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MDBT50Q-512K & MDBT50Q-P512K - Version D

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Version: E Issued Date: 2021/05/28 Approval Sheet (產品承認書) 產品名稱 (Product) Bluetooth Low Energy Module 解決方案 (Solution) Nordic nRF52833 aQFN Package 產品型號 (Model No.) MDBT50Q 512K (Chip Antenna) MDBT50Q P512K (PCB Antenna) 產品料號 (Part No.) see 4.3 Order Code Working distance (in Meters) Operating Temperature Model 125 Kbps 1 Mbps 2 Mbps MDBT50Q-512K over 550 over 300 over 150 -40 ~ 105MDBT50Q-P512K over 450 up to 250 up to 120 -40 ~ 105Working range is tested in open space
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Page 1: MDBT50Q-512K & MDBT50Q-P512K - Version D

Version: E

Issued Date: 2021/05/28

Approval Sheet

(產品承認書)

產品名稱 (Product) Bluetooth Low Energy Module

解決方案 (Solution) Nordic nRF52833 aQFN Package

產品型號 (Model No.) MDBT50Q – 512K (Chip Antenna)

MDBT50Q – P512K (PCB Antenna)

產品料號 (Part No.) see 4.3 Order Code

Working distance (in Meters) Operating

Temperature Model 125 Kbps 1 Mbps 2 Mbps

MDBT50Q-512K over 550 over 300 over 150 -40 ~ 105℃

MDBT50Q-P512K over 450 up to 250 up to 120 -40 ~ 105℃

Working range is tested in open space

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Index

1. Overall Introduction ...................................................................................................... 4

1.1. Application ............................................................................................................ 4

1.2. Features ............................................................................................................... 5

2. Product Dimension ....................................................................................................... 7

2.1. PCB Dimensions & Pin Indication ......................................................................... 7

2.2. Recommended Layout of Solder Pad ................................................................... 9

2.3. RF Layout Suggestion (aka Keep-Out Area) ...................................................... 13

2.4. Footprint & Design Guide ................................................................................... 15

2.5. Pin Assignment ................................................................................................... 16

2.6. GPIO Located Near the Radio ............................................................................ 19

3. Main Chip Solution ...................................................................................................... 19

4. Shipment Packaging Information .............................................................................. 20

4.1. Marking on Metal Shield ..................................................................................... 21

4.2. Packaging Info .................................................................................................... 22

4.3. Order Code ......................................................................................................... 24

5. Specification ................................................................................................................ 25

5.1. Absolute Maximum Ratings ................................................................................ 25

5.2. Operating Conditions .......................................................................................... 26

5.3. Electrical Specifications ...................................................................................... 26

6. Block Diagram ............................................................................................................. 33

7. Antenna ........................................................................................................................ 34

7.1. MDBT50Q ........................................................................................................... 34

7.2. MDBT50Q-P ....................................................................................................... 36

8. Reference Circuit ......................................................................................................... 38

8.1. Reg0 LDO Mode ................................................................................................. 39

8.2. Reg0 LDO Mode Disabled .................................................................................. 41

8.3. USB Powered ..................................................................................................... 43

8.4. USB Disabled ..................................................................................................... 45

9. Certification ................................................................................................................. 47

9.1. Declaration ID ..................................................................................................... 47

9.2. FCC Certificate (USA) ........................................................................................ 49

9.3. TELEC Certificate (Japan) .................................................................................. 50

9.4. NCC Certificate (Taiwan) .................................................................................... 52

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9.5. CE (EU) & RCM (Australia & New Zealand) Test Report .................................... 54

9.6. IC Certificate (Canada) ....................................................................................... 57

9.7. SRRC Certificate (China) .................................................................................... 58

9.8. KC Certificate (South Korea) .............................................................................. 59

9.9. RoHS & REACH Report ..................................................................................... 60

9.10. End-Product Label .............................................................................................. 60

10. Notes and Cautions ..................................................................................................... 63

11. Basic Facts for nRF52 Family .................................................................................... 64

12. Useful Links ................................................................................................................. 65

Full List of Raytac’s BLE Modules .................................................................................... 66

Release Note ....................................................................................................................... 69

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1. Overall IntroductionRaytac’s MDBT50Q & MDBT50Q-P is a BT 5.2 stack (Bluetooth low energy or BLE) module

designed based on Nordic nRF52833 SoC solution, which incorporates: GPIO, SPI, UART,

I2C, I2S, PMD, PWM, ADC, NFC and USB interfaces for connecting peripherals and sensors.

Features:

1. Embedded 2.4GHz transceiver supports Bluetooth 5.2 ( ), IEEE 802.15.4

( & Zigbee) & 2.4Ghz RF & ANT+ upon customer’s preference.

2. Compact size with (L) 15.5 x (W) 10.5 x (H) 2.05 or 2.0 mm.

3. Low power requirements, ultra-low peak, average and idle mode power consumption.

4. Be compatible with a large installed base of mobile phones, tablets and computers.

5. Fully coverage of BLE software stack.

6. BLE & RF transmission switching helps products fit all operation system and most

hardware.

1.1. Application‧IoT Networks

‧Smart home (such as door locks, lighting) sensors and controllers

‧Industrial IoT sensors and controllers

‧Interactive entertainment devices

‧Advanced remote controls

‧Gaming controller

‧Advanced wearables

‧Advanced personal fitness/health and monitor devices

‧Wearables with wireless secure payment

‧High performance HID Controllers

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1.2. Features‧Bluetooth 5.1, IEEE 802.15.4, 2.4 GHz transceiver

‧-96 dBm sensitivity in 1 Mbps Bluetooth low energy (BLE) mode

‧-103 dBm sensitivity in 125 Kbps BLE mode (long range)

‧+8 dBm TX power (down to -20 dBm in 4 dB steps)

‧On-air compatible with nRF52, nRF51, nRF24L and nRF24AP Series

‧Programmable output power from +8dBm to -20dB

‧RSSI (1 dB resolution)

‧Supported data rates:

‧Bluetooth 5.1: 2 Mbps, 1 Mbps, 500 kbps, 125 kbps

‧IEEE 802.15.4-2006: 250 kbps

‧Proprietary 2.4 GHz: 2 Mbps, 1 Mbps

‧Angle-of-arrival (AoA) and angle-of-departure (AoD) direction finding using

Bluetooth® .

‧ARM Cortex –M4 32-bit processor with FPU, 64 MHz

‧Memory: 512KB flash / 128KB RAM

‧HW accelerated security

‧128 bit AES / ECB / CCM / AAR co-processor (on-the-fly packet encryption)

‧Advanced on-chip interfaces

‧USB 2.0 full speed (12 Mbps) controller

‧High speed 32MHz SPI

‧Type 2 near field communication (NFC-A) tag with wake-on field, touch-to-pair

support

‧Programmable peripheral interconnect (PPI)

‧42 general purpose I/O pins

‧EasyDMA automated data transfer between memory and peripherals.

‧12 bit, 200 ksps ADC – 8 configurable channels with programmable gain

‧4 x 4 channel pulse width modulator (PWM) units with EasyDMA

‧Audio peripherals : I2S, digital microphone interface (PDM)

‧5 X 32-bit timers with counter mode

‧Up to 4 x SPI masters / 3 x SPI slaves with EasyDMA

‧Up to 2 x I2C compatible 2-wire master / slave

‧2 x UART(CTS/RTS) with EasyDMA

‧Quadrature decoder (QDEC)

‧3 x 24-bit real-time counters (RTC)

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‧Flexible power management

‧Supply voltage range 1.7V to 5.5V

‧On-chip DC/DC and LDO regulators with automated low current modes

‧Automated peripheral power management

‧Fast wake-up using 64MHz internal oscillator

‧0.4uA at 3V in System OFF mode, no RAM retention

‧1.5uA at 3V in System ON mode, no RAM retention, wake on RTC

‧ Nordic SoftDevice ready with support for concurrent multi-protocol

‧ Operating temperature from -40 to 105 °C

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2. Product Dimension

2.1. PCB Dimensions & Pin Indication

‧MDBT50Q-512K

PCB Size (in mm)

Min. Norm MAX.

L

- 0.15

15.5

+ 0.2 W 10.5

H 2.05

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‧MDBT50Q-P512K

PCB Size (in mm)

Min. Norm MAX.

L

- 0.15

15.5

+ 0.2 W 10.5

H 2.0

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2.2. Recommended Layout of Solder Pad

Graphs are all in Top View, Unit in mm.

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2.3. RF Layout Suggestion (aka Keep-Out Area)Please follow below instruction to have better wireless performance. Make sure to keep the

“No-Ground-Pad” as wider as you can when there is not enough space in your design.

No Ground Pad should be included in the corresponding position of the antenna in EACH

LAYER.

Place the module towards the edge of PCB to have better performance than placing it on the

center.

Welcome to send us your layout in PDF for review at [email protected] or your contact at

Raytac with title “Layout reviewing – Raytac Model No. – YOUR company’s name”.

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Examples of “NOT RECOMMENDED” layout

2.4. Footprint & Design GuidePlease visit “Support” page of our website to download. The package includes footprint,

2D/3D drawing, reflow graph/solder profile and recommended spec for external 32.768khz.

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2.5. Pin Assignment

Pin No. Name Pin function Description

(1) GND Power Ground

(2) GND Power Ground

(3) P0.25 Digital I/O General-purpose I/O

(standard drive, low frequency I/O only)

(4) NC Not connected

(5) P0.23 Digital I/O General-purpose I/O

(standard drive, low frequency I/O only)

(6) P1.05 Digital I/O General-purpose I/O

(standard drive, low frequency I/O only)

(7) P1.03 Digital I/O General-purpose I/O

(standard drive, low frequency I/O only)

(8) P0.19 Digital I/O General-purpose I/O

(standard drive, low frequency I/O only)

(9) P0.03 Digital I/O

General-purpose I/O

(standard drive, low frequency I/O only)

AIN1 Analog input Analog input

(10) P0.29 Digital I/O

General-purpose I/O

(standard drive, low frequency I/O only)

AIN5 Analog input Analog input

(11) P0.02 Digital I/O

General-purpose I/O

(standard drive, low frequency I/O only)

AIN0 Analog input Analog input

(12) P0.31 Digital I/O

General-purpose I/O

(standard drive, low frequency I/O only)

AIN7 Analog input Analog input

(13) P0.28 Digital I/O

General-purpose I/O

(standard drive, low frequency I/O only)

AIN4 Analog input Analog input

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Pin No. Name Pin Function Description

(14) P0.30 Digital I/O

General-purpose I/O

(standard drive, low frequency I/O only)

AIN6 Analog input Analog input

(15) GND Power Ground

(16) P0.27 Digital I/O General-purpose I/O

(17) P0.00 Digital I/O General-purpose I/O

XL1 Analog input Connection for 32.768 kHz crystal

(18) P0.01 Digital I/O General-purpose I/O

XL2 Analog input Connection for 32.768 kHz crystal

(19) P0.26 Digital I/O General-purpose I/O

(20) P0.04 Digital I/O General-purpose I/O

AIN2 Analog input Analog input

(21) P0.05 Digital I/O General-purpose I/O

AIN3 Analog input Analog input

(22) P0.06 Digital I/O General-purpose I/O

(23) P0.07 Digital I/O General-purpose I/O

TRACECLK Trace clock Trace buffer clock

(24) P0.08 Digital I/O General-purpose I/O

(25) P1.08 Digital I/O General-purpose I/O

(26) P1.09 Digital I/O General-purpose I/O

TRACEDATA3 Trace data Trace buffer TRACEDATA [3].

(27) P0.11 Digital I/O General-purpose I/O

TRACEDATA2 Trace data Trace buffer TRACEDATA[2].

(28) VDD Power Power supply

(29) P0.12 Digital I/O General-purpose I/O

TRACEDATA1 Trace data Trace buffer TRACEDATA [1].

(30) VDDH Power High voltage power supply

(31) NC

Not connected

(32) VBUS Power 5V input for USB 3.3V regulator

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Pin No. Name Pin function Description

(33) GND Power Ground

(34) D˗̶̶̶ Digital I/O USB D-

(35) D+ Digital I/O USB D+

(36) P0.14 Digital I/O General-purpose digital I/O

(37) P0.13 Digital I/O General-purpose digital I/O

(38) P0.16 Digital I/O General-purpose digital I/O

(39) P0.15 Digital I/O General-purpose digital I/O

(40) P0.18 Digital I/O General-purpose digital I/O

nRESET Configurable as system RESET

(41) P0.17 Digital I/O General-purpose digital I/O

(42) NC Not connected

(43) P0.21 Digital I/O General-purpose digital I/O

(44) P0.20 Digital I/O General-purpose digital I/O

(45) NC Not connected

(46) P0.22 Digital I/O General-purpose digital I/O

(47) P1.00 Digital I/O General-purpose digital I/O

TRACEDATA0 Trace data Trace buffer TRACEDATA [0].

(48) P0.24 Digital I/O General-purpose digital I/O

(49) NC Not connected

(50) P1.02 Digital I/O General-purpose I/O

(standard drive, low frequency I/O only)

(51) SWDIO Debug Debug serial data

(52) P0.09 Digital I/O

General-purpose I/O

(standard drive, low frequency I/O only)

NFC1 NFC input NFC antenna connection

(53) SWDCLK Debug Serial wire debug clock input for debug and programming

(54) P0.10 Digital I/O

General-purpose I/O

(standard drive, low frequency I/O only)

NFC2 NFC input NFC antenna connection

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Pin No. Name Pin function Description

(55) GND Power Ground

(56) P1.04 Digital I/O General-purpose I/O

(standard drive, low frequency I/O only)

(57) P1.06 Digital I/O General-purpose I/O

(standard drive, low frequency I/O only)

(58) P1.07 Digital I/O General-purpose I/O

(standard drive, low frequency I/O only)

(59) NC Not connected

(60) NC Not connected

(61) P1.01 Digital I/O General-purpose I/O

(standard drive, low frequency I/O only)

2.6. GPIO Located Near the RadioPlease refer to 2.5 Pin Assignment on page 16 to 18 where identifies some GPIO that have

recommended usage. To maximize RF performance, these GPIO are only available to use

under standard drive, low frequency I/O only, wrong usage may lead to undesirable

performance.

Low frequency I/O is a signal with a frequency up to 10 kHz. SPI, I2C, UART, PWM are

NOT low frequency I/O.

3. Main Chip Solution

RF IC Crystal Frequency

Nordic NRF52833 32MHZ

32MHz crystal and RF (VDD) DC/DC inductor (Reg1)

are already inside the module.

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4. Shipment Packaging Information

Model Antenna Photo

MDBT50Q-512K Chip/Ceramic

MDBT50Q-P512K PCB/Printed

- Unit Weight of Module:

MDBT50Q-512K: 0.68 g (±0.02 g) ; MDBT50Q-P512K: 0.64 g (±0.02 g)

- Packaging Type: Anti-static tray or Tape & Reel only.

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4.1. Marking on Metal Shield

4.1.1. Label

4.1.2. Dot Marking

Dot Date Code Photo

Black 950

None 018 and later

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4.2. Packaging Info

4.2.1. Tray PackagingAnti-static tray is specifically designed for mass production. It can be used directly on SMT

automatic machine.

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4.2.2. Tape & Reel Packaging

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4.3. Order CodeEach model has two options of packaging. Please use following part no. when placing order

to us.

Model Tray Tape & Reel

MDBT50Q-512K MD-240A3-024 MD-240A3-024R

MDBT50Q-P512K MD-240A3-023 MD-240A3-023R

MPQ of Reel packaging is 1,500 pcs and Tray packaging is 88 pcs.

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5. Specification

Any technical spec shall refer to Nordic’s official documents as final reference. Contents

below are from “nRF52833 Production Specification v1.3”, please click to download full spec.

5.1. Absolute Maximum Ratings

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5.2. Operating Conditions

5.3. Electrical Specifications

5.3.1. General Radio Characteristics

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5.3.2. Radio Current Consumption (Transmitter)

5.3.3. Radio Current Consumption (Receiver)

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5.3.4. Transmitter Specification

5.3.5. RSSI Specifications

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5.3.6. Receiver Operation

5.3.7. RX Selectivity

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5.3.8. RX Intermodulation

5.3.9. Radio Timing Parameters

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5.3.10. CPU

5.3.11. Power Management

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6. Block Diagram

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7. Antenna

7.1. MDBT50Q

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7.2. MDBT50Q-P

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8. Reference CircuitThis chapter shows a different combination of reference circuits. Before getting started,

please read below notes carefully because it is applied to all the reference circuits.

⚫ 32MHz crystal and RF (VDD) DC/DC inductor (Reg1) are already inside the module.

⚫ Module is pre-programmed with Raytac testing code. Default is using LDO mode

and need to add external 32.768khz to work.

You can use DC-DC mode without adding external 32.768khz, they are NOT related

events.

⚫ When using internal 32.768khz RC oscillator, please remove X2 / C12 / C13.

⚫ When NOT using NFC, please remove NFC1 / C19 / C21.

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8.1. Reg0 LDO ModeRecommend using when the highest input voltage is equal or greater than 3.6V. Supply

power from VCC2 (VDDH).

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8.2. Reg0 LDO Mode DisabledRecommend using when the highest input voltage is less than 3.6V.

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8.3. USB Powered Recommend using when power the device via USB

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8.4. USB DisabledThis circuit only focuses on USB disabled. Please leave D+ & D- as NC when USB is

disabled.

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9. Certification

9.1. Declaration ID

BT 5.1

BT 5.2

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Profile Description Service Description

Alert Notification Profile Alert Notification Service

Blood Pressure Profile Blood Pressure Service

Device Information Service

Cycling Speed & Cadence Profile Cycling Speed & Cadence Service

Device Information Service

Glucose Profile Glucose Service

Device Information Service

Health Thermometer Profile Health Thermometer Service

Device Information Service

Heart Rate Profile Heart Rate Service

Device Information Service

HID over GATT Profile HID Service

Battery Service

Proximity Profile

Link Loss Service

Immediate Alert Service

TX Power Service

Running Speed & Cadence Profile Running Speed & Cadence Service

Device Information Service

Time Profile Time Profile Service

Glucose Profile (Central)

Mesh Profile Mesh Provisioning Service

Mesh Proxy Service

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9.2. FCC Certificate (USA)

BLE 1Mbps & 2Mbps, IEEE 802.15.4 approved.

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9.3. TELEC Certificate (Japan)

BLE 1 Mbps & 2 Mbps

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IEEE 802.15.4

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9.4. NCC Certificate (Taiwan)

BLE 1Mbps & 2Mbps, IEEE 802.15.4 approved.

MDBT50Q

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MDBT50Q-P

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9.5. CE (EU) & RCM (Australia & New Zealand) Test Report

BLE 1 Mbps & 2 Mbps

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IEEE 802.15.4

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9.6. IC Certificate (Canada)

BLE 1Mbps & 2Mbps, IEEE 802.15.4 approved.

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9.7. SRRC Certificate (China)

BLE 1Mbps & 2Mbps, IEEE 802.15.4 approved.

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9.8. KC Certificate (South Korea)

BLE 1Mbps & 2Mbps, IEEE 802.15.4 approved

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9.9. RoHS & REACH ReportPlease visit “Support” page of our website to download.

9.10. End-Product LabelIt is suggested using following content adding to package or user manual or label to obey the

regulation. Any rules of end-product label shall refer to each certification for final reference.

9.10.1. FCC (USA)The FCC statement should be included in the user manual when there is no enough space on

label. Otherwise, it should be included on the label.

“This device complies with part 15 of the FCC rules. Operation is subject to the following two

conditions. (1) This device may not cause harmful interference. (2) This device must accept

any interference received, including interference that may cause undesired operation.”

The final end product must be labeled in a visible area with the following: “Contain FCC ID:

SH6MDBT50Q”.

9.10.2. TELEC (Japan)When manufacturer is placing the product on the Japanese market, the product must be

affixed with the following Specified Radio Equipment marking:

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9.10.3. NCC (Taiwan)請依下列標籤式樣自製標籤,標貼或印鑄於器材本體明顯處,始得販賣或公開陳列。

Series 標籤樣式

MDBT50Q Series

MDBT50Q-P Series

以 MDBT50Q為例,平台廠商必須於平台上標示字樣「本產品內含射頻模組:ID編號

CCAM18LP0820T7」。

「平台」定義如下:若器材組裝本案模組,消費者仍能正常使用該器材主要功能,該器材得視

為平台。若器材不組裝本案模組,消費者不能正常使用該器材主要功能,該器材不能視為平台。

該類不同廠牌型號器材組裝本案審驗模組後,須分別申請型式認證。

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9.10.4. IC (Canada)The IC statement should be included in the user manual when there is no enough space on

label. Otherwise, it should be included on the label.

“This device complies with Industry Canada license-exempt RSS Standard(s). Operation is

subject to the following two conditions. (1) This device may not cause harmful interference. (2)

This device must accept any interference received, including interference that may cause

undesired operation.

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils

radio exempts de licence.L'exploitation est autorisée aux deux conditions suivantes: (1)

l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout

brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le

fonctionnement.”

The final end product must be labeled in a visible area with the following: “Contain IC ID:

8017A-MDBT50Q”.

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10. Notes and CautionsModule is not designed to last for a lifetime. Like general products, it is expected to be worn

out after continuous usage through the years. To assure that product will perform better and

last longer, please make sure you:

⚫ Follow the guidelines of this document while designing circuit/end-product. Any

discrepancy of core Bluetooth technology and technical specification of IC should refer to

definition of Bluetooth Organization and Nordic Semiconductor as final reference.

⚫ Do not supply voltage that is not within range of specification.

⚫ Eliminate static electricity at any cost when working with the module as it may cause

damage. It is highly recommended adding anti-ESD components to circuit design to

prevent damage from real-life ESD events. Anti-ESD methods can be also applied in

mechanical design.

⚫ Do not expose modules under direct sunlight for long duration. Modules should be kept

away from humid and salty air conditions, and any corrosive gasses or substances. Store

it within -40℃ to +125℃ before and after installation.

⚫ Avoid any physical shock, intense stress to the module or its surface.

⚫ Do not wash the module. No-Clean Paste is used in production. Washing it will oxidize

the metal shield and have chemistry reaction with No-Clean Paste. Functions of the

module are not guaranteed if it has been washed.

The module is not suitable for life support device or system and not allowed to be used in

destructive device or systems in any direct or indirect ways. The customer agrees to

indemnify Raytac for any losses when applying modules in applications such as the ones

described above.

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11. Basic Facts for nRF52 FamilyBelow chart shows basic spec for Nordic nRF52 family, which is helpful to understand the

differences between each SoC. Any discrepancy shall refer to Nordic’s technical document as

final reference.

See Full List of Raytac’s BLE Modules for complete model no. of each item.

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12. Useful Links

⚫ Nordic Infocenter: https://infocenter.nordicsemi.com/index.jsp

All the necessary technical files and software development kits of Nordic’s chip are on

this website.

⚫ Nordic DevZone: https://devzone.nordicsemi.com/questions/

A highly recommended website for firmware developer. Interact, discuss and consult with

other fellow developers and Nordic’s employees to get answers to your questions. The

site also includes tutorials in detail to help you get started.

⚫ Official Page of nRF52833 :

https://www.nordicsemi.com/Products/Low-power-short-range-wireless/nRF52833

A brief introduction to nRF52833 and download links for Nordic’s developing software

and SoftDevices.

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Full List of Raytac’s BLE Modules

⚫ MDBT40 Series

Series Nordic Solution

Raytac No. IC

Ver. Antenna RAM

Flash Memory

MDBT40 nRF51822

MDBT40-256V3

3 Chip Antenna

16 kb 256 K

MDBT40-256RV3 32 kb 256 K

MDBT40-P nRF51822

MDBT40-P256V3

3 PCB Antenna

16 kb 256 K

MDBT40-P256RV3 32 kb 256 K

⚫ MDBT42Q Series (QFN Package IC)

Series Nordic Solution Raytac No.

IC Ver. Antenna RAM

Flash Memory

MDBT42Q

nRF52832 MDBT42Q-512KV2 2

Chip

Antenna

64 kb 512 K

nRF52810 MDBT42Q-192KV2 2

24 kb 192 K

nRF52811 MDBT42Q-192KL 1

MDBT42Q-P

nRF52832 MDBT42Q-P512KV2 2

PCB

Antenna

64 kb 512 K

nRF52810 MDBT42Q-P192KV2 2

24 kb 192 K

nRF52811 MDBT42Q-P192KL 1

MDBT42Q-U nRF52832 MDBT42Q-U512KV2 2 u.FL Connector 64 kb 512 K

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⚫ MDBT42 Series (WLCSP Package IC)

Series Nordic Solution

Raytac No. IC

Ver. Antenna RAM

Flash Memory

MDBT42

nRF52832

MDBT42-512KV2

2

Chip Antenna

64 kb 512 K

MDBT42-P MDBT42-P512KV2 PCB Antenna

⚫ MDBT42V Series (WLCSP Package IC)

Series Nordic

Solution Raytac No. IC

Ver. Antenna RAM Flash

Memory

MDBT42V

nRF52832

MDBT42V-512KV2

2

Chip

Antenna 64 kb 512 K

MDBT42V-P MDBT42V-P512KV2 PCB

Antenna

⚫ MDBT42T Series (WLCSP Package IC)

Series Nordic

Solution Raytac No. IC

Ver. Antenna RAM Flash

Memory

MDBT42T

nRF52805

MDBT42T-192K

1

Chip

Antenna 24 kb 192 K

MDBT42T-P MDBT42T-P192K PCB

Antenna

⚫ MDBT42TV Series (WLCSP Package IC)

Series Nordic

Solution Raytac No. IC

Ver. Antenna RAM Flash

Memory

MDBT42TV

nRF52805

MDBT42TV-192K

1

Chip

Antenna 24 kb 192 K

MDBT42TV-P MDBT42TV-P192K PCB

Antenna

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⚫ MDBT50Q Series (aQFN Package IC)

Series Nordic

Solution Raytac No. IC

Ver. Antenna RAM Flash

Memory

MDBT50Q

nRF52840 MDBT50Q-1MV2 2 Chip

Antenna

256 kb 1 MB

nRF52833 MDBT50Q-512K 1 128 kb 512 kb

MDBT50Q-P

nRF52840 MDBT50Q-P1MV2 2 PCB

Antenna

256 kb 1 MB

nRF52833 MDBT50Q-P512K 1 128 kb 512 kb

MDBT50Q-U

nRF52840 MDBT50Q-U1MV2 2 u.FL

Connector

256 kb 1 MB

nRF52833 MDBT50Q-U512K 1 128 kb 512 kb

Dongle nRF52840 MDBT50Q-RX 1, 2 PCB

Antenna 256 kb 1 MB

⚫ MDBT50 Series (QFN Package IC)

Series Nordic

Solution Raytac No. IC

Ver. Antenna RAM Flash

Memory

MDBT50 nRF52820 MDBT50-256R 1 Chip

Antenna 256 kb 32 K

MDBT50-P nRF52820 MDBT50-P256R 1 PCB

Antenna 256 kb 32 K

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Release Note⚫ 2019/11/08 Pre-release

⚫ 2019/12/25 Version A (1st release)

⚫ 2020/04/27 Version B

(1) Update the operating temperature to 105℃.

(2) Correct size info of MDBT50Q in section 2.1.

(3) Update the shipping and marking information in section 4: Shipment Packaging

Information

(4) Update the technical spec in section 5 based on Nordic product specification V1.2.

(5) Add MDBT50-256R and MDBT50-P256R in the section 11: Basic Facts for nRF52

Family and Full List of Raytac’s BLE Modules.

⚫ 2020/06/19 Version C:

(1) Updated information of Tape & Reel and order code in Chapter 4: Shipment Packaging

Information

(2) Corrected note “D-“ and “D+” in Chapter 8: Reference Circuit

(3) Updated CE reports to EN300.328 V2.2.2 & EN62368-1.

(4) Updated Full List of Raytac’s BLE modules.

⚫ 2020/01/05 Version D

(1) Updated information of T&R and corrected order code in Chapter 4: Shipment

Packaging Information.

(2) Added BT 5.2 SIG approval in Chapter 9: Certification.

(3) Updated table in Chapter 11: Basic Facts for nRF52 Family.

(4) Updated Full List of Raytac’s BLE Modules

⚫ 2021/05/28 Version E

(1) Updated MPQ information for T&R package in Chapter 4: Shipment Packaging

Information.

(2) Updated Chapter 5: Specification corresponding to Nordic’s new nRF52833 Product

Specification V1.3.


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