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LTS-4817CKS-P Product Data Sheet LED Display · LITE -ON TECHNOLOGY CORPOR ATION Property of Lite...

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LITE-ON DCC RELEASE LITE-ON Technology Corp. / Optoelectronics No.90,Chien 1 Road, Chung Ho, New Taipei City 23585, Taiwan, R.O.C. Tel: 886-2-2222-6181 Fax: 886-2-2221-1948 / 886-2-2221-0660 http://www.liteon.com/opto LED Display Product Data Sheet LTS-4817CKS-P Spec No.: DS30-2012-0088 Effective Date: 09/07/2012 Revision: - BNS-OD-FC001/A4
Transcript
Page 1: LTS-4817CKS-P Product Data Sheet LED Display · LITE -ON TECHNOLOGY CORPOR ATION Property of Lite -On Only PART NO.:LTS -4817 C K S -P PAGE: 1 of 1 0 BNS -OD -C131/A4 FEATURES à

LITE-ON DCC

RELEASE

LITE-ON Technology Corp. / OptoelectronicsNo.90,Chien 1 Road, Chung Ho, New Taipei City 23585, Taiwan, R.O.C.

Tel: 886-2-2222-6181 Fax: 886-2-2221-1948 / 886-2-2221-0660http://www.liteon.com/opto

LED DisplayProduct Data SheetLTS-4817CKS-P Spec No.: DS30-2012-0088Effective Date: 09/07/2012

Revision: -

BNS-OD-FC001/A4

BNS-OD-FC001/A4

BNS-OD-FC001/A4

BNS-OD-FC001/A4

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LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only

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BNS-OD-C131/A4

LED DISPLAY

LTS-4817CKS-P

DATA SHEET

ITEM Description By DATE

1 New Spec Reo Lin 2012/08/22

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BNS-OD-C131/A4

FEATURES

*0.39 inch (10.0 mm) DIGIT HEIGHT

*CONTINUOUS UNIFORM SEGMENTS

*LOW POWER REQUIREMENT

*EXCELLENT CHARACTERS APPEARANCE

*HIGH BRIGHTNESS & HIGH CONTRAST

*WIDE VIEWING ANGLE

*SOLID STATE RELIABILITY

*CATEGORIZED FOR LUMINOUS INTENSITY

*SMD DISPLAY

*LEAD FREE PACKAGE (ACCORDING TO ROHS)

DESCRIPTION

The LTS-4817CKS-P is a 0.39 inch (10.0 mm) digit height single

digit SMD display. This device uses AS-AlInGaP Yellow LED

chips (AlInGaP epi on GaAs substrate). The display has gray face

and white segments, and suitable for reverse mount assembly.

DEVICE

PART NO. DESCRIPTION

AllnGaP Yellow Common Anode

LTS-4817CKS-P

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BNS-OD-C131/A4

PACKAGE DIMENSIONS

Solder Pad Vs Painting Diagram

R eflector

PC B

Solder Pad

Painting

P lastic burr

0 .14m m M ax

C u 1200μ inch M in

N i 150μ inch M in

Au 4μ inch

Painting 400 μ inch

Scale: 5 :1

0.1

4m

m

NOTES:

1. Plastic pins’ burr max. 0.14 mm,

2. All dimensions are in millimeters. Tolerances are 0.25mm (0.01“) unless otherwise noted.

3. Solder pad materials and thickness: Cu: 1200μinch Ni: Min 150μinch Au: 4μinch.

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BNS-OD-C131/A4

INTERNAL CIRCUIT DIAGRAM

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BNS-OD-C131/A4

PIN CONNECTION

No. CONNECTION

1 CATHODE E

2 CATHODE D

3 COMMON ANODE

4 CATHODE C

5 CATHODE D.P.

6 CATHODE B

7 CATHODE A

8 COMMON ANODE

9 CATHODE F

10 CATHODE G

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BNS-OD-C131/A4

ABSOLUTE MAXIMUM RATING AT Ta = 25oC

PARAMETER MAXIMUM RATING UNIT

Power Dissipation Per Segment 70 mW

Peak Forward Current Per Segment

(Frequency 1Khz,10% duty cycle ) 90 mA

Continuous Forward Current Per Segment 25 mA

Forward Current Derating from 25°C 0.27 mA/°C

Operating Temperature Range -40°C to +105°C

Storage Temperature Range -40°C to +105°C

Iron Soldering Conditions: 1/16 inch Below Seating Plane for 3 Seconds at 260°C

ELECTRICAL / OPTICAL CHARACTERISTICS AT Ta = 25oC

PARAMETER SYMBOL MIN. TYP. MAX. UNIT TEST

CONDITION

Average Luminous Intensity IV 201 650 μcd IF=1mA

Peak Emission Wavelength p 588 nm IF=20mA

Spectral Line Half-Width 15 nm IF=20mA

Dominant Wavelength d 587 nm IF=20mA

Forward Voltage Per Segment VF 2.05 2.6 V IF=20mA

Reverse Current Per Segment(2)

IR 100 uA VR=5V

Luminous Intensity Matching Ratio IV-m 2:1 IF=1mA

Note:

1. Luminous intensity is measured with a light sensor and filter combination that approximates the

CIE (Commision Internationale De L’Eclairage) eye-response curve.

2. Reverse voltage is only for IR test. It can not continue to operate at this situation.

3. Cross talk specification ≦ 2.5%

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BNS-OD-C131/A4

TYPICAL ELECTRICAL / OPTICAL CHARACTERISTIC CURVES

(25oC Ambient Temperature Unless Otherwise Noted)

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BNS-OD-C131/A4

SMT SOLDERING INSTRUCTION

Note:

1. Recommended soldering condition:

Reflow Soldering (Two times only) Soldering Iron (One time only)

Pre-heat:

Pre-heat time:

Peak temperature:

Soldering time:

120~150°C.

120sec. Max.

260°C Max.

5sec. Max.

Temperature

Soldering time

300°C Max.

3sec. Max.

2. Number of reflow process shall be less than 2 times, and cooling process to normal temperature is

required between the first and the second soldering process.

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BNS-OD-C131/A4

RECOMMENDED SOLDERING PATTERN

CUTOUT

Note: All dimensions are in millimeters.

PACKING REEL DIMENSIONS

PS

6

05 0304

0100 02

9

2

1112

101

7

84

3

65

330.0±2.0

100.0±0.5

29.4+1-0.5

24.4+2-0

13.0+0.5-0.2

2.0+0.5-0

120°

21.0±0.5

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BNS-OD-C131/A4

PACKING CARRIER DIMENSIONS

1. Taping parts:

1. 10 sprocket hole pitch cum ulative tolerance ± 0.20.

2. C arrier cam ber is w ithin 1 m m in 250 m m .

4. A ll dim ensions m eet EIA -481-C requirem ents.

6 . Packing length per 22" reel : 45.50 M eters.

7 . C om ponent load per 13" reel : 800 pcs.

5 . Thickness : 0 .40± 0.05m m .

A 0

B 0

K 0

W

10.00± 0.10

16.60± 0.10

4.45± 0.10

24.00± 0.30

K 1 4.15± 0.10

A 1 9.80± 0.10

B 1 16.45± 0.103. M aterial : T ransparent Polystyrene A lloy.(U P-7600)

2. Trailer part/ Leader part:

(40m m M IN .) (400m m M IN .)

(40m m M IN .)

D IR EC TIO N O F PU LLIN G O U T

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BNS-OD-C131/A4

Moisture Proof Packaging

All N/D SMD displays are shipped in moisture proof package. The displays should be stored at 30°C or

less and 90% RH or less. Once the package opened, moisture absorption begins.

Baking Conditions

If the parts are not stored in dry conditions, they must be baked before reflow to prevent damage to the parts.

Package Temperature Time

In Reel 60°C ≧48hours

In Bulk 100°C ≧4hours

125°C ≧2hours

Baking should only be done once.

UNITS IN A SEALED

MOISTURE-PROOF

PACKAGE

PACKAGE IS

OPENED (UNSEALED)

ENVIRONMENT LESS

THAN 30oC, AND

LESS THAN 60% RH?

PERFORM

RECOMMENDED

BAKING CONDITIONS

BAKING IS NOT

NECESSARY

PACKAGE IS

OPENED MORE

THAN 1 WEEK

DAYS?

YES

NO

YES

NO


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