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MCP3204/32082.7V 4-Channel/8-Channel 12-Bit A/D Converters
with SPI™
FEATURES
• 12-bit resolution• ± 1 LSB max DNL• ± 1 LSB max INL (MCP3204/3208-B)• ± 2 LSB max INL (MCP3204/3208-C)• 4 (MCP3204) or 8 (MCP3208) input channels• Analog inputs programmable as single-ended or
pseudo differential pairs• On-chip sample and hold• SPI™ serial interface (modes 0,0 and 1,1)• Single supply operation: 2.7V - 5.5V• 100ksps max. sampling rate at VDD = 5V• 50ksps max. sampling rate at VDD = 2.7V• Low power CMOS technology
- 500 nA typical standby current, 2µA max.- 400 µA max. active current at 5V
• Industrial temp range: -40°C to +85°C • Available in PDIP, SOIC and TSSOP packages
APPLICATIONS
• Sensor Interface• Process Control• Data Acquisition• Battery Operated Systems
DESCRIPTION
The Microchip Technology Inc. MCP3204/3208devices are successive approximation 12-bit Ana-log-to-Digital (A/D) Converters with on-board sampleand hold circuitry. The MCP3204 is programmable toprovide two pseudo-differential input pairs or four sin-gle-ended inputs. The MCP3208 is programmable toprovide four pseudo-differential input pairs or eight sin-gle-ended inputs. Differential Nonlinearity (DNL) isspecified at ±1 LSB, and Integral Nonlinearity (INL) isoffered in ±1 LSB (MCP3204/3208-B) and ±2 LSB(MCP3204/3208-C) versions. Communication with thedevices is done using a simple serial interface compat-ible with the SPI protocol. The devices are capable ofconversion rates of up to 100ksps. The MCP3204/3208devices operate over a broad voltage range (2.7V -5.5V). Low current design permits operation with typi-cal standby and active currents of only 500nA and320µA, respectively. The MCP3204 is offered in 14-pinPDIP, 150mil SOIC and TSSOP packages, and theMCP3208 is offered in 16-pin PDIP and SOIC pack-ages.
SPI is a trademark of Motorola Inc.
PACKAGE TYPES
FUNCTIONAL BLOCK DIAGRAM
VDD
CLK
DOUT
MC
P3204
1
234
14
13121110
98
5
67
VREF
DIN
CH0CH1CH2CH3
CS/SHDNDGND
AGND
NC
VDD
CLKDOUT
MC
P3208
1
234
16
15141312
11109
5
678
VREF
DIN
CS/SHDNDGND
CH0CH1CH2CH3CH4CH5CH6CH7
NC
AGND
PDIP, SOIC, TSSOP
PDIP, SOIC
Comparator
Sampleand Hold
12-Bit SAR
DAC
Control Logic
CS/SHDN
VREF
VSSVDD
CLK DOUT
ShiftRegister
CH0
ChannelMux
InputCH1
CH7*
*Note: Channels 5-7 available on MCP3208 Only
DIN
2001 Microchip Technology Inc. Preliminary DS21298B-page 1
MCP3204/3208
1.0 ELECTRICAL CHARACTERISTICS
1.1 Maximum Ratings*
VDD.........................................................................7.0VAll inputs and outputs w.r.t. VSS ...... -0.6V to VDD +0.6VStorage temperature ..........................-65°C to +150°CAmbient temp. with power applied .....-65°C to +125°CSoldering temperature of leads (10 seconds) .. +300°CESD protection on all pins ...................................> 4kV*Notice: Stresses above those listed under “Maximum Ratings” maycause permanent damage to the device. This is a stress rating only andfunctional operation of the device at those or any other conditionsabove those indicated in the operational listings of this specification isnot implied. Exposure to maximum rating conditions for extended peri-ods may affect device reliability.
PIN FUNCTION TABLE
NAME FUNCTION
VDD
DGND
AGND
CH0-CH7
CLK
DIN
DOUT
CS/SHDN
VREF
+2.7V to 5.5V Power Supply
Digital Ground
Analog Ground
Analog Inputs
Serial Clock
Serial Data In
Serial Data Out
Chip Select/Shutdown Input
Reference Voltage Input
ELECTRICAL CHARACTERISTICSAll parameters apply at VDD = 5V, VSS = 0V, VREF = 5V, TAMB = -40°C to +85°C, fSAMPLE = 100ksps and fCLK = 20*fSAMPLE, unless otherwise noted.
PARAMETER SYMBOL MIN. TYP. MAX. UNITS CONDITIONS
Conversion Rate
Conversion Time tCONV 12 clock cycles
Analog Input Sample Time tSAMPLE 1.5 clock cycles
Throughput Rate fSAMPLE 10050
kspsksps
VDD = VREF = 5VVDD = VREF = 2.7V
DC Accuracy
Resolution 12 bits
Integral Nonlinearity INL ±0.75±1
±1±2
LSB MCP3204/3208-BMCP3204/3208-C
Differential Nonlinearity DNL ±0.5 ±1 LSB No missing codes over temperature
Offset Error ±1.25 ±3 LSB
Gain Error ±1.25 ±5 LSB
Dynamic Performance
Total Harmonic Distortion -82 dB VIN = 0.1V to 4.9V@1kHz
Signal to Noise and Distortion (SINAD)
72 dB VIN = 0.1V to 4.9V@1kHz
Spurious Free Dynamic Range
86 dB VIN = 0.1V to 4.9V@1kHz
Reference Input
Voltage Range 0.25 VDD V Note 2
Current Drain 1000.001
1503
µAµA CS = VDD = 5V
Analog Inputs
Input Voltage Range for CH0-CH7 in Single-Ended Mode
VSS VREF V
Input Voltage Range for IN+ In pseudo-differential Mode
IN- VREF+IN-
Input Voltage Range for IN- In pseudo-differential Mode
VSS-100 VSS+100 mV
Leakage Current 0.001 ±1 µA
DS21298B-page 2 Preliminary 2001 Microchip Technology Inc.
MCP3204/3208
Analog Inputs (Continued)
Switch Resistance 1K Ω See Figure 4-1
Sample Capacitor 20 pF See Figure 4-1
Digital Input/Output
Data Coding Format Straight Binary
High Level Input Voltage VIH 0.7 VDD V
Low Level Input Voltage VIL 0.3 VDD V
High Level Output Voltage VOH 4.1 V IOH = -1mA, VDD = 4.5V
Low Level Output Voltage VOL 0.4 V IOL = 1mA, VDD = 4.5V
Input Leakage Current ILI -10 10 µA VIN = VSS or VDD
Output Leakage Current ILO -10 10 µA VOUT = VSS or VDD
Pin Capacitance(All Inputs/Outputs)
CIN, COUT 10 pF VDD = 5.0V (Note 1)TAMB = 25°C, f = 1 MHz
Timing Parameters
Clock Frequency fCLK 2.01.0
MHzMHz
VDD = 5V (Note 3)VDD = 2.7V (Note 3)
Clock High Time tHI 250 ns
Clock Low Time tLO 250 ns
CS Fall To First Rising CLK Edge
tSUCS 100 ns
Data Input Setup Time tSU 50 ns
Data Input Hold Time tHD 50 ns
CLK Fall To Output Data Valid tDO 200 ns See Test Circuits, Figure 1-2
CLK Fall To Output Enable tEN 200 ns See Test Circuits, Figure 1-2
CS Rise To Output Disable tDIS 100 ns See Test Circuits, Figure 1-2
CS Disable Time tCSH 500 ns
DOUT Rise Time tR 100 ns See Test Circuits, Figure 1-2 (Note 1)
DOUT Fall Time tF 100 ns See Test Circuits, Figure 1-2 (Note 1)
Power Requirements
Operating Voltage VDD 2.7 5.5 V
Operating Current IDD 320225
400 µA VDD = VREF = 5V, DOUT unloadedVDD = VREF = 2.7V, DOUT unloaded
Standby Current IDDS 0.5 2 µA CS = VDD = 5.0V
Note 1: This parameter is guaranteed by characterization and not 100% tested. Note 2: See graphs that relate linearity performance to VREF levels. Note 3: Because the sample cap will eventually lose charge, effective clock rates below 10kHz can affect linearity
performance, especially at elevated temperatures. See Section 6.2 for more information.
ELECTRICAL CHARACTERISTICS (CONTINUED)All parameters apply at VDD = 5V, VSS = 0V, VREF = 5V, TAMB = -40°C to +85°C, fSAMPLE = 100ksps and fCLK = 20*fSAMPLE, unless otherwise noted.
PARAMETER SYMBOL MIN. TYP. MAX. UNITS CONDITIONS
2001 Microchip Technology Inc. Preliminary DS21298B-page 3
MCP3204/3208
FIGURE 1-1: Serial Interface Timing.
FIGURE 1-2: Test Circuits.
CS
CLK
DIN MSB IN
tSU tHD
tSUCS
tCSH
tHI tLO
DOUT
tEN
tDOtR tF
LSBMSB OUT
tDIS
NULL BIT
90%
10%
* Waveform 1 is for an output with internal condi-tions such that the output is high, unless dis-abled by the output control.
† Waveform 2 is for an output with internal condi-tions such that the output is low, unless disabledby the output control.
Test Point
1.4V
DOUT
Load circuit for tR, tF, tDO
3K
CL = 100pF
Test Point
DOUT
Load circuit for tDIS and tEN
3K
100pF
tDIS Waveform 2
tDIS Waveform 1
CS
CLK
DOUT
tEN
1 2
B11
Voltage Waveforms for tEN
tEN Waveform
VDD
VDD/2
VSS
3 4DOUT
tR
Voltage Waveforms for tR, tF
CLK
DOUT
tDO
Voltage Waveforms for tDO
tF
VOHVOL
Voltage Waveforms for tDIS
DOUT
DOUT
CSVIH
TDIS
Waveform 1*
Waveform 2†
DS21298B-page 4 Preliminary 2001 Microchip Technology Inc.
MCP3204/3208
2.0 TYPICAL PERFORMANCE CHARACTERISTICSNote: Unless otherwise indicated, VDD = VREF = 5V, VSS = 0V, fSAMPLE = 100ksps, fCLK = 20* fSAMPLE,TA = 25°C
FIGURE 2-1: Integral Nonlinearity (INL) vs. SampleRate.
FIGURE 2-2: Integral Nonlinearity (INL) vs. VREF.
FIGURE 2-3: Integral Nonlinearity (INL) vs. Code(Representative Part).
FIGURE 2-4: Integral Nonlinearity (INL) vs. SampleRate (VDD = 2.7V).
FIGURE 2-5: Integral Nonlinearity (INL) vs. VREF (VDD = 2.7V).
FIGURE 2-6: Integral Nonlinearity (INL) vs. Code(Representative Part, VDD = 2.7V).
-1.0
-0.8
-0.6
-0.4
-0.2
0.0
0.2
0.4
0.6
0.8
1.0
0 25 50 75 100 125 150
Sample Rate (ksps)
INL
(LS
B)
Positive INL
Negative INL
-3.0-2.5-2.0-1.5-1.0-0.50.00.51.01.52.02.53.0
0 1 2 3 4 5 6
VREF (V)
INL(
LSB
) Positive INL
Negative INL
-1.0
-0.8
-0.6
-0.4
-0.2
0.0
0.2
0.4
0.6
0.8
1.0
0 512 1024 1536 2048 2560 3072 3584 4096
Digital Code
INL
(LS
B)
-2.0
-1.5
-1.0
-0.5
0.0
0.5
1.0
1.5
2.0
0 10 20 30 40 50 60 70 80
Sample Rate (ksps)
INL
(LS
B) Positive INL
Negative INL
VDD = VREF = 2.7V
-2.0
-1.5
-1.0
-0.5
0.0
0.5
1.0
1.5
2.0
0.0 0.5 1.0 1.5 2.0 2.5 3.0
VREF (V)
INL(
LSB
)
Positive INL
Negative INL
-1.0
-0.8
-0.6
-0.4
-0.2
0.0
0.2
0.4
0.6
0.8
1.0
0 512 1024 1536 2048 2560 3072 3584 4096
Digital Code
INL
(LS
B)
VDD = VREF = 2.7V
FSAMPLE = 50ksps
2001 Microchip Technology Inc. Preliminary DS21298B-page 5
MCP3204/3208
Note: Unless otherwise indicated, VDD = VREF = 5V, VSS = 0V, fSAMPLE = 100ksps, fCLK = 20* fSAMPLE,TA = 25°C
FIGURE 2-7: Integral Nonlinearity (INL) vs.Temperature.
FIGURE 2-8: Differential Nonlinearity (DNL) vs.Sample Rate.
FIGURE 2-9: Differential Nonlinearity (DNL) vs.VREF.
FIGURE 2-10: Integral Nonlinearity (INL) vs.Temperature (VDD = 2.7V).
FIGURE 2-11: Differential Nonlinearity (DNL) vs.Sample Rate (VDD = 2.7V).
FIGURE 2-12: Differential Nonlinearity (DNL) vs. VREF
(VDD = 2.7V).
-1.0
-0.8
-0.6
-0.4
-0.2
0.0
0.2
0.4
0.6
0.8
1.0
-50 -25 0 25 50 75 100
Temperature (°C)
INL
(LS
B)
Positive INL
Negative INL
-1.0
-0.8
-0.6
-0.4
-0.2
0.0
0.2
0.4
0.6
0.8
1.0
0 25 50 75 100 125 150
Sample Rate (ksps)
DN
L (L
SB
) Positive DNL
Negative DNL
-3.0
-2.0
-1.0
0.0
1.0
2.0
3.0
0 1 2 3 4 5
VREF (V)
DN
L (L
SB
)
Positive DNL
Negative DNL
-1.0
-0.8
-0.6
-0.4
-0.2
0.0
0.2
0.4
0.6
0.8
1.0
-50 -25 0 25 50 75 100
Temperature (°C)
INL
(LS
B)
Positive INL
VDD = VREF = 2.7V
FSAMPLE = 50ksps
Negative INL
-2.0
-1.5
-1.0
-0.5
0.0
0.5
1.0
1.5
2.0
0 10 20 30 40 50 60 70
Sample Rate (ksps)
DN
L (L
SB
) Positive DNL
Negative DNL
VDD = VREF = 2.7V
-3.0
-2.0
-1.0
0.0
1.0
2.0
3.0
0.0 0.5 1.0 1.5 2.0 2.5 3.0
VREF(V)
DN
L (L
SB
) Positive DNL
Negative DNL
VDD = VREF= 2.7V
FSAMPLE = 50ksps
DS21298B-page 6 Preliminary 2001 Microchip Technology Inc.
MCP3204/3208
Note: Unless otherwise indicated, VDD = VREF = 5V, VSS = 0V, fSAMPLE = 100ksps, fCLK = 20* fSAMPLE,TA = 25°C
FIGURE 2-13: Differential Nonlinearity (DNL) vs.Code (Representative Part).
FIGURE 2-14: Differential Nonlinearity (DNL) vs.Temperature.
FIGURE 2-15: Gain Error vs. VREF.
FIGURE 2-16: Differential Nonlinearity (DNL) vs.Code (Representative Part, VDD = 2.7V).
FIGURE 2-17: Differential Nonlinearity (DNL) vs.Temperature (VDD = 2.7V).
FIGURE 2-18: Offset Error vs. VREF.
-1.0
-0.8
-0.6
-0.4
-0.2
0.0
0.2
0.4
0.6
0.8
1.0
0 512 1024 1536 2048 2560 3072 3584 4096
Digital Code
DN
L (L
SB
)
-1.0
-0.8
-0.6
-0.4
-0.2
0.0
0.2
0.4
0.6
0.8
1.0
-50 -25 0 25 50 75 100
Temperature (°C)
DN
L (L
SB
) Positive DNL
Negative DNL
-4
-3
-2
-1
0
1
2
3
4
0 1 2 3 4 5
VREF(V)
Gai
n E
rror
(LS
B)
VDD = 2.7V
FSAMPLE = 50ksps
VDD = 5V
FSAMPLE = 100ksps
-1.0
-0.8
-0.6
-0.4
-0.2
0.0
0.2
0.4
0.6
0.8
1.0
0 512 1024 1536 2048 2560 3072 3584 4096
Digital Code
DN
L (L
SB
)
VDD = VREF = 2.7V
FSAMPLE = 50ksps
-1.0
-0.8
-0.6
-0.4
-0.2
0.0
0.2
0.4
0.6
0.8
1.0
-50 -25 0 25 50 75 100
Temperature (°C)
DN
L (L
SB
) Positive DNL
VDD = VREF = 2.7V
FSAMPLE = 50ksps
Negative DNL
0
2
4
6
8
10
12
14
16
18
20
0 1 2 3 4 5
VREF (V)
Offs
et E
rror
(LS
B) VDD = 5V
FSAMPLE = 100ksps
VDD = 2.7V
FSAMPLE = 50ksps
2001 Microchip Technology Inc. Preliminary DS21298B-page 7
MCP3204/3208
Note: Unless otherwise indicated, VDD = VREF = 5V, VSS = 0V, fSAMPLE = 100ksps, fCLK = 20* fSAMPLE,TA = 25°C
FIGURE 2-19: Gain Error vs. Temperature.
FIGURE 2-20: Signal to Noise (SNR) vs. InputFrequency.
FIGURE 2-21: Total Harmonic Distortion (THD) vs.Input Frequency.
FIGURE 2-22: Offset Error vs. Temperature.
FIGURE 2-23: Signal to Noise and Distortion(SINAD) vs. Input Frequency.
FIGURE 2-24: Signal to Noise and Distortion(SINAD) vs. Input Signal Level.
-1.8
-1.6
-1.4
-1.2
-1.0
-0.8
-0.6
-0.4
-0.2
0.0
0.2
-50 -25 0 25 50 75 100
Temperature (°C)
Gai
n E
rror
(LS
B)
VDD = VREF = 5V
FSAMPLE = 100ksps
VDD = VREF = 2.7V
FSAMPLE = 50ksps
0
10
20
30
40
5060
70
80
90
100
1 10 100
Input Frequency (kHz)
SN
R (
dB)
VDD = VREF = 2.7V
FSAMPLE = 50ksps
VDD = VREF = 5V
FSAMPLE = 100ksps
-100
-90
-80
-70
-60
-50
-40
-30
-20
-10
0
1 10 100
Input Frequency (kHz)
TH
D (
dB)
VDD = VREF = 5V
FSAMPLE = 100ksps
VDD = VREF = 2.7V
FSAMPLE = 50ksps
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
-50 -25 0 25 50 75 100
Temperature (°C)
Offs
et E
rror
(LS
B) VDD = VREF = 5V
FSAMPLE = 100ksps
VDD = VREF = 2.7V
FSAMPLE = 50ksps
0.0
10.0
20.0
30.0
40.0
50.060.0
70.0
80.0
90.0
100.0
1 10 100
Input Frequency (kHz)
SIN
AD
(dB
)
VDD = VREF = 2.7V
FSAMPLE = 50ksps
VDD = VREF = 5V
FSAMPLE = 100ksps
0
10
20
30
40
50
60
70
80
-40 -35 -30 -25 -20 -15 -10 -5 0
Input Signal Level (dB)
SIN
AD
(dB
)
VDD = VREF = 2.7V
FSAMPLE = 50ksps
VDD = VREF = 5V
FSAMPLE = 100ksps
DS21298B-page 8 Preliminary 2001 Microchip Technology Inc.
MCP3204/3208
Note: Unless otherwise indicated, VDD = VREF = 5V, VSS = 0V, fSAMPLE = 100ksps, fCLK = 20* fSAMPLE,TA = 25°C
FIGURE 2-25: Effective Number of Bits (ENOB) vs.VREF.
FIGURE 2-26: Spurious Free Dynamic Range(SFDR) vs. Input Frequency.
FIGURE 2-27: Frequency Spectrum of 10kHz input(Representative Part).
FIGURE 2-28: Effective Number of Bits (ENOB) vs.Input Frequency.
FIGURE 2-29: Power Supply Rejection (PSR) vs.Ripple Frequency.
FIGURE 2-30: Frequency Spectrum of 1kHz input(Representative Part, VDD = 2.7V).
9.009.259.509.75
10.0010.2510.5010.7511.0011.2511.5011.7512.00
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
VREF (V)
EN
OB
(rm
s)
VDD = VREF = 2.7V
FSAMPLE = 50ksps
VDD = VREF = 5V
FSAMPLE =100ksps
0
10
20
30
40
50
60
70
80
90
100
1 10 100
Input Frequency (kHz)
SF
DR
(dB
)
VDD = VREF = 5V
FSAMPLE = 100ksps
VDD = VREF = 2.7V
FSAMPLE = 50ksps
-130-120-110-100-90-80-70-60-50-40-30-20-10
0
0 10000 20000 30000 40000 50000
Frequency (Hz)
Am
plitu
de (
dB)
VDD = VREF = 5V
FSAMPLE = 100ksps
FINPUT = 9.985kHz
4096 points
8.0
8.5
9.0
9.5
10.0
10.5
11.0
11.5
12.0
1 10 100
Input Frequency (kHz)
EN
OB
(rm
s)
VDD = VREF = 2.7V
FSAMPLE = 50ksps
VDD = VREF = 5V
FSAMPLE = 100ksps
-80
-70
-60
-50
-40
-30
-20
-10
0
1 10 100 1000 10000
Ripple Frequency (kHz)
Pow
er S
uppl
y R
ejec
tion
(dB
)
-130-120-110-100-90-80-70-60-50-40-30-20-10
0
0 5000 10000 15000 20000 25000
Frequency (Hz)
Am
plitu
de (
dB)
VDD = VREF = 2.7V
FSAMPLE = 50ksps
FINPUT = 998.76Hz
4096 points
2001 Microchip Technology Inc. Preliminary DS21298B-page 9
MCP3204/3208
Note: Unless otherwise indicated, VDD = VREF = 5V, VSS = 0V, fSAMPLE = 100ksps, fCLK = 20* fSAMPLE,TA = 25°C
FIGURE 2-31: IDD vs. VDD.
FIGURE 2-32: IDD vs. Clock Frequency.
FIGURE 2-33: IDD vs. Temperature.
FIGURE 2-34: IREF vs. VDD.
FIGURE 2-35: IREF vs. Clock Frequency.
FIGURE 2-36: IREF vs. Temperature.
0
50
100
150
200
250
300
350
400
450
500
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
VDD (V)
IDD (
µA)
VREF = VDD
All points at FCLK = 2MHz except
at VREF = VDD = 2.5V, FCLK = 1MHz
0
50
100
150
200
250
300
350
400
10 100 1000 10000
Clock Frequency (kHz)
I DD (
µA)
VDD = VREF = 5V
VDD = VREF = 2.7V
0
50
100
150
200
250
300
350
400
-50 -25 0 25 50 75 100
Temperature (°C)
IDD (
µA)
VDD = VREF = 5V
FCLK = 2MHz
VDD = VREF = 2.7V
FCLK = 1MHz
0
10
20
30
40
50
60
70
80
90
100
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
VDD (V)
IRE
F (
µA)
VREF = VDD
All points at FCLK = 2MHz except
at VREF = VDD = 2.5V, FCLK = 1MHz
0
10
20
30
40
50
60
70
80
90
100
10 100 1000 10000
Clock Frequency (kHz)
IRE
F (
µA)
VDD = VREF = 5V
VDD = VREF = 2.7V
0
10
20
30
40
50
60
70
80
90
100
-50 -25 0 25 50 75 100
Temperature (°C)
IRE
F (
µA)
VDD = VREF = 5V
FCLK = 2MHz
VDD = VREF = 2.7V
FCLK = 1MHz
DS21298B-page 10 Preliminary 2001 Microchip Technology Inc.
MCP3204/3208
Note: Unless otherwise indicated, VDD = VREF = 5V, VSS = 0V, fSAMPLE = 100ksps, fCLK = 20* fSAMPLE,TA = 25°C
FIGURE 2-37: IDDS vs. VDD.
FIGURE 2-38: IDDS vs. Temperature.
FIGURE 2-39: Analog Input Leakage Current vs.Temperature.
0
10
20
30
40
50
60
70
80
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
VDD (V)
IDD
S (
pA)
VREF = CS = VDD
0.01
0.10
1.00
10.00
100.00
-50 -25 0 25 50 75 100
Temperature (°C)
IDD
S (
nA)
VDD = VREF = CS = 5V
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
-50 -25 0 25 50 75 100
Temperature (°C)
Ana
log
Inpu
t Lea
kage
(nA
)
VDD = VREF = 5V
FCLK = 2MHz
2001 Microchip Technology Inc. Preliminary DS21298B-page 11
MCP3204/3208
3.0 PIN DESCRIPTIONS
3.1 CH0 - CH7
Analog inputs for channels 0 - 7 respectively for themultiplexed inputs. Each pair of channels can be pro-grammed to be used as two independent channels insingle ended-mode or as a single pseudo-differentialinput where one channel is IN+ and one channel is IN-.See Section 4.1 and Section 5.0 for information on pro-gramming the channel configuration.
3.2 CS/SHDN(Chip Select/Shutdown)
The CS/SHDN pin is used to initiate communicationwith the device when pulled low and will end a conver-sion and put the device in low power standby whenpulled high. The CS/SHDN pin must be pulled highbetween conversions.
3.3 CLK (Serial Clock)
The SPI clock pin is used to initiate a conversion and toclock out each bit of the conversion as it takes place.See Section 6.2 for constraints on clock speed.
3.4 DIN (Serial Data Input)
The SPI port serial data input pin is used to load chan-nel configuration data into the device.
3.5 DOUT (Serial Data output)
The SPI serial data output pin is used to shift out theresults of the A/D conversion. Data will always changeon the falling edge of each clock as the conversiontakes place.
3.6 AGND
Analog ground connection to internal analog circuitry.
3.7 DGND
Digital ground connection to internal digital circuitry.
4.0 DEVICE OPERATIONThe MCP3204/3208 A/D Converters employ a conven-tional SAR architecture. With this architecture, a sam-ple is acquired on an internal sample/hold capacitor for1.5 clock cycles starting on the fourth rising edge of theserial clock after the start bit has been received. Fol-lowing this sample time, the device uses the collectedcharge on the internal sample and hold capacitor toproduce a serial 12-bit digital output code. Conversionrates of 100ksps are possible on the MCP3204/3208.See Section 6.2 for information on minimum clockrates. Communication with the device is done using a4-wire SPI-compatible interface.
4.1 Analog Inputs
The MCP3204/3208 devices offer the choice of usingthe analog input channels configured as single-endedinputs or pseudo-differential pairs. The MCP3204 canbe configured to provide two pseudo-differential inputpairs or four single-ended inputs. the MCP3208 can beconfigured to provide four pseudo-differential inputpairs or eight single-ended inputs. Configuration isdone as part of the serial command before each con-version begins. When used in the pseudo-differentialmode, each channel pair (i.e., CH0 and CH1, CH2 andCH3 etc.) are programmed as the IN+ and IN- inputs aspart of the command string transmitted to the device.The IN+ input can range from IN- to (VREF + IN-). TheIN- input is limited to ±100mV from the VSS rail. The IN-input can be used to cancel small signal com-mon-mode noise which is present on both the IN+ andIN- inputs.
When operating in the pseudo-differential mode, if thevoltage level of IN+ is equal to or less than IN-, theresultant code will be 000h. If the voltage at IN+ isequal to or greater than [VREF + (IN-)] - 1 LSB, then theoutput code will be FFFh. If the voltage level at IN- ismore than 1 LSB below VSS, then the voltage level atthe IN+ input will have to go below VSS to see the 000houtput code. Conversely, if IN- is more than 1 LSBabove VSS, then the FFFh code will not be seen unlessthe IN+ input level goes above VREF level.For the A/D Converter to meet specification, the chargeholding capacitor, (CSAMPLE) must be given enough timeto acquire a 12-bit accurate voltage level during the 1.5clock cycle sampling period. The analog input model isshown in Figure 4-1. In this diagram it is shown that the source impedance(RS) adds to the internal sampling switch (RSS) imped-ance, directly affecting the time that is required tocharge the capacitor, CSAMPLE. Consequently, largersource impedances increase the offset, gain, and inte-gral linearity errors of the conversion. See Figure 4-2.
4.2 Reference Input
For each device in the family, the reference input (VREF)determines the analog input voltage range. As the ref-erence input is reduced, the LSB size is reducedaccordingly. The theoretical digital output code pro-duced by the A/D Converter is a function of the analoginput signal and the reference input as shown below.
where:
VIN = analog input voltage
VREF = reference voltage
When using an external voltage reference device, thesystem designer should always refer to the manufac-turer’s recommendations for circuit layout. Any instabil-ity in the operation of the reference device will have adirect effect on the operation of the A/D Converter.
Digital Output Code = 4096 * VIN
VREF
DS21298B-page 12 Preliminary 2001 Microchip Technology Inc.
MCP3204/3208
FIGURE 4-1: Analog Input Model
FIGURE 4-2: Maximum Clock Frequency vs. Inputresistance (RS) to maintain less than a 0.1LSBdeviation in INL from nominal conditions.
CPINVA
RS CHx
7pF
VT = 0.6V
VT = 0.6VILEAKAGE
SamplingSwitch
SS RSS = 1kΩ
CSAMPLE
= DAC capacitance
VSS
VDD
= 20 pF± 1 nA
= Signal Source
= Source Impedance
= Input Channel Pad
= Input Capacitance
= Threshold Voltage
= Leakage Current at the pin due to various junctions
= Sampling Switch
= Sampling Switch Resistor
= Sample/Hold Capacitance
VA
RS
CHx
CPIN
VT
ILEAKAGE
SS
RSS
CSAMPLE
Legend
0.0
0.5
1.0
1.5
2.0
2.5
100 1000 10000
Input Resistance (Ohms)
Clo
ck F
requ
ency
(M
Hz) VDD = 5V
VDD = 2.7V
2001 Microchip Technology Inc. Preliminary DS21298B-page 13
MCP3204/3208
5.0 SERIAL COMMUNICATIONSCommunication with the MCP3204/3208 devices isdone using a standard SPI-compatible serial interface.Initiating communication with either device is done bybringing the CS line low. See Figure 5-1. If the devicewas powered up with the CS pin low, it must be broughthigh and back low to initiate communication. The firstclock received with CS low and DIN high will constitutea start bit. The SGL/DIFF bit follows the start bit and willdetermine if the conversion will be done using singleended or differential input mode. The next three bits(D0, D1 and D2) are used to select the input channelconfiguration. Table 5-1 and Table 5-2 show the config-uration bits for the MCP3204 and MCP3208, respec-tively. The device will begin to sample the analog inputon the fourth rising edge of the clock after the start bithas been received. The sample period will end on thefalling edge of the fifth clock following the start bit.
After the D0 bit is input, one more clock is required tocomplete the sample and hold period (DIN is a don’tcare for this clock). On the falling edge of the nextclock, the device will output a low null bit. The next 12clocks will output the result of the conversion with MSBfirst as shown in Figure 5-1. Data is always output fromthe device on the falling edge of the clock. If all 12 databits have been transmitted and the device continues toreceive clocks while the CS is held low, the device willoutput the conversion result LSB first as shown inFigure 5-2. If more clocks are provided to the devicewhile CS is still low (after the LSB first data has beentransmitted), the device will clock out zeros indefinitely.
If necessary, it is possible to bring CS low and clock inleading zeros on the DIN line before the start bit. This isoften done when dealing with microcontroller-basedSPI ports that must send 8 bits at a time. Refer toSection 6.1 for more details on using theMCP3204/3208 devices with hardware SPI ports.
CONTROL BIT SELECTIONS INPUT
CONFIGURATIONCHANNEL
SELECTIONSINGLE/DIFF
D2* D1 D0
1 X 0 0 single ended CH0
1 X 0 1 single ended CH1
1 X 1 0 single ended CH2
1 X 1 1 single ended CH3
0 X 0 0 differential CH0 = IN+CH1 = IN-
0 X 0 1 differential CH0 = IN-CH1 = IN+
0 X 1 0 differential CH2 = IN+CH3 = IN-
0 X 1 1 differential CH2 = IN-CH3 = IN+
*D2 is don’t care for MCP3204
TABLE 5-1: Configuration Bits for the MCP3204.
CONTROL BIT SELECTIONS INPUT
CONFIGURATIONCHANNEL
SELECTIONSINGLE/DIFF
D2 D1 D0
1 0 0 0 single ended CH0
1 0 0 1 single ended CH1
1 0 1 0 single ended CH2
1 0 1 1 single ended CH3
1 1 0 0 single ended CH4
1 1 0 1 single ended CH5
1 1 1 0 single ended CH6
1 1 1 1 single ended CH7
0 0 0 0 differential CH0 = IN+CH1 = IN-
0 0 0 1 differential CH0 = IN-CH1 = IN+
0 0 1 0 differential CH2 = IN+CH3 = IN-
0 0 1 1 differential CH2 = IN-CH3 = IN+
0 1 0 0 differential CH4 = IN+CH5 = IN-
0 1 0 1 differential CH4 = IN-CH5 = IN+
0 1 1 0 differential CH6 = IN+CH7 = IN-
0 1 1 1 differential CH6 = IN-CH7 = IN+
TABLE 5-2: Configuration Bits for the MCP3208.
DS21298B-page 14 Preliminary 2001 Microchip Technology Inc.
MCP3204/3208
FIGURE 5-1: Communication with the MCP3204 or MCP3208.
FIGURE 5-2: Communication with MCP3204 or MCP3208 in LSB First Format.
CS
CLK
DIN
DOUT
D1D2 D0
HI-Z
Don’t Care
NullBit B11 B10 B9 B8 B7 B6 B5 B4 B3 B2 B1 B0 *
HI-Z
tSAMPLE
tCONV
SGL/DIFF
Start
tCYC
tCSH
tCYC
D2SGL/DIFF
Start
* After completing the data transfer, if further clocks are applied with CS low, the A/D Converter will output LSBfirst data, then followed with zeros indefinitely. See Figure 5-2 below.
** tDATA: during this time, the bias current and the comparator power down while the reference input becomesa high impedance node, leaving the CLK running to clock out the LSB-first data or zeros.
tDATA **
tSUCS
NullBit
B11 B10 B9 B8 B7 B6 B5 B4 B3 B2 B1 B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 B10 B11
CS
CLK
DOUT
HI-Z HI-Z
(MSB)
tCONV tDATA **
Power Down
tSAMPLE
Start
SGL/DIFF
DIN
tCYC
tCSH
D0D1D2
* After completing the data transfer, if further clocks are applied with CS low, the A/D Converter will output zerosindefinitely.
** tDATA: During this time, the bias circuit and the comparator power down while the reference input becomes ahigh impedance node, leaving the CLK running to clock out LSB first data or zeroes.
tSUCS
Don’t Care
*
2001 Microchip Technology Inc. Preliminary DS21298B-page 15
MCP3204/3208
6.0 APPLICATIONS INFORMATION
6.1 Using the MCP3204/3208 with Microcontroller (MCU) SPI Ports
With most microcontroller SPI ports, it is required tosend groups of eight bits. It is also required that themicrocontroller SPI port be configured to clock out dataon the falling edge of clock and latch data in on the risingedge. Because communication with the MCP3204/3208devices may not need multiples of eight clocks, it will benecessary to provide more clocks than are required.This is usually done by sending ‘leading zeros’ beforethe start bit. As an example, Figure 6-1 and Figure 6-2shows how the MCP3204/3208 can be interfaced to aMCU with a hardware SPI port. Figure 6-1 depicts theoperation shown in SPI Mode 0,0 which requires that theSCLK from the MCU idles in the ‘low’ state, whileFigure 6-2 shows the similar case of SPI Mode 1,1where the clock idles in the ‘high’ state.
As shown in Figure 6-1, the first byte transmitted to theA/D Converter contains five leading zeros before thestart bit. Arranging the leading zeros this way producesthe output 12 bits to fall in positions easily manipulatedby the MCU. The MSB is clocked out of the A/D Con-verter on the falling edge of clock number 12. After thesecond eight clocks have been sent to the device, theMCUs receive buffer will contain three unknown bits(the output is at high impedance for the first two clocks),the null bit and the highest order four bits of the conver-sion. After the third byte has been sent to the device, thereceive register will contain the lowest order eight bits ofthe conversion results. Easier manipulation of the con-verted data can be obtained by using this method.
Figure 6-2 shows the same thing in SPI Mode 1,1which requires that the clock idles in the high state. Aswith mode 0,0, the A/D Converter outputs data on thefalling edge of the clock and the MCU latches data fromthe A/D Converter in on the rising edge of the clock.
FIGURE 6-1: SPI Communication using 8-bit segments (Mode 0,0: SCLK idles low).
FIGURE 6-2: SPI Communication using 8-bit segments (Mode 1,1: SCLK idles high).
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
CS
SCLK
DIN
X = Don’t Care Bits
17 18 19 20 21 22 23 24
DOUTNULLBIT B11 B10 B9 B8 B7 B6 B5 B4 B3 B2 B1 B0HI-Z
MCU latches data from A/D Converter
Data is clocked out ofA/D Converter on falling edges
on rising edges of SCLK
DO Don’t CareSGL/DIFF D1D2Start
0 0 0 0 0 1 X X X X XDO X X X X X X X X
B7 B6 B5 B4 B3 B2 B1 B0B11 B10 B9 B80? ? ? ? ? ? ? ? ? ? ?
D1D2SGL/DIFF
StartBit
(Null)
MCU Transmitted Data(Aligned with falling
edge of clock)
MCU Received Data(Aligned with rising
edge of clock)
X
Data stored into MCU receive register after transmission of first 8 bits
Data stored into MCU receive register after transmission of second 8 bits
Data stored into MCU receive register after transmission of last 8 bits
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
CS
SCLK
DIN
X = Don’t Care Bits
17 18 19 20 21 22 23 24
DOUT
DO Don’t Care
NULLBIT B11 B10 B9 B8 B6 B5 B4 B3 B2 B1 B0HI-Z
0 0 0 0 0 1 X X X X XDO
SGL/DIFF
X X X X X X X X
B7 B6 B5 B4 B3 B2 B1 B0B11 B10 B9 B80? ? ? ? ? ? ? ? ? ? ?
MCU latches data from A/D Converteron rising edges of SCLK
Data is clocked out ofA/D Converter on falling edges
D1D2SGL/DIFF
StartBit
(Null)
D1D2Start
MCU Transmitted Data(Aligned with falling
edge of clock)
MCU Received Data(Aligned with rising
edge of clock)
B7
X
Data stored into MCU receive register after transmission of first 8 bits
Data stored into MCU receive register after transmission of second 8 bits
Data stored into MCU receive register after transmission of last 8 bits
DS21298B-page 16 Preliminary 2001 Microchip Technology Inc.
MCP3204/3208
6.2 Maintaining Minimum Clock Speed
When the MCP3204/3208 initiates the sample period,charge is stored on the sample capacitor. When thesample period is complete, the device converts one bitfor each clock that is received. It is important for theuser to note that a slow clock rate will allow charge tobleed off the sample capacitor while the conversion istaking place. At 85°C (worst case condition), the partwill maintain proper charge on the sample capacitor forat least 1.2ms after the sample period has ended. Thismeans that the time between the end of the sampleperiod and the time that all 12 data bits have beenclocked out must not exceed 1.2ms (effective clock fre-quency of 10kHz). Failure to meet this criterion mayinduce linearity errors into the conversion outside therated specifications. It should be noted that during theentire conversion cycle, the A/D Converter does notrequire a constant clock speed or duty cycle, as long asall timing specifications are met.
6.3 Buffering/Filtering the Analog Inputs
If the signal source for the A/D Converter is not a lowimpedance source, it will have to be buffered or inaccu-rate conversion results may occur. See Figure 4-2. It isalso recommended that a filter be used to eliminate anysignals that may be aliased back in to the conversionresults. This is illustrated in Figure 6-3 where an opamp is used to drive the analog input of theMCP3204/3208. This amplifier provides a low imped-ance source for the converter input and a low pass fil-ter, which eliminates unwanted high frequency noise.
Low pass (anti-aliasing) filters can be designed usingMicrochip’s free interactive FilterLab™ software. Fil-terLab will calculate capacitor and resistors values, aswell as determine the number of poles that are requiredfor the application. For more information on filtering sig-nals, see the application note AN699 “Anti-AliasingAnalog Filters for Data Acquisition Systems.”
FIGURE 6-3: The MCP601 Operational Amplifier isused to implement a 2nd order anti-aliasing filter forthe signal being converted by the MCP3204.
6.4 Layout Considerations
When laying out a printed circuit board for use withanalog components, care should be taken to reducenoise wherever possible. A bypass capacitor shouldalways be used with this device and should be placedas close as possible to the device pin. A bypass capac-itor value of 1µF is recommended.
Digital and analog traces should be separated as muchas possible on the board and no traces should rununderneath the device or the bypass capacitor. Extraprecautions should be taken to keep traces with highfrequency signals (such as clock lines) as far as possi-ble from analog traces.
Use of an analog ground plane is recommended inorder to keep the ground potential the same for alldevices on the board. Providing VDD connections todevices in a “star” configuration can also reduce noiseby eliminating return current paths and associatederrors. See Figure 6-4. For more information on layouttips when using A/D Converters, refer to AN688 “Lay-out Tips for 12-Bit A/D Converter Applications”.
FIGURE 6-4: VDD traces arranged in a ‘Star’configuration in order to reduce errors caused bycurrent return paths.
FilterLab is a trademark of Microchip Technology Inc. inthe U.S.A and other countries. All rights reserved.
MCP3204
VDD
10µF
IN-
IN+
-+
VIN
C1
C2
VREF
4.096VReference
ADIREF198
1µF
1µF0.1µFTant.
0.1µF
MCP601R1
R2
R3
R4
VDDConnection
Device 1
Device 2
Device 3
Device 4
2001 Microchip Technology Inc. Preliminary DS21298B-page 17
MCP3204/3208
6.5 Utilizing the Digital and Analog Ground Pins
The MCP3204/3208 devices provide both digital andanalog ground connections to provide another meansof noise reduction. As shown in Figure 6-5, the analogand digital circuitry is separated internal to the device.This reduces noise from the digital portion of the devicebeing coupled into the analog portion of the device. Thetwo grounds are connected internally through the sub-strate which has a resistance of 5 -10 Ω.
If no ground plane is utilized, then both grounds mustbe connected to VSS on the board. If a ground plane isavailable, both digital and analog ground pins shouldbe connected to the analog ground plane. If both ananalog and a digital ground plane are available, boththe digital and the analog ground pins should be con-nected to the analog ground plane. Following thesesteps will reduce the amount of digital noise from therest of the board being coupled into the A/D Converter.
FIGURE 6-5: Separation of Analog and DigitalGround Pins.
VDD
Digital Side
-SPI Interface
-Shift Register
-Control Logic
Analog Side
-Sample Cap
-Capacitor Array
-Comparator
Substrate
5 - 10 Ω
Analog Ground Pin
DigitalGround Pin
DS21298B-page 18 Preliminary 2001 Microchip Technology Inc.
MCP3204/3208
MCP3204 PRODUCT IDENTIFICATION SYSTEMS
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
MCP3208 PRODUCT IDENTIFICATION SYSTEMS
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Sales and Support
Package: P = PDIP (14 lead)SL = SOIC (150 mil Body), 14 leadST = TSSOP, 14 lead (C Grade only)
Temperature I = –40°C to +85°CRange:
Performance B = ±1 LSB INL (TSSOP not available in this grade)Grade: C = ±2 LSB INL
Device: MCP3204 = 4-Channel 12-Bit Serial A/D ConverterMCP3204T = 4-Channel 12-Bit Serial A/D Converter on tape and reel
(SOIC and TSSOP packages only)
MCP3204 - G T /P
Package: P = PDIP (16 lead)SL = SOIC (150 mil Body), 16 lead
Temperature I = –40°C to +85°CRange:
Performance B = ±1 LSB INL (TSSOP not available in this grade)Grade: C = ±2 LSB INL
Device: MCP3208 = 8-Channel 12-Bit Serial A/D ConverterMCP3208T = 8-Channel 12-Bit Serial A/D Converter on tape and reel
(SOIC packages only)
MCP3208 - G T /P
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microchip sales office2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-72773. The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
2001 Microchip Technology Inc. Preliminary DS21298B-page 19
MCP3204/3208
NOTES:
DS21298B-page 20 Preliminary 2001 Microchip Technology Inc.
MCP3204/3208
NOTES:
2001 Microchip Technology Inc. Preliminary DS21298B-page 21
MCP3204/3208
NOTES:
DS21298B-page 22 Preliminary 2001 Microchip Technology Inc.
MCP3204/3208
“All rights reserved. Copyright © 2001, Microchip Technology Incorporated, USA. Information containedin this publication regarding device applications and thelike is intended through suggestion only and may besuperseded by updates. No representation or warrantyis given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracyor use of such information, or infringement of patents orother intellectual property rights arising from such useor otherwise. Use of Microchip’s products as criticalcomponents in life support systems is not authorizedexcept with express written approval by Microchip. Nolicenses are conveyed, implicitly or otherwise, underany intellectual property rights. The Microchip logo andname are registered trademarks of Microchip Technology Inc. in the U.S.A. and other countries. Allrights reserved. All other trademarks mentioned hereinare the property of their respective companies. Nolicenses are conveyed, implicitly or otherwise, underany intellectual property rights.”
Trademarks
The Microchip name, logo, PIC, PICmicro, PICMASTER, PICSTART, PRO MATE, KEELOQ,SEEVAL, MPLAB and The Embedded Control Solutions Company are registered trademarks ofMicrochip Technology Incorporated in the U.S.A. andother countries.
Total Endurance, ICSP, In-Circuit Serial Programming,FilterLab, MXDEV, microID, FlexROM, fuzzyLAB,MPASM, MPLINK, MPLIB, PICDEM, ICEPIC, Migratable Memory, FanSense, ECONOMONITOR,SelectMode and microPort are trademarks of Microchip Technology Incorporated in the U.S.A.
Serialized Quick Term Programming (SQTP) is a service mark of Microchip Technology Incorporated inthe U.S.A.
All other trademarks mentioned herein are property oftheir respective companies.
© 2001, Microchip Technology Incorporated, Printed inthe U.S.A., All Rights Reserved.
2001 Microchip Technology Inc. Preliminary DS21298B-page 23
Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999. The Company’s quality system processes and procedures are QS-9000 compliant for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs and microperipheral products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001 certified.
Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded byupdates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability isassumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectualproperty rights arising from such use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except withexpress written approval by Microchip. No licenses are conveyed, implicitly or otherwise, except as maybe explicitly expressed herein, under any intellec-tual property rights. The Microchip logo and name are registered trademarks of Microchip Technology Inc. in the U.S.A. and other countries. All rightsreserved. All other trademarks mentioned herein are the property of their respective companies.
DS21298B-page 24 Preliminary 2001 Microchip Technology Inc.
All rights reserved. © 2001 Microchip Technology Incorporated. Printed in the USA. 2/01 Printed on recycled paper.
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EUROPEDenmarkMicrochip Technology Denmark ApSRegus Business CentreLautrup hoj 1-3Ballerup DK-2750 DenmarkTel: 45 4420 9895 Fax: 45 4420 9910FranceArizona Microchip Technology SARLParc d’Activite du Moulin de Massy43 Rue du Saule TrapuBatiment A - ler Etage91300 Massy, FranceTel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79GermanyArizona Microchip Technology GmbHGustav-Heinemann Ring 125D-81739 Munich, GermanyTel: 49-89-627-144 0 Fax: 49-89-627-144-44GermanyAnalog Product SalesLochhamer Strasse 13D-82152 Martinsried, GermanyTel: 49-89-895650-0 Fax: 49-89-895650-22ItalyArizona Microchip Technology SRLCentro Direzionale Colleoni Palazzo Taurus 1 V. Le Colleoni 120041 Agrate BrianzaMilan, Italy Tel: 39-039-65791-1 Fax: 39-039-6899883United KingdomArizona Microchip Technology Ltd.505 Eskdale RoadWinnersh TriangleWokingham Berkshire, England RG41 5TUTel: 44 118 921 5869 Fax: 44-118 921-5820
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