LTCC Passive Integration Status and challenges Steve Dai, Motorola Labs, Tempe, Arizona Embedded Capacitor Channel/ cavity
Transcript
1. LTCC Passive Integration Status and challenges Steve Dai,
Motorola Labs, Tempe, Arizona Channel/ cavity Embedded
Capacitor
2. Outline Introduction LTCC (Low Temperature Cofired Ceramics)
LTCC materials LTCC Passive integration LTCC feature forming Zero
shrink tape: ideal way for integration? LTCC Applications Wireless
Automotive, energy and others Summary Steve Dai, SICCAS LTCC
Seminar 7_16_2007
3. Introduction Why Passive Integration? Device miniaturization
Greater component density for increased functionality High speed
signal process requires Lower equivalent series inductors Tighter
control of parasitic R, C and L Higher assembly yield Lower system
cost Better reliability * Robert Heistand, ED Online #2718, Feb 2,
2003 Steve Dai, SICCAS LTCC Seminar 7_16_2007