W,J,1005,R/TP Y5 R408 ERHY0000202 RES,CHIP 1 4.7 ohm,1/16W,J,1005,R/TP Y5 R409 ERHY0000202 RES,CHIP 1 4.7 ohm,1/16W,J,1005,R/TP Y5 R410 ERHY0000202 RES,CHIP 1 4.7 ohm,1/16W,J,1005,R/TP Y5 R414 ERHY0000299 RES,CHIP 1 33000 ohm,1/16W ,J ,1005 ,R/TP Y5 R415 ERHY0000271 RES,CHIP 1 39K ohm,1/16W,J,1005,R/TP Y5 R417 ERHY0000261 RES,CHIP 1 10K ohm,1/16W,J,1005,R/TP Y5 R418 ERHY0000250 RES,CHIP 1 3.3K ohm,1/16W,J,1005,R/TP Y5 R419 ERHY0000258 RES,CHIP 1 7.5K ohm,1/16W,J,1005,R/TP Y5 R420 ERHY0000220 RES,CHIP 1 100 ohm,1/16W,J,1005,R/TP Y5 R421 ERHY0000201 RES,CHIP 1 0 ohm,1/16W,J,1005,R/TP Y5 R450 ERHY0000287 RES,CHIP 1 220K ohm,1/16W,J,1005,R/TP Y5 R500 ERHY0000244 RES,CHIP 1 1.5K ohm,1/16W,J,1005,R/TP Y5 R501 ERHY0000280 RES,CHIP 1 100K ohm,1/16W,J,1005,R/TP Y5 R502 ERHY0000206 RES,CHIP 1 18 ohm,1/16W,J,1005,R/TP Y5 R503 ERHY0000206 RES,CHIP 1 18 ohm,1/16W,J,1005,R/TP Y5 R504 ERHY0000228 RES,CHIP 1 270 ohm,1/16W,J,1005,R/TP Y5 R505 ERHY0000280 RES,CHIP 1 100K ohm,1/16W,J,1005,R/TP Y5 R508 ERHY0000261 RES,CHIP 1 10K ohm,1/16W,J,1005,R/TP Y5 R509 ERHY0000261 RES,CHIP 1 10K ohm,1/16W,J,1005,R/TP Y5 R510 ERHY0006601 RES,CHIP 1 6200 ohm,1/16W ,J ,1005 ,R/TP Y5 R512 ERHY0000261 RES,CHIP 1 10K ohm,1/16W,J,1005,R/TP Y5 R513 ERHY0000261 RES,CHIP 1 10K ohm,1/16W,J,1005,R/TP Y5 R516 ERHY0000211 RES,CHIP 1 33 ohm,1/16W,J,1005,R/TP Y5 R517 ERHY0000202 RES,CHIP 1 4.7 ohm,1/16W,J,1005,R/TP Y5 R518 ERHY0000201 RES,CHIP 1 0 ohm,1/16W,J,1005,R/TP Y5 R519 ERHY0000273 RES,CHIP 1 47K ohm,1/16W,J,1005,R/TP Y5 R520 ERHY0000244 RES,CHIP 1 1.5K ohm,1/16W,J,1005,R/TP Y5 R521 ERHY0000280 RES,CHIP 1 100K ohm,1/16W,J,1005,R/TP Y5 R530 ERHY0000224 RES,CHIP 1 180 ohm,1/16W,J,1005,R/TP Y5 R531 ERHY0008202 RES,CHIP 1 62 ohm,1/16W ,J ,1005 ,R/TP Y5 R532 ERHY0000209 RES,CHIP 1 27 ohm,1/16W,J,1005,R/TP Y5 R535 ERHY0000201 RES,CHIP 1 0 ohm,1/16W,J,1005,R/TP Y5 R600 ERHY0000206 RES,CHIP 1 18 ohm,1/16W,J,1005,R/TP Y
12. EXPLODED VIEW & REPLACEMENT PART LIST
- 108 -
Leve Location No. Part No. Description QTY Specification Service Remark5 R601 ERHY0000229 RES,CHIP 1 300 ohm,1/16W,J,1005,R/TP Y5 R602 ERHY0000229 RES,CHIP 1 300 ohm,1/16W,J,1005,R/TP Y5 R603 ECCH0000110 CAP,CERAMIC,CHIP 1 10 pF,50V,D,NP0,TC,1005,R/TP Y5 R604 ERHY0000214 RES,CHIP 1 51 ohm,1/16W,J,1005,R/TP Y5 R606 ERHY0000214 RES,CHIP 1 51 ohm,1/16W,J,1005,R/TP Y5 R607 ERHY0000214 RES,CHIP 1 51 ohm,1/16W,J,1005,R/TP Y5 R608 ERHY0000214 RES,CHIP 1 51 ohm,1/16W,J,1005,R/TP Y5 R609 ERHY0000201 RES,CHIP 1 0 ohm,1/16W,J,1005,R/TP Y5 R610 ERHY0000201 RES,CHIP 1 0 ohm,1/16W,J,1005,R/TP Y5 R615 ERHY0000247 RES,CHIP 1 2.2K ohm,1/16W,J,1005,R/TP Y5 R617 ERHY0000214 RES,CHIP 1 51 ohm,1/16W,J,1005,R/TP Y5 R620 ERHY0000211 RES,CHIP 1 33 ohm,1/16W,J,1005,R/TP Y5 R621 ERHY0000243 RES,CHIP 1 1.2K ohm,1/16W,J,1005,R/TP Y5 R622 ERHY0000222 RES,CHIP 1 120 ohm,1/16W,J,1005,R/TP Y5 R624 ERHY0006602 RES,CHIP 1 620 Kohm,1/16W ,J ,1005 ,R/TP Y5 R625 ERHY0000241 RES,CHIP 1 1K ohm,1/16W,J,1005,R/TP Y5 R626 ERHY0000241 RES,CHIP 1 1K ohm,1/16W,J,1005,R/TP Y5 R629 ERHY0000241 RES,CHIP 1 1K ohm,1/16W,J,1005,R/TP Y5 R630 ERHY0000241 RES,CHIP 1 1K ohm,1/16W,J,1005,R/TP Y5 R631 ERHY0000241 RES,CHIP 1 1K ohm,1/16W,J,1005,R/TP Y5 R632 ERHY0000201 RES,CHIP 1 0 ohm,1/16W,J,1005,R/TP Y5 R634 ERHY0008503 RES,CHIP 1 9.76 Kohm,1/16W ,F ,1005 ,R/TP Y5 R635 ERHY0000241 RES,CHIP 1 1K ohm,1/16W,J,1005,R/TP Y5 R636 ERHY0008502 RES,CHIP 1 2.7 Kohm,1/16W ,F ,1005 ,R/TP Y5 R637 ERHY0000241 RES,CHIP 1 1K ohm,1/16W,J,1005,R/TP Y5 R638 ERHY0008501 RES,CHIP 1 2.2 Kohm,1/16W ,F ,1005 ,R/TP Y5 R641 ERHY0000231 RES,CHIP 1 390 ohm,1/16W,J,1005,R/TP Y5 R642 ERHY0000241 RES,CHIP 1 1K ohm,1/16W,J,1005,R/TP Y5 R643 ERHY0000296 RES,CHIP 1 1M ohm,1/16W,J,1005,R/TP Y5 R644 ERHY0000244 RES,CHIP 1 1.5K ohm,1/16W,J,1005,R/TP Y5 R645 ERHY0000241 RES,CHIP 1 1K ohm,1/16W,J,1005,R/TP Y5 R646 ERHY0000247 RES,CHIP 1 2.2K ohm,1/16W,J,1005,R/TP Y5 R647 ELCH0001405 INDUCTOR,CHIP 1 3.3 nH,S,1005,R/TP Y5 R648 ERHY0000247 RES,CHIP 1 2.2K ohm,1/16W,J,1005,R/TP Y5 R649 ERHY0000203 RES,CHIP 1 10 ohm,1/16W,J,1005,R/TP Y5 R656 ERHY0000241 RES,CHIP 1 1K ohm,1/16W,J,1005,R/TP Y5 R657 ERHY0000241 RES,CHIP 1 1K ohm,1/16W,J,1005,R/TP Y5 R672 ERHY0000261 RES,CHIP 1 10K ohm,1/16W,J,1005,R/TP Y5 R673 ERHY0000289 RES,CHIP 1 270K ohm,1/16W,J,1005,R/TP Y5 R674 ERHY0000237 RES,CHIP 1 680 ohm,1/16W,J,1005,R/TP Y5 R675 ERHY0000254 RES,CHIP 1 4.7K ohm,1/16W,J,1005,R/TP Y5 R677 ERHY0000201 RES,CHIP 1 0 ohm,1/16W,J,1005,R/TP Y5 R678 ERHY0000201 RES,CHIP 1 0 ohm,1/16W,J,1005,R/TP Y5 SPFY00 SPFY0031306 PCB,MAIN 1 FR-4 ,0.8 mm,MULTI-8 ,Ver1.3 N5 SW500 EUSY0129501 IC 1 SC-74A FIT ,3 PIN,R/TP ,HALL EFFECT SWITCH Y5 SW600 ENWY0000101 CONN,RF SWITCH 1 ANGLE ,SMD ,0.5 dB, Y5 TH601 SETY0001201 THERMISTOR 1 NTC ,22 Kohm,SMD ,1.0*0.5 / NSM4 SERIES Y5 U101 EUSY0077201 IC 1 SOT(DCK) ,5 PIN,R/TP , Y
5 U102 EUSY0111901 IC 1TSSOP ,14 PIN,R/TP ,
YQUAD BUS BUFFER WITH 3_STATE CONTROL INPUTS5 U103 EUSY0100504 IC 1 SC70 ,5 PIN,R/TP ,UHS 2-INPUT OR GATE Y5 U200 EUSY0116401 IC 1 179GHH PBGA ,179 PIN,BK ,DIGITAL BB CHIP N5 U201 EUSY0116501 IC 1 100GGM PBGA ,100 PIN,BK ,ANALOG BB CHIP N5 U202 EUSY0122401 IC 1 SC-82AB ,4 PIN,R/TP ,CMOS LDO 1.8V OUTPUT/ 2.0 X 2.1 Y
5 U301 EUSY0134901 IC 1P-FBGA69 ,69 PIN,R/TP ,
N64M FLASH 32M PSRAM / BOTTOM BOOT5 U302 EUSY0105201 IC 1 P-TFBGA63 ,63 PIN,R/TP ,64 M-bit CMOS FLASH / 70 ns N5 U400 EUSY0077701 IC 1 SC70-5 ,5 PIN,R/TP , Y5 U401 EUSY0077602 IC 1 MSOP-8 ,8 PIN,R/TP , Y
250mA CMOS LDO WIHT ERROR FLAG / 3.3V5 U402 EUSY0077401 IC 1 SOT23-6 ,6 PIN,R/TP ,SPDT ANALOG SWITCH Y5 U403 EUSY0111601 IC 1 32-PIN QFN ,32 PIN,R/TP , Y
MA-3 / 40 TONES / FM + WAVEFORM TABLE5 U404 EUSY0077301 IC 1 SC70-6/SOT23-6 ,6 PIN,R/TP , Y
12. EXPLODED VIEW & REPLACEMENT PART LIST
- 109 -
Leve Location No. Part No. Description QTY Specification Service Remark
5 U501 EUSY0122301 IC 1SURFACE MOUNT ,7 PIN,R/TP ,
YIRDA DATA 1.3 LOW POWER TRANSCEIVER / 115.2kb/s5 U502 EUSY0077301 IC 1 SC70-6/SOT23-6 ,6 PIN,R/TP , Y
5 U600 EXSC0005101 VCO 11887 MHz, PPM, pF,SMD ,9.8*8.0*1.8 , VCO YQUAD VCO( TX/RX )897/921/1747/1885 QUAD
5 U601 EUSY0100102 IC 1RF-K ,12 PIN,R/TP ,
YRF POWER AMPLIFIER / E-GSM:55%, DCS1800:50%5 U602 STMY0018201 TRANSFORMER,MATCHING 1 8 PIN,SMD ,3.2*2.5*1.5mm DUAL Y
5 U603 SFAY0001201 FILTER,SEPERATOR 1880/960 ,1710/1880 ,1.3 dB,1.5 dB,
Y30 dB,25 dB,ETC ,5.4*4.0*1.8 Antenna switch5 U604 EUSY0116701 IC 1 S-PQFP ,64 PIN,R/TP ,RF TRANSCEIVER Y5 U605 EUSY0076701 IC 1 SOT-23-6 ,6 PIN,R/TP , Y5 U606 EXSK0000801 VCTCXO 1 13.0 MHz, PPM,10 pF,SMD ,5.0*3.2*1.5 , Y5 U607 EUSY0100503 IC 1 8-LEAD US8 ,8 PIN,R/TP ,UHS DUAL 2-INPUT NOR GATE Y5 U629 EUSY0077201 IC 1 SOT(DCK) ,5 PIN,R/TP , Y5 V102 SEVY0004901 VARISTOR 1 5.6 V, ,SMD ,CAP=370pF+-30% Y5 V400 SEVY0004901 VARISTOR 1 5.6 V, ,SMD ,CAP=370pF+-30% Y5 V401 SEVY0004901 VARISTOR 1 5.6 V, ,SMD ,CAP=370pF+-30% Y5 V402 SEVY0004901 VARISTOR 1 5.6 V, ,SMD ,CAP=370pF+-30% Y5 V403 SEVY0004901 VARISTOR 1 5.6 V, ,SMD ,CAP=370pF+-30% Y5 V404 SEVY0004901 VARISTOR 1 5.6 V, ,SMD ,CAP=370pF+-30% Y5 V405 SEVY0004901 VARISTOR 1 5.6 V, ,SMD ,CAP=370pF+-30% Y5 V406 SEVY0004901 VARISTOR 1 5.6 V, ,SMD ,CAP=370pF+-30% Y5 V407 SEVY0004901 VARISTOR 1 5.6 V, ,SMD ,CAP=370pF+-30% Y5 X200 EXXY0004601 X-TAL 1 0.32768 MHz,20 PPM,12.5 pF,65000 ohm,SMD ,6.9*1.4*1.3 , Y
12. EXPLODED VIEW & REPLACEMENT PART LIST
- 110 -
12. EXPLODED VIEW & REPLACEMENT PART LIST