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2001 Microchip Technology Inc. Preliminary DS21298B-page 1 MCP3204/3208 FEATURES 12-bit resolution ± 1 LSB max DNL ± 1 LSB max INL (MCP3204/3208-B) ± 2 LSB max INL (MCP3204/3208-C) 4 (MCP3204) or 8 (MCP3208) input channels Analog inputs programmable as single-ended or pseudo differential pairs On-chip sample and hold • SPI serial interface (modes 0,0 and 1,1) Single supply operation: 2.7V - 5.5V 100ksps max. sampling rate at V DD = 5V 50ksps max. sampling rate at V DD = 2.7V Low power CMOS technology - 500 nA typical standby current, 2μA max. - 400 μA max. active current at 5V Industrial temp range: -40°C to +85°C Available in PDIP, SOIC and TSSOP packages APPLICATIONS Sensor Interface Process Control Data Acquisition Battery Operated Systems DESCRIPTION The Microchip Technology Inc. MCP3204/3208 devices are successive approximation 12-bit Ana- log-to-Digital (A/D) Converters with on-board sample and hold circuitry. The MCP3204 is programmable to provide two pseudo-differential input pairs or four sin- gle-ended inputs. The MCP3208 is programmable to provide four pseudo-differential input pairs or eight sin- gle-ended inputs. Differential Nonlinearity (DNL) is specified at ±1 LSB, and Integral Nonlinearity (INL) is offered in ±1 LSB (MCP3204/3208-B) and ±2 LSB (MCP3204/3208-C) versions. Communication with the devices is done using a simple serial interface compat- ible with the SPI protocol. The devices are capable of conversion rates of up to 100ksps. The MCP3204/3208 devices operate over a broad voltage range (2.7V - 5.5V). Low current design permits operation with typi- cal standby and active currents of only 500nA and 320μA, respectively. The MCP3204 is offered in 14-pin PDIP, 150mil SOIC and TSSOP packages, and the MCP3208 is offered in 16-pin PDIP and SOIC pack- ages. SPI is a trademark of Motorola Inc. PACKAGE TYPES FUNCTIONAL BLOCK DIAGRAM V DD CLK D OUT MCP3204 1 2 3 4 14 13 12 11 10 9 8 5 6 7 V REF D IN CH0 CH1 CH2 CH3 CS /SHDN DGND AGND NC V DD CLK D OUT MCP3208 1 2 3 4 16 15 14 13 12 11 10 9 5 6 7 8 V REF D IN CS /SHDN DGND CH0 CH1 CH2 CH3 CH4 CH5 CH6 CH7 NC AGND PDIP, SOIC, TSSOP PDIP, SOIC Comparator Sample and Hold 12-Bit SAR DAC Control Logic CS /SHDN V REF V SS V DD CLK D OUT Shift Register CH0 Channel Mux Input CH1 CH7* *Note: Channels 5-7 available on MCP3208 Only D IN 2.7V 4-Channel/8-Channel 12-Bit A/D Converters with SPI
Transcript
Page 1: MCP3208

MCP3204/32082.7V 4-Channel/8-Channel 12-Bit A/D Converters

with SPI™

FEATURES

• 12-bit resolution• ± 1 LSB max DNL• ± 1 LSB max INL (MCP3204/3208-B)• ± 2 LSB max INL (MCP3204/3208-C)• 4 (MCP3204) or 8 (MCP3208) input channels• Analog inputs programmable as single-ended or

pseudo differential pairs• On-chip sample and hold• SPI™ serial interface (modes 0,0 and 1,1)• Single supply operation: 2.7V - 5.5V• 100ksps max. sampling rate at VDD = 5V• 50ksps max. sampling rate at VDD = 2.7V• Low power CMOS technology

- 500 nA typical standby current, 2µA max.- 400 µA max. active current at 5V

• Industrial temp range: -40°C to +85°C • Available in PDIP, SOIC and TSSOP packages

APPLICATIONS

• Sensor Interface• Process Control• Data Acquisition• Battery Operated Systems

DESCRIPTION

The Microchip Technology Inc. MCP3204/3208devices are successive approximation 12-bit Ana-log-to-Digital (A/D) Converters with on-board sampleand hold circuitry. The MCP3204 is programmable toprovide two pseudo-differential input pairs or four sin-gle-ended inputs. The MCP3208 is programmable toprovide four pseudo-differential input pairs or eight sin-gle-ended inputs. Differential Nonlinearity (DNL) isspecified at ±1 LSB, and Integral Nonlinearity (INL) isoffered in ±1 LSB (MCP3204/3208-B) and ±2 LSB(MCP3204/3208-C) versions. Communication with thedevices is done using a simple serial interface compat-ible with the SPI protocol. The devices are capable ofconversion rates of up to 100ksps. The MCP3204/3208devices operate over a broad voltage range (2.7V -5.5V). Low current design permits operation with typi-cal standby and active currents of only 500nA and320µA, respectively. The MCP3204 is offered in 14-pinPDIP, 150mil SOIC and TSSOP packages, and theMCP3208 is offered in 16-pin PDIP and SOIC pack-ages.

SPI is a trademark of Motorola Inc.

PACKAGE TYPES

FUNCTIONAL BLOCK DIAGRAM

VDD

CLK

DOUT

MC

P3204

1

234

14

13121110

98

5

67

VREF

DIN

CH0CH1CH2CH3

CS/SHDNDGND

AGND

NC

VDD

CLKDOUT

MC

P3208

1

234

16

15141312

11109

5

678

VREF

DIN

CS/SHDNDGND

CH0CH1CH2CH3CH4CH5CH6CH7

NC

AGND

PDIP, SOIC, TSSOP

PDIP, SOIC

Comparator

Sampleand Hold

12-Bit SAR

DAC

Control Logic

CS/SHDN

VREF

VSSVDD

CLK DOUT

ShiftRegister

CH0

ChannelMux

InputCH1

CH7*

*Note: Channels 5-7 available on MCP3208 Only

DIN

2001 Microchip Technology Inc. Preliminary DS21298B-page 1

Page 2: MCP3208

MCP3204/3208

1.0 ELECTRICAL CHARACTERISTICS

1.1 Maximum Ratings*

VDD.........................................................................7.0VAll inputs and outputs w.r.t. VSS ...... -0.6V to VDD +0.6VStorage temperature ..........................-65°C to +150°CAmbient temp. with power applied .....-65°C to +125°CSoldering temperature of leads (10 seconds) .. +300°CESD protection on all pins ...................................> 4kV*Notice: Stresses above those listed under “Maximum Ratings” maycause permanent damage to the device. This is a stress rating only andfunctional operation of the device at those or any other conditionsabove those indicated in the operational listings of this specification isnot implied. Exposure to maximum rating conditions for extended peri-ods may affect device reliability.

PIN FUNCTION TABLE

NAME FUNCTION

VDD

DGND

AGND

CH0-CH7

CLK

DIN

DOUT

CS/SHDN

VREF

+2.7V to 5.5V Power Supply

Digital Ground

Analog Ground

Analog Inputs

Serial Clock

Serial Data In

Serial Data Out

Chip Select/Shutdown Input

Reference Voltage Input

ELECTRICAL CHARACTERISTICSAll parameters apply at VDD = 5V, VSS = 0V, VREF = 5V, TAMB = -40°C to +85°C, fSAMPLE = 100ksps and fCLK = 20*fSAMPLE, unless otherwise noted.

PARAMETER SYMBOL MIN. TYP. MAX. UNITS CONDITIONS

Conversion Rate

Conversion Time tCONV 12 clock cycles

Analog Input Sample Time tSAMPLE 1.5 clock cycles

Throughput Rate fSAMPLE 10050

kspsksps

VDD = VREF = 5VVDD = VREF = 2.7V

DC Accuracy

Resolution 12 bits

Integral Nonlinearity INL ±0.75±1

±1±2

LSB MCP3204/3208-BMCP3204/3208-C

Differential Nonlinearity DNL ±0.5 ±1 LSB No missing codes over temperature

Offset Error ±1.25 ±3 LSB

Gain Error ±1.25 ±5 LSB

Dynamic Performance

Total Harmonic Distortion -82 dB VIN = 0.1V to 4.9V@1kHz

Signal to Noise and Distortion (SINAD)

72 dB VIN = 0.1V to 4.9V@1kHz

Spurious Free Dynamic Range

86 dB VIN = 0.1V to 4.9V@1kHz

Reference Input

Voltage Range 0.25 VDD V Note 2

Current Drain 1000.001

1503

µAµA CS = VDD = 5V

Analog Inputs

Input Voltage Range for CH0-CH7 in Single-Ended Mode

VSS VREF V

Input Voltage Range for IN+ In pseudo-differential Mode

IN- VREF+IN-

Input Voltage Range for IN- In pseudo-differential Mode

VSS-100 VSS+100 mV

Leakage Current 0.001 ±1 µA

DS21298B-page 2 Preliminary 2001 Microchip Technology Inc.

Page 3: MCP3208

MCP3204/3208

Analog Inputs (Continued)

Switch Resistance 1K Ω See Figure 4-1

Sample Capacitor 20 pF See Figure 4-1

Digital Input/Output

Data Coding Format Straight Binary

High Level Input Voltage VIH 0.7 VDD V

Low Level Input Voltage VIL 0.3 VDD V

High Level Output Voltage VOH 4.1 V IOH = -1mA, VDD = 4.5V

Low Level Output Voltage VOL 0.4 V IOL = 1mA, VDD = 4.5V

Input Leakage Current ILI -10 10 µA VIN = VSS or VDD

Output Leakage Current ILO -10 10 µA VOUT = VSS or VDD

Pin Capacitance(All Inputs/Outputs)

CIN, COUT 10 pF VDD = 5.0V (Note 1)TAMB = 25°C, f = 1 MHz

Timing Parameters

Clock Frequency fCLK 2.01.0

MHzMHz

VDD = 5V (Note 3)VDD = 2.7V (Note 3)

Clock High Time tHI 250 ns

Clock Low Time tLO 250 ns

CS Fall To First Rising CLK Edge

tSUCS 100 ns

Data Input Setup Time tSU 50 ns

Data Input Hold Time tHD 50 ns

CLK Fall To Output Data Valid tDO 200 ns See Test Circuits, Figure 1-2

CLK Fall To Output Enable tEN 200 ns See Test Circuits, Figure 1-2

CS Rise To Output Disable tDIS 100 ns See Test Circuits, Figure 1-2

CS Disable Time tCSH 500 ns

DOUT Rise Time tR 100 ns See Test Circuits, Figure 1-2 (Note 1)

DOUT Fall Time tF 100 ns See Test Circuits, Figure 1-2 (Note 1)

Power Requirements

Operating Voltage VDD 2.7 5.5 V

Operating Current IDD 320225

400 µA VDD = VREF = 5V, DOUT unloadedVDD = VREF = 2.7V, DOUT unloaded

Standby Current IDDS 0.5 2 µA CS = VDD = 5.0V

Note 1: This parameter is guaranteed by characterization and not 100% tested. Note 2: See graphs that relate linearity performance to VREF levels. Note 3: Because the sample cap will eventually lose charge, effective clock rates below 10kHz can affect linearity

performance, especially at elevated temperatures. See Section 6.2 for more information.

ELECTRICAL CHARACTERISTICS (CONTINUED)All parameters apply at VDD = 5V, VSS = 0V, VREF = 5V, TAMB = -40°C to +85°C, fSAMPLE = 100ksps and fCLK = 20*fSAMPLE, unless otherwise noted.

PARAMETER SYMBOL MIN. TYP. MAX. UNITS CONDITIONS

2001 Microchip Technology Inc. Preliminary DS21298B-page 3

Page 4: MCP3208

MCP3204/3208

FIGURE 1-1: Serial Interface Timing.

FIGURE 1-2: Test Circuits.

CS

CLK

DIN MSB IN

tSU tHD

tSUCS

tCSH

tHI tLO

DOUT

tEN

tDOtR tF

LSBMSB OUT

tDIS

NULL BIT

90%

10%

* Waveform 1 is for an output with internal condi-tions such that the output is high, unless dis-abled by the output control.

† Waveform 2 is for an output with internal condi-tions such that the output is low, unless disabledby the output control.

Test Point

1.4V

DOUT

Load circuit for tR, tF, tDO

3K

CL = 100pF

Test Point

DOUT

Load circuit for tDIS and tEN

3K

100pF

tDIS Waveform 2

tDIS Waveform 1

CS

CLK

DOUT

tEN

1 2

B11

Voltage Waveforms for tEN

tEN Waveform

VDD

VDD/2

VSS

3 4DOUT

tR

Voltage Waveforms for tR, tF

CLK

DOUT

tDO

Voltage Waveforms for tDO

tF

VOHVOL

Voltage Waveforms for tDIS

DOUT

DOUT

CSVIH

TDIS

Waveform 1*

Waveform 2†

DS21298B-page 4 Preliminary 2001 Microchip Technology Inc.

Page 5: MCP3208

MCP3204/3208

2.0 TYPICAL PERFORMANCE CHARACTERISTICSNote: Unless otherwise indicated, VDD = VREF = 5V, VSS = 0V, fSAMPLE = 100ksps, fCLK = 20* fSAMPLE,TA = 25°C

FIGURE 2-1: Integral Nonlinearity (INL) vs. SampleRate.

FIGURE 2-2: Integral Nonlinearity (INL) vs. VREF.

FIGURE 2-3: Integral Nonlinearity (INL) vs. Code(Representative Part).

FIGURE 2-4: Integral Nonlinearity (INL) vs. SampleRate (VDD = 2.7V).

FIGURE 2-5: Integral Nonlinearity (INL) vs. VREF (VDD = 2.7V).

FIGURE 2-6: Integral Nonlinearity (INL) vs. Code(Representative Part, VDD = 2.7V).

-1.0

-0.8

-0.6

-0.4

-0.2

0.0

0.2

0.4

0.6

0.8

1.0

0 25 50 75 100 125 150

Sample Rate (ksps)

INL

(LS

B)

Positive INL

Negative INL

-3.0-2.5-2.0-1.5-1.0-0.50.00.51.01.52.02.53.0

0 1 2 3 4 5 6

VREF (V)

INL(

LSB

) Positive INL

Negative INL

-1.0

-0.8

-0.6

-0.4

-0.2

0.0

0.2

0.4

0.6

0.8

1.0

0 512 1024 1536 2048 2560 3072 3584 4096

Digital Code

INL

(LS

B)

-2.0

-1.5

-1.0

-0.5

0.0

0.5

1.0

1.5

2.0

0 10 20 30 40 50 60 70 80

Sample Rate (ksps)

INL

(LS

B) Positive INL

Negative INL

VDD = VREF = 2.7V

-2.0

-1.5

-1.0

-0.5

0.0

0.5

1.0

1.5

2.0

0.0 0.5 1.0 1.5 2.0 2.5 3.0

VREF (V)

INL(

LSB

)

Positive INL

Negative INL

-1.0

-0.8

-0.6

-0.4

-0.2

0.0

0.2

0.4

0.6

0.8

1.0

0 512 1024 1536 2048 2560 3072 3584 4096

Digital Code

INL

(LS

B)

VDD = VREF = 2.7V

FSAMPLE = 50ksps

2001 Microchip Technology Inc. Preliminary DS21298B-page 5

Page 6: MCP3208

MCP3204/3208

Note: Unless otherwise indicated, VDD = VREF = 5V, VSS = 0V, fSAMPLE = 100ksps, fCLK = 20* fSAMPLE,TA = 25°C

FIGURE 2-7: Integral Nonlinearity (INL) vs.Temperature.

FIGURE 2-8: Differential Nonlinearity (DNL) vs.Sample Rate.

FIGURE 2-9: Differential Nonlinearity (DNL) vs.VREF.

FIGURE 2-10: Integral Nonlinearity (INL) vs.Temperature (VDD = 2.7V).

FIGURE 2-11: Differential Nonlinearity (DNL) vs.Sample Rate (VDD = 2.7V).

FIGURE 2-12: Differential Nonlinearity (DNL) vs. VREF

(VDD = 2.7V).

-1.0

-0.8

-0.6

-0.4

-0.2

0.0

0.2

0.4

0.6

0.8

1.0

-50 -25 0 25 50 75 100

Temperature (°C)

INL

(LS

B)

Positive INL

Negative INL

-1.0

-0.8

-0.6

-0.4

-0.2

0.0

0.2

0.4

0.6

0.8

1.0

0 25 50 75 100 125 150

Sample Rate (ksps)

DN

L (L

SB

) Positive DNL

Negative DNL

-3.0

-2.0

-1.0

0.0

1.0

2.0

3.0

0 1 2 3 4 5

VREF (V)

DN

L (L

SB

)

Positive DNL

Negative DNL

-1.0

-0.8

-0.6

-0.4

-0.2

0.0

0.2

0.4

0.6

0.8

1.0

-50 -25 0 25 50 75 100

Temperature (°C)

INL

(LS

B)

Positive INL

VDD = VREF = 2.7V

FSAMPLE = 50ksps

Negative INL

-2.0

-1.5

-1.0

-0.5

0.0

0.5

1.0

1.5

2.0

0 10 20 30 40 50 60 70

Sample Rate (ksps)

DN

L (L

SB

) Positive DNL

Negative DNL

VDD = VREF = 2.7V

-3.0

-2.0

-1.0

0.0

1.0

2.0

3.0

0.0 0.5 1.0 1.5 2.0 2.5 3.0

VREF(V)

DN

L (L

SB

) Positive DNL

Negative DNL

VDD = VREF= 2.7V

FSAMPLE = 50ksps

DS21298B-page 6 Preliminary 2001 Microchip Technology Inc.

Page 7: MCP3208

MCP3204/3208

Note: Unless otherwise indicated, VDD = VREF = 5V, VSS = 0V, fSAMPLE = 100ksps, fCLK = 20* fSAMPLE,TA = 25°C

FIGURE 2-13: Differential Nonlinearity (DNL) vs.Code (Representative Part).

FIGURE 2-14: Differential Nonlinearity (DNL) vs.Temperature.

FIGURE 2-15: Gain Error vs. VREF.

FIGURE 2-16: Differential Nonlinearity (DNL) vs.Code (Representative Part, VDD = 2.7V).

FIGURE 2-17: Differential Nonlinearity (DNL) vs.Temperature (VDD = 2.7V).

FIGURE 2-18: Offset Error vs. VREF.

-1.0

-0.8

-0.6

-0.4

-0.2

0.0

0.2

0.4

0.6

0.8

1.0

0 512 1024 1536 2048 2560 3072 3584 4096

Digital Code

DN

L (L

SB

)

-1.0

-0.8

-0.6

-0.4

-0.2

0.0

0.2

0.4

0.6

0.8

1.0

-50 -25 0 25 50 75 100

Temperature (°C)

DN

L (L

SB

) Positive DNL

Negative DNL

-4

-3

-2

-1

0

1

2

3

4

0 1 2 3 4 5

VREF(V)

Gai

n E

rror

(LS

B)

VDD = 2.7V

FSAMPLE = 50ksps

VDD = 5V

FSAMPLE = 100ksps

-1.0

-0.8

-0.6

-0.4

-0.2

0.0

0.2

0.4

0.6

0.8

1.0

0 512 1024 1536 2048 2560 3072 3584 4096

Digital Code

DN

L (L

SB

)

VDD = VREF = 2.7V

FSAMPLE = 50ksps

-1.0

-0.8

-0.6

-0.4

-0.2

0.0

0.2

0.4

0.6

0.8

1.0

-50 -25 0 25 50 75 100

Temperature (°C)

DN

L (L

SB

) Positive DNL

VDD = VREF = 2.7V

FSAMPLE = 50ksps

Negative DNL

0

2

4

6

8

10

12

14

16

18

20

0 1 2 3 4 5

VREF (V)

Offs

et E

rror

(LS

B) VDD = 5V

FSAMPLE = 100ksps

VDD = 2.7V

FSAMPLE = 50ksps

2001 Microchip Technology Inc. Preliminary DS21298B-page 7

Page 8: MCP3208

MCP3204/3208

Note: Unless otherwise indicated, VDD = VREF = 5V, VSS = 0V, fSAMPLE = 100ksps, fCLK = 20* fSAMPLE,TA = 25°C

FIGURE 2-19: Gain Error vs. Temperature.

FIGURE 2-20: Signal to Noise (SNR) vs. InputFrequency.

FIGURE 2-21: Total Harmonic Distortion (THD) vs.Input Frequency.

FIGURE 2-22: Offset Error vs. Temperature.

FIGURE 2-23: Signal to Noise and Distortion(SINAD) vs. Input Frequency.

FIGURE 2-24: Signal to Noise and Distortion(SINAD) vs. Input Signal Level.

-1.8

-1.6

-1.4

-1.2

-1.0

-0.8

-0.6

-0.4

-0.2

0.0

0.2

-50 -25 0 25 50 75 100

Temperature (°C)

Gai

n E

rror

(LS

B)

VDD = VREF = 5V

FSAMPLE = 100ksps

VDD = VREF = 2.7V

FSAMPLE = 50ksps

0

10

20

30

40

5060

70

80

90

100

1 10 100

Input Frequency (kHz)

SN

R (

dB)

VDD = VREF = 2.7V

FSAMPLE = 50ksps

VDD = VREF = 5V

FSAMPLE = 100ksps

-100

-90

-80

-70

-60

-50

-40

-30

-20

-10

0

1 10 100

Input Frequency (kHz)

TH

D (

dB)

VDD = VREF = 5V

FSAMPLE = 100ksps

VDD = VREF = 2.7V

FSAMPLE = 50ksps

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

-50 -25 0 25 50 75 100

Temperature (°C)

Offs

et E

rror

(LS

B) VDD = VREF = 5V

FSAMPLE = 100ksps

VDD = VREF = 2.7V

FSAMPLE = 50ksps

0.0

10.0

20.0

30.0

40.0

50.060.0

70.0

80.0

90.0

100.0

1 10 100

Input Frequency (kHz)

SIN

AD

(dB

)

VDD = VREF = 2.7V

FSAMPLE = 50ksps

VDD = VREF = 5V

FSAMPLE = 100ksps

0

10

20

30

40

50

60

70

80

-40 -35 -30 -25 -20 -15 -10 -5 0

Input Signal Level (dB)

SIN

AD

(dB

)

VDD = VREF = 2.7V

FSAMPLE = 50ksps

VDD = VREF = 5V

FSAMPLE = 100ksps

DS21298B-page 8 Preliminary 2001 Microchip Technology Inc.

Page 9: MCP3208

MCP3204/3208

Note: Unless otherwise indicated, VDD = VREF = 5V, VSS = 0V, fSAMPLE = 100ksps, fCLK = 20* fSAMPLE,TA = 25°C

FIGURE 2-25: Effective Number of Bits (ENOB) vs.VREF.

FIGURE 2-26: Spurious Free Dynamic Range(SFDR) vs. Input Frequency.

FIGURE 2-27: Frequency Spectrum of 10kHz input(Representative Part).

FIGURE 2-28: Effective Number of Bits (ENOB) vs.Input Frequency.

FIGURE 2-29: Power Supply Rejection (PSR) vs.Ripple Frequency.

FIGURE 2-30: Frequency Spectrum of 1kHz input(Representative Part, VDD = 2.7V).

9.009.259.509.75

10.0010.2510.5010.7511.0011.2511.5011.7512.00

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

VREF (V)

EN

OB

(rm

s)

VDD = VREF = 2.7V

FSAMPLE = 50ksps

VDD = VREF = 5V

FSAMPLE =100ksps

0

10

20

30

40

50

60

70

80

90

100

1 10 100

Input Frequency (kHz)

SF

DR

(dB

)

VDD = VREF = 5V

FSAMPLE = 100ksps

VDD = VREF = 2.7V

FSAMPLE = 50ksps

-130-120-110-100-90-80-70-60-50-40-30-20-10

0

0 10000 20000 30000 40000 50000

Frequency (Hz)

Am

plitu

de (

dB)

VDD = VREF = 5V

FSAMPLE = 100ksps

FINPUT = 9.985kHz

4096 points

8.0

8.5

9.0

9.5

10.0

10.5

11.0

11.5

12.0

1 10 100

Input Frequency (kHz)

EN

OB

(rm

s)

VDD = VREF = 2.7V

FSAMPLE = 50ksps

VDD = VREF = 5V

FSAMPLE = 100ksps

-80

-70

-60

-50

-40

-30

-20

-10

0

1 10 100 1000 10000

Ripple Frequency (kHz)

Pow

er S

uppl

y R

ejec

tion

(dB

)

-130-120-110-100-90-80-70-60-50-40-30-20-10

0

0 5000 10000 15000 20000 25000

Frequency (Hz)

Am

plitu

de (

dB)

VDD = VREF = 2.7V

FSAMPLE = 50ksps

FINPUT = 998.76Hz

4096 points

2001 Microchip Technology Inc. Preliminary DS21298B-page 9

Page 10: MCP3208

MCP3204/3208

Note: Unless otherwise indicated, VDD = VREF = 5V, VSS = 0V, fSAMPLE = 100ksps, fCLK = 20* fSAMPLE,TA = 25°C

FIGURE 2-31: IDD vs. VDD.

FIGURE 2-32: IDD vs. Clock Frequency.

FIGURE 2-33: IDD vs. Temperature.

FIGURE 2-34: IREF vs. VDD.

FIGURE 2-35: IREF vs. Clock Frequency.

FIGURE 2-36: IREF vs. Temperature.

0

50

100

150

200

250

300

350

400

450

500

2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0

VDD (V)

IDD (

µA)

VREF = VDD

All points at FCLK = 2MHz except

at VREF = VDD = 2.5V, FCLK = 1MHz

0

50

100

150

200

250

300

350

400

10 100 1000 10000

Clock Frequency (kHz)

I DD (

µA)

VDD = VREF = 5V

VDD = VREF = 2.7V

0

50

100

150

200

250

300

350

400

-50 -25 0 25 50 75 100

Temperature (°C)

IDD (

µA)

VDD = VREF = 5V

FCLK = 2MHz

VDD = VREF = 2.7V

FCLK = 1MHz

0

10

20

30

40

50

60

70

80

90

100

2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0

VDD (V)

IRE

F (

µA)

VREF = VDD

All points at FCLK = 2MHz except

at VREF = VDD = 2.5V, FCLK = 1MHz

0

10

20

30

40

50

60

70

80

90

100

10 100 1000 10000

Clock Frequency (kHz)

IRE

F (

µA)

VDD = VREF = 5V

VDD = VREF = 2.7V

0

10

20

30

40

50

60

70

80

90

100

-50 -25 0 25 50 75 100

Temperature (°C)

IRE

F (

µA)

VDD = VREF = 5V

FCLK = 2MHz

VDD = VREF = 2.7V

FCLK = 1MHz

DS21298B-page 10 Preliminary 2001 Microchip Technology Inc.

Page 11: MCP3208

MCP3204/3208

Note: Unless otherwise indicated, VDD = VREF = 5V, VSS = 0V, fSAMPLE = 100ksps, fCLK = 20* fSAMPLE,TA = 25°C

FIGURE 2-37: IDDS vs. VDD.

FIGURE 2-38: IDDS vs. Temperature.

FIGURE 2-39: Analog Input Leakage Current vs.Temperature.

0

10

20

30

40

50

60

70

80

2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0

VDD (V)

IDD

S (

pA)

VREF = CS = VDD

0.01

0.10

1.00

10.00

100.00

-50 -25 0 25 50 75 100

Temperature (°C)

IDD

S (

nA)

VDD = VREF = CS = 5V

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

-50 -25 0 25 50 75 100

Temperature (°C)

Ana

log

Inpu

t Lea

kage

(nA

)

VDD = VREF = 5V

FCLK = 2MHz

2001 Microchip Technology Inc. Preliminary DS21298B-page 11

Page 12: MCP3208

MCP3204/3208

3.0 PIN DESCRIPTIONS

3.1 CH0 - CH7

Analog inputs for channels 0 - 7 respectively for themultiplexed inputs. Each pair of channels can be pro-grammed to be used as two independent channels insingle ended-mode or as a single pseudo-differentialinput where one channel is IN+ and one channel is IN-.See Section 4.1 and Section 5.0 for information on pro-gramming the channel configuration.

3.2 CS/SHDN(Chip Select/Shutdown)

The CS/SHDN pin is used to initiate communicationwith the device when pulled low and will end a conver-sion and put the device in low power standby whenpulled high. The CS/SHDN pin must be pulled highbetween conversions.

3.3 CLK (Serial Clock)

The SPI clock pin is used to initiate a conversion and toclock out each bit of the conversion as it takes place.See Section 6.2 for constraints on clock speed.

3.4 DIN (Serial Data Input)

The SPI port serial data input pin is used to load chan-nel configuration data into the device.

3.5 DOUT (Serial Data output)

The SPI serial data output pin is used to shift out theresults of the A/D conversion. Data will always changeon the falling edge of each clock as the conversiontakes place.

3.6 AGND

Analog ground connection to internal analog circuitry.

3.7 DGND

Digital ground connection to internal digital circuitry.

4.0 DEVICE OPERATIONThe MCP3204/3208 A/D Converters employ a conven-tional SAR architecture. With this architecture, a sam-ple is acquired on an internal sample/hold capacitor for1.5 clock cycles starting on the fourth rising edge of theserial clock after the start bit has been received. Fol-lowing this sample time, the device uses the collectedcharge on the internal sample and hold capacitor toproduce a serial 12-bit digital output code. Conversionrates of 100ksps are possible on the MCP3204/3208.See Section 6.2 for information on minimum clockrates. Communication with the device is done using a4-wire SPI-compatible interface.

4.1 Analog Inputs

The MCP3204/3208 devices offer the choice of usingthe analog input channels configured as single-endedinputs or pseudo-differential pairs. The MCP3204 canbe configured to provide two pseudo-differential inputpairs or four single-ended inputs. the MCP3208 can beconfigured to provide four pseudo-differential inputpairs or eight single-ended inputs. Configuration isdone as part of the serial command before each con-version begins. When used in the pseudo-differentialmode, each channel pair (i.e., CH0 and CH1, CH2 andCH3 etc.) are programmed as the IN+ and IN- inputs aspart of the command string transmitted to the device.The IN+ input can range from IN- to (VREF + IN-). TheIN- input is limited to ±100mV from the VSS rail. The IN-input can be used to cancel small signal com-mon-mode noise which is present on both the IN+ andIN- inputs.

When operating in the pseudo-differential mode, if thevoltage level of IN+ is equal to or less than IN-, theresultant code will be 000h. If the voltage at IN+ isequal to or greater than [VREF + (IN-)] - 1 LSB, then theoutput code will be FFFh. If the voltage level at IN- ismore than 1 LSB below VSS, then the voltage level atthe IN+ input will have to go below VSS to see the 000houtput code. Conversely, if IN- is more than 1 LSBabove VSS, then the FFFh code will not be seen unlessthe IN+ input level goes above VREF level.For the A/D Converter to meet specification, the chargeholding capacitor, (CSAMPLE) must be given enough timeto acquire a 12-bit accurate voltage level during the 1.5clock cycle sampling period. The analog input model isshown in Figure 4-1. In this diagram it is shown that the source impedance(RS) adds to the internal sampling switch (RSS) imped-ance, directly affecting the time that is required tocharge the capacitor, CSAMPLE. Consequently, largersource impedances increase the offset, gain, and inte-gral linearity errors of the conversion. See Figure 4-2.

4.2 Reference Input

For each device in the family, the reference input (VREF)determines the analog input voltage range. As the ref-erence input is reduced, the LSB size is reducedaccordingly. The theoretical digital output code pro-duced by the A/D Converter is a function of the analoginput signal and the reference input as shown below.

where:

VIN = analog input voltage

VREF = reference voltage

When using an external voltage reference device, thesystem designer should always refer to the manufac-turer’s recommendations for circuit layout. Any instabil-ity in the operation of the reference device will have adirect effect on the operation of the A/D Converter.

Digital Output Code = 4096 * VIN

VREF

DS21298B-page 12 Preliminary 2001 Microchip Technology Inc.

Page 13: MCP3208

MCP3204/3208

FIGURE 4-1: Analog Input Model

FIGURE 4-2: Maximum Clock Frequency vs. Inputresistance (RS) to maintain less than a 0.1LSBdeviation in INL from nominal conditions.

CPINVA

RS CHx

7pF

VT = 0.6V

VT = 0.6VILEAKAGE

SamplingSwitch

SS RSS = 1kΩ

CSAMPLE

= DAC capacitance

VSS

VDD

= 20 pF± 1 nA

= Signal Source

= Source Impedance

= Input Channel Pad

= Input Capacitance

= Threshold Voltage

= Leakage Current at the pin due to various junctions

= Sampling Switch

= Sampling Switch Resistor

= Sample/Hold Capacitance

VA

RS

CHx

CPIN

VT

ILEAKAGE

SS

RSS

CSAMPLE

Legend

0.0

0.5

1.0

1.5

2.0

2.5

100 1000 10000

Input Resistance (Ohms)

Clo

ck F

requ

ency

(M

Hz) VDD = 5V

VDD = 2.7V

2001 Microchip Technology Inc. Preliminary DS21298B-page 13

Page 14: MCP3208

MCP3204/3208

5.0 SERIAL COMMUNICATIONSCommunication with the MCP3204/3208 devices isdone using a standard SPI-compatible serial interface.Initiating communication with either device is done bybringing the CS line low. See Figure 5-1. If the devicewas powered up with the CS pin low, it must be broughthigh and back low to initiate communication. The firstclock received with CS low and DIN high will constitutea start bit. The SGL/DIFF bit follows the start bit and willdetermine if the conversion will be done using singleended or differential input mode. The next three bits(D0, D1 and D2) are used to select the input channelconfiguration. Table 5-1 and Table 5-2 show the config-uration bits for the MCP3204 and MCP3208, respec-tively. The device will begin to sample the analog inputon the fourth rising edge of the clock after the start bithas been received. The sample period will end on thefalling edge of the fifth clock following the start bit.

After the D0 bit is input, one more clock is required tocomplete the sample and hold period (DIN is a don’tcare for this clock). On the falling edge of the nextclock, the device will output a low null bit. The next 12clocks will output the result of the conversion with MSBfirst as shown in Figure 5-1. Data is always output fromthe device on the falling edge of the clock. If all 12 databits have been transmitted and the device continues toreceive clocks while the CS is held low, the device willoutput the conversion result LSB first as shown inFigure 5-2. If more clocks are provided to the devicewhile CS is still low (after the LSB first data has beentransmitted), the device will clock out zeros indefinitely.

If necessary, it is possible to bring CS low and clock inleading zeros on the DIN line before the start bit. This isoften done when dealing with microcontroller-basedSPI ports that must send 8 bits at a time. Refer toSection 6.1 for more details on using theMCP3204/3208 devices with hardware SPI ports.

CONTROL BIT SELECTIONS INPUT

CONFIGURATIONCHANNEL

SELECTIONSINGLE/DIFF

D2* D1 D0

1 X 0 0 single ended CH0

1 X 0 1 single ended CH1

1 X 1 0 single ended CH2

1 X 1 1 single ended CH3

0 X 0 0 differential CH0 = IN+CH1 = IN-

0 X 0 1 differential CH0 = IN-CH1 = IN+

0 X 1 0 differential CH2 = IN+CH3 = IN-

0 X 1 1 differential CH2 = IN-CH3 = IN+

*D2 is don’t care for MCP3204

TABLE 5-1: Configuration Bits for the MCP3204.

CONTROL BIT SELECTIONS INPUT

CONFIGURATIONCHANNEL

SELECTIONSINGLE/DIFF

D2 D1 D0

1 0 0 0 single ended CH0

1 0 0 1 single ended CH1

1 0 1 0 single ended CH2

1 0 1 1 single ended CH3

1 1 0 0 single ended CH4

1 1 0 1 single ended CH5

1 1 1 0 single ended CH6

1 1 1 1 single ended CH7

0 0 0 0 differential CH0 = IN+CH1 = IN-

0 0 0 1 differential CH0 = IN-CH1 = IN+

0 0 1 0 differential CH2 = IN+CH3 = IN-

0 0 1 1 differential CH2 = IN-CH3 = IN+

0 1 0 0 differential CH4 = IN+CH5 = IN-

0 1 0 1 differential CH4 = IN-CH5 = IN+

0 1 1 0 differential CH6 = IN+CH7 = IN-

0 1 1 1 differential CH6 = IN-CH7 = IN+

TABLE 5-2: Configuration Bits for the MCP3208.

DS21298B-page 14 Preliminary 2001 Microchip Technology Inc.

Page 15: MCP3208

MCP3204/3208

FIGURE 5-1: Communication with the MCP3204 or MCP3208.

FIGURE 5-2: Communication with MCP3204 or MCP3208 in LSB First Format.

CS

CLK

DIN

DOUT

D1D2 D0

HI-Z

Don’t Care

NullBit B11 B10 B9 B8 B7 B6 B5 B4 B3 B2 B1 B0 *

HI-Z

tSAMPLE

tCONV

SGL/DIFF

Start

tCYC

tCSH

tCYC

D2SGL/DIFF

Start

* After completing the data transfer, if further clocks are applied with CS low, the A/D Converter will output LSBfirst data, then followed with zeros indefinitely. See Figure 5-2 below.

** tDATA: during this time, the bias current and the comparator power down while the reference input becomesa high impedance node, leaving the CLK running to clock out the LSB-first data or zeros.

tDATA **

tSUCS

NullBit

B11 B10 B9 B8 B7 B6 B5 B4 B3 B2 B1 B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 B10 B11

CS

CLK

DOUT

HI-Z HI-Z

(MSB)

tCONV tDATA **

Power Down

tSAMPLE

Start

SGL/DIFF

DIN

tCYC

tCSH

D0D1D2

* After completing the data transfer, if further clocks are applied with CS low, the A/D Converter will output zerosindefinitely.

** tDATA: During this time, the bias circuit and the comparator power down while the reference input becomes ahigh impedance node, leaving the CLK running to clock out LSB first data or zeroes.

tSUCS

Don’t Care

*

2001 Microchip Technology Inc. Preliminary DS21298B-page 15

Page 16: MCP3208

MCP3204/3208

6.0 APPLICATIONS INFORMATION

6.1 Using the MCP3204/3208 with Microcontroller (MCU) SPI Ports

With most microcontroller SPI ports, it is required tosend groups of eight bits. It is also required that themicrocontroller SPI port be configured to clock out dataon the falling edge of clock and latch data in on the risingedge. Because communication with the MCP3204/3208devices may not need multiples of eight clocks, it will benecessary to provide more clocks than are required.This is usually done by sending ‘leading zeros’ beforethe start bit. As an example, Figure 6-1 and Figure 6-2shows how the MCP3204/3208 can be interfaced to aMCU with a hardware SPI port. Figure 6-1 depicts theoperation shown in SPI Mode 0,0 which requires that theSCLK from the MCU idles in the ‘low’ state, whileFigure 6-2 shows the similar case of SPI Mode 1,1where the clock idles in the ‘high’ state.

As shown in Figure 6-1, the first byte transmitted to theA/D Converter contains five leading zeros before thestart bit. Arranging the leading zeros this way producesthe output 12 bits to fall in positions easily manipulatedby the MCU. The MSB is clocked out of the A/D Con-verter on the falling edge of clock number 12. After thesecond eight clocks have been sent to the device, theMCUs receive buffer will contain three unknown bits(the output is at high impedance for the first two clocks),the null bit and the highest order four bits of the conver-sion. After the third byte has been sent to the device, thereceive register will contain the lowest order eight bits ofthe conversion results. Easier manipulation of the con-verted data can be obtained by using this method.

Figure 6-2 shows the same thing in SPI Mode 1,1which requires that the clock idles in the high state. Aswith mode 0,0, the A/D Converter outputs data on thefalling edge of the clock and the MCU latches data fromthe A/D Converter in on the rising edge of the clock.

FIGURE 6-1: SPI Communication using 8-bit segments (Mode 0,0: SCLK idles low).

FIGURE 6-2: SPI Communication using 8-bit segments (Mode 1,1: SCLK idles high).

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

CS

SCLK

DIN

X = Don’t Care Bits

17 18 19 20 21 22 23 24

DOUTNULLBIT B11 B10 B9 B8 B7 B6 B5 B4 B3 B2 B1 B0HI-Z

MCU latches data from A/D Converter

Data is clocked out ofA/D Converter on falling edges

on rising edges of SCLK

DO Don’t CareSGL/DIFF D1D2Start

0 0 0 0 0 1 X X X X XDO X X X X X X X X

B7 B6 B5 B4 B3 B2 B1 B0B11 B10 B9 B80? ? ? ? ? ? ? ? ? ? ?

D1D2SGL/DIFF

StartBit

(Null)

MCU Transmitted Data(Aligned with falling

edge of clock)

MCU Received Data(Aligned with rising

edge of clock)

X

Data stored into MCU receive register after transmission of first 8 bits

Data stored into MCU receive register after transmission of second 8 bits

Data stored into MCU receive register after transmission of last 8 bits

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

CS

SCLK

DIN

X = Don’t Care Bits

17 18 19 20 21 22 23 24

DOUT

DO Don’t Care

NULLBIT B11 B10 B9 B8 B6 B5 B4 B3 B2 B1 B0HI-Z

0 0 0 0 0 1 X X X X XDO

SGL/DIFF

X X X X X X X X

B7 B6 B5 B4 B3 B2 B1 B0B11 B10 B9 B80? ? ? ? ? ? ? ? ? ? ?

MCU latches data from A/D Converteron rising edges of SCLK

Data is clocked out ofA/D Converter on falling edges

D1D2SGL/DIFF

StartBit

(Null)

D1D2Start

MCU Transmitted Data(Aligned with falling

edge of clock)

MCU Received Data(Aligned with rising

edge of clock)

B7

X

Data stored into MCU receive register after transmission of first 8 bits

Data stored into MCU receive register after transmission of second 8 bits

Data stored into MCU receive register after transmission of last 8 bits

DS21298B-page 16 Preliminary 2001 Microchip Technology Inc.

Page 17: MCP3208

MCP3204/3208

6.2 Maintaining Minimum Clock Speed

When the MCP3204/3208 initiates the sample period,charge is stored on the sample capacitor. When thesample period is complete, the device converts one bitfor each clock that is received. It is important for theuser to note that a slow clock rate will allow charge tobleed off the sample capacitor while the conversion istaking place. At 85°C (worst case condition), the partwill maintain proper charge on the sample capacitor forat least 1.2ms after the sample period has ended. Thismeans that the time between the end of the sampleperiod and the time that all 12 data bits have beenclocked out must not exceed 1.2ms (effective clock fre-quency of 10kHz). Failure to meet this criterion mayinduce linearity errors into the conversion outside therated specifications. It should be noted that during theentire conversion cycle, the A/D Converter does notrequire a constant clock speed or duty cycle, as long asall timing specifications are met.

6.3 Buffering/Filtering the Analog Inputs

If the signal source for the A/D Converter is not a lowimpedance source, it will have to be buffered or inaccu-rate conversion results may occur. See Figure 4-2. It isalso recommended that a filter be used to eliminate anysignals that may be aliased back in to the conversionresults. This is illustrated in Figure 6-3 where an opamp is used to drive the analog input of theMCP3204/3208. This amplifier provides a low imped-ance source for the converter input and a low pass fil-ter, which eliminates unwanted high frequency noise.

Low pass (anti-aliasing) filters can be designed usingMicrochip’s free interactive FilterLab™ software. Fil-terLab will calculate capacitor and resistors values, aswell as determine the number of poles that are requiredfor the application. For more information on filtering sig-nals, see the application note AN699 “Anti-AliasingAnalog Filters for Data Acquisition Systems.”

FIGURE 6-3: The MCP601 Operational Amplifier isused to implement a 2nd order anti-aliasing filter forthe signal being converted by the MCP3204.

6.4 Layout Considerations

When laying out a printed circuit board for use withanalog components, care should be taken to reducenoise wherever possible. A bypass capacitor shouldalways be used with this device and should be placedas close as possible to the device pin. A bypass capac-itor value of 1µF is recommended.

Digital and analog traces should be separated as muchas possible on the board and no traces should rununderneath the device or the bypass capacitor. Extraprecautions should be taken to keep traces with highfrequency signals (such as clock lines) as far as possi-ble from analog traces.

Use of an analog ground plane is recommended inorder to keep the ground potential the same for alldevices on the board. Providing VDD connections todevices in a “star” configuration can also reduce noiseby eliminating return current paths and associatederrors. See Figure 6-4. For more information on layouttips when using A/D Converters, refer to AN688 “Lay-out Tips for 12-Bit A/D Converter Applications”.

FIGURE 6-4: VDD traces arranged in a ‘Star’configuration in order to reduce errors caused bycurrent return paths.

FilterLab is a trademark of Microchip Technology Inc. inthe U.S.A and other countries. All rights reserved.

MCP3204

VDD

10µF

IN-

IN+

-+

VIN

C1

C2

VREF

4.096VReference

ADIREF198

1µF

1µF0.1µFTant.

0.1µF

MCP601R1

R2

R3

R4

VDDConnection

Device 1

Device 2

Device 3

Device 4

2001 Microchip Technology Inc. Preliminary DS21298B-page 17

Page 18: MCP3208

MCP3204/3208

6.5 Utilizing the Digital and Analog Ground Pins

The MCP3204/3208 devices provide both digital andanalog ground connections to provide another meansof noise reduction. As shown in Figure 6-5, the analogand digital circuitry is separated internal to the device.This reduces noise from the digital portion of the devicebeing coupled into the analog portion of the device. Thetwo grounds are connected internally through the sub-strate which has a resistance of 5 -10 Ω.

If no ground plane is utilized, then both grounds mustbe connected to VSS on the board. If a ground plane isavailable, both digital and analog ground pins shouldbe connected to the analog ground plane. If both ananalog and a digital ground plane are available, boththe digital and the analog ground pins should be con-nected to the analog ground plane. Following thesesteps will reduce the amount of digital noise from therest of the board being coupled into the A/D Converter.

FIGURE 6-5: Separation of Analog and DigitalGround Pins.

VDD

Digital Side

-SPI Interface

-Shift Register

-Control Logic

Analog Side

-Sample Cap

-Capacitor Array

-Comparator

Substrate

5 - 10 Ω

Analog Ground Pin

DigitalGround Pin

DS21298B-page 18 Preliminary 2001 Microchip Technology Inc.

Page 19: MCP3208

MCP3204/3208

MCP3204 PRODUCT IDENTIFICATION SYSTEMS

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

MCP3208 PRODUCT IDENTIFICATION SYSTEMS

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

Sales and Support

Package: P = PDIP (14 lead)SL = SOIC (150 mil Body), 14 leadST = TSSOP, 14 lead (C Grade only)

Temperature I = –40°C to +85°CRange:

Performance B = ±1 LSB INL (TSSOP not available in this grade)Grade: C = ±2 LSB INL

Device: MCP3204 = 4-Channel 12-Bit Serial A/D ConverterMCP3204T = 4-Channel 12-Bit Serial A/D Converter on tape and reel

(SOIC and TSSOP packages only)

MCP3204 - G T /P

Package: P = PDIP (16 lead)SL = SOIC (150 mil Body), 16 lead

Temperature I = –40°C to +85°CRange:

Performance B = ±1 LSB INL (TSSOP not available in this grade)Grade: C = ±2 LSB INL

Device: MCP3208 = 8-Channel 12-Bit Serial A/D ConverterMCP3208T = 8-Channel 12-Bit Serial A/D Converter on tape and reel

(SOIC packages only)

MCP3208 - G T /P

Data Sheets

Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:

1. Your local Microchip sales office2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-72773. The Microchip Worldwide Site (www.microchip.com)

Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.

New Customer Notification System

Register on our web site (www.microchip.com/cn) to receive the most current information on our products.

2001 Microchip Technology Inc. Preliminary DS21298B-page 19

Page 20: MCP3208

MCP3204/3208

NOTES:

DS21298B-page 20 Preliminary 2001 Microchip Technology Inc.

Page 21: MCP3208

MCP3204/3208

NOTES:

2001 Microchip Technology Inc. Preliminary DS21298B-page 21

Page 22: MCP3208

MCP3204/3208

NOTES:

DS21298B-page 22 Preliminary 2001 Microchip Technology Inc.

Page 23: MCP3208

MCP3204/3208

“All rights reserved. Copyright © 2001, Microchip Technology Incorporated, USA. Information containedin this publication regarding device applications and thelike is intended through suggestion only and may besuperseded by updates. No representation or warrantyis given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracyor use of such information, or infringement of patents orother intellectual property rights arising from such useor otherwise. Use of Microchip’s products as criticalcomponents in life support systems is not authorizedexcept with express written approval by Microchip. Nolicenses are conveyed, implicitly or otherwise, underany intellectual property rights. The Microchip logo andname are registered trademarks of Microchip Technology Inc. in the U.S.A. and other countries. Allrights reserved. All other trademarks mentioned hereinare the property of their respective companies. Nolicenses are conveyed, implicitly or otherwise, underany intellectual property rights.”

Trademarks

The Microchip name, logo, PIC, PICmicro, PICMASTER, PICSTART, PRO MATE, KEELOQ,SEEVAL, MPLAB and The Embedded Control Solutions Company are registered trademarks ofMicrochip Technology Incorporated in the U.S.A. andother countries.

Total Endurance, ICSP, In-Circuit Serial Programming,FilterLab, MXDEV, microID, FlexROM, fuzzyLAB,MPASM, MPLINK, MPLIB, PICDEM, ICEPIC, Migratable Memory, FanSense, ECONOMONITOR,SelectMode and microPort are trademarks of Microchip Technology Incorporated in the U.S.A.

Serialized Quick Term Programming (SQTP) is a service mark of Microchip Technology Incorporated inthe U.S.A.

All other trademarks mentioned herein are property oftheir respective companies.

© 2001, Microchip Technology Incorporated, Printed inthe U.S.A., All Rights Reserved.

2001 Microchip Technology Inc. Preliminary DS21298B-page 23

Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999. The Company’s quality system processes and procedures are QS-9000 compliant for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs and microperipheral products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001 certified.

Page 24: MCP3208

Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded byupdates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability isassumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectualproperty rights arising from such use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except withexpress written approval by Microchip. No licenses are conveyed, implicitly or otherwise, except as maybe explicitly expressed herein, under any intellec-tual property rights. The Microchip logo and name are registered trademarks of Microchip Technology Inc. in the U.S.A. and other countries. All rightsreserved. All other trademarks mentioned herein are the property of their respective companies.

DS21298B-page 24 Preliminary 2001 Microchip Technology Inc.

All rights reserved. © 2001 Microchip Technology Incorporated. Printed in the USA. 2/01 Printed on recycled paper.

AMERICASCorporate Office2355 West Chandler Blvd.Chandler, AZ 85224-6199Tel: 480-792-7200 Fax: 480-792-7277Technical Support: 480-792-7627Web Address: http://www.microchip.comRocky Mountain2355 West Chandler Blvd.Chandler, AZ 85224-6199Tel: 480-792-7966 Fax: 480-792-7456Atlanta500 Sugar Mill Road, Suite 200BAtlanta, GA 30350Tel: 770-640-0034 Fax: 770-640-0307AustinAnalog Product Sales8303 MoPac Expressway NorthSuite A-201Austin, TX 78759Tel: 512-345-2030 Fax: 512-345-6085Boston2 Lan Drive, Suite 120Westford, MA 01886Tel: 978-692-3848 Fax: 978-692-3821BostonAnalog Product SalesUnit A-8-1 Millbrook Tarry Condominium97 Lowell RoadConcord, MA 01742Tel: 978-371-6400 Fax: 978-371-0050Chicago333 Pierce Road, Suite 180Itasca, IL 60143Tel: 630-285-0071 Fax: 630-285-0075Dallas4570 Westgrove Drive, Suite 160Addison, TX 75001Tel: 972-818-7423 Fax: 972-818-2924DaytonTwo Prestige Place, Suite 130Miamisburg, OH 45342Tel: 937-291-1654 Fax: 937-291-9175DetroitTri-Atria Office Building 32255 Northwestern Highway, Suite 190Farmington Hills, MI 48334Tel: 248-538-2250 Fax: 248-538-2260Los Angeles18201 Von Karman, Suite 1090Irvine, CA 92612Tel: 949-263-1888 Fax: 949-263-1338Mountain ViewAnalog Product Sales1300 Terra Bella AvenueMountain View, CA 94043-1836Tel: 650-968-9241 Fax: 650-967-1590

New York150 Motor Parkway, Suite 202Hauppauge, NY 11788Tel: 631-273-5305 Fax: 631-273-5335San JoseMicrochip Technology Inc.2107 North First Street, Suite 590San Jose, CA 95131Tel: 408-436-7950 Fax: 408-436-7955Toronto6285 Northam Drive, Suite 108Mississauga, Ontario L4V 1X5, CanadaTel: 905-673-0699 Fax: 905-673-6509

ASIA/PACIFICAustraliaMicrochip Technology Australia Pty LtdSuite 22, 41 Rawson StreetEpping 2121, NSWAustraliaTel: 61-2-9868-6733 Fax: 61-2-9868-6755China - BeijingMicrochip Technology Beijing OfficeUnit 915New China Hong Kong Manhattan Bldg.No. 6 Chaoyangmen Beidajie Beijing, 100027, No. ChinaTel: 86-10-85282100 Fax: 86-10-85282104China - ShanghaiMicrochip Technology Shanghai OfficeRoom 701, Bldg. BFar East International PlazaNo. 317 Xian Xia RoadShanghai, 200051Tel: 86-21-6275-5700 Fax: 86-21-6275-5060Hong KongMicrochip Asia PacificRM 2101, Tower 2, Metroplaza223 Hing Fong RoadKwai Fong, N.T., Hong KongTel: 852-2401-1200 Fax: 852-2401-3431IndiaMicrochip Technology Inc.India Liaison OfficeDivyasree Chambers1 Floor, Wing A (A3/A4)No. 11, O’Shaugnessey RoadBangalore, 560 025, IndiaTel: 91-80-2290061 Fax: 91-80-2290062JapanMicrochip Technology Intl. Inc.Benex S-1 6F3-18-20, ShinyokohamaKohoku-Ku, Yokohama-shiKanagawa, 222-0033, JapanTel: 81-45-471- 6166 Fax: 81-45-471-6122

ASIA/PACIFIC (continued)KoreaMicrochip Technology Korea168-1, Youngbo Bldg. 3 FloorSamsung-Dong, Kangnam-KuSeoul, KoreaTel: 82-2-554-7200 Fax: 82-2-558-5934SingaporeMicrochip Technology Singapore Pte Ltd.200 Middle Road#07-02 Prime CentreSingapore, 188980Tel: 65-334-8870 Fax: 65-334-8850TaiwanMicrochip Technology Taiwan11F-3, No. 207Tung Hua North RoadTaipei, 105, TaiwanTel: 886-2-2717-7175 Fax: 886-2-2545-0139

EUROPEDenmarkMicrochip Technology Denmark ApSRegus Business CentreLautrup hoj 1-3Ballerup DK-2750 DenmarkTel: 45 4420 9895 Fax: 45 4420 9910FranceArizona Microchip Technology SARLParc d’Activite du Moulin de Massy43 Rue du Saule TrapuBatiment A - ler Etage91300 Massy, FranceTel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79GermanyArizona Microchip Technology GmbHGustav-Heinemann Ring 125D-81739 Munich, GermanyTel: 49-89-627-144 0 Fax: 49-89-627-144-44GermanyAnalog Product SalesLochhamer Strasse 13D-82152 Martinsried, GermanyTel: 49-89-895650-0 Fax: 49-89-895650-22ItalyArizona Microchip Technology SRLCentro Direzionale Colleoni Palazzo Taurus 1 V. Le Colleoni 120041 Agrate BrianzaMilan, Italy Tel: 39-039-65791-1 Fax: 39-039-6899883United KingdomArizona Microchip Technology Ltd.505 Eskdale RoadWinnersh TriangleWokingham Berkshire, England RG41 5TUTel: 44 118 921 5869 Fax: 44-118 921-5820

01/30/01

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