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From Technologies to Markets © 2019 Advanced Packaging Trends in this Era of Digital New Age Market Briefing 23-April-2019 Santosh KUMAR Director & Principal Analyst | [email protected] Favier SHOO Technology & Market Analyst | [email protected]
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Page 1: Market Briefing: Advanced Packaging Trends in this Era of ... · Large Logics/Memories ≤2018 : Technology Benchmark 2019 - 2030 : MEGA TRENDS for Digital New Age ... RFFE is a sophisticated

From Technologies to Markets

© 2019

Advanced Packaging Trends

in this Era of Digital New Age

Market Briefing

23-April-2019

Santosh KUMAR

Director & Principal Analyst | [email protected]

Favier SHOO

Technology & Market Analyst | [email protected]

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2

APU

DRAM

2019 Symposium on Advanced Packaging & System Integration Technology | Powered by Yole Développement & Hosted by NCAP China | www.yole.fr | ©2019

MARKET-APPLICATION ROADMAP DRIVEN BY MEGA TRENDS

IO Counts

10000

100

1000

2x2 10x10 20x20 50x50 >>50x50

Package Size (mm)

GPU, CPU

CPU +

Memories

Codec

WiFi

MEMS

Display

Drivers

BB

PMIC

RF

APU

DRAM

(X)PU / FPGA +

Memories (HBM)

Large

Logics/Memories

2019 - 2030 : MEGA TRENDS for Digital New Age≤ 2018 : Technology Benchmark

COMPUTING

MOBILE

WIRELESS

IO Counts

10000

100

1000

2x2 10x10 20x20 50x50 >>50x50

Package Size (mm)

GPU, CPU

CPU +

Memories

Codec

WiFi

MEMS

Display

Drivers

BB

PMIC

RF

(X)PU / FPGA +

Memories (HBM)

Large

Logics/Memories

5G

IoT

Big Data

Al, Smart

COMPUTING

MOBILE

Only major trends/markets are considered

WIRELESS

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32019 Symposium on Advanced Packaging & System Integration Technology | Powered by Yole Développement & Hosted by NCAP China | www.yole.fr | ©2019

DIGITAL NEW AGE: NEW TRENDS

2030

Imaging

1995 20062000 2010 2014 2017

TRENDS

1990 2020

Audio

Smartwatchwith AI

Smartphone

Virtualassistant

Next-genassistant

Smartphone with AI

Olfactometry

Smelling AI

2040

Motion sensing

Holographic interaction

Augmented human

Robot home

Disruptive Technology

Hyper

Data Center

Driver-less

Mobile

HD Voice

Processing

PC Mobile Smart Robotics Human Augmentation

EDGECLOUD SPECIALIZATION

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42019 Symposium on Advanced Packaging & System Integration Technology | Powered by Yole Développement & Hosted by NCAP China | www.yole.fr | ©2019

TECHNOLOGY ROADMAP: FROM NANO-SCALE TO MICRO-SCALE..

2014 2016 2018 2020 2022 2024

Assumed

Moore’s Law

Die to Substrate

Bump Pitch (μm)

RDL L/S (μm)

Solder Ball Pitch

(μm)

22nm 14nm 10nm 7nm

28nm 14nm 10nm 7nm 5nm 3nm

20nm 16nm 10nm 7nm 5nm 3nm

20nm 14nm (licensed) Stopped

Adva

nce

d N

odes*

Adva

nce

d P

ackag

ing

16/14nm 10nm 7nm 5nm 3nm

200 to 150 μm 150 to 80 μm 60 to 40 μm <40 μm

15/15 to 9/9 μm 10/10 to 8/8 μm 8/8 to 5/5 μm < 2/2 μm

400/350 μm 300 μm

6nm

Average trends of the various industry players

Non-exhaustive list of players listed

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52019 Symposium on Advanced Packaging & System Integration Technology | Powered by Yole Développement & Hosted by NCAP China | www.yole.fr | ©2019

PACKAGING MARKET GROWTH

2014 2023

$53 B

$84 B

Global Packaging

Conventional Packaging

Advanced Packaging

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6

258

105

2066

530

90

2019 Symposium on Advanced Packaging & System Integration Technology | Powered by Yole Développement & Hosted by NCAP China | www.yole.fr | ©2019

CONSUMER MARKET OVERVIEW: TOTAL UNITS IN 2018

MOBILE

68%

COMPUTING

9%

WEARABLES

3%

ENTERTAINMENT

17%

IoT

3%

3 Billion Units

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72019 Symposium on Advanced Packaging & System Integration Technology | Powered by Yole Développement & Hosted by NCAP China | www.yole.fr | ©2019

APPLICATION PROCESSOR ENGINE (APE) - TRENDS IN SMARTPHONES

600

Processor packaging thickness*

2015 2016 2017 2018

300

200

400

500

MCeP

inFO-PoP

MCePMCeP

inFO-PoP

FCCSP FCCSPFCCSP

FC CSP

≥2019

inFO-PoP

ePLP-PoP

?

Fan-Out Fan-Out? Fan-Out?

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8

FAN-OUT APPLICATIONS

Orange: Devices that can be found in

FOWLP packages today

Green: Devices that could be found

in the future in FOWLPGrey: Devices that will likely remain on WLCSP or

flip-chip package or move to 3DIC or Embedded

die

Apple iPhone 8 and X (2017)

A11 APE – InFO package (TSMC)

Samsung Galaxy S7 (2016)Qualcomm Audio Codec

WCD9335 – eWLB package by

Amkor Portugal (Nanium) or JCET

(STATS ChipPAC)

Bosch MRR1Plus Radar (2015)Infineon RASIC™ (77GHz RADAR System

IC Chipset) – eWLB Package

BK Ultrasound Sonic Window (2015)Multichip Module – eWLB Package Amkor Portugal

(Nanium)

Continental ARS400 Radar (2015)NXP MR2001 (77GHz multichannel

RADAR) – RCP Package

Applications out of mobile market

NXP SCM-iMX6Q (2017)APE, PMIC and Flash memory – Fan-Out PoP

(Nepes)

Apple iPhone 7 (2016)

A10 APE – InFO package (TSMC)

Apple iPhone XS and XR (2018)

A12 APE – InFO package (TSMC)

Samsung Exynos 9110 ePLP (2018)APE, PMIC– FOPLP (SEMCO)

2019 Symposium on Advanced Packaging & System Integration Technology | Powered by Yole Développement & Hosted by NCAP China | www.yole.fr | ©2019

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92019 Symposium on Advanced Packaging & System Integration Technology | Powered by Yole Développement & Hosted by NCAP China | www.yole.fr | ©2019

FAN-OUT PACKAGING EVOLUTION

A long and volatile journey yet history is still in the making…

≤2007

Chip-First

Face-Up

Fan-Out

Chip-First

Face-Down

Fan-Out

eWLB creation

RCP creation

RCP licensing and first volume

eWLB licensing and first volume

2010 2012 20152013 20142008 2009 20162011

Early Fan-Out Activities(long history, high volume)

Recent Fan-Out InflectionCreation of many new technology and IP

RDL-First R&D

InFO creation

2017

InFO first volume

M-Series creation

Chip-Last

Fan-Out

ePLP firstvolume

2018

HD

FOWLP

made

possible

2019 2020

HD

FOPLP

Possible Scenario

FOWLP

vsFOPLP

1 new player in HD FOCost Pressure in Core FO

vs

vs

HD FO

Core FO

FOPLP

Milestone

Achieved

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102019 Symposium on Advanced Packaging & System Integration Technology | Powered by Yole Développement & Hosted by NCAP China | www.yole.fr | ©2019

FAN-OUT MARKET: BUSINESS MODEL EVOLUTION

100%

$244 M*

2015

OSAT only

65%

35%

$847 M*

2017

Foundry Impact

2019

IDM Entry

10%

71%

19%

$3,864 M*

2024

Foundry vs IDM

CAGR +51%

CAGR +23%

CAGR +19%

6%

65%

28%

$1,584 M*

*Total Market Value based on revenue

OSAT Foundry IDM

Page 11: Market Briefing: Advanced Packaging Trends in this Era of ... · Large Logics/Memories ≤2018 : Technology Benchmark 2019 - 2030 : MEGA TRENDS for Digital New Age ... RFFE is a sophisticated

© 2019

Advanced RF SiP Trends for Cellphones

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12

LTE-A

Pro

CELLULAR TECHNOLOGY DEVELOPMENT

From 2G to 5G: Less than a 30 year journey

1992 1997 2001 2007 2010 2013 2018 2020

GSM GPRS EDGE

CDMA CDMA2000 1xRTTCDMA2000

1xEV-DO

WCDMA

TD-SCDMA

TD-CDMA

EV-DO Rev

A/B/C

HSPA HSPA+

TD-HSPA

TDD-LTE

FDD-LTE

TDD-

LTE-

Advanced

FDD-

LTE-

Advanced

5G sub-6GHz 5G mmWave

2G 2.5G 2.75G/Pre-3G 3G 3.5G 3.9G/Pre-4G 4G Pre-5G 5G4.5G

Other standards from IEEE family

including WiMAX and iBurst

It takes around 10 years between two cellular generations, including a long transition phase with intermediate technologies.

Ideal conditions, theoretically possible Deployment in reality, upper limit observed

2019 Symposium on Advanced Packaging & System Integration Technology | Powered by Yole Développement & Hosted by NCAP China | www.yole.fr | ©2019

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2019 Symposium on Advanced Packaging & System Integration Technology | Powered by Yole Développement & Hosted by NCAP China | www.yole.fr | ©2019 1313

20252024

2023

2022

2021

2020

2019

2018

2017

Fre

quency

(GH

z)

APPLICATION MAPPING

5G use cases extend far beyond the mobile phone, from IoT to autonomous vehicles, creating new challenges for the network in terms of data rate and latency agility.

4K video streaming

New Gaming Content

Wireless VR

AR

Port Management

Medical Robot

Industrial Automation

Smart City

Remote Surveillance

360° Video Telepresence

Drone Delivery

Autonomous Vehicle

Agriculture

Real-time Translation

Advanced AI assistant

Connected

Wearable

Cloud Computing

Connected Home

Smart Grid

Asset Tracking

Shared Utilities

Robotic Service

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142019 Symposium on Advanced Packaging & System Integration Technology | Powered by Yole Développement & Hosted by NCAP China | www.yole.fr | ©2019

RF FRONT-END COMPONENTS

Filters/ Duplexers PA LNA Switches RF transceiver Antenna Passives

Cellular

PAMiD X X X X X

PAD X X X

RxDM X X X X

ASM X X

Antennaplexers

(multiplexer) X X

LMM (Low noise amplifier -

multiplexer module)X X

MMMB PA (Multi-Mode,

Multi-Band Power Amplifier)X X

mmWave FEM X X X

ConnectivityWiFi FEM X X X X

WiGiG FEM X X X

RFFE is a sophisticated set of technologies and components situated between the modem and the antenna, and is

responsible for physically transmitting and receiving information over the air.

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15152019 Symposium on Advanced Packaging & System Integration Technology | Powered by Yole Développement & Hosted by NCAP China | www.yole.fr | ©2019

INSIDE RF SIP

• SiP reach high level of integration and accommodate heterogeneous technology from III-V compound semiconductor to Silicon ICs through specialty MEM’s acoustic resonator

AFEM-8072

Avago MHB PAMiD

MB BAW filtersHB BAW filters

Switches

PAs

passives

LNA

SAW filters LNASwitches

SKY78140

Skyworks RxDM

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16162019 Symposium on Advanced Packaging & System Integration Technology | Powered by Yole Développement & Hosted by NCAP China | www.yole.fr | ©2019

RF CONTENT EVOLUTION IN MOBILE PHONE

In every cellular generation evolution leads to new technology and additional RF content.

4x4 MIMO

Dual connectivity

Diversity

Wi-Fi 2x2 MIMO

Carrier Aggregation

High band

Carrier Aggregation

Ultra high band

RF

co

nte

nt –

rela

tive

scale

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17172019 Symposium on Advanced Packaging & System Integration Technology | Powered by Yole Développement & Hosted by NCAP China | www.yole.fr | ©2019

MOBILE BROADBAND RF FRONT-END EVOLUTION

RF Front-End continues to evolve. First step is merging high and mid bands, densification and continuous support for carrier aggregation. New Radio bands to be integrated into ultra high band module with dual connectivity.

Finally, mmWave should come on top of that beyond 2020.

HB module

MB module

LB module

UHB module

HB+MB module

LB module

UHB module

HB+MB module

LB module

2017 2018 2019

NR band dual

connectivity

600 MHz inclusion

More CA

Band refarming

Densification

> 2020

UHB module

HB+MB module

LB module

mmWave module

Band refarming

mmWave module

Sam

e t

ech

nolo

gy

More

com

ple

xity

More

densi

fica

tion

Dis

ruption

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18

MOBILE RF FEM PACKAGE TRENDLe

vel o

f in

tegr

ation

Freq

uen

cy b

ands

Discrete PA pkg. Single-side SiP

Antenna in/on package

2G (GSM) 3G(WCDMA) 4G (LTE) 5G sub 6GHz

Antenna outside phone body

10

15

20

25

30

35

No FEM,

Discrete PA

Usually 1 FEM (Tx,Rx)

Discrete PA still main

3-5 FEM

PA + FEM

integrationDis

crete

pkg

Hig

hly

inte

grat

ed S

iP

5G mmWave

20202019

Antenna “on phone case” Antenna on flex PCB

2008 2013

Double-side SiP

5-7 FEM

PA + FEM integration7-9 FEM

PA + Antenna + RFIC+

FEM+ integration

Enhanced double-side SiP

PA + Antenna + RFIC+

FEM + Modem

integration

2022 &

beyond

Future

direction ??

Need disruptive innovation

in packaging

2019 Symposium on Advanced Packaging & System Integration Technology | Powered by Yole Développement & Hosted by NCAP China | www.yole.fr | ©2019

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192019 Symposium on Advanced Packaging & System Integration Technology | Powered by Yole Développement & Hosted by NCAP China | www.yole.fr | ©2019

TECHNOLOGY TOOLBOX FOR RF SiP FOR 5G MOBILE

Packaging innovations needed at

various levels

Double side BGA assembly

Double side mold

Embedded active & passives

Conformal & compartmental

shielding

Thin substrate, fine L/S

Miniaturized passive

components

Antenna in package

integration

Low loss materials

Compression Molding

High accuracy , high speed pick

& place

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20

ANTENNA IN PACKAGE (AIP) SOLUTIONS

Various solutions are proposed for integrating

antenna element with RF

components for 5G mobile

communication

AiP

Flip chip

Fan-out

PoP type Source: JECT/ STATSChipPAC

Source: TSMC

Source: ASE

Integrate Patch antenna array & Yagi-Uda

antennas in a package.

• Low Dk/Df materials for better signal

integrity.

2019 Symposium on Advanced Packaging & System Integration Technology | Powered by Yole Développement & Hosted by NCAP China | www.yole.fr | ©2019

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21

ASSEMBLY / PACKAGING MARKET FOR RF SiP FOR MOBILE

Assembly of various RF

components in SiPs basically consists of 2 processes: wafer level

assembly & SiP level assembly

Assembly of RF components

Wafer level

SiP level

Cap wafer

bondingTSV

RDL/

UBMBumping Dicing

SMT Wire bond Molding Shielding BGA/LGA

Wafer

grinding

Wafer

dicingInspection

Components available

as SMT components in

SiP assembly / Flip-chip

Components available as

bare dies (in wafer form)

in SiP assembly / wire-

bond process

Test

Included in

market forecast

Included in

market forecast

BAW filters SAW filters Filters / Switches / IPDs

Prior to SiP

assembly

2019 Symposium on Advanced Packaging & System Integration Technology | Powered by Yole Développement & Hosted by NCAP China | www.yole.fr | ©2019

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22

TOTAL ASSEMBLY/PACKAGING MARKET FORECAST FOR RF SiP IN MOBILE

The share of WLP for RF components

assembly prior to SiP assembly will decrease from 9% in

2017 to 8% in 2023

CAGR2017-2020 ~11%

WLP

8%

SiP

92%

2023

($5.3B)

2019 Symposium on Advanced Packaging & System Integration Technology | Powered by Yole Développement & Hosted by NCAP China | www.yole.fr | ©2019

Page 23: Market Briefing: Advanced Packaging Trends in this Era of ... · Large Logics/Memories ≤2018 : Technology Benchmark 2019 - 2030 : MEGA TRENDS for Digital New Age ... RFFE is a sophisticated

232019 Symposium on Advanced Packaging & System Integration Technology | Powered by Yole Développement & Hosted by NCAP China | www.yole.fr | ©2019

RF FEM MARKET FORECAST

By share of various RF FEMs SiP (in $M)

PAMiD market share by

revenue will increase from

23% in 2018 to 39% in 2023.

PAMiD

PAM

Rx DM

ASM (switchplexer)

antennaplexers

(multiplexer)

LMM

MMMB PA

mmW FEM

WiFi FEM

WiGig FEM

2023

($4.9B)

PAMiD

PAM

Rx DM

ASM

(switchplexer)

antennaplexers

(multiplexer)

LMM

MMMB PA

WiFi FEM WiGig FEM

2018

( $3.07B)

Page 24: Market Briefing: Advanced Packaging Trends in this Era of ... · Large Logics/Memories ≤2018 : Technology Benchmark 2019 - 2030 : MEGA TRENDS for Digital New Age ... RFFE is a sophisticated

Automotive Packaging Trend

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25

HOW SIGNIFICANT IS THE AUTOMOTIVE INDUSTRY?

Two industries, both controlled by giant companies with ~$250B in revenue

$1.2T

≈ ≈ ≈ ≈ $250B

$2.3T

Automotive electronics

$142B

x2

$3.7BAutomotive packaging

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26

THE TWO CURRENT BIG TRENDS FOR VEHICLES

Impact of electrification should be limited in the next 5 years but, at long term, the story is different. Automation guides innovation.

• ~1 - 2Mu in 2022

• ~5Mu in 2027 (Level 3*)

Automation

• ~14Mu in 2022

• ~25 - 30Mu in 2027

Electrification**

Thermal vehicles

94Mu

vehicles

105Mu

vehicles

* Level 3 = hands-off / ** Includes hybrids2017 2027

EV/HEV/hybrids

Automated vehicles sold

Non-thermal vehicles sold

A 3rd trend will appear

soon together with the

other two: More

connectivity

2019 Symposium on Advanced Packaging & System Integration Technology | Powered by Yole Développement & Hosted by NCAP China | www.yole.fr | ©2019

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27

MORE AUTONOMY

2015 2016 2017 2018 2019 2020 2021 2022 2023 2024 2025 2026 2027 2028 2029 2030 2031 2032 2033 2034 2035 2036 2037 2038 2039 2040 2041 2042 2043 2044 2045 2046 2047 2048 2049 2050

Car

sal

es

(Munits)

Potential evolution of autonomous car sales by level of automation

Vehicle Level 0 Vehicle Level 1 Vehicle Level 2 Vehicle Level 3 Vehicle Level 4 Vehicle Level 5 Vehicle On Demand

02 3

54

By 2045, more than 70% of all vehicles sold will integrate autonomous capabilities!

2019 Symposium on Advanced Packaging & System Integration Technology | Powered by Yole Développement & Hosted by NCAP China | www.yole.fr | ©2019

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28

AUTONOMOUS VEHICLES - THE DISRUPTION CASE

Two distinctive paths for autonomous vehicle

Both strategies end up at the same place –Autonomous driving

Level 1 Level 2 Level 3 Level 4 Level 5

Where?

Autonomous

driving

Robotic

vehicle

ADAS vehicle

Some players may want

to change side

How?

2019 Symposium on Advanced Packaging & System Integration Technology | Powered by Yole Développement & Hosted by NCAP China | www.yole.fr | ©2019

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29

MAIN TREND 3: CONNECTIVITY

Connecting Internally

• For infotainment onboard:

• Wifi, streaming, etc…

• In-cabin sensors

• Sensor connection of the vehicle

Source: Bosch

Source: Bosch

Connecting Externally

• Connecting to other vehicles for safety and autonomous driving

• Connecting to external facilities

• Development aligned with 5G trend

• Together with more autonomy and 5G future deployment, a 3rd main trend will appear: More connectivity in the car

• Connecting the car both internally and externally will become more and more important

• Numerous electronics-based applications will develop

2019 Symposium on Advanced Packaging & System Integration Technology | Powered by Yole Développement & Hosted by NCAP China | www.yole.fr | ©2019

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30

Group of

devices

Power conversion

ADAS sensors

MEMS & sensors

LightingProcessing & Storage

Connectivity Modules / Telematics

Display

MICROELECTRONICS IN AUTOMOTIVE

Different electronics devices familyMOSFET, IGBTs, DC-

DC convertor, GaN

HEMT etc.

RADAR, LiDAR, CIS,

Infrared Imager.

Accelerometers

Gyroscope

Microphones

Pressure sensor

Micro bolometer

Micromirror IMUs

Magnetometer Ultrasonic

Humidity sensor

Front light, Rear light,

Interior lighting, etc

CPU/GPU, Memory,

ECU, MCUs

Antenna, WiFi,

Switch, GPS,

FEM

Screen, ToF

sensor

2019 Symposium on Advanced Packaging & System Integration Technology | Powered by Yole Développement & Hosted by NCAP China | www.yole.fr | ©2019

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31

GENERAL TRENDS IN AUTOMOTIVE PACKAGING

Reliability

Power

Power density

Complexity of Integration

Data processing

Years

Requirements

Cost

Defects

Foot Print

2019 Symposium on Advanced Packaging & System Integration Technology | Powered by Yole Développement & Hosted by NCAP China | www.yole.fr | ©2019

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32

ADAS COMPUTING HARDWARE TREND

Ultrasonic

Radar

Forward Camera

Surround Camera

Driver Camera

LiDAR

Fusion

Fusion

Functionalities

Level 1

ACC: Automatic Cruise Control

AEB: Advanced Emergency Braking

CTA: Cross Traffic Alert

TJA: Traffic Jam Assist

PA: Park Assist

LKA: Lane Keeping Assist

DM: Driver Monitoring

HP: Highway Pilot

AP: Auto Pilot

ACC Level 2

PALKA

ACC

TJA

Level 3

PALKA

ACC

TJA

AEB DM TJA

Level 4

PALKA

ACC

TJA

AEB DM TJA

HPLevel 5

PALKA

ACC

TJA

AEB DM TJA

AP

Fusion

Fusion

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TREND FOR HARDWARE FOR INFOTAINMENT

From MCU to fusion platform

Utilization of the existing resources provided by the computing platform used for safety and autonomy

Level 1 Level 2 Level 3 Level 4 Level 5

Intelligence

ADAS level

Single SoC

Fusion platform

for both

Multi chips (MCUs)

• Instead of having multiple processing die for each infotainment application, the goal now is to merge all thecomputing on a SoC. For upper ADAS level 3 to 5 infotainment system might take advantage of the GPU build in forADAS. Infotainment that require deep learning processing will come with this higher ADAS level cars. Two scenarioscould be possible:

?

Fusion

platform for

ADASOne SoC for

infotainment

+

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EXAMPLE OF ADAS COMPUTING HARDWARE

Fusion Platform – NVidia

Drive PX XavierFusion Platform –

Renesas R-CAR H3

FPGA – Xilinx ZYNQVP – Intel Mobileye

EyeQ5

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352019 Symposium on Advanced Packaging & System Integration Technology | Powered by Yole Développement & Hosted by NCAP China | www.yole.fr | ©2019

EXAMPLE OF SoC PLATFORMS FOR INFOTAINMENT USING AI

Product ApplicationComputingCompany

R-Car H3

Snapdragon 820

Automotive Platform

Intel® GO™ Platform

for In-Vehicle Experiences

Infotainment using AI

Infotainment using AI

Infotainment using AI

Infotainment using AIArm-based multi-core platform

Cortex-A5/ Cortex-M4/Cortex-MO+ MAC57D5xx MCU family

Arm® Cortex®-A57 Cortex®-A53

Quad

Arm® Cortex®-R7 Dual lockstep

Custom 64-bit Kryo quad-core SoC

14nm FinFET

-

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36

CONCLUSION

• Advanced Packaging is viewed as the key solution to address the functional challenge and bridge the scale-gapbetween die and to board.

• Currently, key players from different business models have Fan-Out packaging solutions with a strong emphasison cost and performance trade-off between Panel-level vs Wafer-level processing.

• The RF FEM SiP assembly market was $2.5B & $3.0B in 2017 & 2018 respectively and will have a CAGR of 11%to reach $4.9B in 2023.

• 5G sub 6GHz require incremental innovation in packaging with small BOM increase while mmWave requiredisruptive innovation. Antenna technology and placement is one of the most critical challenges for 5Gsemiconductor systems.

• Automotive key trend: electrification, automation, infotainment. Hardware requirements for computing forADAS, infotainment will drive adoption of advanced packaging in automotive

2019 Symposium on Advanced Packaging & System Integration Technology | Powered by Yole Développement & Hosted by NCAP China | www.yole.fr | ©2019


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