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2[Do It Now] [Execution defines Value]Confidential : Properties of Kolon Ind., Inc.
KS-8700 Series
GENERAL FEATURES
Scum Free
Excellent Plating Chemical Tolerance Excellent Alkaline Etching Resistance
APPLICATION
Plating Process Selective Gold Plating Alkaline Etching
FILM SPECIFICATION
Thickness : 40, 50 m Color (Unexposed) : Green Color (Exposed) : Blue
3[Do It Now] [Execution defines Value]Confidential : Properties of Kolon Ind., Inc.
General Properties [Circuit Properties]
KP-2140 KP-2150Dry film Thickness (m) 38 48
Minimum Develop Time (sec.) 26 34
Step 21sst 41sst
ExposureProperty
Exposure Energy *1
(mJ/cm2)
6 16 17 19
7 19 24 27
8 22 34 40
9 25 52 60
Circuit *2
Properties
Resolution(m)
6 16 29 32
7 19 31 35
8 22 38 42
9 25 46 50
Adhesion(m)
6 16 43 57
7 19 35 48
8 22 27 40
9 25 25 31
L/S=1/1 Resolution(m)
6 16 37 53
7 19 33 44
8 22 39 40
9 25 48 50
*1: Exposure Energy ; Real Exposure energy (ORC UV meter), *2: Circuit properties : Perkin-Elmer 5Kw Collimated Exposure, KOLON TEST Artwork ( Glass Artwork)
4[Do It Now] [Execution defines Value]Confidential : Properties of Kolon Ind., Inc.
General Properties [Strip Properties]
KP-2140 KP-2150
Step 21sst 41sst
Strip
Properties
Stripping Time
(sec)
3.0 wt% NaOH
6 16 37 45
7 19 46 65
8 22 53 78
9 25 63 93
TentingStrength(kg)
Instron0.63 0.71
Elongation(mm) 2.7 2.6
Scum Scum Generator Scum free Scum free
Skin Size - S : Small, M : Medium, L : Large
5[Do It Now] [Execution defines Value]Confidential : Properties of Kolon Ind., Inc.
Sensitivity vs. Exposure Energy
Test condition •Stouffer 21 and 41 Step Tablet, Resist step• Exposure System : Perkin-Elmer 5kw Collimated Exposure
1724
34
52
19
27
40
60
0
10
20
30
40
50
60
70
80
90
100
15 16 17 18 19 20 21 22 23 24 25 26
Step Held (41 SST)
Stou
ffer 4
1 St
ep T
able
t
KP-2140
KP-2150
6[Do It Now] [Execution defines Value]Confidential : Properties of Kolon Ind., Inc.
Resolution
2931
38
46
3235
42
50
0
10
20
30
40
50
60
15 16 17 18 19 20 21 22 23 24 25 26Step Held (41 SST)
Res
olut
ion
(m
)KP-2140
KP-2150
Test Condition•Stouffer 21 and 41 Step Tablet, Resist step•Test Artwork : KOLON Test Artwork(Glass Artwork)•Lamination Condition : Auto cut sheet laminator(Hakuto 610-I), Temp. 110 C, Pressure 4kg/cm2, speed 2.0m/min•Develop. condition : 1.0wt% Na2CO3, Temp. 30 ,Break Point 50%, Spray pressure 1.5kg/cm℃ 2
7[Do It Now] [Execution defines Value]Confidential : Properties of Kolon Ind., Inc.
Adhesion (Minimum Survived Line Width)
43
35
2725
57
48
40
31
0
10
20
30
40
50
60
15 16 17 18 19 20 21 22 23 24 25 26Step Held (41 SST)
Adh
esio
n (
m)
KP-2140KP-2150
Test Condition•Stouffer 21 and 41 Step Tablet, Resist step•Test Artwork : KOLON Test Artwork(Glass Artwork)•Lamination Condition : Auto cut sheet laminator(Hakuto 610-I), Temp. 110 C, Pressure 4kg/cm2, speed 2.0m/min•Develop. condition : 1.0wt% Na2CO3, Temp. 30 ,Break Point 50%, Spray pressure 1.5kg/cm℃ 2
8[Do It Now] [Execution defines Value]Confidential : Properties of Kolon Ind., Inc.
1/1 Resolution
3733
39
4853
4440
50
0
10
20
30
40
50
60
15 16 17 18 19 20 21 22 23 24 25 26Step Held (41 SST)
1/1
Res
olut
ion
(m
)
KP-2140KP-2150
Test Condition•Stouffer 21 and 41 Step Tablet, Resist step•Test Artwork : KOLON Test Artwork(Glass Artwork)•Lamination Condition : Auto cut sheet laminator(Hakuto 610-I), Temp. 110 C, Pressure 4kg/cm2, speed 2.0m/min•Develop. condition : 1.0wt% Na2CO3, Temp. 30 ,Break Point 50%, Spray pressure 1.5kg/cm℃ 2
9[Do It Now] [Execution defines Value]Confidential : Properties of Kolon Ind., Inc.
Strip Properties
0
10
20
30
40
50
60
70
80
15 16 17 18 19 20 21 22 23 24 25 26Step Held (41 SST)
Stri
ppin
g Ti
me(
sec.
)KP-2140 3wt%KP-2150 3wt%
Test Condition• Pretreatment ->Lamination->Exposure->Develop->Etching -> Strip •Temperature : 50 C, Conc. : NaOH 3, 4 wt%•TEST Method : Dipping Method
10[Do It Now] [Execution defines Value]Confidential : Properties of Kolon Ind., Inc.
Tenting: INSTRON Method
KP-2140 KP-2150
Step Held
(21 SST and 41 SST)8/21 ; 22/41 8/21 ; 22/41
Strength(kg) 0.63 0.71
Elongation(mm) 2.7 2.6
INSTRON
X = 3ØY = 6Ø
Copper Board
Dry film Photoresist
Probe
x
y
Stress/StrainX = 3ØY = 6Ø
Stress : Load of Max load when the 6mm hole broken. Average of 8 times test.
Strain : Displacement during the hole broken at Max.load(mm) Average of 8 times test.
0.0
0.5
1.0
1.5
2.0
2.5
3.0
Strength(Kg) Elongation(mm)Tenting
KP-2140KP-2150
11[Do It Now] [Execution defines Value]Confidential : Properties of Kolon Ind., Inc.
SEM Images of KP-2140(X200, X350)
Line / Space = 50 / 50 m
200 Times
350 Times
19 / 41SST(7 / 21SST) 22 / 41SST(8 / 21SST) 25 / 41SST(9 / 21SST)
12[Do It Now] [Execution defines Value]Confidential : Properties of Kolon Ind., Inc.
SEM Images of KP-2150(X250, X400)
Line / Space = 50 / 50 m
250 Times
400 Times
19 / 41SST(7 / 21SST) 22 / 41SST(8 / 21SST) 25 / 41SST(9 / 21SST)
13[Do It Now] [Execution defines Value]Confidential : Properties of Kolon Ind., Inc.
Evaluation Parameters (Sensitivity)
Optical DuPont Stouffer Stouffer StoufferDensity 25 Step Tab. 21 Step Tab. 31 Step Tab. 41 Step Tab.0.00 10.05 1 10.10 2 20.15 30.20 2 3 40.25 50.30 4 60.35 3 70.40 5 80.45 90.50 1 4 6 100.55 2 110.60 3 7 120.65 4 5 130.70 5 8 140.75 6 150.80 7 6 9 160.85 8 170.90 9 10 180.95 10 7 191.00 11 11 201.05 12 211.10 13 8 12 221.15 14 231.20 15 13 241.25 16 9 251.30 17 14 261.35 18 271.40 19 10 15 28
Step Tablet Relationships
2345678
KolonStep(21)
91011121314
2345678
KolonStep(21)
91011121314
Exposure
Step Held
Development
14[Do It Now] [Execution defines Value]Confidential : Properties of Kolon Ind., Inc.
General Process Guideline
Process Recomendation Specification
Lamination
Roll Temp. (°C) 110 ± 10
Exit Temp.: 50 10 °CSpeed (m/min) 2.0 ± 1.0
Roll Pressure (Kgf/cm2) 3.5 ± 1.5
Holding Time Time (min) 15min – 8hrs Under Yellow Light
Exposure Exposure Energy (mJ/cm2)Step Held7~10/21ST
Without ArtworkResist Step
Holding Time Time (min) 15min – 8hrs Under Yellow Light
Development
Chemical 1.0 ± 0.2wt% Na2CO3 *Antifoam:
Non-silicon Type
(0.05 ~ 0.1 vol%)
Temp. (°C) 30 ± 2
Break Point 50~70%
Spray Pressure (Kgf/cm2) 2.0 ± 0.5
Stripping
Chemical 2 - 4wt% NaOH
Temp. (°C) 45-55
Break Point 40~60%
* Clean Room: 20~22 °C, 50 ± 10 % RH