IPC 1752

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Sectionals * Material Info Subsectionals * Manufacturing Info

Company Name * STMicroelectronics Response Date *

Contact Name *

Authorized Representative * Giovanni Giacopello Representative Title

Representative Phone * Refer to Supplier Comment section Representative Email *

Supplier Comment

Uncertainty Statement

Supplier Acceptance * true Legal Declaration *

Legal Statement

While STMicroelectronics has endeavored to provide information which is accurate and up to date, this document and its contents are provided on a strict 'as is' and 'as available'

basis. STMicroelectronics disclaims all warranties, express or implied related to this document and its contents, including but not limited to implied warranties of completeness,

truth, accuracy, merchantability, fitness for a particular purpose and non-infringement. ST shall have no responsibility and assumes no liability for any cost, loss or damage of any

kind which could arise, directly or indirectly, from the use or inability to use this document and/or its contents.

Refer to Supplier Comment section

ADG & SGP MD CHAMPION

Refer to Supplier Comment section

Refer to Supplier Comment section

Materials Declaration Form

A-D

Supplier Information

2017-09-25

Version 2

* : Required Field

Legal Statement

Online Technical Support - STMicroelectronics :

http://www.st.com/web/en/support/support.html

Standard

Supplier certifies that it gathered the provided information and such information is true and correct to the best of its knowledge and

belief, as of the date that Supplier completes this form. Supplier acknowledges that Company will rely on this certification in determining the

compliance of its products. Company acknowledges that Supplier may have relied on information provided by others in completing this

form, and that Supplier may not have independently verified such information. However, in situations where Supplier has not

independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have provided certifications

regarding their contributions to the part(s), and those certifications are at least as omprehensive as the certification in this paragraph. If

the Company and the Supplier enter into a written agreement with respect to the identified part(s), the terms and conditions of

that agreement, including any warranty rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of

the Supplier’s liability and the Company’s remedies for issues that arise regarding information the Supplier provides in this form.

Mfr Item Number Mfr Item Name Version Mfr Site Date

SPWF04SA A0UQ*WIFI009 A Microtel 2017-09-25

Amount UoM Unit type ST ECOPACK Grade

1448.00 mg Each ECOPACK® 2

J-STD-020 MSL Rating Classification Temp Nbr of Reflow Cycles

NAC NAC NAC

bulk Solder Termination Terminal Plating Terminal Base Alloy Comment

NAC NAC NAC

Package Designator Size Nbr of instances Shape

Mounted BOARD 26.9x15.4x0.8 NAC flat

Comment

Manufacturing information

Product

QueryList : ROHS directive 2011/65/EU _ July 2011

Response

false

false

truefalse

false

false

Exemption Id.

7c-I

Response

true

CategoryLevel_Name CategoryLevel_Threshold amount in product (mg) Application ppm in product

Lead monoxide (lead oxide) 1000 ppm 3.73 2576

3 - Product(s) meets EU RoHS requirements by application of the selected exemption(s)

2 - Product(s) meets EU RoHS requirements except lead in solder and this usage may qualify under the lead in solder '7b' exemption (other selected exemptions may

apply)

Description

1 - Product(s) does not contain REACH Substances Of Very High Concern above the limits per the definition within REACH

Query

QueryList : REACH-20th June 2016

6 - Product(s) is unknown, no information is available

1 - Product(s) meets EU RoHS requirement without any exemptions

Query

5 - Product(s) is obsolete, no information is available

4 - Product(s) does not meet EU RoHS requirements and is not under exemptions

Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic

devices, or in a glass or ceramic matrix compound

Mfr Item Name 1164.7870 15074113.0 804417.0

Homogeneous Material Material Group Mass UoM Level Substance Category Substance CAS Exempt Mass UoM

Concentration in

homogeneous

material (ppm)

Concentration in

product (ppm)

PCB Other inorganic materials 1019.359 mg supplier alloy Copper (Cu) 7440-50-8 285.019 mg 279606 196836

PCB supplier substrate Epoxy resin 25068-38-6 290.672 mg 285152 200740

PCB supplier substrate Fiber glass 65997-17-3 326.370 mg 320172 225394

PCB supplier substrate Baruim sulfate 7727-43-7 30.602 mg 30019 21134

PCB supplier substrate Acrylated epoxy resin proprietary 71.396 mg 70040 49307

PCB supplier metallization Nickel (Ni) 7440-02-0 5.097 mg 5000 3520

PCB supplier metallization Gold (Au) 7440-57-5 10.203 mg 10011 7046

STM32F439ZI Other inorganic materials 30.058 mg supplier die Silicon (Si) 7440-21-3 22.001 mg 731952 15194

STM32F439ZI supplier metallization Aluminium (Al) 7429-90-5 0.045 mg 1401 31

STM32F439ZI supplier metallization Copper (Cu) 7440-50-8 0.444 mg 14771 307

STM32F439ZI supplier metallization Tantalum (Ta) 7440-25-7 0.126 mg 4192 87

STM32F439ZI supplier metallization Cobalt (Co) 7440-48-4 0.001 mg 33 1

STM32F439ZI supplier metallization Titanium (Ti) 7440-32-6 0.004 mg 133 3

STM32F439ZI supplier metallization Tungsten (W) 7440-33-7 0.003 mg 100 2

STM32F439ZI supplier passivation Silicon Nitride (SiN) 68034-42-4 0.102 mg 3393 70

STM32F439ZI supplier passivation Silicon Oxide(SiO2) 7631-86-9 0.258 mg 8583 178

STM32F439ZI supplier Alloy Ti 7440-32-6 0.007 mg 233 5

STM32F439ZI supplier Alloy Cu 7440-50-8 0.026 mg 865 18

STM32F439ZI supplier Polymer 4-Butyrolactone 96-48-0 0.118 mg 3926 81

STM32F439ZI supplier Polymer Polyamide Proprietary 0.106 mg 3527 73

STM32F439ZI supplier Polymer 1-Methoxy-2-propyl acetate 108-65-6 0.012 mg 399 8

STM32F439ZI supplier Alloy Cu 7440-50-8 0.531 mg 17666 367

STM32F439ZI supplier Polymer 4-Butyrolactone 96-48-0 0.111 mg 3693 77

STM32F439ZI supplier Polymer Polyamide Proprietary 0.099 mg 3294 68

STM32F439ZI supplier Polymer 1-Methoxy-2-propyl acetate 108-65-6 0.011 mg 461 8

STM32F439ZI supplier Alloy Cu 7440-50-8 0.479 mg 15936 331

STM32F439ZI supplier Solder Sn 7440-31-5 4.518 mg 150309 3120

STM32F439ZI supplier Solder Ag 7440-22-4 0.055 mg 1830 38

STM32F439ZI supplier Solder Cu 7440-50-8 0.023 mg 765 16

STM32F439ZI supplier Solder Ni 7440-02-0 0.002 mg 67 1

STM32F439ZI supplier Polymer Polybutylene terephthalate (PBT) 25038-59-9 0.639 mg 21259 441

STM32F439ZI supplier Polymer Silica Proprietary 0.191 mg 6354 132

STM32F439ZI supplier Polymer Proprietary Material-Other Epoxy resins Proprietary 0.073 mg 2429 50

STM32F439ZI supplier Polymer Proprietary Material-Other Acrylic resins Proprietary 0.073 mg 2429 50

SN74LVC125ARGYR Other inorganic materials 32.376 mg supplier die Silicon 7440-21-3 0.578 mg 17853 399

SN74LVC125ARGYR supplier frame alloy Copper (Cu) 7440-50-8 12.703 mg 392359 8773

SN74LVC125ARGYR supplier frame alloy Tin (Sn) 7440-31-5 0.032 mg 988 22

SN74LVC125ARGYR supplier frame alloy Zinc (Zn) 7440-66-6 0.031 mg 957 21

SN74LVC125ARGYR supplier frame alloy Chromium (Cr) 7440-47-3 0.033 mg 1019 23

SN74LVC125ARGYR supplier frame metallisation Nickel (Ni) 7440-02-0 0.219 mg 6764 151

SN74LVC125ARGYR supplier frame metallisation Palladium (Pd) 7440-05-3 0.009 mg 278 6

SN74LVC125ARGYR supplier frame metallisation Gold (Au) 7440-57-5 0.001 mg 31 1

SN74LVC125ARGYR supplier Die Attach Adhesive Silicon Oxide 7631-86-9 0.003 mg 94 2

SN74LVC125ARGYR supplier Die Attach Adhesive Silver (Ag) 7440-22-4 0.121 mg 3737 84

SN74LVC125ARGYR supplier Die Attach Adhesive Epoxy Proprietary 0.050 mg 1544 35

SN74LVC125ARGYR supplier Bond wire Copper (Cu) 7440-50-8 0.088 mg 2718 61

SN74LVC125ARGYR supplier Mold compound Fused Silica 60676-86-0 16.751 mg 517389 11568

SN74LVC125ARGYR supplier Mold compound Carbon Black 1333-86-4 0.092 mg 2842 64

SN74LVC125ARGYR supplier Mold compound Epoxy Proprietary 1.665 mg 51427 1150

74LVC2T45GD Other inorganic materials 5.455 mg supplier die Silicon 7440-21-3 0.110 mg 20165 76

74LVC2T45GD supplier frame alloy Nickel (Ni) 7440-02-0 0.862 mg 158020 595

74LVC2T45GD supplier frame alloy Palladium (Pd) 7440-05-3 0.009 mg 1650 6

74LVC2T45GD supplier frame alloy Gold (Au) 7440-57-5 0.002 mg 367 1

74LVC2T45GD supplier Die Attach Adhesive 4-Methyl-2-Phenyl-1 H-Imidazole 827-43-0 0.011 mg 2016 8

74LVC2T45GD supplier Die Attach Adhesive C18-Unsatured fatty acids dimers diglycidyl ester68475-94-5 0.011 mg 2016 8

74LVC2T45GD supplier Die Attach Adhesive Poly(Propyleneglycol)diamine 9046-10-0 0.011 mg 2016 8

74LVC2T45GD supplier Die Attach Adhesive 1.4-Butanediol Diglycidil Ether 2425-79-8 0.033 mg 6049 23

74LVC2T45GD supplier Die Attach Adhesive Bisphenol-F/Diclycidyl ether resin 39817-09-9 0.044 mg 8066 30

74LVC2T45GD supplier Bond wire Gold (Au) 7440-57-5 0.101 mg 18515 70

A0UQ*WIFI009Material Composition Declaration

74LVC2T45GD supplier Bond wire Palladium (Pd) 7440-05-3 0.001 mg 184 1

74LVC2T45GD supplier Mold compound Additive Proprietary 0.046 mg 8433 32

74LVC2T45GD supplier Mold compound Silica fused 60676-86-0 3.786 mg 694042 2615

74LVC2T45GD supplier Mold compound Carbon Black 1333-86-4 0.008 mg 1467 6

74LVC2T45GD supplier Mold compound Epoxy resin Proprietary 0.222 mg 40697 153

74LVC2T45GD supplier Mold compound Phenolic resin Proprietary 0.198 mg 36297 137

STLQ50C18R Other inorganic materials 5.900 mg supplier Silicon die Silicon (Si) 7440-21-3 0.291 mg 49322 201

STLQ50C18R supplier Passivation Gamma-butyrolactone 96-48-0 0.002 mg 339 1

STLQ50C18R supplier Passivation Polyhydroxyamide 55295-98-2 0.001 mg 169 1

STLQ50C18R supplier Back side metallization Nickel (Ni) 7440-02-0 0.002 mg 339 1

STLQ50C18R supplier Back side metallization Gold (Au) 7440-57-5 0.001 mg 169 1

STLQ50C18R supplier Alloy Copper 7440-50-8 2.782 mg 471525 1921

STLQ50C18R supplier Alloy Iron 7439-89-6 0.066 mg 11186 46

STLQ50C18R supplier Alloy Iron Phosphide(FeP) 26508-33-8 0.001 mg 169 1

STLQ50C18R supplier Alloy Zinc 7440-66-0 0.003 mg 508 2

STLQ50C18R supplier Coating Nickel 7440-02-0 0.033 mg 5593 23

STLQ50C18R supplier Coating Palladium 7440-05-3 0.003 mg 508 2

STLQ50C18R supplier Glue Silver 7440-22-4 0.044 mg 7458 30

STLQ50C18R supplier Glue Carbocyclic Acrylates proprietary 0.005 mg 847 3

STLQ50C18R supplier Glue Bismaleimide resin proprietary 0.002 mg 339 1

STLQ50C18R supplier Glue 2-preponoic acid, 2-methyl 68586-19-6 0.002 mg 339 1

STLQ50C18R supplier Glue Additive proprietary 0.002 mg 339 1

STLQ50C18R supplier Bonding wire Gold (Au) 7440-57-5 0.055 mg 9322 38

STLQ50C18R supplier Molding compound Epoxy resin-1 Proprietary 0.079 mg 13390 55

STLQ50C18R supplier Molding compound Epoxy resin-2 Proprietary 0.079 mg 13390 55

STLQ50C18R supplier Molding compound Phenol resin Proprietary 0.118 mg 20000 81

STLQ50C18R supplier Molding compound Silica 60676-86-0 2.324 mg 393898 1605

STLQ50C18R supplier Molding compound Carbon Black 1333-86-4 0.005 mg 851 3

CW110001UBTM Other inorganic materials 17.480 mg supplier die Silicon (Si) 7440-21-3 9.180 mg 525172 6340

CW110001UBTM supplier metallisation Aluminium (Al) 7429-90-5 0.033 mg 1888 23

CW110001UBTM supplier metallisation Copper (Cu) 7440-50-8 0.198 mg 11327 137

CW110001UBTM supplier metallisation Nickel (Ni) 7440-02-0 0.001 mg 57 1

CW110001UBTM supplier metallisation Tantalum (Ta) 7440-25-7 0.034 mg 1945 23

CW110001UBTM supplier metallisation Titanium (Ti) 7440-32-6 0.009 mg 515 6

CW110001UBTM supplier metallisation Tungsten (W) 7440-33-7 0.001 mg 57 1

CW110001UBTM supplier Passivation Silicon Nitride (SiN) 12033-89-5 0.045 mg 2574 31

CW110001UBTM supplier passivation Silicon Oxide 7631-86-9 0.153 mg 8753 106

CW110001UBTM supplier die polymer coating PBO 29791-96-6 0.001 mg 57 1

CW110001UBTM supplier RDL Copper (Cu) 7440-50-8 0.035 mg 2002 24

CW110001UBTM supplier bumps Tin (Sn) 7440-31-5 6.457 mg 369394 4459

CW110001UBTM supplier bumps Silver (Ag) 7440-22-4 0.256 mg 14645 177

CW110001UBTM supplier bumps Copper (Cu) 7440-50-8 0.040 mg 2288 28

CW110001UBTM supplier resin silica vitreous 60676-86-0 0.504 mg 28833 348

CW110001UBTM supplier resin Epoxy resin Proprietary 0.181 mg 10355 125

CW110001UBTM supplier resin Acrylic polymer Proprietary 0.181 mg 10355 125

CW110001UBTM supplier resin Bis-phenol A diglycidyl ether 25036-25-3 0.062 mg 3547 43

CW110001UBTM supplier resin carbon black 1333-86-4 0.005 mg 286 3

CW110001UBTM supplier resin Iron compound 7439-89-6 0.052 mg 2975 36

CW110001UBTM supplier resin Zinc compound 7440-66-6 0.052 mg 2975 36

LFB182G45SG9B740 Other inorganic materials 4.370 mg supplier Ceramic Nd2O3 1313-97-9 3.168 mg 724943 2188

LFB182G45SG9B740 supplier metallisation Copper (Cu) 7440-50-8 1.202 mg 275057 830

Antenna Other inorganic materials 23.630 mg supplier Ceramic Aluminium oxide 1344-28-1 9.950 mg 421074 6872

Antenna supplier Ceramic Silicon dioxide 7631-86-9 4.976 mg 210580 3436

Antenna SVHC Ceramic Lead oxide 1317-36-8 7c-I-Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound3.730 mg 157850 2576

Antenna supplier Ceramic Calcium Oxide 1305-78-8 2.487 mg 105248 1718

Antenna supplier Electrode termination Silver (Ag) 7440-22-4 2.487 mg 105248 1718

Crystal 1 Other inorganic materials 6.525 mg supplier Cover Iron 7439-89-6 0.725 mg 111111 501

Crystal 1 supplier Cover Nickel 7440-02-0 0.424 mg 64981 293

Crystal 1 supplier Cover Cobalt 7440-48-4 0.255 mg 39080 176

Crystal 1 supplier Cover Manganese 7439-96-5 0.007 mg 1073 5

Crystal 1 supplier Cover Silicon 7440-21-3 0.002 mg 307 1

Crystal 1 supplier Cover Nickel 7440-02-0 0.188 mg 28812 130

Crystal 1 supplier Base Alminium oxide 1344-28-1 2.322 mg 355862 1604

Crystal 1 supplier Base Manganese oxide 1313-13-9 0.082 mg 12567 57

Crystal 1 supplier Base Silicon dioxide 7631-86-9 0.082 mg 12567 57

Crystal 1 supplier Base Molybdenum oxide 1313-27-5 0.012 mg 1839 8

Crystal 1 supplier Base Magnesium Oxide 1309-48-4 0.012 mg 1839 8

Crystal 1 supplier Base Molybdenum 7439-98-7 0.672 mg 102989 464

Crystal 1 supplier Base Nickel 7440-02-0 0.153 mg 23448 106

Crystal 1 supplier Base Cobalt 7440-48-4 0.036 mg 5517 25

Crystal 1 supplier Base Gold 7440-57-5 0.047 mg 7203 32

Crystal 1 supplier Base Iron 7439-89-6 0.412 mg 63142 285

Crystal 1 supplier Base Nickel 7440-02-0 0.225 mg 34483 155

Crystal 1 supplier Base Cobalt 7440-48-4 0.129 mg 19770 89

Crystal 1 supplier Base Silver 7440-22-4 0.330 mg 50575 228

Crystal 1 supplier Base Copper 7440-50-8 0.058 mg 8889 40

Crystal 1 supplier Electro conductive adhesive Silver 7440-22-4 0.205 mg 31418 142

Crystal 1 supplier Electro conductive adhesive Silicon dioxide 7631-86-9 0.031 mg 4751 21

Crystal 1 supplier Electro conductive adhesive Quartz 14808-60-7 0.092 mg 14100 64

Crystal 1 supplier Evaporation Gold 7440-57-5 0.023 mg 3525 16

Crystal 1 supplier Evaporation Chromium 7440-47-3 0.001 mg 152 1

Capacitors 1 Other inorganic materials 0.331 mg supplier Ceramics Zirconium oxide 1314-23-4 0.117 mg 353474 81

Capacitors 1 supplier Ceramics Calcium oxide 1305-78-8 0.094 mg 283988 65

Capacitors 1 supplier Copper alloys Copper 7440-50-8 0.088 mg 265861 61

Capacitors 1 supplier Glass diboron trioxide; bor 1303-86-2 0.002 mg 6043 1

Capacitors 1 supplier Electrolytic Nickel Plating Nickel 7440-02-0 0.008 mg 24169 6

Capacitors 1 supplier Electrolytic Tin plating Tin 7440-31-5 0.022 mg 66465 15

Capacitors 2 Other inorganic materials 1.014 mg supplier Copper alloys Zirconium oxide 1314-23-4 0.351 mg 346154 242

Capacitors 2 supplier Copper alloys Calcium oxide 1305-78-8 0.282 mg 278107 195

Capacitors 2 supplier Nickel /Other Nickel alloy Nickel 7440-02-0 0.029 mg 28600 20

Capacitors 2 supplier Copper alloys Copper 7440-50-8 0.236 mg 232742 163

Capacitors 2 supplier Glass diboron trioxide; bor 1303-86-2 0.020 mg 19724 14

Capacitors 2 supplier Glass Silicon dioxide 7631-86-9 0.007 mg 6902 5

Capacitors 2 supplier Electrolytic Nickel Plating Nickel 7440-02-0 0.023 mg 22682 16

Capacitors 2 supplier Electrolytic Tin plating Tin 7440-31-5 0.066 mg 65089 46

Capacitors 3 Other inorganic materials 7.068 mg supplier Ceramics Barium oxide, obtain 1304-28-5 3.029 mg 428551 2092

Capacitors 3 supplier Ceramics Titanium dioxide 13463-67-7 1.514 mg 214205 1046

Capacitors 3 supplier Copper alloys Copper 7440-50-8 1.560 mg 220713 1077

Capacitors 3 supplier Glass diboron trioxide; bor 1303-86-2 0.046 mg 6508 32

Capacitors 3 supplier Glass Silicon dioxide 7631-86-9 0.138 mg 19525 95

Capacitors 3 supplier Nickel plating Nickel 7440-02-0 0.161 mg 22779 111

Capacitors 3 supplier Nickel and Nickel alloys Nickel 7440-02-0 0.184 mg 26033 127

Capacitors 3 supplier Tin plating Tin 7440-31-5 0.436 mg 61686 301

Capacitors 4 Other inorganic materials 9.794 mg supplier Ceramics Barium oxide, obtain 1304-28-5 4.189 mg 427711 2893

Capacitors 4 supplier Ceramics Titanium dioxide 13463-67-7 2.098 mg 214213 1449

Capacitors 4 supplier Copper alloys Copper 7440-50-8 1.128 mg 115173 779

Capacitors 4 supplier Glass diboron trioxide; bor 1303-86-2 0.026 mg 2655 18

Capacitors 4 supplier Glass Silicon dioxide 7631-86-9 0.098 mg 10006 68

Capacitors 4 supplier Nickel plating Nickel 7440-02-0 0.118 mg 12047 81

Capacitors 4 supplier Nickel and Nickel alloys Nickel 7440-02-0 1.829 mg 186747 1263

Capacitors 4 supplier Tin plating Tin 7440-31-5 0.308 mg 31448 213

Inductor 1 Other inorganic materials 0.191 mg supplier Ceramics Silver 7440-22-4 0.043 mg 225131 30

Inductor 1 supplier Glass Silicon dioxide 7631-86-9 0.003 mg 15707 2

Inductor 1 supplier Nickel plating Nickel 7440-02-0 0.009 mg 47120 6

Inductor 1 supplier Tin plating Tin 7440-31-5 0.010 mg 52356 7

Inductor 1 supplier Glass Silica 7631-86-9 0.063 mg 329843 44

Inductor 1 supplier Glass Aluminum oxide 1344-28-1 0.050 mg 261780 35

Inductor 1 supplier Glass diboron trioxide 1303-86-2 0.013 mg 68063 9

Inductor 2 Other inorganic materials 0.887 mg supplier Ceramic Silicon dioxide 7631-86-9 0.428 mg 482525 296

Inductor 2 supplier Ceramic Magnesium oxide 1309-48-4 0.107 mg 120631 74

Inductor 2 supplier Ceramic Alminium oxide 1344-28-1 0.023 mg 25930 16

Inductor 2 supplier Ceramic Diboron-trioxide 1303-86-2 0.087 mg 98083 60

Inductor 2 supplier pigment Manganese ferrite 68186-94-7 0.008 mg 9021 6

Inductor 2 supplier conductor Silver 7440-22-4 0.167 mg 188275 115

Inductor 2 supplier Nickel plating Nickel 7440-02-0 0.028 mg 31567 19

Inductor 2 supplier Tin plating Tin 7440-31-5 0.039 mg 43968 27

Inductor 3 Other inorganic materials 4.709 mg supplier Ferrite Nickel Oxide 1313-99-1 0.349 mg 74113 241

Inductor 3 supplier Ferrite Copper Oxide 1317-38-0 0.116 mg 24634 80

Inductor 3 supplier Ferrite Diiron trioxide 1309-37-1 1.744 mg 370355 1204

Inductor 3 supplier Ferrite Zinc Oxide 1314-13-2 0.414 mg 87917 286

Inductor 3 supplier electrode Silver 7440-22-4 0.010 mg 2124 7

Inductor 3 supplier electrode Glass Frit Proprietary 0.001 mg 212 1

Inductor 3 supplier Electrode II Silver 7440-22-4 0.020 mg 4247 14

Inductor 3 supplier Electrode II Phenolic Resin 9003-35-4 0.001 mg 212 1

Inductor 3 supplier Electrode II Biphenol F-type epoxy resin 9003-36-5 0.001 mg 212 1

Inductor 3 supplier Electrode under plating Nickel 7440-02-0 0.001 mg 212 1

Inductor 3 supplier Electrode finish plating Tin 7440-31-5 0.004 mg 849 3

Inductor 3 supplier Winding wire Copper 7440-50-8 0.869 mg 184540 600

Inductor 3 supplier Insulation Coating Polyuretane Foams 9009-54-5 0.027 mg 5734 19

Inductor 3 supplier Exterior part with ferrite Bismuth oxide 1304-76-3 0.008 mg 1699 6

Inductor 3 supplier Ceramics Nickel oxide 1313-99-1 0.092 mg 19537 64

Inductor 3 supplier Ceramics Copper oxide 1317-38-0 0.019 mg 4035 13

Inductor 3 supplier Ceramics Bisphenol A Epichlorohydrin resin 25068-38-6 0.070 mg 14865 48

Inductor 3 supplier Electrode Diiron trioxide 1309-37-1 0.612 mg 129964 423

Inductor 3 supplier Electrode Zinc Oxide 1314-13-2 0.205 mg 43534 142

Inductor 3 supplier Paste Phenolic resin 9003-35-4 0.049 mg 10406 34

Inductor 3 supplier Resistive Element Epoxy resin amine adduct 134091-76-2 0.047 mg 9981 32

Inductor 3 supplier Resistive Element Epoxy resin Proprietary 0.037 mg 7857 26

Inductor 3 supplier Nickel Plating Catalyst Proprietary 0.013 mg 2761 9

Resistors 1 Other Organic Materials 3.961 mg supplier Substrate Aluminium Oxide 1344-28-1 0.033 mg 8331 23

Resistors 1 supplier Substrate Silicon Dioxide 7631-86-9 0.007 mg 1767 5

Resistors 1 supplier Substrate Magnesium Oxide 1309-48-4 0.014 mg 3534 10

Resistors 1 supplier Inner electrode Silver 7440-22-4 3.288 mg 830093 2271

Resistors 1 supplier Inner electrode Silver 7440-22-4 0.559 mg 141126 386

Resistors 1 supplier Inner electrode Ruthenium dioxide 12036-10-1 0.013 mg 3282 9

Resistors 1 supplier Termination Nickel 7440-02-0 0.013 mg 3282 9

Resistors 1 supplier Termination Tin 7440-31-5 0.013 mg 3282 9

Resistors 1 supplier Primary Glass Glass Frit 65997-18-4 0.017 mg 4292 12

Resistors 1 supplier Overcoat II Epoxy Resin 25068-38-6 0.004 mg 1011 3

Shield Other Organic Materials 274.892 mg supplier alloy Copper (Cu) 7440-50-8 173.733 mg 632005 119981

Shield supplier alloy Zinc (Zn) 7440-66-6 54.235 mg 197296 37455

Shield supplier alloy Nickel (Ni) 7440-02-0 46.457 mg 169001 32084

Shield supplier alloy Iron (Fe) 7439-89-6 0.467 mg 1698 323