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CYCLONE - CARTRIDGE - ELECTROSTATIC SOD m S800 CFM's DUST - SMOKE - FUME - MIST COLLECTORS conditioning means includes make up means for adding elec- troless plating ingredients to keep the plating ingredients in the so- lution properly in balance. CLlANING IUCTIIONIC HAIIDWARt COMPONINTS u.s. Patent 5,865,902. Feb. 2, 1999 B.S. Yam and K.S. CoLbert, assiJ(nors to Church & Dwight Co. Inc., Princeton, N.J. A blast medium for cleaning elec- tronic hardware comprising wa- ter-soluble alkaline metal salt abrasive particles having a parti- cle size of at least 20 microns but not more than 300 microns and a Mohs hardness of no greater than 5.0; a chloride content of no more than 100 ppm; a chemical oxygen demand orno more than 100 ppm; and a moisture content of no more than 0.20% by weight, wherein the blast medium is free of silica and organic-containing flow aids. ...GNIITIION SPUnIRINtI APPARATUS U.S. Patent 5,865,961. Feb. 2, 1999 M. Yokoyama et aL., assignors to Matsushita ELectric Industrial Co. Ltd.• Kadoma, Japan A method of magnetron sputter- ing comprising generating plasma in a vicinity of a plurality of an- nular flat targets; supplying elec- tric power to the targets; and gen- erating magnetic fields that form approximately parallel to the front surfaces of the targets and that have approximately uniform intensities with the magnets that are located along the inner and outer circumferential edges of the targets so as to distribute the plasma approximately uniformly. .. APPARATUS U.S. Patent 5,865,969. Feb. 2, 1999 P.J. Clarke, assignor to Sputtered Films Inc., Santa Barbara, Calif. An apparatus for providing a con- trolled deposition on a substrate including means for providing a rotation of the substrate on a par- ticular axis; a pair of anodes dis- posed on opposite sides of the par- ticular axis; a pair of targets each associated with an individual one of the anodes; means for introduc- ing inert gas; means for applying an alternating voltage between each individual one of the anodes and the associated one of the tar- gets to establish an electrical field for a flow of electrons; and means disposed relative to the anodes and the targets for providing a movement of the electrons be- tween each anode and the associ- ated target through other than a straight line path to enhance the ionization of the atoms of the in- ert gas and the emission of the sputtered atoms from such target for movement toward the sub- strate. ... GNIT S'IIIUC'IU. POll ... IN SPUn'IIII_ U.S. Patent 5,865,970. Feb. 2, 1999 R.E. SteLter, assignor to Permag Corp., Fremont, CaLif. A permanent magnet structure in a magnetron utilized in sputter depositing of a target material onto a substrate comprising a base plate; and a central magnet struc- ture having a magnetic field orien- tation substantially parallel to the base plate and target material. 1600 Douglas· Kalamazoo, MI· (616) 345·7151 Circle 029 on reader Information card 90 PLATING MITIIOD U.S. Patent 5,865,976. Feb. 2, 1999 H. Takeuchi et al., assignors to Metal Finishing
