LS A67F

1 Version 1.8 | 2021-04-28

Produktdatenblatt | Version 1.1 www.osram-os.com

Applications

LS A67F

SIDELED®

— Cluster, Button Backlighting

— Electronic Equipment

— Interior Illumination (e.g. Ambient Map)

Features: — Package: white SMT package, colorless clear resin

— Chip technology: Thinfilm

— Typ. Radiation: 120° (Lambertian emitter)

— Color: λdom = 633 nm (● super red)

— Corrosion Robustness Class: 3B

— Qualifications: The product qualification test plan is based on the guidelines of AEC-Q101-REV-C, Stress Test Qualification for Automotive Grade Discrete Semiconductors. — ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)

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Ordering Information Type Luminous Intensity 1) Ordering Code

IF = 30 mAIv

LS A67F-U2BA-1-3A4B 560 ... 2240 mcd Q65112A9480

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Maximum RatingsParameter Symbol Values

Operating Temperature Top min. max.

-40 °C 100 °C

Storage Temperature Tstg min. max.

-40 °C 100 °C

Junction Temperature Tj max. 125 °C

Forward current TS = 25 °C

IF max. 50 mA

Surge Current t ≤ 10 µs; D = 0.005 ; TS = 25 °C

IFS max. 100 mA

Reverse voltage 2) TS = 25 °C

VR max. 12 V

ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)

VESD 2 kV

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CharacteristicsIF = 30 mA; TS = 25 °C

Parameter Symbol Values

Peak Wavelength λpeak typ. 645 nm

Dominant Wavelength 3) IF = 30 mA

λdom min. typ. max.

627 nm 633 nm 639 nm

Spectral Bandwidth at 50% Irel,max ∆λ typ. 15 nm

Viewing angle at 50% IV 2φ typ. 120 °

Forward Voltage 4) IF = 30 mA

VF min. typ. max.

1.80 V 2.00 V 2.40 V

Reverse current 2) VR = 12 V

IR typ. max.

0.01 µA 10 µA

Temperature Coefficient of Peak Wavelength -10°C ≤ T ≤ 100°C

TCλpeak typ. 0.15 nm / K

Temperature Coefficient of Dominant Wavelength -10°C ≤ T ≤ 100°C

TCλdom typ. 0.05 nm / K

Real thermal resistance junction/solderpoint 5) RthJS real max. 180 K / W

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Brightness Groups Group Luminous Intensity 1) Luminous Intensity. 1) Luminous Flux 6)

IF = 30 mA IF = 30 mA IF = 30 mAmin. max. typ.Iv Iv ΦV

U2 560 mcd 710 mcd 1910 mlm

V1 710 mcd 900 mcd 2420 mlm

V2 900 mcd 1120 mcd 3030 mlm

AA 1120 mcd 1400 mcd 3780 mlm

AB 1400 mcd 1800 mcd 4800 mlm

BA 1800 mcd 2240 mcd 6060 mlm

Forward Voltage Groups Group Forward Voltage 4) Forward Voltage 4)

IF = 30 mA IF = 30 mAmin. max.VF VF

3A 1.80 V 1.95 V

3B 1.95 V 2.10 V

4A 2.10 V 2.25 V

4B 2.25 V 2.40 V

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Group Name on Label Example: AA-1-3ABrightness Wavelength Forward Voltage

AA 1 3A

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Relative Spectral Emission 6)Irel = f (λ); IF = 30 mA; TS = 25 °C

OHL02654

4000

20

40

60

80

100

450 500 550 600 650 700nm

%

λ

Vλ

yelloworangeamber

super-redred

relΙ

Radiation Characteristics 6)Irel = f (ϕ); TS = 25 °C

0

0.2

0.4

1.0

0.8

0.6

ϕ

1.0 0.8 0.6 0.4

0˚10˚20˚40˚ 30˚ OHL01660

50˚

60˚

70˚

80˚

90˚

100˚0˚ 20˚ 40˚ 60˚ 80˚ 100˚ 120˚

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Forward current 6), 7)IF = f(VF); TS = 25 °C

OHL02665

mA

100V

101

210

IF

VF

2.31.5 1.7 1.9 2.1 2.5

amber, orangeyellow

super red, red

Relative Luminous Intensity 6), 7)Iv/Iv(30 mA) = f(IF); TS = 25 °C

OHL02812

IF

IIV (30 mA)

V

10 105 210mA0 1

010

101

10-1

5

10-2

5

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Forward Voltage 6)ΔVF = VF - VF(25 °C) = f(Tj); IF = 30 mA

OHL02667

T

FV

j

-40-0.2

-20 0 20 40

0.25

˚C60 100-60

V

-0.15

-0.1

-0.05

0

0.05

0.1

0.15

∆

Relative Luminous Intensity 6)Iv/Iv(25 °C) = f(Tj); IF = 30 mA

OHL02666

0-40 ˚C

T

(25 ˚C)IV

IV

0.5

1.0

1.5

2.0

2.5

-20 0 20 40 60 100

super red

j

-60

amberredorange

yellow

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Max. Permissible Forward CurrentIF = f(T)

temp. ambienttemp. solder point

00 20 40

A

STT

˚C60 80 100T

IFmA

ST

OHL02705

TA

10

20

30

40

50

60

Permissible Pulse Handling CapabilityIF = f(tp); D: Duty cycle; TA = 25 °C

10

1

100

0.02

0.04

0.06

-5 -4 -3 -21010 10

Pt=D T

Pt

T

IF

0.08

FI

0.10

0.12

A

0.5

0.2

-1 0 1 210tp

10 s 10

=

0.020.010.005

0.05

OHL02703

0.1

D

Permissible Pulse Handling CapabilityIF = f(tp); D: Duty cycle; TA = 85 °C

10

1

100

0.02

0.04

0.06

-5 -4 -3 -21010 10

Pt=D T

Pt

T

IF

0.08

FI

0.10

0.12

A

0.5

0.2

-1 0 1 210tp

10 s 10

=

0.020.010.005

0.05

OHL02704

0.1

D

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Dimensional Drawing 8)

GPLY6880

(R1)

Cathode marking

Cathode Anode

(2.4 (0.094))

2.8

(0.1

10)

2.4

(0.0

94)

4.2

(0.1

65)

3.8

(0.1

50)

0.9 (0.035)

1.1 (0.043)

spacing2.54 (0.100)

0.7

(0.0

28)

(2.85 (0.112))

(1.4 (0.055))

(0.3

(0.0

12))

3.4

(0.1

34)

3.8

(0.1

50)

3.8 (0.150)4.2 (0.165)

(2.9

(0.1

14))

AC

Further Information:

Approximate Weight: 67.0 mg

Package marking: Cathode

Corrosion test: Class: 3B Test condition: 40°C / 90 % RH / 15 ppm H2S / 14 days (stricter than IEC 60068-2-43)

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Recommended Solder Pad 8)

3.7 (0.146)

1.2 (0.047)

3.0

(0.1

18)

Cu-area > 16 mmCu-Fläche > 16 mm

Paddesignfor improvedheat dissipation

Wärmeableitungfür verbessertePadgeometrie

LötstopplackSolder resist

OHLPY965

2

2

For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not suitable for ultra sonic cleaning.

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Reflow Soldering ProfileProduct complies to MSL Level 2 acc. to JEDEC J-STD-020E

00

s

OHA04525

50

100

150

200

250

300

50 100 150 200 250 300t

T

˚C

St

t

Pt

Tp240 ˚C

217 ˚C

245 ˚C

25 ˚C

L

Profile Feature Symbol Pb-Free (SnAgCu) Assembly UnitMinimum Recommendation Maximum

Ramp-up rate to preheat*)25 °C to 150 °C

2 3 K/s

Time tSTSmin to TSmax

tS 60 100 120 s

Ramp-up rate to peak*)TSmax to TP

2 3 K/s

Liquidus temperature TL 217 °C

Time above liquidus temperature tL 80 100 s

Peak temperature TP 245 250 °C

Time within 5 °C of the specified peaktemperature TP - 5 K

tP 10 20 30 s

Ramp-down rate*TP to 100 °C

3 4 K/s

Time25 °C to TP

480 s

All temperatures refer to the center of the package, measured on the top of the component* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range

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Taping 8)

OHAY2273

1.5 (0.059)

4 (0.157)

2 (0.079)

8 (0.315)4.25 (0.167)

3.95

(0.1

56)

5.5

(0.2

17)

1.75

(0.0

69)

12 (0

.472

)

Cathode/Collector Marking

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Tape and Reel 9)

Reel DimensionsA W Nmin W1 W2 max Pieces per PU

330 mm 12 + 0.3 / - 0.1 mm 60 mm 12.4 + 2 mm 18.4 mm 2000

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Barcode-Product-Label (BPL)

Dry Packing Process and Materials 8)

OHA00539

OSRA

M

Moisture-sensitive label or print

Barcode label

Desiccant

Humidity indicator

Barcode label

OSRAM

Please check the HIC immidiately afterbag opening.

Discard if circles overrun.Avoid metal contact.

WET

Do not eat.

Comparatorcheck dot

parts still adequately dry.

examine units, if necessary

examine units, if necessary

5%

15%

10%bake units

bake units

If wet,

change desiccant

If wet,

Humidity IndicatorMIL-I-8835

If wet,

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whe

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Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.

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Chip Technology: 3: standard InGaN 6: Standard InGalP B: HOP 2000 C: ATON F: Thinfilm InGaAlP G: ThinGaN(Thinfilm InGaN) (Subcon:Sapphire) K: InGaAlP low current

´

Encapsulant Type / Lens Properties 7: Colorless clear or white volume conversion

(resin encapsulation) S: Silicone (with or without diffuser)

Wavelength Emission Color Color coordinates according (λdom typ.) CIE 1931/Emission color: A: 617 nm amber W: white S: 633 nm super red UW: ultra white T: 528 nm true green CB: color on demand blue Y: 587 nm yellow CG: color on demand green O: 606 nm orange CL: color on demand lagune G: 570 nm green P: 560 nm pure green R: 625 nm red B: 470 nm blue H: 645 nm hyper-red V: 505 nm verde green L: Light emitting diode

Package Type A: SIDELED

Lead / Package Properties 6: folded leads

Type Designation System

L A A 6 7 6

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NotesThe evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this data sheet fall into the class exempt group (exposure time 10000 s). Under real circumstances (for expo-sure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light sources have a high secondary exposure potential due to their blinding effect. When looking at bright light sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irrita-tion, annoyance, visual impairment, and even accidents, depending on the situation.

Subcomponents of this device contain, in addition to other substances, metal filled materials including silver. Metal filled materials can be affected by environments that contain traces of aggressive substances. There-fore, we recommend that customers minimize device exposure to aggressive substances during storage, production, and use. Devices that showed visible discoloration when tested using the described tests above did show no performance deviations within failure limits during the stated test duration. Respective failure limits are described in the IEC60810.

For further application related information please visit www.osram-os.com/appnotes

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Disclaimer

Attention please!The information describes the type of component and shall not be considered as assured characteristics.Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances.For information on the types in question please contact our Sales Organization.If printed or downloaded, please find the latest version on the OSRAM OS website.

PackingPlease use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred.

Product and functional safety devices/applications or medical devices/applicationsOSRAM OS components are not developed, constructed or tested for the application as safety relevant component or for the application in medical devices.OSRAM OS products are not qualified at module and system level for such application.

In case buyer – or customer supplied by buyer – considers using OSRAM OS components in product safety devices/applications or medical devices/applications, buyer and/or customer has to inform the local sales partner of OSRAM OS immediately and OSRAM OS and buyer and /or customer will analyze and coordi-nate the customer-specific request between OSRAM OS and buyer and/or customer.

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Glossary1) Brightness: Brightness values are measured during a current pulse of typically 25 ms, with an internal

reproducibility of ±8 % and an expanded uncertainty of ±11 % (acc. to GUM with a coverage factor of k = 3).

2) Reverse Operation: This product is intended to be operated applying a forward current within the specified range. Applying any continuous reverse bias or forward bias below the voltage range of light emission shall be avoided because it may cause migration which can change the electro-optical char-acteristics or damage the LED.

3) Wavelength: The wavelength is measured at a current pulse of typically 25 ms, with an internal repro-ducibility of ±0.5 nm and an expanded uncertainty of ±1 nm (acc. to GUM with a coverage factor of k = 3).

4) Forward Voltage: The forward voltage is measured during a current pulse of typically 8 ms, with an internal reproducibility of ±0.05 V and an expanded uncertainty of ±0.1 V (acc. to GUM with a coverage factor of k = 3).

5) Thermal Resistance: Rth max is based on statistic values (6σ).6) Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devic-

es, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could dif-fer from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice.

7) Characteristic curve: In the range where the line of the graph is broken, you must expect higher differ-ences between single devices within one packing unit.

8) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and dimensions are specified in mm.

9) Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm.

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Revision HistoryVersion Date Change

1.6 2019-08-12 Ordering Information Brightness Groups

1.7 2021-02-10 Features Schematic Transportation Box Dimensions of Transportation Box Glossary

1.8 2021-04-28 Features

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Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93055 Regensburg www.osram-os.com © All Rights Reserved.