LT E6SG

1 Version 1.3 | 2020-06-17

Produktdatenblatt | Version 1.1 www.osram-os.com

Applications

LT E6SG

Power TOPLED® PowerTOPLED, a powerful member of the TOPLED family. Thanks to their high luminous efficacy, the LEDs are ideal for rear light clusters and indicators on vehicles and for display panels for traffic control systems.

— Cluster, Button Backlighting

— Electronic Equipment

— Interior Illumination (e.g. Ambient Map)

Features: — Package: white PLCC-4 package, colorless clear silicone resin

— Chip technology: ThinGaN

— Typ. Radiation: 120° (Lambertian emitter)

— Color: λdom = 530 nm (● true green)

— Corrosion Robustness Class: 1B

— Qualifications: The product qualification test plan is based on the guidelines of AEC-Q101-REV-C, Stress Test Qualification for Automotive Grade Discrete Semiconductors. — ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)

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Ordering Information Type Luminous Intensity 1) Ordering Code

IF = 30 mAIv

LT E6SG-AABB-36-U686 1120 ... 2800 mcd Q65113A1343

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Maximum RatingsParameter Symbol Values

Operating Temperature Top min. max.

-40 °C 110 °C

Storage Temperature Tstg min. max.

-40 °C 110 °C

Junction Temperature 2) Tj max. 125 °C

Junction Temperature for short time applications* Tj max. 175 °C

Forward current TS = 25 °C

IF min. max.

5 mA 50 mA

Surge Current t ≤ 10 µs; D = 0.005 ; TS = 25 °C

IFS max. 400 mA

Reverse voltage 3) TS = 25 °C

VR max. 5 V

ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)

VESD 2 kV

* The median lifetime (L70/B50) for Tj = 175°C is 100h.

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CharacteristicsIF = 30 mA; TS = 25 °C

Parameter Symbol Values

Peak Wavelength λpeak typ. 520 nm

Dominant Wavelength 4) IF = 30 mA

λdom min. typ. max.

516 nm 530 nm 540 nm

Spectral Bandwidth at 50% Irel,max ∆λ typ. 33 nm

Viewing angle at 50% IV 2φ typ. 120 °

Forward Voltage 5) IF = 30 mA

VF min. typ. max.

2.50 V 2.80 V 3.40 V

Reverse current 3) VR = 5 V

IR typ. max.

0.01 µA 10 µA

Real thermal resistance junction/solderpoint 6) RthJS real max. 180 K / W

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Brightness Groups Group Luminous Intensity 1) Luminous Intensity. 1) Luminous Flux 7)

IF = 30 mA IF = 30 mA IF = 30 mAmin. max. typ.Iv Iv ΦV

AA 1120 mcd 1400 mcd 3780 mlm

AB 1400 mcd 1800 mcd 4800 mlm

BA 1800 mcd 2240 mcd 6060 mlm

BB 2240 mcd 2800 mcd 7560 mlm

Forward Voltage Groups Group Forward Voltage 5) Forward Voltage 5)

IF = 30 mA IF = 30 mAmin. max.VF VF

U6 2.50 V 2.80 V

26 2.80 V 3.10 V

86 3.10 V 3.40 V

Wavelength Groups Group Dominant Wavelength 4) Dominant Wavelength 4)

IF = 30 mA IF = 30 mAmin. max.λdom λdom

3 516 nm 522 nm

4 522 nm 528 nm

5 528 nm 534 nm

6 534 nm 540 nm

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Group Name on Label Example: AA-3-26Brightness Wavelength Forward Voltage

AA 3 26

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Relative Spectral Emission 7)Irel = f (λ); IF = 30 mA; TS = 25 °C

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350 400 450 500 550 600 650 700 750 800

λ [nm]

0,0

0,2

0,4

0,6

0,8

1,0Irel

: Vλ: true green

Radiation Characteristics 7)Irel = f (ϕ); TS = 25 °C

LT E6SG

-100°

-90°

-80°

-70°

-60°

-50°

-40°

-30°

-20°-10° 0° 10° 20° 30° 40° 50° 60° 70° 80° 90°

ϕ [°]

0,0

0,2

0,4

0,6

0,8

1,0Irel

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Forward current 7)IF = f(VF); TS = 25 °C

LT E6SG

2.4 3.52.6 2.8 3.0 3.2 3.4

VF / V

5

20

40

60

80

100IF / mA

Relative Luminous Intensity 7), 8)Iv/Iv(30 mA) = f(IF); TS = 25 °C

LT E6SG

510

05 10 20 30 40 50

IF [mA]

0,3

0,4

0,5

1

2

IVIV(30mA)

Dominant Wavelength 7)λdom = f(IF); TS = 25 °C

LT E6SG

5 20 40 60 80 100

IF / mA

-10

-5

0

5

10∆λ dom / nm

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Forward Voltage 7)ΔVF = VF - VF(25 °C) = f(Tj); IF = 30 mA

LT E6SG

-40 -20 0 20 40 60 80 100 120

Tj / °C

-0.2

0.0

0.2

0.4∆VF / V

Relative Luminous Intensity 7)Iv/Iv(25 °C) = f(Tj); IF = 30 mA

LT E6SG

-40 -20 0 20 40 60 80 100 120

Tj / °C

0.0

0.2

0.4

0.6

0.8

1.0

1.2IvIv(25°C)

Dominant Wavelength 7)λdom = f(Tj); IF = 30 mA

LT E6SG

-40 -20 0 20 40 60 80 100 120

Tj / °C

-8

-6

-4

-2

0

2

4

6

8

10∆λ dom / nm

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Max. Permissible Forward CurrentIF = f(T)

OHL01362

00

ImA

F

˚CT

20 40 60 80 100 120

temp. ambienttemp. solder point

TTS

A

AT TS

10

20

30

40

50

60

Permissible Pulse Handling CapabilityIF = f(tp); D: Duty cycle; TS = 25 °C

0-5

FIA tP=D T

tps

0.20.5

0.05

1

0.1

OHL01546

0.02

0.0050.01

=D

T

tPIF

-410 -310 -210 -110 010 110 21010

0.05

0.10

0.15

0.20

0.25

0.30

0.35

0.45

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Dimensional Drawing 9)

Further Information:

Approximate Weight: 30.0 mg

Package marking: Cathode

Corrosion test: Class: 1B Test condition: 25°C / 75 % RH / 200ppb SO2, 200ppb NO2, 10ppb H2S, 10ppb Cl2 / 21 days (EN 60068-2-60 (Method 4))

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Electrical Internal Circuit

Recommended Solder Pad 9)

OHLPY440

Padgeometrie fürverbesserte Wärmeableitung

improved heat dissipationPaddesign for

LötstoplackSolder resist

0.8 (0.031)

3.7

(0.1

46)

1.1

(0.0

43)

2.3 (0.091)

3.3 (0.130)

1.5

(0.0

59)

11.1

(0.4

37)

Cu Fläche / 16 mm per pad2Cu-area

_<

3.3 (0.130)

Kathode/Cathode

Anode

0.7 (0.028)

Fläche darf bei Verwendung von TOPLED®

For TOPLED® assembly do not use

elektrisch nicht beschaltet werden.

this area for electrical contact

Fläche darf bei Verwendung von TOPLED®

For TOPLED® assembly do not use

elektrisch nicht beschaltet werden.

this area for electrical contact

For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not suitable for ultra sonic cleaning.

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Reflow Soldering ProfileProduct complies to MSL Level 2 acc. to JEDEC J-STD-020E

00

s

OHA04525

50

100

150

200

250

300

50 100 150 200 250 300t

T

˚C

St

t

Pt

Tp240 ˚C

217 ˚C

245 ˚C

25 ˚C

L

Profile Feature Symbol Pb-Free (SnAgCu) Assembly UnitMinimum Recommendation Maximum

Ramp-up rate to preheat*)25 °C to 150 °C

2 3 K/s

Time tSTSmin to TSmax

tS 60 100 120 s

Ramp-up rate to peak*)TSmax to TP

2 3 K/s

Liquidus temperature TL 217 °C

Time above liquidus temperature tL 80 100 s

Peak temperature TP 245 260 °C

Time within 5 °C of the specified peaktemperature TP - 5 K

tP 10 20 30 s

Ramp-down rate*TP to 100 °C

3 6 K/s

Time25 °C to TP

480 s

All temperatures refer to the center of the package, measured on the top of the component* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range

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Taping 9)

OHAY06674 (0.157)

2.9 (0.114)

1.5 (0.059) 4 (0.157)

3.6

(0.1

42)

3.5

(0.1

38)

2 (0.079)

1.75

(0.0

69)

8 (0

.315

)

Cathode/Collector Marking

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Tape and Reel 10)

Reel DimensionsA W Nmin W1 W2 max Pieces per PU

180 mm 8 + 0.3 / - 0.1 mm 60 mm 8.4 + 2 mm 14.4 mm 2000

330 mm 8 + 0.3 / - 0.1 mm 60 mm 8.4 + 2 mm 14.4 mm 8000

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Barcode-Product-Label (BPL)

Dry Packing Process and Materials 9)

OHA00539

OSRA

M

Moisture-sensitive label or print

Barcode label

Desiccant

Humidity indicator

Barcode label

OSRAM

Please check the HIC immidiately afterbag opening.

Discard if circles overrun.Avoid metal contact.

WET

Do not eat.

Comparatorcheck dot

parts still adequately dry.

examine units, if necessary

examine units, if necessary

5%

15%

10%bake units

bake units

If wet,

change desiccant

If wet,

Humidity IndicatorMIL-I-8835

If wet,

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Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.

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NotesThe evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this data sheet falls into the class exempt group (exposure time 10000 s). Under real circumstances (for expo-sure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light sources have a high secondary exposure potential due to their blinding effect. When looking at bright light sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irrita-tion, annoyance, visual impairment, and even accidents, depending on the situation.

Subcomponents of this device contain, in addition to other substances, metal filled materials including silver. Metal filled materials can be affected by environments that contain traces of aggressive substances. There-fore, we recommend that customers minimize device exposure to aggressive substances during storage, production, and use. Devices that showed visible discoloration when tested using the described tests above did show no performance deviations within failure limits during the stated test duration. Respective failure limits are described in the IEC60810.

For further application related information please visit www.osram-os.com/appnotes

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Disclaimer

Attention please!The information describes the type of component and shall not be considered as assured characteristics.Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances.For information on the types in question please contact our Sales Organization.If printed or downloaded, please find the latest version on the OSRAM OS website.

PackingPlease use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred.

Product and functional safety devices/applications or medical devices/applicationsOSRAM OS components are not developed, constructed or tested for the application as safety relevant component or for the application in medical devices.OSRAM OS products are not qualified at module and system level for such application.

In case buyer – or customer supplied by buyer – considers using OSRAM OS components in product safety devices/applications or medical devices/applications, buyer and/or customer has to inform the local sales partner of OSRAM OS immediately and OSRAM OS and buyer and /or customer will analyze and coordi-nate the customer-specific request between OSRAM OS and buyer and/or customer.

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Glossary1) Brightness: Brightness values are measured during a current pulse of typically 25 ms, with an internal

reproducibility of ±8 % and an expanded uncertainty of ±11 % (acc. to GUM with a coverage factor of k = 3).

2) Package discoloration: The LED chip exhibits excellent performance but slight package discoloration occurs at highest temperatures.

3) Reverse Operation: This product is intended to be operated applying a forward current within the specified range. Applying any continuous reverse bias or forward bias below the voltage range of light emission shall be avoided because it may cause migration which can change the electro-optical char-acteristics or damage the LED.

4) Wavelength: The wavelength is measured at a current pulse of typically 25 ms, with an internal repro-ducibility of ±0.5 nm and an expanded uncertainty of ±1 nm (acc. to GUM with a coverage factor of k = 3).

5) Forward Voltage: The forward voltage is measured during a current pulse of typically 8 ms, with an internal reproducibility of ±0.05 V and an expanded uncertainty of ±0.1 V (acc. to GUM with a coverage factor of k = 3).

6) Thermal Resistance: Rth max is based on statistic values (6σ).7) Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devic-

es, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could dif-fer from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice.

8) Characteristic curve: In the range where the line of the graph is broken, you must expect higher differ-ences between single devices within one packing unit.

9) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and dimensions are specified in mm.

10) Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm.

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Revision HistoryVersion Date Change

1.3 2020-06-17 Features Ordering Information Maximum Ratings Characteristics Forward Voltage Groups Wavelength Groups Electro - Optical Characteristics (Diagrams) Further Information Electrical Internal Circuit Schematic Transportation Box Dimensions of Transportation Box Glossary

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Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93055 Regensburg www.osram-os.com © All Rights Reserved.