LIGHT PEAK Ref : Optical Technologies and Applications Intel Technology Journal –January 2010 By Jason Ziller, Victor Krutul

Presented By:Manish Kumar I.T(8th Sem) ID 7210

Seminar-20101

CONTENTS• INTRODUCTION• FEATURES• TODAYS CHALLENGES• LIGHT PEAK VS USB 3.0• COMPONENT OVERVIEW• VCSEL• OPTICAL MODULE• CONTROLLER CHIP• ADVANTAGES• CONCLUSION• REFERENCES

2

INTRODUCTION• Light peak is the code name for the high

speed optical cable technology

• It connects electronic devices to each other

• Delivers bandwidth of 10Gb/s with a potential to scale to 100Gb/s.

3

FeaturesProvide a standard low cost optical based

interconnect - support for key existing protocols(USB, HDMI, DP, PCIe , etc) - scalable bandwidth, cost, power to support broad base for 10+years

- support wide range of devices(handhelds , laptop , pc’s)

• Common optical i/o architecture for the next decade and more

- single flexible cable that can carry any platform i/o - economies of scale from a single optical solution

4

Today’s Challenges

• Electrical i/o nearing practical limits - speed & distance limited

• Devices getting smaller, thinner, and lighter

• Too many different connectors and cables

5

6

LIGHT PEAK VS USB 3.0

• 4 Optical Fibre Cable• Speed-10 Gb/sec • Universal• Max Cable Length-100m

• 9 Copper Wires• Speed-3 Gb/sec• Only Usb Protocol• Max Cable Length-9m

7

8

MAJOR COMPONENTS

• OPTICAL MODULE

• VCSEL

• CONTROLLER CHIP

9

OPTICAL MODULE

• Two way chip

• Consists of photo detectors and miniature lasers(VCSEL)

• Does conversion from Light to Electricity Vice-Versa

10

OPTICAL MODULE

11

12

A simplified schematic illustration of a vertical cavitysurface emitting laser (VCSEL).

Contact

Surface emission

Dielectric mirror

Contact

Substrate

/4n1

Active layer

/4n2 Dielectric mirror

© 1999 S.O. Kasap, Optoelectronics (Prentice Hall)

VCSEL

13

VCSEL• The geometry of the dielectric mirrors

provide wavelength

• Thickness of alternating layers d1 and d2 with refractive indices of n1 and n2 if the following equation is satisfied:

• n1d1 + n2d2 = 1/2λ

14

CONTROLLER CHIP

• Manages multiple protocol

• It Identifies which protocol is to be transmitted

• API helps to determine the different protocols

• API places the FIS packets in memory.15

• Controller chip access the FIS packets from memory

• sends these Packets to destination over Optical link

16

Future Client Usage Models• Fast external storage

• SSD or HDD arrays transferring at 10Gbs and faster

• Advanced docking• High-performance docks, With a single cable,

connect to dock with:

• PC-to-PC high-speed connection• Transfer files, PC migration, etc

• Simplified home connectivity• Connect multiple PCs and portable CE devices

17

ADVANTAGES

• 10 Gbit/s over optical cable (up to 100 metres in length)

• Connect to multiple devices at the same time• Multiple protocols• Bi-Directional transfer• Quality of service implementation• Hot Pluggable

18

Industry Perspective

• “Sony is excited about the potential for Light Peak technology that has been developing, and believe it could enable a new generation of high-speed device connectivity.”

• “Nokia believes that Light Peak technology enables new wired connectivity solutions for Mobile Computers and Smart phones, and looks forward to working to create a global standard based on Light Peak technology.”

19

CONCLUSION

“ LIGHT PEAK is an high speed optical i/o architecture for the next decade and beyond ”

20

References

• www.intel.com/go/lightpeak• en.wikipedia.org/wiki/Light_Peak• techresearch.intel.com• blogs.intel.com/research• Intel Technology Journal• ……

21

QUESTIONS

?

22

23

THANK YOU