Southeast Asia
Volume 4 Number 2 March/April 2013
Stephen MitchellInterview Inside
MATERIAL AND PROCESS OPTIMIZATION FOR HIP DEFECT ELIMINATIONIMPEDIMENTS TO SOLDER ALLOY FREE ELECTRONIC (SAFE) ASSEMBLYEFY Expo 2013 - AN INDIAN ELECTRONICS EXHIBITION FOR GLOBAL INDUSTRY
Covering India, Thailand, Malaysia,Singapore, The Philippines and Hong Kong
www.globalsmtseasia.com
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Material and process optimization for hiP defect elimination
What is the head-in-pillow defect?The head-in-pillow defect is one in which both the solder paste and the solder ball reflow, but do not coalesce together. It typically occurs when the component or printed wiring board (PWB) warps during the reflow oven preheat and soak phase of the thermal profile. This warping causes the solder paste and BGA solder ball to separate prior to melting. Hence, the solder paste and BGA solder ball coalesce sepa-rately. During this coalescence, an oxide layer forms on the molten solder of both surfaces. During the cool down phase of the thermal profile, the compo-nent and PWB warp back, but the solders have solidified or, if still liquid, the oxide layer is
too thick for the solder paste and BGA solder ball to coalesce together (See Figure 2).
three types of hipThere are three types of HIP defects. Type 1 occurs when the BGA solder balls have excessive oxides, are contaminated, or have a non-wettable surface. An example of a non-wettable sur-face is silver segregation to the surface of the BGA solder balls. Figure 3 shows an example of this phenomenon. Although it might be possible for the flux in a superior solder paste to remove the oxides or the con-taminants, silver segregation at the solder ball surface can only be solved by obtaining BGA packages with solder balls that do not have silver segregation.
The area array package has become important in modern electronic products. From mobile phones, tablets, and PCs, to aerospace, area array packages are essential to the functioning of electronics. Prismark estimates that in 2013, over 30 billion area array packages, such as chip scale (CSP) and ball grid array (BGA) packages, will be assembled. This number is more than four for every man, women and child on the Earth. However, in recent years, a new area array assembly defect mode has been identified: the head-in-pillow (HIP) defect. HIP is a defect associated with BGAs, due to their larger size. HIP is so named because a cross section of a HIP-failed BGA solder joint looks like a head in a pillow (See Figure 1).
Timothy Jensen, Ronald Lasky, PhD, PE, Sehar Samiappan, Indium Corporation, Clinton, NY, USA
This paper was presented at SMTA Penang, Malaysia, in April 2012 as well as at SMTA International in Orlando, FL, October 2012.
Material and process optimization for hip defect elimination
Figure 1. A cross-section of a BGA solder joint that has the head-in-pillow defect.
EDITORIAL2. Will local manufacturing of STBs gain
momentum in India?- Usha Prasad
TECHNOLOGY FOCUS19. Material and process optimization for HIP
defect elimination- Timothy Jensen, Ronald Lasky, PhD, PE, SeharSamiappan, Indium Corporation
18. Product Showcase
SPECIAL FEATURES13. Interview -Stephen Mitchell
8. Report—EFY Expo 2013
16. ISA announces New Charter
REGULAR COLUmNS25. Chasing perfection....
– Keith Bryant
27. Impediments to Solder Alloy Free Electronic (SAFE) assembly
– Joe Fjelstad
OTHER REGULAR FEATURES4. Industry News
29. INDIA - National Policy on Electronics 2012, by Department of Electronics and Information Technology
32. International Diary
Volume 4, No. 2march/April 2013
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Global SmT & Packaging – march/April 2013 – 1www.globalsmtseasia.com
Excerpts:You had mentioned that 2013 will be the next growth phase for Teknek, during which the company will adopt a new approach to South East Asia? Could you explain in detail.
Last year, Teknek embarked on a major re-organisation of its Asia operations. Resources in the area have been increased.
For South East Asia, we have appointed a long-standing Teknek employee, Richard Meredith as our Master Distributor. Richard’s new business Merasia is ideally placed to grow our business in that area, Richard was for many years the Asia Regional Manager for Teknek, and has lived in Japan and China. Now headquartered in Thailand, Richard and his team will develop this vibrant area.
Since moving the Asia Regional office to Shanghai, and with the appointment of Douglas Gray we have started to increase the commercial team in China. Rebecca Wong is the latest new recruit; based in Shenzhen she will lead the development of Teknek in
Stephen Mitchell Teknek’s new technology helps increase customer base across Asia
Teknek, the global leader in contact cleaning and yield improvement technology for a number of sectors including PCB, SMT, converting, printing, decorative surfaces and medical packaging, has embarked on major developments for its Asian operations.
Based in Glasgow, Scotland, Teknek has been supplying yield improvement products for over 25 years. For around 15 years, Teknek has had offices in Asia -Japan, Taiwan, Korea, and more recently China. The
Asian Regional head office moved from Yokohama, Japan to Shanghai, China three years ago. In addition to sales and service operations, Teknek also has an adhesive production and fulfilment centre in Hong Kong. The Asia regional is managed by Douglas Gray, who moved to Shanghai from Scotland in 2012.
Stephen Mitchell, managing director, Teknek Ltd., shared more details on the company and its Asia operations with Usha Prasad.
Interview
BC460 ISO Right Adhesive Out
Global SmT & Packaging – march/April 2013 – 13www.globalsmtseasia.com
the highly important Guangdong region. Further appointments are due soon.
Our Hong Kong production facility continues to be improved to better serve the needs of our expanding customer base across Asia. Consumable products for the Teknek machines are produced at our HK facility and shipped across Asia. The facility mirrors those we have in the UK and USA and is part of our Global fulfilment program.
How is the market for contact cleaning equipment in South East Asia? Which sectors form the major market for your products?
The market for Teknek products is expanding. This is due to new technology being introduced by Teknek on the one hand, and increasing needs to improve yield in ever more complex manufacturing processes.
Teknek machines are used far and wide, from high value printing for the food and pharma sector to cleaning next generation barrier films produced in vacuum chambers.
Of course, electronics is an important sector from the cleaning of CCL (copper clad
laminate) to boards prior to solder paste, to thin films for tablets. In the later area, Tablets, we have developed new elastomers (UTF – Ultra Thin Film) to allow high volume cleaning of the thin multifunctional films which make up the display. Some of the films are as thin as 35µ.
What are the major challenges you face doing business in South East Asia?
Teknek faces similar challenges to other organisations. Asia is a large region with many different cultures and languages,
BGA Fibre Dust
Stephen mitchell
14 – Global SmT & Packaging – march/April 2013 www.globalsmtseasia.com
being able to adapt successfully is something we continue to improve. That said, with a growing team of locals working on the Teknek team we are making very good progress.
Overall, we find Asia open and a great place to do business.
Any new product or expansion plans in the pipeline?
Teknek invented the commercial contact cleaning process over 25 years ago and continues to innovate. There will be a new contact cleaner for cleaning boards prior to solder paste. This new machine is designed for the high volume board producer found in Asia. The product was launched at the “SMThybridpacking” show in Nuremberg, Germany 16-18th April 2013.
This unit will feature Teknek Nanocleen technology which is proving particularly useful in the electronics assembly area as it cleans and helps reduce static.
What are the top trends in 2013 for the SMT & packaging industry?
We are seeing a number of trends which impact our business.
a. Zero defects, yield improvement whatever the label, the drive for better quality and higher yields continues. With a high percentage of defects at solder paste, which is compounded by smaller components, higher production speeds and the like, the demand for cleaning boards prior to solder paste is increasing.
b. Plastic electronics - Teknek has been taking part in several collaborative research programs, and is the cleaning partner in the EU funded “Clean4Yield program”. As new methods for producing products based around plastic electronics emerge, Teknek has the technology ready to assist the roll out.
Stephen mitchell
Global SmT & Packaging – march/April 2013 – 15www.globalsmtseasia.com
