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Master Bond EP21TCHT-1 for High Performance Bonding and Sealing

Date post:	02-Jul-2015
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Master Bond Polymer System EP21TCHT-1 is a two component, thermally conductive, heat resistant epoxy compound formulated to cure at ambient temperatures or more rapidly at elevated temperatures. EP21TCHT-1 passes NASA low outgassing tests and develops a high bonding strength of 1,800 psi at ambient temperatures.

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Page 1: Master Bond EP21TCHT-1 for High Performance Bonding and Sealing

Page 2: Master Bond EP21TCHT-1 for High Performance Bonding and Sealing

Page 3: Master Bond EP21TCHT-1 for High Performance Bonding and Sealing

Page 4: Master Bond EP21TCHT-1 for High Performance Bonding and Sealing

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